Wafer cleaning apparatus, device and method

Abstract

The application discloses a wafer cleaning device, equipment and a cleaning method, the wafer cleaning device includes main drive assembly, slave drive assembly and state detection component, slave drive assembly is driven under the drive of main drive assembly, and the wafer to be cleaned is rotated, and state detection component obtains detection data for detecting whether the rotation state of the wafer to be cleaned is normal, and slave drive assembly moves along the extension direction of the second rotation axis when the rotation state of the wafer to be cleaned is abnormal, so that the rotation state of the wafer to be cleaned is normal, i.e., the rotation speed of the wafer to be cleaned is normal, and then the probability of fragments caused by low rotation speed, unstable rotation speed or non-rotation of the wafer can be reduced, and the wafer cleaning effect can be improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and in particular to a wafer cleaning apparatus, equipment, and cleaning method. Background Technology

[0002] In the cleaning section of a CMP machine, to achieve a good and uniform cleaning effect, the wafers are kept rotating at a constant speed inside the cleaning tank driven by rollers, typically at 50 r / min.

[0003] like Figure 1 As shown, the active roller drives the driven roller to rotate, thereby rotating the wafer. The wafer's rotation drives the speed measuring roller to rotate, converting the speed of the speed measuring roller into the actual speed of the wafer.

[0004] During the wafer cleaning process, issues such as low wafer rotation speed, unstable rotation speed, or no rotation speed may lead to wafer fragmentation and poor cleaning effect. Summary of the Invention

[0005] This invention provides a wafer cleaning apparatus, device, and cleaning method to solve the problems of wafer fragmentation and poor cleaning effect caused by low, unstable, or no rotation speed of the wafer during the wafer cleaning process in the prior art.

[0006] In a first aspect, embodiments of the present invention provide a wafer cleaning apparatus, comprising:

[0007] The main drive assembly is used to rotate about the first rotation axis;

[0008] The drive component is connected to the main drive component and is used to drive the wafer being cleaned to rotate under the drive of the main drive component.

[0009] A state detection component is used to acquire detection data to determine whether the rotation state of the wafer being cleaned is normal.

[0010] The slave drive assembly is further configured to, in the event of an abnormal rotation state, move along the extension direction of the second rotation axis of the slave drive assembly to restore the normal rotation state of the wafer being cleaned.

[0011] In one possible implementation, the driven component includes a telescopic motor, a connecting mechanism, and a driven roller;

[0012] The telescopic motor is connected to the driven roller via the connecting mechanism;

[0013] The telescopic motor is used to control the driven roller to move along the extension direction of the second rotation axis.

[0014] In one possible implementation, the telescopic motor is a lead screw motor;

[0015] The lead screw motor includes a motor body and a motor shaft, the motor shaft being a lead screw, and a movable block cooperating with the lead screw is provided on the lead screw.

[0016] In one possible implementation, the connecting mechanism includes a ball bearing and a connecting shaft;

[0017] The inner ring of the ball bearing is sleeved around the periphery of the moving block and fixed to the moving block;

[0018] The connecting shaft is tubular and is sleeved around the circumference of the lead screw. One end of the connecting shaft is fixed to the outer ring of the ball bearing, and the driven roller is sleeved around the circumference of the connecting shaft.

[0019] In one possible implementation, the main drive assembly and the slave drive assembly are connected by a transmission mechanism;

[0020] The transmission mechanism includes a first gear and a second gear, which are meshed together; the first gear is coaxial with the first rotation axis, the second gear is sleeved on the outer ring of the ball bearing, and the second gear is fixed to one end of the connecting shaft.

[0021] In one possible implementation, the wafer cleaning apparatus further includes a first rack, a second rack, a first nozzle disposed opposite to a first surface of the wafer to be cleaned, and a second nozzle disposed opposite to a second surface of the wafer to be cleaned. The first nozzle is disposed on the first rack, and the second nozzle is disposed on the second rack. The first nozzle is used to spray liquid onto the first surface of the wafer to be cleaned, and the second nozzle is used to spray liquid onto the second surface of the wafer to be cleaned.

[0022] The status detection component includes a water pressure transducer;

[0023] The water pressure transducer is mounted on the first rack or the second rack and is used to receive the reaction force generated by the liquid acting on the first surface or the second surface of the wafer being cleaned and convert the reaction force into voltage, wherein the voltage is the detection data;

[0024] and / or

[0025] The wafer cleaning apparatus further includes a speed measuring component, which is used to rotate about a third rotation axis under the drive of the wafer being cleaned.

[0026] In a second aspect, embodiments of the present invention provide a wafer cleaning apparatus, including a defect detection and classification system and a wafer cleaning device as described in any one of the first aspects;

[0027] The defect detection and classification system is communicatively connected to the state detection component and the slave drive component, respectively. It is used to acquire detection data through the state detection component to detect whether the rotation state of the wafer being cleaned is normal, and when it is determined from the detection data that the rotation state of the wafer being cleaned is abnormal, it controls the slave drive component to move along the extension direction of the second rotation axis of the slave drive component so that the rotation state of the wafer being cleaned is normal.

[0028] In one possible implementation, the defect detection and classification system is also communicatively connected to the main drive component and the speed measurement component;

[0029] The defect detection and classification system is also used to obtain the actual rotational speed of the wafer being cleaned through the speed measuring component, and to obtain the torque of the drive motor in the main drive component through the main drive component; and to determine whether the rotational state of the wafer being cleaned is normal based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor.

