A device for taping or loading chips into tubes after chip testing and burning, and its working method

Abstract

The present invention provides a device for taping or loading chips into a material tube after chip testing and burning, and its working method. The device includes a lower frame, a tube pushing mechanism, a tube turning mechanism, a material unloading track, a material feeding assembly, a first material dividing mechanism connected to the tube turning mechanism, a first conveying mechanism, a second conveying mechanism, an electrical testing assembly located between the first conveying mechanism and the second conveying mechanism, a defective product storage device, a material picking robot, a second material dividing mechanism connected to the material picking robot, a tape transport mechanism, a sealing mechanism, a carrier tape rewinding mechanism, a connecting flow channel, and a lower tube assembly. The present invention integrates mechanical and electrical integration to form an intelligent device for advanced IC chip manufacturing. The IC chips are fed by a tube stacking rack, and the tube pushing mechanism separates the tubes. The device has an IC chip pin electrical detection function and adopts gold finger pressure testing. The device is easy to operate, has a mature and stable structure, and its parts are durable and easy to operate. It has precise positioning and a simple and elegant appearance.

Description

Technical Field

[0001] The present invention belongs to the technical field of intelligent equipment for IC chip manufacturing, and in particular relates to a device for taping or loading chips into a material tube after chip testing and burning, and a working method thereof. Background Art

[0002] The current IC chip manufacturing process involves many packages (such as SOP / MSOP / SSOP / TSSOP / LSOP) being loaded into tubes before being transferred to the testing and programming process. Good and bad IC chips sorted out during testing are then loaded into tubes, or good IC chips are taped and packaged with carrier tape. Traditionally, ICs are manually removed from tubes, inspected, and good ICs are manually taped or packaged into tubes. These processes require different equipment, increasing equipment investment costs for manufacturers. With labor costs in China and declining profits, automation is becoming a growing trend. Summary of the Invention

[0003] The purpose of the present invention is to provide a device and a working method for taping or loading IC chips into a material tube after chip testing and burning. IC chips are fed by a material tube stacking rack and separated by a tube pushing mechanism. The device is easy to operate, has accurate positioning, and a simple and elegant appearance.

[0004] The present invention provides a device for taping or loading a chip into a material tube after chip testing and burning, which comprises a lower frame, a tube pushing mechanism, a tube turning mechanism, a material unloading track, a material feeding assembly, a first material dividing mechanism connected to the tube turning mechanism, a first conveying mechanism, a second conveying mechanism, an electrical testing assembly located between the first conveying mechanism and the second conveying mechanism, a defective product storage device, a material picking manipulator, a second material dividing mechanism connected to the material picking manipulator, a tape walking mechanism, a sealing mechanism, a carrier tape winding mechanism, a connecting flow channel and a lower tube assembly; wherein the tube pushing mechanism comprises a material tube induction switch, a tube pushing cylinder connected to the material tube induction switch, a material pushing plate driven to move by the tube pushing cylinder, a plurality of limit blocks located near the material pushing plate, a support on the material pushing plate, and a plurality of limit blocks located near the material pushing plate. Support plates at both ends of the plate, material tube limiting plates for limiting the material tubes of IC chips, material height limiting blocks and guide plates located near the material tube limiting plates, pipe pushing cylinders and material tube stacking racks; wherein the material tubes of IC chips are placed in the material tube stacking racks; the pipe turning mechanism includes a pipe clamping block for clamping the material tube, a pipe clamping support plate for supporting the pipe clamping block, a pipe clamping cylinder, a pipe clamping cylinder fixing seat for fixing the pipe clamping cylinder, a flipping mechanism side plate fixedly connected to the pipe clamping cylinder fixing seat, a first pipe knocking cylinder and a second pipe knocking cylinder connected to the flipping mechanism side plate, a flipping mechanism rotating shaft connected to the flipping mechanism side plate, a flipping mechanism bearing fixing seat for fixing the flipping mechanism side plate, a pipe turning cylinder fixedly connected to the flipping mechanism side plate and a pipe turning cylinder fixing seat supporting the pipe turning cylinder.

[0005] Furthermore, the unloading track includes a product flow channel cover plate, a product flow channel base located below the product flow channel cover plate, a product flow channel gasket located between the product flow channel cover plate and the product flow channel base, a knocking block located at the entrance of the product flow channel cover plate, a knocking cylinder, a tension spring connecting the knocking block and the knocking cylinder, an induction block located below the knocking block, a proximity switch located below the tension spring, a dividing rod and a stop block located at the end of the product flow channel cover plate, a dividing cylinder connected to the dividing rod, an in-position photoelectric sensor located below the dividing rod, and a material shortage photoelectric sensor connected to the product flow channel cover plate.

[0006] Furthermore, the first conveying mechanism and the second conveying mechanism are both conveying robots, each including a servo motor, a motor fixing seat supporting the servo motor, a first synchronous wheel fixedly connected to the servo motor, a bearing seat, a second rotating shaft synchronous wheel fixed on the bearing seat, a synchronous belt connected between the first synchronous wheel and the second rotating shaft synchronous wheel, a slider located in the synchronous belt, a conveying stop cylinder fixing seat, a conveying stop cylinder fixed on the conveying stop cylinder fixing seat, a conveying stop block connected to the conveying stop cylinder, an origin sensing plate located near the conveying stop block, a synchronous belt origin sensing switch located near the servo motor, and a material sensing counter-shooting sensor located near the bearing seat.

[0007] Furthermore, the electrical testing component includes a plurality of finger cylinders arranged side by side, a cylinder fixing seat supporting the finger cylinders, a gold finger located under the corresponding finger cylinder, an insulating rubber rod and a pressure rod fixing seat located near the corresponding gold finger, a material stop shaft, a test material stop block, two rows of test material stop cylinders, a runner base pad, a runner base, a runner cover plate and a material arrival detection.

[0008] Furthermore, the material transfer assembly includes a material dividing cylinder, a material stop block, a material dividing rod, a first material in place sensor, a second material in place sensor, a material stop shaft, a material stop cylinder connected to the material stop shaft, a guide cylinder, and a guide claw connected to the guide cylinder.

