Functional module for chip testing, chip testing method, device, and system

Abstract

The present application is applicable to the field of chip testing technology, and specifically discloses a functional module for chip testing, including: a microprocessor, a first connector, a data transmission expansion circuit, a first communication circuit, and a printed circuit board for carrying these devices; wherein, the communication end of the microprocessor is used to connect to the host computer through the first communication circuit, and the data pin of the microprocessor is extended by the data transmission expansion circuit and connected to the second connector provided on the chip functional test fixture through the first connector, and a time-sharing multiplexing method is used to send and receive test data to the chip to be tested installed in the slot, thereby realizing a microprocessor-based chip testing functional module, which does not have to be used with the host computer. Compared with the solution based on the DAQ card, the portability is greatly increased, and it is convenient for the microprocessor to develop and debug test tools. The present application also discloses a chip testing method, device, and system with the above-mentioned beneficial effects.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a functional module for chip testing and a chip testing method, device, and system. Background Art

[0002] Functional testing of chips packaged in packages such as LGA, M.2, and leadless chip carriers (LCC) typically includes current testing, voltage testing, and audio testing. Data acquisition (DAQ) cards are often used to perform these tests.

[0003] Figure 1 The present invention is a chip testing system based on DAQ card in the prior art.

[0004] like Figure 1 As shown, the existing chip test system based on the DAQ card mainly consists of a function test (FT) fixture board 101, a DAQ card 102, a function adapter board 103, a programmable power supply 104 and a host computer 105. Wherein, function test fixture plate 101 is provided with the slot for placing chip under test (DUT module), this slot is provided with the pin docked with chip under test, and wherein power pin is connected with the output of program-controlled power supply 104;Host computer 105 is connected with the control end of program-controlled power supply 104 by general-purpose interface bus (General-Purpose Interface Bus, GPIB) cable, for controlling program-controlled power supply 104 to power chip under test and test circuit;Function adapter plate 103 is connected with the horn seat of function test fixture plate 101 by horn seat, for realizing signal conversion and signal transmission between DAQ card 102 and chip under test, namely the signal pin on slot is transferred to DAQ card 102 based on the data link on function adapter plate 103 after being connected by two horn seats, DAQ card 102 is installed in host computer 105, for receiving and sending the test data of chip under test.Chip under test can also be directly connected with host computer 105 by USB interface, so that host computer 105 and chip under test carry out direct communication.

[0005] The existing chip testing system based on DAQ card 102 has at least the following defects: DAQ card 102 must be installed and used on the host computer 105, and is not portable. In addition, the function adapter board 103 that matches the DAQ card 102 is usually too large to be introduced into the automated line, and the wiring harness inside the fixture box is complex, which is not conducive to the development and debugging of the test tool.

[0006] Providing a more portable chip testing tool is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0007] The purpose of this application is to provide a functional module and chip testing method, device, and system for chip testing, which are more portable than chip testing solutions based on DAQ cards.

[0008] To solve the above technical problems, the present application provides a functional module for chip testing, including:

[0009] A microprocessor, a first connector, a data transmission expansion circuit, a first communication circuit, and a printed circuit board for carrying the microprocessor, the first connector, the data transmission expansion circuit, and the first communication circuit;

[0010] The pins at the first end of the data transmission expansion circuit are connected to the signal pins of the microprocessor, the extension pins at the second end of the data transmission expansion circuit are correspondingly connected to the pins at the first end of the first connector, the pins at the second end of the first connector are used to connect correspondingly to the pins at the first end of the second connector of the chip function test fixture, and the pins at the second end of the second connector are used to connect to the pins of the chip to be tested installed in the chip function test fixture;

[0011] The communication terminal of the microprocessor is used to connect to the host computer through the first communication circuit;

[0012] The microprocessor is used for transmitting and receiving test data to the chip to be tested installed in the slot in a time-division multiplexing manner based on the data transmission expansion circuit.

[0013] Optionally, it further includes a pressure detection circuit provided on the printed circuit board;

[0014] The input end of the pressure detection circuit is connected to the signal output end of the pressure signal detection switch provided on the chip function test fixture, the pressure signal detection switch is linked to the pressure arm provided on the slot, and the output end of the pressure detection circuit is connected to the pressure detection signal input end of the microprocessor;

[0015] The microprocessor is further configured to determine the degree of press-fit between the chip to be tested and the slot according to an output signal of the pressure detection circuit.

[0016] Optionally, it further includes a third connector provided on the printed circuit board;

[0017] The pins of the first end of the third connector are connected to the pins of the first end of the first connector, and the second end of the third connector is used for connecting to an external test instrument.

[0018] Optionally, it further includes an audio output circuit provided on the printed circuit board;

[0019] The input end of the audio output circuit is connected to the audio signal output end of the microprocessor, the output end of the audio output circuit is connected to the audio signal input end of the chip under test via the first connector and the second connector, and the audio signal input end of the microprocessor is connected to the audio signal output end of the chip under test via the first connector and the second connector;

[0020] The microprocessor is further configured to control the audio output circuit to input a first audio signal to the chip under test, receive a second audio signal output after processing by the chip under test, and evaluate an audio test result of the chip under test based on the second audio signal.

