Display panel, test method for display panel and display device

Abstract

This invention provides a display panel, a testing method for the display panel, and a display device, comprising a substrate, the substrate including a first bonding region, the substrate including two first pins disposed in the first bonding region, each first pin being electrically connected to a corresponding first test point; a control circuit board, the control circuit board including a second bonding region, the substrate including at least two second pins disposed in the second bonding region; and a flexible circuit board, the flexible circuit board including two connecting lines, each connecting line being electrically connected to a corresponding third test point, the two ends of the connecting lines being electrically connected to a corresponding first pin and a corresponding second pin, respectively; wherein the two first pins are electrically connected. By setting a first test point on the first pin and a third test point on the connecting line, and measuring the corresponding impedance through the first test point and the second test point, the bonding impedance of the first bonding part is calculated, thereby solving the problem of inaccurate bonding impedance testing.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, a testing method for the display panel, and a display device. Background Technology

[0002] In the prior art, a display device includes a display panel, a flexible circuit board, and a control circuit board assembly. The flexible circuit board is used to connect the display panel and the control circuit board, and the control circuit board is used to provide various signals to the display panel.

[0003] like Figure 1 As shown, the flexible circuit board includes multiple connecting lines. The display panel and the control circuit board are connected to the connecting lines via a first pin and a second pin, respectively. The portion of the connecting line connected to the display panel is the first bonding portion, the portion connected to the control circuit board is the second bonding portion, and the remaining portion of the connecting line is the connecting portion. Since the bonding impedance (the impedance of the first bonding portion) is an important factor affecting the image display quality, if the bonding impedance is too high, it may cause abnormal image display. Therefore, bonding impedance testing is required in the production and experimental analysis of liquid crystal display devices.

[0004] Conventional bonding impedance testing methods obtain test signals from the two second pins of the control board. The impedance being tested includes other impedances besides the bonding impedance, such as the connection line impedance (the impedance other than the first and second bonding parts), the control board end impedance (the impedance between the second bonding part and the second pin), and the panel end impedance (the impedance of the first pin). Therefore, the test results cannot accurately express the bonding impedance. Summary of the Invention

[0005] Embodiments of the present invention provide a display panel, a testing method for the display panel, and a display device to solve the problem.

[0006] To address the above problems, embodiments of the present invention provide a display panel, comprising:

[0007] A display panel, comprising:

[0008] The substrate includes a first bonding area and two first pins disposed in the first bonding area, each of the first pins being electrically connected to a corresponding first test point.

[0009] A control circuit board, the control circuit board including a second bonding area and at least two second pins disposed in the second bonding area;

[0010] The flexible circuit board comprises two connecting lines, each of the connecting lines is electrically connected with a corresponding third test point, and two ends of the connecting line are electrically connected with a corresponding first pin and a corresponding second pin respectively.

[0011] The two first pins are electrically connected.

[0012] According to a preferred embodiment of the present application, the third test point is electrically connected to one end of the connecting line close to the substrate.

[0013] According to a preferred embodiment of the present application, the control circuit board further comprises at least two second test points, and each of the second pins is electrically connected with a corresponding second test point.

[0014] According to a preferred embodiment of the present application, the substrate comprises three second pins, one end of one of the two connecting lines comprises a first connecting part and a second connecting part connected to each other, and the first connecting part and the second connecting part are electrically connected with a corresponding second pin respectively.

[0015] According to a preferred embodiment of the present application, a middle part of one end of each of the connecting lines close to the substrate is provided with an opening, the opening penetrates through a side of the connecting line away from an adjacent other connecting line, the side of the connecting line surrounds the opening and is connected to the third test point, and at least part of the material of the third test point is the same as that of the connecting line.

[0016] According to a preferred embodiment of the present application, the substrate further comprises a plurality of data lines and a plurality of third pins arranged in the first binding area, each of the third pins is electrically connected with a corresponding data line, and the first pin is a virtual pin.

[0017] The embodiment of the present application further provides a test method of a display panel, which is used for testing a display panel, and the display panel comprises:

[0018] A substrate comprises a first binding area, and the substrate comprises two first pins arranged in the first binding area, and each of the first pins is electrically connected with a corresponding first test point.

[0019] A control circuit board comprises a second binding area, and the control circuit board comprises two second pins arranged in the second binding area.

