A method for adjusting the modulus of a display module, a display module, and an electronic device

Abstract

This application relates to the technical field of display screens, and particularly relates to a method for adjusting the modulus of a display module, a display module, and an electronic device. The display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus, a first end of the metal sheet layer is connected to the positive electrode of a power supply, and a second end is connected to the negative electrode of the power supply, so that the power supply can output current to the metal sheet layer; wherein, when the electronic device is about to collide with other objects, the metal sheet layer is used to receive a first current from the power supply, and the first current is used to reduce the modulus of the metal sheet layer. The display module can have different moduli in different scenarios to cope with the extrusion or impact caused by different scenarios, and can improve the durability of the display module.

Description

Technical Field

[0001] The present application relates to the technical field of display screens, and particularly relates to a method for adjusting the modulus of a display module, a display module, and an electronic device. Background Art

[0002] A screen support backplane (super clean film, SCF) is used to support and protect the display screen of an electronic device. Among them, the protection of the display screen by the screen support backplane can include the following two aspects.

[0003] Protection effect 1: Coping with or resisting static extrusion caused by the assembly of the electronic device and the tolerances between the components of the electronic device, preventing moiré printing and color deviation of the display panel under assembly stress; and resisting extrusion suffered by the electronic device in a narrow environment (for example, the electronic device is squeezed by a key when placed in a pocket), etc.

[0004] Protection effect 2: Coping with or resisting dynamic impact caused by the whole electronic device falling, preventing bright spots and black spots from being broken by falling, etc.

[0005] Therefore, it is meaningful to provide a screen support backplane with both anti-extrusion ability and anti-impact ability to improve the durability of the electronic device screen. Summary of the Invention

[0006] The embodiments of the present application provide a method for adjusting the modulus of a display module, a display module, and an electronic device, which can dynamically adjust the modulus of the display module to adapt to different scenarios.

[0007] In a first aspect, the embodiments of the present application provide a display module configured in an electronic device, and the display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus, a first end of the metal sheet layer is connected to the positive electrode of a power supply, and a second end is connected to the negative electrode of the power supply, so that the power supply can output current to the metal sheet layer; wherein, when the electronic device is about to collide with other objects, the metal sheet layer is used to receive a first current from the power supply, and the first current is used to reduce the modulus of the metal sheet layer.

[0008] In a possible implementation manner, the first current is used to reduce the modulus of the metal sheet layer from the initial modulus to a target modulus; the target modulus is determined by the impact energy density caused by the electronic device colliding with the other objects.

[0009] In a possible implementation manner, the first end and the second end are two ends in the length direction of the metal sheet layer; or, the first end and the second end are two ends in the width direction of the metal layer.

[0010] In a possible implementation, the display layer is foldable; wherein, when the display module is bent, the metal sheet layer is configured to receive a second current from the power source, and the second current is used to reduce the modulus of the metal sheet layer.

[0011] In a possible implementation, when the bending of the display module is completed, the metal sheet layer no longer receives current from the power source, so that the metal sheet layer restores its initial modulus.

[0012] In a second aspect, an embodiment of the present application provides a modulus adjustment method, which is applied to an electronic device configured with a display module. The display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer whose initial modulus is greater than a preset modulus. The first end of the metal sheet layer is connected to the positive electrode of the power source, and the second end is connected to the negative electrode of the power source, so that the power source can output current to the metal sheet layer. The method includes: determining that the electronic device is about to collide with another object; before the electronic device contacts the other object, controlling the power source to output a first current to the metal sheet layer, and the first current is used to reduce the modulus of the metal sheet layer.

[0013] In a possible implementation, the determining that the electronic device is about to collide with another object includes: determining the impact energy density that the electronic device is about to suffer; according to the impact energy density, based on the corresponding relationship between the modulus and the impact energy density, determining the target modulus; the controlling the power source to output a first current to the metal sheet layer includes: according to the target modulus, based on the corresponding relationship between the modulus and the current density, determining the target current density; calculating the product of the target current density and the cross-sectional area to obtain the target current; the cross-sectional area is the cross-sectional area of the metal layer in the direction perpendicular to the current direction; determining the current equal to or greater than the target current as the first current.

[0014] In a possible implementation, the other object is the ground; the determining that the electronic device is about to collide with another object specifically is determining that the electronic device starts to fall from a first height from the ground; the determining the impact energy density that the electronic device is about to suffer includes: predicting the impact energy when the electronic device lands according to the first height and the mass of the electronic device; and predicting the contact area between the electronic device and the ground when the electronic device lands according to the falling angle of the electronic device; dividing the impact energy by the contact area to obtain the impact energy density.

[0015] In a possible implementation, the display layer is foldable; the method further includes: determining that the display module is being bent; controlling the power source to output a second current to the metal sheet layer, and the second current is used to reduce the modulus of the metal sheet layer.

[0016] In a possible implementation, the method further includes: determining that the display module has completed the bending; controlling the power supply to stop outputting current to the metal sheet layer, so that the metal sheet layer returns to the initial modulus.

[0017] In a third aspect, an embodiment of the present application provides an electronic device, including: a display module, a processor, and a memory; the display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus, a first end of the metal sheet layer is connected to the positive electrode of the power supply, and a second end is connected to the negative electrode of the power supply, so that the power supply can output current to the metal sheet layer; the memory is used to store computer instructions; when the electronic device runs, the processor executes the computer instructions, so that the electronic device performs: determining that the electronic device is about to collide with other objects; before the electronic device touches the other objects, controlling the power supply to output a first current to the metal sheet layer, and the first current is used to reduce the modulus of the metal sheet layer.

[0018] In a possible implementation, when the electronic device runs, the processor executes the computer instructions, so that the electronic device further performs: determining the impact energy density that the electronic device is about to suffer; according to the impact energy density, based on the corresponding relationship between the modulus and the impact energy density, determining the target modulus; according to the target modulus, based on the corresponding relationship between the modulus and the current density, determining the target current density; calculating the product of the target current density and the cross-sectional area to obtain the target current; the cross-sectional area is the cross-sectional area of the metal layer in the direction perpendicular to the current direction; determining the current equal to or greater than the target current as the first current.

