Capacitive touch panel

Abstract

A capacitive touch panel includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes, a plurality of light emitting diode chips mounted on the substrate module, and a controller. The plurality of sensing electrodes and the plurality of driving electrodes are formed at different height positions of the substrate module. The plurality of driving electrodes define a plurality of layout spaces extending along a normal direction of the substrate module. Each of the light emitting diode chips is located in one of the layout spaces. The controller is electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light emitting diode chips through the substrate module. When a conductor forms a coupling capacitance with at least one of the sensing electrodes, at least one of the light emitting diode chips adjacent to the conductor can be driven to emit light by the controller. Accordingly, the touch effect of the capacitive touch panel can be avoided from being affected by the position of any of the light emitting diode chips.

Description

TECHNICAL FIELD

[0001] The present application relates to a touch panel, and more particularly to a capacitive touch panel. BACKGROUND

[0002] The conventional capacitive touch panel has a plurality of light emitting diode chips disposed at the side portion, and a light guide plate is arranged with the plurality of light emitting diode chips, so that the light emitted by the plurality of light emitting diode chips is guided by the light guide plate. However, the touch effect of the side portion of the conventional capacitive touch panel is affected by the plurality of light emitting diode chips disposed thereat.

[0003] Therefore, the present inventor believes that the above-mentioned defects can be improved, and after careful research and application of scientific principles, finally proposes the present application which has a reasonable design and effectively improves the above-mentioned defects. SUMMARY

[0004] The embodiment of the present application provides a capacitive touch panel which can effectively improve the defects that may be generated by the conventional capacitive touch panel.

[0005] The embodiment of the present application discloses a capacitive touch panel, which comprises: a substrate module defining a normal direction; a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; a driving electrode layer located at different height positions from the sensing electrode layer in the normal direction, and comprising a plurality of driving electrodes formed on the substrate module; wherein the driving electrode layer defines a plurality of layout spaces extending from the plurality of driving electrodes in the normal direction; a plurality of light emitting diode chips mounted on the substrate module, each of which is located in one of the layout spaces, and the plurality of light emitting diode chips do not shield any of the sensing electrodes in the normal direction; and a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light emitting diode chips through the substrate module; wherein when a conductor forms a coupling capacitance with at least one of the sensing electrodes, the controller can drive at least one of the light emitting diode chips adjacent to the at least one of the sensing electrodes forming the coupling capacitance to emit light.

[0006] Preferably, the substrate module comprises a plurality of substrates arranged in the normal direction, and the plurality of sensing electrodes and the plurality of light emitting diode chips are arranged on one of the substrates, which is defined as a first substrate.

[0007] Preferably, the capacitive touch panel further comprises a protective layer covering the plurality of sensing electrodes and the plurality of light emitting diode chips.

[0008] Preferably, a distance between the light emitting end face of any one of the light emitting diode chips and the first substrate is greater than a thickness of any one of the sensing electrodes; a surface of the protective layer facing the first substrate is concaved with a plurality of accommodating grooves, and the light emitting end faces of the plurality of light emitting diode chips are respectively located in the plurality of accommodating grooves.

[0009] Preferably, the protective layer comprises an operation surface away from the substrate module, and the operation surface is spaced apart from the light emitting end face of any one of the light emitting diode chips by a distance greater than 0 and less than 1 millimeter.

[0010] Preferably, the substrate module comprises a plurality of first transmission lines and a plurality of second transmission lines electrically coupled to the controller, the plurality of first transmission lines are respectively and one-to-one connected to the plurality of light emitting diode chips, and the plurality of second transmission lines are respectively and one-to-one connected to the plurality of light emitting diode chips.

[0011] Preferably, the substrate module comprises a plurality of first transmission lines and a plurality of second transmission lines respectively corresponding to the plurality of first transmission lines electrically coupled to the controller, the plurality of light emitting diode chips are divided into a plurality of light emitting groups, and each light emitting group comprises at least two light emitting diode chips; any one of the first transmission lines is connected to each light emitting diode chip of one light emitting group, and any one of the second transmission lines is connected to one light emitting diode chip of each light emitting group in at least two light emitting groups.

[0012] Preferably, the plurality of driving electrodes are disposed on another substrate other than the first substrate.

[0013] The embodiment of the present application also discloses a capacitive touch panel, which comprises: a substrate module defining a normal direction; a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; a driving electrode layer comprising a plurality of driving electrodes formed on the substrate module; wherein each of the plurality of driving electrodes is surrounded to form a layout area, and the driving electrode layer defines a plurality of layout spaces extending from the plurality of layout areas along the normal direction; a plurality of light emitting diode chips mounted on the substrate module, each of the light emitting diode chips is located in one of the layout spaces, and the plurality of light emitting diode chips do not shield any one of the sensing electrodes along the normal direction; and a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light emitting diode chips through the substrate module; wherein when a conductor forms a coupling capacitance to at least one of the sensing electrodes, the controller can drive at least one of the light emitting diode chips adjacent to the at least one of the sensing electrodes forming the coupling capacitance to emit light.

[0014] Preferably, the substrate module comprises a plurality of substrates arranged along a normal direction, and the plurality of driving electrodes and the plurality of light-emitting diode chips are disposed on one of the substrates, which is defined as a first substrate, and any one of the light-emitting diode chips is surrounded by one of the driving electrodes and is located in a corresponding layout region.

[0015] Preferably, the plurality of sensing electrodes are disposed on the first substrate; the capacitive touch panel further comprises a protective layer, and the protective layer covers the plurality of sensing electrodes, the plurality of driving electrodes, and the plurality of light-emitting diode chips.

[0016] Preferably, a distance between the light-emitting end surface of any one of the light-emitting diode chips and the first substrate is greater than a thickness of any one of the sensing electrodes; a surface of the protective layer facing the first substrate is concavely provided with a plurality of accommodation grooves, and the light-emitting end surfaces of the plurality of light-emitting diode chips are respectively located in the plurality of accommodation grooves.

