Electronic device

Abstract

The electronic device is disclosed. The middle frame assembly comprises a middle frame body and a vapor chamber, the middle frame body comprises a first surface; the vapor chamber comprises a first heat dissipation piece, a second heat dissipation piece and a third heat dissipation piece, the first heat dissipation piece is fixedly arranged on the first surface, and the first heat dissipation piece is provided with a heat source mounting portion facing the second heat dissipation piece; the second heat dissipation piece is connected with the first heat dissipation piece through the third heat dissipation piece, and the second heat dissipation piece can be arranged in a spaced-apart manner with the first heat dissipation piece to form a heat dissipation space. The electronic device can improve the heat dissipation efficiency to avoid the occurrence of local overheating of the electronic device.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronics, and in particular, to an electronic device. BACKGROUND

[0002] At present, electronic devices such as mobile phones, tablets, wearable devices, ranging devices, and scanning devices have become indispensable technological products in people's life, learning, and entertainment processes. With the development of electronic devices, the number of cores of CPUs (Central Processing Units) used by the electronic devices increases, and the performance of the CPUs is increasingly enhanced, resulting in that the heat generated by the electronic devices is increasingly large. In recent years, temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0003] However, in the related application electronic device heat dissipation technical solutions, there is still a problem of not timely heat dissipation, which leads to local overheating of the electronic device. SUMMARY

[0004] The present disclosure provides an electronic device that can improve heat dissipation efficiency to avoid local overheating of the electronic device.

[0005] The technical scheme is as follows:

[0006] According to a first aspect of an embodiment of the present disclosure, an electronic device is provided, which includes a heat source module and a middle frame assembly. The middle frame assembly includes a middle frame body and a vapor chamber. The middle frame body includes a first surface. The vapor chamber includes a first heat dissipation piece, a second heat dissipation piece, and a third heat dissipation piece, the first heat dissipation piece is fixed to the first surface, and the first heat dissipation piece is provided with a heat source mounting portion facing the second heat dissipation piece, at least part of the third heat dissipation piece has flexibility, the second heat dissipation piece is connected to the first heat dissipation piece through the third heat dissipation piece, and the second heat dissipation piece can be arranged to be spaced apart from the first heat dissipation piece to form a heat dissipation space. The heat source module is fixed to the first heat dissipation piece through the heat source mounting portion. The middle frame assembly further includes a heat dissipation device, the heat dissipation device is arranged outside the heat dissipation space, and is used for actively dissipating heat from the second heat dissipation piece. The heat dissipation device includes a heat dissipation fan and a semiconductor refrigeration piece, the semiconductor refrigeration piece includes a heat dissipation portion and a heat absorption portion in thermal conduction cooperation with the second heat dissipation piece, and the heat dissipation fan is arranged towards the heat dissipation portion.

[0007] The electronic device further includes a protective cover cooperating with the middle frame to form a protective space, the heat source module is arranged in the protective space, and the heat dissipation fan is detachably arranged on the protective cover. The protective cover is provided with an air hole communicating with the protective space. When the electronic device can meet the heat dissipation demand by using the semiconductor refrigeration piece, the heat dissipation fan is separated from the protective cover. When the semiconductor refrigeration piece cannot meet the heat dissipation demand, the heat dissipation fan is externally connected to an external power supply and is installed into the electronic device through the protective cover to send external air into the electronic device through the air hole.

[0008] The technical scheme provided by the embodiment of the present disclosure can include the following beneficial effects:

[0009] The third heat dissipation member is used to bend the vapor chamber to form the first heat dissipation member and the second heat dissipation member which are oppositely arranged to form a heat dissipation space, and the first heat dissipation member is arranged on the middle frame body, so that the heat dissipation efficiency of the middle frame body can be improved. When the middle frame assembly is applied to an electronic device, the heat source module can be fixed in the heat dissipation space through the heat source mounting part, and then the first heat dissipation member, the second heat dissipation member and the third heat dissipation member can be fully utilized to dissipate heat of the heat source module, so that the electronic device has high heat dissipation efficiency, and the local overheating phenomenon of the heat source module can be avoided, thereby the operation stability of the electronic device can be ensured.

[0010] When the electronic device of the present disclosure is used, the heat source module is fixed in the heat dissipation space, the first heat dissipation member, the second heat dissipation member and the third heat dissipation member can be fully utilized to dissipate heat of the heat source module, so that the electronic device of the present disclosure has high heat dissipation efficiency, and the local overheating phenomenon of the heat source module can be avoided, thereby the operation stability and reliability can be improved. In addition, the first heat dissipation member is arranged on the middle frame body, the area of the middle frame body can be fully utilized for heat dissipation, and the heat dissipation efficiency can be further improved.

[0011] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0012] The accompanying drawings, which are part of the present disclosure, are used to provide a further understanding of the present disclosure, and the illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure, and do not constitute an improper limitation on the present disclosure.

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description can only be some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0014] Figure 1 It is a structural schematic diagram of a mobile terminal shown in an embodiment.

[0015] Figure 2 It is a structural schematic diagram of a mobile terminal shown in an embodiment. Figure 1 It is a partial structural explosion schematic diagram of a mobile terminal shown in an embodiment.

[0016] Figure 3 It is a structural front view schematic diagram of a middle frame assembly shown in an embodiment. Figure 2

[0017] It is a structural front view schematic diagram of a middle frame assembly shown in an embodiment. Figure 4 Figure 3 ​A side view schematic diagram of the middle frame assembly shown.

[0018] Figure 5 A side view schematic diagram of the middle frame assembly shown for another embodiment.

[0019] Figure 6 A partial sectional view schematic diagram of the middle frame assembly shown for another embodiment.

[0020] Figure 7 A partial sectional view schematic diagram of the middle frame assembly shown for another embodiment.

[0021] Figure 8 A top view schematic diagram of the passive heat dissipation structure shown for an embodiment.

[0022] Figure 9 A Figure 2 A structure rear view schematic diagram of the middle frame assembly shown.

[0023] Figure 10 A Figure 9 A structure exploded schematic diagram of the middle frame assembly shown.

[0024] Figure 11 A Figure 10 A partial structure schematic diagram of the middle frame assembly shown.

[0025] Figure 12 A Figure 11 An enlarged schematic diagram of A shown.

[0026] Figure 13 A Figure 11 A heat dissipation state schematic diagram of the middle frame assembly shown.

[0027] Figure 14 A Figure 13 An enlarged schematic diagram of B shown.

[0028] Figure 15 A Figure 9 A structure schematic diagram of another embodiment of the middle frame assembly shown.

[0029] Figure 16 A partial structure schematic diagram of the middle frame assembly shown for another embodiment.

