High-efficiency heat dissipation type log measuring instrument

Abstract

The application provides a high-efficiency heat dissipation type log measuring instrument, which comprises a shell, a photographing device, a driving device, a display device and a heat dissipation device. The high-efficiency heat dissipation type log measuring instrument is provided with a heat dissipation structure to dissipate heat inside the log measuring instrument, so that high-temperature thermal damage of the instrument is avoided. The heat of a core circuit board and the display device is conducted to the shell for heat dissipation through a first mounting frame. A second mounting frame is transversely arranged between the circuit board and the core circuit board, so that the heat dissipation effect of the driving device is improved. The second mounting frame further connects the photographing device and the first mounting frame, so that the compact structure design improves the stability of the connection of the high-efficiency heat dissipation type log measuring instrument. Meanwhile, the heat dissipation device connects various components, so that the heat dissipation effect of the overall structure of the instrument is improved, and the structure has high practicability.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of log detection equipment, and particularly relates to a high-efficiency heat dissipation type log measuring instrument. BACKGROUND

[0002] Log processing is widely applied, and log measurement is a common detection requirement in the wood processing, pulp production and paper production industries. The reason for detecting logs is that the hardness and fiber quality of log materials are important factors affecting wood and paper products.

[0003] The existing log measuring instrument has poor heat dissipation, and internal components of the instrument are easily damaged due to lack of timely heat dissipation, thereby affecting the service life of the equipment. Therefore, a high-efficiency heat dissipation type log measuring instrument is needed to solve the above technical problems. SUMMARY

[0004] The present application provides a high-efficiency heat dissipation type log measuring instrument to solve the problem of poor heat dissipation of the existing log measuring instrument.

[0005] To solve the above technical problems, the technical scheme of the present application is as follows: a high-efficiency heat dissipation type log measuring instrument, comprising:

[0006] a housing;

[0007] a photographing device arranged on one side of the housing for photographing;

[0008] a display device arranged on the other side of the housing for displaying images;

[0009] a driving device arranged inside the housing, the driving device being located between the photographing device and the display device, the driving device being connected with the photographing device and the display device, the driving device comprising a power mainboard and a core circuit board arranged above the power mainboard; and

[0010] a heat dissipation device fixed inside the housing, the heat dissipation device comprising:

[0011] a first mounting frame vertically arranged between the core circuit board and the display device, the two ends of the first mounting frame being connected with the two sides of the housing inside; and

[0012] a second mounting frame horizontally arranged between the power mainboard and the core circuit board, one side of the second mounting frame being connected with the photographing device, and the other side of the second mounting frame being connected with the second mounting frame.

[0013] In the present application, the heat dissipation device further comprises a heat pipe, the heat pipe being arranged on the other side of the first mounting frame, and the heat pipe connecting the first mounting frame with the housing.

[0014] In the present application, the first mounting frame comprises:

[0015] The first heat dissipation main plate is vertically arranged in the shell, and the first heat dissipation main plate is connected with the core circuit board through the first supporting column;

[0016] The first heat dissipation fin is arranged on one side of the first heat dissipation main plate, and the first heat dissipation fin is located between the core circuit board and the first heat dissipation main plate, and the plane where the first heat dissipation fin is located intersects with the plane where the first heat dissipation main plate is located; and

[0017] The first heat dissipation mounting plate is arranged in two groups, and the two groups of first heat dissipation mounting plates are respectively connected with two ends of the first heat dissipation main plate and are respectively connected with two ends of the inner wall of the shell.

[0018] In the present application, the first mounting frame is provided with a first mounting groove on the other side, and the heat conduction pipe is clamped with the first mounting groove.

[0019] In the present application, the first mounting frame is provided with a first heat dissipation source area at the center of the other side, and the heat conduction pipe comprises:

[0020] The first section is arranged at one end of the heat conduction pipe, and the first section is located in the first heat dissipation source area;

[0021] The second section is arranged at the other end of the heat conduction pipe, and the second section is vertically arranged at the side edge of the first mounting frame, and the side wall of the second section is in contact with the inner wall of the shell; and

[0022] The first connecting section is arranged in the middle of the heat conduction pipe, and connects the first section and the second section.

[0023] In the present application, the second mounting frame comprises:

[0024] The second heat dissipation mounting plate is horizontally arranged in the shell, and the second heat dissipation mounting plate is located above the power supply main plate;

[0025] The second supporting column is arranged in several groups, and the second supporting column is connected with the bottom end of the second heat dissipation mounting plate, the second supporting column is connected with the power supply main plate, a second heat dissipation area is formed between the second supporting column and the second heat dissipation mounting plate, and the electronic components on the power supply main plate are located in the second heat dissipation area; and

[0026] The second heat dissipation fin is vertically arranged at the top end of the second heat dissipation mounting plate.

[0027] In the application, the second heat dissipation fin is provided with at least two groups, and the core circuit board is arranged between adjacent second heat dissipation fins; the second heat dissipation mounting plate is further provided with a second wiring hole, which facilitates power supply of the core circuit board.

[0028] In the application, the second heat dissipation mounting plate is provided with a second fixing pin on the other side, and the second fixing pin is connected with the first mounting frame.

[0029] In the application, the second heat dissipation mounting plate is further provided with a second avoiding notch, and the bottom end of the second heat dissipation fin is accommodated in the second avoiding notch.

[0030] In the application, the photographing device comprises a first connecting column, which is connected with the core circuit board.

[0031] The second heat dissipation mounting plate is further provided with a second connecting groove, and the sidewall of the first connecting column is connected with the second connecting groove.

[0032] Compared with the prior art, the application has the following beneficial effects: the high-efficiency heat dissipation type log measuring instrument of the application is provided with a heat dissipation structure to dissipate heat inside the log measuring instrument, thereby avoiding high-temperature thermal damage to the instrument; the heat dissipation device is arranged between the core circuit board and the display device through the first mounting frame, so as to conduct heat of the core circuit board and the display device to the shell for heat dissipation. The driving device comprises a power mainboard and a core circuit board arranged above the power mainboard.

[0033] The second mounting frame is arranged transversely between the circuit board and the core circuit board, thereby improving the heat dissipation effect of the driving device; further, the second mounting frame connects the photographing device and the first mounting frame, which is compact in structure design and improves the stability of connection of the high-efficiency heat dissipation type log measuring instrument. Meanwhile, the heat dissipation device connects each component, thereby improving the heat dissipation effect of the overall structure of the instrument, and the structure is practical. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following briefly introduces the drawings needed in the embodiments, and the drawings in the following description are only corresponding to some embodiments of the application.

