A method for assembling a vibration unit and a method for assembling a bone conduction headset

Abstract

The present invention discloses a method for assembling a vibration unit and a method for assembling a bone conduction headset. The vibration unit includes a vibrator circuit board, an upper bracket cover, a lower bracket cover, and a magnetic circuit assembly, and further includes the following assembly steps: a first ultrasonic joint is provided at the bottom of the upper bracket cover, and a second ultrasonic joint is provided on the lower bracket cover. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and the shrapnel is clamped therebetween; the voice coil is installed below the upper bracket cover; the vibrator circuit board is flush-embedded at the top of the upper bracket cover. The present invention uses a plastic ultrasonic welding process to assemble the bone conduction headset and the vibration unit therein. The process is simple, which can reduce the overall machine processes, improve the output of the automated production line, and improve the assembly efficiency and reduce the defective rate. In addition, the bone conduction headset and the vibration unit fixed by ultrasonic waves can have the medium fully entangled to increase the vibration conduction area, so that the mid-bass can be effectively transmitted to the housing and then transmitted to the human body by the housing, thereby improving the mid-bass sound quality.

Description

Technical Field

[0001] The present invention relates to the technical field of speakers, and particularly to an assembly method for a bone conduction oscillator and an assembly method for a whole bone conduction earphone. Background Art

[0002] With the improvement of living standards, music has become an indispensable part of life. Various earphones have emerged as the times require.

[0003] Bone conduction earphones are used to convert sound into mechanical vibrations of different frequencies, and transmit sound waves through the human skull, bony labyrinth, inner ear lymph, spiral organ, auditory nerve, and auditory center. Compared with the classical sound conduction method of generating sound waves through a diaphragm, bone conduction can achieve clear sound restoration in a noisy environment, and the sound waves will not affect others due to sound leakage.

[0004] In the prior art, a bone conduction earphone generally includes a main housing and a sub-housing that is fastened to the main housing to form a circuit chamber and a speaker chamber, and a bone conduction oscillator is installed in the speaker chamber. In the prior art, the main housing and the sub-housing are generally assembled together by providing screw holes in the main housing and the sub-housing being fitted with screws into the screw holes. At the same time, the mounting bracket of the bone conduction oscillator is generally an integral bracket, and the elastic piece is assembled together during the injection molding of the bracket. For this kind of assembly method of the elastic piece, most of the elastic pieces just keep in contact with the mounting bracket, and usually it is impossible to ensure that there is a sufficiently tight connection between the elastic piece and the mounting bracket. While the vibration conduction area cannot be further increased, it is also affected by the vibration of the oscillator itself, thereby reducing the sound wave conduction of the mid-bass and affecting the sound quality.

[0005] Therefore, the technical problems in the prior art need to be improved urgently. Summary of the Invention

[0006] Based on this, in order to solve the above technical problems in the traditional technology, the present invention uses a plastic ultrasonic welding process to assemble the housing of the bone conduction earphone and the vibration unit therein, and provides an assembly method for a bone conduction vibration unit and an assembly method for a bone conduction earphone with simple process, reduced whole-machine processes, increased output of the automated production line, improved assembly efficiency, reduced defect rate, and improved mid-bass sound quality.

[0007] In a first aspect, the present invention relates to an assembly method for a vibration unit. The vibration unit includes an oscillator circuit board, an upper bracket cover, a lower bracket cover, an elastic piece, a voice coil, and a magnetic circuit assembly, and further includes the following assembly steps:

[0008] A first ultrasonic joint is provided at the bottom of the upper bracket cover, and a second ultrasonic joint is provided on the lower bracket cover. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and clamp the elastic piece;

[0009] The voice coil is installed below the upper bracket cover;

[0010] The top of the upper bracket cover is flush-embedded with the oscillator circuit board, and the oscillator circuit board is connected to the voice coil;

[0011] The magnetic circuit assembly is suspended on the elastic sheet.

[0012] In a second aspect, the present invention relates to a method for assembling a bone conduction headphone. The bone conduction headphone includes a first outer shell and a second outer shell that are integrally formed and enclose a housing, and further includes a vibration unit installed in the housing. The vibration unit includes an upper bracket cover, a lower bracket cover, and an elastic sheet. The method further includes the following assembly steps:

[0013] A first ultrasonic joint is provided at the bottom of the upper bracket cover, and a second ultrasonic joint is provided on the lower bracket cover. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and clamp the elastic sheet therebetween;

[0014] A third ultrasonic joint is provided at the top of the frame of the first outer shell, and a fourth ultrasonic joint is provided at the top of the frame of the second outer shell. The third ultrasonic joint and the fourth ultrasonic joint are welded by a plastic ultrasonic welding process.

