Modular socket

Abstract

The present invention relates to a modular socket. A plug of a patch cord is inserted and connected to the modular socket, and the modular socket includes: a housing having an insertion opening for inserting the plug of the patch cord; a circuit board fixed inside the housing; a plurality of interface pins provided on the circuit board to connect with a plurality of plug pins constituting the plug of the patch cord; one or more optical modules provided inside the housing, which are respectively connected to one or more pairs of the interface pins of the plurality of interface pins in a state where the plug of the patch cord is separated from the modular socket, so that the optical modules emit light when powered by one or more pairs of the interface pins, and during the process of installing the plug of the patch cord onto the modular socket, the disconnection contact time points of one or more pairs of the interface pins and one or more pairs of optical module terminals of the one or more optical modules respectively connected thereto are different. The optical module is used to be able to receive test power from a remote location for position identification and to protect the circuit of the optical module even when a PoE patch cord is connected.

Description

Technical Field

[0001] The present invention relates to a modular jack. More specifically, the present invention relates to a modular jack including an optical module that can receive test power from a remote location for position identification and can protect the circuit of the optical module even when a PoE patch cord is connected. Background Art

[0002] Power over Ethernet (PoE) is a technology that transmits both power and data through an Ethernet cable for Ethernet communication, an RJ-45 standard plug, and a modular jack. Since power can be received through Ethernet, no additional power cable is required, thus simplifying the system configuration and reducing costs.

[0003] Generally, network devices such as switches, routers, and gateways in a communication room, patch panels, and modular jacks of communication interfaces can be connected through an Ethernet cable (such as UTP, FTP, or STP cable) or the Ethernet patch cord.

[0004] During the installation, maintenance, or repair of such a communication system, it is necessary to confirm the connection status between network devices such as switches, routers, and gateways, patch panels, and communication interfaces, or whether there is an abnormality in each communication line connecting them.

[0005] In particular, as a prerequisite for maintaining or repairing the communication lines inside the communication room, it is first necessary to confirm or specify the connection positions of the patch cords for communication that connect the network devices and patch panels in the communication room. However, depending on the size of the communication room, a large number of Ethernet cables or Ethernet patch cords are complexly installed inside the communication room and connect between various network devices, between patch panels, or between network devices and patch panels. Therefore, in such an internal environment of the communication room, it is difficult for an operator to specify the connection positions of the respective connectors of the patch cords for communication.

[0006] For this purpose, an optical module is provided in the modular jack connected to the communication line, and a test instrument is installed in one of the modular jacks with the optical module connected and test power is supplied. Thus, the connection position of the modular jack can be specified by whether the opposite modular jack lights up.

[0007] In order to provide such a position identification function, an LED provided in the modular jack or an optical module including an LED circuit is designed on the premise of applying test power with a required low power to be lit, but a plug of a PoE patch cord for supplying driving power to a device or the like is installed thereon. Therefore, when power is supplied, the optical module is exposed to overvoltage or medium voltage, and thus damage may occur.

[0008] In particular, when an abnormal voltage and current are applied through static electricity, inrush current, etc., the possibility of damage to the optical module may be further increased. In addition, since the PoE standard tends to further increase the power supply size, the probability of failure of the optical module in the modular jack will further increase.

[0009] Although the damage of such an optical module does not affect the communication function, a failure of the optical recognition function may occur, which may lead to problems such as the quality of the communication system, product repair, and increased costs. SUMMARY OF THE INVENTION

[0010] The present invention relates to a modular jack. More specifically, an object of the present invention is to provide a modular jack including an optical module that can receive test power from a remote location for position recognition and can protect the circuit of the optical module even when a PoE patch cord is connected.

[0011] To solve the above problems, the present invention can provide a modular jack into which a plug of a patch cord is inserted and connected. The modular jack is characterized in that it includes: a housing having an insertion port for inserting and setting the plug of the patch cord; a circuit board fixed within the housing unit; a plurality of interface pins provided on the circuit board to connect to a plurality of plug pins constituting the plug of the patch cord; and one or more optical modules provided within the housing. In a state where the plug of the patch cord is separated from the modular jack, the one or more optical modules are respectively connected to one or more pairs of the interface pins, so that when power is supplied through the one or more pairs of the interface pins, the one or more optical modules emit light. During the process of installing the plug of the patch cord into the modular jack, the disconnection contact time points between the one or more pairs of the interface pins and one or more pairs of the optical module terminals of the one or more optical modules respectively connected thereto are different.

[0012] In addition, during the process of installing the plug into the modular jack, before the one or more pairs of the interface pins connected to the optical module are in electrical contact with one or more pairs of the plug pins corresponding to the plug, at least one of the one or more pairs of the interface pins and one or more pairs of the optical module terminals of the one or more optical modules may be disconnected from contact.

