Workpiece dimension detection apparatus and method

Abstract

The application discloses a workpiece size detection device and a detection method, the workpiece at least includes a chamfer surface and an adjacent surface which is obliquely connected with the chamfer surface, the detection device comprises: an infrared light source, which is used for irradiating infrared light on a detection area of the workpiece containing the chamfer surface; a camera, which is used for acquiring an image of the detection area; an image processor, which is connected with the camera and obtains the size of the chamfer surface area based on the image; the wavelength of the infrared light is between 850-940nm. The detection device provided by the application can effectively solve the problems of reducing the influence of white spots, improving the definition of the edge position of the chamfer surface, and further improving the definition of the image of the detection area, due to the strong penetration ability of the infrared light. The camera transmits the obtained image to the image processor, and the image processor obtains size data, which can effectively improve the precision and efficiency of the chamfer surface size detection. The wavelength of the infrared light is 850-940nm, and the ordinary industrial camera can obtain the infrared light of this wavelength, so that the cost of the infrared camera is not needed, the requirement for the camera is reduced, and the detection cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of size detection equipment, in particular to a workpiece size detection equipment and a detection method. BACKGROUND

[0002] When detecting the size of the chamfer surface of the middle frame of the electronic device, the light source generally uses white light. However, when the white light irradiates the edge of the chamfer surface, due to the existence of burrs and other uneven structures on the edge of the chamfer surface, white spot interference occurs on the edge of the chamfer surface, and the size will increase on the basis of the original size, causing size measurement out of limit, which is easy to cause missed detection.

[0003] In addition, in the prior art, the upper and lower edge lines of the chamfer surface are generally detected by manual detection under a magnifying glass, and the size is measured by using a measuring tool or by taking points on a two-dimensional machine. However, due to the small detection target, long-time concentrated effort detection by manual detection is easy to cause eye fatigue, resulting in inaccurate measurement, and low product detection efficiency. In addition, different people have different parallax, which will cause inconsistent size measurement accuracy of the chamfer surface of the middle frame, thereby causing measurement misjudgment.

[0004] Therefore, how to improve the measurement accuracy of the detection equipment is a technical problem to be solved by those skilled in the art at present. SUMMARY

[0005] The purpose of the present application is to provide a workpiece size detection equipment and a detection method, which can improve the detection accuracy and reduce the influence of the burrs on the edge of the chamfer surface.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0007] The workpiece size detection device provided by the application, which comprises a chamfer surface and an adjacent surface intersecting with the chamfer surface, comprises: an infrared light source for irradiating infrared light on a detection area of the workpiece containing the chamfer surface; a camera for acquiring an image of the detection area; and an image processor connected with the camera and acquiring the size of the chamfer surface area based on the image; wherein the wavelength of the infrared light is between 850-940nm. The detection device provided by the application uses the infrared light source to emit infrared light, which has strong penetration ability, can effectively solve the white spot problem caused by possible burrs and unevenness on the chamfer surface when white light irradiates the chamfer surface, reduce the influence of white spots, improve the clarity of the edge position of the chamfer surface, and further improve the clarity of the image of the detection area; the camera transmits the acquired image to the image processor, and the image processor analyzes the image through the built-in program to obtain size data, which can effectively improve the accuracy and efficiency of the size detection of the chamfer surface; at the same time, by setting the wavelength of the infrared light to 850-940nm, an ordinary industrial camera can acquire infrared light of this wavelength, without the need to use a more expensive infrared camera, which can reduce the requirements for the camera and reduce the detection cost.