[0019] In a possible implementation, the other object is the ground; when the electronic device runs, the processor executes the computer instructions, so that the electronic device further performs: determining that the electronic device starts to fall from a first height from the ground; the determining the impact energy density that the electronic device is about to suffer includes: predicting the impact energy when the electronic device lands according to the first height and the mass of the electronic device; and predicting the contact area between the electronic device and the ground when the electronic device lands according to the falling angle of the electronic device; dividing the impact energy by the contact area to obtain the impact energy density.

[0020] In a possible implementation, the display layer is foldable; when the electronic device runs, the processor executes the computer instructions, so that the electronic device further performs: determining that the display module is being bent; controlling the power supply to output a second current to the metal sheet layer, and the second current is used to reduce the modulus of the metal sheet layer.

[0021] In a possible implementation, when the electronic device is running, the processor executes the computer instructions, so that the electronic device further executes: determining that the display module has completed the bending; controlling the power supply to stop outputting current to the metal sheet layer, so that the metal sheet layer returns to the initial modulus.

[0022] In a fourth aspect, an embodiment of the present application provides an electronic device, including the display module described in the first aspect.

[0023] In a fifth aspect, an embodiment of the present application provides a computer storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method provided in the second aspect is implemented.

[0024] In a sixth aspect, an embodiment of the present application provides a computer program product, including the method for implementing the method provided in the second aspect.

[0025] The display module adjustment method, display module and electronic device provided by the embodiments of the present application can adjust the modulus of the display module in different scenarios to cope with the extrusion or impact caused by different scenarios, and can improve the durability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. is a schematic structural diagram of a display module;

[0027] Figure 2 FIG. is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0028] Figure 3 FIG. is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0029] Figure 4 FIG. is a curve diagram of the corresponding relationship between impact energy density and modulus, and a schematic diagram of the corresponding relationship curve between extrusion die printing stress and modulus;

[0030] Figure 5 FIG. is a schematic diagram of the stress-strain relationship under different current densities;

[0031] Figure 6 FIG. is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0032] Figure 7 FIG. is a flowchart of a method for adjusting the modulus of a display module provided by an embodiment of the present application;

[0033] Figure 8 FIG. is a schematic block diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0035] In the description of this specification, unless otherwise specified, "a plurality of" means two or more.

[0036] In the description of this specification, "an embodiment" or "some embodiments" etc. mean that in one or more embodiments of the present application, specific features, structures or characteristics described in connection with that embodiment are included. Thus, statements such as "in an embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all of the embodiments", unless otherwise specifically emphasized in other ways.

[0037] Among them, in the description of this specification, unless otherwise specified, " / " means "or", for example, A / B can mean A or B; "and / or" herein is only a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality of" means two or more than two.

[0038] In the description of this specification, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. The terms "comprise", "include", "have" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0039] The screen support backplane (super clean film, SCF) is used to support and protect the display screen of an electronic device. Among them, the protective effect of the screen support backplane on the display screen can include the following two aspects.

[0040] Protective effect 1: Cope with or resist the static extrusion caused by the assembly of the electronic device and the tolerances between the components of the electronic device, prevent the display panel from being colored under stamping and assembly stress; and resist the extrusion suffered by the electronic device in a narrow environment (for example, the electronic device is squeezed by a key when placed in a pocket), etc.

[0041] Protective effect 2: Cope with or resist the dynamic impact caused by the whole machine of the electronic device falling, and prevent bright spots and black spots from being broken during the fall.

[0042] Among them, the requirements for the material or performance of the screen support backplane for anti-static extrusion and anti-dynamic impact are contradictory. The higher the modulus of the material, the higher the anti-extrusion ability of the screen support backplane prepared from it, but the lower the anti-impact ability. Typical examples include metals, PET, and PI. The lower the modulus of the material, the higher the anti-impact ability of the screen support backplane prepared from it, but the lower the anti-extrusion ability. Typical examples include foam and grid glue. At present, it is difficult for a screen support backplane prepared from a single material to simultaneously meet the anti-extrusion and anti-impact requirements of electronic devices.

[0043] In one solution, as Figure 1 shown, a screen support backplane is prepared by stacking multiple layers of materials such as foam, PI, and metal Cu, so as to utilize the foam to absorb dynamic impact and utilize Cu and PI to resist static extrusion. As Figure 1 shown, an adhesive is used for interfacial bonding between the layers. A typical structure of this solution is as Figure 1 shown. The display layer includes a cover glass (CG) arranged in sequence, a polarizer (POL) bonded to the CG through an optically clear adhesive (OCA), a display and touch panel bonded to the polarizer through an optically clear adhesive, a PI layer bonded to the display and touch panel through a pressure sensitive adhesive (PSA), a foam layer bonded to the PI layer through a pressure sensitive adhesive or grid glue, and a metal layer bonded to the foam layer through a pressure sensitive adhesive or grid glue. In this solution, the screen support backplane includes multiple stacked layers of materials, with a relatively thick thickness, which is not conducive to the overall thinning of the electronic device. Moreover, the modulus of metal Cu is only 30 - 40 GPa, with strong anti-impact ability and weak anti-extrusion ability, and it is easy to cause crushed bright spots on the display screen due to extrusion.

[0044] The embodiment of the present application provides a method for adjusting the modulus of a display module and a display module, including a display layer and a support layer arranged on the back of the display layer. The support layer can be composed of a single layer of material. Moreover, the material constituting the support layer can change its modulus and also adapt to anti-extrusion scenarios and anti-impact scenarios. Among them, in an anti-extrusion scenario, for example, when an electronic device is placed in a narrow pocket and is squeezed by a key, the support layer can present a high modulus state to cope with or resist the extrusion suffered by the display module. In an anti-impact scenario, for example, in a drop scenario, it can present a low modulus state to cope with or resist the impact caused by the drop. Thus, the contradiction that the high anti-impact ability and high anti-extrusion ability of a screen support backplane composed of a single layer of material cannot be achieved simultaneously can be solved. Moreover, a buffer layer (such as a foam layer) can be dispensed with, thereby reducing the number of layers of the screen support backplane and reducing the thickness of the screen support backplane.

