A visualization-based method and system for semiconductor chip packaging

Abstract

The application relates to a visual-based semiconductor chip packaging method and system, the visual-based semiconductor chip packaging system comprises a packaging box, a visual window is arranged on one side of the packaging box, a conveying mechanism for conveying chips is arranged at the bottom of the packaging box, a plurality of fixing mechanisms for clamping the chips are arranged above the conveying mechanism, a curing mechanism for curing the chips is arranged on one side in the packaging box, a packaging cylinder is fixed to the top of the packaging box, and a hot-pressing rod is fixed to the output end of the packaging cylinder and penetrates through the packaging box. The existing semiconductor chip packaging system has the problems that the chips are fixed at a position and cannot be moved during packaging, most of the chips are packaged one by one, the packaging efficiency is low, the chips are not fully contacted with hot air during hot pressing, and the packaging effect is poor.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of chip packaging, in particular to a visual-based semiconductor chip packaging method and system. BACKGROUND

[0002] Chip packaging refers to a shell for mounting a semiconductor integrated circuit chip, and has the functions of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. The chip packaging is a bridge between the internal world of the chip and the external circuit.

[0003] The existing semiconductor chip packaging system is often fixed at a position and cannot be moved when the chip is packaged, and most of the chips are packaged, resulting in low packaging efficiency. At the same time, when hot pressing, the chip is not fully contacted with hot air, resulting in poor packaging effect.

[0004] In order to solve the above defects, the present application provides a technical scheme. SUMMARY

[0005] The application aims to provide a visual-based semiconductor chip packaging method and system.

[0006] The technical problems to be solved by the application are as follows:

[0007] The existing semiconductor chip packaging system is often fixed at a position and cannot be moved when the chip is packaged, and most of the chips are packaged, resulting in low packaging efficiency. At the same time, when hot pressing, the chip is not fully contacted with hot air, resulting in poor packaging effect.

[0008] The purpose of the application can be achieved by the following technical scheme:

[0009] A visual-based semiconductor chip packaging system, comprising a packaging box, a visual window is formed on one side of the packaging box, a conveying mechanism for conveying the chip is arranged at the bottom of the inside of the packaging box, the conveying mechanism comprises two symmetrical support plates, symmetrical first sliding rails are arranged on the side of the two support plates close to each other, a lifting plate is slidably connected to the first sliding rail on the two support plates, a second sliding rail is fixed to the top of the lifting plate, a I-beam is sleeved on the outer surface of the lifting plate, the I-beam is slidably connected to the second sliding rail, a conveying platform is fixed between the two I-beams, a plurality of fixing mechanisms for clamping the chip are arranged above the conveying mechanism, a curing mechanism for hot pressing and curing the chip is arranged on one side of the inside of the packaging box, a packaging cylinder is fixed to the top of the outside of the packaging box, and a hot pressing rod is fixed to the output end of the packaging cylinder and penetrates through the packaging box.

[0010] Further, the top of one of the support plates is fixed with a lifting motor, the output end of the lifting motor penetrates through the support plate and is fixed with a threaded rod, one side of the support plate is provided with a lifting groove, the outer surface of the threaded rod is threadedly connected with a threaded seat, the other side of the threaded seat is fixed with the one side of the lifting plate through a fixing rod.

[0011] Further, the bottom of the lifting plate is provided with an opening, the inner surface of the lifting plate is rotatably connected with two belt pulleys through two drive columns, and a conveying belt is arranged between the two belt pulleys.

[0012] Further, the bottom of the I-shaped plate is fixed with the lower surface of the conveying belt, one side of the outer surface of the lifting plate is fixed with a conveying motor, the output end of the conveying motor penetrates through the lifting plate and is fixed with the one end of one of the drive columns.

[0013] Further, the fixing mechanism comprises a fixing plate, the top of the fixing plate is provided with a fixing groove, and the top of the fixing plate is rotatably connected with two rotating rods, and the top end of the rotating rod is fixed with a rotating plate.

[0014] Further, the two ends of the rotating plate are penetrated through clamping rods, the top end of the clamping rod is fixed with a handle, the bottom end of the clamping rod is fixed with a clamping plate, the outer surface of the clamping rod is sleeved with a clamping spring, and the two ends of the clamping spring are fixed with the handle and the rotating plate respectively.