[0035] Figure 1 It is a whole structure schematic view of the preferred embodiment of the application.

[0036] Figure 2 It is an explosion view of the whole structure of the preferred embodiment of the application.

[0037] Figure 3 It is a photographing device solid of the preferred embodiment of the applicationFigure 1 .

[0038] Figure 4 Photographing device exploded view for preferred embodiment of the present invention Figure 2 .

[0039] Figure 5 First mounting plate perspective view for preferred embodiment of the present invention

[0040] Figure 6 Photographing device exploded view for preferred embodiment of the present invention Figure 1 .

[0041] Figure 7 Photographing device exploded view for preferred embodiment of the present invention Figure 2 .

[0042] Figure 8 Sunshade structure schematic view for preferred embodiment of the present invention

[0043] Figure 9 Mask perspective view for preferred embodiment of the present invention Figure 1 .

[0044] Figure 10 Mask perspective view for preferred embodiment of the present invention Figure 2 .

[0045] Figure 11 Housing internal structure sectional view for preferred embodiment of the present invention

[0046] Figure 12 Heat dissipation structure in use view for preferred embodiment of the present invention

[0047] Figure 13 Heat dissipation structure perspective view for preferred embodiment of the present invention Figure 1 .

[0048] Figure 14 First mounting frame perspective view for preferred embodiment of the present invention

[0049] Figure 15 Second mounting frame perspective view for preferred embodiment of the present invention Figure 1 .

[0050] Figure 16 Second mounting frame perspective view for preferred embodiment of the present invention Figure 2 .

[0051] : photographing device 1, main body frame 11, first mounting plate 111, first receiving groove 1111, first guide cylinder 1112, first heat dissipation groove 1113, first fixing seat 1114, first through hole 1115, first connecting column 1116, first fixed frame 112, first light-transmitting surface 1121, first fixed groove 1122, limiting curved surface 1123, first protection groove 1124, first clamping groove 1125, first sealing ring 113, first buckle 114, first fixed groove 1141, first protrusion 1142, industrial camera 12, camera main board 121, lens assembly 122, camera heat sink 123, laser structure 13, laser assembly 131, light-emitting structure 14, strip-shaped IED assembly 141, driving device 2, core circuit board 21, power supply main board 22, display device 3, display main board assembly 31, loudspeaker 33, heat dissipation device 4, first mounting frame 41, first heat dissipation main board 411, first mounting groove 411, heat dissipation source area 4112, first supporting column 412, first heat dissipation fin 413, first heat dissipation mounting plate 414, first heat dissipation hole 4141, second fixing column 415, insulating column 416, loudspeaker fixing seat 417, heat conduction pipe 42, first section 421, first connecting section 422, second section 423, second mounting frame 43, second mounting plate 431, second avoiding gap 4311, first wiring groove 4312, second limiting groove 4313, second connecting groove 4314, fixing pin 432, second heat dissipation fin 433, second baffle 434, second reinforcing rib 435, second supporting column 436, shell 5, fifth clamping groove 51, sixth clamping groove 52, handle 53, light shield 6, fifth clamping block 61, fifth deformation groove 62, fifth reinforcing rib 63, mask 7, sixth clamping protrusion 71, sixth deformation groove 72, fifth end 73, sixth end 74, alignment groove 741, sixth connecting part 75. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative work fall within the protection scope of the present application.

[0053] In the drawings, similar elements are denoted by the same reference numerals.

[0054] The terms "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying relative importance, and are not as a limitation on the order.

[0055] Please refer to Figure 1 , Figure 2 and Figure 12Wherein Figure 1 The whole structure schematic diagram of the preferred embodiment of the present application, Figure 2 The whole structure exploded view of the preferred embodiment of the present application, Figure 11 The heat dissipation structure use state diagram of the preferred embodiment of the present application.

[0056] The preferred embodiment of the high-efficiency heat dissipation type log measuring instrument provided by the present application is as follows.

[0057] The preferred embodiment of the high-efficiency heat dissipation type log measuring instrument provided by the present application is as follows: a high-efficiency heat dissipation type log measuring instrument, comprising a shell 5, a photographing device 1, a driving device 2, a display device 3 and a heat dissipation device 4; wherein the photographing device 1 is arranged on one side of the shell 2 for shooting; the display device 3 is arranged on the other side of the shell 5 for displaying images; the driving device 2 is arranged inside the shell 5, and the driving device 2 is connected with the photographing device 1 and the display device 3 to make the equipment run.

[0058] The driving device 2 comprises a power mainboard 22 and a core circuit board 21 arranged above the power mainboard 22. The core circuit board 21 is a GPIO board, which is a core PCB board of the logical control end of the whole measuring equipment.

[0059] The heat dissipation device 4 is fixed inside the shell 5, and the heat dissipation device 4 comprises a first mounting frame 41, a second mounting frame 43 and a heat pipe 42.

[0060] The first mounting frame 41 is vertically arranged between the core circuit board 21 and the display device 3, and the two ends of the first mounting frame 41 are connected with the two sides inside the shell 5; the second mounting frame 43 is transversely arranged between the power mainboard 22 and the core circuit board 21, one side of the second mounting frame 43 is connected with the photographing device 1, and the other side of the second mounting frame 43 is connected with the first mounting frame 41.

[0061] Further, the heat dissipation device 4 in the embodiment further comprises the heat pipe 42.

[0062] The heat dissipation structure is arranged on the side of the core circuit board of the measuring system, and the heat dissipation structure is a heat dissipation core component of the whole measuring system. The core circuit board is a core PCB board of the logical control end of the whole measuring equipment. In the use process of the heat dissipation structure of the log measuring instrument measuring system, the first mounting frame conducts and dissipates heat of the core circuit board, the heat pipe connects the first mounting frame with the shell, further improves the heat conduction efficiency of the heat dissipation structure, avoids that the temperature inside the shell is too high to affect the use, and guarantees the measuring effect of the log measuring instrument.

[0063] Figure 16 - Figure 13 The heat dissipation structure in the present application is described in detail as follows:

[0064] In combination Figure 14 And Figure 2 , the first mounting frame 41 in the embodiment includes a first heat dissipation main plate 411, a first heat dissipation fin 413, and a first heat dissipation mounting plate 414; the first heat dissipation main plate 411 is vertically arranged in the shell 5, and the first heat dissipation main plate 411 is connected with the core circuit board 21 through a first support column 412; the first support column 412 in the embodiment is a hollow structure, and the first support column 412 is connected with the core circuit board 21 through a plug-in insulating column 416.