[0030] BRIEF DESCRIPTION OF THE DRAWINGS

[0031] 10, middle frame assembly; 100, middle frame body; 101, first surface; 102, second surface; 110, cooling part; 120, battery mounting part; 130, loop pipe groove; 140, mounting groove; 200, vapor chamber; 210, heat source mounting part; 220, first heat dissipation part; 230, second heat dissipation part; 240, third heat dissipation part; 250, heat dissipation space; 260, heat conduction layer; 300, heat dissipation device; 310, heat dissipation fan; 320, passive heat dissipation structure; 321, heat conduction body; 322, heat dissipation fin; 330, semiconductor refrigeration device; 400, loop heat pipe; 410, evaporator; 411, liquid supplementing end; 412, gas outlet end; 413, evaporation part; 414, liquid storage cavity; 420, pipeline unit; 421, first conveying pipe; 422, second conveying pipe; 423, condensing pipe; 424, liquid supplementing branch; 425, gas outlet branch; 430, anti-backflow structure; 432, Tesla valve structure; 500, working fluid; 600, sealing cover; 700, heat conduction adhesive layer; 20, heat source module; 21, circuit board; 22, heat source component; 30, protective cover; 31, air vent. DETAILED DESCRIPTION

[0032] In order to make the objects, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and do not limit the protection scope of the present disclosure.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the present disclosure herein is only for the purpose of describing specific embodiments and is not intended to limit the present disclosure.

[0034] For the convenience of understanding, the technical terms involved in the embodiments of the present disclosure will be explained and described below.

[0035] Vapor chamber (VC for short in English), a vacuum cavity with microstructure, has good heat dissipation function, its material includes but is not limited to copper, stainless steel, titanium alloy, etc.

[0036] The heat dissipation fan includes a micro-turbine fan or an axial flow fan, etc.

[0037] Thermal Electric Cooler (TEL for short in English), also known as Peltier refrigeration device.

[0038] Thermal interface material (TEL) has good thermal conductivity, and its specific implementation includes but is not limited to thermal silicone grease, thermal adhesive, thermal pad, etc.

[0039] Loop heat pipe (LHP) is a closed loop heat pipe with good heat dissipation function.

[0040] Passive heat dissipation structure, passive heat dissipation component, has a sheet-shaped heat dissipation tooth.

[0041] Resistor-capacitor element, a general term for resistor and capacitor elements.

[0042] At present, mobile phones, tablets, wearable devices, ranging devices, scanning devices and other electronic devices have become essential technology products in people's life, learning and entertainment process. With the development of electronic devices, the number of cores of CPU (Central Processing Unit, Central Processing Unit) used by the electronic devices increases, and the performance of the electronic devices is increasingly enhanced, resulting in increasing heat generation of the electronic devices, which poses higher and higher challenges to the heat dissipation performance of the electronic devices. In particular, in recent years, temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices. At the same time, the better the heat dissipation performance, the more balanced the heat dissipation, the more likely consumers will purchase, so improving the heat dissipation efficiency of the electronic devices and avoiding local overheating has become a problem that the industry pays more and more attention to.

[0043] However, in the related application electronic device heat dissipation technical solutions, the heat dissipation is not timely, and the heat dissipation efficiency is difficult to improve. The heat dissipation is not timely, which will cause local overheating of the electronic device, which will affect the operation performance of the electronic device, and even cause the phenomenon of death.

[0044] Therefore, the present disclosure provides a middle frame assembly which can improve the heat dissipation efficiency and avoid the occurrence of local overheating phenomenon, so as to ensure the operation performance of the electronic device and improve the reliability of the electronic device.

[0045] The technical solutions of the present disclosure will be further described below in combination with specific structural drawings.

[0046] As Figures 1 to 4 is a structural diagram of an electronic device and a middle frame assembly shown in an embodiment. Among them, Figure 1 is a structural diagram of a mobile terminal shown in an embodiment. Figure 2 is Figure 1 is a partial structure explosion diagram of the mobile terminal shown. Figure 3 is Figure 2 is a structural front view diagram of the middle frame assembly shown. Figure 4 is Figure 3 is a side view diagram of the middle frame assembly shown.

[0047] Embodiments of the present disclosure provide an electronic device, which can be a mobile phone, a tablet computer, an e-reader, a notebook computer, a vehicle-mounted device, a wearable device, a ranging device, a scanning device, etc., comprising a middle frame assembly 10 and a heat source module 20.

[0048] The middle frame assembly 10 comprises a middle frame body 100 and a vapor chamber 200. The middle frame body 100 comprises a first surface 101. The vapor chamber 200 comprises a first heat dissipation member 220, a second heat dissipation member 230 and a third heat dissipation member 240. The first heat dissipation member 220 is fixed to the first surface 101, and the first heat dissipation member 220 is provided with a heat source mounting portion 210 facing the second heat dissipation member 230. The second heat dissipation member 230 is connected to the first heat dissipation member 220 through the third heat dissipation member 240, and the second heat dissipation member 230 can be arranged opposite to the first heat dissipation member 220 to form a heat dissipation space 250.

[0049] The heat source module 20 is fixed to the first heat dissipation member 220 through the heat source mounting portion 210.

[0050] In this way, the third heat dissipation member 240 is used to bend the vapor chamber 200 to form the first heat dissipation member 220 and the second heat dissipation member 230 arranged opposite to each other to form the heat dissipation space 250, and the first heat dissipation member 220 is arranged on the middle frame body 100, which can improve the heat dissipation efficiency of the middle frame body 100. When the electronic device is in use, the heat source module 20 is fixed in the heat dissipation space 250, and the first heat dissipation member 220, the second heat dissipation member 230 and the third heat dissipation member 240 can be fully utilized to dissipate heat from the heat source module 20, so that the electronic device of the present disclosure has high heat dissipation efficiency, and the local overheating of the heat source module 20 can be avoided, which is beneficial to improve the operation stability and reliability. In addition, the first heat dissipation member 220 is arranged on the middle frame body 100, which can fully utilize the area of the middle frame body 100 for heat dissipation, which is beneficial to further improve the heat dissipation efficiency.

[0051] In the embodiments of the present disclosure, the middle frame body 100 can be a frame structure of the electronic device. In addition to integrating the vapor chamber 200 and the heat source module 20, other parts or all components of the electronic device can be directly or indirectly arranged on the middle frame body 100 to assemble the electronic device.

[0052] Optionally, the middle frame body 100 can be arranged inside the electronic device, and the edge of the middle frame body 100 can be designed as part of the shell of the electronic device. When the edge of the middle frame body 100 serves as the shell of the electronic device, it can play a role in protecting the electronic device.

[0053] Optionally, the middle frame body 100 can have a flat or flat-like structure, so that the two sides of the middle frame body 100 can be visually distinguished, which can be referred to as the front and back of the middle frame body 100, or the two sides can also be referred to as one side and the other side of the middle frame body 100. Inside the middle frame body 100, part of it can be partially hollowed out as needed to accommodate other components in the electronic device.