[0045] The display module modulus adjustment method and the display module provided in the embodiments of the present application can be applied to the electronic device 100. The electronic device 100 can be a mobile phone, a tablet computer, a digital camera, a personal digital assistant (PDA), a wearable device, a laptop, a watch, a bracelet and other portable electronic devices. The above portable electronic devices can also be other portable electronic devices, such as a laptop with a touch-sensitive surface (such as a touch panel). It should also be understood that in some other embodiments of the present application, the electronic device 100 may not be a portable electronic device, but a desktop computer, a television, etc. with a touch-sensitive surface (such as a touch panel). In some other embodiments, the electronic device 100 may also be an LCD module, an OLED module, a navigator, etc. The embodiments of the present application do not specifically limit the type of the electronic device 100.

[0046] Figure 2 The structural schematic diagram of the electronic device 100 is shown.

[0047] The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0048] It can be understood that the structure schematically shown in the embodiments of the present invention does not specifically limit the electronic device 100. In some other embodiments of the present application, the electronic device 100 may include more or fewer components than those shown in the figure, or combine certain components, or split certain components, or have different component arrangements. The components shown in the figure can be implemented in hardware, software, or a combination of software and hardware.

[0049] The processor 110 may include one or more processing units. For example, the processor 110 may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units may be independent devices or integrated in one or more processors. In some embodiments, the processor 110 may also be referred to as a system-on-chip.

[0050] The controller can generate operation control signals according to the instruction operation code and timing signals to complete the control of fetching and executing instructions.

[0051] A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store the instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to use the instruction or data again, it can directly call it from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0052] The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives the inputs from the battery 142 and / or the charging management module 140 and supplies power to the processor 110, the internal memory 121, the display screen 194, the camera 193, and the wireless communication module 160, etc. The power management module 141 can also receive the control instructions sent by the processor 110 and supply power to the relevant power-consuming components in response to the control instructions. The power management module 141 can also be used to monitor parameters such as the battery capacity, the number of battery cycles, and the battery health status (leakage, impedance). In some other embodiments, the power management module 141 may also be provided in the processor 110. In some other embodiments, the power management module 141 and the charging management module 140 may also be provided in the same device.

[0053] The display screen 194 is used to display images, videos, etc. The display screen 194 includes a display panel. The display panel can adopt a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a Miniled, a MicroLed, a Micro-oLed, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the electronic device 100 may include one or N display screens 194, where N is a positive integer greater than 1.

[0054] In some embodiments of the present application, the display screen 194 can be bent, that is, the electronic device 100 can be configured with a foldable display screen. Here, the display screen 194 can be bent means that the display screen can be bent to any angle at a fixed position or any position and can be maintained at that angle. The foldable display screen has two modes: an unfolded state and a folded state. Among them, when the bending angle formed when the foldable display screen is bent is greater than a preset value, it can be regarded as being in the unfolded state, and when the bending angle formed when the foldable display screen is bent is less than the preset value, it can be regarded as being in the folded state. The preset value can be predefined, for example, it can be 90 degrees, 80 degrees, etc. The bending angle can refer to the angle formed at the bending position on the side of the foldable screen that is not used for displaying content. In some embodiments, an angle sensor may be provided at the bending position of the foldable display screen, and the electronic device can detect the bending angle through the angle sensor and can judge whether the foldable display screen is in the unfolded state or the folded state according to the bending angle; and judge whether the foldable display screen is in the bending process or is being bent according to the change of the bending angle.

[0055] The pressure sensor 180A is used to sense pressure signals and can convert the pressure signals into electrical signals. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194. There are many types of pressure sensors 180A, such as resistive pressure sensors, inductive pressure sensors, capacitive pressure sensors, etc. The capacitive pressure sensor may include at least two parallel plates having conductive materials. When a force acts on the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device 100 determines the intensity of the pressure based on the change in capacitance. When a touch operation acts on the display screen 194, the electronic device 100 detects the intensity of the touch operation according to the pressure sensor 180A. The electronic device 100 can also calculate the position of the touch based on the detection signal of the pressure sensor 180A. In some embodiments, touch operations acting on the same touch position but with different touch operation intensities may correspond to different operation instructions. For example, when a touch operation with a touch operation intensity less than the first pressure threshold acts on the short message application icon, the instruction to view the short message is executed. When a touch operation with a touch operation intensity greater than or equal to the first pressure threshold acts on the short message application icon, the instruction to create a new short message is executed. In some embodiments, the pressure sensor 180A can detect the detection signal of the user's finger touching the display screen 194 to determine the contact area and contact region of the finger touching the display screen 194, and further can determine whether the finger is clamped between the electronic devices 100 in the folded state.

[0056] The gyroscope sensor 180B can be used to determine the motion posture of the electronic device 100. In some embodiments, the angular velocity of the electronic device 100 around three axes (i.e., the x, y, and z axes) can be determined by the gyroscope sensor 180B. The gyroscope sensor 180B can be used for anti-shake during shooting. Exemplarily, when the shutter is pressed, the gyroscope sensor 180B detects the angle of jitter of the electronic device 100, calculates the distance that the lens module needs to compensate according to the angle, and enables the lens to offset the jitter of the electronic device 100 through reverse movement to achieve anti-shake. The gyroscope sensor 180B can also be used for navigation and somatosensory game scenarios.

[0057] The barometric pressure sensor 180C is used to measure the barometric pressure. In some embodiments, the electronic device 100 calculates the altitude based on the barometric pressure value measured by the barometric pressure sensor 180C to assist in positioning and navigation.

[0058] The magnetic sensor 180D includes a Hall sensor. The electronic device 100 can use the magnetic sensor 180D to detect the opening and closing of the flip leather case. In some embodiments, when the electronic device 100 is a flip phone, the electronic device 100 can detect the opening and closing of the flip according to the magnetic sensor 180D. Furthermore, according to the detected opening and closing state of the leather case or the opening and closing state of the flip, features such as automatic unlocking of the flip are set.

[0059] The acceleration sensor 180E can detect the magnitude of the acceleration of the electronic device 100 in various directions (generally three axes). When the electronic device 100 is stationary, it can detect the magnitude and direction of gravity. It can also be used to identify the posture of the electronic device and is applied to functions such as horizontal and vertical screen switching and pedometers.

[0060] The distance sensor 180F is used to measure distance. The electronic device 100 can measure distance through infrared or laser. In some embodiments, when shooting a scene, the electronic device 100 can use the distance sensor 180F to measure distance to achieve fast focusing.