[0015] Further, the curing mechanism comprises a heating chamber fixed with one side of the outer surface of the packaging box, and the top end of the outer surface of the heating chamber is fixed with a fan, and the output end of the fan is in communication with the heating chamber.

[0016] Further, the inner side wall of the packaging box is fixed with two symmetrical curing plates, and the side, which is close to each other, of the two curing plates is rotatably connected with two adjusting rods, and the two adjusting rods are fixed with a connecting pipe, and the connecting pipe is connected with the heating chamber through a connecting hose.

[0017] Further, one side of the connecting pipe is connected with a plurality of curing pipes, the end, which is away from the connecting pipe, of the curing pipe is fixed with a spray head, one side of one of the curing plates is fixed with an adjusting motor, and the output end of the adjusting motor penetrates through the curing plate and is fixed with the one end of the adjusting rod.

[0018] The beneficial effects of the present application are as follows:

[0019] The application sets the conveying mechanism, so that the lifting motor drives the threaded rod to rotate, thereby driving the threaded seat to move on the threaded rod, the fixed rod drives the lifting plate to move on the first sliding rail, and the conveying motor drives one of the driving columns to rotate, thereby driving the two belt pulleys to rotate to make the conveying belt move, the conveying belt drives the conveying platform to move in the horizontal direction through the I-beam, so that the chip in the fixing mechanism can move freely in the horizontal and vertical directions, facilitating the movement of the chip to the processing position and improving the processing efficiency.

[0020] The fixing mechanism is set, the rotating rod drives the rotating plate to move to the fixed groove, and the clamping plate clamps the chip under the action of the clamping spring, avoiding the deviation of the chip during packaging, ensuring the stability of the chip packaging, and setting a plurality of fixing mechanisms, cooperating with the conveying mechanism to make a plurality of chips work continuously, and the working efficiency is higher.

[0021] The curing mechanism is set, the fan sends the external cold air into the heating chamber to obtain hot air under the heating of the electric heating rod, and the hot air is sent into the connecting pipe through the connecting hose, and finally sprayed from the nozzle through the curing pipe, cooperating with the hot pressing rod to heat and press the chip, completing the packaging process, and adjusting the motor to cooperate with the adjusting rod to drive the connecting pipe to rotate, so that the spraying angle of the hot air on the nozzle is adjusted, ensuring the contact of the chip with the hot air and improving the effect of heat pressing and curing. BRIEF DESCRIPTION OF DRAWINGS

[0022] The application will be further described in detail below in combination with the drawings and specific embodiments.

[0023] Figure 1 is a structure diagram of a semiconductor chip packaging system based on visualization of the application;

[0024] Figure 2 is a schematic diagram of the internal structure of the packaging box of the application;

[0025] Figure 3 is a structure diagram of the conveying mechanism of the application;

[0026] Figure 4 is a schematic diagram of the internal structure of the support plate of the application;

[0027] Figure 5 is a schematic diagram of the internal structure of the lifting plate of the application;

[0028] Figure 6 is a structure diagram of the fixing mechanism of the application;

[0029] Figure 7 is an enlarged view of A in the application Figure 6

[0030] Figure 8 ​is a structural schematic view of the solidification mechanism of the application.

[0031] In the figure: 1, packaging box; 2, conveying mechanism; 3, fixing mechanism; 4, solidification mechanism; 5, packaging cylinder; 101, visible window; 201, support plate; 202, first sliding rail; 203, lifting plate; 204, second sliding rail; 205, I-beam; 206, conveying platform; 207, lifting motor; 208, threaded rod; 209, lifting groove; 210, threaded seat; 211, pulley; 212, conveying belt; 213, conveying motor; 301, fixing plate; 302, fixing groove; 303, rotating rod; 304, rotating plate; 305, clamping rod; 306, handle; 307, clamping plate; 308, clamping spring; 401, heating chamber; 402, fan; 403, solidification plate; 404, adjusting rod; 405, connecting pipe; 406, solidification pipe; 407, spray head; 408, adjusting motor; 501, hot-pressing rod. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] Please refer to Figures 1-8 The present application provides a technical solution:

[0034] A semiconductor chip packaging system based on visualization, comprising a packaging box 1, support legs are fixed at the four corners of the bottom of the packaging box 1, a visible window 101 is formed on one side of the packaging box 1, and a visible glass is installed on the visible window 101. By setting the visible window 101, the packaging process can be clearly and real-time seen, which is convenient for mastering the packaging information and timely adjusting. A conveying mechanism 2 for conveying chips is arranged at the bottom of the inside of the packaging box 1, a fixing mechanism 3 for clamping chips is arranged above the conveying mechanism 2, a solidification mechanism 4 for hot-pressing and solidifying chips is arranged at one side of the inside of the packaging box 1, a packaging cylinder 5 is fixed at the top of the outside of the packaging box 1, and a hot-pressing rod 501 is fixed at the output end of the packaging cylinder 5.

[0035] Please refer to Figures 3-5The conveying mechanism 2 comprises two symmetrically distributed supporting plates 201, the bottom of the supporting plate 201 is fixed with the inner bottom end of the packaging box 1, the side of the two supporting plates 201 close to each other is provided with symmetrically distributed first sliding rails 202, the first sliding rails 202 on the two supporting plates 201 are slidably connected with lifting plates 203, the top of the lifting plate 203 is fixed with a second sliding rail 204, the outer surface of the lifting plate 203 is sleeved with an I-shaped plate 205, the I-shaped plate 205 is in the shape of an I, the top of the I-shaped plate 205 is slidably connected with the second sliding rail 204, and the conveying platform 206 is fixed between the two I-shaped plates 205; the top of one of the supporting plates 201 is fixed with a lifting motor 207, the output end of the lifting motor 207 penetrates through the supporting plate 201 and is fixed with a threaded rod 208, the threaded rod 208 is located in the supporting plate 201 and is rotatably connected with the supporting plate 201, the side of the supporting plate 201 is provided with a lifting groove 209, the outer surface of the threaded rod 208 is threadedly connected with a threaded seat 210, one side of the threaded seat 210 is slidably connected with the inner side wall of the supporting plate 201, the other side of the threaded seat 210 is fixed with one side of the lifting plate 203 through a fixing rod, the fixing rod penetrates through the lifting groove 209 and is slidably connected with the lifting groove 209; the bottom of the lifting plate 203 is provided with an opening, the inner surface of the lifting plate 203 is rotatably connected with two belt pulleys 211 at both ends through driving columns, a conveying belt 212 is installed between the two belt pulleys 211, the bottom of the I-shaped plate 205 is fixed with the lower surface of the conveying belt 212, the outer side of the lifting plate 203 is fixed with a conveying motor 213, the output end of the conveying motor 213 penetrates through the lifting plate 203 and is fixed with one end of one of the driving columns. Through the conveying mechanism 2, the lifting motor 207 drives the threaded rod 208 to rotate, thereby driving the threaded seat 210 to move on the threaded rod 208, the lifting plate 203 is driven to move on the first sliding rail 202 through the fixing rod, and meanwhile the conveying motor 213 drives one of the driving columns to rotate, thereby driving the two belt pulleys 211 to rotate and enabling the conveying belt 212 to move, the conveying belt 212 drives the conveying platform 206 to move in the horizontal direction through the I-shaped plate 205, thereby ensuring that the chips in the fixing mechanism 3 can freely move in the horizontal and vertical directions, facilitating the movement of the chips to the processing position and improving the processing efficiency.

[0036] Please refer to Figures 6-7The fixing mechanism 3 comprises a fixing plate 301, a fixing groove 302 is formed in the top of the fixing plate 301 and used for placing a chip, rotating rods 303 are rotatably connected to the top of the fixing plate 301 at both ends, rotating plates 304 are fixed to the top ends of the rotating rods 303, clamping rods 305 are arranged to penetrate through the rotating plates 304 at both ends, handles 306 are fixed to the top ends of the clamping rods 305, clamping plates 307 are fixed to the bottom ends of the clamping rods 305, clamping springs 308 are sleeved on the outer surfaces of the clamping rods 305, and the two ends of each clamping spring 308 are fixed to the handle 306 and the rotating plate 304 respectively. The fixing mechanism 3 is arranged to drive the rotating plate 304 to move to the fixing groove 302 through the rotating rod 303, and the clamping plate 307 clamps the chip under the action of the clamping spring 308, so that the chip is prevented from deviating in the packaging process and the stability of the chip packaging is ensured.

