A liquid cooling system and a data center

Abstract

The embodiment of this specification provides a hybrid immersion liquid cooling system for a data center. Among them, the liquid cooling system includes a first cooling module and a second cooling module. The first cooling module can be a single-phase liquid cooling system composed of an immersion device and a single-phase coolant. The second cooling module can be a two-phase hybrid immersion liquid cooling system composed of a condenser, a liquid cooling plate, etc. The second cooling module can be used for cooling high-power devices, and the first cooling module can be used for cooling low-power devices. The second cooling module works immersed in the single-phase coolant of the first cooling module, so that the heat exchange mode of the condenser of the second cooling module is liquid-liquid heat exchange. At the same time, a two-phase coolant and a liquid cooling plate are used in the second cooling module, greatly reducing the thermal resistance of the second cooling module and improving the heat dissipation capacity of the system, especially for high-power devices. In addition, the differential liquid cooling scheme fully utilizes the heat dissipation capacity of two-phase liquid cooling while avoiding waste of resources.

Description

Technical Field

[0001] This specification relates to a hybrid immersion liquid cooling technology in the field of server technology, and more specifically, to a liquid cooling system and a data center. Background Art

[0002] With the rapid development of integrated circuit technology, the computing power of integrated circuit chips has been greatly improved. Modern large-scale integrated circuits or very large-scale integrated circuit devices such as application specific integrated circuits (ASICs) and general-purpose processors can operate at high frequencies and high power specifications. This enables electronic devices based on integrated circuit chips to also have strong performance. However, the subsequent problem is how to provide a good cooling system for the devices of various electronic devices to ensure that the devices of various devices work in a suitable temperature environment.

[0003] Current cooling systems can be roughly divided into air-cooling systems and liquid-cooling systems (or water-cooling systems). Air-cooling systems are the most common cooling systems. Most air-cooling systems include cooling fans and heat sinks. The heat sinks absorb the heat generated by the devices, and then the cooling fans cool the heat sinks. A liquid-cooling system is a system that uses liquid to cool the devices. Since, under normal circumstances, the specific heat capacity of the liquid is higher than that of air, the liquid-cooling system usually has better heat dissipation performance and has characteristics such as quietness and stable temperature reduction.

[0004] With the further improvement of the performance of electronic devices, it is necessary to further optimize the heat dissipation performance of the existing cooling systems. Summary of the Invention

[0005] Embodiments of this specification provide a liquid cooling system and a data center to achieve the purpose of improving the heat dissipation performance of the liquid cooling system.

[0006] To achieve the above technical purpose, the embodiments of this specification provide the following technical solutions:

[0007] In a first aspect, an embodiment of this specification provides a liquid cooling system for cooling an electronic device, where the electronic device includes a first heat-generating device, and the liquid cooling system includes: a first heat dissipation module and a second heat dissipation module; wherein,

[0008] The first heat dissipation module includes an immersion device, and the immersion device is used to arrange a first coolant and the second heat dissipation module;

[0009] The second heat dissipation module includes a circulating heat dissipation device, and the circulating heat dissipation device includes a first evaporator and a first condenser. The first evaporator and the first condenser are connected, and a second coolant is arranged in the first evaporator and the first condenser. Both the second coolant and the first coolant are insulating coolants;

[0010] The first evaporator is used to absorb the heat dissipated by the first heat generating device, so that the second coolant in the first evaporator is heated up. The first condenser is used to perform heat exchange based on the temperature difference between the second coolant in the first condenser and the first coolant in the immersion device, so that the second coolant in the first condenser is cooled down.

[0011] In one embodiment, the circulating heat dissipation device further includes: a first pipeline and a second pipeline. The first pipeline connects the first end of the first evaporator and the first end of the first condenser, and the second pipeline connects the second end of the first evaporator and the second end of the first condenser;

[0012] The first evaporator is specifically used to absorb the heat dissipated by the first heat generating device, so that at least part of the second coolant in the first evaporator is converted from a liquid phase state to a gas phase state. The first pipeline is used to transmit the second coolant in the gas phase state to the first condenser;

[0013] The first condenser is specifically used to perform heat exchange based on the temperature difference between the second coolant in the first condenser and the first coolant in the immersion device, so that the second coolant in the gas phase state is converted into the second coolant in the liquid phase state. The second pipeline is used to transmit the second coolant in the liquid phase state to the first evaporator.

