Support unit and substrate processing apparatus

Abstract

The present invention provides a support unit and a substrate processing apparatus. The support unit for supporting the substrate may include: a chuck stage, which is rotatable; a heating member disposed above the chuck stage and heating the substrate supported by the support unit; a power source that applies power to the heating member; a window disposed above the chuck stage and defining an internal space in which the heating member is disposed; and an interlock module that selectively cuts off the power applied to the heating member.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0042577, filed with the Korean Intellectual Property Office on April 1, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the present invention described herein relate to a support unit and a substrate processing device. Background Technology

[0004] Generally, in the manufacturing processes of flat panel display devices or semiconductors, the processes for handling glass substrates or wafers include various processes such as photoresist coating, developing, etching, and ashing. These processes include wet cleaning processes using chemicals or deionized water and drying processes for drying chemicals or deionized water remaining on the substrate surface to remove various contaminants adhering to the substrate. Furthermore, in recent years, selective removal processes (e.g., etching processes) have been performed using chemicals such as sulfuric acid or phosphoric acid to remove silicon nitride and silicon oxide films.

[0005] As substrate processing equipment using chemicals, substrate processing equipment that heats the substrate has been used to improve substrate processing efficiency. An example of such substrate processing equipment is disclosed in U.S. Patent Application Publication No. 2016-0013079. According to the patent, the substrate processing equipment has a lamp for heating the substrate in a rotating head. This lamp generates radiant heat to heat the substrate. When the heat radiated by the lamp is delivered to the substrate, the temperature of the substrate increases. Therefore, the substrate processing efficiency is increased.

[0006] However, due to abnormal operation of the lamp or malfunction of the components operating the lamp, the temperature of the space in which the lamp is housed may rise excessively. In such a case, an explosion may occur within the rotating head. Furthermore, heat may be delivered to the driver of the rotating head, and thus the driver may malfunction. Summary of the Invention

[0007] An embodiment of the present invention provides a support unit and a substrate processing device, the support unit being able to detect abnormal operation of the heating component of the heating substrate or malfunction of the components operating the heating component.

[0008] An embodiment of the present invention provides a support unit and a substrate processing device, the support unit being capable of detecting overheating of the space in which a heating element is disposed.

[0009] Embodiments of the present inventive concept provide a support unit and a substrate processing apparatus that can improve a risk of explosion and / or a risk of malfunction of a rotation driving part caused by heat generated by a heating member.

[0010] The objects of the present inventive concept are not limited to the above-mentioned objects, and other unmentioned objects that are obvious to those skilled in the art can be clearly understood from the following description.

[0011] According to an exemplary embodiment, a support unit that supports a substrate can include a chuck table rotatable, a heating member configured above the chuck table and heating the substrate supported by the support unit, a power source applying power to the heating member, a window configured above the chuck table and defining an internal space in which the heating member is disposed, and an interlock module selectively cutting off the power applied to the heating member.

[0012] According to an exemplary embodiment, the support unit can further include a controller, and the interlock module can include a temperature sensor measuring a temperature of the internal space and delivering the measured temperature of the internal space to the controller, and when the temperature of the internal space delivered from the temperature sensor is higher than a default temperature, the controller can generate a control signal for cutting off the power applied to the heating member.

[0013] According to an exemplary embodiment, the interlock module can include a cut-off member cutting off the power delivered from the power source to the heating member by opening a closed circuit provided by the power source and the heating member according to a change in the temperature of the internal space.

[0014] According to an exemplary embodiment, the cut-off member can include a first cut-off member, and a second cut-off member connected in series to the first cut-off member and having a power cut-off structure different from a power cut-off structure of the first cut-off member.

[0015] According to an exemplary embodiment, the first cut-off member can include a fuse, and the second cut-off member can include a bimetal.

[0016] According to an exemplary embodiment, the support unit can include a reflection plate disposed below the heating member, a cooling plate disposed below the reflection plate, and a support member mounted to overlap an opening formed in the reflection plate when viewed from the top and disposed above the cooling plate, and the cut-off member can be mounted in the support member.

[0017] According to an exemplary embodiment, the support unit can further include a plate disposed below the heating member, and a terminal member inserted into an opening formed in the plate and connected to a power supply line that delivers the electric power to the heating member, and the heating member can have a hook shape, and one end and an opposite end of the heating member can be connected to the terminal member.

[0018] According to an exemplary embodiment, the support unit can further include a rotation driving part coupled to the chuck table to rotate the chuck table and having a hollow part, and a main body inserted into the hollow part of the rotation driving part, and the plate can be coupled to the main body to be independent of rotation of the chuck table.

[0019] According to an exemplary embodiment, a plurality of heating members can be provided, and the heating members can surround the main body when viewed from the top.

[0020] According to an exemplary embodiment, a substrate processing apparatus can include a chamber having an internal space, a support unit supporting a substrate in the internal space and rotating the substrate, and a fluid supply unit supported by the support unit and supplying a processing fluid to the rotating substrate, a bowl having a processing space for processing the substrate supported by the support unit, and a controller, and the support unit can include a chuck table coupled to a rotation driving part having a hollow part, a heating member disposed above the chuck table and heating the substrate supported by the support unit, a power source applying electric power to the heating member, a window disposed above the chuck table and defining an internal space in which the heating member is disposed, and an interlock module cutting off the electric power delivered to the heating member when a temperature of the internal space is higher than a default temperature, and the interlock module can include a temperature sensor measuring the temperature of the internal space and delivering the measured temperature of the internal space to the controller, or a cut-off member cutting off the electric power delivered from the power source to the heating member by opening a closed circuit provided by the power source and the heating member according to a change in the temperature of the internal space.

[0021] According to an exemplary embodiment, when the temperature of the internal space delivered from the temperature sensor is higher than a default temperature, the controller can generate a control signal for cutting off the electric power applied to the heating member.

[0022] According to an exemplary embodiment, the support unit can further include a nozzle body inserted into the hollow portion of the rotary driving part, a reflection plate coupled to the nozzle body and disposed below the heating member, a cooling plate disposed below the reflection plate, and a support member inserted into an opening formed in the reflection plate and disposed above the cooling plate, and the cutting member can be installed in the support member.

[0023] According to an exemplary embodiment, the cutting member can include a first cutting member, and a second cutting member having a different power cutting structure from that of the first cutting member.

[0024] According to an exemplary embodiment, the first cutting member can include a fuse, and the second cutting member can include a bimetal.

[0025] According to an exemplary embodiment, the substrate processing apparatus can further include a terminal member inserted into the opening and connected to a power supply line that delivers the power to the heating member, and the heating member can have a hook shape, and one end and the opposite end of the heating member are connected to the terminal member.

[0026] According to an exemplary embodiment, a plurality of heating members can be provided, and when viewed from the top, the heating members can surround the nozzle body.

[0027] According to an exemplary embodiment, the heating members can be fixedly installed above the reflection plate to be independent of the rotation of the chuck table.

[0028] According to an exemplary embodiment, a support unit that supports a substrate can include a chuck table coupled to a rotary driving part having a hollow portion, a rear nozzle part that supplies a processing fluid to the substrate supported by the support unit, a plurality of IR lamps disposed above the chuck table and heating the substrate supported by the support unit, a power source that applies power to the IR lamps, a window disposed above the chuck table, defining an inner space in which the IR lamps are disposed, and having at least one discharge hole on a side surface thereof, a reflection plate disposed below the IR lamps, a cooling plate having a cooling passage in which a cooling fluid flows, disposed below the reflection plate, and a portion of an upper surface thereof contacting a lower surface of the reflection plate, a gas supply line that supplies an inert gas to a space between the reflection plate and the cooling plate, and an interlock module that cuts off the power applied to the IR lamps when a default condition is satisfied.

[0029] According to an exemplary embodiment, the rear nozzle part can include a nozzle body inserted into the hollow part, and a fluid ejection part disposed above the nozzle body, and the reflection plate and the cooling plate can be coupled to the rear nozzle part to be independent of rotation of the chuck table, and a plurality of discharge holes can be provided and can be formed to be spaced apart from each other in a circumferential direction of the window when viewed from the top.

