Solid state disk storage grain welding anomaly detection method and device, equipment and medium

By connecting the host to the solid-state drive, burning error information statistics firmware, performing full disk read and write tests, analyzing error distribution, solving the soldering problem, realizing rapid detection and feedback of soldering abnormalities, improving the quality of solid-state drives and reducing production costs.

CN115101116BActive Publication Date: 2026-05-19SHANDONG YUNHAI GUOCHUANG CLOUD COMPUTING EQUIP IND INNOVATION CENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANDONG YUNHAI GUOCHUANG CLOUD COMPUTING EQUIP IND INNOVATION CENT CO LTD
Filing Date
2022-07-27
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

In existing technologies, read status errors caused by poor soldering during the production process of solid-state drives (SSDs) cannot be detected in a timely and accurate manner, affecting product quality, and there is a lack of effective judgment methods.

Method used

By connecting the host to the solid-state drive, the error information statistics firmware is burned, a full disk read and write test is performed, the error location is recorded, and the error distribution is analyzed according to preset rules to determine whether there are any abnormalities in the soldering of the storage chips.

Benefits of technology

Timely detection and feedback of welding abnormalities improve product quality and reduce production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to the technical field of storage, and particularly relates to a solid state disk storage grain welding abnormality detection method, device, equipment and medium.The method comprises the following steps: connecting a to-be-detected solid state disk to a control host; using the control host to burn an error information statistics firmware into the to-be-detected solid state disk; using the control host to perform a full-disk read-write test on the to-be-detected solid state disk, so that the error information statistics firmware records the positions of errors occurring in the process of performing the full-disk read-write test on the to-be-detected solid state disk; using the control host to read all the positions of errors corresponding to the full-disk read-write test from the to-be-detected solid state disk, and performing statistical analysis according to a preset rule to obtain error distribution statistical results; and judging whether the solid state disk has welding abnormality according to the error distribution statistical results.The scheme of the present application can quickly find welding abnormality problems in the solid state disk and feed back to the factory, which helps to improve the quality of the solid state disk and reduce the production cost.
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Description

Technical Field

[0001] This invention relates to the field of storage technology, and in particular to a method, apparatus, equipment, and medium for detecting welding anomalies in solid-state drive (SSD) storage particles. Background Technology

[0002] Information storage, recording history, and preserving civilization are indispensable means for the continuation and development of human society. Solid-state drives (SSDs) are hard drives made using solid-state electronic storage chip arrays. They consist of a control unit and storage units (FLASH chips, DRAM chips, and cache units). As a crucial storage product using flash memory as the storage medium, SSDs are widely used in mobile terminals, laptops, desktops, servers, and data centers, with extremely high demand. As data carriers, besides high performance and large capacity, enterprise customers also place stringent requirements on SSDs in various performance aspects, including lifespan, stability and reliability, power consumption control, system compatibility, data error correction, and data retention capabilities.

[0003] Currently, most solid-state drives (SSDs) use Nand Flash memory as their storage medium. During factory production, due to insufficient factory experience or differences in processes, some SSDs may have poor Nand Flash soldering, leading to read errors in some units. Currently, there is no effective method in the industry to diagnose these soldering defects, causing them to go undetected and compromise SSD product quality. Therefore, improvements are urgently needed. Summary of the Invention

[0004] In view of this, it is necessary to provide a method, device, equipment and medium for detecting abnormal welding of solid-state drive storage particles in response to the above technical problems.

[0005] According to a first aspect of the present invention, a method for detecting soldering anomalies in solid-state drive (SSD) memory chips is provided, the method comprising:

[0006] Connect the solid-state drive to be tested to the control host;

[0007] The control host is used to burn the error information statistics firmware into the solid-state drive to be tested;

[0008] The control host is used to perform a full disk read / write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occurred during the full disk read / write test of the solid-state drive under test.

[0009] The control host is used to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and statistical analysis is performed according to preset rules to obtain the error distribution statistics.

[0010] Based on the error distribution statistics, it can be determined whether there are any abnormalities in the soldering of the solid-state drive's storage chips.