[0008] The second aspect of the embodiment of the application provides a detection method applied to the size detection of a workpiece, the workpiece comprising a chamfer surface and an adjacent surface intersecting with the chamfer surface, which comprises: irradiating infrared light on a detection area of the workpiece, the detection area containing the chamfer surface; acquiring an image of the detection area; and acquiring the size of the chamfer surface based on the image. The workpiece size detection method provided by the application uses the infrared light to irradiate the detection area, which has strong penetration ability, can effectively solve the white spot problem caused by possible burrs and unevenness on the chamfer surface when white light irradiates the chamfer surface, reduce the influence of white spots, improve the clarity of the edge position of the chamfer surface, and further improve the detection accuracy of the size of the chamfer surface. BRIEF DESCRIPTION OF DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0010] Figure 1 The position structure diagram of a specific embodiment of the workpiece in the workpiece size detection device provided by the application and the camera and the infrared light source;

[0011] Figure 2 For Figure 1Structure diagram of a first chamfer surface detected by the workpiece size detection device shown;

[0012] Figure 3 Position structure diagram of another specific embodiment of the workpiece size detection device provided by the present application;

[0013] Figure 4 For Figure 3 Structure diagram of a second chamfer surface detected by the workpiece size detection device shown;

[0014] Figure 5 Overall structure diagram of a specific embodiment of the workpiece size detection device provided by the present application;

[0015] Figure 6 For Figure 5 Internal structure diagram of the workpiece size detection device shown;

[0016] Figure 7 For Figure 6 Structure diagram of a first detection station in the workpiece size detection device shown;

[0017] Figure 8 For Figure 7 Mounting structure diagram of a camera in the first detection station of the workpiece size detection device shown;

[0018] Figure 9 For Figure 6 Structure diagram of a second detection station in the workpiece size detection device shown;

[0019] Figure 10 For Figure 9 Mounting structure diagram of a camera in the second detection station of the workpiece size detection device shown;

[0020] Figure 11 Image diagram obtained by a first camera in the workpiece size detection device;

[0021] Figure 12 Flowchart of a specific embodiment of the detection method provided by the present application;

[0022] Wherein: camera-100; first camera-101; second camera-102; infrared light source-200; first infrared light source-201; second infrared light source-202; workpiece-300; first chamfer-301; second chamfer-302; workpiece size detection device-400; feeding device-410; jig-421; first XY two-way moving module-422; first rotating component-423; gripper-430; second XY two-way moving module-431; second rotating component-432; lifting component-433; camera support-440; first camera support-441; second camera support-442; micro-motion platform-450; first micro-motion platform-451; second micro-motion platform-452; light source support-460; first light source support-461; second light source support-462. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0024] Please refer to Figures 1 to 11 In this embodiment, the workpiece detected by the workpiece size detection device includes at least a chamfer and an adjacent surface intersecting the chamfer, specifically, the workpiece size detection device includes an infrared light source, a camera and an image processor, as shown in Figure 1 and Figure 3 .

[0025] Wherein, the infrared light source 200 is used to irradiate infrared light on the detection area of the workpiece 300 containing the chamfer; the camera 100 is used to acquire the image of the detection area; the image processor is connected with the camera 100 and acquires the size of the chamfer area based on the image; wherein the wavelength of the infrared light is between 850-940nm.

[0026] The detection equipment provided by the application utilizes the infrared light source 200 to emit infrared light, and the infrared light has strong penetration capability, which can effectively solve the white spot problem caused by possible burrs and unevenness on the chamfer surface when white light irradiates the chamfer surface, reduce the influence of the white spot, improve the definition of the edge position of the chamfer surface, and further improve the definition of the image of the detection area; the camera transmits the obtained image to the image processor, and the image processor analyzes the image through the built-in program to obtain size data, so that the precision and efficiency of the chamfer surface size detection can be effectively improved; at the same time, by setting the wavelength of the infrared light to 850-940 nm, the ordinary industrial camera can obtain the infrared light of this wavelength, without using the infrared camera with higher cost, the requirement for the camera 100 can be reduced, and the detection cost can be reduced.

[0027] As described above, the size data can be obtained by the image processor running the built-in program to analyze the image. For example, the obtained image can be compared with the existing reference to obtain the size data according to certain image size proportion relationship, pixel proportion relationship, etc. Of course, the image can also be analyzed to obtain the size data by other existing algorithms, which is not absolutely limited in the present application.

[0028] The detection equipment is preferably applied to the detection of small-sized planes, such as the detection of the chamfer surface size of the middle frame of electronic equipment, and of course, can also be applied to the detection of other small-sized planes, and the plane to be detected and the adjacent surface have obvious boundaries.

