Probe station OCR recognition result correction method and system

Abstract

The present application relates to a kind of probe station OCR identification result correction method and system, comprising: probe station optical identification system is identified to the image of wafer to be measured, and original identification message is sent to probe station test system;Interception module is intercepted to original identification message, and whether original main batch name and target main batch name are consistent is judged, if yes, original identification message is modified as the modified identification message containing target batch name;Probe station test system judges whether the target batch name corresponding to modified identification message and artificial input batch name are consistent, if yes, then output module artificial input batch name is transmitted to test machine, to make test machine to the wafer to be measured for testing.The present application utilizes the identification function of probe station, intercepts and corrects identification message, achieves the purpose that identification result and artificial input batch name are consistent while splitting wafer, so that test machine can be normally tested, meets the splitting demand of different users.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit testing, in particular to a probe station OCR identification result correction method and system. BACKGROUND

[0002] The wafer generally marks the batch name in the form of a steel number on the wafer, and the probe station provides the function of OCR identifying the steel number, so that the test manufacturer can correctly read the batch name information, the probe station compares the batch name identified by OCR with the batch name manually entered, and after the comparison is correct, the batch name manually entered is returned to the test machine for testing. However, if the wafer factory carries out batch processing on the wafer, requires the batch name manually entered to contain sub-batch information, and requires the test machine to write the batch name containing the sub-batch information into the chip, but the steel number on the wafer does not have sub-batch information, and the normal identification content of OCR is the steel number, which cannot be compared with the batch name containing the sub-batch information. Therefore, it is urgent to provide a method for correcting the UF3000 probe station OCR identification result to meet the requirement of the wafer factory for using the sub-batch name for testing. SUMMARY

[0003] To solve the above technical problems, the present application provides a probe station OCR identification result correction method and system.

[0004] The technical scheme of the probe station OCR identification result correction method of the present application is as follows:

[0005] S1, the optical recognition system of the probe station performs OCR identification on the original image of the wafer to be tested to obtain the original main batch name of the wafer to be tested, and sends the original identification message containing the original main batch name to the test system of the probe station;

[0006] S2, the interception module intercepts the original identification message, and judges whether the original main batch name in the original identification message is consistent with the target main batch name of the wafer to be tested, if yes, modifies the original identification message to a modified identification message containing the target batch name of the wafer to be tested, and sends the modified identification message to the test system of the probe station; wherein the target batch name includes: the target main batch name and the target sub-batch name;

[0007] S3, the test system of the probe station receives the modified identification message, and judges whether the target batch name corresponding to the modified identification message is consistent with the manually entered batch name of the wafer to be tested, to obtain a judgment result;

[0008] S4, when the judgment result is yes, the output module transmits the manually entered batch name to the test machine, so that the test machine tests the wafer to be tested.

[0009] The probe station OCR recognition result correction method has the following beneficial effects:

[0010] The method of the present application uses the OCR recognition function of the probe station to intercept and correct the recognition message, and achieves the consistency of the OCR recognition result and the manually entered batch name while splitting the wafer, so that the test machine can be tested normally, and the splitting batch requirement of different users is met.

[0011] Based on the above-mentioned scheme, the probe station OCR recognition result correction method of the present application can be further improved as follows.

[0012] Further, before step S2, it further includes:

[0013] The interception module receives the target batch name sent by the user.

[0014] Further, the target batch name is the batch name set by the user for the wafer to be tested.

[0015] Further, the original recognition message and the corrected recognition message are both expressed in hexadecimal form.

[0016] Further, the probe station is a UF3000 type probe station.

[0017] The technical scheme of the probe station OCR recognition result correction system of the present application is as follows:

[0018] The probe station OCR recognition result correction system of the present application includes:

[0019] The optical recognition system of the probe station, the interception module, the test system of the probe station and the output module;

[0020] The optical recognition system of the probe station is used to perform OCR recognition on the original image of the wafer to be tested to obtain the original main batch name of the wafer to be tested, and send the original recognition message containing the original main batch name to the test system of the probe station.