[0017] Preferably, the protective layer comprises an operation surface away from the substrate module, and the operation surface is separated from the light-emitting end surface of any one of the light-emitting diode chips by a distance greater than 0 and less than 1 millimeter.

[0018] Preferably, the plurality of sensing electrodes are disposed on another substrate, which is defined as a second substrate, other than the first substrate, and the second substrate is formed with a plurality of through holes in a region through which the plurality of layout spaces pass, and the light-emitting end surface of any one of the light-emitting diode chips faces one of the through holes.

[0019] Preferably, the substrate module comprises a plurality of substrates arranged along a normal direction, the plurality of driving electrodes are disposed on one of the substrates, which is defined as a first substrate, and the plurality of light-emitting diode chips are disposed on another of the substrates; the first substrate is formed with a plurality of through holes corresponding to the plurality of layout regions in position, and the light-emitting end surface of any one of the light-emitting diode chips faces one of the through holes.

[0020] Preferably, the plurality of sensing electrodes are disposed on the first substrate; the capacitive touch panel further comprises a protective layer, and the protective layer covers the plurality of sensing electrodes and the plurality of driving electrodes.

[0021] Preferably, the substrate module comprises a plurality of first transmission lines and a plurality of second transmission lines electrically coupled to the controller, the plurality of first transmission lines are respectively and one-to-one connected to the plurality of light-emitting diode chips, and the plurality of second transmission lines are respectively and one-to-one connected to the plurality of light-emitting diode chips.

[0022] Preferably, the substrate module comprises a plurality of first transmission lines electrically coupled to the controller and a plurality of second transmission lines corresponding to the plurality of first transmission lines, respectively, the plurality of light emitting diode chips are divided into a plurality of light emitting groups, and each of the light emitting groups comprises at least two light emitting diode chips; any one of the first transmission lines is connected to each of the light emitting diode chips of one of the light emitting groups, and any one of the second transmission lines is connected to one of the light emitting diode chips of each of the at least two light emitting groups.

[0023] The embodiment of the present application also discloses a capacitive touch panel, which comprises: a substrate module; a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; a driving electrode layer comprising a plurality of driving electrodes formed on the substrate module, and the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units with the same area; and a plurality of light emitting diode chips mounted on the substrate module, each of the light emitting diode chips is placed in two adjacent sensing units, and the position of each of the light emitting diode chips corresponds to one of the driving electrodes, but does not affect the capacitance change between the sensing electrodes and the driving electrodes.

[0024] Preferably, the substrate module defines a normal direction, and the driving electrode layer defines a plurality of layout spaces extending from the plurality of driving electrodes along the normal direction, wherein each of the light emitting diode chips is located in one of the layout spaces, and the plurality of light emitting diode chips does not shield any of the sensing electrodes along the normal direction.

[0025] Preferably, the substrate module comprises a plurality of substrates arranged along the normal direction, the plurality of sensing electrodes and the plurality of light emitting diode chips are arranged in one of the substrates and defined as a first substrate, and the plurality of driving electrodes are arranged in another of the substrates other than the first substrate.

[0026] Preferably, the substrate module defines a normal direction, each of the driving electrodes surrounds a layout area, and the driving electrode layer defines a plurality of layout spaces extending from the plurality of layout areas along the normal direction, wherein each of the light emitting diode chips is located in one of the layout spaces, and the plurality of light emitting diode chips does not shield any of the sensing electrodes along the normal direction.

[0027] Preferably, the substrate module comprises a plurality of substrates arranged along a normal direction, the plurality of sensing electrodes, the plurality of driving electrodes and the plurality of LED chips are disposed in one of the substrates, which is defined as a first substrate, and any of the LED chips is surrounded by one of the driving electrodes to be located in a corresponding layout area.

[0028] Preferably, the substrate module comprises a plurality of substrates arranged along a normal direction, the plurality of sensing electrodes and the plurality of driving electrodes are disposed in one of the substrates, which is defined as a first substrate, and the plurality of LED chips are disposed in another of the substrates other than the first substrate, wherein the first substrate is formed with a plurality of through holes in an area through which the layout spaces pass, and a light emitting end surface of any of the LED chips faces one of the through holes.

[0029] Preferably, the substrate module comprises a plurality of substrates arranged along a normal direction, the plurality of sensing electrodes and the plurality of driving electrodes are disposed in one of the substrates, which is defined as a first substrate, and the plurality of LED chips are disposed in another of the substrates other than the first substrate, wherein the first substrate is formed with a plurality of through holes in an area through which the layout spaces pass, and a light emitting end surface of any of the LED chips faces one of the through holes.

[0030] The embodiment of the present application also discloses a capacitive touch panel, which comprises: a substrate module; a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; a driving electrode layer comprising a plurality of driving electrodes formed on the substrate module, and the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units with the same area; and a plurality of LED chips mounted on the substrate module, each of the LED chips is located in two adjacent sensing units, and the position of each of the LED chips corresponds to one of the sensing electrodes, but does not affect the capacitance change between the sensing electrodes and the driving electrodes.

[0031] Preferably, the substrate module is defined with a normal direction, and the sensing electrode layer is defined with a plurality of layout spaces extending from the plurality of sensing electrodes along the normal direction, wherein each of the LED chips is located in one of the layout spaces, and the plurality of LED chips do not shield any of the driving electrodes along the normal direction.

[0032] Preferably, the substrate module comprises a plurality of substrates arranged along the normal direction, the plurality of driving electrodes and the plurality of light emitting diode chips are disposed in one of the substrates and defined as a first substrate, and the plurality of sensing electrodes are disposed in another of the substrates other than the first substrate.

[0033] Preferably, the substrate module defines a normal direction, each of the sensing electrodes encloses a layout area, and the sensing electrode layer defines a plurality of layout spaces extending from the plurality of layout areas along the normal direction, wherein each of the light emitting diode chips is located in one of the layout spaces, and the plurality of light emitting diode chips do not shield any of the driving electrodes along the normal direction.