[0021] Optionally, the first connector and the second connector are correspondingly arranged board-to-board connectors.

[0022] Optionally, the data transmission expansion circuit specifically includes a plurality of expansion switches;

[0023] The first pin of the expansion switch is connected to the data pin of the microprocessor, the expansion pin of the expansion switch is connected to the pin of the first end of the first connector, and the selection control terminal of the expansion switch is connected to the expansion control terminal of the microprocessor;

[0024] The data pin of the microprocessor includes at least one of an analog-to-digital conversion pin, a digital-to-analog conversion pin and a general input-output pin interface.

[0025] Optionally, the first communication circuit specifically includes a UART to USB interface converter, a switch, a UART interface and a USB interface;

[0026] The first UART end of the microprocessor is connected to the UART interface, the second UART end of the microprocessor is connected to the USB interface through the interface converter, the switching switch is arranged between the interface converter and the USB interface, and the control end of the switching switch is connected to the communication switching control end of the microprocessor.

[0027] To solve the above technical problems, the present application further provides a chip testing method, based on the microprocessor in the functional module for chip testing described in any one of the above, comprising:

[0028] When the chip to be tested is installed in the slot of the chip function test fixture, it receives the test control signal sent by the host computer;

[0029] inputting a test signal to the chip under test according to the test control signal;

[0030] receiving a feedback signal output by the chip under test;

[0031] Test data is generated according to the test signal and the feedback signal, and the test data is sent to the host computer, so that the host computer generates a functional test result of the chip to be tested according to the test data.

[0032] To solve the above technical problems, the present application further provides a chip testing device, comprising the functional module for chip testing as described in any one of the above items, and further comprising a chip functional testing fixture docked with the first connector of the functional module via a second connector;

[0033] The chip function test fixture includes: a fixture plate provided with a slot for placing the chip to be tested, and the second connector provided on the fixture plate; the pins on the slot that are connected to the pins of the chip to be tested are correspondingly connected to the pins of the first connector via the second connector.

[0034] To solve the above technical problems, the present application also provides a chip testing system, comprising any one of the functional modules for chip testing described above, and further comprising: a host computer, a programmable power supply, and a chip functional testing fixture;

[0035] The chip function test fixture includes: a fixture plate provided with a slot for placing the chip to be tested, and a second connector provided on the fixture plate; pins on the slot that are connected to the pins of the chip to be tested are connected to the pins of the first connector of the functional module via the second connector; and power pins on the slot that are used to connect to the power supply end of the chip to be tested are connected to the output end of the programmable power supply;

[0036] The control terminal of the programmable power supply is connected to the power control terminal of the host computer;

[0037] The communication interface of the host computer is connected to the second end of the first communication circuit of the functional module, and the host computer is used to control the microprocessor of the functional module to perform a test on the chip to be tested.

[0038] The functional module for chip testing provided in the present application includes: a microprocessor, a first connector, a data transmission expansion circuit, a first communication circuit, and a printed circuit board for carrying these devices; wherein, the communication end of the microprocessor is used to connect to the host computer through the first communication circuit, and the data pin of the microprocessor is expanded through the data transmission expansion circuit and then connected to the second connector provided on the chip functional test fixture through the first connector, and test data is sent and received to the chip to be tested installed in the slot in a time-sharing multiplexing manner, thereby realizing a microprocessor-based chip testing functional module, which does not have to be used in conjunction with the host computer. Compared with the DAQ card-based solution, the portability is greatly increased, and it is convenient for the microprocessor to develop and debug test tools.

[0039] The present application also provides a chip testing method, device, and system, which have the above-mentioned beneficial effects and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 It is a chip testing system based on DAQ card in the prior art;

[0042] Figure 2 A schematic diagram of the structure of a functional module for chip testing provided in an embodiment of the present application;

[0043] Figure 3 A schematic diagram of the appearance of a functional module for chip testing provided in an embodiment of the present application;

[0044] Figure 4 A schematic diagram of the structure of a chip testing system based on a functional module for chip testing provided in an embodiment of the present application;

[0045] FIG5( a ) is a schematic diagram of the first part of pins of a microprocessor provided in an embodiment of the present application;

[0046] FIG5( b ) is a schematic diagram of the second portion of pins of a microprocessor provided in an embodiment of the present application;

[0047] FIG6( a ) is a circuit diagram of an interface converter provided in an embodiment of the present application;

[0048] FIG6( b ) is a circuit diagram of a UART interface provided in an embodiment of the present application;

[0049] FIG6( c ) is a circuit diagram of a USB interface provided in an embodiment of the present application;

[0050] Figure 7 A circuit diagram of a program download interface provided in an embodiment of the present application;

[0051] Figure 8 A circuit diagram of an audio output circuit provided in an embodiment of the present application;

[0052] Figure 9 A circuit diagram of an expansion switch provided in an embodiment of the present application;

[0053] Figure 10A circuit diagram of a chip pin control switch provided in an embodiment of the present application;

[0054] Figure 11 A pin diagram of a first connector provided in an embodiment of the present application;

