A moonlight-like spectral LED package structure and method

Abstract

This invention discloses a moonlight-spectrum LED packaging structure and method. The structure includes a bracket, a bowl, a first LED chip, a second LED chip, a third LED chip, a fourth LED chip, a fifth LED chip, a sixth LED chip, a seventh LED chip, and an eighth LED chip. The method includes steps one, fixing the chips; step two, connecting the circuits; step three, preparing the fluorescent adhesive solution; step four, dispensing the adhesive; and step five, parameter spectral dispersion. In step five, qualified products must meet the following conditions: chromaticity bandwidth controlled within a 3rd-order McAdam ellipse; light color quality satisfying Ra>93, R9>90, TM-30-18, Rg>100, Rf>95; color temperature satisfying 3800-4200K; chromaticity coordinates satisfying the 403 chromaticity standard; and moonlight spectrum SSI (spectral similarity index) coefficient>93%. Compared to existing LED lights, this invention is designed as a moonlight-spectrum LED. The light color quality of this LED is close to moonlight, and the emitted light has the soft beauty of moonlight, which can create a romantic atmosphere when used for auxiliary lighting.

Description

Technical Field

[0001] This invention relates to the field of LED technology, specifically to a moonlight-spectrum LED packaging structure and method. Background Technology

[0002] LED is a common type of lighting fixture. It consists of a P-layer formed by P-type semiconductors, an N-layer formed by N-type semiconductors, and an active layer in the middle composed of a double heterostructure. When selecting LED photography fill lights, it is necessary to consider the lighting quality of the LED, that is, whether the lighting source meets the requirements of visual function, visual comfort, safety, and visual aesthetics. Common photography fill lights can be roughly divided into warm-colored lights and cool-colored lights. However, in the current technology, there is a lack of moonlight-like LED lights, which cannot meet the needs of users. Summary of the Invention

[0003] The purpose of this invention is to provide a moonlight spectrum LED packaging structure and method to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a moonlight spectrum LED packaging structure, including a bracket, a first pin fixedly connected to one outer wall of the bracket, a second pin fixedly connected to the other outer wall, a cup opened inside the bracket, and a first LED chip, a second LED chip, a third LED chip, a fourth LED chip, a fifth LED chip, a sixth LED chip, a seventh LED chip, and an eighth LED chip fixedly connected inside the cup.

[0005] Preferably, the first LED chip, the second LED chip, the third LED chip, the fourth LED chip, the fifth LED chip, the sixth LED chip, the seventh LED chip, and the eighth LED chip are connected in series, and the first LED chip is electrically connected to the first pin, and the eighth LED chip is electrically connected to the second pin.

[0006] Preferably, the first pin is the positive pin and the second pin is the negative pin.

[0007] Preferably, the specifications of the first LED chip are: 455-460nm, 240-250mw, 2.9-3.0V; the specifications of the second LED chip are: 380-385nm, 30-40mw, 3.2-3.3V; the specifications of the third LED chip are: 95-400nm, 250-270mw, 3.4-3.5V; and the specifications of the fourth LED chip are: 4-410-415nm, 20-25mw, 3.0-3.1V. The specifications of the fifth LED chip are: 420-425nm, 150-170mw, 3.2-3.3V; the specifications of the sixth LED chip are: 440-445nm, 204-210mw, 3.0-3.2V; the specifications of the seventh LED chip are: 450-455nm, 240-250mw, 2.9-3.0V; and the specifications of the eighth LED chip are: 475-480nm, 160-170mw, 1.7-2.08V.

[0008] A packaging method for a moonlight spectrum LED packaging structure includes the following steps: Step 1, chip fixing; Step 2, circuit connection; Step 3, preparation of phosphor adhesive solution; Step 4, dispensing; and Step 5, parameter spectral dispersion.

[0009] In step one above, a die bonder is first used to fix eight LED chips in the bracket cup according to the drawings using insulating glue or silver glue. After die bonding is completed, an oven is used to bake the LED chips so that they are completely fixed on the bracket.

[0010] In step two above, the first pin and the second pin are connected by wire bonding technology using a gold wire bonding machine, so that the eight LED chips are connected in series.

[0011] In step three above, a 4000K fluorescent adhesive solution is prepared. The formula of the fluorescent adhesive solution is: adhesive, blue powder with an emission wavelength of 465-485nm, green powder with an emission wavelength of 520-535nm, and red powder with an emission wavelength of 635-665nm.

