A new type of automated pressure oven for semiconductor packaging

Abstract

The present invention relates to the technical field of semiconductor processing ovens, and specifically discloses a new type of automated pressure oven for semiconductor packaging, comprising a box body, a three-color indicator light and a control panel arranged on the top of the box body, a nitrogen charging assembly arranged on the back of the box body, a sealing plate arranged on the front of the box body, a pressure cavity area arranged inside the box body, a heating assembly arranged inside the pressure cavity area, a hollow groove is opened on one side of the box body located in the pressure cavity area, an oven pressure door is installed on one side of the pressure cavity area located in the hollow groove, the oven pressure door is located in the hollow groove, and sliding assemblies are installed on both sides of the box body located in the interior of the hollow groove, the sliding assemblies are used to control the opening and closing of the oven pressure door, and the present application can utilize the pressure block on the oven pressure door to press the guide rod, so that the guide rod moves inward, thereby driving the valve core to move inward, and conveniently controlling the switch of the nitrogen charging tube.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing ovens, and more particularly to a new type of automated pressure oven for semiconductor packaging. Background Art

[0002] With the rapid development of the semiconductor industry, factories must not only ensure output volume but also quality assurance to better benefit the company's growth and development. The temperature changes of products inside the sealed oven must also be strictly controlled to facilitate product quality tracking.

[0003] For example, the utility model with publication number CN206806299U discloses a semiconductor chip curing device that can simultaneously perform plasma decontamination, including an oven for baking a substrate chip structure; the substrate chip structure includes a chip and a substrate, and the chip has been fixed to the substrate using silver glue; a plasma mixture liquid ejector is used to generate plasma in a plasma state and eject it into the oven; a vacuum device is located outside the oven and is used to extract the gas inside the oven so that impurities in the space inside the oven are absorbed; the plasma is mixed with oxygen, argon or nitrogen to form a plasma mixture liquid, which is used to chemically react with the solvent volatilized by the silver glue during baking to form a gaseous substance such as carbon or water, and bombard the oxide in the oven or on the substrate chip structure to form a gas, and then the vacuum device extracts the reacted solvent and gas to prevent these solvents from adhering to the substrate chip structure.

[0004] According to the above, in the above-mentioned prior art, when the oven is heating and curing, it is necessary to evacuate or fill it with nitrogen for protection. However, the existing exhaust or filling of protective gas generally requires a separate ventilation pipe to be set in the oven. This ventilation pipe can be used for inflation or exhaust, but half of the existing ventilation pipe is independently set, which is not convenient to control by opening and closing the door. Summary of the Invention

[0005] The present invention provides a new type of automated pressure oven for semiconductor packaging, which aims to solve the problem in the prior art that the oven needs to be evacuated or filled with nitrogen for protection during heating and curing. However, the existing extraction or filling of protective gas generally requires a separate ventilation pipe to be set in the oven. This ventilation pipe can be used for inflation or extraction, but half of the existing ventilation pipe is independently set, which is inconvenient to control by opening and closing the door.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions:

[0007] A new type of automated pressure oven for semiconductor packaging includes a box body, a three-color indicator light and a control panel are provided on the top of the box body, a nitrogen charging assembly is provided on the back of the box body, a sealing plate is provided on the front of the box body, a pressure cavity area is provided inside the box body, a heating assembly is provided inside the pressure cavity area, a hollow groove is provided on one side of the box body located in the pressure cavity area, an oven pressure door is installed on one side of the hollow groove of the pressure cavity area, the oven pressure door is located in the hollow groove, and sliding assemblies are installed on both sides of the box body located in the hollow groove, and the sliding assemblies are used to control the opening and closing of the oven pressure door.

[0008] As a preferred solution of the present invention, a reinforcing plate is provided on the inner side of the oven pressure door, a circle of annular convex ring is provided on the side of the reinforcing plate, an annular embedding groove is provided on the annular convex ring, a circle of rubber sealing ring is embedded in the annular embedding groove, a door groove is provided on one side of the hollow groove in the pressure cavity area, a circle of sealing groove is provided on the outer side of the door groove in the pressure cavity area, and the annular convex ring is embedded in the sealing groove when the oven pressure door is closed.

