An automatic chip encapsulating machine

Abstract

The application discloses an automatic chip packaging machine, which comprises a packaging chamber, a conveying belt is rotatably installed in the packaging chamber, two limiting mechanisms are fixedly installed on the inner walls of the two sides of the packaging chamber, two chip feeding ports are formed in the two sides of the packaging chamber, feeding mechanisms are fixedly installed on the top of the limiting mechanisms, and the two feeding mechanisms correspond to the two chip feeding ports one by one. Through the design of the two feeding mechanisms on the two sides of the packaging chamber, the feeding efficiency of the chips can be higher, the position of the limiting wheel on the side-moving frame can be adjusted through the setting of the side-moving frame which can laterally move on the limiting mechanism, and then the limiting wheels on the two side-moving frames can meet the clamping of substrate placing boxes of different sizes, so that the deviation of the conveying belt on the substrate placing box during conveying can be prevented, and then the situation that the chips cannot be accurately placed on the substrate during the subsequent packaging process can be avoided.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to an automated chip packaging machine. Background Technology

[0002] Chip packaging refers to the casing used to mount semiconductor integrated circuit chips. It serves to house, secure, seal, and protect the chip, as well as enhance its electrical and thermal performance. Chip packaging acts as a bridge between the internal world of the chip and external circuitry. For example... Figure 1 As shown, during the chip packaging process, the substrate placement box before packaging is easily shifted during transport, affecting subsequent packaging. During chip feeding, adhesive cannot be sprayed onto the bottom at the same time, which means that the feeding process and the adhesive spraying process need to be separated, resulting in low chip packaging efficiency and low applicability of the chip packaging equipment. Furthermore, each chip can only be fed sequentially through the feeding belt on one side, resulting in low feeding efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide an automatic chip packaging machine to solve the following technical problems: (1) solving the problem that the substrate placement box of the chip packaging equipment is easily offset during transportation, which affects the subsequent packaging technology; (2) solving the technical problem that the bottom cannot be sprayed with glue at the same time during the chip feeding process, which requires the feeding process and the glue spraying process to be separated, resulting in low chip packaging efficiency; (3) solving the technical problem that the chip packaging equipment in the prior art is not very applicable and can only complete the feeding of one chip at a time, resulting in low feeding efficiency.

[0004] The objective of this invention can be achieved through the following technical solutions:

[0005] An automatic chip packaging machine includes a packaging chamber, a conveyor belt rotatably mounted inside the packaging chamber, two limiting mechanisms fixedly mounted on the inner walls of both sides of the packaging chamber, two chip loading ports opened on both sides of the packaging chamber, a feeding mechanism fixedly mounted on the top of the limiting mechanisms, the two feeding mechanisms corresponding one-to-one with the two chip loading ports, the feeding mechanism passing through the chip loading ports, a substrate placement box provided on the conveyor belt, the substrate placement box having a plurality of substrate placement slots, an assembly mechanism fixedly mounted on the top of the inner wall of the packaging chamber, the assembly mechanism including a mounting top shell, the bottom of the mounting top shell being open, two adjusting sleeves slidably mounted inside the mounting top shell, a lifting cylinder fixedly mounted on the bottom of the adjusting sleeve, the piston rod end of the lifting cylinder being connected to a negative pressure suction cup.

[0006] Furthermore, the limiting mechanism includes a fixed side shell, one side of which is open, and two mounting cylinders are fixedly installed inside the fixed side shell, with the piston rod end of the mounting cylinder connected to a connecting block.

[0007] Furthermore, a spring rod is rotatably mounted on the connecting block, and both spring rods are rotatably connected to the side shift frame, which is rotatably mounted with several limiting wheels.

[0008] Furthermore, the feeding mechanism includes a feeding shell with an open top, a filter belt rotatably installed inside the feeding shell, and a glue storage box fixedly installed inside the feeding shell.

[0009] Furthermore, a glue pump is fixedly installed on the top of the glue storage box, the glue pump's suction port is connected to the top of the glue storage box, and a first diversion pipe is installed on the glue pump's outlet.

[0010] Furthermore, a plurality of second diversion pipes are installed on the first diversion pipe, and a plurality of spray nozzles are fixedly installed on the top of the second diversion pipes.

[0011] Furthermore, a feeding motor is fixedly installed on the outer wall of the feeding shell, and two feeding rollers are rotatably installed inside the feeding shell. The two feeding rollers are connected by a filter belt drive, and the output shaft of the feeding motor is connected to one of the feeding rollers.

