A hot water pump with a rapid cooling mechanism

Abstract

The present invention discloses a hot water pump with a rapid cooling mechanism, which relates to the technical field of hot water pumps. The present invention includes a hot water pump main body, a rapid cooling pretreatment structure, and a guiding rapid cooling structure. One end of the hot water pump main body is fixedly connected to the rapid cooling pretreatment structure, and one end of the rapid cooling pretreatment structure away from the hot water pump main body is fixedly connected to the guiding rapid cooling structure. The rapid cooling pretreatment structure includes an air suction pump, a compression pump, and a gasification conduit. One end of the air suction pump is fixedly connected to the compression pump, and one end of the compression pump away from the air suction pump is fixedly connected to the gasification conduit. Through the combined design of the hot water pump main body, the rapid cooling pretreatment structure, and the guiding rapid cooling structure, the device is convenient for guiding the hot water exported by the hot water pump, so as to facilitate the convenient connection and continuous use of sucking, compressing and gasifying, exhausting, and condensing and liquefying the water body in the hot water. By using a variety of different heat exchange contacts, efficient and rapid cooling is formed, thereby greatly improving the application performance.

Description

Technical Field

[0001] The present invention relates to the technical field of hot water pumps, and particularly to a hot water pump with a rapid cooling mechanism. Background Art

[0002] A hot water pump is an essential device for extracting geothermal water and can also be used for water pools, water tanks, and pressurization, specifically for underground water intake of hotel hot springs, district heating, etc. Existing hot water pumps can only pump hot water, but lack the design of a corresponding rapid cooling mechanism. Therefore, it is not convenient to rapidly cool the guided hot water, resulting in the lack of timely application performance of the exported hot water after cooling. Summary of the Invention

[0003] The purpose of the present invention is to provide a hot water pump with a rapid cooling mechanism to solve the existing problems: the lack of the design of a corresponding rapid cooling mechanism, so it is not convenient to rapidly cool the guided hot water, resulting in the lack of timely application performance of the exported hot water after cooling.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A hot water pump with a rapid cooling mechanism, including a hot water pump main body, a rapid cooling pretreatment structure, and a guided rapid cooling structure. One end of the hot water pump main body is fixedly connected to the rapid cooling pretreatment structure, and the end of the rapid cooling pretreatment structure away from the hot water pump main body is fixedly connected to the guided rapid cooling structure. The rapid cooling pretreatment structure includes an air suction pump, a compression pump, and a vaporization conduit. One end of the air suction pump is fixedly connected to the compression pump, and the end of the compression pump away from the air suction pump is fixedly connected to the vaporization conduit.

[0005] The hot water pump main body is used to extract hot water. When it is necessary to cool the extracted hot water, the air suction pump is used to complete the auxiliary guidance of the hot water, and the compression pump is used to compress the hot water to form gasification, thereby forming a thermal gas. The thermal gas is introduced into the inner side of the guided rapid cooling structure through the vaporization conduit.

[0006] Preferably, the guided rapid cooling structure includes an overcurrent condensation module, an auxiliary heat dissipation carrier module, and a circulating auxiliary cooling reduction module. The overcurrent condensation module is fixedly connected to the inner side of the auxiliary heat dissipation carrier module, the circulating auxiliary cooling reduction module is arranged on the outer side of the auxiliary heat dissipation carrier module, and the inner side of the circulating auxiliary cooling reduction module is attached to the outer surface of the overcurrent condensation module.

[0007] Preferably, the overcurrent condensation module includes a branched inlet air pipe, a cooling and reduction guiding pipe, a shunt conduit, and a centralized outlet pipe. One end of the cooling and reduction guiding pipe is fixedly connected to the branched inlet air pipe, and the other end of the cooling and reduction guiding pipe is fixedly connected to the centralized outlet pipe. A plurality of shunt conduits are arranged inside the cooling and reduction guiding pipe. The material of the cooling and reduction guiding pipe is copper. The shunt conduit is used to increase the condensation contact area, thereby facilitating more efficient condensation and reduction.