[0014] In one embodiment, the installation height of the first condenser is greater than the installation height of the first evaporator. The installation height of the first condenser is the distance between the first condenser and the bottom surface of the immersion device, and the installation height of the first evaporator is the distance between the first evaporator and the bottom surface of the immersion device.

[0015] In one embodiment, the circulating heat dissipation device further includes: a first circulating pump and a third pipeline. The third pipeline is used to connect the first circulating pump, the first condenser and the first evaporator in sequence;

[0016] The first circulating pump is used to provide circulating power to enable the second coolant to circulate in the circulating heat dissipation device.

[0017] In one embodiment, the immersion device includes a first connection port and a second connection port, and the first heat dissipation module further includes: a circulation device;

[0018] The circulation device is respectively connected to the first connection port and the second connection port, and is configured to receive the first coolant flowing out of the immersion device from the first connection port, cool the first coolant, and then transmit it to the immersion device through the second connection port.

[0019] In one embodiment, the first coolant and the second coolant are different types of mutually compatible electronic fluorinated liquids.

[0020] In one embodiment, the electronic device further includes a second heating device, and the heat design power consumption of the first heating device is greater than that of the second heating device.

[0021] The immersion device is further configured to arrange the second heating device.

[0022] In one embodiment, the first evaporator is a cold plate.

[0023] In a second aspect, an embodiment of the present specification provides a liquid cooling heat dissipation system for dissipating heat from an electronic device, where the electronic device includes a first heating device, and the liquid cooling heat dissipation system includes: a third heat dissipation module and a fourth heat dissipation module; wherein,

[0024] The third heat dissipation module is configured to provide a liquid cooling immersion environment;

[0025] The fourth heat dissipation module includes a circulating heat dissipation device, and the circulating heat dissipation device is configured to dissipate heat from the first heating device by using a third coolant in the liquid cooling immersion environment and cool the third coolant based on the liquid cooling immersion environment.

[0026] In one embodiment, the electronic device further includes a second heating device, and the heat design power consumption of the first heating device is greater than that of the second heating device.

[0027] The third heat dissipation module is further configured to dissipate heat from the first heating device.

[0028] In one embodiment, the third heat dissipation module provides the liquid cooling immersion environment based on a fourth coolant.

[0029] Both the fourth coolant and the third coolant are insulating coolants, and the third coolant and the fourth coolant are mutually compatible.

[0030] In a third aspect, an embodiment of the present specification provides a data center, including: a first node device, where the first node device includes a first heating component and the liquid cooling system as described in any one of the above.

[0031] The liquid cooling system is used to dissipate heat from the first node device.

[0032] In one implementation, the first node device is a server, and the first heating component includes a processor.

[0033] As can be seen from the above technical solutions, an embodiment of the present specification provides a liquid cooling system and a data center. Among them, the liquid cooling system includes a first heat dissipation module and a second heat dissipation module. The first heat dissipation module provides an immersion liquid cooling environment for the second heat dissipation module through an immersion device, so that the circulating heat dissipation device of the second heat dissipation module can work in the first coolant in the immersion device, and the heat exchange mode of the first condenser of the second heat dissipation module is liquid-liquid heat exchange, greatly reducing the thermal resistance of the first condenser and improving the heat dissipation capacity of the liquid cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present specification or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present specification. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0035] Figure 1 A schematic diagram of the structure of a liquid cooling system;

[0036] Figure 2 A schematic diagram of the structure of another liquid cooling system;

[0037] Figure 3 A schematic diagram of the structure of a liquid cooling system provided by an embodiment of the present specification;

[0038] Figure 4 A schematic diagram of the structure of another liquid cooling system provided by an embodiment of the present specification;

[0039] Figure 5 A schematic diagram of the structure of yet another liquid cooling system provided by an embodiment of the present specification;

[0040] Figure 6 A schematic diagram of the structure of still another liquid cooling system provided by an embodiment of the present specification;

[0041] Figure 7Schematic diagram of the structure of a liquid cooling system provided for another embodiment of this specification;

[0042] Figure 8 Schematic diagram of the structure of a data center provided for an embodiment of this specification. Detailed implementation manners

[0043] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the ordinary meanings understood by those of ordinary skill in the art to which this specification pertains. The "first", "second" and similar terms used in the embodiments of this specification do not denote any order, quantity or importance, but are only used to avoid confusion of components.