[0030] In one possible implementation, the defect detection and classification system is also used for:

[0031] Based on the actual rotational speed of the wafer being cleaned, determine whether the moving direction of the drive component is correct;

[0032] If the movement direction is incorrect, the drive component is controlled to move in the opposite direction of the previous movement direction.

[0033] Thirdly, embodiments of the present invention provide a wafer rotation state adjustment method, applied to a wafer cleaning equipment as described in any one of the second aspects, the method comprising:

[0034] The main drive assembly is controlled to rotate, so that the slave drive assembly drives the wafer to be cleaned to rotate under the drive of the main drive assembly;

[0035] Determine whether the rotation state of the wafer being cleaned is normal. If not, control the drive assembly to move along the extension direction of the second rotation axis of the drive assembly so that the rotation state of the wafer being cleaned is normal.

[0036] In one possible implementation, determining whether the rotation state of the wafer being cleaned is normal includes:

[0037] Liquid is sprayed onto the first and second surfaces of the wafer being cleaned, and the rotation state of the wafer being cleaned is determined to be normal based on the reaction force generated by the liquid acting on the first or second surface of the wafer.

[0038] In one possible implementation, determining whether the rotational state of the wafer being cleaned is normal based on the reaction force generated by the liquid acting on the first or second surface of the wafer being cleaned includes:

[0039] The reaction force is converted into voltage using a water pressure converter;

[0040] The voltage is compared with a preset voltage, and the rotation state of the wafer being cleaned is determined based on the comparison result.

[0041] In one possible implementation, determining whether the rotation state of the wafer being cleaned is normal based on the comparison result includes:

[0042] If the voltage is equal to the preset voltage, the rotation state is determined to be normal; otherwise, the rotation state is determined to be abnormal.

[0043] In one possible implementation, before controlling the movement of the slave drive assembly along the extension direction of the second rotation axis of the slave drive assembly, the method further includes:

[0044] The direction of movement is determined based on the comparison between the voltage and the preset voltage.

[0045] In one possible implementation, if the water pressure transducer is disposed on the first rack of the wafer cleaning apparatus, then determining the moving direction based on the comparison result of the voltage and the preset voltage includes:

[0046] If the voltage is greater than the preset voltage, the moving direction is towards the first surface of the wafer being cleaned; if the voltage is less than the preset voltage, the moving direction is away from the first surface of the wafer being cleaned.

[0047] If the water pressure transducer is installed on the second rack of the wafer cleaning apparatus, then determining the direction of movement based on the comparison between the voltage and the preset voltage includes:

[0048] If the voltage is greater than the preset voltage, the moving direction is towards the second surface of the wafer being cleaned; if the voltage is less than the preset voltage, the moving direction is away from the second surface of the wafer being cleaned.

[0049] In one possible implementation, controlling the movement of the driven component along the extension direction of the second rotational axis of the driven component includes:

[0050] The driven roller in the drive assembly is controlled to move along the extension direction of the second rotation axis according to the step value.

[0051] In one possible implementation, before controlling the movement of the slave drive assembly along the extension direction of the second rotation axis of the slave drive assembly, the method further includes:

[0052] The abnormal rotational state of the wafer being cleaned is determined based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor in the main drive assembly.

[0053] In one possible implementation, after controlling the driven component to move along the extension direction of the second rotation axis of the driven component, the method further includes:

[0054] Based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor in the main drive assembly, determine whether the rotational state of the wafer being cleaned has returned to normal.

[0055] In one possible implementation, after controlling the driven component to move along the extension direction of the second rotation axis of the driven component, the method further includes:

[0056] Based on the actual rotational speed of the wafer being cleaned, determine whether the moving direction of the drive component is correct;

[0057] If the movement direction is incorrect, the drive component is controlled to move in the opposite direction of the previous movement direction.

[0058] The beneficial effects of this invention are as follows:

[0059] This invention provides a wafer cleaning apparatus, device, and cleaning method. The wafer cleaning apparatus includes a main drive component, a slave drive component, and a status detection component. The main drive component rotates around a first rotation axis. The slave drive component, driven by the main drive component, rotates the wafer to be cleaned. The status detection component acquires detection data to determine whether the rotation state of the wafer to be cleaned is normal. If the rotation state of the wafer to be cleaned is abnormal, the slave drive component moves along the extension direction of the second rotation axis of the slave drive component to normalize the rotation state of the wafer to be cleaned. Because the status detection component can acquire detection data to determine whether the rotation state of the wafer to be cleaned is normal, and the slave drive component moves along the extension direction of the second rotation axis of the slave drive component when the rotation state of the wafer to be cleaned is abnormal, thereby normalizing the rotation state of the wafer to be cleaned, i.e., ensuring the normal rotation speed of the wafer to be cleaned, it can reduce the fragmentation problem caused by low, unstable, or no wafer rotation speed, and also improve the wafer cleaning effect. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 This is a structural diagram showing the position of each roller in the related technology;

[0062] Figure 2 This is a schematic diagram of a wafer cleaning apparatus provided in an embodiment of the present invention;

[0063] Figure 3 This is a schematic diagram of the structure of the master drive component and the slave drive component in the related technology;

