Camera module

Abstract

A camera module according to an embodiment of the present invention includes: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board; an optical component disposed on the light source and including electrodes; and a conductive part disposed on the housing and electrically connecting the electrodes of the optical component to the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to a camera module. BACKGROUND

[0002] Three-dimensional content is applied not only in the fields of games and culture, but also in various fields such as education, manufacturing, autonomous driving, etc., and in order to acquire three-dimensional content, a depth map is required. The depth map is a map showing spatial distance, and the depth map shows perspective information of one point with respect to another point in a two-dimensional image.

[0003] A time-of-flight (ToF) method is attracting attention as a technique for acquiring a depth map. According to the ToF method, the distance to an object is calculated by measuring the time of flight, i.e., the time for which light is emitted, reflected, and returned. The greatest advantage of the ToF method is that distance information in a three-dimensional space is provided in real time quickly. In addition, the user can obtain accurate distance information without applying an additional algorithm or hardware correction. Furthermore, accurate depth information can be obtained even when measuring a very close object or measuring a moving object.

[0004] However, unlike a camera module that does not use a separate light source, since a ToF camera has a structure that emits light using a light source, there can be a safety problem. In particular, when light of high light intensity is emitted into a light-sensitive part such as the eyes, etc. in the human body, a serious injury can occur. In order to prevent such accidents, a ToF camera module is manufactured in accordance with strict safety regulations. Therefore, there is a need for a camera module that can solve these problems. SUMMARY

[0005] TECHNICAL PROBLEM

[0006] The present application aims to provide a time-of-flight (ToF) camera module.

[0007] The objects to be achieved by the embodiments are not limited thereto, and further include objects or effects that can be recognized by the following technical solutions or embodiments.

[0008] TECHNICAL SOLUTION

[0009] One aspect of the present application provides a camera module including: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board; an optical member disposed above the light source and including an electrode; and a conductive unit disposed on the housing and electrically connecting the electrode of the optical member with the circuit board.

[0010] The camera module can include a cover disposed on the housing, wherein the cover can be spaced apart from the conductive unit.

[0011] The conductive unit can include a first conductive unit and a second conductive unit.

[0012] Each of the first conductive unit and the second conductive unit can include a first portion disposed on the housing, a second portion extending from the first portion, and a third portion extending from the second portion and having a width greater than that of the second portion.

[0013] The second portion can include a first sub-portion extending along an upper surface of the housing and a second sub-portion connected to the first sub-portion and extending along a side surface of the housing.

[0014] The first sub-portion of the first conductive unit can include a first piece and a second piece curved and connected to the first piece.

[0015] The second portion of the second conductive unit can be curved and extend from the third portion of the second conductive unit.

[0016] The housing can include a first recess, and the conductive unit can be disposed in the first recess.

[0017] The first recess can include a first area and a second area, wherein the first conductive unit can be disposed in the first area of the first recess, and the second conductive unit can be disposed in the second area of the first recess.

[0018] A width of the first recess can be greater than a width of the conductive unit.

[0019] A depth of the first recess can be greater than a thickness of the conductive unit.

[0020] The housing can include a protrusion further protruding than the conductive unit.

[0021] The housing can include a first hole located above the light source and a stepped portion disposed at a periphery of the first hole, wherein the stepped portion can include a seating surface on which the optical member is disposed.

[0022] The first area of the first recess can extend to a first corner portion of the seating surface, and the second area of the first recess can extend to a second corner portion of the seating surface.

[0023] The first conductive unit can be disposed to extend from the first groove to the first corner portion, and the second conductive unit can be disposed to extend from the first groove to the first corner portion.

[0024] The camera module can include a dummy electrode disposed between the optical member and the housing and spaced apart from the conductive unit.

[0025] The dummy electrode can include a first dummy electrode disposed on a third corner portion of the seating surface and a second dummy electrode disposed on a fourth corner portion of the seating surface.

[0026] The first dummy electrode and the second dummy electrode can have the same thickness as the first conductive unit and the second conductive unit.

[0027] The seating surface can include first to fourth seating surfaces disposed between the first to fourth corner portions, and the housing can include first to fourth connection surfaces extending from the first to fourth seating surfaces to an upper end surface and a second groove disposed in at least one of the first to fourth seating surfaces and extending to at least one of the first to fourth connection surfaces.

[0028] Another aspect of the present application provides a camera module including: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board and including a first hole overlapping the light source; a cover disposed on the housing; an optical member disposed above the light source and disposed to overlap the first hole; and a connection electrode disposed to extend from the first hole to an outside of the housing, wherein the connection electrode is spaced apart from the cover.

[0029] The housing can include a pattern portion having a concave shape in an upper end surface in contact with the cover.

[0030] The circuit board can include a first terminal connected to the cover, a second terminal connected to a first connection electrode of the connection electrode, and a third terminal connected to a second connection electrode of the connection electrode.

[0031] The cover can include a first side plate and a second side plate disposed on a first side surface, and a step can be formed between the first side plate and the second side plate such that the cover does not overlap upper portions of the first to third terminals.

[0032] The lower end of the first side plate may be configured to contact the circuit board, and the lower end of the second side plate may be configured to be spaced apart from the circuit board.

[0033] The cover may include a protrusion that extends from the lower end of the first side plate and contacts the first terminal.

[0034] The camera module may include: a first welding portion that joins the protrusion to the first terminal; a second welding portion that joins the first connecting electrode to the second terminal; and a third welding portion that joins the second connecting electrode to the third terminal.

[0035] The cover may include a recess adjacent to one of the corner portions of the circuit board in the plan view, and the first to the third welding portions may be disposed on the recess.

[0036] Another aspect of the present invention provides a camera module, the camera module comprising: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board and including a first hole overlapping the light source; an optical component disposed above the light source and configured to overlap the first hole; a connecting electrode extending from the first hole to the outside of the housing; and a dummy electrode disposed around the first hole, wherein at least a portion of the connecting electrode and at least a portion of the dummy electrode are disposed between the optical component and the housing.

[0037] The housing may include a stepped portion disposed on the inner circumferential surface of the first hole. A portion of the connecting electrode may be disposed on at least one corner of the stepped portion. The dummy electrode may be disposed on at least one corner of the stepped portion where no portion of the connecting electrode is disposed.

[0038] The thickness of the dummy electrode can be the same as the thickness of the connecting electrode.

[0039] Beneficial effects

[0040] According to the embodiments, a highly secure Time-of-Flight (ToF) camera module can be provided.

[0041] It can simplify the manufacturing process of camera modules.

[0042] This can reduce the defect rate of camera modules during manufacturing.

[0043] The various useful advantages of the present invention are not limited to the above description and can be more readily understood in the description of specific embodiments of the invention. Attached Figure Description

[0044] Figure 1 This is a perspective view showing a camera module according to an embodiment of the present invention;

[0045] Figure 2 This is an exploded view showing a camera module according to an embodiment of the present invention;

[0046] Figure 3 This is a plan view showing the housing according to an embodiment of the present invention;

[0047] Figure 4 This is a rear view showing the housing according to an embodiment of the present invention;

[0048] Figure 5 This is a side view showing the housing according to an embodiment of the present invention;

[0049] Figure 6 This is an enlarged perspective view showing one side of the housing according to an embodiment of the present invention;

[0050] Figure 7 This is a cross-sectional view showing the housing according to an embodiment of the present invention;

[0051] Figure 8 This is an enlarged plan view showing the stepped portion of the housing according to an embodiment of the present invention;

[0052] Figure 9 This is a view showing the first conductive unit according to an embodiment of the present invention;

[0053] Figure 10 This is a view showing the second conductive unit according to an embodiment of the present invention;

[0054] Figure 11 This is a plan view showing a housing in which conductive units, dummy electrodes, and optical components are joined according to an embodiment of the present invention;

[0055] Figure 12 This is a side view showing a housing in which conductive units, dummy electrodes, and optical components are joined according to an embodiment of the present invention;

[0056] Figure 13 This is a plan view showing the cover according to an embodiment of the present invention;

[0057] Figure 14 This is a side view showing the cover according to an embodiment of the present invention;

[0058] Figure 15 This is an enlarged view showing one side of a camera module according to an embodiment of the present invention. Detailed Implementation

[0059] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0060] However, the spirit of the present invention is not limited to the described embodiments, but can be implemented in various different forms, and one or more components in the embodiments can be selectively combined, substituted and used within the scope of the spirit of the present invention.