[0029] Preferably, the wavelength of the infrared light is 920-940 nm, and most preferably 940 nm. The infrared light of this wavelength can be obtained by the ordinary industrial camera under the premise of ensuring strong penetration capability.

[0030] Specifically, the camera 100 is used to obtain the image of the chamfer surface and the adjacent surface, and the camera 100 can be an industrial camera; the infrared light source 200 is used to emit infrared light to the chamfer surface, part of the light path in the infrared light can be reflected after the chamfer surface, and enter the camera 100, and the camera 100 obtains part of the light path of the infrared light. Due to the strong penetration of the infrared light, part of the light path will form a weak diffuse scattering type of residual light at the edge position of the chamfer surface, which will refract to both sides of the chamfer surface and will not refract into the camera 100, which can overcome the white spot influence caused by the chamfer burr and other factors at the edge of the chamfer surface, improve the exposure definition of the edge position of the chamfer surface, and further improve the precision of the chamfer surface size detection; the image processor is used to calculate the width size of the chamfer surface according to the image, and judge whether the size of the chamfer surface is within the qualified size range, which has high precision and high efficiency.

[0031] In order to solve the problem that the industrial camera is not sensitive to infrared light, the brightness of the infrared light is increased for improvement. Specifically, the brightness power of the infrared light source 200 is 8-12W, which is 5 to 10 times higher than the brightness of the white light in the prior art. By increasing the brightness of the infrared light, the problem of low sensitivity of the ordinary industrial camera to the infrared light can be effectively solved, and the detection accuracy can be significantly improved under the premise of the existing camera 100, and the cost is low.

[0032] In some embodiments, the detection device further comprises a camera support 440 and a micro-motion platform 450, and the camera 100 is connected to the camera support 440 through the micro-motion platform 450; wherein the camera 100 is configured to be arranged in an inclined manner with the imaging optical axis direction being inclined to the chamfered surface, so that the camera 100 acquires the image of the detection area in a direction inclined to the chamfered surface. Specifically, the inclination angle of the camera 100 can be realized by adjusting the micro-motion platform 450. Further, the light source support 460 is also installed on the camera support 440, and the infrared light source 200 is installed on the light source support 460, and the irradiation angle of the infrared light source 200 can be realized by adjusting the light source support 460.

[0033] In some embodiments, the detection device further comprises a jig 421, and the jig 421 is used to carry the workpiece 300, and the workpiece 300 at least comprises a first chamfered surface 301 and a first abutting surface intersecting the first chamfered surface 301, as shown in Figure 2 Further, the infrared light source 200 comprises a first infrared light source 201, and the camera 100 comprises a first camera 101, as shown in Figure 1 The first infrared light source 201 and the first camera 101 are both arranged above the jig 421, and when the workpiece 300 is placed on the jig 421, the first chamfered surface 301 is located in the upper inner side of the workpiece 300. The first camera 101 is configured to be arranged in an angle of 75°-80° between the imaging optical axis direction and the first chamfered surface 301. The irradiation direction of the first infrared light source 201 is parallel to the imaging optical axis direction of the first camera 101. The above-mentioned arrangement can reduce the influence of the chamfered surface burr on the imaging effect, and can ensure stable imaging effect even in the case of burr or uneven burr.

[0034] Preferably, as shown in Figure 1As shown, the light emitting position of the first infrared light source 201 is close to the imaging optical axis position of the first camera 101. Specifically, by using the first infrared light source 201 close to the first camera 101, that is, by using the light source close to the lens of the camera 100, the light emitted by the first infrared light source 201 can cover the edge of the chamfered surface, and the influence of the inconsistent light and dark caused by the difference in the material of the product around the chamfered surface is minimized; part of the light path in the infrared light just passes through the chamfered surface, and in combination with the inclined arrangement of the first camera 101 and the first infrared light source 201 relative to the first chamfered surface 301, as well as the penetration of the infrared light, part of the light path is not refracted into the lens due to weak diffusion, which can effectively overcome the influence of the chamfer burr.