[0037] Please refer to Figure 1 and Figure 8 The curing mechanism 4 comprises a heating chamber 401 fixed to the outer side of the packaging box 1, an electric heating rod arranged in the heating chamber 401, a fan 402 fixed to the top end of the outer side of the heating chamber 401, an output end of the fan 402 in communication with the heating chamber 401, two symmetrical curing plates 403 fixed to the inner side wall of the packaging box 1, adjusting rods 404 rotatably connected to the sides of the two curing plates 403, a connecting pipe 405 fixed between the two adjusting rods 404, the connecting pipe 405 connected to the heating chamber 401 through a connecting hose, a plurality of curing pipes 406 connected to one side of the connecting pipe 405, spray heads 407 fixed to the ends of the curing pipes 406 away from the connecting pipe 405, an adjusting motor 408 fixed to one side of one of the curing plates 403, and an output end of the adjusting motor 408 penetrating through the curing plate 403 and fixed to one end of the adjusting rod 404. The curing mechanism 4 is arranged to make the fan 402 deliver external cold air into the heating chamber 401 to obtain hot air under the heating of the electric heating rod, and then send the hot air into the connecting pipe 405 through the connecting hose, and finally spray the hot air out of the spray heads 407 through the curing pipes 406, so as to cooperate with the hot pressing rod 501 to heat and press the chip to complete the packaging process, and meanwhile, the adjusting motor 408 drives the connecting pipe 405 to rotate through the cooperation of the adjusting rod 404, so that the spraying angle of the hot air on the spray heads 407 is adjusted, the contact between the chip and the hot air is ensured, and the effect of the heat pressing and curing is improved.

[0038] A semiconductor chip packaging method based on visualization, comprising the following steps:

[0039] The first step, the chip is placed in the fixed groove 302, so that the rotating rod 303 drives the rotating plate 304 to move to the fixed groove 302, and the clamping spring 308 is clamped under the action of the clamping plate 307 to clamp the chip, the lifting motor 207 is started to drive the threaded rod 208 to rotate, thereby driving the threaded seat 210 to move on the threaded rod 208, the lifting plate 203 is driven to move on the first sliding rail 202 to the appropriate height through the fixed rod, and the conveying motor 213 drives one of the driving columns to rotate, thereby driving the two belt pulleys 211 to rotate to make the conveying belt 212 move, the conveying belt 212 drives the conveying platform 206 to move in the horizontal direction below the hot pressing rod 501 through the I-beam 205;

[0040] The second step, the fan 402 is started to convey the external cold air into the heating chamber 401 to obtain hot air under the heating of the electric heating rod, and the hot air is sent into the connecting pipe 405 through the connecting hose, and finally sprayed from the nozzle 407 through the curing pipe 406, the packaging cylinder 5 is started to drive the hot pressing rod 501 to descend and contact the chip to perform hot pressing and curing, and the packaging process is completed, and meanwhile, the adjusting motor 408 cooperates with the adjusting rod 404 to drive the connecting pipe 405 to rotate, so that the spraying angle of the hot air on the nozzle 407 is adjusted.

[0041] The third step, when the chip in one of the fixing mechanisms 3 completes packaging, the conveying motor 213 is continuously started to drive the chips in the remaining fixing mechanisms 3 to move below the hot pressing rod 501, and the packaging operation is continuously performed.

[0042] In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, a particular orientation and operation, therefore, it cannot be understood as a limitation on the present application. In addition, "first", "second" is only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0043] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0044] The above detailed description has shown, by way of example, an embodiment of the application. It is specifically contemplated that the application is not limited to the embodiments described herein, but rather the scope of the application is defined by the claims.