[0061] Furthermore, unless specifically defined and explicitly described, all terms used in this invention (including technical and scientific terms) are generally understood by one of ordinary skill in the art to which this invention pertains, and the meaning of commonly used terms can be interpreted in light of the context of the relevant art. For example, their meanings are typically defined in dictionaries.

[0062] Furthermore, the terminology used in the embodiments of this invention is for descriptive purposes and is not intended to limit the invention.

[0063] In this specification, unless the context otherwise indicates, the singular form may also include the plural form, and in the case of describing “at least one (or one or more) of A, B and C”, this may include at least one combination of all possible combinations of A, B and C.

[0064] In addition, when describing the components of embodiments of the present invention, terms such as "first", "second", "A", "B", "(a)", "(b)" may be used.

[0065] These terms are used only to distinguish one element from another, and do not limit the nature, order, etc. of the elements.

[0066] Furthermore, it should be understood that when an element is described as being “connected” or “coupled” to another element, such a description may include two cases: the element is directly connected or coupled to another element; and the element is connected or coupled to another element by another element inserted between the element and the other element.

[0067] Furthermore, when any element is described as being formed or positioned "above" or "below" another element, this description includes two cases: the two elements are formed or positioned in direct contact with each other; and one or more other elements are inserted between the two elements. Additionally, when an element is described as "above or below," this description can include the other element being formed on the upper or lower side relative to one element.

[0068] The optical device according to this embodiment will now be described.

[0069] Optical devices can include any of the following: mobile phones, portable phones, smartphones, portable smart devices, digital cameras, laptops, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), and navigation devices. However, the types of optical devices are not limited to these; any device used for capturing images can be included as an optical device.

[0070] The optical device may include a main body. The main body may be strip-shaped. Alternatively, the main body may have one of various structures (e.g., sliding, folding, oscillating, rotating), wherein two or more sub-body parts are connected and can move relative to each other. The main body may include a shell (outer shell, housing, and cover) forming the exterior. For example, the main body may include a front shell and a rear shell. Various electronic components of the optical device may be mounted in the space formed between the front and rear shells.

[0071] Optical devices may include a display. The display may be mounted on a surface of the main body of the optical device. The display may output images. The display may output images captured by a camera.

[0072] The optical device may include a camera. The camera may include a Time-of-Flight (ToF) camera device. The ToF camera device may include a camera module. The ToF camera device may be disposed on the front surface of the optical device's body. In this case, the ToF camera device can be used for various types of biometrics, such as facial recognition and iris recognition of the user, for secure authentication of the optical device.

[0073] In the following text, reference will be made to Figures 1 to 12 A camera module according to an embodiment of the present invention is described.

[0074] Figure 1 This is a perspective view showing a camera module according to an embodiment of the present invention.

[0075] refer to Figure 1 According to an embodiment of the present invention, the camera module may include a light-emitting unit 1, a light-receiving unit 2, a bonding unit 3, a circuit board 4, a second board 5, a connecting part 6, and a connector 7.

[0076] The light-emitting unit 1 can be a light-emitting module, a light-emitting unit, a light-emitting component, or a light-emitting device. The light-emitting unit 1 can generate an output light signal and emit it towards the object. In this case, the light-emitting unit 1 can generate and output an output light signal in the form of a pulse wave or a continuous wave. The continuous wave can be in the form of a sine wave or a square wave. Because the output light signal is generated in the form of a pulse wave or a continuous wave, the ToF camera device can detect the phase difference between the output light signal output by the light-emitting unit 1 and the input light signal reflected by the object and input to the light receiving unit 2 of the ToF camera device. In this specification, the output light can be light output by the light-emitting unit 1 and incident on the object, and the input light can be light output by the light-emitting unit 1, reaching the object, being reflected by the object, and then input to the ToF camera device. Depending on the object, the output light can be incident light, and the input light can be reflected light.

[0077] The light-emitting unit 1 emits the generated output light signal during a predetermined integration time. In this case, the integration time refers to one frame period. To generate multiple frames, the preset integration time is repeated. For example, when the ToF camera device captures an image of the object at 20 frames per second (FPS), the integration time is 1 / 20 of a second. Alternatively, to generate 100 frames, the integration time may be repeated 100 times.

[0078] The light-emitting unit 1 can output multiple output light signals with different frequencies. The light-emitting unit 1 can generate multiple output light signals with different frequencies sequentially and repeatedly. Alternatively, the light-emitting unit 1 can also output multiple output light signals with different frequencies simultaneously.

[0079] The camera module may include a light receiving unit 2. The light receiving unit 2 may be a light receiving module, a light receiving unit, a light receiving component, or a light receiving device. The light receiving unit 2 can detect light emitted by the light emitting unit 1 and reflected by an object. The light receiving unit 2 can generate an input light signal corresponding to the output light signal output by the light emitting unit 1. The light receiving unit 2 may be arranged side-by-side with the light emitting unit 1. The light receiving unit 2 may be positioned next to the light emitting unit 1. The light receiving unit 2 may be arranged in the same direction as the light emitting unit 1.

[0080] The camera module may include a circuit board 4. Circuit board 4 may include a printed circuit board (PCB). Light-emitting unit 1 and light-receiving unit 2 may be disposed on circuit board 4. Circuit board 4 may be electrically connected to light-emitting unit 1 and light-receiving unit 2.

[0081] Circuit board 4 may include multiple terminals on one side. Circuit board 4 may include a first terminal to a third terminal. The first terminal may be a terminal connected to a cover. The first terminal may be a ground terminal. The second terminal may be a terminal connected to a first conductive unit. The third terminal may be a terminal connected to a second conductive unit. The second and third terminals may be electrically connected to a transparent electrode through the first and second conductive units.

[0082] The camera module may include a bonding unit 3. The bonding unit 3 may be electrically connected to a circuit board 4. The bonding unit 3 may be connected to components of the optical device. The bonding unit 3 may include a connector 7 that connects to components of the optical device. The bonding unit 3 may include a second board 5, on which the connector 7 is disposed, and the second board 5 is connected to a connecting portion 6. The second board 5 may be a PCB.

[0083] The camera module may include a connector 6. The connector 6 connects the circuit board 4 and the bonding unit 3. The connector 6 may be flexible. The connector 6 may be a flexible PCB (FPCB).

[0084] Figure 2 This is an exploded view of a camera module according to an embodiment of the present invention.

[0085] refer to Figure 2 The light-emitting unit may include a light source 40 and an optical component 50.

[0086] The light-emitting unit 1 may include a light source 40. The light source 40 may be disposed on the circuit board 4. The light source 40 can generate light. The light source 40 can output light. The light source 40 can emit light. The light generated by the light source 40 may be infrared light with a wavelength of 770 nm to 3000 nm. Alternatively, the light generated by the light source 40 may be visible light with a wavelength of 380 nm to 770 nm. The light source 40 may include a light-emitting diode (LED) or a vertical-cavity surface-emitting laser (VCSEL). The light source 40 may include multiple LEDs or VCSELs arranged in a predetermined pattern. Furthermore, the light source 40 may include an organic light-emitting LED (OLED) or a laser diode (LD).

[0087] The light-emitting unit 1 may include an optical component 50. The optical component 50 may be a diffuser, lens, diffractive optical element (DOE), or holographic optical element (HOE). The optical component 50 may be positioned in front of the light source 40. Light emitted by the light source 40 can pass through the optical component 50 and be incident on the object. The optical component 50 may alter the path of the light emitted by the light source 40. The optical component 50 may focus the light emitted by the light source 40. Electrodes may be disposed on the optical component 50. The optical component 50 may include electrodes, or separate electrodes may be provided. The electrodes may be transparent electrodes.