[0055] Figure 12 A circuit diagram of a pressure detection circuit provided in an embodiment of the present application;

[0056] Figure 13 A pin diagram of a third connector provided in an embodiment of the present application;

[0057] Among them, 101 is a functional test fixture board, 102 is a DAQ card, 103 is a function adapter board, 104 is a programmable power supply, and 105 is a host computer;

[0058] 201 is a microprocessor, 202 is a first connector, 203 is a data transmission expansion circuit, 204 is an interface converter, 205 is a switch, 206 is a UART interface, 207 is a USB interface, and 208 is a printed circuit board;

[0059] 200 is a functional module for chip testing;

[0060] 400 is a chip function test fixture. DETAILED DESCRIPTION

[0061] The core of this application is to provide a functional module and chip testing method, device, and system for chip testing, which are more portable than chip testing solutions based on DAQ cards.

[0062] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0063] Example 1

[0064] Figure 2 A schematic diagram of the structure of a functional module for chip testing provided in an embodiment of the present application; Figure 3 A schematic diagram of the appearance of a functional module for chip testing provided in an embodiment of the present application; Figure 4A schematic structural diagram of a chip testing system based on a functional module for chip testing provided in an embodiment of the present application; FIG5(a) is a schematic diagram of the first portion of pins of a microprocessor provided in an embodiment of the present application; FIG5(b) is a schematic diagram of the second portion of pins of a microprocessor provided in an embodiment of the present application; FIG6(a) is a circuit diagram of an interface converter provided in an embodiment of the present application; FIG6(b) is a circuit diagram of a UART interface provided in an embodiment of the present application; FIG6(c) is a circuit diagram of a USB interface provided in an embodiment of the present application; Figure 7 A circuit diagram of a program download interface provided in an embodiment of the present application; Figure 8 A circuit diagram of an audio output circuit provided in an embodiment of the present application.

[0065] like Figure 2 As shown, the functional module for chip testing provided in the embodiment of the present application includes: a microprocessor 201 (MCU in the figure), a first connector 202, a data transmission expansion circuit 203, a first communication circuit, and a printed circuit board 208 for carrying the microprocessor 201, the first connector 202, the data transmission expansion circuit 203 and the first communication circuit;

[0066] Among them, the pin of the first end of the data transmission expansion circuit 203 is connected to the signal pin of the microprocessor 201, the expansion pin of the second end of the data transmission expansion circuit 203 is correspondingly connected to the pin of the first end of the first connector 202, the pin of the second end of the first connector 202 is used to connect correspondingly to the pin of the first end of the second connector of the chip function test fixture, and the pin of the second end of the second connector is used to connect to the pin of the chip to be tested installed in the chip function test fixture;

[0067] The communication terminal of the microprocessor 201 is used to connect to the host computer through the first communication circuit;

[0068] The microprocessor 201 is used to send and receive test data to the chip under test installed in the slot in a time-division multiplexing manner based on the data transmission expansion circuit 203 .

[0069] When performing a functional (FT) test on a chip under test, the number of data pins on either the DAQ card or the microprocessor 201 is insufficient to interface with the pins of a single chip under test. Therefore, a function adapter board is required to expand the data pins of the main controller (primarily the digital-to-analog conversion pins and the analog-to-digital conversion pins). In the prior art, a function adapter board that accompanies the DAQ card is used to expand the data pins. The functional module for chip testing provided in the embodiments of the present application replaces the DAQ card with a microprocessor 201 and directly integrates the microprocessor 201 on the function adapter board, thereby realizing a function adapter board based on the microprocessor 201 that meets the requirements of chip functional testing.

[0070] like Figure 2 As shown, the data pins of the microprocessor 201, which may include an analog-to-digital conversion pin (ADC), a digital-to-analog conversion pin (DAC), and a general-purpose input and output pin (GPIO), are each extended through a data transmission extension circuit 203. The microprocessor 201 uses a time-sharing multiplexing method to send and receive data on the extended pins to meet the test requirements when the number of pins of the chip to be tested is large. The extended pins are connected to the slots of the chip function test fixture through a first connector 202 and a second connector provided on the chip function test fixture. The distribution of the pins on the slots is arranged according to the pin distribution of the chip to be tested and the installation position on the slots. The slots also include a power pin connected to the voltage output end of the programmable power supply. The control end of the programmable control unit is connected to the host computer 105 via a GPIB cable.

[0071] Multiple microprocessors 201 can be integrated on a functional adapter board. That is, in the functional module for chip testing provided in the embodiments of the present application, multiple microprocessors 201 can be set on a printed circuit board 208. When the chip functional test fixture has slots for multiple types of chips to be tested, different microprocessors 201 can be designed to connect to different slots. Alternatively, different microprocessors 201 can be set to correspond to different groups of pins on the first connector 202 to reduce the number of extended pins reused in each group and speed up the data exchange rate with the chip to be tested.

