Magnetic assembly and power conversion module

Abstract

The present disclosure relates to a power conversion module, comprising a circuit board, an adapter board, a first component and a second component. The circuit board has a first surface and a second surface arranged oppositely. The second surface of the circuit board has a recessed area. The circuit board comprises a first sidewall, a second sidewall, a third sidewall and a fourth sidewall. The adapter board has a first surface and a second surface arranged oppositely. The first surface of the adapter board is attached to the second surface of the circuit board. The first surface of the adapter board comprises a component setting area. The setting position of the component setting area corresponds to the setting position of the recessed area. The first component is fixedly arranged in the recessed area. The height of the first component is less than or equal to the depth of the corresponding recessed area. The second component is fixedly arranged on the component setting area and accommodated in the corresponding recessed area. The height of the second component is less than or equal to the depth of the corresponding recessed area.

Description

Technical Field

[0001] This disclosure relates to a magnetic component and a power conversion module, and particularly to a magnetic component and a power conversion module that are small in size and thin in thickness. Background Technology

[0002] Please see Figure 1A and Figure 1B ,in Figure 1A This is a schematic diagram of the structure of the first existing electronic device. Figure 1B for Figure 1A The diagram shows the structure of the power conversion module within the electronic device. Figure 1A and Figure 1B As shown, the existing first type of electronic device 1 adopts a horizontal power supply structure and includes a central processing unit (CPU) 11, a power conversion module 12, a system board 13, and an output capacitor 14. The power conversion module 12 is used to convert the received input voltage into a regulated voltage and supply it to the CPU 11, and both the power conversion module 12 and the CPU 11 are disposed on the first surface of the system board 13. The output capacitor 14 is disposed on the second surface of the system board 12 opposite to the first surface and is adjacent to the power supply input terminal of the CPU 11.

[0003] In addition, the power conversion module 12 also includes a printed circuit board 15 and a magnetic component 16. The magnetic component 16 is disposed on the printed circuit board 15, and a switching component can be disposed in the gap between the printed circuit board 15 and the magnetic component 16. The printed circuit board 15 is disposed on the first surface of the system board 13, thereby allowing the heat generated by the power conversion module 12 to be transferred to the system board 13 through the printed circuit board 15, and then dissipated using the heat dissipation system (not shown) of the system board 13.

[0004] However, as the current required by the central processing unit (CPU) increases, the size requirements of electronic devices become smaller and smaller. Figure 1A The arrangement of the central processing unit 11 and the power conversion module 12 on the same side results in a long wiring path and high parasitic resistance between them, leading to excessive conduction losses and consequently, low efficiency in power supply from the power conversion module 12 to the central processing unit 11. Please refer to... Figure 2This is a schematic diagram of the structure of the second type of electronic device. As shown in the figure, in order to reduce the size of the electronic device and improve the efficiency of the power conversion module in supplying power to the central processing unit, the second type of electronic device 1' changes the traditional horizontal power supply structure to a vertical power supply structure. That is, the power conversion module 12 is changed to be set on the second surface of the system board 13, so that the power conversion module 12 and the central processing unit 11 are located on opposite surfaces of the system board 13. In this way, the size of the electronic device 1' can be effectively reduced, and the line path between the central processing unit 11 and the power conversion module 12 is shorter and the parasitic resistance on the line is smaller, thereby reducing conduction losses and further improving the power supply efficiency of the power conversion module 12.

[0005] Although the power conversion module 12 of the aforementioned second type of electronic device 1' can improve power supply efficiency, the placement of the power conversion module 12 in this electronic device 1' is cramped. Figure 1A and Figure 1B The limited space for the output capacitor 14 significantly reduces the number of output capacitors that can be installed in the electronic device 1'. As a result, when the load on the central processing unit 11 undergoes large dynamic changes, the output voltage fluctuation range of the power conversion module 12 increases, causing the central processing unit 11 to malfunction. Furthermore, the power conversion module 12 uses switching components (not shown) to generate switching signals to control the magnetic component 16 within the power conversion module 12. However, each switching component in the existing power conversion module 12 generates a set of switching signals with the same phase difference to control the magnetic component 16 within the power conversion module 12, resulting in an excessively large AC component in the power conversion module 12. The existing power conversion module 12 requires a large number of output capacitors 14 to achieve the expected input and output voltages, increasing both the cost and size of the power conversion module 12.

[0006] Therefore, it is necessary to develop a magnetic component and power conversion module to solve the problems faced by existing technologies. Summary of the Invention

[0007] The purpose of this disclosure is to provide a magnetic component and a power conversion module that offer the advantage of lower cost.

[0008] To achieve the above objectives, one embodiment of this disclosure provides a magnetic component comprising M center posts, 2N side posts, 2N first windings, and a second winding. The 2N side posts are wound around the M center posts. Each first winding is wound around a corresponding side post among the 2N side posts, and each first winding has at least one turn on its corresponding side post, where M and N are both integers greater than 1. The second windings are wound around the M center posts, forming a loop, wherein the second winding has at least one turn on each center post.

[0009] To achieve the above objectives, another embodiment of this disclosure provides a power conversion module, comprising a circuit board, an adapter board, at least one first element, and at least one second element. The circuit board has a first surface and a second surface disposed opposite to each other. The second surface of the circuit board has at least one recessed area. The circuit board further includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall. The first sidewall, second sidewall, third sidewall, and fourth sidewall are all located between the first surface and the second surface of the circuit board. The first sidewall and the second sidewall are disposed opposite to each other, and the third sidewall and the fourth sidewall are disposed opposite to each other and located between the first sidewall and the second sidewall. The adapter board has a first surface and a second surface disposed opposite to each other. The first surface of the adapter board is attached to the second surface of the circuit board, and the first surface of the adapter board includes a conductive element placement area. The placement position of the at least one element placement area corresponds to the placement position of the at least one recessed area. The at least one first element is fixed within the at least one recessed area, wherein the height of the at least one first element is less than or equal to the depth of the corresponding at least one recessed area. At least one second element is fixed on at least one element placement area and accommodated in a corresponding at least one recessed area, and the height of the at least one second element is less than or equal to the depth of the corresponding at least one recessed area. Attached Figure Description

[0010] Figure 1A This is a schematic diagram of the structure of the first existing electronic device.

[0011] Figure 1B for Figure 1A A schematic diagram of the power conversion module inside the electronic device shown.

[0012] Figure 2 This is a schematic diagram of the structure of the second type of electronic device.

[0013] Figure 3A This is a schematic diagram of the power conversion module according to the first embodiment of this disclosure.

[0014] Figure 3B for Figure 3A The diagram shows the exploded structure of the power conversion module.

[0015] Figure 4A for Figure 3A The diagram shows a structural schematic of the power conversion module from another perspective.

[0016] Figure 4B for Figure 4A The diagram shows the exploded structure of the power conversion module.

[0017] Figure 5 for Figure 3A The equivalent circuit diagram of the power conversion module is shown.

[0018] Figure 6 for Figure 5The diagram shows the signal waveform of the PWM switching signal generated by the control circuit of the power conversion module.

[0019] Figure 7 for Figure 3A The diagram shows the structure of the magnetic component of the power conversion module.

[0020] Figure 8A for Figure 3A The diagram shows a cross-sectional view of the central column and side columns of the magnetic components of the power conversion module.

[0021] Figure 8B for Figure 3A A cross-sectional schematic diagram of another embodiment of the central column and side columns of the magnetic components of the power conversion module shown.

[0022] Figure 9 for Figure 4B The diagram shows the side view of the power conversion module's circuit board and input capacitor.

[0023] Figure 10 for Figure 7 The diagram shows the voltage waveform of the second winding wound around the central column.

[0024] Figure 11 This is a schematic diagram of the power conversion module according to the second embodiment of this disclosure.

[0025] Figure 12 This is a schematic diagram of the magnetic component of the power conversion module according to the third embodiment of this disclosure.

[0026] Figure 13 This is a schematic diagram of the magnetic component of the power conversion module according to the fourth embodiment of this disclosure.

[0027] Figure 14 This is a schematic diagram of the magnetic component of the power conversion module according to the fifth embodiment of this disclosure.

[0028] Figure 15 for Figure 5 The diagram shows the circuit connection between the electromagnetic integrated circuit and the control component of the power conversion module.

[0029] Figure 16A This is a schematic diagram of the power conversion module according to the sixth embodiment of this disclosure.

[0030] Figure 16B for Figure 16A The diagram shows the exploded structure of the power conversion module.

[0031] Figure 17A for Figure 16A The diagram shows a structural schematic of the power conversion module from another perspective.

[0032] Figure 17B for Figure 17A The diagram shows the exploded structure of the power conversion module.

[0033] Figure 18 This is a side view of the power conversion module according to the seventh embodiment of this disclosure.

[0034] Figure 19 This is a side view of the power conversion module according to the eighth embodiment of this disclosure.

[0035] Figure 20 and Figure 21 This is a side view of the power conversion module according to the ninth embodiment of this disclosure.

[0036] Figure 22 This is an exploded structural diagram of the power conversion module according to the tenth embodiment of this disclosure.

[0037] Figure 23 for Figure 22 The diagram shows an exploded view of the power conversion module from another perspective.

[0038] Figure 24 for Figure 22 The diagram shows a partial side view of the power conversion module.

[0039] Figure 25 for Figure 22 The diagram shows the structure of the magnetic component of the power conversion module.

[0040] Figure 26A This is a schematic diagram of the magnetic component of the power conversion module according to the eleventh embodiment of this disclosure.

[0041] Figure 26B This is a schematic diagram of the magnetic component of the power conversion module according to the twelfth embodiment of this disclosure.

[0042] Figure 27 for Figure 22 The diagram shown illustrates the structure of the power conversion module, which includes the first epoxy resin.

[0043] Figure 28 for Figure 22 The diagram shows a simplified configuration of the multiple adapter conductors of the power conversion module.

[0044] Figure 29A This is a schematic diagram of the power conversion module according to the thirteenth embodiment of this disclosure.

[0045] Figure 29B for Figure 29A The diagram shows the exploded structure of the power conversion module.

[0046] Figure 30A for Figure 29A The diagram shows a structural schematic of the power conversion module from another perspective.

[0047] Figure 30B for Figure 30A The diagram shows the exploded structure of the power conversion module.

[0048] Figure 31 for Figure 29A The diagram shows the production process of the power conversion module.

[0049] Figure 32 for Figure 29A The diagram shows the side structure of the power conversion module's circuit board and adapter board before soldering.

[0050] Figure 33A This is an exploded structural diagram of the power conversion module according to the fourteenth embodiment of this disclosure.

[0051] Figure 33B for Figure 33A The diagram shows an exploded view of the power conversion module from another perspective.

[0052] Figure 34 for Figure 33A The diagram shows the structure of the magnetic component of the power conversion module.

[0053] Figure 35 for Figure 22 A simplified configuration diagram showing the placement of multiple adapter conductors of another embodiment of the power conversion module.

[0054] Figure 36A This is a schematic diagram of the power conversion module according to the fifteenth embodiment of this disclosure.

[0055] Figure 36B for Figure 36A The diagram shows the exploded structure of the power conversion module.

[0056] Figure 37A for Figure 36A The diagram shows a structural schematic of the power conversion module from another perspective.

[0057] Figure 37B for Figure 37A The diagram shows the exploded structure of the power conversion module.

[0058] Figure 38A This is a schematic diagram of the power conversion module according to the sixteenth embodiment of this disclosure.

[0059] Figure 38B for Figure 38A The diagram shows the exploded structure of the power conversion module.

[0060] Figure 39A for Figure 38A The diagram shows a structural schematic of the power conversion module from another perspective.

[0061] Figure 39B for Figure 39A The diagram shows the exploded structure of the power conversion module.

[0062] Figure 40A This is a schematic diagram of the power conversion module according to the seventeenth embodiment of this disclosure.

[0063] Figure 40B for Figure 40A The diagram shows the exploded structure of the power conversion module.

[0064] Figure 41A for Figure 40A The diagram shows a structural schematic of the power conversion module from another perspective.

[0065] Figure 41B for Figure 41A The diagram shows the exploded structure of the power conversion module.

[0066] Symbol Explanation

[0067] 1: The first existing electronic device

[0068] 11: Central Processing Unit

[0069] 12: Power conversion module

[0070] 13: System Board

[0071] 14: Output capacitor

[0072] 15: Printed Circuit Board

[0073] 16: Magnetic components

[0074] 1': There is a second type of electronic device.