[0064] Figure 4 A schematic diagram of the structure of a telescopic motor provided in an embodiment of the present invention;

[0065] Figure 5 This is a schematic diagram of the structure of a ball bearing provided in an embodiment of the present invention;

[0066] Figure 6 A schematic diagram of a connecting shaft provided in an embodiment of the present invention;

[0067] Figure 7 A schematic diagram of the connection between a lead screw motor, a connecting mechanism, and a driven roller is provided for an embodiment of the present invention;

[0068] Figure 8A schematic diagram of the connection between a ball bearing and a first gear is provided in an embodiment of the present invention;

[0069] Figure 9 This is a schematic diagram of a wafer cleaning apparatus provided in an embodiment of the present invention;

[0070] Figure 10 This is a schematic diagram of another wafer cleaning apparatus provided in an embodiment of the present invention;

[0071] Figure 11 This is a schematic diagram of another wafer cleaning apparatus provided in an embodiment of the present invention;

[0072] Figure 12 This is a structural schematic diagram showing the positions of each roller according to an embodiment of the present invention;

[0073] Figure 13 This is a schematic diagram of the structure of a wafer cleaning device provided in an embodiment of the present invention;

[0074] Figure 14 This is a schematic diagram of another wafer cleaning device provided in an embodiment of the present invention;

[0075] Figure 15 This is a schematic diagram illustrating the movement direction of a moving block according to an embodiment of the present invention;

[0076] Figure 16 This is a schematic flowchart of a wafer cleaning method provided in an embodiment of the present invention;

[0077] Figure 17 A schematic diagram illustrating the formation of a reaction force provided in an embodiment of the present invention;

[0078] Figure 18 This is another schematic diagram of the formation of a reaction force provided in an embodiment of the present invention;

[0079] Figure 19 This is another schematic diagram of the formation of a reaction force provided in an embodiment of the present invention;

[0080] Figure 20 A graph showing the moving distance of a moving block and the rotational speed of a wafer is provided for an embodiment of the present invention;

[0081] Figure 21 Another graph showing the moving block distance and wafer rotation speed provided in an embodiment of the present invention. Detailed Implementation

[0082] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0083] During the wafer cleaning process, the roller gaskets are the ones that actually contact the wafer edge. Since the gaskets are made of rubber, they have a limited lifespan. When the roller gaskets need to be replaced, it can lead to low wafer rotation speed, unstable rotation speed, or no rotation at all. In addition, the thickness of wafers varies from product to product, generally ranging from 0.5mm to 0.7mm. Besides thickness, the curvature of wafers also changes with the advancement of the manufacturing process. If wafers from different products use the same cleaning equipment, low rotation speed, unstable rotation speed, or no rotation at all can also occur.

[0084] To address the aforementioned problems, embodiments of the present invention provide a wafer cleaning apparatus, such as... Figure 2 As shown, the wafer cleaning apparatus includes a main drive assembly 21, a slave drive assembly 22, and a status detection assembly 23;

[0085] Main drive assembly 21, for rotating about a first rotation axis;

[0086] The drive component 22 is connected to the main drive component 21 and is used to drive the wafer being cleaned to rotate under the drive of the main drive component 21.

[0087] The status detection component 23 is used to acquire detection data to determine whether the rotational state of the wafer being cleaned is normal.

[0088] The drive assembly 22 is also used to move along the extension direction of the second rotation axis from the drive assembly 22 in case the rotation state of the wafer being cleaned is abnormal, so as to make the wafer being cleaned rotate normally.

[0089] The wafer cleaning apparatus provided in this embodiment of the invention includes a main drive assembly that rotates around a first rotation axis, and a driven component that rotates the wafer to be cleaned under the drive of the main drive assembly. A state detection assembly acquires detection data to determine whether the rotation state of the wafer to be cleaned is normal. If the rotation state of the wafer to be cleaned is abnormal, the driven component moves along the extension direction of the second rotation axis of the drive assembly to restore the normal rotation state of the wafer. Because the state detection assembly can acquire detection data to determine whether the rotation state of the wafer to be cleaned is normal, and the driven component moves along the extension direction of the second rotation axis of the drive assembly when the rotation state of the wafer to be cleaned is abnormal, the normal rotation state of the wafer to be cleaned is achieved, i.e., the normal rotation speed of the wafer. This reduces the probability of fragmentation caused by low, unstable, or no wafer rotation speed, and also improves the wafer cleaning effect.

[0090] In this embodiment of the invention, the first rotation axis is the rotation axis of the main drive component itself, and the second rotation axis is the rotation axis of the slave drive component itself.

[0091] like Figure 3 As shown, the main drive assembly may include a drive motor and an active roller, and the driven assembly may include a telescopic motor, a connecting mechanism, and a driven roller. The main drive assembly and the driven assembly are connected by a transmission mechanism, which includes a first gear and a second gear. The first gear and the second gear are meshed together. When the drive motor drives the active roller to rotate around the first axis, the driven roller is driven to rotate through the first gear and the second gear, thereby driving the wafer being cleaned to rotate.

[0092] In one embodiment, the telescopic motor is connected to the driven roller via a connecting mechanism, and the telescopic motor can control the driven roller to move along the extension direction of the second rotation axis.