[0030] According to an exemplary embodiment, the support unit can further include a support member inserted into an opening formed in the reflection plate and positioned on the cooling plate, and the interlocking module can include a cut-off member installed in the support member and cutting off the power delivered from the power source to the IR lamps by opening a closed circuit provided by the power source and the IR lamps according to a change in temperature of the inner space, and a temperature sensor measuring the temperature of the inner space and delivering the measured temperature of the inner space to a controller controlling the support unit, the cut-off member can include a first cut-off member having a fuse and a second cut-off member having a bimetal, and when the temperature of the inner space delivered from the temperature sensor is higher than a default temperature, the controller can generate a control signal for cutting off the power applied to the IR lamps. BRIEF DESCRIPTION OF DRAWINGS

[0031] The above and other objects and features will become apparent from the following description of the drawings, in which like reference numerals refer to like parts throughout the various drawings unless otherwise specified.

[0032] Figure 1 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.

[0033] Figure 2 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept. Figure 1 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.

[0034] Figure 3 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept. Figure 1 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.

[0035] Figure 4 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept. Figure 2 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.

[0036] Figure 5 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept. Figure 4 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.

[0037] is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept.Figure 6 is a perspective view showing Figure 5 a window and a chuck table.

[0038] Figure 7 is a view of a cooling plate of Figure 5 from a top.

[0039] Figure 8 is a view showing a support unit of Figure 4 heating a substrate.

[0040] Figure 9 is an enlarged view of a region "B" of Figure 2 .

[0041] Figure 10 is a sectional view of a support unit of Figure 9 from a direction C-C'.

[0042] Figure 11 is a block diagram schematically showing an example of an electrical connection of a heating module and an interlock module of the inventive concept.

[0043] Figure 12 is a view showing an example in which an interlock module of Figure 11 performs interlocking.

[0044] Figure 13 is a view showing another example in which an interlock module of Figure 11 performs interlocking.

[0045] Figure 14 is a view showing another example in which an interlock module of Figure 11 performs interlocking.

[0046]

Explanation of symbols

[0047] 1 - substrate processing facility; 10 - substrate processing apparatus; 12 - first direction; 14 - second direction; 16 - third direction; 100 - chamber; 102 - horizontal partition wall; 110 - air flow supply member; 120 - process area; 130 - maintenance / repair area; 200 - bowl; 210 - first recovery container; 220 - second recovery container; 230 - third recovery container; 241 - first recovery line; 243 - second recovery line; 245 - third recovery line; 290 - exhaust conduit; 300 - support unit; 310 - chuck; 312 - chuck table; 312a - blocking boss; 314 - quartz window; 314a - exhaust hole; 316 - chucking pin; 317 - inner space; 318 - support pin; 320 - rotary drive member; 330 - rear nozzle member; 332 - fluid ejection member; 334 - nozzle body; 340 - heating module; 342 - heating member; 344 - power supply line; 346 - power source; 347 - switch; 348 - terminal member; 349 - support member; 360 - reflection plate; 362 - support bracket; 370 - cooling plate; 372 - cooling passage; 373 - center hole; 374 - contact portion; 374a - first contact portion; 374b - second contact portion; 375 - spacing portion; 380 - gas supply member; 381 - first gas supply line; 382 - first gas supply source; 383 - second gas supply line; 384 - second gas supply source; 390 - cooling fluid supply member; 391 - cooling fluid supply line; 392 - cooling fluid supply source; 393 - cooling fluid exhaust line; 400 - fluid supply unit; 410 - fluid nozzle member; 411 - nozzle; 413 - nozzle arm; 415 - support rod; 417 - nozzle driver; 420 - supply unit; 500 - exhaust unit; 510 - exhaust line; 520 - damper; 600 - lifting unit; 612 - bracket; 614 - movable shaft; 616 - driver; 700 - interlock module; 710 - temperature sensor; 712 - probe; 714 - sensor line; 720 - first shut-off member; 730 - second shut-off member; 722 - fuse; 724 - first lead wire; 732 - bimetal; 734 - second lead wire; 1000 - indexing module; 1200 - load port; 1300 - carrier; 1400 - feed frame; 1420 - indexing track; 1440 - indexing robot; 1441 - base; 1442 - body; 1443 - indexing arm; 2000 - process execution module; 2200 - buffer unit; 2400 - feed chamber; 2420 - guide track; 2440 - main robot; 2441 - base; 2442 - body; 2443 - main arm; 2600 - process chamber; 3000 - controller; G - gas; H - thermal energy; RS1 - first recovery space; RS2 - second recovery space; RS3 - third recovery space; W - substrate. DETAILED DESCRIPTION

[0048] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so as to be easily practiced by those having ordinary knowledge in the technical field to which the inventive concept pertains. However, the inventive concept can be implemented in various different forms and is not limited to these embodiments. In addition, in the detailed description of the preferred embodiments of the inventive concept, a detailed description of functions or configurations that are related to the known art can be omitted when it can make the essence of the inventive concept unclear.

[0049] Unless specifically contradicted by context, the term "comprising" can include "including," "containing," "carrying," "decomposing," "accommodating," "covering," "plus," "characterized by," "characterized in that," and / or "characterized by a process that can include other steps" but does not exclude other components, steps, processes, methods, and / or steps. In particular, the terms "comprising" and "having" are used to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification can be included but one or more other features, numbers, steps, operations, components, parts, or combinations thereof can be further included.

[0050] Unless otherwise defined, the singular form of a word can include the plural form. In addition, in the drawings, the shape and size of components can be exaggerated for a clearer description.

[0051] Figure 1 is a plan view schematically showing a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the inventive concept. Referring to Figure 1 , the substrate processing facility 1 includes an indexing module 1000, a process performing module 2000, and a controller 3000.

[0052] The indexing module 1000 includes a plurality of load ports 1200 and a feed frame 1400. The load ports 1200, the feed frame 1400, and the process performing module 2000 can be configured in a row in order. Hereinafter, a direction in which the load ports 1200, the feed frame 1400, and the process performing module 2000 are arranged will be referred to as a first direction 12. A direction perpendicular to the first direction 12 when viewed from the top will be referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0053] A carrier 1300 in which a substrate "W" is received is seated on the load port 1200. A plurality of load ports 1200 are provided, and the load ports 1200 are configured in a row in the second direction 14. Figure 1Four load ports 1200 are shown to be provided. However, the number of load ports 1200 can be increased or decreased depending on conditions such as process efficiency and footprint of the process execution module 2000. A plurality of slots (not shown) provided to support the periphery of the substrate "W" are formed in the carrier 1300. The plurality of slots are provided in the third direction 16. The substrates "W" are stacked in the carrier 1300 while being spaced apart from each other in the third direction 16. A front opening unified pod (FOUP) can be used as the carrier 1300.

[0054] The process execution module 2000 includes a buffer unit 2200, a feed chamber 2400, and a plurality of process chambers 2600. The feed chamber 2400 is configured such that the length direction thereof is parallel to the first direction 12. The process chambers 2600 are arranged on opposite sides of the feed chamber 2400 in the second direction 14. The process chambers 2600 located on one side of the feed chamber 2400 and the process chambers 2600 located on the opposite side of the feed chamber 2400 are symmetrical to each other about the feed chamber 2400. Some of the process chambers 2600 are arranged in the length direction of the feed chamber 2400. Further, some of the process chambers 2600 are arranged to be stacked with each other. That is, process chambers 2600 having an A x B (A and B are natural numbers) array can be arranged on one side of the feed chamber 2400. Here, A is the number of process chambers 2600 arranged in a row in the first direction 12, and B is the number of process chambers 2600 arranged in a row in the third direction 16. When four or six process chambers 2600 are arranged on one side of the feed chamber 2400, the process chambers 2600 can be arranged in a 2 x 2 or 3 x 2 array. The number of process chambers 2600 can be increased or decreased. Unlike the description mentioned above, the process chambers 2600 can be arranged only on one side of the feed chamber 2400. In addition, unlike the description mentioned above, the process chambers 2600 can be arranged on one side or the opposite side of the feed chamber 2400.

[0055] The buffer unit 2200 is arranged between the feed frame 1400 and the feed chamber 2400. The buffer unit 2200 provides a space in which the substrate "W" is temporarily stayed before being transferred between the feed chamber 2400 and the feed frame 1400. Slots (not illustrated) in which the substrate "W" is positioned are provided in the buffer unit 2200, and a plurality of slots (not illustrated) are provided to be spaced apart from each other in the third direction 16. A surface of the buffer unit 2200 facing the feed frame 1400 and a surface of the buffer unit 2200 facing the feed chamber 2400 are respectively open.