[0013] Furthermore, the housing may include: a front housing formed with the insertion port; a rear housing installed behind the front housing, and the circuit board is installed in the rear housing in a manner opposite to the insertion port of the front housing; and an intermediate housing installed in the rear housing in a manner connecting the front housing and the rear housing. The interface pins are disposed at the upper part of the intermediate housing, and an optical module is installed in front of the intermediate housing.

[0014] Here, the optical module is embedded in front of the intermediate housing in such a way that one of its sides is exposed, and the intermediate housing is provided with a front end portion which is configured such that the end portion of the interface pin can be displaced below the front end portion of the intermediate housing, and a pair of the interface pins can contact the terminals of the optical module exposed to the lower part of the front end portion of the intermediate housing.

[0015] In this case, in order to elastically connect with the plug pins of the patch cord plug, a plurality of the interface pins are provided with contact portions bent or folded upward between the outer end and the inner end, and the positions or shapes of the contact portions of more than one pair of the interface pins connected to the optical module can be different from each other.

[0016] In addition, a plurality of the interface pins can also be provided with connecting portions which are bent or folded again from the contact portions in a horizontal direction or a downward direction.

[0017] Furthermore, one interface pin having a connecting portion with a different shape is bent in such a way that a straight portion is formed in front of the highest point of the connecting portion, while another interface pin is bent in such a way that a curved contact portion is provided in front of the highest point of the connecting portion.

[0018] In addition, the positions or shapes of the contact portions of one or more of the interface pins among more than one pair of the interface pins can be the same as the positions or shapes of the contact portions of a plurality of interface pins not connected to the optical module.

[0019] Here, in at least one of the plurality of interface pins, the inclination angle formed at the position where the outer end and the plug pin corresponding to the contact portion initially contact can be different.

[0020] In this case, in at least one of the plurality of interface pins, the positions of the contact portions arranged after the outer end are different.

[0021] In addition, the optical module can have an LED or a circuit including an LED.

[0022] In addition, to solve the above problems, the present invention can provide a modular socket, into which the plug of a patch cord is inserted and connected. The modular socket is characterized in that it includes: a housing having an insertion opening for inserting the plug of the patch cord; a circuit board fixed within the housing unit; a plurality of interface pins provided on the circuit board to connect with a plurality of plug pins constituting the plug of the patch cord; and one or more optical modules provided within the housing. In a state where the plug of the patch cord is separated from the modular socket, the one or more optical modules are respectively connected to one or more pairs of the interface pins among the plurality of interface pins, so that when powered by one or more pairs of the interface pins, the one or more optical modules emit light. During the process of installing the plug of the patch cord onto the modular socket, the contact time points of at least one of one or more pairs of interface pins that can be electrically connected to one or more optical module terminals of one or more optical modules and the plug pins of the plug corresponding to the positions of one or more pairs of the interface pins are different.

[0023] The modular socket according to the present invention includes an optical module, which is used to be able to receive test power from a remote location for position identification and can also protect the circuit of the optical module even when a PoE patch cord is connected.

[0024] In addition, the modular socket according to the present invention can improve the utilization rate of devices because it is applicable to both PoE-based power and Ethernet communication transmission systems and general Ethernet communication systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view of a modular socket and a plug of a patch cord according to an embodiment of the present invention.

[0026] Figure 2 is Figure 1 an exploded view of the modular socket of the present invention shown in

[0027] Figure 3 is a top view of the modular socket of the present invention shown in a state where the front housing is removed Figure 1 shown in

[0028] Figure 4 is a bottom view of a plug for a communication patch cord that can be installed in the modular socket of the present invention.

[0029] Figure 5 and Figure 6 is a side cross-sectional view showing the state where the plug of the patch cord enters the insertion opening of the modular socket of the present invention shown in Figure 1 shown in

[0030] Figure 7 and Figure 8It is a side sectional view showing the process of disconnection of the electrical connection between the optical module terminal of the modular jack and a pair of interface pins during the process of the plug of the patch cord entering and connecting to the insertion port of the modular jack.

[0031] Figure 9 and Figure 10 is a side sectional view showing the state where the plug of the patch cord is fully installed in Figure 1 the modular jack of the present invention shown.

[0032] Figure 11 is another embodiment applicable to the No. 3 and No. 6 interfaces of the modular jack of the present invention, shown for protecting the optical module described with reference to Figures 3 to 10 explanation.

[0033] Figure 12 is yet another embodiment applicable to the No. 3 and No. 6 interfaces of the modular jack of the present invention, shown for protecting the optical module described with reference to Figures 3 to 10 explanation.

