Tool changer, tool changer control method and test system

Abstract

The application discloses a tool changing device, a tool changing device control method and a test system. The tool changing device comprises a bearing table for bearing and fixing a blade; a tool changing module which can pick up the blade on the bearing table and replace the blade; wherein the blade comprises at least two positioning holes, the bearing table comprises at least two positioning pins corresponding to the positioning holes, the size of the positioning pin is smaller than the size of the positioning hole, the position of at least part of the positioning pin is movable, the positioning pin is in contact with the side wall of the positioning hole and clamped by moving the positioning pin to complete the positioning and fixing of the blade on the bearing table. By applying the tool changing device to a semiconductor bonding strength test system, by improving the stepping module and adding the tool changing device, the automatic replacement of the blade is realized, the safety risk of manually replacing the blade is avoided, and the replacement of the blade is more convenient and fast.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a tool changing device, a tool changing device control method, and a testing system. Background Technology

[0002] In existing semiconductor products, bonding processes are usually involved, and bonding is a core process in the entire process flow. The bonding force of the bonding interface is a key indicator in the bonding process, which directly affects whether the subsequent process flow can proceed normally and the product yield. The existing method for testing bonding strength is the blade insertion method, which tests the bonding strength by inserting a blade into the bonding gap.

[0003] Existing testing equipment suffers wear and tear on the test blades after a certain number of uses, rendering them unusable for testing. As consumable parts, the blades must be replaced manually by operators after the equipment is shut down. This process is not only time-consuming and reduces testing efficiency, but also poses certain safety risks to the operators.

[0004] Further improvements to the semiconductor bonding strength testing system are expected to address this issue. Summary of the Invention

[0005] The purpose of this invention is to provide a tool changing device, a tool changing device control method, and a semiconductor bonding strength testing system. By improving the stepper module and the support platform and setting up a tool changing module, the automatic replacement of the blade is realized, avoiding the safety risks of manual blade replacement and making blade replacement faster and more convenient.

[0006] According to one aspect of the present invention, a tool changing device is provided, characterized in that it comprises: a support platform for supporting and fixing a blade; a tool changing module, the tool changing module being capable of picking up the blade on the support platform and replacing the blade; wherein the blade includes at least two positioning holes, the support platform includes at least two positioning pins corresponding to the positioning holes, the size of the positioning pins is smaller than the size of the positioning holes, at least a portion of the positioning pins are movable, and by moving the positioning pins, the positioning pins contact and lock with the side wall of the positioning holes in the positioning holes, thereby completing the positioning and fixing of the blade on the support platform.

[0007] Preferably, the support platform is further provided with an adsorption unit to adsorb the blade, and the adsorption unit has at least one adsorption function, namely electromagnetic adsorption or vacuum adsorption.

[0008] Preferably, at least one side of the support platform is provided with a barrier to assist in positioning the blade.

[0009] Preferably, the tool changing module includes a pickup unit, a blade slot, and a waste blade slot, and the pickup unit is used to pick up and release the blade.

[0010] Preferably, the picking unit includes a movable robotic arm and an end effector located at the end of the robotic arm for picking up and releasing the blade.

[0011] Preferably, the tool changing module further includes a control unit, which controls the tool changing module to replace the blade.

[0012] Preferably, the shape of the blade includes at least one of the following: circular, semi-circular, elliptical, triangular, rectangular, trapezoidal, and convex.

[0013] Preferably, the blade includes at least two cutting edge areas. When one cutting edge area of ​​the blade is unusable, the support platform and the blade changing module can move or rotate the blade and re-fix it so that the other cutting edge area is located in the working area.

[0014] According to another aspect of the present invention, a control method for a tool changing device is also provided, characterized in that the tool changing module includes a control unit, a sensor is provided on the support platform to obtain the number of times the blade is used, the sensor is electrically connected to the control unit, and the control method for the tool changing device includes the following steps: when the number of times the blade is used reaches a preset value and the blade is in a non-working state, the control unit controls the support platform to release the blade; a tool retrieval operation is performed, the control unit controls the tool changing module to pick up the blade on the support platform and remove it; a new blade is replaced and fixed, the tool changing module picks up the new blade, places it on the support platform, and fixes it through the support platform.

