Thermal analysis device

Abstract

The present invention provides a thermal analysis device in which a protection fan is protected from the radiant heat of a heating furnace and a decrease in the accuracy of thermal analysis is suppressed. A shutter is disposed in a pipe for opening and closing a passage in the pipe. The shutter includes a first baffle and a second baffle. The first baffle includes a first rotation shaft and a first plate portion. The first plate portion extends downward from the first rotation shaft. The first baffle is supported so as to be rotatable about the first rotation shaft. The second baffle includes a second rotation shaft, a second plate portion, and a lower end. The second rotation shaft is disposed at a position above and on the side of the cooling fan with respect to the first rotation shaft. The second plate portion extends downward from the second rotation shaft. The lower end of the second plate portion overlaps the first baffle from the heating furnace side. The second baffle is supported so as to be rotatable about the second rotation shaft.

Description

Technical Field

[0001] The present invention relates to a thermal analysis device. Background Art

[0002] In thermal analysis, there are various methods such as differential thermal analysis, thermogravimetry, thermomechanical analysis, differential scanning calorimetry, etc. For example, differential thermal analysis is a method in which while changing the temperatures of a sample and a reference material according to a predetermined measurement procedure, the temperature difference between the sample and the reference material is measured as a function of temperature. Differential thermal analysis targets phenomena accompanied by endothermic and exothermic reactions such as transfer, melting, and reaction. In addition, thermogravimetry is a method of measuring the change in the weight of a sample when the sample is heated or cooled at a fixed rate or when the sample is maintained at a constant temperature. Thermogravimetry targets chemical or physical changes accompanied by weight changes with respect to temperature such as evaporation, decomposition, oxidation, reduction, and adsorption.

[0003] In some thermal analysis devices, a cooling system is provided. For example, the thermal analysis device of Patent Document 1 includes a fan and a shutter. The fan generates cooling air for air-cooling a heat sink. The shutter includes a plurality of baffles. The plurality of baffles are arranged in the vertical direction. The plurality of baffles include a rotating shaft and are supported so as to be rotatable about the rotating shaft.

[0004] In the above thermal analysis device, when the fan operates, the plurality of baffles rotate and open under the action of the wind pressure of the cooling air. Thus, the cooling air from the fan reaches the heat sink through the gaps between the baffles. When the fan stops, the plurality of baffles close under their own weight. Thus, the heat sink and the fan are blocked from each other.

[0005] Prior art documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent No. 3267220 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] In some thermal analysis devices, a cooling system is used to cool a heating furnace that has been heated to a high temperature. During the heating process of the heating furnace, the fan is stopped and the shutter is closed. Thus, the fan is protected from the heat radiation of the heating furnace. After the heating is completed, the fan is operated and the shutter is opened. Thus, the cooling air reaches the heating furnace and the heating furnace is quickly cooled.

[0010] The above-described baffle is suspended in such a way that it can rotate under the action of the wind pressure. Therefore, when the heating furnace becomes high temperature, the baffle sometimes swings under the action of the air convection. In this case, a gap is generated between the baffles, and there is a possibility that the fan is damaged because the radiant heat from the heating furnace reaches the fan. In addition, there is a possibility that the temperature distribution in the heating furnace is disturbed due to the swinging of the baffle, resulting in a decrease in the accuracy of the thermal analysis. An object of the present invention is to protect the fan from the radiant heat of the heating furnace in the thermal analysis device and to suppress a decrease in the accuracy of the thermal analysis.

[0011] Means for Solving the Problem

[0012] The thermal analysis device according to the first aspect of the present invention includes a heating furnace, a cooling fan, a duct, and a gate. The heating furnace includes a heating unit for heating a specimen. The cooling fan is used to supply cooling air to the heating furnace. The duct is disposed between the cooling fan and the heating furnace and includes a passage through which the cooling air passes. The gate is disposed in the duct and is used to open and close the passage. The gate includes a first baffle and a second baffle. The first baffle includes a first rotation axis and a first plate portion. The first plate portion extends downward from the first rotation axis. The first baffle is supported so as to be rotatable about the first rotation axis. The second baffle includes a second rotation axis, a second plate portion, and a lower end. The second rotation axis is disposed at a position above and closer to the cooling fan side than the first rotation axis. The second plate portion extends downward from the second rotation axis. The lower end overlaps the first baffle from the heating furnace side. The second baffle is supported so as to be rotatable about the second rotation axis.

