Electro-optic modulator assembly and method of assembling the same
By integrating the modulator chip, focusing lens, and optical fiber positioning slot and fixed-axis structure, the coupling efficiency and stability issues of the electro-optic modulator are solved, realizing the miniaturized and efficient assembly of optical communication modules suitable for the field of communication technology.
Patent Information
- Application Number
- CN202210756913.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-29
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2042-06-29
AI Technical Summary
In existing optical communication systems, the coupling efficiency and system stability of electro-optic modulators are limited, resulting in large module device size, high transmission loss, and difficulty in fixing the relative positions of focusing lens, modulator chip and optical fiber, which affects the application and promotion of integrated modules.
By employing a positioning groove and fixed-axis structure, the modulator chip, focusing lens, and optical fiber are integrated together. By adjusting the inclined bonding between the fixed-axis section and the focusing lens and the modulator chip, efficient coupling between the optical fiber and the optical waveguide is achieved, and the coupling effect is optimized by adjusting the bias voltage.
It improves the coupling efficiency between the optical waveguide and the light source, reduces the module integration volume, and enhances the stability and reliability of the system, making it suitable for mass production and application in the field of communication technology.
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Figure CN115032820B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of optical transmitter module integration for optical communication and optical interconnection, and in particular to an electro-optical modulator assembly and an assembling method thereof. BACKGROUND
[0002] The trend of high-speed integrated optical transmitter module for optical communication system puts forward high requirements for the process of high-speed electro-optical devices and the integration of the devices, and the key point is the high-efficiency coupling of the light source and the electro-optical modulator and the matching degree of the light spots.
[0003] In the prior art, there are two coupling methods for the integrated module, i.e., fiber coupling and space coupling.
[0004] The fiber coupling method uses a modulator input end to couple a fiber to receive light from a DFB light source through a collimating lens.
[0005] The space coupling method uses a modulator input end to couple a suitable focusing lens to receive light from a DFB light source through a collimating lens, which can reduce the overall size of the system integrated module and reduce the high transmission loss of the transmission cable RF transmission signal. Before use, the focusing lens, the modulator chip, and the fiber need to be adjusted by a three-dimensional adjustment frame to determine the relative positions of the focusing lens, the modulator chip, and the fiber. In actual application, the relative positions of the focusing lens, the modulator chip, and the fiber cannot be fixed, which limits the coupling efficiency, system stability, and reliability of the system module, and is not conducive to the application and promotion of the integrated module.
[0006] Therefore, it is necessary to provide an electro-optical modulator assembly and an assembling method thereof capable of improving the coupling efficiency, system stability, and reliability. SUMMARY
[0007] The present application aims to overcome the shortcomings of the prior art and provide an electro-optical modulator assembly and an assembling method thereof capable of improving the coupling efficiency, system stability, and reliability.
[0008] The technical scheme of the present application provides an electro-optical modulator assembly, which comprises a modulator chip with an optical waveguide, a substrate with a positioning slot, a focusing lens, an axis positioning part, and a fiber.
[0009] The positioning slot is arranged on the top surface of the substrate and extends along the length direction of the substrate.
[0010] The modulator chip comprises a first chip end and a second chip end arranged oppositely, wherein an end surface of the second chip end is a second end bevel, a waveguide incident end of the optical waveguide is in the first chip end, and a waveguide emission end of the optical waveguide is in the second chip end;
[0011] An end surface of the shaft fixing part facing the second end bevel side is a shaft fixing part bevel, the shaft fixing part bevel is parallel to the second end bevel, and the shaft fixing part has a shaft fixing part through hole therein;
[0012] The modulator chip is fixedly installed in the positioning groove, wherein the first chip end is in the positioning groove, and the second chip end extends out of the outside of the positioning groove;
[0013] One end of the optical fiber is bonded in the shaft fixing part through hole, the shaft fixing part bevel is bonded with the second end bevel, and the optical fiber is coupled with the waveguide emission end;
[0014] The focusing lens is installed on one side of the first chip end, and the focusing lens is coupled with the waveguide incident end.
[0015] In one of the optional technical solutions, before the shaft fixing part bevel is bonded with the second end bevel, the shaft fixing part is adjusted to couple the optical fiber with the waveguide emission end;
[0016] In one of the optional technical solutions, when the output power of the waveguide incident end is maximum, the shaft fixing part is positioned, and the shaft fixing part bevel is bonded with the second end bevel.
[0017] In one of the optional technical solutions, the included angle between the second end bevel and the positioning groove is between 70°-85°.
[0018] In one of the optional technical solutions, an end surface of the first chip end is a first end straight surface, and the first end straight surface is perpendicular to the length direction of the positioning groove;
[0019] The first end straight surface is flush with a slot opening of one end of the positioning groove, and the focusing lens is bonded with the first end straight surface.