[0093] In specific implementation, such as Figure 4 As shown, the telescopic motor can be a lead screw motor, which includes a main body 401 and a motor shaft 402. The motor shaft is a lead screw, and a moving block 403 that cooperates with the lead screw is provided on the lead screw.

[0094] like Figure 5 , Figure 6 and Figure 7 As shown, the connecting mechanism may include a ball bearing 501 and a connecting shaft 502. The inner ring of the ball bearing 501 is sleeved on the periphery of the moving block 403 and fixed to the moving block 403. The connecting shaft 502 is tubular and is sleeved on the periphery of the lead screw 402. One end of the connecting shaft 502 is fixed to the outer ring of the ball bearing 501, and the driven roller is sleeved on the periphery of the connecting shaft 502.

[0095] The connecting mechanism may also include a nut, which is fixedly connected to one end of the lead screw to limit the movement of the block and prevent the block from detaching from the lead screw.

[0096] The shape of the periphery of the movable block 403 is adapted to the shape of the inner ring of the ball bearing 501. For example, the shape of the periphery of the movable block 403 and the shape of the inner ring of the ball bearing 501 are both regular hexagons.

[0097] Reference Figure 7 When the lead screw of the lead screw motor rotates, the moving block 403 can move on the lead screw 402. The ball bearing 501 and the connecting shaft 502 will also move on the lead screw 402 along with the moving block 403. The driven roller is sleeved on the connecting shaft 502, so the driven roller can also move on the lead screw 402.

[0098] In this embodiment of the invention, the driven roller can rotate about the second rotation axis and can also move along the extension direction of the second rotation axis. Therefore, as... Figure 8 As shown, the second gear can be sleeved on the outer ring of the ball bearing 501, and the second gear is fixed to one end of the connecting shaft 502.

[0099] The wafer cleaning apparatus provided in this embodiment of the invention includes, in addition to a main drive assembly, a slave drive assembly, and a status detection assembly, such as... Figure 9 As shown, it also includes a first rack 901, a second rack 902, a first nozzle 903 disposed opposite to the first surface of the wafer to be cleaned, and a second nozzle 904 disposed opposite to the second surface of the wafer to be cleaned. The first nozzle 903 is disposed on the first rack 901, and the second nozzle 904 is disposed on the second rack 902. The first nozzle 903 is connected to the liquid pipe 1 and is used to spray liquid onto the first surface of the wafer to be cleaned. The second nozzle 904 is connected to the liquid pipe 2 and is used to spray liquid onto the second surface of the wafer to be cleaned.

[0100] Reference Figure 10 and Figure 11 The status detection component includes a water pressure transducer 905, which is disposed on a first rack 901 or a second rack 902. The water pressure transducer 905 is used to receive the reaction force generated by the liquid acting on the first or second surface of the wafer being cleaned and convert the reaction force into voltage. The voltage is the detection data for detecting whether the rotation state of the wafer being cleaned is normal.

[0101] The main reason for low, unstable, or no rotation speed of the wafer being cleaned in the cleaning tank is that the driving roller, driven roller, and speed measuring roller are not aligned. For example, this can be due to prolonged use causing them to be misaligned, or the wafer may have a certain curvature or be thick, leading to misalignment. Figure 12 As shown.

[0102] In this embodiment of the invention, a water pressure transducer is installed on a first or second rack. The water pressure transducer receives the reaction force generated by the liquid acting on the first or second surface of the wafer being cleaned and converts the reaction force into voltage. Based on the voltage, it is determined whether there is a misalignment between the driven roller and the driving roller. If there is a misalignment, the position of the driven roller along the extension direction of the second rotation axis is adjusted by a lead screw motor so that there is no misalignment between the driven roller and the driving roller, that is, they are on the same straight line, thereby ensuring that the rotation state of the wafer being cleaned is normal.

[0103] It should be noted that, in the embodiments of the present invention, the water pressure sensor can be installed not only on the first frame or the second frame, but also on the first nozzle or the second nozzle. Any location where the reaction force can be detected can be used as the installation location of the water pressure sensor.

[0104] In this embodiment of the invention, the liquid sprayed onto the wafer being cleaned can not only detect whether the rotation state of the wafer being cleaned is normal, but also moisturize the surface of the wafer being cleaned.

[0105] The wafer cleaning apparatus disclosed in this embodiment of the invention further includes a speed measuring component, which is used to rotate about a third rotation axis under the drive of the wafer being cleaned.

[0106] The speed measuring component here is the speed measuring roller, and the third rotation axis is the axis of rotation of the speed measuring roller itself.

[0107] Based on the same inventive concept, this invention also provides a wafer cleaning device, which includes a defect detection and classification system and any of the above-mentioned wafer cleaning apparatus. The principle of the device in solving the problem is similar to that of the wafer cleaning device in solving the problem, and the repeated parts will not be described again.

[0108] like Figure 13 As shown, an embodiment of the present invention provides a wafer cleaning apparatus, including a defect detection and classification system 131 and a wafer cleaning device 132;

[0109] The defect detection and classification system 131 is communicatively connected to the state detection component 23 and the drive component 22, respectively. It is used to acquire detection data through the state detection component 23 to detect whether the rotation state of the wafer being cleaned is normal, and when it is determined that the rotation state of the wafer being cleaned is abnormal based on the detection data, it controls the drive component 22 to move along the extension direction of the second rotation axis of the drive component so that the rotation state of the wafer being cleaned is normal.