[0021] The interception module is used to intercept the original recognition message, and judge whether the original main batch name in the original recognition message is consistent with the target main batch name of the wafer to be tested, if yes, modify the original recognition message into a corrected recognition message containing the target batch name of the wafer to be tested, and send the corrected recognition message to the test system of the probe station; wherein the target batch name includes the target main batch name and the target sub-batch name.

[0022] The test system of the probe station is used for receiving the modified identification message, and judging whether the target batch name corresponding to the modified identification message is consistent with the manually-entered batch name of the wafer to be tested.

[0023] The output module is used for transmitting the manually-entered batch name to a test machine, so that the test machine tests the wafer to be tested.

[0024] The probe station OCR identification result modification system has the following beneficial effects.

[0025] The system uses the OCR identification function of the probe station to intercept and modify the identification message, achieves the consistency of the OCR identification result and the manually-entered batch name when the wafer is split, and thus enables the test machine to normally test and meets the batch splitting requirements of different users.

[0026] On the basis of the above-mentioned scheme, the probe station OCR identification result modification system can be further improved as follows.

[0027] Further, the interception module is further used for receiving the target batch name sent by a user.

[0028] Further, the target batch name is a batch name set by the user for the wafer to be tested.

[0029] Further, the original identification message and the modified identification message are both expressed in hexadecimal form.

[0030] Further, the probe station is a probe station with a model of UF3000. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A flowchart of a probe station OCR identification result modification method according to an embodiment of the present application is shown.

[0032] Figure 2 A flowchart of a probe station OCR identification result modification method according to an embodiment of the present application is shown.

[0033] Figure 3 A structure diagram of a probe station OCR identification result modification system according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0034] As shown in the figure, a probe station OCR identification result modification method according to an embodiment of the present application includes the following steps: Figure 1

[0035] ​S1, the optical recognition system of the probe station performs OCR identification on the original image of the wafer to be measured to obtain the original main batch name of the wafer to be measured, and sends the original identification message containing the original main batch name to the test system of the probe station.

[0036] The optical recognition system of the probe station is a subsystem in the probe station, used for collecting, OCR identifying and transmitting the original image of the wafer.

[0037] The wafer will have the batch name and the piece number printed on the wafer in the form of a steel number. The wafer to be measured is a wafer that needs to be identified by the probe station and tested by the tester after identification.

[0038] The original image of the wafer to be measured is an image containing the original main batch name and the piece number of the wafer to be measured.

[0039] The OCR identification is a character recognition software, which identifies the information on the wafer to be measured.

[0040] The original main batch name of the wafer to be measured is the batch name printed on the wafer to be measured in the form of a steel number.

[0041] It should be noted that in this embodiment, the execution body of the intercepting module and the output module of the probe station can be a chip, or the programs corresponding to the intercepting module and the output module of the probe station are embedded into the optical recognition system or the test system of the probe station, which is not limited herein.

[0042] Specifically, for example, the original main batch name of the wafer to be measured is A7513331, and the piece number information is No. 1 piece, then the steel number printed on the wafer is A7513331.1, and the original main batch name of the wafer to be measured after identification by the optical recognition system of the probe station is A7513331, and the original main batch name is sent to the test system of the probe station in the form of a data message for comparison.

[0043] S2, the intercepting module intercepts the original identification message and judges whether the original main batch name in the original identification message is consistent with the target main batch name of the wafer to be measured, if yes, the original identification message is modified into a modified identification message containing the target batch name of the wafer to be measured, and the modified identification message is sent to the test system of the probe station; wherein the target batch name includes the target main batch name and the target sub-batch name.

[0044] The intercepting module is provided with an intercepting program; the target batch name is obtained according to the user's batch splitting requirement, and the target batch name includes the target main batch name and the target sub-batch name; the target main batch name is the same as the original main batch name, and the target sub-batch name is set according to the user's requirement.