[0013] The thermal analysis device according to the second aspect of the present invention includes a heating furnace, a cooling fan, a duct, and a gate. The heating furnace includes a heating unit for heating a specimen. The cooling fan is used to supply cooling air to the heating furnace. The duct is disposed between the cooling fan and the heating furnace and includes a passage through which the cooling air passes. The gate is disposed in the duct and is used to open and close the passage. The gate includes a first baffle, a second baffle, and a counterweight. The first baffle includes a first rotation axis and a first plate portion. The first plate portion extends downward from the first rotation axis. The first baffle is supported so as to be rotatable about the first rotation axis. The second baffle includes a second rotation axis, a second plate portion, and a lower end. The second rotation axis is disposed at a position above the first rotation axis. The second plate portion extends downward from the second rotation axis. The lower end overlaps the first plate portion from the heating furnace side. The second baffle is supported so as to be rotatable about the second rotation axis. The counterweight is connected to the second baffle. The counterweight is arranged so that the center of gravity of the second baffle is located below the center in the vertical direction of the second baffle.

[0014] Effects of the Invention

[0015] In the thermal analysis apparatus of the first mode, the second rotation axis is disposed offset from the first rotation axis toward the cooling fan side. Further, the lower end of the second baffle plate overlaps the first baffle plate from the heating furnace side. Thus, even if convection of air from the heating furnace side occurs, the second baffle plate is not easily moved under its own weight. Thereby, the fan is protected from the radiant heat of the heating furnace. In addition, the disturbance of the temperature distribution in the heating furnace is suppressed, and the deterioration of the accuracy of the thermal analysis is suppressed.

[0016] In the thermal analysis apparatus of the second mode, the lower end of the second baffle plate overlaps the first baffle plate from the heating furnace side. Further, a counterweight is used to position the center of gravity of the second baffle plate at a position below the center of the second baffle plate. Thus, even if convection of air from the heating furnace side occurs, the second baffle plate is not easily moved under its own weight. Thereby, the fan is protected from the radiant heat of the heating furnace. In addition, the disturbance of the temperature distribution in the heating furnace is suppressed, and the deterioration of the accuracy of the thermal analysis is suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a side view of the thermal analysis apparatus of the first embodiment.

[0018] Figure 2 is a diagram showing the internal structure of the thermal analysis apparatus of the first embodiment.

[0019] Figure 3 is a block diagram showing the control system of the thermal analysis apparatus of the first embodiment.

[0020] Figure 4 is a diagram showing the internal structure of the thermal analysis apparatus of the first embodiment.

[0021] Figure 5 is a diagram showing the shutter of the thermal analysis apparatus of the second embodiment.

[0022] Figure 6 is a diagram showing the shutter of the thermal analysis apparatus of the second embodiment.

[0023] REFERENCE SYMBOL DESCRIPTION

[0024] 12, heating furnace; 15, heating unit; 17, temperature sensor; 20, controller; 21, cooling fan; 23, duct; 24, shutter; 26, radiation shield; 31, first baffle plate; 32, second baffle plate; 41, first rotation axis; 42, first plate portion; 44, second rotation axis; 45, second plate portion; 46, lower end. DETAILED DESCRIPTION OF THE INVENTION

[0025] [First Embodiment]

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Figure 1It is a side view of the thermal analysis device 1 of the first embodiment. The thermal analysis device 1 of this embodiment is a differential thermal gravimetric simultaneous measurement device. The thermal analysis device 1 includes a housing 10, a mounting table 11, a heating furnace 12, and a cooling device 13. The mounting table 11, the heating furnace 12, and the cooling device 13 are arranged inside the housing 10. The mounting table 11 is arranged inside the heating furnace 12. The mounting table 11 is for placing a sample and a reference substance. The heating furnace 12 is used to heat the sample and the reference substance. The cooling device 13 is used to cool the heating furnace 12.

