Back surface protective film forming composite, method for manufacturing first laminate, method for manufacturing third laminate, and method for manufacturing semiconductor device with back surface protective film

Abstract

A composite body (1) for forming a back protective film, which is formed by stacking a protective layer (12) and a film for forming a back protective film (13), is used in a method for manufacturing a first laminate, which comprises the following steps: a first lamination step of attaching a film for forming a back protective film (13) to the back of a semiconductor substrate to obtain a second laminate having the semiconductor substrate, the film for forming a back protective film (13) and the protective layer (12) stacked in sequence; a curing step of curing the film for forming a back protective film (13) of the second laminate to form a back protective film; and a conveying step of conveying the second laminate from the first lamination step to the curing step, wherein the first laminate is formed by stacking the semiconductor substrate, the back protective film and the protective layer (12) in sequence.

Description

Technical Field

[0001] The present invention relates to a composite for forming a back surface protective film, a method for producing a first stacked body, a method for producing a third stacked body, and a method for producing a semiconductor device with a back surface protective film.

[0002] This application claims priority based on Japanese Patent Application No. 2020-028103 filed in Japan on February 21, 2020, and uses the contents thereof herein. Background Art

[0003] In recent years, semiconductor device manufacturing has been progressing using a mounting method known as flip-chip. In this method, a semiconductor chip with electrodes, such as bumps, on its circuit surface is bonded to a substrate. As a result, the backside of the semiconductor chip, opposite the circuit surface, may be exposed.

[0004] Sometimes, a resin film containing an organic material is formed as a backside protective film on the backside of the exposed semiconductor chip, and the chip is mounted in a semiconductor device as a semiconductor chip with a protective film. The backside protective film is used to prevent cracks from forming on the semiconductor chip during the dicing process or after packaging (for example, Patent Documents 1 and 2).

[0005] The semiconductor chip with the back protective film is, for example, Figures 1A-1G That is, the following method is known: a back surface protective film forming film 13 ( Figure 1A ), the back protective film forming film 13 is thermally cured or energy ray cured to form a back protective film 13 '( Figure 1B ), laser marking the back protective film 13' ( Figure 1C ), a support sheet 10 is laminated on the back protective film 13' ( Figure 1D ), the semiconductor wafer 8 and the back protective film 13 'are cut to form a semiconductor chip 7 with a back protective film ( Figure 1E and Figure 1F ), pick up the semiconductor chip 7 with the back protection film from the support sheet 10 ( Figure 1G ).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent No. 4271597

[0009] Patent Document 2: Japanese Patent No. 5363662 Summary of the Invention

[0010] Technical Problems to be Solved by the Invention

[0011] exist Figure 1A The laminated body obtained in the lamination process is transported to the curing process, which is Figure 1B The back protective film forming film 13 is thermally cured or energy-ray cured to form the back protective film 13'. When the lamination step and the curing step are performed using separate apparatuses, the laminated body obtained in the lamination step is transported with the adsorption surface of the transport arm having adsorption holes adsorbed onto the back protective film forming film surface of the laminated body. The laminated body is then stored in a box and transported to the apparatus performing the curing step. In this case, the back protective film forming film may become contaminated or deformed during transport by the transport arm and during storage in the box.

[0012] Even when the lamination process and the curing process are performed by connecting the device for attaching the back protective film forming film to the device for curing the back protective film forming film, it is still necessary to transport the laminated body obtained using the device for attaching the back protective film forming film to the device for curing the back protective film forming film. At this time, there is a possibility that the back protective film forming film may be contaminated or deformed.

[0013] When the processes from the lamination step to the curing step are performed using the same apparatus, for example, the process can be performed using an apparatus including a back surface protective film forming film attaching station, a unit for performing curing, and a transport arm. Specifically, a workpiece (also referred to as a "semiconductor substrate") introduced into the apparatus is transported to the back surface protective film forming film attaching station by the transport arm, and a back surface protective film forming film is attached to the back side of the workpiece to form a laminate. The back surface protective film forming film is processed to the size of the workpiece in advance outside the apparatus or processed to the size of the workpiece within the apparatus immediately before attachment.

[0014] The stack is transported to a unit for curing by adsorbing the surface of the back protective film-forming film of the stacked body with the adsorption holes of the transport arm. The stacked body transported to the unit for curing is heated or irradiated with energy rays to form a back protective film from the back protective film-forming film.

[0015] The inventors of this application observed the surface of the back-side protective film after being transported by a transport arm and discovered that deformation (concavity and convexity) may occur due to the suction holes of the transport arm. Furthermore, they believe there is a possibility that waste or dust may adhere to the back-side protective film during transport, causing contamination. Such deformation (concavity and convexity) or the adhesion of waste or dust could adversely affect the reliability of semiconductor devices.

[0016] The present invention has been completed in view of the above situation, and its technical problem is to provide a back protective film forming composite body that can prevent contamination and deformation of the back protective film forming film when the back protective film forming film is attached to the back side of the semiconductor substrate and then transported in a method for manufacturing a semiconductor device with a back protective film, a method for manufacturing a first stack using the back protective film forming composite body, a method for manufacturing a third stack body, and a method for manufacturing a semiconductor device with a back protective film.

[0017] Technical means to solve technical problems

[0018] In order to solve the above technical problems, the present invention has the following solutions.

[0019] (1) A composite body for forming a back protective film, which is formed by stacking a protective layer and a film for forming a back protective film, and is used in a method for manufacturing a first laminate, the manufacturing method comprising the following steps: a first lamination step of attaching the film for forming a back protective film to the back surface of a semiconductor substrate to obtain a second laminate having the semiconductor substrate, the film for forming a back protective film, and the protective layer stacked in sequence; a curing step of curing the film for forming a back protective film of the second laminate to form a back protective film; and a conveying step of conveying the second laminate from the first lamination step to the curing step, wherein the first laminate is formed by stacking the semiconductor substrate, the back protective film, and the protective layer in sequence.

[0020] (2) A composite body for forming a back protective film, which is formed by stacking a protective layer and a film for forming a back protective film, and is used in a method for manufacturing a third stack, the manufacturing method comprising the following steps: a first stacking step of attaching the film for forming a back protective film to the back of a semiconductor substrate to obtain a second stack having the semiconductor substrate, the film for forming a back protective film and the protective layer stacked in sequence; a second stacking step of attaching a support sheet to the protective layer of the second stack to obtain a third stack having the semiconductor substrate, the film for forming a back protective film, the protective layer and the support sheet stacked in sequence; and a conveying step of conveying the second stack from the first stacking step to the second stacking step.

[0021] (3) A method for manufacturing a first stacked body, which is formed by sequentially stacking a semiconductor substrate, a back protective film and a protective layer, the manufacturing method comprising the following steps: a first stacking step of attaching the back protective film forming film of the back protective film forming composite described in (1) to the back side of the semiconductor substrate to obtain a second stacked body in which the semiconductor substrate, the back protective film forming film and the protective layer are sequentially stacked; a curing step of curing the back protective film forming film of the second stacked body to form a back protective film; and a conveying step of conveying the second stacked body from the first stacking step to the curing step.

[0022] (4) A method for manufacturing a third stacked body, which is formed by stacking a semiconductor substrate, a film for forming a back protective film, a protective layer and a support sheet in sequence, and the manufacturing method includes the following steps: a first stacking step of attaching the film for forming a back protective film of the composite body for forming a back protective film described in (2) to the back side of the semiconductor substrate to obtain a second stacked body in which the semiconductor substrate, the film for forming a back protective film and the protective layer are stacked in sequence; a second stacking step of attaching a support sheet to the protective layer of the second stacked body to obtain a third stacked body in which the semiconductor substrate, the film for forming a back protective film, the protective layer and the support sheet are stacked in sequence; and a conveying step of conveying the second stacked body from the first stacking step to the second stacking step.

[0023] (5) A method for manufacturing a semiconductor device with a back protective film, comprising the following steps: a second stacking step of attaching a support sheet to the protective layer of the first stack manufactured by the manufacturing method described in (3) to obtain a fourth stack having the semiconductor substrate, the back protective film, the protective layer and the support sheet stacked in sequence; a step of cutting the semiconductor substrate and the back protective film in the fourth stack to produce a semiconductor device with a back protective film; and a step of picking up the semiconductor device with the back protective film from the support sheet.

[0024] (6) A method for manufacturing a semiconductor device with a back protective film, comprising the following steps: a step of curing the back protective film-forming film of the third stack manufactured by the manufacturing method described in (4) to form a back protective film, thereby obtaining a fourth stack having the semiconductor substrate, the back protective film, the protective layer, and the support sheet stacked in this order; a step of cutting the semiconductor substrate and the back protective film in the fourth stack to form a semiconductor device with a back protective film; and

[0025] A step of picking up the semiconductor device with the back surface protection film from the support sheet.

[0026] (7) A method for manufacturing a semiconductor device with a back protective film, comprising the following steps: a step of cutting the semiconductor substrate and the back protective film forming film in the third stacked body manufactured by the manufacturing method described in (4) to produce a semiconductor device with a back protective film forming film; a step of curing the back protective film forming film to produce a back protective film; and

[0027] A step of picking up the semiconductor device with the film for forming a back surface protective film or the semiconductor device with a back surface protective film from the support sheet.

[0028] (8) Use of the composite for forming a back surface protective film according to (1) or (2) for forming a back surface protective film.

[0029] (9) The composite for forming a back protective film as described in (1) or (2), the manufacturing method as described in any one of (3) to (7), or the use as described in (8), wherein the film for forming a back protective film is formed using an uncured curable resin composition, and the protective layer is formed using a cured curable resin or thermoplastic resin.

[0030] Effects of the Invention

[0031] According to the present invention, there are provided a method for manufacturing a semiconductor device with a back side protective film, wherein a back side protective film forming composite body is provided, which is capable of preventing contamination and deformation of the back side protective film forming film when the back side protective film forming film is attached to the back side of the workpiece and then transported; a method for manufacturing a first stacked body using the back side protective film forming composite body; a method for manufacturing a third stacked body; and a method for manufacturing a semiconductor device with a back side protective film. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1A The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0033] Figure 1B The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0034] Figure 1C The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0035] Figure 1D The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0036] Figure 1EThe diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0037] Figure 1F The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0038] Figure 1G The diagram is a cross-sectional view schematically showing part of the steps in an example of a conventional method for manufacturing a semiconductor chip with a back surface protective film.

[0039] Figure 2 1 is a schematic cross-sectional view showing an example of a composite body for forming a back surface protective film.

[0040] Figure 3 1 is a schematic cross-sectional view showing an example of a composite body for forming a back surface protective film.

[0041] Figure 4A It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0042] Figure 4B It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0043] Figure 4C It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0044] Figure 4D It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0045] Figure 5A It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0046] Figure 5B It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0047] Figure 5C It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0048] Figure 5D It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0049] Figure 5E It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the first stacked body.

[0050] Figure 6A It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0051] Figure 6B It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0052] Figure 6C It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0053] Figure 6D It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0054] Figure 6E It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0055] Figure 7A It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0056] Figure 7B It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0057] Figure 7C It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0058] Figure 7D It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0059] Figure 7E It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0060] Figure 7F It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the third stacked body.

[0061] Figure 8 1 is a schematic cross-sectional view showing an example of a support sheet 10 in which an adhesive layer 102 is provided on a substrate 101 .

[0062] Figure 9 1 is a schematic cross-sectional view showing an example of a composite body for forming a back surface protective film.

[0063] Figure 10A It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the fourth stacked body.

[0064] Figure 10B It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the fourth stacked body.

[0065] Figure 10C It is a cross-sectional view schematically showing part of the steps in one example of an embodiment of the method for producing the fourth stacked body.

[0066] Figure 11A It is a cross-sectional view schematically showing part of the process in another example of the embodiment of the method for producing the fourth stacked body.

[0067] Figure 11B It is a cross-sectional view schematically showing part of the process in another example of the embodiment of the method for producing the fourth stacked body.