[0020] A flexible circuit board comprises two connecting lines, each of the connecting lines is electrically connected with a corresponding third test point, the third test point is electrically connected to one end of the connecting line close to the substrate, and two ends of the connecting line are electrically connected with a corresponding first pin and a corresponding second pin respectively.

[0021] two first pins are electrically connected;

[0022] The test method comprises:

[0023] acquiring a first impedance between two first test points corresponding to two first pins when the two first pins are not electrically connected with two connection lines;

[0024] acquiring a second impedance between two third test points corresponding to two connection lines after the two first pins are electrically connected with the two connection lines;

[0025] calculating a binding impedance of the connection line located in the first binding area through the first impedance and the second impedance.

[0026] According to a preferred embodiment of the present application, the control circuit board comprises three second test points and three second pins, each of the second pins is electrically connected with a corresponding second test point, one end of one of the two connection lines comprises a first connecting part and a second connecting part connected with each other, the first connecting part and the second connecting part are electrically connected with corresponding second pins respectively; the test method further comprises:

[0027] acquiring a control circuit board impedance between two second test points corresponding to two second pins electrically connected with the first connecting part and the second connecting part.

[0028] According to a preferred embodiment of the present application, further comprising:

[0029] acquiring a third impedance between the second test point corresponding to one of the second pins electrically connected with the first connecting part or the second connecting part and the second test point corresponding to the other second pin not electrically connected with the first connecting part and the second connecting part;

[0030] calculating an impedance of the connection line located outside the first binding area and the second binding area through the third impedance, the control circuit board impedance and the second impedance.

[0031] The embodiment of the present application further provides a display device comprising the display panel as described in any one of the above.

[0032] The beneficial effect of the present application is that the embodiment sets the first test point on the first pin, sets the third test point on the connecting line, measures the impedance between the two first pins when the two first pins are not connected with the connecting line, and measures the impedance between the two connecting lines when the two first pins are connected with the two connecting lines, thereby calculating the bonding impedance of the first bonding part, and solving the problem of inaccurate Bonding impedance test in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0034] FIG. 1 is a structural schematic diagram of a display panel in the prior art; Figure 1 FIG. 1 is a structural schematic diagram of a display panel in the prior art;

[0035] FIG. 2 is a structural schematic diagram of a display panel of the present application; Figure 2 FIG. 2 is a structural schematic diagram of a display panel of the present application;

[0036] FIG. 3 is a structural schematic diagram of a connecting line of the present application; Figure 3 FIG. 3 is a structural schematic diagram of a connecting line of the present application;

[0037] FIG. 4 is a structural schematic diagram of a first pin of the present application; Figure 4 FIG. 4 is a structural schematic diagram of a first pin of the present application;

[0038] FIG. 5 is a structural schematic diagram of a first pin and a third pin of the present application. Figure 5 FIG. 5 is a structural schematic diagram of a first pin and a third pin of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.

[0040] As shown in FIG. 1, the flexible circuit board 3 includes a plurality of connecting lines, the display panel and the control circuit board 2 are connected with the connecting lines through first pins 11 and second pins (not shown) respectively, the part of the connecting lines connected with the display panel is a first bonding part 33, and the part of the connecting lines connected with the control circuit board 2 is a second bonding part 34. Figure 1

[0041] ​The conventional bonding impedance (impedance of the first bonding part 33) test method obtains test signals from the two second pins of the control circuit board 2. The tested impedance includes other impedances besides the bonding impedance, such as the impedance of the connection part 35 (the part of the connection line other than the first bonding part 33 and the second bonding part 34), the impedance of the control circuit board 2 terminal (the impedance between the second bonding part 34 and the second pin), the impedance of the first pin 11, etc. Therefore, the test results cannot accurately express the bonding impedance.

[0042] One embodiment of the present invention provides a display panel to solve the problem of inaccurate Bonding impedance testing mentioned above.

[0043] like Figures 2-5 As shown, the display panel includes a substrate 1, a flexible circuit board 3, and a control circuit board 2. The substrate 1 includes a plurality of sub-pixels arranged in an array, a plurality of data lines electrically connected to the plurality of sub-pixels, and a plurality of first pins 11 electrically connected to the plurality of data lines. Each first pin 11 is electrically connected to a first test point. The area where the first pins 11 are distributed is a first bonding area. It can be seen that the substrate 1 is an array substrate.

