Wiring device

Abstract

The wiring device of the present invention comprises: a plate portion having a first surface and a second surface thereon; a first protrusion disposed on the second surface and having a side surface and a first upper surface, the side surface being capable of locking a first substrate having a terminal and being plugged and unplugged on the second surface along a first direction parallel to the second surface and a second direction opposite thereto, the first upper surface being provided with a plurality of first grooves disposed in parallel with the first direction and accommodating a sheath for wiring, the first protrusion extending in a third direction intersecting the first and second directions and parallel to the second surface; a first component disposed on the second surface and having a plurality of connecting portions and a second upper surface, the plurality of connecting portions straddling the inserted first substrate and being connected to the second surface by clamping the first substrate, the second upper surface being provided with a plurality of second grooves disposed in parallel with the first direction and accommodating exposed conductors; a second component disposed on the second surface and being supported on the plate portion in an openable and closable manner, and having a second protrusion between the first protrusion and the first component for crimping the conductor to the terminal.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2021-47618 (filing date: March 22, 2021), and the present application incorporates the entire contents of the basic application by reference. Technical Field

[0002] An embodiment of the present invention relates to a wiring device. Background Art

[0003] When wiring is connected to a substrate such as a printed circuit board, a bonding material such as solder is used. However, connection using a bonding material may not always be easy to perform. In this case, connection using a wiring device is performed. Summary of the invention

[0004] An embodiment of the present invention provides a wiring device that can easily connect wiring.

[0005] The wiring device of the embodiment comprises: a plate portion having a first surface and a second surface arranged above the first surface; a first protrusion arranged on the second surface and having a side surface and a first upper surface, the side surface being capable of locking a first substrate having terminals on the surface, the first substrate being capable of being inserted in a first direction parallel to the second surface on the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a wiring covering having a conductor and a covering arranged around the conductor, the first protrusion being capable of being inserted in a first direction parallel to the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a wiring covering having a conductor and a covering arranged around the conductor, the first protrusion being capable of being inserted in a first direction parallel to the first surface and the first upper surface being capable of being pulled out in a second direction opposite to the first direction, The first component is provided on the second surface and has a plurality of connecting parts and a second upper surface, the plurality of connecting parts straddle the inserted first substrate and are connected to the second surface in a manner of clamping the first substrate, the second upper surface has a plurality of second grooves provided parallel to the first direction, the plurality of second grooves can respectively accommodate conductors exposed from the sheathing; and the second component is provided on the second surface, has a supporting part supported on the plate part so as to be openable and rotatable, and has a second protrusion between the first protrusion and the first component for crimping the exposed conductor to the terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 This is a schematic perspective view of the wiring device according to the first embodiment.

[0007] Figure 2 This is a schematic perspective view of the wiring device according to the first embodiment.

[0008] Figure 3 (a) to (c) are schematic diagrams of main parts of the wiring device according to the first embodiment.

[0009] Figure 4 This is a schematic perspective view of wiring according to the first embodiment.

[0010] Figure 5 This is a schematic cross-sectional view of the plate portion according to the first embodiment.

[0011] Figure 6 (a) to (c) are schematic cross-sectional views of another example of the main part of the wiring device according to the first embodiment.

[0012] Figure 7 This is a schematic cross-sectional view of a wiring device according to a second embodiment. DETAILED DESCRIPTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same reference numerals are given to the same components and the like, and the description of the components and the like once described will be appropriately omitted.

[0014] In this specification, in order to indicate the positional relationship of components, the upper side of the drawings is described as "upper", and the lower side of the drawings is described as "lower". In this specification, the concepts of "upper" and "lower" are not necessarily terms indicating the relationship with the direction of gravity.

[0015] (First embodiment)

[0016] The wiring device of this embodiment comprises: a plate portion having a first surface and a second surface arranged above the first surface; a first protrusion arranged on the second surface and having a side surface and a first upper surface, the side surface being capable of locking a first substrate having terminals on the surface, the first substrate being capable of being inserted in a first direction parallel to the second surface on the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a wiring covering having a conductor and a covering arranged around the conductor, the first protrusion being capable of being inserted in a first direction parallel to the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a wiring covering having a conductor and a covering arranged around the conductor, the first protrusion being capable of being inserted in a first direction parallel to the first surface and the first upper surface being capable of being pulled out in a second direction opposite to the first direction, The first component is provided on the second surface and has a plurality of connecting parts and a second upper surface, the plurality of connecting parts straddle the inserted first substrate and are connected to the second surface in a manner of clamping the first substrate, the second upper surface has a plurality of second grooves provided parallel to the first direction, the plurality of second grooves can respectively accommodate conductors exposed from the sheathing; and the second component is provided on the second surface, has a supporting part supported on the plate part so as to be openable and rotatable, and has a second protrusion between the first protrusion and the first component for crimping the exposed conductor to the terminal.

