Reconfigurable host with replaceable interface board

Abstract

A host of a device manufacturing system includes a base, a plurality of floors on the base, and a cover above the plurality of floors. A first floor of the plurality of floors includes a frame. The base, the cover, and the plurality of floors together define an interior space that includes a robotic arm. A first replaceable interface plate is attached to the first frame of the first floor. The first replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide the robotic arm with access to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide the robotic arm with access to a second process chamber.

Description

[0001] This application is a divisional application of the invention patent application with the application date of December 7, 2020, the application number of 202011439532.7, and the invention name of “Reconfigurable mainframe with replaceable interface plate”. TECHNICAL FIELD

[0002] Embodiments of the present disclosure generally relate to electronic device manufacturing systems, and more particularly to a reconfigurable mainframe of an electronic device manufacturing system including a replaceable interface plate. Embodiments also relate to a replaceable interface plate for a mainframe. BACKGROUND

[0003] A conventional electronic device manufacturing system (also referred to as a device manufacturing system) can include a mainframe around which a plurality of process chambers and load lock chambers are arranged. The mainframe can have a plurality of sidewalls (commonly referred to as “facets”) to which the process chambers and / or load lock chambers are coupled. The facets of a conventional mainframe are machined to have a pre-arranged configuration with substrate access ports of predetermined sizes, positions, etc. Once a conventional mainframe is manufactured, the types, sizes, arrangements, and positions of the substrate access ports are fixed for that mainframe. If the owner of the mainframe wants a new configuration, a new mainframe with the new configuration is purchased. SUMMARY

[0004] According to a first aspect of the present disclosure, a mainframe of a device manufacturing system includes a base, a plurality of facets on the base, and a lid over the plurality of facets. A first facet of the plurality of facets includes a first frame. The base, the lid, and the plurality of facets together define an interior space that includes a robot arm. A first replaceable interface plate is attached to the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide the robot arm with access to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide the robot arm with access to a second process chamber. In one embodiment, the first replaceable interface plate is load bearing and the frame is not load bearing.

[0005] According to a second aspect of the disclosure, a replaceable interface plate is configured for attachment to a machine face of a host machine. The replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide access from the host machine to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide access from the host machine to a second process chamber. The replaceable interface plate is load bearing for the host machine. Thus, the replaceable interface plate is configured to bear vertical forces acting on the host machine caused by a pressure differential between an interior space of the host machine and an exterior of the host machine.

[0006] According to a third aspect of the disclosure, a method of configuring a host machine includes determining a first plurality of process chambers to be coupled to a first machine face of the host machine, determining locations of a plurality of substrate access ports on the machine face that are to accommodate the first plurality of process chambers, determining a configuration of a first replaceable interface plate having one of the plurality of substrate access ports at each of the locations, and manufacturing the first replaceable interface plate. The method further includes attaching the first replaceable interface plate to the first machine face of the host machine, and attaching the first plurality of process chambers to the first replaceable interface plate, wherein each of the plurality of process chambers is accessible from the host machine through one of the plurality of substrate access ports. The method can be performed after the host machine has been manufactured (e.g., to change a configuration of the host machine). BRIEF DESCRIPTION OF DRAWINGS

[0007] In the drawings, which are included by way of example and not limitation, like numerals refer to like elements throughout the several views of the drawings, and in which:

[0008] FIG. 1A A schematic top view of an electronic device manufacturing system having a reconfigurable host machine in a first configuration is shown in accordance with an embodiment of the disclosure.

[0009] FIG. 1B A schematic top view of an electronic device manufacturing system having a reconfigurable host machine in a second configuration is shown in accordance with an embodiment of the disclosure.

[0010] FIG. 1C A schematic top view of an electronic device manufacturing system having a reconfigurable host machine in a third configuration is shown in accordance with an embodiment of the disclosure.

[0011] FIG. 2AA perspective view of a reconfigurable host is shown in accordance with embodiments of the present disclosure.

[0012] FIG. 2B A side view of a first example replaceable interface plate is shown in accordance with embodiments of the present disclosure.

[0013] FIG. 2C A side view of a second example replaceable interface plate is shown in accordance with embodiments of the present disclosure.

[0014] FIG. 2D A side view of a third example replaceable interface plate is shown in accordance with embodiments of the present disclosure.

[0015] FIG. 3 A cross-sectional side view of a host and attached replaceable interface plate taken at the location of a substrate in-out port is depicted in accordance with embodiments of the present disclosure.

[0016] FIG. 4 A cross-sectional side view of a host and attached replaceable interface plate taken at the location of a column of the frame of the host is depicted in accordance with embodiments of the present disclosure.

[0017] FIG. 5 A process for assembling a reconfigurable host of an electronic device manufacturing system is shown in accordance with embodiments of the present disclosure. DETAILED DESCRIPTION

[0018] Embodiments are directed to a reconfigurable host (also referred to as a transfer chamber) having one or more replaceable interface plates. The reconfigurable host includes a plurality of bays, where at least one of the bays includes a frame configured to receive a replaceable interface plate. In one embodiment, the reconfigurable host includes a frame for each bay of the reconfigurable host. A replaceable interface plate can be attached to each frame. A cover can be located above the frames of the bays and can be secured to the replaceable interface plates. In embodiments, the replaceable interface plates are load bearing and the frames are not load bearing. Thus, when the interior space of the host is evacuated to a vacuum, the replaceable interface plates bear the vertical (and horizontal) forces and little or no force is imparted to the frames.

[0019] In some embodiments, the mainframe can have a square or rectangular shape. One or more load lock chambers can be coupled to one face of the mainframe. In one embodiment, one or more load lock chambers are coupled to a replaceable interface plate on one face of the mainframe. In one embodiment, additional replaceable interface plates are connected to one or more additional faces of the mainframe, and one or more process chambers are coupled to some or all of these additional replaceable interface plates. The process chambers can perform various substrate processes, and the process chambers coupled to different replaceable interface plates on these faces can have different sizes, can have different sized substrate access ports, can have different connection types, can have different heights, etc. For example, some substrate access ports can include a height to accommodate two end effectors at different pitches. Also, each replaceable interface plate can be configured to couple to the same number or a different number of process and / or load lock chambers. For example, one replaceable interface plate can be configured to couple to a single process chamber of a first size, a second replaceable interface plate can be configured to couple to two process chambers each having a second size different from the first size, etc. One or more substrate access ports on each replaceable interface plate can interface each of the load lock chambers and process chambers with a transfer chamber to enable substrates to be transferred between the two. The substrate access ports can be sized and positioned on each replaceable interface plate to accommodate the number and size of chambers that can be coupled to each face. An electronic device manufacturing system having such a mainframe can enable a wider range of variations and more diverse sequences of substrate processes to be performed in a single system, thereby increasing the versatility, capability, and / or efficiency of such an electronic device manufacturing system. In other aspects, methods of assembling an electronic device manufacturing system are provided.

