A method for manufacturing an atomizing core and an atomizer
By pressing conductive powder onto the bottom layer of the blank to form a composite blank and then sintering it, the problems of complex atomizing core preparation and separation are solved, realizing an atomizing core that integrates liquid guiding and heating, and ensuring the simplicity and safety of the preparation process.
Patent Information
- Application Number
- CN202210579493.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-25
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2042-05-25
AI Technical Summary
The preparation process of the atomizing core in existing atomizers is complex and can easily lead to separation of the liquid guide and the heat source, resulting in a clogging phenomenon.
The bottom layer of the blank is formed by mixing and pressing a first silicon carbide, a first pore-forming agent and a first binder. A conductive powder is formed by mixing a second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite and a second pore-forming agent and a second binder, and then pressing it onto the bottom layer of the blank to form a composite blank. The blank is then sintered to obtain an atomizing core that integrates liquid conduction and heating functions.
The manufacturing process of the atomizing core has been simplified, ensuring that the liquid guiding and heating functions are integrated, avoiding the core clogging phenomenon caused by separation during use, and adopting a safe and environmentally friendly material system.
Smart Images
Figure CN115104779B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of atomization equipment, in particular to a preparation method of an atomization core and an atomizer. BACKGROUND
[0002] In the prior art, there are three ways for the atomization core in the atomizer, i.e., a heating wire wrapped around a cotton core, a porous ceramic wrapped around a heating wire, and a porous ceramic printed with a heating circuit. In these three ways, the liquid guiding function and the heating function are realized by one material respectively, and the two kinds of materials are combined together by certain physical and chemical methods in the preparation process to realize the atomization function, so that the preparation process is complicated and not easy to control, and the liquid guiding function and the heating function are easily separated to cause the core to be caked. SUMMARY
[0003] The present application provides a preparation method of an atomization core and an atomizer to solve the problem that the preparation process of the atomization core is complicated and not easy to control, and the liquid guiding function and the heating function are easily separated to cause the core to be caked.
[0004] To solve the above technical problem, the first technical solution adopted by the present application is to provide a preparation method of an atomization core, comprising:
[0005] pressing and molding the first silicon carbide, the first pore-forming agent and the first binder to obtain a green body bottom layer;
[0006] mixing the second silicon carbide, the silicon powder, the nickel powder, the molybdenum powder, the graphite, the second pore-forming agent and the second binder to obtain a conductive powder;
[0007] pressing and molding the conductive powder on the green body bottom layer to form a green body top layer and obtain a composite green body;
[0008] sintering the composite green body to obtain the atomization core.
[0009] Optionally, pressing and molding the first silicon carbide, the first pore-forming agent and the first binder to obtain a green body bottom layer comprises:
[0010] mixing the first silicon carbide, the first pore-forming agent and the first binder to obtain a mixed powder A;
[0011] pressing and molding the mixed powder A at a pressure of 5-10MPA to obtain the green body bottom layer.
[0012] Optionally, mixing the second silicon carbide, the silicon powder, the nickel powder, the molybdenum powder, the graphite, the second pore-forming agent and the second binder to obtain a conductive powder comprises:
[0013] Mix 100 parts by weight of the second silicon carbide, 10-20 parts by weight of silicon powder, 3-10 parts by weight of nickel powder, 3-10 parts by weight of molybdenum powder, 10-20 parts by weight of graphite and 15-30 parts by weight of the second pore-forming agent at 200-300 r / min for 3-5 h to obtain the mixed powder B;
[0014] Mix the mixed powder B and the second binder to obtain the conductive powder.
[0015] Optionally, the particle size of the first silicon carbide is 40-60 um, and the particle size of the second silicon carbide is 10-30 um.
[0016] Optionally, the composite blank is sintered to obtain the atomizing core, which comprises:
[0017] The composite blank is sintered for the first time to obtain the atomizing core blank;
[0018] The atomizing core blank is sintered for the second time to obtain the atomizing core.
[0019] Optionally, the temperature for the first sintering is 500-600 DEG C, and the time is 0.5-1.5 h; the temperature for the second sintering is 1800-2000 DEG C, and the time is 1-3 h.
[0020] Optionally, the first pore-forming agent and the second pore-forming agent are at least one of starch, lignin and PMMA, and the first binder and the second binder are PVA solution with a mass concentration of 10-15%.
[0021] Optionally, the conductive powder is pressed and formed on the blank bottom layer to form a blank top layer, and a composite blank is obtained, which comprises:
[0022] The conductive powder is pressed and formed on the blank bottom layer to form a blank top layer at a pressure of 15-20 MPa, and a composite blank is obtained.
[0023] The second technical solution adopted by the present application is to provide an atomizer, which comprises an atomizing core prepared by the preparation method as described above.
[0024] Optionally, the atomizing core comprises a liquid guiding layer and a heating layer, the thickness of the liquid guiding layer is 2-2.5 mm, the porosity is 45-65%, and the pore size is 15-30 um; the thickness of the heating layer is 0.2-0.5 um, the porosity is 20-40%, and the pore size is 10-20 um.