[0044] The control circuit board 2 includes multiple second pins, and the flexible circuit board 3 includes multiple connecting lines. Each connecting line is electrically connected to a corresponding third test point. Both ends of each connecting line are electrically connected to the corresponding first pin 11 and the corresponding second pin, respectively. The part of the connecting line that connects to the display panel is the first bonding part 33, the part of the connecting line that connects to the control circuit board 2 is the second bonding part 34, and the remaining part of the connecting line is the connecting part 35.

[0045] In this embodiment, the substrate 1 includes two first pins 11, the control circuit board 2 includes two second pins, and the flexible circuit board 3 includes two connecting lines, namely a first connecting line 31 and a second connecting line 32. The first test points connected to the two first pins 11 are test point A and test point B, respectively, and the third test points connected to the first connecting line 31 and the second connecting line 32 are test point C and test point D, respectively. It can be seen that by measuring the first impedance R between the two first pins 11 when they are not connected to the two connecting lines... A-B And the second impedance R between the two connecting lines after the two first pins 11 are connected to the two connecting lines. C-D, the impedance of the connection line in the first binding area, i.e. the bonding impedance of the first binding part 33, can be obtained. In this embodiment, the first test point is arranged on the first pin 11, and the third test point is arranged on the connection line. The impedance between the two first pins 11 when the two first pins 11 are not connected with the connection line, and the impedance between the two connection lines when the two first pins 11 are connected with the two connection lines are measured, so as to calculate the impedance R of the first binding part 33 第一绑定部 , and the problem of inaccurate Bonding impedance test in the prior art is solved.

[0046] In some embodiments of the present application, the third test point is electrically connected to one end of the connection line close to the substrate 1. It can be known that, since the third test point is not directly electrically connected to the first binding part 33, but is connected to a position of the connection line other than the first binding part 33, the closer the position where the third test point is electrically connected to the connection line to the first binding part 33 of the connection line, the more accurate the measured impedance of the first binding part 33.

[0047] In some embodiments of the present application, the control circuit board 2 further comprises at least two second test points, each of the second pins is electrically connected with a corresponding second test point, and the impedance between the two second test points is measured to calculate the impedance of the entire loop (including the impedance of the first binding part 33, the impedance of the connection part 35, the impedance of the control circuit board 2, and the impedance of the first pin 11).

[0048] In some embodiments of the present application, the substrate 1 comprises three second pins, one end of the first connection line 31 comprises a first connection part and a second connection part connected with each other, the first connection part and the second connection part are electrically connected to corresponding second pins respectively, and the other end of the first connection line 31 is electrically connected to a corresponding first pin 11; the two ends of the second connection line 32 are electrically connected to corresponding first pins 11 and second pins respectively. Among them, the second test point corresponding to the second pin electrically connected to the first connection part is test point E, the second test point corresponding to the second pin electrically connected to the second connection part is test point F, and the second test point corresponding to the second pin electrically connected to the second connection line 32 is test point G. The impedance between the two second test points corresponding to the two second pins electrically connected to the first connection part and the second connection part is measured, i.e. the impedance between test point E and test point F is measured, so as to obtain the impedance R of the control circuit board 2 E-F , the impedance between test point F and test point G is measured, so as to obtain the impedance of the entire loop (denoted as the third impedance R F-G ). It can be known that the impedance R of the control circuit board 2E-F The second impedance is between the second binding part 34 and the second pin.

[0049] The embodiment measures the impedance between the two second test points corresponding to the two second pins electrically connected with the first connecting part and the second connecting part, to obtain the accurate control circuit board 2 impedance R E-F The impedance of the connecting part 35 can be calculated through the third impedance R F-G , the control circuit board 2 impedance R E-F and the second impedance R C-D .

[0050] In some embodiments of the present application, each connecting line is provided with an opening near the middle of one end of the substrate 1, the opening penetrates through the side of the connecting line away from the adjacent other connecting line, the side of the connecting line surrounds the opening and is connected to the third test point, and at least part of the material of the third test point is the same as that of the connecting line. By providing the opening on the connecting line, the connecting point can be formed by the material of the connecting line itself, and the same material can make the impedance calculation more accurate.