[0088] The light-emitting unit 1 may include an optical modulator for modulating light. The light source 40 can generate an output light signal in the form of a pulsed wave or a continuous wave by repeatedly switching the light source 40 on and off at predetermined time intervals. The predetermined time interval may correspond to the frequency of the output light signal. The switching on / off of the light source 40 can be controlled by the optical modulation unit. The optical modulation unit can control the switching on / off of the light source 40, causing the light source 40 to generate an output light signal in the form of a continuous wave or a pulsed wave. The optical modulation unit can control the light source 40 to generate an output light signal in the form of a continuous wave or a pulsed wave through frequency modulation, pulse modulation, etc. The optical modulator may be mounted on a board.

[0089] The light receiving unit may include a lens module 10, a filter 20, and a sensor 30.

[0090] The lens module 10 can transmit light reflected from an object. The optical axis of the lens module 10 and the optical axis of the sensor 30 can be aligned. The lens module 10 can be attached to the housing 100. The lens module 10 can be fixed to the housing 100.

[0091] Filter 20 can be attached to housing 100. Filter 20 can be disposed between lens module 10 and sensor 30. Filter 20 can be disposed in the optical path between object and sensor 30. Filter 20 can filter light within a predetermined wavelength range. Filter 20 can transmit light with a specific wavelength. That is, filter 20 can block light with wavelengths other than a specific wavelength by reflecting or absorbing light. Filter 20 can transmit infrared light and block light with wavelengths other than infrared light. Alternatively, filter 20 can transmit visible light and block light with wavelengths other than visible light wavelengths. Filter 20 can be movable. Filter 20 can be moved integrally with the holder. Filter 20 can be tilted. Filter 20 can be moved to adjust the optical path. Filter 20 can be moved to change the path of light incident on sensor 30. Filter 20 can change the angle, direction, etc., of the field of view (FOV) of the incident light.

[0092] Sensor 30 can detect light. Sensor 30 can detect light and output an electrical signal. Sensor 30 can detect light having a wavelength corresponding to the wavelength of the light output by light source 40. Sensor 30 can detect infrared light. Alternatively, sensor 30 can detect visible light. Sensor 30 can be mounted on circuit board 4. Sensor 30 can be an image sensor.

[0093] Sensor 30 may include: a pixel array that receives light passing through lens module 10 and converts the light into an electrical signal corresponding to the light; a driving circuit that drives a plurality of pixels included in the pixel array; and a readout circuit that reads the analog pixel signals of the pixels. The readout circuit can perform analog-to-digital conversion to generate digital pixel signals (image signals) by comparing the analog pixel signals with a reference signal. In this case, the digital pixel signals of the pixels included in the pixel array constitute the image signal, and since the image signal is transmitted in units of frames, the image signal can be defined as an image frame. That is, sensor 30 can output multiple image frames.

[0094] The light receiving unit 2 may include an image compositing unit. The image compositing unit may include an image processor that receives image signals from the sensor 30 and processes the image signals (e.g., performs interpolation, frame synthesis, etc.). The image compositing unit may be mounted on a board, but is not limited to this. The image compositing unit can be implemented using an application processor (AP) of a terminal equipped with a camera module.

[0095] The camera module according to an embodiment of the present invention may include a housing 100, a conductive unit 210, a dummy electrode 220, a cover 300, and a welding part 400.

[0096] The housing 100 can be disposed on the plate. The housing 100 can be disposed on the upper surface of the plate. The conductive unit 210 and the dummy electrode 220 can be coupled to the housing 100. The optical component 50 can be coupled to the housing 100. The conductive unit 210, the dummy electrode 220, and the optical component 50 can be configured to correspond to a first hole in the housing 100. The filter 20 can be coupled to the housing 100. The lens module 10 can be coupled to the housing 100. The filter 20 and the lens module 10 can be configured to correspond to a second hole in the housing 100.

[0097] The housing 100 may include a first hole, a second hole, a stepped portion, and a first groove. The first hole may overlap with the light source. The first hole may be located above the light source 40. The second hole may overlap with the sensor 30. The second hole may be located above the sensor 30.

[0098] The stepped portion may be disposed adjacent to the first hole. The stepped portion may be disposed on the inner circumferential surface of the first hole. The stepped portion may support the optical component 50. The stepped portion may include a mounting surface on which the optical component 50 is disposed. The mounting surface of the stepped portion may include a first corner portion to a fourth corner portion. The mounting surface may include a first mounting surface to a fourth mounting surface disposed between the first corner portion and the fourth corner portion. The housing 100 may include a first connecting surface to a fourth connecting surface extending from the first mounting surface to the fourth mounting surface.

[0099] The first groove can be connected to the step portion. The first groove can be connected to the corner portion of the step portion. The conductive unit 210 can be disposed in the first groove. The first groove can be disposed in the upper surface of the housing 100 and can extend toward the side surface of the housing 100. The width of the first groove can be greater than the width of the conductive unit 210. The depth of the first groove can be greater than the thickness of each of the conductive units 210.

[0100] The first groove may include a first region and a second region. A conductive unit 210 may be disposed in the first groove. The first conductive unit may be disposed in the first region of the first groove, and the second conductive unit may be disposed in the second region of the first groove. A protrusion extending further than the conductive unit may be disposed between the first and second regions of the first groove. The protrusion may be disposed on the upper surface of the housing and may extend to the side surface of the housing. The length of the portion of the protrusion disposed on the side surface of the housing may be less than the height of the side surface of the housing. Because the depth of the first groove is greater than the thickness of the conductive unit 210, damage to the conductive unit 210 can be prevented during manufacturing.

[0101] The housing 100 may include a second groove. The housing 100 may include at least one second groove, which connects to at least one of the first to fourth connecting surfaces. The second groove may be disposed in at least one of the first to fourth connecting surfaces and may extend to a connecting surface corresponding to at least one of the first to fourth connecting surfaces. For example, when the second groove is disposed in the first connecting surface, the second groove may extend to the first connecting surface corresponding to the first connecting surface.

[0102] The housing 100 may include a patterned portion. The housing 100 may include a patterned portion formed as a concave shape in the upper surface that contacts the cover 300.

[0103] The conductive unit 210 can electrically connect the transparent electrode and the circuit board 4. The conductive unit 210 can be formed of a conductor capable of electrically connecting the transparent electrode and the circuit board 4. In this specification, the conductive unit may be referred to as a connecting electrode.

[0104] The conductive unit 210 can be disposed in a recess in the housing 100. A portion of each of the conductive units 210 can be disposed in the first recess. A portion of the conductive unit 210 can be disposed on a stepped portion of the housing 100. A portion of the conductive unit 210 can be disposed on a corner of the mounting surface of the stepped portion of the housing 100. A portion of the conductive unit 210 can be disposed on at least one of the corners of the mounting surface.

[0105] According to an embodiment, one conductive unit 210 may be provided, or multiple conductive units 210 may be provided. The conductive unit 210 may include a first conductive unit and a second conductive unit. The first conductive unit and the second conductive unit can electrically connect the transparent electrode and the circuit board 4.

[0106] Each of the conductive units 210 may include a first portion and a second portion. Each of the first conductive unit and the second conductive unit may include a first portion, a second portion, and a third portion. The first portion is disposed on the housing. The second portion extends from the first portion. The second portion includes a first sub-part and a second sub-part. The first sub-part is disposed on the upper surface of the housing. The first sub-part extends from the first portion along the upper surface of the housing. The second sub-part is connected to the second sub-part. The second sub-part extends along the side surface of the housing. The third portion extends from the second portion. The third portion is disposed on the side surface of the housing. The width of the second portion is smaller than the width of the third portion. That is, the width of the third portion may be larger than the width of the second portion.

[0107] The first part of the first conductive unit can be disposed on the first corner of the mounting surface of the step portion.

[0108] The second part of the first conductive unit may be disposed on the first region of the first groove. The first sub-part and the second sub-part included in the second part of the first conductive unit may be disposed in the first region of the first groove.