[0075] 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, 2j, 2k: Power conversion modules

[0076] 3a: First electromagnetic integrated circuit

[0077] 3b: Second electromagnetic integrated circuit

[0078] 31: First power conversion circuit

[0079] 32: Second power conversion circuit

[0080] 311: Switch Integration

[0081] L: Inductance

[0082] 312, 322: Drive circuit

[0083] Cin: Input capacitance

[0084] Cout: Output capacitor

[0085] Vin+: Positive input terminal

[0086] Vin-: Negative input terminal

[0087] Vo+: Positive output terminal

[0088] Vo-: Negative output terminal

[0089] K: Control Component

[0090] PWM1: First PWM switching signal

[0091] PWM2: Second PWM switching signal

[0092] PWM3: Third PWM switching signal

[0093] PWM4: Fourth PWM switching signal

[0094] PWM5: Fifth PWM switching signal

[0095] PWM6: Sixth PWM switching signal

[0096] PWM7: Seventh PWM switching signal

[0097] PWM8: Eighth PWM switching signal

[0098] fsw: Switching frequency

[0099] D: Duty Cycle

[0100] 20: Circuit board

[0101] 20a: First page

[0102] 201a: Fourth Depression Region

[0103] 202a: Fifth Depression Region

[0104] 20b: Second page

[0105] 201b: Third Depression Area

[0106] 20c: First depression area

[0107] 20d: Second depression area

[0108] 20e: Circuit board substrate

[0109] 20f: Circuit board surface

[0110] 40, 40a, 40b, 40c, 40d, 40e, 40f, 40g: Magnetic components

[0111] 411: Side Post

[0112] 411a: Second air gap

[0113] 412: Central Pillar

[0114] 412a: First air gap

[0115] 43: First winding

[0116] 45: Second winding

[0117] 45a: External inductor

[0118] 451a: External inductor magnetic cover

[0119] 452a: External inductor side post

[0120] 453a: External inductor center post

[0121] 454a: Solder foot

[0122] 455a: solder pad

[0123] 41: First magnetic element

[0124] 41a: First side

[0125] 41b: Second side

[0126] 41c: Third side

[0127] 41d: Fourth side

[0128] 42: Second magnetic element

[0129] 42a: First side

[0130] 42b: Second side

[0131] 42c: Third side

[0132] 42d: Fourth side

[0133] 47a: First Channel

[0134] 47b: Second Channel

[0135] 47c: Third Channel

[0136] 50: First switch assembly

[0137] 60: Second switch assembly

[0138] 413: First magnetic cover

[0139] 414: Second magnetic cover

[0140] 41: Third magnetic element

[0141] 41: Fifth magnetic element

[0142] 42: Fourth magnetic element

[0143] 71: Positive Input Terminal Conductor

[0144] 72: Positive output terminal conductor

[0145] 73: Negative output terminal conductor

[0146] 74: Signal Conductor

[0147] 75: Side electroplating section

[0148] V(w1), V(w2), V(w3), V(w4), V(w5): Voltage waveforms

[0149] S1: First control signal

[0150] S2: Second control signal

[0151] 80: Adapter plate, plate structure

[0152] 80a: First page

[0153] 801a: Through hole

[0154] 80b: Second page

[0155] 80c: Milling groove

[0156] 80d: Adapter board substrate

[0157] 80e: Adapter board surface

[0158] Cout: Output capacitor

[0159] 81: Positive Input Pin

[0160] 82: Positive output pin

[0161] 83: Negative output pin

[0162] 84: Signal pin

[0163] 85: Adapter Connector

[0164] 85a: Output adapter conductor

[0165] 85b: Grounding Adapter Conductor

[0166] 85c: Input adapter conductor

[0167] 85d: Signal transfer conductor

[0168] 90: Integrated circuit board

[0169] 91: First Epoxy Adhesive

[0170] 92: Second epoxy resin

[0171] 93: Integrated substrate

[0172] B: System board

[0173] CPU: Central Processing Unit

[0174] S1~S9: Steps

[0175] 22: First Component

[0176] 221: First Component Integration

[0177] 20a: First page

[0178] 20b: Second page

[0179] 203a: Sixth Depression Region

[0180] 204a: Seventh Depression

[0181] 21a: First sidewall

[0182] 21b: Second sidewall

[0183] 21c: Third sidewall

[0184] 21d: Fourth lateral wall

[0185] 23: Second Component

[0186] 231: Second Component Integration

[0187] 802a: Component Setting Area

[0188] 802b: First row

[0189] 802c: Second row

[0190] 802d: Third row

[0191] 802e: Fourth row

[0192] 311: Switch Integration

[0193] 851: First Adapter Connector

[0194] 24: Protrusion

[0195] 852: Second Adapter Connector Detailed Implementation

[0196] Some typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can be varied in different implementations without departing from the scope of this disclosure, and the descriptions and drawings therein are for illustrative purposes only and not for limiting the scope of this disclosure.

[0197] Please see Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 5 , Figure 6 and Figure 7 ,in Figure 3A This is a schematic diagram of the power conversion module according to the first embodiment of the present disclosure. Figure 3B for Figure 3A The diagram shown is an exploded view of the power conversion module. Figure 4A for Figure 3A The diagram shown is a structural schematic of the power conversion module from another perspective. Figure 4B for Figure 4A The diagram shown is an exploded view of the power conversion module. Figure 5 for Figure 3A The equivalent circuit diagram of the power conversion module shown is as follows. Figure 6 for Figure 5 The diagram shows the signal waveform of the PWM switching signal generated by the control circuit of the power conversion module. Figure 7 for Figure 3A The diagram shows a schematic of the magnetic component of the power conversion module. As shown, the power conversion module 2 of this embodiment can be applied in an electronic device and connected to a system board (not shown) within the electronic device via soldering. In terms of circuit structure, the circuit structure constituted by the power conversion module 2 includes multiple electromagnetic integrated circuits. For example, the power conversion module 2 includes three first electromagnetic integrated circuits 3a and two second electromagnetic integrated circuits 3b. However, for the sake of simplicity, [the following is omitted]. Figure 5 Only two first electromagnetic integrated circuits 3a and one second electromagnetic integrated circuit 3b are shown. The three first electromagnetic integrated circuits 3a and the two second electromagnetic integrated circuits 3b are arranged alternately, and the individual input terminals of the three first electromagnetic integrated circuits 3a and the individual input terminals of the two second electromagnetic integrated circuits 3b are connected in parallel to form the total input terminal of the power conversion module 2, which is used to receive electrical energy provided by an external power source (not shown). The individual output terminals of the three first electromagnetic integrated circuits 3a and the individual output terminals of the two second electromagnetic integrated circuits 3b are connected in parallel to form the total output terminal of the power conversion module 2, which is used to output an output voltage.

[0198] To meet the high current demands of the central processing unit within the electronic device and to effectively increase the output current capability of the power conversion module 2, for example... Figure 5 As shown, each first electromagnetic integrated circuit 3a is a four-phase buck converter circuit and includes four first power conversion circuits 31, an input capacitor Cin, an output capacitor Cout, and a drive circuit 312. The individual input terminals of the four first power conversion circuits 31 are connected in parallel, and the output terminals of the four first power conversion circuits 31 are connected in parallel. Each first power conversion circuit 31 includes a switching integrated circuit 311 and an inductor L.

[0199] Each switching integrated circuit 311 of each first power conversion circuit 31 is composed of a half-bridge arm, including an upper switching transistor and a lower switching transistor, and is connected in series to the first terminal of the corresponding inductor L to form a one-phase Buck circuit. The first terminals of the four individual one-phase Buck circuits are connected in parallel and then electrically connected to the input capacitor Cin of the first electromagnetic integrated circuit 3a, forming the input terminal of the first electromagnetic integrated circuit 3a (including the positive input terminal Vin+ and the negative input terminal Vin-). The second terminals of the four individual one-phase Buck circuits (i.e., the second terminal of each inductor L) are connected in parallel and then electrically connected to the output capacitor Cout, forming the output terminal of the first electromagnetic integrated circuit 3a (including the positive output terminal Vo+ and the negative output terminal Vo-, wherein the negative input terminal Vin- and the negative output terminal Vo- are short-circuited). The first terminal of the output capacitor Cout can form the positive output terminal Vo+ of the first electromagnetic integrated circuit 3a, and the second terminal of the output capacitor Cout can form the negative output terminal Vo- of the first electromagnetic integrated circuit 3a. The first terminal of the input capacitor Cin is electrically connected to the positive input terminal Vin+ of the first electromagnetic integrated circuit 3a, and the second terminal of the input capacitor Cin is electrically connected to the negative input terminal Vin- of the first electromagnetic integrated circuit 3a. The driving circuit 312 of the first power conversion circuit 31 is connected to the switch integrated circuit 311 to drive the switch integrated circuit 311. In some embodiments, the driving circuit 312 and the switch integrated circuit 311 of the first power conversion circuit 31 can be jointly integrated on a semiconductor chip, a semiconductor package, a carrier board, or a PCB board.

[0200] Each second electromagnetic integrated circuit 3b is a four-phase buck converter circuit and includes four second power conversion circuits 32, an input capacitor Cin, an output capacitor Co, and a drive circuit 322. The individual input terminals of the second power conversion circuits 32 are connected in parallel, and the output terminals of the four second power conversion circuits 32 are connected in parallel. Each second power conversion circuit 32 includes a switching integrated circuit 311 and an inductor L.

[0201] Each switching integrated circuit 311 of each second power conversion circuit 32 is composed of a half-bridge arm, including an upper switching transistor and a lower switching transistor, and is connected in series to the first terminal of the corresponding inductor L to form a one-phase Buck circuit. The first terminals of the four individual one-phase Buck circuits are connected in parallel and then electrically connected to the input capacitor Cin of the second electromagnetic integrated circuit 3b, forming the input terminal of the second electromagnetic integrated circuit 3b (including the positive input terminal Vin+ and the negative input terminal Vin-). The second terminals of the four individual one-phase Buck circuits (i.e., the second terminal of each inductor L) are connected in parallel and then electrically connected to the output capacitor Cout, forming the output terminal of the second electromagnetic integrated circuit 3b (including the positive output terminal Vo+ and the negative output terminal Vo-, wherein the negative input terminal Vin- and the negative output terminal Vo- are short-circuited). The first terminal of the output capacitor Cout can form the positive output terminal Vo+ of the second electromagnetic integrated circuit 3b, and the second terminal of the output capacitor Cout can form the negative output terminal Vo- of the second electromagnetic integrated circuit 3b. The first terminal of the input capacitor Cin is electrically connected to the positive input terminal Vin+ of the second electromagnetic integrated circuit 3b, and the second terminal of the input capacitor Cin is electrically connected to the negative input terminal Vin- of the second electromagnetic integrated circuit 3b. The drive circuit 322 of the second power conversion circuit 32 is connected to the switch integrated circuit 311 to drive the switch integrated circuit 311. In some embodiments, the drive circuit 322 of the second power conversion circuit 32 and the switch integrated circuit 311 can be integrated on a semiconductor chip, a semiconductor package, a carrier board, or a PCB board.

[0202] Please see Figure 5 and Figure 6 The power conversion module 2 also includes a control component K, which is connected to the drive circuit 312 of the first power conversion circuit 31 and the drive circuit 322 of the second power conversion circuit 32. The control component K generates eight sets of PWM switching signals PWM1, PWM2, PWM3, PWM4, PWM5, PWM6, PWM7, and PWM8 by sampling the output voltage of the power conversion module 2 and the current of each phase Buck circuit. Figure 6As shown, eight sets of PWM switching signals PWM1-PWM8 are sequentially staggered by 45 degrees. The pulse period of each PWM switching signal is denoted as 1 / fsw, the switching frequency of each PWM switching signal is fsw, and the duty cycle of each PWM switching signal is denoted as D. In this embodiment, PWM switching signals PWM1, PWM3, PWM5, and PWM7 are used to control the corresponding one-phase Buck circuit of each first electromagnetic integrated circuit 3a. Therefore, the phases of the four PWM switching signals used to control the four one-phase Buck circuits of the first electromagnetic integrated circuit 3a are sequentially staggered by 90 degrees. Similarly, PWM switching signals PWM2, PWM4, PWM6, and PWM8 are used to control the corresponding one-phase Buck circuit of each second electromagnetic integrated circuit 3b. Therefore, the phases of the four PWM switching signals used to control the four one-phase Buck circuits of the second electromagnetic integrated circuit 3b are sequentially staggered by 90 degrees.

[0203] Since the control component K of the power conversion module 2 in this embodiment can generate eight sets of sequentially staggered PWM switching signals at 45 degrees, and control the four one-phase Buck circuits in the two electromagnetic integrated circuits 3a and 3b respectively, compared with only generating four sets of mutually staggered PWM switching signals at 90 degrees to control the Buck circuit of a single electromagnetic integrated circuit, the number of phases of the PWM switching signals in this embodiment is doubled. This results in a significant increase in the AC current component at eight times the frequency of the input capacitor Cin and the output capacitor Cout of the power conversion module 2, and a significant decrease in the AC current component at four times the frequency. As a result, the overall AC current component of the power conversion module 2 is significantly reduced. Therefore, the number of input capacitors Cin and output capacitors Cout of the power conversion module 2 in this embodiment can be significantly reduced, thus maintaining the expected input voltage and output voltage.

[0204] Please see Figure 3A , Figure 3B , Figure 4A and Figure 4BThe power conversion module 2, in its physical structure, includes a circuit board 20, a magnetic component 40, at least one first switching component 50, and at least one second switching component 60. The circuit board 20 includes opposing first surfaces 20a and second surfaces 20b, and the power conversion module 2 can be mounted on a system board via the second surface 20b of the circuit board 20. The magnetic component 40 is fastened to the first surface 20a and the second surface 20b of the circuit board 20 and includes 2N side posts 411, M center posts 412, 2N first windings 43, and second windings 45, where N and M are both integers greater than 1. N of the 2N side posts 411 are located on one side of the M center posts 412, and the other N side posts 411 are located on the other side of the M center posts 412. For ease of understanding, in this embodiment, the magnetic component 40 is described as containing twenty... The following describes the components: one side post 411, five center posts 412, and twenty first windings 43 (i.e., N=10 and M=10). Each set of four side posts 411 and their corresponding center posts 412 constitute a magnetic element. Therefore, in this embodiment, the power conversion module 2 includes five magnetic elements: three first magnetic elements 41 and two second magnetic elements 42, which are arranged alternately. The four side posts 411 of each first magnetic element 41 surround the corresponding center post 412, and the four side posts 411 of each second magnetic element 42 also surround the corresponding center post 412.