[0044] Unless otherwise required by the context, throughout this specification, "a plurality of" means "at least two", and "including" is interpreted in an open, inclusive sense, that is, "including, but not limited to". In the description of this specification, the terms "an embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples", etc., are intended to indicate that specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of this specification. The schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0045] Next, the technical solutions in the embodiments of this specification will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are only a part of the embodiments of this specification, rather than all the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this specification.

[0046] Application Overview

[0047] With the increasing demand for the computing power of devices such as the CPU (Central Processing Unit) and the GPU (Graphics Processing Unit), the Thermal Design Power (TDP) has also been continuously increasing. Conventional air-cooled cooling systems are gradually unable to meet the cooling requirements of high-performance devices / components, and liquid cooling systems such as cold plate liquid cooling have emerged.

[0048] Refer to Figure 1 , Figure 1A server heat dissipation scenario is shown. In this implementation environment, a coolant 10 is provided in the heat dissipation system 30, and the server 20 is immersed in the coolant 10 for heat dissipation. The heat dissipation system 30 uses an external circulation device to circulate and cool the coolant 10, so that during the operation of the heat dissipation system 30, the coolant that has absorbed the heat dissipated by the server 20 circulates and cools in the circulation device, and then enters again into the container that houses the coolant 10 and the server 20, achieving the absorption of the heat of the server 20.

[0049] In the heat dissipation system 30, the coolant 10 is also called the working medium, which is the working substance for realizing heat transfer. According to the type of the coolant 10, the heat dissipation system is also divided into a single-phase heat dissipation system and a two-phase heat dissipation system. In the container of the heat dissipation system 30 that houses the server 20, if the coolant does not undergo a phase change, it is a single-phase heat dissipation system. And referring to Figure 2 , if the coolant undergoes a phase change (such as becoming a gas phase) after absorbing the heat dissipated by the server 20, then this heat dissipation system is a two-phase heat dissipation system.

[0050] The inventors' research found that in the Figure 1 shown heat dissipation system, using the coolant 10 to dissipate heat from all components of devices such as the server 20 has the characteristics of high energy efficiency and low power usage effectiveness (PUE). However, due to limitations such as the thermal conductivity coefficient of the coolant 10, the ultimate heat dissipation capacity of this heat dissipation system may not be able to meet the heat dissipation requirements of high-performance processors.

[0051] The inventors further discovered that the purpose of improving the ultimate heat dissipation capacity of the heat dissipation system can be achieved by cooperatively installing a radiator with a boiling enhancement coating (BEC) on the surface of the processor in a two-phase heat dissipation system. However, the working medium of the two-phase heat dissipation system is volatile and the control is relatively complex, making it difficult to ensure the reliability of the heat dissipation system.

[0052] In view of this, the embodiments of this specification provide a liquid cooling heat dissipation system and a data center. Among them, the liquid cooling heat dissipation system includes a first heat dissipation module and a second heat dissipation module. The first heat dissipation module provides an immersion liquid cooling environment for the second heat dissipation module through an immersion device, so that the circulating heat dissipation device of the second heat dissipation module can work in a first coolant in the immersion device, and the heat exchange method of the first condenser of the second heat dissipation module is liquid-liquid heat exchange, greatly reducing the thermal resistance of the first condenser and enhancing the heat dissipation capacity of the liquid cooling heat dissipation system. At the same time, since the second heat dissipation module works in an immersion liquid cooling environment, the volatilization problem of the second coolant in the second heat dissipation module can also be effectively avoided, improving the reliability of the liquid cooling heat dissipation system.

[0053] The liquid cooling system provided by the embodiments of this specification will be described below in conjunction with feasible exemplary embodiments.

[0054] Exemplary System

[0055] The embodiments of this specification provide a liquid cooling system, as Figure 3 shown, for cooling an electronic device. The electronic device includes a first heat-generating device. The liquid cooling system includes: a first heat dissipation module 100 and a second heat dissipation module 200. Among them,

[0056] The first heat dissipation module 100 includes an immersion device, and the immersion device is used to arrange a first coolant and the second heat dissipation module 200.

