Display panel and display device

Abstract

The present invention discloses a display panel and a display device, which relates to the field of display technology. The display panel includes: an opening area, a first non-display area surrounding the opening area, and a display area surrounding the first non-display area; the display panel also includes a substrate, a circuit layer and a light-emitting layer, the light-emitting layer is located on the side of the circuit layer away from the substrate, and the circuit layer includes a plurality of inorganic layers; the first non-display area includes at least one blocking portion and at least one groove, along a direction perpendicular to the plane where the substrate substrate is located, the groove penetrates the inorganic layer in the circuit layer to form a blocking portion, and a metal portion is provided on the side of the blocking portion away from the substrate; the light-emitting layer is disconnected at the groove; the circuit layer also includes a plurality of transistors, the transistor includes an active layer, a gate, a source and a drain, and the metal portion is arranged on the same layer as the gate. The present invention is conducive to reducing process steps and reducing production costs.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly, to a display panel and a display device. Background Art

[0002] At present, display technology has penetrated into every aspect of people's daily life, and accordingly, more and more materials and technologies are used in display screens. In order to better and more fully utilize the space of the display panel, the screen-to-body ratio is getting higher and higher, that is, the proportion of the display area to the display panel area is getting larger and larger. When the display area is large, it will occupy the space of the front camera, etc., so an opening area is set in the display area of ​​the display panel to set components such as the front camera.

[0003] However, the opening area may cause water and oxygen from the outside to easily enter the display area through the opening area, resulting in poor display. Therefore, a barrier is usually set in the frame between the opening area and the display area. The barrier will increase the process and increase the production cost. Summary of the invention

[0004] In view of this, the present invention provides a display panel and a display device, which are beneficial to reducing process steps and production costs.

[0005] The present invention provides a display panel, comprising: an opening area, a first non-display area surrounding the opening area, and a display area surrounding the first non-display area; the display panel also comprises a base substrate, a circuit layer and a light-emitting layer, the light-emitting layer is located on a side of the circuit layer away from the base substrate, and the circuit layer comprises a plurality of inorganic layers; the first non-display area comprises at least one blocking portion and at least one groove, along a direction perpendicular to the plane where the base substrate is located, the groove penetrates the inorganic layer in the circuit layer to form a blocking portion, and a metal portion is provided on a side of the blocking portion away from the base substrate; the light-emitting layer is disconnected at the groove; the circuit layer also comprises a plurality of transistors, the transistor comprises an active layer, a gate, a source and a drain, and the metal portion is arranged on the same layer as the gate.

[0006] Based on the same idea, the present invention further provides a display device, including the display panel provided by the present invention.

[0007] Compared with the prior art, the display panel and display device provided by the present invention achieve at least the following beneficial effects:

[0008] In the display panel provided by the present invention, a blocking portion and a groove are provided in the first non-display area. In the direction perpendicular to the plane where the substrate is located, the groove penetrates the inorganic layer in the circuit layer to form a blocking portion. There is a step difference between the part of the light-emitting layer in the groove and the part in the blocking portion, so that the light-emitting layer is disconnected at the groove, so that the part of the light-emitting layer in the first non-display area and the part of the light-emitting layer in the display area are disconnected from each other, and the water oxygen invasion path is disconnected. Even if the part of the light-emitting layer in the first non-display area is corroded by water oxygen, water oxygen cannot be transmitted to the display area through the light-emitting layer. In the present invention, the inorganic layer in the circuit layer is reused to form the blocking portion by the groove penetrating the inorganic layer in the circuit layer, and no additional material is required to form the blocking portion, which is conducive to reducing the process and reducing the production cost. And a metal part is provided on the side of the barrier away from the substrate, and the metal part and the gate in the transistor are arranged in the same layer, that is, the metal part and the gate in the transistor can be made of the same material in the same process, and the metal part can be used as a blocking groove to form the blocking part, and there is no need to set up a photoresist etching groove to form the blocking part, which is conducive to reducing the process and reducing the production cost.

[0009] Of course, any product implementing the present invention does not necessarily need to achieve all of the above-mentioned technical effects at the same time.