[0008] Preferably, the auxiliary heat dissipation module includes a mounting positioning box, an internal mounting positioning plate, a sheet-shaped heat conduction block, a first semiconductor cooling plate, a mounting and fitting frame, and a wind fan. The sheet-shaped heat conduction block and the internal mounting positioning plate are arranged inside the mounting positioning box. The internal mounting positioning plate is located at both ends of the sheet-shaped heat conduction block. The bottom end of the mounting positioning box is fixedly connected to the first semiconductor cooling plate. One side of the mounting positioning box is fixedly connected to the mounting and fitting frame by screws. The wind fan is fixedly connected to the inside of the mounting and fitting frame by screws.

[0009] Preferably, a wind guiding hole is provided on one side of the mounting positioning box close to the mounting and fitting frame. The material of the sheet-shaped heat conduction block is copper.

[0010] Preferably, a plurality of heat dissipation grooves are provided inside the sheet-shaped heat conduction block. The top end of the first semiconductor cooling plate is connected to the sheet-shaped heat conduction block by heat conduction glue.

[0011] At this time, the thermal gas is introduced into the inside of the cooling and reduction guiding pipe through the branched inlet air pipe. The shunt conduit is used to quickly branch the gas. The design of the shunt conduit facilitates increasing the contact surface during the gas condensation process. When the heat is transferred through the cooling and reduction guiding pipe, the sheet-shaped heat conduction block is used to assist in guiding the heat outward. At this time, the heat dissipation grooves of the sheet-shaped heat conduction block are used to quickly dissipate the heat inside the cooling and reduction guiding pipe, and the wind fan is used to form wind to export the heat.

[0012] The first semiconductor cooling plate is used to cool the sheet-shaped heat conduction block, so that the sheet-shaped heat conduction block is continuously at a low temperature. Using the principle of heat transfer, continuous heat conduction of the cooling and reduction guiding pipe is formed.

[0013] Preferably, the circulating auxiliary cooling and reduction module includes a micro circulating water pump, an output pipe, a first surrounding heat conduction pipe, a connecting pipe, a second surrounding heat conduction pipe, a return pipe, a condensation water tank and a second semiconductor condensation plate. The top of the carrying positioning box is fixedly connected with a micro circulating water pump. One side of the micro circulating water pump is fixedly connected with a condensation water tank. The other side of the micro circulating water pump is fixedly connected with an output pipe. The bottom end of the output pipe is connected with a first surrounding heat conduction pipe. The bottom end of the first surrounding heat conduction pipe is connected with a connecting pipe. One side of the connecting pipe away from the first surrounding heat conduction pipe is connected with a second surrounding heat conduction pipe. The top end of the second surrounding heat conduction pipe is fixedly connected with a return pipe. One side of the top of the condensation water tank is connected with the return pipe. The outer side of the condensation water tank is connected with a second semiconductor condensation plate through heat conduction glue.

[0014] Preferably, the materials of the output pipe, the first surrounding heat conduction pipe, the connecting pipe, the second surrounding heat conduction pipe and the return pipe are copper. The inner sides of the first surrounding heat conduction pipe and the second surrounding heat conduction pipe are both in contact with the cooling and reduction guiding pipe.

[0015] In order to facilitate the further rapid export of the heat at the cooling and reduction guiding pipe to form the condensation of hot gas, at this time, control the second semiconductor condensation plate to cool the water body inside the condensation water tank. At this time, use the micro circulating water pump to guide the cooled water body inside the condensation water tank into the output pipe. Utilize the connection of the output pipe, the first surrounding heat conduction pipe, the connecting pipe, the second surrounding heat conduction pipe and the return pipe, so that the cooling water continuously circulates in multiple pipe bodies. Utilize the principle of heat transfer to adsorb the heat in the water body. When the temperature follows the water body into the inside of the condensation water tank, it is cooled again by the second semiconductor condensation plate, thereby greatly improving the cooling effect in use.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] Through the cooperative design of the hot water pump main body, the rapid cooling pretreatment structure and the guiding rapid cooling structure, the device of the present invention is convenient for guiding the hot water exported by the hot water pump, and thus is convenient for the convenient connection and continuous use of the water body in the hot water for air suction, compression and gasification, exhaust and condensation and liquefaction. Utilize a variety of different heat exchange contacts to form efficient and rapid cooling, thereby greatly improving the application performance. Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1It is a schematic structural diagram of the whole of the present invention;

[0020] Figure 2 It is a side view of the whole of the present invention;

[0021] Figure 3 It is a schematic partial structural diagram of the quick-cooling pretreatment structure of the present invention;

[0022] Figure 4 It is a schematic partial structural diagram of the guiding quick-cooling structure of the present invention;

[0023] Figure 5 It is a schematic partial structural diagram of the flow condensation module of the present invention;

[0024] Figure 6 It is a schematic partial structural diagram of the auxiliary heat dissipation carrying module of the present invention;

[0025] Figure 7 It is a schematic partial structural diagram of the over-circulation auxiliary condensation reduction module of the present invention.