[0012] In step four above, the fluorescent adhesive solution prepared in step three above is poured into the glue tank of the dispensing machine. After the glue and bubbles are removed, the fluorescent adhesive solution is dispensed into the cup according to the color parameters. After dispensing, it is baked at 80℃ / 0.5H+160℃ / 4H.

[0013] In step five above, the LED products after dispensing and baking in step four are de-granulated to obtain finished LED products. Finally, a spectrophotometer is used to perform spectral analysis according to the given color parameters, and qualified products are packaged and stored.

[0014] Preferably, in step one, the oven baking temperature is 150-160℃ and the baking time is 2h±10min.

[0015] Preferably, in step three, the fluorescent adhesive solution is prepared by mixing adhesive: 480nm blue powder: 525nm green powder: 660nm fluorescent powder in a ratio of approximately 3:0.5:1.2:0.08.

[0016] Preferably, in step five, qualified products must meet the following conditions: the chromaticity capacity is controlled within the third-order McAdam ellipse, the light color quality meets Ra>93, R9>90, TM-30-18, Rg>100, Rf>95, the color temperature meets 3800-4200K, the chromaticity coordinates meet the 403 chromaticity standard, and the moonlight spectrum SSI (spectral similarity) coefficient >93%.

[0017] Compared with the prior art, the beneficial effects of the present invention are: compared with the existing LED lights, the present invention is designed as a moonlight spectrum LED, the light color quality of which is close to that of moonlight, and the emitted light has the soft beauty of moonlight, which can create a romantic atmosphere when used for auxiliary lighting. Attached Figure Description

[0018] Figure 1 This is a front sectional view of the overall structure of the present invention;

[0019] Figure 2 This is a bin diagram showing the chromaticity distribution of the finished LED product of this invention.

[0020] Figure 3 This is a spectral curve of the finished LED product of the present invention;

[0021] Figure 4 This is a graph showing the similarity between the product of this invention and the SSI spectrum of moonlight.

[0022] Figure 5 This is a graph showing the mixed spectrum test data of the product of this invention;

[0023] Figure 6 This is a flowchart of the method of the present invention;

[0024] In the diagram: 1. Support; 2. Bowl / cup; 3. First pin; 4. Second pin; 5. First LED chip; 6. Second LED chip; 7. Third LED chip; 8. Fourth LED chip; 9. Fifth LED chip; 10. Sixth LED chip; 11. Seventh LED chip; 12. Eighth LED chip. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figure 1 This invention provides an embodiment of a moonlight-spectrum LED packaging structure, comprising a support 1. A first pin 3 is fixedly connected to one outer wall of the support 1, and a second pin 4 is fixedly connected to the other outer wall. A bowl-shaped cavity 2 is formed inside the support 1, and a first LED chip 5, a second LED chip 6, a third LED chip 7, a fourth LED chip 8, a fifth LED chip 9, a sixth LED chip 10, a seventh LED chip 11, and an eighth LED chip 12 are fixedly connected inside the bowl-shaped cavity 2. The first LED chip 5, the second LED chip 6, the third LED chip 7, the fourth LED chip 8, the fifth LED chip 9, the sixth LED chip 10, the seventh LED chip 11, and the eighth LED chip 12 are connected in series, with the first LED chip 5 electrically connected to the first pin 3 and the eighth LED chip 12 electrically connected to the second pin 4. The first pin 3 is the positive electrode pin, and the second pin 4 is the negative electrode pin. The specifications of the first LED chip 5 are 455-46. The specifications of the first LED chip are: 0nm, 240-250mw, 2.9-3.0V; the specifications of the second LED chip 6 are: 380-385nm, 30-40mw, 3.2-3.3V; the specifications of the third LED chip 7 are: 95-400nm, 250-270mw, 3.4-3.5V; the specifications of the fourth LED chip 8 are: 4-410-415nm, 20-25mw, 3.0-3.1V; the specifications of the fifth LED chip 9 ... third LED chip 7 are: 95-400nm, 250-270mw, 3.4-3.5V; the specifications of the fourth LED chip 8 are: 4-410-415nm, 20-25mw, 3.0-3.1V; the specifications of the fifth LED chip 9 are: 0nm, 240-250mw, 2.9-3.0V; the specifications of the fifth LED chip 9 are: 0nm, 2.9-3.0V; the specifications of the second LED chip 6 are: 380 The specifications for the sixth LED chip 10 are: 420-425nm, 150-170mw, 3.2-3.3V; the specifications for the seventh LED chip 11 are: 450-455nm, 240-250mw, 2.9-3.0V; and the specifications for the eighth LED chip 12 are: 475-480nm, 160-170mw, 1.7-2.08V.