[0110] In this embodiment of the invention, since the defect detection and classification system can control the drive assembly to move along the extension direction of the second rotation axis of the drive assembly when it determines that the rotation state of the wafer being cleaned is abnormal, so as to achieve the purpose of normal rotation state of the wafer being cleaned, thereby reducing the probability of fragmentation caused by low wafer rotation speed, unstable rotation speed or no rotation, and also improving the wafer cleaning effect.

[0111] like Figure 14 As shown, the defect detection and classification system 131 is also communicatively connected to the main drive component 21 and the speed measurement component 24;

[0112] The defect detection and classification system 131 is also used to obtain the actual rotation speed of the wafer being cleaned through the speed measuring component 24 and the torque of the drive motor in the main drive component through the main drive component 21; and to determine whether the rotation state of the wafer being cleaned is normal based on the actual rotation speed of the wafer being cleaned and / or the torque of the drive motor.

[0113] In one embodiment, after the defect detection and classification system 131 obtains the actual rotation speed of the wafer being cleaned through the speed measuring component 24, it can determine whether the moving direction of the drive component 22 is correct based on the actual rotation speed of the wafer being cleaned. If the moving direction is incorrect, it controls the drive component to move in the opposite direction of the previous moving direction.

[0114] For example, such as Figure 15 When the defect detection and classification system 131 determines that the rotational state of the wafer being cleaned is abnormal based on the detection data, it controls the drive assembly 22 to move along the first direction, that is, controls the moving block 403 on the lead screw motor to move along the first direction. Then, based on the actual rotational speed of the wafer being cleaned, the defect detection and classification system 131 determines that the direction of movement is incorrect, and controls the moving block 403 on the lead screw motor to move along the second direction.

[0115] Based on the same inventive concept, this invention also provides a wafer rotation state adjustment method. This method is applied to any of the above-mentioned wafer cleaning equipment. The principle of this method in solving the problem is similar to that of the wafer cleaning equipment in solving the problem, and the repeated parts will not be described again.

[0116] like Figure 16 The diagram shown is a flowchart illustrating a wafer rotation state adjustment method provided in an embodiment of the present invention. The method includes:

[0117] S1601. Control the main drive assembly to rotate, so that under the drive of the main drive assembly, the slave drive assembly drives the wafer to be cleaned to rotate.

[0118] S1602. Determine whether the rotation state of the wafer being cleaned is normal. If not, control the drive assembly to move along the extension direction of the second rotation axis of the drive assembly so that the rotation state of the wafer being cleaned is normal.

[0119] The present invention provides a wafer rotation state adjustment method. When the wafer rotation state is determined to be abnormal, the control component moves along the extension direction of the second rotation axis of the drive component, thereby normalizing the rotation state of the wafer being cleaned. This can reduce the probability of fragmentation caused by low wafer rotation speed, unstable rotation speed, or no rotation, and can also improve the wafer cleaning effect.

[0120] In practice, the rotation state of the wafer being cleaned can be determined in the following way: liquid is sprayed onto the first and second surfaces of the wafer being cleaned through the first and second nozzles, and the reaction force of the liquid acting on the first or second surface of the wafer being cleaned is obtained through the water pressure transducer to determine whether the rotation state of the wafer being cleaned is normal.

[0121] Specifically, the water pressure transducer converts the reaction force of the liquid acting on the first or second surface of the wafer being cleaned into voltage. The defect detection and classification system obtains this voltage through the water pressure transducer, then compares the voltage with a preset voltage, and determines whether the rotation state of the wafer being cleaned is normal based on the comparison result.

[0122] For example, such as Figure 17 As shown, the arrow pointing from the first nozzle 903 to the wafer indicates the direction in which the first nozzle 903 sprays liquid onto the wafer, and the arrow pointing from the wafer to the water pressure transducer 905 indicates the direction of the reaction force. Under normal circumstances, the voltage converted from the reaction force by the water pressure transducer 905 is constant. If the wafer being cleaned rotates abnormally, that is, if the drive assembly and the main drive assembly are not aligned, such as... Figure 18 and Figure 19 As shown, the voltage converted from the reaction force by the water pressure converter 905 will change. According to the comparison result between this voltage and the preset voltage, the embodiment of the present invention determines whether the rotation state is normal.

[0123] If the voltage equals the preset voltage, the rotation state of the wafer being cleaned is determined to be normal; otherwise, the rotation state is determined to be abnormal.

[0124] like Figure 18As shown, 221 is the driven roller and 211 is the driving roller. In this figure, since the driven roller 221 is offset relative to the driving roller 211 towards the liquid pipe 1, the straight-line distance between the first nozzle 903 and the wafer being cleaned becomes smaller. This reduces the distance from which the liquid is sprayed from the first nozzle 903 to the first surface of the wafer being cleaned, thus increasing the force exerted by the liquid on the wafer being cleaned. As this force increases, its reaction force also increases. Therefore, the voltage obtained by the water pressure converter 905 after converting this reaction force will also increase, meaning that this voltage is greater than the preset voltage.