[0068] Figure 11C It is a cross-sectional view schematically showing part of the process in another example of the embodiment of the method for producing the fourth stacked body.

[0069] Figure 12A The diagram is a cross-sectional view schematically showing part of the steps in one example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0070] Figure 12B The diagram is a cross-sectional view schematically showing part of the steps in one example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0071] Figure 12C The diagram is a cross-sectional view schematically showing part of the steps in one example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0072] Figure 12D The diagram is a cross-sectional view schematically showing part of the steps in one example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0073] Figure 12E The diagram is a cross-sectional view schematically showing part of the steps in one example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0074] Figure 13A The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0075] Figure 13B The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0076] Figure 13C The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0077] Figure 14A The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0078] Figure 14B The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0079] Figure 14C The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.

[0080] Figure 14D The present invention is a schematic cross-sectional view schematically showing a part of the steps in another example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film. DETAILED DESCRIPTION

[0081] Figure 2 This is a cross-sectional view schematically showing one embodiment of the composite for forming a back protective film of the present invention.

[0082] Figure 3 This is a cross-sectional view schematically showing another embodiment of the composite for forming a back protective film of the present invention.

[0083] In order to make features easier to understand, the drawings used in the following description may sometimes show feature parts exaggerated for convenience, and the dimensional ratios of the components are not necessarily the same as the actual ones.

[0084] Figure 2 The composite body 1 for forming a back surface protective film shown includes a protective layer 12 and a film 13 for forming a back surface protective film in this order.

[0085] The composite body 1 for forming a back protective film of this embodiment is used in a method for producing a third laminate, which includes the following steps: a first lamination step of attaching a back protective film-forming film 13 to the back surface of a workpiece to produce a second laminate comprising the workpiece, the back protective film-forming film 13, and a protective layer 12 laminated in this order; a second lamination step of attaching a support sheet to the protective layer 12 of the second laminate to produce a third laminate comprising the workpiece, the back protective film-forming film 13, the protective layer 12, and the support sheet laminated in this order; and a transport step of transporting the second laminate from the first lamination step to the second lamination step. The presence of the protective layer 12 allows the composite body 1 for forming a back protective film of this embodiment to prevent contamination and deformation of the back protective film-forming film 13 (before curing) during the transport step.

[0086] Furthermore, the composite body 1 for forming a back protective film of this embodiment is used in a method for producing a first laminate, which includes the following steps: a first lamination step of attaching a back protective film-forming film 13 to the back surface of a workpiece to obtain a second laminate comprising the workpiece, the back protective film-forming film 13, and a protective layer 12 laminated in this order; a curing step of curing the back protective film-forming film 13 of the second laminate to form a back protective film; and a conveying step of conveying the second laminate from the first lamination step to the curing step, the first laminate being formed by laminating the workpiece, the back protective film, and the protective layer 12 in this order. By including the protective layer 12, the composite body 1 for forming a back protective film of this embodiment can prevent contamination and deformation of the back protective film-forming film 13 (before curing) during the conveying step.

[0087] Figure 3 The composite body 2 for back surface protective film formation shown has the release film 151, the protective layer 12, and the film 13 for back surface protective film formation in this order.

[0088] The composite body 2 for forming a back protective film of this embodiment is used in the following method for producing a third laminate, which includes the following steps: a first lamination step of attaching a back protective film-forming film 13 to the back surface of a workpiece to produce a fifth laminate comprising the workpiece, the back protective film-forming film 13, a protective layer 12, and a release film 151 laminated in this order; a second lamination step of attaching a support sheet to the protective layer 12 of the second laminate obtained by peeling the release film 151 from the fifth laminate to produce the third laminate; and a transport step of transporting the second laminate from the first lamination step to the second lamination step. The inclusion of the protective layer 12 allows the composite body 2 for forming a back protective film of this embodiment to prevent contamination and deformation of the back protective film-forming film 13 (before curing) during the transport step.

[0089] Furthermore, the composite body 2 for forming a back protective film of this embodiment is used in a method for producing a first laminate, which includes the following steps: a first lamination step of attaching a back protective film-forming film 13 to the back surface of a workpiece to produce a fifth laminate comprising the workpiece, the back protective film-forming film 13, a protective layer 12, and a release film 151 laminated in this order; a curing step of curing the back protective film-forming film 13 of the second laminate obtained by peeling the release film 151 from the fifth laminate to produce a back protective film; and a transport step of transporting the second laminate from the first lamination step to the curing step. The inclusion of the protective layer 12 allows the composite body 2 for forming a back protective film of this embodiment to prevent contamination and deformation of the back protective film-forming film 13 (before curing) during the transport step.

[0090] The composite body 1 for forming a back side protective film and the composite body 2 for forming a back side protective film of this embodiment are particularly preferably used in the manufacturing method of the third stacked body, in which a device for attaching a film for forming a back side protective film and a device for attaching a support sheet are connected or the same device is used to perform at least the processes from the first stacking process to the second stacking process.

[0091] In addition, the composite body 1 for forming a back side protective film and the composite body 2 for forming a back side protective film of this embodiment are particularly preferably used in a method for manufacturing a first stack, in which a device for attaching a film for forming a back side protective film and a device for curing the film for forming a back side protective film are connected or the same device is used to perform at least the processes from the first stacking process to the curing process.

[0092] The thickness of the composite body 1 for forming a back protective film is not particularly limited, but is preferably 30 to 550 μm, more preferably 35 to 450 μm, and even more preferably 40 to 400 μm. If the thickness of the composite body 1 for forming a back protective film is greater than or equal to the lower limit, the strength of the back protective film can be improved. If the thickness of the composite body 1 for forming a back protective film is less than or equal to the upper limit, the back protective film can be easily cut.

[0093] The thickness of the composite body 2 for forming the back protective film is not particularly limited, but is preferably 30 to 550 μm, more preferably 35 to 450 μm, and even more preferably 40 to 400 μm. If the thickness of the composite body 2 for forming the back protective film is greater than or equal to the lower limit, the strength of the back protective film can be improved. If the thickness of the composite body 2 for forming the back protective film is less than or equal to the upper limit, the back protective film can be easily cut.

[0094] Next, each layer constituting the composite for forming a back surface protective film according to this embodiment will be described.

[0095] ○ Film for forming back protective film

[0096] In the composite for forming a back surface protective film of this embodiment, a back surface protective film is attached to a wafer (i.e., a workpiece) and cured to serve as the wafer's back surface protective film. The back surface protective film is curable and can be either an energy-curable film or a thermosetting film.

[0097] In this specification, "energy curing property" means a property of curing by irradiation with energy rays, and "thermosetting property" means a property of curing by heating.

[0098] In this specification, "energy rays" refer to rays with energy quanta, such as electromagnetic waves or charged particle beams. Examples of energy rays include ultraviolet rays, radiation, and electron beams. Ultraviolet rays can be irradiated using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light lamp, or an LED lamp as a source of ultraviolet rays. Electron beams can be irradiated using, for example, an electron beam generated by an electron beam accelerator.

[0099] The thickness of the film for forming the back protective film is not particularly limited, but is preferably 3 to 300 μm, more preferably 5 to 250 μm, and even more preferably 7 to 200 μm. If the thickness of the film for forming the back protective film is greater than or equal to the lower limit, the strength of the back protective film can be further improved. If the thickness of the film for forming the back protective film is less than or equal to the upper limit, the back protective film can be easily cut.

[0100] (Composition for forming back protective film)

[0101] The composition for forming a back protective film preferably contains a binder polymer component and a curable component. Specifically, the back protective film-forming composition is preferably an (uncured) curable resin composition, and the back protective film-forming film is formed from this curable resin composition.

[0102] (Binder polymer component)

[0103] In order to impart sufficient adhesiveness and film-forming properties (sheet-forming properties) to the film for forming the back protective film, a binder polymer component is used. As the binder polymer component, conventionally known acrylic polymers, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber-based polymers, etc. can be used.

[0104] The weight average molecular weight (Mw) of the binder polymer component is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,200,000. If the weight average molecular weight of the binder polymer component is too low, the adhesion between the back protective film forming film and the support sheet increases, which sometimes causes poor transfer of the back protective film forming film. If the weight average molecular weight of the binder polymer component is too high, the adhesion of the back protective film forming film decreases, and sometimes it is impossible to transfer to the chip, etc., or the back protective film will be peeled off from the chip, etc. after transfer. That is, if the weight average molecular weight of the binder polymer component is above the above lower limit, it is possible to suppress the adhesion between the back protective film forming film and the support sheet and cause poor transfer of the back protective film forming film. If the weight average molecular weight of the binder polymer component is below the above upper limit, it is possible to suppress the adhesion of the back protective film forming film to reduce and cause it to be unable to be transferred to the chip, etc. In addition, if the weight average molecular weight of the binder polymer component is below the above upper limit, it is possible to suppress the back protective film from being peeled off from the chip, etc. after transfer.

[0105] In this specification, unless otherwise specified, the "weight average molecular weight" refers to a weight average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC).

[0106] It is preferred to use an acrylic polymer as a binder polymer component. The glass transition temperature (Tg) of the acrylic polymer is preferably in the range of -60 to 50°C, more preferably in the range of -50 to 40°C, and particularly preferably in the range of -40 to 30°C. If the glass transition temperature of the acrylic polymer is too low, the peeling force between the back protective film forming film and the support sheet increases, which sometimes causes poor transfer of the back protective film forming film. If the glass transition temperature of the acrylic polymer is too high, the adhesiveness of the back protective film forming film decreases, and sometimes it cannot be transferred to the chip, etc., or the back protective film will be peeled off from the chip, etc. after transfer. That is, if the glass transition temperature of the acrylic polymer is above the above lower limit, it is possible to suppress the increase in the peeling force between the back protective film forming film and the support sheet and cause poor transfer of the back protective film forming film. If the glass transition temperature of the acrylic polymer is below the above upper limit, it is possible to suppress the adhesiveness of the back protective film forming film from decreasing, which causes the inability to be transferred to the chip, etc. Moreover, when the glass transition temperature of the acrylic polymer is below the above upper limit, it is possible to suppress the back protective film from being peeled off from the chip or the like after transfer.

[0107] The glass transition temperature of the acrylic polymer can be determined by, for example, differential scanning calorimetry (DSC).

[0108] Examples of monomers constituting the acrylic polymer include (meth)acrylate monomers and derivatives thereof. Examples include (meth)acrylate alkyl esters having an alkyl group with 1 to 18 carbon atoms, specifically methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Examples include (meth)acrylates having a cyclic skeleton, specifically cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and imide (meth)acrylate. Furthermore, examples of monomers having a functional group include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and 2-hydroxypropyl (meth)acrylate, each having a hydroxyl group. Examples include glycidyl (meth)acrylate, each having an epoxy group. Among acrylic polymers, acrylic polymers containing monomers having a hydroxyl group are preferred because they have good compatibility with the curable component described below. In addition, the acrylic polymers may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, and the like.

[0109] In this specification, "(meth)acrylic acid" is a concept encompassing both "acrylic acid" and "methacrylic acid." Terms similar to (meth)acrylic acid are also used in the same manner. For example, "(meth)acrylate" is a concept encompassing both "acrylate" and "methacrylate," and "(meth)acryloyl" is a concept encompassing both "acryloyl" and "methacryloyl."

[0110] Furthermore, as a binder polymer component, a thermoplastic resin for maintaining the flexibility of the back protective film after curing can be blended. As such a thermoplastic resin, a thermoplastic resin with a weight average molecular weight of 1,000 to 100,000 is preferred, and a thermoplastic resin with a weight average molecular weight of 3,000 to 80,000 is more preferred. The glass transition temperature of the thermoplastic resin is preferably -30 to 120°C, more preferably -20 to 120°C. Examples of thermoplastic resins include polyester resins, thermoplastic urethane resins, phenoxy resins, polybutene, polybutadiene, polystyrene, and the like. These thermoplastic resins can be used alone or in combination of two or more. By containing the above-mentioned thermoplastic resin, the film for forming the back protective film will follow the transfer surface of the film for forming the back protective film, and the generation of voids can be suppressed.