[0056] The feeding frame 1400 transfers the substrates "W" between the carriers 1300 seated on the load port 1200 and the buffer units 2200. An indexing track 1420 and an indexing robot 1440 are provided in the feeding frame 1400. The indexing track 1420 is configured such that its length direction is parallel to the second direction 14. The indexing robot 1440 is mounted on the indexing track 1420 and linearly moves along the indexing track 1420 in the second direction 14. The indexing robot 1440 has a base 1441, a body 1442, and a plurality of indexing arms 1443. The base 1441 is mounted to move along the indexing track 1420. The body 1442 is coupled to the base 1441. The body 1442 is provided to move on the base 1441 in the third direction 16. The body 1442 is provided to rotate on the base 1441. The indexing arms 1443 are coupled to the body 1442 and are provided to move back and forth relative to the body 1442. The plurality of indexing arms 1443 are provided to be individually driven. The indexing arms 1443 are configured to be stacked so as to be spaced apart from each other in the third direction 16. Some of the indexing arms 1443 are used when the substrates "W" are transferred to the carriers 1300 in the process execution modules 2000, and some of the indexing arms 1443 can be used when the substrates "W" are transferred from the carriers 1300 to the process execution modules 2000. This configuration can prevent particles generated from the substrates "W" before process treatment from adhering to the substrates "W" after process treatment in the process of carrying the substrates "W" in and out by the indexing robot 1440.

[0057] The feeding chamber 2400 transfers the substrates "W" between the buffer units 2200 and the process chambers 2600 and between the process chambers 2600. A guide track 2420 and a main robot 2440 are provided in the feeding chamber 2400. The guide track 2420 is configured such that its length direction is parallel to the first direction 12. The main robot 2440 is mounted on the guide track 2420 and linearly moves along the guide track 2420 in the first direction 12. The main robot 2440 has a base 2441, a body 2442, and a plurality of main arms 2443. The base 2441 is mounted to move along the guide track 2420. The body 2442 is coupled to the base 2441. The body 2442 is provided to move on the base 2441 in the third direction 16. The body 2442 is provided to rotate on the base 2441. The main arms 2443 are coupled to the body 2442 and are provided to move back and forth relative to the body 2442. The plurality of main arms 2443 are provided to be individually driven. The main arms 2443 are configured to be stacked so as to be spaced apart from each other in the third direction 16. The main arms 2443 are used when the substrates "W" are transferred from the buffer units 2200 to the process chambers 2600, and the main arms 2443 are used when the substrates "W" are transferred from the process chambers 2600 to the buffer units 2200.

[0058] A substrate processing apparatus 10 for performing fluid processing processes (e.g., cleaning processes or film removal processes such as etching) on ​​a substrate "W" is disposed in a process chamber 2600. Depending on the type of cleaning process, the substrate processing apparatus 10 disposed in the process chamber 2600 may have different structures. Optionally, the substrate processing apparatus 10 in the process chamber 2600 may have the same structure. Optionally, the process chambers 2600 may be classified into multiple groups, such that substrate processing apparatus 10 belonging to the same group have the same structure, and substrate processing apparatus 10 belonging to different groups have different structures. For example, when the process chambers 2600 are classified into two groups, the first group of process chambers 2600 may be disposed on one side of the feed chamber 2400, and the second group of process chambers 2600 may be disposed on the opposite side of the feed chamber 2400. Optionally, the first group of process chambers 2600 may be disposed on the lower side of the feed chamber 2400, and the second group of process chambers 2600 may be disposed on the upper side of the feed chamber 2400, on the opposite side of the feed chamber 2400. The first group of process chambers 2600 and the second group of process chambers 2600 may be classified according to the type of chemical used or the type of cleaning method.

[0059] The controller 3000 can control the substrate processing facility 1. The controller 3000 can control the index module 1000 and the process execution module 2000. The controller 3000 can be disposed in the process chamber 2600 of the process execution module 2000 and can control the substrate processing apparatus 10, as will be described below. The controller 3000 is included in the substrate processing apparatus 10 and can control the support unit 300, as will be described below. The controller 3000 can receive temperature data delivered from the interlock module 700, as will be described below, and can control the support unit 300 based on the received temperature data.

[0060] Furthermore, the controller 3000 may include a process controller comprising: a microprocessor (computer) that performs control over the substrate processing facility 1; a keyboard for inputting commands that allow an operator to manage the substrate processing facility 1; a user interface including a display for visualizing and showing the operating status of the substrate processing facility 1; and a memory unit for storing control formulas for executing processes performed by the substrate processing facility 1 under the control of the process controller, or programs (i.e., process recipes) for executing processes in elements according to various data and process conditions. Additionally, the user interface and memory unit may be connected to the process processor. The process recipes may be stored in a memory medium in the memory unit, and this memory medium may be a hard disk, a portable disk (such as a CD-ROM, DVD, or similar), or semiconductor memory (such as flash memory).

[0061] In the following description, a substrate processing apparatus 10 of the present invention, disposed in a process chamber 2600, will be described. In the following embodiments, an apparatus for fluid processing a substrate “W” using a processing fluid, such as high-temperature sulfuric acid, high-temperature phosphoric acid, alkaline chemicals, acidic chemicals, and drying gases, will be described as an example of the substrate processing apparatus 10. However, the spirit of the present invention is not limited thereto, and can be applied to all various substrate processing apparatuses that perform fluid processing processes by supplying processing fluid to a rotating substrate “W”.

[0062] Figure 2 It is located in the process chamber Figure 1 A plan view of the substrate processing equipment. Figure 3 It is located in the process chamber Figure 1 A cross-sectional view of the substrate processing equipment. (Reference) Figure 2 and Figure 3 The substrate processing equipment 10 includes a chamber 100, a bowl-shaped component 200, a support unit 300, a fluid supply unit 400, an exhaust unit 500, a lifting unit 600, and an interlock module 700.

[0063] Chamber 100 provides an enclosed internal space. An airflow supply member 110 is mounted on the upper side. The airflow supply member 110 forms a downward airflow within the chamber 100. The airflow supply member 110 filters high-humidity external air and supplies external air into the chamber 100. The high-humidity external air passes through the airflow supply member 110 and is supplied into the interior of the chamber 100, forming a downward airflow. The downward airflow provides a uniform airflow to the upper side of the substrate "W" and, via the recovery containers (210, 220, and 230) of the bowl-shaped members 200, discharges contaminants generated during the process of treating the surface of the substrate "W" with the processing fluid, along with the air, to the exhaust unit 500.

[0064] The interior space of chamber 100 is divided by horizontal partition wall 102 into a process area 120 (an example of a processing space) and a maintenance / repair area 130. The bowl-shaped component 200 and support unit 300 are located in process area 120. In addition to the recovery lines (241, 243, and 245) connected to the bowl-shaped component 200 and the exhaust line 510, the drive portion of the lifting unit 600, the drive portion of the fluid supply unit 400, the supply lines, and the like are also located in maintenance / repair area 130. Maintenance / repair area 130 is isolated from process area 120.

[0065] The bowl-shaped member 200 may have a processing space for processing the substrate "W" supported by the support unit 300, as will be described below. The bowl-shaped member 200 has a cylindrical shape with a top opening and a processing space for processing the substrate "W". The upper surface of the opening of the bowl-shaped member 200 is provided as a carry-in / carry-out passage for the substrate "W". The support unit 300 is located in the processing space. The support unit 300 supports the substrate "W" while rotating the substrate "W" during the process.

[0066] The bowl-shaped member 200 provides a lower space in which an exhaust duct 290 is connected to the lower end of the bowl-shaped member 200 to enable forced exhaust. Processing fluids and gases splashed onto the rotating substrate "W" are introduced or drawn into the first recovery container 210, the second recovery container 220, and the third recovery container 230, which are arranged in the bowl-shaped member 200 in a plurality of stages.

[0067] The annular first recycling container 210, second recycling container 220, and third recycling container 230 have vent holes "H" communicating with a shared annular space. Specifically, each of the first recycling container 210, second recycling container 220, and third recycling container 230 includes a bottom surface having an annular ring shape and a sidewall extending upward from the bottom surface having a cylindrical shape. The second recycling container 220 surrounds and is spaced apart from the first recycling container 210. The third recycling container 230 surrounds and is spaced apart from the second recycling container 220.