[0015] According to another aspect of the present invention, a testing system is also provided, characterized in that it comprises: a fixture for fixing a semiconductor under test; a stepping module located on one side of the fixture, the stepping module being capable of moving forward and backward toward the fixture; and a tool changing device; wherein the support platform is connected to the stepping module, the support platform being located at the end of the stepping module facing the fixture, the stepping module being capable of driving a blade on the support platform to move, so that the blade is inserted into the test gap of the semiconductor under test, and the tool changing device being capable of automatically changing the blade.

[0016] Preferably, an insulating layer is provided between the stepper module and the support platform to provide electrical isolation between the stepper module and the support platform.

[0017] Preferably, the tool changing module further includes a control unit. The stepper module is equipped with a sensor to obtain the number of movements of the stepper module. The sensor is electrically connected to the control unit. When the number of movements of the stepper module reaches a preset value, the control unit controls the tool changing module to replace the blade.

[0018] The tool changing device, tool changing device control method, and testing system provided by this invention, through improvements to the stepper module and the support platform and the addition of a tool changing module, achieve automated tool replacement, avoiding system downtime and manual tool replacement. This reduces the time spent on tool replacement, eliminates the safety risks associated with manual tool replacement, and makes tool replacement faster and more convenient. Furthermore, a sensor is incorporated to monitor the number of times the tool has been used, allowing for tool replacement before wear becomes too severe to affect normal testing, thus preventing tool wear from impacting test results and making the results more accurate. Attached Figure Description

[0019] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings.

[0020] Figure 1 A schematic diagram of an existing semiconductor bonding strength testing system is shown.

[0021] Figure 2 A schematic diagram of a semiconductor bonding strength testing system according to a first embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram of a semiconductor bonding strength testing system according to a second embodiment of the present invention is shown. Detailed Implementation

[0023] The invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown.

[0024] It should be understood that when describing the structure of a device, when referring to a component or region as being "above" or "on top of" another component or region, it may mean that it is directly above the other component or region, or that it contains other structures between itself and the other component or region.

[0025] In order to describe a situation where it is located directly on another component or another area, this article will use the expressions "directly on top of" or "on top of and adjacent to".

[0026] This invention can be presented in various forms. In order to highlight its functions and application scenarios, the tool changing device is described in conjunction with the test system below. Of course, the following description is only a few examples.

[0027] Figure 1 A schematic diagram of an existing semiconductor bonding strength testing system is shown; as follows: Figure 1 As shown, an existing semiconductor bonding strength testing system includes a stepper 20 and a tray (not shown) for fixing the wafer 10 under test. The stepper 20 can move forward and backward toward the wafer 10 under test, realizing a reciprocating motion as indicated by the arrow in the figure, so that the blade 30 on the stepper 20 can be inserted into the test gap of the wafer 10 under test. A support platform 21 is provided at the front end of the stepper 20 toward the wafer 10. The support platform 21 is used to support the blade 30. The blade 30 has two symmetrical through holes, and the support platform 21 has corresponding threaded holes. A bolt 31 passes through the through holes on the blade 30 and connects to the threaded holes, fixing the blade 30 to the support platform 21 by the bolt 31, so that the cutting edge of the blade 30 protrudes from the support platform 21. The wafer 10 under test has, for example, a bonding portion. When the stepper 20 moves toward the wafer 10 under test, the blade 30 can be inserted into the test gap (the gap of the bonding portion) of the wafer 10 under test to detect its bonding strength. When the blade 30 wears down to the point that it cannot be tested normally, the testing system needs to be stopped and an operator needs to enter and manually replace the blade 30. This replacement process is not only time-consuming, but also carries certain safety risks.

[0028] Figure 2 A schematic diagram of a semiconductor bonding strength testing system according to a first embodiment of the present invention is shown. This semiconductor bonding strength testing system includes a fixture 400, a stepping module 200, a support platform 210, and a tool changing module 500. The fixture 400 is used, for example, to fix the wafer 100 to be tested. The stepping module 200 is located, for example, on one side of the fixture 400. The stepping module 200 can reciprocate along the direction of the arrow, connecting the support platform 210 and the blade 300 thereon, so that the blade 300 is inserted into the test gap of the wafer 100. After repeated insertion and withdrawal, the cutting edge area of ​​the blade 300 will wear, thus affecting the normal performance of subsequent tests. The tool changing module 500 and the support platform 210 can automatically replace the worn blade 300 to ensure the normal performance of subsequent tests.