[0065] The first heat dissipation fin 413 is arranged on one side of the first heat dissipation main plate 411, and the first heat dissipation fin 413 is located between the core circuit board 21 and the first heat dissipation main plate 411. The plane on which the first heat dissipation fin 413 is located intersects the plane on which the first heat dissipation main plate 411 is located; the first heat dissipation mounting plate 414 is provided in two groups, and the two groups of first heat dissipation mounting plates 414 are respectively connected with two ends of the first heat dissipation main plate 411 and are respectively connected with two ends of the inner wall of the shell 5.

[0066] The first mounting frame 41 improves the heat dissipation area through the first heat dissipation fin 413 arranged on one side, thereby improving the heat dissipation effect of the first mounting frame 41; the other side of the first heat dissipation main plate 411 is connected with the core circuit board 21, thereby improving the connection stability of the first mounting frame 41 and the core circuit board 21 and improving the heat dissipation efficiency of the first mounting frame 41 on the core circuit board 21. The first mounting frame 41 further includes the first heat dissipation mounting plate 414 connected with two ends of the inner wall of the shell 5, thereby improving the contact area of the first mounting frame 41 and the shell 5 and improving the heat dissipation efficiency of the first mounting frame 41 on the core circuit board 21.

[0067] Further, the first heat dissipation mounting plate 414 in the embodiment is provided with a first heat dissipation hole 4141. In combination Figure 14 , the first mounting frame 41 in the embodiment further includes a loudspeaker fixing frame 417, the loudspeaker fixing frame 417 is arranged in the first mounting frame 41 and is close to one side of one of the first heat dissipation mounting plates 414, and the first heat dissipation mounting plate 414 corresponding to the position of the loudspeaker fixing frame 417 is provided with the first heat dissipation hole 4141. The first heat dissipation hole 4141 not only plays a role in propagating sound, but also can transmit heat inside the shell 5 to the outside of the shell 5, thereby improving the heat dissipation effect of the heat dissipation structure.

[0068] The loudspeaker fixing frame 417 is used for mounting and fixing a loudspeaker, and the loudspeaker increases the voice broadcast function, so that an operator can know the size of a current measurement object without checking a display screen.

[0069] In addition, the first heat dissipation fin 413 in the embodiment is provided in several groups, and the several first heat dissipation fins 413 are parallel to each other, thereby improving the structural efficiency of the first mounting frame 41.

[0070] In the present application, the first mounting frame 41 and the shell 5 are both metal materials, preferably, the first mounting frame 41 in the embodiment is an integrally formed aluminum alloy frame, and the shell 5 is an aluminum alloy shell 5.

[0071] In combination Figure 10 The structure of the heat pipe 42 in the embodiment will be described in detail as follows:

[0072] The first mounting frame 41 is provided with a first mounting groove 4111 on the other side, and the heat pipe 42 is clamped with the first mounting groove 4111. This structure not only improves the stability of the structure of the heat pipe 42 and the first mounting frame 41, but also improves the heat conduction efficiency of the heat pipe 42 and the first mounting frame 41, and further optimizes the heat dissipation effect of the heat dissipation structure.

[0073] In the embodiment, the heat pipe 42 includes a first section 421, a second section 423 and a first connecting section 422. The first section 421 is arranged at one end of the heat pipe 42, and the first section 421 is arranged at the center of the other side of the first mounting frame 41. The center of the first mounting frame 41 has a weak heat dissipation effect, and the heat pipe 42 mainly dissipates heat at the center of the first mounting frame 41, thereby improving the heat dissipation efficiency of the heat dissipation structure. The second section 423 is arranged at the other end of the heat pipe 42, and the second section 423 is arranged vertically at the side edge of the first mounting frame 41. The side wall of the second section 423 is in contact with the inner wall of the shell 5, and the second section 423 quickly transfers heat to the shell 5 for heat dissipation, thereby improving the heat dissipation efficiency. The first connecting section 422 is arranged at the middle part of the heat pipe 42, and the first connecting section 422 connects the first section 421 and the second section 423.

[0074] Further, the first connecting section 422 is a bending structure. On the premise of not occupying other space inside the equipment, the length of the first connecting section 422 can be extended, for example, the first connecting section 422 is arranged in a wave structure or a "U" shaped structure, thereby increasing the contact area of the heat pipe 42 and the first mounting frame 41, and further improving the heat dissipation efficiency of the heat dissipation structure.

[0075] In the present application, the first mounting frame 41 is an integrally formed aluminum alloy frame, and the first mounting frame 41 is provided with a first heat source area 4112 at the center of the other side, and the first section 421 is located in the first heat source area 4112. The center of the first mounting frame 41 has a weak heat dissipation effect, and the heat pipe 42 mainly dissipates heat at the center of the first mounting frame 41, thereby improving the heat dissipation efficiency of the heat dissipation structure.

[0076] The heat pipes 42 in the application are provided in several groups, and the several heat pipes 42 are symmetrically arranged relative to the first heat source area 4112. The first sections 421 of the several heat pipes 42 are located in the first heat source area 4112. Preferably, the heat pipes 42 in the embodiment are provided in two groups, and the two groups of heat pipes 42 are symmetrically arranged relative to the center of the first heat source area 4112. The two groups of heat pipes 42 are respectively connected to the inner walls of the two sides of the shell 5, so as to further improve the heat dissipation efficiency of the heat dissipation structure.

[0077] Preferably, the heat pipes 42 in the application are copper heat pipes, which are convenient for bending and installation, and have excellent heat conduction effect.

[0078] The heat dissipation working principle of the first mounting frame 41 of the application is as follows:

[0079] The heat dissipation structure of the log measuring instrument measuring system in the embodiment is arranged between the corresponding core circuit board 21 and the display main board assembly 31 of the display device 3 of the equipment. The frame is the heat dissipation core component of the entire measuring system, and the core circuit board 21 is the core PCB board of the logical control end of the entire measuring equipment.

[0080] In the process of using the heat dissipation structure of the log measuring instrument measuring system, the heat dissipation effect of the center of the first mounting frame 41 is weak, and the heat pipes 42 in the center of the first mounting frame 41 mainly dissipate heat, so as to improve the heat dissipation efficiency of the heat dissipation structure. The first mounting frame 41 and the shell 5 in the embodiment are both made of aluminum alloy material which is easy to dissipate heat. Moreover, the metal frame structure is not deformed when subjected to external impact, and has strong structural practicability.