[0009] As a preferred solution of the present invention, the sliding assembly includes a cylinder fixedly mounted on the side wall of the hollow groove, the end of the piston rod of the cylinder is fixedly connected to a rack through a connecting piece, one side of the rack is meshedly connected to a gear, one side of the gear is fixedly connected to a connecting rod, the other end of the connecting rod is rotatably connected to the side of the oven pressure door via a rotating shaft, the side of the oven pressure door close to the cylinder is also rotatably connected to a first support rod and a second support rod, the other ends of the first support rod and the second support rod are rotatably connected to the side wall of the hollow groove;

[0010] The connecting piece is a U-shaped fork arm structure, and a plurality of fixing holes are opened on the connecting piece, and the rack is fixed on the U-shaped fork arm of the connecting piece.

[0011] As a preferred solution of the present invention, a guide sleeve is sleeved on the outer side of the rack, the guide sleeve is U-shaped, and the rack is slidably arranged in the guide sleeve.

[0012] As a preferred solution of the present invention, the other side of the oven pressure door is rotatably connected to a third support rod and a fourth support rod, and the other sides of the third support rod and the fourth support rod are rotatably connected to the side walls of the hollow groove.

[0013] As a preferred solution of the present invention, the inner tank structure of the pressure cavity area is a stainless steel structure, the heating component includes a heating tube arranged in a serpentine shape, the heating tube is provided with heating fins, and the heating tube is arranged on the back side wall of the pressure cavity area.

[0014] As a preferred solution of the present invention, the nitrogen charging assembly includes a nitrogen charging pipe that leads into the pressure chamber area, the other end of the nitrogen charging pipe is arranged through the side wall of the box, and a control valve assembly is installed on the nitrogen charging pipe.

[0015] As a preferred solution of the present invention, the control valve assembly includes a valve seat installed on the nitrogen filling pipe, a valve cavity is opened in the valve seat, a valve core is slidably arranged in the valve cavity, a guide rod is connected to one side of the valve core, a spring is sleeved on the guide rod, a limit block is provided on the guide rod, one end of the spring rests on the limit block, the other end of the spring rests on the valve seat, and the other end of the guide rod is slidably arranged on one side of the gate groove.

[0016] As a preferred solution of the present invention, a pressing block is provided on the inner side surface of the oven pressure door, and the pressing block presses the guide rod when the oven pressure door is closed, causing the guide rod to move.

[0017] As a preferred solution of the present invention, support blocks are evenly arranged on the inner side walls of the pressure chamber area, and the support blocks are arranged at intervals.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] (1) In order to make the oven pressure door more sealed when closing the pressure cavity area, a reinforcement plate is set on the side of the oven pressure door. The reinforcement plate can increase the thickness of the oven pressure door, and the annular convex ring set on the oven pressure door can be embedded in the sealing groove. A rubber sealing ring is set on the annular convex ring and is also embedded in the sealing groove to play a good sealing role. The cylinder can drive the movement of the piston rod, and the rack connected to the piston rod can drive the rotation of the gear. The rotation of the gear can drive the rotation of the connecting rod. The rotation of the connecting rod can pull the oven pressure door to move up and down. In addition, the first support rod, the second support rod, the third support rod and the fourth support rod are rotatably connected on both sides of the oven pressure door. The first support rod, the second support rod, the third support rod and the fourth support rod can play a role in supporting the oven pressure door.

[0020] (2) The present application controls the opening and closing of the oven pressure door through a cylinder. By arranging a control valve assembly on the nitrogen filling pipe, the valve core in the control valve assembly can control the inflation. When the valve core moves inward, the nitrogen filling pipe is opened, so that the external inflation pipe can be filled with nitrogen into the pressure cavity area through the nitrogen filling pipe. When the valve core moves outward, the nitrogen filling pipe is in a closed state, which plays a sealing role. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the three-dimensional structure of the present invention Figure 1 ;

[0022] Figure 2 Schematic diagram of the three-dimensional structure of the present invention Figure 2 ;

[0023] Figure 3 It is a side structural schematic diagram of the present invention;

[0024] Figure 4 It is a schematic diagram of the partial internal structure of the present invention;

[0025] Figure 5 It is a schematic diagram of a partial top view of the structure of the present invention;

[0026] Figure 6 Schematic diagram of the sliding assembly structure of the present invention Figure 1 ;

[0027] Figure 7 Schematic diagram of the sliding assembly structure of the present invention Figure 2 ;

[0028] Figure 8 It is a schematic diagram of the connecting member structure of the present invention;

[0029] Figure 9 It is a schematic structural diagram of the control valve assembly of the present invention.