[0205] Each first winding 43 is disposed within the circuit board 20, and as follows: Figure 7 As shown, the four first windings 43 are wound around the corresponding side posts 411, and each first winding 43 has at least one turn wound around the corresponding side post 411. In this embodiment, the four side posts 411 of the first magnetic element 41 and the four first windings 43 wound around the four side posts 411 of the first magnetic element 41 constitute a total of 410 ... Figure 5 The four inductors L of the first power conversion circuit 31 of the first electromagnetic integrated circuit 3a shown, the four side posts 411 of the second magnetic element 42, and the four first windings 43 wound on the four side posts 411 of the second magnetic element 42 constitute a complete circuit. Figure 5 The second electromagnetic integrated circuit 3b has four inductors L in its second power conversion circuit 32. In this embodiment, the four opposite posts 411 of the first magnetic element 41 are respectively wound with corresponding first windings 43, so that the four inductors L of the first power conversion circuit 31 of the first electromagnetic integrated circuit 3a are coupled together, and the four opposite posts 411 of the second magnetic element 42 are respectively wound with corresponding first windings 43, so that the four inductors L of the second power conversion circuit 32 of the second electromagnetic integrated circuit 3b are coupled together.

[0206] The second winding 45 is disposed within the circuit board 20, and as follows: Figure 7As shown, the winding is wound on five center posts 412 to form a circuit, wherein the second winding 45 has at least one turn on each center post 412. The winding method of the second winding 45 will be explained later.

[0207] In this embodiment, the power conversion module 2 includes three first switching components 50 and two second switching components 60. Each first switching component 50, together with a corresponding first magnetic element 41, four first windings 43 wound around the four side posts 411 of the corresponding first magnetic element 41, and a portion of the second winding 45 wound around the center post 412 of the corresponding first magnetic element 41, constitutes a configuration. Figure 5 The first electromagnetic integrated circuit 3a shown includes a first switch assembly 50 comprising four switch assemblies 311 disposed on the first surface 20a of a circuit board 20. These assemblies are respectively connected to corresponding first windings 43 constituting the same first electromagnetic integrated circuit 3a and also surround the first magnetic element 41 constituting the same first electromagnetic integrated circuit 3a. Each second switch assembly 60, together with a corresponding second magnetic element 42, four first windings 43 wound around the four side posts 411 of the corresponding second magnetic element 42, and a portion of the second winding 45 wound around the center post 412 of the corresponding second magnetic element 42, constitutes... Figure 5 The second electromagnetic integrated circuit 3b shown includes a second switch assembly 60 comprising four switch integrations 311 disposed on the first surface 20a of the circuit board 20 and respectively connected to the corresponding first winding 43 constituting the same second electromagnetic integrated circuit 3b, and also surrounding the second magnetic element 42 constituting the same second electromagnetic integrated circuit 3b.

[0208] In this embodiment, two of the four switch integrations 311 in each first switch assembly 50 and two of the four switch integrations 311 in each second switch assembly 60 are arranged in a first row to form a first switch row. The remaining two switch integrations 311 in each first switch assembly 50 and the remaining two switch integrations 311 in each second switch assembly 60 are arranged in a second row to form a second switch row. The total number of switch integrations in the first switch row and the total number of switch integrations in the second switch row is 2N. (i.e., 20), and the two switch integrations 311 of the first switch assembly 50 constituting the first switch row are located on one side of the central post 412 of the corresponding first magnetic element 41, the two switch integrations 311 of the first switch assembly 50 constituting the second switch row are located on the other side of the central post 412 of the corresponding first magnetic element 41, the two switch integrations 311 of the second switch assembly 60 constituting the first switch row are located on one side of the central post 412 of the corresponding second magnetic element 42, and the two switch integrations 311 of the second switch assembly 60 constituting the second switch row are located on the other side of the central post 412 of the corresponding second magnetic element 42.

[0209] As can be seen from the above, each first winding 43 of the magnetic component 40 of the power conversion module 2 of this disclosure is wound around the corresponding side post 411, and the second winding 45 is wound around all the middle posts 412 to form a loop. When the load driven by the electronic device composed of power conversion module 2 undergoes dynamic switching, from heavy load to light load, the output voltage of power conversion module 2 may overshoot. In order to solve the problem of output voltage overshoot, the control component K of power conversion module 2 responds by making the duty cycle of all output PWM switching signals zero, and the lower switching transistor of each switch is turned on, so that the inductor L formed by each first winding 43 and the corresponding side post 411 bears the output voltage, while the second winding 45 couples out a large voltage and applies it to the line of the second winding 45, causing the current in the line of the second winding 45 to rise sharply, while the current in the first winding 43 drops sharply, thereby greatly suppressing the output voltage overshoot and effectively reducing the output voltage overshoot caused by dynamic load switching. Therefore, the power conversion module 2 of this disclosure can achieve the effect of suppressing the fluctuation range of output voltage without increasing the number of output capacitors. Thus, the power conversion module 2 of this disclosure can achieve the technical effect of reducing cost and size.

[0210] In some embodiments, the magnetic component 40 further includes W pairs of magnetic caps, where W is an integer greater than 1. For ease of understanding, this embodiment will be described as having five pairs of magnetic caps (i.e., W = 5). Figure 3B and Figure 4B As shown, each pair of magnetic covers includes a first magnetic cover 413 and a second magnetic cover 414, which are fastened to the first surface 20a and the second surface 20b of the circuit board 20. Each central post 412 and its corresponding four side posts 411 are located between the corresponding first magnetic cover 413 and second magnetic cover 414, and each central post 412 and its corresponding four side posts 411 pass through the circuit board 20.

[0211] In this embodiment, as Figure 7 As shown, the four side posts 411 are located at the ends of the two intersecting diagonals of the second magnetic cover 414 (and also at the ends of the two intersecting diagonals of the first magnetic cover 413), while the central post 412 is located at the intersection of the two intersecting diagonals formed by the four side posts 411. Of course, in some embodiments, the shapes of the first magnetic cover 413 and the second magnetic cover 414 are not limited to those of other magnetic covers. Figure 7 The diagram shows a quadrilateral shape, but the shapes of the first magnetic cover 413 and the second magnetic cover 414 can be changed according to actual conditions, so that the positions of the four side posts 411 and the center post 412 can also be adjusted as needed. Four first windings 43 are respectively wound on the four side posts 411, and the current direction on the four first windings 43 is the same, for example... Figure 7The counterclockwise direction shown ensures that the DC magnetic flux directions on all four side posts 411 are the same. For example, the DC magnetic flux direction on side post 411 is... Figure 7 As shown, with the paper penetrating upwards, the direction of the DC magnetic flux on the central column 412 is opposite to the direction of the DC magnetic flux on any of the side columns 411. For example, the direction of the DC magnetic flux on the side column 411 is... Figure 7 As shown, the direction penetrating the paper downwards is such that the central post 412 and the four side posts 411 form four closed magnetic circuits, and the DC flux on the four side posts 411 is superimposed on the DC flux on the central post 412. Of course, in some embodiments, the current direction on the four first windings 43 can also be clockwise, so that the DC flux direction on the four side posts 411 is downwards penetrating the paper, while the DC flux direction on the central post 412 is upwards penetrating the paper. Because the phases of the four PWM switching signals of the four switching integrations 311 driving the power conversion circuit of each electromagnetic integrated circuit are out of phase by 90 degrees, and the phases of the voltage signals of the four first windings 43 wound on the four side posts 411 connected to the four switching integrations 311 are also out of phase by 90 degrees, the amplitude of the AC flux on the four side posts 411 is added to the phase on the central post 412, causing a significant decrease in the amplitude of the AC flux on the central post 412. In this embodiment, the cross-sectional shape of the four side posts 411 is circular, which makes the winding path of each first winding 43 wound on the side posts 411 shorter and the winding width wider, thereby achieving the advantage of reducing the parasitic inductance on the first winding 43. The cross-sectional shape of the middle post 412 is square, which makes the winding path of the second winding 45 wound on the middle post 412 shorter and the winding width wider, thereby achieving the advantage of reducing the parasitic inductance on the second winding 45.

[0212] Please see Figure 8A and cooperate Figure 3A , Figure 3B , Figure 4A and Figure 4B ,in Figure 8A for Figure 3AThe diagram shows a cross-sectional view of the central column and side columns of the magnetic components of the power conversion module. In some embodiments, the central column 412 has a first air gap 412a. The first air gap 412a is used to reduce the DC magnetic flux density of the four closed magnetic circuits formed by the central column 412 and the four side columns 411, so as to avoid saturation between the four closed magnetic circuits of the first magnetic element 4. This results in a large AC magnetic flux and a small magnetic reluctance on the side columns 411, while the AC magnetic flux and the magnetic reluctance on the central column 412 are small. For example, the magnetic reluctance on the central column 412 is greater than twice the magnetic reluctance of the side columns 411. Therefore, the equivalent steady-state inductance of the four first windings 43 wound on the four side columns 411 increases significantly. When the load driven by the electronic device undergoes a dynamic transition from heavy load to light load, the output voltage of the power conversion module 2 may overshoot. In response, the control component K sets the duty cycle of all output PWM switching signals to zero, causing the four inductors L formed by the four first windings 43 and the four side posts 411 to simultaneously bear the output voltage. This results in the AC magnetic flux on the four side posts 411 being superimposed in phase onto the central post 412, significantly increasing the AC magnetic flux on the central post 412. Consequently, the AC current in the four first windings 43 also increases significantly, and the equivalent dynamic inductance of each first winding 43 is relatively small. In some embodiments, the central post 412 and the side posts 411 are both made of a single magnetic material, such as ferrite. Due to the high permeability of ferrite, the first air gap 412a on the central post 412 can be greater than or equal to the length of the side posts 411. In other embodiments, the central pillar 412 and the side pillars 411 can be made of various magnetic materials. For example, the central pillar 412 can be made of iron powder, and the side pillars 411 can be made of ferrite. Because iron powder has low magnetic permeability, the central pillar 412 may not have an air gap, allowing for a significant increase in the allowable saturation magnetic flux density and further reducing the size of the central pillar 412. In some embodiments, such as... Figure 8B As shown, each side column 411 has a second air gap 411a, which is less than or equal to the first air gap 412a.

[0213] In this embodiment, as Figure 4B As shown, the second surface 20b of the circuit board 20 has at least one first recessed area 20c, for example... Figure 4BThe circuit board 20 has five first recessed areas 20c, each formed by a recess in the second surface 20b of the circuit board 20. Each first recessed area 20c has a first depth based on the depth of the recess. Each second magnetic cover 414 is disposed in a corresponding first recessed area 20c, and the thickness of the second magnetic cover 414 is less than or equal to the first depth of the corresponding first recessed area 20c. The second surface 20b of the circuit board 20 also has multiple second recessed areas 20d, formed by a recess in the second surface 20b of the circuit board 20. Some of the second recessed areas 20d are located on one side of the first recessed area 20c, and the remaining second recessed areas 20d are located on the other side of the first recessed area 20c. Each second recessed area 20d has a second depth based on the depth of the recess. Each input capacitor Cin of the power conversion module 2 is disposed within a corresponding second recessed area 20d, and the thickness of each input capacitor Cin is less than or equal to the second depth. When the power conversion module 2 is mounted on the system board of the electronic device via the second side 20b of the circuit board 20, since the height of the magnetic component 40 and the height of the input capacitor Cin are lower than the second side 20b of the circuit board 20, the power conversion module 2 will not be hindered by the magnetic component 40 and the input capacitor Cin during the mounting process on the system board, thereby improving the convenience of mounting the power conversion module 2 on the system board.

[0214] Please continue reading. Figure 4A and 4B The power conversion module 2 includes multiple positive input terminals 71, multiple positive output terminals 72, multiple negative output terminals 73, and multiple signal terminals 74. These terminals are surface-mounted on the second surface 20b of the circuit board 20. The positive input terminals 71 constitute the positive input terminal Vin+ of the power conversion module 2, the positive output terminals 72 constitute the positive output terminal Vo+, the negative output terminals 73 constitute the negative output terminal Vo-, and the signal terminals 74 constitute the signal terminals of the power conversion module 2, such as PWM switching signal transmission / reception terminals, output current detection signal transmission / reception terminals, or temperature detection signal transmission / reception terminals. Therefore, the power conversion module 2 does not require additional soldered copper blocks for connections, resulting in a simple structure, good flatness, and ease of use. Of course, the positions of the positive input terminal guide 71, the positive output terminal guide 72, the negative output terminal guide 73, and the signal guide 74 are not limited to... Figure 4A The setting location can be adjusted according to actual needs.