[0057] The second heat dissipation module 200 includes a circulating heat dissipation device. The circulating heat dissipation device includes a first evaporator 210 and a first condenser 220. The first evaporator 210 and the first condenser 220 are connected. A second coolant is arranged in the first evaporator 210 and the first condenser 220. Both the second coolant and the first coolant are insulating coolants. Optionally, in order to improve the heat dissipation efficiency, the first evaporator 210 may further include heat dissipation fins (Fin) 211.

[0058] The first evaporator 210 is used to absorb the heat dissipated by the first heat-generating device 310, so that the second coolant in the first evaporator 210 is heated. The first condenser 220 is used to perform heat exchange based on the temperature difference between the second coolant in the first condenser 220 and the first coolant in the immersion device, so that the second coolant in the first condenser 220 is cooled.

[0059] The circulating heat dissipation device, also known as a thermal circulating radiator, refers to a device that circulates a liquid-phase and / or gas-phase coolant to flow in a pipeline for heat exchange to ensure that a heat-generating device (such as the first heat-generating device 310) can operate within a normal temperature range and improve the service life of the heat-generating device. The working principle of the circulating heat dissipation device is that the liquid coolant flows in the circulating pipeline to the heat absorption position. The low-temperature liquid coolant performs the first heat exchange with the heat-generating device. The liquid coolant absorbs heat, the temperature of the heat-generating device decreases, and the temperature of the liquid coolant increases. Then it flows to the heat dissipation position to perform the second heat exchange, dissipating a large amount of heat, and the temperature of the liquid coolant decreases. Then it circulates again, thereby achieving the purpose of heat dissipation and temperature reduction.

[0060] According to whether the liquid coolant undergoes a phase change after absorbing heat at the heat absorption position, the circulating heat dissipation device can also be divided into a single-phase circulating heat dissipation device and a two-phase circulating heat dissipation device. It is not difficult to understand that in the single-phase circulating heat dissipation device, the liquid coolant does not undergo a phase change after absorbing heat at the heat absorption position, and the liquid coolant remains in the liquid state (or called the liquid phase). In the two-phase circulating heat dissipation device, the liquid coolant is converted from the liquid state to the gaseous state (or called the gaseous phase) after absorbing heat at the heat absorption position. After the gaseous coolant dissipates heat at the heat dissipation position, it returns to the liquid coolant and enters the cycle again.

[0061] Traditionally, the circulating heat dissipation device needs to rely on a condenser (or called a heat exchanger or a heat exchanger) for the second heat exchange. The condenser of the traditional circulating heat dissipation device usually exchanges the heat of the internal coolant with the external air, that is, the heat exchange method of the condenser of the traditional circulating heat dissipation device is gas / liquid heat exchange. The heat resistance of the condenser with this heat exchange method is relatively large, usually accounting for more than 50% of the total heat resistance of the heat dissipation device, which hinders the heat exchange efficiency.

[0062] In this embodiment, by arranging the second heat dissipation module 200 in the immersion device of the first heat dissipation module 100, the first condenser 220 of the second heat dissipation module 200 can perform heat exchange based on the temperature difference between the second coolant in the first condenser 220 and the first coolant in the immersion device, so that the first condenser 220 can perform heat exchange in a liquid / liquid manner, greatly reducing the heat resistance of the first condenser 220, also reducing the overall heat resistance of the second heat dissipation module 200, improving the heat dissipation efficiency of the second heat dissipation module 200, and also improving the heat dissipation efficiency of the entire liquid cooling heat dissipation system.

[0063] Based on the source of the circulating power of the coolant in the circulating heat dissipation device, it can be divided into a forced circulation heat dissipation (cooling) device and a natural circulation heat dissipation (cooling) device.

[0064] Taking the natural circulation heat dissipation device as an example, in an embodiment of this specification, refer to Figure 4 , a circulating heat dissipation device is provided, and the circulating heat dissipation device further includes:

[0065] A first pipeline 231 and a second pipeline 232, the first pipeline 231 connects the first end of the first evaporator 210 and the first end of the first condenser 220, and the second pipeline 232 connects the second end of the first evaporator 210 and the second end of the first condenser 220.