[0034] Preferably, the substrate module comprises a plurality of substrates arranged along the normal direction, the plurality of sensing electrodes, the plurality of driving electrodes and the plurality of light emitting diode chips are disposed in one of the substrates and defined as a first substrate, and any of the light emitting diode chips is surrounded by one of the sensing electrodes to be located in a corresponding layout area.

[0035] Preferably, the substrate module comprises a plurality of substrates arranged along the normal direction, the plurality of sensing electrodes and the plurality of driving electrodes are disposed in one of the substrates and defined as a first substrate, and the plurality of light emitting diode chips are disposed in another of the substrates other than the first substrate, wherein the first substrate forms a plurality of through holes in the region through which the layout spaces pass, and the light emitting end surface of any of the light emitting diode chips faces one of the through holes.

[0036] Preferably, the substrate module comprises a plurality of substrates arranged along the normal direction, the plurality of driving electrodes are disposed in one of the substrates and defined as a first substrate, and the plurality of sensing electrodes and the plurality of light emitting diode chips are disposed in another of the substrates other than the first substrate, wherein the first substrate forms a plurality of through holes in the region through which the layout spaces pass, and the light emitting end surface of any of the light emitting diode chips faces one of the through holes.

[0037] The present application also discloses a capacitive touch panel, which comprises a substrate module, a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module, a driving electrode layer comprising a plurality of driving electrodes formed on the substrate module, wherein the sensing electrodes and the driving electrodes form a touch sensing area of the capacitive touch panel, the touch sensing area is divided into a plurality of sensing units with the same area, and a plurality of light emitting diode chips are mounted on the substrate module, each of the light emitting diode chips is located in one of the sensing units, and the position of each of the light emitting diode chips corresponds to the intersection of the sensing electrode and the driving electrode without affecting the capacitance change between the sensing electrode and the driving electrode.

[0038] Preferably, the substrate module defines a normal direction, and comprises a plurality of substrates arranged along the normal direction, wherein one of the substrates is defined as a first substrate, and the sensing electrodes and the driving electrodes are arranged on at least one of the substrates other than the first substrate.

[0039] The present application also discloses a capacitive touch panel, which comprises a substrate module, a sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module, a driving electrode layer comprising a plurality of driving electrodes formed on the substrate module, wherein the sensing electrodes and the driving electrodes form a touch sensing area of the capacitive touch panel, the touch sensing area is divided into a plurality of sensing units with the same area, and a plurality of light emitting diode chips are mounted on the substrate module, each of the light emitting diode chips is located in one of the sensing units, and the position of each of the light emitting diode chips corresponds to the intersection of the sensing electrode and the driving electrode without affecting the capacitance change between the sensing electrode and the driving electrode.

[0040] In summary, the capacitive touch panel disclosed by the present application can avoid the position of the light emitting diode chips affecting the touch effect of the capacitive touch panel, and the capacitive touch panel can also have delicate local optical changes through the cooperation between the light emitting diode chips and other components (for example, each of the light emitting diode chips is located in one of the layout spaces, and the light emitting diode chips along the normal direction do not shield any of the sensing electrodes).

[0041] For further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application, but the description and drawings are only used to illustrate the present application, and do not limit the protection scope of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 A plan view of a capacitive touch panel according to an embodiment of the present application.

[0043] Figure 2 A cross-sectional view along section line II-II. Figure 1

[0044] Figure 3 A partial circuit diagram of the capacitive touch panel according to the first embodiment of the present application (1).

[0045] Figure 4 A partial circuit diagram of the capacitive touch panel according to the first embodiment of the present application (2).

[0046] Figure 5 A plan view of a capacitive touch panel according to a second embodiment of the present application.

[0047] Figure 6 A cross-sectional view along section line VI-VI. Figure 5

[0048] A partial cross-sectional view of a capacitive touch panel according to a third embodiment of the present application. Figure 7

[0049] A plan view of a capacitive touch panel according to a fourth embodiment of the present application. Figure 8

[0050] A cross-sectional view along section line IX-IX. Figure 9 Figure 8 A plan view of a capacitive touch panel according to a fifth embodiment of the present application.

[0051] Figure 10 A plan view of a capacitive touch panel according to a sixth embodiment of the present application.

[0052] Figure 11 A plan view of a capacitive touch panel according to a seventh embodiment of the present application.

[0053] Figure 12 A plan view of a capacitive touch panel according to an eighth embodiment of the present application.

[0054] DETAILED DESCRIPTION Figure 13

[0055] ​​​The following embodiments of the disclosed "capacitive touch panel" are explained by way of specific embodiments, and those skilled in the art can understand the advantages and effects of the present application from the content disclosed in the specification. The present application can be implemented or applied by other different embodiments, and the details in the specification can be modified and changed in various ways based on different views and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations and are not actual size depictions, as previously stated. The following embodiments will further explain the related technical content of the present application in detail, but the disclosed content is not intended to limit the protection scope of the present application.

[0056] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of the associated listed items, as appropriate.

[0057] [Embodiment One]

[0058] Please refer to Figures 1 to 4 , which is embodiment one of the present application. As shown in Figure 1 and Figure 2 , the present embodiment discloses a capacitive touch panel 100, which includes a substrate module 1, a sensing electrode layer 2, a driving electrode layer 3, a plurality of light-emitting diode chips 4, a protective layer 5, and a controller 6. Among them, the sensing electrode layer 2, the driving electrode layer 3, the plurality of light-emitting diode chips 4, and the controller 6 are all installed on the substrate module 1, and the protective layer 5 covers the sensing electrode layer 2 and the plurality of light-emitting diode chips 4.

[0059] It should be noted that the capacitive touch panel 100 in the present embodiment is described as including the above-mentioned elements, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the capacitive touch panel 100 can omit the protective layer 5 or replace the protective layer with other components. The structure of each component of the capacitive touch panel 100 will be introduced first, and then the connection relationship between the structures of each component of the capacitive touch panel 100 will be described in due course.