[0011] In some embodiments, connecting the solid-state drive to be tested to the control host includes:

[0012] The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

[0013] In some embodiments, the error information statistics firmware records the location where the error occurred using the following steps:

[0014] Create a status record table;

[0015] Receive command requests to erase, write, or read data at a specific location on the solid-state drive to be tested;

[0016] Determine if the data read return status is normal;

[0017] In response to a normal read data status, the process returns to the next position from a given position to execute the command request for receiving, erasing, writing, or reading data.

[0018] In response to an abnormal read data status, the position corresponding to the abnormal read / write status is recorded in the status record table, and the next position of a certain position is returned to execute the command request to receive, erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information of each position.

[0019] In response to the completion of erasing, writing, and reading data in all locations of the solid-state drive under test, the status record table is saved to the solid-state drive under test.

[0020] In some embodiments, the step of using the control host to read all locations where errors occurred during the full disk read / write test from the solid-state drive under test, and performing statistical analysis according to preset rules to obtain error distribution statistics includes:

[0021] The status record table saved by the solid-state drive under test is read using the nvme cli command;

[0022] Count the number of pages in the status record table that belong to the same channel, the same chip select signal, and the same logic unit;

[0023] The rm_show command outputs the channel information, chip select signal information, logic unit information, and the statistically obtained quantity for each logic unit.

[0024] In some embodiments, determining whether there are abnormalities in the soldering of the solid-state drive's storage chips based on the error distribution statistics includes:

[0025] Compare the quantity corresponding to each logic unit with the preset value;

[0026] If the number of a certain logical unit exceeds a preset value, it is confirmed that the soldering of the memory chips in that logical unit is abnormal.

[0027] In some embodiments, determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics further includes:

[0028] Calculate the sum of the quantities corresponding to all logic units;

[0029] Calculate the ratio of the sum to the total number of logic units;

[0030] The ratio is used as the preset value.

[0031] In some embodiments, after the step of determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics, the method further includes:

[0032] The control host is used to delete the error information statistics firmware in the solid-state drive under test.

[0033] According to a second aspect of the present invention, a device for detecting abnormal soldering of solid-state drive (SSD) memory chips is provided, the device comprising:

[0034] A connection module configured to connect the solid-state drive under test to the control host;

[0035] A programming module is configured to use the control host to program error information statistics firmware into the solid-state drive to be tested;

[0036] The testing module is configured to use the control host to perform a full-disk read and write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occur during the read and write test of the solid-state drive under test;

[0037] The analysis module is configured to use the control host to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and perform statistical analysis according to preset rules to obtain error distribution statistics.

[0038] The judgment module is configured to determine whether there are any abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics.

[0039] According to a third aspect of the present invention, a computer device is also provided, the computer device comprising:

[0040] At least one processor; and

[0041] The memory stores a computer program that can run on a processor. When the processor executes the program, it performs the aforementioned method for detecting welding anomalies in solid-state drive storage particles.

[0042] According to a fourth aspect of the present invention, a computer-readable storage medium is also provided, which stores a computer program that, when executed by a processor, performs the aforementioned solid-state drive storage particle welding anomaly detection method.

[0043] The aforementioned method for detecting soldering anomalies in solid-state drive (SSD) storage chips involves establishing a connection between a control host and the SSD under test, then burning error information statistics firmware to the SSD. The control host then performs a full-disk read / write test on the SSD to record the locations of errors that occurred during the test. The system then analyzes all error locations according to preset rules to obtain error distribution statistics. Finally, based on these statistics, it determines whether there are soldering anomalies in the SSD's storage chips. This allows for timely and rapid detection of soldering anomalies in the SSD and provides feedback to the factory, facilitating reprocessing and troubleshooting. This approach helps improve SSD quality and reduce production costs.