[0072] The microprocessor 201 can perform some test functions on its own, but often needs to communicate with the host computer to accept the host computer's regulation and test control. In the functional module for chip testing provided in the embodiment of the present application, the first communication circuit may include a Universal Asynchronous Receiver / Transmitter (UART) to Universal Serial Bus (USB) interface converter 204, a switch 205, a UART interface 206, and a USB interface 207;

[0073] The first UART terminal (UART1_RX, UART1_TX) of the microprocessor 201 is connected to the UART interface 206, and the second UART terminal (UART2_RX, UART2_TX) of the microprocessor 201 is connected to the USB interface 207 through the interface converter 204. The switching switch 205 is arranged between the interface converter 204 and the USB interface 207, and the control terminal of the switching switch 205 is connected to the communication switching control terminal of the microprocessor 201.

[0074] That is, the functional module for chip testing provided in the embodiment of the present application provides two communication modes: UART and USB. The first UART terminal of the microprocessor 201 is used to receive debugging via the UART interface 206 when the microprocessor 201 is acting as a slave computer. The second UART terminal of the microprocessor 201 is used to receive debugging and test control from the host computer 105. The microprocessor 201 selects the mode (USB communication or UART communication) for receiving debugging and test control from the host computer 105 by controlling the switch 205.

[0075] See Figure 2 , Figure 5(a), Figure 5(b), Figure 6(a), Figure 6(b), Figure 6(c), it should be noted that, Figure 2 The MCU in FIG. 5 is a hardware connection diagram of the microprocessor 201, and the U301 shown in FIG. 5( a) and FIG. 5( b) is a pin type combination diagram of the microprocessor 201. Based on the functional module for chip testing provided in the embodiment of the present application, there may also be other hardware arrangements and pin combinations.

[0076] The interface converter 204 can be a PL2303. The serial port read / write pins USART2_RX and USART2_TX of the interface converter 204 chip U337 are connected to the UART2_TX and UART2_RX of the microprocessor 201, respectively. The USB read / write pins USB_DM and USB_DP of the interface converter 204 chip U337 are connected to the USB read / write pins USB_DM and USB_DP of the USB interface 207 connector J302, respectively. The switch 205 is located between the USB read / write pins of the interface converter 204 chip U337 and the USB read / write pins of the USB interface 207 connector J302. The control end of the switch 205 is connected to the D+ and D- pins of the microprocessor 201. The serial port read / write pins USART1_RX and USART1_TX of the UART interface 206 connector J303 are connected to the UART1_TX and UART1_RX of the microprocessor 201, respectively.

[0077] In addition, the functional module for chip testing provided in the embodiment of the present application may also include a program download interface connected to the microprocessor 201 for accepting updates and maintenance of the test tool. Figure 7 As shown, the data pin SWDIO and the clock pin SWCLK of the program download interface J301 are connected to the pins SWDIO and SWCLK of the microprocessor 201 respectively, the boot pin BOOT of the program download interface J301 is connected to the BOOT pin of the microprocessor 201, and the program download interface J301 is powered by a 3.3V DC power supply.

[0078] In addition, the NRST pin of the microprocessor 201 is used to connect to a reset circuit.

[0079] The functional module for chip testing provided in the embodiment of the present application is used to perform functional testing on the chip to be tested, which may include but is not limited to voltage, current, audio, and baseband testing. After the functional module and the chip functional test fixture are connected through the first connector 202 and the second connector, the microprocessor 201 is connected to the pins of the chip to be tested on the slot of the chip functional test fixture through the data transmission expansion circuit 203 to complete the test function according to the test requirements.

[0080] Among them, the voltage test can specifically include: the microprocessor 201 collects the pin output voltage of the chip to be tested, uses the ADC pin to detect the voltage value, and determines whether it is within a first voltage threshold. If so, the voltage test is passed, otherwise the voltage test is failed; or the DAC pin of the microprocessor 201 inputs a voltage to the pin of the chip to be tested, and the chip to be tested determines whether it is within a second voltage threshold. If so, the voltage test is passed, otherwise the voltage test is failed.

[0081] The current test may specifically include: the microprocessor 201 reads the current value of the chip under test and determines whether it is within the current threshold. If so, the current test is passed; otherwise, the current test is failed. In addition, the current test can be directly performed by the host computer 105, which controls the programmable power supply 104 via a GPIB cable to read the current data of the chip under test (shutdown current, sleep current, charging current, etc.).

[0082] Audio testing and baseband testing can also be implemented by cooperating with the pins extended by the data transmission extension circuit 203 .

[0083] To improve the accuracy of the audio test, the functional module for chip testing provided in the embodiment of the present application may further include an audio output circuit provided on the printed circuit board 208;

[0084] The input end of the audio output circuit is connected to the audio signal output end of the microprocessor 201, the output end of the audio output circuit is connected to the audio signal input end of the chip under test via the first connector 202 and the second connector, and the audio signal input end of the microprocessor 201 is connected to the audio signal output end of the chip under test via the first connector 202 and the second connector;

[0085] The microprocessor 201 is further configured to control the audio output circuit to input a first audio signal to the chip under test, receive a second audio signal output after processing by the chip under test, and evaluate the audio test result of the chip under test according to the second audio signal.