[0027] Figure 2 It is a diagram showing the internal structure of the thermal analysis device 1. As Figure 2 shown, the heating furnace 12 includes a furnace core tube 14 and a heating part 15. The furnace core tube 14 is made of a heat-resistant material such as ceramics, for example. The above-mentioned mounting table 11 is arranged inside the furnace core tube 14. The heating part 15 is arranged around the furnace core tube 14 and is used to heat the furnace core tube 14. The heating part 15 is, for example, an electric heating wire wound around the furnace core tube 14.

[0028] The cooling device 13 includes a cooling fan 21, a fan motor 22, a duct 23, and a shutter 24. The cooling fan 21 is connected to the fan motor 22. The cooling fan 21 conveys cooling air to the heating furnace 12 by rotating. The fan motor 22 is an electric motor for rotating the cooling fan 21. The duct 23 is arranged between the cooling fan 21 and the heating furnace 12. The duct 23 includes a passage 25 through which the cooling air passes.

[0029] A radiation shield 26 and a heat shield 27 are arranged between the duct 23 and the heating furnace 12. The radiation shield 26 covers the furnace core tube 14. A ventilation hole 28 is provided in the radiation shield 26. The heat shield 27 covers the radiation shield 26. The radiation shield 26 reflects the radiant heat from the heating furnace 12 during heating. The radiation shield 26 is made of a material such as nickel, aluminum, or iron that is easy to reflect radiant heat, for example. The heat shield 27 reduces the heat dissipation to the outside.

[0030] The shutter 24 is arranged inside the duct 23. The shutter 24 is used to open and close the passage 25 inside the duct 23. The shutter 24 includes a plurality of baffles 31 to 33. The plurality of baffles 31 to 33 are made of metal and have a thin plate shape. The plurality of baffles 31 to 33 are arranged in the vertical direction. The plurality of baffles 31 to 33 are suspended in a rotatable manner. Specifically, the plurality of baffles 31 to 33 include a first baffle 31, a second baffle 32, and a third baffle 33.

[0031] The first baffle 31 is arranged at the lowermost position among the plurality of baffles 31 to 33. The first baffle 31 includes a first rotating shaft 41 and a first plate portion 42. The first rotating shaft 41 is supported by the pipe 23 so as to be rotatable. The first baffle 31 can rotate around the first rotating shaft 41. The first plate portion 42 extends downward from the first rotating shaft 41. The first baffle 31 has a length greater than the height from the bottom surface 29 of the pipe 23 to the first rotating shaft 41. The lower end 43 of the first baffle 31 contacts the bottom surface 29 of the pipe 23. The first baffle 31 is inclined downward and toward the heating furnace 12 side.

[0032] The second baffle 32 is arranged above the first baffle 31. The second baffle 32 includes a second rotating shaft 44 and a second plate portion 45. The second rotating shaft 44 is supported by the pipe 23 so as to be rotatable. The second baffle 32 can rotate around the second rotating shaft 44. The second rotating shaft 44 is arranged at a position above and closer to the cooling fan 21 side than the first rotating shaft 41.

[0033] The second plate portion 45 extends downward from the second rotating shaft 44. The second baffle 32 has a length greater than the distance between the first rotating shaft 41 and the second rotating shaft 44. The lower end 46 of the second baffle 32 overlaps the first baffle 31 from the heating furnace 12 side. The lower end 46 of the second baffle 32 contacts the first baffle 31. The second baffle 32 is inclined downward and toward the heating furnace 12 side.

[0034] The third baffle 33 is arranged above the second baffle 32. The third baffle 33 is arranged at the uppermost position among the plurality of baffles 31 to 33. The third baffle 33 includes a third rotating shaft 47 and a third plate portion 48. The third rotating shaft 47 is supported by the pipe 23 so as to be rotatable. The third baffle 33 can rotate around the third rotating shaft 47. The third rotating shaft 47 is arranged at a position above and closer to the cooling fan 21 side than the second rotating shaft 44.

[0035] The third plate portion 48 extends downward from the third rotating shaft 47. The third baffle 33 has a length greater than the distance between the second rotating shaft 44 and the third rotating shaft 47. The lower end 49 of the third baffle 33 overlaps the second baffle 32 from the heating furnace 12 side. The lower end 49 of the third baffle 33 contacts the second baffle 32. The third baffle 33 is inclined downward and toward the heating furnace 12 side.