[0125] like Figure 19 As shown, since the driven roller 221 is offset relative to the driving roller 211 towards the liquid pipe 2, the distance between the first nozzle 903 and the wafer being cleaned increases, which reduces the force exerted by the liquid on the wafer being cleaned. As this force decreases, its reaction force also decreases. Therefore, the voltage obtained by the water pressure converter 905 after converting this reaction force will also decrease, that is, the voltage is less than the preset voltage.

[0126] The principle of the water pressure transducer 905 installed on the second frame 902 is the same as that of the water pressure transducer 905 installed on the first frame 901. Please refer to the description and examples of the water pressure transducer 905 installed on the first frame 901. It will not be repeated here.

[0127] In another embodiment, the determination of whether the rotation state of the wafer being cleaned is normal can also be made by using the actual rotation speed of the wafer being cleaned obtained by the speed measuring component. For example, the wafer being cleaned corresponds to a preset rotation speed. The defect detection and classification system obtains the rotation speed of the speed measuring component through the speed measuring component, and then converts the rotation speed of the speed measuring component into the rotation speed of the wafer being cleaned according to a preset relationship. The converted rotation speed of the wafer being cleaned is the actual rotation speed of the wafer being cleaned. The defect detection and classification system compares the actual rotation speed with the preset rotation speed. If the comparison result is the same, it is determined that the rotation speed of the wafer being cleaned is normal; otherwise, it is determined that the rotation speed of the wafer being cleaned is abnormal.

[0128] In another implementation, the normality of the rotation state of the wafer being cleaned can also be determined based on the torque of the drive motor in the main drive assembly. There is a corresponding relationship between the torque of the drive motor and the normal rotation speed of the wafer being cleaned. That is, if the rotation state of the wafer being cleaned is normal, it means that the rotation speed of the wafer being cleaned is normal, and the normal torque of the drive motor is the torque corresponding to the normal rotation speed of the wafer being cleaned. If the torque of the drive motor obtained by the defect detection and classification system is the same as the normal torque of the drive motor, it is determined that the rotation state of the wafer being cleaned is normal; otherwise, it is determined that the rotation state of the wafer being cleaned is abnormal.

[0129] In this embodiment of the invention, the rotation state of the wafer being cleaned can be determined by any one or more of the above methods, and this embodiment of the invention does not limit the scope of the determination.

[0130] Once it is determined that the rotation state of the wafer being cleaned is abnormal, the control is moved along the extension direction of the second rotation axis of the drive assembly, that is, the moving block on the control screw motor is moved to adjust the position of the driven roller, thereby adjusting the rotation state of the wafer being cleaned until the rotation state of the wafer being cleaned is normal.

[0131] Before controlling the movement of the moving block on the lead screw motor, the direction of movement of the moving block must first be determined. Specifically, the direction of movement can be determined based on the comparison between the voltage and the preset voltage.

[0132] The determination of the movement direction in the embodiments of the present invention will be explained below through two different scenarios.

[0133] Scenario 1: The water pressure converter is installed on the first frame.

[0134] If the voltage is greater than the preset voltage, the movement direction is towards the first surface of the wafer being cleaned, as shown in the reference. Figure 18 If the voltage is less than the preset voltage, the direction of movement is away from the first surface of the wafer being cleaned, as shown in the reference. Figure 19 .

[0135] Scenario 2: The water pressure converter is installed on the second frame.

[0136] If the voltage is greater than the preset voltage, the moving direction is towards the second surface of the wafer being cleaned; if the voltage is less than the preset voltage, the moving direction is away from the second surface of the wafer being cleaned.

[0137] In a specific implementation, controlling the movement of the drive assembly along the extension direction of the second rotation axis can control the driven roller in the drive assembly to move along the direction of the second rotation axis according to the step value.

[0138] For example, if the defect detection and classification system determines that the direction of movement is pointing towards the first surface, it controls the moving block on the lead screw motor to move one step distance in the direction of pointing towards the first surface. If the direction of movement is determined to be pointing towards the first surface again, it controls the moving block on the lead screw motor to move another step distance in the direction of pointing towards the first surface.

[0139] After the defect detection and classification system controls the drive assembly to move along the extension direction of the second rotation axis, it can also determine whether the movement direction of the drive assembly is correct based on the actual rotation speed of the wafer being cleaned. If the movement direction is incorrect, it controls the drive assembly to move in the opposite direction of the previous movement direction.

[0140] For example, such as Figure 20 As shown, if the defect detection and classification system detects that the rotational speed of the wafer being cleaned is 0, it determines that the rotational state of the wafer being cleaned is abnormal. The defect detection and classification system determines the movement direction of the moving block on the lead screw motor as the first direction. The defect detection and classification system controls the moving block to move one step value (0.5 cm) along the first direction through the lead screw motor. After the moving block moves one step value along the first direction, if the defect detection and classification system detects that the rotational speed of the wafer being cleaned is greater than 0, it determines that the movement direction is correct. It then controls the lead screw motor to continue controlling the moving block to move one step value along the first direction until the rotational speed of the wafer being cleaned reaches 50 r / min. Finally, the defect detection and classification system controls the lead screw motor to stop working.