[0015] In the bone conduction vibration unit assembly method and the bone conduction headphone assembly method of the present invention, the plastic ultrasonic welding process is used to assemble the bone conduction headphone and the vibration unit therein. The elastic sheet of the vibration unit is clamped between the upper bracket cover and the lower bracket cover after ultrasonic welding, and the combination is tight, which is beneficial to the conduction of sound wave signals; there is no need to provide studs in the inner cavity of the housing of the bone conduction headphone, and the structure is streamlined to increase the space of the inner cavity of the housing. In this embodiment, the outer shell welding guide lines of the first outer shell and the second outer shell are arranged along the contour of the top of the housing, and are tightly joined after ultrasonic welding, having a good waterproof effect.

[0016] In the bone conduction vibration unit assembly method and the bone conduction headphone assembly method of the present invention, the plastic ultrasonic welding process is simple, which can reduce the processes of the whole bone conduction headphone, increase the output of the automated production line, and improve the assembly efficiency and reduce the defective rate.

[0017] In addition, the oscillator welding guide lines, welding surfaces on the ultrasonic joints of the vibration unit, and the surface molecules between the elastic sheet and the first and second outer shells of the bone conduction headphone generate motion and diffuse and entangle with each other through high-frequency friction. The melted welding guide line medium and the welded parts are fully entangled to increase the conduction area of vibration, so that the mid-low frequency sound can be effectively transmitted to the housing and then transmitted to the human body by the housing, thereby improving the mid-low frequency sound quality. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Wherein:

[0020] Figure 1 It is the overall structure diagram of the bone conduction headset in this embodiment;

[0021] Figure 2 It is the usage schematic diagram of the bone conduction headset in this embodiment;

[0022] Figure 3 It is the exploded structure diagram of the first headset in this embodiment;

[0023] Figure 4 It is the exploded structure diagram of the second headset in this embodiment;

[0024] Figure 5 It is the cross-sectional structure diagram of the speaker housing of the second or second headset in this embodiment;

[0025] Figure 6 It is the cross-sectional structure schematic diagram of the vibration unit in this embodiment;

[0026] Figure 7 It is the exploded structure schematic diagram of the vibration unit in this embodiment;

[0027] Figure 8 It is the structure schematic diagram of the oscillator circuit board in this embodiment;

[0028] Figure 9 It is the structure schematic diagram of the upper bracket cover, lower bracket cover and elastic piece in this embodiment;

[0029] Figure 10 It is another structure schematic diagram of the upper bracket cover and the lower bracket cover;

[0030] Figure 11 It is the flow schematic diagram of the vibration unit assembly method of the present invention;

[0031] Figure 12 It is the flow schematic diagram of the bone conduction headset assembly method of the present invention. Detailed implementation manners

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0033] Embodiment 1

[0034] Please refer to Figures 1 to 4 together, which shows the structural diagram of the bone conduction earphone according to the embodiment of the present application.

[0035] The bone conduction earphone includes a first earphone 1 and a second earphone 5, and the first earphone 1 is connected to the second earphone 5 through a wire tube 4.

[0036] The first earphone 1 includes a first outer shell 11 and a second outer shell 12 that are integrally formed and enclose the earhook and the speaker as a whole shell, and further includes a first vibration unit 2 installed in the speaker shell. Similarly, the second earphone 5 includes a first outer shell 51 and a second outer shell 52 on the opposite side that are integrally formed and enclose the earhook and the speaker as a whole shell, and further includes a second vibration unit 8 installed in the speaker shell.

[0037] As Figure 2 shown, when in use, the wire tube 4 of the bone conduction earphone surrounds the back of the head A and is hung on both ears through the arc part 13 of the earphone.

[0038] Please refer to Figure 3 together, which shows the unfolded view of the shell of the first earphone 1. Among them, the first outer shell 11 of the first earphone 1 includes three parts: an earhook, an arc part, and a speaker shell. The first vibration unit 2 is fixed in the cavity of the speaker shell. The main control circuit board 7 is installed in the earhook cavity. The main control circuit board 7 is connected to the first vibration unit 2 through a wire arranged along the arc part.

