A display module and a testing method thereof

Abstract

The present invention discloses a display module and a testing method thereof. The display module includes: a display panel and a bonding component; the display panel includes a bonding impedance testing portion and a first signal line, the bonding component includes a bonding impedance testing line and a first bonding portion, the bonding impedance testing line is electrically connected to the first bonding portion, the first bonding portion is bonded to the bonding impedance testing portion; the first signal line is connected to the bonding impedance testing portion; the bonding impedance testing line is used for testing the bonding impedance between the bonding component and the display panel, and the feedback signal on the first signal line. The present invention achieves the effect of reducing the number of test pads.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and particularly to a display module and a test method thereof. Background Art

[0002] With the development of display technology, higher and higher requirements are imposed on the display effect of display devices, and it is necessary to perform test analysis on the display devices themselves.

[0003] There are many test items for existing display devices, resulting in a large number of test pads, which is not conducive to the small-size design of display devices. Summary of the Invention

[0004] The present invention provides a display module and a test method thereof to reduce the number of test pads.

[0005] In a first aspect, an embodiment of the present invention provides a display module, which includes a display panel and a bonding element;

[0006] The display panel includes a bonding impedance test portion and a first signal line. The bonding element includes a bonding impedance test line and a first bonding portion. The bonding impedance test line is electrically connected to the first bonding portion, and the first bonding portion is bonded to the bonding impedance test portion; the first signal line is connected to the bonding impedance test portion; the bonding impedance test line is used to test the bonding impedance between the bonding element and the display panel and the feedback signal on the first signal line.

[0007] Optionally, the bonding element includes a chip-on-film and a flexible printed circuit board; the bonding impedance test line and the first bonding portion are located on the chip-on-film, and the chip-on-film further includes a second bonding portion. The first bonding portion is electrically connected to the second bonding portion via the bonding impedance test line;

[0008] The flexible printed circuit board includes a third bonding portion and a bonding impedance test point which are electrically connected, and the third bonding portion is bonded to the second bonding portion.

[0009] Optionally, the bonding element further includes a first insulating layer covering the bonding impedance test point.

[0010] The first insulating layer can isolate the first signal line from other parts of the flexible printed circuit board, avoiding a short circuit between the ground wire and the first signal line on the flexible printed circuit board when the display module is powered on and operates normally.

[0011] Optionally, a first pre-conduction structure is provided between the first signal line and the bonding impedance test portion.

[0012] Before testing the feedback signal on the first signal line, the first pre-conduction structure is in an open state. The first pre-conduction structure can insulate the first signal line from the bonding impedance test section, in a non-electrically connected state, thus isolating the electrical connection between the first signal line and other parts of the flexible circuit board, and avoiding a short circuit between the ground wire and the first signal line on the flexible circuit board when the display module is powered on and operates normally. When it is necessary to test the feedback signal on the first signal line, the first pre-conduction structure is changed to a conduction state through a first preset condition, so that the first signal line is electrically connected to the bonding impedance test section, in order to subsequently test the feedback signal on the first signal line.

[0013] Optionally, the display panel includes a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked along the thickness direction of the substrate on one side of the substrate. The first pre-conduction structure includes a first sub-signal line located in the first metal layer and a second sub-signal line located in the second metal layer. The first sub-signal line and the second sub-signal line are stacked and insulated along the thickness direction of the substrate; one of the first sub-signal line and the second sub-signal line is electrically connected to the first signal line; the other of the first sub-signal line and the second sub-signal line is electrically connected to the bonding impedance test section; the first sub-signal line and the second sub-signal line are configured to be able to conduct through a first preset condition.

[0014] The first sub-signal line and the second sub-signal line are insulated by the second insulating layer, so that the second sub-signal line is insulated from the bonding impedance test section, that is, the first pre-conduction structure is in an open state, avoiding a short circuit between the ground wire and the first signal line on the flexible circuit board. Through the action of the first preset condition, the second insulating layer is removed, so that the wire segment connecting the first signal line and the bonding impedance test section contacts and is electrically connected to the first sub-signal line, so that the first signal line is electrically connected to the bonding impedance test section, in order to subsequently test the feedback signal on the first signal line.

[0015] Optionally, the bonding impedance test section includes a first test section and a second test section, the bonding impedance test line includes a first test line and a second test line, and the first bonding section includes a first sub-bonding section and a second sub-bonding section; the first test line is connected to the first sub-bonding section, the first sub-bonding section is bonded to the first test section, the second test line is connected to the second sub-bonding section, and the second sub-bonding section is bonded to the second test section;

[0016] The first signal line is connected to the first test section; the first test line and the second test line are used to test the bonding impedance between the bonding element and the display panel when the first test section and the second test section are of an integral structure; the first test line is used to test the feedback signal on the first signal line when the first test section and the second test section are separated;

[0017] The display panel further includes leads and at least one second signal line; a second pre-conduction structure is provided between the leads and the second test portion, and the second test line is used to test the feedback signal of at least one second signal line through the leads when the first test portion is separated from the second test portion.

[0018] By dividing the bonding impedance test portion into a first test portion and a second test portion, the bonding impedance test line can test the feedback signals of multiple signal lines in the display panel, so as to test more signals.

[0019] Optionally, the display panel further includes a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked on one side of the substrate along the thickness direction of the substrate. The leads are located in the first metal layer;

[0020] The first signal line and the multiple second signal lines are arranged in a first direction, and the mth second signal line is the second signal line farthest from the first signal line; the leads extend in the first direction; where m is a positive integer greater than 1;

[0021] The second signal lines are located in the second metal layer, and a third pre-conduction structure is provided between the leads and the multiple second signal lines;

[0022] Alternatively, the mth second signal line is located in the first metal layer, and the remaining second signal lines are located in the second metal layer. The leads are connected to the mth second signal line, and a third pre-conduction structure is provided between the leads and the remaining second signal lines.

[0023] Optionally, a third pre-conduction structure is formed at the overlapping position of the projections of the leads and the second signal lines on the substrate of the display panel.

[0024] The projections of the leads and the second signal lines on the substrate of the display module overlap, which is convenient for conducting the leads and the second signal lines when the feedback signal of the second signal line needs to be tested.

[0025] Optionally, the first signal line includes a scan signal line or a light emission control signal line, and the second signal line includes a data signal line, a light emission control circuit start signal line, a light emission control circuit clock signal line, a scan circuit clock signal line, or a scan circuit start signal line.

[0026] The bonding impedance test line can test the feedback signals of multiple signal lines in the display panel to ensure that the display panel can display normally.

[0027] In a second aspect, an embodiment of the present invention further provides a test method for a display module. The test method for the display module is used to test any display module in the first aspect. The test method for the display module includes:

[0028] Testing the bonding impedance between the bonding element and the display panel through the bonding impedance test line;

[0029] By binding an impedance test line, a feedback signal on a first signal line of a display panel is tested.

[0030] Optionally, the binding impedance test unit includes a first test unit and a second test unit; the binding impedance test line includes a first test line and a second test line, and the first binding unit includes a first sub-binding unit and a second sub-binding unit; the first test line is connected to the first sub-binding unit, the first sub-binding unit is bound to the first test unit, the second test line is connected to the second sub-binding unit, and the second sub-binding unit is bound to the second test unit; the display panel further includes a lead and at least one second signal line, and the first signal line is connected to the first test unit;

[0031] Testing the feedback signal on the first signal line of the display panel by binding an impedance test line includes: testing the feedback signal of the first signal line through the first test line;

[0032] The test method further includes:

[0033] Connecting the lead and the second test unit through a second pre-conduction structure, and testing the feedback signal of the second signal line through the second test line.

[0034] By dividing the binding impedance test unit into a first test unit and a second test unit, the binding impedance test line can test the feedback signals of multiple signal lines in the display panel, realizing the testing of more signals.