[0030] Description of the numbers in the figure:

[0031] 1. Box; 2. Three-color indicator light; 3. Control panel; 4. Nitrogen charging assembly; 401. Nitrogen charging tube; 5. Sealing plate; 6. Pressure chamber area; 7. Heating assembly; 701. Heating tube; 702. Heating fin; 8. Hollow groove; 9. Oven pressure door; 901. Reinforcement plate; 902. Annular convex ring; 903. Annular embedded groove; 904. Rubber sealing ring; 905. Door groove; 906. Sealing groove; 10. Sliding assembly; 1001. Cylinder; 1002. Connector; 10 03. Rack; 1004. Gear; 1005. Connecting rod; 1006. Rotating shaft; 1007. First support rod; 1008. Second support rod; 1009. Guide sleeve; 1010. Third support rod; 1011. Fourth support rod; 1012. Fixing hole; 11. Control valve assembly; 1101. Valve seat; 1102. Valve chamber; 1103. Valve core; 1104. Guide rod; 1105. Spring; 1106. Limit block; 1107. Pressure block; 12. Support block. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention in specific circumstances.

[0035] Example:

[0036] See also Figure 1-3 A new type of automated pressure oven for semiconductor packaging includes a box body 1. A three-color indicator light 2 and a control panel 3 are provided on the top of the box body 1. The three-color indicator light 2 can be used to warn the status of the box body 1. The control panel 3 can be used to control the temperature inside the box body 1. A nitrogen filling component 4 is provided on the back of the box body 1. The nitrogen filling component 4 can fill nitrogen protective gas into the pressure cavity area 6, so that the semiconductor can play a protective role during the packaging and curing process. A sealing plate 5 is provided on the front of the box body 1. A pressure cavity area 6 is provided inside the box body 1. Support blocks 12 are evenly provided on the inner side walls of the pressure cavity area 6. The support blocks 12 are arranged at intervals, and the semiconductors can be placed in layers in the pressure cavity area 6. When in use, the semiconductor is placed in the pressure cavity area 6. A heating component 7 is provided inside the pressure cavity area 6. Then, the heating component 7 can heat the pressure cavity area 6 to quickly fix the semiconductor package.

[0037] At present, the semiconductor pressure ovens in the market are of the side-opening cavity type. When the automated factory is upgraded, the main disadvantage is that the pressure oven equipment has a side-opening door. When the equipment is upgraded to automation, it is necessary to design a side robotic arm, which is difficult to design, costly, and has a high risk of damage. The pressure oven door 9 needs to be opened twice on the side, first opening the oven outer door, and then opening the pressure cavity door. The labor intensity is high, and opening the door twice takes up a lot of workshop space.

[0038] A hollow groove 8 is provided on one side of the pressure cavity area 6 of the box body 1, and an oven pressure door 9 is installed on one side of the hollow groove 8 of the pressure cavity area 6. The oven pressure door 9 is located in the hollow groove 8, and sliding components 10 are installed on both sides of the interior of the hollow groove 8 of the box body 1. The sliding components 10 are used to control the opening and closing of the oven pressure door 9.

[0039] In the present application, the box body 1 is hollowed out from the top with a slot 8, and an upper and lower automatic control arm can be used to automate the equipment. The overhead crane can be used to move the lifting equipment installed on the overhead crane to the hollow slot 8. The lifting equipment installed on the overhead crane can be installed with a control arm to automate the oven, reduce the difficulty of design, reduce the risk of damage, and reduce costs. After the hollow slot 8 is opened, the sliding component 10 can be used to control the opening and closing of the oven pressure door 9. Moreover, the opening and closing method of the oven pressure door 9 of the present application is to open and close from top to bottom, which greatly reduces the space occupied, thereby solving the problems of high labor intensity of manual door opening and the problem of occupying a lot of space.

[0040] See also Figure 3 A reinforcing plate 901 is provided on the inner side of the oven pressure door 9, and a circle of annular convex ring 902 is provided on the side of the reinforcing plate 901. An annular embedding groove 903 is provided on the annular convex ring 902, and a circle of rubber sealing ring 904 is embedded in the annular embedding groove 903. A door groove 905 is provided on one side of the hollow groove 8 of the pressure cavity area 6, and a circle of sealing groove 906 is provided on the outside of the door groove 905 of the pressure cavity area 6. The annular convex ring 902 is embedded in the sealing groove 906 when the oven pressure door 9 is closed.