[0020] In one of the optional technical solutions, the waveguide incident end is aligned with the axis of the focusing lens.
[0021] In one of the optional technical solutions, an end surface of the first chip end is a first end bevel, and the first end bevel is parallel to the second end bevel;
[0022] The positioning groove has a lens mounting groove at the slot opening, the first end bevel extends into the lens mounting groove, and the focusing lens is connected in the lens mounting groove.
[0023] In an alternative, the focusing lens and the substrate are adjusted to couple the focusing lens with the waveguide entrance end before the focusing lens is connected in the lens mounting slot.
[0024] In an alternative, the focusing lens and the substrate are positioned and the focusing lens is positioned in the lens mounting slot when the output power of the optical fiber is maximum.
[0025] In an alternative, the focusing lens is bonded in the lens mounting slot.
[0026] The present application also provides an assembling method of the electro-optical modulator assembly as claimed in any one of the preceding technical solutions, comprising the following steps:
[0027] S01: connecting one end of the optical fiber in the axis positioning hole of the axis positioning part;
[0028] S02: mounting the modulator chip in the positioning slot of the substrate, with the first end of the chip in the positioning slot and the second end of the chip extending out of the positioning slot;
[0029] S03: bonding the axis positioning part bevel of the axis positioning part with the second end bevel of the chip second end, and coupling the optical fiber with the waveguide exit end;
[0030] S04: fixing the focusing lens, with the focusing lens on one side of the chip first end and the focusing lens coupled with the waveguide entrance end.
[0031] In an alternative, the step S03 further comprises:
[0032] connecting one end of the optical fiber with a first light source and connecting the waveguide entrance end with a first optical power meter;
[0033] using a first adjusting device to hold and adjust the axis positioning part, to make the axis positioning part bevel fit with the second end bevel and to preliminarily align the optical fiber with the waveguide exit end;
[0034] applying a first preset bias voltage to the modulator chip;
[0035] fine-tuning the axis positioning part through the first adjusting device until the display value of the first optical power meter reaches maximum;
[0036] bonding the axis positioning part bevel with the second end bevel.
[0037] In one of the optional technical solutions, the end face of the first end of the chip is a first end straight face, and the first end straight face is perpendicular to the length direction of the positioning groove;
[0038] The step S02 further comprises:
[0039] The first end straight face is placed flush with the notch at one end of the positioning groove;
[0040] The step S04 further comprises:
[0041] The axis of the focusing lens is aligned with the waveguide incident end;
[0042] The focusing lens is bonded to the first end straight face.
[0043] In one of the optional technical solutions, the end face of the first end of the chip is a first end inclined face, and the first end inclined face is parallel to the second end inclined face;
[0044] The notch of the positioning groove has a lens mounting groove;
[0045] The step S02 further comprises:
[0046] The first end inclined face extends into the lens mounting groove;
[0047] The step S04 further comprises:
[0048] The focusing lens is placed in the lens mounting groove;
[0049] A second light source and a collimating lens are arranged on the side of the focusing lens away from the first end inclined face, and the collimating lens is used to emit light from the second light source in parallel to the focusing lens;
[0050] The optical fiber is connected with a second optical power meter;
[0051] A second adjusting device is used to hold and adjust the focusing lens, and a third adjusting device is used to hold and adjust the substrate, and the focusing lens and the waveguide incident end are preliminarily aligned;
[0052] A second preset bias voltage is applied to the modulator chip;
[0053] The focusing lens is fine-tuned by the second adjusting device and / or the substrate is fine-tuned by the third adjusting device until the display value of the second optical power meter reaches the maximum;
[0054] The focusing lens is bonded in the lens mounting groove.
