Display panel, display device, and method for manufacturing display panel

Abstract

This application discloses a display panel, a display device, and a method for manufacturing a display panel. The display panel includes a substrate, a light-emitting substrate, and a cover plate. The light-emitting substrate is used to emit light from the display panel. A pressure sensing module is located between the substrate and the cover plate, that is, the pressure sensing module is located within the display panel, which can reduce the overall thickness of the display panel and facilitate under-screen integration of the pressure sensing module.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] With the rapid development of electronic devices, in order to deepen the interaction between users and terminal products and enhance the tactile and perceptual experience, the functions of mobile communications and consumer electronic terminal products (such as smartphones, tablets, laptops, etc.) need to be expanded. Therefore, pressure sensing has been widely developed and applied in electronic terminal products.

[0003] The implementation of pressure sensing includes a variety of technologies, such as capacitive pressure sensing modules, piezoelectric pressure sensing modules, piezoresistive pressure sensing modules, etc. However, pressure sensing modules are currently all single modules and need to be assembled separately during the assembly process of electronic terminal products. External modules increase the thickness of the entire machine, which is not conducive to under-screen integration of the display panel. Summary of the Invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which facilitate under-screen integration of a pressure sensing module.

[0005] The first embodiment of the present application provides a display panel, which includes: a substrate; a light-emitting substrate located on the substrate; a cover plate located on a side of the light-emitting substrate facing away from the substrate; and a pressure sensing module located in the display area and between the substrate and the cover plate.

[0006] According to the implementation of the first aspect of the present application, a plurality of pressure sensing modules are distributed in an array.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple pressure sensing modules are evenly distributed.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the pressure sensing module includes a plurality of pressure-sensitive resistors.

[0009] The multiple piezoresistors of the same pressure sensing module are located on one layer or on two layers.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the minimum effective range of deformation sensing of the varistor in the thickness direction is 0.1 μm-1 μm.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple piezoresistors of the same pressure sensing module are located in the same layer, and the multiple piezoresistors are located between two adjacent ones of the substrate, the light-emitting substrate and the cover.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple piezoresistors of the same pressure sensing module are arranged in two layers, and both layers of piezoresistors are located between the substrate and the light-emitting substrate, or both layers of piezoresistors are located between the light-emitting substrate and the cover plate, or one of the two layers of piezoresistors is located between the substrate and the light-emitting substrate, and the other is located between the light-emitting substrate and the cover plate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple piezoresistors of the same pressure sensing module are arranged in two layers, and the multiple piezoresistors of the same pressure sensing module include a first resistor, a second resistor, a third resistor and a fourth resistor. The first resistor and the second resistor are located in one layer, and the third resistor and the fourth resistor are located in another layer.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first resistor on the substrate overlaps with the orthographic projection of the third resistor on the substrate, and / or the orthographic projection of the second resistor on the substrate overlaps with the orthographic projection of the fourth resistor on the substrate.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting substrate includes:

[0016] Driver array layer;

[0017] a light-emitting layer, located on a side of the driving array layer facing away from the substrate;

[0018] The encapsulation layer is located on the side of the light-emitting layer away from the driving array layer;

[0019] At least one piezoresistor is located between the substrate and the driving array layer, and / or at least one piezoresistor is located between the packaging layer and the cover plate.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes an insulating layer located on a side of the light-emitting substrate facing away from the substrate, and at least one varistor is located between the insulating layer and the encapsulation layer.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a buffer layer located between the substrate and the drive array layer, and at least one piezoresistor is located between the buffer layer and the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting layer includes a pixel definition layer, the pixel definition layer includes a pixel opening and an isolation portion arranged around the pixel opening, at least one varistor is located between the encapsulation layer and the cover plate, and the orthographic projection of the varistor on the substrate is located within the orthographic projection of the isolation portion on the substrate.

[0023] An embodiment of the second aspect of the present application provides a display device, which includes the display panel of any of the above embodiments.