[0035] Optionally, the display panel includes a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked on one side of the substrate along the thickness direction of the substrate, and the lead is located in the first metal layer;

[0036] The first signal line and multiple second signal lines are arranged in a first direction, the lead extends in the first direction, and the (k + 1)-th second signal line is located on the side of the k-th second signal line away from the first signal line; the m-th second signal line is the second signal line farthest from the first signal line; where k is a positive integer greater than zero and less than m;

[0037] Testing the feedback signal of the second signal line through the second test line includes:

[0038] Testing the feedback signal of the (k + 1)-th second signal line through the second test line;

[0039] Cutting off the connection between the lead and the (k + 1)-th second signal line, conducting the connection between the lead and the k-th second signal line, and testing the feedback signal of the k-th second signal line through the second test line.

[0040] By conducting the lead with different second signal lines, the feedback signals of different second signal lines can be tested, so that the feedback signals of multiple second signal lines can be tested.

[0041] Optionally, when a third pre-conduction structure is provided between the lead and the m-th second signal line, before testing the feedback signal of the m-th second signal line through the second test line, it further includes: conducting the connection between the lead and the m-th second signal line.

[0042] Optionally, before testing the feedback signal of the first signal line through the first test line, it further includes:

[0043] Cutting off the connection between the first test part and the second test part, and the connection between the first sub-bonding part and the second sub-bonding part.

[0044] By cutting off the connection between the first test part and the second test part, the first signal line and the second signal line can be tested separately.

[0045] In the present invention, by connecting the first signal line of the display panel to the bonding impedance test part, the bonding impedance line can test the feedback signal of the first signal line, which is convenient for judging whether the feedback signal of the first signal line is consistent with the signal output from the driving chip to the display panel, thereby realizing the monitoring of the first signal line and ensuring the normal display of the display panel. There is no need to set a separate test part (such as a bonding pad or a test pad) on the display panel to connect to the first signal line, and there is no need to set a test part and a test line on the bonding element either, saving the space of the display panel and the bonding element, reducing the number of test pads, reserving space for other tests, and also being beneficial to the small-size design of the display device. The present invention solves the problem that there are many test items in the display device, resulting in a large number of test pads, and achieves the effect of reducing the number of test pads. Description of the Drawings

[0046] Figure 1 is a schematic structural diagram of a display module provided by an embodiment of the present invention;

[0047] Figure 2 is another schematic structural diagram of a display module provided by an embodiment of the present invention;

[0048] Figure 3 is another schematic structural diagram of a display module provided by an embodiment of the present invention;

[0049] Figure 4 is another schematic structural diagram of a display module provided by an embodiment of the present invention;

[0050] Figure 5 is another schematic structural diagram of a display module provided by an embodiment of the present invention;

[0051] Figure 6 is another schematic structural diagram of a display module provided by an embodiment of the present invention;

[0052] Figure 7 It is a flowchart of a method for testing a display module provided by an embodiment of the present invention;

[0053] Figure 8 It is a flowchart of another method for testing a display module provided by an embodiment of the present invention;

[0054] Figure 9 It is a flowchart of another method for testing a display module provided by an embodiment of the present invention;

[0055] Figure 10 It is a flowchart of another method for testing a display module provided by an embodiment of the present invention;

[0056] Figure 11 It is a schematic structural diagram of a display device provided by an embodiment of the present invention. Detailed implementation manners

[0057] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0058] As mentioned in the background art, the existing display device has the problem of a large number of test pads. The applicant has carefully studied and found that the reason for this technical problem is that: there are many test items for the display module, many signals need to be tested, and there are many test pads corresponding to the signal lines.

[0059] Figure 1 It is a schematic structural diagram of a display module provided by an embodiment of the present invention. Refer to Figure 1 , the display module includes: a display panel 100 and a bonding element 200.

[0060] The display panel 100 includes a bonding impedance test portion 101 and a first signal line 102. The bonding element 200 includes a bonding impedance test line 201 and a first bonding portion 202. The bonding impedance test line 201 is electrically connected to the first bonding portion 202, and the first bonding portion 202 is bonded to the bonding impedance test portion 101; the first signal line 102 is connected to the bonding impedance test portion 101. The bonding impedance test line 201 is used to test the bonding impedance between the bonding element 200 and the display panel 100, as well as the feedback signal on the first signal line 102.

[0061] Specifically, the display panel 100 is, for example, an organic light-emitting display panel, a liquid crystal display panel, etc. The display panel 100 can display a picture according to data signals, timing control signals, DC voltage signals, etc. output by the driving chip. To ensure the input of signals such as data signals, timing control signals, and DC voltage signals in the display panel 100, the display panel 100 is bonded to the bonding component 200. The bonding component 200 may include one or more of a chip on film and a driving flexible printed circuit board. Exemplarily, the display panel 100 is bonded to the driving flexible printed circuit board (Driver Flexible Printed Circuit, DFPC) through a chip on film (Chip on Flim, COF), and the driving chip may be bonded to the flexible printed circuit board. The bonding component may be a flexible printed circuit board or a chip on film, etc. The display panel 100 includes a bonding impedance test unit 101. The bonding impedance test unit 101 includes, for example, a bonding impedance test pad (pad). The bonding impedance test line 201 of the bonding component 200 is connected to the bonding impedance test unit 101, so that the bonding impedance test line 201 can test the bonding impedance between the bonding component 200 and the display panel 100, realizing the monitoring of the bonding impedance, and avoiding abnormal bonding impedance from affecting the display effect of the display panel 100.

[0062] The first bonding part 202 and the bonding impedance test unit 101 may be pads (pads). When the first bonding part 202 is bonded to the bonding impedance test unit 101, a bonding impedance will be formed, and the smaller the bonding impedance, the better. The first bonding part 202 and the bonding impedance test unit 101 are bonded and connected through a conductive adhesive (such as an anisotropic conductive adhesive, etc.). By measuring the bonding impedance between the first bonding part 202 and the bonding impedance test unit 101, the bonding situation of other bonding pads between the display panel 100 and the bonding component 200 can be reflected.

[0063] The display panel 100 includes a first signal line 102. The first signal line 102 can be a data signal line connected to the data circuit in the display module, or a scan signal line connected to the scan circuit in the display panel 100, or a light emission control signal line in the light emission control circuit in the display panel 100, or a signal line connected to other circuits in the display panel 100, and no limitation is made here. The first signal line 102 is electrically connected to the bonding impedance test unit 101, so that the first signal line 102 is connected to the bonding impedance test line 201. Through the bonding impedance test line 201, the feedback signal of the first signal line 102 can be obtained, which is convenient for judging whether the feedback signal of the first signal line 102 is consistent with the signal output by the driving chip, so as to realize the monitoring of the first signal line 102 and ensure the normal display of the display panel 100. By electrically connecting the first signal line 102 to the bonding impedance test unit 101, the first signal line 102 is connected to the bonding impedance test line 201, so that there is no need to set a separate test unit on the display panel 100 to connect to the first signal line 102, and there is no need to set a test unit and a test line on the bonding component 200, saving the space of the display panel 100 and the bonding component 200, reducing the number of test pads, and reserving space for other tests.

[0064] The bonding impedance test line 201 can be time-division multiplexed to test the bonding impedance between the bonding component 200 and the display panel 100 (which can include the bonding impedance formed by the bonding of the first bonding part 202 and the bonding impedance test unit 101), and the feedback signal on the first signal line 102. When testing the bonding impedance, the display panel 100 does not need to be powered on, and the bonding impedance can be measured by a multimeter for measuring resistance values, etc., for example, measuring the bonding impedance formed by the bonding of the first bonding part 202 and the bonding impedance test unit 101. After the display panel 100 is powered on, the data signal, timing control signal, etc. output by the driving chip can be transmitted to the display panel 100 through the bonding component 200, and the feedback signal of the first signal line 102 on the display panel 100 can be transmitted to the bonding impedance test line 201 through the bonding impedance test unit 101 and the first bonding part 202 for testing and monitoring.