[0068] The first recycling container 210, the second recycling container 220, and the third recycling container 230 can provide a first recycling space RS1, a second recycling space RS2, and a third recycling space RS3, into which processing fluid splashed from the substrate "W" and airflow of flue gas are introduced. The first recycling space RS1 is defined by the first recycling container 210, the second recycling space RS2 is defined by the space between the first recycling container 210 and the second recycling container 220, and the third recycling space RS3 is defined by the space between the second recycling container 220 and the third recycling container 230.

[0069] The central portion of the upper surface of the first recycling container 210, the second recycling container 220, and the third recycling container 230 is open. Each of the first recycling container 210, the second recycling container 220, and the third recycling container 230 has an inclined surface, the distance of which gradually increases from the connecting sidewall to the opening. The processing fluid splashed from the substrate "W" flows along the upper surfaces of the first recycling container 210, the second recycling container 220, and the third recycling container 230 into the first recycling space RS1, the second recycling space RS2, and / or the third recycling space RS3.

[0070] The first processed fluid introduced into the first recovery space RS1 is discharged to the outside via the first recovery line 241. The second processed fluid introduced into the second recovery space RS2 is discharged to the outside via the second recovery line 243. The third processed fluid introduced into the third recovery space RS3 is discharged to the outside via the third recovery line 245.

[0071] The fluid supply unit 400 can process the substrate "W" by supplying a processing fluid to the substrate "W". The fluid supply unit 400 can supply a heat-treated fluid to the substrate "W". The processing fluid can treat the surface of the substrate "W". The processing fluid can be a high-temperature chemical used to etch the substrate "W", for example, to remove a thin film from the substrate "W". For example, the chemical can be sulfuric acid, phosphoric acid, or a mixture of sulfuric acid and phosphoric acid. The fluid supply unit 400 may include a fluid nozzle member 410 and a supply unit 420.

[0072] The fluid nozzle assembly 410 may include a nozzle 411, a nozzle arm 413, a support rod 415, and a nozzle driver 417. The nozzle 411 can receive processed fluid from the supply unit 420. The nozzle 411 can discharge the processed fluid onto the surface of the substrate "W". The nozzle arm 413 is an arm whose length is arranged longer in one direction, and the nozzle 411 is mounted at the top end of the nozzle arm 413. The nozzle arm 413 supports the nozzle 411. The support rod 415 is mounted at the rear end of the nozzle arm 413. The support rod 415 is located at the lower portion of the nozzle arm 413. The nozzle driver 417 is located at the lower end of the support rod 415. The nozzle driver 417 causes the support rod 415 to rotate about its longitudinal axis. As the support rod 415 rotates, the nozzle arm 413 and the nozzle 411 oscillate about the support rod 415. The nozzle 411 can oscillate between the outside and inside of the cup-shaped member 200. In addition, the nozzle 411 can discharge the processing fluid while oscillating in the segment between the central region and the peripheral region of the substrate "W".

[0073] The venting unit 500 can vent air from the interior of the bowl-shaped member 200. For example, the venting unit 500 can provide venting pressure (suction pressure) to one of the first recovery container 210, the second recovery container 220, and the third recovery container 230, which recover process fluids during the process. The venting unit 500 may include an venting line 510 connected to an venting duct 290 and a damper 520. The venting line 510 may be provided with venting pressure from an venting pump (not shown) and connected to a main venting line embedded in the bottom space of the semiconductor production line.

[0074] Simultaneously, the bowl-shaped component 200 is coupled to the lifting unit 600, which changes the vertical position of the bowl-shaped component 200. The lifting unit 600 causes the bowl-shaped component 200 to move linearly up and down. As the bowl-shaped component 200 moves up and down, its relative height to the support unit 300 changes.

[0075] The lifting unit 600 includes a bracket 612, a movable shaft 614, and a driver 616. The bracket 612 is fixedly mounted on the outer wall of the bowl-shaped member 200. The movable shaft 614, which moves up and down by the driver 616, is fixedly coupled to the bracket 612. When the substrate "W" is loaded onto or removed from the support unit 300, the bowl-shaped member 200 is lowered so that the support unit 300 protrudes above the bowl-shaped member 200. Furthermore, during the process, the height of the bowl-shaped member 200 is adjusted according to the type of processing fluid supplied to the substrate "W" so that the processing fluid is introduced into preset recovery containers (210, 220, and 230). Therefore, the bowl-shaped member 200 can allow for different types of processing fluids and pollutant gases to be recovered in the recovery spaces (RS1, RS2, and RS3).

[0076] Figure 4 From Figure 2 A cross-sectional view of the support unit viewed from direction AA. Figure 5 This is an example Figure 4 An enlarged view of a portion of the support unit. (Reference) Figure 4 and Figure 5 The support unit 300 can support the substrate "W" during the process while simultaneously allowing the substrate "W" to rotate during the process.

[0077] The support unit 300 may include a chuck 310, a rotary drive component 320, a rear nozzle component 330, a heating module 340, a reflector 360, a cooling plate 370, a gas supply component 380, and a cooling fluid supply component 390.

[0078] The chuck 310 may include a chuck stage 312 and a quartz window 314. The quartz window 314 may be configured above the chuck stage 312.

[0079] A quartz window 314 may be configured to protect the heating element 342, as will be described below. The quartz window 314 may cover the heating element 342. The quartz window 314 may form an internal space 317 in which the heating element 342 is disposed. For example, the quartz window 314 may be combined with a chuck stage 312, as will be described below, to define the internal space 317. Furthermore, the quartz window 314 may have a covering shape that covers the chuck stage 312. A reflector 360 and a cooling plate 370, as will be described below, may be disposed within the internal space 317. The chuck stage 312 may be coupled to a rotary drive member 320 to enable rotation. The quartz window 314 may be coupled to the chuck stage 312. Therefore, the quartz window 314 may rotate together with the chuck stage 312.

[0080] The quartz window 314 can be formed of a transparent material, allowing light generated by the heating element 342, as described below, to pass through it. Furthermore, when viewed from above, the diameter of the chuck stage 312 can be larger than the diameter of the quartz window 314.

[0081] Furthermore, the quartz window 314 may include a top surface and side surfaces. The top surface of the quartz window 314 may be configured to face the bottom surface of the substrate "W" supported by the support unit 300. That is, the top surface of the quartz window 314 may be a surface parallel to the bottom surface of the substrate "W" supported by the support unit 300. Furthermore, the side surfaces of the quartz window 314 may extend downwards from the top surface to the peripheral region of the quartz window 314. At least one discharge hole 314a through which the inert gas (described below) passes may be formed on the side surface of the quartz window 314. For example, the discharge hole 314a may be a hole through which the gas "G" supplied by the gas supply line 380 (described below) is discharged. The discharge hole 314a may be formed on the side surface of the quartz window 314, and as... Figure 6 The examples can be spaced apart from each other at equal intervals. For example, when viewed from the top, the drain holes 314a can be spaced apart from each other at equal intervals along the circumferential direction of the quartz window 314.

[0082] Refer again Figure 5 Support pins 318 can also be disposed in the quartz window 314. Support pins 318 can be disposed on the periphery of the upper surface of the quartz window 314 to be spaced apart from each other. Support pins 318 can be configured to protrude upward from the quartz window 314. Support pins 318 support the lower surface of the substrate "W" so that the substrate "W" is supported while being spaced upward from the quartz window 314.

[0083] A retaining pin 316 can be mounted around the periphery of the chuck stage 312. The retaining pin 316 is configured to pass through the quartz window 314 and protrude to the upper side of the quartz window 314. The retaining pin 316 configures the substrate "W" such that the substrate "W," supported by a plurality of support pins 318, can be positioned in place. During the process, the retaining pin 316 contacts one side of the substrate "W" to prevent the substrate "W" from deviating from its proper position.

[0084] Furthermore, a blocking boss 312a can be formed in the chuck stage 312. The blocking boss 312a can prevent impurities outside the support unit 300 from being introduced into the internal space 317 of the chuck 310. When viewed from above, the blocking boss 312a can be circular. The blocking boss 312a can be configured to surround the cooling plate 370, which will be described below, when viewed from above. Furthermore, the blocking boss 312a can be configured to overlap with the reflector 360 when viewed from above. Furthermore, the blocking boss 312a can be configured such that its upper end is spaced apart from the reflector 360. The gap between the upper end of the blocking boss 312a and the reflector 360 can serve as a discharge opening through which the inert gas, which will be described below, is discharged.