[0041] In order to make the oven pressure door 9 more sealed when closing the pressure cavity area 6, a reinforcing plate 901 is provided on the side of the oven pressure door 9. The reinforcing plate 901 can increase the thickness of the oven pressure door 9, and the annular convex ring 902 provided on the oven pressure door 9 can be embedded in the sealing groove 906. A rubber sealing ring 904 is provided on the annular convex ring 902, which is also embedded in the sealing groove 906, and can play a good sealing role.

[0042] See also Figure 6-8The sliding assembly 10 includes a cylinder 1001 fixedly mounted on the side wall of the hollow groove 8, and the end of the piston rod of the cylinder 1001 is fixedly connected to a rack 1003 through a connecting piece 1002, and one side of the rack 1003 is meshed with a gear 1004, and one side of the gear 1004 is fixedly connected to a connecting rod 1005, and the other end of the connecting rod 1005 is rotatably connected to the side of the oven pressure door 9 through a rotating shaft 1006. The side of the oven pressure door 9 close to the cylinder 1001 is also rotatably connected to a first support rod 1007 and a second support rod 1008, and the other ends of the first support rod 1007 and the second support rod 1008 are rotatably connected to the side wall of the hollow groove 8, and the other side of the oven pressure door 9 is rotatably connected to a third support rod 1010 and a fourth support rod 1011, and the other sides of the third support rod 1010 and the fourth support rod 1011 are rotatably connected to the side wall of the hollow groove 8.

[0043] When the oven pressure door 9 needs to be opened or closed, it is only necessary to control the operation of the cylinder 1001 through the solenoid valve (not shown in the figure). During specific implementation, the cylinder 1001 can drive the movement of the piston rod, and the rack 1003 connected to the piston rod can drive the rotation of the gear 1004. The rotation of the gear 1004 can drive the rotation of the connecting rod 1005. The rotation of the connecting rod 1005 can pull the oven pressure door 9 to move up and down, and the first support rod 1007, the second support rod 1008, the third support rod 1010 and the fourth support rod 1011 are also rotatably connected on both sides of the oven pressure door 9. The first support rod 1007, the second support rod 1008, the third support rod 1010 and the fourth support rod 1011 can support the oven pressure door 9. The present application controls the opening and closing of the oven pressure door 9 through the cylinder 1001, which can realize automatic control.

[0044] The connecting member 1002 is a U-shaped fork arm structure, and a plurality of fixing holes 1012 are opened on the connecting member 1002 , and the rack 1003 is fixed on the U-shaped fork arm of the connecting member 1002 .

[0045] By setting the U-shaped fork arm structure connector 1002, the rack 1003 can be installed in the fixing holes 1012 at different positions, which makes it easy to adjust the position of the rack 1003. Since the stroke of the cylinder 1001 is generally a fixed value, the oven pressure door 9 switch can be made more adaptable by adjusting the position of the rack 1003.

[0046] A guide sleeve 1009 is sleeved on the outer side of the rack 1003 . The guide sleeve 1009 is U-shaped, and the rack 1003 is slidably arranged in the guide sleeve 1009 .

[0047] The guide sleeve 1009 can be used to support the rack 1003 so that the rack 1003 can move along the guide sleeve 1009, and the guide sleeve 1009 plays a role of limiting.

[0048] See also Figure 4 and Figure 5 The inner tank structure of the pressure cavity area 6 is a stainless steel structure. The heating component 7 includes a heating tube 701 arranged in a serpentine shape. The heating tube 701 is provided with heating fins 702. The heating tube 701 is arranged on the back side wall of the pressure cavity area 6.

[0049] The heating tube 701 can heat the pressure chamber area 6. Since the heating tube 701 is arranged in a serpentine shape, the temperature is controlled more evenly during heating. In addition, heating fins 702 are arranged on the heating tube 701, and the heating fins 702 can also generate heat.