[0039] Please refer to Figure 4 together, which shows the unfolded view of the shell of the second earphone 5. Among them, the first outer shell 51 of the second earphone 5 includes three parts: an earhook, an arc part, and a speaker shell. The second vibration unit 8 is fixed in the cavity of the speaker shell. A rechargeable battery 74 is installed in the earhook cavity. The rechargeable battery 74 is connected to the main control circuit board 7 of the first earphone 1 through a connecting wire arranged along the wire tube 4, and is connected to the second vibration unit 8 through a wire arranged along the arc part.

[0040] The following takes the first vibration unit 2 as an example to introduce the internal structure, and the structure of the second vibration unit 8 is the same.

[0041] Please refer to Figure 6 and Figure 7, the first vibration unit 2 includes a vibrator circuit board 25, an upper bracket cover 21, a lower bracket cover 22, a shrapnel 23, a voice coil 24, and a magnetic circuit assembly.

[0042] Please refer to Figure 8 , the vibrator circuit board 25 includes a first touch terminal A1, a second touch terminal A2, a first connection terminal C1, and a second connection terminal C2.

[0043] The magnetic circuit assembly includes a magnetic conductive sheet 31, a magnet 32, a U-shaped iron 33, and a counterweight iron 34.

[0044] To achieve plastic ultrasonic welding of the vibrator, a first ultrasonic joint is provided at the bottom of the upper bracket cover 21, and a second ultrasonic joint is provided on the lower bracket cover. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and clamp the shrapnel 23.

[0045] Please refer to Figure 9 and Figure 10 , the first ultrasonic joint includes a first stop 213 and a first welding surface 214 provided on the periphery. The corresponding second ultrasonic joint includes a second stop 223 and a second welding surface 224 provided on the periphery. In this embodiment, the welding surface is provided outside the vibration unit to ensure that the welding sol is blocked by the stop and does not enter the vibrator cavity to affect the vibrator quality or sound quality.

[0046] A vibrator welding guide line is provided on the first welding surface 214 or the second welding surface 224. In this embodiment, the vibrator welding guide line 215 is provided on the first welding surface 214. The cross section of the vibrator welding guide line 215 is triangular. The upper bracket cover 21 is provided with a plurality of positioning posts 216 around the first ultrasonic joint. An installation opening 231 is provided at the center of the shrapnel 23, and a plurality of positioning openings 232 are provided on the outer peripheral edge corresponding to the positioning posts 216.

[0047] Please refer to Figure 11 , the assembly method based on the above vibration unit structure.

[0048] The vibration unit assembly method includes the following assembly steps:

[0049] Step 110: Align the positioning openings 232 of the shrapnel 23 with the corresponding positioning posts 216 and place them in a limited position on the boss of the first stop 213 of the first ultrasonic joint of the upper bracket cover 21.

[0050] Step 120: A first ultrasonic joint is provided at the bottom of the upper bracket cover 21, and a second ultrasonic joint is provided on the lower bracket cover 22. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and clamp the shrapnel 23.

[0051] Step 130: Install the voice coil 24 below the upper bracket cover 21.

[0052] Step 140: The top of the bracket upper cover 21 is flush-embedded with the oscillator circuit board 25. Specifically, when implemented, the bracket upper cover 21 is provided with a lead outlet 212, and the first connection terminal C1 and the second connection terminal C2 of the oscillator circuit board 25 are welded to the connection wires led out from the voice coil 24.

[0053] Step 150: Pass the magnetic circuit assembly through the mounting opening 231 of the elastic sheet 23, so that the flange edge of the U-shaped iron 33 is suspended on the elastic sheet 23.

[0054] For the assembly method of the bone conduction vibration unit and the assembly method of the bone conduction earphone of the present invention, the top of the bracket upper cover is flush-embedded with the oscillator circuit board. Through this oscillator circuit board, the circuit connection of the vibration unit can be optimized, which is convenient for expanding functional modules in the speaker cavity, such as a button module or an LED module, etc.

[0055] Among them, the assembly process of the magnetic circuit assembly is as follows:

[0056] Fix the magnet 32 in the U-shaped iron 33;

[0057] Fix the magnetic conductive sheet 31 on the magnet 32; and

[0058] Set and fix the counterweight iron 34 on the outer circumference of the U-shaped iron 33.