[0085] The chuck stage 312 can be coupled to the rotary drive component 320 to enable rotation. The rotary drive component 320 may include a hollow motor and may be configured as a hollow rotating shaft with a hollow portion. At least any one of the first gas supply line 381, the second gas supply line 383, the cooling fluid supply line 391, and the cooling fluid discharge line 393, which will be described below, may be disposed in the hollow portion of the rotary drive component 320.

[0086] As described below, when the chuck stage 312 rotates, the quartz window 314 can rotate together with the chuck stage 312. Furthermore, components disposed in the chuck 310 can be positioned independently of the rotation of the chuck 310. For example, the heating element 342, reflector 360, cooling plate 370, first gas supply line 381, second gas supply line 383, cooling fluid supply line 391, cooling fluid discharge line 393, fuse 722, bimetallic strip 732, first wire 724, second wire 734, and temperature sensor 710, all described below, can be positioned independently of the rotation of the chuck 310.

[0087] The rear nozzle component 330 is configured to supply a processing fluid (e.g., a chemical) to the rear surface of the substrate "W". The rear nozzle component 330 may include a fluid injection component 332 and a nozzle body 334. The nozzle body 334 may be coupled to the fluid injection component 332. For example, the fluid injection component 332 may be coupled to the upper end of the nozzle body 334. The fluid injection component 332 may receive chemicals from a chemical supply line (not shown) and supply the processing fluid to the rear surface of the substrate "W". The nozzle body 334 may extend vertically and may have a container shape with space within it. The nozzle body 334 may be inserted into the hollow portion of the rotary drive component 320 and may be positioned independently of the rotation of the rotary drive component 320 and the chuck stage 312. Furthermore, the reflector 360 and cooling plate 370, already described above, may be coupled to the nozzle body 334 and may be positioned independently of the rotation of the chuck stage 312 and the rotary drive component 320.

[0088] The heating module 340 can heat the substrate "W" during the process. The heating module 340 may include a heating element 342, a power line 344, a power supply 346, a switch 347, a terminal element 348, and a support element 349.

[0089] Heating member 342 can be disposed above chuck stage 312. Heating member 342 can be disposed below quartz window 314. Heating member 342 can be disposed between chuck stage 312 and quartz window 314. Heating member 342 can be directly or indirectly coupled to nozzle body 334 and can be set independently of the rotation of chuck stage 312. For example, heating member 342 can be supported by support bracket 362 disposed above reflector 360. Therefore, heating member 342 can be set independently of chuck stage 312. Heating member 342 can heat substrate "W" supported by support unit 300. Heating member 342 can deliver heat energy to substrate "W" supported by support unit 300 to heat substrate "W". Heating member 342 can radiate light to substrate "W" supported by support unit 300 to heat substrate "W". This light can be light with wavelength in the infrared region. Alternatively, this light can be light with wavelength in the ultraviolet region. The heating member 342 may be hook-shaped. The heating member 342 may be configured to surround the nozzle body 334 when viewed from above. Multiple heating members 342 may be provided. The heating members 342 may be configured to surround the nozzle body 334 when viewed from above. The heating members 342 may be configured to have different diameters when viewed from above. For example, when viewed from above, the inner diameter of any one of the heating members 342 may be smaller than the inner diameter of another heating member 342. For example, the heating member 342 may be a lamp. For example, the heating member 342 may be an IR lamp. However, the inventive concept is not limited thereto, and various modifications can be made to the heating member 342 by using known materials that radiate light capable of heating the substrate "W".

[0090] Furthermore, the heat energy generated by the heating element 342 (e.g., the light output generated by the heating element 342) can be individually controlled. The heating element 342 can perform temperature control during the process by controlling the temperature in individual segments according to the radius of the substrate "W" to continuously increase or decrease the temperature. In this embodiment, five heating elements 342 are shown, but this is merely one embodiment, and the number of heating elements 342 can be increased or decreased depending on the desired temperature to be controlled.

[0091] The power supply line 344, power supply 346, switch 347, terminal component 348 and support component 349 of the heating module 340 will be described later.

[0092] A reflector 360 may be disposed below the heating member 342. The reflector 360 can reflect the heat generated by the heating member 342 to the substrate "W". The reflector 360 can reflect the heat generated by the heating member 342 to the peripheral area and / or the central area of ​​the substrate "W". The reflector 360 may be formed of a material with high reflectivity to the heat generated by the heating member 342. The reflector 360 may be formed of a material with high reflectivity to the light radiated by the heating member 342. For example, the reflector 360 may be formed of a material including gold, silver, copper, and / or aluminum. The reflector 360 may be formed of a material obtained by coating gold, silver, copper, and / or aluminum onto quartz. The reflector 360 may be formed of a material obtained by coating gold, silver, copper, and / or aluminum onto quartz via a physical vapor deposition (PVD) process.

[0093] A cooling plate 370 may be disposed below a reflector 360. A cooling passage 372 through which cooling fluid flows may be formed in the cooling plate 370. A cooling fluid supply member 390 may supply cooling fluid to the cooling passage 372. The cooling fluid supply member 390 may include a cooling fluid supply line 391, a cooling fluid supply source 392, and a cooling fluid discharge line 393. The cooling fluid supply line 391 may receive cooling fluid from the cooling fluid supply source 392 and supply cooling fluid to the cooling passage 372. The cooling plate 370 may be formed of a material with excellent thermal conductivity. For example, the cooling plate 370 may be formed of a material including aluminum.

[0094] Furthermore, when viewed from above, the cooling plate 370 may have a smaller diameter than the reflector 360. Additionally, the cooling plate 370 may contact the reflector 360. Furthermore, a portion of the upper surface of the cooling plate 370 may contact the reflector 360, while another portion of the upper surface of the cooling plate 370 may be spaced apart from the reflector 360. For example, as... Figure 7As illustrated, a central hole 373, a contact portion 374, and a spacer portion 375 can be formed in the cooling plate 370. The contact portion 374 on the upper surface of the cooling plate 370 can contact the lower surface of the reflector 360. The spacer portion 375 on the upper surface of the cooling plate 370 can be spaced apart from the lower surface of the reflector 360 to define the gap space through which the inert gas "G," which will be described below, is introduced. That is, the contact portion 374 can be higher than the spacer portion 375. The spacer portion 375 can be lower than the contact portion 374. Furthermore, when viewed from the top, the ratio of the contact portion 374 to the spacer portion 375 per unit area in the peripheral region of the cooling plate 370 can be greater than in the central region of the cooling plate 370. That is, the peripheral region of the cooling plate 370 can contact the reflector 360 more, while the central region of the cooling plate 370 can contact the reflector 360 less. This is because the quartz window 314 has side surfaces, which allows more heat energy generated by the heating element 342 to be contained in the peripheral area of ​​the quartz window 314. Therefore, since the temperature in the peripheral area of ​​the reflector 360 can be higher than the temperature in the central area of ​​the reflector 360, the cooling plate 370 has a structure that allows it to have more contact with the reflector in the peripheral area.

[0095] Furthermore, the contact portion 374 may include a first contact portion 374a and a second contact portion 374b. The first contact portion 374a may be formed to extend from the central hole 373 to the peripheral region of the cooling plate 370, while the second contact portion 374b may be formed in the peripheral region of the cooling plate 370. Additionally, a plurality of second contact portions 374b may be provided. The second contact portions 374b may be formed to be spaced apart from each other. The regions between adjacent second contact portions 374b and between the second contact portions 374b and the first contact portion 374a may serve as discharge openings through which the inert gas, as described below, is discharged.

[0096] Refer again Figure 4 and Figure 5The gas supply component 380 can supply gas "G" to the internal space 317 defined by the chuck table 312 and the quartz window 314. The gas "G" supplied by the gas supply component 380 to the internal space 317 can be a cooling gas. The gas supply component 380 may include a first gas supply line 381, a first gas supply source 382, ​​a second gas supply line 383, and a second gas supply source 384. The gas "G" supplied by the gas supply component 380 to the internal space 317 can be an inert gas. For example, gas "G" can be an inert gas including nitrogen, argon, and the like. However, the inventive concept is not limited thereto, and gas "G" can be modified to various known inert gases. The first gas supply line 381 can receive gas "G" from the first gas supply source 382 and can supply gas "G" to the space between the cooling plate 370 and the reflector 360. The second gas supply line 383 can receive gas "G" from the second gas supply source 384 and can supply gas "G" to the lower region of the cooling plate 370.