[0050] See also Figure 9 The nitrogen charging assembly 4 includes a nitrogen charging pipe 401 that passes into the pressure chamber area 6. The other end of the nitrogen charging pipe 401 is arranged through the side wall of the box body 1. A control valve assembly 11 is installed on the nitrogen charging pipe 401. The control valve assembly 11 includes a valve seat 1101 installed on the nitrogen charging pipe 401. A valve cavity 1102 is opened in the valve seat 1101. A valve core 1103 is slidably arranged in the valve cavity 1102. A guide rod 1104 is connected to one side of the valve core 1103. A spring 1105 is sleeved on the guide rod 1104. A limit block 1106 is provided on the guide rod 1104. One end of the spring 1105 is against the limit block 1106, and the other end of the spring 1105 is against the valve seat 1101. The other end of the guide rod 1104 is slidably arranged on one side of the door groove 905.

[0051] When the semiconductor in the oven is packaged, heated and cured, nitrogen needs to be filled in to protect the semiconductor. However, the existing inflation method generally places the semiconductor in the oven, closes the oven pressure door 9, and then fills in nitrogen. However, this inflation method is inefficient and inconvenient to control. The present application provides a control valve assembly 11 on the nitrogen filling pipe 401. The valve core 1103 in the control valve assembly 11 can control the inflation. When the valve core 1103 moves inward, the nitrogen filling pipe 401 is opened, so that the external inflation pipe can be filled with nitrogen into the pressure chamber area 6 through the nitrogen filling pipe 401. When the valve core 1103 moves outward, the nitrogen filling pipe 401 is in a closed state, which plays a sealing role.

[0052] A pressing block 1107 is provided on the inner side surface of the oven pressure door 9. When the oven pressure door 9 is closed, the pressing block 1107 presses the guide rod 1104 to move the guide rod 1104.

[0053] When the oven pressure door 9 is closed, the pressure block 1107 on the oven pressure door 9 can press the guide rod 1104, causing the guide rod 1104 to move inward, thereby driving the valve core 1103 to move inward, making it convenient to control the switch of the nitrogen filling tube 401. When the oven pressure door 9 is opened, the elastic force of the spring 1105 can move the valve core 1103 outward.

[0054] The working principle of this embodiment is as follows:

[0055] The semiconductor is placed in the pressure chamber area 6, and a heating component 7 is provided inside the pressure chamber area 6. Then, the pressure chamber area 6 can be heated by the heating component 7 to quickly fix the semiconductor package. In order to make the oven pressure door 9 more sealed when closing the pressure chamber area 6, a reinforcing plate 901 is provided on the side of the oven pressure door 9. The reinforcing plate 901 can increase the thickness of the oven pressure door 9, and the annular convex ring 902 provided on the oven pressure door 9 can be embedded in the sealing groove 906. A rubber sealing ring 904 is provided on the annular convex ring 902, which is also embedded in the sealing groove 906 to play a good sealing role. The cylinder 1001 can drive the movement of the piston rod, and the rack 1003 connected to the piston rod can drive the rotation of the gear 1004. The rotation of the gear 1004 can drive the rotation of the connecting rod 1005. The connecting rod 10 05 is rotated, which can pull the oven pressure door 9 to move up and down, and the first support rod 1007, the second support rod 1008, the third support rod 1010 and the fourth support rod 1011 are also rotatably connected on both sides of the oven pressure door 9. The first support rod 1007, the second support rod 1008, the third support rod 1010 and the fourth support rod 1011 can support the oven pressure door 9. The present application controls the opening and closing of the oven pressure door 9 through the cylinder 1001, and provides a control valve assembly 11 on the nitrogen filling pipe 401. The valve core 1103 in the control valve assembly 11 can control the inflation. When the valve core 1103 moves inward, the nitrogen filling pipe 401 is opened, so that the external inflation pipe can be filled with nitrogen into the pressure chamber area 6 through the nitrogen filling pipe 401. When the valve core 1103 moves outward, the nitrogen filling pipe 401 is in a closed state, which plays a sealing role.

[0056] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solutions and improved concepts of the present invention within the technical scope disclosed by the present invention, and these changes should be covered by the scope of protection of the present invention.