[0054] Optionally, part or all of the middle frame body 100 can be made of metal or alloy material (for example, aluminum alloy). Of course, the material of the middle frame body 100 can also be other, which is not specifically limited in the embodiments of the present disclosure.

[0055] On the basis of any of the above embodiments, in an embodiment, at least part of the third heat dissipation member 240 has flexibility. In this way, the second heat dissipation member 230 can be bent over the first heat dissipation member 220 to form the heat dissipation space 250.

[0056] Alternatively, in another embodiment, the vapor chamber 200 is a flexible vapor chamber. In this way, the first heat dissipation member 220, the third heat dissipation member 240, and the second heat dissipation member 230 can be integrally formed and manufactured, the second heat dissipation member 230 can be bent over the first heat dissipation member 220 to form the heat dissipation space 250, and the heat transfer path can be shortened and the conduction thermal resistance can be reduced.

[0057] In addition, the vapor chamber 200 is integrally formed and manufactured, which is beneficial to improve the reliability.

[0058] On the basis of any of the above embodiments, in an embodiment, the vapor chamber 200 further includes a phase change working medium, and the phase change working medium is arranged in at least one of the first heat dissipation member 220, the second heat dissipation member 230, or the third heat dissipation member 240. In this way, it can be selected according to actual needs to meet the heat dissipation needs of the electronic device while obtaining better cost performance.

[0059] Optionally, the phase change working medium is arranged in the first heat dissipation member 220, the second heat dissipation member 230, and the third heat dissipation member 240. In this way, the heat dissipation of the vapor chamber 200 is more uniform, which is beneficial to further avoid local overheating of the electronic device caused by heat generation of the heat source module 20.

[0060] On the basis of any of the above embodiments, in an embodiment, the boiling point of the phase change working medium is 20-90℃. In this way, the vapor chamber 200 has good heat conduction and heat dissipation performance under the working temperature of 10-45℃ of the electronic device. Further, the heat generated by the heat source module 20 can be promptly dissipated and conducted through the vapor chamber 200, avoiding local overheating of the electronic device.

[0061] The phase change working medium includes but is not limited to formaldehyde, methanol, ethanol, or a mixture thereof and pure water.

[0062] In addition, the starting temperature of the vapor chamber 200 can be adjusted more. For example, by adjusting the vacuum degree in the cavity of the vapor chamber 200, and / or using a phase change working medium with different boiling points to reduce the starting temperature of the vapor chamber 200, the balance state of the gas-liquid full phase change is achieved in advance.

[0063] In order to further improve the heat dissipation efficiency of the middle frame assembly 10, for example, Figures 5 to 7 is a structural diagram of the middle frame assembly 10 shown in some embodiments. Among them, Figure 5 is a side view schematic diagram of the middle frame assembly 10 shown in another embodiment. Figure 6 is a partial cross-sectional view schematic diagram of the middle frame assembly 10 shown in another embodiment. Figure 7 is a partial cross-sectional view schematic diagram of the middle frame assembly 10 shown in another embodiment. Figure 8 is a top view schematic diagram of the passive heat dissipation structure 320 shown in an embodiment.

[0064] In some embodiments, the middle frame assembly 10 further comprises a heat dissipation device 300, which is arranged outside the heat dissipation space 250 and is used for actively dissipating heat from the second heat dissipation member 230. In this way, the second heat dissipation member 230 can be actively cooled by the heat dissipation device 300, further improving the heat dissipation efficiency of the electronic device. At the same time, the cooperation of the middle frame body 100 and the heat dissipation device 300 makes the heat dissipation of the heat source module 20 more uniform, which is beneficial to further avoid local overheating.

[0065] The specific implementation of the heat dissipation device 300 can be various:

[0066] For example, in an embodiment, the heat dissipation device 300 comprises a heat dissipation fan 310, which is arranged towards the second heat dissipation member 230. In this way, the heat dissipation fan 310 can generate disturbance airflow, which can further realize uniform heat dissipation of the middle frame assembly 10. In addition, for example, by interacting with external gas and introducing external cold gas into the electronic device, the electronic device can be cooled, which can further improve the heat dissipation efficiency of the electronic device.

[0067] The heat dissipation fan 310 can be arranged in the electronic device, or can be detachably arranged in the electronic device, which is not limited here.

[0068] Alternatively, in another embodiment, the heat dissipation device 300 comprises a semiconductor refrigeration device 330 arranged on the second heat dissipation member 230, and the semiconductor refrigeration device 330 comprises a heat absorption portion in thermal conduction cooperation with the second heat dissipation member 230. In this way, the semiconductor refrigeration device 330 is used as an active heat dissipation element, and the heat absorption portion is used to actively absorb the heat transferred from the second heat dissipation member 230, so as to cool the heat dissipation space 250 and reduce the temperature of the heat dissipation space 250, thereby improving the heat dissipation efficiency of the electronic device.

[0069] Alternatively, in another embodiment, the heat dissipation device 300 comprises a semiconductor refrigeration device 330 arranged on the second heat dissipation member 230, and the semiconductor refrigeration device 330 comprises a heat absorption portion in thermal conduction cooperation with the second heat dissipation member 230. In this way, the semiconductor refrigeration device 330 is used as an active heat dissipation element, and the heat absorption portion is used to actively absorb the heat transferred from the second heat dissipation member 230, so as to cool the heat dissipation space 250 and reduce the temperature of the heat dissipation space 250, thereby improving the heat dissipation efficiency of the electronic device.

[0070] In addition, the heat dissipation device 300 can be provided with an active heat dissipation component and can also be integrated with a passive heat dissipation structure 320.

[0071] For example, in an embodiment, the heat dissipation device 300 comprises a heat dissipation fan 310 and a passive heat dissipation structure 320, the passive heat dissipation structure 320 is fixedly arranged on the second heat dissipation member 230, and the heat dissipation fan 310 is arranged on the passive heat dissipation structure 320. In this way, the passive heat dissipation structure 320 is used to absorb the heat of the second heat dissipation member 230 and accelerate the heat dissipation of the second heat dissipation member 230. At the same time, the heat dissipation fan 310 can generate disturbance airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 320, so that the heat dissipation efficiency of the middle frame assembly 10 is high and uniform.

[0072] Alternatively, in another embodiment, the heat dissipation device 300 comprises a semiconductor refrigeration device 330 arranged on the second heat dissipation member 230, and the semiconductor refrigeration device 330 comprises a heat absorption portion in thermal conduction cooperation with the second heat dissipation member 230. In this way, the semiconductor refrigeration device 330 is used as an active heat dissipation element, and the heat absorption portion is used to actively absorb the heat transferred from the second heat dissipation member 230, so as to cool the heat dissipation space 250 and reduce the temperature of the heat dissipation space 250, thereby improving the heat dissipation efficiency of the electronic device.