[0061] The proximity light sensor 180G can include, for example, a light-emitting diode (LED) and a light detector, such as a photodiode. The light-emitting diode can be an infrared light-emitting diode. The electronic device 100 emits infrared light outward through the light-emitting diode. The electronic device 100 uses the photodiode to detect the infrared reflected light from nearby objects. When sufficient reflected light is detected, it can be determined that there is an object near the electronic device 100. When insufficient reflected light is detected, the electronic device 100 can determine that there is no object near the electronic device 100. The electronic device 100 can use the proximity light sensor 180G to detect when the user holds the electronic device 100 close to the ear during a call, so as to automatically turn off the screen to save power. The proximity light sensor 180G can also be used in the holster mode and pocket mode for automatic unlocking and locking of the screen.

[0062] The ambient light sensor 180L is used to sense the ambient light brightness. The electronic device 100 can adaptively adjust the brightness of the display screen 194 according to the sensed ambient light brightness. The ambient light sensor 180L can also be used to automatically adjust the white balance when taking pictures. The ambient light sensor 180L can also cooperate with the proximity light sensor 180G to detect whether the electronic device 100 is in the pocket to prevent accidental touch.

[0063] The fingerprint sensor 180H is used to collect fingerprints. The electronic device 100 can use the collected fingerprint characteristics to achieve fingerprint unlocking, access application locks, fingerprint photography, fingerprint answering of incoming calls, etc.

[0064] The temperature sensor 180J is used to detect temperature. In some embodiments, the electronic device 100 executes a temperature processing strategy based on the temperature detected by the temperature sensor 180J. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the electronic device 100 reduces the performance of the processor near the temperature sensor 180J to reduce power consumption and implement thermal protection. In other embodiments, when the temperature is lower than another threshold, the electronic device 100 heats the battery 142 to avoid abnormal shutdown of the electronic device 100 caused by low temperature. In still other embodiments, when the temperature is lower than yet another threshold, the electronic device 100 boosts the output voltage of the battery 142 to avoid abnormal shutdown caused by low temperature.

[0065] The touch sensor 180K, also known as the "touch control device". The touch sensor 180K can be disposed on the display screen 194. The touch sensor 180K and the display screen 194 form a touch screen, also known as the "touch control screen". The touch sensor 180K is used to detect touch operations acting thereon or nearby. The touch sensor can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through the display screen 194. In some other embodiments, the touch sensor 180K can also be disposed on the surface of the electronic device 100, at a different position from that of the display screen 194.

[0066] The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire vibration signals of the vibrating bone mass of the human vocal part. The bone conduction sensor 180M can also contact the human pulse to receive blood pressure pulsation signals. In some embodiments, the bone conduction sensor 180M can also be disposed in the earphone to form a bone conduction earphone. The audio module 170 can parse out voice signals based on the vibration signals of the vibrating bone mass of the human vocal part acquired by the bone conduction sensor 180M to implement the voice function. The application processor can parse out heart rate information based on the blood pressure pulsation signals acquired by the bone conduction sensor 180M to implement the heart rate detection function.

[0067] An embodiment of the present application provides a display module 400, which can be configured in the electronic device 100. As Figure 3 shown, the display module 400 can include a display layer 410 and a support layer 420. Among them, the support layer 420 is disposed on the non-display surface of the display layer 410. Exemplarily, the support layer 420 can be adhesively bonded to the non-display surface of the display layer 410. In one example, the adhesive can be a pressure-sensitive adhesive. In another example, the adhesive can be a grid adhesive. Exemplarily, the support layer 420 can also be fixed to the non-display surface of the display layer 410 by means of nuts, buckles, etc.

[0068] As Figure 3 shown, the support layer 420 can include a metal layer 421. The metal layer 421 can be a metal plate with a relatively high modulus, which can meet the anti-extrusion requirements of the display module 400. In specific implementation, the developer or designer of the electronic device 100 or the display module 400 can select a metal plate according to the anti-extrusion requirements of the display layer 410 to prepare the metal layer 421.

[0069] Exemplarily, the display layer 410 can be designed to resist or cope with a preset stress at most, and according to the preset stress, the minimum modulus of the support layer 420 is determined so that the display layer 410 does not fail or be damaged when subjected to the preset stress. In other words, when the modulus of the support layer 420 is greater than or equal to the minimum modulus, the display layer 410 does not fail or be damaged when subjected to the preset stress. The damage or failure of the display layer 410 may refer to damage or failure of the circuit of the display panel. The damage or failure of the display layer 410 may also refer to mold printing or color cast of the display panel.

[0070] For example, the modulus of the metal layer 420 may specifically refer to a tensile modulus.

[0071] In one example, the Figure 4 The corresponding relationship between the extrusion die stress and the modulus is shown, and the minimum modulus is determined by using the preset stress. Figure 4 ISEA refers to intelligent superelastic alloy, Cu refers to metallic copper, and SUS-316L refers to a type of stainless steel, namely, stainless steel with model number 316L.

[0072] After the minimum modulus is determined, a metal sheet having a modulus greater than or equal to the minimum modulus may be selected for use as the metal layer 421 .

[0073] Back to Figure 3 , the first end of the metal layer 421 can be connected to the positive electrode of the battery 142, and the second end can be connected to the negative electrode of the battery 142. Exemplarily, the first end and the second end can be opposite ends of the metal layer 421 in the length direction. Exemplarily, the first end and the second end can be opposite ends of the metal layer 421 in the width direction. Exemplarily, as Figure 3 As shown, a first end of the metal layer 421 can be connected to the positive electrode of the battery 142 through a wire 4211 , and a second end of the metal layer 421 can be connected to the negative electrode of the battery 142 through a wire 4212 .

[0074] Thus, the battery 142 can output current to the metal layer 421, and the circuit can reduce the modulus of the metal layer 421. Specifically, metal has an electroplastic effect, and the modulus of the metal decreases when current passes through it.

[0075] In the embodiments of the present application, the modulus that a metal has in the non-powered state can be referred to as the inherent modulus, and the modulus of the metal in the powered state can be referred to as the dynamic modulus. Among them, for the same metal, its dynamic modulus is less than its inherent modulus. Thus, when the electronic device 100 is in an impact-resistant scenario, the battery 142 can output a current to the metal layer 421 to reduce the modulus of the metal layer 421, that is, from the inherent modulus to the dynamic modulus, thereby improving the impact resistance of the display module 400.