[0017] Figure 1 It is a schematic perspective view of the wiring device 100 according to the present embodiment. Figure 2 It is a schematic perspective view of the wiring device 100 according to the present embodiment. Figure 3 It is a schematic diagram of the main part of the wiring device 100 according to the present embodiment.

[0018] The wiring device 100 includes a plate portion 2 , a first protrusion 8 , a first member 10 , and a second member 12 .

[0019] The second member 12 is supported by the support portion 12 a with respect to the plate portion 2 so as to be openable and closable. Figure 1 This is a schematic perspective view of the wiring device 100 in a state where the second member 12 is opened. Figure 2 It is a schematic perspective view of the wiring device 100 in a state where the second member 12 is closed. Figure 3 (a) is a schematic plan view of the wiring device 100 in a state where the second member 12 is closed. Figure 3 (b) is a schematic cross-sectional view of the wiring device 100 in a state where the second member 12 is closed. Figure 3 (c) is a schematic cross-sectional view of the main part of the wiring device 100 in a state where the second member 12 is closed.

[0020] Here, an X direction, a Y direction perpendicularly intersecting the X direction, and a Z direction perpendicularly intersecting the X direction and the Y direction are defined. The X direction is an example of a second direction, the -X direction is an example of a first direction, and the Y direction is an example of a third direction.

[0021] The plate portion 2 has a first surface 2a and a second surface 2b disposed above the first surface 2a. In other words, the plate portion 2 has a first surface 2a and a second surface 2b disposed on the opposite side of the first surface 2a. The first surface 2a and the second surface 2b are disposed, for example, parallel to the XY plane.

[0022] The first protrusion 8 is provided on the second surface 2b of the plate portion 2. The first protrusion 8 has a side surface 8a and a first upper surface 8c. The first protrusion 8 extends along the Y direction.

[0023] The first substrate 4 can be inserted in the −X direction on the second surface 2b and can be pulled out in the X direction. The first substrate 4 inserted in the −X direction can be locked by the side surface 8a of the first protrusion 8 provided on the X direction side.

[0024] A plurality of terminals 4b are formed on the surface 4a of the first substrate 4. The wiring device 100 of this embodiment is a device for connecting wiring 6 described later to the plurality of terminals 4b of the first substrate 4. Here, the first substrate 4 is, for example, a printed circuit board, but is not limited thereto.

[0025] Figure 4Schematic diagram of the wiring 6 of this embodiment. The wiring 6 includes a conductor 6b and a coating 6a provided around the conductor 6b. The wiring 6 used in the wiring device 100 of this embodiment is not limited to Figure 4 The method shown.

[0026] The first upper surface 8c has a plurality of first grooves 8b provided parallel to the X direction (-X direction). The plurality of wires 6 are introduced from the -X direction side to the X direction side. The plurality of first grooves 8b can accommodate the coating 6a of the wires 6, respectively.

[0027] The first member 10 is provided on the second surface 2b of the plate portion 2. The first member 10 has a plurality of connection portions 10a and a second upper surface 10c. Figure 1 as well as Figure 3 As shown in (c), the first component 10 is arranged to straddle the inserted first substrate 4 in the Y direction. Furthermore, the first component 10 is connected to the second surface 2b at the connection portion 10a1 and the connection portion 10a2 as the connection portion 10a in a manner that clamps the inserted first substrate 4 in the Y direction.

[0028] The second upper surface 10c has a plurality of second grooves 10b provided parallel to the direction X. Each of the plurality of second grooves 10b can accommodate the conductors 6b exposed from the covering 6a.

[0029] Preferably, the same imaginary straight line L passes through each of the plurality of first grooves 8b and each of the plurality of second grooves 10b.

[0030] As described above, the second member 12 is supported by the support portion 12a relative to the plate portion 2 so as to be openable and rotatable. The second member 12 has a second convex portion 12b. Figure 3 As shown in (c) of FIG. 1 , when the second member 12 is closed, the plurality of conductors 6b can be crimped to the terminals 4b.

[0031] Furthermore, it is preferable that the plurality of conductors 6b are bent toward the first substrate 4 by the second protrusions 12b and are crimped.

[0032] Preferably, the support portion 12a is provided so that the first member 10 is provided above the support portion 12a and the terminals 4b on the inserted first substrate 4. However, the location where the support portion 12a is provided on the plate portion 2 is not particularly limited.