[0020] The reconfigurable host and replaceable interface plates disclosed in embodiments provide a number of advantages over conventional hosts. Conventional hosts have a single design that is determined at the time of manufacture. The single design has a fixed number of substrate in / out ports that are of fixed size and fixed location. If it is ever advantageous to change the configuration of such a conventional host, the option is to purchase a new host with the new configuration. In contrast, the reconfigurable host can be reconfigured at any time by manufacturing a new replaceable interface plate. If a new configuration would be beneficial, one or more new replaceable interface plates can be manufactured with the new configuration. The existing replaceable interface plates can then be removed from the host and the new replaceable interface plates can be attached to the host. Thus, in embodiments, the flexibility of the host is significantly increased. In addition, the useful life of the host can be increased since the host can be updated with new replaceable interface plates as new process chambers become available, new slit valve technology is developed, new local center finding (LCF) technology (e.g., using light emitting diodes (LEDs), lasers for determining the position of a wafer within a pocket of an end effector or robot blade, and / or other scanning methods) is developed, etc. For example, an old replaceable interface plate with outdated slit valve technology, outdated local center finding technology, etc. can be replaced with a new replaceable interface plate with new slit valve technology and / or new local center finding technology.

[0021] As used herein, the singular form "a", "an", and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a single substrate (e.g., a single wafer) as well as a plurality of substrates in combination, reference to "a process chamber" includes one process chamber as well as a combination of two or more process chambers, and so on.

[0022] As used herein, the term "about" in connection with a measured quantity means the normal variations associated with the measurement of that quantity as would be appreciated by one of ordinary skill in the art, to the extent that such variations are expected to exist, and as would be expected by one of ordinary skill in the art in making the measurement and exercising a level of care typical in the art. In certain embodiments, the term "about" includes ±10% of the referenced number, such that "about 10" would include 9 to 11.

[0023] The description herein of values of ranges is meant to serve only as a reductive way of separately referencing each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it was individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate certain materials and methods and does not pose a limitation on the scope of the disclosed materials and methods. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the disclosed materials and methods.

[0024] FIGS. 1A-1C A schematic top view of an electronic device manufacturing system having a reconfigurable host is shown. FIG. 1A A schematic top view of a first configuration 100A of an electronic device manufacturing system according to embodiments of the disclosure is shown. FIG. 1B A schematic top view of a second configuration 100B of an electronic device manufacturing system according to embodiments of the disclosure is shown. FIG. 1C A schematic top view of a third configuration 100C of an electronic device manufacturing system according to embodiments of the disclosure is shown.

[0025] The electronic device manufacturing system is configured to process substrates and can include a host (also referred to as a transfer chamber) 104 having four floors 101A-D. Although the four floors 101A-D are shown in a rectangular configuration, the host 104 can alternatively have other numbers of floors (e.g., such as 5 floors, 6 floors, 7 floors, 8 floors, etc.) and / or other shapes. In embodiments, the floors can have the same dimensions (e.g., the same width) or different dimensions. In one embodiment, the host 104 has a rectangular shape in which the floors 101A and 101C are approximately parallel to each other, the floors 101B and 101D are approximately parallel to each other, and the floors 101A and 101C are approximately perpendicular to the floors 101B and 101D. In one embodiment, the floors 101B and 101D have a first length that is at least twice a second length of the floors 101A and 101C. In one embodiment, the floors 101B and 101D have a length of about 100-150 inches and the floors 101A and 101C have a length of about 40-60 inches. In one embodiment, the host 104 has a pentagonal shape. In one embodiment, the host includes a first floor having a first length, second and third floors on either side of the first floor (each having a second length that is greater than the first length), and fourth and fifth floors connected to the second and third floors, respectively (each having a third length that is greater than or equal to the first length and less than the second length).

[0026] The main unit 104 may include an internal space 134, wherein facets 101A to 101D may define sidewalls of the internal space 134. The main unit 104 may additionally include a base (not shown) and a cover (not shown). Facets 101A to 101D, the base, and the cover may together define the internal space 134. A robotic arm (also referred to as a robotic assembly) 136 may be disposed within the internal space 134 of the main unit 104. The internal space 134 may typically be under a vacuum during operation of the main unit 104.

[0027] Each of the facets 101A to 101D may include a frame and may have replaceable interface plates attached. Alternatively, a subset of facets 101A to 101D may include multiple frames to which multiple replaceable interface plates are attached. Other facets with built-in sidewalls having a fixed construction can be manufactured in a conventional manner. For each facet having a frame instead of a fixed construction, a replaceable interface plate may be attached to the frame of that facet and may form the sidewall of that facet. At any time, an existing replaceable interface plate attached to a facet may be removed, and a new replaceable interface plate with a different design may be attached to that facet. Thus, host 104 is a reconfigurable host with a flexible design.

[0028] exist FIG. 1A In this configuration, replaceable interface board 128A is attached to surface 101B, replaceable interface board 129 is attached to surface 101C, replaceable interface board 130A is attached to surface 101D, and replaceable interface board 131 is attached to surface 101A. Replaceable interface board 128A has three substrate in / out ports 132. Each substrate in / out port 132 can be configured to allow a horizontally oriented substrate 140 to pass through it. The substrate 140 can be a wafer (e.g., a semiconductor wafer or non-semiconductor device substrate), a glass plate or panel, and / or other workpieces used for manufacturing electronic devices or circuit components. Each substrate in / out port 132 may be, for example, an elongated slot or slit formed in the sidewall of the host 104 or in the replaceable interface plates 128A, 130A, and each may include, for example, a slit valve or other suitable means for opening and closing the substrate in / out port 132 and / or a local center finder (LCF) suitable for determining the position of the substrate 140 conveyed through the substrate in / out port 132. The slit valve may have any suitable conventional construction, such as, for example, an L-shaped motion slit valve. Other suitable means may also be used to open and close the substrate in / out port 132. In embodiments, the substrate in / out port 132 may include a single gate or a double gate (e.g., having a first gate at the substrate in / out port on the inside of the replaceable interface plate and a second gate at the substrate in / out port on the outside of the replaceable interface plate).

