In-ear speakers

Abstract

In one embodiment, a method for emitting sound from an in-ear speaker worn by a subject includes generating a source audio signal by an audio source of the in-ear speaker. One or more speakers of the in-ear speaker can emit sound based on the audio signal, and an audio transmission tube of the in-ear speaker can receive the sound. The one or more speakers can include a single speaker or a speaker array coupled to a crossover network. The audio transmission tube has an input end coupled to the one or more speakers to receive the sound. An audio reflector of the in-ear speaker can reflect the sound. The audio reflector is coupled to the output end of the audio transmission tube.

Description

Technical Field

[0001] The present disclosure generally relates to in-ear speakers for determining a dynamic head-related transfer function for a subject. Background Art

[0002] Head-related transfer function (HRTF) can be used to characterize how the ear of the subject receives sound from a certain point in space. Specifically, the HRTF for the subject can be used to synthesize binaural sound that appears to be derived from a given point in three-dimensional (3D) space in the subject. Traditionally, HRTF can be measured for the subject by placing a microphone inside the ear of the subject to receive the sound emitted from a series of speakers in the anechoic chamber. Each of a series of speakers can be arranged in a circular or semicircular arrangement close to the microphone inside the ear of the subject to emit corresponding sounds, so that the microphone can capture the sound emitted from each speaker individually. However, this process may be time-consuming, because HRTF requires small incremental measurements (e.g., a measurement every 5° to 30° on the horizontal plane), so that each speaker in a series can emit corresponding sounds for each increment. In addition, this process may prove to be arduous for the subject, because each HRTF measurement requires the subject to remain still while the microphone inside the ear of the subject receives the corresponding sound emitted individually from each speaker in a series of speakers. Furthermore, because the subject is asked to remain still throughout the process, the process may not account for changes in the subject's position (e.g., tilting the head, rotating the head, etc.), thereby limiting the range of binaural sounds that the HRTF measurement can synthesize for the subject. Summary of the invention

[0003] In-ear speakers, a series of audio sensors and a series of image sensors can be used to determine the dynamic head-related transfer function (HRTF) for the subject. The in-ear speakers can be worn inside the ear of the subject in a soundproof room or "capture space" so that the in-ear speakers can emit sound from the subject's ear away from the surrounding capture space. The sound emitted from the in-ear speakers can be or include a sine wave sweep, and the frequency of the sound increases or decreases so that multiple frequency ranges (e.g., from 20Hz to 20kHz) can be emitted in the entire capture space. In order to emit sound, the audio source of the in-ear speakers can first generate a source audio signal. The frequency division network coupled to the audio source can filter the source audio signal into multiple frequency signals. One or more speakers coupled to the frequency division network can emit sound respectively, and the audio transmission tube with the input end coupled to the speaker can receive the sound. The audio reflector coupled to the output end of the audio transmission tube can receive the sound and reflect the sound into the entire capture space.

[0004] According to a first aspect of the present disclosure, there is provided an in-ear speaker configured to be worn by a subject, the in-ear speaker comprising: an audio source configured to generate a source audio signal; one or more speakers configured to emit sound based on the source audio signal; an enclosure configured to surround the one or more speakers; an audio transmission tube having an input end coupled to the enclosure to receive sound from the enclosure; and an audio reflector coupled to an output end of the audio transmission tube and configured to reflect sound.

[0005] According to a second aspect of the present disclosure, there is provided a method for emitting sound from an in-ear speaker worn by a subject, the method comprising: generating a source audio signal by an audio source of the in-ear speaker; emitting sound based on the source audio signal by one or more speakers of the in-ear speaker; receiving the sound by an audio transmission tube of the in-ear speaker, the audio transmission tube having an input end coupled to one or more speakers to receive the sound; and reflecting the sound by an audio reflector of the in-ear speaker, the audio reflector being coupled to an output end of the audio transmission tube.

[0006] The audio reflector may further include a microphone coupled to the audio reflector and configured to capture sound.The method may further include capturing the sound by a microphone of the in-ear speaker, the microphone coupled to the audio reflector.

[0007] The microphone may be enclosed within an audio reflector.

[0008] The audio reflector may be configured to be worn inside the subject's ear.

[0009] The audio reflector may include an open end and a closed end. The open end may be directed away from the subject's ear. The closed end may include a rigid surface worn inside the subject's ear and configured to reflect sound away from the subject's ear through the open end.

[0010] The audio reflector may be removably coupled to an absorbent material configured to be worn inside the subject's inner ear to prevent the inner ear from receiving sound. The method may also include preventing the subject's inner ear from receiving sound by an absorbent material removably coupled to the audio reflector, the absorbent material configured to be worn inside the subject's inner ear.

[0011] The audio source may further include an audio converter coupled to the audio source and configured to convert the digital source audio signal into a source audio signal. The method may further include converting, by the audio converter coupled to the audio source, the digital source audio signal into a source audio signal.

[0012] Each of the one or more speakers may be positioned within a speaker funnel within the enclosure.

[0013] The one or more speakers may include a single speaker.

[0014] The one or more speakers may include a speaker array coupled to a frequency division network. The frequency division network may be coupled to an audio source and configured to filter a source audio signal from the audio source into a plurality of frequency signals. The speaker array may include a plurality of speakers configured to respectively emit frequency signals in the plurality of frequency signals.

[0015] The embodiments disclosed herein are merely examples, and the scope of the present disclosure is not limited to them. Specific embodiments may include all, some, or none of the components, elements, features, functions, operations, or steps of the embodiments disclosed herein. Embodiments are particularly disclosed in the attached claims relating to in-ear speakers and methods, wherein any feature mentioned in one claim category (e.g., method) may also be claimed in another claim category (e.g., system). The dependencies or references in the attached claims are selected only for formal reasons. However, any subject matter arising from intentional tracing back to any previous claim (especially multiple dependencies) may also be claimed, so any combination of claims and their features is disclosed and may be claimed, regardless of the dependencies selected in the attached claims. The subject matter that may be claimed includes not only the combination of features set forth in the attached claims, but also any other feature combination in the claims, wherein each feature mentioned in the claims may be combined with any other feature or other feature combination in the claims. In addition, any embodiment and feature described or depicted herein may be claimed in a separate claim and / or in any combination with any embodiment or feature described or depicted herein or with any feature of the attached claims.

[0016] Embodiments may include an artificial reality system or may be implemented in conjunction with an artificial reality system. Artificial reality is a form of reality that has been adjusted in some way before being presented to a user, which may include, for example, virtual reality (VR), augmented reality (AR), mixed reality (MR), mixed reality, or some combination and / or derivative thereof. Artificial reality content may include fully generated content or generated content combined with captured content (e.g., a photo of the real world). Artificial reality content may include video, audio, tactile feedback, or some combination thereof, and any of which may be presented in a single channel or multiple channels (such as a stereoscopic video that produces a three-dimensional effect to the viewer). In addition, in some embodiments, artificial reality may be associated with, for example, an application, product, accessory, service, or some combination thereof that is used to create content in artificial reality and / or used in artificial reality (e.g., performing activities therein). Artificial reality systems that provide artificial reality content can be implemented on various platforms, including a head-mounted display (HMD) connected to a host computer system, a standalone HMD, a mobile device or computing system, or any other hardware platform capable of providing artificial reality content to one or more viewers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Selected elements of an example system environment for determining a dynamic inverse head-related transfer function for a subject are illustrated.

[0018] Figure 2 Selected elements of an example in-ear speaker are illustrated.

[0019] Figure 3A and Figure 3B Selected elements of an example in-ear speaker worn by a subject are illustrated.

[0020] Figure 4 Selected elements of an example enclosure for an in-ear speaker are illustrated.

[0021] Figure 5 Selected elements of an example speaker funnel of an enclosure are illustrated.