[0097] Figure 8 It shows Figure 4 A view of the heating substrate of the support unit. (Reference) Figure 8 The heat energy "H" generated by the heating element 342 can be directly delivered to the substrate "W" or reflected by the reflector 360 to be directly delivered to the substrate "W". The heat energy "H" generated by the heating element 342 can then increase the temperature of the reflector 360. When the temperature of the reflector 360 increases, the heat from the reflector 360 can be delivered to the rotary drive component 320. When the temperature of the rotary drive component 320 increases, the rotary drive component 320, including the hollow motor, may not drive correctly or the hollow motor may malfunction. Therefore, it is important to minimize the heat from the reflector 360 heated by the heating element 342 delivered to the rotary drive component 320. According to one embodiment of the present invention, cooling water can flow in the cooling passage 372 of the cooling plate 370. Furthermore, the cooling plate 370 can contact the reflector 360. That is, the cooling plate 370 can prevent the temperature of the reflector 360 from increasing excessively in the water-cooling scheme.

[0098] Depending on the timing, the cooling water flowing in the cooling passage 372 of the cooling plate 370 can be boiled by the heat of the reflector 360. Therefore, the cooling plate 370 according to an embodiment of the present invention may include a contact portion 374 and a spacer portion 375. That is, the entire upper surface of the cooling plate 370 does not contact the lower surface of the reflector 360, but a partial area of ​​the upper surface of the cooling plate 370 contacts the reflector 360. Furthermore, the inert gas "G" supplied by the gas supply member 380 can flow in the space between another area of ​​the upper surface of the cooling plate 370 that does not contact the reflector 360 and the lower surface of the reflector 360. The inert gas "G" supplied by the gas supply member 380 can block a portion of the heat from the reflector 360 heated by the heating member 342 from being delivered to the cooling plate 370. Additionally, a portion of the heat from the reflector 360 can be delivered to the gas "G" and can be discharged to the outside via the discharge hole 314a. In other words, according to one embodiment of the present invention, a local area of ​​the upper surface of the cooling plate 370 can contact the reflector 360, and inert gas "G" can be supplied to the space defined by the cooling plate 370 and the reflector 360 when they are separated from each other, thereby maximally suppressing the boiling of the cooling water flowing in the cooling passage 372. In other words, according to one embodiment of the present invention, the reflector 360 can be effectively cooled in a water cooling scheme that has a higher cooling efficiency than an air cooling scheme (because the specific heat of the cooling water used in the water cooling scheme is higher than that of the cooling gas used in the air cooling scheme compared to the air cooling scheme), or the heat of the reflector 360 can be prevented from being delivered to the rotary drive member 320, and the boiling of the cooling water that may occur when using the water cooling scheme can be maximally suppressed by the air cooling scheme that supplies inert gas "G". In other words, since the delivery of heat to the rotary drive member 320 can be maximally suppressed, the process of processing the substrate "W" can be stably executed for a longer period of time. Furthermore, the cooling effect of the reflector 360 can be selectively controlled by configuring a selected cooling plate among multiple cooling plates 370 having different contact areas with the reflector 360 in the internal space 317. This is because the thermal conductivity varies depending on the contact area between the cooling plate 370 and the reflector 360.

[0099] Furthermore, as described above, the blocking protrusion 312a formed in the chuck stage 312 prevents the processing fluid supplied by the fluid supply unit 400 from being introduced into the internal space 317 of the chuck 310. Additionally, the inert gas "G" supplied by the gas supply member 380 can flow from the internal space 317 of the chuck 310 through the discharge hole 314a in the direction facing the external space of the chuck 310. Furthermore, regarding the inert gas "G" supplied by the gas supply member 380, the pressure in the internal space 317 of the chuck 310 can be a relatively positive pressure compared to the pressure in the external space of the chuck 310. Therefore, even when the substrate "W" rotates at a relatively low speed, the introduction of the processing fluid supplied by the fluid supply unit 400 into the internal space of the chuck 310 can be suppressed to the greatest extent possible.

[0100] Furthermore, as described above, due to abnormal operation of the heating element 342 or a malfunction of the components operating the heating element 342, or similar reasons, the heating element 342 may generate more heat than needed. In this case, the heat generated by the heating element 342 may excessively increase the temperature of the internal space 317. When the temperature of the internal space 317 increases excessively, the risk of the support unit 300 exploding may increase. Furthermore, when the temperature of the internal space 317 increases excessively, heat may be delivered to the rotary drive component 320. The heat may cause the rotary drive component 320 to malfunction. Therefore, the present invention includes an interlock module 700 that cuts off power to the heating element 342 when a default condition is met. For example, the default condition may refer to a situation where the temperature of the internal space 317 becomes higher than a default temperature. However, the present invention is not limited to this, and various modifications can be made to the default condition as needed.

[0101] The interlock module 700 according to an embodiment of the present invention will be described in detail below. Figure 9 yes Figure 2 A magnified view of area "B". Figure 10 From Figure 9 A cross-sectional view of the support unit observed in the direction C-C'.

[0102] refer to Figure 9 and Figure 10 An opening 361 may be formed in a reflector 360. When viewed from above, the opening 361 formed in the reflector 360 may extend radially from the central region of the reflector 360. The opening 361 may extend from the upper surface to the lower surface of the reflector 360. That is, the opening 361 may pass through the reflector 360.

[0103] Terminal member 348 can be inserted into opening 361 formed in reflector plate 360. When viewed from above, terminal member 348 can substantially have a general stapler shape. When viewed from above, the opening portion of stapler-shaped terminal member 348 can face fluid jet member 332. Furthermore, one end and the opposite end of hook-shaped heating member 342 can be coupled to terminal member 348. Terminal member 348 can function as a medium for delivering power applied by power source 346 through power line 344 to heating member 342. That is, power line 344 can be connected to terminal member 348. Furthermore, at least a portion of power line 344 can be disposed in the internal space of nozzle body 334. Furthermore, since terminal member 348 is inserted into opening 361 formed in reflector plate 360, terminal member 348 can be positioned on the upper surface of cooling plate 370 disposed below reflector plate 360. For example, the lower surface of terminal member 348 can be configured to contact the upper surface of cooling plate 370.

[0104] The support member 349 can be inserted into the opening 361 formed in the reflector 360. That is, the support member 349 can be positioned to overlap with the opening 361 when viewed from above. The support member 349 can be coupled to the terminal member 348. The support member 349 can have a shape where the area of ​​its upper surface is larger than the area of ​​its lower surface. The support member 349 can be positioned above the cooling plate 370. The lower surface of the support member 349 can directly contact the cooling plate 370, or can be spaced apart from the cooling plate 370 by a small gap. Furthermore, the upper sides of the terminal member 348 and the support member 349 can be covered by a cover (not shown) to protect the points where the terminal member 348, the power line 344, and the heating member 342 are connected to each other. Furthermore, the terminal member 348 and the support member 349 can be positioned independently of the rotation of the chuck stage 312. Figure 9 and Figure 10 The following example is shown: the terminal member 348 and the support member 349 are constructed separately and these constructions are fastened to each other, but the terminal member 348 and the support member 349 can be arranged as a whole.

[0105] The interlock module 700 may include at least one of a temperature sensor 710, a first cutting-off member 720, and a second cutting-off member 730. For example, the interlock module 700 may include a temperature sensor 710, a first cutting-off member 720, and a second cutting-off member 730.

[0106] The temperature sensor 710 may include a probe 712 and a sensor line 714. The probe 712 may be disposed at one end of the sensor line 714. The probe 712 can measure the temperature of the internal space 317 and can transmit the measured temperature to the controller 3000 via the sensor line 714. The probe 712 may be configured adjacent to a terminal member 348. The probe 712 may be configured among a plurality of heating members 342. For example, the probe 712 may be configured between the second and third heating members 342 in order of proximity to the heating members 342 of the nozzle body 334. At least a portion of the sensor line 714 may be disposed within the internal space of the nozzle body 334. Furthermore, the position of the sensor line 714 may be fixed by the terminal member 348, as will be described below. For example, a plug may be formed in the terminal member 348, as will be described below, a mood bolt may be fixed to the plug, and the sensor line 714 may be inserted into the hole of the bolt.