[0059] Please refer to again Figure 3 , in order to realize the plastic ultrasonic welding of the overall housing, the top edge of the first housing 11 of the first earphone 1 is provided with a third ultrasonic joint around its edge contour, and the edge of the second housing 12 of the first earphone 1 is provided with a fourth ultrasonic joint around its contour. The third ultrasonic joint and the fourth ultrasonic joint are welded by a plastic ultrasonic welding process. Under specific requirements, a sealed ultrasonic welding connection can be made.

[0060] Please refer to Figure 5 , the third ultrasonic joint includes a third rabbet 111 and a third welding surface 112 provided on the inner side. The corresponding fourth ultrasonic joint includes a fourth rabbet 121 and a fourth welding surface 122 provided on the inner side. The welding surface is provided on the inner side to ensure that the melted colloid does not leak out, making the outside of the housing smoother and neater. An outer housing welding guide line is provided on the third welding surface or the fourth welding surface. In this embodiment, the outer housing welding guide line 15 is provided on the third welding surface 112, and the cross-section of the outer housing welding guide line 15 is triangular.

[0061] Please refer to Figure 12 , the assembly method based on the above bone conduction earphone structure is shown. In this embodiment, the bone conduction earphone uses a plastic ultrasonic welding process to assemble the vibration unit, also known as the bone conduction oscillator. The overall housing of the bone conduction earphone is assembled by a plastic ultrasonic welding process.

[0062] Step 100: A first ultrasonic joint is provided at the bottom of the upper cover of the bracket of the vibration unit, and a second ultrasonic joint is provided on the lower cover of the bracket. The first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and the elastic sheet is clamped therebetween;

[0063] Step 200: A third ultrasonic joint is provided at the top of the first outer shell frame of the housing, and a fourth ultrasonic joint is provided at the top of the second outer shell frame. The third ultrasonic joint and the fourth ultrasonic joint are welded by a plastic ultrasonic welding process;

[0064] In this embodiment, the welding guide wires of the first outer shell and the second outer shell corresponding to the first earphone 1 and the second earphone 5 are arranged along the contour of the top of the housing. After ultrasonic welding, they are tightly joined and have a good waterproof effect.

[0065] The plastic ultrasonic welding process is simple, which can reduce the processes of the whole bone conduction earphone, increase the output of the automatic production line, improve the assembly efficiency and reduce the defective rate. In addition, for the bone conduction earphone and the vibration unit fixed by ultrasonic welding, the molecular high-frequency friction on the welding guide wire, the welding surface of the ultrasonic joint and the corresponding surface of the elastic sheet generates movement and diffuses and entangles with each other. The melted welding guide wire medium and the welded parts are fully entangled to increase the vibration conduction area, so that the mid-bass can be effectively transmitted to the housing and then to the human body, thereby improving the mid-bass sound quality.

[0066] In addition, please refer to Figure 8 , both the vibration unit assembly method and the bone conduction earphone assembly method further include the following steps:

[0067] The conduction contact areas of the first touch end A1 and the second touch end A2 of the oscillator circuit board 25 are enlarged, so that the proportion of the conduction contact area of the first touch end or the second touch end in the area of the oscillator circuit board is respectively at least greater than 30%.

[0068] By enlarging the conduction contact areas of the first touch end A1 and the second touch end A2 of the oscillator circuit board 25, the proportion of the conduction contact area of the first touch end A1 or the second touch end A2 in the area of the oscillator circuit board is respectively at least greater than 30%, so as to ensure that the conduction contact area is larger under the elastic sheet type contact connection of the oscillator circuit board, and avoid the situation of no sound caused by poor contact due to the offset of the button assembly.

[0069] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A method for assembling a vibration unit, characterized in that, the vibration unit includes a vibrator circuit board, an upper bracket cover, a lower bracket cover, a shrapnel, a voice coil and a magnetic circuit assembly, and further includes the following assembly steps: A first ultrasonic joint is provided at the bottom of the upper bracket cover, a second ultrasonic joint is provided on the lower bracket cover, and the first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and the shrapnel is clamped therebetween; The voice coil is installed below the upper bracket cover; The vibrator circuit board is flush-mounted at the top of the upper bracket cover, and the vibrator circuit board is connected to the voice coil; The magnetic circuit assembly is suspended on the shrapnel; The vibrator circuit board includes a first touch terminal, a second touch terminal, a first wiring terminal and a second wiring terminal; and further includes the step: The conduction contact areas of the first touch terminal and the second touch terminal are enlarged, so that the proportion of the conduction contact area of the first touch terminal or the second touch terminal in the area of the vibrator circuit board is at least greater than 30%.