[0044] In addition, the present invention also provides a solid-state drive storage chip welding anomaly detection device, a computer device, and a computer-readable storage medium, which can achieve the above-mentioned technical effects, and will not be described in detail here. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0046] Figure 1 A flowchart of a method for detecting welding anomalies in solid-state drive storage chips according to an embodiment of the present invention;

[0047] Figure 2A schematic diagram of the hardware architecture of a method for detecting welding anomalies in solid-state drive storage particles provided in another embodiment of the present invention;

[0048] Figure 3 A schematic diagram of the processing flow of error information statistics firmware provided in one embodiment of the present invention;

[0049] Figure 4 This is a schematic diagram of error distribution statistics provided in one embodiment of the present invention;

[0050] Figure 5 A schematic diagram of a solid-state drive storage chip welding anomaly detection device provided in another embodiment of the present invention;

[0051] Figure 6 This is an internal structural diagram of a computer device according to another embodiment of the present invention. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to specific examples and the accompanying drawings.

[0053] It should be noted that all uses of "first" and "second" in the embodiments of the present invention are for the purpose of distinguishing two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of the present invention. Subsequent embodiments will not explain this in detail.

[0054] In one embodiment, please refer to Figure 1 As shown, the present invention provides a method 100 for detecting abnormal soldering of solid-state drive storage chips. Specifically, the method includes the following steps:

[0055] Step 101: Connect the solid-state drive to be tested to the control host;

[0056] Step 102: Use the control host to burn the error information statistics firmware into the solid-state drive to be tested;

[0057] Step 103: Use the control host to perform a full disk read / write test on the solid-state drive under test so that the error information statistics firmware records the location of the error that occurred during the full disk read / write test of the solid-state drive under test;

[0058] Step 104: Use the control host to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and perform statistical analysis according to preset rules to obtain the error distribution statistics.

[0059] Step 105: Determine whether there are any abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics.

[0060] The aforementioned method for detecting soldering anomalies in solid-state drive (SSD) storage chips involves establishing a connection between a control host and the SSD under test, then burning error information statistics firmware to the SSD. The control host then performs a full-disk read / write test on the SSD to record the locations of errors that occurred during the test. The system then analyzes all error locations according to preset rules to obtain error distribution statistics. Finally, based on these statistics, it determines whether there are soldering anomalies in the SSD's storage chips. This allows for timely and rapid detection of soldering anomalies in the SSD and provides feedback to the factory, facilitating reprocessing and troubleshooting. This approach helps improve SSD quality and reduce production costs.

[0061] In some embodiments, step 101, connecting the solid-state drive to be tested to the control host, includes:

[0062] The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

[0063] In some embodiments, the error information statistics firmware records the location where the error occurred using the following steps:

[0064] Create a status record table;

[0065] Receive command requests to erase, write, or read data at a specific location on the solid-state drive to be tested;

[0066] Determine if the data read return status is normal;

[0067] In response to a normal read data status, the process returns to the next position from a given position to execute the command request for receiving, erasing, writing, or reading data.

[0068] In response to an abnormal read data status, the position corresponding to the abnormal read / write status is recorded in the status record table, and the next position of a certain position is returned to execute the command request to receive, erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information of each position.

[0069] In response to the completion of erasing, writing, and reading data in all locations of the solid-state drive under test, the status record table is saved to the solid-state drive under test.

[0070] In some embodiments, step 101, which involves using the control host to read all locations where errors occurred during the full disk read / write test from the solid-state drive under test, and performing statistical analysis according to preset rules to obtain error distribution statistics, includes:

[0071] The status record table saved by the solid-state drive under test is read using the nvme cli command;

[0072] Count the number of pages in the status record table that belong to the same channel, the same chip select signal, and the same logic unit;

[0073] The rm_show command outputs the channel information, chip select signal information, logic unit information, and the statistically obtained quantity for each logic unit.

[0074] In some embodiments, step 105 above, determining whether there are abnormalities in the soldering of the solid-state drive's storage chips based on the error distribution statistics, includes:

[0075] Compare the quantity corresponding to each logic unit with the preset value;

[0076] If the number of a certain logical unit exceeds a preset value, it is confirmed that the soldering of the memory chips in that logical unit is abnormal.

[0077] In some embodiments, step 105 above, determining whether there are any abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics, further includes:

[0078] Calculate the sum of the quantities corresponding to all logic units;

[0079] Calculate the ratio of the sum to the total number of logic units;

[0080] The ratio is used as the preset value.