[0076] Among them, the electronic device being in an impact-resistant scenario includes the period from when the electronic device 100 detects that it is about to collide with another object to when it collides with that other object. That other object refers to an object outside the electronic device 100. For convenience of description, the object that the electronic device is about to collide with can be referred to as object A. For example, when the electronic device 100 determines that it has fallen (i.e., object A is the ground or other object located below the electronic device 100), it can be determined that it has entered the impact-resistant scenario. For another example, when the electronic device 100 determines that it is approaching object A and the approaching speed is greater than a preset speed threshold B1 or the acceleration is equal to or greater than a preset acceleration threshold C1 (such as the acceleration due to gravity), it can be determined that the electronic device 100 has entered the impact-resistant scenario. When the fall is completed or the impact ends, the electronic device 100 can exit the impact-resistant state. For example, when the electronic device 100 detects that it has come to a standstill after a violent impact or the relative speed between it and object A is lower than a preset speed threshold B2 (i.e., the relative speed between the electronic device 100 and object A is small or even zero), the electronic device 100 can determine that it has exited the impact-resistant scenario.

[0077] In some embodiments, the electronic device 100 can determine or predict the impact energy density that the electronic device 100 will suffer when it collides with object A; then, in combination with the corresponding relationship between the impact energy density and the modulus, the target modulus of the metal layer 421 can be determined, that is, what modulus is needed to cope with or resist the impact energy density that the electronic device 100 will suffer. After that, according to the target modulus, the magnitude of the current that the battery 142 needs to output to the metal layer 421 can be determined, and the determined magnitude of the current can be referred to as the target current; furthermore, the battery 142 can be controlled to output the target current to the metal layer 421. When the target current passes through the metal layer 421, the modulus of the metal layer 421 can be reduced to the target modulus or below the target modulus.

[0078] Next, taking the fall of the electronic device 100 as an example, the process of adjusting the modulus of the metal layer 421 will be introduced by way of example.

[0079] The electronic device 100 can determine, through the acceleration sensor 180E, that the electronic device 100 is currently accelerating at the acceleration due to gravity, from which it can be determined that the electronic device 100 is currently in a free fall state, that is, the electronic device 100 has fallen. At this time, the electronic device 100 can determine that it has entered an anti-shock scenario.

[0080] The electronic device 100 can, through the distance sensor 180F, determine the height h1 between the electronic device 100 and the object A (such as the ground) below it. Then, using the gravitational potential energy formula E = mgh, and with the height h1 and the mass of the electronic device 100 itself, the gravitational potential energy E1, that is, the impact energy E1, is calculated. For example, the height h1 can be set to 0.4 m, the mass of the electronic device 100 is 200 g, and the calculated E1 = 0.2 Kg * 10 N / Kg * 0.4 m = 0.8 J.

[0081] When the impact energy E1 is determined, the impact energy density D1 can be determined according to the contact area S1 between the electronic device 100 and the object A when the electronic device 100 impacts the object A. Where D1 = E1 / S1. Exemplarily, the electronic device 100 can determine the attitude of the electronic device 100 during the fall, and thus determine or predict, according to this attitude, the contact area S1 between the electronic device 100 and the object A1 when the electronic device 100 impacts the object A. For example, the electronic device 100 can determine the attitude of the electronic device 100 through the gyroscope sensor 180B. In one example, it can be set that the electronic device 100 falls with one of its corners downward. Thus, it can be predicted or determined that when the electronic device 100 impacts the object A1, this corner will directly impact the object A1, that is, at the moment of impact, this corner contacts the object A. The area of this corner can be used as the area S1. The area of this corner can be set to 10 mm * 5 mm. Thus, the impact energy density D1 = 0.8 J / (10 mm * 5 mm) = 0.016 J / mm 2 。

[0082] The target modulus can be determined according to the impact energy density D1. Exemplarily, it can be determined according to Figure 4 the corresponding relationship curve between the impact energy density and the modulus as shown, the modulus F1 corresponding to the impact energy density D1 is determined. Exemplarily, the modulus F1 can be used as the target modulus. Exemplarily, the modulus F2 can be used as the target modulus, and the modulus F2 is less than the modulus F1. Taking the impact energy density D1 as 0.016 J / mm 2 as an example, as Figure 4 shown, 0.016 J / mm 2 corresponds to a modulus of 100 GPa. In one example, 100 GPa can be used as the target modulus. In other examples, a modulus less than 100 GPa (such as 90 GPa) can also be used as the target modulus.

[0083] Next, the target current can be determined based on the target modulus of 100 GPa. For a metal, there is a fixed corresponding relationship between its dynamic modulus and the current density passing through it. This corresponding relationship can be obtained through experimental measurement. The specific measurement process can refer to the introduction of the prior art and will not be elaborated here. Taking SUS-316L as an example, at different current densities, its stress and strain are as Figure 5 shown, where the modulus is the ratio of stress to strain, that is Figure 5 the slope of the curve shown. According to Figure 5 the corresponding relationship between stress and strain shown, the current density G1 corresponding to the target modulus can be determined, and the current density G1 is used as the target current density. Taking the target modulus of 100 GPa as an example, according to Figure 5 the stress-strain relationship shown, the current density corresponding to the modulus of 100 GPa can be determined to be 5.3 A / mm 2 . Among them, the response time is 4 seconds, that is to say, when the current density is 5.3 A / mm 2 and lasts for 4 seconds or more, the modulus of SUS-316L drops to 100 GPa.

[0084] After determining the target current density G1, the product of the cross-sectional area S2 of the metal layer 421 in the direction perpendicular to the current and the target current density G1 can be calculated to obtain the target current I1. In one example, one end of the metal layer 421 in the length direction can be connected to the positive electrode of the battery 142, and the other end can be connected to the negative electrode of the battery 142. That is to say, when the metal layer 421 is energized, the current flows through the metal layer 421 along the length direction of the metal layer 421. The length direction of the metal layer 421 is perpendicular to its width direction. Thus, the product of the width and thickness of the metal layer 421 can be calculated to obtain the cross-sectional area S2 in the direction perpendicular to the current. Furthermore, the product of the cross-sectional area S2 in the direction perpendicular to the current and the target current density G1 is calculated to obtain the target current I1. In one example, one end of the metal layer 421 in the width direction can be connected to the positive electrode of the battery 142, and the other end can be connected to the negative electrode of the battery 142. That is to say, when the metal layer 421 is energized, the current flows through the metal layer 421 along the width direction of the metal layer 421. The width direction of the metal layer 421 is perpendicular to its length direction. Thus, the product of the length and thickness of the metal layer 421 can be calculated to obtain the cross-sectional area S2 in the direction perpendicular to the current. Furthermore, the product of the cross-sectional area S2 in the direction perpendicular to the current and the target current density G1 is calculated to obtain the target current I1.