[0022] Fig. 6A and Figure 6B Selected elements of an example audio reflector for an in-ear speaker are illustrated.

[0023] Figure 7 Illustrated are selected elements of an example method for emitting sound from an in-ear speaker worn by a subject.

[0024] Figure 8 Selected elements of an example computer system are illustrated. DETAILED DESCRIPTION

[0025] Figure 1 Selected elements of an example system environment for determining a dynamic inverse head-related transfer function for a subject are illustrated. Figure 1 In the example illustrated in FIG. 1 , the system environment 100 includes a capture space 110 and a computing device 170. The capture space 110 includes a series of audio sensors 120-1 to 120-N (collectively referred to herein as “audio sensors 120”), a series of image sensors 130-1 to 130-N (collectively referred to herein as “image sensors 130”), and a plurality of image sensors 130-1 to 130-N (collectively referred to herein as “image sensors 130”). Figure 1 FIG. 1 is a diagram of a subject 160 wearing an in-ear speaker 140 in the right ear of the subject 160. The in-ear speaker 140 is coupled to a microphone 150, which is also worn on the subject 160. Figure 1 160. The computing device 170 includes a head-related transfer function (HRTF) database 180 for storing the measured dynamic HRTF of the subject 160. In other examples, the system environment 100 may include more, fewer, and / or any combination of components suitable for determining a dynamic HRTF for a subject.

[0026] In one example, the capture space 110 can include a room or other enclosed space, generally operable to absorb reflections of sound. In particular, the capture space 110 can absorb reverberant sound waves so that sensor devices within the capture space 110 can specifically detect direct sound waves. These "free field" conditions can be used to measure transfer functions associated with sound sources. For example, an in-ear speaker 140 can emit sound pressure waves within the capture space 110 so that a series of audio sensors 120 placed throughout the capture space 110 can capture the sound. The captured sound or waveform can be used in part to calculate a dynamic HRTF for the subject. Figure 1 In the example illustrated in , the capture space 110 may include a series of audio sensors 120 and a series of image sensors 130. For example, the capture space 110 may include microphones and cameras evenly disposed throughout the capture space 110 to detect sounds generated by the in-ear speakers 140 and to capture images of the subject 160, respectively. In one example, the capture space 110 may be or include a dome having the audio sensors 120 and image sensors 130 evenly disposed throughout the dome surrounding the subject 160. In another example, the capture space 110 may be or include an audio / video capture stage including the audio sensors 120 and image sensors 130 embedded in the walls and oriented toward the subject 160. In other examples, the capture space 110 may be or include any combination of an anechoic chamber, a semi-anechoic chamber, and / or a soundproof environment suitable for absorbing sound reflections.

[0027] In one example, the in-ear speaker 140 may include a system, device or apparatus that is generally operable to emit sound (e.g., sound pressure waves) away from the subject's head. Specifically, the in-ear speaker 140 may be worn inside the ear (e.g., left ear, right ear, or both ears) of the subject 160 so that the in-ear speaker 140 can emit sound away from the ear of the subject 160 into the surrounding capture space 110. In one example, each sound emitted by the in-ear speaker 140 may be or include a "sine wave sweep", with the frequency of the sound increasing (e.g., ranging from 20 Hz to 20 kHz) so that various frequencies are emitted into the surrounding capture space 110. For example, the in-ear speaker 140 may include a frequency division network (not shown in the figure), which is configured to divide the source audio signal into high, medium and low frequency sound waves through corresponding transducers. These high, medium and low frequency sound waves can be emitted by the in-ear speaker 140 throughout the capture space 110 so that the audio sensor 120 can capture the sound waves for processing. In other examples, the sound emitted by the in-ear speaker 140 may be or include a logarithmic sweep, a linear sweep, white noise, pink noise, and / or any combination of sounds suitable for use as a reference signal. Figure 2 - Fig. 6 describes the in-ear speaker 140 in more detail.

[0028] In one example, microphone 150 may include a system, device, or apparatus that is generally operable to capture sound emitted by in-ear speaker 140. In particular, microphone 150 may be coupled to in-ear speaker 140 inside the ear of subject 160 so that microphone 150 may capture sound near the ear canal of subject 160 before the sound reflects and leaves the ear to be modified by the anthropometric features of subject 160. For example, various frequencies of the input signal may be boosted or attenuated as the sound leaves in-ear speaker 140 and reflects off the head, ear, and body of subject 160. Because the sound is captured before being modified, the sound captured by microphone 150 may be used as a “reference signal” when determining a dynamic HRTF for subject 160. That is, computing device 170 may use the reference signal captured by microphone 150 as an input signal during a process for determining the dynamic HRTF of subject 160. In one example, microphone 150 may be or include a microelectromechanical system (MEMS) microphone. In other examples, microphone 150 may be or include a dynamic microphone, a condenser microphone, a piezoelectric microphone, or any combination of transducers suitable for receiving sound waves and converting them into electrical signals.

[0029] In one example, each audio sensor 120-1 to 120-N may include a system, device, or apparatus generally operable to capture the sound emitted by the in-ear speaker 140. Specifically, the audio sensors 120 may be placed throughout the capture space 110 (e.g., embedded in a wall) so that the diaphragm or other acoustic sensor of each audio sensor 120 is oriented toward the subject 160 (and the in-ear speaker 140). Each audio sensor 120 may capture the sound emitted by the in-ear speaker 140 after the sound has left the ear and has been modified by the anthropometric features of the subject 160. For example, various frequencies of the sound may be modified in response to being reflected back from the auricle of the ear of the subject 160 and other parts of the body when leaving the ear. Because the sound is captured after being modified, the sound captured by each audio sensor 120 may be used as an output signal when determining a dynamic HRTF for the subject 160. That is, the computing device 170 may use the audio recording of the sound captured by each audio sensor 120 as an output signal during the process for determining the dynamic HRTF of the subject 160. In one example, the audio sensor 120 may be or include an array of omnidirectional microphones. In other examples, the audio sensor 120 may be or include an array of dynamic microphones, condenser microphones, piezoelectric microphones, surround sound microphones, high-order surround sound microphones, or any combination of transducers suitable for receiving sound waves and converting them into electrical signals.

[0030] In one example, each image sensor 130-1 to 130-N may include a system, device, or apparatus that is generally operable to capture one or more images of a subject 160. In particular, the image sensors 130 may be placed throughout the capture space 110 (e.g., embedded in a wall) so that the lens or other light sensor of each image sensor 130 is oriented toward the subject 160. Each image sensor 130 may capture one or more images (e.g., still images, video images, etc.) depicting the body posture of the subject 160 or the orientation of the subject 160 relative to the capture space 110. In one example, the image sensor 130 may capture one or more images of the subject 160 while the in-ear speaker 140 is emitting sound, so that the body posture of the subject 160 may be mapped to both the audio recording of the sound captured by the audio sensor 120 and the reference signal captured by the microphone 150. In one example, the image sensor 130 may be or include a series of digital cameras. In another example, the image sensor 130 may be or include a series of depth sensors, range imaging cameras, time-of-flight (ToF) cameras, etc. In other examples, image sensor 130 may be or include a series of thermal imaging cameras, infrared cameras, and / or any combination of image sensors suitable for receiving an image and converting the image into an electrical signal.

[0031] In one example, computing device 170 may include a system, device, or apparatus that is generally operable to determine a dynamic HRTF for subject 160. Computing device 170 may receive an audio recording of one or more sounds emitted by in-ear speaker 140 captured by audio sensor 120. In addition, computing device 170 may receive one or more reference signals captured by microphone 150 and one or more images captured by image sensor 130. One or more images may depict the body posture of subject 160 relative to surrounding capture space 110 when in-ear speaker 140 is emitting sound. By allowing subject 160 to change body posture, a set of intensive measurements can be achieved and used to determine a dynamic HRTF for subject 160. In one example, computing device 170 may be or include a desktop computer. In other examples, computing device 170 may be or include any combination of a server system, a microcontroller unit, a tablet computer, a notebook computer, and / or a computing device suitable for determining a dynamic HRTF for a subject.