[0027] Please see Figure 2-6 Table 1 shows an embodiment of the present invention: a packaging method for a moonlight spectrum LED packaging structure, comprising: step one, chip fixing; step two, circuit connection; step three, preparation of phosphor adhesive solution; step four, dispensing; and step five, parameter spectral dispersion.

[0028] In step one above, a die bonder is first used to fix eight LED chips in the bracket cup 2 according to the drawing using insulating glue or silver glue. After die bonding is completed, the LED chips are baked in an oven at 150-160℃ for 2 hours ± 10 minutes to completely fix the LED chips on the bracket 1.

[0029] In step two above, the first pin 3 and the second pin 4 are connected by wire bonding technology using a gold wire bonding machine, so that the eight LED chips are connected in series.

[0030] In step three above, a 4000K fluorescent adhesive solution is prepared by mixing 480nm blue powder: 525nm green powder: 660nm phosphor in a ratio of approximately 3:0.5:1.2:0.08.

[0031] In step four above, the fluorescent adhesive solution prepared in step three above is poured into the glue tank of the dispensing machine. After the glue and bubbles are removed, the fluorescent adhesive solution is dispensed into cup 2 according to the color parameters. After dispensing, it is baked at 80℃ / 0.5H+160℃ / 4H.

[0032] In step five above, the LED products after dispensing and baking in step four are de-granulated to obtain finished LED products. Finally, a spectrophotometer is used to perform spectral analysis according to the given color parameters. Qualified products are packaged and stored. Qualified products must meet the following conditions: chromaticity capacity is controlled within the 3rd order McAdam ellipse; light color quality meets Ra>93, R9>90, TM-30-18, Rg>100, Rf>95; color temperature meets 3800-4200K; chromaticity coordinates meet the 403 chromaticity standard; and moonlight spectrum SSI (spectral similarity) coefficient>93%.

[0033]

[0034] Table 1. Parameters of ANSI-C78.377-2015 Standard Ellipse

[0035] Based on the above, the advantages of this invention are that it uses eight LED chips with different specifications and parameters connected in series, and by coating the LED chips with a special fluorescent adhesive, it improves the light color quality performance of the finished LED light, making the SSI coefficient of the moonlight spectrum of the finished LED light >93%, thereby producing a moonlight-like LED photography fill light. This fill light can create a romantic moonlight atmosphere and greatly satisfy the needs of users.

[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A moonlight-spectrum LED packaging structure, comprising a support (1), characterized in that: The bracket (1) has a first pin (3) fixedly connected to one side of its outer wall and a second pin (4) fixedly connected to the other side of its outer wall. The bracket (1) has a bowl (2) inside, and the bowl (2) has a first LED chip (5), a second LED chip (6), a third LED chip (7), a fourth LED chip (8), a fifth LED chip (9), a sixth LED chip (10), a seventh LED chip (11), and an eighth LED chip (12) fixedly connected inside. The specifications of the first LED chip (5) are: 455-460nm, 240-250mw, 2.9-3.0V; the specifications of the second LED chip (6) are: 380-385nm, 30-40mw, 3.2-3.3V; the specifications of the third LED chip (7) are: 395-400nm, 250-270mw, 3.4-3.5V; the specifications of the fourth LED chip (8) are: 410-415nm, 20-25mw, 3.0-3.1V; the specifications of the fifth LED chip (6) are: 495-400nm, 250-270mw, 3.4-3.5V; the specifications of the fifth LED chip (8) are: 410-415nm, 20-25mw, 3.0-3.1V; The specifications of the ED chip (9) are: 420-425nm, 150-170mw, 3.2-3.3V; the specifications of the sixth LED chip (10) are: 440-445nm, 204-210mw, 3.0-3.2V; the specifications of the seventh LED chip (11) are: 450-455nm, 240-250mw, 2.9-3.0V; the specifications of the eighth LED chip (12) are: 475-480nm, 160-170mw, 1.7-2.08V; The bowl (2) contains a 4000K fluorescent adhesive solution. The formula of the fluorescent adhesive solution is: glue, blue powder with an emission wavelength of 465-485nm, green powder with an emission wavelength of 520-535nm, and red powder with an emission wavelength of 635-665nm. The finished product of the moonlight-like spectrum LED packaging structure meets the following conditions: the chromaticity capacity is controlled within the 3rd order McAdam ellipse, the light color quality meets Ra>93, R9>90, TM-30-18, Rg>100, Rf>95, the color temperature meets 3800-4200K, the chromaticity coordinates meet the 403 chromaticity standard, and the moonlight spectrum SSI (spectral similarity) coefficient is >93%.