[0085] In a specific example, the cross-sectional area of the metal layer 421 in the direction perpendicular to the current direction can be set as the product of the width and thickness of the metal layer 421. For example, the width of the metal layer 421 can be set to 75 mm and the thickness to 0.05 mm, then the cross-sectional area S2 = 0.05 mm * 75 mm = 3.75 mm 2 . Multiply it by the target current density G1 = 5.3 A / mm 2 , and the target current is obtained as 19.875 A. Thus, the electronic device 100 can control the battery 142 to output a current of 19.875 A to the metal layer 421, so as to reduce the modulus of the metal layer 421 to 100 GPa.

[0086] Specifically, when the target current is determined (at this time, the electronic device 100 has not collided with or touched the object A), the power-on can start according to the target current, that is, before the electronic device 100 collides with or touches the object A, the metal layer 421 is powered on according to the target current to reduce the modulus of the metal layer. When it is detected that the electronic device 100 exits the anti-impact scenario, the power-on can be stopped to restore the inherent modulus of the metal layer 421.

[0087] The above text only gives an example of the process of the electronic device 100 determining the target current and outputting the target current to the metal layer 421 in the anti-impact scenario, and is not a limitation. In other embodiments, the metal layer 421 can be a titanium alloy (fixed modulus of 110 GPa) plate, or an Al-SiC (fixed modulus of 103 GPa) plate, or a stainless steel (fixed modulus of 193 GPa) plate, or a 5052-H18 aluminum alloy (fixed modulus of 60 - 70 GPa) plate, a Ni-Ti alloy (fixed modulus of 110 - 130 GPa) plate, etc. The developer or designer of the electronic device 100 or the display module 400 can freely select a metal with a suitable modulus according to needs. For different metals, the corresponding relationship between the current density and the modulus is different. The current density can be determined according to the specific material of the metal layer 421, and the corresponding relationship between the current density and the modulus of this material can be used to further determine the target current, so as to control the battery 142 to output the target current to the metal layer 421 and reduce the modulus of the metal layer 421 to the target modulus.

[0088] After the electronic device 100 exits the anti-impact scenario, it can control the battery 142 to no longer output current to the metal layer 421. Thus, the modulus of the metal layer 421 can be restored to the fixed modulus, so as to cope with or resist extrusion.

[0089] In some embodiments, the above determination of the impact energy density, determination of the target current, etc. can be executed by the processor 110.

[0090] In some embodiments, the thickness of the metal layer 421 can be 0.03 mm - 0.07 mm. In one example, as Figure 3 shown, the thickness of the metal layer 421 is 0.05 mm.

[0091] In other embodiments, the thickness of the metal layer 421 can be set by the developer or designer of the electronic device 100 or the display module 400 according to relevant requirements, and will not be limited herein.

[0092] In addition, regarding Figure 3 the structure of the display layer 410 shown, it is only used to exemplify the display layer and is not limiting. In other embodiments, the thickness of each layer of the display layer 410 can vary, the adhesive used can also vary, and more or fewer layers can be included. The display panel can be a display and touch panel. The specific implementation of the display layer 410 can refer to the introduction of the prior art, and this application does not limit it.

[0093] Figure 3 The buffer layer 422 (such as a foam layer or a thermoplastic polyurethanes (TPU) layer) in the support layer 420 shown is optional. That is to say, through the solution provided by the embodiments of this application, the buffer layer 422 is no longer a necessary layer and becomes optional. This is beneficial to the overall thinning of the electronic device 100.

[0094] The display module and the modulus adjustment method of the display module provided by the embodiments of this application can achieve anti-extrusion and anti-impact simultaneously by using a single-layer metal material. Therefore, the traditional buffer layer can be removed, which is beneficial to the thinning of the electronic device; and a metal sheet with a relatively high fixed modulus can be used as the metal layer, which can better resist extrusion when different metal layers are not powered on. For example, through the solution of this application, a stainless steel sheet can be used as the metal layer, and when it is not powered on, its anti-extrusion ability is more than twice that of the traditional metal Cu sheet.

[0095] The electronic device 100 can be a foldable electronic device, which has a foldable display screen or a foldable display module. For a foldable display screen or a display module, if the modulus of its screen support backplane is relatively low, it may be difficult to maintain the high flatness of the foldable display screen when it is in the unfolded state. However, if the modulus of the screen support backplane is relatively high, when the user bends the foldable display screen, a relatively large bending force needs to be applied, resulting in inconvenient bending and poor user experience.

[0096] Referring to Figure 6 , the embodiments of this application provide a foldable display module 700, which can be configured in the electronic device 100. AsFigure 6 As shown, the display module 700 may include a display layer 710 and a support layer 720 disposed on the non-display side of the display layer 710.

[0097] In some embodiments, as Figure 6 shown, the display layer 710 includes a colorless polyimide (CPI) film layer, a POL layer bonded to the CPI film layer through OCA, a display panel bonded to the POL layer through OCA, and a back film layer bonded to the display panel through PSA. Among them, the display panel may be a display and touch panel.

[0098] Figure 6 The display layer 710 shown is only for illustrative purposes of the display layer and is not limiting. In other embodiments, the thickness of each layer of the display layer 710 may vary, the adhesives used may also vary, and more or fewer layers may be included. The specific implementation of the display layer 710 may refer to the introduction of the prior art, and this application does not limit it.

[0099] As Figure 6 shown, the support layer 720 may include a metal layer 721. The metal layer 721 is a metal sheet structure and has electroplasticity. When the metal layer 721 is energized, its modulus decreases. In one example, the metal layer 721 may specifically be a stainless steel sheet, such as SUS-316L stainless steel. In one example, the metal layer 721 may specifically be a 5052-H18 aluminum alloy sheet. In one example, the metal layer 721 may specifically be a Ni-Ti alloy sheet. In one example, the metal layer 721 may specifically be an Al-SiC sheet. And so on, and no further enumeration is provided here.