[0141] like Figure 21 As shown, if the defect detection and classification system detects that the rotational speed of the wafer being cleaned is 0, it determines that the rotational state of the wafer being cleaned is abnormal. The defect detection and classification system determines the movement direction of the moving block on the lead screw motor as the first direction. The defect detection and classification system controls the moving block to move one step value (0.5 cm) along the first direction through the lead screw motor. After the moving block moves one step value along the first direction, if the defect detection and classification system detects that the rotational speed of the wafer being cleaned is still 0, it determines that the movement direction is incorrect. It then controls the lead screw motor to continue controlling the moving block to move one step value in the opposite direction of the first direction, that is, to return the moving block to the initial position. If the defect detection and classification system detects that the rotational speed of the wafer being cleaned is not 0, it determines that the movement direction is correct. It then continues to control the moving block to move one step value in the opposite direction of the first direction until the rotational speed of the wafer being cleaned reaches 50 r / min. Finally, the defect detection and classification system controls the lead screw motor to stop working.

[0142] It should be noted that, Figure 20 and Figure 21 The distance in the equation is the distance between the moving slider and the reference position, which can be the initial position or a fixed position on the lead screw.

[0143] After the defect detection and classification system controls the movement of the drive assembly along the extension direction of the second rotation axis of the drive assembly, in addition to determining whether the movement direction is correct, it can also determine whether the rotation state of the wafer being cleaned has returned to normal based on the actual rotation speed of the wafer being cleaned and / or the torque of the drive motor.

[0144] To determine whether the rotational state of the wafer being cleaned has returned to normal, i.e., whether the wafer's rotational speed is normal, the speed of the acquired speed measuring component can be converted into the actual rotational speed of the wafer being cleaned. The defect detection and classification system compares this actual rotational speed with a preset speed. If the comparison result is the same, the wafer's rotational speed is determined to be normal; otherwise, the wafer's rotational speed is determined to be abnormal. Alternatively, the torque of the drive motor can be compared with the normal torque of the drive motor. If they are the same, the wafer's rotational state has returned to normal; otherwise, it has not returned to normal. Here, the normal torque of the drive motor is the torque corresponding to the normal rotational speed of the wafer being cleaned.

[0145] If the defect detection and classification system determines that the rotation state of the wafer being cleaned has returned to normal, it controls the lead screw motor to stop working. If it determines that the rotation state of the wafer being cleaned has not returned to normal, it continues to control the movement of the moving block on the lead screw motor.

[0146] The present application has been described above with reference to block diagrams and / or flowcharts illustrating methods, apparatus (systems), and / or computer program products according to embodiments of the present application. It should be understood that a block of a block diagram and / or flowchart, as well as combinations of blocks of block diagrams and / or flowcharts, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, and / or other programmable data processing means to produce a machine, such that the instructions, executable via the computer processor and / or other programmable data processing means, create methods for implementing the functions / actions specified in the blocks of the block diagrams and / or flowcharts.

[0147] Accordingly, this application can also be implemented using hardware and / or software (including firmware, resident software, microcode, etc.). Furthermore, this application can take the form of a computer program product on a computer-usable or computer-readable storage medium, having computer-usable or computer-readable program code implemented in the medium for use by or in conjunction with an instruction execution system. In the context of this application, a computer-usable or computer-readable medium can be any medium that can contain, store, communicate, transmit, or deliver a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0148] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A wafer cleaning apparatus, characterized in that, include: The main drive assembly is used to rotate about the first rotation axis; The drive component is connected to the main drive component and is used to drive the wafer being cleaned to rotate under the drive of the main drive component. A state detection component is used to acquire detection data to determine whether the rotation state of the wafer being cleaned is normal. The slave drive assembly is further configured to, in the event of an abnormal rotation state, move along the extension direction of the second rotation axis of the slave drive assembly to restore the normal rotation state of the wafer being cleaned. The driven component includes a telescopic motor, a connecting mechanism, and a driven roller; The telescopic motor is connected to the driven roller via the connecting mechanism; The telescopic motor is used to control the driven roller to move along the extension direction of the second rotation axis; The connecting mechanism includes a ball bearing and a connecting shaft; The main drive assembly and the slave drive assembly are connected by a transmission mechanism; The transmission mechanism includes a first gear and a second gear, which are meshed together; the first gear is coaxial with the first rotation axis, the second gear is sleeved on the outer ring of the ball bearing, and the second gear is fixed to one end of the connecting shaft.

2. The wafer cleaning apparatus as described in claim 1, characterized in that, The telescopic motor is a lead screw motor; The lead screw motor includes a motor body and a motor shaft, the motor shaft being a lead screw, and a movable block cooperating with the lead screw is provided on the lead screw.

3. The wafer cleaning apparatus as described in claim 2, characterized in that, The inner ring of the ball bearing is sleeved around the periphery of the moving block and fixed to the moving block; The connecting shaft is tubular and is sleeved around the circumference of the lead screw. One end of the connecting shaft is fixed to the outer ring of the ball bearing, and the driven roller is sleeved around the circumference of the connecting shaft.

4. The wafer cleaning apparatus according to any one of claims 1-3, characterized in that, The wafer cleaning apparatus further includes a first rack, a second rack, a first nozzle disposed opposite to a first surface of the wafer to be cleaned, and a second nozzle disposed opposite to a second surface of the wafer to be cleaned. The first nozzle is disposed on the first rack, and the second nozzle is disposed on the second rack. The first nozzle is used to spray liquid onto the first surface of the wafer to be cleaned, and the second nozzle is used to spray liquid onto the second surface of the wafer to be cleaned. The status detection component includes a water pressure transducer; The water pressure transducer is mounted on the first rack or the second rack and is used to receive the reaction force generated by the liquid acting on the first surface or the second surface of the wafer being cleaned and convert the reaction force into voltage, wherein the voltage is the detection data; and / or The wafer cleaning apparatus further includes a speed measuring component, which is used to rotate about a third rotation axis under the drive of the wafer being cleaned.