[0010] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0012] Figure 1 is a plan view of a display panel provided by the present invention;

[0013] Figure 2 yes Figure 1 A cross-sectional view of the display panel along line AA';

[0014] Figure 3 yes Figure 1 Another cross-sectional view of the display panel along line AA';

[0015] Figure 4 yes Figure 1 Another cross-sectional view of the display panel along line AA';

[0016] Figure 5 This is a schematic diagram of a manufacturing process of a display panel provided by the present invention;

[0017] Figure 6 is another schematic diagram of a manufacturing process of a display panel provided by the present invention;

[0018] Figure 7 and Figure 8 is another schematic diagram of a manufacturing process of a display panel provided by the present invention;

[0019] Fig. 9 It is a plan schematic diagram of a display device provided by the present invention. DETAILED DESCRIPTION

[0020] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0021] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0022] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0023] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0024] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0025] Figure 1 is a plan view of a display panel provided by the present invention, Figure 2 yes Figure 1 A cross-sectional view of the display panel along line AA', see Figure 1 and Figure 2 This embodiment provides a display panel, which includes an opening area FA, a first non-display area NA1 surrounding the opening area FA, and a display area AA surrounding the first non-display area NA1. The opening area FA refers to the area where the display panel has a film layer that is dug out to improve the light transmittance of the opening area FA, so that the opening area FA can be set as a storage space for modules such as cameras and sensors in the display device. It should be noted that Figure 2 exemplarily shows that in the opening area FA, all the film layers of the display panel are dug out. Of course, in other embodiments of the present invention, the opening area FA may also retain some film layers, such as retaining a film layer with a higher light transmittance. Optionally, the display panel further includes a second non-display area NA2 surrounding the display area AA.

[0026] The display panel further includes a base substrate 10, a circuit layer 20 and a light emitting layer 30, wherein the circuit layer 20 is located on one side of the base substrate 10, and the light emitting layer 30 is located on a side of the circuit layer 20 away from the base substrate 10, and the circuit layer 20 includes a plurality of inorganic layers 21. The base substrate 10 may be the base of the entire display panel, and illustratively, the base substrate 10 may include a polyimide material layer, an inorganic material layer and a polyimide material layer stacked in sequence.

[0027] The first non-display area NA1 includes at least one blocking portion 40 and at least one groove 50. Along a direction perpendicular to the plane where the base substrate 10 is located, the groove 50 penetrates the inorganic layer 21 in the circuit layer 20 to form the blocking portion 40. A metal portion 41 is provided on the side of the blocking portion 40 away from the base substrate 10.

[0028] The light emitting layer 30 is disconnected at the groove 50 .

[0029] The circuit layer 30 further includes a plurality of transistors T. The transistor T includes an active layer T01 , a gate T02 , a source T03 , and a drain T04 . The metal portion 41 is disposed in the same layer as the gate T02 .

[0030] Specifically, the light-emitting layer 30 includes an organic layer, and water oxygen can extend along the light-emitting layer 30 to invade the interior of the display panel, affecting the stability of the display panel. In the present application, a blocking portion 40 and a groove 50 are provided in the first non-display area NA1. In a direction perpendicular to the plane where the base substrate 10 is located, the groove 50 penetrates the inorganic layer 21 in the circuit layer 20 to form the blocking portion 40. There is a step difference between the portion of the light-emitting layer 30 in the groove 50 and the portion in the blocking portion 40, so that the light-emitting layer 30 is disconnected at the groove 50, so that the portion of the light-emitting layer 30 in the first non-display area NA1 and the portion of the light-emitting layer 30 in the display area AA are disconnected from each other, and the water oxygen invasion path is disconnected. Even if the portion of the light-emitting layer 30 in the first non-display area NA1 is corroded by water oxygen, the water oxygen cannot be transmitted to the display area AA through the light-emitting layer 30.

[0031] In the present application, the inorganic layer 21 in the circuit layer 20 is penetrated by the groove 50 to form the blocking portion 40, that is, the inorganic layer 21 in the circuit layer 20 can be reused to form the blocking portion 40, and no additional material is needed to form the blocking portion 40, which is conducive to reducing the process and production costs. A metal portion 41 is provided on the side of the blocking portion 40 away from the base substrate 10, and the metal portion 41 and the gate T02 in the transistor T are arranged in the same layer, that is, the metal portion 41 and the gate T02 in the transistor T can be made of the same material in the same process, and the metal portion 41 can be used as a blocking groove 50 to form the blocking portion 40, and there is no need to set up a photoresist etching groove 50 to form the blocking portion 40, which is conducive to reducing the process and production costs.