[0055] The above technical solution has the following beneficial effects:
[0056] The electro-optical modulator assembly and the assembling method thereof are provided, the focusing lens, the modulator chip and the optical fiber are integrated together as an assembly, only the spatial position between the light source and the collimating lens and the assembly needs to be considered when used, the relative position between the focusing lens, the modulator chip and the optical fiber does not need to be adjusted, the coupling efficiency between the optical waveguide and the light source is greatly improved, the light source and the collimating lens can be made into another assembly, the two assemblies are aligned, coupled and fixed in the spatial position, the integrated module can be conveniently and efficiently integrated in batches, the integrated module has small volume and high stability, can be integrally packaged and is suitable for popularization and application in the field of communication technology. BRIEF DESCRIPTION OF DRAWINGS
[0057] The disclosure will become more readily apparent from the detailed description when taken in conjunction with the accompanying drawings. It should be understood that the drawings are for illustration only and are not intended to limit the scope of the present application in any way. In the drawings:
[0058] Figure 1 A perspective view of the electro-optical modulator assembly provided by the first embodiment of the present application;
[0059] Figure 2 A top view of the electro-optical modulator assembly shown in Figure 1
[0060] Figure 3 A schematic view of the modulator chip with the optical waveguide, the axis fixing part and the optical fiber integrated together in the electro-optical modulator assembly shown in Figure 1
[0061] A schematic view of the substrate in the electro-optical modulator assembly shown in Figure 4 Figure 1 A schematic view of the axis fixing part and the optical fiber integrated together
[0062] Figure 5 A perspective view of the electro-optical modulator assembly provided by the second embodiment of the present application;
[0063] Figure 6 A top view of the electro-optical modulator assembly shown in
[0064] Figure 7 Figure 6 A schematic view of the substrate in the electro-optical modulator assembly shown in
[0065] Figure 8 A schematic view of the substrate in the electro-optical modulator assembly shown in Figure 6
[0066] A schematic view of the modulator chip with the optical waveguide, the axis fixing part and the optical fiber integrated together in the electro-optical modulator assembly shown in Figure 9 Figure 6
[0067] Figure 10 To couple Figure 6 Fig. 1 is a schematic diagram showing a focusing lens in an electro-optical modulator assembly according to an embodiment of the present application. DETAILED DESCRIPTION
[0068] The specific embodiments of the present application will be further described with reference to the drawings. Like components are denoted by like reference numerals throughout the description. It should be noted that the terms "front", "back", "left", "right", "upper" and "lower" as used in the following description refer to directions in the drawings and the terms "inner" and "outer" refer to directions towards or away from the geometric center of the particular component.
[0069] As Figures 1-9 shown in the drawings, an embodiment of the present application provides an electro-optical modulator assembly, which comprises a modulator chip 2 having an optical waveguide 1, a substrate 3 having a positioning groove 31, a focusing lens 4, an axis positioning portion 5 and an optical fiber 6.
[0070] The positioning groove 31 is disposed on the top surface of the substrate 3, and extends along the length direction of the substrate 3.
[0071] The modulator chip 2 comprises a first chip end 21 and a second chip end 22 arranged oppositely, wherein the end surface of the second chip end 22 is a second end bevel 221, the waveguide incident end 11 of the optical waveguide 1 is located in the first chip end 21, and the waveguide outgoing end 12 of the optical waveguide 1 is located in the second chip end 22.
[0072] The end surface of the axis positioning portion 5 facing the side of the second end bevel 221 is an axis positioning portion bevel 51, which is parallel to the second end bevel 221, and the axis positioning portion 5 has an axis positioning portion through hole 52.
[0073] The modulator chip 2 is fixedly installed in the positioning groove 31, wherein the first chip end 21 is located in the positioning groove 31, and the second chip end 22 extends out of the outside of the positioning groove 31.
[0074] One end of the optical fiber 6 is bonded in the axis positioning portion through hole 52, the axis positioning portion bevel 51 is bonded with the second end bevel 221, and the optical fiber 6 is coupled with the waveguide outgoing end 12.
[0075] The focusing lens 4 is installed on one side of the first chip end 21, and the focusing lens 4 is coupled with the waveguide incident end 11.
[0076] The electro-optical modulator assembly provided by the present application integrates the modulator chip 2, the substrate 3, the focusing lens 4, the axis positioning portion 5 and the optical fiber 6 together.
[0077] The modulator chip 2 can be a straight waveguide modulator, a Y waveguide modulator, a lithium niobate thin film intensity modulator, an MZ type intensity modulator or other modulators. The modulator chip 2 has the optical waveguide 1 thereon.
[0078] The modulator chip 2 is long strip-shaped. One end of the modulator chip 2 is defined as a chip first end 21, and the other end of the modulator chip 2 is defined as a chip second end 22. The end face of the chip second end 22 is a second end bevel 221, which reduces the reflection of back light.
[0079] One end of the optical waveguide 1 is defined as a waveguide incident end 11, and the other end of the optical waveguide 1 is defined as a waveguide emission end 12. Both the waveguide incident end 11 and the waveguide emission end 12 are straight waveguides. The waveguide incident end 11 is in the chip first end 21, and the end face of the waveguide incident end 11 is on the end face of the chip first end 21. The waveguide emission end 12 is in the chip second end 22, and the end face of the waveguide emission end 12 is on the second end bevel 221.
[0080] Two waveguides, specifically a first waveguide 13 and a second waveguide 14, are connected between the waveguide incident end 11 and the waveguide emission end 12. Bias electrodes 15 are arranged on both sides of the first waveguide 13 and the second waveguide 14. When different bias voltages are applied to the bias electrodes 15 on both sides of the first waveguide 13 and the second waveguide 14, the refractive index of the waveguide changes, ultimately leading to a change in output optical power.
[0081] A positioning groove 31 is arranged on the top surface of the substrate 3, which extends along the length direction of the substrate 3 and penetrates through the front and back ends of the substrate 3. The middle part of the positioning groove 31 has an opening 32, which facilitates the user to place or take out the modulator chip 2 from the positioning groove 31.