[0060] The substrate module 1 defines a normal direction D, and the substrate module 1 includes a plurality of substrates 10 arranged along the normal direction D; that is, in this embodiment, the surface of any one of the substrates 10 is perpendicular to the normal direction D. For ease of explanation of this embodiment, the plurality of substrates 10 are sequentially defined with a first substrate 11, a second substrate 12, and a third substrate 13 spaced apart from each other along a direction away from the protective layer 5, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the substrate module 1 may omit the third substrate 13 or add other substrates.

[0061] The sensing electrode layer 2 includes a plurality of sensing electrodes 21 formed on the substrate module 1. In this embodiment, the plurality of sensing electrodes 21 are spaced apart from each other and formed on the surface of the first substrate 11 adjacent to the protective layer 5 (e.g., ...). Figure 2 The first substrate 11 in the diagram is the top surface of the substrate 11, but the invention is not limited thereto. For example, in other embodiments not illustrated in this invention, at least one of the sensing electrodes 21 may be formed on the surface of the first substrate 11 away from the protective layer 5 (e.g., the top surface of the first substrate 11). Figure 2 (The bottom surface of the first substrate 11 in the middle).

[0062] The driving electrode layer 3 and the sensing electrode layer 2 are located at different heights in the normal direction D, and the driving electrode layer 3 includes a plurality of driving electrodes 31 formed on the substrate module 1. The plurality of driving electrodes 31 are disposed on another substrate 10 other than the first substrate 11, and in this embodiment, the plurality of driving electrodes 31 are spaced apart from each other and formed on the surface of the second substrate 12 adjacent to the first substrate 11 (e.g., ...). Figure 2 The second substrate 12 in the invention is the top surface of the substrate 12, but the invention is not limited thereto.

[0063] For example, in other embodiments not illustrated in this invention, at least one of the driving electrodes 31 may be formed on the surface of the second substrate 12 away from the first substrate 11 (e.g.: Figure 2 The bottom surface of the second substrate 12 in the protective layer 5); or, at least one of the driving electrodes 31 may also be formed on the surface of the first substrate 11 away from the protective layer 5 (e.g., the ... Figure 2 (The bottom surface of the first substrate 11 in the middle).

[0064] More specifically, the driving electrode layer 3 defines a plurality of layout spaces S extending from the plurality of driving electrodes 31 along the normal direction D, and in this embodiment, the plurality of sensing electrodes 21 are located outside the plurality of layout spaces S; that is, a projection area formed by the orthographic projection of the plurality of sensing electrodes 21 toward the second substrate 12 surrounds the outside of the plurality of driving electrodes 31, but the invention is not limited thereto. For example, in other embodiments not shown in the invention, the peripheral portion of at least one sensing electrode 21 may be located within the layout space S.

[0065] Multiple light-emitting diode (LED) chips 4 and multiple sensing electrodes 21 are disposed together on one of the substrates 10 (i.e., the first substrate 11), and each LED chip 4 is located within a layout space S, while the multiple LED chips 4 do not obscure any of the sensing electrodes 21 along the normal direction D. Alternatively, in this embodiment, the position of any LED chip 4 along the normal direction D corresponds to one of the driving electrodes 31.

[0066] Furthermore, the light-emitting end face 41 of any of the aforementioned light-emitting diode chips 4 (e.g.: Figure 2 The distance D41 between the top surface of the light-emitting diode chip 4 and the first substrate 11 is preferably greater than the thickness T21 of any of the sensing electrodes 21. The difference between the distance D41 and the thickness T21 can be greater than 0 and less than 1 mm, but the present invention is not limited thereto.

[0067] In this embodiment, the protective layer 5 is described as being detachably disposed on a plate of the substrate module 1, and the protective layer 5 covers the plurality of sensing electrodes 21 and the plurality of light-emitting diode chips 4. The surface of the protective layer 5 facing the substrate module 1 (e.g., the first substrate 11) (e.g., the bottom surface of the protective layer 5 in the figure) is recessed with a plurality of receiving grooves 51, and the light-emitting end faces 41 of the plurality of light-emitting diode chips 4 are respectively located within the plurality of receiving grooves 51.

[0068] Furthermore, the protective layer 5 includes an operating surface 52 (e.g., the top surface of the protective layer 5 in the figure) that is away from the substrate module 1, and the operating surface 52 is preferably separated from the light-emitting end face 41 of any of the light-emitting diode chips 4 by a distance D52 greater than 0 and less than 1 mm, but the present invention is not limited thereto.

[0069] In this embodiment, the controller 6 is mounted on the surface of the third substrate 13, which is away from the protective layer 5 (e.g., ...). Figure 2The third substrate 13 is installed on the bottom surface of the substrate module 1, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the controller 6 can be installed on any one of the substrates 10 in the substrate module 1 or on other components outside the substrate module 1.

[0070] Furthermore, the controller 6 is electrically coupled to the sensing electrode layer 2, the driving electrode layer 3, and the plurality of light-emitting diode chips 4 through the substrate module 1. When a conductor (e.g., a stylus or a finger) forms a coupling capacitance with at least one of the sensing electrodes 21, the controller 6 can drive at least one of the light-emitting diode chips 4 adjacent to the at least one of the sensing electrodes 21 forming the coupling capacitance to emit light. Further, the number of the at least one of the light-emitting diode chips 4 driven by the controller 6 to emit light can be adjusted according to design requirements.

[0071] Accordingly, in the present embodiment, the capacitive touch panel 100 is arranged such that each of the light-emitting diode chips 4 is located in one of the layout spaces S and the plurality of light-emitting diode chips 4 do not shield any of the sensing electrodes 21 along the normal direction D, so that the touch effect of the capacitive touch panel 100 can be prevented from being affected by the positions of the light-emitting diode chips 4, and the capacitive touch panel 100 can also have delicate local optical changes.