[0107] Cutting members 720 and 730 can be installed in the support member 349, and the power supplied by the power source 346 to the heating member 342 can be cut off by opening the closed circuit provided by the power source 346 and the heating member 342 according to the temperature change of the internal space 317. Cutting members 720 and 730 can be disposed in the closed circuit provided by the power source 346 and the heating member 342. Furthermore, a signal that allows the controller 3000 to generate a control signal for opening the closed circuit provided by the power source 346 and the heating member 342 according to the temperature change of the internal space 317 can be delivered to the controller 3000. Additionally, cutting members 720 and 730 may include a first cutting member 720 and a second cutting member 730.

[0108] The first cutting-off member 720 may include a fuse 722 and a first conductor 724. The first conductor 724 can electrically connect the fuse 722 to the heating member 342 and the power supply 346. The second cutting-off member 730 may include a bimetallic strip 732 and a second conductor 734. The second conductor 734 can electrically connect the bimetallic strip 732 to the heating member 342 and the power supply 346. The fuse 722 and the bimetallic strip 732 may be positioned to overlap with the opening 361 when viewed from the top. For example, the fuse 722 and the bimetallic strip 732 may be mounted in a support member 349 inserted into the opening 361. For example, the fuse 722 and the bimetallic strip 732 may be mounted on the upper surface of the support member 349 inserted into the opening 361. The fuse 722 and the bimetallic strip 732 may have a structure that can cut off power according to temperature changes.

[0109] The first cutting member 720 and the second cutting member 730 may have an electrical cutting structure that cuts off the power supplied from the power line 344 to the heating member 342 when the temperature of the internal space 317 increases. The first cutting member 720, having a fuse 722, has an electrical cutting structure in which the fuse wire of the fuse 722 breaks to cut off the power when the temperature of the internal space 317 increases. That is, since the fuse wire of the fuse 722 breaks, the closed circuit between the power source 346 and the heating member 342 is opened, the power supplied from the power source 346 to the heating member 342 can be cut off. Furthermore, the second cutting member 730, having a bimetal 732, has an electrical cutting structure in which the bimetallic plates with different coefficients of thermal expansion deform thermally to cut off the power when the temperature of the internal space 317 increases. That is, since the bimetallic 732 deforms thermally, the closed circuit between the power source 346 and the heating member 342 is opened, the power supplied from the power source 346 to the heating member 342 can be cut off.

[0110] Simultaneously, even if the heating element 342 does not malfunction, the internal space may become extremely hot (e.g., approximately 600°C or higher), and when the first cutting element 720 and the second cutting element 730 are configured as is in the internal space 317, the fuse wire may break or the metal plate may deform due to heat, even if the heating element 342 does not malfunction. For example, the interlock sensing condition (i.e., temperature condition) for the fuse wire of the fuse 722 to break may be approximately 160°C (an example of a first temperature). For example, the interlock sensing condition (i.e., temperature condition) for the bimetallic thermal deformation of the bimetallic 732 may be approximately 180°C (an example of a second temperature). When the fuse 722 and the bimetallic 732 are configured as is in the internal space 317, the first cutting element 720 and the second cutting element 730 interlock even if the heating element 342 does not malfunction.

[0111] Therefore, the first cutting member 720 and the second cutting member 730, according to an embodiment of the present invention, can be configured to overlap with the opening 361 formed in the reflector 360. Thus, a portion of the cooling plate 370 is exposed toward the terminal member 348 and the support member 349. For example, as described above, the first cutting member 720 and the second cutting member 730 are mounted in the support member 349. Therefore, the problem of melt line breakage or thermal deformation of the metal plate when the heating member 342 is not operating abnormally can be solved by the cooling air of the cooling plate 370.

[0112] Figure 11 This is a block diagram schematically illustrating an example of the electrical connection between the heating module and the interlocking module of the present invention. (Reference) Figure 11As described above, heating element 342 generates heat from heating substrate "W". Heating element 342 can be operated by power applied by power source 346. Power source 346 can apply power to heating element 342. Power applied by power source 346 can be delivered to heating element 342 from power line 344. Whether power is applied to power source 346 can be controlled by switch 347 provided between power source 346 and heating element 342.

[0113] Furthermore, the first cutting member 720 and the second cutting member 730 can be electrically connected in series with each other. Additionally, the temperature of the internal space 317 measured by the temperature sensor 710 can be transmitted to the controller 3000. When the temperature of the internal space 317 received from the temperature sensor 710 is higher than a pre-stored default temperature, the controller 3000 can generate a control signal to cut off the power supplied from the power line 344 to the heating member 342. For example, as... Figure 12 As illustrated, controller 3000 can generate a control signal for turning on switch 347.

[0114] Furthermore, the fuse 722 of the first cutting member 720 may be configured to disconnect the fuse wire when the temperature of the internal space 317 is higher than a default temperature. For example, when the temperature of the internal space 317 is higher than a pre-stored default temperature, such as... Figure 13 As illustrated, the fuse 722 can be disconnected. Therefore, the power supplied by the power source 346 to the heating element 342 can be cut off.

[0115] Similarly, the bimetal 732 of the second cutting member 730 may have a specification that causes the metal plate of the bimetal 732 to deform when the temperature of the internal space 317 is higher than the default temperature. For example, when the temperature of the internal space 317 is higher than the default temperature, such as Figure 14 As illustrated, the metal plate of the second cutting member 730 can be thermally deformed. Therefore, the power applied by the power source 346 can be cut off.

[0116] Furthermore, when viewed from above, the area in the reflector 360 without the opening 361 is the first region, and the area in the interior space 317 with the opening 361 is the second region, as described above, the temperature of the first region of the interior space 317 can be higher than the temperature of the second region of the interior space 317. However, since the first region and the second region are interconnected, their temperatures can be proportional.

[0117] Furthermore, when the fuse 722 and bimetal 732 are interlocked, the two components cannot be reused. Therefore, in this application, the interlocking of the temperature sensor 710 can be performed at a temperature lower than the interlocking conditions of the first cutting member 720 and the second cutting member 730. For example, the case where the fuse wire of the fuse 722 located in the second region breaks at about 160°C, as described above, could be a case where the temperature of the first region is about 660°C. Furthermore, the case where the bimetal 732 located in the second region undergoes thermal deformation could be a case where the temperature of the first region is about 680°C. As described above, when the fuse 722 and bimetal 732 are interlocked, the two components cannot be reused. Therefore, when the temperature measured by the temperature sensor 710, which measures the temperature of the first region, reaches about 640°C, the controller 3000 can generate a control signal for cutting off the power to be delivered from the power source 346 to the heating member 342.

[0118] As described above, the interlock module 700 of this invention has a triple power cut-off structure. First, the temperature sensor 710 of the interlock module 700 measures the temperature of the internal space 317 and transmits the measured temperature data to the controller 3000, which then generates a control signal based on this data to prevent power applied by the power source 346 from being applied to the heating member 342. Second, the first cut-off member 720 of the interlock module 700 has a power cut-off structure, wherein power applied by the power source 346 is delivered to the heating member 342 when the temperature of the internal space 317 is higher than a default temperature. Third, the second cut-off member 730 of the interlock module 700 has a power cut-off structure, wherein power applied by the power source 346 is delivered to the heating member 342 when the temperature of the internal space 317 is higher than a default temperature.

[0119] Furthermore, the first cutting member 720 and the second cutting member 730 can be electrically connected in series with each other, and they have different power cutting structures. Therefore, when the temperature of the internal space 317 becomes higher than the default temperature and any of these cutting members cuts off the power, the power applied by the power source 346 is not delivered to the heating member 342. That is, despite various environmental factors, the present invention effectively detects excessive rise in the temperature of the internal space 317 and stops the operation of the heating member 342 when the temperature of the internal space 317 rises excessively, thereby effectively mitigating the risk of explosion of the support unit 300 and the risk of failure of the rotary drive component 320.

[0120] The application of the interlock module 700 to the support unit 300 has been described as an example, but the inventive concept is not limited thereto. For example, the interlock module 700 described above can be applied in the same or similar manner to various devices having materials that generate heat.