[0065] The bonding impedance test using the bonding impedance test unit 101 can be carried out before bonding the driving chip, while the test of the first signal line 102 can be carried out after bonding the driving chip. The test of the bonding impedance and the test of the first signal line 102 share a bonding impedance test unit 101, without mutual influence and without causing confusion of the detection signals.

[0066] The technical solution of this embodiment connects the first signal line of the display panel to the binding impedance test unit, enabling the binding impedance line to test the feedback signal of the first signal line, facilitating the determination of whether the feedback signal of the first signal line is consistent with the signal output by the driving chip, thereby realizing the monitoring of the first signal line and ensuring the normal display of the display panel. There is no need to set up a separate test unit on the display panel to connect to the first signal line, nor is there a need to set up a test unit and test line on the binding component, saving the space of the display panel and the binding component, reducing the number of test pads, reserving space for other tests, and also being conducive to the small-size design of the display device. The technical solution of this embodiment solves the problem that there are many test items in the display device, resulting in a large number of test pads, and achieves the effect of reducing the number of test pads.

[0067] Optionally, the binding impedance test line 201 includes a first test line and a second test line electrically connected to the first binding part 202. The binding component may further include binding impedance test points respectively and electrically connected to the first test line and the second test line. The binding impedance test points may be pads. The two test ends of an instrument such as a multimeter for measuring resistance values can be respectively in contact with the binding impedance test points electrically connected to the first test line and the second test line to measure the binding impedance. Other test devices can be in contact with the binding impedance test points electrically connected to the first test line and the second test line to test the feedback signal of the first signal line 102.

[0068] Figure 2 It is a schematic structural diagram of another display module provided by an embodiment of the present invention. Optionally, referring to Figure 2 , the binding component 200 includes a flip chip film 210. The binding impedance test line 201 and the first binding part 202 may be located on the flip chip film 210. The flip chip film 210 may further include a second binding part 211, and the first binding part 202 is electrically connected to the second binding part 211 through the binding impedance test line 201. The flip chip film 210 may further include a substrate, the binding impedance test line 201 and the first binding part 202 are arranged on the substrate, and the second binding part 211 is arranged at one end of the binding impedance test line 201 extending out of the substrate and away from the first binding part 202.

[0069] Optionally, the binding component 200 may further include a flexible circuit board 300. The flexible circuit board 300 may include a third binding part 310 and a binding impedance test point 301 that are electrically connected. The third binding part 310 is bound to the second binding part 211.

[0070] Optionally, there may be multiple second bonding parts 211. Optionally, there may be multiple third bonding parts 310. Optionally, the third bonding parts 310 are bonded to the second bonding parts 211 in a one-to-one correspondence. The bonding impedance test line 201 may include multiple test lines 201. Optionally, the second bonding parts 211 are connected to the test lines 201 in a one-to-one correspondence. There may be multiple bonding impedance test points 301. Optionally, the bonding impedance test points 301 are connected to the third bonding parts 310 in a one-to-one correspondence. Optionally, the bonding impedance test line 201 includes a first test line and a second test line that are electrically connected to both ends of the first bonding part 202. The third bonding parts 310 and the second bonding parts 211 may be pads. The bonding impedance test points 301 may be pads. When the third bonding parts 310 are bonded to the second bonding parts 211, a bonding impedance is formed, and the smaller the bonding impedance, the better. The third bonding parts 310 and the second bonding parts 211 are bonded and connected through a conductive adhesive (such as an anisotropic conductive adhesive, etc.). By measuring the bonding impedance between the first bonding part 202 and the bonding impedance test part 101 (which can reflect the bonding situation between the COF film 210 and the display panel 100), and by measuring the bonding impedance between the third bonding parts 310 and the second bonding parts 211 (which can reflect the bonding situation between the COF film 210 and the flexible circuit board 300), the overall bonding situation between the display panel 100 and the bonding component 200 can be reflected.

[0071] Optionally, the bonding component further includes a first insulating layer 302 covering the bonding impedance test points 301.

[0072] Specifically, there may be multiple bonding impedance test points 301. Refer to Figure 2 , the flexible circuit board 300 includes two bonding impedance test points 301, and the bonding impedance of the bonding component 200 can be tested. The bonding impedance test points 301 are connected to the bonding impedance test line 201, so that the flexible circuit board 300 can obtain the bonding impedance and the feedback signal of the first signal line 102 through the bonding impedance test line 201, which is convenient for analyzing the bonding impedance and the feedback signal of the first signal line 102. A first insulating layer 302 is provided on the bonding impedance test points 301. The first insulating layer 302 covers the bonding impedance test points 301, which can isolate the connection between the first signal line 102 and other parts of the flexible circuit board 300 (such as an electromagnetic shielding layer that can be grounded, and the electromagnetic shielding layer wraps the flexible circuit board), and avoid a short circuit between the ground wire or other signal lines on the flexible circuit board 300 and the first signal line 102 when the display module is powered on. When it is necessary to test the feedback signal of the first signal line 102, the first insulating layer 302 can be removed.

[0073] Optionally, the first insulating layer 302 includes insulating ink or insulating tape. When testing the feedback signal of the first signal line 102, the insulating ink can be scraped off or the insulating tape can be torn off. The area of the insulating ink is small, which can avoid insulating other positions of the flexible circuit board 300; the insulating tape is convenient for pasting and tearing off.

[0074] Figure 3 It is a schematic structural diagram of another display module provided by an embodiment of the present invention. Optionally, refer to Figure 3 , the flexible circuit board 300 includes four bonding impedance test points, and the bonding impedance between the bonding element 200 and the display panel can be tested. The current path between the first bonding impedance test point 301-1 and the second bonding impedance test point 301-2 passes through the third bonding portion 310, the second bonding portion 211, the first bonding portion 202 and the bonding impedance test portion 101, and the bonding impedance formed by the first bonding portion 202 and the bonding impedance test portion 101 can be measured, as well as the total impedance in series of the bonding impedance formed by the third bonding portion 310 and the second bonding portion 211; the current path between the third bonding impedance test point 301-3 and the fourth bonding impedance test point 301-4 passes through the third bonding portion 310 and the second bonding portion 211, and the bonding impedance formed by the third bonding portion 310 and the second bonding portion 211 can be measured. The FOF bonding position is the bonding position between the flexible circuit board 300 and the flip chip film 210, and the bonding impedance of the FOF bonding position can be tested. The first bonding impedance test point 301-1, the second bonding impedance test point 301-2, the third bonding impedance test point 301-3 and the fourth bonding impedance test point 301-4 are all connected to the bonding impedance test portion 101 via the bonding impedance test line 201, and any bonding impedance test line 201 can test the feedback signal of the first signal line 102.

[0075] Exemplarily, the two test terminals of an instrument such as a multimeter (set to the resistance range) can be respectively contacted with the first bonding impedance test point 301-1 and the second bonding impedance test point 301-2 to realize the test of the total impedance in series of the bonding impedance between the flip chip film 210 and the display panel 100 and the bonding impedance between the flip chip film 210 and the flexible circuit board 300.

[0076] Optionally, the bonding impedance test line 201 further includes a third test line connected to the third bonding impedance test point 301-3 and a fourth test line connected to the fourth bonding impedance test point 301-4. The third test line and the fourth test line can be electrically connected to the second test line, and the lengths of the third test line and the fourth test line are less than the length of the second test line. The two test terminals of an instrument such as a multimeter (set to the resistance range) can be respectively contacted with two of the second bonding impedance test point 3012, the third bonding impedance test point 3013 and the fourth bonding impedance test point 3014 to realize the test of the bonding impedance between the flip chip film 210 and the flexible circuit board 300.

[0077] Figure 4 This is another schematic structural diagram of a display module provided by an embodiment of the present invention. Optionally, referring to Figure 4 , a first pre-conduction structure B0 is provided between the first signal line 102 and the bonding impedance test unit 101. The first pre-conduction structure can be conducted through a first preset condition. For example, it can be laser-conducted, that is, the connection between the first signal line 102 and the bonding impedance test unit 101 is opened by laser.