[0009] Furthermore, the material picking robot includes a material picking servo motor, a material picking cam connected to the material picking servo motor, an upper silver slider, a nozzle rod fixing block fixed on the upper silver slider, a nozzle rod fixed on the nozzle rod fixing block, a glue nozzle fixed at the end of the nozzle rod, a proximity switch fixed on the material picking cam, a bearing fixing seat, a bearing retaining ring fixed on the bearing fixing seat, a material picking mechanism track plate connected to the bearing fixing seat and the material picking servo motor, a connecting block connecting the material picking mechanism track plate and the upper silver slider, a material picking mechanism X-direction adjustment base, a material picking mechanism Y-direction adjustment vertical plate, a rotating shaft passing through the bearing fixing seat and the bearing retaining ring, a negative pressure gauge and a material picking protective cover.

[0010] Furthermore, the tape transport mechanism includes a closed-loop stepper motor, a needle wheel connected to the closed-loop stepper motor, a carrier main channel, a carrier baffle, a carrier cover plate, an inlet carrier pallet, an outlet carrier pallet, a carrier origin sensing device, a convex material sensing device, a cover tape limit plate, a pressure plate, a tape transport base plate, a cutter device, a cutter cylinder connected to the cutter device, and a cutter cylinder fixing seat supporting the cutter cylinder.

[0011] Furthermore, the sealing mechanism includes a first-level belt pressing cylinder, a second-level belt pressing cylinder, an inner sealing knife, an outer sealing blade, a sealing knife push rod, a sealing knife outer cover, a cover tape guide wheel, a cover tape tensioning shaft, a cover tape tensioning block, a cover tape pressure piece, a sensor piece, a photoelectric switch, a cover tape disk, a cover tape inner chuck retaining ring and a cover tape inner chuck adjustment shaft, a CCD lens fixing seat, a CCD lens fixedly connected to the CCD lens fixing seat, a CCD lens Y-direction adjustment angle seat for adjusting the CCD lens, a light source Y-direction adjustment angle seat, a first light source Z-direction adjustment angle seat, a second light source Z-direction adjustment angle seat, a heating rod and a sealing knife.

[0012] The present invention also provides a method for operating a device for taping or loading a chip into a tube after chip testing and burning, comprising the following steps:

[0013] S1: The IC chip tube is placed into the tube stacking rack of the tube pushing mechanism;

[0014] S2: The push tube cylinder of the push tube mechanism separates the material tube;

[0015] S3: The pipe-pushing cylinder of the pipe-pushing mechanism pushes the discharge pipe to the pipe-turning mechanism;

[0016] S4: The tube turning mechanism clamps and turns the tube, and the material slides down by gravity;

[0017] S5: The first material distribution mechanism distributes the material, and then the first transport mechanism transports the material tube to the flow channel of the electrical testing component and performs electrical testing;

[0018] S6: The second transport mechanism transports defective IC chips to the defective product storage device, and transports good IC chips to the feed port of the feed assembly, and the feed slides down due to gravity;

[0019] S7: The second material dividing mechanism divides the material, and the material taking manipulator clamps the material tube;

[0020] S8: The carrier tape rewinding mechanism loads the IC chip and detects whether there are any defects in the IC chip, IC chip pins, and characters;

[0021] S9: The sealing mechanism performs sealing;

[0022] S10: The tape transport mechanism cuts and rewinds the tape.

[0023] The present invention also provides a method for operating a device for taping or loading a chip into a tube after chip testing and burning, comprising the following steps:

[0024] S1: The IC chip tube is placed into the tube stacking rack of the tube pushing mechanism;

[0025] S2: The push tube cylinder of the push tube mechanism separates the material tube;

[0026] S3: The pipe-pushing cylinder of the pipe-pushing mechanism pushes the discharge pipe to the pipe-turning mechanism;

[0027] S4: The tube turning mechanism clamps and turns the tube, and the material slides down by gravity;

[0028] S5: The first material distribution mechanism distributes the material, and then the first transport mechanism transports the material tube to the flow channel of the electrical testing component and performs electrical testing;

[0029] S6: The second transport mechanism transports defective IC chips to the defective product storage device, and transports good IC chips to the feed port of the feed assembly, and the feed slides down due to gravity;

[0030] S7: The second material distribution mechanism performs material distribution;

[0031] S8: The empty tubes are placed into the tube stacking rack of the tube pushing mechanism at one time;

[0032] S9: The pipe-pushing cylinder of the pipe-pushing mechanism pushes out the empty pipe, the pipe-turning mechanism clamps and turns the pipe, and the material slides down by gravity;

[0033] S10: The transport stop cylinder of the second transport mechanism retracts, and the IC chip product slides down into the empty tube;

[0034] S11: After the IC chip tube is full, the limit cylinder of the tube pushing mechanism retracts, the tube pushing cylinder of the tube pushing mechanism retracts, and the tube pushing cylinder of the tube pushing mechanism moves to push the full tube into the box.

[0035] The present invention integrates mechanical and electrical functions into an intelligent device for advanced IC chip manufacturing. The IC chips are fed by a material tube stacking rack, and the material tubes are separated by a tube pushing mechanism. The device has an IC chip pin electrical property detection function and adopts gold finger pressure testing. The device of the present invention is easy to operate, has a mature and stable structure, and has durable parts. It is easy to operate, has precise positioning, and has a simple and elegant appearance. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 and Figure 2This is a schematic structural diagram of a device for taping or loading chips into a tube after chip testing and burning according to an embodiment of the present invention;

[0038] Figure 3 A schematic structural diagram of a pipe pushing mechanism of a device according to an embodiment of the present invention;

[0039] Figure 4 and Figure 5 This is a schematic structural diagram of a tube turning mechanism of a device according to an embodiment of the present invention;

[0040] Figure 6 This is a schematic structural diagram of a material unloading track of an apparatus according to an embodiment of the present invention;