[0029] Three process chambers 106, 108, 110 are attached to replaceable interface plate 128A. Process chambers 106-110 each have a chamber port that is aligned with a substrate in-out port 132 in replaceable interface plate 128A.

[0030] Replaceable interface plate 130A has three substrate in-out ports 132. Three process chambers 112, 114, 116 are attached to replaceable interface plate 130A. Process chambers 112-116 each have a chamber port that is aligned with a substrate in-out port 132 in replaceable interface plate 130A.

[0031] Replaceable interface plate 129 is a solid plate without substrate in-out ports. Replaceable interface plate 131 includes two substrate in-out ports 132. Replaceable interface plate 131 is coupled to one or more load lock chambers 126 (e.g., load lock chambers 126 can include two side-by-side load lock chambers). Load lock chambers 126 each have a chamber port that is aligned with one of the substrate in-out ports in replaceable interface plate 131.

[0032] Load lock chambers 126 can each be batch or single substrate type load lock chambers. In some embodiments, load lock chambers 126 can be stacked load lock chambers. For example, load lock chambers 126 can be double stacked load lock chambers, triple stacked load lock chambers, load lock chambers with four or more stacked loads (e.g., four load lock chambers), etc. Alternatively, load lock chambers 126 can be single space load lock chambers. Load lock chambers 126 can each have one or more chamber ports that correspond to a respective substrate in-out port 132. For example, a stacked load lock chamber 126 that has two separate substrate volumes can have vertically aligned chamber ports that respectively correspond to vertically aligned substrate in-out ports 132. A triple stacked load lock chamber that has three separate substrate volumes can have three vertically aligned chamber ports that correspond to vertically aligned substrate in-out ports. A single space load lock chamber can have a single chamber port that corresponds to a single substrate in-out port 132. Any one of load lock chambers 126 or multiple load lock chambers can be stacked load lock chambers, triple stacked load lock chambers, and / or single space load lock chambers. Also, in some embodiments, any one of load lock chambers 126 or multiple load lock chambers can be process capable chambers. That is, any one of load lock chambers 126 or multiple load lock chambers or any space located therein can be capable of performing a substrate pre-heat process, a purge process, a cool down process, and / or another process.

[0033] The host 104, process chambers 106-116, and / or load lock chambers 126 can each operate under vacuum pressure. The process chambers 106-116 can each perform the same or different processes on the substrates 140, including, for example, deposition, oxidation, nitridation, etching, polishing, cleaning, lithography, inspection, or the like. Other processes can also be performed therein.

[0034] The host 104 can also include a robot assembly 136 in the interior space 134. The robot assembly 136 can be configured to move one or more substrates 140 into and out of each of the process chambers 106-116 and the load lock chambers 126. The robot assembly 136 can be configured to transfer a substrate 140 directly from any one chamber to any other chamber attached to the host 104. In some embodiments, the substrates 140 can be transferred by the robot assembly 136 in any order or direction. In some embodiments, the robot assembly 136 can have dual transfer blades (or more transfer blades, also known as end effectors), each of which can independently extend to and retract from any chamber attached to the host 104, thereby increasing system throughput by enabling parallel substrate transfers. In some embodiments, the robot assembly 136 can have a single transfer blade and / or can be a SCARA (selective compliance articulated robot arm) robot. Alternatively, the robot assembly 136 can be any suitable mechanism for transferring substrates between chambers attached to the host 104, such as a linear robot or a non-linear robot.

[0035] The load lock chambers 126 can be coupled to the factory interface 102, which can be coupled to one or more FOUPs (front opening unified pods) 118. One or more load lock chambers 126 can provide a first vacuum interface between the factory interface 102 and the transfer chamber 104. In some embodiments, the load lock chambers 126 can each increase throughput of substrates by alternatingly communicating with the host (transfer chamber) 104 and the factory interface 102. That is, while one space of a stack or tri-stack load lock chamber or one load lock chamber 126 is in communication with the transfer chamber 104, other spaces of the stack or tri-stack load lock chamber or other load lock chambers 126 can be in communication with the factory interface 102. Substrate transfer between the factory interface 102, load lock chambers 126, and transfer chamber 104 can be performed in any other suitable manner.

[0036] Each FOUP 118 may be a container having a holding box for holding multiple substrates. Each FOUP 118 may have a front-opening interface configured for use with factory interface 102. Factory interface 102 may have a buffer chamber (not shown) and one or more robot assemblies 138 configured to transfer substrates 140 via linear, rotational, and / or vertical movement between FOUP 118 and loading locking chamber 126. Substrates may be transferred between FOUP 118 and loading locking chamber 126 in any order or direction. Each loading locking chamber 126 may be a batch-type or single-substrate-type loading locking chamber.

[0037] Controller 171 controls the operation of robot assembly 138, robot assembly 136, and / or the electronic device manufacturing system. Controller 171 controls the processing and transfer of substrate 140 within and through the electronic device manufacturing system. Controller 171 may be, for example, a general-purpose computer and / or may include a microprocessor or other suitable CPU (central processing unit), memory for storing software routines controlling the electronic device manufacturing system, input / output peripherals, and supporting circuitry (such as, for example, power supplies, clock circuitry, circuitry for driving robot assemblies 138, 136, caches, and / or the like). Controller 171 may be programmed to process one or more substrates sequentially, for example, through each process chamber attached to host 104. In other embodiments, controller 171 may be programmed to process substrates through process chambers in any order. In other embodiments, controller 171 may be programmed to skip and / or repeat processing of one or more substrates in one or more process chambers. Controller 171 may alternatively be programmed to process one or more substrates in the electronic device manufacturing system in any suitable manner.