[0024] According to a third aspect of the present application, there is provided a method for manufacturing a display panel, wherein the display panel has a display area, including:

[0025] A pressure sensing module is prepared between the substrate and the cover plate, and the pressure sensing module is located in the display area.

[0026] The display panel according to an embodiment of the present application has a display area, comprising a substrate, a light-emitting substrate, and a cover plate. The light-emitting substrate is used to emit light from the display panel. The pressure sensing module is located between the substrate and the cover plate, that is, within the display panel. This reduces the overall thickness of the display panel and facilitates under-screen integration of the pressure sensing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0028] Figure 1 This is a schematic structural diagram of a display panel provided by an embodiment of the first aspect of the present application;

[0029] Figure 2 yes Figure 1 A partial enlarged view of the display panel;

[0030] Figure 3 is a partial enlarged view of a display panel in another embodiment;

[0031] Figure 4 yes Figure 2 A partial cross-sectional view of the display panel is shown;

[0032] Figure 5 is a partial cross-sectional view of a display panel in another embodiment;

[0033] Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment;

[0034] Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment;

[0035] Figure 8 is a partial enlarged view of a display panel in another embodiment;

[0036] Figure 9 FIG. 4 is a schematic structural diagram of a pressure sensing module in yet another embodiment.

[0037] Figure 10 This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the third aspect of the present application;

[0038] Figure 11 It is a flow chart of a method for preparing a display panel in another embodiment of the third aspect of the present application.

[0039] Description of reference numerals:

[0040] 10. Display panel;

[0041] 100, substrate;

[0042] 200, light-emitting substrate; 210, drive array layer; 220, light-emitting layer; 221, pixel definition layer; 222, pixel opening; 223, isolation portion; 230, encapsulation layer;

[0043] 300, cover plate;

[0044] 410, pressure sensing module; 420, pressure-sensitive resistor; 421, first resistor; 422, second resistor; 423, third resistor; 424, fourth resistor;

[0045] 500, insulation layer;

[0046] 600. Buffer layer. DETAILED DESCRIPTION

[0047] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0048] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0049] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0050] On electronic devices such as mobile phones and tablets, it is necessary to integrate light-sensing components such as a front-facing camera, an infrared light sensor, a proximity light sensor, and pressure-sensing components such as a pressure-sensing module on one side of the display panel. In some embodiments, the pressure-sensing module can be placed outside the display panel to achieve full-screen display while ensuring the normal operation of the pressure-sensing components.

[0051] To improve the integration of pressure sensing modules on display panels, some related technologies use external pressure sensing modules laminated or printed on the display panel. However, existing pressure sensing modules are externally laminated or printed, which are bulky and block the light output of the display panel, making them difficult to integrate on the display panel.

[0052] To solve the above problems, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Hereinafter, various embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described with reference to the accompanying drawings.

[0053] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0054] Please also refer to Figure 1 , Figure 1 This is a structural diagram of a display panel provided in an embodiment of the first aspect of the present application.

[0055] The display panel 10 provided in the embodiment of the first aspect of the present application has a display area. The display panel 10 includes a substrate 100, a light-emitting substrate 200 located on the substrate 100, a cover plate 300 located on the side of the light-emitting substrate 200 facing away from the substrate 100, and a pressure sensing module 410 located between the substrate 100 and the cover plate 300. The pressure sensing module 410 is located in the display area.

[0056] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, a light-emitting substrate 200, and a cover plate 300. The light-emitting substrate 200 is used to emit light from the display panel 10. The pressure sensing module 410 is located between the substrate 100 and the cover plate 300. That is, the pressure sensing module 410 is located inside the display panel 10, which can reduce the overall thickness of the display panel 10 and facilitate the under-screen integration of the pressure sensing module 410. The pressure sensing module 410 is located in the display area, which can realize pressure sensing in the area corresponding to the pressure sensing module 410 in the display area.

[0057] In some optional embodiments, the pressure sensing module 410 can also be located in the non-display area, that is, the pressure sensing module 410 is located in the display area and the non-display area, and pressure sensing modules 410 are provided in multiple areas to perform pressure sensing on each area respectively, thereby realizing multi-point pressure sensing of the display panel.