[0034] Description of Reference Numerals

[0035] 100: Modular Jack

[0036] 140: Optical Module

[0037] 150: Interface Pin

[0038] 200: Ethernet Communication Cable

[0039] 300: Plug of Patch Cord

[0040] 350: Plug Pin Detailed Description of the Invention

[0041] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. On the contrary, the embodiments provided herein are for the purpose of making the content disclosed in the embodiments introduced herein thorough and complete, and for the purpose of fully transmitting the idea of the invention to those skilled in the art. Throughout the specification, the same reference numerals denote the same components.

[0042] Figure 1 is a perspective view of the modular jack 100 of an embodiment of the present invention and the plug of the patch cord 300, Figure 2 is Figure 1 an exploded view of the modular jack 100 of the present invention shown, Figure 3 is a top view of the modular jack 100 of the present invention shown in a state where the front cover 110 is removed, Figure 1 shown. Figure 4The bottom view of the plug 300 of the patch cord for communication that can be installed in the modular socket 100 of the present invention.

[0043] RJ45 standard plugs 300 can be installed at both ends of an Ethernet cable 200 for communication having a plurality of twisted pairs to form a patch cord for communication.

[0044] The plug 300 of such a patch cord can be installed in the modular socket 100 of a communication device or the like, so that communication data and power in Power over Ethernet (PoE) technology can be supplied.

[0045] Therefore, in a PoE system, the modular socket 100 functions as, for example, a Power over Ethernet socket of an electronic device (not shown), and in addition, the plug 300 of the patch cord can function as, for example, a Power over Ethernet plug.

[0046] However, the modular socket as a Power over Ethernet socket and the plug of the patch cord as a Power over Ethernet plug can also function as a common Ethernet socket and an Ethernet plug with the power supply function omitted.

[0047] In the following description, the case where one optical module is provided is described, but the number of optical modules can be plural, the number of optical module terminals can be more than one pair, and the number of interface pins connected to the optical module terminals can also be more than one pair. However, for ease of explanation, the case where one optical module is provided with one pair of optical module terminals and the number of interface pins connected to the optical module terminals is one pair is described.

[0048] Figures 1 to 3 The modular socket 100 of the present invention shown is characterized in that it includes: a cover unit having an insertion port 111 for inserting and arranging the plug 300 of the patch cord; a circuit board 160 fixed inside the cover unit; a plurality of interface pins 150 arranged on the circuit board 160 to be connected to a plurality of plug pins 350 constituting the plug 300 of the patch cord; and an optical module 140 arranged inside the cover unit. In a state where the plug 300 of the patch cord is separated from the modular socket 100, it is connected to a pair of interface pins 150a, 150b (refer to Figure 3 ) among the plurality of interface pins 150, so as to emit light when power is supplied, and during the process of installing the plug of the patch cord into the modular socket, the contact or disconnection time points between the pair of interface pins and the terminals of the pair of optical modules are different from each other.

[0049] In addition, a pair of the interface pins 150a and 150b that are in terminal contact with the optical module 140 of the modular socket 100 of the present invention have the following characteristics: when the plug 300 of the patch cord is installed, the time points at which it comes into contact with or disconnects from the terminal 141 of the optical module 140 exposed at the lower part of the front end of the intermediate housing 120 are different. This will be described in detail later.

[0050] The housings 110, 120, and 130 form the outer shape of the modular socket 100, protect the internal components, and provide an insertion space for the plug 300 of the patch cord.

[0051] The housing may include: a front housing 110 formed with the insertion port 111; a rear housing 130 that is installed behind the front housing 110, and the circuit board 160 is installed in the rear housing 130 in a manner opposite to the insertion port 111 of the front housing 110; and an intermediate housing 120 that is installed in the rear housing 130 in a manner connecting the front housing 110 and the rear housing 130, the interface pins 150 are arranged at the upper part of the intermediate housing 120, and the optical module 140 is installed in front of the intermediate housing 120.

[0052] A circuit board 160 is installed in front of the rear housing 130, a plurality of interface pins 150 are connected to the front, and a plurality of connection pins 170 can be connected through the circuit board 160.

[0053] Specifically, the connection pins 170 are installed in the rear housing 130, and the wires 210 (refer to Figure 5 ) forming the twisted pairs of the Ethernet cable 200 are inserted from the rear and supported by the grooves 135 provided in the rear housing 130, so that they can be connected to the connection pins 170.

[0054] Among the interface pins 150, with the inner ends 155 connected to the circuit board 160, the outer ends 151 are arranged in the direction of the front housing 110 of the housing unit.

[0055] In addition, in order to elastically connect to the plug pins 350 of the patch cord plug 300, a plurality of the interface pins 150 include: a contact portion 152 that is bent or folded upward between the inner end and the outer end and comes into contact with and moves relative to the plug pins of the plug when the plug is installed in the modular socket; and a connecting portion 153 that is bent or folded again from the contact portion in the horizontal direction or downward direction, and in the case where the plug is installed in the modular socket, the connecting portion 153 is configured to be the portion that remains connected to the plug pins.