[0038] The electronic device manufacturing system may have a suitable number of FOUP 118 and / or load-locking chambers 126 other than those shown. In some embodiments, the number of load-locking chambers coupled to machine face 101A may be independent of the number of process chambers coupled to any of machine faces 101B to 101D. For example, the number of load-locking chambers may differ from the maximum number of process chambers coupled to a single machine face. Moreover, in some embodiments, up to four process chambers may be coupled to a single machine face, or more than four process chambers may be coupled to a single machine face, depending on the dimensions of the host 104 relative to the dimensions of the four process chambers.

[0039] FIG. 1B It shows the relationship with FIG. 1A The same FOUP 118, factory interface 102, loading lock 126, and main unit 104 are shown. However, in FIG. 1BIn the second configuration 100B, replaceable interface board 128A has been removed from surface 101B, and replaceable interface board 128B has been attached to surface 101B. Similarly, replaceable interface board 130A has been removed from surface 101D, and replaceable interface board 130B has been attached to surface 101D. Unlike the three substrate in / out ports 132 of replaceable interface board 128A, replaceable interface board 128B has two substrate in / out ports 132. Similarly, unlike the three substrate in / out ports 132 of replaceable interface board 130A, replaceable interface board 130B has two substrate in / out ports 132. Therefore, in the second configuration 100B, process chambers 106, 108, 112, and 114 have been repositioned, and process chambers 110 and 116 have been removed.

[0040] FIG. 1C It shows the relationship with FIGS. 1A-1B The same FOUP 118, factory interface 102, loading lock 126, and main unit 104 are shown. However, in FIG. 1C In the first configuration 100C, replaceable interface board 128A has been removed from surface 101B, and replaceable interface board 128C has been attached to surface 101B. Similarly, replaceable interface board 130A has been removed from surface 101D, and replaceable interface board 130C has been attached to surface 101D. Unlike the three substrate in / out ports 132 of replaceable interface board 128A, replaceable interface board 128C has four substrate in / out ports 132. Replaceable interface board 130C has three substrate in / out ports 132, but they are in different positions than the three substrate in / out ports 132 of replaceable interface board 130A. In the third configuration 100C, process chamber 112 is in the same position, but process chambers 106, 108, 110, 114, and 116 have been removed and replaced with process chambers 122, 124, 125, and 127.

[0041] As shown, any type of process chamber can be connected to the front of the host 104 via a replaceable interface board. Some examples of process chambers include four process chambers (e.g., including process chambers 106 to 116), a single process chamber (e.g., including process chambers 125, 127), and a dual process chamber (e.g., including process chambers 122, 124).

[0042] The substrate access ports 132 can each be of a common size or have different sizes. Each of the replaceable interface plates 128A-C, 130A-C, 129, 131 can include the same or different number of substrate access ports 132, which can be similar or different in size. For example, some substrate access ports can have a first width (e.g., to receive 200 mm wafers), some substrate access ports can have a second width (e.g., to receive 300 mm wafers), and some substrate access ports can have a third width. Each substrate access port 132 can be at least wide enough for a substrate 140 to pass therethrough. Substrate access ports of different sizes can enable the robotic assembly 136 to reach different areas within a chamber coupled to one of the decks 101A-D. In some embodiments in which a replaceable interface plate has two or more substrate access ports, the substrate access ports can not be laterally centered in the substrate interface plate and / or spaced equidistant from one another. In some embodiments in which a replaceable interface plate has a single substrate access port, the substrate access port can be laterally centered or offset on the deck.

[0043] In one example, the replaceable interface plate 128A is interchangeable with a plurality of additional replaceable interface plates having: a) a different number of substrate access ports than the replaceable interface plate 128A; b) one or more substrate access ports in a different location than the plurality of substrate access ports in the replaceable interface plate 128A; c) one or more substrate access ports of a different size than the plurality of substrate access ports in the replaceable interface plate 128A; d) slit valves of a different type than the replaceable interface plate 128A; and / or e) local center finders of a different type than the replaceable interface plate 128A.

[0044] The replaceable interface plates can each have various numbers, sizes, and / or combinations of substrate access ports, as long as the width of the deck is suitable to accommodate those numbers, sizes, and / or combinations of substrate access ports. For example, in some embodiments, a replaceable interface plate can have one substrate access port 132 instead of three substrate access ports 132. In other embodiments, one replaceable interface plate can have one substrate access port 132 of a first width and one substrate access port 132 of a second width, while another replaceable interface plate can have one substrate access port of the first width and one substrate access port of a third width. Various combinations of substrate access ports are possible if the deck has a suitable width. This enables the mainframe 104 to be customized to couple to particular types and numbers of process and load lock chambers. In one example, the first width can be about 1.2 meters, the second width can be about 2.4 meters, and the third width can be about 800 mm.

[0045] In some embodiments, two electronic device manufacturing systems can be combined. That is, one face of each of the hosts 104, such as, for example, face 101C of the first host and face of the second host 202, can each include a replaceable interface plate that enables the two hosts to be coupled (e.g., coupled with one or more load locks sandwiched between the two hosts). The hosts can be coupled in a manner that provides a pass-through chamber for transferring substrates between the two hosts. This can further enhance the versatility, capability, and / or efficiency of such an electronic device manufacturing system.

[0046] FIG. 2A A perspective view of a reconfigurable host 200 according to embodiments of the present disclosure is shown. In embodiments, the reconfigurable host 200 can correspond to FIGS. 1A-1C the host 104 of FIG. 1.

[0047] The reconfigurable host 200 includes a base 206 on which a set of frames are mounted. Each frame can correspond to and enclose a side or face of the host 200. The set of frames can be conceptually a single three-dimensional frame 201 with a plurality of frame faces, where each of the frame faces encloses one face of the host 200. The frame 201 can include columns 204A-D and can further include beams 208A-D that connect the columns 204A-D. Each of the frames (or frame faces) can include a portion of the base, a pair of columns, and a corresponding beam that connects the pair of columns. For example, the base 206, columns 204A-B, and beam 208B can constitute a first frame (or frame face) for a first face, the base 206, columns 204A and 204D, and beam 208C can constitute a second frame (or frame face) for a second face, the base 206, columns 204C-D, and beam 208D can constitute a third frame (or frame face) for a third face, and the base 206, columns 204B-C, and beam 208A can constitute a fourth frame (or frame face) for a fourth face.