[0033] The connector 20 is provided, for example, at the end portion on the X direction side of the first substrate 4. A connector wiring 22 is provided inside the connector 20. The connector wiring 22 is connected to the terminal 4b via wiring not shown. Other connectors not shown are connected to the connector 20. Then, the connector not shown is connected to other substrates not shown. In this way, the wiring 6 is connected to wiring on other substrates not shown.

[0034] The plate portion 2, the first protrusion 8 and the first component 10 are formed of, for example, a material containing epoxy resin, a material containing epoxy resin containing glass fiber, or a material containing silicone rubber, etc. However, the materials contained in the plate portion 2, the first protrusion 8 and the first component 10 are not limited thereto.

[0035] use Figure 5 , taking the plate portion 2 as an example, the materials included in the plate portion 2, the first protrusion 8 and the first component 10 are described. The plate portion 2 is preferably formed of a material including a metal component 3a and an insulating component 3b1 and an insulating component 3b2 provided on the surface of the metal component 3a. Figure 5 In the embodiment, an insulating component 3b1 is provided on the first surface 2a side, and an insulating component 3b2 is provided on the second surface 2b side. Here, the metal component 3a includes, for example, metals such as Cu (copper), Al (aluminum), Ag (silver), Au (gold), Fe (iron), Co (cobalt), and Ni (nickel), but is not particularly limited thereto. In addition, the insulating component 3b1 and the insulating component 3b2 are, for example, fluororesins such as polytetrafluoroethylene and polychlorotrifluoroethylene, but are not particularly limited thereto. In addition, the material included in the first protrusion 8 and the first component 10 can be the same as that of the plate portion 2.

[0036] For example, the plate portion 2, the first protrusion 8, and the first member 10 are formed integrally. However, the plate portion 2, the first protrusion 8, and the first member 10 may be formed separately and then joined.

[0037] Figure 6 This is a schematic cross-sectional view of another example of the main part of wiring device 100 according to the present embodiment. Figure 6 Another example of the second protrusion 12b is shown. Figure 6 The second convex portion 12b in (a) has a third convex portion 12b1 which is provided on the second convex portion 12b (the upper surface of the second convex portion 12b) and is smaller than the second convex portion 12b. Figure 6 The second convex portion 12b in (b) has a curved surface portion 12b2 on the second convex portion 12b (on the upper surface of the second convex portion 12b). Figure 6 The second convex portion 12c in (c) has a flat surface 12b3 which can be arranged parallel to the surface 4a of the first substrate 4 on the second convex portion 12b (the upper surface of the second convex portion 12b).

[0038] Next, the effects of the wiring device 100 according to the present embodiment will be described.

[0039] Consider the case where a plurality of wirings 6 are connected to a plurality of terminals 4b disposed on the surface 4a of the first substrate 4. For example, by using a bonding material such as solder, a good electrical connection can be obtained between the plurality of terminals 4b and the plurality of wirings 6. However, not everyone can perform the soldering operation for obtaining the electrical connection. Moreover, in particular, when the intervals between the terminals 4b are narrow for miniaturization, a precise soldering operation is required, so it is more difficult to ensure that everyone can perform the soldering operation. In addition, the wirings 6 are easily twisted, so the operation of arranging the plurality of wirings 6 on the plurality of terminals 4b is not easy in itself.

[0040] As a method for obtaining the electrical connection without soldering, for example, the following method can be considered: a through hole is provided in the first substrate 4, a metal material is arranged on the inner wall of the through hole, and the wiring 6 is passed through the through hole and wound to be electrically connected to the above-mentioned metal material. However, in particular, when the diameter of the through hole is small, it is difficult to pass the wiring 6 through the through hole. Therefore, there is a problem that it is difficult to obtain good electrical connection between the plurality of terminals 4b and the plurality of wirings 6 without soldering.

[0041] Therefore, the wiring device 100 of the present embodiment comprises: a plate portion having a first surface and a second surface arranged above the first surface; a first protrusion arranged on the second surface and having a side surface and a first upper surface, the side surface being capable of locking a first substrate having terminals on the surface, the first substrate being capable of being inserted in a first direction parallel to the second surface on the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a wiring covering having a conductor and a covering arranged around the conductor, the first protrusion being capable of being inserted in a first direction parallel to the second surface and being capable of being pulled out in a second direction The first component is provided on the second surface and has a plurality of connecting parts and a second upper surface, wherein the plurality of connecting parts straddle the inserted first substrate and are connected to the second surface in a manner of clamping the first substrate, and the second upper surface has a plurality of second grooves provided in parallel with the first direction, and the plurality of second grooves can respectively accommodate conductors exposed from the sheath; and the second component is provided on the second surface, has a supporting part supported on the plate part in an openable and rotatable manner, and has a second protrusion between the first protrusion and the first component for crimping the exposed conductor to the terminal.