[0086] like Figure 8As shown, the audio output circuit is a voltage follower constructed using operational amplifier U302, enabling microprocessor 201 to output a stable first audio signal. Microprocessor 201's audio output pin DAC0 is connected to the audio output circuit's input terminal DAC0. The audio output circuit's output terminal DAC0_B is connected to the audio signal input terminal of the chip under test. The audio output circuit is powered by a 3.3V DC power supply.

[0087] When performing an audio test on the chip under test, the microprocessor 201 outputs a sine wave of a preset frequency and a preset AC effective value (such as a frequency of 1KHZ and an AC effective value of 50mV) to the chip under test through the audio output circuit, reads the second audio signal after amplification by the chip under test, analyzes and calculates the RMS (root mean square) value and THD (total harmonic distortion) value of the second audio signal, and determines whether they are within the corresponding threshold value.

[0088] In the functional module for chip testing provided in the embodiment of the present application, the first connector 202 cooperates with the second connector of the chip functional test fixture, and can use a bullnose socket of a functional adapter board such as an existing DAQ card. However, the bullnose socket is relatively large in size, and needs to be staggered on the two boards during design, and the wiring harness inside the fixture box is complicated by connecting the cables. Therefore, in the functional module for chip testing provided in the embodiment of the present application, the first connector 202 and the second connector preferably use correspondingly arranged board-to-board (BTB) connectors. Figure 3 As shown, on the printed circuit board 208, the microprocessor 201 can be placed in the center, and the first connector 202 is set on the edge of the printed circuit board 208. The design is specifically based on the arrangement position of the second connector on the chip function test fixture so that the first connector 202 and the second connector can be fastened together, thereby saving the space occupied by the functional module itself and the space occupied after connecting the chip function test fixture. By changing the first connector 202 to a board-to-board connector and integrating the necessary data transmission expansion circuit 203, the physical body of the functional module for chip testing provided by the embodiment of the present application occupies a board size of approximately 100×60mm, which is significantly reduced in area compared to the original DAQ function adapter board (210×70mm), making it more conducive to the introduction of automation solutions.

[0089] The chip testing system constructed based on the functional modules for chip testing provided in the embodiment of the present application can be as follows: Figure 4As shown, the functional module 200 for chip testing provided in the embodiment of the present application can be directly fastened to the chip functional test fixture 400 through the first connector 202. The microprocessor 201 of the functional module 200 for chip testing is connected to the host computer through the first communication circuit. The host computer can also be directly connected to the chip under test through the USB interface 207. The slot of the chip functional test fixture 400 for placing the chip under test is provided with pins for docking with the chip under test, wherein the power pin is connected to the output end of the programmable power supply 104; the host computer 105 is connected to the control end of the programmable power supply 104 through a general-purpose interface bus (GPIB) cable, and is used to control the programmable power supply 104 to supply power to the chip under test and the test circuit.

[0090] At the same time, the functional module for chip testing provided in the embodiment of the present application does not have to be connected to the host computer 105 and can also complete simple functional testing work. It is easy to carry and facilitates the deployment and updating of testing tools.

[0091] Example 2

[0092] Figure 9 A circuit diagram of an expansion switch provided in an embodiment of the present application; Figure 10 A circuit diagram of a chip pin control switch provided in an embodiment of the present application; Figure 11 A pin diagram of a first connector provided in an embodiment of the present application.

[0093] Based on the above embodiment, the embodiment of the present application further illustrates the data transmission expansion circuit 203.

[0094] In the functional module for chip testing provided in the embodiment of the present application, the data transmission expansion circuit 203 specifically includes a plurality of expansion switches;

[0095] The first pin of the expansion switch is connected to the data pin of the microprocessor 201, the expansion pin of the expansion switch is connected to the pin of the first end of the first connector 202, and the selection control terminal of the expansion switch is connected to the expansion control terminal of the microprocessor 201;

[0096] The data pins of the microprocessor 201 include at least one of an analog-to-digital conversion pin (ADC), a digital-to-analog conversion pin (DAC), and a general purpose input and output pin (GPIO).

[0097] Figure 9An expansion switch U501 in the form of an eight-to-one data selector is shown. The expansion switch U501 is used to expand the general input and output pin IO_DET0 of the microprocessor 201 into eight expansion pins, namely IO_DET0_0, IO_DET0_1, IO_DET0_2, IO_DET0_3, IO_DET0_4, IO_DET0_5, IO_DET0_6, and IO_DET0_7. The expansion switch U501 is enabled by controlling DET_EN0, and the selected expansion pin is controlled by the three pins IO_SETA, IO_SETB, and IO_SETC. The expansion switch U501 is powered by a 3.3V DC power supply.