[0058] When the pressure sensing module 410 is located between the light emitting substrate 200 and the cover plate 300 , the overall thickness of the display panel 10 can also be reduced.

[0059] There are many ways to configure the substrate 100. The substrate 100 can be made of a light-transmitting material such as glass or polyimide (PI). In some embodiments, the substrate 100 further includes a support layer located on one side of the substrate 100.

[0060] There are many ways to dispose the light-emitting substrate 200 . In some embodiments, the light-emitting substrate 200 includes a driving array layer 210 and a light-emitting layer 220 located on the driving array layer 210 .

[0061] There are many ways to set up the cover plate 300. The cover plate 300 can be made of glass, so that the cover plate 300 has higher transmittance and stronger structural rigidity.

[0062] In some optional embodiments, multiple pressure sensing modules 410 are provided in the display area, and the multiple pressure sensing modules 410 are arranged in an array. This allows pressure sensing to be generated in different areas of the display panel 10, thereby increasing the pressure sensing range. The multiple pressure sensing modules 410 do not affect each other, thereby improving sensing sensitivity.

[0063] Optionally, the plurality of pressure sensing modules 410 are evenly distributed.

[0064] In these optional embodiments, multiple pressure sensing modules 410 are evenly distributed in the display panel 10, which can maximize the effect of each pressure sensing module 410. When the area of the display panel 10 is fixed, the number of required pressure sensing modules 410 is reduced, thereby increasing the utilization rate of the pressure sensing modules 410.

[0065] Please also refer to Figure 2 and Figure 3 , Figure 2 yes Figure 1 A partial enlarged view of the display panel; Figure 3 FIG. 4 is a partial enlarged view of a display panel in another embodiment.

[0066] In some optional embodiments, the pressure sensing module 410 includes a plurality of pressure-sensitive resistors 420 , wherein the plurality of pressure-sensitive resistors 420 of the same pressure sensing module 410 are located in one layer or in two layers.

[0067] In these optional embodiments, the piezoresistors 420 deform in the thickness direction when subjected to pressure, thereby reducing impedance and achieving pressure sensing. When multiple piezoresistors 420 of the same pressure sensing module 410 are located in a single layer, the overall thickness of the display panel 10 can be reduced. When multiple piezoresistors 420 of the same pressure sensing module 410 are located in two separate layers, the manufacturing process is simplified, facilitating the fabrication of the pressure sensing module 410. Furthermore, a relatively large number of pressure sensing modules 410 can be located within the same area, increasing sensing sensitivity.

[0068] In some optional embodiments, the minimum effective range of deformation sensing of the piezoresistor 420 in the thickness direction is 0.1 μm-1 μm.

[0069] In these optional embodiments, the minimum deformation sensing effective range of the piezoresistor 420 is the minimum vertical displacement that the piezoresistor 420 can detect, which is in the range of 0.1 μm-1 μm. The piezoresistor 420 has a high detection sensitivity and can detect small deformations. Figure 4 and Figure 5 , Figure 4 yes Figure 2 A partial cross-sectional view of the display panel is shown; Figure 5 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0070] In some optional embodiments, the light-emitting substrate 200 includes: a driving array layer 210; a light-emitting layer 220, located on the side of the driving array layer 210 facing away from the substrate 100; an encapsulation layer 230, located on the side of the light-emitting layer 220 facing away from the driving array layer 210; at least one varistor 420 is located between the substrate 100 and the driving array layer 210, and / or, at least one varistor 420 is located between the encapsulation layer 230 and the cover plate 300.

[0071] In these optional embodiments, at least one piezoresistor 420 is located between the substrate 100 and the drive array layer 210, or at least one piezoresistor 420 is located between the encapsulation layer 230 and the cover plate 300. Providing the piezoresistor 420 between layers reduces the overall thickness of the display panel 10 and reduces the cost of the pressure sensing module 410.