[0082] The focusing lens 4 is a convex lens. The axis setting part 5 is a positioning block, and the end face of the axis setting part 5 facing the second end bevel 221 side is an axis setting part bevel 51, and the end face of the axis setting part 5 facing away from the second end bevel 221 side is an axis setting part straight face. The axis setting part bevel 51 is parallel to the second end bevel 221. The axis setting part 5 has an axis setting part through hole 52, which penetrates through the axis setting part straight face and the axis setting part bevel 51.
[0083] During assembly, one end of the optical fiber 6 is first bonded in the axis setting part through hole 52. An adhesive layer is arranged in the axis setting part through hole 52 for bonding with the optical fiber 6.
[0084] Then the modulator chip 2 is bonded in the positioning groove 31, and the chip first end 21 is in the positioning groove 31 or flush with one end of the positioning groove 31, and the chip second end 22 extends outside the positioning groove 31. To further improve the connection stability, an adhesive layer is arranged in the positioning groove 31 and the bottom is a horizontal rectangular surface, so that when the modulator chip 2 is placed in the positioning groove 31, it can be directly bonded and connected with the adhesive layer, eliminating the process of dropping glue.
[0085] The fixed shaft part inclined surface 51 is bonded with the second end inclined surface 221, and the optical fiber 6 is coupled with the waveguide exit end 12 to realize the light path propagation. The fixed shaft part inclined surface 51 and / or the second end inclined surface 221 has a bonding layer to facilitate the bonding of the fixed shaft part inclined surface 51 and the second end inclined surface 221.
[0086] Finally, the focusing lens 4 is installed on one side of the chip first end 21, and the focusing lens 4 is coupled with the waveguide exit end 12 to realize the light path propagation.
[0087] The focusing lens 4, the modulator chip 2 and the optical fiber 6 are integrated together and used as a component.
[0088] In use, only the spatial position between the light source, the collimating lens and the focusing lens 4 needs to be considered, and the relative positions between the focusing lens 4, the modulator chip 2 and the optical fiber 6 do not need to be adjusted, which greatly improves the coupling efficiency between the optical waveguide 1 and the light source. After the module is integrated, the volume is small, and the module can be integrally packaged, which is suitable for popularization and application in the field of communication technology.
[0089] In one embodiment, before the fixed shaft part inclined surface 51 is bonded with the second end inclined surface 221, the fixed shaft part 5 is adjusted to couple the optical fiber 6 with the waveguide exit end 12.
[0090] When the output power of the waveguide exit end 11 is maximum, the fixed shaft part 5 is positioned, and the fixed shaft part inclined surface 51 is bonded with the second end inclined surface 221.
[0091] In order to improve the coupling effect between the optical fiber 6 and the waveguide exit end 12, before the fixed shaft part inclined surface 51 is bonded with the second end inclined surface 221, the following operations are adopted:
[0092] One end of the optical fiber 6 is connected with a first light source. The first light source can be a DFB light source.
[0093] The light of the first light source is propagated to the waveguide exit end 11 through the optical fiber 6.
[0094] The waveguide exit end 11 is connected with a first optical power meter. The first optical power meter is used to monitor the output power of the waveguide exit end 11. A first adjusting device 7 is used to clamp and adjust the fixed shaft part 5. The first adjusting device 7 is a three-dimensional adjusting frame. The fixed shaft part inclined surface 51 is bonded with the second end inclined surface 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12. The fixed shaft part 5 is adjusted through the first adjusting device 7, and then the position and angle of the optical fiber 6 are adjusted, and the optical fiber 6 is aligned with the waveguide exit end 12.
[0095] The first preset bias voltage is applied to the bias electrode 15 in the modulator chip 2, and the first adjusting device 7 is used to fine tune the shaft part 5 until the display value of the first optical power meter reaches the maximum, which indicates that the coupling effect between the optical fiber 6 and the waveguide exit end 12 is the best. The shaft part inclined surface 51 is fixed by the glue and the second end inclined surface 221.
[0096] In one embodiment, as shown in Figure 3 and Figure 9 the angle between the second end inclined surface 221 and the length direction of the positioning groove 31 is between 70°-85°, and the anti-light reflection effect is good.
[0097] In one embodiment, as shown in Figures 1-3 the end surface of the chip first end 21 is a first end straight surface 211, and the first end straight surface 211 is perpendicular to the length direction of the positioning groove 31.
[0098] The first end straight surface 211 is flush with the slot at one end of the positioning groove 31, and the focusing lens 4 is bonded to the first end straight surface 211.
[0099] In this embodiment, one end of the chip first end 21 is a first end straight surface 211, and the other end is a second end inclined surface 221. When the modulator chip 2 is assembled and bonded into the positioning groove 31, the first end straight surface 211 is flush with the slot at one end of the positioning groove 31. When the focusing lens 4 is coupled with the waveguide exit end 11, the focusing lens 4 is directly bonded to the first end straight surface 211, and the focusing lens 4 is attached to the end of the substrate 3, which facilitates assembly.