[0036] Figure 3 It is a block diagram showing the control system of the thermal analysis device 1. As Figure 3As shown, the thermal analysis device 1 includes a heating device 16, a temperature sensor 17, a weight sensor 18, an input device 19, and a controller 20. The heating device 16 includes a drive circuit for supplying power to the heating unit 15 described above. The temperature sensor 17 is used to detect the temperatures of the sample and the reference material. The temperature sensor 17 is, for example, a thermocouple and is disposed on the placement table 11 described above. The temperature sensor 17 outputs a differential thermal signal indicating the temperature difference between the sample and the reference material. The temperature sensor 17 can detect a temperature difference of, for example, 0.1°C or less. The temperature sensor 17 can detect a temperature difference up to, for example, 0.01°C.

[0037] The weight sensor 18 is used to measure the weights of the sample and the reference material. The weight sensor 18 is, for example, a thermobalance-type sensor. The weight sensor 18 outputs a signal indicating the weights of the sample and the reference material. The input device 19 can be operated by the user of the thermal analysis device 1. The input device 19 includes, for example, hard keys. Alternatively, the input device 19 can also include a touch screen.

[0038] The controller 20 includes a computer having a processor and a memory. The controller 20 controls the temperature increase of the heating furnace 12 realized by the heating unit 15 by controlling the heating device 16. The controller 20 cools the heating furnace 12 by controlling the cooling device 13. The controller 20 operates the cooling fan 21 by controlling the fan motor 22. The controller 20 stores the measurement program input by the user.

[0039] Next, the operation of the measurement performed by the thermal analysis device 1 will be described. The user places the sample and the reference material on the placement table 11 inside the heating furnace 12. The user uses the input device 19 to set the measurement program and instructs the start of the measurement. When the controller 20 receives the instruction to start the measurement, it starts the temperature increase of the heating furnace 12 according to the measurement program. In the thermal analysis device 1 of the present embodiment, the controller 20 can increase the temperature of the heating furnace 12 to a temperature above the temperature at which radiant heat becomes dominant. The temperature at which radiant heat becomes dominant is, for example, a temperature of 600°C or higher. For example, the controller 20 can control the temperature of the heating furnace 12 from room temperature to a temperature of about 1500°C.

[0040] During the execution of the measurement program, the sample and the reference material are heated inside the heating furnace 12. During this period, the temperature sensor 17 continuously or intermittently repeatedly measures the temperatures of the sample and the reference material and sends the measured values of their temperatures to the controller 20. The weight sensor 18 continuously or intermittently repeatedly measures the weights of the sample and the reference material and sends the measured values of their weights to the controller 20. The controller 20 records the measured values of the temperature and the weight.

[0041] During the execution of the measurement program, the controller 20 stops the cooling fan 21. Therefore, as Figure 2As shown, the multiple baffles 31 to 33 are kept stacked on each other under their own weights. Thus, the gate 24 closes the passage 25 in the pipe 23. Thereby, the cooling fan 21 can be protected from the heat radiation of the heating furnace 12.

[0042] At the end of the measurement of temperature and weight carried out according to the measurement procedure, the controller 20 operates the cooling fan 21, so that the temperature of the heating furnace 12 drops to near room temperature. At this time, as Figure 4 shown, the multiple baffles 31 to 33 are pushed from the cooling fan 21 side toward the heating furnace 12 side by the wind pressure of the cooling air A1 from the cooling fan 21. Therefore, the multiple baffles 31 to 33 rotate around the rotation shafts 41, 44, 47, and gaps are generated between the multiple baffles 31 to 33. Thus, the gate 24 opens the passage 25 in the pipe 23. Thereby, the heating furnace 12 is cooled by allowing the cooling air A1 to reach the heating furnace 12.

[0043] In the thermal analysis device 1 of the present embodiment described above, the second rotation shaft 44 is arranged offset from the first rotation shaft 41 toward the cooling fan 21 side. The third rotation shaft 47 is arranged offset from the second rotation shaft 44 toward the cooling fan 21 side. In addition, the lower end 46 of the second baffle 32 overlaps the first baffle 31 from the heating furnace 12 side. The lower end 49 of the third baffle 33 overlaps the second baffle 32 from the heating furnace 12 side. Thus, as Figure 2 shown, even if the air convection A2 from the heating furnace 12 side occurs, the multiple baffles 31 to 33 are not easily moved under their own weights. Thereby, the fan is protected from the radiant heat of the heating furnace 12. In addition, the disorder of the temperature distribution in the heating furnace 12 is suppressed, and the deterioration of the accuracy of the thermal analysis is suppressed.