[0215] Please see Figure 9 and cooperate Figure 4B ,in Figure 9 for Figure 4BThis is a side view diagram of the circuit board and input capacitor of the power conversion module. Figure 9 In the circuit, the second recessed area 20d is located between the positive output terminal conductive part 72 and the negative output terminal conductive part 73, and the side wall of the second recessed area 20d has a side electroplating part 75. The side electroplating part 75 is connected to the positive output terminal conductive part 72 and the negative output terminal conductive part 73 respectively, so that the positive output terminal conductive part 72 and the negative output terminal conductive part 73 can be electrically connected to the inner copper foil in the circuit board 20 or the solder pads of other components located in the second recessed area 20d through the side electroplating part, so as to realize the electrical connection between the conductive part and the inside of the circuit board 20 without occupying the horizontal space of the circuit board 20, thereby saving the size of the circuit board 20. Furthermore, the side-plated portion 75 can reduce the parasitic impedance on the conductive path of the power conversion module 2 and reduce the conduction loss of the conductive portion. Moreover, the combination of the side-plated portion 75 and the positive output conductive portion 72 can form a protruding thumb-shaped conductive portion that protrudes from the circuit board 20, and the combination of the side-plated portion 75 and the negative output conductive portion 73 can also form a protruding thumb-shaped conductive portion that protrudes from the circuit board 20. This thumb-shaped conductive portion is similar to a protruding copper block conductive portion. When this conductive portion is surface-mounted and soldered, the side-plated portion can form sidewall soldering, which has lower requirements for the flatness of the soldering surface and higher solder joint reliability, making it easier to solder onto the system board. As shown in Figure 4, the second recessed area 20d can also be located between the positive input terminal guide portion 71 and the positive output terminal guide portion 72, or on one side of the signal guide portion 74, or on one side of the positive input terminal guide portion 71. Therefore, the positive input terminal guide portion 71 and the signal guide portion 74 can also be matched with the side electroplating portion 75 to form a hand guide portion.

[0216] Please refer to the previous document. Figure 3BThe first magnetic element 41 includes a first side 41a, a second side 41b, a third side 41c, and a fourth side 41d. The first side 41a and the second side 41b of the first magnetic element 41 are arranged opposite to each other, and the third side 41c and the fourth side 41d of the first magnetic element 41 are arranged opposite to each other and located between the first side 41a and the second side 41b. The plurality of side posts 411 of the first magnetic element 41 include a first side post 411, a second side post 411, a third side post 411, and a fourth side post 411. The first post 411 of the first magnetic element 41 is adjacent to the first side 41a and the third side 41c of the first magnetic element 41; the second post 411 of the first magnetic element 41 is adjacent to the first side 41a and the fourth side 41d of the first magnetic element 41; the third post 411 of the first magnetic element 41 is adjacent to the second side 41b and the third side 41c of the first magnetic element 41; and the fourth post 411 of the first magnetic element 41 is adjacent to the second side 41b and the fourth side 41d of the first magnetic element 41. The plurality of switch integrations 311 of the first switch assembly 50 include a first switch integration 311, a second switch integration 311, a third switch integration 311, and a fourth switch integration 311. The first switch integration 311 of the first switch assembly 50 is adjacent to the first side 41a and the first side post 411 of the first magnetic element 41. The second switch integration 311 of the first switch assembly 50 is adjacent to the first side 41a and the second side post 411 of the first magnetic element 41. The third switch integration 311 of the first switch assembly 50 is adjacent to the second side 41b and the third side post 411 of the first magnetic element 41. The fourth switch integration 311 of the first switch assembly 50 is adjacent to the second side 41b and the fourth side post 411 of the first magnetic element 41.

[0217] The second magnetic element 42 includes a first side 42a, a second side 42b, a third side 42c, and a fourth side 42d. The first side 42a and the second side 42b of the second magnetic element 42 are arranged opposite to each other, and the third side 42c and the fourth side 42d of the second magnetic element 42 are arranged opposite to each other and located between the first side 42a and the second side 42b. The second magnetic element 42 has a plurality of side posts 411, including a first side post 411, a second side post 411, a third side post 411, and a fourth side post 411. The first side post 411 of the second magnetic element 42 is adjacent to the first side 42a and the third side 42c of the second magnetic element 42; the second side post 411 of the second magnetic element 42 is adjacent to the first side 42a and the fourth side 42d of the second magnetic element 42; the third side post 411 of the second magnetic element 42 is adjacent to the second side 42b and the third side 42c of the second magnetic element 42; and the fourth side post 411 of the second magnetic element 42 is adjacent to the second side 42b and the fourth side 42d of the second magnetic element 42. The second switch assembly 60 includes a plurality of switch integrations 311, a first switch integration 311, a second switch integration 311, a third switch integration 311, and a fourth switch integration 311. The first switch integration 311 of the second switch assembly 60 is adjacent to the first side 42a and the first side post 411 of the second magnetic element 42; the second switch integration 311 of the second switch assembly 60 is adjacent to the first side 42a and the second side post 411 of the second magnetic element 42; the third switch integration 311 of the second switch assembly 60 is adjacent to the second side 42b and the third side post 411 of the second magnetic element 42; and the fourth switch integration 311 of the second switch assembly 60 is adjacent to the second side 42b and the fourth side post 411 of the second magnetic element 42.

[0218] Please refer to the previous document. Figure 5 and Figure 6 The first switch integration 311 of the first switch assembly 50 operates by receiving the first PWM switch signal PWM1, and the first side post 411 of the first magnetic element 41 is adjacent to the first switch integration 311 of the first switch assembly 50, such as... Figure 3B As shown, the phase of the voltage signal of the first winding 43 surrounding the first post 411 of the first magnetic element 41 is the same as the phase of the first PWM switching signal PWM1. The second switch integration 311 of the first switching assembly 50 operates by receiving the fifth PWM switching signal PWM5. The second post 411 of the first magnetic element 41 is adjacent to the second switch integration 311 of the first switching assembly 50, as shown. Figure 3B As shown, the phase of the voltage signal of the first winding 43 surrounding the second post 411 of the first magnetic element 41 is the same as the phase of the fifth PWM switching signal PWM5. The third switch integration 311 of the first switching assembly 50 operates by receiving the third PWM switching signal PWM3, and the third post 411 of the first magnetic element 41 is adjacent to the third switch integration 311 of the first switching assembly 50, as shown. Figure 3B As shown, the phase of the voltage signal of the first winding 43 surrounding the third post 411 of the first magnetic element 41 is the same as the phase of the third PWM switching signal PWM3. The fourth switch integration 311 of the first switching assembly 50 operates by receiving the seventh PWM switching signal PWM7. The fourth post 411 of the first magnetic element 41 is adjacent to the fourth switch integration 311 of the first switching assembly 50, as shown. Figure 3B As shown, the phase of the voltage signal of the first winding 43 of the fourth post 411 surrounding the first magnetic element 41 is the same as the phase of the seventh PWM switching signal PWM7.

[0219] In this embodiment, the voltage phase difference between the first winding wound on one side post of the magnetic element and the first winding wound on the other side post of the magnetic element is a first angle, wherein the first angle is a function of N and W, for example, the first angle is 360 / (2N / W) degrees. In some embodiments, the first angle may have an error of ±15 degrees. Furthermore, the voltage phase difference between at least two first windings of at least two side posts wound on one side of the central post is a second angle, and the voltage phase difference between at least two first windings of the remaining side posts wound on the other side of the central post is also a second angle, wherein the second angle is a function of N and W, for example, the second angle is 360 / (N / W) degrees. In some embodiments, the second angle may have an error of ±15 degrees. Figure 6 It can be seen that the PWM switching signal received by the first switch integration 311 of each switching assembly is out of phase with the PWM switching signal received by the second switch integration 311 by 180 degrees, and the phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the corresponding magnetic element is out of phase with the phase of the voltage signal of the first winding 43 of the second side post 411 by 180 degrees; the PWM switching signal received by the first switch integration 311 of each switching assembly is out of phase with the PWM switching signal received by the third switch integration 311 by 90 degrees, and the phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the corresponding magnetic element is out of phase with the voltage signal of the first winding 43 of the second side post 411 by 180 degrees; The phase of the voltage signal of the first winding 43 of the first side post 411 of the corresponding magnetic element is out of phase with the phase of the voltage signal of the first winding 43 of the third side post 411 by 90 degrees; the PWM switching signal received by the third switch integration 311 of each switching assembly is out of phase with the PWM switching signal received by the fourth switch integration 311 by 180 degrees, and the phase of the voltage signal of the first winding 43 of the third side post 411 of the corresponding magnetic element is out of phase with the phase of the voltage signal of the first winding 43 of the fourth side post 411 by 180 degrees.

[0220] Furthermore, according to Figure 6It can be seen that the first PWM switching signal PWM1 received by the first switch integration 311 of the first switch assembly 50 is out of phase with the fifth PWM switching signal PWM5 received by the second switch integration 311 of the first switch assembly 50 by 180 degrees, and the phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the first magnetic element 41 is out of phase with the phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the first magnetic element 41 by 180 degrees; the first PWM switching signal PWM1 received by the first switch integration 311 of the first switch assembly 50 is out of phase with the third PWM switching signal PWM3 received by the third switch integration 311 of the first switch assembly 50 by 90 degrees. The phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the first magnetic element 41 is 90 degrees out of phase with the phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the first magnetic element 41; the phase of the third PWM switching signal PWM3 received by the third switch integration 311 of the first switch assembly 50 is 180 degrees out of phase with the phase of the seventh PWM switching signal PWM7 received by the fourth switch integration 311 of the first switch assembly 50; and the phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the first magnetic element 41 is 180 degrees out of phase with the phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the first magnetic element 41.

[0221] And according to Figure 6 It can be seen that the first switch integration 311 of the second switch assembly 60 operates by receiving the second PWM switch signal PWM2, and the first side post 411 of the second magnetic element 42 is adjacent to the first switch integration 311 of the second switch assembly 60, as shown below. Figure 3B As shown, the phase of the voltage signal of the first winding 43 surrounding the first post 411 of the second magnetic element 42 is the same as the phase of the second PWM switching signal PWM2. The second switch integration 311 of the second switch assembly 60 operates by receiving the sixth PWM switching signal PWM6, and the second post 411 of the second magnetic element 42 is adjacent to the second switch integration 311 of the second switch assembly 60, as shown. Figure 3B As shown, the phase of the voltage signal of the first winding 43 surrounding the second post 411 of the second magnetic element 42 is the same as the phase of the sixth PWM switching signal PWM6. The third switch integration 311 of the second switching assembly 60 operates by receiving the fourth PWM switching signal PWM4, and the third post 411 of the second magnetic element 42 is adjacent to the third switch integration 311 of the second switching assembly 60, as shown. Figure 3BAs shown, the phase of the voltage signal of the first winding 43 surrounding the third post 411 of the second magnetic element 42 is the same as the phase of the fourth PWM switching signal PWM4. The fourth switch integration 311 of the second switching assembly 60 operates by receiving the eighth PWM switching signal PWM8, and the fourth post 411 of the second magnetic element 42 is adjacent to the fourth switch integration 311 of the second switching assembly 60, as shown. Figure 3B As shown, the phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the second magnetic element 42 is the same as the phase of the eighth PWM switching signal PWM8.

[0222] according to Figure 6 It can be seen that the second PWM switching signal PWM2 received by the first switch integration 311 of the second switch assembly 60 is out of phase with the sixth PWM switching signal PWM6 received by the second switch integration 311 of the second switch assembly 60 by 180 degrees, and the phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the second magnetic element 42 is out of phase with the phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the second magnetic element 42 by 180 degrees; the second PWM switching signal PWM2 received by the first switch integration 311 of the second switch assembly 60 is out of phase with the fourth PWM switching signal PWM4 received by the third switch integration 311 of the second switch assembly 60 by 90 degrees. The phase of the voltage signal of the first winding 43 of the first side post 411 of the second magnetic element 42 is out of phase with the phase of the voltage signal of the first winding 43 of the third side post 411 of the second magnetic element 42 by 90 degrees; the fourth PWM switching signal PWM4 received by the third switch integration 311 of the second switching assembly 60 is out of phase with the eighth PWM switching signal PWM8 received by the fourth switch integration 311 of the second switching assembly 60 by 180 degrees, and the phase of the voltage signal of the first winding 43 of the third side post 411 of the second magnetic element 42 is out of phase with the phase of the voltage signal of the first winding 43 of the fourth side post 411 of the second magnetic element 42 by 180 degrees. Based on the phase shift setting between the switches, the frequency of the AC current of the input capacitor Cin adjacent to the switch is doubled to twice the switching frequency of the PWM switching signal, and the amplitude of the AC current decreases, resulting in a significant reduction in the conduction loss of the input capacitor Cin and an increase in the efficiency of the power conversion module 2.

[0223] Furthermore, in this embodiment, the difference between the sum of the voltage phases of the windings corresponding to the four pillars of each magnetic element and the sum of the voltage phases of the windings corresponding to the four pillars of another adjacent magnetic element is 180 degrees. More specifically, according to... Figure 6It can be seen that the phase of the voltage signal surrounding the first winding 43 of the first side post 411 of the first magnetic element 41, the phase of the voltage signal surrounding the first winding 43 of the second side post 411 of the first magnetic element 41, the phase of the voltage signal surrounding the first winding 43 of the third side post 411 of the first magnetic element 41, and the phase of the voltage signal surrounding the first winding 43 of the fourth side post 411 of the first magnetic element 41, is 540 degrees (i.e., 0 degrees + 180 degrees + 90 degrees + 270 degrees). The phase of the voltage signal surrounding the first winding 43 of the first side post 411 of the second magnetic element 42 is... The sum of the phases of the voltage signals of the first winding 43 of the second post 411 surrounding the second magnetic element 42, the first winding 43 of the third post 411 surrounding the second magnetic element 42, and the first winding 43 of the fourth post 411 surrounding the second magnetic element 42 is 720 degrees (i.e., 45 degrees + 225 degrees + 135 degrees + 315 degrees). The difference between the sum of the phases of the first windings 43 of the four posts surrounding the first magnetic element 41 and the sum of the phases of the first windings 43 of the four posts surrounding the second magnetic element 42 is 180 degrees. Based on this difference in phase sums, the AC current component of each PWM switching signal flowing through each input capacitor Cin at four times the switching frequency increases significantly, while the AC current component of each PWM switching signal flowing through each input capacitor Cin at twice the switching frequency decreases significantly. Therefore, the total AC current component on each input capacitor Cin is significantly reduced, thereby reducing the conduction loss of each input capacitor Cin.