5. A wafer cleaning device, characterized in that, Includes a defect detection and classification system and a wafer cleaning apparatus as described in any one of claims 1 to 4; The defect detection and classification system is communicatively connected to the state detection component and the slave drive component, respectively. It is used to acquire detection data through the state detection component to detect whether the rotation state of the wafer being cleaned is normal, and when it is determined from the detection data that the rotation state of the wafer being cleaned is abnormal, it controls the slave drive component to move along the extension direction of the second rotation axis of the slave drive component so that the rotation state of the wafer being cleaned is normal.

6. The wafer cleaning equipment as described in claim 5, characterized in that, The defect detection and classification system is also communicatively connected to the main drive assembly and the speed measuring assembly in the wafer cleaning device, wherein the speed measuring assembly is used to rotate around a third rotation axis under the drive of the wafer being cleaned. The defect detection and classification system is also used to obtain the actual rotational speed of the wafer being cleaned through the speed measuring component, and to obtain the torque of the drive motor in the main drive component through the main drive component; and to determine whether the rotational state of the wafer being cleaned is normal based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor.

7. The wafer cleaning equipment as described in claim 6, characterized in that, The defect detection and classification system is also used for: Based on the actual rotational speed of the wafer being cleaned, determine whether the moving direction of the drive component is correct; If the movement direction is incorrect, the drive component is controlled to move in the opposite direction of the previous movement direction.

8. A method for adjusting the state of a wafer rotation, characterized in that, The method, applied to the wafer cleaning equipment as described in any one of claims 5 to 7, comprises: The main drive assembly is controlled to rotate, so that the slave drive assembly drives the wafer to be cleaned to rotate under the drive of the main drive assembly; Determine whether the rotation state of the wafer being cleaned is normal. If not, control the drive assembly to move along the extension direction of the second rotation axis of the drive assembly so that the rotation state of the wafer being cleaned is normal.

9. The method as described in claim 8, characterized in that, The determination of whether the rotation state of the wafer being cleaned is normal includes: Liquid is sprayed onto the first and second surfaces of the wafer being cleaned, and the rotation state of the wafer being cleaned is determined to be normal based on the reaction force generated by the liquid acting on the first or second surface of the wafer.

10. The method as described in claim 9, characterized in that, The step of determining whether the rotation state of the wafer being cleaned is normal based on the reaction force generated by the liquid acting on the first or second surface of the wafer being cleaned includes: The reaction force is converted into voltage using a water pressure converter; The voltage is compared with a preset voltage, and the rotation state of the wafer being cleaned is determined based on the comparison result.

11. The method as described in claim 10, characterized in that, The step of determining whether the rotation state of the wafer being cleaned is normal based on the comparison results includes: If the voltage is equal to the preset voltage, the rotation state is determined to be normal; otherwise, the rotation state is determined to be abnormal.

12. The method as described in claim 11, characterized in that, Before controlling the driven assembly to move along the extension direction of the second rotation axis of the driven assembly, the method further includes: The direction of movement is determined based on the comparison between the voltage and the preset voltage.

13. The method as described in claim 12, characterized in that, If the water pressure transducer is installed on the first rack of the wafer cleaning apparatus, then determining the moving direction based on the comparison result of the voltage and the preset voltage includes: If the voltage is greater than the preset voltage, the moving direction is towards the first surface of the wafer being cleaned; if the voltage is less than the preset voltage, the moving direction is away from the first surface of the wafer being cleaned. If the water pressure transducer is installed on the second rack of the wafer cleaning apparatus, then determining the direction of movement based on the comparison between the voltage and the preset voltage includes: If the voltage is greater than the preset voltage, the moving direction is towards the second surface of the wafer being cleaned; if the voltage is less than the preset voltage, the moving direction is away from the second surface of the wafer being cleaned.

14. The method as described in claim 12, characterized in that, The control of moving the slave drive assembly along the extension direction of the second rotation axis of the slave drive assembly includes: The driven roller in the drive assembly is controlled to move along the extension direction of the second rotation axis according to the step value.

15. The method as described in claim 8, characterized in that, Before controlling the driven assembly to move along the extension direction of the second rotation axis of the driven assembly, the method further includes: The abnormal rotational state of the wafer being cleaned is determined based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor in the main drive assembly.

16. The method as described in claim 8, characterized in that, After controlling the driven component to move along the extension direction of the second rotation axis of the driven component, the method further includes: Based on the actual rotational speed of the wafer being cleaned and / or the torque of the drive motor in the main drive assembly, determine whether the rotational state of the wafer being cleaned has returned to normal.

17. The method according to any one of claims 8 to 16, characterized in that, After controlling the driven component to move along the extension direction of the second rotation axis of the driven component, the method further includes: Based on the actual rotational speed of the wafer being cleaned, determine whether the moving direction of the drive component is correct; If the movement direction is incorrect, the drive component is controlled to move in the opposite direction of the previous movement direction.

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