Claims

1. A novel automatic pressure oven for semiconductor packaging, comprising a box (1), a three-color indicator light (2) and a control panel (3) provided above the box (1), characterized in that: A nitrogen charging assembly (4) is provided on the back of the box (1), a sealing plate (5) is provided on the front of the box (1), a pressure cavity area (6) is provided inside the box (1), a heating assembly (7) is provided inside the pressure cavity area (6), a hollow groove (8) is provided on one side of the box (1) located at the pressure cavity area (6), the hollow groove (8) is located on the upper side of the box (1), and the pressure cavity area (6) is located on one side of the hollow groove (8). An oven pressure door (9) is installed, and the oven pressure door (9) is located in the hollow groove (8). The box body (1) is located inside the hollow groove (8) and is provided with sliding components (10) on both sides thereof. The sliding components (10) are used to control the opening and closing of the oven pressure door (9); the nitrogen filling component (4) includes a nitrogen filling pipe (401) that passes into the pressure cavity area (6), and the other end of the nitrogen filling pipe (401) is provided through the side wall of the box body (1). 1) is installed with a control valve assembly (11); the control valve assembly (11) includes a valve seat (1101) installed on the nitrogen filling pipe (401), a valve cavity (1102) is opened in the valve seat (1101), a valve core (1103) is slidably arranged in the valve cavity (1102), a guide rod (1104) is connected to one side of the valve core (1103), a spring (1105) is sleeved on the guide rod (1104), and a limit position is set on the guide rod (1104). Block (1106), one end of the spring (1105) abuts against the limit block (1106), the other end of the spring (1105) abuts against the valve seat (1101), and the other end of the guide rod (1104) is slidably arranged on one side of the door groove (905); a pressing block (1107) is provided on the inner side surface of the oven pressure door (9), and the pressing block (1107) presses the guide rod (1104) when the oven pressure door (9) is closed, so that the guide rod (1104) moves.

2. The novel automated pressure oven for semiconductor packaging according to claim 1, characterized in that: A reinforcing plate (901) is provided on the inner side of the oven pressure door (9), a ring-shaped convex ring (902) is provided on the side of the reinforcing plate (901), an annular embedding groove (903) is provided on the annular convex ring (902), a ring-shaped rubber sealing ring (904) is embedded in the annular embedding groove (903), a door groove (905) is provided on one side of the hollow groove (8) of the pressure cavity area (6), a sealing groove (906) is provided on the outer side of the door groove (905) of the pressure cavity area (6), and the annular convex ring (902) is embedded in the sealing groove (906) when the oven pressure door (9) is closed.

3. The novel automated pressure oven for semiconductor packaging according to claim 1, characterized in that: The sliding assembly (10) comprises a cylinder (1001) fixedly mounted on the side wall of the hollow groove (8); the piston rod end of the cylinder (1001) is fixedly connected to a rack (1003) via a connecting piece (1002); one side of the rack (1003) is meshedly connected to a gear (1004); one side of the gear (1004) is fixedly connected to a connecting rod (1005); the other end of the connecting rod (1005) is rotatably connected to the side of the oven pressure door (9) via a rotating shaft (1006); the side of the oven pressure door (9) close to the cylinder (1001) is also rotatably connected to a first support rod (1007) and a second support rod (1008); the other ends of the first support rod (1007) and the second support rod (1008) are rotatably connected to the side wall of the hollow groove (8); The connecting member (1002) is a U-shaped fork arm structure, and a plurality of fixing holes (1012) are provided on the connecting member (1002), and the rack (1003) is fixed on the U-shaped fork arm of the connecting member (1002).

4. The novel automated pressure oven for semiconductor packaging according to claim 3, characterized in that: The outer side of the rack (1003) is covered with a guide sleeve (1009), the guide sleeve (1009) is U-shaped, and the rack (1003) is slidably arranged in the guide sleeve (1009).

5. The novel automated pressure oven for semiconductor packaging according to claim 2, characterized in that: The other side of the oven pressure door (9) is rotatably connected to a third support rod (1010) and a fourth support rod (1011), and the other sides of the third support rod (1010) and the fourth support rod (1011) are rotatably connected to the side wall of the hollow groove (8).

6. The novel automated pressure oven for semiconductor packaging according to claim 1, characterized in that: The inner liner structure of the pressure cavity area (6) is a stainless steel structure. The heating component (7) includes a heating tube (701) arranged in a serpentine shape. The heating tube (701) is provided with a heating fin (702). The heating tube (701) is arranged on the back side wall of the pressure cavity area (6).

7. The novel automated pressure oven for semiconductor packaging according to claim 1, characterized in that: The inner side walls of the pressure cavity area (6) are evenly provided with support blocks (12), and the support blocks (12) are arranged at intervals.

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