[0045] It should be noted that the interception module uses TCP / IP interception. There are various existing interception methods, including driver interception and application layer interception. However, this invention has a single purpose, so it adopts the method of directly injecting into the application to take over the send and receive functions of the application Ws2_32.dll module, thereby achieving the purpose of modifying the packets.

[0046] Specifically, such as Figure 2 As shown, when the original identification message is sent to the probe station's testing system, the interception module initiates an interception program to intercept the original identification message via the TCP / IP protocol. In the example above, the original master batch name of the wafer under test is A7513331. After batching, the target batch name of the wafer under test is A7513331.00 (where the target master batch name is A7513331 and the target sub-batch name is A7513331.00). The user requests testing using the target batch name and that the target batch name be written to the chip. Therefore, the user sends the target batch name, A7513331.00, to the interception module via the MES system. The interception program of the interception module should correctly obtain the target batch name as A7513331.00. Taking piece number 1 as an example, the steel grade is A7513331.1, where A7513331 is the original master batch name and 1 is the piece number. Without splitting the batch, both the original master batch name recognized by OCR and the manually entered batch name are A7513331. The OCR recognition function of the probe station optical recognition system can prevent manual input errors or incorrect batch assignment. However, the user now requires testing with the target batch name: A7513331.00, meaning the manually entered batch name must be A7513331.00. But the original master batch name recognized by OCR is A7513331, which will fail to match the manually entered A7513331.00, resulting in the inability to perform normal testing. In this embodiment, the interception module obtains the true target batch name for this test, namely A7513331.00. At this time, the original main batch name recognized by OCR is A7513331. The interception program needs to compare the original main batch name with the target main batch name. When the comparison is successful, the OCR recognition result is considered correct. After confirmation, the interception program modifies the original recognition message (i.e., changes the OCR recognition result to A7513331.00) and sends the modified recognition message to the probe station's testing system.

[0047] S3. The test system of the probe station receives the correction identification message and determines whether the target batch name corresponding to the correction identification message is consistent with the manually entered batch name of the wafer to be tested, and obtains the judgment result.

[0048] Specifically, when the target batch name corresponding to the modified identification message is the same as the manually entered batch name of the wafer to be tested, the output module is called for subsequent processing. For example, the target batch name corresponding to the modified identification message is A7513331.00, and at this time, the manually entered batch name of the wafer to be tested is also A7513331.00. At this time, the target batch name is consistent with the manually entered batch name, and the output module is called for subsequent processing.

[0049] S4、When the judgment result is yes, the output module transmits the manually entered batch name to the test machine, so that the test machine tests the wafer to be tested.

[0050] Wherein, the test machine obtains the manually entered batch name from the probe station, the present application ensures that the manually entered batch name matches the wafer steel number information, in short, it ensures that the batch name is correct, part of the product needs to write the batch name into the chip, all products will form a test log, and the log needs to contain the correct batch name.

[0051] It should be noted that the test machine and the probe station form a test combination, the test machine is a test logic processing center, the probe station cooperates with the test machine, is responsible for the conveying and positioning of the wafer, ensures that a more stable signal is conveyed from the wafer surface to the precision instrument, makes the crystal grains on the wafer contact the probe in turn and are tested one by one, and realizes more accurate data test measurement.

[0052] Preferably, before step S2, it further comprises:

[0053] The interception module receives the target batch name sent by the user.

[0054] Specifically, the user sends the target batch name to the interception module through the MES system.

[0055] Wherein, the MES system is a chip test process control system, which completes the control of the whole process of the wafer to be tested, such as entering the factory, testing, inspection, and leaving the factory, ensures that the wafer to be tested tested by the test machine and the probe station is the wafer to be tested by the MES system, and ensures that the wafer batch name is the batch name given by the user, the batch name should be reflected in the test report given to the user, and the manually entered batch name is written into the chip according to the demand.