[0109] A first sub-part of the first conductive unit is disposed in a first region of a first groove in the upper surface of the housing. The first sub-part of the first conductive unit includes a first component and a second component. The first component extends from the first sub-part. The first component extends toward the short side of the housing. The second component extends from the first component. The second component extends along the long side of the housing. Therefore, the first component and the second component can be bent and connected.

[0110] The second sub-part of the first conductive unit is disposed in the first region of the first groove in the side surface of the housing. Since the first sub-part is disposed on the upper surface and the second sub-part is disposed on the side surface, the first and second sub-parts can be bent at the connection. The second and first sub-parts can be bent at a predetermined curvature and connected.

[0111] The third portion of the first conductive unit is disposed in the first region of the first groove in the side surface of the housing. The third portion of the first conductive unit extends from the second portion. The width of the third portion is greater than the width of the second portion. When the third portion extends from the second portion, the third portion may not be bent. That is, the center of the third portion may coincide with the centerline of the second portion.

[0112] The first part of the second conductive unit can be set on the second corner of the mounting surface of the step portion.

[0113] The second part of the second conductive unit can be disposed in the second region of the first groove. The first sub-part and the second sub-part included in the second part of the second conductive unit can be disposed in the second region of the first groove.

[0114] The first sub-part of the second conductive unit is disposed in the second region of the first groove in the upper surface of the housing. The second sub-part of the second conductive unit is disposed in the second region of the first groove in the side surface of the housing. Since the first sub-part is disposed on the upper surface and the second sub-part is disposed on the side surface, the first and second sub-parts can be bent at the connection. The second and first sub-parts can be bent at a predetermined curvature and connected.

[0115] The third portion of the second conductive unit is disposed in the second region of the first groove in the side surface of the housing. The third portion of the second conductive unit extends from the second portion. The width of the third portion is greater than the width of the second portion. When the third portion of the second conductive unit extends from the second portion, the third portion of the second conductive unit can be bent. That is, the centerline of the third portion may not be consistent with the centerline of the second portion.

[0116] The dummy electrode 220 can be positioned adjacent to the first hole of the housing 100. The dummy electrode 220 can be positioned on the stepped portion of the housing. The dummy electrode 220 can be positioned at the corner of the mounting portion of the stepped portion, where no conductive element is provided.

[0117] One or more dummy electrodes 220 can be provided. For example, when four dummy electrodes 220 are provided at the corner of the stepped section and one conductive unit 210 is provided, three dummy electrodes 220 can be provided. As another example, when four dummy electrodes 220 are provided at the corner of the stepped section and two conductive units 210 are provided, two dummy electrodes 220 can be provided. The thickness of each of the dummy electrodes 220 can be the same as the thickness of the conductive unit 210. Since the dummy electrodes 220 are provided on the corner of the stepped section where no conductive unit 210 is provided, balance can be achieved when setting the optical component 50.

[0118] A transparent electrode can be attached to the optical component 50. The transparent electrode can be electrically connected to the optical component 50. The transparent electrode can be disposed on the lower end of the optical component 50. The transparent electrode can be shaped according to the shape of the optical component 50, and can be formed in any shape other than that.

[0119] Each of the transparent electrodes may include a transparent conductive material, thereby allowing current to flow without interfering with light transmission. The transparent electrode may include a material having high conductivity and a transmittance greater than or equal to a predetermined value. For example, the transparent electrode may include an indium tin oxide film, an indium zinc oxide film, or an oxide such as zinc oxide. Furthermore, the transparent electrode may include a metal (here, the metal includes at least one of Au, Ag, Al, Ti, and Cu) electrode, carbon nanotubes, silver nanowires, graphene, or a nanomesh in the form of a mesh pattern with a linewidth of less than 10 μm.

[0120] A transparent electrode can be electrically connected to a circuit board via a conductive unit. In this case, the capacitance of the transparent electrode can be detected using a self-capacitance measurement method. Under normal conditions, the transparent electrode may have a predetermined capacitance C1. Therefore, the transparent electrode in a normal state can be charged according to the predetermined capacitance C1. Thus, the voltage or current detected by the transparent electrode in a normal state can correspond to the predetermined capacitance C1. However, when the transparent electrode is damaged or separated from the conductive unit, the capacitance of the transparent electrode may change (e.g., capacitance C1 may become capacitance C2). Therefore, the voltage or current detected by the transparent electrode under abnormal conditions (fault conditions) such as damage or separation can correspond to the changed capacitance C2. By detecting the aforementioned changes in voltage or current, it is possible to check whether the optical component is in a normal state. According to an embodiment, based on a specific value, time change, or integral value change of the voltage or current detected by the transparent electrode, the output of the light source can be reduced, or the light source can be turned off.

[0121] Alternatively, the transparent electrode can be electrically connected to the circuit board via multiple conductive units. According to an embodiment, the transparent electrode can be electrically connected to the circuit board via a first conductive unit and a second conductive unit. Specifically, the transparent electrode may include a first transparent electrode pattern and a second transparent electrode pattern electrically separated (disconnected) from the first transparent electrode pattern. When the first conductive unit electrically connects the first transparent electrode pattern to the circuit board, and the second conductive unit electrically connects the second transparent electrode pattern to the circuit board, and a voltage or current is applied, a predetermined capacitance C2 is formed between the first and second transparent electrodes, and the predetermined capacitance C2 can be charged. In this case, the capacitance between the first and second transparent electrode patterns can be detected by mutual capacitance measurement. When at least one of the first and second transparent electrode patterns is damaged, or when at least one of the first and second transparent electrodes is separated from the first or second conductive unit, a capacitance change occurs (capacitance C1 becomes capacitance C2'), and a specific value, time change, or integral value change of the output voltage or current can be detected to determine whether the optical component is in a normal state. Furthermore, even when the first conductive unit electrically connects the first transparent electrode pattern of the transparent electrode to the circuit board, and the second conductive unit electrically connects the second transparent electrode pattern of the transparent electrode to the circuit board, the change in capacitance can be detected by self-capacitance.

[0122] Furthermore, multiple first transparent electrode patterns (first to nth patterns) and multiple second transparent electrode patterns (first to nth patterns) can be formed, as can multiple first conductive units (first to nth electrodes) and multiple second conductive units (first to nth electrodes), such that the first and second transparent electrode patterns can be electrically connected to the first and second conductive units, respectively. When a small crack appears in the optical component 50 and some areas of the transparent electrode are damaged, the capacitance of the corresponding area may change, limiting the output of the light source corresponding to that area, while the remaining parts can function normally.

[0123] Furthermore, a pattern of the transparent electrode can be electrically connected to the first conductive unit and the second conductive unit. Specifically, the plate (the first terminal of the plate), the first conductive unit, a pattern of the transparent electrode, the second conductive unit, and the plate (the second terminal of the plate) can be connected, and current can flow to the transparent electrode. When the transparent electrode is damaged or separated from at least one of the first or second conductive units, the optical component 50 can be checked for normal operation due to the detected change in current.

[0124] That is, since the transparent electrode and the circuit board are electrically connected, and changes in capacitance or current are checked, damage or malfunction of the optical component 50 can be detected, and the output of the light source can be controlled.

[0125] Light emitted by the light-emitting unit is scattered by optical components to protect the object. Directly emitting light from the light-emitting unit onto light-sensitive parts such as the eyes can be extremely dangerous. Therefore, detecting damage or malfunction of the light-emitting unit is crucial. In this invention, light output can be controlled by utilizing changes in the capacitance or current of the transparent electrode to detect damage or malfunction of the optical components, thus improving safety in use.

[0126] Cover 300 can be disposed on circuit board 4. Cover 300 can be disposed on housing 100. Cover 300 can be configured to surround housing 100. Cover 300 can house housing 100 therein. Cover 300 can form the exterior of camera module. Cover 300 can be a non-magnetic cover. Cover 300 can be formed of a metallic material. Cover 300 can be formed of a metal plate. Cover 300 can be electrically connected to the grounding portion of circuit board 4. Cover 300 can be electrically connected to a first terminal that serves as the grounding terminal of circuit board 4. Thus, cover 300 can be grounded. Cover 300 can block electromagnetic interference (EMI). In this case, cover 300 can be referred to as an "EMI shield". Cover 300 is the last component assembled and can protect the product from external impacts. Cover 300 can be formed of a thin and strong material.