[0032] In one example, computing device 170 may use one or more images captured by image sensor 130 to generate a model or "posture representation" of the body posture of subject 160 to be used to determine dynamic HRTF. Because the subject is required to remain still throughout the process, traditional HRTF measurements may not take into account changes in the subject's position (e.g., tilting the head, rotating the head, etc.), thereby limiting the range of binaural sounds that the HRTF measurement can synthesize for the subject. For example, a traditional HRTF data set can be represented using functions HRTF_L(azimuth_i, elevation_i) and HRTF_R(azimuth_i, elevation_i) for the subject's left ear (L) and right ear (R), respectively. In this example, "i" can be used as an index to represent each speaker in a series of speakers, where azimuth_i and elevation_i describe the angle indicating the position of each speaker relative to the subject. In contrast, computing device 170 can use a posture representation of the body posture of subject 160 to produce a set of dense measurements that take into account changes in the position of subject 160. For example, the dynamic HRTF dataset can be represented using the functions: HRTF_L(azimuth_i, elevation_i, radius_i, pose_j) and HRTF_R(azimuth_i, elevation_i, radius_i, pose_j) for the left (L) ear and the right (R) ear of the subject 160, respectively. In this example, "i" can be used as an index used to represent each audio sensor 120 in the capture space 110, where azimuth_i and elevation_i describe the angle indicating the position of each audio sensor 120 relative to the subject 160. In addition, radius_i can describe the distance between the subject 160 and each audio sensor 120, and pose_j can describe the body posture of the subject 160 (i.e., as indicated using the posture representation). Here, "j" can be used as an additional index to represent each body posture of the subject 160 in multiple body postures corresponding to a specific azimuth_i, elevation_i, and radius_i of a given audio sensor 120. By allowing subject 160 to change body posture, the dynamic HRTF measurement effectively increases the range of binaural sounds that the HRTF measurement can synthesize for the subject. In one example, the posture representation of the body posture can be or include a three-dimensional (3D) virtual reconstruction of the body posture of subject 160. For example, the posture representation can be generated using a 3D mesh, from which the azimuth, elevation, radius, and body posture of subject 160 relative to each audio sensor 120 can be derived.

[0033] In one example, computing device 170 may process an audio recording of sounds captured by audio sensor 120 using a reference signal and a gesture representation captured by microphone 150 to determine an HRTF for each audio sensor 120-1 through 120-N within capture space 110. That is, for a given body gesture of subject 160, computing device 170 may determine an HRTF for each audio sensor 120 at its location within capture space 110. Figure 1 In the example illustrated in , computing device 170 may first determine the HRTF for the body posture "A" of subject 160, for the location of each audio sensor 120 within capture space 110. In one example, computing device 170 may process an audio recording of sounds captured by audio sensor 120 using a reference signal and a posture representation captured by microphone 150 (e.g., using deconvolution), where the audio recording may be used as an output signal and the reference signal may be used as an input signal. For example, computing device 170 may use the following equation to determine the HRTF for audio sensor 120-1( Figure 1 HRTF (H 1 (ω)):

[0034]

[0035] In the above equation, Y 1 (ω) is the output signal (i.e., the audio recording captured by audio sensor 120-1) and X(ω) is the input signal (i.e., the reference signal captured by microphone 150). Since both the input and output signals are known, computing device 170 can solve H 1 (ω), thereby determining the HRTF for the position of the audio sensor 120-1 in the capture space 110. In one example, the computing device 170 may calculate the HRTF (H 1 (ω)) is stored in HRTF database 180 along with data indicating a posture representation associated with the HRTF (eg, indicating body posture “A” of subject 160 ).

[0036] In another example, computing device 170 may use the following equation to determine the audio sensor 120-2 ( Figure 1 HRTF (H 2 (ω)):

[0037]

[0038] In the above equation, Y 2(ω) is the output signal (i.e., the audio recording captured by audio sensor 120-2) and X(ω) is the input signal (i.e., the reference signal captured by microphone 150). Again, because both the input and output signals are known, computing device 170 can solve H 2 (ω), thereby determining the HRTF for the position of microphone 120-2 in capture space 110. In one example, computing device 170 may calculate HRTF (H 2 (ω)) is stored in the HRTF database 180 together with data indicating the posture representation associated with the HRTF. For example, the computing device 170 may store the HRTF for each audio sensor 120 as a data structure including: HRTF measurements; azimuth, elevation, and radius values ​​of the audio sensor 120 relative to the subject 160; and posture representation coordinates indicating the body posture "A" of the subject 160. In one example, the computing device 170 may determine the HRTF for each audio sensor 120-1 to 120-N within the capture space 110. That is, the computing device 170 may determine the HRTF for a given posture representation, the location of each audio sensor 120 within the capture space 110.

[0039] In one example, computing device 170 may process an audio recording of additional sounds captured by audio sensor 120 using additional reference signals and gesture representations captured by microphone 150 embedded within in-ear speaker 140 to determine an HRTF for each audio sensor 120-1 through 120-N within capture space 110. That is, computing device 170 may determine an HRTF for the location of each audio sensor 120 within capture space 110 for the additional body gestures of subject 160. Figure 1 In the example illustrated in , computing device 170 may determine the HRTF for the location of each audio sensor 120 within capture space 110 for an additional body posture "B" of subject 160. In response to subject 160 changing the body posture, in-ear speaker 140 may emit additional sounds from the ear (e.g., left ear, right ear, or both ears) of subject 160 when subject 160 is oriented to the additional body posture. Microphone 150 may capture additional reference signals before the additional sounds leave the ears and are modified by the anthropometric features of subject 160. Similarly, audio sensor 120 may capture additional sounds after the additional sounds leave the ears and are modified by the anthropometric features of subject 160. In addition, image sensor 130 may capture additional one or more images of subject 160 while in-ear speaker 140 is emitting the additional sounds. The additional body posture of subject 160 may be mapped to both the audio recording of the additional sounds captured by audio sensor 120 and the additional reference signals captured by microphone 150.

[0040] In one example, computing device 170 may modify the gesture representation of the body posture of subject 160 based on the additional one or more images captured by image sensor 130. Specifically, computing device 170 may modify the gesture representation to represent the additional body posture of subject 160, as shown in the additional one or more images. Figure 1 , computing device 170 may modify the gesture representation to represent an additional body posture “B” of subject 160. As described above with respect to body posture “A,” computing device 170 may process the audio recording of additional sounds captured by audio sensor 120 using the additional reference signal captured by microphone 150 and the gesture representation to determine an HRTF for each audio sensor 120. In one example, computing device 170 may store the HRTF for each audio sensor 120 in HRTF database 180 along with data indicating the gesture representation associated with the HRTF. For example, computing device 170 may store the HRTF for each audio sensor 120 as a data structure that includes: HRTF measurements; azimuth, elevation, and radius values ​​of audio sensor 120 relative to subject 160; and gesture representation coordinates indicating an additional body posture “B” of subject 160.

[0041] In one example, the HRTF database 180 may include a system, device, or apparatus that is generally operable to store HRTF measurements for each audio sensor 120 in the capture space 110. In particular, the HRTF database 180 may store HRTF measurements and associated metadata for the location of each audio sensor 120 within the capture space 110. For example, each entry stored in the HRTF database 180 may correspond to an audio sensor 120, or a location of an audio sensor 120 within the capture space 110, and include: an HRTF measurement; an azimuth, elevation, and radius value of the audio sensor 120 relative to the subject 160; and a posture representation coordinate indicating a given body posture of the subject 160. Here, each audio sensor 120 within the capture space 110 may include multiple entries in the HRTF database 180. Specifically, each audio sensor 120 may include multiple HRTF measurements in the HRTF database 180, each HRTF measurement corresponding to a corresponding body posture of the subject 160. Because HRTF database 180 includes multiple HRTF measurements corresponding to each corresponding body posture of subject 160, computing device 170 can access HRTF database 180 to determine the HRTF measurement at a given position within capture space 110 corresponding to a given body posture of subject 160, thereby determining a dynamic HRTF for subject 160.