[0012] Furthermore, a ball screw is rotatably installed inside the mounting top shell. The threaded surfaces at both ends of the ball screw are symmetrically arranged along the middle. Two adjusting sleeves are threaded to both ends of the ball screw. An adjusting motor is fixedly installed on the outer wall of the packaging chamber, and the output shaft of the adjusting motor is connected to the ball screw.

[0013] The beneficial effects of this invention are:

[0014] (1) By designing two feeding mechanisms on both sides of the packaging chamber, the chip can be fed on both sides at the same time, making the chip feeding efficiency higher. By setting the side shift frame that can be moved laterally on the limiting mechanism, the position of the upper limit wheel of the side shift frame can be adjusted. Thus, the limit wheels on both sides of the side shift frame can clamp different sizes of substrate placement boxes, which can prevent the substrate placement box from shifting during the conveyor belt conveyor, and thus prevent the chip from being accurately placed on the substrate during the subsequent packaging process.

[0015] (2) Through the coordinated design of the glue storage box, glue pump, first diversion pipe, second diversion pipe, glue spraying head and filter belt in the feeding mechanism, the bottom of the chip can be sprayed with glue while the chip is being transported, thereby improving the glue spraying efficiency of the chip. At the same time, the filter belt can filter out the sediment in the glue, ensuring that there is no sediment in the glue sprayed on the bottom of the chip. The equal spacing of several second diversion pipes and the equal spacing of several glue spraying heads ensures that the glue sprayed on the bottom of the chip is more even.

[0016] (3) By setting two adjustable sleeves on the assembly mechanism, the distance between the two lifting cylinders can be adjusted, which facilitates the simultaneous adsorption and packaging of chips on both sides, thereby improving the chip packaging efficiency. Through the design of the lifting cylinder and the negative pressure suction cup, the adsorption and packaging of chips of different thicknesses can be met. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 These are prior art diagrams of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of an automatic chip packaging machine according to the present invention;

[0020] Figure 3 This is an internal structural diagram of the mounting top shell of the present invention;

[0021] Figure 4 This is a schematic diagram of the feeding mechanism of the present invention;

[0022] Figure 5 This is a diagram of the internal structure of the upper shell of the present invention;

[0023] Figure 6 This is an installation view of the second shunt tube of the present invention;

[0024] Figure 7 This is an internal structural diagram of the fixed side shell of the present invention.

[0025] In the diagram: 100, Packaging chamber; 101, Conveyor belt; 102, Conveyor motor; 103, Chip loading port; 104, Substrate placement box; 105, Substrate placement slot; 200, Limiting mechanism; 201, Fixed side shell; 202, Mounting cylinder; 203, Connecting block; 204, Spring rod; 205, Side shifting frame; 206, Limiting wheel; 300, Loading mechanism; 301, Loading shell; 302, Loading motor; 303, Loading roller; 304, Filter belt; 305, Glue storage box; 306, Glue pump; 307, First diversion pipe; 308, Second diversion pipe; 309, Glue spray head; 400, Assembly mechanism; 401, Mounting top shell; 402, Ball screw; 403, Adjusting sleeve; 404, Lifting cylinder; 405, Negative pressure suction cup; 406, Adjusting motor. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] See Figure 2 As shown, the present invention is an automatic chip packaging machine, including a packaging chamber 100. A conveyor belt 101 is rotatably installed inside the packaging chamber 100. Two limiting mechanisms 200 are fixedly installed on the inner walls of both sides of the packaging chamber 100. Two chip loading ports 103 are opened on both sides of the packaging chamber 100. A loading mechanism 300 is fixedly installed on the top of the limiting mechanism 200. The two loading mechanisms 300 correspond one-to-one with the two chip loading ports 103. The loading mechanism 300 passes through the chip loading port 103. A substrate placement box 104 is provided on the conveyor belt 101. The substrate placement box 104 has several substrate placement slots 105. An assembly mechanism 400 is fixedly installed on the top of the inner wall of the packaging chamber 100. Through the design of the two loading mechanisms 300 on both sides of the packaging chamber 100, the chip loading on both sides can be satisfied at the same time, so that the chip loading efficiency is higher.

[0028] See Figure 7 As shown, two conveyor rollers are rotatably installed inside the packaging chamber 100. The two conveyor rollers are connected by a conveyor belt 101. A conveyor motor 102 is fixedly installed on one side of the packaging chamber 100, and the output shaft of the conveyor motor 102 is connected to one of the conveyor rollers. The limiting mechanism 200 includes a fixed side shell 201, one side of which is open. Two mounting cylinders 202 are fixedly installed inside the fixed side shell 201. The piston rod ends of the mounting cylinders 202 are connected to a connecting block 203. A spring rod 204 is rotatably mounted on the connecting block 203. Both spring rods 204 are rotatably connected to a side shift frame 205. Several limiting wheels 206 are rotatably mounted on the side shift frame 205. By setting the side shift frame 205 on the limiting mechanism 200, which can be laterally moved, the position of the upper limit wheel 206 on the side shift frame 205 can be adjusted. Thus, the limiting wheels 206 on both sides of the side shift frame 205 can meet the clamping of substrate placement boxes 104 of different sizes. This can prevent the substrate placement box 104 from being deviated during conveying on the conveyor belt 101, and thus prevent the chip from being unable to be accurately placed on the substrate during the subsequent packaging process.