[0127] The connection between the terminals formed on the circuit board 4 and the conductive unit 210 is fixed by the solder part 400. The connection between the terminals formed on the circuit board 4 and the cover 300 is fixed by the solder part 400.

[0128] In the following text, reference will be made to Figures 3 to 8 Describe the structure of the shell in detail.

[0129] Figure 3 This is a plan view showing the housing according to an embodiment of the present invention. Figure 4 This is a rear view showing the housing according to an embodiment of the present invention. Figure 5 This is a side view showing the housing according to an embodiment of the present invention. Figure 6 This is an enlarged perspective view showing one side of the housing according to an embodiment of the present invention. Figure 7 This is a cross-sectional view showing the housing according to an embodiment of the present invention. Figure 8 This is an enlarged plan view showing the stepped portion of the housing according to an embodiment of the present invention.

[0130] The housing 100 may have a hexahedral shape including a lower surface with an opening. The housing 100 may include an upper plate 101 and first to fifth side plates 106. The housing 100 may include an upper plate 101 with holes and first to fifth side plates 102 to 106 extending downward from the outer periphery or edge of the upper plate 101.

[0131] The upper plate 101 of the housing 100 may have a quadrilateral shape. A step may be formed at one edge of the quadrilateral upper plate 101 of the housing 100. The upper plate 101 of the housing 100 may include a first hole 110 and a second hole 120. The first hole 110 may have a quadrilateral shape, and the second hole 120 may have a circular shape, but the invention is not limited thereto. The width of the first hole 110 may be smaller than the width of the second hole 120, but is not limited thereto.

[0132] The first side plate 102 and the second side plate 103 can be disposed on one surface of the housing 100. Each of the second side plates 103 to the fifth side plate 106 can be disposed on one of different surfaces. The first side plate 102 and the second side plate 103 can be disposed on the side opposite to the fourth side plate 105. The third side plate 104 can be disposed on the side opposite to the fifth side plate 106. For example, the first side plate 102 and the second side plate 103 can be disposed on the first side surface of the housing 100. The third side plate 104 can be disposed on the second side surface of the housing 100. The fourth side plate 105 can be disposed on the third side surface of the housing 100. The fifth side plate 106 can be disposed on the fourth side surface of the housing 100.

[0133] The first side plate 102 may be disposed adjacent to the fifth side plate 106 and the second side plate 103. The first side plate 102 may extend laterally from the outer periphery or edge of the second side plate 103 and the fifth side plate 106. The second side plate 103 may be disposed adjacent to the first side plate 102 and the third side plate 104. The second side plate 103 may extend laterally from the outer periphery or edge of the first side plate 102 and the third side plate 104. A first groove with conductive units may be disposed on the outer surface of the second side plate 103. The third side plate 104 may be disposed adjacent to the second side plate 103 and the fourth side plate 105. The third side plate 104 may extend laterally from the outer periphery or edge of the second side plate 103 and the outer periphery or edge of the fourth side plate 105. The fourth side plate 105 may be disposed adjacent to the third side plate 104 and the fifth side plate 106. The fourth side plate 105 may extend laterally from the outer periphery or edge of the third side plate 104 and the fifth side plate 106. The fifth side plate 106 may be disposed adjacent to the fourth side plate 105 and the first side plate 102. The fifth side plate 106 may extend laterally from the outer periphery or edge of the fourth side plate 105 and the first side plate 102.

[0134] The lengths of the third side plate 104 and the fifth side plate 106 can be different from each other. The length of the fifth side plate 106 can be greater than the length of the third side plate 104. Therefore, a step can be formed between the first side plate 102 extending from the fifth side plate 106 and the second side plate 103 extending from the third side plate 104. Because a step is formed between the first side plate 102 and the second side plate 103, even when the housing 100 is attached to the circuit board, the terminals that are attached to the conductive units may be exposed to the outside of the housing 100.

[0135] The upper plate 101 of the housing 100 may include a stepped portion 130 formed adjacent to the first hole 110. The stepped portion 130 may be formed around the inner circumferential surface of the first hole 110. The stepped portion 130 may include a mounting surface. The mounting surface of the stepped portion 130 may be configured to form a step relative to the upper surface of the housing 100. The length from the bottom surface of the housing 100 to the upper surface may be greater than the length from the bottom surface of the housing 100 to the mounting surface. The mounting surface of the stepped portion 130 may include a first corner portion 131 to a fourth corner portion 134. The first corner portion 131 may be provided diagonally from the third corner portion 133. The second corner portion 132 may be provided diagonally from the fourth corner portion 134. The mounting surface of the stepped portion 130 may include a first mounting surface 135 to a fourth mounting surface 138 disposed between the first corner portion 131 and the fourth corner portion 134. The first mounting surface 135 may be disposed between the first corner portion 131 and the second corner portion 132. The second mounting surface 136 can be disposed between the second corner portion 132 and the third corner portion 133. The third mounting surface 137 can be disposed between the third corner portion 133 and the fourth corner portion 134. The fourth mounting surface 138 can be disposed between the fourth corner portion 134 and the first corner portion 131. The first mounting surface 135 can be disposed on the side opposite to the third mounting surface 137. The second mounting surface 136 can be disposed on the side opposite to the fourth mounting surface 138.

[0136] The housing 100 may include a first connecting surface 191 to a fourth connecting surface 194 connected to a first mounting surface 135 to a fourth mounting surface 138. The first connecting surface 191 may be adjacent to the first mounting surface 135. The first connecting surface 191 may extend from the edge of the first mounting surface 135. A second connecting surface 192 may be adjacent to the second mounting surface 136. The second connecting surface 192 may extend from the edge of the second mounting surface 136. A third connecting surface 193 may be adjacent to the third mounting surface 137. The third connecting surface 193 may extend from the edge of the third mounting surface 137. A fourth connecting surface 194 may be adjacent to the fourth mounting surface 138. The fourth connecting surface 194 may extend from the edge of the fourth mounting surface 138.

[0137] The housing may include a second groove 139. A second groove 139 may be included in at least one of the first to fourth mounting surfaces 138. The second groove 139 formed in at least one of the support surfaces 138 may extend to the first to fourth connecting surfaces 194. Multiple second grooves 139 may be provided. Referring to the drawings, as an example, three second grooves 139 may be formed in the second mounting surface 136. The three second grooves 139 may extend to a second connecting surface 192 extending from the second mounting surface 136. Gas inside the housing can be discharged to the outside through the second grooves 139. According to an embodiment, the optical component can be bonded to the step portion 130 by an adhesive. When the optical component is bonded by the adhesive, a portion of the adhesive may be evaporated due to heat and introduced into the housing. When a portion of the evaporated adhesive is not discharged to the outside of the housing, there may be a problem of light distortion output by the light source. However, in this invention, this problem can be solved because the evaporated adhesive can be discharged through the second grooves 139.

[0138] The housing 100 may include a first recess. The first recess may include a first region 140 and a second region 150.

[0139] A first region 140 of the first groove is disposed on the upper plate 101 of the housing 100. The first region 140 of the first groove extends to the side plate of the housing 100. The first region 140 of the first groove extends to the second side plate 103 of the housing 100. The first region 140 of the first groove connects to the first corner portion 131 of the mounting surface of the stepped portion 130. A bend may be formed in the upper plate 101 within the first region 140 of the first groove.

[0140] The second region 150 of the first groove is disposed on the upper plate 101 of the housing 100. The second region 150 of the first groove extends to the side plate of the housing 100. The second region 150 of the first groove extends to the second side plate 103 of the housing 100. The second region 150 of the first groove is connected to the second corner portion 132 of the mounting surface of the stepped portion 130.