[0066] The first evaporator 210 is specifically configured to absorb the heat dissipated by the first heating device 310, so that at least part of the second coolant in the first evaporator 210 is converted from a liquid phase state to a gas phase state, and the first pipeline 231 is used to transmit the second coolant in the gas phase state to the first condenser 220.

[0067] The first condenser 220 is specifically configured to perform heat exchange based on the temperature difference between the second coolant in the first condenser 220 and the first coolant in the immersion device, so that the second coolant in the gas phase state is converted into the second coolant in the liquid phase state, and the second pipeline 232 is used to transmit the second coolant in the liquid phase state to the first evaporator 210.

[0068] In this embodiment, the circulating heat dissipation device is a natural circulation heat dissipation device, and the circulating power of the second coolant in the circulating heat dissipation device comes from the pressure difference in the device. Specifically, the second coolant is absorbed in the first evaporator 210 and converted into a gas phase state. At this time, a pressure difference is generated in the circulation loop due to the liquid-gas conversion of the second coolant, forcing the second coolant into the first condenser 220. The second coolant is reconverted into a liquid phase state in the first condenser 220 and re-enters the circulation.

[0069] Since this natural circulation heat dissipation device involves the phase change of the second coolant, it can also be called a two-phase circulation heat dissipation device. The circulating heat dissipation device provided in this embodiment is beneficial to reducing the volume of the entire heat dissipation device because there is no need to additionally provide a device for providing circulating power.

[0070] In addition, in an exemplary embodiment of this specification, the installation height of the first condenser 220 is greater than the installation height of the first evaporator 210. The installation height of the first condenser 220 is the distance between the first condenser 220 and the bottom surface of the immersion device, and the installation height of the first evaporator 210 is the distance between the first evaporator 210 and the bottom surface of the immersion device.

[0071] With such a relative positional relationship between the first condenser 220 and the first evaporator 210, after the second coolant is converted into a liquid phase in the first condenser 220, the second coolant can enter the circulation by gravity, which is beneficial to improving the circulation efficiency of the circulating heat dissipation device.

[0072] Optionally, the first condenser 220 is a cold plate, and the second coolant flows inside the cold plate and exchanges heat through the internal fins thereof, so as to achieve the purpose of cooling the first heating device 310.

[0073] In this embodiment, the second heat dissipation module operates while being immersed in the single-phase coolant of the first heat dissipation module, such that the heat exchange mode of the condenser of the second heat dissipation module is liquid-liquid heat exchange. At the same time, a two-phase coolant and a liquid cooling plate are used in the second heat dissipation module, greatly reducing the thermal resistance of the second heat dissipation module and enhancing the heat dissipation capacity of the system, especially for high-power devices.

[0074] Taking the forced circulation heat dissipation device as an example, in one embodiment of this specification, referring to Figure 3 , the circulating heat dissipation device further includes: a first circulation pump 230 and a third pipeline, and the third pipeline is used to sequentially connect the first circulation pump 230, the first condenser 220, and the first evaporator 210.

[0075] The first circulation pump 230 is used to provide circulating power to enable the second coolant to circulate in the circulating heat dissipation device.

[0076] In this embodiment, the circulating heat dissipation device is a forced circulation heat dissipation device. According to the type of the second coolant, it can be divided into a single-phase forced circulation heat dissipation device and a two-phase forced circulation heat dissipation device. Since the first circulation pump 230 provides the circulating power for the second coolant in the device, the circulating efficiency of the second coolant is higher.

[0077] Whether the second heat dissipation module is a forced circulation heat dissipation device or a natural circulation heat dissipation device, the second heat dissipation module is a closed circulation system, avoiding the problem of easy volatilization of the two-phase coolant.

[0078] For the first heat dissipation module 100, in order to improve the heat dissipation efficiency of the first heat dissipation module 100, referring to Figure 5 , the immersion device 110 includes a first connection port 121 and a second connection port 122, and the first heat dissipation module 100 further includes: a circulation device 120.

[0079] The circulation device 120 is respectively connected to the first connection port 121 and the second connection port 122. The circulation device 120 is used to receive the first coolant flowing out from the first connection port 121 by the immersion device 110, cool the first coolant, and then transmit it to the immersion device 110 through the second connection port 122.

[0080] In this embodiment, by providing the circulation device 120 for the immersion device 110, the first coolant can circulate between the immersion device 110 and the circulation device 120 under the drive of the circulation device 120. At the same time, the heat dissipation efficiency and heat dissipation performance of the first heat dissipation module 100 are improved by using the circulation device 120 to cool the first coolant.