[0100] In one embodiment, as shown in Figure 2 when one end of the chip first end 21 is a first end straight surface 211, the waveguide exit end 11 is aligned with the axis of the focusing lens 4, and the coupling effect of the focusing lens 4 with the waveguide exit end 11 is the best.
[0101] In one embodiment, as shown in Figures 6-9 the end surface of the chip first end 21 is a first end inclined surface 212, and the first end inclined surface 212 is parallel to the second end inclined surface 221.
[0102] The positioning groove 31 has a lens mounting groove 33 at the slot, the first end inclined surface 212 extends into the lens mounting groove 33, and the focusing lens 4 is connected in the lens mounting groove 33.
[0103] In this embodiment, one end of the first end 21 of the chip is a first end inclined surface 212, and the other end is a second end inclined surface 221. The first end inclined surface 212 is parallel to the second end inclined surface 221, and the inclined surfaces function to prevent light reflection. A lens mounting groove 33 is formed at the notch of the positioning groove 31 where the first end 21 of the chip is mounted. When the modulator chip 2 is assembled and bonded into the positioning groove 31, the first end inclined surface 212 extends into the lens mounting groove 33. When the focusing lens 4 is coupled to the waveguide incident end 11, the focusing lens 4 is mounted in the lens mounting groove 33, and the focusing lens 4 has no connection relationship with the first end inclined surface 212.
[0104] In one embodiment, before the focusing lens 4 is connected in the lens mounting groove 33, the focusing lens 4 and the substrate 3 are adjusted to couple the focusing lens 4 with the waveguide incident end 11.
[0105] In one embodiment, before the focusing lens 4 is connected in the lens mounting groove 33, the focusing lens 4 and the substrate 3 are adjusted to couple the focusing lens 4 with the waveguide incident end 11.
[0106] In one embodiment, before the focusing lens 4 is connected in the lens mounting groove 33, the focusing lens 4 and the substrate 3 are adjusted to couple the focusing lens 4 with the waveguide incident end 11. Figure 10 As shown in the figure, in order to improve the coupling effect between the focusing lens 4 and the waveguide incident end 11, the following operations are adopted before the focusing lens 4 is fixed in the lens mounting groove 33:
[0107] The focusing lens 4 is placed in the lens mounting groove 33 in advance.
[0108] A second light source 100 and a collimating lens 200 are arranged on one side of the focusing lens 4, and the second light source 100 and the collimating lens 200 are used as another assembly. The collimating lens 200 is between the second light source 100 and the focusing lens 4. The collimating lens 200 is used to make the light emitted by the second light source 100 parallel to the focusing lens 4.
[0109] The light of the second light source 100 is collimated by the collimating lens 200 and then emitted to the focusing lens 4, and then propagates to the optical fiber 6 through the optical waveguide 1.
[0110] The optical fiber 6 is connected with a second light power meter.
[0111] The focusing lens 4 is clamped and adjusted by the second adjusting device 8, the substrate 3 is clamped and adjusted by the third adjusting device 9, the position and angle of the focusing lens 4 and the waveguide incident end 11 are preliminarily aligned by fine adjustment of the focusing lens 4 by the second adjusting device 8 and / or fine adjustment of the substrate 3 by the third adjusting device 9.
[0112] A second preset bias voltage is applied to the bias electrode 15 in the modulator chip 2.
[0113] Then the focusing lens 4 and / or the base plate 3 are fine-tuned by the second adjusting device 8 and the third adjusting device 9 until the display value of the second optical power meter reaches the maximum, which indicates that the coupling effect between the focusing lens 4 and the waveguide incident end 11 is the best at this time, and then the focusing lens 4 is fixed in the lens mounting groove 33.
[0114] In one of the embodiments, the focusing lens 4 is bonded in the lens mounting groove 33, and an adhesive layer is coated in the lens mounting groove 33 in advance, which facilitates the fixation of the focusing lens 4 in the lens mounting groove 33.
[0115] The adhesive referred to in the present application is an adhesive commonly used in the optical field and has light guiding performance, which will not be described herein.
[0116] The assembly method of the electro-optical modulator assembly provided by the embodiment of the present application combines the advantages of the above two methods. Figures 1-10 As shown in the figure, the method comprises the following steps:
[0117] S01: One end of the optical fiber 6 is connected in the fixed shaft portion through hole 52 of the fixed shaft portion 5.
[0118] S02: The modulator chip 2 is installed in the positioning groove 31 of the base plate 3, and the chip first end 21 is in the positioning groove 31, and the chip second end 22 extends out of the positioning groove 31.