[0042] Figure 2 Selected elements of an example in-ear speaker are shown. Figure 1 As described, in-ear speaker 140 may include a system, device, or apparatus generally operable to emit sound outwardly away from the head of subject 160. In particular, in-ear speaker 140 may be worn inside the ear of subject 160 such that in-ear speaker 140 emits sound outwardly away from the ear of subject 160 into surrounding capture space 110. Figure 2 In the example illustrated in , the in-ear speaker 140 includes an audio source 210, a frequency division network 230, one or more speakers 240, an audio transmission tube 250, and an audio reflector 260. The audio source 210 includes an audio converter 220. The audio reflector 260 includes a microphone 150. In other examples, the in-ear speaker 140 may include more, fewer, and / or any combination of components suitable for emitting sound outwardly away from the head of the subject 160.

[0043] In one example, the audio source 210 may include a system, device, or apparatus generally operable to generate a digital signal or "source audio signal" to be converted into an analog signal and used as sound. For example, the audio source 210 may generate a digital sine wave that is converted into an analog signal and used as a sine wave sweep emitted from the in-ear speaker 140 as sound. Figure 2 In the example illustrated in , the audio source 210 includes an audio converter 220 for converting a digital source audio signal into an analog source audio signal to be sent to the crossover network 230. In one example, the audio source 210 can be or include a computing device. In other examples, the audio source 210 can be or include a sinusoidal oscillator circuit, a microcontroller unit, and / or any combination of audio sources suitable for generating a digital source audio signal.

[0044] In one example, the audio converter 220 may include a system, device or apparatus that is generally operable to convert a digital signal generated by the audio source 210 into an analog source audio signal. Specifically, the audio converter 220 may be coupled to the audio source 210 to receive the digital source audio signal and convert the digital source audio signal into an analog source audio signal. For example, the audio converter 220 may convert a finite precision number such as a fixed-point binary number including the digital source audio signal into a physical quantity such as a sound pressure including the analog source audio signal. That is, the audio converter 220 may receive a digital output from the audio source 210 and convert the digital output into an analog line level output that can be filtered by the frequency division network 230 and emitted by the speaker 240. In one example, the audio converter 220 may be or include a sound card coupled to the audio source 210. In other examples, the audio converter 220 may be or include a digital-to-analog converter (DAC), a weighted resistor network and / or any combination of electronic components suitable for converting a digital signal into an analog source audio signal.

[0045] In one example, the crossover network 230 may include a system, device, or apparatus that is generally operable to filter a source audio signal into corresponding frequency signals. In particular, the crossover network 230 may receive an analog source audio signal from the audio converter 220 (e.g., via a 3.5 mm headphone jack) and split the source audio signal into two or more corresponding frequencies so that each corresponding frequency can be emitted by the speaker 240. For example, the crossover network 230 may receive a source audio signal from the audio converter 220 and filter the received source audio signal into high frequency, mid frequency, and low frequency signals using a combination of high pass, band pass, and low pass filters. Figure 2 In the example illustrated in , the crossover network 230 can be coupled to the speaker 240 so that the crossover network 230 can provide corresponding high frequency, mid-frequency, and low frequency signals to the speaker 240. In one example, the crossover network 230 can be or include an active crossover network, a passive crossover network, a digital crossover network, a mechanical crossover network, and / or any combination of crossover networks suitable for filtering the source audio signal into corresponding frequency signals. Figure 2 In the example illustrated in , the crossover network 230 may be enclosed within the enclosure 200 of the in-ear speaker 140. In another example, the crossover network 230 may be located outside the enclosure 200. In other examples, the in-ear speaker 140 may not include the crossover network 230, such as Figure 2 As shown in the figure.

[0046] In one example, speaker 240 may include a system, device, or apparatus that is generally operable to emit sound including multi-frequency signals. Specifically, speaker 240 may include one or more speakers having various specifications (e.g., size, frequency response, impedance, sensitivity, etc.) such that each speaker in speaker 240 may be optimized to emit a corresponding frequency. Figure 2 In the example illustrated in , each of the speakers 240 can receive a frequency signal from the crossover network 230 according to the frequency that the speaker is optimized to emit. For example, a speaker configured to optimize high frequencies can receive a high frequency signal from the crossover network 230. Similarly, a speaker configured to optimize intermediate frequencies can receive an intermediate frequency signal from the crossover network 230. The speaker 240 can be enclosed in the enclosure 200 to suppress leakage so that the sound emitted from the speaker 240 is prevented from spreading throughout the surrounding capture space 110. Specifically, the sound pressure including the sound can be contained in the enclosure 200 and directed toward the opening of the audio transmission tube 250 so that the sound can be reflected by the audio reflector 260. In one example, the speaker 240 can be or include a speaker array consisting of a series of speakers coupled to the crossover network 230. In another example, the speaker 240 can be or include a single speaker. In other examples, speaker 240 can be or include a series of balanced armature drivers formed in an array, a single balanced armature driver, a series of dynamic drivers formed in an array, a single dynamic driver, and / or any combination of transducers suitable for converting electrical audio signals into sound waves.

[0047] In one example, the audio transmission tube 250 may include a system, device, or apparatus that is generally operable to transmit sound from the speaker 240 to the audio reflector 260. Specifically, the audio transmission tube 250 may couple the speaker 240 to the audio reflector 260 so that the audio reflector 260 may receive the sound generated by the speaker 240 and reflect the sound into the entire capture space 110. In one example, the audio transmission tube 250 may include one or more bends so that each bend modifies the overall frequency response of the audio transmission tube 250. In one example, the audio transmission tube 250 may be made of a flexible material (e.g., plastic, carbon fiber, rubber, etc.) having elastic properties so that the formation of one or more bends in the audio transmission tube 250 may vary depending on the orientation and / or movement of the subject 160. Here, the overall frequency response of the audio transmission tube 250 may be variable because the flexible material allows the audio transmission tube 250 to bend and twist into various shapes. In another example, the audio transmission tube 250 can be constructed of a rigid material (e.g., hardened steel, tungsten carbide, glass, etc.) having rigid properties such that the number of bends in the audio transmission tube 250 can remain constant regardless of the orientation and / or movement of the subject 160. Here, because the rigid material prevents the audio transmission tube 250 from bending or otherwise distorting after manufacture, the overall frequency response of the audio transmission tube 250 can be constant. In other examples, the audio transmission tube 250 can be constructed of any combination of flexible and rigid materials suitable for transmitting sound from the speaker 240 to the audio reflector 260. Figure 3A and Figure 3B The audio transmission tube 250 is further described.

[0048] In one example, the audio reflector 260 may include a system, device, or apparatus that is generally operable to reflect sound throughout the capture space 110. In particular, the audio reflector 260 may receive sound from the speaker 240 via the audio transmission tube 250 and reflect the sound away from the head of the subject 160. Upon reaching the audio reflector 260 via the audio transmission tube 250, the sound may be reflected or bounced off the audio reflector 260 inside the ear of the subject 160. The audio reflector 260 may direct the reflected sound pressure away from the ear of the subject 160, thereby reflecting the sound throughout the capture space 110. In one example, the audio reflector 260 may be removably coupled to an absorbent material (e.g., foam) to prevent the sound pressure from entering the inner ear of the subject, which may damage the eardrum and / or generate an unwanted inner ear frequency response. In one example, the audio reflector 260 may be configured to diffuse the sound throughout the capture space 110. For example, the audio reflector 260 may receive sound from the speaker 240 and diffuse the sound away from the head of the subject 160. Figure 3A, Figure 3B , Fig. 6A and Figure 6B The audio reflector 260 is further described.