[0042] According to the wiring device 100 of the present embodiment, the coating 6a of the wiring 6 can be accommodated by the plurality of first grooves 8b provided on the first upper surface 8c of the first protrusion 8. In addition, the conductor 6b exposed from the coating 6a can be accommodated by the plurality of second grooves 10b provided on the second upper surface 10c of the first member 10. Since such accommodation is possible, the wiring 6 is not twisted, and the conductors 6b are less likely to be short-circuited.

[0043] Furthermore, by the second convex portion 12b, a plurality of conductors 6b can be crimped against the terminal 4b at once. Thus, a good electrical connection between the conductor 6b and the terminal 4b can be obtained. In addition, even if there are a plurality of wirings 6, high operability can be maintained. Furthermore, the second convex portion 12b can be used to uniformly apply force to each conductor 6b. Therefore, the deviation of the degree of electrical connection between the conductor 6b and the terminal 4b is reduced.

[0044] The conductor 6b is bent toward the first substrate 4 by the second protrusion 12b. By being bent, the connection strength is increased, and the wiring 6 is less likely to be detached from the wiring device 100.

[0045] The first protrusion 8, the first component 10 or the second component 12 preferably has a metal component and an insulating component provided on the surface of the metal component. For example, when silicone rubber is used, the expansion and contraction accompanying the increase and decrease of temperature is large, so the contact state between the conductor 6b and the terminal 4b is easy to change. In addition, the degradation of silicone rubber is relatively large. In contrast, when a metal component and an insulating component are used, the expansion and contraction accompanying the increase and decrease of temperature is small, so the contact state between the conductor 6b and the terminal 4b is not easy to change. Furthermore, when a metal component and an insulating component are used, degradation is not easy to occur.

[0046] A method having a third protrusion 12b1 that is arranged on the second protrusion 12b (the surface of the second protrusion 12b) and is smaller than the second protrusion 12b, a method having a curved portion 12b2 on the surface, and a method having a plane 12b3 that can be arranged parallel to the surface 4a of the first substrate 4 can all enable the conductor 6b to be in good contact with the terminal 4b.

[0047] The support portion 12a is preferably provided so that the first member 10 is provided above the support portion 12a and the terminal 4b of the inserted first substrate 4. The portion of the second member 12 that can be opened and closed and rotated is arranged as much as possible on the X direction side. Thus, it is easy to insert the wiring 6 (conductor 6b) into the first groove 8b and the second groove 10b from the -X direction side.

[0048] Preferably, each of the plurality of first grooves 8b and each of the plurality of second grooves 10b are passed through by the same imaginary straight line L. In the case where the plurality of first grooves 8b and the plurality of second grooves 10b cannot pass through the same imaginary straight line L, the coating 6a and the conductor 6b are stored in the first groove 8b and the second groove 10b, for example, while being staggered in the Y direction. In this case, it is not easy to distinguish whether the coating 6a and the conductor 6b of the same wiring 6 are stored in the first groove 8b and the second groove 10b, respectively. In addition, this is because, in the case where the plurality of first grooves 8b and the plurality of second grooves 10b pass through the same imaginary straight line L, the storage of the wiring 6 becomes easy.

[0049] According to the wiring device 100 of the present embodiment, it is possible to provide a wiring device that can easily perform wiring connection.

[0050] (Second embodiment)

[0051] The wiring device of this embodiment is different from the wiring device of the first embodiment in that it further comprises: a second substrate, which is provided on the first substrate and has a length in the first direction shorter than that of the first substrate; and a third substrate, which is provided on the second substrate and has a length in the first direction shorter than that of the first substrate, and a distance between the third substrate and the second substrate is longer than a distance between the second substrate and the first substrate. The description of the contents repeated in the first embodiment is omitted here.

[0052] Figure 7 : is a schematic cross-sectional view of the wiring device 200 of the present embodiment. A connector 24 is provided on the first substrate 4. A second substrate 40 is provided on the connector 24 in parallel with the XY plane. The connector 24 connects the first substrate 4 and the second substrate 40. A connector 26 is provided on the second substrate 40. A third substrate 42 is provided on the connector 26 in parallel with the XY plane. The connector 26 connects the second substrate 40 and the third substrate 42. A connector 28 is provided on the third substrate 42. A fourth substrate 44 is provided on the connector 28 in parallel with respect to the XY plane. The connector 28 connects the third substrate 42 and the fourth substrate 44. Connector wiring (not shown) is provided inside the connector 24, the connector 26, and the connector 28. Furthermore, the wiring (not shown) provided on the first substrate 4, the wiring (not shown) provided on the second substrate 40, the wiring (not shown) provided on the third substrate 42, and the wiring (not shown) provided on the fourth substrate 44 can be electrically connected to each other through the connector wiring.