[0029] Specifically, the fixture 400, for example, has a baffle or a tray with vacuum adsorption or other means to fix the wafer 100 under test on the side opposite to the stepper module 200. A support platform 210 is provided at the front end of the stepper module 200 facing the wafer 100 under test. An insulating layer 220 is provided between the support platform 210 and the stepper module 200 to prevent the support platform 210 from becoming electrified. The support platform 210 is provided with an adsorption unit 212 and movable positioning pins 211. The blade 300 has two positioning holes 310, the size of which is, for example, larger than the size of the positioning pins 211. Both positioning pins 211 can move laterally, for example. When the positioning pins 211 move to the position shown in the figure... When positioning the blade 300 (moving from the center to both sides), the blade 300 can be positioned. For example, when installing the blade 300, the blade 300 falls from the corresponding position above the positioning pins 211. The positions of both positioning pins 211 are slightly moved towards the center relative to the position shown in the figure. Since the size of the positioning pins 211 is smaller than the size of the positioning hole 310, the positioning pins 211 can easily pass through the positioning hole 310. The blade 300 falls on the support platform 210. The two positioning pins 211 move to the left and right respectively to correct the position of the blade 300. When the positioning pins 211 move to the position shown in the figure and lock the blade 300, the positioning of the blade 300 is completed. Of course, it is not necessary to make the two positioning pins 211 far apart to complete the positioning of the blade 300, and the shape of the positioning hole 310 and the positioning pins 211 does not have to be circular. They can be changed according to the actual situation, such as using ellipses, semicircles, etc. After the blade 300 is positioned, the adsorption unit 212 is used to fix the blade 300 on the support platform 210. The adsorption unit 212, for example, uses a vacuum suction hole as shown in the figure to fix the blade 300 on the support platform 210 by vacuum adsorption. When the blade 300 is made of magnetic material, the adsorption unit 212 can also use an electromagnet to fix the blade 300 by magnetic adsorption. Of course, the adsorption unit 212 can simultaneously perform multiple adsorption functions such as vacuum adsorption and magnetic adsorption. The blade changing module 500 includes a pickup unit, a blade slot 520, a waste blade slot 530, and a control unit 540. The pickup unit includes an end effector 510 and a robotic arm (not shown in the figure). The pickup end 510 is connected to the robotic arm and electrically connected to the control unit 540.The tool changing process is as follows: First, the adsorption unit 212 of the stepper module 200 releases the blade 300, and the positioning pin 211 moves and disengages from the positioning hole 310; the control unit 540 controls the robotic arm to move the end effector 510 to the blade 300, where the end effector 510 picks up the blade 300. The robotic arm rises, and the end effector 510, along with the blade 300, rises, causing the positioning pin 211 to disengage from the positioning hole 310. The blade 300 is then moved above the waste tool groove 530, and the end effector 510 releases the blade 300. The blade 300 falls into the waste blade slot 530. The end effector 510 then moves to the blade slot 520 to pick up the new blade 300. The new blade 300 is moved to a position opposite to the positioning pin 211, and released. The blade 300 falls onto the support platform 210. The positioning pin 211 passes through the positioning hole 310 of the blade and moves until it contacts and locks with the edge of the positioning hole 310, completing the positioning. Finally, the adsorption unit 212 is activated to fix the blade 300, thus completing the replacement of the blade 300. Furthermore, the stepping module 200 also includes a sensor 230, which can record the number of its reciprocating motions, i.e., the number of times the blade 300 is inserted. The sensor 230 is electrically connected to the control unit 540, which also has a preset value. When the number of times the blade 300 is inserted reaches the preset value, the stepping module 200 is reset, and the control unit 540 controls the blade changing module 500 to replace the blade 300.

[0030] Figure 3 A schematic diagram of a semiconductor bonding strength testing system according to a second embodiment of the present invention is shown. In this embodiment, the blade 700 and the stepping module 600 are separated for clearer description. The semiconductor bonding strength testing system of this second embodiment is largely similar to that of the first embodiment, such as the insulating layer 620 and the adsorption unit 612, etc., which will not be described in detail here. Figure 3 As can be seen, a baffle 614 is also provided on the left side of the support platform 610 of the stepper module 600. The baffle 614 can assist in the positioning of the blade 700. Of course, the baffle 614 can also be changed to a groove or similar structure on the support platform 610 for assisting positioning. There are, for example, two positioning pins 611. The two positioning pins 611 can move laterally in the guide rail 613. Of course, although the two positioning pins 611 are located in the same guide rail 613 in the figure, they can be independently set in two sections of the guide rail according to the actual situation. The blade 700 is, for example, rectangular. In addition to the two positioning holes 710 symmetrically arranged in the middle, it also has a first cutting edge area 720 and a second cutting edge area 730. The two cutting edge areas are, for example, arranged opposite to each other. When the first cutting edge area 720 is worn and unusable, the blade 700 can be rotated 180° by the blade changing module and placed on the support platform 610 for continued use. When both cutting edge areas are worn and unusable, the blade 700 is replaced.