[0041] Figure 7 A schematic structural diagram of a first transport mechanism and a second transport mechanism of an apparatus according to an embodiment of the present invention;

[0042] Figure 8 and Figure 9 A schematic structural diagram of an electrical test assembly of a device according to an embodiment of the present invention;

[0043] Figure 10 and Figure 11 This is a schematic structural diagram of a defective product storage device of an apparatus according to an embodiment of the present invention;

[0044] Figure 12 This is a schematic structural diagram of a material transfer assembly of an apparatus according to an embodiment of the present invention;

[0045] Figures 13 to 15 A schematic structural diagram of a retrieving manipulator of an apparatus according to an embodiment of the present invention;

[0046] Figure 16 and Figure 17 A schematic structural diagram of a tape transport mechanism of an apparatus according to an embodiment of the present invention;

[0047] Figures 18 to 20 A schematic structural diagram of a sealing mechanism of a device according to an embodiment of the present invention;

[0048] Figure 21 This is a structural schematic diagram of a carrier tape winding mechanism of an apparatus according to an embodiment of the present invention;

[0049] Figure 22 A schematic structural diagram of the connecting flow channels of a device according to an embodiment of the present invention;

[0050] Figure 23 and Figure 24 Schematic diagram of the structure of the down tube assembly of the device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0051] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0052] In the description of the present invention, it should be understood that the terms "length," "width," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," and the like, indicating positions or location relationships, are based on the positions or location relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, in the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

[0053] like Figure 1 and Figure 2 As shown, the device for taping or loading the chip into a material tube after the chip is tested and burned includes: a lower frame 10, a tube pushing mechanism 30, a tube turning mechanism 40, a material unloading track 89, a material passing assembly 50, a first material dividing mechanism 61 connected to the tube turning mechanism 40, a first conveying mechanism 71, a second conveying mechanism 72, an electrical testing assembly 81 located between the first conveying mechanism 71 and the second conveying mechanism 72, a defective product storage device 82, a material picking robot 83, a second material dividing mechanism 62 connected to the material picking robot 83, a tape transport mechanism 84, a sealing mechanism 86, a carrier tape winding mechanism 87, a connecting channel 88 and a lower tube assembly 85.

[0054] This equipment meets two types of process requirements: first, the IC chip in the TUBE tube is tested and burned and then filled into the carrier tape; second, the IC chip in the TUBE tube is tested and burned and then transferred into the TUBE tube.

[0055] like Figure 3 As shown, the pipe pushing mechanism 30 includes a material pipe sensing switch 34, a pipe pushing cylinder 31 connected to the material pipe sensing switch 34, a pushing plate 33 driven to move by the pipe pushing cylinder 31, a plurality of limit blocks 32 located near the pushing plate 33, a support plate 35 supported at both ends of the pushing plate 33, a material pipe limit plate 37 for limiting the material pipe of the IC chip, a material height limit block 36 and a guide plate 39 located near the material pipe limit plate 37, a pipe pushing cylinder 38 and a material pipe stacking rack 391.

[0056] The present invention adopts the material tube 100 (such as Figure 6 and Figure 7The tube stacker 391 can hold approximately 50 tubes at a time, reducing manual operation time. Operating Principle: First, tubes filled with IC chips are manually placed into the tube stacker 391. The tube sensor switch 34 triggers the tube push cylinder 31 to move to the stop block 32, activating the tube push cylinder 38 and ejecting the tube to the tube turning mechanism 40 for clamping in the next process. The tube stop plate 37 is adjustable to accommodate tubes of varying IC chip widths.

[0057] like Figure 4 and Figure 5 As shown, the tube turning mechanism 40 includes a tube clamping block 41 for clamping the material tube 100, a tube clamping support plate 42 for supporting the tube clamping block 41, a tube clamping cylinder 43, a tube clamping cylinder fixing seat 44 for fixing the tube clamping cylinder 43, a flipping mechanism side plate 46 fixedly connected to the tube clamping cylinder fixing seat 44, a first tube knocking cylinder 451 and a second tube knocking cylinder 452 connected to the flipping mechanism side plate 46, a flipping mechanism rotating shaft 47 connected to the flipping mechanism side plate 46, a flipping mechanism bearing fixing seat 48 for fixing the flipping mechanism side plate 46, a tube turning cylinder 491 fixedly connected to the flipping mechanism side plate 46, and a tube turning cylinder fixing seat 492 for supporting the tube turning cylinder 491.

[0058] When the pipe-pushing cylinder 38 of the pipe-pushing mechanism 30 pushes the material pipe 100 to the proper position, the pipe clamping block 41 actuates to clamp the material pipe 100. The clamping block 41 is trumpet-shaped and has a guiding function, ensuring the consistent positioning of the material pipe 100. The pipe-turning cylinder 491 then actuates to flip the material pipe 100 to a level with the unloading track 89, allowing the IC chip material in the material pipe 100 to slide smoothly onto the unloading track. The pipe-clamping cylinder mounting bracket 44 is fixed to the side plate 46 of the unloading mechanism. The clamping cylinder mounting bracket 44 has a U-shaped hole that allows for forward and backward adjustment to prevent misalignment between the clamping block 41 and the unloading channel cavity due to machining errors. The clamping cylinder mounting bracket 44 also features a U-shaped hole for securing the clamping cylinder 43, allowing for vertical adjustment of the clamping block 41 to accommodate material pipes 100 with IC chips of varying thicknesses.

[0059] like Figure 6As shown, the unloading track 89 includes a product flow channel cover plate 897, a product flow channel base 896 located below the product flow channel cover plate 897, a product flow channel pad 895 located between the product flow channel cover plate 897 and the product flow channel base 896, a knocking block 891 located at the entrance of the product flow channel cover plate 897, a knocking cylinder 892, a tension spring 893 connecting the knocking block 891 and the knocking cylinder 892, an induction block 8992 located below the knocking block 891, a proximity switch 894 located below the tension spring 893, a dividing rod 8991 and a stop block 899 located at the end of the product flow channel cover plate 897, a dividing cylinder 898 connected to the dividing rod 8991, an in-position photoelectric sensor 8995 located below the dividing rod 8991, and a material shortage photoelectric sensor 8996 connected to the product flow channel cover plate 897.