[0032] Optional, continue to refer to Figure 2 , the transistor T is a top-gate structure transistor, in which the gate T02 is located on a side of the active layer T01 away from the substrate 10. In other embodiments of the present invention, refer to Figure 3 , Figure 3 yes Figure 1 In another cross-sectional view of the display panel along line AA′, the transistor T may also be a bottom-gate transistor. In the transistor T, the active layer T01 is located on a side of the gate electrode T02 away from the base substrate 10 .

[0033] Figure 4 yes Figure 1 Another cross-sectional view of the display panel along line AA', see Figure 1 and Figure 4 In some optional embodiments, the transistor T includes a first transistor T1 and a second transistor T2, the first transistor T1 includes a first active layer T011, a first gate T021, a first source T031 and a first drain T041, and the second transistor T2 includes a second active layer T012, a second gate T022, a second source T032 and a second drain T042.

[0034] The first gate T021 is located at a side of the second gate T022 away from the base substrate 10 .

[0035] The metal portion 41 is disposed on the same layer as the first gate T021 .

[0036] Specifically, in the display panel provided in the present application, the transistor T includes a first transistor T1 and a second transistor T2, the first gate T021 in the first transistor T1 and the second gate T022 in the second transistor T2 are located in different film layers, and the first gate T021 in the first transistor T1 is located on the side of the second gate T022 in the second transistor T2 away from the base substrate 10, that is, along the direction perpendicular to the plane where the base substrate 10 is located, the distance between the first gate T021 in the first transistor T1 and the base substrate 10 is greater than the distance between the second gate T022 in the second transistor T2 and the base substrate 10. The metal portion 41 is arranged on the same layer as the first gate T021. The metal portion 41 and the first gate T021 in the first transistor T1 can be made of the same material in the same process. The metal portion 41 can be used as a barrier to etch the groove 50 to form the blocking portion 40. Since the distance between the first gate T021 in the first transistor T1 and the substrate 10 is greater than the distance between the second gate T022 in the second transistor T2 and the substrate 10 in the direction perpendicular to the plane where the substrate 10 is located, it is beneficial to increase the height of the blocking portion 40 in the direction perpendicular to the plane where the substrate 10 is located, and it is beneficial to increase the step difference between the part of the light-emitting layer 30 in the groove 50 and the part in the blocking portion 40, which is beneficial to disconnect the light-emitting layer 30 at the groove 50, thereby disconnecting the water and oxygen intrusion path. Even if the part of the light-emitting layer 30 in the first non-display area NA1 is corroded by water and oxygen, the water and oxygen cannot be transmitted to the display area AA through the light-emitting layer 30.

[0037] It should be noted that Figure 3 It is exemplarily shown that the first transistor T1 and the second transistor T2 are both located in the display area AA, and the first transistor T1 and the second transistor T2 are arranged adjacent to each other. This is to clearly illustrate the technical features of the first transistor T1 and the second transistor T2. The first transistor T1 and the second transistor T2 are drawn together for illustration, which does not represent the actual setting position of the first transistor T1 and the second transistor T2 in the display panel. In specific implementation, the setting position and connection relationship of the first transistor T1 and the second transistor T2 are set according to actual production requirements, and the present invention will not be repeated here.

[0038] Figure 5 is a schematic diagram of a manufacturing process of a display panel provided by the present invention, referring to Figure 1 , Figure 4 and Figure 5 The metal portion 41 and the first gate T021 in the first transistor T1 may be made of the same material and in the same process.

[0039] Continue to refer Figure 1 and Figure 4In some optional embodiments, the first active layer T011 includes an oxide semiconductor, and the second active layer T012 includes silicon. That is, the first transistor T1 is an oxide semiconductor transistor, and the oxide semiconductor material is such as amorphous indium gallium zinc oxide, i.e., IGZO (Indium Gallium Zinc Oxide). The second transistor T2 is a silicon transistor, and silicon can be polycrystalline silicon deposited using a low-temperature method, i.e., LTPS (Low Temperature Poly-silicon) or low-temperature polycrystalline silicon. Since the materials of the first active layer T011 and the second active layer T012 are different, the first active layer T011 in the first transistor T1 and the second active layer T012 in the second transistor T2 are located in different film layers, and accordingly, the first gate T021 in the first transistor T1 and the second gate T022 in the second transistor T2 are also located in different film layers.