[0056] The circuit board 160 is installed in the rear cover 130 in a manner opposite to the insertion port 111 of the front cover 110, and an intermediate cover 120 may be provided between the front cover 110 and the rear cover 130.

[0057] The interface pins 150 are arranged on the upper part of the intermediate cover 120, and the outer ends 151 of the interface pins 150 may be arranged to be displaceable below the lower part of the front end of the intermediate cover 120.

[0058] As Figure 2 and Figure 3 shown, a plurality of grooves 123 are provided on the inner side of the front end of the intermediate cover 120, which are configured to prevent the mutual contact of the respective interface pins 150 and enable the outer ends 151 of the interface pins 150 to be displaced, and the optical module 140 may be installed to be exposed on the top surface of the front end, and a pair of optical module terminals 141a, 141b for supplying power to the optical module 140 may be provided to be exposed downward, and according to whether a plug is installed, they are in contact or disconnected from the outer ends 151a, 151b of a pair of interface pins 150a, 150b inserted and arranged in the respective grooves 123.

[0059] The optical module 140 may perform the function of identifying the position among a plurality of modular jacks 100 by lighting the modular jack 100 that requires position identification among a pair of modular jacks 100 connected to the communication line.

[0060] That is, on one communication line, a pair of modular jacks 100 may also be connected by an Ethernet cable 200, and a test instrument may be connected to one of the modular jacks 100 and test power may be applied to identify the position of the other modular jack 100.

[0061] Specifically, the optical module 140 installed on the intermediate cover 120 of the modular jack 100 is configured to be in contact with a pair of interface pins among a plurality of interface pins 150 in a state where the plug 300 is not installed. Thus, when supplying test power provided by a test instrument or the like based on a communication line connected to a pair of interface pins, it can emit light to identify the position of the modular jack 100 that requires position identification.

[0062] The front end of the intermediate cover 120 provided with the optical module 140 may be closely attached to the back surface of the front cover 110 to be connected to the bottom surface of the insertion port 111 of the front cover 110.

[0063] In addition, when the PoE power is directly or indirectly supplied to the interface pins via the circuit board 160 by the patch cord, a problem of circuit damage to the optical module 140 may occur.

[0064] Therefore, a technique of the following manner is adopted: Among a pair of interface terminals electrically connected to the optical module 140, when the plug 300 of the patch cord is installed, a pair of interface pins 150 connected to the optical module terminals 141 have a structure of being separated from the pair of optical module terminals 141 during the connection process with a pair of plug pins 350 constituting the plug 300, thereby protecting the optical module 140. That is, when the modular jack and the plug are combined, the interface pins capable of switchable contact with the optical module terminals constituting the modular jack disconnect the electrical connection with the optical module terminals before being electrically connected to the plug pins of the plug, thereby protecting the optical module from damage by physically cutting off the situation of overvoltage and overcurrent applied from the plug pins to the optical module.

[0065] However, during the process of installing the plug 300 into the modular jack 100, before the pair of interface pins 150 and the pair of optical module terminals 141 are completely separated, the pair of interface pins 150a, 150b come into contact with the pair of plug pins 350. In the case where PoE power is supplied through the patch cord, a part of this power is directly or indirectly transmitted to the optical module 140 through the circuit board 160. Therefore, there is still a risk of damage to the optical module 140.

[0066] Therefore, in the present invention, during the process of installing the plug 300 of the patch cord into the modular jack 100 provided with the optical module 140, before the electrical connection between a pair of interface pins 150 connected in a manner capable of switchable contact with the pair of optical module terminals 141 and a pair of corresponding plug pins 350, a structure for cutting off the connection between the pair of interface pins and the optical module 140 is adopted to physically cut off the situation of overvoltage and overcurrent applied from the plug pins to the optical module, thereby being able to protect the optical module from damage.

[0067] Specifically, the modular jack 100 of the present invention can provide the following method: Before one interface pin 150a among the pair of interface pins 150a, 150b is electrically connected to the corresponding plug pin 350a (refer to Figure 5 ), the connection state between the other interface pin 150b and the optical module terminal 141b (refer to Figure 6 ) is disconnected to block the supply of PoE power to the optical module 140 through the pair of interface pins 150. The detailed method will be described later.

[0068] As Figure 2 shown, in order to elastically connect with the plug pins 350 of the patch cord plug 300, the plurality of interface pins 150 include: a contact portion 152, which is bent or folded upward toward the upper side of the middle housing 120 between both end portions; and a connecting portion 153, which is bent or folded again from the contact portion in a horizontal direction or a downward direction.