[0111] (Curing component)

[0112] As the curable component, one or more selected from thermosetting components and energy ray curable components are used.

[0113] As the thermosetting component, a thermosetting resin and a thermosetting agent are used. As the thermosetting resin, for example, epoxy resin is preferable.

[0114] As the epoxy resin, conventionally known epoxy resins can be used. Specifically, examples of the epoxy resin include multifunctional epoxy resins, or epoxy compounds having a functionality of two or more in the molecule, such as biphenyl compounds, bisphenol A diglycidyl ether or its hydride, o-cresol novolac epoxy resin, dicyclopentadiene epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, and phenylene skeleton epoxy resin. These epoxy resins can be used alone or in combination of two or more.

[0115] Relative to 100 parts by mass of the binder polymer component, the back protective film forming film preferably contains 1 to 1000 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass of a thermosetting resin. If the content of the thermosetting resin is less than 1 part by mass, sufficient adhesion is sometimes not obtained. If the content of the thermosetting resin exceeds 1000 parts by mass, the peeling force between the back protective film forming film and the adhesive sheet or substrate film increases, which sometimes causes poor transfer of the back protective film forming film. That is, if the content of the thermosetting resin is above the above lower limit, sufficient adhesion can be obtained. If the content of the thermosetting resin is below the above upper limit, it is possible to suppress the peeling force between the back protective film forming film and the adhesive sheet or substrate film, thereby causing poor transfer of the back protective film forming film.

[0116] Thermosetting agents function as curing agents for thermosetting resins, particularly epoxy resins. Preferred thermosetting agents include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of such functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and acid anhydrides. Among these functional groups, phenolic hydroxyl groups, amino groups, and acid anhydrides are preferred, and phenolic hydroxyl groups and amino groups are more preferred.

[0117] Specific examples of phenolic curing agents include polyfunctional phenolic resins, biphenol, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, xylok-type phenolic resins, and aralkyl phenolic resins. Specific examples of amine-based curing agents include DICY (dicyandiamide). These curing agents can be used alone or in combination of two or more.

[0118] The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, relative to 100 parts by mass of the thermosetting resin. If the content of the thermosetting agent is small, sometimes the curing is insufficient and adhesion cannot be obtained. If the content of the thermosetting agent is excessive, sometimes the moisture absorption rate of the film for forming the back protective film increases, so that the reliability of the semiconductor device is reduced. That is, if the content of the thermosetting agent is above the above lower limit, it is sufficiently cured and sufficient adhesion can be obtained. If the content of the thermosetting agent is below the above upper limit, it is possible to suppress the moisture absorption rate of the film for forming the back protective film from increasing and reducing the reliability of the semiconductor device.

[0119] As the energy ray curable component, a low molecular weight compound containing an energy ray polymerizable group (energy ray polymerizable compound) can be used, which is polymerized and cured when irradiated with energy rays such as ultraviolet rays or electron beams. As such energy ray curable components, specifically, acrylate compounds such as trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxy pentaacrylate, dipentaerythritol hexaacrylate or 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomers, epoxy-modified acrylates, polyether acrylates and itaconic acid oligomers can be listed. Such a compound has at least one polymerizable double bond in the molecule, and generally has a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000. The amount of the energy beam polymerizable compound to be added is preferably 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass, relative to 100 parts by mass of the binder polymer component.

[0120] In addition, as the energy-ray curable component, an energy-ray curable polymer in which an energy-ray polymerizable group is bonded to the main chain or side chain of the binder polymer component can be used. This energy-ray curable polymer has both the functions of a binder polymer component and a curable component.

[0121] The main skeleton of the energy-ray curable polymer is not particularly limited and may be an acrylic polymer commonly used as a binder polymer component, or a polyester, polyether, etc. Since synthesis and physical properties can be easily controlled, it is particularly preferred that the energy-ray curable polymer have an acrylic polymer as the main skeleton.

[0122] The energy-ray polymerizable group bonded to the main chain or side chain of the energy-ray curable polymer is, for example, an energy-ray polymerizable group containing a carbon-carbon double bond, specifically, a (meth)acryloyl group, etc. The energy-ray polymerizable group may be bonded to the energy-ray curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.

[0123] The weight average molecular weight (Mw) of the energy ray-curable polymer having an energy ray-polymerizable group is preferably from 100,000 to 2,000,000, more preferably from 1,000,000 to 1,500,000. Further, the glass transition temperature (Tg) of the energy ray-curable polymer is preferably in the range of -60 to 50°C, further preferably in the range of -50 to 40°C, particularly preferably in the range of -40 to 30°C.

[0124] The energy ray-curable polymer is obtained, for example, by reacting an acrylic polymer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, etc. with a polymerizable group-containing compound which reacts with the functional group. As the polymerizable group-containing compound, a compound having 1 to 5 substituents which react with the functional group and an energy ray-polymerizable carbon-carbon double bond in each molecule can be exemplified. As the substituents which react with the functional group, an isocyanate group, a glycidyl group, a carboxyl group, etc. can be exemplified.

[0125] As the polymerizable group-containing compound, (meth)acryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, (meth)acryloyl isocyanate, allyl isocyanate, (meth)acrylic acid glycidyl ester; (meth)acrylic acid, etc. can be exemplified.

[0126] The acrylic polymer is preferably a copolymer formed from a (meth)acrylic monomer or a derivative thereof having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, etc. and another (meth)acrylic ester monomer or a derivative thereof which is capable of copolymerizing with the monomer.

[0127] As the (meth)acrylic monomer or a derivative thereof having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, etc., for example, (meth)acrylic acid 2-hydroxyethyl ester, (meth)acrylic acid 2-hydroxypropyl ester having a hydroxyl group; acrylic acid, methacrylic acid, itaconic acid having a carboxyl group; methacrylic acid glycidyl ester, acrylic acid glycidyl ester having an epoxy group, etc. can be exemplified.

[0128] Examples of other (meth)acrylate monomers or derivatives thereof copolymerizable with the above-mentioned monomers include (meth)acrylate alkyl esters having an alkyl group with 1 to 18 carbon atoms, specifically methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; and (meth)acrylates having a cyclic skeleton, specifically cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl acrylate, dicyclopentyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, and imide acrylate. Furthermore, the above-mentioned acrylic polymers may be copolymerized with vinyl acetate, acrylonitrile, styrene, and the like.

[0129] When using an energy-ray curable polymer, the energy-ray polymerizable compound can be used simultaneously, and a binder polymer component can also be used simultaneously. Regarding the relationship between the blending amounts of the above three components in the film for forming a back protective film of this embodiment, the energy-ray polymerizable compound is preferably contained in an amount of 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass, relative to 100 parts by mass of the sum of the mass of the energy-ray curable polymer and the binder polymer component. If the content of the energy-ray polymerizable compound is within the above numerical range, the curability of the composition for forming a back protective film can be further improved.

[0130] When a thermosetting component and an energy-beam-curable component are used together, the mass ratio of the thermosetting component to the energy-beam-curable component is, for example, preferably 5:95 to 95:5, more preferably 10:90 to 90:10, and even more preferably 15:85 to 85:15. When the mass ratio of the thermosetting component to the energy-beam-curable component is within this numerical range, the curability of the back protective film-forming composition can be further improved.

[0131] By imparting energy-ray-curing properties to the back protective film-forming film, the back protective film-forming film can be cured easily and quickly, thereby improving the production efficiency of chips with back protective films. Since the energy-ray-curable back protective film-forming film cures quickly upon exposure to energy rays, the back protective film can be easily formed, contributing to improved production efficiency.

[0132] The film for back surface protective film formation can contain the following components in addition to the said binder polymer component and a curable component.

[0133] (colorant)

[0134] The back protective film forming film preferably contains a colorant. By blending a colorant in the back protective film forming film, when the semiconductor device is installed in the machine, it is possible to shield infrared rays generated by the surrounding devices, etc., to prevent the failure of the semiconductor device caused thereby. In addition, by blending a colorant in the back protective film forming film, when the back protective film forming film is cured and the back protective film is printed with a product number, the readability of the text is improved. That is, in a semiconductor device or semiconductor chip formed with a back protective film, a product number is usually printed on the surface of the back protective film by a laser marking method (a method of printing by cutting off the surface of the back protective film with a laser). By making the back protective film contain a colorant, the contrast difference between the portion of the back protective film cut off by the laser and the portion not cut off can be fully obtained, and the readability is improved. As a colorant, organic or inorganic pigments and dyes can be used. Among them, from the point of view of electromagnetic wave or infrared shielding, black pigments are preferred. As black pigments, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, etc. can be used, but are not limited to these pigments. From the perspective of improving the reliability of semiconductor devices, carbon black is particularly preferred. Colorants can be used alone or in combination of two or more. When a colorant is used and the transmittance of ultraviolet rays is reduced, it is particularly preferred to give full play to the high curability of the back protective film forming film of this embodiment. As such a colorant, there can be listed a colorant that reduces the transmittance of visible light, a colorant that reduces the transmittance of infrared rays and ultraviolet rays, and a colorant that reduces the transmittance of visible light, infrared rays and ultraviolet rays. As such a colorant, in addition to the above-mentioned black pigment, there is no particular limitation as long as it is a colorant that has absorptivity or reflectivity in the wavelength region of visible light, the wavelength region of infrared rays and ultraviolet rays, or the wavelength region of visible light, infrared rays and ultraviolet rays.

[0135] The amount of the colorant added is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 1 to 15 parts by mass, relative to 100 parts by mass of the total solid content constituting the film for forming a back protective film. When the amount of the colorant added is at least the lower limit, sufficient shielding of infrared rays and the like can be achieved. When the amount of the colorant added is at most the upper limit, the curability of the composition for forming a back protective film can be further improved.

[0136] (Curing Accelerator)

[0137] The curing accelerator is used to adjust the curing speed of the film for forming the back protective film. The curing accelerator is particularly preferably used together with the epoxy resin and the thermosetting agent in the curable component.

[0138] As preferred curing accelerators, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol, and the like; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and the like; organophosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine, and the like; tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, and the like can be exemplified. These curing accelerators can be used singly or in combination of two or more.

[0139] The curing accelerator is preferably contained in an amount of 0.01 to 10 parts by mass, and further preferably in an amount of 0.1 to 1 parts by mass, with respect to 100 parts by mass of the curable component. By containing the curing accelerator in the above range, even when exposed to high temperature and high humidity, excellent adhesion properties are maintained, and high reliability can be achieved even when exposed to severe reflow conditions. If the content of the curing accelerator is small, curing is insufficient, and sufficient adhesion properties cannot be obtained, and if the content of the curing accelerator is excessive, the curing accelerator having high polarity moves to the adhesion interface side in the back surface protective film-forming film under high temperature and high humidity, and segregates, resulting in a decrease in reliability of the semiconductor device.

[0140] (Coupling agent)

[0141] The coupling agent can be used to improve one or more of the adhesion of the back surface protective film-forming film to the chip, the close adhesion, and the cohesion of the back surface protective film. Furthermore, by using the coupling agent, the water resistance of the back surface protective film obtained by curing the back surface protective film-forming film can be improved without impairing the heat resistance.

[0142] As the coupling agent, it is preferable to use a compound having a group that reacts with a functional group possessed by the binder polymer component, the curable component, etc. As the coupling agent, a silane coupling agent is most preferable. Examples of such coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-(methacryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These coupling agents can be used alone or in combination of two or more.

[0143] The coupling agent is generally contained in an amount of 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass relative to a total of 100 parts by mass of the binder polymer component and the curable component. When the content of the coupling agent is less than 0.1 parts by mass, there is a possibility that the above-mentioned effect cannot be obtained. If the content of the coupling agent exceeds 20 parts by mass, there is a possibility that outgassing may occur. That is, if the content of the coupling agent is above the above-mentioned lower limit, the above-mentioned effect can be obtained. If the content of the coupling agent is below the above-mentioned upper limit, outgassing can be suppressed.