[0078] The display panel 100 includes a substrate, and a first metal layer 103, a second insulating layer 104, and a second metal layer 105 that are sequentially stacked on one side of the substrate along the thickness direction of the substrate.

[0079] Optionally, the first pre-conduction structure includes a first sub-signal line 1021 located in the first metal layer 103 and a second sub-signal line 1022 located in the second metal layer 105. The first sub-signal line 1021 and the second sub-signal line 1022 are stacked and insulated along the thickness direction of the substrate. As shown in position B0, one of the first sub-signal line 1021 and the second sub-signal line 1022 is electrically connected to the first signal line 102; the other of the first sub-signal line 1021 and the second sub-signal line 1022 is electrically connected to the bonding impedance test unit 101; the first sub-signal line 1021 and the second sub-signal line 1022 are configured to be able to be conducted through a first preset condition, so that the first pre-conduction structure changes the connection between the first signal line 102 and the bonding impedance test unit 101 from disconnected to conducted.

[0080] Exemplarily, the first signal line 102 is located in the second metal layer 105; the first signal line 102 is electrically connected to the first sub-signal line 1021 through a via hole. At least a part of the bonding impedance test unit 101 can be located in the first metal layer 103 and / or the second metal layer 105.

[0081] Specifically, the bonding impedance test unit 101 can be connected to the inside of the display panel 100 through the first sub-signal line 1021 and the second sub-signal line 1022 to obtain the signals inside the display panel 100. At the overlapping position B0, the first sub-signal line 1021 is located on the first metal layer 103, and the second sub-signal line 1022 is located on the second metal layer 105. The first sub-signal line 1021 and the second sub-signal line 1022 are insulated from each other by the second insulating layer 104, so that the second sub-signal line 1022 and the bonding impedance test unit 101 are insulated from each other, which can further prevent the ground wire or other signal lines on the flexible circuit board 300 from forming a short circuit with the first signal line 102. When the connection between the bonding impedance test unit 101 and the inside of the display panel 100 is disconnected, when it is necessary to test the feedback signal of the first signal line 102, the first sub-signal line 1021 and the second sub-signal line 1022 can be conducted through a first preset condition, and the bonding impedance test unit 101 can be connected to the inside of the display panel 100, so that the bonding impedance test unit 101 can obtain the feedback signal of the first signal line 102.

[0082] It should be noted that, referring to Figure 4 , at the position B0, the width of the first sub-signal line 1021 drawn is larger, only to represent the positional relationship between the first sub-signal line 1021 and the second sub-signal line 1022, and does not limit the widths of the first sub-signal line 1021 and the second sub-signal line 1022.

[0083] It should be noted that when the second insulating layer 104 is provided, the first insulating layer 302 can be provided, or the first insulating layer 302 can be not provided. Figure 4 Only the case where both the first insulating layer 302 and the second insulating layer 104 are provided is shown in

[0084] Optionally, the first preset condition is, for example, laser conduction. By means of laser ablation, part of the second insulating layer 104 is removed, so that part of the first sub-signal line 1021 is exposed, and the first sub-signal line 1021 and the second sub-signal line 1022 can be in contact conduction, so that the bonding impedance test unit 101 and the first signal line 102 are conducted.

[0085] Figure 5 is a schematic structural diagram of another display module provided by an embodiment of the present invention. Optionally, referring to Figure 4 or Figure 5 , the display panel 100 further includes one or more second signal lines 106. The second signal line 106 can be connected to the bonding impedance test unit 101. The bonding impedance test line 201 can also be reused to test the feedback signal on the second signal line 106.

[0086] Optionally, the display panel 100 further includes a lead wire 107. The lead wire 107 is connected to the bonding impedance test unit 101. A second pre-conduction structure (such as at position B1) may be provided between the lead wire 107 and the bonding impedance test unit 101. The second pre-conduction structure is the same as or similar to the first pre-conduction structure, with the difference being that one of the first sub-signal wire and the second sub-signal wire in the second pre-conduction structure is electrically connected to the lead wire 107; the other of the first sub-signal wire and the second sub-signal wire is electrically connected to the bonding impedance test unit 101. Before testing the feedback signal of the second signal wire 102, the second pre-conduction structure is in an open state. When it is necessary to test the feedback signal of the second signal wire 102, the second pre-conduction structure becomes conductive. The second pre-conduction structure can be made conductive through a second preset condition, for example, it can be laser conduction.

[0087] Optionally, a third pre-conduction structure may be provided between the lead wire 107 and the second signal wire 102. Before testing the feedback signal of the corresponding second signal wire 102, the corresponding third pre-conduction structure is in an open state. When it is necessary to test the feedback signal of the corresponding second signal wire 102, the corresponding third pre-conduction structure (such as at position B2) becomes conductive. Each time, only one of the second signal wires 102 is made conductive to the lead wire 107 through the corresponding third pre-conduction structure to test the feedback signal of this second signal wire 102. After testing the feedback signal of this second signal wire 102, a cut-off point (such as at position B3) is set on the lead wire 107 to disconnect the tested second signal wire 102 from the lead wire 107. Then, the third pre-conduction structure corresponding to another untested second signal wire 102 (such as at position B4) is changed from the off state to the conductive state with the lead wire 107 to test the feedback signal of this second signal wire 102. This cycle continues until all the second signal wires are tested. The third pre-conduction structure is the same as or similar to the first pre-conduction structure, with the difference being that one of the first sub-signal wire and the second sub-signal wire in the third pre-conduction structure is electrically connected to the lead wire 107; the other of the first sub-signal wire and the second sub-signal wire is electrically connected to the corresponding second signal wire. A third pre-conduction structure may or may not be provided between the first tested second signal wire 102 and the lead wire 107, and they can be directly connected. The third pre-conduction structure can be made conductive through a third preset condition, for example, it can be laser conduction. Cut-off points may be provided on that part of the lead wire 107 between the second signal wires 106 adjacent in position, and can be cut off by laser, for example, laser cutting. The cut-off points can all be set on the lead wire 107.

[0088] Optionally, the bonding impedance test unit 101 includes a first test unit 1011 and a second test unit 1012.

[0089] Optionally, the bonding impedance test line includes a first test line 201-1 and a second test line 201-2.

[0090] Optionally, the first binding part 202 includes a first sub-binding part 2021 and a second sub-binding part 2022.

[0091] Optionally, the first test line 201-1 is connected to the first sub-binding part 2021, the first sub-binding part 2021 is bound to the first test part 1011, the second test line 201-2 is connected to the second sub-binding part 2022, and the second sub-binding part 2022 is bound to the second test part 1012.

[0092] Optionally, when testing the binding impedance between the test binding element 200 and the display panel 100, the first test part 1011 and the second test part 1012 are of an integral structure, and the first sub-binding part 2021 and the second sub-binding part 2022 are of an integral structure. Optionally, when testing the feedback signal on the first signal line 102, the binding impedance test part 101 and the first binding part 202 can be disconnected so that the first test part 1011 is separated from the second test part 1012, and the first sub-binding part 2021 is separated from the second sub-binding part 2022.

[0093] Optionally, a first pre-conduction structure can be provided between the first test part 1011 and the first signal line 102.

[0094] Optionally, the display panel 100 further includes one or more second signal lines 106. Optionally, the first signal line 102 is connected to the first test part 1011. The second signal line 106 can be connected to the second test part 1012.

[0095] Optionally, the first test line 201-1 and the second test line 201-2 are used to test the binding impedance between the test binding element 200 and the display panel 100 when the first test part 1011 and the second test part 1012 are of an integral structure.

[0096] Optionally, the first test line 201-1 is used to test the feedback signal on the first signal line 102 when the first test part 1011 is separated from the second test part 1012.

[0097] Optionally, the second test line 201-2 is used to test the feedback signal of at least one second signal line 106 through the lead 107 when the first test part 1011 is separated from the second test part 1012.

