Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel is provided with a first encapsulation layer on a driving substrate and a light emitting device, and the first encapsulation layer is provided with a second encapsulation layer. The first encapsulation layer is doped with a black heat-conducting factor. The transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and the heat generated by the black heat-conducting factor is dissipated. In this way, by doping the black heat-conducting factor in the first encapsulation layer, the black heat-conducting factor can absorb light between adjacent light emitting devices, avoid light crosstalk between adjacent light emitting devices, and dissipate the heat converted by the black heat-conducting factor from absorbing light, so as to avoid the heat converted by the black heat-conducting factor from affecting the heat dissipation of the display panel, thereby relieving the problem that the black material in the existing encapsulation gel affects the heat dissipation of the display device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] In the existing Micro LED and Mini LED display device, an encapsulating glue is usually arranged on the LED chip and between adjacent LED chips to protect the LED chip. In order to avoid light crosstalk between adjacent LED chips, black material is doped in the encapsulating glue to absorb light. However, the light absorbed by the black material will be converted into heat, which affects the heat dissipation of the display device. SUMMARY

[0003] The present application provides a display panel, a preparation method thereof and a display device to alleviate the technical problem that the black material in the existing encapsulating glue affects the heat dissipation of the display device.

[0004] To solve the above problems, the technical scheme provided by the present application is as follows:

[0005] The present application provides a display panel, which comprises:

[0006] a driving substrate;

[0007] a plurality of light emitting devices, which are arrayed on the driving substrate and are bonded with the driving substrate;

[0008] a first encapsulating layer, which is arranged on the light emitting devices and the driving substrate and is provided with an opening at a position corresponding to the light emitting devices, the opening exposing the light emitting devices; and

[0009] a second encapsulating layer, which is arranged on the first encapsulating layer and the light emitting devices;

[0010] The first encapsulating layer is doped with black heat-conducting factors, so that the transmittance of the first encapsulating layer is less than that of the second encapsulating layer, and the heat generated by the black heat-conducting factors is dissipated.

[0011] In the display panel provided by the present application, the black heat-conducting factors include black boron nitride particles.

[0012] In the display panel provided by the present application, the upper surface of the first encapsulating layer is flush with the upper surface of the light emitting devices.

[0013] In the display panel provided by the present application, the thickness of the second encapsulating layer ranges from 50 microns to 100 microns.

[0014] The present application also provides a display panel preparation method, which comprises:

[0015] providing a driving substrate;

[0016] providing a light emitting device, and binding the light emitting device on the driving substrate, so that the light emitting device is arranged in an array;

[0017] preparing a first encapsulation layer on the light emitting device and the driving substrate, the first encapsulation layer being provided with an opening at a position corresponding to the light emitting device, the opening exposing the light emitting device;

[0018] preparing a second encapsulation layer on the first encapsulation layer and the light emitting device;

[0019] wherein the first encapsulation layer is doped with a black heat conduction factor, so that the transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and heat generated by the black heat conduction factor is dissipated.

[0020] In the display panel preparation method provided in the embodiments of the present application, the step of preparing the first encapsulation layer on the light emitting device and the driving substrate comprises:

[0021] preparing an encapsulation glue material;

[0022] covering the encapsulation glue material on the driving substrate and the light emitting device by using a molding or glue spraying process;

[0023] removing the encapsulation glue material beyond the upper surface of the light emitting device by using laser to form the first encapsulation layer, and making the upper surface of the first encapsulation layer flush with the upper surface of the light emitting device.

[0024] In the display panel preparation method provided in the embodiments of the present application, the step of preparing the encapsulation glue material comprises:

[0025] providing a heat conduction factor, and blackening the heat conduction factor to form a black heat conduction factor;

[0026] doping the black heat conduction factor in a glue material to form the encapsulation glue material.

[0027] In the display panel preparation method provided in the embodiments of the present application, the heat conduction factor comprises boron nitride particles.

[0028] In the display panel preparation method provided in the embodiments of the present application, the step of preparing the second encapsulation layer on the first encapsulation layer and the light emitting device comprises:

[0029] covering epoxy resin or silica gel on the first encapsulation layer and the light emitting device by using a molding or glue spraying process to form the second encapsulation layer.

[0030] The display device provided by the embodiment of the present application comprises a housing and a display panel as described in any one of the foregoing embodiments, and the display panel is assembled in the housing.