[0119] S03: The fixed shaft portion inclined surface 51 of the fixed shaft portion 5 is bonded with the second end inclined surface 221 of the chip second end 22, and the optical fiber 6 is coupled with the waveguide exit end 12.
[0120] S04: The focusing lens 4 is fixed, and the focusing lens 4 is on one side of the chip first end 21, and the focusing lens 4 is coupled with the waveguide incident end 11.
[0121] The assembly method of the electro-optical modulator assembly provided by the present application comprises the following assembly steps
[0122] First, one end of the optical fiber 6 is bonded in the fixed shaft portion through hole 52. An adhesive layer is arranged in the fixed shaft portion through hole 52 for bonding with the optical fiber 6.
[0123] Then, the modulator chip 2 is bonded in the positioning groove 31, the chip first end 21 is in the positioning groove 31 or flush with one end of the positioning groove 31, and the chip second end 22 extends out of the outside of the positioning groove 31. In order to further improve the connection stability, an adhesive layer is arranged in the positioning groove 31 and the bottom is a horizontal plane rectangle, so that when the modulator chip 2 is placed in the positioning groove 31, it can be directly bonded and connected with the adhesive layer, and the process of dropping glue is omitted.
[0124] The fixed shaft part bevel 51 and the second end bevel 221 are bonded, and the optical fiber 6 is coupled with the waveguide exit end 12 to realize light path propagation. The fixed shaft part bevel 51 and / or the second end bevel 221 has a bonding layer to facilitate the bonding of the fixed shaft part bevel 51 and the second end bevel 221.
[0125] Finally, the focusing lens 4 is installed on one side of the chip first end 21, and the focusing lens 4 is coupled with the waveguide exit end 12 to realize light path propagation.
[0126] The focusing lens 4, the modulator chip 2 and the optical fiber 6 are integrated together and used as a component.
[0127] In use, only the spatial positions between the light source, the collimating lens and the focusing lens 4 need to be considered, and the relative positions between the focusing lens 4, the modulator chip 2 and the optical fiber 6 do not need to be adjusted, which greatly improves the coupling efficiency between the optical waveguide 1 and the light source. After the module is integrated, the volume is small, and the module can be integrally packaged, which is suitable for popularization and application in the field of communication technology.
[0128] In one embodiment, the step S03 further includes:
[0129] One end of the optical fiber 6 is connected with the first light source, and the waveguide exit end 12 is connected with the first optical power meter.
[0130] The fixed shaft part 5 is clamped and adjusted by the first adjusting device 7, the fixed shaft part bevel 51 is attached to the second end bevel 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12.
[0131] The first preset bias voltage is applied to the modulator chip 2.
[0132] The fixed shaft part 5 is finely adjusted by the first adjusting device 7 until the display value of the first optical power meter reaches the maximum.
[0133] The fixed shaft part bevel 51 and the second end bevel 221 are bonded.
[0134] In this embodiment, in order to improve the coupling effect between the optical fiber 6 and the waveguide exit end 12, the following operations are adopted before the fixed shaft part bevel 51 and the second end bevel 221 are bonded.
[0135] One end of the optical fiber 6 is connected with the first light source. The first light source can be a DFB light source.
[0136] The light of the first light source is propagated to the waveguide exit end 11 through the optical fiber 6.
[0137] The waveguide incident end 11 is connected with the first optical power meter. The first optical power meter is used to monitor the output power of the waveguide incident end 11. The first adjusting device 7 is used to clamp and adjust the fixed shaft part 5. The first adjusting device 7 is a three-dimensional adjusting frame. The fixed shaft part inclined surface 51 is attached to the second end inclined surface 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12. The fixed shaft part 5 is adjusted through the first adjusting device 7, and then the position and angle of the optical fiber 6 are adjusted, so that the optical fiber 6 is aligned with the waveguide exit end 12.
[0138] The first preset bias voltage is applied to the bias electrode 15 in the modulator chip 2, and then the fixed shaft part 5 is finely adjusted through the first adjusting device 7 until the display value of the first optical power meter reaches the maximum. At this time, the coupling effect between the optical fiber 6 and the waveguide exit end 12 is the best, and the fixed shaft part inclined surface 51 and the second end inclined surface 221 are fixedly bonded by glue.
[0139] In one embodiment, the end surface of the chip first end 21 is a first end straight surface 211, and the first end straight surface 211 is perpendicular to the length direction of the positioning groove 31.
[0140] In step S02, the following is further included:
[0141] The first end straight surface 211 is placed flush with the notch at one end of the positioning groove 31.
[0142] In step S04, the following is further included:
[0143] The axis of the focusing lens 4 is aligned with the waveguide incident end 11.
[0144] The focusing lens 4 is bonded to the first end straight surface 211.