[0144] (Inorganic filler)

[0145] By adding an inorganic filler to the film used to form the back protective film, the thermal expansion coefficient of the cured back protective film can be adjusted. Therefore, by optimizing the thermal expansion coefficient of the cured back protective film for the semiconductor chip, the reliability of the semiconductor device can be improved. Furthermore, the moisture absorption rate of the cured back protective film can be reduced.

[0146] Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium dioxide, iron oxide, silicon carbide, boron nitride, and the like, beads obtained by sphericalizing these inorganic fillers, single crystal fibers of these inorganic fillers, and glass fibers. Among these inorganic fillers, silica fillers and alumina fillers are preferred. The above-mentioned inorganic fillers can be used alone or in combination of two or more. The content of the inorganic filler can generally be adjusted within the range of 1 to 80 parts by mass relative to 100 parts by mass of all solid components constituting the film for forming the back protective film.

[0147] (Photopolymerization initiator)

[0148] When the back protective film-forming film contains an energy-ray-curable component as the curable component, the back protective film-forming film is irradiated with energy rays such as ultraviolet rays during use to cure the energy-ray-curable component. In this case, by including a photopolymerization initiator in the back protective film-forming composition, the polymerization curing time and the amount of light irradiation can be reduced.

[0149] Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, α-hydroxycyclohexylphenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil, dibenzil, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and β-chloroanthraquinone. The photopolymerization initiators can be used alone or in combination of two or more.

[0150] Regarding the blending ratio of the photopolymerization initiator, it is preferred that 0.1 to 10 parts by mass of the photopolymerization initiator be contained relative to 100 parts by mass of the energy ray curable component, and more preferably 1 to 5 parts by mass of the photopolymerization initiator be contained. If it is less than 0.1 parts by mass, sometimes the photopolymerization is insufficient and satisfactory transferability cannot be obtained. If it exceeds 10 parts by mass, sometimes residues that do not contribute to photopolymerization are generated, and the curability of the film for forming the back protective film becomes insufficient. That is, if the blending ratio of the photopolymerization initiator is above the above lower limit, photopolymerization can be fully carried out to obtain satisfactory transferability. If the blending ratio of the photopolymerization initiator is below the above upper limit, the generation of residues that do not contribute to photopolymerization can be suppressed, and the curability of the film for forming the back protective film can be further improved.

[0151] (cross-linking agent)

[0152] In order to adjust the initial adhesive force and cohesive force of the film for forming a back protective film, a crosslinking agent may be added. Examples of the crosslinking agent include organic polyisocyanate compounds and organic polyimide compounds.

[0153] Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, alicyclic polyisocyanate compounds, trimers of these organic polyisocyanate compounds, and isocyanate-terminated urethane prepolymers obtained by reacting these organic polyisocyanate compounds with polyol compounds.

[0154] Examples of the organic polyisocyanate compound include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, trimethylolpropane-added toluene diisocyanate, and lysine isocyanate.

[0155] Examples of the organic polyimine compound include N,N′-diphenylmethane-4,4′-bis(1-aziridinecarboxamide), trimethylolpropane-tris-β-aziridinylpropionate, tetramethylolmethane-tris-β-aziridinylpropionate, and N,N′-toluene-2,4-bis(1-aziridinecarboxamide)triethylenemelamine.

[0156] The crosslinking agent is generally used in an amount of 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the combined amount of the binder polymer component and the energy-beam-curable polymer. When the crosslinking agent content is within the above numerical range, the initial adhesive strength and cohesive strength of the film for forming a back protective film can be further improved.

[0157] (General additives)

[0158] In addition to the above components, various additives (general additives) may be blended into the back protective film forming film as needed. Examples of the various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, and chain transfer agents.

[0159] (Solvent)

[0160] The composition for forming a back protective film preferably further contains a solvent. A composition for forming a back protective film containing a solvent improves workability.

[0161] The solvent is not particularly limited, but preferred solvents include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutanol (2-methylpropane-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone.

[0162] The solvent contained in the back protective film forming composition may be only one kind or two or more kinds. When two or more kinds are contained, the combination and ratio thereof can be arbitrarily selected.

[0163] The solvent content is preferably 5 to 95% by mass, more preferably 7 to 93% by mass, and even more preferably 10 to 90% by mass relative to the total mass of the back protective film-forming composition. When the solvent content is above the lower limit, the workability of the back protective film-forming composition can be further improved. When the solvent content is below the upper limit, the curability of the back protective film-forming composition can be further improved.

[0164] The solvent contained in the back surface protective film forming composition is preferably methyl ethyl ketone or the like from the viewpoint of being able to more uniformly mix the components contained in the back surface protective film forming composition.

[0165] The back protective film forming composition composed of the above-mentioned components is coated and dried to obtain a back protective film forming film having adhesiveness and curability. By pressing on a workpiece (semiconductor wafer or chip, etc.) in an uncured state, the back protective film forming film is easily adhered to the workpiece. When pressing, the back protective film forming film can be attached while being heated. Then, after curing, a back protective film with high impact resistance can be provided. The adhesive strength of the back protective film is also excellent, and sufficient protection function can be maintained even under harsh high temperature and high humidity conditions. In addition, the back protective film forming film can be a single-layer structure, and can also be a multilayer structure as long as it includes more than one layer containing the above-mentioned components.

[0166] (Method for Preparing Composition for Forming Back Protective Film)

[0167] The back protective film-forming composition is obtained by blending the respective components constituting the composition.

[0168] The order of adding the components when blending them is not particularly limited, and two or more components may be added simultaneously.

[0169] When a solvent is used, the solvent may be mixed with any blending components other than the solvent to dilute the blending components before use, or the solvent may be mixed with the blending components without diluting the blending components before use.

[0170] When blending, the method for mixing the components is not particularly limited and may be appropriately selected from the following known methods: a method of mixing by rotating a stirring bar or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves, etc.

[0171] The temperature and time for adding and mixing the components are not particularly limited and may be appropriately adjusted as long as the components are not degraded. However, the temperature is preferably 15 to 30°C.

[0172] (Method for manufacturing back surface protective film forming film)

[0173] The back surface protective film forming film can be formed using a back surface protective film forming composition containing the constituent material of the film. For example, by applying the back surface protective film forming composition to the surface on which the back surface protective film forming film is to be formed and drying it as necessary, the back surface protective film forming film can be formed at the target site. The content ratio of the components that do not vaporize at ordinary temperature in the back surface protective film forming composition is generally the same as the content ratio of the components in the back surface protective film forming film. In the present specification, "ordinary temperature" means the temperature without special cooling or heating, that is, the usual temperature, and for example, a temperature of 15 to 25°C or the like can be mentioned.

[0174] The application of the back surface protective film forming composition can be performed by a publicly known method, and for example, a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll-knife coater, a curtain coater, a die coater, a doctor coater, a screen coater, a Meyer rod coater, a kiss coater, and the like can be mentioned.

[0175] The drying conditions of the back surface protective film forming composition are not particularly limited, but when the back surface protective film forming composition contains a solvent described later, it is preferable to perform heat drying. For example, it is preferable to perform drying of the back surface protective film forming composition containing the solvent under conditions of 70 to 130°C for 10 seconds to 5 minutes. For example, it is more preferable to perform drying of the back surface protective film forming composition containing the solvent under conditions of 80 to 130°C for 20 seconds to 4 minutes, and it is further preferable to perform drying under conditions of 90 to 130°C for 30 seconds to 3 minutes. If the heating temperature at the time of heat drying is equal to or higher than the lower limit value described above, the back surface protective film forming composition can be sufficiently cured. If the heating temperature at the time of heat drying is equal to or lower than the upper limit value described above, the deterioration of the workpiece can be suppressed. If the drying time at the time of heat drying is equal to or longer than the lower limit value described above, the back surface protective film forming composition can be sufficiently cured. If the drying time at the time of heat drying is equal to or shorter than the upper limit value described above, the productivity of the back surface protective film forming film can be improved.

[0176] o protective layer

[0177] In the composite body for forming a back protective film of this embodiment, the protective layer is used as a layer for protecting the film for forming a back protective film. Specifically, in the following transport step of the method for manufacturing a third laminate, the protective layer prevents contamination and deformation of the film for forming a back protective film (before curing). The method for manufacturing the third laminate includes the following steps: a first lamination step of attaching the film for forming a back protective film in the composite body for forming a back protective film to the back surface of a semiconductor substrate to obtain a second laminate having the semiconductor substrate, the film for forming a back protective film, and the protective layer laminated in sequence; a second lamination step of attaching a support sheet to the protective layer of the second laminate to obtain a third laminate having the semiconductor substrate, the film for forming a back protective film, the protective layer, and the support sheet laminated in sequence; and a transport step of transporting the second laminate from the first lamination step to the second lamination step.

[0178] In addition, in the following conveying process of the manufacturing method of the first stack, the protective layer prevents contamination and deformation of the back protective film forming film (before curing), and the manufacturing method of the first stack includes the following processes: a first stacking process of attaching the back protective film forming film in the back protective film forming composite to the back side of the semiconductor substrate to obtain a second stack having the semiconductor substrate, the back protective film forming film and the protective layer stacked in sequence; a curing process of curing the back protective film forming film of the second stack to form a back protective film; and a conveying process of conveying the second stack from the first stacking process to the curing process, wherein the first stack is formed by stacking the semiconductor substrate, the back protective film and the protective layer in sequence.

[0179] The thickness of the protective layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 2 to 95 μm, and even more preferably 3 to 90 μm. When the thickness of the protective layer is at least the lower limit, contamination and deformation of the film for forming a back protective film can be further suppressed. When the thickness of the protective layer is at most the upper limit, the handleability of the composite for forming a back protective film can be further improved.

[0180] The thickness of the protective layer can be determined by observing a cross section formed by cutting the composite for forming a back surface protective film in the thickness direction using a microscope or the like, for example.

[0181] The protective layer is not particularly limited, and examples thereof include energy-ray curable films and substrates. As the energy-ray curable film, a film obtained by curing the energy-ray curable film described in the film for forming a back protective film can be used. When an uncured energy-ray curable film is used as a protective layer, it is preferred to use a film of a different type from that of the film for forming a back protective film. In addition, the following energy-ray curable film for a protective layer can also be used as a protective layer. The energy-ray curable film for a protective layer and the substrate for a protective layer that can be used as a protective layer are described below.

[0182] (Energy ray curable film for protective layer)

[0183] The energy-beam-curable film for the protective layer other than the energy-beam-curable film described in the film for forming the back protective film is not particularly limited, and for example, an energy-beam-curable urethane-containing resin can be used.

[0184] Examples of the energy-beam-curable urethane-containing resin include energy-beam-curable resins containing a urethane (meth)acrylate resin or a urethane polymer and an energy-beam-polymerizable monomer as main components.

[0185] Furthermore, it is preferable to cure the energy-ray-curable film for the protective layer before the first lamination step of this embodiment.

[0186] (Base material)

[0187] As a base material that can be used as the protective layer, a resin film is preferable.

[0188] Examples of the resin film include polyethylene films such as low-density polyethylene (LDPE) films and linear low-density polyethylene (LLDPE) films, ethylene-propylene copolymer films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene-vinyl acetate copolymer films, ionomer resin films, ethylene-(meth)acrylic acid copolymer films, ethylene-(meth)acrylate copolymer films, polystyrene films, polycarbonate films, polyimide films, and fluororesin films.

[0189] The substrate used in one embodiment of the present invention may be a single-layer film composed of one type of resin film, or may be a laminated film in which two or more types of resin films are laminated.

[0190] Furthermore, in one embodiment of the present invention, a sheet obtained by surface-treating the surface of the substrate such as the resin film can be used as the protective layer.

[0191] These resin films may be cross-linked films.