[0049] In one example, microphone 150 may include a system, device, or apparatus generally operable to capture sound (e.g., sound pressure waves) emitted by in-ear speaker 140. Specifically, microphone 150 may be coupled to audio reflector 260 so that microphone 150 can capture sound within the subject's ear before the sound leaves the ear and is modified by the subject's anthropometric characteristics. Because the sound is captured before being modified, the sound captured by microphone 150 can be used as a reference signal in determining a dynamic HRTF for the subject, as described above with respect to Figure 1 As described. In addition, the reference signal captured by the microphone 150 can be used to interpret the overall frequency response of the audio transmission tube 250 caused by one or more bends and remove the sound associated with the delay captured by the audio sensor 120. In one example, the microphone 150 can be or include a micro-electromechanical system (MEMS) microphone. In other examples, the microphone 150 can be or include a dynamic microphone, a condenser microphone, a piezoelectric microphone, or any combination of transducers suitable for receiving sound waves and converting them into electrical signals.

[0050] Figure 3A and Figure 3B Selected elements of an example in-ear speaker worn by a subject are illustrated. Figure 3A and Figure 3B In the example illustrated in , the in-ear speaker 140 may include an audio reflector 260, an absorbent material 300, an audio transmission tube 250, and a surround 200. The surround 200 may be coupled to the shoulder strap 320 and may include a crossover network 230 and a speaker 240 (not shown) enclosed therein. In other examples, the in-ear speaker 140 may include more, fewer, and / or any combination of components suitable for emitting sound outwardly away from the head of the subject 160.

[0051] Figure 3A A side view of a subject 160 wearing an in-ear speaker 140 is shown. Figure 3A In the example illustrated in , the enclosure 200 may be coupled to a shoulder strap 320 worn by the subject 160 near the base of the neck. An audio transmission tube 250 may be coupled to the enclosure 200. Specifically, the audio transmission tube 250 may be coupled to a speaker 240 enclosed within the enclosure 200 to receive sound emitted by the speaker 240. The audio transmission tube 250 may guide the sound received from the speaker 240 from the enclosure 200 to the audio reflector 260. Figure 3A and Figure 3BIn the example illustrated in , the audio transmission tube 250 may wrap around behind the ear 310 of the subject 160 to direct the sound to the audio reflector 260. Upon reaching the audio reflector 260 via the audio transmission tube 250, the sound pressure including the sound may reflect or bounce off the audio reflector 260 inside the ear 310 of the subject 160, thereby directing the sound pressure outward away from the ear 310.

[0052] exist Figure 3A In the example illustrated in , the audio reflector 260 can be removably coupled to the absorbent material 300 inside the ear 310 of the subject 160. Specifically, the absorbent material 300 can include an outward-facing end having a concave or cup-shaped center, which is shaped to receive a peg (not shown in the figure) of the audio reflector 260. In addition, the absorbent material 300 can include an inward-facing end that is shaped to be worn inside the inner ear of the subject 160. The inward-facing end of the absorbent material 300 can prevent the inner ear of the subject 160 from receiving the sound reflected by the audio reflector 260. In particular, the inward-facing end of the absorbent material 300 can prevent sound pressure from entering the inner ear of the subject 160, which may damage the eardrum, thereby ensuring the safety of the subject 160 when the in-ear speaker 140 emits sound.

[0053] Figure 3B A rear view of a subject 160 wearing an in-ear speaker 140 is shown. Figure 3B In the example illustrated in FIG. 1 , the enclosure 200 can be coupled to the shoulder strap 320 between the shoulders of the subject 160 near the base of the neck. The enclosure 200 can include a headphone jack 330 or similar multi-channel audio coupler for receiving audio from the audio converter 220 ( Figure 2 Specifically, the crossover network 230 (shown in FIG. 200 ) enclosed in the enclosure 200 receives the source audio signal. Figure 2 ) can receive an analog source audio signal from the audio converter 220 and split the source audio signal into two or more corresponding frequencies so that each corresponding frequency can be played by the speaker 240 ( Figure 2 The speaker 240 may be enclosed in the enclosure 200 so that the sound emitted from the speaker 240 is prevented from spreading to the entire surrounding capture space 110. That is, the sound pressure may be contained in the enclosure 200 and directed toward the opening of the audio transmission tube 250 so that the sound may be reflected by the audio reflector 260.

[0054] Figure 4 Selected elements of an example enclosure for an in-ear speaker are illustrated. Figure 4In the example illustrated in , the enclosure 200 includes an enclosure top portion 400, a speaker housing cover 420 (individually referred to herein as "speaker housing cover 420"), a speaker housing portion 430 (individually referred to herein as "speaker housing portion 430"), a speaker funnel 440 (individually referred to herein as "speaker funnel 440"), and an enclosure bottom portion 460. The speaker housing cover 420 may include a speaker housing cover hole 410 (individually referred to herein as "speaker housing cover hole 410"). The speaker funnel 440 may include a speaker funnel output 450 (individually referred to herein as "speaker funnel output 450"). The enclosure top portion 400 may include a screw hole 480. The enclosure bottom portion 460 may include a speaker funnel output hole 470 (individually referred to herein as "speaker funnel output hole 470") and a screw hole 490. Note that although the crossover network 230 and the speaker 240 are not shown in Figure 4 As shown in the figure, but as mentioned above Figure 2 3 , enclosure 200 may surround crossover network 230 and speaker 240. In other examples, enclosure 200 may include more, fewer, and / or any combination of components suitable for preventing sound from spreading throughout surrounding capture space 110.

[0055] In one example, the enclosure top portion 400 can be removably coupled to the enclosure bottom portion 460 to enclose the speaker housing cover 420, the speaker housing portion 430, and the speaker funnel 440 within the enclosure 200. In particular, the enclosure top portion 400 can be removably coupled to the enclosure bottom portion 460 by connecting the screw holes 480 of the enclosure top portion 400 to the screw holes 490 of the enclosure bottom portion 460 using screws (not shown). In one example, the enclosure top portion 400 and the enclosure bottom portion 460 can include a rigid material (e.g., an opaque thermoplastic, an amorphous polymer, etc.) that provides impact resistance, strength, and heat resistance. For example, the enclosure top portion 400 and the enclosure bottom portion 460 can each include acrylonitrile butadiene styrene (ABS) plastic, which can be 3D printed to form the enclosure top portion 400 and the enclosure bottom portion 460. In one example, the enclosure top portion 400, the speaker housing cover 420, the speaker housing portion 430, the speaker funnel 440, and the enclosure bottom portion 460 can include the same material. In other examples, the enclosure top portion 400, the speaker housing cover 420, the speaker housing portion 430, the speaker funnel 440, and the enclosure bottom portion 460 can include two or more materials.