[0040] Continue to refer Figure 1 and Figure 4 In some optional embodiments, the first active layer T011 includes silicon, and the second active layer T012 includes an oxide semiconductor. That is, the first transistor T1 is a silicon transistor, and the silicon can be polycrystalline silicon deposited using a low-temperature method, namely LTPS or low-temperature polycrystalline silicon. The second transistor T2 is an oxide semiconductor transistor, and the oxide semiconductor material is such as amorphous indium gallium zinc oxide, namely IGZO. Since the materials of the first active layer T011 and the second active layer T012 are different, the first active layer T011 in the first transistor T1 and the second active layer T012 in the second transistor T2 are located in different film layers, and accordingly, the first gate T021 in the first transistor T1 and the second gate T022 in the second transistor T2 are also located in different film layers.

[0041] Figure 6 is another schematic diagram of the manufacturing process of the display panel provided by the present invention, referring to Figure 1 , Figure 4 and Figure 6 In some optional embodiments, the circuit layer 20 includes a first metal layer 22, a second metal layer 23 and a third metal layer 24 which are insulated from each other, the second metal layer 23 is located on a side of the first metal layer 22 away from the substrate 10, and the third metal layer 24 is located on a side of the second metal layer 23 away from the substrate 10.

[0042] The second gate T022 is located in the first metal layer 22 , the second source T032 and the second drain T042 are located in the third metal layer 24 , and the second source T032 and the second drain T042 are electrically connected to the second active layer T012 through the first through hole 61 .

[0043] The first gate T021 is located in the second metal layer 23 , the first source T031 and the first drain T041 are located in the third metal layer 24 , and the first source T031 and the first drain T041 are electrically connected to the first active layer T011 through the second through hole 62 .

[0044] The groove 50 can be made by the same mask process as the first through hole 61. Specifically, since the metal part 41 is provided in the first non-display area NA1, when the first through hole 61 is formed by the existing mask plate, the inorganic layers 21 between the metal part 41 and the base substrate 10 will not be etched away due to the blocking of the metal part 41, so that the blocking part 40 and the groove 50 are formed in the first non-display area NA1, and there is no need to set up a photoresist to etch the groove 50 to form the blocking part 40, which is conducive to reducing the process and reducing the production cost.

[0045] Figure 7 and Figure 8 is another schematic diagram of a manufacturing process of a display panel provided by the present invention, referring to Figure 1 , Figure 4 , Figure 7 and Figure 8 , the groove 50 can be made with the second through hole 62 by the same mask process. Specifically, since the metal part 41 is provided in the first non-display area NA1, when the second through hole 62 is formed by the existing mask plate, the inorganic layers 21 between the metal part 41 and the base substrate 10 will not be etched away due to the blocking of the metal part 41, so that the blocking part 40 and the groove 50 are formed in the first non-display area NA1, and there is no need to set up a photoresist to etch the groove 50 to form the blocking part 40, which is conducive to reducing the process and reducing the production cost.

[0046] It should be noted that Figure 7 and Figure 8 It is exemplarily shown that the first through hole 61 can be formed by etching through a mask process, and then the second through hole 62 can be formed by etching through another mask process. In other embodiments of the present invention, the second through hole 62 can be formed by etching through a mask process, and then the first through hole 61 can be formed by etching through another mask process. The present invention will not be repeated here.

[0047] Continue to refer Figure 1 and Figure 4 In some optional embodiments, a vertical projection of the blocking portion 40 on the base substrate 10 is located within a vertical projection of the metal portion 41 on the base substrate 10 .

[0048] Specifically, the metal portion 41 is provided in the first non-display area NA1, so that when the first through hole 61 or the second through hole 62 is formed by the existing mask plate, the inorganic layers 21 between the metal portion 41 and the base substrate 10 will not be etched due to the blocking of the metal portion 41, so that the blocking portion 40 and the groove 50 are formed in the first non-display area NA1. Since the groove 50 is etched with the metal portion 41 as a barrier to form the blocking portion 40, the inorganic layers 21 between the metal portion 41 and the base substrate 10 will not be etched, so that the vertical projection of the blocking portion 40 on the base substrate 10 is located within the vertical projection of the metal portion 41 on the base substrate 10.

[0049] Continue to refer Figure 1 and Figure 4 In some optional embodiments, the material of the metal portion 41 is at least one of titanium or molybdenum.