[0192] Further, a film obtained by coloring the resin film, or a film obtained by printing the resin film, etc. can also be used. Furthermore, the resin film can be a film obtained by extrusion molding a thermoplastic resin into a sheet, can be a stretched film, or can be a film obtained by forming a sheet from a curable resin by film formation and curing in a prescribed manner.

[0193] Among these resin films, a substrate having excellent heat resistance and a glass transition temperature of 70°C or higher is preferable.

[0194] In addition, as a film having excellent heat resistance, for example, a film obtained by casting a polyester film, a polycarbonate film, a polyphenylene sulfide film, a cyclic olefin resin film, a polyimide resin film, an ultraviolet curable resin into a film and curing, and a laminate of two or more of these films, etc. can be listed.

[0195] When a substrate is used, the substrate can be used as a protective layer alone, or a sheet having an adhesive layer or a release agent layer on a substrate can be used as a protective layer. When a sheet having an adhesive layer or a release agent layer on a substrate is used as a protective layer, in the back surface protective film forming composite, it is preferable that the adhesive layer or the release agent layer be laminated between the back surface protective film forming film and the substrate.

[0196] The adhesive layer can be appropriately selected from the adhesive layers described below in the support sheet depending on the kind of the substrate and the back surface protective film forming film.

[0197] The release agent layer can be appropriately selected from silicone-based, olefin-based, long-chain alkyl-based, alkyd-based, fluorine-based, etc. release agent layers depending on the kind of the substrate and the back surface protective film forming film.

[0198] Release film

[0199] As the release film 151 of the back surface protective film forming composite 2 of the present embodiment, a protect film is preferable. The protect film is generally composed of a substrate film and an adhesive layer laminated on the substrate film. The substrate film can be composed of, for example, a thermoplastic resin. As the thermoplastic resin, as examples, polyethylene-based resins, polypropylene-based resins, and other polyolefin-based resins; polyethylene terephthalate, polyethylene naphthalate, and other polyester-based resins; polycarbonate-based resins; and (meth)acrylic resins can be listed. As the adhesive layer, it can be composed of acrylic, rubber, urethane, silicone. The release film of the present embodiment has re-releasability after attachment.

[0200] <<Manufacturing method of the third laminate>>

[0201] Figures 6A-6EThis is a cross-sectional view schematically illustrating an example of an embodiment of a method for manufacturing a third laminate using a composite body 1 for forming a back protective film. The method for manufacturing the third laminate of this embodiment is a method for manufacturing a third laminate 25 in which a workpiece 14, a film 13 for forming a back protective film, a protective layer 12, and a support sheet 10 are sequentially stacked. The method includes the following steps: a first stacking step (a step in which the back protective film 13 of the composite body 1 for forming a back protective film is attached to the back surface 14b of the workpiece 14 to obtain a second laminate 24 in which the workpiece 14, the film 13 for forming a back protective film, and the protective layer 12 are sequentially stacked. Figure 6B and Figure 6C ); transporting to the second stacking step of attaching the support sheet 10 on the second stack 24 ( Figures 6C-6D ); a second lamination step of attaching the support sheet 10 on the protective layer 12 ( Figure 6D and Figure 6E ).

[0202] Figures 7A-7F This is a cross-sectional view schematically illustrating an example of an embodiment of a method for manufacturing a third laminate using a composite body 2 for forming a back protective film. The method for manufacturing the third laminate of this embodiment is a method for manufacturing a third laminate 25 in which a workpiece 14, a film 13 for forming a back protective film, a protective layer 12, and a support sheet 10 are sequentially stacked. The method includes the following steps: a first stacking step (a) of attaching the back protective film forming film 13 of the composite body 2 for forming a back protective film to the back surface 14b of the workpiece 14 to obtain a stack in which the workpiece 14, the film 13 for forming a back protective film, the protective layer 12, and a release film 151 are sequentially stacked. Figure 7B and Figure 7C After peeling the release film 151 from the laminate, the conveying step is to attach the support sheet 10 to the protective layer 12 in a second lamination step ( Figures 7C-7E and attaching the second lamination step 10 of the support sheet 12 on the protective layer ( Figure 7E and Figure 7F ).

[0203] <<Method for producing the first laminate>>

[0204] Figures 4A-4DThis is a cross-sectional view schematically illustrating an example of an embodiment of a method for manufacturing a first laminate using a composite body 1 for forming a back protective film. The method for manufacturing a first laminate of this embodiment is a method for manufacturing a first laminate 23 in which a workpiece 14, a back protective film 13', and a protective layer 12 are sequentially stacked, and the method sequentially includes the following steps: a first stacking step (a) of attaching the back protective film-forming film 13 of the composite body 1 for forming a back protective film to the back surface 14b of the workpiece 14 to obtain a second laminate 24 in which the workpiece 14, the back protective film-forming film 13, and the protective layer 12 are sequentially stacked. Figure 4B and Figure 4C The second stack 24 is conveyed to the back protective film forming film 13 is cured to form a back protective film 13 'conveying step ( Figures 4C-4D and the back protective film forming film 13 of the second laminate 24 is cured to form a back protective film 13 'curing step ( Figure 4D ).

[0205] Figures 5A-5E This is a cross-sectional view schematically illustrating an example of an embodiment of a method for manufacturing a first laminate using a composite body 2 for forming a back protective film. The method for manufacturing the first laminate of this embodiment is a method for manufacturing a first laminate 23 in which a workpiece 14, a back protective film 13', and a protective layer 12 are sequentially stacked, and the method sequentially includes the following steps: a first stacking step (a) of attaching the back protective film-forming film 13 of the composite body 2 for forming a back protective film to the back surface 14b of the workpiece 14 to obtain a stack in which the workpiece 14, the back protective film-forming film 13, the protective layer 12, and the release film 151 are sequentially stacked. Figure 5B and Figure 5C ); peeling the release film 151 from the laminate to obtain a second laminate 24; the second laminate 24 is conveyed to the back protective film forming film 13 is cured to form a back protective film 13 'conveying step ( Figure 5D ~

[0206] Figure 5E and the back protective film forming film 13 of the second laminate 24 is cured to form a back protective film 13 'curing step ( Figure 5E ).

[0207] Hereinafter, the common items in the manufacturing method of the first stack and the manufacturing method of the third stack will be described. In this embodiment, a semiconductor wafer is used as Figure 4A 、 Figure 5A 、 Figure 6A and Figure 7AThe workpiece 14 shown. One surface of the semiconductor wafer is a circuit surface, formed with bumps. In addition, in order to prevent the circuit surface and bumps of the semiconductor wafer from being broken when the back of the semiconductor wafer is ground, or to prevent dimples or cracks from being generated on the back of the wafer, a circuit surface protection tape 17 is used to protect the circuit surface and bumps of the semiconductor wafer. The circuit surface protection tape 17 is a back grinding tape, and the back of the semiconductor wafer (i.e., the back of the workpiece) as the workpiece 14 is a ground surface. In addition, although Figures 4A-4D 、 Figures 5A-5E Although not shown in the diagram in the manufacturing method of the first laminate, it is preferred to use a circuit surface protection tape 17 to protect the circuit surface and bumps of the semiconductor wafer. Figure 4D or Figure 5E The circuit surface protection tape is peeled off at any stage before the curing step shown.

[0208] The workpiece 14 is not limited as long as it has a circuit surface on one side and the other side can be referred to as a back surface. Examples of the workpiece 14 include a semiconductor wafer having a circuit surface on one side, a semiconductor device panel composed of an assembly of terminal-attached semiconductor devices in which individual electronic components are sealed with a sealing resin and the terminal-attached semiconductor devices have a terminal-forming surface (in other words, a circuit surface) on one side, and the like.

[0209] As the circuit surface protective tape 17, for example, the surface protective sheets disclosed in Japanese Patent Application Publication No. 2016-192488 and Japanese Patent Application Publication No. 2009-141265 can be used. The circuit surface protective tape 17 comprises an adhesive layer having moderate removability. The adhesive layer can be formed from a general-purpose weakly adhesive adhesive such as a rubber, acrylic, silicone, urethane, or vinyl ether adhesive. Alternatively, the adhesive layer can be an energy-ray-curable adhesive that cures upon exposure to energy rays, thereby enabling removable adhesive.

[0210] In the method for producing the third stacked body, the first stacking step ( Figures 6B-6C or Figures 7B-7D ) and the second lamination step ( Figures 6D-6E or Figures 7E-7F )(hereinafter also referred to as method 1).

[0211] In the method for producing the third laminate, it is preferred that the apparatus for attaching the back protective film forming film and the apparatus for attaching the support sheet are connected, or the steps from the first lamination step to the second lamination step are performed in the same apparatus ( Figures 6B-6E or Figures 7B-7F )(hereinafter also referred to as method 2).

[0212] In the method for producing the first stacked body, the first stacking step ( Figures 4B-4C or Figures 5B-5D ) and the curing process ( Figure 4D or Figure 5E )(hereinafter also referred to as method 3).

[0213] In the method for producing the first laminate, it is preferred that an apparatus for attaching a film for forming a back protective film and an apparatus for curing the film for forming a back protective film are connected, or the steps from the first lamination step to the curing step are performed in the same apparatus ( Figures 4B-4D 、 Figure 5B ~Picture

[0214] 5E) (hereinafter also referred to as method 4).

[0215] In the method 2, in the process from the first lamination process to the second lamination process, the second laminated body in which the back protective film forming film 13 and the protective layer 12 are laminated on the workpiece 14 can be transported piece by piece to the workpiece 14 without being stored in a cassette. Figures 6D-6E or Figures 7E-7F The second lamination process is shown.

[0216] In the method 4, in the steps from the first lamination step to the curing step, the second laminated body in which the back protective film forming film 13 and the protective layer 12 are laminated on the workpiece 14 can be transported piece by piece to the workpiece 14 without being stored in a box. Figure 4D or Figure 5E During the curing process shown.

[0217] By performing this process within the same device, the space occupied by the device can be further reduced. By connecting the device for attaching the back protective film-forming film to the device for attaching the support sheet (or the device for curing the back protective film-forming film), even without a complete design, existing devices can be modified to address the issue, reducing initial costs. Furthermore, since the second laminate is transported outside the device rather than housed in a box, production efficiency can be improved and contamination of the second laminate can be suppressed.

[0218] The back protective film forming film 13 and the protective layer 12 used in the first lamination step may be processed into the shape of a workpiece in advance, or may be processed in the same apparatus before the first lamination step.

[0219] Further, the back surface protective film forming film 13 and the protective layer 12 can be processed after the first layering process in the following manner. When the back surface protective film forming composite 1 is used, the back surface protective film forming film 13 of the back surface protective film forming composite 1 is attached to the back surface of the workpiece 14 in the first layering process, and after a second layered body in which the workpiece 14, the back surface protective film forming film 13, and the protective layer 12 are sequentially layered is obtained, the back surface protective film forming film 13 and the protective layer 12 are processed into the shape of the workpiece.

[0220] When the back surface protective film forming composite 2 is used, the back surface protective film forming film 13 of the back surface protective film forming composite 2 is attached to the back surface of the workpiece 14 in the first layering process, and after a layered body in which the workpiece 14, the back surface protective film forming film 13, and the protective layer 12 are sequentially layered is obtained by peeling the peeling film 151, the back surface protective film forming film 13 and the protective layer 12 are processed into the shape of the workpiece.

[0221] Further, in another embodiment, the workpiece 14 can be transported for 7000 mm or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process), and the space occupied by the apparatus can be reduced. The workpiece 14 can be transported for 6500 mm or less, 6000 mm or less, 4500 mm or less, or 3000 mm or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process). The lower limit of the transport time of the workpiece 14 is not particularly limited, and can be, for example, 100 mm.

[0222] Further, in another embodiment, the workpiece 14 can be transported for 7000 mm or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process), and the space occupied by the apparatus can be reduced. The workpiece 14 can be transported for 6500 mm or less, 6000 mm or less, 4500 mm or less, or 3000 mm or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process). The lower limit of the transport time of the workpiece 14 is not particularly limited, and can be, for example, 100 mm.