[0072] See also Figure 6 , Figure 6 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0073] In some optional embodiments, the display panel 10 further includes an insulating layer 500 located on a side of the light-emitting base plate 200 facing away from the substrate 100 , and at least one varistor 420 is located between the insulating layer 500 and the encapsulation layer 230 .

[0074] In these optional embodiments, at least one piezoresistor 420 is located between the insulating layer 500 and the encapsulation layer 230. The insulating layer 500 insulates the piezoresistor 420 from other conductive layers, preventing the piezoresistor 420 from short-circuiting and ensuring normal pressure sensing. Placing the piezoresistor 420 between layers reduces the overall thickness of the display panel 10.

[0075] See also Figure 7 , Figure 7 FIG. 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0076] In some optional embodiments, the display panel 10 further includes a buffer layer 600 located between the substrate 100 and the driving array layer 210 , and at least one piezoresistor 420 is located between the buffer layer 600 and the substrate 100 .

[0077] In these optional embodiments, at least one piezoresistor 420 is located between the substrate 100 and the buffer layer 600. The buffer layer 600 insulates the piezoresistor 420 from other conductive layers, preventing short circuits in the piezoresistor 420 and ensuring normal pressure sensing. Placing the piezoresistor 420 between layers reduces the overall thickness of the display panel 10.

[0078] Optionally, when the varistor 420 is located between layers, the varistor 420 can be embedded in the encapsulation layer 230 or the insulating layer 500 or the buffer layer 600, eliminating the need for double-sided tape or OCA optical adhesive layer, thereby reducing the overall thickness of the display panel 10 and reducing the production cost of the pressure sensing module 410.

[0079] Please also refer to Figures 4 to 7 In some optional embodiments, the light-emitting layer 220 includes a pixel definition layer 221, the pixel definition layer 221 includes a pixel opening 222 and an isolation portion 223 arranged around the pixel opening 222, at least one varistor 420 is located between the encapsulation layer 230 and the cover plate 300, and the orthographic projection of the varistor 420 on the substrate 100 is located within the orthographic projection of the isolation portion 223 on the substrate 100.

[0080] In these optional embodiments, at least one piezoresistor 420 is located between the encapsulation layer 230 and the cover plate 300. By arranging the piezoresistor 420 between the layers, double-sided tape or OCA optical adhesive layer is eliminated, thereby reducing the overall thickness of the display panel 10 and reducing the production cost of the pressure sensing module 410.

[0081] Preferably, in this embodiment, the orthographic projection of the varistor 420 located between the encapsulation layer 230 and the cover plate 300 on the substrate 100 is located within the orthographic projection of the isolation portion 223 on the substrate 100, effectively preventing the varistor 420 from affecting the luminescence of the light-emitting layer 220 and facilitating under-screen integration.

[0082] In some embodiments, the piezoresistors 420 are disposed in the non-luminescent area of the display region. This minimizes the impact on the light extraction efficiency of the luminescent layer 220. Furthermore, the array arrangement of the piezoresistors 420 in the display region enables multi-point sensing of the display region, i.e., sensing the force conditions at multiple locations.

[0083] In some optional embodiments, multiple piezoresistors of the same pressure sensing module are located in the same layer, and the multiple piezoresistors are located between the substrate and the light-emitting base plate or between the light-emitting base plate and the cover plate.

[0084] When multiple piezoresistors 420 are located between the substrate 100 and the light-emitting substrate 200, not only can the overall thickness of the display panel 10 be reduced, but the multiple piezoresistors 420 are also located on the side of the light-emitting substrate 200 close to the substrate 100, which does not affect the light emission of the light-emitting substrate 200, so that the display panel 10 can display and have a pressure sensing function.

[0085] In these optional embodiments, the plurality of varistors 420 are located in one layer, which not only reduces the overall thickness of the display panel 10 but also facilitates the preparation of the varistors 420 .