Claims

1. A visualization-based semiconductor chip packaging system comprising a packaging box (1), characterized in that, The packaging box (1) is provided with a visual window (101) on one side, and a conveying mechanism (2) for conveying chips is arranged at the bottom of the packaging box (1). The conveying mechanism (2) comprises two symmetrically distributed support plates (201), and symmetrically distributed first sliding rails (202) are arranged on the side of each support plate (201) close to each other. First sliding rails (202) are arranged on the support plates (201), and a lifting plate (203) is slidably connected to the first sliding rails (202). The top of the lifting plate (203) is fixedly connected to a second sliding rail (204), and a I-shaped plate (205) is sleeved on the outer surface of the lifting plate (203). The top of the I-shaped plate (205) is slidably connected to the second sliding rail (204), and a conveying platform (206) is fixed between the two I-shaped plates (205). A fixing mechanism (3) for clamping the chips is arranged above the conveying mechanism (2), a curing mechanism (4) for heat pressing and curing the chips is arranged on one side of the packaging box (1), and a packaging cylinder (5) is fixed to the top of the packaging box (1). The output end of the packaging cylinder (5) penetrates through the packaging box (1) and is fixedly connected to a heat pressing rod (501). The fixing mechanism (3) comprises a fixed plate (301), and a fixed groove (302) is formed in the top of the fixed plate (301). Rotating rods (303) are rotatably connected to the top of the fixed plate (301) at both ends, and rotating plates (304) are fixedly connected to the top of the rotating rods (303). The two ends of the rotating plate (304) are provided with clamping rods (305), and the top of the clamping rod (305) is fixedly connected to a handle (306). The bottom of the clamping rod (305) is fixedly connected to a clamping plate (307), and a clamping spring (308) is sleeved on the outer surface of the clamping rod (305). The two ends of the clamping spring (308) are fixedly connected to the handle (306) and the rotating plate (304), respectively. The curing mechanism (4) comprises a heating chamber (401) fixed to one side of the packaging box (1), and a fan (402) is fixed to the top of the heating chamber (401). The output end of the fan (402) is in communication with the heating chamber (401). By arranging the curing mechanism, the fan can deliver external cold air into the heating chamber to generate hot air under the heating of the electric heating rod.

2. A visual-based semiconductor chip packaging system according to claim 1, wherein The top of one of the support plates (201) is fixedly connected to a lifting motor (207), the output end of the lifting motor (207) penetrates through the support plate (201) and is fixedly connected to a threaded rod (208), and a lifting groove (209) is formed in one side of the support plate (201). The outer surface of the threaded rod (208) is threadedly connected to a threaded seat (210), and the other side of the threaded seat (210) is fixedly connected to one side of the lifting plate (203) through a fixing rod.

3. A visual-based semiconductor chip packaging system according to claim 2, wherein, The bottom of the lifting plate (203) is provided with an opening, and the inner surface of the lifting plate (203) is rotatably connected to two belt pulleys (211) at both ends through drive columns. A conveying belt (212) is arranged between the two belt pulleys (211).

4. A visual-based semiconductor chip packaging system according to claim 3, wherein The bottom of the I-shaped plate (205) is fixed with the lower surface of the conveying belt (212), the outer side of the lifting plate (203) is fixed with a conveying motor (213), the output end of the conveying motor (213) penetrates through the lifting plate (203) and is fixed with one end of one driving column.

5. The visual-based semiconductor chip packaging system of claim 1, wherein, The inner side wall of the packaging box (1) is fixed with two symmetrical curing plates (403), the side close to each other of the two curing plates (403) is rotationally connected with an adjusting rod (404), the two adjusting rods (404) are fixed with a connecting pipe (405), and the connecting pipe (405) is connected with the heating chamber (401) through a connecting hose.

6. A visual-based semiconductor chip packaging system according to claim 5, wherein, A plurality of curing pipes (406) are connected with one side of the connecting pipe (405), the end, away from the connecting pipe (405), of the curing pipe (406) is fixed with a nozzle (407), one side of one curing plate (403) is fixed with an adjusting motor (408), and the output end of the adjusting motor (408) penetrates through the curing plate (403) and is fixed with one end of the adjusting rod (404).

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