[0081] In combination with Figure 15 , Figure 16 and Figure 5 , the second mounting frame structure in the heat dissipation structure is described in detail as follows:

[0082] In the embodiment, the shell 5 is internally provided with a power main board 22, and the top end of the power main board 22 is provided with electronic components. In combination with Figure 6 and Figure 3The second mounting frame 43 comprises a second heat dissipation mounting plate 431, a second support column 436 and a second heat dissipation fin 433; the second heat dissipation mounting plate 431 is horizontally arranged in the shell 5 and is located above the power supply main plate 22; the second support column 436 is arranged in several groups; the second support column 436 is connected with the bottom end of the second heat dissipation mounting plate 431 and is connected with the power supply main plate 22; the power supply main plate 22 is connected with the second heat dissipation mounting plate 431 through the second support column 436; a second heat dissipation area is formed between the second support column 436 and the second heat dissipation mounting plate 431; and the electronic components are located in the second heat dissipation area. The second heat dissipation fin 433 is vertically arranged at the top end of the second heat dissipation mounting plate 431 and improves the heat dissipation effect of the second mounting frame 43.

[0083] Further, the shell 5 in the embodiment is preferably an aluminum alloy shell 5, which improves the heat dissipation effect of the connection between the bottom surface of the power supply main plate 22 and the shell 5.

[0084] In the present application, the shell 5 is arranged to fixedly mount the power supply main plate 22; the power supply main plate 22 is arranged at the bottom end inside the shell 5; the second heat dissipation mounting plate 431 of the second mounting frame 43 is arranged at the top end of the power supply main plate 22 through the second support column 436, so as to facilitate heat dissipation of the top surface of the power supply main plate 22 and improve the heat dissipation effect of the power supply main plate 22. The second heat dissipation fin 433 is arranged at the top end of the second heat dissipation mounting plate 431, which improves the heat dissipation area of the second mounting frame 43 and further improves the heat dissipation efficiency of the wood measuring instrument battery heat dissipation structure.

[0085] In addition, in the embodiment, the core circuit board 21 is arranged above the power supply main plate 22; the second mounting frame 43 separates the core circuit board 21 and the power supply main plate 22, thereby improving the utilization rate of the internal space of the shell 5.

[0086] Further, in the embodiment, the second heat dissipation fin 433 is arranged in several groups; the second heat dissipation fins 433 are uniformly arranged along the top surface of the second heat dissipation mounting plate 431, thereby improving the heat dissipation effect of the second mounting frame 43.

[0087] The core circuit board 21 is vertically arranged inside the shell 5 and is electrically connected with the power supply main plate 22 through the fourth connecting line. The second heat dissipation fin 433 is arranged in at least two groups; the core circuit board 21 is arranged between the adjacent second heat dissipation fins 433; the second heat dissipation mounting plate 431 is further provided with a second wiring hole 4312, which facilitates power supply for the core circuit board 21.

[0088] The core circuit board 21 is arranged above the power supply main plate 22, the second mounting frame 43 separates the core circuit board 21 and the power supply main plate 22, and the utilization rate of the internal space of the shell 5 is improved. The second mounting frame 43 also has a heat dissipation effect on the core circuit board 21, and the practicability of the structure of the second mounting frame 43 is further improved.

[0089] In addition, the second wiring hole 4312 is arranged on the second heat dissipation mounting plate 431, the second wiring hole 4312 facilitates the wiring and power supply of the core circuit board 21, and the second wiring hole 4312 facilitates the circulation of gas above and below the second mounting frame 43, and the heat dissipation efficiency of the second mounting frame 43 is improved.

[0090] The photographing device 1 in the application is arranged on one side of the second mounting frame 43, the second mounting frame 43 is provided with a second baffle 434, the second baffle 434 is connected to one side of the bottom end of the second heat dissipation mounting plate 431, the fourth mounting hole is arranged on the second baffle 434 and connected with the photographing device. The second baffle 434 is arranged to connect with the photographing device 1, the photographing device 1 in the embodiment is connected with the second baffle 434 through the first mounting plate 111, and the first mounting plate 111 is a first aluminum alloy mounting plate. The structure design not only improves the compact assembly of the internal structure of the shell 5, but also facilitates the heat dissipation of the photographing device 1 structure of the second mounting frame 43, and the practicability of the structure is high.

[0091] Further, the photographing device 1 further comprises a first connecting column 1116, and the first mounting plate 111 in the embodiment is connected with the core circuit board 21 through the first connecting column 1116. The second connecting groove 4314 is further arranged on the second heat dissipation mounting plate 431, and the side wall of the first connecting column 1116 is connected with the second connecting groove 4314. The second heat dissipation mounting plate 431 is provided with the second connecting groove 4314, the first positioning groove limits and fixes the position of the first connecting column 1116, and the stability of the connection between the core circuit board 21, the photographing device 1 and the second mounting frame 43 is improved.

[0092] Further, the first connecting column 1116 in the embodiment is an aluminum alloy connecting column. The aluminum alloy connecting column has good heat conduction effect, and facilitates the heat dissipation of the photographing device 1 structure of the second mounting frame 43.

[0093] In addition, the photographing device comprises a first guide cylinder 1112 for fixing a laser, and the second heat dissipation fin 433 is provided with a second limiting groove 4313, the second limiting groove 4313 is in contact with the first guide cylinder 1112 for limiting, the structure not only improves the stability of the connection between the second mounting frame 43 and the photographing device 1, but also improves the area of the contact between the second mounting frame 43 and the laser, improves the use effect of the heat dissipation of the second mounting frame 43, and the practicability of the structure is high.

[0094] In the embodiment, the second reinforcing rib 435 is arranged at the connecting position of the second baffle 434 and the mounting plate, the second reinforcing rib 435 avoids the second baffle 434 from being deformed in the assembling process, and improves the stability of the structure in use.

[0095] Further, the second mounting plate 431 is further provided with the second avoiding gap 4311 of the second heat dissipation fin 433, and the first heat dissipation fin 413 is accommodated in the second avoiding gap 4311, so that the gas circulation between the first mounting frame 41 and the second mounting frame 43 is improved, the overall heat dissipation effect of the heat dissipation structure is improved, and the structure is practical.