[0098] Optionally, a second pre-conduction structure is provided between the lead 107 and the second test part 101. The lead 107 and the second test part 1012 are conducted through a second preset condition, which can be laser conduction for example. Optionally, the second test line 201-2 is used to test the feedback signals of multiple second signal lines 106 through the lead 107 when the first test part 1011 and the second test part 1012 are separated. Specifically, the display panel 100 includes multiple second signal lines 106. The second signal line 106 is, for example, a data signal line connected to the data circuit of the display panel 100, or a scan signal line connected to the scan circuit in the display panel 100, or a signal line in other circuits of the display panel 100, which is not limited here.

[0099] The bonding impedance test part 101 includes, for example, a first test part 1011 and a second test part 1012. The first signal line 102 is electrically connected to the first test part 1011, so that the bonding impedance test line 201 can obtain the feedback signal of the first signal line 102 through the first test part 1011. The lead 107 is connected to the second test part 1012. When it is necessary to test the second signal line 106, the lead 107 and the second test part 1012 can be conducted through a second preset condition, and the lead 107 and the second signal line 106 can be conducted through a third preset condition, so that the second test part 1012 is connected to the second signal line 106, and the second test line 201-2 can test the feedback signal of the second signal line 106 through the second test part 1012, facilitating the monitoring of the feedback signal of the second signal line 106 to ensure that the display panel 100 can display normally.

[0100] Optionally, the second preset condition is, for example, laser conduction. The lead 107 and the second test part 1012 are conducted through a laser laser method, and the lead 107 and the second signal line 106 are conducted, so that the second test part 1012 and the second signal line 106 are conducted, and the second test line 201-2 can test the feedback signal of the second signal line 106 through the second test part 1012.

[0101] After testing the bonding impedance between the bonding component 200 and the display panel 100, the bonded bonding impedance test part 101 and the first bonding part 202 are cut off (which can be laser laser cutting for example), forming the first test part 1011 and the second test part 1012, as well as the first sub-bonding part 2021 and the second sub-bonding part 2022, so as to separately test the feedback signals of the first signal line 102 and the second signal line 106 simultaneously to improve the test efficiency.

[0102] If, after testing the bonding impedance between the bonding component 200 and the display panel 100, the bonding impedance test unit 101 and the first bonding unit 202 of the bonding are not cut off, it is necessary to separately connect and conduct the first signal line 102 and the second signal line 106 to the bonding impedance test unit 101 one by one through corresponding preset conditions, and separately test the feedback signals of the first signal line 102 and the second signal line 106. Each time, only one of the signal lines is conducted to the bonding impedance test unit 101 through the corresponding pre-conduction structure to test the feedback signal of this signal line. After testing the feedback signal of this signal line, a cut-off point is set to disconnect the tested signal line from the bonding impedance test unit 101, and then the pre-conduction structure corresponding to the other untested signal line is changed from the off state to the on state to the bonding impedance test unit 101 to test the feedback signal of this signal line. This cycle continues until all signal lines are tested.

[0103] Optionally, referring to Figure 5 , the display panel 100 includes a substrate, and a first metal layer 103, a second insulating layer 104, and a second metal layer 105 that are sequentially stacked on one side of the substrate along the thickness direction of the substrate.

[0104] Optionally, the lead 107 is located in the first metal layer 103. Optionally, the first signal line 102 and the plurality of second signal lines 106 are arranged along the first direction X. Optionally, the m-th second signal line 106 can be the first second signal line 106 to be tested. Optionally, the m-th second signal line 106 is the second signal line 106 farthest from the bonding impedance test unit 101.

[0105] Optionally, the m-th second signal line 106 is the second signal line 106 farthest from the first signal line. Optionally, the lead 107 extends along the first direction X. Wherein, m is a positive integer greater than 1.

[0106] Referring to Figure 5 , optionally, the second signal line 106 is located in the second metal layer 105. Optionally, a third pre-conduction structure (such as at positions B2 and B4) is provided between the lead 107 and the second signal line 106, and it is changed from the off state to the on state through a third preset condition, for example, it can be laser conduction.

[0107] Figure 6 It is a schematic structural diagram of another display module provided by an embodiment of the present invention. Optionally, referring to Figure 6, the m-th second signal line 106 is located in the first metal layer 103, and the remaining second signal lines 106 are located in the second metal layer 105. The lead 107 is connected to the m-th second signal line 106, that is, a third pre-conduction structure may not be provided between the lead 107 and the m-th second signal line 106. Optionally, a third pre-conduction structure is provided between the lead 107 and the remaining second signal lines 106 and is conducted through a third preset condition. Optionally, the lead 107 and the remaining second signal lines 106 overlap in the orthographic projection on the substrate of the display panel, and a third pre-conduction structure is formed at the overlapping position. Optionally, a third pre-conduction structure is formed at the overlapping position of the orthographic projection of the lead 107 and the second signal line 106 on the substrate of the display panel. Before the third pre-conduction structure is conducted, an insulating layer exists at the overlapping position of the lead 107 and the second signal line 106, and after the third pre-conduction structure is conducted, the overlapping position of the lead 107 and the second signal line 106 is connected.

[0108] The first pre-conduction structure, the second pre-conduction structure, and the third pre-conduction structure have the same or similar structures and can be changed from the off state to the on state by laser welding the wire to test the feedback signals of the first signal line 102 and the second signal line 106. Figure 4 and Figure 5 Exemplarily, the states of the first pre-conduction structure, the second pre-conduction structure, and the third pre-conduction structure before laser conduction are drawn, and the state before the cut-off point of the lead is cut by laser is drawn.

[0109] Specifically, referring to Figure 5 , the lead 107 is located in the first metal layer 103, and the bonding impedance test portion 101 is located in the first metal layer 103, so that the lead 107 and the bonding impedance test portion 101 can be connected. The second signal line 106 is located in the second metal layer 105, and the lead 107 and the second signal line 106 are insulated by the second insulating layer 104. The lead 107 and the second signal line 106 overlap in the orthographic projection on the substrate of the display panel, and a third pre-conduction structure is formed at the overlapping position, facilitating individually conducting the lead 107 and the second signal line 106 one by one when it is necessary to test the feedback signal of the second signal line 106 and individually testing the feedback signal of the second signal line 106 one by one.

[0110] Optionally, referring to Figure 6, the m-th second signal line 106 is located on the first metal layer 103, and the remaining second signal lines 106 are located on the second metal layer 105, such that the m-th second signal line 106 is directly connected to the lead 107 without being conducted through a third preset condition. The feedback signal of the m-th second signal line 106 can be tested first, and then the connection between the m-th second signal line 106 and the lead 107 is cut off, for example, a cut-off point is formed at position B5, and then the lead 107 and the remaining second signal lines 106 are conducted individually one by one through a third preset condition (such as at positions B6 and B8), and the feedback signals of the remaining second signal lines 106 are tested individually one by one.

[0111] Optionally, the first signal line 102 includes a scan signal line or a light emission control signal line, and the second signal line 106 includes a data signal line, a light emission control circuit start signal line, a light emission control circuit clock signal line, a scan circuit clock signal line, or a scan circuit start signal line.

[0112] Specifically, the first signal line 102 includes, for example, a scan signal line electrically connected to the scan circuit of the display panel 100 or a light emission control signal line electrically connected to the light emission control circuit. The bonding impedance test line 201 can test the feedback signal of the scan signal line or the light emission control signal line, and monitor the feedback signal of the scan signal line or the light emission control signal line to ensure that the display panel 100 can display normally. In some other embodiments, the first signal line 102 can also be other signal lines in the display panel 100, which is not limited herein. The second signal line 106 includes, for example, a data signal line electrically connected to the data circuit, a light emission control circuit start signal line (which can be an EIN signal line), a light emission control circuit clock signal line, a scan circuit clock signal line, a scan circuit start signal line (which can be a SIN signal line), a multiplexer signal line (which can be a MUX signal line). The bonding impedance test line 201 can test the feedback signals of multiple signal lines in the display panel 100 to ensure that the display panel 100 can display normally. In some other embodiments, the second signal line 106 can also be other signal lines in the display panel 100, which is not limited herein.