[0081] Optionally, the circulation device 120 may include a second circulation pump 123 and a second condenser 124. The second circulation pump 123 promotes the circulation of the first coolant between the immersion device 110 and the circulation device 120. The second condenser 124 provides a heat exchange place for the first coolant, specifically enabling heat exchange between the first coolant and other external coolants to reduce the temperature of the first coolant.

[0082] In an exemplary embodiment of the present specification, the first coolant and the second coolant are different types of mutually compatible electronic fluorinated liquids.

[0083] Electronic fluorinated liquid is a colorless, transparent, and fully fluorinated liquid with good chemical inertness, electrical insulation performance, and thermal conductivity. Using electronic fluorinated liquid as the first coolant and the second coolant can avoid problems such as corrosion and short - circuit of the electronic devices in the liquid - cooled heat dissipation system caused by the coolant.

[0084] The first coolant and the second coolant being mutually compatible means that no chemical reaction or property change occurs after the first coolant and the second coolant are mixed, and they can still perform the cooling function of the coolant. The compatibility of the first coolant and the second coolant ensures that even if the second coolant in the second heat dissipation module 200 leaks, it will not have a significant impact on the heat dissipation performance of the electronic devices or the liquid - cooled heat dissipation system, and will not damage the devices like the cold - plate water - cooling.

[0085] Optionally, in an embodiment of the present specification, as Figure 6 shown, the electronic device further includes a second heating device 320, and the heat design power consumption of the first heating device 310 is greater than that of the second heating device 320.

[0086] The immersion device 110 is also used to arrange the second heating device 320.

[0087] In this embodiment, for the first heating device 310 and the second heating device 320 with different heat design power consumptions, the liquid - cooled heat dissipation system can use the second heat dissipation module 200 with higher heat dissipation capacity to dissipate heat from the first heating device 310 with higher heat dissipation requirements, and use the first heat dissipation module 100 with relatively lower heat dissipation capacity to dissipate heat from the second heating device 320 with relatively lower heat dissipation requirements. This realizes the full utilization of the first heat dissipation module 100, meets the different heat dissipation requirements of different heating devices, and improves the practicality of the liquid - cooled heat dissipation system.

[0088] Optionally, the first heating device 310 includes, but is not limited to, a processor, and the processor includes, but is not limited to, processors of types such as a CPU, a Graphics Processing Unit (GPU), a Tensor Processing Unit (TPU), or a Neural network Processing Unit (NPU). This specification does not make any limitations in this regard.

[0089] The second heating device 320 includes, but is not limited to, heating devices such as a memory and a circuit board. The circuit board includes, but is not limited to, a Printed Circuit Board (PCB) or a Flexible Printed Circuit (FPC). The memory includes, but is not limited to, Dual-Inline-Memory-Modules (DIMM) or Small Outline Dual In-line Memory Module (SODIMM), etc. In this embodiment, for high- and low-power devices, a two-phase and single-phase differentiated liquid cooling heat dissipation solution is adopted, which avoids resource waste and fully utilizes the two-phase liquid cooling heat dissipation capacity.

[0090] Generally speaking, the liquid cooling heat dissipation system provided by the embodiments of this specification combines the advantages of single-phase immersion and two-phase cold plates. The second heat dissipation module based on two-phase heat dissipation technology is used for heat dissipation of high-power devices such as CPUs and GPUs, and the first heat dissipation module based on single-phase immersion technology is used for heat dissipation of other low-power devices such as memories and hard disks. The differentiated liquid cooling solution avoids resource waste and fully utilizes the two-phase liquid cooling heat dissipation capacity. In addition, the second heat dissipation module operates immersed in the single-phase coolant of the first heat dissipation module, making the heat exchange mode of the condenser of the second heat dissipation module a liquid-liquid heat exchange. At the same time, a two-phase coolant and a liquid cooling plate are used in the second heat dissipation module, greatly reducing the thermal resistance of the second heat dissipation module and enhancing the heat dissipation capacity of the system, especially the heat dissipation capacity for high-power devices. Further, the second heat dissipation module is a closed circulation system, which avoids the problem of easy volatilization of the two-phase coolant, reduces the usage cost. At the same time, the two-phase coolant in the second heat dissipation module is non-conductive, and even if leakage occurs, it will not damage the equipment like the water cooling of the cold plate.