[0096] Working principle of the second mounting frame of the application:

[0097] In the log measuring instrument, the power mainboard 22 is arranged in the shell 5, the photographing device 1 and the first mounting frame 41 are arranged at two ends of the power mainboard 22, and the core circuit board 21 is arranged above the power mainboard 22. In the use process of the second mounting frame 43, the bottom end of the second mounting frame 43 protects and dissipates heat for the power mainboard 22, the top end of the second mounting frame 43 supports the core circuit board 21, and the second heat dissipation fin 433 not only improves the heat dissipation efficiency of the second mounting frame 43, but also limits the structure of the core circuit board 21.

[0098] The second mounting frame 43 is connected with the photographing device 1 and the first mounting frame 41 at two ends respectively, the second mounting frame 43 limits and fixes the photographing device 1, and dissipates heat for the photographing device 1. The first mounting frame 41 not only improves the stability of the core circuit board 21 fixed in the shell 5, but also facilitates the conduction of heat of the second mounting frame 43 to the shell 5, so as to further improve the heat dissipation efficiency of the battery heat dissipation structure of the log measuring instrument.

[0099] In addition, the bottom end of the shell 5 of the high-efficiency heat dissipation type log measuring instrument is further provided with a handle 53, the handle 53 facilitates the staff to hold and shoot, and the structure is practical. The handle 53 is a hollow structure, and a power supply device is arranged in the handle 53, and the power supply device is connected with the power mainboard 21.

[0100] In combination Figure 7 - Figure 4 The photographing device in the embodiment is described in detail.

[0101] The photographing device 1 comprises a main frame 11, an industrial camera 12, a laser mechanism 13 and a light-emitting mechanism 14. The industrial camera 12 is connected with the main frame 11, and the industrial camera 12 is located at the center of the main frame 11. The laser mechanism 13 is connected with the main frame 11, and the laser mechanism 13 comprises a plurality of lasers 131, and the plurality of lasers 131 are located outside the industrial camera 12. The light-emitting mechanism 13 is connected with the main frame 11, and the light-emitting mechanism 13 comprises a plurality of strip-shaped LED assemblies 141, and the plurality of strip-shaped LED assemblies 141 are arranged around the outer circle of the laser mechanism 13.

[0102] The photographing device 1 comprises a main frame 11, an industrial camera 12, a laser mechanism 13 and a light-emitting mechanism 14. The industrial camera 12 is connected with the main frame 11, and the industrial camera 12 is located at the center of the main frame 11. The laser mechanism 13 is connected with the main frame 11, and the laser mechanism 13 comprises a plurality of lasers 131, and the plurality of lasers 131 are located outside the industrial camera 12. The light-emitting mechanism 13 is connected with the main frame 11, and the light-emitting mechanism 13 comprises a plurality of strip-shaped LED assemblies 141, and the plurality of strip-shaped LED assemblies 141 are arranged around the outer circle of the laser mechanism 13.

[0103] The structure of the main frame 11 in the embodiment is described in detail as follows:

[0104] In combination with Figure 5 The main frame 11 comprises a first mounting plate 111, a first fixed frame 112, a camera heat sink 123 and a first sealing ring 113. The first fixed frame 112 is provided with a first fixed groove 1122 on the other side, and the first mounting plate 111 is accommodated in the first fixed groove 1122, thereby improving the compactness and installation stability of the main frame 11.

[0105] In combination with Figure 6 and Figure 3 The first mounting plate 111 is provided with a first accommodating groove 1111 at the center of one side, and the industrial camera 12 and the plurality of lasers 131 are arranged in the first accommodating groove 1111. The first mounting plate 111 is further provided with a first fixed seat 1114 around the periphery of one side, and the first fixed seat 1114 is used for connecting the strip-shaped LED assembly 141. The structure design is exquisite, the first accommodating groove 1111 improves the assembly stability of the industrial camera 12 and the laser mechanism 13 during use of the photographing assembly, the first mounting plate 111 is provided with the first fixed seat 1114 around the periphery to connect the strip-shaped LED assembly 141, thereby improving the illumination range of the light-emitting mechanism, further improving the brightness of the photographed picture of the photographing measuring instrument, and improving the accuracy of the instrument photographing detection.

[0106] The first fixed frame 112 is connected with the first mounting plate 111, and is used for limiting the positions of the industrial camera 12, the laser mechanism 13 and the light emitting mechanism 14. The first fixed frame 112 is provided with first light transmission holes corresponding to the positions of the industrial camera 12, the plurality of lasers 131 and the plurality of strip-shaped LED assemblies 141. The first fixed frame 112 closes the first receiving groove 1111 on the first mounting plate 111, thereby improving the stability of integrated assembly of the industrial camera 12, the laser mechanism 13 and the light emitting mechanism 14.

[0107] The first fixed frame 112 in the embodiment is provided with first light transmission holes corresponding to the positions of the industrial camera 12, the plurality of lasers 131 and the plurality of strip-shaped LED assemblies 141. Dustproof lenses are arranged on the first light transmission holes. The dustproof lenses are quartz glass lenses arranged outside the strip-shaped LED assemblies 141, the industrial camera 12 and the plurality of lasers 131, and mainly function to prevent dust and moisture.

[0108] Further, the structure of the first mounting plate 111 in the embodiment is described in detail.

[0109] In combination with Figure 5 Figure 3 The first mounting plate 111 in the embodiment is provided with a first through hole 1115 at the center. The industrial camera 12 includes a camera main plate 121 and a lens assembly 122. The camera main plate 121 is connected with the other side of the first mounting plate 111, and the lens assembly 122 is connected with the camera main plate 121 and penetrates through the first through hole 1115 and is located in the first receiving groove 1111. The main frame 11 further includes a camera heat sink 123 arranged on the other side of the camera main plate 121 and connected with the first mounting plate 111. The camera heat sink 123 is in contact with the camera main plate 121, thereby improving the stability of installation of the camera main plate 121 and the heat dissipation effect of the industrial camera 12.

[0110] Preferably, the industrial camera 12 in the embodiment is a small and light near-infrared enhanced board-level industrial camera.

[0111] In combination with Figure 7 and Figure 3 The laser mechanism 13 in the embodiment is described in detail.

[0112] ​The angle between the axis of the laser 131 and the axis of the camera in this embodiment is a first preset angle, and the first guide cylinder 1112 is further arranged on the first mounting plate 111. The laser 131 is inserted with the first guide cylinder 1112, and the angle between the axis of the first guide cylinder 1112 and the axis of the industrial camera 12 is equal to the first preset angle. The first preset angle in this embodiment is 0°-60°, and the angle between the axis of the first guide cylinder 1112 and the axis of the industrial camera 12 is also between 0°-60°. Preferably, the first preset angle in this embodiment is 30°.