[0121] The interlock module 700 has been described as an example of its application in a substrate processing apparatus 10 for performing fluid processing, but the inventive concept is not limited thereto. For example, the interlock module 700 described above can be applied in the same or similar manner to a substrate processing apparatus for drying a substrate "W", a substrate processing apparatus for processing a substrate using plasma, a substrate processing apparatus for forming a coating film on a substrate, and the like.

[0122] Although the controller 3000 controlling the support unit 300, the fluid supply unit 400, and the like have been described by way of example, the inventive concept is not limited thereto. For example, the support unit 300 may include a controller that controls the configuration of the support unit 300, and when the temperature of the internal space 317 becomes higher than the default temperature, the controller of the support unit 300 may perform an interlock to cut off the power delivered to the heating member 342 in the same or similar manner as the controller 3000 described above.

[0123] According to the embodiments of the present invention, abnormal operation of the heating element of the heating substrate or failure of the components operating the heating element can be detected.

[0124] Furthermore, according to the embodiments conceived in this invention, an excessive increase in temperature of the space in which the heating element is disposed can be detected.

[0125] Furthermore, according to embodiments conceived in this invention, the risk of explosion caused by heat generated by the heating element and / or the risk of failure of the rotary drive component are mitigated.

[0126] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand the effects not mentioned based on this specification and the accompanying drawings.

[0127] The above detailed description illustrates the inventive concept by example. Furthermore, the foregoing descriptions depict exemplary embodiments of the inventive concept, which can be used in various other combinations, variations, and environments. That is, modifications and corrections can be made to the inventive concept without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the skill or knowledge of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept, and various desired changes can be made to the detailed application areas and purposes of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiments. Furthermore, the appended claims must be interpreted to include other embodiments.

Claims

1. A support unit for supporting a substrate, the support unit comprising: A chuck table, which is rotatable; A heating element, which is disposed above the chuck stage and configured to heat the substrate supported by the support unit; A reflector, the reflector being disposed below the heating element; A cooling plate, wherein the cooling plate is disposed below the reflector; A support member configured to overlap with an opening formed in the reflector and positioned above the cooling plate when viewed from above; A power source configured to apply power to the heating element; A window is disposed above the chuck table and defines an internal space, in which the heating element is disposed; as well as An interlock module configured to selectively cut off the power applied to the heating element; The interlock module includes: A cutting-off member, configured to cut off the power supplied from the power source to the heating member by opening a closed circuit provided by the power source and the heating member, based on changes in the temperature of the internal space; and The cutting component is installed in the supporting component.

2. The support unit according to claim 1, wherein the support unit further comprises: Controller in, The interlock module includes: A temperature sensor, configured to measure the temperature of the interior space and transmit the measured temperature of the interior space to the controller, and When the temperature of the internal space, as measured by the temperature sensor, is higher than the default temperature, the controller generates a control signal to cut off the power applied to the heating element.

3. The support unit according to claim 1, wherein, The cutting component includes: First cutting component; and A second cutting member is connected in series with the first cutting member and has a power cutting structure different from that of the first cutting member.

4. The support unit according to claim 3, wherein, The first cutting component includes a fuse, and The second cutting member comprises a bimetallic component.

5. The support unit according to any one of claims 1 to 4, wherein the support unit further comprises: A plate, the plate being disposed below the heating element; and A terminal component, inserted into an opening formed in the plate and connected to a power line that delivers power to the heating component. in, The heating element has a hook shape, and one end and the opposite end of the heating element are connected to the terminal element.

6. The support unit according to claim 5, wherein the support unit further comprises: A rotary drive component, coupled to the chuck stage to rotate the chuck stage, and having a hollow portion; and The main body is inserted into the hollow portion of the rotary drive component. in, The plate is coupled to the body to be independent of the rotation of the chuck stage.

7. The support unit according to claim 6, wherein, A plurality of the heating elements are provided, and the plurality of the heating elements are configured to surround the body when viewed from above.

8. A substrate processing apparatus, the substrate processing apparatus comprising: A chamber having an internal space; A support unit configured to support a substrate in the internal space and to rotate the substrate. A fluid supply unit, supported by the support unit and configured to supply processing fluid to the substrate; A bowl-shaped component having a processing space for processing the substrate supported by the support unit; as well as Controller The support unit includes: A chuck stage, the chuck stage being coupled to a rotary drive component having a hollow portion; The nozzle body is inserted into the hollow portion of the rotary drive component; A heating element, which is disposed above the chuck stage and configured to heat the substrate supported by the support unit; A reflector, the reflector being coupled to the nozzle body and disposed below the heating element; A cooling plate, wherein the cooling plate is disposed below the reflector; A support member, which is inserted into an opening formed in the reflector and positioned above the cooling plate; A power source configured to apply power to the heating element; A window, disposed above the chuck platform and defining an internal space, wherein the heating element is disposed within the internal space of the window; and An interlock module configured to cut off power delivery to the heating element when the temperature of the interior space of the window is higher than a default temperature. The interlock module includes: A temperature sensor configured to measure the temperature of the interior space of the window and deliver the measured temperature of the interior space of the window to the controller; and A cutting-off member, configured to cut off the power supplied from the power source to the heating member by opening a closed circuit provided by the power source and the heating member, based on changes in the temperature of the internal space; and The cutting component is installed in the supporting component.

9. The substrate processing apparatus according to claim 8, wherein, When the temperature of the interior space of the window, as delivered from the temperature sensor, is higher than the default temperature, the controller generates a control signal to cut off the power applied to the heating element.

10. The substrate processing apparatus according to claim 8, wherein, The cutting component includes: First cutting component; and The second cutting member has a power cutting structure that is different from that of the first cutting member.

11. The substrate processing apparatus according to claim 10, wherein, The first cutting component includes a fuse, and The second cutting member comprises a bimetallic component.

12. The substrate processing apparatus according to any one of claims 8, 10, and 11, wherein the substrate processing apparatus further comprises: A terminal component, inserted into the opening and connected to a power line, which delivers power to the heating component. in, The heating element has a hook shape, and one end and the opposite end of the heating element are connected to the terminal element.

13. The substrate processing apparatus according to any one of claims 8, 10, and 11, wherein, Multiple heating elements are provided, and the multiple heating elements are configured to surround the nozzle body when viewed from above.

14. The substrate processing apparatus according to claim 13, wherein, The heating element is fixedly mounted above the reflector plate to be independent of the rotation of the chuck stage.

15. A support unit for supporting a substrate, the support unit comprising: A chuck stage, the chuck stage being coupled to a rotary drive component having a hollow portion; A rear nozzle assembly configured to supply processing fluid to the rear surface of the substrate supported by the support unit; Multiple IR lamps are disposed above the chuck stage and configured to heat the substrate supported by the support unit; A power source configured to apply power to the IR lamp; A window is disposed above the chuck table to define an interior space in which the IR lamp is disposed and has at least one discharge hole on a side surface of the interior space. A reflector, wherein the reflector is disposed below the IR lamp; A cooling plate having a cooling passage through which cooling fluid flows, the cooling plate being disposed below the reflector, and a portion of the upper surface of the cooling plate contacting the lower surface of the reflector; A support member, which is inserted into an opening formed in the reflector and positioned on the cooling plate. A gas supply line configured to supply inert gas to the space between the reflector and the cooling plate; as well as An interlock module configured to cut off the power applied to the IR lamp when a preset condition is met; The interlock module includes: A cutting-off member, mounted in the support member, and configured to cut off the power supplied from the power source to the IR lamp by opening a closed circuit provided by the power source and the IR lamp, based on changes in the temperature of the internal space; and A temperature sensor configured to measure the temperature of the interior space and transmit the measured temperature of the interior space to a controller that controls the support unit.

16. The support unit according to claim 15, wherein, The rear nozzle component includes: A nozzle body, the nozzle body being inserted into the hollow portion; and A fluid injection component is disposed above the nozzle body. The reflector and the cooling plate are coupled to the rear nozzle component to be independent of the rotation of the chuck stage. The window has multiple discharge holes, which are spaced apart from each other in the circumferential direction when viewed from the top.

17. The support unit according to claim 15 or 16, wherein, The cutting component includes: A first cutting member, the first cutting member having a fuse; and The second cutting member has a bimetallic structure, and When the temperature of the internal space, as measured by the temperature sensor, is higher than a default temperature, the controller generates a control signal to cut off the power supplied to the IR lamp.

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