[0060] The unloading track 89 forms a 55-degree angle with the horizontal plane. IC chip products enter the runner and fall freely under the action of gravity. A knocking block 891 is installed at the runner inlet to sense whether there is product at the inlet. If the sensing block 8992 is about to contact the proximity switch 894, it means that there is no material in the inlet. After several consecutive sensings of IC chip material, and at the same time, the lack of material sensing indicates that there is no product, the tube turning cylinder 491 flips to the level of the push tube 100. A dividing rod 8991 is designed at the end of the runner. The dividing cylinder 898 is used to divide the material. The blocking block 899 and the dividing rod 8991 move in an intersecting manner. When the handling robot moves to the docking point of the unloading runner, the dividing cylinder 898 is activated, the dividing rod 8991 descends to separate the second material from the first material, and the blocking block 899 rises. Under the action of gravity and the blowing device 8993, the first product quickly slides into the runner fixture in the handling robot device. The knock block 891 is not fixed to the material distribution cylinder 898, but uses a tension spring 893 to prevent damage to the product. The IC chip product flow channel pad has a dust drop groove 8994 to prevent the product from being stuck due to dust accumulation on the product flow channel base 896.

[0061] like Figure 7 As shown, the first conveying mechanism 71 and the second conveying mechanism 72 are both conveying robots, both of which include a servo motor 911, a motor fixing seat 912 supporting the servo motor 911, a first synchronous wheel 9191 fixedly connected to the servo motor 911, a bearing seat 913, a second rotating shaft synchronous wheel 914 fixed on the bearing seat 913, a synchronous belt 9192 connected between the first synchronous wheel 9191 and the second rotating shaft synchronous wheel 914, a slider 9193 located in the synchronous belt 9192, a conveying stop cylinder fixing seat 9196, a conveying stop cylinder 918 fixed on the conveying stop cylinder fixing seat 9196, a conveying stop block 919 connected to the conveying stop cylinder 918, an origin sensing plate 916 located near the conveying stop block 919, a synchronous belt origin sensing switch 915 located near the servo motor 911, and a material sensing counter-shooting sensor 917 located near the bearing seat 913.

[0062] The product handling mechanism utilizes synchronous wheels 9191 and 914, a synchronous belt 9192, and a servo motor 911 to drive the slider guide structure. This simple structure, coupled with a servo-driven motion block, ensures high alignment accuracy. When the flow channel in the handling robot 91 aligns with that of the previous process, the material distribution cylinder 898 activates, causing the IC chip product to drop into the flow channel of the handling robot 91. The material blocking block 919 blocks the IC chip product. Simultaneously, the material sensing and beam sensor 917 detects the presence of the product, and the servo motor 911 activates to align the flow channel of the handling robot 91 with the flow channel in the detection assembly, resulting in a repetitive back-and-forth motion.

[0063] like Figure 8 and Figure 9 As shown, the electrical test component 81 mainly tests the pins of IC chip products, which includes multiple finger cylinders 811 arranged side by side, a cylinder fixing seat 812 supporting the finger cylinder 811, a gold finger 813 located below the corresponding finger cylinder 811, an insulating rubber stick 814 and a pressure rod fixing seat 815 located near the corresponding gold finger 813, a material blocking shaft 816, a test material blocking block 817, two rows of test material blocking cylinders 818, a runner base pad 819, a runner base 8191, a runner cover 8192 and a material in place detection 8193.

[0064] The electrical test component 81 is assembled independently and can be easily disassembled. The electrical test component 81 is connected to the large panel with a connecting plate 8194. The height can be adjusted by removing the screws to align the upper and lower flow channel interfaces to solve the problem of material jamming. The material blocking device at the first material in place detection point 8195 serves as a reserve material. If the second material in place detection point 8196 and the first material in place detection point 8195 simultaneously sense the presence of material, the first conveying mechanism 71 and the second conveying mechanism 72 will not convey the product to this flow channel interface, ensuring that the product reaches the second material in place detection point 8196 alone. The sensing of material triggers the finger cylinder 811 to move, clamping the product to test its electrical properties. The material blocking device at the third material in place detection point can reserve one material in preparation for the next process. Because testing takes time, this equipment is equipped with four additional tests to increase the production capacity of IC chips.

[0065] like Figure 10 and Figure 11 As shown, the defective product collection device 82 is used to collect waste IC chips using a material tube, without damaging the IC chip products. The defective product collection device 82 includes a material tube guide plate 821 with six material tube slots, a sensor 822 located in each material tube slot, a pressure plate 823 to press the material tube, and a carriage 824 to support the material tube.

[0066] When the sensor 822 senses the presence of a waste discharge pipe 101, the first conveying mechanism 71 and / or the second conveying mechanism 72 conveys the product with defective IC chips to the defective product storage device 82 for storage. The material pipe groove of the material pipe guide plate 821 has an R angle to facilitate the waste discharge pipe 101. The pressure sheet 823 is used to press the waste discharge pipe 101 to prevent it from falling. A support plate 824 is installed to prevent the material pipe from deforming after being filled with material.

[0067] like Figure 12 As shown, the material feeding assembly 50 includes a material dividing cylinder 51, a material blocking block 52, a material dividing rod 53, a first material in place sensor 54, a second material in place sensor 55, a material blocking shaft 56, a material blocking cylinder 57 connected to the material blocking shaft 56, a guide cylinder 58, and a guide claw 59 connected to the guide cylinder 58.