2. The method for assembling a vibration unit according to claim 1, characterized in that, The first ultrasonic joint includes a first stop and a first welding surface provided on the periphery, and the corresponding second ultrasonic joint includes a second stop and a second welding surface provided on the periphery. A vibrator welding guide wire is provided on the first welding surface or the second welding surface, and the cross-section of the vibrator welding guide wire is triangular. The upper bracket cover is provided with a plurality of positioning posts around the first ultrasonic joint, and the shrapnel is provided with a plurality of positioning holes corresponding to the positioning posts; Before ultrasonic welding, it further includes the step: Align the positioning holes of the shrapnel with the corresponding positioning posts and place them in a limited position on the first stop.

3. The method for assembling a vibration unit according to claim 1, characterized in that, The magnetic circuit assembly includes a magnetic conductive sheet, a magnet, a U-shaped iron and a counterweight iron, and further includes the steps: Fix the magnet in the U-shaped iron; Fix the magnetic conductive sheet on the magnet; and Install and fix the counterweight iron on the outer circumference of the U-shaped iron.

4. A method for assembling a bone conduction headset, characterized in that, the bone conduction headset includes a first outer shell and a second outer shell that are integrally formed and enclose a housing, and further includes a vibration unit installed in the housing. The vibration unit includes an upper bracket cover, a lower bracket cover, a shrapnel, a vibrator circuit board, a voice coil and a magnetic circuit assembly, and further includes the following assembly steps: A first ultrasonic joint is provided at the bottom of the upper bracket cover, a second ultrasonic joint is provided on the lower bracket cover, and the first ultrasonic joint and the second ultrasonic joint are welded by a plastic ultrasonic welding process and the shrapnel is clamped therebetween; A third ultrasonic joint is provided at the top of the first outer shell frame, a fourth ultrasonic joint is provided at the top of the second outer shell frame, and the third ultrasonic joint and the fourth ultrasonic joint are welded by a plastic ultrasonic welding process; The vibrator circuit board includes a first touch terminal, a second touch terminal, a first wiring terminal and a second wiring terminal, and further includes the step: The conduction contact areas of the first touch terminal and the second touch terminal are enlarged so that the proportion of the conduction contact area of the first touch terminal or the second touch terminal in the area of the oscillator circuit board is at least greater than 30%.

5. The bone conduction headphone assembly method according to claim 4, wherein, the vibration unit further includes the following assembly steps: install the voice coil below the upper cover of the bracket; embed the oscillator circuit board flush with the top of the upper cover of the bracket, and the oscillator circuit board is connected to the voice coil; suspend the magnetic circuit assembly on the shrapnel.

6. The bone conduction headphone assembly method according to claim 4, wherein, the first ultrasonic joint includes a first rabbet and a first welding surface arranged on the periphery, and the corresponding second ultrasonic joint includes a second rabbet and a second welding surface arranged on the periphery. An oscillator welding guiding wire is arranged on the first welding surface or the second welding surface. The cross-section of the oscillator welding guiding wire is triangular. The upper cover of the bracket is provided with a plurality of positioning posts around the first ultrasonic joint, and the shrapnel is provided with a plurality of positioning holes corresponding to the positioning posts; Before ultrasonic welding, it further includes the steps of: align the positioning holes of the shrapnel with the corresponding positioning posts and place them on the first rabbet in a limited manner.

7. The bone conduction headphone assembly method according to claim 4, wherein, the third ultrasonic joint includes a third rabbet and a third welding surface arranged on the inner side, and the corresponding fourth ultrasonic joint includes a fourth rabbet and a fourth welding surface arranged on the inner side. An outer shell welding guiding wire is arranged on the third welding surface or the fourth welding surface. The cross-section of the outer shell welding guiding wire is triangular.

8. The bone conduction headphone assembly method according to claim 4, wherein, the outer shell welding guiding wire is arranged along the border envelope of the first outer shell or the second outer shell to realize the overall welding and sealed welding of the housing.

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