[0050] Specifically, when etching the inorganic layer 21 of the display panel, titanium and molybdenum will not be etched away, and the metal part 41 can be made of at least one material of titanium or molybdenum, so that the metal part 41 can be used as a barrier to etch the groove 50 to form the blocking part 40. Titanium and molybdenum are materials frequently used in the manufacturing process of display panels. Making the metal part 41 of at least one material of titanium or molybdenum is conducive to reducing production costs. At the same time, the gate T02 of the transistor T is usually made of at least one material of titanium and molybdenum. The metal part 41 and the gate T02 of the transistor T can be made of the same material in the same process, so that the material of the metal part 41 is at least one material of titanium or molybdenum.

[0051] Continue to refer Figure 1 and Figure 4 In some optional embodiments, the light emitting layer 30 includes a first portion 31 and a second portion 32, the first portion 31 is located on a side of the metal portion 41 away from the base substrate 10, the second portion 32 is located at the bottom of the groove 50, and the first portion 31 and the second portion 32 are disconnected from each other.

[0052] Specifically, a blocking portion 40 and a groove 50 are provided in the first non-display area NA1. In a direction perpendicular to the plane where the base substrate 10 is located, the groove 50 penetrates the inorganic layer 21 in the circuit layer 20 to form the blocking portion 40. The light-emitting layer 30 includes a first portion 31 located on the side of the metal portion 41 away from the base substrate 10 and a second portion 32 located at the bottom of the groove 50. A step difference is formed between the first portion 31 and the second portion 32, so that the first portion 31 and the second portion 32 are disconnected from each other, that is, the light-emitting layer 30 is disconnected at the groove 50, so that the portion of the light-emitting layer 30 in the first non-display area NA1 and the portion of the light-emitting layer 30 in the display area AA are disconnected from each other, thereby disconnecting the water and oxygen intrusion path. Even if the portion of the light-emitting layer 30 in the first non-display area NA1 is corroded by water and oxygen, the water and oxygen cannot be transmitted to the display area AA through the light-emitting layer 30.

[0053] Continue to refer Figure 1 and Figure 4 In some optional embodiments, the display panel further includes an encapsulation layer 70, which is located on the side of the light-emitting layer 30 away from the base substrate 10, that is, the encapsulation layer 70 is arranged on the side of the light-emitting layer 30 away from the base substrate 10 to prevent external water and oxygen erosion.

[0054] The encapsulation layer 70 includes an inorganic encapsulation layer 71 , and the inorganic encapsulation layer 71 covers the first portion 31 , the second portion 32 , and the sidewall of the groove 50 .

[0055] Specifically, the encapsulation layer 70 includes an inorganic encapsulation layer 71. When the encapsulation layer 70 is arranged on the side of the light-emitting layer 30 away from the base substrate 10, due to the step difference formed between the first part 31 and the second part 32, the first part 31 and the second part 32 are disconnected from each other, that is, the first part 31 and the second part 32 are disconnected at the groove 50, so that the inorganic encapsulation layer 71 covers the first part 31, the second part 32 and the side walls of the groove 50.

[0056] The sidewalls of the groove 50 include the sidewalls of each inorganic layer 21. When the inorganic encapsulation layer 71 covers the sidewalls of the groove 50, the inorganic encapsulation layer 71 and the inorganic layer 21 have a high bonding strength, so that they can better cooperate to achieve encapsulation. The inorganic encapsulation layer 71 covers the sidewalls of the groove 50, so that the first part 31 and the second part 32 can be further blocked by the inorganic encapsulation layer 71 to prevent external water and oxygen erosion.

[0057] Optionally, the encapsulation layer 70 includes an inorganic encapsulation layer 71 , an organic encapsulation layer 72 , and an inorganic encapsulation layer 71 that are stacked.

[0058] In some alternative embodiments, please refer to Fig. 9 , Fig. 9 1 is a schematic plan view of a display device provided by the present invention. The display device 1000 provided by this embodiment includes the display panel 100 provided by the above embodiment of the present invention. Fig. 9 The embodiment only takes a mobile phone as an example to illustrate the display device 1000. It can be understood that the display device 1000 provided in the embodiment of the present invention can also be a computer, a television, a car display device or other display device 1000 with a display function, and the present invention does not specifically limit this. The display device 1000 provided in the embodiment of the present invention has the beneficial effects of the display panel 100 provided in the embodiment of the present invention. For details, please refer to the specific description of the display panel 100 in the above embodiments, and this embodiment will not be repeated here.