[0069] The inner end 155 of the interface pin 150 is mounted on the circuit board 160, and the outer end 151 is configured to be displaceable in the groove 123 of the intermediate housing 120. Therefore, when the plug 300 is installed, the bottom surface of the plug pin 350 (refer to Figure 1 ) and the connecting portion 153 of the interface pin 150 can be elastically contacted. More specifically, during the process of installing the plug 300 into the modular socket, the initial contact points such as the front corners of the plug pin 350 first contact the contact portion 152 of the interface pin 150. While the plug continues to enter the inside of the modular socket, the contact point between the plug and the plug pin moves from the contact portion 152 to the connecting portion 153 and maintains the connection with the connecting portion 153.

[0070] Figure 2 The modular socket 100 shown may be provided with eight interface pins 150. Generally, the shapes of the respective interface pins 150, the contact portions 152, and the connecting portions 153 are the same. However, in the present invention, a pair of the interface pins 150a, 150b electrically connected to the optical module 140 are configured to have different shapes of the interface pin 150a.

[0071] In Figure 2 the modular socket 100 of the present invention shown, the third interface pin 150a and the sixth interface pin 150b among the eight interface pins 150 are the interface pins 150 connected to the optical module 140. The shape of one of the interface pins 150b is the same as the shapes of the remaining six interface pins 150, and the other interface pin 150a can be bent in such a way that the contact portion 152a forms a straight line in front of the connecting portion 153a. Here, the shape of the contact portion 152 may be formed to be curved or may be a straight line.

[0072] That is, even if the heights and positions of the highest points of the connecting portions 153 are the same, when the plug 300 is installed into the modular socket 100 along the shapes of the contact portions 152 and the connecting portions 153, the contact time points of the plug pin 350 and the interface pin 150 can be different. The modular socket 100 of the present invention adopts the following structure: This structure utilizes the above characteristics to disconnect the connection of at least one of the two optical module terminals 141a, 141b of the pair of interface pins and the optical module 140 before completing the electrical connection of the pair of interface pins connected to the pair of optical module terminals 141 and the corresponding pair of plug pins 350 to cut off the flow of current applied from the pair of plug pins to the optical module. Related descriptions will be given later.

[0073] As Figure 4As shown, the patch cord can be formed by installing a plug 300 in the form of a connector at the end of an Ethernet communication cable 200. The plug 300 is provided with a plug housing 310, and a plurality of plug pins 350 can be respectively connected to the insulated covered wires (not shown) that make up the communication cable 200. A bending prevention member 330 can be installed behind the plug housing 310, and the bending prevention member 330 is used to prevent the Ethernet communication cable 200 from being bent.

[0074] The plug pins 350 are installed between a plurality of rib-shaped parallel partition walls 360 formed on the front bottom surface of the housing unit so as not to protrude or expose to the outside.

[0075] Therefore, when the plug 300 is installed in the modular jack 100, the interface pins 150 are inserted between the bottom partition walls 360 of the plug housing 310 of the plug 300 and connected to the plug pins 350.

[0076] Each plug pin 350 is configured in the shape of a blade, and can be connected in a form of contacting an elastic wire-shaped conductor, that is, the interface pin 150, during the process of inserting the plug 300 into the modular jack.

[0077] The interface pin 150 is formed in the form of a wire, and is provided with a connection portion 153 and is fixed to the circuit board 160 only at one end. Therefore, when the connection between the plug 300 and the modular jack 100 is completed, the interface pin 150 can maintain an elastic connection state with the plug pin 350.

[0078] In addition, when the plug housing 310 enters the insertion port 111 of the modular jack 100, before each interface pin 150 enters between the partition walls 360 of the plug housing 310 until it contacts the plug pin 350, the two interface pins 150a, 150b connected to the optical module 140 can maintain a state of respectively contacting the two optical module terminals 141a, 141b.

[0079] Figure 5 and Figure 6 are side cross-sectional views showing the state where the plug 300 of the patch cord enters the Figure 1 insertion port 111 of the modular jack 100 of the present invention shown in

[0080] Specifically, the two interface pins connected to the optical module terminals 141a, 141b are the No. 3 interface pin 150a and the No. 6 interface pin 150b among the eight interface pins. Figure 5 A cross-sectional view of the modular jack 100 in front of the No. 3 interface pin 150a is shown. Figure 6 A cross-sectional view of the modular jack 100 in front of the No. 6 interface pin 150b is shown.

[0081] The connecting portion 153b of the No. 6 interface pin 150b is bent forward to be provided with a contact portion 152b. The No. 3 interface pin 150a may have a bent shape to form a straight line section, i.e., a contact portion 152a, in front of the connecting portion 153a.

[0082] In addition, as Figure 5 and Figure 6 shown, during the initial stage of the process of installing the plug 300 into the modular socket 100, the No. 3 interface pin 150a and the No. 6 interface pin 150b remain in contact with the optical module terminals 141a, 141b.