[0145] In this embodiment, one end of the chip first end 21 is a first end straight surface 211, and the other end is a second end inclined surface 221. When the modulator chip 2 is assembled and bonded into the positioning groove 31, the first end straight surface 211 is flush with the notch at one end of the positioning groove 31. When the focusing lens 4 is coupled with the waveguide incident end 11, the focusing lens 4 is directly bonded to the first end straight surface 211, and the focusing lens 4 is attached to the end of the substrate 3, which facilitates assembly.
[0146] In one embodiment, the end surface of the chip first end 21 is a first end inclined surface 212, and the first end inclined surface 212 is parallel to the second end inclined surface 221.
[0147] The notch of the positioning groove 31 has a lens mounting groove 33.
[0148] In step S02, the following is further included:
[0149] The first end inclined surface 212 extends into the lens mounting groove 33.
[0150] In step S04, the following is further included:
[0151] The focusing lens 4 is placed in the lens mounting groove 33.
[0152] The second light source 100 and the collimating lens 200 are arranged on the side of the focusing lens 4 away from the first end bevel 212, and the collimating lens 200 is used to make the light emitted by the second light source 100 parallel to the focusing lens 4.
[0153] The optical fiber 6 is connected with the second optical power meter.
[0154] The focusing lens 4 is clamped and adjusted by the second adjusting device 8, and the substrate 3 is clamped and adjusted by the third adjusting device 9, so that the focusing lens 4 is preliminarily aligned with the waveguide incident end 11.
[0155] The second preset bias voltage is applied to the modulator chip 2.
[0156] The focusing lens 4 and / or the substrate 3 are fine-adjusted by the second adjusting device 8 and the third adjusting device 9 respectively until the display value of the second optical power meter reaches the maximum.
[0157] The focusing lens 4 is bonded in the lens mounting groove 33.
[0158] In the embodiment, one end of the first end 21 of the chip is the first end bevel 212, and the other end is the second end bevel 221. The bevels play a role of preventing light reflection. The first end bevel 212 is parallel to the second end bevel 221. The lens mounting groove 33 is formed at the notch of the positioning groove 31 where the first end 21 of the chip is installed. When the modulator chip 2 is assembled and bonded in the positioning groove 31, the first end bevel 212 extends into the lens mounting groove 33. When the focusing lens 4 is coupled with the waveguide incident end 11, the focusing lens 4 is installed in the lens mounting groove 33, and the focusing lens 4 has no connection relationship with the first end bevel 212.
[0159] In combination with Figure 10 As shown in the figure, in order to improve the coupling effect between the focusing lens 4 and the waveguide incident end 11, the following operations are adopted before the focusing lens 4 is fixed in the lens mounting groove 33:
[0160] The focusing lens 4 is placed in the lens mounting groove 33 in advance.
[0161] The second light source 100 and the collimating lens 200 are arranged on one side of the focusing lens 4 and are used as another component. The collimating lens 200 is between the second light source 100 and the focusing lens 4. The collimating lens 200 is used to make the light emitted by the second light source 100 parallel to the focusing lens 4.
[0162] The light of the second light source 100 is collimated by the collimating lens 200 and then is emitted to the focusing lens 4, and then is propagated to the optical fiber 6 through the optical waveguide 1.
[0163] The optical fiber 6 is connected with the second optical power meter.
[0164] The focusing lens 4 is clamped and adjusted by the second adjusting device 8, the base plate 3 is clamped and adjusted by the third adjusting device 9, the position and angle of the focusing lens 4 and the waveguide incident end 11 are preliminarily aligned by fine adjustment of the focusing lens 4 through the second adjusting device 8 and / or fine adjustment of the base plate 3 through the third adjusting device 9.
[0165] A second preset bias voltage is applied to the bias electrode 15 in the modulator chip 2.
[0166] Then the focusing lens 4 is fine adjusted through the second adjusting device 8 and / or the base plate 3 is fine adjusted through the third adjusting device 9 until the display value of the second optical power meter reaches the maximum, which indicates that the coupling effect between the focusing lens 4 and the waveguide incident end 11 is the best at this time, and then the focusing lens 4 is fixed in the lens mounting groove 33.
[0167] According to the needs, the above technical solutions can be combined to achieve the best technical effect.
[0168] The above only describes the principles and preferred embodiments of the present application. It should be noted that for those skilled in the art, on the basis of the principles of the present application, a number of other variations can also be made, which should be considered as the protection scope of the present application.