[0113] The scanning circuit may include a plurality of cascaded first shift registers, which are configured to sequentially output a scanning signal (Scan) to corresponding scanning signal lines under the action of a clock signal, a start signal SIN, a DC voltage signal, etc. received from a driving chip. The light emission control circuit may include a plurality of cascaded second shift registers, which are configured to sequentially output a light emission control signal (EM) to corresponding light emission control signal lines under the action of a clock signal, a start signal EIN, a DC voltage signal, etc. received from the driving chip. Optionally, the first signal line 102 may include: a scanning signal line connected to the last-stage first shift register in the scanning circuit, or a light emission control signal line connected to the last-stage second shift register in the light emission control circuit, etc.

[0114] Figure 7 It is a flowchart of a method for testing a display module provided by an embodiment of the present invention. The method for testing a display module is used to test the display module provided by any of the above embodiments. Refer to Figure 7 , the method for testing a display module includes:

[0115] S610. Test the bonding impedance between the bonding element and the display panel by binding an impedance test line.

[0116] Specifically, refer to Figure 1 , the display panel 100 includes a bonding impedance test portion 101. The bonding impedance test portion 101 includes, for example, a bonding impedance test pad. The first bonding portion 202 of the bonding element 200 is bonded to the bonding impedance test portion 101, so that the bonding impedance test line 201 can test the bonding impedance between the bonding element 200 and the display panel 100, realizing the monitoring of the bonding impedance, and avoiding abnormal bonding impedance from affecting the display effect of the display panel 100.

[0117] S620. Test the feedback signal on the first signal line of the display panel by binding an impedance test line.

[0118] Specifically, the display panel 100 includes a first signal line 102. The first signal line 102 can be a data signal line of the display panel 100, a scanning signal line, a light emission control signal line, or other signal lines in the display panel 100, which is not limited herein. The first signal line 102 is electrically connected to the bonding impedance test unit 101, so that the first signal line 102 is connected to the bonding impedance test line 201. The feedback signal of the first signal line 102 can be obtained through the bonding impedance test line 201, which is convenient for judging whether the feedback signal of the first signal line 102 is consistent with the signal sent by the driving chip, thereby realizing the monitoring of the first signal line 102 and ensuring the normal display of the display panel 100. By electrically connecting the first signal line 102 to the bonding impedance test unit 101, the first signal line 102 is connected to the bonding impedance test line 201, so that there is no need to set a separate test unit on the display panel 100 to connect to the first signal line, and there is no need to set a test unit and a test line on the bonding element 200 either, saving the space of the display panel 100 and the bonding element 200, reducing the number of test pads, and reserving space for other tests.

[0119] The technical solution of this embodiment connects the first signal line of the display panel to the bonding impedance test unit, so that the bonding impedance line can test the feedback signal of the first signal line, which is convenient for judging whether the feedback signal of the first signal line is consistent with the signal output by the driving chip to the display panel, thereby realizing the monitoring of the first signal line and ensuring the normal display of the display panel. There is no need to set a separate test unit on the display panel to connect to the first signal line, and there is no need to set a test unit and a test line on the bonding element either, saving the space of the display panel and the bonding element, reducing the number of test pads, reserving space for other tests, and also facilitating the small-size design of the display device. The technical solution of this embodiment solves the problem that there are many test items in the display device, resulting in a large number of test pads, and achieves the effect of reducing the number of test pads.

[0120] Optionally, the display panel 100 further includes at least one second signal line 106. Optionally, the display panel 100 further includes a lead 107.

[0121] Optionally, the test method for the display module further includes: testing the feedback signal on the second signal line 106 of the display panel by binding an impedance test line. If the binding impedance test unit 101 is not cut into multiple parts after the binding impedance is tested, it is necessary to separately connect and conduct the first signal line 102 and the second signal line 106 to the binding impedance test unit 101 one by one, so as to separately test the feedback signals of the first signal line 102 and the second signal line 106 one by one. The binding impedance test unit 101 can only be connected and conducted with one signal line at the same time. The binding impedance test unit 101 cannot be connected and conducted with multiple signal lines at the same time, and cannot test the feedback signals of multiple signal lines at the same time. By means of laser wire bonding or the like, the first pre-conduction structure, the second pre-conduction structure and the second pre-conduction structure at the corresponding positions are changed from the off state to the on state, and by means of laser cutting or the like, cut-off points are formed at the corresponding positions such as leads, so as to separately connect and conduct the first signal line 102 and the second signal line 106 to the binding impedance test unit 101 one by one, and further separately test the feedback signals of the first signal line 102 and the second signal line 106.

[0122] Optionally, continue to refer to Figure 5 , the binding impedance test unit 101 includes a first test unit 1011 and a second test unit 1012, and the binding impedance test line 201 includes a first test line 201-1 and a second test line 201-2. The first binding part 202 includes a first sub-binding part 2021 and a second sub-binding part 2022. The first test line 201-1 is connected to the first sub-binding part 2021. The first sub-binding part 2021 is bound to the first test unit 1011. The second test line 201-2 is connected to the second sub-binding part 2022. The second sub-binding part 2022 is bound to the second test unit 1012. The first signal line 102 is electrically connected to the first test unit 1011.

[0123] If the bound binding impedance test unit 101 and the first binding part 202 are cut off after the binding impedance is tested, forming the first test unit 1011 and the second test unit 1012, as well as the first sub-binding part 2021 and the second sub-binding part 2022, it is convenient to separately and synchronously test the first signal line 102 and the second signal line 106.

[0124] Figure 8 is a flowchart of another test method for the display module provided by the embodiment of the present invention. Optionally, refer to Figure 8 , the test method for the display module includes:

[0125] S710. Test the binding impedance between the binding element and the display panel through the binding impedance test line.

[0126] Among them, the bonding impedance between the bonding element and the display panel can be tested through the first test line 201-1 and the second test line 201-2. Optionally, when the first test unit 1011 and the second test unit 1012 are of an integrated structure, the bonding impedance between the bonding element and the display panel is tested through the first test line 201-1 and the second test line 201-2. After testing the bonding impedance, the bonding impedance test unit 101 and the first bonding unit 202 are cut off to form the first test unit 1011 and the second test unit 1012, as well as the first sub-bonding unit 2021 and the second sub-bonding unit 2022.

[0127] S720. Test the feedback signal of the first signal line through the first test line.

[0128] Specifically, referring to Figure 5 , the bonding impedance test unit 101 includes, for example, a first test unit 1011 and a second test unit 1012. The first test line 201-1 is connected to the first sub-bonding unit 2021, and the first sub-bonding unit 2021 is bonded to the first test unit 1011, so that the first test line 201-1 can obtain the feedback signal of the first signal line 102 through the first test unit 1011. The feedback signal of the second signal line 106 can be tested through the second test line 201-2.

[0129] S730. Conduct the lead and the second test unit through the second pre-conduction structure, and test the feedback signal of the second signal line through the second test line.

[0130] Specifically, referring to Figure 5 , the display panel 100 further includes a plurality of second signal lines 106. The second signal lines 106 are, for example, data signal lines of the display panel 100, or can be scan signal lines in the display panel 100, or other signal lines in the display panel 100, which are not limited herein. The lead 107 is connected to the bonding impedance test unit 101. When the second signal line 106 needs to be tested, the lead 107 is conducted with the second test unit 1012, and the lead 107 and the second signal line 106 can be conducted through a third preset condition, so that the second test unit 1012 is connected to the second signal line 106, and the second test line 201-2 can test the feedback signal of the second signal line 106 through the second test unit 1012, facilitating the monitoring of the feedback signal of the second signal line 106 to ensure that the display panel 100 can display normally.

[0131] In the technical solution of this embodiment, by dividing the bonding impedance test unit into a first test unit and a second test unit, the first test line can test the feedback signal of the first signal line, and the second test line can test the feedback signal of the second signal line, so that the bonding impedance test line can test the feedback signals of multiple signal lines in the display panel, realizing the testing of more signals.