[0044] [Second Embodiment]

[0045] Next, the thermal analysis device of the second embodiment of the present invention will be described. Figure 5 And Figure 6 are diagrams showing the gate 24 of the thermal analysis device of the second embodiment. Figure 5 Shows the gate 24 closing the passage 25. Figure 6 Shows the gate 24 opening the passage 25. As Figure 5 And Figure 6 shown, in the thermal analysis device of the second embodiment, the gate 24 includes multiple counterweights 51 to 53. The multiple counterweights 51 to 53 are respectively connected to the multiple baffles 31 to 33. The multiple counterweights 51 to 53 are arranged so that the center of gravity of each of the multiple baffles 31 to 33 is located below the vertical centers C1, C2, C3 of the respective baffles 31 to 33. For example, the multiple counterweights 51 to 53 are respectively connected to the lower ends 43, 46, 49 of the multiple baffles 31 to 33.

[0046] Specifically, the multiple counterweights 51 to 53 include a first counterweight 51, a second counterweight 52, and a third counterweight 53. The first counterweight 51 is connected to the first baffle 31. The first counterweight 51 is configured to position the center of gravity of the first baffle 31 at a position below the center C1 in the vertical direction of the first baffle 31. The second counterweight 52 is connected to the second baffle 32. The second counterweight 52 is configured to position the center of gravity of the second baffle 32 at a position below the center C2 in the vertical direction of the second baffle 32. The third counterweight 53 is connected to the third baffle 33. The third counterweight 53 is configured to position the center of gravity of the third baffle 33 at a position below the center C3 in the vertical direction of the third baffle 33.

[0047] In addition, in the thermal analysis device of the second embodiment, the second rotation shaft 44 is disposed directly above the first rotation shaft 41. The third rotation shaft 47 is disposed directly above the second rotation shaft 44. However, the second rotation shaft 44 may also be disposed offset from the first rotation shaft 41 toward the cooling fan 21 side in the same manner as in the first embodiment. The third rotation shaft 47 may also be disposed offset from the second rotation shaft 44 toward the cooling fan 21 side in the same manner as in the first embodiment. Other structures of the thermal analysis device of the second embodiment are the same as those of the thermal analysis device 1 of the first embodiment.

[0048] In the thermal analysis device of the second embodiment described above, the lower end 46 of the second baffle 32 overlaps the first baffle 31 from the heating furnace 12 side. The lower end 49 of the third baffle 33 overlaps the second baffle 32 from the heating furnace 12 side. In addition, the multiple counterweights 51 to 53 are used to position the centers of gravity of the multiple baffles 31 to 33 at positions below the centers C1, C2, and C3 of the respective baffles. Thus, even if there is convection of air from the heating furnace 12 side, the multiple baffles 31 to 33 are not easily moved under their own weights. Thus, the fan is protected from the radiant heat of the heating furnace 12. In addition, the disturbance of the temperature distribution in the heating furnace 12 is suppressed, and the decrease in the accuracy of thermal analysis is suppressed.

[0049] As described above, one embodiment of the present invention has been described, but the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the invention.

[0050] The thermal analysis device is not limited to a differential thermal thermogravimetric simultaneous measurement device. The thermal analysis device may, for example, also be other devices such as a thermogravimetric measurement device, a thermomechanical analysis device, or a differential scanning calorimetry device. The number of baffles of the gate is not limited to three. The number of baffles may be less than three, or may be more than three. The upper limit value of the temperature that can be increased by the thermal analysis device is not limited to the value of the above-described embodiment, and can also be changed. The lower limit value of the temperature difference that can be detected by the thermal analysis device is not limited to the value of the above-described embodiment, and can also be changed.

[0051] [Mode]

[0052] Those skilled in the art can understand that the above multiple exemplary embodiments are specific examples of the following modes.