[0223] Further, the workpiece 14 can be transported for 250 s or less, 200 s or less, 150 s or less, 100 s or less, or 50 s or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process).

[0224] Further, the workpiece 14 can be transported for 250 s or less, 200 s or less, 150 s or less, 100 s or less, or 50 s or less from the start point of the attachment in the first layering process to the end point of the attachment in the second layering process (or from the start point of the attachment in the first layering process to the end point of the curing in the curing process).

[0225] The speed at which the exposed surface of the back surface protection film forming film 13 is attached to the workpiece 14 in the first layering process of the first layered body manufacturing method and the third layered body manufacturing method, and the speed at which the support sheet 10 is attached to the exposed surface of the protective layer 12 in the second layering process of the third layered body manufacturing method can be set to 100 mm / sec or less, 80 mm / sec or less, 60 mm / sec or less, or 40 mm / sec or less. By setting the attachment speed in the first layering process and the attachment speed in the second layering process to the above upper limit values or less, the adhesion between the workpiece 14 and the back surface protection film forming film 13, and the adhesion between the protective layer 12 and the support sheet 10 can be made good.

[0226] The attachment speed in the first layering process and the attachment speed in the second layering process can also be set to 2 mm / sec or more, 5 mm / sec or more, or 10 mm / sec or more. By setting the attachment speed in the first layering process and the attachment speed in the second layering process to the above lower limit values or more, the production efficiency of the first layered body 23 and the third layered body 25 can be improved, and the workpiece 14 transport time from the start of attachment in the first layering process to the end of attachment in the second layering process (or from the start of attachment in the first layering process to the end of curing in the curing process) can also be set to 400 seconds or less.

[0227] The apparatus for attaching the back surface protection film forming film and the apparatus for attaching the support sheet (or the apparatus for curing the back surface protection film forming film) can be connected to perform the first layered body manufacturing method and the third layered body manufacturing method of the present embodiment, or the first layered body manufacturing method and the third layered body manufacturing method of the present embodiment can be performed within the same apparatus.

[0228] As the same apparatus, for example, the present embodiment can be implemented using an apparatus provided with a back surface protection film forming film attachment table, a support sheet attachment table (or a curing unit), and a transport arm.

[0229] Specifically, the workpiece fed into the apparatus is transported to the back surface protection film forming film attachment table by the transport arm, and the back surface protection film forming film of the back surface protection film forming complex 1 is attached to the back surface side of the workpiece (first layering process).

[0230] The suction surface of the transport arm having a suction hole is suctioned to the protective layer surface of the layered body obtained in the first layering process, and is transported to the second layering process for attaching the support sheet (or the curing process for curing the back surface protection film forming film) (transport process).

[0231] After the above-mentioned conveying step, a support sheet is attached to the protective layer to obtain a third laminated body in which the workpiece, the film for forming a back surface protective film, the protective layer, and the support sheet are laminated in this order (second laminating step).

[0232] Furthermore, after the above-mentioned conveying step, the back surface protective film-forming film is cured to obtain a first laminated body in which the workpiece, the back surface protective film, and the protective layer are sequentially laminated (curing step).

[0233] By using the composite body 1 for forming a back surface protective film of the present embodiment, it is possible to prevent contamination and deformation of the film 13 for forming a back surface protective film in the above-mentioned conveying step.

[0234] The apparatus preferably includes 1 to 5 film laminating stages for forming a back protective film, and more preferably includes 1 to 3 film laminating stages for forming a back protective film. If the number of film laminating stages for forming a back protective film in the apparatus is greater than or equal to the lower limit of the range, production efficiency is improved, while if it is less than or equal to the upper limit, the space occupied by the apparatus can be reduced.

[0235] The apparatus preferably includes 1 to 5 support sheet attaching stations, more preferably 1 to 3 support sheet attaching stations. If the number of support sheet attaching stations in the apparatus is greater than the lower limit of the range, production efficiency is improved, while if it is less than the upper limit, the space occupied by the apparatus can be reduced.

[0236] The apparatus preferably includes a transport arm for each transport path. Setting the ratio of the number of transport arms to the total number of workstations to 1 or greater can improve production efficiency. Furthermore, when two or more workstations are provided, setting the ratio of the number of transport arms to the total number of workstations to a value greater than 0 and less than 1 (for example, 1 transport arm for each of the two workstations) can reduce the space occupied by the apparatus.

[0237] As a specific example of connecting an apparatus for attaching a back protective film forming film with an apparatus for attaching a support sheet, the following method can be listed: an apparatus having a mechanism for attaching a back protective film forming film with an apparatus having a mechanism for attaching a support sheet is connected, and a conveying arm is used between each mechanism to convey the second stack body with the back protective film forming film 13 attached to the workpiece 14 piece by piece.

[0238] As a specific example of connecting an apparatus for attaching a back protective film forming film with an apparatus for curing the back protective film forming film, the following method can be listed: an apparatus having a mechanism for attaching a back protective film forming film with an apparatus having a mechanism for curing the back protective film forming film is connected, and a conveying arm is used between each mechanism to convey the second stack with the back protective film forming film 13 attached to the workpiece 14 piece by piece.

[0239] The first lamination step in the method for producing the first laminate and the method for producing the third laminate of this embodiment is preferably performed by the following method. Hereinafter, a case where the back protective film-forming film 13 and the protective layer 12 used in the first lamination step are processed into the shape of a workpiece in advance, or a case where they are processed in the same apparatus before the first lamination step is performed will be described.

[0240] The back protective film forming composite body 2 of this embodiment has a release film 152 on the outermost surface of the back protective film forming film 13. Figure 9 The composite body 3 for forming a back surface protective film is shown in a strip shape.

[0241] The strip-shaped composite body 3 for forming a back protective film is preferably wound into a roll and stored.

[0242] First, the release film 152 is peeled off, and the back protective film forming film 13 and the protective layer 12 are cut into the shape of the workpiece 14. Then, the laminated body composed of the back protective film forming film 13 and the protective layer 12 is wound and removed.

[0243] When the protective layer 12 is not provided, the outer peripheral portion is wound only with the back protective film forming film 13. Since the back protective film forming film 13 is thin and fragile, it may be cut during winding, and the outer peripheral portion may not be wound smoothly.

[0244] When the composite body 3 for forming a back protective film of this embodiment is used, the aforementioned winding of the outer periphery is winding of a laminate composed of the film 13 for forming a back protective film and the protective layer 12. The presence of the protective layer 12 increases the thickness of the laminate and improves its strength, thereby reducing the possibility of cutting during winding and enabling efficient winding of the outer periphery.

[0245] The composite body 2 for forming a back protective film of this embodiment, which has been cut and processed into the shape of a workpiece in the above-described manner, is attached to the back surface of a workpiece 14, thereby obtaining a laminated body in which the workpiece 14, the film 13 for forming a back protective film, the protective layer 12, and the release film 151 are sequentially laminated. As described above, since the release film 151 has not been cut, it remains in a strip shape. The strip-shaped release film 151 is wound and peeled off, thereby obtaining a second laminated body 24 in which the workpiece 14, the film 13 for forming a back protective film, and the protective layer 12 are sequentially laminated.

[0246] In the method for manufacturing the third laminate Figure 6D or Figure 7EIn the second layering step, the support sheet 10 is layered on the protective layer 12. The support sheet 10 can be, for example, a circular polyolefin film having a thickness of 80 μm and a diameter of 270 mm, and can have an adhesive layer for a jig at the outer peripheral portion. In the present embodiment, the workpiece 14 can be fixed to the fixing jig 18 together with the film 13 for forming a back surface protective film and the protective layer 12. Alternatively, the support sheet 10 can be layered on the protective layer 12 and fixed to the fixing jig 18 at the same time. Figure 6E Figure 7F

[0247] Support Sheet

[0248] As the support sheet 10 used in one aspect of the present application, a sheet composed only of the base material 101, or an adhesive sheet having an adhesive layer 102 on the base material 101 can be exemplified.

[0249] The support sheet of the third layered body of one aspect of the present application functions as a release sheet for preventing dust and the like from adhering to the surface of the film for forming a back surface protective film, or functions as a cutting sheet and the like for protecting the surface of the film for forming a back surface protective film in a cutting step and the like.

[0250] The thickness of the support sheet can be appropriately selected depending on the use, but from the viewpoint of imparting sufficient flexibility to the composite sheet and good adhesiveness to a silicon wafer, it is preferably 10 to 500 μm, more preferably 20 to 350 μm, and further preferably 30 to 200 μm.

[0251] In addition, the thickness of the support sheet includes not only the thickness of the base material constituting the support sheet, but also the thickness of the layers or films when an adhesive layer is present.

[0252] As the base material 101 constituting the support sheet 10, the base materials described in the protective layer can be used.

[0253] In addition, in one aspect of the present application, a sheet in which surface treatment has been performed on the surface of the above-described resin film or the like base material can be used as the support sheet.

[0254] Among these resin films, from the viewpoint of excellent heat resistance and the fact that the sheet has ductility due to moderate flexibility and is easy to maintain pick-up suitability, a base material containing a polypropylene film is preferred.

[0255] In addition, as the constitution of the base material containing a polypropylene film, it can be a single layer structure composed only of a polypropylene film, or a multi-layer structure composed of a polypropylene film and another resin film.

[0256] ​​When the back surface protective film forming film is thermosetting, the resin film constituting the substrate has heat resistance, so that damage to the substrate due to heat can be suppressed, and the occurrence of problems in the semiconductor device manufacturing process can be suppressed.

[0257] When a sheet consisting only of a substrate is used as a supporting sheet, from the perspective of adjusting the peeling force to a certain range, the surface tension of the surface of the substrate in contact with the surface of the film for forming the back protective film is preferably 20 to 50 mN / m, more preferably 23 to 45 mN / m, and further preferably 25 to 40 mN / m.

[0258] The thickness of the substrate constituting the support sheet is preferably 10 to 500 μm, more preferably 15 to 300 μm, and even more preferably 20 to 200 μm.

[0259] (Adhesive Sheet)

[0260] As an adhesive sheet used as the support sheet 10 in one embodiment of the present invention, there is exemplified a sheet having an adhesive layer 102 formed of an adhesive on a base material 101 such as the above-mentioned resin film.

[0261] Figure 8 1 is a schematic cross-sectional view showing an example of a support sheet 10 in which an adhesive layer 102 is provided on a substrate 101 .

[0262] When the support sheet 10 includes the adhesive layer 102 , the adhesive layer 102 of the support sheet 10 is laminated on the protective layer 12 in the second lamination step.

[0263] Examples of the adhesive that is a material for forming the adhesive layer include an adhesive composition containing an adhesive resin. The adhesive composition may further contain general additives such as the above-mentioned cross-linking agent and tackifier.

[0264] As the adhesive resin, when focusing on its resin structure, for example, acrylic resin, urethane resin, rubber resin, silicone resin, vinyl ether resin, etc. can be listed; when focusing on its resin function, for example, energy-ray curing adhesives, heat-foaming adhesives, energy-ray foaming adhesives, etc. can be listed.

[0265] In one embodiment of the present invention, the adhesive layer 102 of the support sheet is preferably a strong adhesive layer to ensure adhesion with the protective layer. It may be an energy-curable adhesive layer formed from an adhesive composition containing an energy-curable resin.

[0266] Furthermore, from the perspective of adjusting the peeling force within a certain range, a pressure-sensitive adhesive containing an acrylic resin is preferred.

[0267] The acrylic resin is preferably an acrylic polymer having a structural unit (x1) derived from an alkyl (meth)acrylate, and more preferably an acrylic copolymer having a structural unit (x1) and a structural unit (x2) derived from a functional group-containing monomer.

[0268] The alkyl group of the alkyl (meth)acrylate preferably has 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 8 carbon atoms.

[0269] Examples of the alkyl (meth)acrylate include the same ones as those described in the section of the binder polymer component.

[0270] In addition, the (meth)acrylates may be used alone or in combination of two or more.