Claims
1. An electro-optic modulator assembly, comprising: The application relates to an electro-optical modulator assembly, which comprises a modulator chip with an optical waveguide, a substrate with a positioning groove, a focusing lens, an axis positioning part and an optical fiber. The positioning groove is arranged on the top surface of the substrate and extends along the length direction of the substrate. The modulator chip comprises oppositely arranged chip first and second ends, wherein the end surface of the chip second end is a second end bevel for reducing back light reflection; the waveguide incident end of the optical waveguide is in the chip first end, and the waveguide emission end of the optical waveguide is in the chip second end; wherein the included angle between the second end bevel and the positioning groove is between 70 DEG and 85 DEG. The end surface of the axis positioning part facing the side of the second end bevel is an axis positioning part bevel, which is parallel to the second end bevel, and the axis positioning part has an axis positioning part through hole. The modulator chip is fixedly installed in the positioning groove, wherein the chip first end is in the positioning groove, and the chip second end extends out of the positioning groove. One end of the optical fiber is bonded in the axis positioning part through hole, the axis positioning part bevel is bonded with the second end bevel, and the optical fiber is coupled with the waveguide emission end. The focusing lens is a convex lens, which is installed on one side of the chip first end and is coupled with the waveguide incident end. The end surface of the chip first end is a first end bevel, which is parallel to the second end bevel and plays a role of preventing light reflection; the positioning groove has a lens mounting groove at the slot opening, the first end bevel extends into the lens mounting groove, and the focusing lens is connected in the lens mounting groove. The focusing lens, the modulator chip and the optical fiber are used as an integrated assembly, and only the spatial position between the light source and the collimating lens and the focusing lens needs to be considered during use.
2. The electro-optic modulator assembly of claim 1, wherein, Before the axis positioning part bevel is bonded with the second end bevel, the axis positioning part is adjusted to couple the optical fiber with the waveguide emission end. When the output power of the waveguide incident end is maximum, the axis positioning part is positioned, and the axis positioning part bevel is bonded with the second end bevel.
3. The electro-optical modulator assembly according to claim 1, wherein Before the focusing lens is connected in the lens mounting groove, the focusing lens and the substrate are adjusted to couple the focusing lens with the waveguide incident end. When the output power of the optical fiber is maximum, the focusing lens and the substrate are positioned, and the focusing lens is positioned in the lens mounting groove.
4. The electro-optic modulator assembly of claim 3, wherein, The focusing lens is bonded in the lens mounting groove.
5. A method of assembling an electro-optic modulator assembly as claimed in any one of claims 1 to 4, characterised by, The method comprises the following steps: S01: connecting one end of the optical fiber in the axis positioning part through hole of the axis positioning part; S02: installing the modulator chip in the positioning groove of the substrate, and making the chip first end in the positioning groove and the chip second end extending out of the positioning groove; S03: bonding the axis positioning part bevel of the axis positioning part with the second end bevel of the chip second end, and making the optical fiber coupled with the waveguide emission end; S04: fixing the focusing lens on one side of the first end of the chip, and making the focusing lens coupled with the waveguide incident end.
6. The method of assembling an electro-optic modulator assembly of claim 5, wherein, The step S03 further comprises: connecting one end of the optical fiber with the first light source, and connecting the waveguide incident end with the first optical power meter; using the first adjusting device to hold and adjust the shafting part, making the inclined surface of the shafting part fit with the inclined surface of the second end, and preliminarily aligning the optical fiber with the waveguide emergent end; applying a first preset bias voltage to the modulator chip; fine-tuning the shafting part through the first adjusting device until the display value of the first optical power meter reaches the maximum; bonding the inclined surface of the shafting part with the inclined surface of the second end.
7. The method of assembling an electro-optic modulator assembly of claim 5, wherein, The end surface of the first end of the chip is a first end straight surface, and the first end straight surface is perpendicular to the length direction of the positioning groove; The step S02 further comprises: placing the first end straight surface flush with the notch at one end of the positioning groove; The step S04 further comprises: the axis of the focusing lens is aligned with the waveguide incident end; bonding the focusing lens with the first end straight surface.
8. The method of assembling an electro-optic modulator assembly of claim 5, wherein, The end surface of the first end of the chip is a first end inclined surface, and the first end inclined surface is parallel to the second end inclined surface; the notch of the positioning groove is provided with a lens mounting groove; The step S02 further comprises: the first end inclined surface extends into the lens mounting groove; The step S04 further comprises: placing the focusing lens in the lens mounting groove; arranging a second light source and a collimating lens on the side of the focusing lens away from the first end inclined surface, and the collimating lens is used to make the light emitted by the second light source parallel to the focusing lens; connecting the optical fiber with the second optical power meter; using the second adjusting device to hold and adjust the focusing lens, and using the third adjusting device to hold and adjust the substrate, and preliminarily aligning the focusing lens with the waveguide incident end; applying a second preset bias voltage to the modulator chip; fine-tuning the focusing lens through the second adjusting device and / or fine-tuning the substrate through the third adjusting device until the display value of the second optical power meter reaches the maximum; bonding the focusing lens in the lens mounting groove.
Citation Information
Patent Citations
Coupling fixing device and coupling device assembly
CN112230449A
Optical transmission and reception module having coupled optical waveguide chips
US5497438A
Coupling optical fibre to waveguide
US6212320B1