Packaging structure of ultra-thin diode

Abstract

The application discloses a packaging structure of an ultrathin diode and belongs to the diode packaging field. The packaging structure of the ultrathin diode comprises a shell, a base is arranged below the shell, a mounting groove one is arranged on the top of the base, a diode main body is arranged in the mounting groove one, a plurality of pins are linearly and equidistantly arranged on the front surface of the diode main body, a protective sleeve is arranged on the outer wall of the pin, a protection mechanism is arranged on the outer wall of the pin, a plurality of side plates are arranged in front of the base, two fixing mechanisms are arranged on the inner wall of the mounting groove one in a left-right symmetrical structure, two mounting grooves two are arranged on the inner wall of the base in a front-rear symmetrical structure, a clamping mechanism is arranged on the inner wall of the mounting groove two, two clamping grooves are arranged on the two sides of the shell in a front-rear symmetrical structure, a sliding groove is arranged on the inner wall top of the clamping groove, the design can protect the pins, avoid the pins from being inclined, and avoid the remaining part of the pin from being exposed to the outside to be oxidized.

Description

Technical Field

[0001] This invention relates to the field of diode packaging, and more specifically, to a packaging structure for an ultrathin diode. Background Technology

[0002] A diode is an electronic device made of semiconductor materials. It has unidirectional conductivity, meaning that the diode conducts when a forward voltage is applied to its anode. It is mainly composed of a PN junction, corresponding electrode leads, and a casing. When a reverse voltage is applied to the anode and cathode, the diode is cut off. Therefore, the conduction and cutoff of a diode are equivalent to the on and off states of a switch. Diodes are one of the earliest semiconductor devices and have a wide range of applications, especially in various electronic circuits. By using diodes in conjunction with resistors, capacitors, inductors, and other components, circuits with different functions can be constructed. These circuits can perform various functions such as AC rectification, modulation signal detection, limiting and clamping, and voltage regulation. Diodes are mainly classified into point-contact diodes, surface-contact diodes, planar diodes, Zener diodes, photodiodes, and light-emitting diodes.

[0003] Existing ultrathin diodes are mainly packaged in plastic shells, leaving the diode leads exposed. Due to the relatively long lead length, the leads are prone to misalignment during transportation, leading to improper diode installation.

[0004] In view of this, we propose an ultrathin diode packaging structure. Summary of the Invention

[0005] 1. Technical problems to be solved

[0006] The purpose of this invention is to provide a packaging structure for an ultrathin diode to solve the problems mentioned in the background art.

[0007] 2. Technical Solution

[0008] An ultrathin diode packaging structure includes a housing, a base at the bottom of the housing, a mounting groove at the top of the base, a diode body placed inside the mounting groove, multiple pins linearly and equally spaced on the front of the diode body, protective sleeves and protective mechanisms fitted on the outer walls of the pins, multiple side plates at the front of the base, two fixing mechanisms symmetrically arranged on the inner wall of the mounting groove, two mounting grooves symmetrically arranged on both sides of the inner wall of the base, a snap-fit ​​mechanism fixed on the inner wall of the mounting grooves, two snap-fit ​​slots symmetrically arranged on both sides of the housing, a sliding groove at the top of the inner wall of the snap-fit ​​slot, and a pressure plate slidably connected to the inner wall of the sliding groove.

[0009] Preferably, the protective sleeve is connected and fixed to the base.

[0010] Preferably, the protective mechanism includes a telescopic sleeve, and a fixing plate is fixedly provided on the outer wall of the telescopic sleeve on both sides. A sliding rod is fixedly provided on the back of the fixing plate. A spring is sleeved on the outer circumference of the sliding rod, and an mounting plate is slidably connected to the outer circumference of the sliding rod.

[0011] Preferably, one end of the spring is connected and fixed to the fixing plate, the other end of the spring is connected and fixed to the mounting plate, the slide rod is slidably connected to the inner wall of the housing, the mounting plate is connected and fixed to the protective sleeve, the telescopic sleeve is connected and fixed to the side plate, and the telescopic sleeve is connected and fixed to the protective sleeve.

[0012] Preferably, the fixing mechanism includes a clamping plate, a limiting block is fixedly provided on the top of the inner side of the clamping plate, a rubber pad is fixedly provided on the inner side of the clamping plate, a hinge seat is fixedly provided on the outer side of the clamping plate, a connecting arm is rotatably connected to the inner wall of the hinge seat, a connecting rod is fixedly provided on the inner wall of the connecting arm, a spring is sleeved on the outer circumference of the connecting rod, and a fixing rod is slidably connected to the outer circumference of the connecting rod.