[0073] Alternatively, in another embodiment, the heat dissipation device 300 includes the passive heat dissipation structure 320, the heat dissipation fan 310, and the semiconductor refrigeration device 330 arranged on the second heat dissipation device 230. The semiconductor refrigeration device 330 includes a heat dissipation part and a heat absorption part in thermal conduction with the second heat dissipation device 230. The heat dissipation part is in thermal conduction with the heat absorption part. The passive heat dissipation structure 320 is arranged on the heat dissipation part, and the heat dissipation fan 310 is arranged on the passive heat dissipation structure 320. In this way, the semiconductor refrigeration device 330 is used as an active heat dissipation element to actively absorb heat transferred from the second heat dissipation device 230 through the heat absorption part, thereby cooling the heat dissipation space 250. At the same time, the passive heat dissipation structure 320 is used to absorb heat of the heat dissipation part to accelerate the heat dissipation efficiency of the semiconductor refrigeration device 330. Further, the heat dissipation fan 310 can generate disturbance airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 320, so that the electronic device has high and uniform heat dissipation efficiency.

[0074] On the basis of the above-mentioned embodiments, in an embodiment, the heat dissipation fan 310 or the heat dissipation fan 310 and the passive heat dissipation structure 320 can be detachably arranged in the electronic device. The electronic device is provided with a ventilation hole 31 matched with the heat dissipation fan 310. In this way, when the electronic device can meet the heat dissipation requirement by using the semiconductor refrigeration device 330, the heat dissipation fan 310 can be detached. When the semiconductor refrigeration device 330 cannot meet the heat dissipation requirement, the heat dissipation fan 310 can be externally connected to an external power supply and installed in the electronic device. External air is sent into the electronic device through the ventilation hole 31 to improve the heat dissipation efficiency of the electronic device.

[0075] Further, the electronic device further includes a protective cover 30 matched with the middle frame body 100 to form a protection space. The middle frame assembly 10 further includes the passive heat dissipation device 300. At least part of the heat dissipation device 300 is detachably connected with the protective cover 30. In this way, when the heat dissipation device 300 includes the heat dissipation fan 310, the heat dissipation fan 310 can be detachably arranged on the protective cover 30.

[0076] In some embodiments, when the electronic device is a mobile terminal, the protective cover 30 is a back cover.

[0077] Optionally, the electronic device is a smart television. In any embodiment of the above-mentioned heat dissipation fan 310, the heat dissipation fan 310 is detachably arranged on the back cover. In this way, according to different specifications of central processing units corresponding to different smart television models, the heat dissipation fan 310 can be selectively installed to reduce production cost and avoid waste of heat dissipation performance.

[0078] In some embodiments, the passive heat dissipation structure 320 includes a heat conduction body 321 and heat dissipation fins 322, the heat dissipation fins 322 are arranged on the outer surface of the heat conduction body 321, the heat conduction body 321 transmits the heat generated by the heat source module to the heat dissipation fins 322, and further transmits the heat to the external air by the heat dissipation fins 322, so as to enhance the heat dissipation effect. For example, the heat conduction body 321 and the heat dissipation fins 322 are respectively arranged as independent components, and for example, the passive heat dissipation structure 320 is integrally cast to enhance the mechanical properties.

[0079] The material of the passive heat dissipation structure 320 is aluminum alloy. For example, the specific surface area of the heat dissipation fins 322 is 4 to 10 times of the specific surface area of the heat conduction body 321, for example, the specific surface area of the heat dissipation fins 322 is 6.8 times of the specific surface area of the heat conduction body 321.

[0080] When the heat dissipation fan 310 is combined with the passive heat dissipation structure 320, the heat dissipation fan 310 is arranged outside the heat conduction body 321, the heat dissipation fins 322 include a plurality of fins, a heat dissipation flow channel is formed between adjacent two fins, the heat dissipation flow channel is used to guide the airflow generated by the heat dissipation fan 310, and the heat dissipation efficiency is improved.

[0081] In the embodiments of the present disclosure, the heat source module 20 refers to a device that radiates more heat in an electronic device, and includes at least one heat source device, that is, a heating element.

[0082] In an exemplary embodiment, the heat source module 20 includes a circuit board 21 and a heat source component 22 arranged on the circuit board 21.

[0083] In actual application process, the heat radiated by the component is usually positively correlated with the power consumption of the component, the greater the power consumption of the component, the greater the heat radiated by the component. Correspondingly, the heat source component 22 in the present disclosure can be a device in an electronic device whose power consumption exceeds M% of the total power consumption M, and M can be 20, 30, 40, etc.

[0084] Optionally, the heat source component 22 can include a central processing unit, a processor device integrating processing and storage functions, a power supply component (such as a battery), etc.

[0085] In an exemplary embodiment, the heat source component 22 includes a central processing unit (CPU) and a resistance-capacitance device, and is respectively arranged on two board surfaces of the circuit board 21.

[0086] Optionally, the central processing unit is fixed on the heat source mounting portion 210 through a heat conduction layer 260. The heat conduction layer 260 can be arranged in various ways between the central processing unit and the heat source mounting portion 210, such as pasting, smearing, spraying, or clamping the formed heat conduction layer 260 between the central processing unit and the heat source mounting portion 210 through a fixed connection mode.

[0087] In an exemplary example, the heat-conducting layer 260 is elastic and is pressed between the central processor and the heat source mounting portion 210. In this way, the heat-conducting layer 260 can fill the gap between the central processor and the heat source mounting portion 210, increase the contact area, and improve the heat dissipation efficiency of the heat-conducting central processor. In addition, the heat-conducting layer 260 is elastic and can act as a buffer to protect the central processor.

[0088] In some exemplary examples, the heat-conducting layer 260 is one of a heat-conducting silica gel, a heat-conducting rubber, and the like.

[0089] Of course, the heat source module 20 can also be other, and the embodiments of the present disclosure do not make specific limitations on this.

[0090] In addition, in some embodiments, the heat-conducting layer 260 having elasticity can also be provided between the above-mentioned independent adjacent components to improve the heat-conducting effect between the adjacent components and accelerate the heat dissipation efficiency by using the heat-conducting layer 260.

[0091] The heat-conducting layer 260 can be provided between the middle frame body 100 and the first heat dissipation member 220, and / or between the second heat dissipation member 230 and the heat dissipation member 300, and / or between the first heat dissipation member 220 and the heat source module 20, and the like.

[0092] In order to further improve the heat dissipation efficiency and effect of the electronic device, the heat dissipation efficiency of the middle frame body 100 can be further improved, and thus the components directly or indirectly provided on the middle frame body 100 have a good heat dissipation environment.

[0093] As shown in Figure 9 and Figure 14 , a structure schematic diagram of the middle frame assembly 10 is shown in some embodiments. Among them, Figure 9 is Figure 2 a rear view schematic diagram of the structure of the middle frame assembly 10. Figure 10 is Figure 9 an exploded schematic diagram of the structure of the middle frame assembly 10. Figure 11 is Figure 10 a partial structure schematic diagram of the middle frame assembly 10. Figure 12 is Figure 11 an enlarged schematic diagram of A. Figure 13 is Figure 11 a heat dissipation state schematic diagram of the middle frame assembly 10. Figure 14 is Figure 13 an enlarged schematic diagram of B.