[0029] Two mounting cylinders 202 are respectively fixedly mounted on the inner walls of the two sides of the fixed side shell 201, and the two mounting cylinders 202 are arranged opposite to each other. The feeding mechanism 300 includes a feeding shell 301, the top of which is open. A filter belt 304 is rotatably installed inside the feeding shell 301. A glue storage box 305 is fixedly installed inside the feeding shell 301. A glue pump 306 is fixedly installed on the top of the glue storage box 305. The glue pump 306's glue inlet is connected to the top of the glue storage box 305. A first diversion pipe 307 is installed at the glue pump 306's glue outlet. Several second diversion pipes 308 are installed on the first diversion pipe 307. Several glue spray heads are fixedly installed on the top of the second diversion pipes 308. 309. The output shaft of the feeding motor 302 is connected to one of the feeding rollers 303. Through the coordinated design of the glue storage box 305, glue pump 306, first diversion pipe 307, second diversion pipe 308, glue spraying head 309 and filter belt 304 in the feeding mechanism 300, glue can be sprayed on the bottom of the chip while the chip is being transported, thereby improving the glue spraying efficiency of the chip. At the same time, the filter belt 304 can filter out the sediment in the glue to ensure that there is no sediment in the glue sprayed on the bottom of the chip.

[0030] See Figure 4 As shown, a feeding motor 302 is fixedly installed on the outer wall of the feeding shell 301. Two feeding rollers 303 are rotatably installed inside the feeding shell 301, and the two feeding rollers 303 are connected by a filter belt 304. The assembly mechanism 400 includes a mounting top shell 401 with an open bottom. Two adjusting sleeves 403 are slidably installed inside the mounting top shell 401. A lifting cylinder 404 is fixedly installed at the bottom of the adjusting sleeve 403. The piston rod end of the lifting cylinder 404 is connected to a negative pressure suction cup 405. By setting two adjustable sleeves 403 on the assembly mechanism 400, the distance between the two lifting cylinders 404 can be adjusted, which facilitates the simultaneous adsorption and encapsulation of chips fed from both sides, thereby improving the chip encapsulation efficiency.

[0031] See Figure 5 , 6 As shown, several second shunt tubes 308 are fixedly installed at equal intervals on the top of the first shunt tube 307, and several adhesive spraying heads 309 are fixedly installed at equal intervals on the top of the second shunt tubes 308. The equal intervals of the second shunt tubes 308 and the equal intervals of the adhesive spraying heads 309 ensure that the adhesive sprayed on the bottom of the chip is more even.

[0032] As shown in Figure 3, a ball screw 402 is rotatably mounted inside the mounting top shell 401. The threaded surfaces at both ends of the ball screw 402 are symmetrically arranged along the middle. Two adjusting sleeves 403 are threadedly connected to both ends of the ball screw 402. An adjusting motor 406 is fixedly mounted on the outer wall of the packaging chamber 100. The output shaft of the adjusting motor 406 is connected to the ball screw 402. Through the design of the lifting cylinder 404 and the negative pressure suction cup 405, the adsorption and packaging of chips of different thicknesses can be met.

[0033] Please see Figure 1-7 As shown, the working process of an automated chip packaging machine in this embodiment is as follows:

[0034] Step 1: Place the substrate in the corresponding substrate placement slot 105 on the substrate placement box 104, place the substrate placement box 104 on the conveyor belt 101, turn on the two mounting cylinders 202 in the fixed side shell 201, the piston rod of the mounting cylinder 202 pushes the connecting block 203, the connecting block 203 drives the spring rod 204 to rotate, the two spring rods 204 drive the side shift frame 205 to move out of the fixed side shell 201, the limiting wheel 206 on the side shift frame 205 contacts the side of the substrate placement box 104, turn on the conveyor motor 102, the output shaft of the conveyor motor 102 drives the conveyor roller to rotate, the two conveyor rollers drive the conveyor belt 101 to rotate, the conveyor belt 101 conveys the substrate placement box 104, and when the substrate placement box 104 is conveyed to the bottom of the assembly mechanism 400, the conveying stops;