[0048] Each of the frames (or frame faces) can include a lip 210A, 210B located in the base 206. The lips 210A-B can be configured to support forces transferred to the lips 210A-B by replaceable interface plates attached to the faces. Additionally, each of the frames (or frame faces) can include a slot or other feature that can accept an O-ring 215, 220. The O-ring can seal the replaceable interface plate to the frame (or frame face).

[0049] As shown, the replaceable interface plate 230 is attached to the frame (or frame face) of the mainframe 200. The replaceable interface plate 230 can be attached to the frame via bolts, screws, and / or other attachment mechanisms. The replaceable interface plate 230 can include a set number, size, and location of substrate access ports 234, 236, each of which can be configured to provide a robot arm with access to a process chamber. The replaceable interface plate 230 can also have slit valves (not shown), LCFs (not shown), and / or other components attached to or integrated in the replaceable interface plate 230.

[0050] The replaceable interface plate 230 can be a metal plate. For example, the replaceable interface plate can be formed of aluminum, an aluminum alloy, steel, or another metal. In some embodiments, the replaceable interface plate includes a surface treatment, such as a coating or an anodization layer (e.g., an AI2O3 anodization layer). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, etc. Some example coatings include dielectric coatings, AI2O3 coatings, nickel plating, Y2O3 coatings, etc. The replaceable interface plate 230 can be coated prior to being attached to the mainframe 200. Alternatively, the mainframe 200 can be coated after the replaceable interface plate has been attached. Thus, in some embodiments, portions of the replaceable interface plate 230 have a surface treatment.

[0051] The replaceable interface plate 230 additionally includes a step 232 on an inner bottom surface of the replaceable interface plate 230. The step can mate with a lip on a sidewall of a base 206 that forms the frame (or frame face) to which the replaceable interface plate 230 is mounted.

[0052] The mainframe is configured to operate under vacuum, which can result in large vertical and horizontal forces being applied to the mainframe 200 based on a pressure differential between an exterior of the mainframe (e.g., which can be at atmospheric pressure) and an interior space of the mainframe. The frame 201 can bend and / or buckle under exposure to these forces. Thus, in embodiments, the replaceable interface plate (e.g., the replaceable interface plate 230) is designed to be load bearing for the mainframe 200, and the frame of the first face is not load bearing. Thus, the replaceable interface plate 230 bears the vertical forces acting on the mainframe 200 resulting from the pressure differential between the interior space of the mainframe and the exterior of the mainframe. These vertical forces can be transferred from the replaceable interface plate 230 to the base at the interface of the lip of the base mating with the step 232.

[0053] In one embodiment, a vertical force of about 95,000 pounds pressure is applied to the mainframe 200 when the mainframe 200 is under vacuum. In embodiments where the two long machine faces have a length of about 100 to 150 inches and the two short machine faces have a length of about 40 to 60 inches, about 30% to 40% of the vertical force is supported by each of the replaceable interface plates attached to the long machine faces, and about 10% to 15% of the force is supported by each of the replaceable interface plates attached to the short machine faces. Thus, a single replaceable interface plate can be constructed to withstand a force of about 28,500 to 38,000 pounds without flexing.

[0054] In alternative embodiments, steps and lips are not used to transfer vertical forces from one or more of the replaceable interface plates to the base 206. The replaceable interface plate 230 can include pins on the inner bottom surface of the replaceable interface plate instead of mating steps and lips. The pins can be, for example, square or round pins, and can be intermittently spaced apart. The plurality of pins can mate with one or more features in the sidewall of the base, and the vertical force can be transferred from the replaceable interface plate to the base at the interface of the one or more features and the plurality of pins. The features can be, for example, holes, lips, or other features that mate with the pins.

[0055] In alternative embodiments, the base extends under the replaceable interface plate, and the vertical force can be transferred from the replaceable interface plate to the base without using any steps, lips, pins, or other features in the base or replaceable interface plate.

[0056] Although not shown, additional replaceable interface plates can be attached to the remaining machine faces of the mainframe 200. Additionally, a cover can be secured to the top of the mainframe over the frame 201 and over the replaceable interface plates. In embodiments, the cover contacts the replaceable interface plates, but does not contact the frame 201. This ensures that the frame will not bear any load even if there is slight misalignment in the vertical spacing of the lips, steps, tops of the replaceable interface plates, and / or the top of the frame 201.

[0057] FIG. 2B A side view of a first example replaceable interface plate 250 according to embodiments of the disclosure is shown. The first replaceable interface plate 250 includes a step 232 and three substrate access ports 252, 254, 256 that all have the same width, height, and vertical position.

[0058] FIG. 2C A side view of a second example replaceable interface plate 260 according to embodiments of the disclosure is shown. The second replaceable interface plate 260 includes a step 232 and three substrate access ports 262, 264, 266 that have varying widths and heights.

[0059] FIG. 2D A side view of a third example replaceable interface plate 270 is shown, in accordance with embodiments of the present disclosure. The third replaceable interface plate 270 includes a step 232 and two substrate access ports 272, 274 that have the same width and height but different vertical positions.

[0060] In embodiments, either the first example replaceable interface plate 250, the second example replaceable interface plate 260, or the third example replaceable interface plate 270 can be attached to the host machine 200.

[0061] FIG. 3 A cross-sectional side view of a host machine 300 and an attached replaceable interface plate 330 taken at the location of a substrate access port 335 machined into the replaceable interface plate 330 is depicted, in accordance with embodiments of the present disclosure. The host machine 300 includes a base 315, a frame face (including a portion of the base, a beam 320, and a plurality of columns (not shown)), and a lid 325. The beam 320, the base 315, and the columns (not shown) define a frame (or frame face) for a machine face 310 of the host machine 300. The replaceable interface plate 330 is attached to the frame that encloses the machine face 310 of the host machine 300.