[0035] In an embodiment, the first chamfered surface 301 is at an angle of 45° relative to the bearing surface of the jig 421, and the imaging optical axis direction of the first camera 101 is inclined at an angle of 55°-60° relative to the bearing surface direction of the jig 421, that is, the angle of the first camera 101 can be adjusted by taking the bearing surface of the jig 421 as a reference, which is convenient for operation.

[0036] Further, as shown in Figure 7 and Figure 8 , the camera support 440 includes a first camera support 441, and the micro-motion platform 450 includes a first micro-motion platform 451, and the first camera 101 is connected to the first camera support 441 through the first micro-motion platform 451; the inclination angle of the first camera 101 can be achieved by adjusting the first micro-motion platform 451; the first camera support 441 is also provided with a first light source support 461, and the first infrared light source 201 is installed on the first light source support 461, and the position and irradiation angle of the first infrared light source 201 can be achieved by adjusting the first light source support 461.

[0037] In some embodiments, as shown in Figure 6 , the detection device further includes a gripper 430 for grabbing the workpiece 300, and the workpiece 300 further includes a second chamfered surface 302 located on the side opposite to the first chamfered surface 301; as shown in Figure 3As shown, the infrared light source 200 includes a second infrared light source 202, and the camera 100 further includes a second camera 102; the second infrared light source 202 and the second camera 102 are both arranged below the gripper 430, and the second camera 102 is arranged at an angle of 70°-75° with the imaging optical axis direction of the second chamfered surface 302, and the second infrared light source 202 is arranged at an angle of 45° with the second chamfered surface 302, and the imaging optical axis direction of the second camera 102 and the irradiation direction of the second infrared light source 202 are respectively located on two sides of the perpendicular direction of the second chamfered surface 302, i.e. the imaging optical axis direction of the second camera 102 and the irradiation direction of the second infrared light source 202 are inclined in different directions relative to the perpendicular line of the second chamfered surface 302, so that the light emitted by the second infrared light source 202 can enter the second camera 102. In a specific embodiment, the angle between the second chamfered surface 302 and the bearing surface of the gripper 430 is 45°, and the second infrared light source 202 can irradiate the second chamfered surface 302 in a direction perpendicular to the bearing surface of the gripper 430, i.e. the second infrared light source 202 can be installed directly below the gripper 430, or the gripper 430 can be moved to be directly above the second infrared light source 202.

[0038] Further, as shown in Figure 9 and Figure 10 , the camera support 440 includes a second camera support 442, and the micro-motion platform 450 includes a second micro-motion platform 452, and the second camera 102 is connected to the second camera support 442 through the second micro-motion platform 452; the inclination angle of the second camera 102 can be adjusted through the second micro-motion platform 452; the second light source support 462 is also installed on the second camera support 442, and the second infrared light source 202 is installed on the second light source support 462, and the position and irradiation angle of the second infrared light source 202 can be adjusted through the second light source support 462.

[0039] In some embodiments, as shown in Figure 7 , the detection device further includes a first XY bidirectional movement module 422 and a first rotating component 423; specifically, the first rotating component 423 is arranged on the first XY bidirectional movement module 422, and the jig 421 is connected to the first rotating component 423; wherein the workpiece size detection device 400 is configured to: the jig 421 can be moved into the detection field of view of the first camera 101 under the drive of the first XY bidirectional movement module 422, and can be rotated in the detection field of view of the first camera 101 under the drive of the first rotating component 423. The first XY bidirectional movement module 422 can be a linear motor mechanism arranged along the X direction and another linear motor mechanism arranged along the Y direction arranged above it, and the first rotating component 423 can be installed on the linear motor mechanism arranged along the Y direction.