[0132] Based on the above technical solution, optionally, before S720, testing the feedback signal of the first signal line through the first test line, the following steps are further included:

[0133] Step a: Cut off the connection between the first test unit 1011 and the second test unit 1012, and the connection between the first sub-bonding unit and the second sub-bonding unit.

[0134] Exemplarily, the bonding impedance test unit 101 can be cut off by means of laser ablation, so as to cut off the connection between the first test unit 1011 and the second test unit 1012, so that the signals tested by the first test unit 1011 and the second test unit 1012 do not interfere with each other, and the first signal line 102 and the second signal line 106 can be tested separately.

[0135] Specifically, the first bonding part 202 can be cut off by means of laser ablation, so as to cut off the connection between the first sub-bonding part and the second sub-bonding part, so that the first test line 201-1 is connected to the first test unit 1011 through the first sub-bonding part, and the second test line 201-2 is connected to the second test unit 1012 through the second sub-bonding part. The feedback signals of different signal lines can be tested through the first test unit 1011 and the second test unit 1012 respectively, further saving the space of the display panel and the bonding components.

[0136] Optionally, continue to refer to Figure 5 , the display panel 100 includes a first metal layer 103, a second insulating layer 104, and a second metal layer 105 stacked in sequence. Optionally, the lead 107 is located on the first metal layer 103. Optionally, the lead 107 overlaps with the projection of the second signal line 106 on the substrate of the display module.

[0137] Optionally, the first signal line 102 and a plurality of second signal lines 106 are arranged along the first direction X. Optionally, the lead 107 extends along the first direction X. Optionally, the (k + 1)-th second signal line 106 is located on the side of the k-th second signal line 106 away from the bonding impedance test unit 101. Optionally, the (k + 1)-th second signal line 106 is located on the side of the k-th second signal line 106 away from the first signal line 102. Optionally, the m-th second signal line 106 is the second signal line 106 farthest from the first signal line 102. Wherein, k can be a positive integer greater than zero and less than m - 1.

[0138] Figure 9 is a flowchart of another test method for a display module provided by an embodiment of the present invention. Optionally, refer to Figure 9 , the test method for the display module includes:

[0139] S810. Test the bonding impedance between the bonding component and the display panel by binding the impedance test line.

[0140] S820. Test the feedback signal of the first signal line through the first test line.

[0141] S830. Conduct the lead and the second test part through the second pre-conduction structure.

[0142] S840. Test the feedback signal of the (k + 1)-th second signal line through the second test line.

[0143] Specifically, referring to Figure 5 , conduct the lead 107 and the second test part 1012 through the second preset condition. If there is a third pre-conduction structure between the lead 107 and the (k + 1)-th second signal line 106, then conduct the lead 107 and the (k + 1)-th second signal line 106, that is, first conduct the second signal line 106 far from the first signal line 102, so that the second test part 1012 is connected to the (k + 1)-th second signal line 106, and the second test line 201-2 can test the feedback signal of the (k + 1)-th second signal line 106. If there is no third pre-conduction structure between the lead 107 and the (k + 1)-th second signal line 106 (for example, when k + 1 = m), then directly test the feedback signal of the (k + 1)-th second signal line 106. Figure 5 only shows the case where the display panel 100 includes two second signal lines 106, but it is not limited.

[0144] Exemplarily, referring to Figure 5 , conduct the lead 107 and the second test part 1012, and can be conducted by laser at the metal staggered layer position B1 (equivalent to the second pre-conduction structure). When conducting the lead 107 and the (k + 1)-th second signal line 106, for example, it is the metal staggered layer position B2 (equivalent to the third pre-conduction structure) between the (k + 1)-th second signal line 106 and the lead 107, and conduct the lead 107 and the (k + 1)-th second signal line 106 by laser.

[0145] S850. Cut off the connection between the lead and the (k + 1)-th second signal line, conduct the connection between the lead and the k-th second signal line, and test the feedback signal of the k-th second signal line through the second test line.

[0146] Specifically, referring to Figure 5, cut off the connection between the lead 107 and the (k + 1)-th second signal line 106, for example, at position B3 between the (k + 1)-th second signal line 106 and the k-th second signal line 106, and cut off the connection between the lead 107 and the (k + 1)-th second signal line 106 (equivalent to setting a cut-off point at position B3), then conduct the connection between the lead 107 and the k-th second signal line 106 (that is, the lead 107 and the k-th second signal line 106 are conducted through the third pre-conduction structure, such as laser conduction of the third pre-conduction structure at position B4), so that the second test part 1012 is connected to the k-th second signal line 106, and the second test line 201-2 can test the feedback signal of the k-th second signal line 106, thereby the feedback signals of multiple second signal lines 106 can be tested.

[0147] Exemplarily, refer to Figure 5 , when conducting the lead 107 and the k-th second signal line 106, it can be conducted by laser at the metal staggered layer position B4 (equivalent to the third pre-conduction structure). Since the metal staggered layer position B1 (equivalent to the second pre-conduction structure) has been conducted, conducting the metal staggered layer position B4 can conduct the lead 107 and the k-th second signal line 106. The metal staggered layer position B4 is the overlapping part of the lead 107 and the k-th second signal line 106.

[0148] The technical solution of this embodiment first conducts the lead and the (k + 1)-th second signal line, that is, first conducts the second signal line far from the first signal line, so that the binding impedance test line corresponding to the second test part can test the feedback signal of the (k + 1)-th second signal line. Then set a cut-off point at the part of the lead at the position between the (k + 1)-th second signal line and the k-th second signal line, that is, cut off the connection between the lead and the (k + 1)-th second signal line, conduct the connection between the lead and the k-th second signal line, and connect the second test part to the k-th second signal line, so that the binding impedance test line corresponding to the second test part can test the feedback signal of the k-th second signal line, thereby the feedback signals of multiple second signal lines can be tested.

[0149] Optionally, when there is a third pre-conduction structure between the lead and the m-th second signal line, before testing the feedback signal of the m-th second signal line through the second test line, it further includes: conducting the connection between the lead and the m-th second signal line.

[0150] Figure 10 is a flowchart of another test method for a display module provided by an embodiment of the present invention. Optionally, refer to Figure 10 , the test method for the display module includes:

[0151] S910. Test the binding impedance between the binding element and the display panel through the binding impedance test line.

[0152] S920. Test the feedback signal of the first signal line through the first test line.

[0153] S930. Conduct the lead and the second test section through the second pre-conduction structure, and test the feedback signal of the m-th second signal line through the second test line.

[0154] Specifically, referring to Figure 6 , the m-th second signal line 106 is located in the first metal layer 103, and the remaining second signal lines 106 are located in the second metal layer 105, so that the m-th second signal line 106 is directly connected to the lead 107 without being conducted through the third preset condition. The feedback signal of the m-th second signal line 106 can be tested first, then the connection between the m-th second signal line 106 and the lead 107 is cut off, and then the lead 107 and the remaining second signal lines 106 are conducted through the third preset condition to test the feedback signals of the remaining second signal lines 106.

[0155] S940. Cut off the connection between the lead and the m-th second signal line, conduct the connection between the lead and the (m - i)-th second signal line, and test the feedback signal of the (m - i)-th second signal line through the second test line; where i is a positive integer greater than zero and less than m - 2.

[0156] Specifically, referring to Figure 6 , cut off the connection between the lead 107 and the m-th second signal line 106, for example, at position B5 between the m-th second signal line 106 and the (m - i)-th second signal line 106, and cut off the connection between the lead 107 and the m-th second signal line 106 (equivalent to setting a cut-off point at position B5); then conduct the connection between the lead 107 and the (m - i)-th second signal line 106, for example, at the metal staggered layer position B6 (equivalent to the third pre-conduction structure), and conduct the connection between the lead 107 and the (m - i)-th second signal line 106, so that the second test section 1012 is connected to the (m - i)-th second signal line 106, and the second test line 201-2 can test the feedback signal of the (m - i)-th second signal line 106, thereby testing the feedback signals of multiple second signal lines 106.