[0094] In some embodiments, the middle frame body 100 further comprises a cooling portion 110 and a second surface 102 opposite to the first surface 101, the middle frame assembly 10 further comprises a loop heat pipe 400 and a working fluid 500; the loop heat pipe 400 is arranged on the second surface 102, the loop heat pipe 400 comprises an evaporator 410 and a pipe unit 420, the evaporator 410 is arranged opposite to the heat source mounting portion 210, the evaporator 410 comprises a liquid supplementing end 411 and a gas outlet end 412, one end of the pipe unit 420 is in communication with the liquid supplementing end 411, and the other end of the pipe unit 420 is in communication with the gas outlet end 412, and part of the pipe unit 420 is in heat conduction cooperation with the cooling portion 110; the working fluid 500 is arranged in the loop heat pipe 400, and the working fluid 500 in a liquid state can be converted into a gaseous state by the evaporator 410, and the working fluid 500 in a gaseous state can flow into the pipe unit 420 through the gas outlet end 412; the working fluid 500 in a gaseous state can be re-liquefied in the pipe unit 420 and fed into the liquid supplementing end 411.

[0095] In this way, the loop heat pipe 400 is integrated on the middle frame body 100, the heat of the heat source mounting portion 210 is absorbed by the evaporator 410 to actively dissipate heat of the heat source device, and then the heat is transferred to the cooling portion 110 by the pipe unit 420, so that the space of the middle frame body 100 can be fully utilized for heat dissipation, and the heat dissipation performance of the middle frame body 100 can be improved, thereby facilitating the improvement of the heat dissipation efficiency of the elements integrated on the middle frame body 100, especially the heat source module 20 which is prone to heat.

[0096] In some embodiments, the first surface 101 is a front surface of the middle frame body 100, and the second surface 102 is a back surface of the middle frame body 100.

[0097] It should be noted that the "cooling portion 110" generally refers to a position with a slower temperature rise than the heat source mounting portion 210, that is, a position with a relatively lower temperature inside the electronic device than the temperature of the "heat source mounting portion 210" during use of the electronic device.

[0098] Optionally, the battery compartment and the small plate area far from the heat source mounting portion 210 correspond to the back surface area, which can be set as the cooling portion 110 to accelerate the liquefaction of the working fluid 500.

[0099] It should be noted that the "working fluid 500" includes but is not limited to a cooling liquid (such as water) and other fluids that can be applied to the loop heat pipe 400, and the boiling point of the "working fluid 500" can be adjusted according to actual needs, which is not limited herein.

[0100] For example, the working fluid 500 includes but is not limited to formaldehyde, methanol, ethanol or a mixture thereof with pure water.

[0101] It should be noted that the "evaporator 410" includes a capillary core and the like, and the specific structure thereof includes but is not limited to other structures of the evaporator 410 that can be applied to the loop heat pipe 400.

[0102] In some embodiments, when the electronic device of the present disclosure is in use, the heat source module 20 generates heat due to work, and the evaporator 410 can actively absorb the heat transferred by the heat source module 20 through the heat source mounting portion 210, so that the liquid working fluid 500 in the evaporator 410 absorbs heat and evaporates, consumes heat energy, and flows to the cooling portion 110 through the pipeline unit 420 due to volume expansion. In this process, the gaseous working fluid 500 will transfer heat to the middle frame body 100, and can release a large amount of heat and condense into liquid when flowing through the cooling portion 110. The liquefied working fluid 500 will return to the liquid compensation end 411 under the driving action of the capillary force of the capillary core in the evaporator 410. The liquid in the compensation cavity will be evaporated again by the evaporator 410 to continue to absorb heat. In this way, an evaporation-condensation cycle is formed, and the circulation of the working fluid 500 is driven by the capillary pressure generated by the capillary core of the evaporator 410. The flow direction of the working fluid 500 is regular and the flow rate is fast, which can accelerate heat dissipation. Further, the heat of the heat source module 20 can be actively cooled by the middle frame body 100, and the heat can be transported and dissipated to the battery compartment and the cooling portion 110 such as a small plate at a long distance, fully utilizing the size of the middle frame body 100 for heat dissipation, and greatly improving the heat dissipation efficiency of the electronic device.

[0103] The middle frame assembly 10 of the present disclosure realizes the core capability improvement of large heat transfer amount and long heat transfer distance without increasing the thickness of the conventional middle frame body 100 and the whole machine stack, and combines the distribution of the heat source part and the non-heat source part (i.e. the cooling portion 110), fully utilizing the whole middle frame area for efficient heat dissipation.

[0104] In some embodiments, at least part of the loop heat pipe 400 is embedded on the middle frame body 100. Further, the thickness space of the middle frame body 100 can be fully utilized to integrate the loop heat pipe 400, that is, the contact area can be increased, thereby improving the heat dissipation efficiency, and actively reducing the thickness size of the heat dissipation structure. Further, the middle frame assembly 10 of the present disclosure can adapt to the design needs of the thin and light electronic device, so that the electronic device of the present disclosure can be designed to be thinner and lighter, and at the same time has good heat dissipation performance, which can improve the product competitiveness.

[0105] As shown in FIG. 1, Figure 4 In some embodiments, the heat source mounting portion 210 and the cooling portion 110 are arranged on both sides of the battery mounting portion 120. In this way, the heat source mounting portion 210 and the cooling portion 110 can be separated to fully dissipate heat. At the same time, the battery mounting portion 120 can be cooled when flowing through the battery mounting portion 120.

[0106] As shown in the present disclosure, the electronic device can integrate the central processor as the heat source module 20 on the mainboard, and make the mainboard be arranged at one end of the battery, and the small board or the charging control board and the like be placed at the other end of the battery. When the battery is not charged and the electronic device is used, the central processor generates heat, and the loop heat pipe 400 is used for heat dissipation at the same time. In addition, the heat dissipation layer of the battery and the heat dissipation layer of the charging control board part can also be used to accelerate heat dissipation, and the heat dissipation efficiency is further improved. When the battery is charged, the loop heat pipe 400 can also be used for heat dissipation.