[0068] The feeding assembly 50 is at an angle of 55 degrees to the horizontal plane. The IC chip products enter the flow channel and fall freely under the action of gravity. A material dividing device is designed at the end of the flow channel. The material dividing cylinder 51 is a finger cylinder for material dividing. The material blocking block 52 and the material dividing rod 53 act crosswise. When the first conveying mechanism 71 and / or the second conveying mechanism 72 continuously transport the qualified materials in the electrical test assembly 81 to the second unloading flow channel assembly until the photoelectric sensor is full of materials, and at the same time the second material in place sensor 55 senses the presence of products, the material dividing cylinder 51 is activated, the material blocking rod 53 descends to separate the second material from the first material, and the material blocking block 52 rises. Under the action of gravity and the blowing device, the first product quickly slides to the material blocking block at the guiding position. The first material in place sensor 54 senses the presence of products. If the process is braiding, the material blocking shaft 56 is always in a lifting state to block the material. When the material is in place, the guiding cylinder 58 is activated to open the guiding claw 59, and the material taking robot 83 takes the material. If the process is tube loading, the blocking block 52 is in a descending state, the guiding cylinder 58 does not move, and the IC chip product flows into the third material discharge channel and slides into the material tube.

[0069] like Figures 13 to 15As shown, the material picking robot 83 includes a material picking servo motor 831, a material picking cam 832 connected to the material picking servo motor 831, an upper silver slider 833, a nozzle rod fixing block 834 fixed on the upper silver slider 833, a nozzle rod 835 fixed on the nozzle rod fixing block 834, a glue nozzle 836 fixed at the end of the nozzle rod 835, a proximity switch 837 fixed on the material picking cam 832, a bearing fixing seat 8381, and a bearing fixing seat 838 fixed on the bearing fixing seat 838. 1, a material picking mechanism track plate 8384 connected to the bearing fixing seat 8381 and the material picking servo motor 831, a connecting block 8383 connecting the material picking mechanism track plate 8384 and the upper silver slider 833, a material picking mechanism X-axis adjustment base 8385, a material picking mechanism Y-axis adjustment vertical plate 8386, a rotating shaft 8387 passing through the bearing fixing seat 8381 and the bearing retaining ring 8382, a negative pressure gauge 8388 and a material picking protective cover 8389.

[0070] The retrieving robot 83 utilizes a retrieving cam 832, a retrieving mechanism track plate 8384, and a retrieving servo motor 831 to drive and control the structure, allowing products on the ramp to be placed horizontally into the carrier cavity. A side guard 8390 is located at the front of the retrieving protective cover 8389, preventing injury to personnel during the retrieving robot 83's movement and enhancing safety. The servo drive and the silver slider 833 ensure high precision. The track in the retrieving mechanism track plate 8384 is also computer-machined, ensuring the perfect clearance between the bearing 8391 and the retrieving mechanism track plate 8384. The bearing 8391 slides smoothly within the track plate 8384, maintaining a small and uniform clearance, significantly improving motion accuracy. The retrieving mechanism track plate 8384 is hardened for wear resistance and enhanced performance. The position between the bearing mount 8381, the connecting block 8383, and the shaft 8392 is limited by a bearing retaining ring 8382, replacing a retaining spring or screw. The bearing retaining ring 8382 can be adjusted to prevent the connecting block 8383 from moving left or right during movement. The reclaiming mechanism's X-axis adjustment base 8385 has a plus-shaped hole, allowing the reclaiming manipulator 83 to adjust the Y-axis adjustment plate 8386 of the reclaiming mechanism. The Y-axis adjustment plate 8386 has a U-shaped hole and can adjust the position of the reclaiming manipulator 83 in the Y direction. The Z-axis fixation also has a U-shaped hole, allowing the reclaiming manipulator 83 to adjust its suction height in the Z direction.

[0071] like Figure 16 and Figure 17As shown, the tape transport mechanism 84 includes a closed-loop stepper motor 841, a pin wheel 842 connected to the closed-loop stepper motor 841, a carrier tape main channel 843, a carrier tape baffle 844, a carrier tape cover plate 845, a carrier tape inlet support plate 846, a carrier tape outlet support plate 847, a carrier tape origin sensor 848, a convex material sensor 849, a cover tape limit plate 8491, a pressure plate 8492, a tape transport base plate 8493, a cutter device 8494, a cutter cylinder 8495 connected to the cutter device 8494, and a cutter cylinder fixing seat 8496 supporting the cutter cylinder 8495.

[0072] The carrier tape moves along the carrier track and is secured by the carrier cover plate 845. The feed mechanism feeds qualified IC chips into the carrier tape, then into the inlet carrier plate 846, the outlet carrier plate 847, the carrier tape origin sensor 848, the convex material sensor 849, the cover tape stop plate 8491, the pressure plate 8492, the tape feed base 8493, the cutter device 8494, and a robotic arm to remove material, break through the gap, and load the carrier tape. A closed-loop stepper motor 841 drives the pinwheel 842, moving the carrier tape one space, repeating this cycle to continuously output loaded carrier tape. The cutter device 8494 automatically cuts the tape after a certain number of IC chip products have been rewound, according to customer specifications, and after a specified number of empty seals have been obtained. The cover tape stop plate 8491 has limit slots on both sides, accommodating two widths of carrier tape.

[0073] like Figures 18 to 20 As shown, the sealing mechanism 86 includes a first-level pressing cylinder 861, a second-level pressing cylinder 862, an inner sealing knife 863, an outer sealing blade 864, a sealing knife push rod 865, a sealing knife outer cover 866, a cover tape guide wheel 867, a cover tape tensioning shaft 868, a cover tape tensioning block 869, a cover tape pressing piece 8691, a sensor piece 8692, a photoelectric switch 8693, a cover tape disk 8694, a cover tape inner chuck retaining ring 8695 and a cover tape inner chuck adjustment shaft 8696, a CCD lens fixing seat 8681, a CCD lens 8682 fixedly connected to the CCD lens fixing seat 8681, a CCD lens Y-direction adjustment angle seat 8683 for adjusting the CCD lens 8682, a light source Y-direction adjustment angle seat 8684, a first light source Z-direction adjustment angle seat 8685, a second light source Z-direction adjustment angle seat 8686, a heating rod 8687 and a sealing knife seat 8688.