[0056] In one example, the speaker housing cover 420, the speaker housing portion 430, and the speaker funnel 440 can be removably coupled together within the enclosure 200. Specifically, the speaker housing cover 420 can be removably coupled to the speaker housing portion 430, and the speaker housing portion 430 can be removably coupled to the speaker funnel 440. Figure 4 In the example illustrated in , each speaker funnel 440 may include one or more speakers 240. The speaker housing cover holes 410 of the speaker housing cover 420 may allow a crossover network 230 (not shown) enclosed in the enclosure 200 to provide frequency signals (e.g., high frequency, mid-frequency, and low frequency signals) to each speaker of the speakers 240 (not shown) enclosed in the speaker funnel 440. For example, one or more wires carrying corresponding frequency signals may pass through the speaker housing cover holes 410 of the speaker housing cover 420 and couple to corresponding speakers of the speakers 240 housed within the speaker funnel 440. Each speaker funnel 440 may include one or more speakers 240 so that the in-ear speaker 140 may output a high signal-to-noise ratio (SNR) to assist in processing audio recordings of sounds captured by the audio sensor 120, such as with respect to Figure 1 As described. For example, the speaker funnel 440 can accommodate one or more speakers 240, including four tweeters and two woofers, each of which emits a corresponding frequency to generate sound. Sound emitted by each speaker of the speakers 240 can leave the speaker funnel 440 at the speaker funnel output 450 and enter the corresponding opening of the audio transmission tube 250 via the speaker funnel output hole 470. Removably coupling the speaker housing cover 420, the speaker housing portion 430 and the speaker funnel 440 together can prevent the sound emitted by the speaker 240 from diffusing throughout the enclosure 200, and thereby preventing it from diffusing into the entire surrounding capture space 110. About Figure 5 The speaker funnel 440 is described in more detail.

[0057] Figure 5 Selected elements of an example speaker funnel of an enclosure are illustrated. In one example, the speaker funnel 440 may include a system, device, or apparatus generally operable to accommodate the speaker 240 within the enclosure 200. In particular, the speaker funnel 440 may include one or more slots, each slot being shaped to accommodate one of the speakers 240. Figure 5In the example illustrated in , the speaker funnel 440 may include two sets of tweeter slots 500 (individually referred to herein as "tweeter slots 500") and two woofer slots 510 (individually referred to herein as "woofer slots 510"). In one example, the speaker funnel 440 may include two of each slot in order to increase the sound pressure level measured in decibels output from each speaker funnel 440 without causing destructive interference between the sound waves comprising each sound. Increasing the sound pressure level output from each speaker funnel 440 may increase the SNR, which helps as described with respect to Figure 1 The described processing is an audio recording of the sounds captured by the audio sensor 120. In other examples, the speaker funnel 440 may include more, fewer, and / or any combination of slots suitable for accommodating the speaker 240.

[0058] In one example, each tweeter slot 500 can be shaped to accommodate a speaker optimized to emit high to mid-frequency signals received from the crossover network 230. Figure 5 In the example illustrated in , the speaker funnel 440 may include two tweeter slots 500 of different sizes. Specifically, Figure 5 The smaller tweeter slots 500 shown in the figure can be shaped to accommodate speakers optimized to emit high frequencies, while the larger tweeter slots 500 can be shaped to accommodate speakers optimized to emit mid- and low-frequency frequencies. In one example, each tweeter slot 500 can accommodate a balanced armature driver optimized to emit high- to mid-frequency signals. In another example, each tweeter slot 500 can accommodate a dynamic driver optimized to emit high- to mid-frequency signals. Figure 5 In the example illustrated in , each speaker funnel 440 of the enclosure 200 may include a total of four tweeter slots 500. In other examples, each speaker funnel 440 of the enclosure 200 may include more, less, or any number of tweeter slots 500 suitable for emitting high- to mid-frequency signals and increasing SNR.

[0059] In one example, each woofer slot 510 can be shaped to accommodate a speaker optimized to emit low frequency signals received from the crossover network 230. Figure 5 In the example illustrated in , the speaker funnel 440 can include two woofer slots 510. In one example, each woofer slot 510 can accommodate a balanced armature driver optimized to emit low frequency signals. In another example, each woofer slot 510 can accommodate a dynamic driver optimized to emit low frequency signals. Figure 5In the example illustrated in , each speaker funnel 440 of the enclosure 200 may include a total of two woofer slots 510. In other examples, each speaker funnel 440 may include more, less, or any number of woofer slots 510 suitable for emitting low frequency signals and increasing SNR.

[0060] Fig. 6A and Figure 6B Selected elements of an example audio reflector for an in-ear speaker are shown. Figure 2 As described, the audio reflector 260 may include a system, device, or apparatus that is generally operable to provide a plurality of audio signals throughout the capture space 110 ( Figure 1 Specifically, the audio reflector 260 can transmit the sound to the audio transmission tube 250 ( Figure 2 ) receives data from the speaker 240 ( Figure 2 ) and from the head of the subject 160 ( Figure 1 ) reflects sound away from the ground. Fig. 6A and Figure 6B In the example illustrated in , the audio reflector 260 can have a slightly oval shape that is shaped to be worn inside the subject's ear and can include an audio reflector opening 600, a microphone 150, an open end 610, a closed end 620, and a peg 630. In one example, the audio reflector 260 can be coupled to the audio transmission tube 250 via the audio reflector opening 600. In other examples, the audio reflector 260 can include more, fewer, and / or any combination of components suitable for reflecting sound throughout the capture space 110.

[0061] Fig. 6A A front three quarter view of the audio reflector 260 is shown. Fig. 6A In the example illustrated in , the audio reflector 260 can be shaped into a truncated cone having an open end 610 and a closed end 620. The open end 610 can be pointed away from the subject's ear. The closed end 620 can be or include a rigid surface that is worn inside the subject's ear and is configured to reflect or diffuse sound away from the subject's ear through the open end 610. Specifically, the audio reflector 260 can receive sound from the audio transmission tube 250 via the audio reflector opening 600. Figure 3A and Figure 3BAs shown in , the audio transmission tube 250 can be wrapped behind the ear 310 of the subject 160. Therefore, the audio reflector opening 600 can be oriented so that the audio transmission tube 250 can be coupled with the audio reflector opening 600 near the upper portion of the subject's ear. In addition, the audio reflector 260 can be oriented so that the sound received from the audio transmission tube 250 can be directed toward the microphone 150 located on the rigid surface of the closed end 620. That is, the sound pressure including the sound can be reflected or bounced off the closed end 620 of the audio reflector 260 inside the subject's ear. The audio reflector 260 can direct the reflected sound pressure away from the subject's ear, thereby reflecting the sound throughout the capture space 110. In addition, the microphone 150 can capture the sound inside the subject's ear before the sound leaves the ear and is modified by the subject's anthropometric features.

[0062] Figure 6B A rear three-quarter view of the audio reflector 260 is shown. Figure 6B In the example illustrated in , the audio reflector 260 can include a peg 630 extending from the back of the closed end 620. In one example, the peg 630 can be aligned with the absorbent material 300 ( Figure 3A In particular, the profile of the peg 630 can be removably coupled to the outwardly facing end of the absorbent material 300, as shown in FIG. Figure 3A As depicted, the outwardly facing end of the absorbent material 300 has a concave or cupped center that is shaped to receive the peg 630. The peg 630 can ensure that the audio reflector 260 remains positioned within the subject's ear, while the inwardly facing end of the absorbent material 300 can prevent the inner ear of the subject 160 from receiving sound reflected by the audio reflector 260.

[0063] Figure 7 Selected elements of an example method for emitting sound from an in-ear speaker worn by a subject are illustrated. The method may begin at step 710, where an audio source of the in-ear speaker generates a source audio signal. At step 720, one or more speakers of the in-ear speaker may emit sound based on the source audio signal. The one or more speakers may include a single speaker and / or a speaker array coupled to a crossover network. At step 730, an audio transmission tube of the in-ear speaker may receive sound. The audio transmission tube has an input end coupled to one or more speakers to receive sound. At step 740, an audio reflector of the in-ear speaker may reflect sound, where the audio reflector is coupled to an output end of the audio transmission tube.

[0064] Specific examples may be repeated where appropriate. Figure 7 Although the present disclosure will Figure 7The specific steps of the method are described and illustrated as occurring in a particular order, but the present disclosure contemplates Figure 7 Any suitable steps of the method may occur in any suitable order. In addition, although the present disclosure describes and illustrates methods including Figure 7 The present disclosure contemplates any suitable method for emitting sound from an in-ear speaker worn by a subject, including any suitable steps, which may include, where appropriate, Figure 7 In addition, although the present disclosure describes and illustrates the implementation of the method Figure 7 specific components, devices or systems for specific steps of the method, but the present disclosure contemplates performing Figure 7 Any suitable combination of any suitable components, devices, or systems of any suitable steps of the method.