[0059] It can be seen from the above embodiments that the display panel and the display device provided by the present invention achieve at least the following beneficial effects:

[0060] In the display panel provided by the present invention, a blocking portion and a groove are provided in the first non-display area. In the direction perpendicular to the plane where the substrate is located, the groove penetrates the inorganic layer in the circuit layer to form a blocking portion. There is a step difference between the part of the light-emitting layer in the groove and the part in the blocking portion, so that the light-emitting layer is disconnected at the groove, so that the part of the light-emitting layer in the first non-display area and the part of the light-emitting layer in the display area are disconnected from each other, and the water oxygen invasion path is disconnected. Even if the part of the light-emitting layer in the first non-display area is corroded by water oxygen, water oxygen cannot be transmitted to the display area through the light-emitting layer. In the present invention, the inorganic layer in the circuit layer is reused to form the blocking portion by the groove penetrating the inorganic layer in the circuit layer, and no additional material is required to form the blocking portion, which is conducive to reducing the process and reducing the production cost. And a metal part is provided on the side of the barrier away from the substrate, and the metal part and the gate in the transistor are arranged in the same layer, that is, the metal part and the gate in the transistor can be made of the same material in the same process, and the metal part can be used as a blocking groove to form the blocking part, and there is no need to set up a photoresist etching groove to form the blocking part, which is conducive to reducing the process and reducing the production cost.

[0061] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A display panel, characterized in that: include: an opening area, a first non-display area surrounding the opening area, and a display area surrounding the first non-display area; The display panel further comprises a base substrate, a circuit layer and a light emitting layer, wherein the light emitting layer is located on a side of the circuit layer away from the base substrate, and the circuit layer comprises a plurality of inorganic layers; The first non-display area includes at least one blocking portion and at least one groove, wherein the groove penetrates the inorganic layer in the circuit layer in a direction perpendicular to the plane where the base substrate is located to form the blocking portion, and a metal portion is provided on a side of the blocking portion away from the base substrate; The light emitting layer is disconnected at the groove; The circuit layer further includes a plurality of transistors, each of which includes an active layer, a gate, a source and a drain, and the metal part is disposed in the same layer as the gate; The transistor includes a first transistor and a second transistor, the first transistor includes a first active layer, a first gate, a first source and a first drain, and the second transistor includes a second active layer, a second gate, a second source and a second drain; The first gate is located on a side of the second gate away from the substrate; The metal portion is disposed in the same layer as the first gate.

2. The display panel according to claim 1, characterized in that: The first active layer includes an oxide semiconductor, and the second active layer includes silicon.

3. The display panel according to claim 1, characterized in that: The first active layer includes silicon, and the second active layer includes an oxide semiconductor.

4. The display panel according to claim 1, characterized in that: The circuit layer comprises a first metal layer, a second metal layer and a third metal layer which are insulated from each other, the second metal layer is located on a side of the first metal layer away from the substrate, and the third metal layer is located on a side of the second metal layer away from the substrate; The second gate is located in the first metal layer, the second source and the second drain are located in the third metal layer, and the second source and the second drain are electrically connected to the second active layer through a first through hole; The first gate is located in the second metal layer, the first source and the first drain are located in the third metal layer, and the first source and the first drain are electrically connected to the first active layer through a second through hole; The groove and the first through hole or the second through hole are made by the same mask process.

5. The display panel according to claim 1, characterized in that: A vertical projection of the blocking portion on the base substrate is located within a vertical projection of the metal portion on the base substrate.

6. The display panel according to claim 1, characterized in that: The material of the metal part is at least one of titanium and molybdenum.

7. The display panel according to claim 1, characterized in that: The light emitting layer includes a first portion and a second portion, the first portion is located at a side of the metal portion away from the base substrate, the second portion is located at the bottom of the groove, and the first portion and the second portion are disconnected from each other.

8. The display panel according to claim 7, characterized in that: The display panel further comprises an encapsulation layer, wherein the encapsulation layer is located on a side of the light emitting layer away from the base substrate; The encapsulation layer includes an inorganic encapsulation layer, and the inorganic encapsulation layer covers the first portion, the second portion, and a sidewall of the groove.

9. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 8.

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