[0224] Of course, the voltage signal on the corresponding winding of the magnetic element's side post and the PWM switching signal received by the switching assembly are not limited to the phase distribution described above. For ease of explanation, Figure 3A and Figure 7 The three first magnetic elements 41 of the power conversion module 2 shown are referred to as the first magnetic element 41, the third magnetic element 41, and the fifth magnetic element 41, respectively. The two second magnetic elements 42 of the power conversion module 2 are referred to as the second magnetic element 42 and the fourth magnetic element 42, respectively. Figure 3A and Figure 7In the configuration, the first magnetic element 41, the second magnetic element 42, the third magnetic element 41, the fourth magnetic element 42, and the fifth magnetic element 41 are arranged sequentially from left to right. In some embodiments, the phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the first magnetic element 41 and the switching signal received by the connected switch integration 311 are both the first PWM switching signal PWM1; the phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the first magnetic element 41 and the switching signal received by the connected switch integration 311 are both the fifth PWM switching signal PWM5; the phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the first magnetic element 41 and the switching signal received by the connected switch integration 311 are both the third PWM switching signal PWM3; and the phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the first magnetic element 41 and the switching signal received by the connected switch integration 311 are both the seventh PWM switching signal PWM7. The phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the second magnetic element 42 and the switching signal received by the connected switch integration 311 are both the first PWM switching signal PWM1. The phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the second magnetic element 42 and the switching signal received by the connected switch integration 311 are both the fifth PWM switching signal PWM5. The phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the second magnetic element 42 and the switching signal received by the connected switch integration 311 are both the third PWM switching signal PWM3. The phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the second magnetic element 42 and the switching signal received by the connected switch integration 311 are both the seventh PWM switching signal PWM7.

[0225] The phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the third magnetic element 41 and the switching signal received by the connected switch integration 311 are both the second PWM switching signal PWM2. The phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the third magnetic element 41 and the switching signal received by the connected switch integration 311 are both the sixth PWM switching signal PWM6. The phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the third magnetic element 41 and the switching signal received by the connected switch integration 311 are both the fourth PWM switching signal PWM4. The phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the third magnetic element 41 and the switching signal received by the connected switch integration 311 are both the eighth PWM switching signal PWM8. The phase of the voltage signal of the first winding 43 of the first side post 411 surrounding the fourth magnetic element 42 and the switching signal received by the connected switch integration 311 are both the second PWM switching signal PWM2. The phase of the voltage signal of the first winding 43 of the second side post 411 surrounding the fourth magnetic element 42 and the switching signal received by the connected switch integration 311 are both the sixth PWM switching signal PWM6. The phase of the voltage signal of the first winding 43 of the third side post 411 surrounding the fourth magnetic element 42 and the switching signal received by the connected switch integration 311 are both the fourth PWM switching signal PWM4. The phase of the voltage signal of the first winding 43 of the fourth side post 411 surrounding the fourth magnetic element 42 and the switching signal received by the connected switch integration 311 are both the eighth PWM switching signal PWM8.

[0226] The phase of the voltage signal of the first winding 43 of the first pillar 411 surrounding the fifth magnetic element 41 and the switching signal received by the connected switch integration 311 are both the first PWM switching signal PWM1. The phase of the voltage signal of the first winding 43 of the second pillar 411 surrounding the fifth magnetic element 41 and the switching signal received by the connected switch integration 311 are both the fifth PWM switching signal PWM5. The phase of the voltage signal of the first winding 43 of the third pillar 411 surrounding the fifth magnetic element 41 and the switching signal received by the connected switch integration 311 are both the third PWM switching signal PWM3. The phase of the voltage signal of the first winding 43 of the fourth pillar 411 surrounding the fifth magnetic element 41 and the switching signal received by the connected switch integration 311 are both the seventh PWM switching signal PWM7. In this embodiment, the difference between the sum of the voltage phases on the four pillars of each magnetic element and the sum of the voltage phases on the four pillars of the adjacent magnetic element is 0 degrees or 180 degrees. The calculation method is similar to that in the previous embodiment, so it will not be repeated here. Of course, the phase distribution of the voltage signal on the side post of the magnetic element and the PWM switching signal received by the switch assembly can also be configured in other ways. However, for the convenience of explaining other technical features, the following technical features are described with reference to the first phase distribution mentioned above.

[0227] Please continue reading. Figure 7The first magnetic element 41 has a first channel 47a between its first and second side pillars 411 and its middle pillar 412; a second channel 47b between its third and fourth side pillars 411 and its middle pillar 412; and a third channel 47c between its middle pillar 412 and the middle pillar 412 of the second magnetic element 42. Similarly, the second magnetic element 42 has a first channel 47a between its first and second side pillars 411 and its middle pillar 412; a second channel 47b between its third and fourth side pillars 411 and its middle pillar 412; and a third channel 47c between its middle pillar 412 and the middle pillar 412 of the third magnetic element 41. The third magnetic element 41 has a first channel 47a between its first and second side pillars 411 and its middle pillar 412; a second channel 47b between its third and fourth side pillars 411 and its middle pillar 412; and a third channel 47c between its middle pillar 412 and the middle pillar 412 of the fourth magnetic element 42. Similarly, the fourth magnetic element 42 has a first channel 47a between its first and second side pillars 411 and its middle pillar 412; a second channel 47b between its third and fourth side pillars 411 and its middle pillar 412; and a third channel 47c between its middle pillar 412 and the middle pillar 412 of the fifth magnetic element 41. The first side post 411 and the second side post 411 of the fifth magnetic element 41 have a first channel 47a between them and the middle post 412, and the third side post 411 and the fourth side post 411 of the fifth magnetic element 41 have a second channel 47b between them and the middle post 412.

[0228] In this embodiment, as Figure 7As shown, the second winding 45 takes the first channel 47a of the first magnetic element 41 as the input point and sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the first channel 47a of the fourth magnetic element 42, the first channel 47a of the fifth magnetic element 41, the fourth side 41d of the fifth magnetic element 41, the second channel 47b of the fifth magnetic element 41, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, the second channel 47b of the second magnetic element 42, the third side 41c of the first magnetic element 41, the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the third channel 47c between the second magnetic element 42 and the third magnetic element 41, the second channel 47b of the second magnetic element 42, the third channel 47c between the first magnetic element 41 and the second magnetic element 42, and the first channel 47a of the second magnetic element 42. Channel 47a, first channel 47a of third magnetic element 41, first channel 47a of fourth magnetic element 42, third channel 47c between fourth magnetic element 42 and fifth magnetic element 41, second channel 47b of fourth magnetic element 42, third channel 47c between third magnetic element 41 and fourth magnetic element 42, first channel 47a of fourth magnetic element 42, first channel 47a of fifth magnetic element 41, fourth side 41d of fifth magnetic element 41, second channel 47b of fifth magnetic element 41 The second winding 45 is wound in series with the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, the second channel 47b of the second magnetic element 42, the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41, such that the second winding 45 is wound in series with the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, the central post 412 of the fourth magnetic element 42, and the central post 412 of the fifth magnetic element 41. Of course, the second winding 45 can be wound with different input points, and is not limited to the first channel 47a of the first magnetic element 41 as the input point.According to the above winding method, the second winding 45 wound on the central column 412 of the first magnetic element 41 has two turns, the second winding 45 wound on the central column 412 of the second magnetic element 42 has three turns, the second winding 45 wound on the central column 412 of the third magnetic element 41 has two turns, the second winding 45 wound on the central column 412 of the fourth magnetic element 42 has three turns, and the second winding 45 wound on the central column 412 of the fifth magnetic element 41 has two turns. The number of turns of the second winding 45 wound on the central column 412 of the second magnetic element 42 (or the fourth magnetic element 42) is 1.5 times the number of turns of the second winding 45 wound on the central column 412 of the first magnetic element 41 (or the third magnetic element 41 or the fifth magnetic element 41). It is understood that, in some embodiments, at least a portion of the second windings wound on the central column of the magnetic assembly 40c can be connected in series.

[0229] In some embodiments, in order to withstand a larger output voltage, such as Figure 7 As shown, the second winding 45 is further electrically connected to an external inductor 45a (or a parasitic inductance on the line), so that the voltage coupled out by the second winding 45 can be distributed across the external inductor 45a (or the parasitic inductance on the line), and the second winding 45 and the external inductor 45a (or the parasitic inductance on the line) can form a closed loop. Please refer to [link / reference]. Figure 10 and cooperate Figure 6 and Figure 7 ,in Figure 10 for Figure 7 The diagram shows the voltage waveform of the second winding wound on the central column. As shown, V(w1) represents the voltage waveform of the second winding 45 wound on the central column 412 of the first magnetic element 41, V(w2) represents the voltage waveform of the second winding 45 wound on the central column 412 of the second magnetic element 42, V(w3) represents the voltage waveform of the second winding 45 wound on the central column 412 of the third magnetic element 41, V(w4) represents the voltage waveform of the second winding 45 wound on the central column 412 of the fourth magnetic element 42, and V(w5) represents the voltage waveform of the second winding 45 wound on the central column 412 of the fifth magnetic element 41. According to... Figure 10 It can be seen that the voltage waveform V(w1) of the second winding 45 wound on the central post 412 of the first magnetic element 41 is equal to the voltage waveform V(w3) of the second winding 45 wound on the central post 412 of the third magnetic element 41 and the voltage waveform V(w5) of the second winding 45 wound on the central post 412 of the fifth magnetic element 41. According to... Figure 10 and cooperate Figure 6It can be seen that the switching frequency of the voltage waveform of the second winding of each central column of the magnetic element is four times the switching frequency of the first PWM switching signal PWM1, and the switching period is 1 / (4fsw). Therefore, when the duty cycle of the first PWM switching signal PWM1 is 12.5%, the duty cycle of the voltage waveform V(w1) of the second winding 45 of the central column 412 of the first magnetic element 41, the duty cycle of the voltage waveform V(w3) of the second winding 45 of the central column 412 of the third magnetic element 41, and the duty cycle of the second winding 45 of the central column 412 of the third magnetic element 41 are all related to the switching frequency of the second winding of the third magnetic element 41. The duty cycle of the voltage waveform V(w5) of the second winding 45 of the central column 412 of the fifth magnetic element 41 is 50%, and the positive voltage amplitudes of the voltage waveform V(w1) of the second winding 45 wound on the central column 412 of the first magnetic element 41, the voltage waveform V(w3) of the second winding 45 wound on the central column 412 of the third magnetic element 41, and the voltage waveform V(w5) of the second winding 45 wound on the central column 412 of the fifth magnetic element 41 are eight times the output voltage (i.e., Figure 10 The negative voltage amplitudes of the voltage waveform V(w1) of the second winding 45 wound on the central column 412 of the first magnetic element 41, the negative voltage amplitudes of the voltage waveform V(w3) of the second winding 45 wound on the central column 412 of the third magnetic element 41, and the negative voltage amplitudes of the voltage waveform V(w5) of the second winding 45 wound on the central column 412 of the fifth magnetic element 41 are respectively negative eight times the output voltage (i.e., 8Vo). Figure 10 (as shown in -8Vo).

[0230] Please continue reading. Figure 10 The voltage waveform V(w2) of the second winding 45 wound on the central column 412 of the second magnetic element 42 is equal to the voltage waveform V(w4) of the second winding 45 wound on the central column 412 of the fourth magnetic element 42. When the duty cycle of the first PWM switching signal PWM1 is 12.5%, the phase of the voltage waveform V(w2) of the second winding 45 wound on the central column 412 of the second magnetic element 42 and the phase of the second winding 45 wound on the central column 412 of the fourth magnetic element 42 are equal. The phase of the voltage waveform V(w4) of group 45 is 180 degrees out of phase with the phase of the voltage waveform V(w1) of the second winding 45 wound on the middle post 412 of the first magnetic element 41. Therefore, the positive voltage amplitude of the voltage waveform V(w2) of the second winding 45 wound on the middle post 412 of the second magnetic element 42 and the positive voltage amplitude of the voltage waveform V(w4) of the second winding 45 wound on the middle post 412 of the fourth magnetic element 42 are twelve times the output voltage (i.e., Figure 10The output voltage (i.e., 12Vo) shown, and the negative voltage amplitude of the voltage waveform V(w2) of the second winding 45 wound on the middle column 412 of the second magnetic element 42 and the negative voltage amplitude of the voltage waveform V(w4) of the second winding 45 wound on the middle column 412 of the fourth magnetic element 42 is negative twelve times. Figure 10 (as shown in -12Vo).