[0271] The content of the structural unit (x1) is usually 50 to 100 mass %, preferably 50 to 99.9 mass %, more preferably 60 to 99 mass %, and even more preferably 70 to 95 mass % relative to all structural units (100 mass %) of the acrylic polymer.

[0272] Examples of the functional group-containing monomer include hydroxyl group-containing monomers, carboxyl group-containing monomers, and epoxy group-containing monomers. Specific examples of these monomers include the same monomers as those exemplified in the binder polymer component.

[0273] In addition, these monomers can be used alone or in combination of two or more.

[0274] The content of the structural unit (x2) is usually 0 to 40 mass %, preferably 0.1 to 40 mass %, more preferably 1 to 30 mass %, and further preferably 5 to 20 mass % relative to all structural units (100 mass %) of the acrylic polymer.

[0275] The acrylic resin used in one embodiment of the present invention may be an energy-ray-curable acrylic resin obtained by reacting a compound having an energy-ray polymerizable group with the acrylic copolymer having the structural units (x1) and (x2).

[0276] The compound having an energy ray polymerizable group may be any compound having a polymerizable group such as a (meth)acryloyl group or a vinyl group.

[0277] When using a pressure-sensitive adhesive containing an acrylic resin, it is preferred that the pressure-sensitive adhesive contain a cross-linking agent in addition to the acrylic resin in order to adjust the peeling strength to a certain range.

[0278] Examples of the crosslinking agent include isocyanate crosslinking agents, imine crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, and carbodiimide crosslinking agents. From the perspective of adjusting the peeling force within a certain range, isocyanate crosslinking agents are preferred.

[0279] The content of the crosslinking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, further preferably 0.5 to 10 parts by mass, and even more preferably 1 to 8 parts by mass, relative to the total mass (100 parts by mass) of the acrylic resin contained in the adhesive.

[0280] The support sheet 10 may be composed of a single layer or a plurality of layers. When the support sheet is composed of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different from each other. As long as the effects of the present invention are not impaired, the combination of these multiple layers is not particularly limited.

[0281] In addition, in this specification, not limited to supporting sheets, "multiple layers may be the same as or different from each other" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, "multiple layers may be different from each other" means "at least one of the constituent materials and thicknesses of each layer is different from each other".

[0282] The support sheet may be transparent or opaque, and may be colored according to the purpose.

[0283] For example, when the film for back surface protective film formation has energy ray curability, the support sheet is preferably a sheet that transmits energy rays.

[0284] For example, in order to enable optical inspection of the film for back surface protective film formation through the support sheet, the support sheet is preferably transparent.

[0285] In this embodiment, the circuit surface of the workpiece 14 is protected by the circuit surface protection tape 17, and a stripping process of stripping the circuit surface protection tape 17 from the circuit surface of the workpiece 14 can be included after the second lamination process. In this embodiment, the circuit surface protection tape 17 has an adhesive layer on the side adhered to the circuit surface. The adhesive layer is not limited to its type as long as it has moderate re-peelability from the workpiece, and can be formed by general adhesives such as rubber, acrylic, silicone, urethane, vinyl ether, etc. In addition, it can be formed by an energy-ray curing adhesive that is cured by irradiation with energy rays to become re-peelable. When the adhesive layer is formed by an energy-ray curing adhesive, in the stripping process, the adhesive layer of the circuit surface protection tape 17 is irradiated with energy rays to cure the adhesive layer so that it can be stripped again, thereby making it easy to strip the circuit surface protection tape 17 from the circuit surface of the workpiece 14.

[0286] The method for producing the third laminate of this embodiment may include a step of laser marking the back protective film-forming film 13 by irradiating the film 13 with a laser from the support sheet 10 side. In the method for producing the third laminate of this embodiment, since the support sheet 10 is laminated on the protective layer 12, laser marking can be performed on the surface of the back protective film-forming film 13 that contacts the protective layer 12 by irradiating the film 13 with a laser through the support sheet and the protective layer.

[0287] The method for producing the first laminate of the present embodiment may include a step of irradiating the back protective film-forming film 13 or the back protective film 13 ′ with laser light to perform laser marking.

[0288] By using the composite body 1 for forming a back protective film of this embodiment in the method for manufacturing the first stack and the method for manufacturing the third stack, it is possible to prevent contamination and deformation of the back protective film forming film 13. Therefore, it is also possible to prevent contamination and deformation of the back protective film 13' obtained by curing the back protective film forming film 13. When the back protective film forming film 13 or the back protective film 13' is contaminated or deformed (when there are uneven surfaces), when laser marking is performed by irradiating a laser through the support sheet 10, problems such as defects in printing and poor readability after printing may occur.

[0289] By using the composite body 1 for forming a back surface protective film according to the present embodiment in the method for producing the first laminate and the method for producing the third laminate, the film for forming a back surface protective film can be suppressed.

[0290] 13 (back protective film 13 ') is prevented from being contaminated or deformed. As a result, the above-mentioned printing defects can be suppressed, and the readability after printing becomes good.

[0291] <<Method for producing the fourth laminate>>

[0292] The fourth laminate manufacturing method of this embodiment is a method for manufacturing a fourth laminate 26, including the following step: curing the back protective film-forming film 13 in the third laminate 25 manufactured by the third laminate manufacturing method to form a back protective film 13'. The fourth laminate 26 is formed by sequentially stacking a workpiece 14, a back protective film 13', a protective layer 12, and a support sheet 10.

[0293] In addition, the manufacturing method of the fourth stack of this embodiment is a manufacturing method of the fourth stack 26, which includes the following steps: a second stacking step of attaching a support sheet 10 on the protective layer 12 of the first stack 23 manufactured by the manufacturing method of the first stack, to obtain a fourth stack in which the workpiece 14, the back protective film 13', the protective layer 12 and the support sheet 10 are stacked in sequence.

[0294] Figures 10A-10C The cross-sectional view schematically illustrates an example of an embodiment of the method for manufacturing the fourth laminate. The method for manufacturing the fourth laminate of this embodiment includes the following steps after the second lamination step in the method for manufacturing the third laminate: a peeling step (a step of peeling the circuit surface protective tape 17 from the circuit surface of the workpiece 14) Figure 10A ); irradiating the back protective film 13 from the support sheet 10 side and performing a laser marking process ( Figure 10B and the back protective film forming film 13 is cured to form a back protective film 13 'curing step ( Figure 10C In this embodiment, a thermosetting film for forming a back protective film is used, and in the curing step of this embodiment, thermal curing is performed under the conditions of 130° C. and 2 hours.

[0295] As long as the back protective film is cured to a degree sufficient to fully exert its function, the thermosetting back protective film-forming film is heat-treated to be thermally cured. The curing conditions for forming the back protective film are not particularly limited and can be appropriately selected according to the type of thermosetting back protective film-forming film.

[0296] For example, the heating temperature during thermal curing is preferably 100-200°C, more preferably 110-180°C, and particularly preferably 120-170°C. Furthermore, the heating time during thermal curing is preferably 0.5-5 hours, more preferably 0.5-3 hours, and particularly preferably 1-2 hours. When thermal curing is performed during the curing step, the stripping step is preferably performed before the curing step, taking into account the heat resistance of the circuit surface protective tape 17.

[0297] Figures 11A-11C The cross-sectional view schematically illustrates another example of an embodiment of the method for manufacturing the fourth laminate. The method for manufacturing the fourth laminate of this embodiment includes the following steps after the second lamination step in the method for manufacturing the third laminate: a peeling step ( Figure 11A ); the back protective film forming film 13 is cured to form a back protective film 13 'curing step ( Figure 11B and irradiating the back protective film 13 'from the support sheet 10 side and performing a laser marking step ( Figure 11C ).

[0298] Figure 12A 、 Figure 12BThis is a cross-sectional view schematically showing another example of an embodiment of the method for manufacturing the fourth laminate. The method for manufacturing the fourth laminate of this embodiment includes a second lamination step of attaching a support sheet to the first laminate 23 manufactured by the method for manufacturing the first laminate. The step of peeling off the circuit surface protective tape 17 and the step of laser marking by irradiating a laser from the support sheet 10 side may be included in the step of manufacturing the first laminate 23, or the step of Figure 12A 、 Figure 12B The process of manufacturing the fourth laminate 26 from the first laminate 23 shown includes a step of peeling off the circuit surface protective tape 17 and a step of laser marking by irradiating a laser from the support sheet 10 side.

[0299] <<Method for manufacturing a semiconductor device with a back surface protective film>>

[0300] Figures 12C-12E and Figures 13A-13C This is a cross-sectional view schematically illustrating an example of an embodiment of a method for manufacturing a semiconductor device with a back protective film. The method for manufacturing a semiconductor device with a back protective film of this embodiment includes the following steps: cutting the workpiece 14, back protective film 13', and protective layer 12 in the fourth stack 26 manufactured by the method for manufacturing the fourth stack to produce a semiconductor device 22' with a back protective film ( Figure 12C 、 Figure 12D 、 Figure 13A and Figure 13B and picking up the semiconductor device 22 'with a back protective film from the protective layer 12 ( Figure 12E 、 Figure 13C ).

[0301] Figures 14A-14D This is a cross-sectional view schematically illustrating another example of an embodiment of a method for manufacturing a semiconductor device with a back protective film. The method for manufacturing a semiconductor device with a back protective film of this embodiment includes the following steps: cutting the back protective film forming film 13, the workpiece 14, and the protective layer 12 in the third stack 25 manufactured by the method for manufacturing the third stack to produce a semiconductor device 22 with a back protective film forming film ( Figure 14A and Figure 14B ); the back protective film forming film 13 is cured to form a back protective film 13 'curing step ( Figure 14C and picking up the semiconductor device 22 'with a back protective film from the support sheet 10 (protective layer 12) step ( Figure 14D ).

[0302] The dicing in the above-mentioned semiconductor device manufacturing method can be performed by various cutting methods, such as blade dicing using a blade, laser dicing using laser irradiation, or water jetting using water containing an abrasive. In these dicing methods, the workpiece held on the support sheet via the protective layer and the back protective film (film for forming the back protective film) is cut together with the protective layer and the back protective film (film for forming the back protective film).

[0303] In addition, the cutting in the manufacturing method of the above-mentioned semiconductor device can also be performed by Stealth Dicing (registered trademark). In Stealth Dicing (registered trademark), first, a pre-division position is set inside the wafer, and the position is used as the focus. The laser is irradiated in a manner focused on the focus, thereby forming a modified layer inside the wafer. The modified layer of the wafer is different from other parts of the wafer. It is degraded and its strength is weakened due to the irradiation of the laser. Therefore, by applying force to the wafer, cracks extending in the direction of both sides of the wafer will be generated in the modified layer inside the wafer, which becomes the starting point for dividing (cutting) the wafer. Then, force is applied to the wafer to divide the wafer at the position of the modified layer to make chips. At this time, for example, a chip with a back protective film can be made by simultaneously stretching the wafer with a modified layer formed on the support sheet through the protective layer and the back protective film (film for forming the back protective film) in a direction parallel to the surface of the wafer, and the support sheet, protective layer, and back protective film (film for forming the back protective film) to apply force to the wafer.

[0304] The back protective film forming film 13 of the method for manufacturing a semiconductor device with a back protective film of this embodiment is thermosetting. In the process of manufacturing the back protective film of this embodiment, the back protective film forming film 13 is thermally cured under the conditions of, for example, 130°C and 2 hours.

[0305] As described above, as long as the degree of curing is such that the back protective film can fully exhibit its function, the curing conditions when thermally curing the thermosetting back protective film-forming film to form the back protective film are not particularly limited and can be appropriately selected according to the type of thermosetting back protective film-forming film.

[0306] The back protective film forming film 13 of the method for manufacturing a semiconductor device with a back protective film of this embodiment is energy ray-curable, and the process of manufacturing the back protective film can be a process of irradiating the back protective film forming film 13 with energy rays to cure it.