[0026] In the figure: 1. Main body of hot water pump; 2. Quick-cooling pretreatment structure; 3. Guiding quick-cooling structure; 4. Suction pump; 5. Compression pump; 6. Gasification conduit; 7. Overflow condensation module; 8. Auxiliary heat dissipation carrying module; 9. Circulation auxiliary cooling reduction module; 10. Sub-guide inlet pipe; 11. Cooling reduction guiding pipe; 12. Shunt conduit; 13. Centralized export pipe; 14. Carrying positioning box; 15. Inner-mounted carrying positioning plate; 16. Sheet-shaped temperature guiding block; 17. First semiconductor condensation plate; 18. Carrying and fitting rack; 19. Wind fan; 20. Micro-circulation water pump; 21. Output pipe; 22. First surrounding temperature guiding pipe; 23. Connecting pipe; 24. Second surrounding temperature guiding pipe; 25. Return pipe; 26. Condensation water tank; 27. Second semiconductor condensation plate. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0028] Please refer to Figure 1-7 , a hot water pump with a rapid cooling mechanism, including a main body 1 of the hot water pump, a quick-cooling pretreatment structure 2 and a guiding quick-cooling structure 3. One end of the main body 1 of the hot water pump is fixedly connected to the quick-cooling pretreatment structure 2, and one end of the quick-cooling pretreatment structure 2 away from the main body 1 of the hot water pump is fixedly connected to the guiding quick-cooling structure 3. The quick-cooling pretreatment structure 2 includes a suction pump 4, a compression pump 5 and a gasification conduit 6. One end of the suction pump 4 is fixedly connected to the compression pump 5, and one end of the compression pump 5 away from the suction pump 4 is fixedly connected to the gasification conduit 6.

[0029] The hot water pump main body 1 is used to extract hot water. When it is necessary to cool the extracted hot water, the suction pump 4 is used to complete the auxiliary guidance of the hot water, and the compression pump 5 is used to compress the hot water to form gasification, thereby forming a thermal gas. The thermal gas is introduced into the inner side of the guiding rapid cooling structure 3 by the gasification conduit 6;

[0030] The guiding rapid cooling structure 3 includes an overcurrent condensation module 7, an auxiliary heat dissipation carrying module 8, and a circulating auxiliary cooling reduction module 9. The overcurrent condensation module 7 is fixedly connected to the inner side of the auxiliary heat dissipation carrying module 8. The circulating auxiliary cooling reduction module 9 is arranged on the outer side of the auxiliary heat dissipation carrying module 8, and the inner side of the circulating auxiliary cooling reduction module 9 is attached to the outer surface of the overcurrent condensation module 7;

[0031] The overcurrent condensation module 7 includes a sub-guide inlet pipe 10, a cooling reduction guide pipe 11, a shunt conduit 12, and a centralized outlet pipe 13. One end of the cooling reduction guide pipe 11 is fixedly connected to the sub-guide inlet pipe 10, and the other end of the cooling reduction guide pipe 11 is fixedly connected to the centralized outlet pipe 13. A plurality of shunt conduits 12 are arranged inside the cooling reduction guide pipe 11. The material of the cooling reduction guide pipe 11 is copper, and the shunt conduit 12 is used to increase the condensation contact area, so as to facilitate more efficient condensation reduction;

[0032] The auxiliary heat dissipation carrying module 8 includes a carrying positioning box 14, an inner-mounted carrying positioning plate 15, a sheet-shaped temperature guiding block 16, a first semiconductor condensation plate 17, a carrying mounting frame 18, and a wind fan 19. The sheet-shaped temperature guiding block 16 and the inner-mounted carrying positioning plate 15 are arranged inside the carrying positioning box 14. The inner-mounted carrying positioning plate 15 is located at both ends of the sheet-shaped temperature guiding block 16. The bottom end of the carrying positioning box 14 is fixedly connected to the first semiconductor condensation plate 17. One side of the carrying positioning box 14 is fixedly connected to the carrying mounting frame 18 by screws, and the wind fan 19 is fixedly connected to the inner side of the carrying mounting frame 18 by screws;