[0113] The plurality of lasers include two cross visible lasers and two invisible lasers, and the two cross visible lasers and the two invisible lasers are arranged in a rectangular array around the first mounting plate; wherein the two cross visible lasers are respectively located on a first diagonal line of the first mounting plate, and the two invisible lasers are respectively located on a second diagonal line of the first mounting plate, and the first diagonal line and the second diagonal line are perpendicular to each other.

[0114] The main frame structure is made of aluminum alloy material, which is the main structure of the entire shooting device. The industrial camera, cross line laser, LED light source and other components are all installed on the main frame structure. The main frame structure has high strength and small thermal deformation coefficient. There are four first guide cylinders on the main frame structure, which are diagonally distributed and have an angle of 90° between each other. The cross line laser has two wavelengths, 638nm and 850nm, of which the visible laser of 638nm is used for manual aiming, and the invisible laser of 850nm is used for actual measurement. The four lasers are divided into two groups: visible laser group and invisible laser group, and are installed according to the diagonal line in the group. The angle between the rotation axis of the laser and the normal line of the plane where the main frame structure is located is 30°, which is convenient for the device to measure the log.

[0115] In combination with Figure 5 , Figure 6 and Figure 4 , the light emitting mechanism 14 in this embodiment will be described in detail:

[0116] The light emitting mechanism 14 includes a plurality of strip-shaped LED assemblies 141, and the plane where the strip-shaped LED assembly 141 is located is arranged at a second preset angle with the plane where the first mounting plate 111 is located. Taking the plane where the first mounting plate 111 is located as the reference, the height of the strip-shaped LED assembly 141 on the side away from the industrial camera 12 gradually decreases. The inclination of the strip-shaped LED facilitates the light emitting mechanism 14 to illuminate the periphery of the device, thereby improving the illumination range of the light emitting mechanism.

[0117] The strip-shaped LED assembly 141 provides active lighting for the shooting device, and the wavelength of the LED light source is 850nm. The four strip-shaped light sources are arranged in a rectangular shape, and each light source has 8 LED lamp beads.

[0118] The other structures of the main frame 11 in the embodiment are described as follows:

[0119] In combination with Figure 6 and Figure 3 , the main frame 11 further comprises a first sealing ring 113, which is sleeved around the periphery of the first mounting plate 111 and seals the periphery of the first mounting plate 111 and the inner wall of the first fixing groove 1122, thereby improving the sealing performance and stability of the main frame 11.

[0120] In the embodiment, the first fixing frame 112 is provided with a limiting curved surface 1123 at the position corresponding to the first receiving groove 1111, the limiting curved surface 1123 is convex in the direction close to the first recess, the limiting curved surface 1123 limits the laser mechanism 13 and the light emitting mechanism 14, thereby improving the stability of the laser mechanism 13 and the industrial camera 12 during use, and avoiding the shaking of the laser 131.

[0121] In the embodiment, the other side of the first mounting plate 111 is further provided with a first heat dissipation groove 1113, thereby improving the heat dissipation effect of the first mounting plate 111.

[0122] In combination with Figure 3 , the structure of the first fixing frame 112 in the embodiment is described as follows:

[0123] The first fixing frame 112 comprises a first fixing end 1126, a second fixing end 1128 and an intermediate connecting section 1127; the first fixing end 1126 is arranged at one end of the first fixing frame 112 and is connected with the periphery of the first mounting plate 111; the second fixing end 1128 is arranged at the other end of the first fixing frame 112, and the limiting curved surface 1123 is arranged at the second fixing end 1128; the intermediate connecting section 1127 is arranged at the middle part of the first fixing frame 112 and connects the periphery of the second fixing end 1128 with the periphery of the second fixing end 1128, and the intermediate connecting section 1127 is provided with an intermediate insertion hole and a first connecting seat.

[0124] The width of the first fixing end 1126, the intermediate connecting section 1127 and the second fixing end 1128 gradually decreases along the projection in the plane of the first mounting plate 111, thereby improving the stability of the first fixing frame 112 in limiting the structures of the industrial camera 12, the laser mechanism 13, the light emitting mechanism 14 and the first mounting plate 111.

[0125] In combination with Figure 5 , Figure 6 and Figure 1The main body frame 11 further comprises a first buckle 114, which is buckled with the corner of the first fixed frame 112 to avoid the corner structure of the main body frame 11 from being easily damaged by collision. The first fixed frame 112 is provided with a first protection groove 1124 at each corner, and the first buckle 114 is buckled with the first protection groove 1124 to improve the stability of the connection between the first buckle 114 and the first fixed frame 112.

[0126] Further, the first buckle 114 is provided with a first positioning groove 1141 on the other side, which accommodates the corner of the first mounting plate 111 and the corner of the first fixed frame 112 to protect the corner of the first mounting plate 111 from being damaged by collision. The first fixed frame 112 is provided with a first clamping groove 1125 on one side, and the first positioning groove 1141 is provided with a first protrusion 1142 on the inner wall, which is buckled with the first clamping groove 1125 to further improve the stability of the connection between the first buckle 114 and the first fixed frame 112.

[0127] The first fixed frame 112 in the embodiment is a frame structure made of plastic material, which mainly functions as sealing and protection. It prevents dust, water vapor and other substances from entering the measuring device, and at the same time protects the first mounting plate structure made of aluminum behind it, so that the metal frame structure does not deform when subjected to external impact.

[0128] The working principle of the photographing device 1 of the present application is as follows:

[0129] I. Assembling the industrial camera 12 and the first mounting plate 111.

[0130] First, the lens assembly 122 in the industrial camera 12 is inserted through the first through hole 1115 in the center of the first mounting plate 111, so that the lens assembly 122 is accommodated in the first accommodation groove 1111, and then the camera main board 121 is fixed to the other side of the first mounting plate 111 by screws.

[0131] Then, the camera heat sink 123 is buckled at the position of the camera main board 121, and the camera heat sink 123 is fixed to the other side of the first mounting plate 111 by screws.

[0132] II. Assembling the laser mechanism 13 and the first mounting plate 111.

[0133] The laser 131 of the laser mechanism 13 is inserted into the first guide cylinder 1112 on one side of the first mounting plate 111, and then the other end of the laser 131 penetrates through the first guide cylinder 1112 and is connected, which improves the stability of the structure during the assembly of the laser 131 and the first mounting plate 111.