[0051] In some embodiments of the present application, the substrate 1 further comprises a plurality of data lines and a plurality of third pins 12 provided in the first binding area, each third pin 12 is electrically connected with the corresponding data line, and the first pin 11 is not connected with the data line, that is, the first pin 11 is a dummy pin. By setting the first pin 11 not to be connected with the data line, the normal operation of the display panel will not be affected during the test of the impedance, and similarly, the connecting line and the second pin corresponding to the first pin 11 do not participate in the signal transmission in the display panel.

[0052] Please refer to Figures 2-4 , the embodiment of the present application further provides a display panel test method for testing a display panel, wherein the display panel comprises a substrate 1, a control circuit board 2 and a flexible circuit board 3, the substrate 1 comprises a first binding area, the substrate 1 comprises two first pins 11 provided in the first binding area, the two first pins 11 are electrically connected, and each first pin 11 is electrically connected with a corresponding first test point, and the first test points connected by the two first pins 11 are test point A and test point B respectively.

[0053] The control circuit board 2 comprises a second binding area and three second pins provided in the second binding area, each second pin is electrically connected with a corresponding second test point, and the second test points corresponding to the three second pins are test point E, test point F and test point G respectively.

[0054] The flexible circuit board 3 includes two connecting lines, each of which is electrically connected to a corresponding third test point. The third test points connected by the two connecting lines are test point C and test point D, respectively, and both third test points are electrically connected to the end of the connecting line near the substrate 1. The two connecting lines are a first connecting line 31 and a second connecting line 32. One end of the first connecting line 31 includes a first connecting portion and a second connecting portion that are connected to each other. The first connecting portion and the second connecting portion are electrically connected to the corresponding second pin, respectively. The other end of the first connecting line 31 is electrically connected to the corresponding first pin 11. The two ends of the second connecting line 32 are electrically connected to the corresponding first pin 11 and the second pin, respectively.

[0055] The method includes the following steps:

[0056] S10. Measure the first impedance R between the two first test points corresponding to the two first pins 11 when the two first pins 11 are not electrically connected to the two connecting lines. A-B .

[0057] Measure the first impedance R A-B At this time, an electrical detection device can be used to output a first physical quantity applied to test point A and test point B, and the electrical detection device can be used to receive a second physical quantity. The ratio calculated from the first physical quantity and the second physical quantity is the first impedance R. A-B Preferably, the electrical detection device can be a multimeter, the first physical quantity includes voltage, and the second physical quantity includes current. It is known that the first impedance R... A-B The detection method is not limited to this, and those skilled in the art may use other measurement methods based on this solution.

[0058] S20. After the two first pins 11 are electrically connected to the two connecting lines, measure the second impedance R between the two third test points corresponding to the two connecting lines. C-D Wherein, the second impedance R C-D It can be measured using the same method as in step S10.

[0059] Specifically, an electrical detection device outputs a first physical quantity and applies it to test points C and D, and the same device receives a second physical quantity. The ratio calculated from the first and second physical quantities is the impedance R of the control circuit board 2. C-D .

[0060] S30, through the first impedance R A-B and the second impedance R C-DCalculate the bonding impedance of the first bonding region, that is, the impedance R of the first bonding part 33. 第一绑定部 .

[0061] Specifically, through the second impedance R C-D Subtract the first impedance R A-B R 第一绑定部 =R C-D -R A-B .

[0062] S40. Measure the impedance R of the control circuit board 2 between two test points corresponding to the two second pins electrically connected to the first connection part and the second connection part. E-F The control circuit board 2 has an impedance R. E-F Measured using the same method as in step S10.

[0063] Specifically, an electrical detection device outputs a first physical quantity and applies it to test points E and F, and the electrical detection device receives a second physical quantity. The ratio calculated from the first physical quantity and the second physical quantity is the impedance R of the control circuit board 2. E-F .

[0064] S50. Measure the third impedance between the second test point corresponding to a second pin that is electrically connected to the first connection portion or the second connection portion, and the second test point corresponding to a second pin that is not electrically connected to the first connection portion or the second connection portion.

[0065] Specifically, an electrical detection device outputs a first physical quantity and applies it to test points F and G, and the electrical detection device receives a second physical quantity. The ratio calculated from the first physical quantity and the second physical quantity is the third impedance R. F-G .