[0033] A wind guiding hole is opened on one side of the carrying positioning box 14 close to the carrying mounting frame 18, and the material of the sheet-shaped temperature guiding block 16 is copper;

[0034] A plurality of heat dissipation grooves are opened inside the sheet-shaped temperature guiding block 16, and the top end of the first semiconductor condensation plate 17 is connected to the sheet-shaped temperature guiding block 16 through a temperature guiding adhesive;

[0035] At this time, the sub-guide inlet pipe 10 is used to introduce the thermal gas into the inner side of the cooling reduction guide pipe 11, and the shunt conduit 12 is used to quickly guide the gas. The design of the shunt conduit 12 is convenient for increasing the contact surface during the gas condensation process. When the heat is transferred through the cooling reduction guide pipe 11, the sheet-shaped temperature guiding block 16 is used to assist in guiding the heat outward. At this time, the heat dissipation grooves of the sheet-shaped temperature guiding block 16 are used to quickly dissipate the heat inside the cooling reduction guide pipe 11, and the wind fan 19 is used to form wind, so as to export the heat;

[0036] The first semiconductor cooling plate 17 is used to cool the sheet-shaped heat conduction block 16, so that the sheet-shaped heat conduction block 16 is continuously at a low temperature. Using the principle of heat transfer, a continuous heat conduction of the cooling and reduction guide pipe 11 is formed;

[0037] The circulating auxiliary cooling and reduction module 9 includes a micro circulating water pump 20, an output pipe 21, a first surrounding heat conduction pipe 22, a connecting pipe 23, a second surrounding heat conduction pipe 24, a return pipe 25, a condensation water tank 26 and a second semiconductor cooling plate 27. The top of the positioning box 14 is fixedly connected with a micro circulating water pump 20. One side of the micro circulating water pump 20 is fixedly connected with a condensation water tank 26. The other side of the micro circulating water pump 20 is fixedly connected with an output pipe 21. The bottom end of the output pipe 21 is connected with a first surrounding heat conduction pipe 22. The bottom end of the first surrounding heat conduction pipe 22 is connected with a connecting pipe 23. One side of the connecting pipe 23 away from the first surrounding heat conduction pipe 22 is connected with a second surrounding heat conduction pipe 24. The top end of the second surrounding heat conduction pipe 24 is fixedly connected with a return pipe 25. One side of the top of the condensation water tank 26 is connected with the return pipe 25. The outside of the condensation water tank 26 is connected with a second semiconductor cooling plate 27 through heat conduction glue;

[0038] The output pipe 21, the first surrounding heat conduction pipe 22, the connecting pipe 23, the second surrounding heat conduction pipe 24 and the return pipe 25 are made of copper. The inner sides of the first surrounding heat conduction pipe 22 and the second surrounding heat conduction pipe 24 are both in contact with the cooling and reduction guide pipe 11.

[0039] In order to facilitate the further rapid export of the heat at the cooling and reduction guide pipe 11 and form the condensation of hot air, at this time, the second semiconductor cooling plate 27 is controlled to cool the water body inside the condensation water tank 26. At this time, the micro circulating water pump 20 is used to guide the cooled water body inside the condensation water tank 26 into the output pipe 21. Using the connection of the output pipe 21, the first surrounding heat conduction pipe 22, the connecting pipe 23, the second surrounding heat conduction pipe 24 and the return pipe 25, the cooling water continuously circulates in multiple pipe bodies. Using the principle of heat transfer, the heat is adsorbed in the water body. When the temperature follows the water body into the inside of the condensation water tank 26, it is refrigerated again by the second semiconductor cooling plate 27, thereby greatly improving the cooling effect in use.