[0074] The CCD lens 8682 of the sealing mechanism 86, with two light sources, takes two photos: one to detect the product characters and one to detect the product pins. During automatic operation, the movements of the first-stage pressing cylinder 861 and the second-stage pressing cylinder 862 alternate with the inching of the carrier tape. After the heating rod 8687 heats the sealing knife to the set temperature, the second-stage pressing cylinder 862 presses the hot sealing knife downward. Under the action of temperature and pressure, the cover tape and the carrier tape are hot-melt bonded. The sealing knife is made into a split type, and the outer sealing blade 864 is fixed to the inner sealing blade 863. The inner sealing blade 863 has a U-shaped hole, which can adjust the height of the outer sealing blade 864 up and down to prevent the sealing effect from being affected by the uneven height of the carrier tape main channel and the carrier tape baffle in the tape running section. To switch from a 12-inch to a 16-inch tape, simply flip the outer sealing blade 864 over and secure it. The blade position can also be adjusted forward or backward by loosening the four screws on the sealing blade holder 8688 and turning the sealing blade Y-axis adjustment nut 8689 counterclockwise or clockwise until the blade seals the tape properly. The CCD light source is fixed with a slider that allows it to be moved up and down. If the CCD detects a problem, the light source can be raised, facilitating manual removal of waste and refilling of IC chips.

[0075] like Figure 21 As shown, the carrier tape winding mechanism 87 includes a tape taking-up motor 871, a tape taking-up reel 872 and a tape taking-up arm 873 fixedly connected to the tape taking-up motor 871, a tape taking-up sensing shaft 874 fixed under the tape taking-up arm 873, a tape taking-up sensing tensioning block 875 connected to the tape taking-up sensing shaft 874, and a tape taking-up sensing tensioning wheel 876 connected to the tape taking-up sensing tensioning block 875.

[0076] The take-up motor 871 operates intermittently, driving the take-up reel 872 to rotate and rewind the carrier tape. As the radius increases during the take-up process, the tension increases. To prevent damage to the carrier tape, the carrier tape rewinding mechanism 87 includes a take-up sensor tensioning block 875 and a take-up sensor tensioning pulley 876. When the take-up sensor tensioning block 875 and the take-up sensor tensioning pulley 876 are illuminated, the take-up motor 871 stops; otherwise, it starts rotating.

[0077] like Figure 22 As shown, the connecting channel 88 includes a connecting channel base pad 881, a connecting channel base 882, a connecting channel cover 883, a knocking cylinder 884, a knocking cylinder fixing seat 885, a photoelectric device 886, a photoelectric fixing seat 887 and a material clamping sensing device 888.

[0078] A transfer channel is provided between the second feeder assembly and the lower tube assembly to allow the IC chips in the second lower tube assembly to fall into the tube under gravity through the connecting channel 88. Optical fiber detection is provided at the junction of the connecting channel 88 and the tube to detect stuck materials. A knock-out cylinder 884 is also added to move any stuck materials into the tube.

[0079] like Figure 23 and Figure 24 As shown, the lower tube assembly 85 includes a tube pushing cylinder 851, a tube clamp 852, a tube pushing plate 853, a tube pushing slider 854, a tube sensor 855, a tube support pad 856, a tube limiting plate 857, a tube clamping cylinder plate 8581, a tube clamp 8582, a tube support plate 8583, a tube clamping slider 8584, a micro switch 8585, a tube knocking cylinder 8586, a tube knocking shaft 8587, a tube knocking block 8588, a rotating shaft 8589, a tube pushing cylinder 8691, a tube pushing connecting block 8592, a tube pushing block 8693, and a tube knocking cylinder fixing seat 8594.

[0080] Using tubes to collect qualified products facilitates process automation and saves costs. The tube stacking rack 391 can stack approximately 50 tubes at a time, reducing manual operation time.

[0081] First, manually place the empty tubes into the tube stacking rack 391 at one time. The tube induction triggers the action of the tube-pushing cylinder, which pushes the tube to the point where it contacts the connecting flow channel, and the tube clamping cylinder clamps the tube. When the tube is full of material, the lifting cylinder descends, and the tube-pushing cylinder pushes the filled tube into the tube storage box. The tube limit plate 857 has a U-shaped hole, which can accommodate tubes of different widths and adjust the position of the tube. A micro switch 8585 is added to the tube clamping position to detect whether the tube is clamped. The tube-pushing connection block 8592 is equipped with a spring to hold the tube in place and prevent it from being damaged. The tube-knocking cylinder fixing seat 8594 is equipped with a tension spring screw, and the tube-knocking block 8588 is also equipped with a tension spring screw, which is connected with a tension spring to reset the position of the tube-knocking block 8588. The knocking cylinder 8586 moves and the knocking block 8588 rotates, which can knock the inclined material pipe to be placed horizontally with the material pipe support pad 856. The knocking shaft 8587 has U-force glue to prevent the material pipe from being damaged.

[0082] The present invention also discloses a working method of a device for taping or loading a chip into a material tube after chip testing and burning, comprising the following steps:

[0083] S1: The IC chip tube is placed into the tube stacking rack 391 of the tube pushing mechanism 30;

[0084] S2: The pipe pushing cylinder 31 of the pipe pushing mechanism 30 separates the material pipe;

[0085] S3: The pipe pushing cylinder 38 of the pipe pushing mechanism 30 pushes the material pipe to the pipe turning mechanism 40;

[0086] S4: The tube turning mechanism 40 clamps and turns the tube, and the material slides down by gravity;

[0087] S5: The first material distribution mechanism 61 distributes the material, and then the first transport mechanism 71 transports the material tube to the flow channel of the electrical testing component 81 and performs electrical testing;

[0088] S6: The second transport mechanism 72 transports defective IC chips to the defective product storage device 82, and transports good IC chips to the feed port of the feed assembly 50, and the feed slides down due to gravity;

[0089] S7: The second material dividing mechanism 62 divides the material, and the material taking manipulator 83 grabs the material tube;

[0090] S8: The carrier tape rewinding mechanism 87 loads the IC chips and detects whether there are any defects in the IC chips, IC chip pins, and characters;

[0091] S9: The sealing mechanism 86 performs sealing;

[0092] S10: The tape transport mechanism 84 cuts and rewinds the tape.