[0053] Furthermore, when the length of the first substrate 4 in the X direction is L1 and the length of the second substrate 40, the third substrate 42 and the fourth substrate 44 in the X direction is L2, L1>L2. That is, the length of the second substrate 40, the third substrate 42 and the fourth substrate 44 in the X direction is shorter than the length of the first substrate 4 in the X direction.

[0054] In addition, when the distance between the first substrate 4 and the second substrate 40 in the Z direction is set to h1, the distance between the second substrate 40 and the third substrate 42 in the Z direction is set to h2, and the distance between the third substrate 42 and the fourth substrate 44 in the Z direction is set to h2, h1>h2. That is, the distance between the second substrate 40 and the third substrate 42 and the distance between the third substrate 42 and the fourth substrate 44 in the Z direction are shorter than the distance between the first substrate 4 and the second substrate 40 in the Z direction.

[0055] The above method is preferable when a large number of substrates are installed while ensuring a space for the second member 12 to open and close and making the wiring device 200 compact. For example, when L2>L1, the second member 12 collides with the second substrate 40, so the second member 12 cannot be opened and closed. Therefore, by setting L1>L2, it is easy to open and close the second member 12. In addition, when h2>h1, the wiring device 200 as a whole becomes large. Therefore, by setting h1>h2, as many substrates as possible can be installed in a small area, and the wiring device 200 can be compacted.

[0056] Furthermore, the lengths of the second substrate 40, the third substrate 42, and the fourth substrate 44 in the X direction may not be equal to each other. Furthermore, the distance between the second substrate 40 and the third substrate 42 and the distance between the third substrate 42 and the fourth substrate 44 in the Z direction may not be equal to each other.

[0057] According to the wiring device 200 of the present embodiment, it is also possible to provide a wiring device that can easily perform wiring connection.

[0058] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are included in the invention described in the claims and their equivalents.

Claims

1. A wiring device comprising: A plate portion having a first surface and a second surface disposed on the opposite side of the first surface and facing the first surface; a first protrusion, arranged on the second surface, and having a side surface and a first upper surface, the side surface being capable of locking a first substrate having terminals on the surface, the first substrate being capable of being inserted in a first direction parallel to the second surface on the second surface and being capable of being pulled out in a second direction opposite to the first direction, the first upper surface being capable of having a plurality of first grooves arranged parallel to the first direction, the plurality of first grooves being capable of respectively accommodating a sheath of a wiring, the wiring having a conductor and the sheath arranged around the conductor, the first protrusion extending along a third direction intersecting the first direction and the second direction and being parallel to the second surface; a first component, arranged on the second surface, and having a plurality of connection portions and a second upper surface, wherein the plurality of connection portions straddle the inserted first substrate and are connected to the second surface in a manner of sandwiching the first substrate, and the second upper surface has a plurality of second grooves arranged parallel to the first direction, wherein the plurality of second grooves can respectively accommodate the conductors exposed from the covering; and The second member is provided on the second surface and has a support portion supported by the plate portion so as to be openable and closable and rotatable, and has a second protrusion between the first protrusion and the first member for crimping the exposed conductor to the terminal.

2. The wiring device according to claim 1, wherein: The conductor is bent toward the first substrate by the second protrusion.

3. The wiring device according to claim 1 or 2, wherein: The first protrusion, the first member, or the second member includes a metal member and an insulating member provided on a surface of the metal member.

4. The wiring device according to claim 1 or 2, wherein: The second convex portion includes a third convex portion which is provided on the second convex portion and is smaller than the second convex portion.

5. The wiring device according to claim 1 or 2, wherein: The second convex portion has a curved surface portion.

6. The wiring device according to claim 1 or 2, wherein: The second protrusion has a flat surface that can be arranged parallel to the surface of the first substrate.

7. The wiring device according to claim 1 or 2, wherein: The first member is provided above between the support portion and the inserted terminal of the first substrate.

8. The wiring device according to claim 1 or 2, wherein: The same imaginary straight line passes through the first groove and the second groove.

9. The wiring device according to claim 1 or 2, further comprising: a second substrate disposed on the first substrate and having a length in the first direction shorter than that of the first substrate; and The third substrate is provided on the second substrate and has a shorter length in the first direction than the first substrate, and a distance between the third substrate and the second substrate is shorter than a distance between the second substrate and the first substrate.

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