[0040] In some embodiments, as shown inFigure 9 As shown, the detection device further comprises a second XY bidirectional movement module 431 and a second rotating component 432; the second rotating component 432 is arranged on the second XY bidirectional movement module 431, and the gripper 430 is connected with the second rotating component 432; wherein the workpiece size detection device 400 is configured to: under the driving of the second XY bidirectional movement module 431, the gripper 430 can move the workpiece 300 from the detection field of view of the first camera 101 to the detection field of view of the second camera 102, and under the driving of the second rotating component 432, the workpiece 300 is rotated in the detection field of view of the second camera 102. Specifically, the detection device further comprises a lifting component 433, the second XY bidirectional movement module 431 is installed on the lifting component 433, and the lifting component 433 is used to lift the second XY bidirectional movement module 431, thereby realizing the lifting of the first rotating component 423 and the jig 421. The lifting component 433 can also be a linear motor. The second XY bidirectional movement module 431 can adopt a configuration similar to the principle of the first XY bidirectional movement module 422, and details are not repeated here.

[0041] By using the above scheme, the workpiece can be moved in the X direction and the Y direction, on the one hand, it can ensure that the position of the workpiece to be measured can enter the field of view of the camera; on the other hand, when there are multiple detection points, the workpiece is moved in the X direction and the Y direction, so that multiple measurement point images can be taken in batches, without frequent adjustment of the camera angle. Further, the workpiece can be rotated under the driving of the first rotating component or the second rotating component. When there are detection points on the edges extending in different directions of the workpiece, as long as the workpiece is rotated, any detection point can be opposite to the camera. For example, in a middle frame workpiece, each long edge and each short edge has 3 equidistantly distributed detection points, respectively. During detection, the X direction linear motor mechanism or the Y direction linear motor mechanism is used to move the 3 points on a certain edge to positions opposite to the camera; the workpiece is rotated to face another edge to the camera, and then the workpiece is moved to move the 3 points to positions opposite to the camera, and so on, to complete the detection of 12 detection points.

[0042] Further, when the second chamfer surface 302 is located on the lower surface of the workpiece 300, the second infrared light source 202 is located directly below the second chamfer surface 302. Specifically, since the reflectivity of the first surface and the second surface of the workpiece 300 is different, when the chamfer surface of the second surface of the workpiece 300 is detected, the light source is placed at a position of 30-50 mm below the chamfer surface, regular light is refracted into the lens of the camera 100, the image of the product is stable, and the influence of burrs is overcome.

[0043] Preferably, the lens of the camera 100 is preferably a telecentric lens, which can effectively correct the parallax of a traditional industrial lens, and can keep the magnification of the obtained image unchanged within a certain object distance range.

[0044] In a specific embodiment, the detection equipment also includes a loading device 410 and an equipment body for obtaining the workpiece 300. The loading device 410, the first XY bidirectional movable module 422, the second XY bidirectional movable module 431, and the camera bracket 440 are all installed on the equipment body. The camera 100 and the infrared light source 200 are both installed on the camera bracket 440. The equipment body is provided with a first detection station and a second detection station. The camera bracket 440 includes a first camera bracket 441 and a second camera bracket 442. The first camera 101 and the first infrared light source 201 are installed on the first camera bracket 441. The first camera bracket 441 is located at the first detection station. When the workpiece 300 is in the first detection station, it is located below the first camera 101 and the first infrared light source 201. The first detection station is used to obtain images of the first chamfered surface 301 and the first adjacent surface, such as Figure 11 As shown, it can be seen that the image at the junction of the first chamfered surface 301 and the first adjacent surface is clear; the second camera 102 and the second infrared light source 202 are installed on the second supporting component, and the second supporting component is located at the second inspection station. When the workpiece 300 is in the second inspection station, it is located above the second camera 102 and the second infrared light source 202. The second inspection station is used to obtain the image of the second chamfered surface 302 and the second adjacent surface; the gripper 430 can move the workpiece 300 from the first inspection station to the second inspection station; the manipulator in the loading device 410 places the workpiece 300 on the fixture 421, and the fixture 421 moves following the first XY bidirectional moving module 422. When it moves to the first inspection station, the fixture 421 drives the workpiece 300 The first camera 101 obtains images of target positions of the first chamfered surface 301 on the workpiece 300; the gripper 430 takes the workpiece 300 to the second inspection station, and the gripper 430 moves following the second XY bidirectional moving module 431 and drives the workpiece 300 to rotate. The second camera 102 obtains images of target positions of the second chamfered surface 302 on the workpiece 300. After image acquisition is completed, the gripper 430 drives the workpiece 300 to continue moving to the next process.