[0072] It should be additionally noted that the electrical coupling lines between the substrate module 1, the plurality of light-emitting diode chips 4, and the controller 6 can be adjusted according to design requirements, and for the purpose of understanding the present embodiment, the electrical coupling lines shown in Figure 3 and Figure 4 will be described below, but the present application is not limited thereto.

[0073] Specifically, as shown in Figures 1 to 3 , the substrate module 1 can include a plurality of first transmission lines 14 and a plurality of second transmission lines 15 electrically coupled to the controller 6. The plurality of first transmission lines 14 are respectively connected one-to-one to the plurality of light-emitting diode chips 4, and the plurality of second transmission lines 15 are respectively connected one-to-one to the plurality of light-emitting diode chips 4. Accordingly, each of the light-emitting diode chips 4 can be driven to emit light by the controller 6 individually.

[0074] In addition, as shown in Figure 1 , Figure 2 , and Figure 4As shown, the substrate module 1 may also include multiple first transmission lines 14 electrically coupled to the controller 6 and multiple second transmission lines 15 corresponding to the multiple first transmission lines 14. The multiple light-emitting diode chips 4 are divided into multiple light-emitting groups 40, and each of the multiple light-emitting groups 40 includes at least two light-emitting diode chips 4. Furthermore, any one of the first transmission lines 14 is connected to the positive or negative terminal of each light-emitting diode chip 4 in one of the light-emitting groups 40, and any one of the second transmission lines 15 is connected to the negative or positive terminal of one light-emitting diode chip 4 in each of the at least two light-emitting groups 40. Accordingly, one first transmission line 14 and one second transmission line 15 can jointly control the light emission of a connected light-emitting diode chip 4, so each light-emitting diode chip 4 can be driven to emit light independently by the controller 6.

[0075] [Example 2]

[0076] Please see Figure 5 and Figure 6 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0077] In this embodiment, a plurality of sensing electrodes 21, a plurality of driving electrodes 31, and a plurality of light-emitting diode chips 4 are disposed together on one of the substrates 10 of the substrate module 1 (e.g., the first substrate 11), and the protective layer 5 covers the plurality of sensing electrodes 21, the plurality of driving electrodes 31, and the plurality of light-emitting diode chips 4; that is, the second substrate 12 in the first embodiment can be omitted from the substrate module 1 in this embodiment.

[0078] More specifically, each of the plurality of driving electrodes 31 surrounds a layout region S1; and in this embodiment, any one of the driving electrodes 31 may be annular or U-shaped, such that its inner edge surrounds the layout region S1. For example, any one of the driving electrodes 31 forms a through hole, which is defined as the layout region S1.

[0079] Further, the driving electrode layer 3 defines a plurality of layout spaces S extending from the plurality of layout areas S1 along the normal direction D, and each of the light emitting diode chips 4 is located in one of the layout spaces S, and the plurality of light emitting diode chips 4 do not shield any of the sensing electrodes 21 along the normal direction D. Wherein, any of the light emitting diode chips 4 is surrounded by one of the driving electrodes 31 outside, and is located in the corresponding layout area S1.

[0080] Accordingly, the capacitive touch panel 100 in the present embodiment is designed by the structure of each of the driving electrodes 31, so that the plurality of sensing electrodes 21, the plurality of driving electrodes 31, and the plurality of light emitting diode chips 4 can be commonly arranged on the same substrate 10, so that the thickness of the capacitive touch panel 100 can be effectively reduced.

[0081] [Embodiment Three]

[0082] Please refer to Figure 7 , which is embodiment three of the present application. Since the present embodiment is similar to the above-mentioned embodiment two, the same parts of the two embodiments will not be described again, and the differences of the present embodiment compared with the above-mentioned embodiment two are generally described as follows:

[0083] In the present embodiment, the plurality of driving electrodes 31 and the plurality of sensing electrodes 21 are arranged on one of the substrates 10 (such as the first substrate 11) of the substrate module 1, and the plurality of light emitting diode chips 4 are arranged on another one of the substrates 10 (such as the second substrate 12) of the substrate module 1; that is, the substrate module 1 in the present embodiment can include the second substrate 12 in embodiment one.

[0084] Further, the protective layer 5 covers the plurality of sensing electrodes 21 and the plurality of driving electrodes 31, the first substrate 11 is formed with a plurality of through holes 16 corresponding to the plurality of layout areas S1 respectively, and the light emitting end surface 41 of any of the light emitting diode chips 4 faces one of the through holes 16. Accordingly, the surface (such as the bottom surface of the protective layer 5 in the figure) of the protective layer 5 facing the substrate module 1 (such as the first substrate 11) can be planar, thereby effectively reducing the manufacturing difficulty of the protective layer 5.

[0085] [Embodiment Four]

[0086] Please refer to Figure 8 and Figure 9 , which is embodiment four of the present application. Since the present embodiment is similar to the above-mentioned embodiment three, the same parts of the two embodiments will not be described again, and the differences of the present embodiment compared with the above-mentioned embodiment three are generally described as follows:

[0087] In the embodiment, the plurality of substrates 10 are sequentially defined with a second substrate 12, a first substrate 11 and a third substrate 13 which are arranged in a spaced manner, but the present application is not limited thereto. Further, the plurality of driving electrodes 31 and the plurality of light emitting diode chips 4 are arranged in one of the substrates 10 (e.g. the second substrate 12), and the plurality of sensing electrodes 21 are arranged in another of the substrates 10 (e.g. the first substrate 11) which is different from the second substrate 12.

[0088] Further, the protective layer 5 covers the plurality of sensing electrodes 21, the first substrate 11 is formed with a plurality of through holes 16 in the region where the plurality of layout spaces S pass through, and the light emitting end surface 41 of any one of the light emitting diode chips 4 faces one of the through holes 16. Accordingly, the surface (e.g. the bottom surface of the protective layer 5 in the figure) of the protective layer 5 which faces the substrate module 1 (e.g. the first substrate 11) can be planar, thereby effectively reducing the manufacturing difficulty of the protective layer 5.