[0066] S60, through the third impedance R F-G The impedance R of the control circuit board 2 E-F and the second impedance R C-D Calculate the impedance of the connecting line located outside the first and second bonding areas, i.e., the impedance R of the connecting portion 35. 连接部 .

[0067] Specifically, the third impedance R F-G Subtract the impedance R of the control circuit board 2 E-F and the second impedance R C-D R 连接部 =R F-G -R E-F -RC-D .

[0068] This method can accurately detect the impedance of the first bonding part 33, the impedance of the connection part 35, and the impedance of the control circuit board 2.

[0069] This invention also provides a display device, including a display panel as described in any of the above embodiments.

[0070] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate comprising a first binding area, the substrate comprising two first pins arranged in the first binding area, each of the first pins being electrically connected with a corresponding first test point; a control circuit board comprising a second binding area, and at least two second pins arranged in the second binding area; a flexible circuit board comprising two connection lines, each of the connection lines being electrically connected with a corresponding third test point, the third test point being electrically connected with one end of the connection line close to the substrate, and the two ends of the connection line being electrically connected with the corresponding first pin and the corresponding second pin, respectively; wherein the two first pins are electrically connected; each of the connection lines is provided with an opening in the middle of one end close to the substrate, the opening penetrating through one side of the connection line away from the adjacent other connection line, and the one side of the connection line surrounding the opening and being connected with the third test point.

2. The display panel of claim 1, wherein, The third test point is electrically connected with the one end of the connection line close to the substrate.

3. The display panel of claim 2, wherein, The control circuit board further comprises at least two second test points, each of the second pins being electrically connected with the corresponding second test point.

4. The display panel of claim 3, wherein, The substrate comprises three second pins, and one end of one of the two connection lines comprises a first connecting part and a second connecting part connected with each other, the first connecting part and the second connecting part being electrically connected with the corresponding second pins, respectively.

5. The display panel of claim 4, wherein, At least part of the material of the third test point is the same as that of the connection line.

6. The display panel of claim 1, wherein, The substrate further comprises a plurality of data lines and a plurality of third pins arranged in the first binding area, each of the third pins being electrically connected with the corresponding data line, and the first pin being a dummy pin. 7.A method for testing a display panel, for testing a display panel, characterized in that, The display panel comprises: a substrate comprising a first binding area, the substrate comprising two first pins arranged in the first binding area, each of the first pins being electrically connected with a corresponding first test point; a control circuit board comprising a second binding area, and two second pins arranged in the second binding area; a flexible circuit board comprising two connection lines, each of the connection lines being electrically connected with a corresponding third test point, the third test point being electrically connected with one end of the connection line close to the substrate, and the two ends of the connection line being electrically connected with the corresponding first pin and the corresponding second pin, respectively; wherein the two first pins are electrically connected; each of the connection lines is provided with an opening in the middle of one end close to the substrate, the opening penetrating through one side of the connection line away from the adjacent other connection line, and the one side of the connection line surrounding the opening and being connected with the third test point; The test method comprises: obtaining a first impedance between two first test points corresponding to the two first pins when the two first pins are not electrically connected with the two connection lines; obtaining a second impedance between two third test points corresponding to the two connection lines after the two first pins are electrically connected with the two connection lines; calculating a binding impedance of the connection line in the first binding area through the first impedance and the second impedance.

8. The method of testing a display panel according to claim 7, wherein, The control circuit board includes three second test points and three second pins, each of the second pins is electrically connected to a corresponding second test point, one end of one of the two connection lines includes a first connection part and a second connection part connected to each other, the first connection part and the second connection part are electrically connected to a corresponding second pin respectively; the test method further includes: Obtaining the control circuit board impedance between two second test points corresponding to two second pins electrically connected to the first connection part and the second connection part.

9. The method of testing a display panel according to claim 8, wherein, Further comprising: Obtaining the third impedance between the second test point corresponding to one second pin electrically connected to the first connection part or the second connection part and the second test point corresponding to another second pin not electrically connected to the first connection part and the second connection part; Calculating the impedance of the connection line outside the first binding area and the second binding area through the third impedance, the control circuit board impedance and the second impedance.

10. A display device, characterized by comprising: The display panel comprises the display panel according to any one of claims 1-6.

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