[0086] In some optional embodiments, the multiple piezoresistors 420 of the same pressure sensing module 410 are arranged in two layers, and both layers of piezoresistors 420 are located between the substrate 100 and the light-emitting substrate 200, or both layers of piezoresistors 420 are located between the light-emitting substrate 200 and the cover plate 300, or one of the two layers of piezoresistors 420 is located between the substrate 100 and the light-emitting substrate 200, and the other is located between the light-emitting substrate 200 and the cover plate 300.

[0087] In these optional embodiments, the varistor 420 is two layers, and the varistor 420 in the same layer can be prepared at the same time, which simplifies the preparation process of the varistor 420 and reduces the production cost. Moreover, the two layers of varistor 420 are both located between the light-emitting substrate 200 and the cover plate 300. The varistor 420 is closer to the cover plate and can effectively sense tiny deformations, resulting in a better pressure sensing effect.

[0088] In these optional embodiments, one of the two layers of varistors 420 is located between the substrate 100 and the light-emitting substrate 200, and the other is located between the light-emitting substrate 200 and the cover plate 300. This can not only ensure that the layer of the varistor 420 close to the cover plate 300 has a good pressure sensing effect, but also enable part of the varistor 420 to be located on the side of the light-emitting layer 220 close to the substrate 100, thereby reducing the impact on the light output rate of the light-emitting layer 220.

[0089] Please continue reading Figure 8 , Figure 8 It is a partial enlarged view of a display panel in yet another embodiment.

[0090] In some optional embodiments, the multiple pressure-sensitive resistors 420 of the same pressure sensing module 410 are arranged in two layers. The multiple pressure-sensitive resistors 420 of the same pressure sensing module 410 include a first resistor 421, a second resistor 422, a third resistor 423 and a fourth resistor 424. The first resistor 421 and the second resistor 422 are located in one layer, and the third resistor 423 and the fourth resistor 424 are located in another layer.

[0091] In these optional embodiments, the first resistor 421 and the second resistor 422 are located in one pressure sensing layer 400, the third resistor 423 and the fourth resistor 424 are located in the other pressure sensing layer 400, and the pressure sensitive resistors 420 are evenly distributed in two layers, which facilitates patterning processing and simplifies the process.

[0092] See also Figure 9 , Figure 9 FIG. 4 is a structural diagram of a pressure sensing module 410 in yet another embodiment.

[0093] The first resistor 421, the second resistor 422, the third resistor 423 and the fourth resistor 424 are connected in a bridge circuit. For example, the first resistor 421 and the second resistor 422 are connected in series, and the third resistor 423 and the fourth resistor 424 are connected in series. The first resistor 421 and the second resistor 422 connected in series and the third resistor 423 and the fourth resistor 424 connected in series are connected in parallel. When the pressure sensing module 410 is subjected to force, at least one of the resistance of the first resistor 421, the second resistor 422, the third resistor 423 and the fourth resistor 424 will change, thereby causing the potential difference between points P1 and P2 of the bridge circuit to change. By measuring the potential difference, it is possible to determine whether force is applied and the magnitude of the force.

[0094] In some optional embodiments, the orthographic projection of the first resistor 421 on the substrate 100 overlaps with the orthographic projection of the third resistor 423 on the substrate 100 , and / or the orthographic projection of the second resistor 422 on the substrate 100 overlaps with the orthographic projection of the fourth resistor 424 on the substrate 100 .

[0095] In these optional embodiments, the two layers of piezoresistors 420 are arranged in a one-to-one correspondence, which facilitates patterning, simplifies the manufacturing process, and can further reduce the thickness of the pressure sensing module 410 while ensuring normal pressure sensing function.

[0096] The embodiment of the second aspect of the present invention further provides a display device, comprising the display panel 10 according to any of the above-mentioned embodiments of the first aspect. Since the display device provided by the embodiment of the second aspect of the present invention comprises the display panel 10 according to any of the above-mentioned embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present invention has the beneficial effects of the display panel 10 according to any of the above-mentioned embodiments of the first aspect, and no further details are given here.