[0141] A protrusion 145 may be disposed between a first region 140 and a second region 150 of the first groove. The protrusion 145 may be disposed on the upper surface of the housing. Therefore, the first region 140 and the second region 150 of the first groove can be spaced apart from each other by the protrusion 145. The protrusion 145 may extend from the upper surface of the housing to the side surface. Therefore, the first region 140 and the second region 150 of the first groove can be spaced apart from each other by the protrusion 145. The length of the portion of the protrusion 145 extending to the side surface of the housing may be less than the height of the side plate. Therefore, the first region 140 and the second region 150 of the first groove may be spaced apart from each other at the upper part of the side plate and may be connected to each other at the lower part of the side plate. According to this embodiment, the first region 140 and the second region 150 of the first groove may be spaced apart at the upper part of the second side plate 103 of the housing 100 and may be connected to each other at the lower part of the second side plate 103 of the housing 100. The protrusion 145 may protrude further than the conductive unit disposed on the housing.

[0142] The housing 100 may include a concave patterned portion 160 in the upper surface of the housing 100 that contacts the cover. The concave patterned portion 160 may be provided in the upper plate 101 of the housing 100. The concave groove may be formed in the upper plate 101 of the housing 100 according to a predetermined pattern. The patterned portion 160 is concave based on the uppermost surface of the housing, but may be convex based on the bottom surface of the concave groove. The concave grooves may be spaced apart from each other at predetermined intervals. The housing 100 and the cover may be joined by an adhesive. The adhesive may be applied to the upper surface of the housing 100, and the cover may be installed after the adhesive is applied. In this case, a portion of the adhesive may overflow during the cover installation process, resulting in a manufacturing defect. However, in this invention, the patterned portion 160 provided in the upper surface of the cover accommodates the adhesive overflowing during cover installation, thereby preventing defects during the manufacturing process of the camera module.

[0143] The housing 100 may include a third recess 170. The third recess 170 may be provided in the lower end of the second side plate 103 of the housing 100. The housing 100 and the plate may be joined by an adhesive. The adhesive may be applied to the lower ends of the first to fifth side plates 106 of the housing 100. After the adhesive is applied, when the housing 100 is placed on the plate, a portion of the adhesive may overflow. Since the second side plate 103 of the housing 100 is adjacent to the area of ​​the plate where the first to third terminals are provided, a portion of the overflowing adhesive may be applied to the first to third terminals of the plate. When the adhesive is applied to the first to third terminals, the camera module may be defective. However, since the third recess 170 is provided in the lower end of the second side plate 103, the overflowing adhesive can be contained in the third recess 170. Therefore, it is possible to prevent the overflowing adhesive from being introduced into the first to third terminals of the plate.

[0144] The housing 100 may include engagement protrusions. The housing 100 may include a first engagement protrusion 181 and a second engagement protrusion 182. The first engagement protrusion 181 and the second engagement protrusion 182 can be inserted into a first engagement hole and a second engagement hole formed in the plate. In this case, an example of two engagement protrusions is shown, but one or more engagement protrusions may be provided.

[0145] Below, we will refer to Figures 9 to 12 Describe in detail the way in which the housing, conductive unit, dummy electrode, and optical components are joined. Figure 9 This is a view showing the first conductive unit according to an embodiment of the present invention. Figure 10 This is a view showing the second conductive unit according to an embodiment of the present invention. Figure 11 This is a plan view showing a housing in which conductive units, dummy electrodes, and optical components are joined according to an embodiment of the present invention.

[0146] Figure 12 This is a side view showing a housing in which conductive units, dummy electrodes, and optical components are joined according to an embodiment of the present invention.

[0147] refer to Figure 9 The first conductive unit 211 may include a first portion 212 to a third portion 214. Furthermore, the second portion 213 of the first conductive unit 211 may include a first sub-portion 213-1 and a second sub-portion 213-2. Additionally, the first sub-portion 213-1 of the first conductive unit 211 may include a first component 213-11 and a second component 213-12.

[0148] like Figure 11 and Figure 12As shown, the first conductive unit 211 is disposed on the first corner of the step portion and in the first region 140 of the first groove of the housing.

[0149] The first part 212 of the first conductive unit 211 is disposed on the first corner of the step portion.

[0150] The shape of the first part 212 when viewed from above can be the same as the shape of the first corner when viewed from above.

[0151] The first part 212 connects to the second part 213. That is, the first part 212 can extend from the second part 213.

[0152] The second part 213 of the first conductive unit 211 is disposed along the first region 140 of the first groove.

[0153] Since the second portion 213 is disposed along the first region 140 of the first groove, a curved portion can be formed along the first region 140 of the first groove. Firstly, the first sub-part 213-1 of the first conductive unit 211 is disposed in the first region 140 of the first groove formed in the upper part of the housing, and the second sub-part 213-2 of the first conductive unit 211 is disposed in the first region 140 of the first groove formed in the side surface of the housing. Therefore, the first sub-part 213-1 and the second sub-part 213-2 can be bent towards each other and extend from each other. The first sub-part 213-1 and the second sub-part 213-2 can be bent and extended with a predetermined curvature. Furthermore, since the curved portion is formed in the first region 140 of the first groove formed in the upper part of the housing, the second sub-part 213-1 can be formed as a curve. In the second sub-part 213-1, the first component 213-11 and the second component 213-12 can be bent towards each other and connected to each other. In the accompanying drawings, the first component 213-11 and the second component 213-12 are perpendicular to each other in the longitudinal direction, but this is merely exemplary. The longitudinal directions of the first component 213-11 and the second component 213-12 can also form a predetermined angle other than 90 degrees. Since the stepped portion of the housing is formed at a position lower than the upper surface of the housing, an inclination can be formed in the first region 140 of the first groove extending from the first corner of the stepped portion. Therefore, the first component 213-11 can be formed to be curved along the corresponding inclined surface.

[0154] The width of the second portion 213 can be smaller than the width of the first region 140 of the first groove. Therefore, the second portion 213 can be spaced apart from the first region 140 of the first groove. The thickness of the second portion 213 can be smaller than the depth of the first region 140 of the first groove. Therefore, even when the cover is mounted on the housing, the second portion 213 can be spaced apart from the cover.

[0155] The second part 213 may be located between the first part 212 and the third part 214, and may be connected to the first part 212 and the third part 214. The second part 213 may extend from the first part 212 and the third part 214.

[0156] The third portion 214 of the first conductive unit 211 is disposed along the first region 140 of the first groove. The third portion 214 is disposed in the first region 140 of the first groove disposed in the side surface of the housing.

[0157] The width of the third portion 214 can be larger than the width of the second portion 213. Therefore, the stability of the electrical coupling between the terminals formed on the circuit board and the first conductive unit 211 can be improved. The thickness of the third portion can be smaller than the depth of the first region 140 of the first groove. Therefore, even when the cover is mounted on the housing, the third portion 214 can be spaced apart from the cover.

[0158] Part 3, 214, extends from Part 2, 213. Part 3, 214, extends from Sub-part 2, 213-2.

[0159] refer to Figure 10 The second conductive unit 215 may include a first portion 216 to a third portion 218. Furthermore, the second portion 217 of the second conductive unit 215 may include a first sub-portion 217-1 and a second sub-portion 217-2.

[0160] like Figure 11 and Figure 12 As shown, the second conductive unit 215 is disposed in the second corner of the stepped portion of the housing and in the second region 150 of the first groove.

[0161] The first part 216 of the second conductive unit 215 is disposed on the second corner of the stepped portion.

[0162] The shape of the first part 216 when viewed from above can be the same as the shape of the second corner when viewed from above.

[0163] The first part 216 connects to the second part 217. That is, the first part 216 can extend from the second part 217.

[0164] The second portion 217 of the second conductive unit 215 is disposed along the second region 150 of the first groove.