[0089] [Embodiment Five]

[0090] Please refer to Figure 10 , which is the embodiment five of the present application. As shown in Figure 10 , the embodiment discloses a capacitive touch panel 100, which comprises a substrate module 1, a sensing electrode layer 2, a driving electrode layer 3 and a plurality of light emitting diode chips 4. Wherein, the sensing electrode layer 2 comprises a plurality of sensing electrodes 21 formed on the substrate module 1, and the driving electrode layer 3 comprises a plurality of driving electrodes 31 formed on the substrate module 1.

[0091] The plurality of sensing electrodes 21 and the plurality of driving electrodes 31 can be arranged on two different substrates in the substrate module 1 as in the above-mentioned embodiment one or embodiment four, or can be arranged on the same substrate in the substrate module 1 as in the above-mentioned embodiment two or embodiment three. In summary, the plurality of sensing electrodes 21 and the plurality of driving electrodes 31 are arranged in an interlaced manner, and it should be understood that the plurality of sensing electrodes 21 and the plurality of driving electrodes 31 form a touch sensing area of the capacitive touch panel 100.

[0092] In order to make the touchpad have the function of emitting light, the Chinese patent application CN110568942A discloses that the touch sensing area is divided into a plurality of first sensing units and a plurality of second sensing units. Compared with the first sensing unit, the second sensing unit is less in area to set a light emitting diode chip. Therefore, under the same touch condition, the second sensing unit generates a smaller sensing amount than the first sensing unit, so that the Chinese patent application CN110568942A must compensate for the sensing amount of the second sensing unit.

[0093] Compared with the Chinese patent application CN110568942A, the touch sensing area in the present embodiment is divided into a plurality of sensing units 23 with the same area. That is, under the same touch condition, a plurality of the sensing units 23 have the same sensing amount, and the sensing amount of each of the sensing units 23 is associated with the change in the capacitance between the sensing electrode 21 and the driving electrode 31 covered thereby.

[0094] In addition, a plurality of light emitting diode chips 4 are mounted on the substrate module 1. Each of the light emitting diode chips 4 is placed in or across two adjacent sensing units 23, and the position of each of the light emitting diode chips 4 corresponds to a driving electrode 31. Further, the position of each of the light emitting diode chips 4 does not change the length of the adjacent side line between the corresponding driving electrode 31 and the surrounding sensing electrode 21, so that under the same touch condition, each of the light emitting diode chips 4 does not change the sensing amount of the corresponding sensing unit 23.

[0095] In order to make the light emitting diode chip 4 not affect the change in the capacitance between the sensing electrode 21 and the driving electrode 31, the structural design of the present embodiment can be similar to the above-mentioned embodiment one, embodiment two, embodiment three or embodiment four, so the details are not described here. Accordingly, the capacitive touch panel 100 does not need to compensate for the sensing amount of any one of the sensing units 23, but can directly determine whether the touch sensing area is touched by a conductor (such as a touch pen or a finger) and the touched position according to the sensing amount of each of the sensing units 23.

[0096] [Embodiment six]

[0097] Please refer to Figure 11 which is embodiment six of the present application. Since the present embodiment is similar to the above-mentioned embodiment five, the same parts of the two embodiments are not described here, and the differences between the present embodiment and the above-mentioned embodiment five are described as follows:

[0098] In this embodiment, each of the light-emitting diode chips 4 is placed in two adjacent sensing units 23, or across the two sensing units 23, and the position of each of the light-emitting diode chips 4 corresponds to a sensing electrode 21.

[0099] Furthermore, since the position of each light-emitting diode chip 4 is changed from corresponding to one driving electrode 31 in Embodiment 5 to corresponding to one sensing electrode 21, the structural design of this embodiment can be similar to that of... Figure 2 , Figure 6 , Figure 7 or Figure 9 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, so that each of the light-emitting diode chips 4 in this embodiment can also maintain the capacitance change between the sensing electrode 21 and the driving electrode 31 without affecting the capacitance change.

[0100] For example, if the structural design of this embodiment is to... Figure 2 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, the plurality of light-emitting diode chips 4 and the plurality of driving electrodes 31 are jointly disposed on the first substrate 11 of the substrate module 1, while the plurality of sensing electrodes 21 are disposed on the second substrate 12 of the substrate module 1. Furthermore, this embodiment defines a plurality of layout spaces S extending from the plurality of sensing electrodes 21 along the normal direction D, and the plurality of driving electrodes 31 are located outside the plurality of layout spaces S.

[0101] Each of the LED chips 4 is located within one of the layout spaces S, and none of the driving electrodes 31 is obscured along the normal direction D. This is because at this point, it is only in a non-contradictory manner... Figure 2 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should be able to understand other details at this time from the content of the above embodiment 1, so they will not be elaborated here.

[0102] In contrast, if the structural design of this embodiment is to... Figure 6 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple sensing electrodes 21, multiple driving electrodes 31, and multiple light-emitting diode chips 4 are jointly disposed on the first substrate 11 of the substrate module 1, and each sensing unit 21 surrounds and forms a layout region S1. In addition, this embodiment defines multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D.

[0103] Each of the LED chips 4 is located within one of the layout spaces S, and none of the driving electrodes 31 are obscured along the normal direction D. That is, each LED chip 4 is surrounded by one of the sensing units 21. Since this is only in the case of not deviating... Figure 6 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should also be able to understand other details at this time from the content of the above embodiment 2, so they will not be elaborated here.

[0104] In contrast, if the structural design of this embodiment is to... Figure 7 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple driving electrodes 31 and multiple sensing electrodes 21 are disposed on the first substrate 11 of the substrate module 1, while multiple light-emitting diode chips 4 are disposed on the second substrate 12 of the substrate module 1. Furthermore, each sensing unit 21 surrounds a layout region S1, and in this embodiment, multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D are defined.

[0105] The first substrate 11 has a plurality of through holes 16 formed in the regions through which the plurality of layout spaces S pass, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Since this is only in the case of not deviating from... Figure 7 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should also be able to understand other details at this time from the content of the above embodiment 3, so they will not be elaborated here.