[0091] Compared with the single-phase immersion liquid cooling system and the two-phase immersion liquid cooling system, the liquid cooling system provided by the embodiments of this specification has the following specific advantages: First, compared with the single-phase immersion liquid cooling system, the liquid cooling system provided by the embodiments of this specification uses a two-phase cooling system (the second cooling module) to dissipate heat from high-power devices such as CPUs and GPUs, which is beneficial to improving the heat dissipation capacity for high-power devices. Second, compared with the two-phase immersion liquid cooling system, the second cooling module provided by the embodiments of this specification is a closed system, and the coolant in the second cooling module is not easily volatile, which is beneficial to reducing the usage cost. Third, compared with the cold plate water cooling system, the coolant in the second cooling module of the liquid cooling system provided by the embodiments of this specification is a non-conductive working fluid, and even if there is a leak, it will not damage the equipment.

[0092] Some exemplary embodiments of this specification also provide another liquid cooling system, as Figure 7 shown, for dissipating heat from an electronic device, the electronic device includes a first heat-generating device 310, and the liquid cooling system includes: a third cooling module 400 and a fourth cooling module 500; wherein,

[0093] The third cooling module 400 is used to provide a liquid cooling immersion environment.

[0094] The fourth cooling module 500 includes a circulating heat dissipation device, and the circulating heat dissipation device is used to dissipate heat from the first heat-generating device 310 using a third coolant in the liquid cooling immersion environment, and cool down the third coolant based on the liquid cooling immersion environment.

[0095] Optionally, the electronic device further includes a second heat-generating device 320, and the heat design power consumption of the first heat-generating device 310 is greater than that of the second heat-generating device 320.

[0096] The third cooling module 400 is further used to dissipate heat from the first heat-generating device 310.

[0097] Optionally, the third cooling module 400 provides the liquid cooling immersion environment based on a fourth coolant.

[0098] Both the fourth coolant and the third coolant are insulating coolants, and the third coolant is compatible with the fourth coolant.

[0099] The third heat dissipation module 400, the fourth heat dissipation module 500, the third coolant, and the fourth coolant perform functions that are basically similar to those of the first heat dissipation module 100, the second heat dissipation module 200, the first coolant, and the second coolant described above. For the specific definitions of the third heat dissipation module 400, the fourth heat dissipation module 500, the third coolant, and the fourth coolant, reference can be made to the definitions of the first heat dissipation module 100, the second heat dissipation module 200, the first coolant, and the second coolant in the liquid cooling heat dissipation system described above. Details are not repeated herein.

[0100] Exemplary Data Center

[0101] An exemplary embodiment of this specification further provides a data center, as Figure 8 shown, including:

[0102] A first node device, which includes a first heating device 310 and the liquid cooling heat dissipation system described in any of the above embodiments.

[0103] The liquid cooling heat dissipation system is used to dissipate heat from the first node device.

[0104] Specifically, the first node device is server A10, and the first heating device 310 includes a processor.

[0105] In Figure 8 , in addition to server A10, a switch and a router are also shown. Figure 8 The shown architecture can be called a data center. In this network structure, it can be divided into a server layer, an edge switch layer, an aggregate switch layer, a core switch layer, a router layer, and an optical signal transmission layer.

[0106] For the specific definitions of each module / structure in the liquid cooling heat dissipation system, reference can be made to the relevant descriptions in the "Exemplary Liquid Cooling Heat Dissipation System" section above.

[0107] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0108] The above-described embodiments merely represent several implementation manners of this specification. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the solutions provided by the embodiments of this specification. It should be noted that for those of ordinary skill in the art, without departing from the concept of this specification, several modifications and improvements can still be made, and these all fall within the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be subject to the appended claims.