[0098] and Figure 9 Similarly, the analog-to-digital conversion pins (ADC0, ADC1, ADC2, ADC3, ADC4, ADC5, ADC6, ADC7, ADC8, ADC9, ADC10, ADC11 as shown in FIG5(a) and FIG5(b)), the digital-to-analog conversion pins (DAC0, DAC1, DAC2 as shown in FIG5(a) and FIG5(b)), and the general input and output pins (IO_DET0, IO_DET1, IO_DET2, IO_DET3, IO_DET4, IO_DET5, IO_DET6, IO_DET7, IO_DET8, IO_DET9, IO_DET10, IO_DET11, IO_DET12, IO_DET13, IO_DET14, IO_DET15, IO_DET16, IO_DET17, IO_DET18, IO_DET19, IO_DET20 as shown in FIG5(a) and FIG5(b)) of the microprocessor 201 can be respectively controlled as needed. DET20, IO_DET21) are respectively expanded and respectively enabled through the enable pins of the microprocessor 201 (DET_EN0, DET_EN1, DET_EN2, DET_EN3, DET_EN4, DET_EN5, DET_EN6, DET_EN7, DET_EN8, DET_EN9, DET_EN10, DET_EN11, DET_EN12, DET_EN13 as shown in Figures 5(a) and 5(b)). 3. DET_EN14, DET_EN15, DET_EN16, DET_EN17, DET_EN18, DET_EN19, DET_EN20, DET_EN21, DET_EN22, DET_EN23, DET_EN24) perform enable control of the expansion switch, and the expansion pins of each expansion switch are controlled by the expansion control pins IO_SETA, IO_SETB, IO_SETC of the microprocessor 201.

[0099] It should be noted that the expansion switch can also use other types of data selectors, such as a two-to-one data selector, a four-to-two data selector, etc., which can be configured according to the layout requirements of the microprocessor 201 and the number of pins of the chip to be tested.

[0100] When performing a functional test on a chip under test, it is sometimes necessary to switch and control the pin levels of the chip under test. The functional module for chip testing provided in the embodiment of the present application may further include a chip pin control switch, wherein the control end of the chip pin control switch is connected to the level control pin of the microprocessor 201, and the output end of the chip pin control switch is connected to the pin of the chip under test that needs to be level controlled via the first connector 202 and the second connector in the slot of the chip functional test fixture.

[0101] like Figure 10 As shown, the chip pin control switch can be a MOS transistor. The gate of MOS transistor Q301 is connected to the level control pin SWITCH_CTRL_0 of microprocessor 201. The source of MOS transistor Q301 is grounded. The drain of MOS transistor Q301 outputs the SWITCH_0 signal, which is connected via first connector 202 and second connector to a pin of the chip under test located in a slot of the chip functional test fixture that requires level control. Similarly, the level control pins SWITCH_CTRL_1, SWITCH_CTRL_2, SWITCH_CTRL_3, SWITCH_CTRL_4, SWITCH_CTRL_5, SWITCH_CTRL_6, SWITCH_CTRL_7, and SWITCH_CTRL_8 of microprocessor 201 can also control the pins of the chip under test that require level control by connecting to the gates of the MOS transistors.

[0102] Based on the above description of the expansion switch and the chip pin control switch, the pin arrangement of the first connector 202 can refer to Figure 11The connector J401 shown. Among them, the ADC0, ADC1, ADC2, ADC3, ADC4, ADC5, ADC6, ADC7, ADC8, ADC9, ADC10, and ADC11 pins of the connector J401 are directly connected to the analog-to-digital conversion pins corresponding to the microprocessor 201, and DAC0_0, DAC0_1, DAC0_2, DAC0_3, DAC0_4, DAC0_5, DAC0_6, and DAC0_7 are respectively the pins after the digital-to-analog conversion pin DAC0 of the microprocessor 201 is expanded, and DAC1_0, DAC1_1, DAC1_2, DAC1_3, DAC1_4, DAC1_5, DAC 1_6 and DAC1_7 are respectively pins that are expanded from the digital-to-analog conversion pin DAC1 of the microprocessor 201, DAC2_0, DAC2_1, DAC2_2, DAC2_3, DAC2_4, DAC2_5, DAC2_6, and DAC2_7 are respectively pins that are expanded from the digital-to-analog conversion pin DAC2 of the microprocessor 201, and SWITCH_0, SWITCH_1, SWITCH_2, SWITCH_3, SWITCH_4, SWITCH_5, SWITCH_6, and SWITCH_7 are respectively used to output 8 level control signals via the first connector 202 and the second connector.

[0103] Example 3

[0104] Figure 12 A circuit diagram of a pressure detection circuit provided in an embodiment of the present application.

[0105] On the basis of the above embodiment, in order to prevent the chip under test from being burned, the functional module for chip testing provided in the embodiment of the present application further includes a pressure detection circuit provided on the printed circuit board 208;

[0106] The input end of the pressure detection circuit is connected to the signal output end of the pressure signal detection switch provided on the chip function test fixture, the pressure signal detection switch is linked to the pressure arm provided on the slot, and the output end of the pressure detection circuit is connected to the pressure detection signal input end of the microprocessor 201;

[0107] The microprocessor 201 is further configured to determine the degree of press fit between the chip to be tested and the slot according to the output signal of the pressure detection circuit.

[0108] like Figure 12As shown, the input end J304 of the voltage-down detection circuit is connected to the voltage-down signal detection switch provided in the chip function test fixture, the positive electrode of J304 is connected to the 3.3V DC power supply, the negative electrode of J304 is connected to the gate of the MOS transistor Q309, the drain of the MOS transistor Q309 is connected to the 3.3V DC power supply, the source of the MOS transistor Q309 is grounded, and the drain output signal DET_TEST of the MOS transistor Q309 is connected to the voltage-down detection signal input pin DET_TEST of the microprocessor 201.