[0106] In contrast, if the structural design of this embodiment is to... Figure 9 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple driving electrodes 31 are disposed on the first substrate 11 of the substrate module 1, while multiple sensing electrodes 21 and multiple light-emitting diode chips 4 are disposed on the second substrate 12 of the substrate module 1. Furthermore, each sensing unit 21 surrounds a layout region S1, and in this embodiment, multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D are defined.

[0107] The first substrate 11 has a plurality of through holes 16 formed in the regions through which the plurality of layout spaces S pass, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Since this is only in the case of not deviating from... Figure 9The sensing electrode layer 2 and the driving electrode layer 3 are interchanged under the concept of the above-mentioned embodiment four, so other details at this time can also be understood by the above-mentioned embodiment four, and thus will not be described here.

[0108] [Embodiment Seven]

[0109] Please refer to Figure 12 , which is the embodiment seven of the present application. Since the embodiment seven is similar to the above-mentioned embodiment five or embodiment six, the same will not be described here, and the differences between the embodiment seven and the above-mentioned embodiment five or embodiment six are described as follows:

[0110] In the embodiment seven, each of the light emitting diode chips 4 is placed in two adjacent sensing units 23, or in other words, across the two sensing units 23, and the position of each of the light emitting diode chips 4 corresponds to the intersection of the sensing electrode 21 and the driving electrode 31.

[0111] Further, the light emitting diode chips 4 in the embodiment seven are arranged on the first substrate 11 of the substrate module 1, and the sensing electrodes 21 and the driving electrodes 31 are arranged on the second substrate 12 of the substrate module 1 or arranged on the second substrate 12 and the third substrate 13 respectively. Accordingly, the light emitting diode chips 4 in the embodiment seven only slightly affect the capacitance change between the sensing electrodes 21 and the driving electrodes 31, so that the capacitive touch panel 100 still does not need to have a gap without a sensing unit to arrange the light emitting diode chips 4.

[0112] [Embodiment Eight]

[0113] Please refer to Figure 13 , which is the embodiment eight of the present application. Since the embodiment eight is similar to the above-mentioned embodiment seven, the same will not be described here, and the differences between the embodiment eight and the above-mentioned embodiment seven are described as follows:

[0114] In the embodiment eight, each of the light emitting diode chips 4 is placed in two adjacent sensing units 23, or in other words, across the two sensing units 23, and the position of each of the light emitting diode chips 4 corresponds to the intersection of the sensing electrode 21 and the driving electrode 31.

[0115] [Technical Effects of Embodiments of the Present Application]

[0116] In summary, the capacitive touch panel disclosed in the embodiments of the present application can avoid the influence of the position of any of the light emitting diode chips on the touch effect of the capacitive touch panel, and can also have delicate local optical changes, by the cooperation between the light emitting diode chips and other components (for example, each of the light emitting diode chips is located in one of the layout spaces, and the light emitting diode chips do not shield any of the sensing electrodes in the normal direction).

[0117] Furthermore, the capacitive touch panel disclosed in the embodiments of the present application can effectively reduce the thickness of the capacitive touch panel, by the structural design of each of the drive electrodes (for example, each of the drive electrodes of the plurality of drive electrodes is surrounded by a layout area, and the drive electrode layer defines a plurality of layout spaces extending from the plurality of layout areas in the normal direction), so that the plurality of sensing electrodes, the plurality of drive electrodes, and the plurality of light emitting diode chips can be arranged on the same substrate.

[0118] In addition, the capacitive touch panel disclosed in the embodiments of the present application can reduce the manufacturing difficulty by arranging the plurality of light emitting diode chips on the substrate away from the protective layer, so that the protective layer does not need to cover any of the light emitting diode chips.

[0119] On the other hand, the capacitive touch panel disclosed in the embodiments of the present application divides the touch sensing area formed by the plurality of sensing electrodes and the plurality of drive electrodes into a plurality of sensing units with the same area, and by the above-mentioned various specific embodiments, the light emitting diode chips can be placed in the sensing units (for example, in two adjacent sensing units), and the position corresponds to one of the drive electrodes or one of the sensing electrodes, but does not affect the capacitance change between the sensing electrodes and the drive electrodes, and does not need to compensate for the sensing amount of any of the sensing units.

[0120] Further, the capacitive touch panel disclosed in the embodiments of the present application can be particularly suitable for a touch keyboard, that is, the capacitive touch panel can have a plurality of keycaps, and one or more of the sensing units of the capacitive touch panel can correspond to one keycap. When a keycap is touched, the light emitting diode chip in the corresponding one or more sensing units can emit light.

[0121] The above disclosure is only the preferred feasible embodiments of the present application, and does not limit the patent scope of the present application, so any equivalent technical changes made by applying the content of the specification and drawings of the present application are included in the patent scope of the present application.

Claims

1. A capacitive touch panel, characterized in that, The capacitive touch panel includes: A substrate module is defined with a normal direction; A sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; A driving electrode layer is located at a different height from the sensing electrode layer in the normal direction, and the driving electrode layer includes a plurality of driving electrodes formed on the substrate module; wherein the driving electrode layer defines a plurality of layout spaces extending from the plurality of driving electrodes along the normal direction; A plurality of light-emitting diode (LED) chips are mounted on the substrate module, each LED chip being located within one of the layout spaces, and none of the LED chips obscuring any of the sensing electrodes along the normal direction; and A controller is electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; When a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to the at least one sensing electrode that forms the coupling capacitor to emit light. The substrate module includes a plurality of substrates arranged along the normal direction, and a plurality of sensing electrodes and a plurality of light-emitting diode chips are disposed together on one of the substrates and defined as a first substrate. The capacitive touch panel further includes a protective layer, and the protective layer covers the plurality of sensing electrodes and the plurality of light-emitting diode chips; Wherein, the distance between the light-emitting end face of any one of the light-emitting diode chips and the first substrate is greater than the thickness of any one of the sensing electrodes; the surface of the protective layer facing the first substrate is provided with a plurality of receiving grooves, and the light-emitting end faces of the plurality of light-emitting diode chips are respectively located in the plurality of receiving grooves.