[0081] In some embodiments, after step 105, which determines whether there are any abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics, the method further includes:

[0082] The control host is used to delete the error information statistics firmware in the solid-state drive under test.

[0083] In yet another embodiment, for ease of understanding of the present invention, the following is used... Figure 2 Taking the illustrated architecture as an example, and considering a PC as the control host, and a solid-state drive (SSD) manufactured in a factory as the SSD to be tested, this embodiment provides another method for detecting abnormal soldering of SSD storage chips. The specific implementation process is as follows:

[0084] Step 1: Flash error statistics firmware containing read error information to the factory-produced solid-state drives (SSDs). Specifically, connect the SSD to a computer or server with a Linux system and flash the firmware containing read error information. The processing flow for the read error information firmware is shown in the attached figure. Figure 3 As shown.

[0085] Step two, execute the random read / write test script and analyze the distribution of read errors; specifically, after flashing the firmware in step one, execute the following random read / write test cases:

[0086] fio--ioengine=libaio--direct=1--norandommap--randrepeat=0--buffered=0--refill_buffers--name=128k -sw-loop1--bs=128k--rw=randrw--numjobs=4--iodepth=128--size=100%--loops=10--filename= / dev / nvme0n1

[0087] Step 3: Display the distribution information of the read error locations using terminal commands. Specifically, first enter command input mode using the command "nvme cli", then use "rm_show" to output the statistical information of the read status failure locations, as shown in the attached image. Figure 4 As shown;

[0088] Step four: Based on the distribution information of read error locations in the SSD, infer whether there are soldering problems with the NAND Flash chips in the SSD. For example, see attached... Figure 4 In the middle, the chip select signal ce1 of channels ch9 and ch14 has a significantly higher number of read errors than other positions, which suggests that there may be soldering problems at these two positions.

[0089] The above-mentioned method for detecting welding anomalies in solid-state drive (SSD) storage chips involves pre-programming firmware containing statistical read error information into the SSD, performing read and write tests on the SSD to record error locations using the firmware, and then analyzing the read error locations to pinpoint whether there are welding problems in certain SSDs with read anomalies. This allows for quick feedback to the factory, facilitating further processing and troubleshooting of the welding issues.

[0090] In some embodiments, please refer to Figure 5 As shown, the present invention also provides a solid-state drive (SSD) storage chip soldering anomaly detection device 200, the device comprising:

[0091] Connection module 201 is configured to connect the solid-state drive to be tested to the control host.

[0092] The programming module 202 is configured to use the control host to program the error information statistics firmware into the solid-state drive to be tested;

[0093] Test module 203 is configured to use the control host to perform a full-disk read and write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occur during the read and write test of the solid-state drive under test;

[0094] Analysis module 204 is configured to use the control host to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and perform statistical analysis according to preset rules to obtain error distribution statistics.

[0095] The judgment module 205 is configured to determine whether there is an abnormality in the soldering of the storage chips of the solid-state drive based on the error distribution statistics.

[0096] The aforementioned solid-state drive (SSD) storage chip soldering anomaly detection device establishes a connection between a control host and the SSD under test, then burns error information statistics firmware to the SSD. The control host then performs a full-disk read / write test on the SSD to record the locations of errors that occurred during the test. The device then statistically analyzes all error locations according to preset rules to obtain error distribution statistics. Finally, based on the error distribution statistics, it determines whether there are soldering anomalies in the SSD's storage chips. This allows for timely and rapid detection of soldering anomalies in the SSD and provides feedback to the factory, facilitating reprocessing and troubleshooting. This helps improve the quality of SSDs and reduce production costs.

[0097] In some embodiments, the connection module 201 is further configured to:

[0098] The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

[0099] In some embodiments, the error information statistics firmware records the location where the error occurred using the following steps:

[0100] Create a status record table;

[0101] Receive command requests to erase, write, or read data at a specific location on the solid-state drive to be tested;

[0102] Determine if the data read return status is normal;

[0103] In response to a normal read data status, the process returns to the next position from a given position to execute the command request for receiving, erasing, writing, or reading data.