[0097] The display device in the embodiment of the present invention includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0098] See also Figure 9 , Figure 9 1 is a flow chart of a method for manufacturing a display panel according to an embodiment of the third aspect of the present application. The display panel 10 may be any of the display panels 10 provided in the embodiment of the first aspect.

[0099] like Figure 9 Please also refer to Figures 1 to 8 The display panel 10 shown in FIG. 1 includes a method for manufacturing the display panel 10 including:

[0100] Step S01: preparing a pressure-sensitive material layer between the substrate 100 and the cover plate 300, and patterning the pressure-sensitive material layer to form a pressure sensing module 410. The pressure sensing module 410 is located in the display area.

[0101] In the method for manufacturing the display panel 10 provided in the embodiment of the present application, a cover plate 300 is prepared in step S01 for encapsulating and protecting the display panel 10. A pressure sensing module 410 is prepared for implementing the pressure sensing function of the display panel 10. The pressure sensing module 410 is located between the substrate 100 and the cover plate 300. The pressure sensing module 410 is located within the display panel 10, reducing the overall thickness of the display panel 10 and facilitating under-screen integration of the display panel 10.

[0102] Pressure-sensitive materials are generally carbon nanotubes and carbon nanocomposites, etc.; carbon nanocomposites include carbon nanotube / epoxy resin composites, carbon nanotube / silicon powder composites, and carbon nano / polymer composites, etc.

[0103] In some optional embodiments, the display panel 10 further includes a light-emitting substrate 200, which is located between the substrate 100 and the cover plate 300. The pressure sensing module 410 includes a plurality of piezoresistors 420. The plurality of piezoresistors in the same pressure sensing module are located in the same layer, and the plurality of piezoresistors are located between a group of adjacent two of the substrate, the light-emitting substrate, and the cover plate.

[0104] When the pressure sensing module 410 is located between the substrate 100 and the light emitting base 200, step S01 includes:

[0105] A pressure-sensitive material layer is prepared on the substrate 100 , and the pressure-sensitive material layer is patterned to form a pressure sensing module 410 .

[0106] When the pressure sensing module 410 is located between the light emitting substrate 200 and the cover plate 300, step S01 includes:

[0107] A pressure-sensitive material layer is prepared on the light-emitting substrate 200 , and the pressure-sensitive material layer is patterned to form a pressure sensing module 410 .

[0108] See also Figure 10 , Figure 10 It is a flow chart of a method for preparing a display panel in another embodiment of the third aspect of the present application.

[0109] Optionally, the multiple pressure-sensitive resistors 420 of the same pressure sensing module 410 are located in one layer or in two layers, and step S01 further includes:

[0110] Step S011 : preparing the driving array layer 210 .

[0111] Step S012 : preparing a light emitting layer 220 on the side of the driving array layer 210 facing away from the substrate 100 .

[0112] Step S013 : preparing an encapsulation layer 230 on the side of the light-emitting layer 220 facing away from the substrate 100 .

[0113] The at least one piezoresistor 420 is located between the substrate 100 and the driving array layer 210 , and / or the at least one piezoresistor 420 is located between the packaging layer 230 and the cover plate 300 .

[0114] When at least one piezoresistor 420 is located between the substrate 100 and the driving array layer 210 , before step S011 , the preparation method includes:

[0115] A pressure-sensitive material layer is prepared on the substrate 100 , and the pressure-sensitive material layer is patterned to form a varistor 420 .

[0116] When at least one varistor 420 is located between the encapsulation layer 230 and the cover plate 300, after step S013, the preparation method includes:

[0117] A pressure-sensitive material layer is prepared on the side of the encapsulation layer 230 facing away from the substrate 100 , and the pressure-sensitive material layer is patterned to form a varistor 420 .