[0100] The metal layer 721 may be connected to the battery 142 to form a closed loop, so that the battery 142 can output current to the metal layer 721, and this current can be used to reduce the modulus of the metal layer 721. Specifically, it may be implemented with reference to the embodiment shown above Figure 3 and will not be elaborated here.

[0101] In the embodiments of this application, when it is detected that the electronic device 100 is bent or during bending, the battery 142 can output current to the metal layer 721 to reduce the modulus of the metal layer 721 for easy bending.

[0102] The stiffness S and modulus of the material have the relationship shown in formula (1).

[0103]

[0104] Among them, E represents the modulus of the material, and H is the thickness of the material.

[0105] The stiffness S of the metal layer can represent the bending force required to bend the metal layer. According to formula (1), it can be known that the bending force required to bend the metal layer is proportional to the modulus of the metal layer. That is, when the modulus of the metal layer is reduced by half, the bending force is also reduced by half.

[0106] According to the relationship between the above-mentioned bending force and modulus, the developer or designer of the electronic device 100 or the display module 700 can select the magnitude of the bending force according to the feel requirement of the product, determine the target modulus according to the bending force, and then determine the target current density when the metal layer is energized according to the target modulus, and further determine the target current. For details, reference can be made to the introduction of the Figures 3 - 5 illustrated embodiments above, which will not be elaborated here.

[0107] In some embodiments, the electronic device 100 can detect the angle between the main and secondary middle frames of the electronic device 100 through the magnetic sensor 180D. When it is detected that the angle is less than 180°, it can be determined that the electronic device 100 is being bent or in the process of bending. At this time, the battery 142 can be controlled to output a target current to the metal layer 721 to reduce the modulus of the metal layer 721, facilitating bending.

[0108] In some embodiments, the electronic device 100 can detect the angle between the main and secondary middle frames of the electronic device 100 through the magnetic sensor 180D. When it is detected that the angle is less than 180° and the angle is continuously changing (for example, the angle changes by a preset amplitude within a preset time period), it can be determined that the electronic device 100 is being bent or in the process of bending. At this time, the battery 142 can be controlled to energize the metal layer 721 to reduce the modulus of the metal layer 721, facilitating bending.

[0109] In some embodiments, when the electronic device 100 detects the end of the bending of the electronic device 100, it can control the battery 142 to stop outputting current to the metal layer 721 to restore the modulus of the metal layer 721 to the inherent modulus, so that the display layer 710 can maintain a high flatness.

[0110] In some embodiments, the electronic device 100 can detect the angle between the main and secondary middle frames of the electronic device 100 through the magnetic sensor 180D. When it is detected that the angle between the main and secondary middle frames no longer changes continuously (for example, the angle does not change within a preset time period, or the change amount is less than a preset angle threshold), it can be determined that the bending of the electronic device 100 is ended

[0111] In some embodiments, as Figure 6 shown, the support layer 720 may further include a buffer layer 722. The buffer layer 722 can be disposed between the metal layer 721 and the display layer 710. The buffer layer 722 can be a foam layer or a rubber layer (such as a TPU layer).

[0112] The display module and modulus adjustment method provided by the present application can reduce the modulus of the display screen when the electronic device is bent, making it easier to bend; when the electronic device is in the unfolded state, it can restore the original higher modulus of the display screen and maintain the high flatness of the display screen.

[0113] An embodiment of the present application provides a modulus adjustment method, which can be applied to an electronic device 100 configured with a display module. The display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus. The first end of the metal sheet layer is connected to the positive pole of the power supply, and the second end is connected to the negative pole of the power supply, so that the power supply can output current to the metal sheet layer.

[0114] As Figure 7 shown, the method includes the following steps.

[0115] Step 801, determine that the electronic device is about to collide with other objects.

[0116] Step 802, before the electronic device contacts the other object, control the power supply to output a first current to the metal sheet layer, and the first current is used to reduce the modulus of the metal sheet layer.

[0117] In some embodiments, the determining that the electronic device is about to collide with other objects includes: determining the impact energy density that the electronic device is about to suffer; according to the impact energy density, based on the corresponding relationship between the modulus and the impact energy density, determining the target modulus; the controlling the power supply to output a first current to the metal sheet layer includes: according to the target modulus, based on the corresponding relationship between the modulus and the current density, determining the target current density; calculating the product of the target current density and the cross-sectional area to obtain the target current; the cross-sectional area is the cross-sectional area of the metal layer in the direction perpendicular to the current; determining the current equal to or greater than the target current as the first current.

[0118] In an illustrative example of this embodiment, the other object is the ground; the determining that the electronic device is about to collide with other objects specifically is to determine that the electronic device starts to fall from a first height from the ground; the determining the impact energy density that the electronic device is about to suffer includes: predicting the impact energy when the electronic device lands according to the first height and the mass of the electronic device; and predicting the contact area between the electronic device and the ground when the electronic device lands according to the falling angle of the electronic device; dividing the impact energy by the contact area to obtain the impact energy density.

[0119] In some embodiments, the display layer is foldable; the method further includes: determining that the display module is being bent; controlling the power supply to output a second current to the metal sheet layer, where the second current is used to reduce the modulus of the metal sheet layer.

[0120] In some embodiments, the method further includes: determining that the display module has completed the bending; controlling the power supply to stop outputting current to the metal sheet layer, so that the metal sheet layer returns to the initial modulus.

[0121] The method for adjusting the modulus of the display module provided by the embodiments of the present application can adjust the modulus of the display module in different scenarios to cope with the extrusion or impact caused by different scenarios, and can improve the durability of the display module.

[0122] Refer to Figure 8 , embodiments of the present application provide an electronic device 900. The electronic device 900 may include a processor 910, a memory 920, and a display module 930.

[0123] The display module 930 includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus, where the first end of the metal sheet layer is connected to the positive electrode of the power supply, and the second end is connected to the negative electrode of the power supply, so that the power supply can output current to the metal sheet layer.

[0124] The memory 920 is used to store a computer program. When the computer program stored in the memory 920 is executed by the processor 910, the electronic device 900 can perform the functions of the electronic device 100 described above.

[0125] The method steps in the embodiments of the present application can be implemented in a hardware manner or by a processor executing software instructions. The software instructions can be composed of corresponding software modules. The software modules can be stored in a random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, removable hard disks, CD-ROMs, or any other form of storage medium well known in the art. An exemplary storage medium is coupled to the processor, so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can be located in an ASIC.