[0031] The display panel and the preparation method thereof and the display device provided by the present application have the following beneficial effects: the first encapsulation layer is provided on the driving substrate and the light emitting device, the second encapsulation layer is provided on the first encapsulation layer, and the black heat-conducting factor is doped in the first encapsulation layer, so that the transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and the heat generated by the black heat-conducting factor is dissipated. In this way, by doping the black heat-conducting factor in the first encapsulation layer, the black heat-conducting factor can absorb the light between adjacent light emitting devices, avoid light crosstalk between adjacent light emitting devices, and dissipate the heat converted by the black heat-conducting factor from absorbing light, so as to avoid the heat converted by the black heat-conducting factor from affecting the heat dissipation of the display panel. Thus, the problem that the black material in the encapsulation gel affects the heat dissipation of the display device is solved. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0033] Figure 1 A top view structural schematic diagram of the display panel provided by the embodiment of the present application.

[0034] Figure 2 A sectional view structural schematic diagram of the display panel provided by the embodiment of the present application.

[0035] Figure 3 A flowchart of the display panel preparation method provided by the embodiment of the present application.

[0036] Figure 4 A sectional view structural schematic diagram of the driving substrate provided by the embodiment of the present application.

[0037] Figure 5 A sectional view structural schematic diagram of the driving back plate of the display panel provided by the embodiment of the present application. Figure 4

[0038] A sectional view structural schematic diagram of the structure of the display panel provided by the embodiment of the present application. Figure 6 Figure 5 A sectional view structural schematic diagram of the structure of the display panel provided by the embodiment of the present application.

[0039] Figure 7 Figure 6 A sectional view structural schematic diagram of the structure of the display panel provided by the embodiment of the present application.​​

[0040] Figure 8 A cross-sectional structure schematic diagram of a display device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0041] The following description of the embodiments is provided with reference to the attached drawings, which are used to exemplify specific embodiments of the present application that can be implemented. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inward], [outward], [lateral] and the like, are only the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, and not to limit the present application. In the drawings, similar structures are denoted by the same reference numerals. In the drawings, the thicknesses of some layers and regions are exaggerated for clarity of understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited thereto.

[0042] Please refer to Figures 1 to 2 , Figure 1 A top view structure schematic diagram of a display panel provided by an embodiment of the present application, Figure 2 A cross-sectional structure schematic diagram of a display panel provided by an embodiment of the present application. The display panel 100 includes a driving substrate 10 and a plurality of light emitting devices 20 arranged in an array on the driving substrate 10. Each of the light emitting devices 20 is bound to the driving substrate 10, and there is a spacing between two adjacent light emitting devices 20.

[0043] The display panel 100 includes a plurality of pixels P arranged in an array, and each of the pixels P includes three light emitting devices 20. The spacing distance between two adjacent pixels P is greater than the spacing distance between two adjacent light emitting devices 20 in the same pixel P. The three light emitting devices 20 of each pixel P emit light of different colors, and each of the light emitting devices 20 is a sub-pixel. For example, the three light emitting devices 20 emit red light, green light and blue light respectively, and the light emitting device 20 emitting red light is a red sub-pixel, the light emitting device 20 emitting green light is a green sub-pixel, and the light emitting device 20 emitting blue light is a blue sub-pixel. Of course, the present application is not limited thereto, and the three light emitting devices 20 of each pixel P of the present application can also emit light of the same color, and a quantum dot film or the like needs to be provided in the light emitting direction of the light emitting device 20.

[0044] Optionally, the light emitting device 20 includes a Micro LED chip or a Mini LED chip or the like. The driving substrate 10 is provided with a driving circuit 11, and the driving circuit 11 is electrically connected to the corresponding light emitting device 20 to drive the corresponding light emitting device 20 to emit light.

[0045] In order to protect the light emitting devices 20 and flatten the step difference between the light emitting devices 20, the display panel 100 further comprises a first encapsulation layer 30 and a second encapsulation layer 40. The first encapsulation layer 30 covers the light emitting devices 20 and the driving substrate 10, and is provided with an opening 300 corresponding to the position of the light emitting devices 20, which exposes the light emitting devices 20. The second encapsulation layer 40 covers the first encapsulation layer 30 and the light emitting devices 20.

[0046] The first encapsulation layer 30 is doped with black heat-conducting factors 32, so that the transmittance of the first encapsulation layer 30 is less than that of the second encapsulation layer 40, and the heat generated by the black heat-conducting factors 32 is dissipated.