[0118] In these optional embodiments, a driving array layer 210 is prepared in step S011 to drive the light-emitting layer 220 to emit light. A light-emitting layer 220 is prepared in step S012 to provide light-emitting display for the display panel 10. An encapsulation layer 230 is prepared in step S013 to encapsulate the light-emitting layer 220 and prevent moisture, oxygen, and other external factors from entering the light-emitting layer 220 and damaging it. At least some of the piezoresistors 420 of the same pressure sensing module 410 are located between the substrate 100 and the driving array layer 210, and / or at least some of the piezoresistors 420 are located between the encapsulation layer 230 and the cover plate 300, thereby reducing the overall thickness of the display panel 10 and the production cost of the pressure sensing module 410.

[0119] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: Having a display area including: substrate; a light-emitting substrate, located on the substrate; a cover plate, located on a side of the light-emitting substrate facing away from the substrate; a pressure sensing module, located in the display area and between the substrate and the cover plate; The pressure sensing module includes a plurality of pressure-sensitive resistors. The multiple pressure-sensitive resistors of the same pressure sensing module include a first resistor, a second resistor, a third resistor, and a fourth resistor, the first resistor and the second resistor are located in one layer, the third resistor and the fourth resistor are located in another layer, the first resistor and the second resistor are connected in series, the third resistor and the fourth resistor are connected in series, and the first resistor and the second resistor connected in series are connected in parallel with the third resistor and the fourth resistor connected in series; The light-emitting substrate comprises: Driver array layer; a light-emitting layer, located on a side of the driving array layer facing away from the substrate; an encapsulation layer, located on a side of the light-emitting layer away from the driving array layer; At least one of the piezoresistor is located between the substrate and the driving array layer, and / or at least one of the piezoresistor is located between the packaging layer and the cover plate; The light-emitting layer includes a pixel definition layer, the pixel definition layer includes a pixel opening and an isolation portion arranged around the pixel opening, and the orthographic projection of the varistor on the substrate is located within the orthographic projection of the isolation portion on the substrate.

2. The display panel according to claim 1, wherein: There are multiple pressure sensing modules, and the multiple pressure sensing modules are distributed in an array.

3. The display panel according to claim 2, wherein: The plurality of pressure sensing modules are evenly distributed.

4. The display panel according to claim 1, wherein: The minimum deformation sensing effective range of the varistor in the thickness direction is 0.1 μm-1 μm.

5. The display panel according to claim 1, wherein: The orthographic projection of the first resistor on the substrate overlaps with the orthographic projection of the third resistor on the substrate, and / or the orthographic projection of the second resistor on the substrate overlaps with the orthographic projection of the fourth resistor on the substrate.

6. The display panel according to claim 1, wherein: The display panel further includes an insulating layer located on a side of the light-emitting substrate facing away from the substrate, and at least one varistor is located between the insulating layer and the encapsulation layer.

7. The display panel according to claim 1, wherein: The display panel further includes a buffer layer located between the substrate and the drive array layer, and at least one piezoresistor is located between the buffer layer and the substrate.

8. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 7.

9. A method for preparing a display panel, characterized in that: The display panel has a display area, including: A light-emitting substrate and a pressure sensing module are prepared between the substrate and the cover plate, wherein the pressure sensing module is located in the display area; The pressure sensing module includes a plurality of pressure-sensitive resistors. The multiple pressure-sensitive resistors of the same pressure sensing module include a first resistor, a second resistor, a third resistor, and a fourth resistor, the first resistor and the second resistor are located in one layer, the third resistor and the fourth resistor are located in another layer, the first resistor and the second resistor are connected in series, the third resistor and the fourth resistor are connected in series, and the first resistor and the second resistor connected in series are connected in parallel with the third resistor and the fourth resistor connected in series; The light-emitting substrate comprises: Driver array layer; a light-emitting layer, located on a side of the driving array layer facing away from the substrate; an encapsulation layer, located on a side of the light-emitting layer away from the driving array layer; At least one of the piezoresistor is located between the substrate and the driving array layer, and / or at least one of the piezoresistor is located between the packaging layer and the cover plate; The light-emitting layer includes a pixel definition layer, the pixel definition layer includes a pixel opening and an isolation portion arranged around the pixel opening, and the orthographic projection of the varistor on the substrate is located within the orthographic projection of the isolation portion on the substrate.

Images