[0165] Since the second portion 217 is disposed along the second region 150 of the first groove, the bent portion can be formed along the second region 150 of the first groove. The first sub-portion 217-1 of the second conductive unit 215 is disposed in the second region 150 of the first groove formed in the upper part of the housing, and the second sub-portion 217-2 of the second conductive unit 215 is disposed in the second region 150 of the first groove formed in the side surface of the housing. Therefore, the first sub-portion 217-1 and the second sub-portion 217-2 can be bent towards each other and extend from each other. The first sub-portion 217-1 and the second sub-portion 217-2 can be bent and extended with a predetermined curvature. Since the stepped portion of the housing is formed at a position lower than the upper surface of the housing, an inclination can be formed in the second region 150 of the first groove extending from the second corner of the stepped portion. Therefore, the first sub-portion 217-1 can be formed to be bent along the corresponding inclined surface.

[0166] The width of the second portion 217 can be smaller than the width of the second region 150 of the first groove. Therefore, the second portion 217 can be spaced apart from the second region 150 of the first groove. The thickness of the second portion 217 can be smaller than the depth of the second region 150 of the first groove. Therefore, even when the cover is mounted on the housing, the second portion 217 can be spaced apart from the cover.

[0167] The second part 217 may be located between the first part 216 and the third part 218, and may be connected to the first part 216 and the third part 218. The second part 217 may extend from the first part 216 and the third part 218.

[0168] The third portion 218 of the second conductive unit 215 is disposed along the second region 150 of the first groove. The third portion 218 is disposed in the second region 150 of the first groove disposed in the side surface of the housing.

[0169] The width of the third portion 218 can be larger than the width of the second portion 217. Therefore, the stability of the electrical coupling between the terminals formed on the circuit board and the second conductive unit 215 can be improved. The thickness of the third portion can be smaller than the depth of the second region 150 of the first groove. Therefore, even when the cover is mounted on the housing, the third portion 218 can be spaced apart from the cover.

[0170] The third part 218 extends from the second part 217. The third part 218 extends from the second sub-part 217-2. The third part 218 may be curved and extends from the second part 217.

[0171] The first dummy electrode 221 is disposed on the third corner of the stepped portion, which is located diagonally from the first corner. The second dummy electrode 222 is disposed on the fourth corner of the stepped portion, which is located diagonally from the second corner. Furthermore, a transparent electrode is disposed above the first conductive unit 211, the second conductive unit 215, the first dummy electrode 221, and the second dummy electrode 222.

[0172] The thickness of the first dummy electrode 221 and the second dummy electrode 222 can be the same as the thickness of the first conductive unit 211 and the second conductive unit 215. The thickness of the first dummy electrode 221 and the second dummy electrode 222 can also be the same as the thickness of the first portion 212 of the first conductive unit 211 and the first portion 216 of the second conductive unit 215. Since the thicknesses of the first conductive unit 211, the second conductive unit 215, the first dummy electrode 221, and the second dummy electrode 222 are the same, the optical component 50 located thereon can remain balanced. In this case, the thickness can be the length in the direction perpendicular to the upper surface of the housing.

[0173] The transparent electrode can be bonded to the optical component 50 and is disposed above the first conductive unit 211, the second conductive unit 215, the first dummy electrode 221, and the fourth dummy electrode 222. The transparent electrode can be bonded to the optical component 50 and is disposed above the first mounting surface 135 to the fourth mounting surface 138 of the stepped portion.

[0174] In the following text, reference will be made to Figure 13 and Figure 14 A detailed description of the cover according to an embodiment of the present invention is provided. Figure 13 This is a plan view showing the cover according to an embodiment of the present invention. Figure 14 This is a side view showing the cover according to an embodiment of the present invention.

[0175] The cover 300 may have a hexahedral shape including a lower surface with an opening. The cover 300 may include an upper plate 310 and first to fifth side plates 325. The cover 300 may include an upper plate 310 having a hole and first to fifth side plates 321 to 325 extending downward from the outer periphery or edge of the upper plate 310.

[0176] The upper plate 310 may have a quadrilateral shape. A step may be formed at one edge of the quadrilateral upper plate 310. The upper plate 310 may include a first hole 331 and a second hole 332. The first hole 331 may have a quadrilateral shape, and the second hole 332 may have a circular shape, but the invention is not limited thereto. The width of the first hole 331 may be smaller than the width of the second hole 332, but the invention is not limited thereto.

[0177] The first side plate 321 and the second side plate 322 can be disposed on one surface of the cover 300. Each of the second side plates 322 to the fifth side plate 325 can be disposed on one of different surfaces. The first side plate 321 and the second side plate 322 can be disposed on the side opposite to the fourth side plate 324. The third side plate 323 can be disposed on the side opposite to the fifth side plate 325. For example, the first side plate 321 and the second side plate 322 can be disposed on the first side surface of the cover 300. The third side plate 323 can be disposed on the second side surface of the cover 300. The fourth side plate 324 can be disposed on the third side surface of the cover 300. The fifth side plate 325 can be disposed on the fourth side surface of the cover 300.

[0178] The first side panel 321 may be disposed adjacent to the fifth side panel 325 and the second side panel 322. The first side panel 321 may extend laterally from the outer periphery or edge of the second side panel 322 and the fifth side panel 325. The second side panel 322 may be disposed adjacent to the first side panel 321 and the third side panel 323. The second side panel 322 may extend laterally from the outer periphery or edge of the first side panel 321 and the third side panel 323. The third side panel 323 may be disposed adjacent to the second side panel 322 and the fourth side panel 324. The third side panel 323 may extend laterally from the outer periphery or edge of the second side panel 322 and the outer periphery or edge of the fourth side panel 324. The fourth side panel 324 may be disposed adjacent to the third side panel 323 and the fifth side panel 325. The fourth side panel 324 may extend laterally from the outer periphery or edge of the third side panel 323 and the fifth side panel 325. The fifth side panel 325 may be disposed adjacent to the fourth side panel 324 and the first side panel 321. The fifth side plate 325 can extend laterally from the outer periphery or edge of the fourth side plate 324 and the first side plate 321.

[0179] The first side plate 321 and the second side plate 322 can have different heights. The height h1 of the first side plate 321 can be greater than the height h2 of the second side plate 322. Therefore, the first side plate 321 can be spaced apart from the plate by a predetermined distance h3.

[0180] The width w1 of the third side plate 323 can be smaller than the width w2 of the fifth side plate 325. Therefore, in the plan view of the cover 300, a step with a predetermined width (width w2 - width w1) can be formed between the first side plate 321 and the second side plate 322. In the plan view of the cover 300, the cover 300 may include the step with a predetermined width (width w2 - width w1) and a recess in the second side plate 322. The recess of the cover 300 may be disposed adjacent to a corner of the circuit board 4. The recess of the cover 300 may correspond to the second side plate 322 and the protrusion 326, which will be described later. A single recess of the cover 300 may be provided as shown, or multiple recesses of the cover 300 may be provided. When a single recess of the cover 300 is provided, the bending portion of the cover 300 can be minimized in the plan view, thereby improving the manufacturability and physical reliability of the cover 300.

[0181] The cover 300 may include a protrusion 326 disposed on the lower end of the second side plate 322. The protrusion 326 extends from the region corresponding to the first terminal of the circuit board in the lower end of the second side plate 322. The height of the protrusion 326 may be the same as the value obtained by subtracting the height h2 of the first side plate 321 from the height h1 of the second side plate 322. Therefore, the protrusion 326 can contact the first terminal of the circuit board. The left and right sides of the protrusion 326 may be open. The width of the lower end of the protrusion 326, i.e., the width of the portion contacting the first terminal of the circuit board, may be smaller than the width of the first terminal of the circuit board.

[0182] Figure 15 This is an enlarged view showing one side of a camera module according to an embodiment of the present invention.

[0183] With the housing and cover 300 mounted on the circuit board 4, a first solder joint to a third solder joint 430 can be provided. A first solder joint 410 can be provided on the first terminal 41 of the circuit board 4 and the protrusion 326 of the cover 300. The first solder joint 410 maintains the connection between the first terminal 41 of the circuit board 4 and the protrusion 326 of the circuit board 4. A second solder joint 420 can be provided on the second terminal 42 of the circuit board 4 and the first conductive unit 211. The second solder joint 420 maintains the contact between the second terminal 42 of the circuit board 4 and the first conductive unit 211. A third solder joint 430 can be provided on the third terminal 43 of the circuit board 4 and the second conductive unit 215. The third solder joint 430 maintains the contact between the third terminal 43 of the circuit board 4 and the second conductive unit 215.