[0045] In some embodiments, the number of the loading device 410, the fixture 421, the gripper 430, the first XY bidirectional movable module 422, the second XY bidirectional movable module 431, the first camera bracket 441 and the second camera bracket 442 are all at least two groups, which can measure at least two workpieces 300 at the same time, thereby improving detection efficiency.

[0046] In addition to the above-mentioned detection device, the present invention further provides a detection method for detecting a workpiece 300, wherein the workpiece 300 includes a chamfered surface and an adjacent surface obliquely intersecting the chamfered surface. As shown in FIG12 , the detection method includes the following steps:

[0047] Step S1: irradiating a detection area of the workpiece 300 with infrared light, the detection area comprising the chamfered surface;

[0048] Step S2: acquiring an image of the detection area;

[0049] Step S3: based on the image, acquiring the size of the chamfered surface.

[0050] The detection method uses the infrared light source 200 to emit infrared light, and since the infrared light has strong penetration ability, it can effectively solve the interference of white spots, improve the definition of the edge position of the chamfered surface, and further improve the definition of the image of the detection area. Through the image processor, the size of the chamfered surface can be automatically acquired, which can effectively improve the precision and efficiency of the detection of the size of the chamfered surface.

[0051] In some embodiments, the wavelength of the infrared light is 850-940 nm. By setting the wavelength of the infrared light to 850-940 nm, an ordinary industrial camera can acquire infrared light of this wavelength, without the need to use a more expensive infrared camera, which can reduce the requirements for the camera 100 and reduce the detection cost.

[0052] In some embodiments, the detection area further comprises an abutment surface, and the detection method further comprises, based on the image, acquiring the size of the abutment surface, which can be used as a basis for judging whether the size and position of the chamfered surface meet the requirements. If the size of the abutment surface is too small, there may be a problem of the size of the chamfered surface being too small or the position being incorrect.

[0053] In some embodiments, the image is acquired along a direction inclined to the chamfered surface. By setting the direction of irradiation of the infrared light source 200 to be inclined to the surface of the chamfered surface instead of being perpendicular to it, the influence of burrs on the chamfered surface can be reduced, and the imaging effect can be stable even in the presence of burrs or uneven burrs.

[0054] In some embodiments, the workpiece 300 is frame-shaped, for example, the workpiece 300 can be the middle frame of a mobile phone, and the workpiece 300 comprises a first chamfered surface 301 located along the inner edge of the workpiece 300 and a first abutment surface intersecting the first chamfered surface; wherein the image is acquired from a first direction that is 75°-80° to the first chamfered surface 301, the size of the first chamfered surface 301 and the first abutment surface is further acquired, and the infrared light irradiates the first chamfered surface 301 along a direction parallel to the first direction. The above-mentioned setting can reduce the influence of burrs on the chamfered surface and ensure stable imaging effect, since the intersection position of the chamfered surface and the abutment surface, i.e. the edge position of the chamfered surface, has different reflectivity due to the influence of burrs on the chamfered surface.

[0055] and / or,

[0056] The workpiece 300 includes a second chamfer surface 302 located on the inner side of the workpiece 300 and a second abutment surface intersecting the second chamfer surface, and the second chamfer surface 302 is located on the side opposite to the first chamfer surface 301; an image is obtained from a second direction of 70°-75° with the second chamfer surface 302, and the size of the second chamfer surface 302 and the second abutment surface is further obtained; infrared light irradiates the second chamfer surface 302 along a third direction of 30°-60° with the second chamfer surface 302, wherein the distance between the light source emitting the infrared light and the size of the second chamfer surface 302 is 30-50 mm; and the second direction and the third direction are located on the two sides of the perpendicular direction of the second chamfer surface 302, that is, the second direction and the third direction are inclined in different directions relative to the perpendicular of the second chamfer surface 302, which can ensure that the light emitted by the second infrared light source 202 can enter the second camera 102.