[0035] Step Two: Place the chip on the filter belt 304, turn on the feeding motor 302. The output shaft of the feeding motor 302 drives the feeding roller 303 to rotate. The two feeding rollers 303 drive the filter belt 304 to rotate, and the filter belt 304 conveys the chip. During the conveying process, the glue pump 306 draws glue from the glue storage box 305 and delivers it to the second diversion pipe 308 through the first diversion pipe 307. The glue in the second diversion pipe 308 is sprayed out from the glue spray head 309. The glue passes through the filter belt 304 and is sprayed onto the bottom of the chip. When the chips on both sides are conveyed to the corresponding negative pressure suction cup 405, the lifting cylinder 404 is activated to lift and lower the chip. The piston rod of cylinder 404 pushes the negative pressure suction cup 405 downward, and the negative pressure suction cup 405 adsorbs the chip. Then, the adjustment motor 406 is turned on. The output shaft of the adjustment motor 406 drives the ball screw 402 to rotate. The ball screw 402 drives the two adjustment sleeves 403 to move towards each other. Then, the two adjustment sleeves 403 drive the two lifting cylinders 404 to move above the substrate placement slot 105. The piston rod of the lifting cylinder 404 pushes the negative pressure suction cup 405 downward, and the negative pressure suction cup 405 places the chip on the substrate. Then, the above operation is repeated to place subsequent chips on the substrates in the remaining substrate placement slots 105.

[0036] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0038] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. An automatic chip encapsulator comprising an encapsulation chamber (100), characterized in that The packaging chamber (100) is rotatably provided with a conveying belt (101), two limiting mechanisms (200) are fixedly installed on the inner walls of the two sides of the packaging chamber (100), two chip loading openings (103) are formed on the two sides of the packaging chamber (100), an upper feeding mechanism (300) is fixedly installed on the top of the limiting mechanism (200), the two upper feeding mechanisms (300) correspond to the two chip loading openings (103) one by one, the upper feeding mechanism (300) penetrates the chip loading opening (103), a substrate placing box (104) is arranged on the conveying belt (101), a plurality of substrate placing grooves (105) are formed in the substrate placing box (104), an assembling mechanism (400) is fixedly installed on the inner wall top of the packaging chamber (100), the assembling mechanism (400) comprises a mounting top shell (401), the bottom of the mounting top shell (401) is open, two adjusting sleeves (403) are slidably installed in the mounting top shell (401), a lifting cylinder (404) is fixedly installed at the bottom of the adjusting sleeve (403), and a negative pressure suction disc (405) is connected to the piston rod end of the lifting cylinder (404); The limiting mechanism (200) comprises a fixed side shell (201), one side of the fixed side shell (201) is open, two mounting cylinders (202) are fixedly installed in the fixed side shell (201), and the connecting block (203) is connected to the piston rod end of the mounting cylinder (202); The connecting block (203) is rotatably provided with a spring rod (204), and the two spring rods (204) are rotatably connected with side jibs (205); a plurality of limiting wheels (206) are rotatably installed on the side jib (205).

2. The automatic chip encapsulator according to claim 1, wherein The upper feeding mechanism (300) comprises an upper feeding shell (301), the top of the upper feeding shell (301) is open, a filter belt (304) is rotatably installed in the upper feeding shell (301), and a glue storage box (305) is fixedly installed in the upper feeding shell (301).

3. The automatic chip encapsulator according to claim 2, wherein The glue pump (306) is fixedly installed at the top of the glue storage box (305), the glue pump (306) is fixedly installed at the top of the glue storage box (305), and the first shunt pipe (307) is installed at the glue outlet of the glue pump (306).

4. The automatic chip encapsulator according to claim 3, wherein A plurality of second shunt pipes (308) are installed on the first shunt pipe (307), and a plurality of glue injection heads (309) are fixedly installed at the top of the second shunt pipe (308).

5. The automatic chip encapsulator according to claim 2, wherein An upper feeding motor (302) is fixedly installed on the outer side wall of the upper feeding shell (301), two upper feeding rollers (303) are rotatably installed in the upper feeding shell (301), and the output shaft of the upper feeding motor (302) is connected with one of the upper feeding rollers (303); the two upper feeding rollers (303) are drivingly connected through the filter belt (304).

6. The automatic chip encapsulator according to claim 1, wherein Ball screw (402) is rotationally installed in the installation top shell (401), two ends of the ball screw (402) are symmetrically provided along the middle part, two adjusting sleeves (403) are threadedly connected to the two ends of the ball screw (402), an adjusting motor (406) is fixedly installed on the outer wall of the packaging chamber (100), and the output shaft of the adjusting motor (406) is connected with the ball screw (402).

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