[0109] Before performing a functional test on the chip to be tested, the microprocessor 201 first determines whether the chip to be tested is pressed into the slot through the output signal of the pressure detection circuit, and then executes specific test items, thereby ensuring that the chip to be tested is pressed into the slot before power is supplied to the chip to be tested, avoiding live operation of the chip to be tested (if the chip to be tested is not pressed into the slot, the pins in the slot will be charged), and avoiding burning the chip to be tested.

[0110] Example 4

[0111] Figure 13 A pin diagram of a third connector provided in an embodiment of the present application.

[0112] On the basis of the above embodiment, in order to further improve the accuracy of the test data, the functional module for chip testing provided in the embodiment of the present application further includes a third connector provided on the printed circuit board 208;

[0113] The pins at the first end of the third connector are connected to the pins at the first end of the first connector 202 , and the second end of the third connector is used for connecting to an external test instrument.

[0114] like Figure 13 As shown, the third connector may include, but is not limited to, connector J405. That is, the third connector may include all pins of first connector 202, each connected to a corresponding pin of first connector 202. The third connector may also include pins that are not connected to the chip functional test fixture through first connector 202, such as the extended control pins IO_SETA, IO_SETB, and IO_SETC of microprocessor 201. Through the third connector, a test board can be further connected, and each signal can be introduced to a test instrument such as an energy meter via a flat cable, allowing manual debugging and control of the functional module and verification of the accuracy of the microprocessor 201 readings, thereby improving the accuracy of the test data.

[0115] The arrangement of the third connector on the printed circuit board 208 can be referred to Figure 3 The first connector 202 is arranged in a manner shown and is disposed on the other side of the printed circuit board 208 .

[0116] The above details various embodiments corresponding to the functional modules for chip testing. On this basis, the present application also discloses a chip testing method, a chip testing device and a chip testing equipment corresponding to the above functional modules for chip testing.

[0117] Example 5

[0118] Based on the microprocessor in the functional module for chip testing provided in any of the above embodiments, the chip testing method provided in the embodiment of the present application includes:

[0119] After the chip to be tested is installed in the slot of the chip function test fixture, it receives the test control signal sent by the host computer.

[0120] A test signal is input to the chip under test according to the test control signal.

[0121] Receive a feedback signal output by the chip under test.

[0122] Test data is generated according to the test signal and the feedback signal, and the test data is sent to the host computer, so that the host computer generates a functional test result of the chip to be tested according to the test data.

[0123] In specific implementations, for voltage, current, audio, and baseband tests, the microprocessor can independently complete the readings and parameter evaluations based on pre-deployed test tools to obtain the functional test results of the chip under test; the microprocessor can also upload the readings or processed readings to the host computer, and the host computer can obtain the functional test results of the chip under test.

[0124] Since the embodiments of the chip testing method part correspond to the embodiments of the functional module part for chip testing, the remaining embodiments of the chip testing method part refer to the description of the embodiments of the functional module part for chip testing and will not be repeated here.

[0125] Example 6

[0126] On the basis of the above embodiments, an embodiment of the present application further provides a chip testing device, comprising the functional module for chip testing provided by any of the above embodiments, and further comprising a chip functional testing fixture docked with the first connector of the functional module via a second connector;

[0127] The chip function test fixture includes: a fixture board with a slot for placing the chip to be tested, and a second connector provided on the fixture board; the pins on the slot that are connected to the pins of the chip to be tested are connected to the pins of the first connector via the second connector.

[0128] Since the embodiments of the chip testing device part correspond to the embodiments of the functional module part for chip testing, the remaining embodiments of the chip testing device part refer to the description of the embodiments of the functional module part for chip testing and will not be repeated here.

[0129] Example 7

[0130] On the basis of the above embodiments, the embodiments of the present application further provide a chip testing system, comprising the functional module for chip testing provided by any of the above embodiments, and further comprising: a host computer, a programmable power supply, and a chip functional testing fixture;

[0131] The chip function test fixture includes: a fixture plate having a slot for placing the chip to be tested, and a second connector provided on the fixture plate; pins on the slot that are connected to the pins of the chip to be tested are connected to corresponding pins of the first connector of the functional module via the second connector; and power pins on the slot that are used to connect to the power supply end of the chip to be tested are connected to the output end of the programmable power supply;

[0132] The control terminal of the programmable power supply is connected to the power control terminal of the host computer;

[0133] The communication interface of the host computer is connected to the second end of the first communication circuit of the functional module, and the host computer is used to control the microprocessor of the functional module to execute the test on the chip to be tested.

[0134] Since the embodiments of the chip test system part correspond to the embodiments of the functional module part for chip testing, the remaining embodiments of the chip test system part refer to the embodiments of the functional module part for chip testing, especially Figure 4 The relevant description is not repeated here.