[0093] The method realizes the IC chip packed in the TUBE tube to be tested and burned and then filled into the carrier tape.

[0094] The present invention also discloses a working method of a device for taping or loading a chip into a material tube after chip testing and burning, comprising the following steps:

[0095] S1: The IC chip tube is placed into the tube stacking rack 391 of the tube pushing mechanism 30;

[0096] S2: The pipe pushing cylinder 31 of the pipe pushing mechanism 30 separates the material pipe;

[0097] S3: The pipe pushing cylinder 38 of the pipe pushing mechanism 30 pushes the material pipe to the pipe turning mechanism 40;

[0098] S4: The tube turning mechanism 40 clamps and turns the tube, and the material slides down by gravity;

[0099] S5: The first material distribution mechanism 61 distributes the material, and then the first transport mechanism 71 transports the material tube to the flow channel of the electrical testing component 81 and performs electrical testing;

[0100] S6: The second transport mechanism 72 transports defective IC chips to the defective product storage device 82, and transports good IC chips to the feed port of the feed assembly 50, and the feed slides down due to gravity;

[0101] S7: The second material distribution mechanism 62 performs material distribution;

[0102] S8: The empty tubes are placed in the tube stacking rack 391 of the tube pushing mechanism 30 at one time;

[0103] S9: The pipe-pushing cylinder 38 of the pipe-pushing mechanism 30 pushes out the empty pipe, and the pipe-turning mechanism 40 clamps and turns the pipe, and the material slides down by gravity;

[0104] S10: The transport stop cylinder 918 of the second transport mechanism 72 retracts, and the IC chip product slides down into the empty tube;

[0105] S11: After the tube is full of IC chips, the limit cylinder of the tube pushing mechanism 30 retracts, the tube pushing cylinder 38 of the tube pushing mechanism 30 retracts, and the tube pushing cylinder 31 of the tube pushing mechanism 30 moves to push the full tube into the box.

[0106] The method realizes the IC chip packed in the TUBE tube to be tested and burned and then transferred into the TUBE tube.

[0107] The present invention is compatible with various SOP / MSOP / SSOP / TSSOP / LSOP packages, thus promoting modern operations. The present invention enables one device to meet two types of process requirements: first, IC chips packaged in TUBE tubes are filled into carrier tape after testing and burning; second, IC chips packaged in TUBE tubes are transferred into TUBE tubes after testing and burning, thereby increasing the value of the device. The testing and burning of the device of the present invention takes time, and the addition of four tests improves efficiency and increases the production capacity of IC chip output. The device of the present invention has a group of CCDs, which ensures that the carrier tapes are all good IC chips. Defective IC chips sorted out by the device of the present invention in the testing and burning process are all stored in TUBE tubes. The good IC chips output by the device of the present invention can be selected from carrier tapes or TUBE tubes, thus meeting diverse requirements.

[0108] The present invention integrates mechanical and electrical functions into an intelligent device for advanced IC chip manufacturing. The IC chips are fed by a material tube stacking rack, and the material tubes are separated by a tube pushing mechanism. The device has an IC chip pin electrical property detection function and adopts gold finger pressure testing. The device of the present invention is easy to operate, has a mature and stable structure, and has durable parts. It is easy to operate, has precise positioning, and has a simple and elegant appearance.