[0040] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A hot water pump with a rapid cooling mechanism, characterized in that: It includes a hot water pump body (1), a rapid cooling pretreatment structure (2) and a guiding rapid cooling structure (3). One end of the hot water pump body (1) is fixedly connected to the rapid cooling pretreatment structure (2), and one end of the rapid cooling pretreatment structure (2) away from the hot water pump body (1) is fixedly connected to the guiding rapid cooling structure (3). The rapid cooling pretreatment structure (2) includes an air suction pump (4), a compression pump (5) and a vaporization conduit (6). One end of the air suction pump (4) is fixedly connected to the compression pump (5), and one end of the compression pump (5) away from the air suction pump (4) is fixedly connected to the vaporization conduit (6); The guiding rapid cooling structure (3) includes an overcurrent condensation module (7), an auxiliary heat dissipation mounting module (8) and a circulating auxiliary cooling reduction module (9). The overcurrent condensation module (7) is fixedly connected to the inside of the auxiliary heat dissipation mounting module (8), and the circulating auxiliary cooling reduction module (9) is arranged on the outside of the auxiliary heat dissipation mounting module (8). The inside of the circulating auxiliary cooling reduction module (9) is attached to the outer surface of the overcurrent condensation module (7); The auxiliary heat dissipation mounting module (8) includes a mounting positioning box (14), an internal mounting positioning plate (15), a sheet-shaped heat conduction block (16), a first semiconductor condensation plate (17), a mounting fitting frame (18) and a wind fan (19). The sheet-shaped heat conduction block (16) and the internal mounting positioning plate (15) are arranged inside the mounting positioning box (14). The internal mounting positioning plate (15) is located at both ends of the sheet-shaped heat conduction block (16). The bottom end of the mounting positioning box (14) is fixedly connected to the first semiconductor condensation plate (17). One side of the mounting positioning box (14) is fixedly connected to the mounting fitting frame (18) by screws, and the wind fan (19) is fixedly connected to the inside of the mounting fitting frame (18) by screws.

2. The hot water pump with a rapid cooling mechanism according to claim 1, wherein: The overcurrent condensation module (7) includes a branched air inlet pipe (10), a cooling reduction guiding pipe (11), a shunt conduit (12) and a centralized outlet pipe (13). One end of the cooling reduction guiding pipe (11) is fixedly connected to the branched air inlet pipe (10), and the other end of the cooling reduction guiding pipe (11) is fixedly connected to the centralized outlet pipe (13). A plurality of shunt conduits (12) are arranged inside the cooling reduction guiding pipe (11). The material of the cooling reduction guiding pipe (11) is copper.

3. The hot water pump with a rapid cooling mechanism according to claim 2, characterized in that: A wind guiding hole is provided on one side of the mounting positioning box (14) close to the mounting fitting frame (18). The material of the sheet-shaped heat conduction block (16) is copper.

4. The hot water pump with a rapid cooling mechanism according to claim 3, wherein: A plurality of heat dissipation grooves are provided inside the sheet-shaped heat conduction block (16). The top end of the first semiconductor condensation plate (17) is connected to the sheet-shaped heat conduction block (16) by heat conduction glue.

5. The hot water pump with a rapid cooling mechanism according to claim 4, wherein: The cyclic auxiliary cooling and reduction module (9) includes a micro cyclic water pump (20), an output pipe (21), a first surrounding heat conduction pipe (22), a connecting pipe (23), a second surrounding heat conduction pipe (24), a return pipe (25), a condensation water tank (26) and a second semiconductor condensation plate (27). The top of the carrying and positioning box (14) is fixedly connected with a micro cyclic water pump (20). One side of the micro cyclic water pump (20) is fixedly connected with a condensation water tank (26). The other side of the micro cyclic water pump (20) is fixedly connected with an output pipe (21). The bottom end of the output pipe (21) is connected with a first surrounding heat conduction pipe (22). The bottom end of the first surrounding heat conduction pipe (22) is connected with a connecting pipe (23). One side of the connecting pipe (23) away from the first surrounding heat conduction pipe (22) is connected with a second surrounding heat conduction pipe (24). The top end of the second surrounding heat conduction pipe (24) is fixedly connected with a return pipe (25). One side of the top of the condensation water tank (26) is connected with the return pipe (25). The outer side of the condensation water tank (26) is connected with a second semiconductor condensation plate (27) through heat conduction glue.

6. The hot water pump with a rapid cooling mechanism according to claim 5, characterized in that: The output pipe (21), the first surrounding heat conduction pipe (22), the connecting pipe (23), the second surrounding heat conduction pipe (24) and the return pipe (25) are made of copper. The inner sides of the first surrounding heat conduction pipe (22) and the second surrounding heat conduction pipe (24) are both in contact with the cooling and reduction guiding pipe (11).

Images