[0047] Specifically, referring to Figure 2 , the first encapsulation layer 30 fills the space between the pixels P and the space between the light emitting devices 20 in the same pixel P. The first encapsulation layer 30 comprises a glue material 31 and the black heat-conducting factors 32 doped in the glue material 31. Optionally, the glue material 31 comprises at least one of transparent glue materials such as epoxy resin and silica gel. The black heat-conducting factors 32 comprise black boron nitride particles, which can be formed by blackening boron nitride particles.

[0048] The black heat-conducting factors 32 can absorb light, so the first encapsulation layer 30 doped with the black heat-conducting factors 32 can absorb the side light of two adjacent light emitting devices 20, avoiding light crosstalk between the two adjacent light emitting devices 20. It should be noted that the surface of the light emitting device 20 facing the driving substrate 10 is the lower surface of the light emitting device 20, the surface of the light emitting device 20 away from the driving substrate 10 is the upper surface of the light emitting device 20, and the surface between the upper surface of the light emitting device 20 and the lower surface of the light emitting device 20 is the side surface of the light emitting device 20.

[0049] It can be understood that after the black heat-conducting factors 32 absorb light, the light energy is converted into heat energy, which generates heat in the black heat-conducting factors 32. The heat-conducting factors in the black heat-conducting factors 32 can conduct heat, conduct the heat generated by themselves, and then dissipate the heat generated by the black heat-conducting factors 32. For example, the boron nitride particles are an excellent heat-conducting factor.

[0050] At the same time, the light emitting devices 20 also generate a large amount of heat during operation, and the black heat-conducting factors 32 can also conduct the heat generated by the light emitting devices 20, thereby improving the heat dissipation effect of the display panel 100.

[0051] Furthermore, the upper surface of the first encapsulation layer 30 is flush with the upper surface of the light-emitting device 20 to avoid the first encapsulation layer 30 blocking the light emission from the upper surface of the light-emitting device 20, thereby improving the light emission efficiency of the upper surface of the light-emitting device 20. The upper surface of the first encapsulation layer 30 refers to the surface of the first encapsulation layer 30 that faces away from the driving substrate 10.

[0052] The second encapsulation layer 40 covers the first encapsulation layer 30 and the upper surface of the light-emitting device 20 to protect the light-emitting device 20 and prevent moisture from entering and causing it to malfunction. Simultaneously, the second encapsulation layer 40 also flattens the steps between the light-emitting devices 20, providing a flat top surface.

[0053] The transmittance of the second encapsulation layer 40 is greater than that of the first encapsulation layer 30, so as to avoid the second encapsulation layer 40 affecting the light emission of the light-emitting device 20. Optionally, the material of the second encapsulation layer 40 includes at least one of transparent adhesives such as epoxy resin and silicone.

[0054] Optionally, the thickness of the second encapsulation layer 40 ranges from 50 micrometers to 100 micrometers. If the thickness of the second encapsulation layer 40 is too thin, it cannot effectively block moisture; if the thickness of the second encapsulation layer 40 is too thick, it will increase the thickness of the display panel 100 and affect the light emission of the light-emitting device 20. Therefore, this application selects a second encapsulation layer 40 with a suitable thickness range to balance the encapsulation effect and light transmission effect of the second encapsulation layer 40.

[0055] In one embodiment, a method for manufacturing a display panel is also provided, please refer to... Figures 1 to 7 , Figure 3 This is a schematic flowchart of the display panel fabrication method provided in the embodiments of this application. Figure 4 This is a schematic cross-sectional view of the driving substrate provided in an embodiment of this application. Figure 5 In order to be in Figure 4 A cross-sectional diagram of the light-emitting device mounted on the driver backplane. Figure 6 In order to be in Figure 5 A cross-sectional structural diagram of the encapsulating adhesive material covering the structure. Figure 7 In order to be in Figure 6 A cross-sectional structural diagram showing the formation of the first encapsulation layer on the structure. The display panel manufacturing method includes the following steps:

[0056] S301: Provides a driving substrate 10;

[0057] Specifically, a substrate is provided on which the driving circuit 11 is fabricated to form the driving substrate 10, such as... Figure 4Optionally, the driving circuit 11 includes a thin film transistor or the like.

[0058] S302: providing a light emitting device 20 and binding the light emitting device 20 on the driving substrate 10 to arrange the light emitting device 20 in an array.