[0083] Furthermore, as described above, the plug 300 of the patch cord has the following structure: the plug pins 350 are arranged between a plurality of rib-shaped partition walls 360 without being exposed to the outside. The plug 300 is installed in the modular socket 100, and the interface pins 150 are inserted between the bottom partition walls 360 of the plug cover 310 of the plug 300 and are connected to the plug pins 350.

[0084] Therefore, when the plug cover 310 enters the insertion port 111 of the modular socket 100, before each interface pin enters between the partition walls 360 of the plug cover 310 and until it contacts the plug pins 350a, 350b, the No. 3 interface pin 150a and the No. 6 interface pin 150b remain in contact with the optical module terminals 141a, 141b.

[0085] In Figure 7 and Figure 8 , it shows the state during the process of the plug 300 of the patch cord further entering the insertion port 114 of the modular socket 100 and being connected, in which the No. 3 plug pin 350a among the pair of plug pins 350a, 350b does not contact the No. 3 interface pin 150a, and the other No. 6 plug pin 350b contacts the No. 6 interface pin 150b.

[0086] Specifically, in the state shown in Figure 5 and Figure 6 , when the plug 300 further enters the modular socket 100, Figure 7 is a cross-sectional view of the modular socket 100 in front of the No. 3 interface pin 150a, Figure 8 is a cross-sectional view of the modular socket 100 in front of the No. 6 interface pin 150b.

[0087] Figure 7 The No. 3 interface pin 150a shown in is provided with a straight-line-shaped contact portion 152a in front of the highest point of the connecting portion 153a. Figure 8 In the No. 6 interface pin 150b shown in , the connecting portion 153b and the contact portion 152b are connected in an overall bent shape.

[0088] Therefore, with the outer ends 151a and 151b of the interface pins 150a and 150b being in the same position and shape, the No. 3 interface pin 150a is connected to the highest point of the connecting portion 153a at the same position by a straight connecting portion 152a, and the No. 6 interface pin 150b is connected to the highest point of the connecting portion 153b by a contact portion 152b bent upward.

[0089] Therefore, even though the highest points of the connecting portions 153a and 153b of the No. 3 interface pin 150a and the No. 6 interface pin 150b are in the same position, during the insertion of the plug 300, among the pair of plug pins 350a and 350b corresponding to the No. 3 interface pin 150a and the No. 6 interface pin 150b, the No. 6 plug pin 350b corresponding to the No. 6 interface pin 150b first contacts the contact portion 152b of the No. 6 interface pin 150b.

[0090] That is, as Figure 7 shown, during the insertion of the plug 300 into the modular jack 100, in a state where the No. 3 plug pin 350a has not yet contacted the contact portion 152a of the No. 3 interface pin 150a, as Figure 8 shown, after the No. 6 plug pin 350b contacts the contact portion 152b of the No. 6 interface pin 150b, it advances. Thereby, the outer end 151b of the No. 6 interface pin 150b is separated from the optical module terminal 141b, thus disconnecting the electrical connection between the No. 3 interface pin 150a - optical module 140 - No. 6 interface pin 150b. That is, in the pair of interface pins 150a and 150b, the current path in which the test power supply applied from one side flows through the optical module 140 to the other side is cut off, so that no current flows through the optical module 140.

[0091] That is, by this method, during the installation of the modular jack 100, before the pair of plug pins 350 and the pair of interface pins 150a and 150b connected to the optical module 140 are electrically connected, by disconnecting the connection between the optical module 140 and the pair of interface pins 150a and 150b, even when the patch cord is a PoE patch cord for power, the risk of damage to the optical module 140 of the modular jack 100 can be reduced.

[0092] Figure 9 and Figure 10 are side cross-sectional views showing the state where the plug 300 of the patch cord is fully installed in the Figure 1 modular jack 100 of the present invention as shown.

[0093] Specifically, in the state shown in Figure 7 and Figure 8 , when the plug 300 further enters the modular jack 100 and is in a connected state, Figure 9 is a cross-sectional view of the modular jack 100 in front of the No. 3 interface pin 150a.Figure 10 It is a cross-sectional view of the modular jack 100 showing the front of the No. 6 interface pin 150b.

[0094] In Figure 7 , the No. 3 interface pin 150a and the No. 3 plug pin 350a are in a non-contact state, while the No. 3 interface pin 150a and the optical module terminal 141a are in a contact state. In Figure 8 , the No. 6 interface pin 150b and the No. 6 plug pin 350b are in a contact state, while the No. 6 interface pin 150b and the optical module terminal 141b are in a disconnected contact state.

[0095] As Figure 9 shown, in this state, when the plug 300 further enters the interior of the modular jack 100, the No. 3 interface pin 150a and the No. 3 plug pin 350a contact later than the No. 6 interface pin 150b and the No. 6 plug pin 350b but also come into contact. The No. 3 interface pin 150a and the optical module terminal 141a are disconnected from contact, and the No. 3 plug pin 350a moves to the upper part of the highest point of the connection portion 153a of the No. 3 interface pin 150a to complete the connection.