[0157] S950. Cut off the connection between the lead and the (m - i)-th second signal line, conduct the connection between the lead and the (m - i - 1)-th second signal line, and test the feedback signal of the (m - i - 1)-th second signal line through the second test line.

[0158] Specifically, referring to Figure 6, cut off the connection between the lead wire 107 and the (m - i)-th second signal line 106, for example, at position B7 between the (m - i)-th second signal line 106 and the (m - i - 1)-th second signal line 106, and cut off the connection between the lead wire 107 and the (m - i)-th second signal line 106 (equivalent to setting a cut-off point at B7); then conduct the connection between the lead wire 107 and the (m - i - 1)-th second signal line 106, for example, at the metal staggered layer position B8 (equivalent to the third pre-conduction structure), and conduct the connection between the lead wire 107 and the (m - i - 1)-th second signal line 106, so that the second test part 1012 is connected to the (m - i - 1)-th second signal line 106, and the second test line 201-2 can test the feedback signal of the (m - i - 1)-th second signal line 106, thereby testing the feedback signals of multiple second signal lines 106.

[0159] In the technical solution of this embodiment, by arranging the m-th second signal line on the first metal layer, the m-th second signal line can be directly connected to the lead wire without being conducted through the third preset condition. After testing the feedback signal of the m-th second signal line, the connection between the lead wire and the m-th second signal line can be cut off, and then the connection between the lead wire and other second signal lines can be conducted, so as to test the feedback signals of multiple second signal lines.

[0160] Figure 11 is a schematic structural diagram of a display device provided by an embodiment of the present invention. Refer to Figure 11 , the display device includes the display module provided by any implementation manner of the present invention. The display module can be a mobile phone, a tablet computer, a display, a smart watch, an MP3, an MP4, or other wearable devices, etc. Because it includes the display module provided by any implementation manner of the present invention, it also has the same beneficial effects, which will not be elaborated here.

[0161] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that, Comprising: A display panel and a bonding component; The display panel includes a bonding impedance test section and a first signal line, the bonding component includes a bonding impedance test line and a first bonding section, the bonding impedance test line is electrically connected to the first bonding section, and the first bonding section is bonded to the bonding impedance test section; the first signal line is connected to the bonding impedance test section; the bonding impedance test line is used to test the bonding impedance between the bonding component and the display panel, and the feedback signal on the first signal line; A first pre-conduction structure is provided between the first signal line and the bonding impedance test section, The display panel includes a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked on one side of the substrate along the thickness direction of the substrate. The first pre-conduction structure includes a first sub-signal line located in the first metal layer and a second sub-signal line located in the second metal layer. The first sub-signal line and the second sub-signal line are stacked and insulated along the thickness direction of the substrate. One of the first sub-signal line and the second sub-signal line is electrically connected to the first signal line; the other of the first sub-signal line and the second sub-signal line is electrically connected to the bonding impedance test section; The first sub-signal line and the second sub-signal line are configured to be able to conduct through a first preset condition.

2. The display module according to claim 1, wherein The bonding component includes a chip-on-film and a flexible circuit board; the bonding impedance test line and the first bonding section are located on the chip-on-film, and the chip-on-film further includes a second bonding section. The first bonding section is electrically connected to the second bonding section through the bonding impedance test line; The flexible circuit board includes a third bonding section and a bonding impedance test point that are electrically connected, and the third bonding section is bonded to the second bonding section.

3. The display module according to claim 2, characterized in that, The bonding component further includes a first insulating layer covering the bonding impedance test point.

4. The display module according to claim 1, wherein The bonding impedance test section includes a first test section and a second test section, the bonding impedance test line includes a first test line and a second test line, and the first bonding section includes a first sub-bonding section and a second sub-bonding section; the first test line is connected to the first sub-bonding section, the first sub-bonding section is bonded to the first test section, the second test line is connected to the second sub-bonding section, and the second sub-bonding section is bonded to the second test section; The first signal line is connected to the first test section; the first test line and the second test line are used to test the bonding impedance between the bonding component and the display panel when the first test section and the second test section are an integral structure; the first test line is used to test the feedback signal on the first signal line when the first test section and the second test section are separated; The display panel further includes a lead and at least one second signal line. A second pre-conduction structure is provided between the lead and the second test section. The second test line is used to test the feedback signal of at least one of the second signal lines through the lead when the first test section and the second test section are separated.

5. The display module according to claim 4, characterized in that The display panel further includes a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked on one side of the substrate along the thickness direction of the substrate. The lead is located on the first metal layer; The first signal line and a plurality of the second signal lines are arranged in a first direction. The m-th second signal line is the second signal line farthest from the first signal line; the lead extends along the first direction; where m is a positive integer greater than 1; The second signal line is located on the second metal layer, and a third pre-conduction structure is provided between the lead and each of the plurality of second signal lines; Alternatively, the m-th second signal line is located on the first metal layer, and the remaining second signal lines are located on the second metal layer. The lead is connected to the m-th second signal line, and a third pre-conduction structure is provided between the lead and the remaining second signal lines.

6. The display module according to claim 5, wherein, The third pre-conduction structure is formed at an overlapping position of the projections of the lead and the second signal line on the substrate of the display panel.

7. The display module according to claim 4, characterized in that The first signal line includes a scan signal line or a light emission control signal line, and the second signal line includes a data signal line, a light emission control circuit start signal line, a light emission control circuit clock signal line, a scan circuit clock signal line, or a scan circuit start signal line.

8. A test method for a display module, characterized in that, The test method for the display module is used to test the display module according to any one of claims 1-7. The test method includes: Testing the bonding impedance between the bonding element and the display panel by bonding an impedance test line; Testing the feedback signal on the first signal line of the display panel through the bonding impedance test line.

9. The test method of the display module according to claim 8, wherein, The bonding impedance test unit includes a first test unit and a second test unit; the bonding impedance test line includes a first test line and a second test line, and the first bonding unit includes a first sub-bonding unit and a second sub-bonding unit; the first test line is connected to the first sub-bonding unit, the first sub-bonding unit is bonded to the first test unit, the second test line is connected to the second sub-bonding unit, and the second sub-bonding unit is bonded to the second test unit; the display panel further includes a lead and at least one second signal line, and the first signal line is connected to the first test unit; Testing the feedback signal on the first signal line of the display panel through the bonding impedance test line includes: Testing the feedback signal of the first signal line through the first test line; The test method further includes: Connecting the lead to the second test unit through a second pre-conduction structure, and testing the feedback signal of the second signal line through the second test line.

10. The test method for the display module according to claim 9, wherein, The display panel includes: a substrate, and a first metal layer, a second insulating layer, and a second metal layer that are sequentially stacked on one side of the substrate along the thickness direction of the substrate. The lead is located on the first metal layer, The first signal line and the plurality of second signal lines are arranged in a first direction, the lead extends along the first direction, and the (k + 1)-th second signal line is located on a side of the k-th second signal line away from the first signal line; the m-th second signal line is the second signal line farthest from the first signal line; wherein, k is a positive integer greater than zero and less than m; Testing the feedback signal of the second signal line through the second test line includes: Testing the feedback signal of the (k + 1)-th second signal line through the second test line; Cutting off the connection between the lead and the (k + 1)-th second signal line, conducting the connection between the lead and the k-th second signal line, and testing the feedback signal of the k-th second signal line through the second test line.

11. The test method of the display module according to claim 10, wherein, When there is a third pre-conduction structure between the lead and the m-th second signal line, before testing the feedback signal of the m-th second signal line through the second test line, it further includes: conducting the connection between the lead and the m-th second signal line.

12. The testing method of the display module according to claim 9, wherein, Before testing the feedback signal of the first signal line through the first test line, it further includes: Cutting off the connection between the first test part and the second test part, and the connection between the first sub-bonding part and the second sub-bonding part.

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