[0053] (First Mode) The thermal analysis device includes a heating furnace, a cooling fan, a duct, and a gate. The heating furnace includes a heating part for heating a specimen. The cooling fan is used to supply cooling air to the heating furnace. The duct is arranged between the cooling fan and the heating furnace and includes a passage through which the cooling air passes. The gate is arranged in the duct and is used to open and close the passage. The gate includes a first baffle and a second baffle. The first baffle includes a first rotating shaft and a first plate portion. The first plate portion extends downward from the first rotating shaft. The first baffle is supported so as to be rotatable about the first rotating shaft. The second baffle includes a second rotating shaft, a second plate portion, and a lower end. The second rotating shaft is arranged at a position above and closer to the cooling fan side than the first rotating shaft. The second plate portion extends downward from the second rotating shaft. The lower end overlaps the first baffle from the heating furnace side. The second baffle is supported so as to be rotatable about the second rotating shaft.

[0054] In the thermal analysis device of the first mode, the second rotating shaft is arranged offset from the first rotating shaft toward the cooling fan side. In addition, the lower end of the second baffle overlaps the first baffle from the heating furnace side. Thus, even if convection of air from the heating furnace side occurs, the second baffle is not easily moved under its own weight. Thus, the fan is protected from the radiant heat of the heating furnace. In addition, the disturbance of the temperature distribution in the heating furnace is suppressed, and the decrease in the accuracy of thermal analysis is suppressed.

[0055] (Second Mode) In the thermal analysis device of the first mode, a radiation shield may also be included, which is arranged between the duct and the heating furnace. In this case, even when the heating furnace is heated to a temperature above the temperature at which radiant heat becomes dominant, the leakage of radiant heat to the outside can be suppressed. In addition, when the heating furnace is heated to such a high temperature, the influence of convection on the baffle is greater. Therefore, the thermal analysis device of this mode becomes more effective.

[0056] (Third Mode) In the thermal analysis device of the first or second mode, a controller for controlling the heating part may also be included. It may be that the controller can heat the heating furnace to a temperature above the temperature at which radiant heat becomes dominant. When the heating furnace is heated to such a high temperature, the influence of convection on the baffle is greater. Therefore, the thermal analysis device of this mode becomes more effective.

[0057] (Fourth Method) In the thermal analysis apparatus according to any one of the first to third methods, a temperature sensor may also be included, which outputs a differential thermal signal representing the temperature difference between the specimen and the reference substance. It is also possible that the temperature sensor can detect a temperature difference of 0.1 °C or less. In the case of detecting such a minute differential thermal signal, the accuracy of thermal analysis is liable to be affected by the swing of the baffle. Therefore, the thermal analysis apparatus of this method becomes more effective.

[0058] (Fifth Method) The thermal analysis apparatus includes a heating furnace, a cooling fan, a duct, and a gate. The heating furnace includes a heating section for heating the specimen. The cooling fan is used to supply cooling air to the heating furnace. The duct is disposed between the cooling fan and the heating furnace and includes a passage through which the cooling air passes. The gate is disposed in the duct and is used to open and close the passage. The gate includes a first baffle, a second baffle, and a counterweight. The first baffle includes a first rotating shaft and a first plate portion. The first plate portion extends downward from the first rotating shaft. The first baffle is supported so as to be rotatable about the first rotating shaft. The second baffle includes a second rotating shaft, a second plate portion, and a lower end. The second rotating shaft is disposed at a position above the first rotating shaft. The second plate portion extends downward from the second rotating shaft. The lower end overlaps the first baffle from the heating furnace side. The second baffle is supported so as to be rotatable about the second rotating shaft. The counterweight is connected to the second baffle. The counterweight is disposed such that the center of gravity of the second baffle is located below the center in the vertical direction of the second baffle.

[0059] In the thermal analysis apparatus of the second method, the lower end of the second baffle overlaps the first baffle from the heating furnace side. In addition, the center of gravity of the second baffle is located below the center of the second baffle by using the counterweight. Thereby, even if convection of air from the heating furnace side occurs, the second baffle is not easily moved under its own weight. Thereby, the fan is protected from the radiant heat of the heating furnace. In addition, the disturbance of the temperature distribution in the heating furnace is suppressed, and the decrease in the accuracy of thermal analysis is suppressed.