[0307] As long as the back protective film is cured to a degree sufficient to fully exert its function, the curing conditions when the energy-ray-curable back protective film-forming film is energy-ray-cured to form the back protective film are not particularly limited and can be appropriately selected according to the type of energy-ray-curable back protective film-forming film.

[0308] For example, the illuminance of the energy ray when the energy ray-curable back protective film is cured is preferably 4 to 280 mW / cm 2 In addition, the amount of energy ray during curing is preferably 3 to 1000 mJ / cm 2 .

[0309] As the energy-ray-curable film for forming a back protective film, for example, films disclosed in International Publication No. 2017 / 188200 and International Publication No. 2017 / 188218 can also be used.

[0310] When the protective layer 12 is not present, the semiconductor device 22' with the back protective film is picked up from the support sheet 10. When a thermosetting film is used as the back protective film forming film 13, the adhesion between the cured back protective film 13' and the support sheet 10 increases, making picking up the device difficult. In this case, the composition of the adhesive component of the support sheet needs to be adjusted.

[0311] On the other hand, when the composite body 1 for forming a back surface protective film of this embodiment is used, the semiconductor device 22' with the back surface protective film is picked up from the protective layer 12. At this time, if the adhesion between the protective layer 12 and the support sheet 10 is sufficiently increased, the semiconductor device 22' with the back surface protective film can be easily picked up even without optimizing the adhesion between the protective layer 12 and the support sheet 10.

[0312] Example

[0313] The present invention will be described in more detail below with reference to specific examples, but the present invention is not limited to the following examples.

[0314] <Evaluation of Deformation Suppression of Back Protective Film Forming Film in Transport Step>

[0315] The wafer with the composite for forming a back protective film obtained in Examples 1 to 3 and Comparative Example 1 described later was fixed on a workbench set at a temperature of 40°C with the semiconductor wafer side facing downward, and left for 1 minute. At this time, the measured value of the surface temperature of the workbench was 37 to 38°C. From the upper side of the wafer with the composite for forming a back protective film, a standard 8" I-type robot arm with adsorption holes (adsorption area at the front end of the arm: diameter 34mm) was used to adsorb and hold the wafer with the composite for forming a back protective film for 30 minutes under the condition of a vacuum source of less than -80kPa. Then, the wafer with the composite for forming a back protective film was fixed on a workbench at room temperature with the semiconductor wafer side facing downward, and the adsorption of the robot arm was stopped. The upper surface of the wafer with the composite for forming a back protective film was visually confirmed, and the case where no adsorption marks were seen was marked as A, and the case where adsorption marks were seen was marked as B.

[0316] (Manufacturing of Film for Back Protective Film Formation)

[0317] A first release sheet (SP-PET5011 manufactured by LINTEC Corporation, 50 μm thick) having a silicone release agent layer formed on one side of a polyethylene terephthalate (PET) film and a second release sheet (SP-PET381031 manufactured by LINTEC Corporation, 38 μm thick) having a silicone release agent layer formed on one side of a PET film were prepared.

[0318] A coating solution for forming a back protective film was applied to the release surface of a first release sheet using a knife coater and then dried in an oven at 120°C for 2 minutes to form a 40 μm thick back protective film. Next, the release surface of a second release sheet was superimposed on the back protective film, and the two were bonded together to form a back protective film sheet consisting of the first release sheet, a back protective film (LC2846, manufactured by LINTEC Corporation, 40 μm thick), and the second release sheet.

[0319] (Protective layer)

[0320] The first release sheet described above, which is a sheet having a silicone release agent layer formed on one surface of a polyethylene terephthalate (PET) film (manufactured by LINTEC Corporation: SP-PET5011, thickness 50 μm), was used as the protective layer 1 .

[0321] The film for forming the protective layer 2 was produced by the following method.

[0322] An adhesive composition having a solids concentration of 30% was prepared. The composition contained an acrylic polymer (100 parts by mass, solids) and a trifunctional xylylene diisocyanate crosslinker (TAKENATE D110N, manufactured by MITSUI TAKEDA CHEMICALS, INC.) (10.7 parts by mass, solids). Methyl ethyl ketone was also used as a solvent. The acrylic polymer was a polymer having a weight-average molecular weight of 600,000, obtained by copolymerizing 2-ethylhexyl acrylate (36 parts by mass), butyl acrylate (59 parts by mass), and 2-hydroxyethyl acrylate (5 parts by mass).

[0323] The adhesive composition was applied to the release-treated surface of a release film (SP-PET381031 manufactured by LINTEC Corporation, 38 μm thick) obtained by releasing one side of a polyethylene terephthalate (PET) film by silicone treatment, and then heated and dried at 120° C. for 2 minutes to form an adhesive layer with a thickness of 5 μm.

[0324] Next, a polypropylene film (Young's modulus: 400 MPa, thickness: 80 μm) as a base material was bonded to the exposed surface of the adhesive layer to obtain a film for forming the protective layer 2 having the adhesive layer on one surface of the base material.

[0325] As the film for forming the protective layer 3 , the polypropylene-based film (without an adhesive layer) used in the production of the film for forming the protective layer 2 was used.

[0326] [Example 1]

[0327] The second peeling sheet on the side of the film for forming the back protective film is peeled off, and the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300μm). Further, with the first peeling sheet remaining as the protective layer 1, a wafer with a composite body A for forming a back protective film is obtained.

[0328] The deformation of the back protective film forming film during the transport process was evaluated by the above-mentioned method for the wafer with the back protective film forming composite A. The suction pressure and results of the above-mentioned evaluation are shown in Table 1.

[0329] [Example 2]

[0330] The second peeling sheet on the side of the film for forming the back protective film is peeled off, and the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300 μm). Furthermore, the adhesive layer exposed by peeling off the peeling film of the film for forming the protective layer 2 is attached to the film for forming the back protective film exposed by peeling off the first peeling sheet, thereby obtaining a wafer with a composite body B for forming a back protective film.

[0331] The deformation of the back surface protective film forming film during the transport process was evaluated by the above-mentioned method for the wafer with the back surface protective film forming composite B. The suction pressure and results of the above-mentioned evaluation are shown in Table 1.

[0332] [Example 3]

[0333] The second peeling sheet on the side of the back protective film forming film is peeled off, and the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300μm). Further, a protective layer 3 forming film is attached to the back protective film forming film exposed by peeling off the first peeling sheet to obtain a wafer with a back protective film forming composite C.

[0334] The deformation of the back surface protective film forming film during the transport process was evaluated by the above-mentioned method for the wafer with the back surface protective film forming composite C. The suction pressure and results of the above-mentioned evaluation are shown in Table 1.

[0335] [Comparative Example 1]

[0336] The second release sheet on the back protective film forming film side was peeled off, and the exposed surface was attached to an 8-inch semiconductor wafer (300 μm thick). The first release sheet was further peeled off to obtain a wafer with a back protective film forming film.

[0337] The wafers with the back surface protective film-forming film were subjected to deformation evaluation of the back surface protective film-forming film during the transport process by the above-mentioned method. The suction pressure and results of the above evaluation are shown in Table 1.

[0338] [Table 1]

[0339]

[0340] No adsorption traces were observed in any of Examples 1 to 3 having the protective layer of the present invention. On the other hand, adsorption traces were observed in Comparative Example 1 not having the protective layer of the present invention.

[0341] Industrial Applicability

[0342] The composite for forming a back surface protective film of the present invention can be used to produce a semiconductor device with a back surface protective film.

[0343] Description of Reference Numerals

[0344] 1: A composite body for forming a back protective film; 2: A composite body for forming a back protective film; 3: A composite body for forming a back protective film; 7: A semiconductor chip with a back protective film; 8: A semiconductor wafer; 8a: A circuit surface of a semiconductor wafer; 8b: A back surface of a semiconductor wafer; 9: A semiconductor chip; 10: A supporting sheet; 101: A substrate; 102: An adhesive layer; 12: A protective layer; 13: A film for forming a back protective film; 13': A back protective film; 14: A workpiece; 14a: A circuit surface of a workpiece; 14b: A back surface of the workpiece 14; 151: A release film; 152: A release film; 17: A tape for protecting the circuit surface; 18: A fixture; 21: A semiconductor device; 22: A semiconductor device with a film for forming a back protective film; 22': A semiconductor device with a back protective film; 23: A first stack; 24: A second stack; 25: A third stack; 26: A fourth stack.

Claims

1. A method for producing a first laminate, wherein: A composite for forming a back protective film is used in a method for producing a first laminate, wherein the composite for forming a back protective film is formed by laminating a protective layer and a film for forming a back protective film, wherein the first laminate is formed by laminating a semiconductor substrate, a back protective film, and a protective layer in this order, wherein the protective layer is an energy-ray-curable film, a substrate composed of a resin film, or a protective layer having an adhesive layer or a release agent layer on the substrate, and the production method includes the following steps: a first lamination step of attaching the back protective film-forming film of the back protective film-forming composite to the back surface of the semiconductor substrate to obtain a second laminated body in which the semiconductor substrate, the back protective film-forming film, and the protective layer are sequentially laminated; A curing step of curing the back protective film-forming film of the second laminate to form a back protective film; and A conveying step of conveying the second stacked body from the first lamination step to the curing step.

2. The method for producing the first stacked body according to claim 1, wherein: The protective layer is a base material composed of a resin film alone or a protective layer in which an adhesive layer or a release agent layer is provided on the base material.

3. A method for manufacturing a third laminate, wherein: A composite for forming a back protective film is used in a method for producing a third laminate, wherein the composite for forming a back protective film is formed by laminating a protective layer and a film for forming a back protective film, and the third laminate is formed by sequentially laminating a semiconductor substrate, a film for forming a back protective film, a protective layer, and a support sheet, wherein the protective layer is an energy-ray-curable film, a base material composed of a resin film, or a protective layer having an adhesive layer or a release agent layer on the base material. The manufacturing method includes the following steps: a first lamination step of attaching the back protective film-forming film of the back protective film-forming composite to the back surface of the semiconductor substrate to obtain a second laminated body in which the semiconductor substrate, the back protective film-forming film, and the protective layer are sequentially laminated; a second lamination step of attaching a support sheet to the protective layer of the second laminate to obtain a third laminate having the semiconductor substrate, the film for forming a back surface protective film, the protective layer, and the support sheet laminated in this order; and A conveying step of conveying the second stacked body from the first lamination step to the second lamination step.

4. The method for producing the third stacked body according to claim 3, wherein: The protective layer is a protective layer composed of an energy ray curable film, a base material composed of a single resin film, or a protective layer in which an adhesive layer or a release agent layer is provided on the base material.

5. A method for manufacturing a semiconductor device with a back side protective film, comprising the following steps: a second lamination step of attaching a support sheet to the protective layer of the first laminate manufactured by the manufacturing method according to claim 1 to obtain a fourth laminate having the semiconductor substrate, the back protective film, the protective layer, and the support sheet laminated in this order; a step of cutting the semiconductor substrate and the back surface protective film in the fourth stack to produce a semiconductor device with a back surface protective film; and A step of picking up the semiconductor device with the back surface protection film from the support sheet.

6. A method for manufacturing a semiconductor device with a back side protective film, comprising the following steps: a step of curing the back protective film-forming film of the third laminate produced by the production method according to claim 3 to form a back protective film, thereby obtaining a fourth laminate having the semiconductor substrate, the back protective film, the protective layer, and the support sheet laminated in this order; a step of cutting the semiconductor substrate and the back surface protective film in the fourth stack to produce a semiconductor device with a back surface protective film; and A step of picking up the semiconductor device with the back surface protection film from the support sheet.

7. A method for manufacturing a semiconductor device with a back side protective film, comprising the following steps: a step of cutting the semiconductor substrate and the film for forming a back surface protective film in the third stacked body manufactured by the manufacturing method according to claim 3 to produce a semiconductor device with a film for forming a back surface protective film; a curing step of curing the film for forming a back protective film to form a back protective film; and A step of picking up the semiconductor device with the back surface protection film from the support sheet.

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