[0059] Specifically, a plurality of light emitting devices 20 are prepared on a transfer substrate, and the light emitting devices 20 include a Micro LED chip or a Mini LED chip or the like. Then, the plurality of light emitting devices 20 are transferred to the driving substrate 10, so that each light emitting device 20 is bound on the driving substrate 10 and electrically connected to the corresponding driving circuit 11, as shown in Figure 5 The driving circuit 11 drives the corresponding light emitting device 20 to emit light, each light emitting device 20 corresponds to a separate driving circuit 11, and there is a gap between two adjacent light emitting devices 20.

[0060] S303: preparing a first encapsulation layer 30 on the light emitting device 20 and the driving substrate 10, and the first encapsulation layer 30 is provided with an opening 300 corresponding to the position of the light emitting device 20, and the opening 300 exposes the light emitting device 20;

[0061] Optionally, the step of preparing a first encapsulation layer 30 on the light emitting device 20 and the driving substrate 10 includes:

[0062] Preparation of encapsulation glue material 50;

[0063] Specifically, a thermal conductivity factor is provided, and the thermal conductivity factor is blackened to form a black thermal conductivity factor 32. The blackened thermal conductivity factor has the function of absorbing light. Optionally, the thermal conductivity factor includes boron nitride particles or other particles with thermal conductivity function. Then, the black thermal conductivity factor 32 is doped in the glue material 31 to form the encapsulation glue material 50, which has the functions of absorbing light and conducting heat.

[0064] The encapsulation glue material 50 is covered on the driving substrate 10 and the light emitting device 20 by using a mold pressing or glue spraying process, as shown in Figure 6 ;

[0065] Specifically, the encapsulation glue material 50 is filled in the gap of the light emitting device 20 and wrapped around the light emitting device 20 by using a mold pressing or glue spraying process. Specifically, the encapsulation glue material 50 covers the upper surface and side surface of the light emitting device 20, the surface of the driving circuit 11 and the surface of the driving substrate 10, and exceeds the upper surface of the light emitting device 20.

[0066] The laser is used to remove the encapsulating material 50 exceeding the upper surface of the light emitting device 20 to form the first encapsulating layer 30, and make the upper surface of the first encapsulating layer 30 flush with the upper surface of the light emitting device 20, as shown in Figure 7 .

[0067] S304: Preparing a second encapsulating layer 40 on the first encapsulating layer 30 and the light emitting device 20;

[0068] The first encapsulating layer 30 is doped with black heat-conducting factors 32, so that the transmittance of the first encapsulating layer 30 is less than that of the second encapsulating layer 40, and the heat generated by the black heat-conducting factors 32 is dissipated.

[0069] Specifically, the epoxy resin or the silica gel is covered on the first encapsulating layer 30 and the light emitting device 20 by using the mold pressing or the glue spraying process to form the second encapsulating layer 40, as shown in Figure 2 It can be understood that, since the first encapsulating layer 30 is doped with the black heat-conducting factors 32, the black heat-conducting factors 32 have the function of absorbing light, so that the transmittance of the first encapsulating layer 30 is less than that of the second encapsulating layer 40, to absorb the side light of the light emitting device 20 and avoid the crosstalk between the two adjacent light emitting devices 20.

[0070] In addition, after the black heat-conducting factors 32 absorb light, the light energy is converted into heat energy, so that the black heat-conducting factors 32 generate heat. The heat-conducting factors in the black heat-conducting factors 32 can conduct the heat, conduct the heat generated by themselves, and then dissipate the heat generated by the black heat-conducting factors 32.

[0071] Meanwhile, the light emitting device 20 also generates a large amount of heat in the working process, and the black heat-conducting factors 32 can also conduct the heat generated by the light emitting device 20, thereby improving the heat dissipation effect of the display panel 100.

[0072] Based on the same inventive concept, the embodiment of the present application also provides a display device, which refers to Figures 1 to 8 , Figure 8 for the display device provided by the embodiment of the present application. The display device 1000 includes a housing 200 and a display panel 100 of any one of the foregoing embodiments, and the display panel 100 is assembled in the housing 200. Specifically, the housing 200 is formed with a receiving cavity 201, and the display panel 100 is assembled in the receiving cavity 201. The display device 1000 includes electronic display products such as mobile phones, tablets, televisions, etc.