[0135] The above is a detailed introduction to a functional module for chip testing and a chip testing method, device, and system provided by the present application. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the chip testing method, chip testing device, and chip testing system disclosed in the embodiments, since they correspond to the functional modules for chip testing disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the functional modules for chip testing. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0136] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

Claims

1. A functional module for chip testing, characterized in that: include: A microprocessor, a first connector, a data transmission expansion circuit, a first communication circuit, and a printed circuit board for carrying the microprocessor, the first connector, the data transmission expansion circuit, and the first communication circuit; The pins at the first end of the data transmission expansion circuit are connected to the signal pins of the microprocessor, the expansion pins at the second end of the data transmission expansion circuit are correspondingly connected to the pins at the first end of the first connector, the pins at the second end of the first connector are used to connect correspondingly to the pins at the first end of the second connector of the chip function test fixture, and the pins at the second end of the second connector are used to connect to the pins of the chip to be tested installed in the slot of the chip function test fixture; The communication terminal of the microprocessor is used to connect to the host computer through the first communication circuit; The microprocessor is configured to transmit and receive test data to the chip under test installed in the slot in a time-division multiplexing manner based on the data transmission expansion circuit, and to determine whether the chip under test passes the test based on the test data; The data transmission expansion circuit specifically includes a plurality of expansion switches; The first pin of the expansion switch is connected to the data pin of the microprocessor, the expansion pin of the expansion switch is connected to the pin of the first end of the first connector, and the selection control terminal of the expansion switch is connected to the expansion control terminal of the microprocessor; The data pin of the microprocessor includes at least one of an analog-to-digital conversion pin, a digital-to-analog conversion pin and a general input-output pin interface.

2. The functional module according to claim 1, characterized in that: Also included is a pressure detection circuit provided on the printed circuit board; The input end of the pressure detection circuit is connected to the signal output end of the pressure signal detection switch provided on the chip function test fixture, the pressure signal detection switch is linked to the pressure arm provided on the slot, and the output end of the pressure detection circuit is connected to the pressure detection signal input end of the microprocessor; The microprocessor is further configured to determine the degree of press-fit between the chip to be tested and the slot according to an output signal of the pressure detection circuit.

3. The functional module according to claim 1, characterized in that: Also included is a third connector provided on the printed circuit board; The pins of the first end of the third connector are connected to the pins of the first end of the first connector, and the second end of the third connector is used for connecting to an external test instrument.

4. The functional module according to claim 1, characterized in that: Also included is an audio output circuit provided on the printed circuit board; The input end of the audio output circuit is connected to the audio signal output end of the microprocessor, the output end of the audio output circuit is connected to the audio signal input end of the chip under test via the first connector and the second connector, and the audio signal input end of the microprocessor is connected to the audio signal output end of the chip under test via the first connector and the second connector; The microprocessor is further configured to control the audio output circuit to input a first audio signal to the chip under test, receive a second audio signal output after processing by the chip under test, and evaluate an audio test result of the chip under test based on the second audio signal.

5. The functional module according to claim 1, characterized in that: The first connector and the second connector are correspondingly arranged board-to-board connectors.

6. The functional module according to claim 1, characterized in that: The first communication circuit specifically includes a UART to USB interface converter, a switch, a UART interface and a USB interface; The first UART end of the microprocessor is connected to the UART interface, the second UART end of the microprocessor is connected to the USB interface through the interface converter, the switching switch is arranged between the interface converter and the USB interface, and the control end of the switching switch is connected to the communication switching control end of the microprocessor.

7. A chip testing method, characterized in that: The microprocessor in the functional module for chip testing according to any one of claims 1 to 6 comprises: When the chip to be tested is installed in the slot of the chip function test fixture, it receives the test control signal sent by the host computer; inputting a test signal to the chip under test according to the test control signal; receiving a feedback signal output by the chip under test; Test data is generated according to the test signal and the feedback signal, and the test data is sent to the host computer, so that the host computer generates a functional test result of the chip to be tested according to the test data.

8. A chip testing device, characterized in that: A functional module for chip testing according to any one of claims 1 to 6, further comprising a chip functional test fixture docked with the first connector of the functional module via a second connector; The chip function test fixture comprises: a fixture plate provided with a slot for placing the chip to be tested, and the second connector provided on the fixture plate; The pins on the slot that are connected to the pins of the chip to be tested are correspondingly connected to the pins of the first connector via the second connector.

9. A chip testing system, characterized in that: A functional module for chip testing according to any one of claims 1 to 6, further comprising: a host computer, a programmable power supply and a chip functional test fixture; The chip function test fixture includes: a fixture plate provided with a slot for placing the chip to be tested, and a second connector provided on the fixture plate; pins on the slot that are connected to the pins of the chip to be tested are connected to the pins of the first connector of the functional module via the second connector; and power pins on the slot that are used to connect to the power supply end of the chip to be tested are connected to the output end of the programmable power supply; The control terminal of the programmable power supply is connected to the power control terminal of the host computer; The communication interface of the host computer is connected to the second end of the first communication circuit of the functional module, and the host computer is used to control the microprocessor of the functional module to perform a test on the chip to be tested.

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