2. The capacitive touch panel according to claim 1, characterized in that, The protective layer includes an operating surface remote from the substrate module, and the operating surface is separated from the light-emitting end face of any of the light-emitting diode chips by a distance greater than 0 and less than 1 mm.

3. The capacitive touch panel according to claim 1, characterized in that, The substrate module includes multiple first transmission lines and multiple second transmission lines electrically coupled to the controller. The multiple first transmission lines are connected one-to-one to multiple light-emitting diode chips, and the multiple second transmission lines are connected one-to-one to multiple light-emitting diode chips.

4. The capacitive touch panel according to claim 1, characterized in that, The substrate module includes multiple first transmission lines electrically coupled to the controller and multiple second transmission lines corresponding to the multiple first transmission lines. The multiple light-emitting diode chips are divided into multiple light-emitting groups, and each light-emitting group includes at least two light-emitting diode chips. Any one of the first transmission lines is connected to each light-emitting diode chip in one light-emitting group, and any one of the second transmission lines is connected to one light-emitting diode chip in each of the at least two light-emitting groups.

5. The capacitive touch panel according to claim 1, characterized in that, The plurality of driving electrodes are disposed on another substrate other than the first substrate.

6. A capacitive touch panel, characterized in that, The capacitive touch panel includes: A substrate module is defined with a normal direction; A sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; A driving electrode layer includes a plurality of driving electrodes formed on the substrate module; wherein each of the plurality of driving electrodes surrounds a layout region, and the driving electrode layer defines a plurality of layout spaces extending from the plurality of layout regions along the normal direction. A plurality of light-emitting diode (LED) chips are mounted on the substrate module, each LED chip being located within one of the layout spaces, and none of the LED chips obscuring any of the sensing electrodes along the normal direction; and A controller is electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; When a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to the at least one sensing electrode with the coupling capacitor to emit light. The substrate module includes a plurality of substrates arranged along the normal direction, and a plurality of driving electrodes and a plurality of light-emitting diode chips are disposed together on one of the substrates and defined as a first substrate, wherein each light-emitting diode chip is surrounded by a driving electrode and located in the corresponding layout area. The plurality of sensing electrodes are disposed on the first substrate; the capacitive touch panel further includes a protective layer, and the protective layer covers the plurality of sensing electrodes, the plurality of driving electrodes, and the plurality of light-emitting diode chips; Wherein, the distance between the light-emitting end face of any one of the light-emitting diode chips and the first substrate is greater than the thickness of any one of the sensing electrodes; the surface of the protective layer facing the first substrate is provided with a plurality of receiving grooves, and the light-emitting end faces of the plurality of light-emitting diode chips are respectively located in the plurality of receiving grooves.

7. The capacitive touch panel according to claim 6, characterized in that, The protective layer includes an operating surface remote from the substrate module, and the operating surface is separated from the light-emitting end face of any of the light-emitting diode chips by a distance greater than 0 and less than 1 mm.

8. The capacitive touch panel according to claim 6, characterized in that, The substrate module includes multiple first transmission lines and multiple second transmission lines electrically coupled to the controller. The multiple first transmission lines are connected one-to-one to multiple light-emitting diode chips, and the multiple second transmission lines are connected one-to-one to multiple light-emitting diode chips.

9. The capacitive touch panel according to claim 6, characterized in that, The substrate module includes multiple first transmission lines electrically coupled to the controller and multiple second transmission lines corresponding to the multiple first transmission lines. The multiple light-emitting diode chips are divided into multiple light-emitting groups, and each light-emitting group includes at least two light-emitting diode chips. Any one of the first transmission lines is connected to each light-emitting diode chip in one light-emitting group, and any one of the second transmission lines is connected to one light-emitting diode chip in each of the at least two light-emitting groups.

10. A capacitive touch panel, characterized in that, The capacitive touch panel includes: A substrate module is defined with a normal direction; A sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; A driving electrode layer includes a plurality of driving electrodes formed on the substrate module; wherein each of the plurality of driving electrodes surrounds a layout region, and the driving electrode layer defines a plurality of layout spaces extending from the plurality of layout regions along the normal direction. A plurality of light-emitting diode (LED) chips are mounted on the substrate module, each LED chip being located within one of the layout spaces, and none of the LED chips obscuring any of the sensing electrodes along the normal direction; and A controller is electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; When a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to the at least one sensing electrode with the coupling capacitor to emit light. The substrate module includes a plurality of substrates arranged along the normal direction, and a plurality of driving electrodes and a plurality of light-emitting diode chips are disposed together on one of the substrates and defined as a first substrate, wherein each light-emitting diode chip is surrounded by a driving electrode and located in the corresponding layout area. In this embodiment, a plurality of the sensing electrodes are disposed on another substrate outside the first substrate and defined as a second substrate. The second substrate has a plurality of through holes formed in the area through which the plurality of layout spaces pass, and the light-emitting end face of any one of the light-emitting diode chips faces one of the through holes.

11. The capacitive touch panel according to claim 10, characterized in that, The substrate module includes multiple first transmission lines and multiple second transmission lines electrically coupled to the controller. The multiple first transmission lines are connected one-to-one to multiple light-emitting diode chips, and the multiple second transmission lines are connected one-to-one to multiple light-emitting diode chips.

12. The capacitive touch panel according to claim 10, characterized in that, The substrate module includes multiple first transmission lines electrically coupled to the controller and multiple second transmission lines corresponding to the multiple first transmission lines. The multiple light-emitting diode chips are divided into multiple light-emitting groups, and each light-emitting group includes at least two light-emitting diode chips. Any one of the first transmission lines is connected to each light-emitting diode chip in one light-emitting group, and any one of the second transmission lines is connected to one light-emitting diode chip in each of the at least two light-emitting groups.

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