[0096] In this case, the No. 6 plug pin 350b moves to the upper part of the highest point of the connection portion 153b of the No. 6 interface pin 150b while maintaining contact with the contact portion 152b of the No. 6 interface pin 150b that has been disconnected from the optical module terminal 141b to complete the connection.

[0097] That is, as Figure 9 and Figure 10 shown, in the state where the No. 3 interface pin 150a and the No. 6 interface pin 150b and the corresponding No. 3 plug pin 350a and No. 6 plug pin 350b are connected, in the case of PoE power supply, the lines connecting the No. 3 interface pin 150a and the No. 6 interface pin 150b to the optical module 140 are not electrically connected, thereby protecting the optical module 140.

[0098] Here, before the plug 300 of the patch cord is installed into the modular jack 100, the modular jack 100 is electrically connected to a test power supply unit (not shown) such as a test instrument in a state where a pair of optical module terminals 141a, 141b of the optical module 140 and a pair of interface pins 150a, 150b are connected. Therefore, the circuit for supplying test power through the pair of interface pins 150a, 150b is in a closed circuit state, and thus the blinking of the optical module 140 can be controlled. However, when the plug 300 of the patch cord is installed into the modular jack 100, the connection of one or more of the pair of optical module terminals 141a, 141b and the pair of interface pins 150a, 150b is disconnected, so that the circuit for supplying test power is in an open circuit state, and thus the blinking of the optical module 140 cannot be controlled.

[0099] In addition, referring to Figures 3 to 10 the embodiment of, in order to make the disconnection contact time point of one or more of the optical module 140 and the pair of interface pins 150a, 150b faster than the contact time point of the pair of interface pins 150a, 150b and the pair of plug pins 350a, 350b, a method of making the shapes of the respective contact portions 152 and connection portions 153 of the pair of interface pins 150 connected to the optical module terminals 141 different is used.

[0100] That is, in the foregoing embodiment, the contact portion of one of the pair of interface pins is configured to be a straight shape, and the contact portion of the other interface pin is configured to be a curved shape, so that the contact time points of the contact portion of the interface pin and the plug pin are different. However, a method of adjusting the inclination angle instead of setting the shape of a certain interface pin to a straight portion or a method of changing the positions of the contact portion and the connection portion can also be applied.

[0101] Figure 11 is another embodiment of the No. 3 interface pin 150a' and the No. 6 interface pin 150b' of the modular jack applicable to the present invention shown for protecting the optical module described with reference to Figures 3 to 10 description, Figure 12 is another embodiment of the No. 3 interface pin 150a” and the No. 6 interface pin 150b” of the modular jack applicable to the present invention shown for protecting the optical module described with reference to Figures 3 to 10 description.

[0102] In Figure 11In the illustrated embodiment, the positions of a pair of interface pins 150a' and 150b' at the outer ends 151a' and 151b' and the nodes for forming the bends or kinks of the contact portions 152a' and 152b' are the same, and it is common in that the contact portions 152a' and 152b' are configured in a curved shape rather than a straight line and the maximum heights of the connecting portions 153a' and 153b' are the same. However, in the case of the No. 3 interface pin 150a' and the No. 6 interface pin 150b', the bending or kinking inclination angles θ1 and θ2 for forming the contact portions 152a' and 152b' from the outer ends 151a' and 151b' and the positions of the connecting portions 153a' and 153b' in the insertion direction have different characteristics.

[0103] That is, in Figure 11 the illustrated embodiment, the inclination angle of the connecting portion 152a' of the No. 3 interface pin 150a' is smaller, and the inclination angle θ2 of the contact portion 152b' of the No. 6 interface pin 150b' is relatively larger.

[0104] Therefore, similar to the embodiment with reference to Figures 3 to 10 , the same function can be provided with the same structure in which, during the process of inserting the plug into the modular socket, the optical module terminal and the No. 6 interface pin 150b' come into contact first and the optical module terminal and the No. 6 interface pin 150b' separate first.

[0105] Different from Figure 11 the illustrated embodiment, in Figure 12 the illustrated embodiment, the shapes of the contact portions 152a” and 152b” and the connecting portions 153a” and 153” of the No. 3 interface pin 150a” and the No. 6 interface pin 150b” are the same, but the positions of the contact portions 152a” and 152b” and the connecting portions 153a” and 153b” are shifted upward as a whole in the plug insertion direction.

[0106] That is, in order to form the respective contact portions 152a” and 152b” of the No. 3 interface pin 150a” and the No. 6 interface pin 150b”, the inclination angles during bending or kinking are the same, but the nodes for bending or kinking are different, and the No. 3 interface pin 150a” can be configured in a shape where the connecting portion approaches the circuit board direction.