[0060] (Sixth Method) In the thermal analysis apparatus of the fifth method, a radiation shield may also be included, which is disposed between the duct and the heating furnace. In this case, even when the heating furnace is heated to a temperature above the temperature at which radiant heat becomes dominant, the leakage of radiant heat to the outside can be suppressed. In addition, when the heating furnace is heated to such a high temperature, the influence of convection on the baffle is relatively large. Therefore, the thermal analysis apparatus of this method becomes more effective.

[0061] (Seventh Method) In the thermal analysis apparatus of the fifth or sixth method, a controller for controlling the heating section may also be included. It is also possible that the controller can heat the heating furnace to a temperature above the temperature at which radiant heat becomes dominant. When the heating furnace is heated to such a high temperature, the influence of convection on the baffle is relatively large. Therefore, the thermal analysis apparatus of this method becomes more effective.

[0062] (8th mode) In the thermal analysis device of any one of the 5th to 7th modes, a temperature sensor may also be included, and the temperature sensor outputs a differential thermal signal indicating the temperature difference between the sample and the reference substance. It is also possible that the temperature sensor can detect a temperature difference of 0.1 °C or less. In the case of detecting such a minute differential thermal signal, the accuracy of thermal analysis is liable to be affected by the swing of the baffle. Therefore, the thermal analysis device of this mode becomes more effective.

Claims

1. A thermal analysis device, wherein, the thermal analysis device includes: a heating furnace including a heating unit for heating a specimen; a cooling fan for delivering cooling air to the heating furnace; a duct disposed between the cooling fan and the heating furnace and including a passage through which the cooling air passes; and a shutter disposed in the duct for opening and closing the passage, the shutter includes: a first baffle including a first rotating shaft and a first plate portion extending downward from the first rotating shaft, and the first baffle is supported so as to be rotatable about the first rotating shaft; and a second baffle including a second rotating shaft disposed above and on the cooling fan side of the first rotating shaft, a second plate portion extending downward from the second rotating shaft, and a lower end of the second baffle overlapping the first baffle from the heating furnace side, and the second baffle is supported so as to be rotatable about the second rotating shaft.

2. The thermal analysis device according to claim 1, wherein, the thermal analysis device further includes a radiation shield disposed between the duct and the heating furnace.

3. The thermal analysis device according to claim 1, wherein, the thermal analysis device further includes a controller for controlling the heating unit, and the controller can raise the temperature of the heating furnace to a temperature above the temperature at which radiant heat becomes dominant.

4. The thermal analysis device according to any one of claims 1 to 3, wherein, the thermal analysis device further includes a temperature sensor that outputs a differential thermal signal representing the temperature difference between the specimen and a reference substance, and the temperature sensor can detect a temperature difference of 0.1 °C or less.

5. A thermal analysis device, wherein, the thermal analysis device includes: a heating furnace including a heating unit for heating a specimen; a cooling fan for delivering cooling air to the heating furnace; a duct disposed between the cooling fan and the heating furnace and including a passage through which the cooling air passes; and a shutter disposed in the duct for opening and closing the passage, the shutter includes: a first baffle including a first rotating shaft and a first plate portion extending downward from the first rotating shaft, and the first baffle is supported so as to be rotatable about the first rotating shaft; a second baffle including a second rotating shaft disposed above the first rotating shaft, a second plate portion extending downward from the second rotating shaft, and a lower end of the second baffle overlapping the first baffle from the heating furnace side of the passage, and the second baffle is supported so as to be rotatable about the second rotating shaft; and a counterweight connected to the second baffle, and the counterweight is configured to make the center of gravity of the second baffle located below the center in the vertical direction of the second baffle.

6. The thermal analysis device according to claim 5, wherein, the thermal analysis device further includes a radiation shield disposed between the duct and the heating furnace.

7. The thermal analysis device according to claim 5, wherein, the thermal analysis device further includes a controller for controlling the heating unit, and the controller can raise the temperature of the heating furnace to a temperature above the temperature at which radiant heat becomes dominant.

8. The thermal analysis device according to any one of claims 5 to 7, wherein, the thermal analysis device further includes a temperature sensor that outputs a differential thermal signal representing the temperature difference between the specimen and the reference substance, the temperature sensor is capable of detecting a temperature difference of 0.1 °C or less.

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