[0104] In response to an abnormal read data status, the position corresponding to the abnormal read / write status is recorded in the status record table, and the next position of a certain position is returned to execute the command request to receive, erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information of each position.

[0105] In response to the completion of erasing, writing, and reading data in all locations of the solid-state drive under test, the status record table is saved to the solid-state drive under test.

[0106] In some embodiments, the analysis module 204 is further configured to:

[0107] The status record table saved by the solid-state drive under test is read using the nvme cli command;

[0108] Count the number of pages in the status record table that belong to the same channel, the same chip select signal, and the same logic unit;

[0109] The rm_show command outputs the channel information, chip select signal information, logic unit information, and the statistically obtained quantity for each logic unit.

[0110] In some embodiments, the determining module 205 is further configured to:

[0111] Compare the quantity corresponding to each logic unit with the preset value;

[0112] If the number of a certain logical unit exceeds a preset value, it is confirmed that the soldering of the memory chips in that logical unit is abnormal.

[0113] In some embodiments, the determining module 205 is further configured to:

[0114] Calculate the sum of the quantities corresponding to all logic units;

[0115] Calculate the ratio of the sum to the total number of logic units;

[0116] The ratio is used as the preset value.

[0117] In some embodiments, the apparatus further includes:

[0118] The deletion module is configured to delete the error information statistics firmware in the solid-state drive under test by using the control host after determining whether there is an abnormality in the soldering of the storage chips of the solid-state drive based on the error distribution statistics results.

[0119] It should be noted that the specific limitations of the solid-state drive (SSD) memory chip soldering anomaly detection device can be found in the limitations of the SSD memory chip soldering anomaly detection method described above, and will not be repeated here. Each module in the aforementioned SSD memory chip soldering anomaly detection device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of the computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0120] According to another aspect of the present invention, a computer device is provided, which may be a server, and its internal structure diagram is shown below. Figure 6 As shown. The computer device includes a processor, memory, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores data. The network interface communicates with external terminals via a network connection. When the computer program is executed by the processor, it implements the aforementioned method for detecting welding anomalies in solid-state drive storage particles. Specifically, the method includes the following steps:

[0121] Connect the solid-state drive to be tested to the control host;

[0122] The control host is used to burn the error information statistics firmware into the solid-state drive to be tested;

[0123] The control host is used to perform a full disk read / write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occurred during the full disk read / write test of the solid-state drive under test.

[0124] The control host is used to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and statistical analysis is performed according to preset rules to obtain the error distribution statistics.

[0125] Based on the error distribution statistics, it can be determined whether there are any abnormalities in the soldering of the solid-state drive's storage chips.

[0126] In some embodiments, connecting the solid-state drive to be tested to the control host includes:

[0127] The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

[0128] In some embodiments, the error information statistics firmware records the location where the error occurred using the following steps:

[0129] Create a status record table;

[0130] Receive command requests to erase, write, or read data at a specific location on the solid-state drive to be tested;

[0131] Determine if the data read return status is normal;

[0132] In response to a normal read data status, the process returns to the next position from a given position to execute the command request for receiving, erasing, writing, or reading data.

[0133] In response to an abnormal read data status, the position corresponding to the abnormal read / write status is recorded in the status record table, and the next position of a certain position is returned to execute the command request to receive, erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information of each position.

[0134] In response to the completion of erasing, writing, and reading data in all locations of the solid-state drive under test, the status record table is saved to the solid-state drive under test.

[0135] In some embodiments, the step of using the control host to read all locations where errors occurred during the full disk read / write test from the solid-state drive under test, and performing statistical analysis according to preset rules to obtain error distribution statistics includes:

[0136] The status record table saved by the solid-state drive under test is read using the nvme cli command;

[0137] Count the number of pages in the status record table that belong to the same channel, the same chip select signal, and the same logic unit;

[0138] The rm_show command outputs the channel information, chip select signal information, logic unit information, and the statistically obtained quantity for each logic unit.