[0056] Preferably, the target batch name is the batch name set by the user for the wafer to be tested.

[0057] Preferably, the original identification message and the modified identification message are expressed in hexadecimal form.

[0058] Specifically, taking the original main batch name A7513331 as an example, the original identification message is:

[0059] 00000001000000010000001D00000000000009030231376F31303030393030303030303030413735313333312E31443511; the message contains the steel number information and the check information, wherein the check code algorithm is the cumulative sum of the effective field, the original master batch name in the original identification message is: 41373531333331, converted into a string, that is, A7513331, and the check code is 4435. The corrected identification message is:

[0060] 00000001000000010000001D00000000000009030231376F31303030393030303030303030413735313333312E30302E31363311; the target batch name in the corrected identification message is A7513331.00, and therefore the identification result is A7513331.00.1, that is, the target batch name is A7513331.00, and the piece number is 1, which is completely consistent with the batch name manually entered, and meets the test conditions of the test machine.

[0061] The original identification message and the corrected identification message are in hexadecimal form.

[0062] It should be noted that the data message contains the identification content, and in order to ensure that no error occurs in the transmission process, a check mechanism is introduced, and the cumulative sum of the bytes of the transmission content is obtained, that is, the check code 4435.

[0063] Preferably, the probe station is a UF3000 probe station.

[0064] The UF3000 probe station is the current mainstream probe station.

[0065] The technical scheme of the embodiment of the present application utilizes the OCR identification function of the probe station to intercept and correct the identification message, achieves the purpose that the OCR identification result is consistent with the batch name manually entered while the wafer is split, so that the test machine can be normally tested, and the batch splitting requirements of different users are met.

[0066] As shown in Figure 3 The OCR identification result correction system 200 of the probe station of the embodiment of the present application includes: an optical identification system 210 of the probe station, an interception module 220, a test system 230 of the probe station, and an output module 240.

[0067] The optical recognition system 210 of the probe station is configured to perform OCR recognition on an original image of the wafer to be tested to obtain an original main batch name of the wafer to be tested, and send an original recognition message containing the original main batch name to the test system 230 of the probe station.

[0068] The intercepting module 220 is configured to intercept the original recognition message, and determine whether the original main batch name in the original recognition message is consistent with a target main batch name of the wafer to be tested, if yes, modify the original recognition message into a modified recognition message containing a target batch name of the wafer to be tested, and send the modified recognition message to the test system 230 of the probe station; wherein the target batch name includes the target main batch name and a target sub-batch name.

[0069] The test system 230 of the probe station is configured to receive the modified recognition message, and determine whether the target batch name corresponding to the modified recognition message is consistent with a manually entered batch name of the wafer to be tested, if yes, call the output module 240.

[0070] The output module 240 is configured to transmit the manually entered batch name to a test machine, so that the test machine tests the wafer to be tested.

[0071] Preferably, the intercepting module 220 is further configured to receive the target batch name sent by a user.

[0072] Preferably, the target batch name is a batch name set by the user for the wafer to be tested.

[0073] Preferably, the original recognition message and the modified recognition message are both expressed in hexadecimal form.

[0074] Preferably, the probe station is a probe station with a model number of UF3000.

[0075] The technical solution of the embodiment of the present application utilizes the OCR recognition function of the probe station to intercept and modify the recognition message, achieves the consistency of the OCR recognition result and the manually entered batch name while splitting the wafer, so that the test machine can normally test, and the batch splitting requirements of different users are met.

[0076] The above parameters and modules in the embodiment of the method for modifying the OCR recognition result of the probe station can refer to the parameters and steps in the above embodiment of the method for modifying the OCR recognition result of the probe station, and will not be repeated here.

[0077] The algorithms and displays presented herein are not inherently related to any particular computer, virtual system, or other apparatus. Furthermore, embodiments of the present application are not described with reference to any particular programming language. It is appreciated that a variety of programming languages can be used to implement the teachings of the application as described herein.