[0107] As shown in the present disclosure, the electronic device can integrate the central processor as the heat source module 20 on the mainboard, and make the mainboard be arranged at one end of the battery, and the small board or the charging control board and the like be placed at the other end of the battery. When the battery is not charged and the electronic device is used, the central processor generates heat, and the loop heat pipe 400 is used for heat dissipation at the same time. In addition, the heat dissipation layer of the battery and the heat dissipation layer of the charging control board part can also be used to accelerate heat dissipation, and the heat dissipation efficiency is further improved. When the battery is charged, the loop heat pipe 400 can also be used for heat dissipation. Figure 3 and Figure 9 As shown in some embodiments, at least part of the evaporator 410 and at least part of the heat source mounting portion 210 are coincident in the projection plane of the front view of the middle frame body 100. In this way, the heat source device is mounted on the heat source mounting portion 210. When the electronic device is used, the heat source device can use the middle frame body 100 for heat dissipation at the same time, and the heat energy only needs to pass through the thickness dimension of the middle frame body 100, that is, the heat can be transferred to the evaporator 410, the heat absorption efficiency of the evaporator 410 is improved, the working fluid 500 is heated and vaporized, the heat source device is quickly cooled, and the heat dissipation efficiency is further improved.

[0108] As shown in the present disclosure, the electronic device can integrate the central processor as the heat source module 20 on the mainboard, and make the mainboard be arranged at one end of the battery, and the small board or the charging control board and the like be placed at the other end of the battery. When the battery is not charged and the electronic device is used, the central processor generates heat, and the loop heat pipe 400 is used for heat dissipation at the same time. In addition, the heat dissipation layer of the battery and the heat dissipation layer of the charging control board part can also be used to accelerate heat dissipation, and the heat dissipation efficiency is further improved. When the battery is charged, the loop heat pipe 400 can also be used for heat dissipation. Figures 10 to 11 As shown in some embodiments, the middle frame body 100 is provided with a loop pipe groove 130, and the middle frame assembly 10 further includes a sealing cover 600 which is arranged on the loop pipe groove 130 and forms at least part of the loop heat pipe 400. In this way, the loop pipe groove 130 is directly formed on the middle frame body 100, and the sealing cover 600 is arranged thereon, so that at least part of the loop pipe can be formed by fully utilizing the thickness dimension of the middle frame body 100, such as at least one of the pipe unit 420 or the liquid storage cavity 414.

[0109] The loop pipe groove 130 can be formed by stamping, etching, laser engraving, turning and milling and the like.

[0110] In some embodiments, the loop pipe groove 130 is an etching groove. In this way, more loop heat pipe 400 structures such as the pipe unit 420, the liquid storage cavity 414, the evaporator 410, the one-way valve and the like can be formed on the middle frame body 100 by using etching technology, and the thickness dimension of the middle frame body 100 is fully utilized to accommodate more loop heat pipes 400, which is beneficial to the ultra-light and thin design of the electronic device. At the same time, more accurate loop heat pipe 400 structures can be obtained, and the reliability of the middle frame assembly 10 is improved.

[0111] In an exemplary embodiment, the loop pipe groove 130 is an etching groove, and the etching groove includes a capillary groove. The loop pipe groove 130 cooperates with the sealing cover 600 to form the loop heat pipe 400. In this way, the evaporator 410 can also be etched directly on the middle frame body 100, which can simplify the assembly process and improve the production efficiency of the middle frame assembly 10.

[0112] Optionally, in some embodiments, the sealing cover 600 is welded and sealed with the middle frame body 100. In this way, the sealing cover 600 and the middle frame body 100 are reliably sealed and fixed by using a welding sealing technology, and the two are more closely attached, which is beneficial to reducing the size of the middle frame assembly 10 in the thickness direction.

[0113] On the basis of any of the above embodiments, as shown in Figure 9 or Figure 15 In some embodiments, the loop heat pipe 400 is flat. In this way, the size of the middle frame body 100 in the width direction and / or the length direction can be fully utilized to form a fluid passage, further reducing the size of the middle frame assembly 10 in the thickness direction, which is beneficial to making the electronic device lighter and thinner. At the same time, the contact area of the two can be increased, so that the working fluid 500 can better absorb and dissipate heat.

[0114] Optionally, the maximum thickness of the loop heat pipe 400 is less than or equal to 0.5 mm. In this way, the electronic device can adapt to the ultra-thin design, or provide more space for other components. For example, using this space, a larger volume of battery can be accommodated, thereby improving the endurance of the electronic device.

[0115] Optionally, the maximum thickness of the loop heat pipe 400 is less than or equal to 0.4 mm.

[0116] The thickness of the loop heat pipe 400 includes but is not limited to 0.5 mm, 0.45 mm, 0.4 mm, 0.35 mm, 0.3 mm, etc.

[0117] In some embodiments, the evaporator 410 includes an evaporation portion 413, and in the projection plane of the front view direction of the middle frame body 100, the evaporation portion 413 covers the heat source mounting portion 210, and the area of the evaporation portion 413 is 1.5 to 2 times the area of the heat source mounting portion 210. In this way, the evaporation portion 413 can fully dissipate heat from the heat source device, so that the heat source device is evenly and sufficiently cooled, and local overheating of the heat source device is avoided.

[0118] Optionally, the evaporation portion 413 includes a capillary core.

[0119] On the basis of any of the above embodiments, as shown in Figure 11 and Figure 13As shown, in some embodiments, the pipeline unit 420 includes a first conveying pipe, a second conveying pipe, and a condensing pipe 423 in heat-conducting cooperation with the cooling part 110, the condensing pipe 423 includes a cold end and a hot end, the cold end is in communication with the liquid supplementing end 411 through the first conveying pipe, and the hot end is in communication with the gas outlet end 412 through the second conveying pipe. In this way, by arranging the condensing pipe 423, a detour condensing channel can be formed, and the heat dissipation of the cooling part 110 can be fully utilized. At the same time, the condensing pipe 423 is in cooperation with the evaporator 410 through the first conveying pipe and the second conveying pipe, realizing the cycle switching and orderly flow of the liquid working fluid 500 and the gaseous working fluid 500, so that the heat dissipation reliability of the loop heat pipe 400 is higher.

[0120] On the basis of any of the above embodiments, in some embodiments, the inner diameter of the second conveying pipe is greater than the inner diameter of the first conveying pipe. In this way, after the liquid working fluid 500 is vaporized, it can quickly flow into the second conveying pipe (easy to produce a gas flow from positive pressure to negative pressure), and be conveyed to the condensing pipe 423 for cooling, which is conducive to the circulation of the gaseous working fluid 500 pushing the liquid working fluid 500.

[0121] Optionally, the inner diameter of the second conveying pipe is equal to 1 times or 1.5 times or 2 times or the like of the inner diameter of the first conveying pipe.

[0122] On the basis of any of the above embodiments, in some embodiments, at least part of the condensing pipe 423 coincides with at least part of the cooling part 110 in the projection plane of the front view of the middle frame body 100. In this way, the heat dissipation distance can be reduced as much as possible, and the low temperature of the cooling part 110 can be fully utilized to cool the gas of the condensing pipe 423.

[0123] On the basis of any of the above embodiments, as shown in Figure 11 and Figure 12 In some embodiments, the loop heat pipe 400 further includes an anti-backflow structure 430 arranged in the middle frame body 100, so that the working fluid 500 passes through one end of the pipeline unit 420 and flows into the evaporator 410 through the anti-backflow structure 430. In this way, the working fluid 500 can stably circulate in the designed direction by using the anti-backflow structure 430, so as to ensure the stability and reliability of the operation of the loop heat pipe 400.