[0031] The semiconductor bonding strength testing system provided by this invention achieves automated blade replacement by improving the stepper module and the support platform, and incorporating a blade changing module. This avoids system downtime and manual blade replacement, reducing the time spent on blade replacement, eliminating the safety risks associated with manual blade replacement, and making blade replacement faster and more convenient. Furthermore, a sensor monitors the number of times the blade has been used, replacing the blade before it wears down to the point of affecting normal testing, thus preventing blade wear from impacting test results and making the test results more accurate.

[0032] In the above description, the dimensions, materials, and other technical details of each structure have not been described in detail. However, those skilled in the art should understand that dimensions and materials appropriate to their needs can be adopted. Furthermore, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0033] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. The scope of the invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. A tool changer for use in a semiconductor bond strength testing system, comprising: include: The support platform is used to support and hold the blade. A tool changing module is provided, which can pick up the blades on the support platform and replace the blades. The blade includes at least two positioning holes, and the support platform includes at least two positioning pins corresponding to the positioning holes. The size of the positioning pins is smaller than the size of the positioning holes, and at least part of the positioning pins are movable. By moving the positioning pins, the positioning pins contact and lock with the side wall of the positioning holes in the positioning holes, thereby completing the positioning and fixing of the blade on the support platform. At least one side of the support platform is provided with a barrier to assist in the positioning of the blade.

2. The tool changer according to claim 1, characterized in that The support platform is also equipped with an adsorption unit to adsorb the blade, and the adsorption unit has at least one adsorption function, namely electromagnetic adsorption and vacuum adsorption.

3. The tool changer according to claim 1, characterized in that The tool changing module includes a pickup unit, a blade slot, and a waste blade slot. The pickup unit is used to pick up and release the blade.

4. The tool changer according to claim 3, characterized in that The picking unit includes a movable robotic arm and an end effector located at the end of the robotic arm for picking up and releasing the blade.

5. The tool changing device according to claim 3, characterized in that, The tool changing module also includes a control unit, which controls the tool changing module to replace the blade.

6. The tool changing device according to claim 1, characterized in that, The blade is shaped as one of the following: circular, semi-circular, elliptical, triangular, rectangular, trapezoidal, or convex.

7. The tool changing device according to claim 1, characterized in that, The blade includes at least two cutting edge areas. When one cutting edge area of ​​the blade is unusable, the support platform and the tool changing module can move or rotate the blade and re-fix it so that the other cutting edge area is located in the working area.

8. A control method for a tool changing device applied in a semiconductor bonding strength testing system, characterized in that, The tool changing device is as described in any one of claims 1-7, wherein the tool changing module includes a control unit, a sensor is provided on the support platform to obtain the number of times the blade is operated, the sensor is electrically connected to the control unit, and the control method of the tool changing device includes the following steps: When the number of times the blade operates reaches a preset value and the blade is in a non-operating state, the control unit controls the support platform to release the blade; The tool removal operation is performed by the control unit controlling the tool changing module to pick up the blade on the support platform and remove it. Replace and secure the new blade. The blade replacement module picks up the new blade, places it on the support platform, and secures it through the support platform.

9. A testing system, characterized in that, include: A fixture used to hold the semiconductor under test; A stepping module is located on one side of the fixture, and the stepping module can move forward and backward in the direction of the fixture; The tool changing device as described in any one of claims 1-7; The carrier platform is connected to the stepper module, and the carrier platform is located at the end of the stepper module facing the fixture. The stepper module can drive the blade on the carrier platform to move, so that the blade is inserted into the test gap of the semiconductor under test. The blade changing device can automatically change the blade.

10. The testing system according to claim 9, characterized in that, An insulating layer is also provided between the stepper module and the support platform to provide electrical isolation between the stepper module and the support platform.

11. The testing system according to claim 9, characterized in that, The tool changing module also includes a control unit. The stepper module is equipped with a sensor to obtain the number of times the stepper module moves. The sensor is electrically connected to the control unit. When the number of times the stepper module moves reaches a preset value, the control unit controls the tool changing module to replace the blade.

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