[0134] III. Assembling the light emitting mechanism 14 and the first mounting plate 111.

[0135] The plurality of strip-shaped LED assemblies 141 in the light-emitting mechanism 14 are obliquely assembled by the obliquely arranged first fixing seat 1114, so that the light-emitting surface of the light-emitting mechanism is obliquely outward, thereby improving the illumination range of the light-emitting mechanism.

[0136] IV. The first fixing frame 112 is assembled with the first mounting plate 111 on which the industrial camera 12, the laser mechanism 13 and the light-emitting mechanism 14 are assembled.

[0137] First, the first sealing ring 113 is sleeved on the periphery of the first mounting plate 111, and then the first fixing frame 112 is buckled on the first mounting plate 111, so that the first mounting plate 111 is accommodated in the first fixing frame 112, and the first sealing ring 113 seals the periphery of the first mounting plate 111 and the inner wall of the first fixing groove 1122, thereby improving the compactness and sealing performance of the structure.

[0138] V. The first buckle 114 is installed on the periphery of the first fixing frame 112.

[0139] The first buckle 114 is buckled with the first protection groove 1124 at the corner of the first fixing frame 112, which avoids the structure of the main frame 11 from being worn during shooting, thereby prolonging the service life of the equipment.

[0140] In this way, the installation process of the shooting device 1 of the preferred embodiment is completed.

[0141] The other structures of the high-efficiency heat dissipation type log measuring instrument in the application will be described in detail as follows:

[0142] In combination with Figure 2 , Figure 8 and Figure 10 , Figure 8 , the high-efficiency heat dissipation type log measuring instrument in the embodiment further includes an auxiliary shooting structure, which includes a shell 5, a face shield 7 and a light shield 6. The shell 5 is provided with a shooting surface on one side. The face shield 7 is connected with the shell 5 on one side, and the face shield 7 accommodates the shooting surface. The light shield 6 is arranged above the shooting surface, and one end of the light shield 6 is connected with the outer wall of the shell 5. The face shield avoids dust, and the light shield 6 avoids light halo in shooting, thereby improving the shooting quality of the equipment.

[0143] In combination with Figure 9 , the structure of the light shield 6 in the embodiment will be described in detail:

[0144] In the embodiment, the outer surface of the shell 5 is provided with a fifth clamping groove 51, and one end of the light shield 6 is provided with a fifth clamping block 61, which is buckled with the fifth clamping groove 51. The light shield 6 is buckled with the shell 5, so that the structure is detachable and convenient to assemble and use.

[0145] Further, the fifth clamping groove 51 is in a long strip structure, the long side of the fifth clamping groove 51 is perpendicular to the plane of the shooting surface, and the fifth clamping block 61 is adjustable along the position of the fifth clamping groove 51. The clamping groove on the shell 5 is in a long strip structure, which is convenient for adjusting the length of the light shield cover 6, thereby facilitating the surveying and mapping of logs of different sizes and improving the practicability of the equipment structure. In addition, the light shield cover 6 in the embodiment can be directly slid to the tail end of the fifth clamping groove 51 when placed in the equipment box, thereby reducing the occupied space of the equipment and being more portable.

[0146] In addition, the light shield cover 6 is provided with a fifth deformation groove 62 on one side. The fifth deformation groove 62 is arranged on the outer side of the light shield cover 6, which is convenient for users to disassemble and assemble the light shield cover 6, improves the compression deformation resistance of the light shield cover 6, and avoids the collapse of the fifth clamping block 61 during the clamping and disassembling process.

[0147] In addition, the fifth clamping groove 51 is provided in several groups, and the several fifth clamping grooves 51 are arranged in a vertical direction. The arrangement of the several fifth clamping grooves 51 in the vertical direction not only facilitates the adjustment of the height of the light shield cover 6 and improves the use effect of the structure of the light shield cover 6, but also improves the heat dissipation effect of the shell 5, and the structure is simple and practical.

[0148] In the embodiment, the light shield cover 6 is provided with a fifth reinforcing rib 63 inside, which improves the strength of the light shield cover 6, avoids the bending of the light shield cover 6, and ensures the shooting effect of the equipment.

[0149] In combination Figure 10 and ​ The structure of the mask 7 in the present application will be described in detail as follows:

[0150] In the present application, the sixth clamping protrusion 71 is arranged on the inner side of the mask 7, the sixth clamping groove is arranged on the outer side of the shell 5, and the sixth clamping protrusion 71 is clamped with the sixth clamping groove. The sixth clamping protrusion 71 is arranged on the inner side of the mask 7, the sixth clamping groove is arranged on the outer side of the shell 5, and the sixth clamping protrusion 71 is clamped with the sixth clamping groove, thereby facilitating the assembly of the mask 7 and improving the practicability of the structure, and the mask 7 can be replaced when it is scratched.

[0151] Further, the sixth deformation groove 72 is arranged on the outer side of the mask 7, and the position of the sixth deformation groove 72 corresponds to the position of the sixth clamping protrusion 71. The sixth deformation groove 72 is arranged on the outer side of the mask 7 corresponding to the position of the sixth clamping protrusion 71, which is convenient for the assembly of the mask 7, and also improves the stress resistance during the clamping and assembly of the mask 7, thereby avoiding the breakage of the mask 7.

[0152] In this embodiment, the mask 7 includes a fifth end portion 73, a sixth end portion 74, and a sixth connecting portion 75; the fifth end portion 73 is arranged on one side of the mask 7; the sixth end portion 74 is arranged on the other side of the mask 7 and is inserted on one side of the shell 5; and the sixth connecting portion 75 is arranged in the middle of the mask 7 and connects the circumferential side of the fifth end portion 73 and the circumferential side of the sixth end portion 74. In the projection along the shooting surface, the width of the fifth end portion 73 is smaller than the width of the sixth end portion 74.

[0153] The mask 7 with the ladder structure is convenient for users to grasp and assemble, reduces the unnecessary occupied volume of the mask 7, simplifies the structure of the mask 7, and is convenient for production and use. The width of the fifth end portion 73 is smaller than the width of the sixth end portion 74. The width of the sixth connecting portion gradually decreases away from the sixth end portion 74, which limits the installation position of the mask 7 relative to the shell 5 and avoids the pressing of the shooting structure of the device in the mask 7, thereby ensuring the safety of the mask 7 during use.