[0025] The beneficial effects of this invention are as follows: The preparation method of this application involves pressing conductive powder onto the bottom layer of a blank to form the top layer of the blank, thereby obtaining a composite blank. The composite blank is then sintered to obtain an atomizing core that integrates liquid guiding and heating functions. This preparation method is simple and easy to control, and the atomizing core prepared by this method has an integrated structure of liquid guiding and heating functions, thus avoiding the core clogging phenomenon caused by the separation of liquid guiding and heating functions during installation and use. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:
[0027] Figure 1 This is a schematic flowchart of a method for preparing an atomizing core according to an embodiment of the present invention. Detailed Implementation
[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0029] like Figure 1 As shown, Figure 1 This is a schematic flowchart of a method for preparing an atomizing core according to an embodiment of the present invention. This application provides a method for preparing an atomizing core, comprising:
[0030] The first silicon carbide, the first pore-forming agent and the first binder are mixed and pressed to obtain the bottom layer of the blank;
[0031] Conductive powder is obtained by mixing second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite, second pore-forming agent and second binder;
[0032] The conductive powder is pressed and molded onto the bottom layer of the blank to form the top layer of the blank, and a composite blank is obtained;
[0033] The composite preform is sintered to obtain the atomizing core.
[0034] The preparation method of the present application forms a green body top layer by pressing the conductive powder on the green body bottom layer to obtain a composite green body, and then sintering the composite green body to obtain an atomizing core with integrated liquid guiding and heating functions. The preparation process of the preparation method is simple and easy to control, and the atomizing core prepared by the preparation method has an integrated liquid guiding and heating function, thereby avoiding the phenomenon of paste core caused by separation of liquid guiding and heating during installation and use of the atomizing core. Moreover, the preparation method uses a completely new material system, which does not contain harmful substances to the human body, and is safe and environmentally friendly.
[0035] In the preparation method of the atomizing core provided by the present application, a green body bottom layer is first needed, that is, the first silicon carbide, the first pore former and the first binder are mixed and then pressed to form a green body bottom layer. For example, the first silicon carbide, the first pore former and the first binder are mixed and then pressed to form a green body bottom layer, which includes:
[0036] The first silicon carbide, the first pore former and the first binder are mixed to obtain a mixed powder A;
[0037] The mixed powder A is pressed to form a green body bottom layer at a pressure of 5-10MPA.
[0038] The first silicon carbide, the first pore former and the first binder can be mixed according to actual needs in a certain mass ratio. The particle size of the first silicon carbide is 40-60um; the first pore former is at least one of starch, lignin and PMMA, and the particle size of the first pore former is 10-15um; and the first binder is a PVA solution with a mass concentration of 10-15%. The thickness of the green body bottom layer is 2.5-3.0mm, and the diameter is 11-13mm.
[0039] After obtaining the green body bottom layer, the conductive powder is prepared, that is, the second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite, second pore former and second binder are mixed to obtain the conductive powder. For example, the second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite, second pore former and second binder are mixed to obtain the conductive powder, which includes:
[0040] 100 parts by weight of the second silicon carbide, 10-20 parts by weight of the silicon powder, 3-10 parts by weight of the nickel powder, 3-10 parts by weight of the molybdenum powder, 10-20 parts by weight of the graphite and 15-30 parts by weight of the second pore former are mixed at 200-300r / min for 3-5h to obtain a mixed powder B;
[0041] The mixed powder B and the second binder are mixed and granulated to obtain the conductive powder.
[0042] The mixed powder B and the second binder can be mixed according to actual needs in a certain mass ratio. The particle size of the second silicon carbide is 10-30 um; the second pore-forming agent is at least one of starch, lignin and PMMA, and the particle size of the second pore-forming agent is 10-15 um; and the second binder is a PVA solution with a mass concentration of 10-15%.
[0043] After the conductive powder is prepared, the conductive powder needs to be pressed and formed on the base layer to form a top layer of the base body and obtain a composite base body. For example, the conductive powder is pressed and formed on the base layer to form a top layer of the base body and obtain a composite base body, which includes:
[0044] The conductive powder is pressed and formed on the base layer to form a top layer of the base body at a pressure of 15-20 MPa to obtain a composite base body.
[0045] The base layer is a liquid-conducting layer base body, and the top layer is a heating layer base body. The base layer and the top layer are combined into one to form a composite base body.
[0046] After the composite base body is obtained, the composite base body needs to be sintered, i.e., the composite base body is sintered to obtain an atomizing core. For example, the composite base body is sintered to obtain an atomizing core, which includes:
[0047] The composite base body is sintered for the first time to obtain an atomizing core base body.
[0048] The atomizing core base body is sintered for the second time to obtain an atomizing core.