[0231] Since the number of turns of the second winding 45 wound on the central post 412 of the second magnetic element 42 (or the fourth magnetic element 42) is 1.5 times the number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41 (or the third magnetic element 41 or the fifth magnetic element 41), the voltage of the second winding 45 coupled to the central post 412 of the second magnetic element 42 (or the fourth magnetic element 42) is 1.5 times the voltage of the second winding 45 coupled to the central post 412 of the first magnetic element 41 (or the third magnetic element 41 or the fifth magnetic element 41). Furthermore, since both the second magnetic element 42 and the fourth magnetic element 42 operate with the same set of PWM switching signals... The driving mechanism is as follows: the second magnetic element 42 and the fourth magnetic element 42 are driven by the second PWM switching signal PWM2, the fourth PWM switching signal PWM4, the sixth PWM switching signal PWM6, and the eighth PWM switching signal PWM8. The first magnetic element 41, the third magnetic element 41, and the fifth magnetic element 41 are all driven by another set of identical PWM switching signals, namely, the first magnetic element 41, the third magnetic element 41, and the fifth magnetic element 41 are driven by the first PWM switching signal PWM1, the third PWM switching signal PWM3, the fifth PWM switching signal PWM5, and the seventh PWM switching signal PWM7. Since the number of magnetic elements driven by the first PWM switching signal PWM1, the third PWM switching signal PWM3, the fifth PWM switching signal PWM5, and the seventh PWM switching signal PWM7 is 1.5 times the number of magnetic elements driven by the second PWM switching signal PWM2, the fourth PWM switching signal PWM4, the sixth PWM switching signal PWM6, and the eighth PWM switching signal PWM8, the total DC and AC voltage amplitudes of the second winding 45 wound around all the central columns are small, even approaching zero. Since the voltage of the second winding 45 is applied to the external inductor 45a, and the AC current of the external inductor 45a is small, even close to 0, the AC current of the overall power conversion module 2 is small, so that the efficiency of each power conversion circuit is not affected during steady-state operation.When the load driven by the electronic device undergoes a dynamic transition from heavy load to light load, the output voltage of the power conversion module 2 may overshoot. The control component K responds by making the duty cycle of all output PWM switching signals zero, and the lower switching transistor of each switch is turned on, so that the inductor L formed by each first winding and the corresponding side post bears the output voltage. The second winding 45 couples out 48 times the output voltage and applies it to the external inductor 45a, causing the current of the external inductor 45a to rise sharply, while the current of the second winding 45 drops sharply, thereby greatly suppressing the output voltage overshoot and effectively reducing the output voltage overshoot caused by the dynamic transition of the load. Therefore, the power conversion module 2 of this disclosure can achieve the effect of suppressing the fluctuation range of the output voltage without increasing the number of output capacitors. Thus, the power conversion module 2 of this disclosure can achieve the technical effect of reducing cost and size.

[0232] In some embodiments, to utilize thinner magnetic covers, the power conversion module contains only three pairs of magnetic covers, such as... Figure 11 As shown, the power conversion module 2a of this embodiment has three pairs of magnetic covers. Figure 11 The three pairs of magnetic caps in the magnetic assembly are referred to from left to right as the first pair of magnetic caps, the second pair of magnetic caps, and the third pair of magnetic caps. The side posts 411 and the middle post 412 of the first magnetic element 41 and the side posts 411 and the middle post 412 of the second magnetic element 42 are located between the first magnetic cap 413 and the second magnetic cap 414 of the first pair of magnetic caps. The side posts 411 and the middle post 412 of the third magnetic element 41 and the side posts 411 and the middle post 412 of the fourth magnetic element 42 are located between the first magnetic cap 413 and the second magnetic cap 414 of the second pair of magnetic caps. The side posts 411 and the middle post 412 of the fifth magnetic element 41 are located between the first magnetic cap 413 and the second magnetic cap 414 of the third pair of magnetic caps. Alternatively, in some embodiments, the magnetic assembly 40 includes only one pair of magnetic caps, and all the side posts and the middle post are located between this pair of magnetic caps. Alternatively, in some embodiments, the number of pairs of magnetic caps included in the magnetic assembly 40 and the shape of the magnetic caps can be adjusted according to actual needs, and no restrictions are imposed here.

[0233] Please see Figure 12 This is a schematic diagram of the magnetic component of the power conversion module according to the third embodiment of this disclosure. As shown in the figure, the magnetic component 40a of this embodiment includes only two first magnetic elements 41 and two second magnetic elements 42 to simplify the arrangement of the magnetic elements. For ease of explanation, the two first magnetic elements 41 are referred to as first magnetic element 41 and third magnetic element 41, and the two second magnetic elements 42 are referred to as second magnetic element 42 and fourth magnetic element 42, respectively. Figure 12The first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 in the magnetic assembly 40a of this embodiment are arranged sequentially from left to right. The first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 in the magnetic assembly 40a of this embodiment are similar to... Figure 7 The first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 of the magnetic assembly 40 shown are not described in detail here.

[0234] In this embodiment, as Figure 12 As shown, the second winding 45 takes the first channel 47a of the first magnetic element 41 as the input point and sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the first channel 47a of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, the second channel 47b of the second magnetic element 42, the second channel 47b of the first magnetic element 41, the third side 41c of the first magnetic element 41, the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the first channel 47a of the fourth magnetic element 42, and the fourth side 42d of the fourth magnetic element 42. The fourth side 42d of the magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, the second channel 47b of the second magnetic element 42, the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41 are wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 are all two. Of course, the second winding 45 can be wound at different entry points, and is not limited to using the first channel 47a of the first magnetic element 41 as the entry point. The winding method of the second winding 45 in this embodiment can be as follows: Figure 7 The winding method of the second winding 45 shown achieves a similar effect, so that the second winding 45 couples out 32 times the output voltage and applies it to the external inductor 45a. This further enables the power conversion module 2 to suppress the fluctuation range of the output voltage without increasing the number of output capacitors, so it will not be described in detail here.

[0235] In some embodiments, to simplify the winding method of the second winding 45 and improve the utilization rate on the circuit board 20, such as Figure 13 As shown, in this embodiment, the second winding 45 of the magnetic component 40b takes the first channel 47a of the first magnetic element 41 as the input point and sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the first channel 47a of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, the second channel 47b of the second magnetic element 42, and the second channel of the first magnetic element 41. 47b. The third side 41c of the first magnetic element 41 is wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 is one turn each. Of course, the second winding 45 can be wound from different input points, and is not limited to the first channel 47a of the first magnetic element 41 as the input point. The magnetic assembly 40b of this embodiment has lower losses and higher efficiency. In this embodiment, the voltage coupled to each middle column of the second winding 45 is low, and the inductance requirement of the external inductor 45a is low. Therefore, the external inductor 45a can be replaced by the parasitic inductance of the second winding 45 with low inductance.

[0236] In some embodiments, in order to achieve the effect of parallel connection between windings, such as Figure 14As shown, in this embodiment, the second winding 45 of the magnetic component 40c takes the first channel 47a of the first magnetic element 41 as the input point and sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the third channel 47c between the second magnetic element 42 and the third magnetic element 41, the second channel 47b of the third magnetic element 41, the second channel 47b of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the first channel 47a of the fourth magnetic element 42, the first channel 47a of the third magnetic element 41, the third channel 47c between the second magnetic element 42 and the third magnetic element 41, and the second... The second channel 47b of the magnetic element 42, the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41 are wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 is one turn. In this embodiment, the second winding 45 of the magnetic component 40c passes through the third channel 47c between the second magnetic element 42 and the third magnetic element 41 twice, forming a crossover point. An external inductor 45a is connected across the two ends of this crossover point, so that the portion of the second winding 45 wound on the central post 412 of the first magnetic element 41 and the central post 412 of the second magnetic element 42 is connected in parallel with the portion of the second winding 45 wound on the central post 412 of the third magnetic element 41 and the central post 412 of the fourth magnetic element 42. It is understood that in some embodiments, at least a portion of the second winding wound on the central post of the magnetic component 40c can be connected in parallel.

[0237] In other embodiments, the magnetic components of the power conversion module may include only two first magnetic elements and one second magnetic element. For ease of explanation, the two first magnetic elements are referred to as the first magnetic element and the third magnetic element, respectively. The second winding has K turns wound on the first magnetic element, 2K turns wound on the second magnetic element, and K turns wound on the third magnetic element, where K is an integer greater than 1. Furthermore, the first windings wound on the four side posts of each first magnetic element are controlled by the first PWM switch signal PWM1, the third PWM switch signal PWM3, the fifth PWM switch signal PWM5, and the seventh PWM switch signal PWM7. The first windings wound on the four side posts of the second magnetic element are controlled by the second PWM switch signal PWM2, the fourth PWM switch signal PWM4, the sixth PWM switch signal PWM6, and the eighth PWM switch signal PWM8. The placement positions of the first, second, and third magnetic elements and the control methods of their corresponding switches are as follows... Figure 7 The first magnetic element 41, the second magnetic element 42, and the third magnetic element 41 shown are similar, so they will not be described again here. In some other embodiments, the first winding wound on the four side posts of each first magnetic element and the first winding wound on the four side posts of each second magnetic element can be controlled by twelve different PWM switching signals, and the control method is similar to the control method of the PWM switching signals described above, so they will not be described again here.

[0238] In other embodiments, the magnetic component of the power conversion module may include only a first magnetic element and a second magnetic element. The first winding of the four side posts of the first magnetic element is controlled by the first PWM switch signal PWM1, the third PWM switch signal PWM3, the fifth PWM switch signal PWM5 and the seventh PWM switch signal PWM7. The first winding of the four side posts of the second magnetic element is controlled by the second PWM switch signal PWM2, the fourth PWM switch signal PWM4, the sixth PWM switch signal PWM6 and the eighth PWM switch signal PWM8.

[0239] In some embodiments, all the central columns of the power conversion module can be integrated into a single main central column, all the first magnetic covers of the power conversion module can be integrated into a single first main magnetic cover, and all the second magnetic covers of the power conversion module can be integrated into a single second main magnetic cover, so as to improve the integration of the power conversion module, thereby improving the power density of the power conversion module and reducing the assembly complexity; in another embodiment, the magnetic component can also adopt an asymmetrical magnetic cover structure, that is, the number of all upper magnetic covers is not equal to the number of all lower magnetic covers, which can also achieve the technical effects described in the previous embodiments.

[0240] Please see Figure 15 and cooperate Figure 3A , Figure 5 and Figure 7 ,in Figure 15 for Figure 5 The circuit connection diagram of the electromagnetic integrated circuit and control components of the power conversion module is shown. Figure 15 As shown, the control component K is connected to multiple switch integrations 311 of each first electromagnetic integrated circuit 3a and multiple switch integrations 311 of each second electromagnetic integrated circuit 3b. The control component K outputs a first control signal S1 to... Figure 5 The driving circuit 312 of each first electromagnetic integrated circuit 3a shown outputs a first PWM switching signal PWM1, a third PWM switching signal PWM3, a fifth PWM switching signal PWM5, and a seventh PWM switching signal PWM7 according to the first control signal S1 to control the operation of the plurality of switching integrations 311 of each first electromagnetic integrated circuit 3a, and the control component K further outputs a second control signal S2 to... Figure 5The driving circuit 322 of each first electromagnetic integrated circuit 3a shown outputs a second PWM switching signal PWM2, a fourth PWM switching signal PWM4, a sixth PWM switching signal PWM6, and an eighth PWM switching signal PWM8 according to the second control signal S2 to control the operation of the plurality of switching integrations 311 of each second electromagnetic integrated circuit 3b. The control component K is further used to detect the plurality of first switching currents flowing through the plurality of switching integrations 311 of at least one of the first electromagnetic integrated circuits 3a and the plurality of second switching currents flowing through the plurality of switching integrations 311 of at least one of the second electromagnetic integrated circuits 3b, so that the currents output by the four first windings 43 constituting the first electromagnetic integrated circuit 3a are equal, and the currents output by the four first windings 43 constituting the second electromagnetic integrated circuit 3b are equal, and the currents output by the four first windings 43 constituting the first electromagnetic integrated circuit 3a are equal to the currents output by the four first windings 43 constituting the second electromagnetic integrated circuit 3b. Therefore, the current error between the four side posts 411 wound by the four first windings 43 constituting the first electromagnetic integrated circuit 3a is zero, there is no magnetic pressure problem between the four side posts 411 wound by the four first windings 43 constituting the first electromagnetic integrated circuit 3a, and there is no magnetic saturation problem between the four side posts 411 wound by the four first windings 43 constituting the first electromagnetic integrated circuit 3a, and the current error is also zero. Similarly, the current error between the four side posts 411 wound by the four first windings 43 constituting the second electromagnetic integrated circuit 3b is zero, there is no magnetic pressure problem between the four side posts 411 wound by the four first windings 43 constituting the second electromagnetic integrated circuit 3b, and there is no magnetic saturation problem between the four side posts 411 wound by the four first windings 43 constituting the second electromagnetic integrated circuit 3b, and the current error is also zero. Furthermore, the power conversion module can also achieve current sharing of the first windings in the electromagnetic integrated circuit by balancing the parasitic resistance of the lines in the control circuit board layout.

[0241] In some embodiments, to achieve better dynamic performance, the power conversion module may also include an output capacitor. See also... Figure 16A , Figure 16B , Figure 17A and Figure 17B ,in Figure 16A This is a schematic diagram of the power conversion module according to the sixth embodiment of this disclosure. Figure 16B for Figure 16A The diagram shown is an exploded view of the power conversion module. Figure 17A for Figure 16A The diagram shows another view of the power conversion module. Figure 17B for Figure 17AThe diagram shows an exploded view of the power conversion module. In this embodiment, the power conversion module 2b further includes an adapter board 80, multiple output capacitors Cout, multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84. The adapter board 80 includes a first surface 80a and a second surface 80b, which are disposed opposite to each other. The first surface 80a of the adapter board 80 is disposed on the second surface 20b of the circuit board 20. The second surface 80b of the adapter board 80 includes multiple adapter conductors 85, which are disposed on the system board. The multiple adapter conductors 85 are connected to the central processing unit through through-holes in the system board. In some embodiments, the multiple adapter conductors 85 are composed of pins of a Ball Grid Array (BGA) package. The method by which the power conversion module 2b connects to the central processing unit using the adapter board 80's adapter conductor 85 is very simple, and it results in low parasitic impedance and low conduction loss on the system board, making the power conversion module 2b of this embodiment highly efficient in supplying power to the central processing unit.