[0062] The base 315 includes a lip 340 on a sidewall of the base 315. The replaceable interface plate 330 includes a step 342 on an inner bottom surface of the replaceable interface plate 330, where the step 342 mates with the lip 340 on the sidewall of the base 315. As previously described, forces 350 can be exerted on the host machine 300 when the interior space 305 of the host machine 300 is evacuated to a vacuum. These forces can be concentrated forces 352 that are borne by the replaceable interface plate 330. As shown, the lid 325 can contact the replaceable interface plate 330, but can not contact the beam 320. For example, there can be a small gap 354 between the bottom of the lid 325 and the top of the beam 320. Thus, the forces are transmitted through the replaceable interface plate 330 from the lid 325 to the lip 340 of the base 315.

[0063] The lid 325 can include a notch or groove 346 into which an O-ring can be inserted to ensure a seal between the lid 325 and the beam 320 (e.g., between the lid and the top of the frame that includes the beam 320). Additionally, the frame of the machine face to which the replaceable interface plate 330 is attached (e.g., including the beam 320, the columns (not shown), and the sidewall of the base) can each include a notch or groove 344 into which an O-ring can be inserted to ensure a seal between the replaceable interface plate 330 and the frame.

[0064] In one embodiment, the replaceable interface plate 330 includes a lip 390 at the top of the inner surface of the replaceable interface plate 330. The beam 320 can include a corresponding step 392 that can mate with the lip 390. Notably, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip, and the beam 320 does not include a step.

[0065] FIG. 4 A cross-sectional side view of a host 400 and an attached replaceable interface plate 430 taken at the location of a column 420 of the frame of the host, according to an embodiment of the present disclosure, is depicted. The host 400 includes a base 415, a frame (including multiple portions of the base, multiple beams 421, and multiple columns 420), and a cover 425. A first portion of the base 415, a first beam (not shown), and the column 420 define a first frame face for a machine face 410 of the host 400. A second portion of the base 415, a second beam 421, the column 420, and a second column (not shown) define a second frame face for a second machine face. The replaceable interface plate 430 is attached to the frame that encloses the machine face 410 of the host 400.

[0066] The base 415 includes a lip 440 on the sidewall of the base 415. The replaceable interface plate 430 includes a step 442 on the inner bottom surface of the replaceable interface plate 430, where the step 442 mates with the lip 440 on the sidewall of the base 415. As previously described, forces 450 can be exerted on the host 400 when the interior space of the host 400 is evacuated to a vacuum. These forces can be concentrated forces 452 that are borne by the replaceable interface plate 430. As shown, the cover 425 can contact the replaceable interface plate 430, but can not contact the frame. For example, there can be a small gap 454 between the bottom of the cover 425 and the top of the frame. Thus, the forces are transmitted through the replaceable interface plate 430 from the cover 425 to the lip 440 of the base 415.

[0067] The cover 425 can include a pair of notches or slots 446, 448 into which O-rings can be inserted to ensure a seal between the cover 425 and the frame. In one embodiment, the notch 446 is approximately concentric with the notch 448. Additionally, the frame for the machine face to which the replaceable interface plate 430 is attached (e.g., including beams (not shown), columns 420, additional columns (not shown), and the sidewall of the base) can each include a pair of notches or slots 444, 445 into which O-rings can be inserted to ensure a seal between the replaceable interface plate 430 and the frame. In some embodiments, the notch 444 and the notch 445 can be approximately concentric.

[0068] The region between notches 446 and 448 can be an intermediate vacuum region. Similarly, the region between notches 444 and 445 can be another intermediate vacuum region. Column 420 can include one or more channels (i.e., holes) that fluidically couple these intermediate vacuum regions to vacuum port 490. For example, column 420 can include a vertical channel 472 that fluidically couples the intermediate vacuum region between notches 446, 448 to vacuum port 490, and column 420 can further include a horizontal channel 470 that fluidically couples the intermediate vacuum region between notches 444, 445 to vertical channel 472.

[0069] Differential pumping can be performed to pump these intermediate vacuum regions to a pressure between the pressure of the interior space of mainframe 400 and atmospheric pressure. A first O-ring can be disposed in notch 445 of the frame, with an outer surface of the first O-ring exposed to an external environment, and with an inner surface of the first O-ring exposed to the intermediate vacuum region. A second O-ring can be disposed in notch 444 of the frame, with an outer surface of the second O-ring exposed to the intermediate vacuum region, and with an inner surface of the second O-ring exposed to the interior space of mainframe 400. The external environment has a first pressure, the intermediate vacuum region is to be maintained at a second pressure that is lower than the first pressure, and the interior space is to be maintained at a third pressure that is lower than the second pressure.

[0070] A second frame face perpendicular to second machine face 410 is also shown. Second frame face includes beams 421, columns 420, and base 415. Large opening 405 is framed by second frame face. As shown, notches or slots 460, 462 are machined into beams 421, base 415, and columns 420, with each of notches 460, 462 receiving an O-ring to seal an additional replaceable interface plate (not shown) to the second machine face of mainframe 400. The frame (or frame face) of machine face 410 can further include one or more additional channels in columns 420 that fluidically couple to channel 472. These additional one or more channels can fluidically couple the intermediate vacuum region between notches 460, 462 to vacuum port 490.

[0071] The additional frame (or frame face) of the host can further include channels drilled or otherwise formed therein. These channels can connect to additional intermediate vacuum regions between other pairs of notches / O-rings. These channels can be fluidly coupled to the channels 472 in the column 420 and thus to the vacuum port 490. The frame (or frame face) of the machine face 410 can further include one or more additional channels in the beam 421, and / or additional beams (not shown), and / or the base 415, which are fluidly coupled to one or more channels in the column 420. These channels can further be fluidly coupled to one or more additional channels in an additional column, which still further fluidly connect the intermediate vacuum regions to the vacuum port 490.

[0072] In one example, the first frame (or first frame face) includes a first column on a first side of the first machine face, a second column on a second side of the first machine face, and a first beam connecting the first column to the second column. The second frame (or second frame face) includes a first column on a first side of the second machine face, a third column on a second side of the second machine face, and a second beam connecting the first column to the third column. The third frame (or third frame face) includes the second column on a first side of the third machine face, a fourth column on a second side of the third machine face, and a third beam connecting the second column to the fourth column. The fourth frame (or fourth frame face) includes the third column on a first side of the fourth machine face, the fourth column on a second side of the fourth machine face, and a fourth beam connecting the third column to the fourth column.