[0065] Figure 8 Selected elements of an example computer system are illustrated. In a specific example, one or more computer systems 800 perform one or more steps of one or more methods described or illustrated herein. In a specific example, one or more computer systems 800 provide functionality described or illustrated herein. In a specific example, software running on one or more computer systems 800 performs one or more steps of one or more methods described or illustrated herein, or provides functionality described or illustrated herein. A specific example includes one or more parts of one or more computer systems 800. In this article, references to computer systems may cover computing devices, and vice versa where appropriate. In addition, references to computer systems may cover one or more computer systems where appropriate.

[0066] The present disclosure contemplates any suitable number of computer systems 800. The present disclosure contemplates computer systems 800 taking any suitable physical form. By way of example and not limitation, computer system 800 may be an embedded computer system, a system on a chip (SOC), a single board computer system (SBC) (such as, for example, a computer on a module (COM) or a system on a module (SOM)), a desktop computer system, a laptop or notebook computer system, an interactive kiosk, a mainframe, a computer system grid, a mobile phone, a personal digital assistant (PDA)), a server, a tablet computer system, an augmented / virtual reality device, or a combination of two or more thereof. Where appropriate, computer system 800 may include one or more computer systems 800; be single or distributed; span multiple locations; span multiple machines; span multiple data centers; or reside in a cloud, which may include one or more cloud components in one or more networks. Where appropriate, one or more computer systems 800 may perform one or more steps of one or more methods described or illustrated herein without substantial spatial or temporal limitations. By way of example and not limitation, one or more computer systems 800 may perform one or more steps of one or more methods described or illustrated herein in real time or in batch mode. Where appropriate, one or more computer systems 800 may perform at different times or at different locations one or more steps of one or more methods described or illustrated herein.

[0067] In the particular example, computer system 800 includes a processor 802, a memory 804, a storage device 806, an input / output (I / O) interface 808, a communication interface 810, and a bus 812. Although this disclosure describes and illustrates a particular computer system having particular numbers of particular components in a particular arrangement, this disclosure contemplates any suitable computer system having any suitable numbers of any suitable components in any suitable arrangement.

[0068] In a particular example, the processor 802 includes hardware for executing instructions, such as those constituting a computer program. By way of example and not limitation, to execute instructions, the processor 802 may retrieve (or fetch) instructions from an internal register, an internal cache, a memory 804, or a storage device 806; decode and execute them; and then write one or more results to an internal register, an internal cache, a memory 804, or a storage device 806. In a particular example, the processor 802 may include one or more internal caches for data, instructions, or addresses. Where appropriate, the present disclosure contemplates a processor 802 that includes any suitable number of any suitable internal caches. By way of example and not limitation, the processor 802 may include one or more instruction caches, one or more data caches, and one or more translation lookaside buffers (TLBs). The instructions in the instruction cache may be copies of instructions in the memory 804 or the storage device 806, and the instruction cache may speed up the retrieval of those instructions by the processor 802. The data in the data cache may be a copy of data in the memory 804 or storage device 806 for instructions executed on the processor 802 to operate on it; the results of previous instructions executed at the processor 802 for access by subsequent instructions executed at the processor 802 or for writing to the memory 804 or storage device 806; or other suitable data. The data cache may speed up the read or write operations of the processor 802. The TLB may speed up the virtual address translation of the processor 802. In a specific example, the processor 802 may include one or more internal registers for data, instructions, or addresses. Where appropriate, the present disclosure contemplates a processor 802 including any suitable number of any suitable internal registers. Where appropriate, the processor 802 may include one or more arithmetic logic units (ALUs); be a multi-core processor; or include one or more processors 802. Although the present disclosure describes and illustrates a particular processor, the present disclosure contemplates any suitable processor.

[0069] In a particular example, the memory 804 includes a main memory for storing instructions for the processor 802 to execute or data for the processor 802 to operate on. As an example and not limitation, the computer system 800 can load instructions from the storage device 806 or another source (such as, for example, another computer system 800) to the memory 804. The processor 802 can then load the instructions from the memory 804 to an internal register or an internal cache. In order to execute the instructions, the processor 802 can retrieve the instructions from the internal register or the internal cache and decode them. During or after the execution of the instructions, the processor 802 can write one or more results (which can be intermediate or final results) to the internal register or internal cache. The processor 802 can then write one or more of those results to the memory 804. In a particular example, the processor 802 only executes instructions in one or more internal registers or internal caches or memory 804 (as opposed to the storage device 806 or elsewhere) and only operates on data in one or more internal registers or internal caches or memory 804 (as opposed to the storage device 806 or elsewhere). One or more memory buses (which may each include an address bus and a data bus) may couple the processor 802 to the memory 804. The bus 812 may include one or more memory buses, as described below. In a specific example, one or more memory management units (MMUs) reside between the processor 802 and the memory 804 and facilitate access to the memory 804 requested by the processor 802. In a specific example, the memory 804 includes a random access memory (RAM). Where appropriate, the RAM may be a volatile memory. Where appropriate, the RAM may be a dynamic RAM (DRAM) or a static RAM (SRAM). In addition, where appropriate, the RAM may be a single-port or multi-port RAM. The present disclosure contemplates any suitable RAM. Where appropriate, the memory 804 may include one or more memories 804. Although the present disclosure describes and illustrates specific memories, the present disclosure contemplates any suitable memory.

[0070] In a specific example, the storage device 806 includes a large-capacity storage device for data or instructions. As an example and not limitation, the storage device 806 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a tape, or a universal serial bus (USB) drive or a combination of two or more thereof. Where appropriate, the storage device 806 may include a removable or non-removable (or fixed) medium. Where appropriate, the storage device 806 may be inside or outside the computer system 800. In a specific example, the storage device 806 is a non-volatile solid-state memory. In a specific example, the storage device 806 includes a read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically alterable ROM (EAROM) or a flash memory or a combination of two or more thereof. The present disclosure contemplates a large-capacity storage device 806 in any suitable physical form. Where appropriate, the storage device 806 may include one or more storage control units that facilitate communication between the processor 802 and the storage device 806. Where appropriate, storage device 806 may include one or more storage devices 806. Although this disclosure describes and illustrates particular storage devices, this disclosure contemplates any suitable storage devices.

[0071] In a specific example, the I / O interface 808 includes hardware, software, or both, providing one or more interfaces for communication between the computer system 800 and one or more I / O devices. Where appropriate, the computer system 800 may include one or more of these I / O devices. One or more of these I / O devices can enable communication between a person and the computer system 800. As an example and not limitation, the I / O device may include a keyboard, a keypad, a microphone, a monitor, a mouse, a printer, a scanner, a speaker, a camera, a stylus, a tablet computer, a touch screen, a trackball, a camera, other suitable I / O devices, or a combination of two or more thereof. The I / O device may include one or more sensors. The present disclosure contemplates any suitable I / O device and any suitable I / O interface 808 for them. Where appropriate, the I / O interface 808 may include one or more device or software drivers so that the processor 802 can drive one or more of these I / O devices. Where appropriate, the I / O interface 808 may include one or more I / O interfaces 808. Although the present disclosure describes and illustrates a specific I / O interface, the present disclosure contemplates any suitable I / O interface.