[0109] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of the rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A device for taping or loading chips into tubes after chip testing and burning, characterized in that: The machine comprises a lower frame, a tube pushing mechanism, a tube turning mechanism, a material unloading track, a material feeding assembly, a first material dividing mechanism connected to the tube turning mechanism, a first conveying mechanism, a second conveying mechanism, an electrical testing assembly located between the first conveying mechanism and the second conveying mechanism, a defective product storage device, a material picking robot, a second material dividing mechanism connected to the material picking robot, a tape transport mechanism, a sealing mechanism, a carrier tape winding mechanism, a connecting flow channel and a lower tube assembly; wherein the tube pushing mechanism comprises a tube induction switch, a tube pushing cylinder connected to the tube induction switch, a tube pushing plate driven by the tube pushing cylinder, a plurality of limit blocks located near the tube pushing plate, a support plate supported at both ends of the tube pushing plate, a tube limiting mechanism ... The material tubes for the IC chips are provided with a material tube limiting plate, a material height limiting block and a guide plate located near the material tube limiting plate, a tube pushing cylinder, and a material tube stacking rack; wherein the material tubes for the IC chips are placed in the material tube stacking rack; the tube turning mechanism comprises a tube clamping block for clamping the material tube, a tube clamping support plate for supporting the tube clamping block, a tube clamping cylinder, a tube clamping cylinder fixing seat for fixing the tube clamping cylinder, a turning mechanism side plate fixedly connected to the tube clamping cylinder fixing seat, a first tube knocking cylinder and a second tube knocking cylinder connected to the turning mechanism side plate, a turning mechanism rotating shaft connected to the turning mechanism side plate, a turning mechanism bearing fixing seat for fixing the turning mechanism side plate, a tube turning cylinder fixedly connected to the turning mechanism side plate, and a tube turning cylinder fixing seat supporting the tube turning cylinder; The unloading track includes a product flow channel cover plate, a product flow channel base located below the product flow channel cover plate, a product flow channel pad located between the product flow channel cover plate and the product flow channel base, a knocking block located at the entrance of the product flow channel cover plate, a knocking cylinder, a tension spring connecting the knocking block and the knocking cylinder, a sensing block located below the knocking block, a proximity switch located below the tension spring, a dividing rod and a blocking block located at the end of the product flow channel cover plate, a dividing cylinder connected to the dividing rod, an in-position photoelectric sensor located below the dividing rod, and a material shortage photoelectric sensor connected to the product flow channel cover plate; The first conveying mechanism and the second conveying mechanism are both conveying robots, each including a servo motor, a motor fixing seat supporting the servo motor, a first synchronous wheel fixedly connected to the servo motor, a bearing seat, a second rotating shaft synchronous wheel fixed on the bearing seat, a synchronous belt connected between the first synchronous wheel and the second rotating shaft synchronous wheel, a slider located in the synchronous belt, a conveying stop cylinder fixing seat, a conveying stop cylinder fixed on the conveying stop cylinder fixing seat, a conveying stop block connected to the conveying stop cylinder, an origin induction sheet located near the conveying stop block, a synchronous belt origin induction switch located near the servo motor, and a material induction corresponding sensor located near the bearing seat; The electrical test assembly includes a plurality of finger cylinders arranged side by side, a cylinder fixing seat supporting the finger cylinders, a gold finger located below the corresponding finger cylinder, an insulating rubber rod and a pressure rod fixing seat located near the corresponding gold finger, a material stop shaft, a test material stop block, two rows of test material stop cylinders, a runner base pad, a runner base, a runner cover plate and a material in place detection device; The material transfer assembly includes a material distribution cylinder, a material stop block, a material distribution rod, a first material in place sensor, a second material in place sensor, a material stop shaft, a material stop cylinder connected to the material stop shaft, a guide cylinder, and a guide claw connected to the guide cylinder; The retrieving manipulator includes a retrieving servo motor, a retrieving cam connected to the retrieving servo motor, an upper silver slider, a nozzle rod fixing block fixed on the upper silver slider, a nozzle rod fixed on the nozzle rod fixing block, a glue nozzle fixed on the end of the nozzle rod, a proximity switch fixed on the retrieving cam, a bearing fixing seat, a bearing retaining ring fixed on the bearing fixing seat, a retrieving mechanism track plate connected to the bearing fixing seat and the retrieving servo motor, a connecting block connecting the retrieving mechanism track plate and the upper silver slider, a retrieving mechanism X-direction adjustment base, a retrieving mechanism Y-direction adjustment vertical plate, a rotating shaft passing through the bearing fixing seat and the bearing retaining ring, a negative pressure gauge and a retrieving protective cover; The tape transport mechanism includes a closed-loop stepper motor, a needle wheel connected to the closed-loop stepper motor, a carrier main channel, a carrier baffle, a carrier cover plate, an inlet carrier pallet, an outlet carrier pallet, a carrier origin sensing device, a convex material sensing device, a cover tape limiting plate, a pressure plate, a tape transport base plate, a cutter device, a cutter cylinder connected to the cutter device, and a cutter cylinder fixing seat supporting the cutter cylinder.

2. The device for taping or loading chips into tubes after chip testing and burning according to claim 1, characterized in that: The sealing mechanism includes a first-level belt pressing cylinder, a second-level belt pressing cylinder, an inner sealing knife, an outer sealing blade, a sealing knife push rod, a sealing knife outer cover, a cover tape guide wheel, a cover tape tensioning shaft, a cover tape tensioning block, a cover tape pressing piece, a sensor piece, a photoelectric switch, a cover tape disk, a cover tape inner chuck retaining ring and a cover tape inner chuck adjustment shaft, a CCD lens fixing seat, a CCD lens fixedly connected to the CCD lens fixing seat, a CCD lens Y-direction adjustment angle seat for adjusting the CCD lens, a light source Y-direction adjustment angle seat, a first light source Z-direction adjustment angle seat, a second light source Z-direction adjustment angle seat, a heating rod and a sealing knife.

3. The working method of the device for taping or loading into a tube after chip testing and burning according to any one of claims 1-2, characterized in that: The steps include: S1: The IC chip tube is placed into the tube stacking rack of the tube pushing mechanism; S2: The push tube cylinder of the push tube mechanism separates the material tube; S3: The pipe-pushing cylinder of the pipe-pushing mechanism pushes the discharge pipe to the pipe-turning mechanism; S4: The tube turning mechanism clamps and turns the tube, and the material slides down by gravity; S5: The first material distribution mechanism distributes the material, and then the first transport mechanism transports the material tube to the flow channel of the electrical testing component and performs electrical testing; S6: The second transport mechanism transports defective IC chips to the defective product storage device, and transports good IC chips to the feed port of the feed assembly, and the feed slides down due to gravity; S7: The second material dividing mechanism divides the material, and the material taking manipulator clamps the material tube; S8: The carrier tape rewinding mechanism loads the IC chip and detects whether there are any defects in the IC chip, IC chip pins, and characters; S9: The sealing mechanism performs sealing; S10: The tape transport mechanism cuts and rewinds the tape.

4. The working method of the device for taping or loading into a tube after chip testing and burning according to any one of claims 1-2, characterized in that: The steps include: S1: The IC chip tube is placed into the tube stacking rack of the tube pushing mechanism; S2: The push tube cylinder of the push tube mechanism separates the material tube; S3: The pipe-pushing cylinder of the pipe-pushing mechanism pushes the discharge pipe to the pipe-turning mechanism; S4: The tube turning mechanism clamps and turns the tube, and the material slides down by gravity; S5: The first material distribution mechanism distributes the material, and then the first transport mechanism transports the material tube to the flow channel of the electrical testing component and performs electrical testing; S6: The second transport mechanism transports defective IC chips to the defective product storage device, and transports good IC chips to the feed port of the feed assembly, and the feed slides down due to gravity; S7: The second material distribution mechanism performs material distribution; S8: The empty tubes are placed into the tube stacking rack of the tube pushing mechanism at one time; S9: The pipe-pushing cylinder of the pipe-pushing mechanism pushes out the empty pipe, the pipe-turning mechanism clamps and turns the pipe, and the material slides down by gravity; S10: The transport stop cylinder of the second transport mechanism retracts, and the IC chip product slides down into the empty tube; S11: After the IC chip tube is full, the limit cylinder of the tube pushing mechanism retracts, the tube pushing cylinder of the tube pushing mechanism retracts, and the tube pushing cylinder of the tube pushing mechanism moves to push the full tube into the box.

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