[0049] The first sintering is performed at a temperature of 500-600℃ for 0.5-1.5 h, and the first sintering can discharge the first pore-forming agent, the second pore-forming agent, the first binder and the second binder in the composite base body. The second sintering is performed at a temperature of 1800-2000℃ for 1-3 h.
[0050] The atomizing core obtained after the second sintering of the atomizing core base body includes a liquid-conducting layer and a heating layer. The liquid-conducting layer is formed by sintering the base layer, and the heating layer is formed by sintering the top layer. The atomizing core has a structure of integrating the liquid-conducting and heating functions, thereby avoiding the phenomenon of the atomizing core being pasted during installation and use due to separation of the liquid-conducting and heating functions.
[0051] The thickness of the liquid guiding layer is 2-2.5 mm, the porosity is 45-65%, and the pore size is 15-30 um; the thickness of the heating layer is 0.2-0.5 um, the porosity is 20-40%, and the pore size is 10-20 um. According to the above data, the liquid guiding layer is a porous structure of silicon carbide with high porosity and large pore size, and the heating layer is a porous conductive structure of silicon carbide with moderate porosity and small pore size. The atomization core formed by the liquid guiding layer and the heating layer can realize rapid liquid guiding and self-heating.
[0052] The present application also provides an atomizer comprising the atomization core prepared by the preparation method as described above, which is used for heating an aerosol substrate to generate an aerosol for a user to inhale.
[0053] Compared with the related art, the preparation method of the present application forms a top layer of the blank body by pressing the conductive powder on the bottom layer of the blank body to obtain a composite blank body, and then sintering the composite blank body to obtain an atomization core with integrated liquid guiding and heating functions. The preparation method has a simple preparation process and is easy to control. The atomization core prepared by the preparation method has an integrated liquid guiding and heating function, thereby avoiding the phenomenon of paste core caused by the separation of liquid guiding and heating during installation and use. Moreover, the preparation method uses a completely new material system, which does not contain harmful substances to the human body and is safe and environmentally friendly.
[0054] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.
Claims
1. A method for preparing an atomizing core, characterized in that, include: The first silicon carbide, the first pore-forming agent and the first binder are mixed and pressed to obtain the bottom layer of the blank; Conductive powder is obtained by mixing second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite, second pore-forming agent and second binder; The conductive powder is pressed and molded onto the bottom layer of the blank to form the top layer of the blank, and a composite blank is obtained; The composite preform is sintered to obtain the atomizing core.
2. The preparation method according to claim 1, characterized in that, The first silicon carbide, the first pore-forming agent, and the first binder are mixed and pressed to obtain the bottom layer of the preform, which includes: Mixing the first silicon carbide, the first pore-forming agent and the first binder yields mixed powder A; The mixed powder A is pressed into the blank base layer by a pressure of 5-10 MPa.
3. The preparation method according to claim 1, characterized in that, The conductive powder obtained by mixing second silicon carbide, silicon powder, nickel powder, molybdenum powder, graphite, second pore-forming agent, and second binder includes: Mix 100 parts by weight of second silicon carbide, 10-20 parts by weight of silicon powder, 3-10 parts by weight of nickel powder, 3-10 parts by weight of molybdenum powder, 10-20 parts by weight of graphite and 15-30 parts by weight of second pore-forming agent at 200-300 r / min for 3-5 h to obtain mixed powder B. The conductive powder is obtained by mixing and granulating the mixed powder B and the second binder.
4. The preparation method according to claim 1, characterized in that, The particle size of the first silicon carbide is 40-60 μm, and the particle size of the second silicon carbide is 10-30 μm.
5. The preparation method according to claim 1, characterized in that, The composite preform is sintered to obtain the atomizing core, which includes: The composite preform is sintered for the first time to obtain the atomizing core preform; The atomizing core blank is sintered a second time to obtain the atomizing core.
6. The preparation method according to claim 5, characterized in that, The first sintering temperature is 500-600℃ and the time is 0.5-1.5h; the second sintering temperature is 1800-2000℃ and the time is 1-3h.
7. The preparation method according to claim 1, characterized in that, The first pore-forming agent and the second pore-forming agent are at least one of starch, lignin and PMMA, and the first binder and the second binder are PVA solutions with a mass concentration of 10-15%.
8. The preparation method according to claim 1, characterized in that, The conductive powder is pressed and molded onto the bottom layer of the preform to form the top layer of the preform, resulting in a composite preform comprising: The conductive powder is pressed and molded onto the bottom layer of the blank at a pressure of 15-20 MPa to form the top layer of the blank, and a composite blank is obtained.
9. An atomizer, characterized in that, The atomizer includes an atomizing core prepared by the preparation method described in any one of claims 1 to 8.
10. The atomizer according to claim 9, characterized in that, The atomizing core includes a liquid guiding layer and a heating layer. The thickness of the liquid guiding layer is 2-2.5 mm, the porosity is 45-65%, and the pore size is 15-30 μm. The thickness of the heating layer is 0.2-0.5 μm, the porosity is 20-40%, and the pore size is 10-20 μm.