[0057] When detecting the workpiece 300, taking the chamfer surface size detection of the electronic device middle frame as an example, a plurality of target positions can be set on the chamfer surfaces of the four edges of the middle frame, and then the images of the chamfer surfaces at the target positions are obtained in sequence, and the size of the chamfer surface is obtained, which is used as the basis for determining whether the processing size of the chamfer surface is qualified.

[0058] In a specific embodiment, taking the chamfer surface size detection of the middle frame of the mobile phone as an example, one side of the middle frame of the mobile phone is provided with a first chamfer surface 301, and the other side is provided with a second chamfer surface 302, and three target positions can be taken on each of the two long edges of the first chamfer surface 301 and the second chamfer surface 302, and three target positions can be taken on each of the two short edges of the first chamfer surface 301 and the second chamfer surface 302; during detection, first, the workpiece 300 is moved to the jig 421 by the feeding device 410, and then the jig 421 drives the workpiece 300 to move to the first detection station, and the images of the target positions on the first chamfer surface 301 of the workpiece 300 are obtained, and the images are analyzed and processed by the image processor to output size information, and the size information is compared with the pre-set qualified size, and when at least one of the images of the target positions exceeds the qualified size, the workpiece 300 is judged as unqualified, otherwise it is judged as qualified; then the workpiece 300 is moved to the second detection station by the gripper 430, and the images of the target positions on the second chamfer surface 302 of the workpiece 300 are obtained, and the images are analyzed and processed by the image processor to output size information, and the size information is compared with the pre-set qualified size, and when at least one of the images of the target positions exceeds the qualified size, the workpiece 300 is judged as unqualified, otherwise it is judged as qualified. Of course, the selection position and the number of target positions can be selected as needed, and are not limited to the mode given in the embodiment.

[0059] The various embodiments described in this specification are intended to be exemplary only. The various embodiments were chosen and described in order to explain the principles of the application and its best mode of operation. It will be readily apparent to those skilled in the art that varying and / or modified embodiments of the application can be used without departing from the scope of the application. Accordingly, the application is not defined by the embodiments described herein but is defined only in accordance with the claims and their equivalents.

[0060] The above has carried on the detailed introduction to the detection equipment provided by the application. The principle and implementation mode of the application are described by applying specific examples in this paper. The above embodiment description is only used to help understand the method of the application and its core idea. It should be pointed out that for ordinary skilled in the art, without departing from the principle of the application, the application can be improved and modified. These improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A workpiece dimension detection apparatus, the workpiece (300) comprising at least a chamfer surface and an adjoining surface which meets the chamfer surface at an oblique angle, characterised in that, The infrared light source (200) is used for irradiating infrared light on a detection area containing the chamfer surface of the workpiece (300); The camera (100) is used for acquiring an image of the detection area; The image processor is connected with the camera (100) and acquires the size of the chamfer surface area based on the image; The wavelength of the infrared light is between 850-940nm; The workpiece (300) at least includes a first chamfer surface (301) and a first adjacent surface intersecting with the first chamfer surface (301); The infrared light source (200) includes a first infrared light source (201), and the camera (100) includes a first camera (101); the first infrared light source (201) and the first camera (101) are both arranged above a jig (421), the first camera (101) is arranged at an angle of 75-80° with the first chamfer surface (301) in the imaging optical axis direction; the irradiation direction of the first infrared light source (201) is parallel to the imaging optical axis direction of the first camera (101); and the light-emitting position of the first infrared light source (201) is close to the imaging optical axis position of the first camera (101). Further comprising:

2. The workpiece dimension detecting apparatus according to claim 1, characterized by, A camera support (440) and a micro-motion platform (450), the camera (100) is connected to the camera support (440) through the micro-motion platform (450); wherein the camera (100) is arranged at an angle of 75-80° with the chamfer surface in the imaging optical axis direction, so that the camera (100) acquires the image of the detection area in a direction inclined to the chamfer surface. Further comprising:

3. The workpiece dimension detecting apparatus according to claim 1 or 2, characterized by A jig (421) for carrying the workpiece (300). Further comprising:

4. The workpiece dimension detecting apparatus according to claim 3, wherein A gripper (430) for grabbing the workpiece (300), the workpiece (300) further includes a second chamfer surface (302) located on the side opposite to the first chamfer surface (301); The infrared light source (200) includes a second infrared light source (202), and the camera (100) further includes a second camera (102); the second infrared light source (202) and the second camera (102) are both arranged below the gripper (430), the second camera (102) is arranged at an angle of 70-75° with the second chamfer surface (302) in the imaging optical axis direction, the second infrared light source (202) is arranged at an angle of 30-60° with the second chamfer surface (302), and the imaging optical axis direction of the second camera (102) and the irradiation direction of the second infrared light source (202) are respectively located on the two sides of the perpendicular direction of the second chamfer surface (302). Further comprising:

5. The workpiece dimension detecting apparatus according to claim 4, wherein A first XY bidirectional movement module (422); A first rotating component arranged on the first XY bidirectional movement module (422), the jig (421) is connected with the first rotating component; ​ The workpiece size detection device (400) is configured such that the jig (421) can be moved into the detection field of view of the first camera (101) under the driving of the first XY bidirectional movement module (422) and rotated in the detection field of view of the first camera (101) under the driving of the first rotating component.

6. The workpiece dimension detecting apparatus according to claim 5, wherein Further comprising: A second XY bidirectional movement module (431); A second rotating component (432) arranged on the second XY bidirectional movement module (431), and the gripper (430) is connected with the second rotating component (432); The workpiece size detection device (400) is configured such that the gripper (430) can move the workpiece (300) from the detection field of view of the first camera (101) to the detection field of view of the second camera (102) under the driving of the second XY bidirectional movement module (431), and rotate the workpiece (300) in the detection field of view of the second camera (102) under the driving of the second rotating component (432).

7. A method of measuring a workpiece (300) comprising a chamfer surface and an adjoining surface which meets the chamfer surface at an oblique angle, characterised by, It comprises: Irradiate the detection area of the workpiece (300) with infrared light, and the detection area contains the chamfered surface; wherein the wavelength of the infrared light is between 850-940nm; Obtain an image of the detection area; Obtain the size of the chamfered surface based on the image; The workpiece (300) comprises a first chamfered surface (301) located on the inner side of the workpiece (300) and a first adjacent surface intersecting with the first chamfered surface (301); wherein the image is obtained from a first direction of 75°-80° with the first chamfered surface (301), and the size of the first chamfered surface (301) and the first adjacent surface is further obtained; the infrared light source (200) is used to irradiate the detection area containing the chamfered surface on the workpiece (300) with infrared light, and the camera (100) is used to obtain the image of the detection area, the infrared light source (200) comprises a first infrared light source (201), and the camera (100) comprises a first camera (101); the first infrared light source (201) is arranged close to the imaging optical axis position of the first camera (101).

8. The workpiece size detection method according to claim 7, wherein: The detection area further comprises the adjacent surface, and the detection method further comprises obtaining the size of the adjacent surface based on the image.

9. The workpiece size detection method according to claim 7, wherein: The image is obtained along a direction inclined to the chamfered surface.

10. The workpiece size detection method according to any one of claims 7 to 9, wherein: The workpiece (300) is frame-shaped; And / or, The workpiece (300) comprises a second chamfer surface (302) located in the workpiece (300) and a second abutment surface intersecting the second chamfer surface (302) obliquely, the second chamfer surface (302) is located on the opposite side of the first chamfer surface (301); the image is obtained from a second direction of 70°-75° with the second chamfer surface (302), and the size of the second chamfer surface (302) and the second abutment surface is further obtained; The infrared light irradiates the second chamfer surface (302) along a third direction of 30°-60° with the second chamfer surface (302), wherein the light source emitting the infrared light is 30-50mm away from the second chamfer surface (302); and the second direction and the third direction are located on the two sides of the perpendicular direction of the second chamfer surface (302), respectively.

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