[0139] In some embodiments, determining whether there are abnormalities in the soldering of the solid-state drive's storage chips based on the error distribution statistics includes:

[0140] Compare the quantity corresponding to each logic unit with the preset value;

[0141] If the number of a certain logical unit exceeds a preset value, it is confirmed that the soldering of the memory chips in that logical unit is abnormal.

[0142] In some embodiments, determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics further includes:

[0143] Calculate the sum of the quantities corresponding to all logic units;

[0144] Calculate the ratio of the sum to the total number of logic units;

[0145] The ratio is used as the preset value.

[0146] In some embodiments, after the step of determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics, the method further includes:

[0147] The control host is used to delete the error information statistics firmware in the solid-state drive under test.

[0148] According to another aspect of the present invention, a computer-readable storage medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, it implements the above-described method for detecting welding anomalies in solid-state drive storage particles, specifically including the following steps:

[0149] Connect the solid-state drive to be tested to the control host;

[0150] The control host is used to burn the error information statistics firmware into the solid-state drive to be tested;

[0151] The control host is used to perform a full disk read / write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occurred during the full disk read / write test of the solid-state drive under test.

[0152] The control host is used to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and statistical analysis is performed according to preset rules to obtain the error distribution statistics.

[0153] Based on the error distribution statistics, it can be determined whether there are any abnormalities in the soldering of the solid-state drive's storage chips.

[0154] In some embodiments, connecting the solid-state drive to be tested to the control host includes:

[0155] The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

[0156] In some embodiments, the error information statistics firmware records the location where the error occurred using the following steps:

[0157] Create a status record table;

[0158] Receive command requests to erase, write, or read data at a specific location on the solid-state drive to be tested;

[0159] Determine if the data read return status is normal;

[0160] In response to a normal read data status, the process returns to the next position from a given position to execute the command request for receiving, erasing, writing, or reading data.

[0161] In response to an abnormal read data status, the position corresponding to the abnormal read / write status is recorded in the status record table, and the next position of a certain position is returned to execute the command request to receive, erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information of each position.

[0162] In response to the completion of erasing, writing, and reading data in all locations of the solid-state drive under test, the status record table is saved to the solid-state drive under test.

[0163] In some embodiments, the step of using the control host to read all locations where errors occurred during the full disk read / write test from the solid-state drive under test, and performing statistical analysis according to preset rules to obtain error distribution statistics includes:

[0164] The status record table saved by the solid-state drive under test is read using the nvme cli command;

[0165] Count the number of pages in the status record table that belong to the same channel, the same chip select signal, and the same logic unit;

[0166] The rm_show command outputs the channel information, chip select signal information, logic unit information, and the statistically obtained quantity for each logic unit.

[0167] In some embodiments, determining whether there are abnormalities in the soldering of the solid-state drive's storage chips based on the error distribution statistics includes:

[0168] Compare the quantity corresponding to each logic unit with the preset value;

[0169] If the number of a certain logical unit exceeds a preset value, it is confirmed that the soldering of the memory chips in that logical unit is abnormal.

[0170] In some embodiments, determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics further includes:

[0171] Calculate the sum of the quantities corresponding to all logic units;

[0172] Calculate the ratio of the sum to the total number of logic units;

[0173] The ratio is used as the preset value.

[0174] In some embodiments, after the step of determining whether there are abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics, the method further includes:

[0175] The control host is used to delete the error information statistics firmware in the solid-state drive under test.