[0124] The anti-backflow structure 430 includes but is not limited to a one-way valve and the like.

[0125] Optionally, the anti-backflow structure is a Tesla valve structure 432.

[0126] As shown in Figure 12 and Figure 14As shown, in some embodiments, the loop heat pipe 400 further comprises a Tesla valve structure 432, which is arranged in the middle frame body 100 to enable the working fluid 500 to flow through one end of the pipe unit 420 and into the evaporator 410 through the Tesla valve structure 432. Due to the characteristics of small forward flow resistance and large reverse flow resistance of the Tesla valve, the application of the Tesla valve structure 432 in the loop heat pipe 400 can realize low-resistance backflow of the liquid working fluid 500, prevent the occurrence of reverse flow of the liquid working fluid 500 in the evaporator 410, ensure one-way low-resistance flow of the working fluid 500 in the evaporator 410 to generate driving force, and thus ensure stable circulation of the loop heat pipe 400.

[0127] Optionally, the output area of the Tesla valve structure 432 is generally designed to be equal to or approximately equal to the input area of the capillary core of the evaporator 410.

[0128] On the basis of any of the above embodiments, in some embodiments, the evaporator 410 comprises an evaporation part 413 arranged between the liquid supplementing end 411 and the gas outlet end 412, and the Tesla valve structure 432 is arranged between the liquid supplementing end 411 and the evaporation part 413 to enable the working fluid 500 to flow into the evaporation part 413 through the Tesla valve structure 432. In this way, the evaporator 410 and the Tesla valve structure 432 are coupled into one body, which is beneficial to super-thin design, so that the loop heat pipe 400 is in the form of a super-thin flat plate and the overall thickness is less than 0.5 mm. At the same time, the evaporator 410 after structural integration can be flexibly arranged, that is, a plurality of evaporators 410 can be arranged according to the positions of multiple heat sources on the electronic device, and the Tesla valve structure 432 between the multiple evaporators 410 can effectively prevent turbulence, so that the multiple evaporators 410 operate stably, and the modular assembly is facilitated, which is beneficial to improve the production efficiency of the middle frame assembly 10.

[0129] On the basis of the above embodiments, as shown in Figure 13 and Figure 14 In some embodiments, the evaporator 410 comprises a liquid storage cavity 414 arranged between the liquid supplementing end 411 and the evaporation part 413, and the Tesla valve structure 432 is arranged in the liquid storage cavity 414. In this way, the arrangement of the Tesla valve structure 432 in the liquid storage cavity 414 can prevent the liquid working fluid 500 from flowing out of the evaporator 410, and is also beneficial to keeping the liquid working fluid 500 in the liquid storage cavity 414, so that the evaporation part 413 can obtain the liquid working fluid 500 in time to continuously generate driving force. At the same time, the liquid working fluid 500 can also be stored in the liquid storage cavity 414 when the electronic device is not in use, for evaporation of the evaporation part 413.

[0130] On the basis of any of the above embodiments of the evaporation part 413, as shown in Figure 12 and Figure 14As shown, in some embodiments, there are at least two Tesla valve structures 432, which are arranged in parallel between the liquid replenishment end 411 and the evaporation section 413. Thus, employing at least two Tesla valves in parallel enhances the unidirectional flow capability of the Tesla valve structure 432 of this disclosure.

[0131] Optionally, the width of the Tesla valve structure 432 is less than 1 mm, the height is less than 0.5 mm, and the distance between two adjacent Tesla valve structures 432 is less than 1.5 mm.

[0132] like Figure 15 As shown, in some embodiments, the mid-frame body 100 is provided with a mounting groove 140 adapted to the loop heat pipe 400, and at least a portion of the loop heat pipe 400 is embedded into the mid-frame body 100 through the mounting groove 140. Thus, by using the mounting groove 140 to accommodate at least a portion of the loop heat pipe 400, it is easier for the loop heat pipe 400 to be embedded into the mid-frame body 100, thereby reducing the thickness of the mid-frame assembly 10.

[0133] Based on the above embodiments, in some embodiments, the middle frame assembly 10 further includes a thermally conductive adhesive layer 700, through which at least a portion of the loop heat pipe 400 is fixed in the mounting groove 140. In this way, the loop heat pipe 400 can be initially placed on the mounting groove 140 and then fixed using the thermally conductive adhesive layer 700, which improves the thermal conductivity of both and facilitates their assembly.

[0134] The loop heat pipe 400 has a long heat transfer distance and strong anti-gravity capability, which solves the problem of traditional heat pipes being limited by their location and length. In addition, the loop heat pipe 400 disclosed in this invention separates the vapor channel and the liquid channel, with vapor and liquid flowing in their respective pipelines (e.g., vapor flows in the first delivery pipe and liquid flows in the second delivery pipe), thereby eliminating the phenomenon of mutual carryover and ensuring high heat dissipation reliability; it also makes the installation of the loop heat pipe 400 flexible and convenient, no longer limited by the location and distance of the heat source and heat sink.

[0135] Based on any of the above embodiments, such as Figure 16 As shown, in some embodiments, the evaporator 410 includes two or more, and adjacent evaporators 410 are spaced apart within the middle frame body 100. The piping unit 420 includes a liquid replenishment branch 424 and an exhaust branch 425 corresponding to each evaporator 410. The liquid replenishment branch 424 is connected to the corresponding liquid replenishment end 411, and the exhaust branch 425 is connected to the corresponding exhaust end 412. Thus, the middle frame assembly 10 of this disclosure can actively dissipate heat from different heat source devices on electronic devices, further improving heat dissipation efficiency.

[0136] In combination with the aforementioned Tesla valve structure 432 or the anti-backflow structure 430, each evaporator 410 has a one-way flow characteristic, which can ensure that each evaporator 410 can stably improve the circulating power when the heat load difference is large, and can improve the stable operation of the parallel evaporator 410 structure.

[0137] On the basis of any of the above embodiments, in some embodiments, the greater the vapor generation rate between the two adjacent evaporators 410, the greater the inner diameter of the liquid supplement branch 424 and / or the inner diameter of the gas outlet branch 425. In this way, the working fluid 500 can be reasonably distributed, and the compensation of the liquid working fluid 500 between the evaporators 410 is smooth and sufficient, so as to improve the reliability and stability of the middle frame assembly 10 when dissipating heat.

[0138] It should be noted that the "heat source mounting portion" can be "a part of the middle frame body", that is, the "heat source mounting portion" is integrally formed with "other parts of the middle frame body, such as the cooling portion"; or it can be a separate component that can be separated from "other parts of the middle frame body, such as the cooling portion", that is, the "heat source mounting portion" can be independently manufactured and then combined with "other parts of the middle frame body, such as the cooling portion" to form a whole.