[0107] Therefore, similar to Figure 11 the illustrated embodiment, in Figure 12 the illustrated embodiment, the same function can be provided with the same structure in which, during the process of inserting the plug into the modular socket, the optical module terminal and the No. 6 interface pin 150b” come into contact first and the optical module terminal and the No. 6 interface pin 150b” separate first.

[0108] In this specification, the present invention has been described with reference to preferred embodiments of the present invention. However, those skilled in the art can make various modifications and changes to the present invention without departing from the spirit and scope of the present invention described in the claims. Therefore, if the modified embodiments substantially include the constituent elements of the claims of the present invention, all embodiments should be considered to be included within the technical scope of the present invention.

Claims

1. A modular socket, into which the plug of a patch cord is inserted and connected, Characterized in that, The modular socket comprises: A housing having an insertion opening for inserting the plug of the patch cord; A circuit board fixed within the housing; A plurality of interface pins provided on the circuit board to connect with a plurality of plug pins constituting the plug of the patch cord; and One or more optical modules provided within the housing, which are respectively connected to one or more pairs of the interface pins among the plurality of interface pins in a state where the plug of the patch cord is separated from the modular socket, so that one or more of the optical modules emit light when powered by one or more of the interface pins, During the process of installing the plug of the patch cord onto the modular socket, the disconnection contact time points of one or more of the interface pins and one or more pairs of optical module terminals of one or more of the optical modules respectively connected thereto are different.

2. The modular socket according to claim 1, Characterized in that, During the process of installing the plug onto the modular socket, before one or more of the interface pins connected to the optical module and one or more pairs of plug pins corresponding to the plug are in electrical contact, at least one of one or more of the interface pins and one or more pairs of optical module terminals of one or more of the optical modules is disconnected from contact.

3. The modular socket according to claim 2, Characterized in that, The housing comprises: A front housing formed with the insertion opening; A rear housing installed behind the front housing, and the circuit board is installed in the rear housing in a manner opposite to the insertion opening of the front housing; and An intermediate housing, which is installed in the rear housing in a manner connecting the front housing and the rear housing, the interface pins are arranged at the upper part of the intermediate housing, and the optical module is installed in front of the intermediate housing.

4. The modular socket according to claim 3, Characterized in that, The optical module is embedded in front of the intermediate housing in a manner exposing one of its surfaces, and the intermediate housing is provided with a front end portion configured such that the end portion of the interface pin can shift downward at the front end portion of the intermediate housing, A pair of the interface pins can contact the terminals of the optical module exposed to the lower part of the front end portion of the intermediate housing.

5. The modular socket according to claim 1, Characterized in that, In order to elastically connect with the plug pins of the plug of the patch cord, a plurality of the interface pins are provided with contact portions bent or folded upward between the outer end and the inner end, The positions or shapes of the contact portions of one or more of the interface pins connected to the optical module are different from each other.

6. The modular socket according to claim 5, Characterized in that, A plurality of the interface pins are further provided with connecting portions bent or folded again from the contact portions in a horizontal direction or a downward direction.

7. The modular socket according to claim 6, Characterized in that, One interface pin with connecting parts of different shapes is bent in such a way that a straight part is formed in front of the highest point of the connecting part, while the other interface pin is bent in such a way that a curved contact part is provided in front of the highest point of the connecting part.

8. The modular socket according to claim 5, wherein, the position or shape of the contact part of one or more of the pair or more of the interface pins is the same as the position or shape of the contact parts of a plurality of interface pins not connected to the optical module.

9. The modular socket according to claim 5, wherein, in at least one of the plurality of interface pins, the inclination angles formed at the positions where the outer end and the plug pin corresponding to the contact part first come into contact are different.

10. The modular socket according to claim 5, wherein, in at least one of the plurality of interface pins, the positions of the contact parts arranged after the outer ends are different.

11. The modular socket according to claim 1, wherein, the optical module has an LED or a circuit including an LED.

12. A modular socket, to which the plug of a patch cord is inserted and connected, wherein, the modular socket includes: a housing having an insertion opening for inserting and setting the plug of the patch cord; a circuit board fixed inside the housing; a plurality of interface pins provided on the circuit board to be connected to a plurality of plug pins constituting the plug of the patch cord; and one or more optical modules provided inside the housing, which are respectively connected to one or more of the plurality of interface pins in a state where the plug of the patch cord is separated from the modular socket, so that one or more of the optical modules emit light when powered through one or more of the interface pins, during the process of installing the plug of the patch cord onto the modular socket, the contact time points of at least one of one or more interface pins that can be electrically connected to one or more optical module terminals of one or more optical modules and the plug pins of the plug corresponding to the positions of one or more of the interface pins are different.

Images