[0013] Preferably, one end of the second spring is fixedly connected to the connecting arm, the other end of the second spring is fixedly connected to the fixing rod, the fixing rod is fixedly connected to the inner wall of the mounting groove, the clamp is rotatably connected to the inner wall of the mounting groove, and the rubber pad is in frictional contact with the diode body.

[0014] Preferably, the locking mechanism includes a connecting block, and an elastic locking block is fixed at the bottom of the connecting block.

[0015] Preferably, the elastic locking block engages with the locking slot, and the connecting block is fixedly connected to the inner wall of the mounting groove.

[0016] 3. Beneficial effects

[0017] Compared with the prior art, the advantages of this invention are:

[0018] 1. By inserting the pins into the sockets on the circuit board, multiple telescopic sleeves slide upwards along the pins through compression. As the telescopic sleeves slide, the fixing plate drives the sliding rod to slide along the mounting plate into the housing, while simultaneously compressing the first spring. The soldering iron can then be used to solder the pins onto the circuit board. Under the elastic force of the first spring, the telescopic sleeves will fit against the circuit board. This design can protect the pins, prevent them from becoming misaligned, and prevent the remaining parts of the pins from being exposed and thus oxidized.

[0019] 2. By placing the diode body inside mounting slot one, the clamps are moved to both sides, causing them to rotate and open. When the clamps rotate, the connecting arm moves upward through the hinge. As the connecting arm moves, the connecting rod slides upward along the fixed rod, thereby compressing the second spring. By pressing the diode body downward, the diode body compresses the rubber pads on the two clamps. At this time, the two clamps close together, thus compressing and fixing the diode body. This design facilitates the installation of the diode body. At the same time, under the elastic force of the second spring, the connecting arm pushes against the clamps, increasing the friction between the rubber pads and the diode body.

[0020] 3. By pressing down on multiple pressure plates, the pressure plates slide along the inner wall of the groove, thereby applying pressure to the elastic block inside the slot, causing the elastic block to disengage from the slot; this design facilitates the installation and disassembly of the housing and base, thus enabling the maintenance of the diode body. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the disassembled structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the protective mechanism of the present invention;

[0024] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0025] Figure 5 This is a partial disassembled structural diagram of the base of the present invention;

[0026] Figure 6 For the present invention Figure 5 Enlarged view of point B in the middle;

[0027] Figure 7 This is a cross-sectional view of the connecting arm of the present invention;

[0028] Figure 8 This is a schematic diagram of a partially disassembled structure of the housing of the present invention.

[0029] The following are the labeling instructions in the diagram: 1. Housing; 2. Base; 3. Mounting slot one; 4. Diode body; 5. Pin; 6. Protective sleeve; 7. Protective mechanism; 701. Telescopic sleeve; 702. Fixing plate; 703. Slide rod; 704. Spring one; 705. Mounting plate; 8. Side plate; 9. Fixing mechanism; 91. Clamping plate; 92. Limiting block; 93. Rubber pad; 94. Hinge seat; 95. Connecting arm; 96. Connecting rod; 97. Spring two; 98. Fixing rod; 10. Mounting slot two; 11. Snap-fit ​​mechanism; 111. Connecting block; 112. Elastic snap-fit ​​block; 12. Slot; 13. Slide groove; 14. Pressure plate. Detailed Implementation

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0031] In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] Please see Figure 1-8 The present invention provides a technical solution:

[0033] An ultrathin diode packaging structure includes a housing 1, a base 2 below the housing 1, and a mounting groove 3 on the top of the base 2. A diode body 4 is placed inside the mounting groove 3. Multiple pins 5, also called leads, are linearly and equally spaced on the front of the diode body 4; these pins are the wiring leads from the internal circuitry of the integrated circuit to the external circuitry. A protective sleeve 6 is fitted over the outer wall of each pin 5, located at the end of the pin, with its inner wall fitting snugly against the surface of the pin 5 to prevent breakage at the connection point with the diode body 4. A protective mechanism 7 is fitted over the outer wall of each pin 5. Multiple side plates 8 are located at the front of the base 2. The inner wall of the mounting groove 3 has a symmetrical structure. Two fixing mechanisms 9 and two mounting slots 10 are symmetrically arranged on both sides of the inner wall of the base 2. The inner wall of the mounting slots 10 is fixed with a snap-fit ​​mechanism 11. Two slots 12 are symmetrically arranged on both sides of the housing 1. The top of the inner wall of the slot 12 is provided with a sliding groove 13. The inner wall of the sliding groove 13 is slidably connected with a pressure plate 14. By pressing down on the multiple pressure plates 14, the pressure plates 14 slide along the inner wall of the sliding groove 13, thereby applying pressure to the elastic locking block 112 inside the slot 12, so that the elastic locking block 112 can be disengaged from the slot 12. This design facilitates the installation and disassembly of the housing 1 and the base 2, thereby allowing for the maintenance of the diode body 4.