[0154] Further, the central region of the fifth end portion 73 is provided with an alignment groove 741. This facilitates the user to quickly align the center of the measuring instrument with the object to be shot, and the structure is highly practical.

[0155] The working principle of the auxiliary shooting structure of the present application is as follows.

[0156] During use of the device, the mask 7 is arranged on one side of the shooting surface and is clamped with the shell 5. The mask 7 is used to prevent dust, water vapor and the like from polluting the camera lens and the laser lens, and can also prevent external force from damaging the measuring device, thereby improving the safety during use of the device.

[0157] The mask 7 in the present application has a ladder structure, which is convenient for users to grasp and assemble, reduces the unnecessary occupied volume of the mask 7, simplifies the structure of the mask 7, and is convenient for production and use. In the mask 7, the width of the fifth end portion 73 is smaller than the width of the sixth end portion 74. The width of the sixth connecting portion gradually decreases away from the sixth end portion 74, which limits the installation position of the mask 7 relative to the shell 5 and avoids the pressing of the shooting structure of the device in the mask 7, thereby ensuring the safety of the mask 7 during use.

[0158] The light shield 6 is clamped and installed at the top end of the shell 5, which avoids the formation of a "halo" phenomenon in the picture when the shooting device shoots the picture against the light, thereby improving the measurement accuracy of the device. In addition, the light shield 6 in the present application.

[0159] Further, the outer surface of the shell 5 is provided with a fifth clamping groove 51, one end of the light shield 6 is provided with a fifth clamping block 61, and the fifth clamping block 61 is clamped with the fifth clamping groove 51. The clamping of the light shield 6 and the shell 5 makes the structure detachable and facilitates assembly and use.

[0160] Further, the fifth clamping groove 51 on the shell 5 is a long strip structure, facilitating the adjustment of the light shielding length of the light shield 6, thereby facilitating the surveying of trees of different sizes and improving the practicability of the equipment structure

[0161] Thus, the use process of the auxiliary photographing structure of the measuring device of the preferred embodiment is completed.

[0162] To sum up, although the present application has been disclosed in the preferred embodiment as above, the above-mentioned preferred embodiment is not used to limit the present application, and those skilled in the art can make various changes and decorations without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is subject to the scope defined by the claims.

Claims

1. A high-efficiency heat dissipation type log measuring instrument, characterized by comprising: a log measuring device; a heat dissipation device; and a heat dissipation control device. The utility model relates to a kind of camera, including: Shell; Photographing device, it is arranged in the one side of the shell, for shooting; Display device, it is arranged in the other side of the shell, for showing image; Driving device, it is arranged in the inside of the shell, the driving device is located between the photographing device and display device, the driving device is connected with the photographing device and the display device, the driving device includes power supply mainboard and the core circuit board being arranged above the power supply mainboard; And Heat dissipation device, it is fixed in the inside of the shell, the heat dissipation device includes: First mounting frame, it is vertically arranged between the core circuit board and the display device, the first mounting frame both ends are connected with the inside both sides of the shell;And Second mounting frame, it is transversely arranged between the power supply mainboard and the core circuit board, the second mounting frame one side is connected with the photographing device, the second mounting frame other side is connected with the second mounting frame; The first mounting frame includes: First heat dissipation mainboard, it is vertically arranged in the shell, the first heat dissipation mainboard is connected with the core circuit board by first support column; First heat dissipation fin, it is arranged in the first heat dissipation mainboard one side, and the first heat dissipation fin is located between core circuit board and first heat dissipation mainboard, the plane where the first heat dissipation fin is and the plane where the first heat dissipation mainboard is cross;And First heat dissipation mounting plate, it is arranged with two groups, two groups the first heat dissipation mounting plate is connected with the first heat dissipation mainboard both ends respectively, two groups the first heat dissipation mounting plate is connected with the inside wall both ends of the shell respectively, and the contact area of first mounting frame and shell is improved.

2. The high-efficiency heat-dissipation log measuring instrument according to claim 1, characterized by The heat dissipation device further includes heat pipe, the heat pipe is arranged in the other side of the first mounting frame, and the heat pipe connects the first mounting frame with the shell.

3. The high-efficiency heat-dissipation log measuring instrument according to claim 2, characterized in that, The first mounting groove is arranged in the other side of the first mounting frame, and the heat pipe is clamped with the first mounting groove.

4. The high-efficiency heat dissipating log measuring instrument according to claim 3, characterized in that, The first heat dissipation source area is arranged in the center of the other side of the first mounting frame, and the heat pipe includes: First section, it is arranged in the one end of the heat pipe, and the first section is located in the first heat dissipation source area; Second section, it is arranged in the other end of the heat pipe, and the second section is vertically arranged in the side of the first mounting frame, and the side wall of the second section is in contact with the inside wall of the shell;And First connecting section, it is arranged in the middle of the heat pipe, and the first section and second section are connected.

5. The high-efficiency heat dissipating log measuring instrument according to claim 4, characterized in that, The second mounting frame includes: Second heat dissipation mounting plate, it is horizontally arranged in the shell, and the second heat dissipation mounting plate is located above the power supply mainboard; Second support column, it is arranged with several groups, several the second support column is connected with the bottom end of the second heat dissipation mounting plate, the second support column is connected with the power supply mainboard, and the second support column forms second heat dissipation area with the second heat dissipation mounting plate;And Second heat dissipation fin, it is vertically arranged in the top end of the second heat dissipation mounting plate.

6. The high-efficiency heat dissipating log measuring instrument according to claim 5, characterized by The second heat dissipation fin is arranged with at least two groups, and the core circuit board is arranged between adjacent second heat dissipation fins;Second wiring hole is further arranged on the second heat dissipation mounting plate, and the second wiring hole facilitates power supply of the core circuit board.

7. The high-efficiency heat dissipating log measuring instrument according to claim 5, characterized by The second heat dissipation mounting plate is provided with a second fixing pin on the other side, and the second fixing pin is connected with the first mounting frame.

8. The high-efficiency heat dissipating log measuring instrument according to claim 7, characterized in that, The second heat dissipation mounting plate is further provided with a second avoiding gap, and the bottom end of the second heat dissipation fin is accommodated in the second avoiding gap.

9. The high-efficiency heat dissipating log measuring instrument according to claim 7, characterized by The photographing device comprises a first connecting column connected with the core circuit board. The second heat dissipation mounting plate is further provided with a second connecting groove, and the sidewall of the first connecting column is connected with the second connecting groove.

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