[0139] Similarly, "a body" and "a portion" can be a part of a "component", that is, "a body" and "a portion" are integrally formed with "other parts of the component"; or they can be a separate component that can be separated from "other parts of the component", that is, "a body" and "a portion" can be independently manufactured and then combined with "other parts of the component" to form a whole. The expression of "a body" and "a portion" in the present disclosure is only one embodiment, which is for the convenience of reading and is not a limitation on the scope of protection of the present disclosure. As long as the above-mentioned features are included and the functions are the same, it should be understood as an equivalent technical solution of the present disclosure.

[0140] It should be noted that the "Tesla valve structure" can be one of the parts of the "evaporator" module, that is, assembled with "other components of the evaporator" to form a module, and then modularly assembled; or it can be relatively independent of "other components of the evaporator" and can be installed separately, that is, it can form a whole with "other components of the evaporator" in the device.

[0141] Similarly, the components included in the "heat dissipation device", "middle frame assembly", and "electronic equipment" of the present disclosure can also be flexibly combined, that is, they can be modularly produced according to actual conditions and modularly assembled as an independent module; or they can be assembled separately to form a module in the device. The division of the above-mentioned components in the present disclosure is only one embodiment, which is for the convenience of reading and is not a limitation on the scope of protection of the present disclosure. As long as the above-mentioned components are included and the functions are the same, it should be understood as an equivalent technical solution of the present disclosure.

[0142] In the description of the present disclosure, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.

[0143] In addition, the terms "first", "second", and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "a plurality of" is at least two, for example, two, three, and the like, unless otherwise explicitly specified and limited.

[0144] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0145] In the present disclosure, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0146] It should be noted that when an element is referred to as "fixed to", "provided to", "fixed to" or "installed to" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element.

[0147] Any combination of the technical features in the above embodiments can be made. For the sake of brevity, the foregoing description has not described all possible combinations of the technical features in the above embodiments, however, it is understood that any combination of the technical features is within the scope of the present disclosure as long as the combination does not result in contradiction.

[0148] The above embodiments only express several implementation manners of the present disclosure, and the description is specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which are within the protection scope of the present disclosure.

Claims

1. An electronic device, comprising: The heat source module and the middle frame assembly are included. The middle frame body includes a first surface; and The vapor chamber includes a first heat dissipation element, a second heat dissipation element, and a third heat dissipation element, the first heat dissipation element is fixed to the first surface, and the first heat dissipation element is provided with a heat source mounting portion facing the second heat dissipation element, at least part of the third heat dissipation element has flexibility, the second heat dissipation element is connected with the first heat dissipation element through the third heat dissipation element, and the second heat dissipation element can be arranged in a spaced manner relative to the first heat dissipation element to form a heat dissipation space; the heat source module is fixed to the first heat dissipation element through the heat source mounting portion; The middle frame assembly further includes a heat dissipation element arranged outside the heat dissipation space for actively dissipating heat from the second heat dissipation element; the heat dissipation element includes a heat dissipation fan and a semiconductor refrigeration element, the semiconductor refrigeration element includes a heat dissipation portion and a heat absorption portion in thermal conduction with the second heat dissipation element, and the heat dissipation fan is arranged towards the heat dissipation portion; The electronic device further includes a protective cover cooperating with the middle frame to form a protective space, the heat source module is arranged in the protective space, and the heat dissipation fan is detachably arranged on the protective cover; the protective cover is provided with an air hole communicating with the protective space; when the semiconductor refrigeration element can meet the heat dissipation requirement, the heat dissipation fan is separated from the protective cover; when the semiconductor refrigeration element cannot meet the heat dissipation requirement, the heat dissipation fan is connected with an external power supply and is installed into the electronic device through the protective cover to send external air into the electronic device through the air hole.

2. The electronic device of claim 1, wherein, The vapor chamber is a flexible vapor chamber.

3. The electronic device of claim 1, wherein, The vapor chamber further includes a phase change working medium arranged in at least one of the first heat dissipation element, the second heat dissipation element, or the third heat dissipation element.

4. The electronic device of claim 3, wherein, The boiling point of the phase change working medium is 20-90°C.

5. The electronic device of claim 1, wherein, The heat dissipation element includes a passive heat dissipation structure detachably arranged on the electronic device, the passive heat dissipation structure is arranged on the heat dissipation portion, and the heat dissipation fan is arranged on the passive heat dissipation structure.

6. The electronic device of any one of claims 1 to 5, wherein, The middle frame body further includes a cooling portion and a second surface arranged opposite to the first surface; the middle frame assembly further includes: A loop heat pipe arranged on the second surface, the loop heat pipe includes an evaporator and a pipeline unit, the evaporator is arranged opposite to the heat source mounting portion, the evaporator includes a liquid supplementing end and an air outlet end, one end of the pipeline unit communicates with the liquid supplementing end, the other end of the pipeline unit communicates with the air outlet end, and part of the pipeline unit is in thermal conduction with the cooling portion; and A working fluid arranged in the loop heat pipe, the working fluid in liquid state can be converted into gas state by the evaporator, the working fluid in gas state can flow into the pipeline unit through the air outlet end; the working fluid in gas state can be re-liquefied in the pipeline unit and fed into the liquid supplementing end.

7. The electronic device of claim 6, wherein, The pipeline unit comprises a first conveying pipe, a second conveying pipe and a condensing pipe in heat transfer cooperation with the cooling part, the condensing pipe comprises a cold end and a hot end, the cold end is communicated with the liquid supplementing end through the first conveying pipe, and the hot end is communicated with the gas outlet end through the second conveying pipe.

8. The electronic device of claim 6, wherein, The loop heat pipe further comprises an anti-backflow structure arranged in the middle frame body, so that the working fluid flows through one end of the pipeline unit and flows into the evaporator through the anti-backflow structure.

9. The electronic device of claim 8, wherein, The loop heat pipe further comprises a Tesla valve structure arranged in the middle frame body, so that the working fluid flows through one end of the pipeline unit and flows into the evaporator through the Tesla valve structure.

10. The electronic device of claim 9, wherein, The evaporator comprises an evaporation part arranged between the liquid supplementing end and the gas outlet end, and the Tesla valve structure is arranged between the liquid supplementing end and the evaporation part, so that the working fluid flows into the evaporation part through the Tesla valve structure.

11. The electronic device of claim 10, wherein, The evaporator comprises a liquid storage cavity arranged between the liquid supplementing end and the evaporation part, and the Tesla valve structure is arranged in the liquid storage cavity; and / or the Tesla valve structure is at least two and is arranged in parallel between the liquid supplementing end and the evaporation part.

12. The electronic device of claim 1, wherein, The electronic device further comprises a heat conduction member clamped between the heat source module and the first heat dissipation member.

13. The electronic device of claim 1, wherein, The heat source module comprises a circuit board and a heat source component arranged on the circuit board.

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