[0034] Specifically, the protective cover 6 is connected and fixed to the base 2.

[0035] Furthermore, the protection mechanism 7 includes a telescopic sleeve 701. A fixing plate 702 is fixed to the outer wall of each telescopic sleeve 701 on both sides. A slide rod 703 is fixed to the back of the fixing plate 702. A spring 704 is fitted onto the outer circumference of the slide rod 703. A mounting plate 705 is slidably connected to the outer circumference of the slide rod 703. By inserting the pin 5 into the socket on the circuit board, multiple telescopic sleeves 701 slide upwards along the pin 5 through compression. When the telescopic sleeves 701 slide, the fixing plate 702 drives the slide rod 703 to slide along the mounting plate 705 into the housing 1, simultaneously compressing the spring 704. The pin 5 can then be soldered onto the circuit board using a soldering iron. Under the elastic force of the spring 704, the telescopic sleeves 701 adhere to the circuit board. This design protects the pin 5, preventing it from becoming misaligned and avoiding the remaining portion of the pin 5 being exposed and oxidized.

[0036] Furthermore, one end of spring 704 is connected and fixed to fixed plate 702, and the other end of spring 704 is connected and fixed to mounting plate 705. Sliding rod 703 is slidably connected to the inner wall of housing 1. Mounting plate 705 is connected and fixed to protective sleeve 6. Telescopic sleeve 701 is connected and fixed to side plate 8. Telescopic sleeve 701 is connected and fixed to protective sleeve 6.

[0037] Furthermore, the fixing mechanism 9 includes a clamping plate 91, a limiting block 92 fixedly mounted on the top of the inner side of the clamping plate 91, and a rubber pad 93 fixedly mounted on the inner side of the clamping plate 91. The rubber pad 93 is made of chlorinated butyl rubber, which has all the inherent properties of butyl rubber, and also has a series of advantages such as fast vulcanization speed, co-vulcanization with other rubbers, and better heat resistance. A hinge seat 94 is fixedly mounted on the outer side of the clamping plate 91. A connecting arm 95 is rotatably connected to the inner wall of the hinge seat 94. A connecting rod 96 is fixedly mounted on the inner wall of the connecting arm 95. A spring 97 is sleeved on the outer circumference of the connecting rod 96. A fixing rod 98 is slidably connected to the outer circumference of the connecting rod 96. By placing the diode body 4 inside the mounting groove 3, and by moving it to both sides... By moving the clamping plates 91, the two clamping plates 91 rotate and open. When the clamping plates 91 rotate, the connecting arm 95 moves upward through the hinge 94. When the connecting arm 95 moves, it causes the connecting rod 96 to slide upward along the fixed rod 98, thereby compressing the second spring 97. By compressing the diode body 4 downward, the diode body 4 compresses the rubber pad 93 on the two clamping plates 91. At this time, the two clamping plates 91 close together, thereby compressing and fixing the diode body 4. This design facilitates the installation of the diode body 4. At the same time, under the elastic force of the second spring 97, the connecting arm 95 pushes the clamping plates 91, increasing the friction between the rubber pad 93 and the diode body 4.

[0038] It is worth noting that one end of spring 2 97 is connected and fixed to connecting arm 95, and the other end of spring 2 97 is connected and fixed to fixing rod 98. Fixing rod 98 is connected and fixed to the inner wall of mounting groove 1 3. Clamping plate 91 is rotatably connected to the inner wall of mounting groove 1 3. Rubber pad 93 is in frictional contact with diode body 4. Moving groove is opened on the surface of fixing rod 98 to cooperate with the sliding and moving of connecting rod 96.

[0039] It is worth noting that the snap-fit ​​mechanism 11 includes a connecting block 111, and an elastic snap-fit ​​block 112 is fixed at the bottom of the connecting block 111. The elastic snap-fit ​​block 112 is made of plastic and has a certain degree of hardness and elasticity.

[0040] In addition, the elastic locking block 112 engages with the locking slot 12, and the connecting block 111 is connected and fixed to the inner wall of the mounting groove 10.