[0073] The first frame can include one or more first channels in the first column, wherein the one or more first channels fluidly couple the first intermediate vacuum region to the vacuum port. The first frame can further include one or more second channels in the first beam, which fluidly couple to the one or more channels in the first column.

[0074] The first frame can further include one or more third channels in the second column, which fluidly couple to the one or more second channels in the beam. The one or more third channels can fluidly couple the vacuum port to an additional intermediate vacuum region between a pair of O-rings disposed on an outer surface of the second frame.

[0075] Alternatively or additionally, the third frame can include one or more additional channels in the third beam of the third frame. Additionally, the third frame can include one or more additional channels in the fourth column, which fluidly couple one or more intermediate vacuum regions between additional pairs of O-rings to the vacuum port.

[0076] The vacuum port 490 can be coupled to a vacuum pump (not shown). Differential pumping can be performed to reduce the pressure differential across the O-rings. The O-rings can have a large linear surface (e.g., in implementations where the face can have a length of up to about 130 or 150 inches and a height of about 20 to 50 inches). This can increase the likelihood of leakage across the O-rings and reduce the sealing capability. By using differential pumping, the leakage rate can be greatly reduced. In implementations, a single vacuum port 490 can be fluidly coupled to an intermediate vacuum region between all pairs of O-rings between the mainframe and the lid and replaceable interface plates. These connections can be achieved by drilling a channel (i.e., a hole) through one or more of the beams and / or columns of the mainframe 400, and can provide the connection to the vacuum port 490 without the use of plugs, cross-drilling, or welding (e.g., plug welding). This can improve the operation of the differential pumping by minimizing additional potential leakage points.

[0077] In further implementations, multi-stage differential pumping is used, which can include multiple sets of three concentric notches or grooves, each with its own O-ring, and two adjacent intermediate vacuum regions.

[0078] FIG. 5 A method 500 for assembling a reconfigurable mainframe of an electronic device manufacturing system according to implementations of the present disclosure is shown. Some operations of the method 500 can be performed by processing logic, which can execute on a computing device, such as a general purpose computer. For example, some operations can be performed using computer-aided drafting and / or computer-aided manufacturing (CAM) software installed on a computer.

[0079] At block 502 of the method 500, a mainframe configuration is determined, including determining a first plurality of process chambers to be coupled to a first face of the mainframe. Additionally, load locks and / or process chambers to be connected to one or more other faces of the mainframe can be determined.

[0080] At block 504, the locations of substrate access ports suitable for the determined mainframe configuration (e.g., to accommodate access to each of the process chambers and / or load locks) can be determined. At block 506, a configuration of one or more replaceable interface plates is determined. The replaceable interface plates can be configured to have a substrate access port at each of the determined locations. At block 508, the replaceable interface plates can be manufactured. This can include machining a metal (e.g., aluminum) and / or applying a surface treatment to at least a portion of the replaceable interface plates.

[0081] At block 510, the replaceable interface plates are attached to the mainframe (transfer chamber). This can include bolting or screwing the replaceable interface plates to the frame of the appropriate face of the mainframe. At block 512, the determined process chambers and / or load locks can then be attached to the appropriate interface plates in the determined configuration.

[0082] The engineer can determine a new configuration of the mainframe at any time. At this point, the method 500 can be repeated. For example, a second plurality of process chambers to be coupled to the first floor of the mainframe can be determined, new locations of a second plurality of substrate access ports on the floor to accommodate the second plurality of process chambers can be determined, a configuration of second replaceable interface plates each having one of the second plurality of substrate access ports at the new locations can be determined, and the second replaceable interface plates can be manufactured. The second replaceable interface plates can have at least one of: a different number of substrate access ports than the first replaceable interface plates; b) one or more substrate access ports in different locations than the plurality of substrate access ports in the first replaceable interface plates; c) one or more substrate access ports of different sizes than the plurality of substrate access ports in the first replaceable interface plates; d) slit valves of different types than the first replaceable interface plates; or e) local center finders of different types than the first replaceable interface plates.

[0083] Prior to block 510, the existing process chambers can be removed from the first replaceable interface plates, and then the first replaceable interface plates can be removed from the mainframe. Subsequently, the operations of blocks 510 and 512 can be performed, thereby resulting in a completely new configuration of the mainframe (e.g., having a different number of substrate access ports, substrate access ports in different locations, a different number and / or types of process chambers, etc.).

[0084] In the preceding description, numerous specific details are set forth such as specific materials, dimensions, processes parameters, etc. in order to provide a thorough understanding of the present disclosure. Particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments. The word “example” or “exemplary” is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, use of the word example or exemplary is intended to present concepts in a concrete manner. As used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or”. That is, unless specified otherwise, or clear from context, “X includes A or B” is intended to mean any of the natural inclusive permutations. That is, if X includes A; X includes B; or X includes both A and B, then “X includes A or B” is satisfied under any of the foregoing instances. Reference throughout this specification to “an embodiment”, “certain embodiments”, or “one embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase “an embodiment”, “certain embodiments”, or “one embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment.

[0085] The present disclosure has been described with reference to particular illustrative embodiments. Accordingly, this description and the accompanying drawings are to be regarded in an illustrative sense rather than a restrictive sense. Various modifications, in addition to those shown and described herein, will become apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

Claims

1. A mainframe of a device manufacturing system, comprising: a base; a plurality of floors on the base, wherein each floor of the plurality of floors comprises a frame; a plurality of replaceable interface plates, each replaceable interface plate of the plurality of replaceable interface plates attached to a respective floor of the plurality of floors such that at most one replaceable interface plate is attached to each floor, wherein at least one replaceable interface plate of the plurality of replaceable interface plates comprises one or more substrate in-out ports, and wherein one or more replaceable interface plates of the plurality of replaceable interface plates are load bearing; a lid over the plurality of floors, wherein the base, the lid, and the plurality of floors, together with the attached plurality of replaceable interface plates, define an interior space; and a robotic arm in the interior space, wherein the mainframe is configured to operate under vacuum, and wherein the frame of one or more floors of the plurality of floors is not load bearing with respect to loads caused by the vacuum.