[0176] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0177] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0178] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for detecting abnormal soldering of solid-state drive (SSD) storage chips, characterized in that, The method includes: Connect the solid-state drive to be tested to the control host; The control host is used to burn the error information statistics firmware into the solid-state drive to be tested; The control host is used to perform a full disk read / write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occurred during the full disk read / write test of the solid-state drive under test. The control host is used to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and statistical analysis is performed according to preset rules to obtain the error distribution statistics. Based on the error distribution statistics, determine whether there are any abnormalities in the soldering of the solid-state drive's storage chips; The error information statistics firmware records the location of errors using the following steps: creating a status record table; receiving command requests to erase, write, or read data at a specific location on the solid-state drive under test; determining whether the read data return status is normal; in response to a normal read data return status, returning to the next location of the specified location to execute the command requests to receive erase, write, or read data; in response to an abnormal read data return status, recording the location corresponding to the abnormal read / write status in the status record table, and returning to the next location of the specified location to execute the command requests to receive erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information for each location; in response to all locations on the solid-state drive under test having completed erase, write, and read data operations, saving the status record table to the solid-state drive under test. The process of using the control host to read all locations where errors occurred during the full disk read / write test from the solid-state drive under test, and performing statistical analysis according to preset rules to obtain error distribution statistics, includes: reading the status record table saved by the solid-state drive under test using the nvme cli command; counting the number of all pages belonging to the same channel, the same chip select signal, and the same logical unit in the status record table; outputting the channel information, chip select signal information, logical unit information, and the counted quantity corresponding to each logical unit using the rm_show command; comparing the quantity corresponding to each logical unit with a preset value; and confirming that the memory chip soldering of a certain logical unit is abnormal if the quantity of a certain logical unit exceeds the preset value.

2. The method for detecting abnormal soldering of solid-state drive storage particles according to claim 1, characterized in that, Connecting the solid-state drive to be tested to the control host includes: The solid-state drive to be tested is connected to a control host with a pre-installed Linux system via a PCIe bus, wherein the control host is a PC or a server.

3. The method for detecting abnormal soldering of solid-state drive storage particles according to claim 1, characterized in that, The step of determining whether there are abnormalities in the soldering of storage chips in the solid-state drive based on the error distribution statistics also includes: Calculate the sum of the quantities corresponding to all logic units; Calculate the ratio of the sum to the total number of logic units; The ratio is used as the preset value.

4. The method for detecting abnormal soldering of solid-state drive storage particles according to claim 1, characterized in that, After the step of determining whether there are any abnormalities in the soldering of the solid-state drive's storage chips based on the error distribution statistics, the method further includes: The control host is used to delete the error information statistics firmware in the solid-state drive under test.

5. A device for detecting abnormal soldering of solid-state drive storage chips, characterized in that, The device includes: A connection module configured to connect the solid-state drive under test to the control host; A programming module is configured to use the control host to program error information statistics firmware into the solid-state drive to be tested; The testing module is configured to use the control host to perform a full-disk read and write test on the solid-state drive under test so that the error information statistics firmware records the location of errors that occur during the read and write test of the solid-state drive under test; The analysis module is configured to use the control host to read all the locations where errors occurred during the full disk read / write test from the solid-state drive under test, and perform statistical analysis according to preset rules to obtain error distribution statistics. The judgment module is configured to determine whether there are any abnormalities in the soldering of the storage chips in the solid-state drive based on the error distribution statistics. The testing module is further configured to create a status record table; receive command requests to erase, write, or read data at a specific location on the solid-state drive under test; determine whether the data read return status is normal; in response to a normal data read return status, return to the next location of the specified location and execute the command request to receive erase, write, or read data; in response to an abnormal data read return status, record the location corresponding to the abnormal read / write status in the status record table, and return to the next location of the specified location and execute the command request to receive erase, write, or read data. The information recorded in the status record table includes the channel, chip select signal, logic unit, face, block, and page information for each location; in response to all locations on the solid-state drive under test having completed erasing, writing, and reading data, save the status record table to the solid-state drive under test. The analysis module is also configured to read the status record table saved by the solid-state drive under test via the nvme cli command; count the number of all pages in the status record table belonging to the same channel, the same chip select signal, and the same logical unit; output the channel information, chip select signal information, logical unit information, and the counted quantity corresponding to each logical unit via the rm_show command; compare the quantity corresponding to each logical unit with a preset value; and confirm that the soldering of the memory chips in a logical unit is abnormal if the quantity corresponding to a certain logical unit exceeds the preset value.

6. A computer device, characterized in that, include: At least one processor; as well as A memory storing a computer program executable in the processor, wherein the processor, when executing the program, performs the method according to any one of claims 1-4.

7. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it performs the method described in any one of claims 1-4.