[0184] The first terminal 41 to the third terminal 43 can be disposed on one side of the circuit board 4. The first terminal 41 to the third terminal 43 can be disposed adjacent to any edge of the circuit board 4. For example, when the upper surface of the circuit board 4 has a quadrilateral shape, the first terminal 41 to the third terminal 43 can be disposed adjacent to any one of the two long sides and the two short sides. The first terminal 41 to the third terminal 43 can be disposed adjacent to any corner of the circuit board 4. For example, when the upper surface of the circuit board 4 has a quadrilateral shape, the first terminal 41 to the third terminal 43 can be disposed adjacent to any one of the four corners. The first terminal 41 to the third terminal 43 can be electrically spaced apart from each other. The first terminal 41 to the third terminal 43 can be structurally spaced apart from each other.

[0185] The first to third welding portions 430 can be provided on the circuit board 4 in a state where the housing is engaged with the circuit board 4. That is, the first to third welding portions 430 are provided on the outside of the housing. The cover 300 may include a groove through which a portion of the housing is exposed when the cover is engaged with the housing. The groove may be provided between the protrusion 326 and the first side plate 321. The groove may expose at least one of the first conductive unit and the second conductive unit provided on the housing. The advantage of this structure is that the process of connecting the conductive unit exposed through the groove to the terminal and the process of connecting the protrusion 326 of the cover 300 to the terminal of the circuit board 4 can be performed simultaneously.

[0186] According to an embodiment of the present invention, since the second side plate 322 of the cover is spaced apart from the upper end of the circuit board 4, the second welding portion 420 and the third welding portion 430 can be provided even after the housing and the cover 300 have been joined to the upper end of the circuit board 4. Because the first welding portion to the third welding portion 430 are provided in one process, it is advantageous that the manufacturing process can be simplified, and process time and process cost can be reduced. Furthermore, since protrusions or bends in the circuit board can be minimized, the processability of the circuit board can be improved, and durability can be maintained.

[0187] Although embodiments of the invention have been described in detail with reference to the accompanying drawings, those skilled in the art will recognize that the invention can be practiced in different specific forms without changing the technical field or essential characteristics. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A camera module comprising: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board; an optical member disposed above the light source and including an electrode; and a conductive unit disposed on the housing and electrically connecting the electrode of the optical member with the circuit board, wherein the camera module further comprises a cover disposed on the housing and spaced apart from the conductive unit, wherein the housing includes a first recess, and the conductive unit is disposed in the first recess.

2. The camera module of claim 1, wherein, The conductive unit includes: a first conductive unit; and a second conductive unit.

3. The camera module of claim 2, wherein, Each of the first conductive unit and the second conductive unit includes: a first portion disposed on the housing; a second portion extending from the first portion; and a third portion extending from the second portion and having a width greater than that of the second portion.

4. The camera module of claim 3, wherein, The second portion includes: a first sub-portion extending along an upper surface of the housing; and a second sub-portion connected to the first sub-portion and extending along a side surface of the housing.

5. The camera module of claim 4, wherein, The first sub-portion of the first conductive unit includes: a first piece; and a second piece bent and connected to the first piece.

6. The camera module of claim 5, wherein, The second portion of the second conductive unit is bent and extends from the third portion of the second conductive unit.

7. The camera module of claim 6, wherein, The first recess includes: a first area; and a second area, wherein the first conductive unit is disposed in the first area of the first recess, and the second conductive unit is disposed in the second area of the first recess.

8. The camera module of claim 7, wherein, A width of the first recess is greater than that of the conductive unit.

9. The camera module of claim 7, wherein, A depth of the first recess is greater than a thickness of the conductive unit.

10. The camera module of claim 7, wherein, The housing includes a protrusion further protruding than the conductive unit.

11. The camera module of claim 7, wherein, The housing includes: a first hole above the light source; and a stepped portion disposed at a periphery of the first hole, wherein the stepped portion includes a seating surface on which the optical member is disposed. 12.The camera module of claim 11, wherein: the first area of the first recess extends to a first corner portion of the seating surface; and the second area of the first recess extends to a second corner portion of the seating surface. 13.The camera module of claim 12, wherein: the first conductive unit is disposed to extend from the first recess to the first corner portion; and the second conductive unit is disposed to extend from the first recess to the first corner portion. 14.The camera module of claim 13, comprising a dummy electrode disposed between the optical member and the housing and spaced apart from the conductive unit.

15. The camera module of claim 14, wherein, The dummy electrode includes: a first dummy electrode; and a second dummy electrode, The first dummy electrode is disposed on a third corner portion of the seating surface, and The second dummy electrode is disposed on a fourth corner portion of the seating surface.

16. The camera module of claim 15, wherein, The first dummy electrode and the second dummy electrode have the same thickness as the first conductive unit and the second conductive unit.

17. The camera module according to claim 16, wherein: The seating surface includes first, second, third, and fourth seating surfaces disposed between the first, second, third, and fourth corner portions; and The housing includes first, second, third, and fourth connecting surfaces extending from the first, second, third, and fourth seating surfaces to an upper end surface, and a second recess disposed in at least one of the first, second, third, and fourth seating surfaces and extending to at least one of the first, second, third, and fourth connecting surfaces.

18. A camera module comprising: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board and including a first hole overlapping the light source; a cover disposed on the housing; an optical member disposed above the light source and disposed to overlap the first hole; and a connection electrode disposed to extend from the first hole to an outside of the housing, wherein the connection electrode is spaced apart from the cover, wherein the housing includes a first recess, and the connection electrode is disposed in the first recess. The housing includes a pattern portion having a concave shape in an upper end surface in contact with the cover.

19. The camera module of claim 18, wherein, The circuit board includes:

20. The camera module of claim 19, wherein, a first terminal connected to the cover; a second terminal connected to a first connection electrode of the connection electrode; and a third terminal connected to a second connection electrode of the connection electrode.

21. The camera module according to claim 20, wherein: The cover includes first and second side plates disposed on a first side surface; and a step is formed between the first and second side plates such that the cover does not overlap an upper portion of the first, second, and third terminals.

22. The camera module according to claim 21, wherein: a lower end portion of the first side plate is disposed in contact with the circuit board; and a lower end portion of the second side plate is disposed spaced apart from the circuit board. The cover includes a protruding portion extending from the lower end portion of the first side plate and in contact with the first terminal.

23. The camera module of claim 22, wherein, 24. The camera module according to claim 23, comprising: ​ a first solder portion that joins the protruding portion with the first terminal; a second solder portion that joins the first connection electrode with the second terminal; and a third solder portion that joins the second connection electrode with the third terminal.

25. The camera module according to claim 24, wherein: the cover includes a recess that is disposed adjacent to one of the corner portions of the circuit board in a plan view; and the first solder portion, the second solder portion, and the third solder portion are disposed in the recess.

26. A camera module comprising: a circuit board; a light source and an image sensor disposed on the circuit board; a housing disposed on the circuit board and including a first hole that overlaps the light source; an optical member disposed above the light source and disposed to overlap the first hole; a connection electrode that extends from the first hole to an outside of the housing; and a dummy electrode disposed at a periphery of the first hole, wherein at least a portion of the connection electrode and at least a portion of the dummy electrode are disposed between the optical member and the housing, wherein the camera module further includes a cover disposed on the housing and spaced apart from the connection electrode, wherein the housing includes a first recess, and the connection electrode is disposed in the first recess.

27. The camera module according to claim 26, wherein: the housing includes a stepped portion disposed on an inner peripheral surface of the first hole; a portion of the connection electrode is disposed on at least one of corner portions of the stepped portion; and the dummy electrode is disposed on at least one of the corner portions of the stepped portion that is not disposed with the portion of the connection electrode. a thickness of the dummy electrode is the same as a thickness of the connection electrode. ​ 28. The camera module of claim 27, wherein, ​

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