2. The mainframe of claim 1, wherein a first floor of the plurality of floors has a first length that is at least twice a second length of a second floor of the plurality of floors.

3. The mainframe of claim 2, wherein the mainframe has a rectangular shape, wherein the plurality of floors comprises four floors, wherein the second floor is perpendicular to the first floor, and wherein the robotic arm is an off-axis robotic arm.

4. The mainframe of claim 1, wherein the one or more replaceable interface plates bear a vertical force on the mainframe caused by a pressure differential between the interior space of the mainframe and an exterior of the mainframe.

5. The mainframe of claim 4, wherein the one or more replaceable interface plates comprise a step on an inner bottom surface of the one or more replaceable interface plates, wherein the step cooperates with a lip on a sidewall of the base, and wherein the vertical force is transferred from the one or more replaceable interface plates to the base at an interface of the step and the lip.

6. A mainframe of a device manufacturing system, comprising: a base; a plurality of floors on the base, wherein each floor of the plurality of floors comprises a frame; a plurality of replaceable interface plates, each replaceable interface plate of the plurality of replaceable interface plates attached to a respective floor of the plurality of floors such that at most one replaceable interface plate is attached to each floor, wherein at least one replaceable interface plate of the plurality of replaceable interface plates comprises one or more substrate in-out ports, and wherein one or more replaceable interface plates of the plurality of replaceable interface plates are load bearing; a lid over the plurality of floors, wherein the base, the lid, and the plurality of floors, together with the attached plurality of replaceable interface plates, define an interior space; and a robotic arm in the interior space, wherein the cover is engaged with a top surface of the one or more replaceable interface boards, wherein there is a gap between the cover and the top surface of the frame of one or more of the plurality of machine faces such that the cover does not contact the frame of the one or more of the plurality of machine faces.

7. The host of claim 4, wherein the one or more replaceable interface boards include a plurality of pins on an inner bottom surface of the one or more replaceable interface boards, wherein one or more features in one or more sidewalls of the base mate with the plurality of pins, and wherein the vertical force is transferred from the one or more replaceable interface boards to the base at an interface of the plurality of pins and the one or more features.

8. The host of claim 1, further comprising: a first O-ring disposed on an outer surface of a first frame of a first machine face of the plurality of machine faces, wherein an outer surface of the first O-ring is exposed to an external environment, and wherein an inner surface of the first O-ring is exposed to an intermediate vacuum region; and a second O-ring disposed on the outer surface of the first frame, wherein the second O-ring is approximately concentric with the first O-ring, wherein an outer surface of the second O-ring is exposed to the intermediate vacuum region, and wherein an inner surface of the second O-ring is exposed to the interior space; wherein the external environment has a first pressure, wherein the intermediate vacuum region is to maintain a second pressure that is lower than the first pressure, and wherein the interior space is to maintain a third pressure that is lower than the second pressure.

9. The host of claim 8, wherein the first frame comprises: a first post on a first side of the first machine face; a second post on a second side of the first machine face; a beam connecting the first post and the second post; and one or more channels in the first post, wherein the one or more channels fluidically couple the intermediate vacuum region to a vacuum port.

10. The host of claim 1, wherein the plurality of replaceable interface boards are disposed on the base.

11. The host of claim 1, wherein: a first replaceable interface board of the plurality of replaceable interface boards has at least one of a first number of first substrate access ports, a first position of each substrate access port of the first number of the first substrate access ports, a first size of the first number of the first substrate access ports, a first type of slit valve, or a first type of local center finder; and a second replaceable interface board of the plurality of replaceable interface boards has at least one of a second number of second substrate access ports, a second position of each substrate access port of the second number of the second substrate access ports, a second size of the second number of the second substrate access ports, a second type of slit valve, or a second type of local center finder.

12. The host of claim 1, wherein a first replaceable interface plate of the plurality of replaceable interface plates has a first size, and wherein a second replaceable interface plate of the plurality of replaceable interface plates has a second size, the second size being different from the first size.

13. A replaceable interface plate for attachment to a deck of a host, the replaceable interface plate comprising: one or more substrate access ports each configured to provide access from the host to a chamber; wherein the replaceable interface plate is load bearing for the host such that a frame of the deck is not load bearing with respect to loads caused by vacuum.

14. The replaceable interface plate of claim 13, wherein the replaceable interface plate is configured to bear vertical forces acting on the host caused by a pressure differential between an interior space of the host and an exterior of the host.

15. The replaceable interface plate of claim 13, further comprising: a step on an inner bottom surface of the replaceable interface plate, wherein the step is configured to mate with a lip on a sidewall of a base of the host; wherein the replaceable interface plate is configured to transfer vertical forces from the replaceable interface plate to the base at an interface of the step and the lip.

16. The replaceable interface plate of claim 13, further comprising: one or more local center finders attached to the replaceable interface plate, wherein the one or more local center finders are configured to detect wafers transferred through the one or more substrate access ports.

17. The replaceable interface plate of claim 13, further comprising: a plurality of pins on an inner bottom surface of the replaceable interface plate, wherein one or more features in a sidewall of a base of the host mate with the plurality of pins, wherein the replaceable interface plate is configured to transfer vertical forces from the replaceable interface plate to the base at an interface of the plurality of pins and the one or more features.

18. The replaceable interface plate of claim 13, wherein the one or more substrate access ports are a plurality of substrate access ports each configured to provide access from the host to a different chamber.

19. A host of a device manufacturing system, comprising: a base; a plurality of decks on the base, wherein each deck of the plurality of decks comprises a frame; a first replaceable interface plate attached to a first deck of the plurality of decks, the first replaceable interface plate comprising one or more first substrate access ports and having a first size; a second replaceable interface plate attached to a second deck of the plurality of decks, the second replaceable interface plate comprising one or more second substrate access ports and having a second size, the second size being different from the first size; a lid over the plurality of machine faces, wherein the base, the lid and the plurality of machine faces together define an interior space; and a robot arm in the interior space; wherein the mainframe is configured to operate under vacuum, and wherein the first replaceable interface plate and the second replaceable interface plate are load bearing and the frame of the first machine face and the second machine face are not load bearing with respect to a load caused by the vacuum.

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