[0242] In this embodiment, as Figure 16B As shown, multiple output capacitors Cout, multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84 are disposed on the first surface 80a of the adapter plate 80. Of course, the placement of the output capacitors Cout, positive input pins 81, positive output pins 82, negative output pins 83, and signal pins 84 is not limited to... Figure 16B As shown, the positions can be changed according to actual conditions. The positions of the multiple positive input pins 81 correspond to and are connected to the positions of the multiple positive input conductors 71. The positions of the multiple positive output pins 82 correspond to and are connected to the positions of the multiple positive output conductors 72. The positions of the multiple negative output pins 83 correspond to and are connected to the positions of the multiple negative output conductors 73. The positions of the multiple signal pins 84 correspond to and are connected to the positions of the multiple signal conductors 74.

[0243] Figure 18 This is a side view of the power conversion module according to the seventh embodiment of this disclosure. The structure of the power conversion module 2c in this embodiment is similar to... Figure 16A The power conversion module 2b shown in this embodiment, and the power conversion module 2c of this embodiment, further include at least two first epoxy resins 91, which are located and cured between the second surface 20b of the circuit board 20 and the first surface 80a of the adapter plate 80. Figure 18Taking the example of multiple positive output pins 82 located between the second surface 20b of the circuit board 20 and the first surface 80a of the adapter plate 80, two first epoxy resins 91 are respectively connected to the two outer positive output pins 82. Of course, in actual practice, multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84 are all located between the second surface 20b of the circuit board 20 and the first surface 80a of the adapter plate 80, and the two first epoxy resins 91 are respectively connected to the two outer pins of the multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84. In some embodiments, the number of first epoxy resins 91 may be greater than two, and all of them are connected to the corresponding number of outer pins of the multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84. In this embodiment, the first epoxy adhesive 91 is connected to both the circuit board 20 and the adapter board 80. When the central processing unit on the system board is reflow soldered, the cured first epoxy adhesive 91 is further softened. The viscosity generated by the softening of the first epoxy adhesive 91 forms the solder joint between the pin and the circuit board 20. The viscosity generated by the softening of the first epoxy adhesive 91 also forms the solder joint between the pin and the adapter board 80, thereby preventing the pin from detaching from the circuit board 20 and the adapter board 80.

[0244] Figure 19 This is a side view of the power conversion module according to the eighth embodiment of this disclosure. The structure of the power conversion module 2d in this embodiment is similar to... Figure 18 The power conversion module 2c shown in this embodiment may further include at least two second epoxy adhesives 92. The two second epoxy adhesives 92 are located and cured between the second surface 80b of the adapter plate 80 and the system board B, and multiple adapter conductive parts 85 are located between the two second epoxy adhesives 92. In some embodiments, the number of second epoxy adhesives 92 may be greater than two. In this embodiment, the second epoxy adhesives 92 are simultaneously connected to both the adapter plate 80 and the system board B. When the central processing unit (CPU) on the system board B is reflow soldered, the cured second epoxy adhesives 92 further soften. The viscosity generated by the softening of the second epoxy adhesives 92 forms solder joints between the adapter conductive parts 85 and the adapter plate 80, and also forms solder joints between the adapter conductive parts 85 and the system board B, thus preventing the adapter conductive parts 85 from detaching from the adapter plate 80 and the system board B. Of course, the second epoxy adhesive 92 can also be placed between the system board B and the central processing unit (CPU) to prevent the CPU from detaching from the system board B.

[0245] Figure 20 and Figure 21 This is a side view of the power conversion module according to the ninth embodiment of this disclosure, wherein... Figure 20This is a side view diagram showing the pressure exerted by the transfer conductor receiving system plate and spring. Figure 21 This is a side view of the structure showing the pressure exerted by the copper block receiving system board and spring. The structure of the power conversion module 2e in this embodiment is similar to... Figure 19 The power conversion module 2d shown, in this embodiment, further includes a screw 93, a nut 94, a spring 95, at least one copper block 96, a screw head 97, and a heat dissipation substrate 98. In this embodiment, the adapter board and the circuit board are integrated into a single board structure. Figure 20 and Figure 21 The plate structure is designated by reference numeral 80. A screw 93 passes through the plate structure 80 and the system plate B. A nut 94 is ringed around one end of the screw 93 and contacts the system plate B to fix the screw to the system plate B. A spring 95 and a screw head 97 are located at the other end of the screw 93 to support the weight of the plate structure 80 and the system plate B. A heat dissipation plate 98 is located between the spring 95 and the plate structure 80 to dissipate heat from the plate structure 80. At least one copper block 96 is located between the system plate B and the plate structure 80, adjacent to the transition guide portion 85, wherein the hardness of the copper block 96 is greater than the hardness of the transition guide portion 85. When the pressure from the system plate B and the spring 95 is small enough that the hardness of the transition guide portion 85 can withstand the load, such as... Figure 20 As shown, the transition guide 85 contacts the system plate B and the plate structure 80 to bear pressure. However, when the pressure from the system plate B and the spring 95 is too great and the rigidity of the transition guide 85 cannot withstand it, such as... Figure 21 As shown, the adapter conductor 85 deforms under partial pressure, while the copper block 96 further bears most of the pressure, allowing the copper block 96 to distribute the pressure from the system board B and the spring 95 to a large extent, thus avoiding breakage caused by the deformation of the adapter conductor 85 and resulting in short circuits or open circuits between multiple adapter conductors 85. In this embodiment, the plate structure 80 can also be schematically represented as a power conversion module 12, and the benefits shown in the above embodiment can also be obtained by setting a copper block between the power conversion module and the system board.

[0246] Please see Figure 22 and Figure 23 ,in Figure 22 This is an exploded view of the power conversion module according to the tenth embodiment of this disclosure. Figure 23 for Figure 22 The diagram shows an exploded view of the power conversion module from another perspective. The power conversion module 2f in this embodiment is similar to... Figure 16A , Figure 16B , Figure 17A and Figure 17B The power conversion module 2b shown uses the same component designation to denote similar components, compared to... Figure 16A , Figure 16B , Figure 17A and Figure 17B The power conversion module 2b shown contains five magnetic elements, while the power conversion module 2f in this embodiment contains only four magnetic elements, for example... Figure 23 From left to right, the components are a first magnetic element 41, a second magnetic element 42, a third magnetic element 41, and a fourth magnetic element 42. Furthermore, the power conversion module 2f of this embodiment also includes at least two external inductors 45a. For ease of understanding, Figure 23 The external inductor 45a located on the left side is called the first external inductor 45a. Figure 23 The external inductor 45a located on the right side is referred to as the second external inductor 45a. In this embodiment, the second surface 20b of the circuit board 20 of the power conversion module 2f also includes a plurality of third recessed areas 201b. Each third recessed area 201b is formed by a recess in the second surface 20b of the circuit board 20. Each third recessed area 201b is disposed and connected between two adjacent first recessed areas 20c and is used to accommodate the corresponding external inductor 45a. In this embodiment, the second surface 20b of the circuit board 20 includes four first recessed areas 20c and two third recessed areas 201b. The four first recessed areas 20c are arranged in sequence and are respectively used to accommodate the corresponding magnetic elements among the magnetic elements 41 and 42, so that the first magnetic element 41, the second magnetic element 42, the third magnetic element 41 and the fourth magnetic element 42 are arranged in sequence. The two third recessed areas 201b are respectively used to accommodate the corresponding external inductors 45a. One of the two third recessed areas 201b is located between two adjacent first recessed areas 20c among the four first recessed areas 20c, and the other third recessed area 201b is located between the remaining two adjacent first recessed areas 20c among the four first recessed areas 20c, so that the first external inductor 45a is located between the first magnetic element 41 and the second magnetic element 42, and the second external inductor 45a is located between the third magnetic element 41 and the fourth magnetic element 42.

[0247] Please see Figure 24 and cooperate Figure 22 and Figure 23 ,in Figure 24 for Figure 22 The diagram shows a partial side view of the power conversion module. In this embodiment, the first external inductor 45a and the second external inductor 45a each have multiple solder pads 454a, and the power conversion module 2f also includes multiple solder pads 455a. The solder pads 455a are disposed on the second surface 20b of the circuit board 20 and located on both sides of the third recessed area 201b where the corresponding external inductor 45a is disposed. Each solder pad 454a is connected between the corresponding solder pad 455a and the corresponding external inductor 45a to solder the external inductor 45a to the second surface 20b of the circuit board 20. Figure 24 As shown, a portion of the external inductor 45a is embedded within the third recessed area 201b, while the remaining portion protrudes from the second surface 20b of the circuit board 20. Because a portion of the external inductor 45a is embedded within the circuit board 20, the overall height of the power conversion module 2f in this embodiment is low, and its power density is high. At the location of the adapter plate 80 corresponding to the external inductor 45a, the output capacitor is removed, preventing interference between the external inductor 45a and the output capacitors or pins (e.g., positive output pin 82 or negative output pin 83) on the adapter plate 80. Therefore, this embodiment, by including the external inductor 45a, not only improves the dynamic response speed of the power conversion module 2f but also enhances its integration and power density. In another embodiment, the entire inductor body of the external inductor 45a can be embedded within the third recessed area 201b, with the height protruding from the second surface 20b of the circuit board 20 being 0.

[0248] Please see Figure 25 and cooperate Figure 22 and Figure 23 , Figure 25 for Figure 22 The diagram shows the structure of the magnetic component of the power conversion module. As shown, the first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 are arranged sequentially from left to right. In this embodiment, the first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 of the magnetic component 40d are similar to... Figure 12 The first magnetic element 41, the second magnetic element 42, the third magnetic element 41, and the fourth magnetic element 42 of the magnetic assembly 40a shown will not be described in detail here.

[0249] Compared to Figure 12 The magnetic component 40a shown contains only a single external inductor 45a. The magnetic component 40d in this embodiment contains two external inductors 45a, namely a first external inductor 45a and a second external inductor 45a. Furthermore, the volume of each external inductor 45a in the magnetic component 40d of this embodiment can be less than [a certain value]. Figure 12 The volume of the external inductor 45a of the magnetic component 40a shown is reduced, and two external inductors 45a with smaller volumes can be distributed and integrated inside the magnetic component 40d. For example, the two external inductors 45a with smaller volumes can be placed in a small, unused position within the magnetic component 40d where there are no other components, so that the power conversion module 2f can be miniaturized and made ultra-thin. In this embodiment, as shown... Figure 25As shown, the second winding 45 adopts a two-strand parallel connection or a two-layer planar winding parallel connection. Taking the first channel 47a of the first magnetic element 41 as the input point, it sequentially passes through the first channel 47a of the first magnetic element 41, the first external inductor 45a (forming part of the circuit of the second winding 45), the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the second external inductor 45a (forming part of the circuit of the second winding 45), the first channel 47a of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, and so on. The second channel 47b of the second magnetic element 42, the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41 are wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 is one turn. Of course, the above winding method can be used to continue winding multiple turns, and the second winding 45 can be wound from different input points, not just limited to the first channel 47a of the first magnetic element 41 as the input point. As can be seen from the above, the voltage coupled out by the second winding 45 can be distributed across the first external inductor 45a and the second external inductor 45a, and the second winding 45, the first external inductor 45a, and the second external inductor 45a can form a closed loop. In some embodiments, the second winding 45 can be composed of a single-layer PCB winding or a single strand of wire, or it can be composed of multiple layers of PCB windings connected in parallel or multiple strands of wire connected in parallel.

[0250] The voltage waveform of the second winding 45 in this embodiment is similar to... Figure 10The voltage waveform of the second winding shown is such that the switching frequency of the voltage waveform of the second winding wound on each column of the magnetic element is eight times the switching frequency of the first PWM switching signal PWM1, and the switching period is 1 / (8fsw). Therefore, when the duty cycle of the first PWM switching signal PWM1 is 12.5%, the duty cycle of the voltage waveform of the second winding 45 wound on each column 412 of the magnetic element is 100%. Since the voltage of the second winding 45 is applied to the first external inductor 45a and the second external inductor 45a, and the AC current of the first external inductor 45a and the second external inductor 45a is small, even close to 0, the AC current of the overall power conversion module 2f is small, so that the efficiency of each power conversion circuit is not affected during steady-state operation. When the load driven by the electronic device undergoes a dynamic transition from heavy load to light load, the output voltage of the power conversion module 2f may overshoot. The control component K responds by making the duty cycle of all output PWM switching signals zero, and the lower switching transistor of each switch is turned on, so that the inductor L formed by each first winding and the corresponding side post bears the output voltage. The second winding 45 couples out 16 times the output voltage and applies it to the first external inductor 45a and the second external inductor 45a, causing the current of the first external inductor 45a and the second external inductor 45a to rise sharply, while the current of the second winding 45 drops sharply, thereby greatly suppressing the output voltage overshoot and effectively reducing the output voltage overshoot caused by the dynamic transition of the load. Therefore, the power conversion module 2f of this embodiment can achieve the effect of suppressing the fluctuation range of the output voltage without increasing the number of output capacitors. Thus, the power conversion module 2f of this embodiment can achieve the technical effect of reducing cost and size.