[0078] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been described in detail in order to avoid obscuring the understanding of this description. Also, the description is presented in terms of exemplary embodiments, which are provided as examples. It is to be understood that various aspects of the present application can be implemented in a variety of ways.

[0079] It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the application should, therefore, be determined not with reference to the above description, but instead with reference to the appended claims, along with their full scope of equivalents. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps other than those listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combination thereof. In a unitary or integrated claim, items such as multiple parts, clips, pins, magnets, electrical components, etc. can be presented as collections of items, chunks or as a part of a whole using "comprising" or "including" a plurality. Numerous individual components can be "implemented by" one and the same item or hardware. The implementation can be achieved by means of any future technology mimicking the present technology. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. The references in the specification to "one embodiment", "an embodiment", "exemplary embodiment", "one design", "an design" etc. indicate that the embodiment or design described can include a particular feature, structure, or characteristic, but every embodiment or design can not necessarily include the particular feature, structure, or characteristic.

Claims

1. A method for correcting the results of OCR recognition using a probe station, characterized in that, include: S1. The optical recognition system of the probe station performs OCR recognition on the original image of the wafer under test to obtain the original master batch name of the wafer under test, and sends the original recognition message containing the original master batch name to the test system of the probe station. S2. The interception module intercepts the original identification message and determines whether the original master batch name in the original identification message is consistent with the target master batch name of the wafer under test. If so, the original identification message is modified into a corrected identification message containing the target batch name of the wafer under test, and the corrected identification message is sent to the test system of the probe station; wherein, the target batch name includes: the target master batch name and the target sub-batch name; S3. The test system of the probe station receives the correction identification message and determines whether the target batch name corresponding to the correction identification message is consistent with the manually entered batch name of the wafer to be tested, and obtains the judgment result. S4. When the judgment result is yes, the output module transmits the manually entered batch name to the test machine so that the test machine can test the wafer to be tested. Before step S2, the following is also included: The interception module receives the target batch name sent by the user through the MES system; the target batch name is the batch name set by the user for the wafer to be tested.

2. The method for correcting the OCR recognition result of a probe station according to claim 1, characterized in that, Both the original identification message and the modified identification message are represented in hexadecimal form.

3. A method for correcting the OCR recognition result of a probe station according to claim 1 or 2, characterized in that, The probe station is a UF3000 probe station.

4. A system for correcting the results of OCR recognition using a probe station, characterized in that, include: The probe station includes an optical recognition system, an interception module, a testing system for the probe station, and an output module. The optical recognition system of the probe station is used to: perform OCR recognition on the original image of the wafer under test to obtain the original master batch name of the wafer under test, and send the original recognition message containing the original master batch name to the test system of the probe station. The interception module is used to: intercept the original identification message, and determine whether the original master batch name in the original identification message is consistent with the target master batch name of the wafer under test. If so, the original identification message is modified into a corrected identification message containing the target batch name of the wafer under test, and the corrected identification message is sent to the test system of the probe station; wherein, the target batch name includes: the target master batch name and the target sub-batch name; The testing system of the probe station is used to: receive the correction identification message, and determine whether the target batch name corresponding to the correction identification message is consistent with the manually entered batch name of the wafer to be tested, and obtain the judgment result; The output module is used to: when the judgment result is yes, transmit the manually entered batch name to the testing machine so that the testing machine can test the wafer to be tested; The interception module is also used to: receive the target batch name sent by the user through the MES system; the target batch name is: the batch name set by the user for the wafer to be tested.

5. The system for correcting OCR recognition results using a probe station according to claim 4, characterized in that, Both the original identification message and the modified identification message are represented in hexadecimal form.

6. A system for correcting OCR recognition results using a probe station according to claim 4 or 5, characterized in that, The probe station is a UF3000 probe station.

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