[0072] In a specific example, the communication interface 810 includes hardware, software, or both, providing one or more interfaces for communication (such as, for example, packet-based communication) between the computer system 800 and one or more other computer systems 800 or one or more networks. As an example and not limitation, the communication interface 810 may include a network interface controller (NIC) or a network adapter for communicating with an Ethernet or other wired network, or a wireless NIC (WNIC) or a wireless adapter for communicating with a wireless network such as a WI-FI network. The present disclosure contemplates any suitable network and any suitable communication interface 810. As an example and not limitation, the computer system 800 may communicate with one or more parts of a self-organizing network, a personal area network (PAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), or the Internet, or a combination of two or more thereof. One or more parts of one or more of these networks may be wired or wireless. As an example, the computer system 800 may communicate with a wireless PAN (WPAN) (such as, for example, a Bluetooth WPAN), a WI-FI network, a WI-MAX network, a cellular phone network (such as, for example, a global system for mobile communications (GSM) network) or other suitable wireless network or a combination of two or more thereof. Computer system 800 may include any suitable communication interface 810 for any of these networks, where appropriate. Communication interface 810 may include one or more communication interfaces 810, where appropriate. Although this disclosure describes and illustrates particular communication interfaces, this disclosure contemplates any suitable communication interfaces.

[0073] In a particular example, bus 812 includes hardware, software, or both that couples components of computer system 800 to each other. By way of example and not limitation, bus 812 may include an accelerated graphics port (AGP) or other graphics bus, an enhanced industry standard architecture (EISA) bus, a front side bus (FSB), a hypertransport (HT) interconnect, an industry standard architecture (ISA) bus, an INFINIBAND interconnect, a low pin count (LPC) bus, a memory bus, a micro channel architecture (MCA) bus, a peripheral component interconnect (PCI) bus, a PCI-Express (PCIe) bus, a serial advanced technology attachment (SATA) bus, a video electronics standard association local (VLB) bus, or other suitable busses or a combination of two or more thereof. Where appropriate, bus 812 may include one or more buses 812. Although the present disclosure describes and illustrates a particular bus, the present disclosure contemplates any suitable bus or interconnect.

[0074] Herein, where appropriate, one or more computer-readable non-transitory storage media may include one or more semiconductor-based or other integrated circuits (ICs) (such as, for example, field programmable gate arrays (FPGAs) or application-specific ICs (ASICs)), hard disk drives (HDDs), hybrid hard disk drives (HHDs), optical disks, optical disk drives (ODDs), magneto-optical disks, magneto-optical drives, floppy disks, floppy disk drives (FDDs), magnetic tapes, solid-state drives (SSDs), RAM drives, secure digital cards or drives, any other suitable computer-readable non-transitory storage media, or any suitable combination of two or more thereof. Where appropriate, the computer-readable non-transitory storage medium may be volatile, non-volatile, or a combination of volatile and non-volatile.

[0075] As used herein, "or" is inclusive and not exclusive, unless expressly indicated otherwise or the context indicates otherwise. Thus, as used herein, "A or B" means "A, B, or both," unless expressly indicated otherwise or the context indicates otherwise. Furthermore, "and" is both conjunctive and plural, unless expressly indicated otherwise or the context indicates otherwise. Thus, as used herein, "A and B" means "A and B, jointly or severally," unless expressly indicated otherwise or the context indicates otherwise.

[0076] The scope of the present disclosure covers all changes, substitutions, variations, alterations and modifications to the examples described or illustrated herein that will be understood by those of ordinary skill in the art. The scope of the present disclosure is not limited to the examples described or illustrated herein. In addition, although the present disclosure describes and illustrates the various examples herein as including specific components, elements, features, functions, operations or steps, any of these examples may include any combination or arrangement of any components, elements, features, functions, operations or steps described or illustrated anywhere herein that will be understood by those of ordinary skill in the art. In addition, the references to the device or system or the component of the device or system adapted to, arranged to, capable of, configured to, enabled to, operable or operable to perform a specific function in the attached claims cover the device, system, component, whether it or the specific function is activated, started or unlocked, as long as the device, system or component is so adapted, arranged, capable of, configured, enabled, operable or operable. In addition, although the present disclosure describes or illustrates specific examples as providing specific advantages, specific examples may not provide these advantages, provide some or all of these advantages.

Claims

1. An in-ear speaker configured to be worn by a subject, the in-ear speaker include: an audio source configured to generate a source audio signal; one or more speakers configured to produce sound based on the source audio signal; an enclosure configured to surround the one or more speakers; an audio transmission tube having an input end, the input end being coupled to the enclosure to receive the sound from the enclosure; as well as an audio reflector coupled to the output end of the audio transmission tube and configured to reflect the sound, wherein the audio reflector further comprises a microphone coupled to the audio reflector and configured to capture the sound; wherein the microphone is enclosed within the audio reflector; and Wherein the audio reflector is configured to reflect the sound outwardly away from the subject's ears.

2. The in-ear speaker of claim 1, wherein the audio reflector is configured to be worn inside the subject's ear.

3. An in-ear speaker according to claim 2, wherein the audio reflector includes an open end and a closed end, the open end is pointed away from the ear of the subject, the closed end includes a rigid surface worn inside the ear of the subject, and the closed end is configured to reflect the sound through the open end and away from the ear of the subject.

4. The in-ear speaker of any one of claims 1-3, wherein the audio reflector is removably coupled to an absorbent material configured to be worn inside an inner ear of the subject to prevent the inner ear from receiving the sound.

5. The in-ear speaker according to any one of claims 1 to 3, wherein the audio source further include: An audio converter is coupled to the audio source and is configured to convert a digital source audio signal into the source audio signal.

6. The in-ear speaker of any one of claims 1-3, wherein each of the one or more speakers is positioned within a speaker funnel inside the enclosure.

7. The in-ear speaker of any one of claims 1-3, wherein the one or more speakers comprises a single speaker.

8. An in-ear speaker according to any one of claims 1-3, wherein the one or more speakers include a speaker array coupled to a crossover network, the crossover network is coupled to the audio source and is configured to filter the source audio signal from the audio source into multiple frequency signals, and the speaker array includes multiple speakers configured to respectively emit frequency signals among the multiple frequency signals.

9. A method for emitting sound from an in-ear speaker worn by a subject, the method include: generating a source audio signal from an audio source of the in-ear speaker; emitting the sound based on the source audio signal by one or more speakers of the in-ear speakers; receiving the sound by an audio transmission tube of the in-ear speaker, the audio transmission tube having an input end, the input end being coupled to the one or more speakers to receive the sound; reflecting the sound by an audio reflector of the in-ear speaker, the audio reflector being coupled to an output end of the audio transmission tube; as well as capturing the sound by a microphone of the in-ear speaker, the microphone being coupled to the audio reflector; Wherein the microphone is enclosed within the audio reflector, and wherein the audio reflector is configured to reflect the sound outwardly away from the subject's ear.

10. The method of claim 9, wherein the audio reflector is configured to be worn inside the subject's ear.

11. The method of claim 10, wherein the audio reflector comprises an open end and a closed end, the open end pointing away from the ear of the subject, the closed end comprising a rigid surface worn inside the ear of the subject, and the closed end being configured to reflect the sound through the open end and away from the ear of the subject.

12. The method according to any one of claims 9 to 11, further comprising: include: An inner ear of the subject is prevented from receiving the sound by an absorbent material removably coupled to the audio reflector, the absorbent material being configured to be worn inside the inner ear of the subject.

13. The method according to claim 12, further comprising: include: A digital source audio signal is converted into the source audio signal by an audio converter coupled to the audio source.

14. The method of any one of claims 9 to 11, wherein the one or more speakers are surrounded by an enclosure, and each of the one or more speakers is positioned within a speaker funnel inside the enclosure.

15. A method according to any one of claims 9 to 11, wherein the one or more speakers comprises a single speaker.

16. The method according to any one of claims 9 to 11, wherein the one or more speakers include a speaker array coupled to a crossover network, the crossover network is coupled to the audio source and is configured to filter the source audio signal from the audio source into multiple frequency signals, and the speaker array includes multiple speakers configured to respectively emit frequency signals among the multiple frequency signals.

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