[0073] According to the above embodiment, it can be known that:

[0074] The application provides a display panel, a preparation method thereof and a display device, wherein a first encapsulation layer is arranged on a driving substrate and a light emitting device, a second encapsulation layer is arranged on the first encapsulation layer, and a black heat conduction factor is doped in the first encapsulation layer, so that the transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and heat generated by the black heat conduction factor is dissipated. In this way, by doping the black heat conduction factor in the first encapsulation layer, the black heat conduction factor can absorb light between adjacent light emitting devices, avoid light crosstalk between the adjacent light emitting devices, and dissipate heat converted by the black heat conduction factor from absorbing light, so as to avoid the heat converted by the black heat conduction factor from affecting heat dissipation of the display panel, thereby solving the problem that the black material in the encapsulation glue affects heat dissipation of the display device.

[0075] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0076] The embodiments of the application are described in detail above, and the principle and implementation mode of the application are described by applying specific examples; the above description of the embodiments is only used to help understand the technical solutions and core ideas of the application; those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and the modification or replacement does not make the essence of the corresponding technical solution deviate from the scope of the technical solutions of the embodiments of the application.

Claims

1. A display panel, characterized by, The application relates to a light-emitting device, which comprises: a driving substrate; a plurality of light-emitting devices arranged in an array on the driving substrate and bonded to the driving substrate; a first encapsulation layer filled in the gaps between the light-emitting devices and covering the driving substrate, the upper surface of the first encapsulation layer being flush with the upper surfaces of the light-emitting devices, the first encapsulation layer being provided with openings corresponding to the positions of the light-emitting devices, and the openings exposing the upper surfaces of the light-emitting devices; and a second encapsulation layer covering the first encapsulation layer and the light-emitting devices; wherein the first encapsulation layer is doped with black heat-conducting factors, so that the transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and the heat generated by the black heat-conducting factors is dissipated, and the black heat-conducting factors are located between two adjacent light-emitting devices; the heat-conducting factors in the black heat-conducting factors can conduct heat, and conduct the heat generated by themselves and the light-emitting devices out, and the black heat-conducting factors comprise black boron nitride particles.

2. The display panel of claim 1, wherein, The thickness of the second encapsulation layer ranges from 50 microns to 100 microns.

3. A method for manufacturing a display panel, characterized by, The application further relates to a method for manufacturing a light-emitting device, which comprises: providing a driving substrate; providing light-emitting devices and bonding the light-emitting devices to the driving substrate so that the light-emitting devices are arranged in an array; preparing a first encapsulation layer on the light-emitting devices and the driving substrate, the first encapsulation layer being filled in the gaps between the light-emitting devices and covering the driving substrate, the upper surface of the first encapsulation layer being flush with the upper surfaces of the light-emitting devices, the first encapsulation layer being provided with openings corresponding to the positions of the light-emitting devices, and the openings exposing the upper surfaces of the light-emitting devices; preparing a second encapsulation layer on the first encapsulation layer and the light-emitting devices; wherein the first encapsulation layer is doped with black heat-conducting factors, so that the transmittance of the first encapsulation layer is less than that of the second encapsulation layer, and the heat generated by the black heat-conducting factors is dissipated, and the black heat-conducting factors are located between two adjacent light-emitting devices; the heat-conducting factors in the black heat-conducting factors can conduct heat, and conduct the heat generated by themselves and the light-emitting devices out, and the heat-conducting factors comprise boron nitride particles.

4. The display panel manufacturing method according to claim 3, wherein The step of preparing the first encapsulation layer on the light-emitting devices and the driving substrate comprises: preparing an encapsulation adhesive material; covering the encapsulation adhesive material on the driving substrate and the light-emitting devices by using a molding or spraying process; removing the encapsulation adhesive material beyond the upper surfaces of the light-emitting devices by using a laser to form the first encapsulation layer, and making the upper surface of the first encapsulation layer flush with the upper surfaces of the light-emitting devices.

5. The display panel manufacturing method according to claim 4, wherein The step of preparing the encapsulation adhesive material comprises: providing heat-conducting factors and blackening the heat-conducting factors to form black heat-conducting factors; doping the black heat-conducting factors in an adhesive material to form the encapsulation adhesive material.

6. The display panel manufacturing method according to claim 3, wherein The step of preparing the second encapsulation layer on the first encapsulation layer and the light-emitting devices comprises: covering epoxy resin or silica gel on the first encapsulation layer and the light-emitting devices by using a molding or spraying process to form the second encapsulation layer.

7. A display device, characterized by comprising: A display device comprising a housing and a display panel as claimed in any of claims 1 to 2, the display panel being fitted within the housing.

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