2. The moonlight-spectrum LED packaging structure according to claim 1, characterized in that: The first LED chip (5), the second LED chip (6), the third LED chip (7), the fourth LED chip (8), the fifth LED chip (9), the sixth LED chip (10), the seventh LED chip (11), and the eighth LED chip (12) are connected in series, and the first LED chip (5) is electrically connected to the first pin (3), and the eighth LED chip (12) is electrically connected to the second pin (4).

3. The moonlight-spectrum LED packaging structure according to claim 2, characterized in that: The first pin (3) is the positive pin, and the second pin (4) is the negative pin.

4. A packaging method for a moonlight-spectrum LED packaging structure, comprising: step one, chip fixing; step two, circuit connection; step three, preparation of phosphor adhesive solution; step four, dispensing; and step five, parameter spectral dispersion; characterized in that: In step one above, a die bonder is first used to fix eight LED chips in the bracket cup (2) according to the drawings using insulating glue or silver glue. After die bonding, an oven is used to bake the LED chips so that they are completely fixed on the bracket (1). The eight LED chips include the first LED chip (5), the second LED chip (6), the third LED chip (7), the fourth LED chip (8), the fifth LED chip (9), the sixth LED chip (10), the seventh LED chip (11), and the eighth LED chip (12). The specifications of the first LED chip (5) are: 455-460nm, 240-250mw, 2.9-3.0V; the specifications of the second LED chip (6) are: 380-385nm, 30-40mw, 3.2-3.3V; the specifications of the third LED chip (7) are: 395-400nm, 250-270mw, 3.4-3.5V; the specifications of the fourth LED chip (8) are: 410-415nm, 20-25mw, 3.0-3.1V; the specifications of the fifth LED chip (6) are: 495-400nm, 250-270mw, 3.4-3.5V; the specifications of the fifth LED chip (8) are: 410-415nm, 20-25mw, 3.0-3.1V; The specifications of the ED chip (9) are: 420-425nm, 150-170mw, 3.2-3.3V; the specifications of the sixth LED chip (10) are: 440-445nm, 204-210mw, 3.0-3.2V; the specifications of the seventh LED chip (11) are: 450-455nm, 240-250mw, 2.9-3.0V; the specifications of the eighth LED chip (12) are: 475-480nm, 160-170mw, 1.7-2.08V; In step two above, the first pin (3) and the second pin (4) are connected to the first LED chip (5) and the eighth LED chip (12) respectively by using a gold wire bonding machine and wire bonding technology, so that the eight LED chips are connected in series. In step three above, a 4000K fluorescent adhesive solution is prepared. The formula of the fluorescent adhesive solution is: adhesive, blue powder with an emission wavelength of 465-485nm, green powder with an emission wavelength of 520-535nm, and red powder with an emission wavelength of 635-665nm. In step four above, the fluorescent adhesive solution prepared in step three above is poured into the glue bucket of the dispensing machine. After the glue and bubbles are removed, the fluorescent adhesive solution is dispensed into the bowl (2) according to the color parameter requirements. After dispensing, it is baked at 80℃ / 0.5H+160℃ / 4H. In step five above, the LED products after dispensing and baking in step four are de-granulated to obtain finished LED products. Finally, a spectrophotometer is used to perform spectrophotometry according to the given color parameters, and qualified products are packaged and stored. Qualified LED finished products must meet the following conditions: chromaticity capacity is controlled within the 3rd order McAdam ellipse; light color quality meets Ra>93, R9>90, TM-30-18, Rg>100, Rf>95; color temperature meets 3800-4200K; chromaticity coordinates meet the 403 chromaticity standard; and moonlight spectrum SSI (spectral similarity) coefficient>93%.

5. The packaging method for a moonlight spectrum LED packaging structure according to claim 4, characterized in that: In step one, the oven baking temperature is 150-160℃ and the baking time is 2h±10min.

6. The packaging method for a moonlight spectrum LED packaging structure according to claim 4, characterized in that: In step three, the fluorescent adhesive solution is prepared by mixing adhesive, 480nm blue powder, 525nm green powder, and 660nm fluorescent powder in a ratio of approximately 3:0.5:1.2:0.08.

Images