[0041] Working principle: First, by placing the diode body 4 inside the mounting slot 3, the clamping plates 91 are rotated and opened by moving them to both sides. When the clamping plates 91 rotate, the connecting arm 95 moves upward through the hinge 94. When the connecting arm 95 moves, it causes the connecting rod 96 to slide upward along the fixed rod 98, thereby compressing the spring 97. By pressing the diode body 4 downward, the diode body 4 compresses the rubber pads 93 on the two clamping plates 91. At this time, the two clamping plates 91 close together, thereby compressing and fixing the diode body 4. At the same time, under the elastic force of the spring 97, the connecting arm 95 pushes the clamping plate 91, increasing the friction between the rubber pad 93 and the diode body 4. Finally, by fastening the housing 1 onto the base 2, the housing 1 is compressed and slides towards the inner wall of the base 2, thus pressing against multiple mounting slots. The elastic block 112 inside the second 10 is squeezed until it is inserted into the slot 12, thus fixing the housing 1 and the base 2 together. During disassembly, simply press down on multiple pressure plates 14 to make them slide along the inner wall of the slide groove 13, thereby applying pressure to the elastic block 112 inside the slot 12 and causing it to disengage from the slot 12. During use, insert the pin 5 into the socket on the circuit board, and squeeze to make multiple telescopic sleeves 701 slide upward along the pin 5. When the telescopic sleeves 701 slide, the fixing plate 702 will drive the slide rod 703 to slide along the mounting plate 705 into the housing 1, while squeezing the spring 704. The soldering iron can then be used to solder the pin 5 to the circuit board. Under the elastic force of the spring 704, the telescopic sleeves 701 will fit against the circuit board, preventing the remaining part of the pin 5 from being exposed and oxidized.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for an ultrathin diode, comprising a housing (1), characterized in that: The housing (1) is provided with a base (2) below it. The top of the base (2) is provided with a mounting groove (3). The diode body (4) is placed inside the mounting groove (3). Multiple pins (5) are fixedly arranged linearly and equally spaced on the front of the diode body (4). A protective sleeve (6) is fitted on the outer wall of the pins (5). A protective mechanism (7) is fitted on the outer wall of the pins (5). Multiple side plates (8) are provided in front of the base (2). The inner wall of the mounting groove (3) is provided with two fixing mechanisms (9) in a left-right symmetrical structure. The fixing mechanism (9) includes a clamp (91). A limiting block (92) is fixedly arranged on the top of the inner side of the clamp (91). A rubber pad (93) is fixedly arranged on the inner side of the clamp (91). A hinge seat (94) is fixedly arranged on the outer side of the clamp (91). A connecting arm (95) is rotatably connected to the inner wall of the hinge seat (94). A connecting rod is fixedly arranged on the inner wall of the connecting arm (95). (96), the outer wall of the connecting rod (96) is fitted with a second spring (97), the outer wall of the connecting rod (96) is slidably connected with a fixed rod (98), one end of the second spring (97) is connected and fixed to the connecting arm (95), the other end of the second spring (97) is connected and fixed to the fixed rod (98), the fixed rod (98) is connected and fixed to the inner wall of the first mounting groove (3), the clamp (91) is rotatably connected to the inner wall of the first mounting groove (3), the rubber pad (93) is in frictional contact with the diode body (4), the inner wall of the base (2) has two mounting grooves (10) with a front-to-back symmetrical structure on both sides, the inner wall of the second mounting groove (10) is fixed with a snap-fit ​​mechanism (11), the two sides of the housing (1) have two snap-fit ​​slots (12) with a front-to-back symmetrical structure on both sides, the top of the inner wall of the snap-fit ​​slot (12) is provided with a sliding groove (13), the inner wall of the sliding groove (13) is slidably connected with a pressure plate (14).

2. The packaging structure of the ultrathin diode according to claim 1, characterized in that: The protective sleeve (6) is connected and fixed to the base (2).

3. The packaging structure of the ultrathin diode according to claim 1, characterized in that: The protective mechanism (7) includes a telescopic sleeve (701), and a fixing plate (702) is fixedly provided on the outer wall of the telescopic sleeve (701) on both sides. A slide rod (703) is fixedly provided on the back of the fixing plate (702). A spring (704) is sleeved on the outer circumference of the slide rod (703), and an mounting plate (705) is slidably connected to the outer circumference of the slide rod (703).

4. The packaging structure of the ultrathin diode according to claim 3, characterized in that: One end of the spring (704) is connected and fixed to the fixing plate (702), and the other end of the spring (704) is connected and fixed to the mounting plate (705). The slide rod (703) is slidably connected to the inner wall of the housing (1). The mounting plate (705) is connected and fixed to the protective sleeve (6). The telescopic sleeve (701) is connected and fixed to the side plate (8). The telescopic sleeve (701) is connected and fixed to the protective sleeve (6).

5. The packaging structure of the ultrathin diode according to claim 1, characterized in that: The latching mechanism (11) includes a connecting block (111), and an elastic latching block (112) is fixed at the bottom of the connecting block (111).

6. The packaging structure of the ultrathin diode according to claim 5, characterized in that: The elastic locking block (112) engages with the locking groove (12), and the connecting block (111) is fixedly connected to the inner wall of the mounting groove (10).

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