[0126] In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired manner (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or a wireless manner (such as infrared, wireless, microwave, etc.). The computer-readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more integrated available media. The available medium may be a magnetic medium (for example, a floppy disk, a hard disk, a magnetic tape), an optical medium (for example, a DVD), or a semiconductor medium (for example, a solid state disk (SSD)), etc.

[0127] It can be understood that the various numerical numbers involved in the embodiments of the present application are only for convenience of description and are not used to limit the scope of the embodiments of the present application.

Claims

1. A display module, characterized in that, Configured in an electronic device, the display module includes: A display layer; A support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus. The first end of the metal sheet layer is connected to the positive pole of a power supply, and the second end is connected to the negative pole of the power supply, so that the power supply can output current to the metal sheet layer; wherein, When the electronic device is about to collide with other objects, the metal sheet layer is used to receive a first current from the power supply, and the first current is used to reduce the modulus of the metal sheet layer.

2. The display module according to claim 1, wherein The first current is used to reduce the modulus of the metal sheet layer from the initial modulus to a target modulus; the target modulus is determined by the impact energy density caused by the electronic device colliding with the other objects.

3. The display module according to claim 1, characterized in that, The first end and the second end are two ends in the length direction of the metal sheet layer; or, the first end and the second end are two ends in the width direction of the metal sheet layer.

4. The display module according to claim 1, characterized in that, The display layer is foldable; wherein, When the display module is bent, the metal sheet layer is used to receive a second current from the power supply, and the second current is used to reduce the modulus of the metal sheet layer.

5. The display module according to claim 4, wherein When the display module completes the bending, the metal sheet layer no longer receives current from the power supply, so that the metal sheet layer restores the initial modulus.

6. A modulus adjustment method, characterized in that, Applied to an electronic device configured with a display module, the display module includes: a display layer; a support layer located on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus. The first end of the metal sheet layer is connected to the positive pole of a power supply, and the second end is connected to the negative pole of the power supply, so that the power supply can output current to the metal sheet layer; The method includes: Determine that the electronic device is about to collide with other objects; Before the electronic device contacts the other objects, control the power supply to output a first current to the metal sheet layer, and the first current is used to reduce the modulus of the metal sheet layer.

7. The method according to claim 6, wherein, The determining that the electronic device is about to collide with other objects includes: Determine the impact energy density that the electronic device is about to suffer; According to the impact energy density, based on the corresponding relationship between the modulus and the impact energy density, determine the target modulus; The controlling the power supply to output a first current to the metal sheet layer includes: According to the target modulus, based on the corresponding relationship between the modulus and the current density, determine the target current density; Calculate the product of the target current density and the cross-sectional area to obtain the target current; the cross-sectional area is the cross-sectional area of the metal sheet layer in the direction perpendicular to the current direction; Determine the current equal to or greater than the target current as the first current.

8. The method according to claim 7, wherein The other object is the ground; the determining that the electronic device is about to collide with other objects is specifically to determine that the electronic device starts to fall from a first height from the ground; The determining the impact energy density that the electronic device is about to suffer includes: According to the first height and the mass of the electronic device, predict the impact energy when the electronic device lands; and according to the falling angle of the electronic device, predict the contact area between the electronic device and the ground when the electronic device lands; Divide the impact energy by the contact area to obtain the impact energy density.

9. The method according to claim 6, wherein The display layer is foldable; The method further includes: Determine that the display module is being bent; Control the power supply to output a second current to the metal sheet layer, where the second current is used to reduce the modulus of the metal sheet layer.

10. The method according to claim 9, wherein The method further includes: Determine that the display module has completed the bending; Control the power supply to stop outputting current to the metal sheet layer so that the metal sheet layer returns to the initial modulus.

11. An electronic device, characterized in that, Includes: A display module, a processor, and a memory; The display module includes: a display layer; A support layer on the non-display side of the display layer, including a metal sheet layer with an initial modulus greater than a preset modulus. The first end of the metal sheet layer is connected to the positive pole of the power supply, and the second end is connected to the negative pole of the power supply so that the power supply can output current to the metal sheet layer; The memory is used to store computer instructions; when the electronic device runs, the processor executes the computer instructions, causing the electronic device to execute: Determine that the electronic device is about to collide with other objects; Before the electronic device contacts the other object, control the power supply to output a first current to the metal sheet layer, where the first current is used to reduce the modulus of the metal sheet layer.

12. The electronic device according to claim 11, wherein When the electronic device runs, the processor executes the computer instructions, causing the electronic device to further execute: Determine the impact energy density that the electronic device is about to suffer; According to the impact energy density, based on the corresponding relationship between the modulus and the impact energy density, determine the target modulus; According to the target modulus, based on the corresponding relationship between the modulus and the current density, determine the target current density; Calculate the product of the target current density and the cross-sectional area to obtain the target current; the cross-sectional area is the cross-sectional area of the metal sheet layer perpendicular to the current direction; Determine that the current equal to or greater than the target current is the first current.

13. The electronic device according to claim 12, wherein The other object is the ground; when the electronic device runs, the processor executes the computer instructions, causing the electronic device to further execute: Determine that the electronic device starts to fall from a first height from the ground; The determination of the impact energy density that the electronic device is about to suffer includes: According to the first height and the mass of the electronic device, predict the impact energy when the electronic device lands; and according to the falling angle of the electronic device, predict the contact area between the electronic device and the ground when the electronic device lands; Divide the impact energy by the contact area to obtain the impact energy density.

14. The electronic device according to claim 11, wherein The display layer is foldable; when the electronic device runs, the processor executes the computer instructions, causing the electronic device to further execute: Determine that the display module is being bent; Control the power supply to output a second current to the metal sheet layer, where the second current is used to reduce the modulus of the metal sheet layer.

15. The electronic device according to claim 14, wherein When the electronic device runs, the processor executes the computer instructions, causing the electronic device to further execute: Determine that the display module has completed the bending; Control the power supply to stop outputting current to the metal sheet layer so that the metal sheet layer returns to the initial modulus.

16. An electronic device, characterized in that, Comprising the display module according to any one of claims 1-5.

17. A computer storage medium, characterized in that, A computer program is stored on the computer storage medium, and when the computer program is executed by a processor, the method according to any one of claims 6-10 is implemented.

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