Claims

1. A liquid cooling system, characterized in that, For the heat dissipation of an electronic device, the electronic device includes a first heat-generating device, and the liquid cooling system includes: a first heat dissipation module and a second heat dissipation module; wherein, The first heat dissipation module includes an immersion device, and the immersion device is used to arrange a first coolant and the second heat dissipation module; the second heat dissipation module is completely immersed in the first coolant; The second heat dissipation module includes a circulating heat dissipation device, the circulating heat dissipation device includes a first evaporator and a first condenser, the first evaporator and the first condenser are connected, and a second coolant is arranged in the first evaporator and the first condenser. The second coolant is a two-phase coolant, and both the second coolant and the first coolant are insulating coolants; The first heat-generating device is completely immersed in the first coolant. The first evaporator is connected to the first heat-generating device and is used to absorb the heat dissipated by the first heat-generating device, so that the second coolant in the first evaporator is heated up. The first condenser is used to perform heat exchange based on the temperature difference between the second coolant in the first condenser and the first coolant in the immersion device, so as to cool down the second coolant in the first condenser.

2. The liquid cooling heat dissipation system according to claim 1, wherein The circulating heat dissipation device further includes: a first pipeline and a second pipeline. The first pipeline connects the first end of the first evaporator and the first end of the first condenser, and the second pipeline connects the second end of the first evaporator and the second end of the first condenser; The first evaporator is specifically used to absorb the heat dissipated by the first heat-generating device, so that at least part of the second coolant in the first evaporator is converted from a liquid phase state to a gas phase state, and the first pipeline is used to transport the second coolant in the gas phase state to the first condenser; The first condenser is specifically used to perform heat exchange based on the temperature difference between the second coolant in the first condenser and the first coolant in the immersion device, so that the second coolant in the gas phase state is converted into the second coolant in the liquid phase state, and the second pipeline is used to transport the second coolant in the liquid phase state to the first evaporator.

3. The liquid cooling system according to claim 2, wherein The installation height of the first condenser is greater than the installation height of the first evaporator. The installation height of the first condenser is the distance between the first condenser and the bottom surface of the immersion device, and the installation height of the first evaporator is the distance between the first evaporator and the bottom surface of the immersion device.

4. The liquid cooling and heat dissipation system according to claim 1, characterized in that The circulating heat dissipation device further includes: a first circulation pump and a third pipeline. The third pipeline is used to connect the first circulation pump, the first condenser and the first evaporator in sequence; The first circulation pump is used to provide circulating power to enable the second coolant to circulate in the circulating heat dissipation device.

5. The liquid cooling system according to claim 1, wherein The immersion device includes a first connection port and a second connection port, and the first heat dissipation module further includes: a circulating device; The circulation device is respectively connected to the first connection port and the second connection port. The circulation device is configured to receive the first coolant flowing out of the first connection port by the immersion device, cool the first coolant, and then transmit it to the immersion device through the second connection port.

6. The liquid cooling and heat dissipation system according to any one of claims 1-5, characterized in that, The first coolant and the second coolant are different types of mutually compatible electronic fluorinated liquids.

7. The liquid cooling system according to any one of claims 1-5, characterized in that, The electronic device further includes a second heating device, and the heat design power consumption of the first heating device is greater than that of the second heating device. The immersion device is further configured to accommodate the second heating device.

8. A liquid cooling system, characterized in that, For heat dissipation of an electronic device, the electronic device includes a first heating device, and the liquid cooling heat dissipation system includes: a first heat dissipation module and a second heat dissipation module; wherein, The first heat dissipation module includes an immersion device, and the immersion device is configured to accommodate a first coolant and the second heat dissipation module; the second heat dissipation module is completely immersed in the first coolant. The second heat dissipation module includes a circulating heat dissipation device. The circulating heat dissipation device is configured to dissipate heat from the first heating device by using a second coolant in the immersion device, and cool the second coolant based on the first coolant in the immersion device; the second coolant is a two-phase coolant.

9. The liquid cooling system according to claim 8, wherein The electronic device further includes a second heating device, and the heat design power consumption of the first heating device is greater than that of the second heating device. The first heat dissipation module is further configured to dissipate heat from the first heating device.

10. The liquid cooling system according to claim 8, wherein Both the first coolant and the second coolant are insulating coolants, and the first coolant and the second coolant are mutually compatible.

11. A data center, characterized in that, Comprising: A first node device, the first node device includes a first heating device and the liquid cooling heat dissipation system according to any one of claims 1-10. The liquid cooling heat dissipation system is configured to dissipate heat from the first node device.

12. The data center according to claim 11, wherein The first node device is a server, and the first heating device includes a processor.

Images