[0251] Of course, the number of magnetic components in the power conversion module 2f of this embodiment is not limited to four, but can also be as follows: Figure 7 The five shown can even be any positive integer, and their functions are similar, so they will not be described again here.

[0252] In some embodiments, the locations of the first external inductor 45a and the second external inductor 45a are not limited to, for example, Figure 25 The settings are shown in the image. Figure 26AThis is a schematic diagram of the structure of the magnetic component of the power conversion module according to the eleventh embodiment of this disclosure. As shown in the figure, the second winding 45 of the magnetic component 40e in this embodiment adopts a two-strand parallel connection or a two-layer planar winding parallel connection. Taking the first channel 47a of the first magnetic element 41 as the input point, the winding sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first channel 47a of the third magnetic element 41, the second external inductor 45a (constituting part of the circuit of the second winding 45), the first channel 47a of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, and the second magnetic... The second channel 47b of component 42, the first external inductor 45a (forming part of the circuit of the second winding 45), the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41 are wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 is one turn. Of course, the above winding method can be used to continue winding multiple turns. The second winding 45 can be composed of a single-layer PCB winding or a single strand of wire, or it can be composed of multiple layers of PCB windings connected in parallel or multiple strands of wire connected in parallel.

[0253] Figure 26BThis is a schematic diagram of the structure of the magnetic component of the power conversion module according to the twelfth embodiment of the present disclosure. As shown in the figure, the second winding 45 of the magnetic component 40f in this embodiment adopts a two-strand parallel connection or a two-layer planar winding parallel connection. Taking the first channel 47a of the first magnetic element 41 as the input point, the winding sequentially passes through the first channel 47a of the first magnetic element 41, the first channel 47a of the second magnetic element 42, the first external inductor 45a (constituting part of the circuit of the second winding 45), the first channel 47a of the third magnetic element 41, the first channel 47a of the fourth magnetic element 42, the fourth side 42d of the fourth magnetic element 42, the second channel 47b of the fourth magnetic element 42, the second channel 47b of the third magnetic element 41, and the second external inductor 45a. The inductor 45a (forming part of the circuit of the second winding 45), the second channel 47b of the second magnetic element 42, the second channel 47b of the first magnetic element 41, and the third side 41c of the first magnetic element 41 are wound around the central post 412 of the first magnetic element 41, the central post 412 of the second magnetic element 42, the central post 412 of the third magnetic element 41, and the central post 412 of the fourth magnetic element 42. The number of turns of the second winding 45 wound on the central post 412 of the first magnetic element 41, the second winding 45 wound on the central post 412 of the second magnetic element 42, the second winding 45 wound on the central post 412 of the third magnetic element 41, and the second winding 45 wound on the central post 412 of the fourth magnetic element 42 is one turn. Of course, the above winding method can be used to continue winding multiple turns. The second winding 45 can be composed of a single-layer PCB winding or a single strand of wire, or it can be composed of multiple layers of PCB windings connected in parallel or multiple strands of wire connected in parallel.

[0254] Of course, the first external inductor 45a and the second external inductor 45a are not limited to the above-mentioned positions, and the number of external inductors 45a is not limited to two. For example, there are four external inductors, two of which are located between the first magnetic element 41 and the second magnetic element 42, and the other two are located between the third magnetic element 41 and the fourth magnetic element 42. The positions and number of external inductors can also be changed according to requirements, which will not be elaborated here.

[0255] Please refer to the previous document. Figure 23 The adapter plate 80 of the power conversion module 2f also includes multiple milled slots 80c, such as, but not limited to, four milled slots 80c. Two milled slots 80c are located on the side wall of the first side of the adapter plate 80, and the other two milled slots 80c are located on the side wall of the second side of the adapter plate 80 opposite to the first side of the adapter plate 80. Each milled slot 80c is formed by the corresponding recess in the side wall of the adapter plate 80. Of course, the position and number of milled slots 80c are not limited to, for example, Figure 23As shown, the configuration can be varied according to requirements. When the adapter board 80 is assembled with the circuit board 20, a portion of the second surface 20b of the circuit board 20, and the positive output pin 82 or negative output pin 83 on the second surface 20b of the circuit board 20, can be exposed via the milled groove 80c. In some embodiments, the power conversion module 2f places a first epoxy resin 91 within the milled groove 80c to connect the adapter board 80 upwards and the circuit board 20 downwards, as well as the positive output pin 82 or negative output pin 83 on its side connection 20b, such as... Figure 27 As shown, the first epoxy adhesive 91 is simultaneously connected to the positive output pin 82 or negative output pin 83 on the circuit board 20, the adapter board 80, and the second side 20b of the circuit board 20. High-temperature curing fixes the circuit board 20, the adapter board 80, and the second side 20b of the circuit board 20 together. When the central processing unit on the system board is reflow soldered, the cured first epoxy adhesive 91 will not soften at high temperatures, thus preventing the solder joints between the circuit board 20 and the adapter board 80 from remelting at high temperatures, causing detachment or displacement, further improving product yield in production.

[0256] Please refer to the previous document. Figure 22 and Figure 23 The power conversion module 2f in this embodiment includes multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, multiple signal pins 84, and multiple adapter conductors 85. The multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84 are all disposed on the first surface 80a of the adapter board 80. The multiple adapter conductors 85 are disposed on the second surface 80b of the adapter board 80, and the second surface 80b of the adapter board 80 is disposed on the system board through the multiple adapter conductors 85, wherein the multiple adapter conductors 85 are connected to the central processing unit through through holes in the system board. The location of the adapter conductors 85 is further described below; please refer to [link to relevant documentation]. Figure 28 and cooperate Figure 22 and Figure 23 ,in Figure 28 for Figure 22 The diagram shows a simplified configuration of the multiple adapter conductors of the power conversion module. Figure 28 The diagram only schematically shows a portion of the adapter conductors 85, and the number of adapter conductors 85 is based on actual needs and is not limited to a certain number. Figure 28 As shown, the multiple adapter conductors 85 can be further divided into output adapter conductors 85a, ground adapter conductors 85b, input adapter conductors 85c, and signal adapter conductors 85d according to their functions. The output adapter conductor 85a connects to the grounding adapter conductor 85d via wiring within the adapter board 80. Figure 22The positive output pin 82 shown is connected to the grounding adapter pin 85b via wiring within the adapter plate 80. Figure 22 The negative output pin 83 shown is connected to the input adapter pin 85c via wiring within the adapter board 80. Figure 22 The positive input pin 81 shown is connected to the signal transfer connector 85d via wiring within the adapter board 80. Figure 22 The signal pin 84 shown is connected. And according to... Figure 28 It can be seen that the signal conversion conductors 85d are all located on one side of the adapter plate 80 (e.g., Figure 28 (As shown within the dashed line on the left), a redundant design for the signal transfer conductor 85d can be achieved. The output transfer conductor 85a and the ground transfer conductor 85b are alternately arranged on the other side of the adapter plate 80 (e.g., Figure 28 (As shown within the dashed line on the right), the output transition conductor 85a and the ground transition conductor 85b can be respectively configured to correspond to the pins of the central processing unit on the system board. This increases the number and area of ​​short circuits between the output transition conductor 85a and the ground transition conductor 85b and the pins of the central processing unit, and reduces the parasitic resistance and inductance of the short circuits, thereby reducing connection losses caused by operating current and improving the output voltage response performance of the power conversion module 2f under dynamic load conditions. The input transition conductor 85c is located between the signal transition conductor 85d and the output transition conductor 85a, and between the signal transition conductor 85d and the ground transition conductor 85b. This reduces the parasitic inductance between the input transition conductor 85c and the ground transition conductor 85b, thereby suppressing the resonance between this parasitic inductance and the input capacitor in the power conversion module 2f.

[0257] Figure 29A This is a schematic diagram of the power conversion module according to the thirteenth embodiment of this disclosure. Figure 29B for Figure 29A The diagram shown is an exploded view of the power conversion module. Figure 30A for Figure 29A The diagram shows another view of the power conversion module. Figure 30B for Figure 30A The diagram shows an exploded view of the power conversion module. The power conversion module 2g in this embodiment is similar to... Figure 22 and Figure 23 The power conversion module 2f shown is compared to Figure 22 and Figure 23The first external inductor 45a and the second external inductor 45a of the power conversion module 2f shown are respectively housed in the third recessed area 201b corresponding to the second surface 20b of the circuit board 20. In this embodiment, the first external inductor 45a and the second external inductor 45a of the power conversion module 2g are disposed on the first surface 20a of the circuit board 20. In this embodiment, the first surface 20a of the circuit board 20 includes a plurality of fourth recessed areas 201a and a plurality of fifth recessed areas 202a. Each fourth recessed area 201a is formed by the recess of the first surface 20a of the circuit board 20 and is arranged in sequence to accommodate the corresponding magnetic element, such that the first magnetic element 41, the second magnetic element 42, the third magnetic element 41 and the fourth magnetic element 42 are arranged in sequence. Each fifth recessed area 202a is formed by the recess of the first surface 20a of the circuit board 20. Each fifth recessed area 202a is disposed and connected between two adjacent fourth recessed areas 201a, and is used to accommodate the corresponding external inductor 45a. In this embodiment, the first surface 20a of the circuit board 20 includes four fourth recessed areas 201a and two fifth recessed areas 202a. One of the five fifth recessed areas 202a is located between two adjacent fourth recessed areas 201a among the four fourth recessed areas 201a, and the other fifth recessed area 202a is located between the remaining two adjacent fourth recessed areas 201a among the four fourth recessed areas 201a. The first external inductor 45a located in one of the fifth recessed areas 202a is located between the first magnetic element 41 and the second magnetic element 42, and the second external inductor 45a located in the other fifth recessed area 202a is located between the third magnetic element 41 and the fourth magnetic element 42. In this embodiment, the external inductor 45a is exposed on the first surface 20a of the circuit board 20, and part of the external inductor 45a is embedded in the fifth recessed area 202a, while the rest of the external inductor 45a protrudes from the first surface 20a of the circuit board 20. The height of the external inductor 45a protruding from the first surface 20a of the circuit board 20 is less than or equal to the height of the corresponding magnetic elements 41 and 42 protruding from the first surface 20a of the circuit board 20. The advantage is that the external inductor 45a can dissipate heat to the external metal substrate through the added thermally conductive medium material, thereby reducing the operating temperature of the external inductor 45a.

[0258] In this embodiment, since each magnetic element 41, 42 contains five magnetic pillars, and the second winding 45 and the external inductor 45a form a closed loop, the output inductance of the step-down power circuit formed by the magnetic elements is low when the magnetic elements are equivalent to the load dynamics. Therefore, the first surface 80a of the adapter plate 80 of the power conversion module 2g in this embodiment may not have any components (e.g., output capacitor Cout or...). Figure 22The multiple pins shown include multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84, as follows: Figure 29B As shown, the power conversion module 2g can maintain a small output voltage fluctuation range under dynamic load conditions. The advantage of having no components on the first surface 80a of the adapter plate 80 is that the height of the power conversion module 2g is significantly reduced, achieving a thinner design and greatly expanding its application scenarios. In this embodiment, since there are no components on the first surface 80a of the adapter plate 80 of the power conversion module 2g, the adapter plate 80 and the circuit board 20 can be fixed and electrically connected in two ways: the first way is that the second surface 20b of the circuit board 20 is directly soldered to the first surface 80a of the adapter plate 80; the second way is to use PCB lamination, drilling, and electroplating to fix and electrically connect the circuit board 20 to the adapter plate 80. The second method will be further described in detail below.

[0259] Please see Figure 31 and Figure 32 and cooperate Figure 29A , Figure 29B , Figure 30A and Figure 30B ,in Figure 31 for Figure 29A The diagram shown is a production flow chart for the power conversion module. Figure 32 for Figure 29A The diagram shows the side structure of the power conversion module's circuit board and adapter board before soldering. According to... Figure 32 It can be seen that circuit board 20 and adapter board 80 can jointly constitute integrated circuit board 90. Adapter board 80 is composed of adapter board substrate 80d and adapter board surface layer 80e. The side of adapter board substrate 80d adjacent to circuit board 20 constitutes the first surface 80a of adapter board 80, and the side of adapter board surface layer 80e away from adapter board substrate 80d constitutes the second surface 80b of adapter board 80 (i.e., the second surface of integrated circuit board). Circuit board 20 is composed of circuit board substrate 20e and circuit board surface layer 20f. The side of circuit board substrate 20e adjacent to adapter board 80 constitutes the second surface 20b of circuit board 20, and the side of circuit board surface layer 20f away from circuit board substrate 20e constitutes the first surface 20a of circuit board 20 (i.e., the first surface of integrated circuit board). According to Figure 31As can be seen, firstly, as shown in step S1, the input capacitor Cin is soldered to the side of the circuit board substrate 20e adjacent to the adapter plate 80 (i.e., the second side 20b of the circuit board 20). Next, as shown in step S2, magnetic components 41 and 42 are assembled onto the circuit board substrate 20e. Next, as shown in step S3, the adapter plate substrate 80d and the circuit board substrate 20e are pressed together, for example, by pressing with an adhesive sheet (prepreg), to achieve a mechanical connection between the adapter plate substrate 80d and the circuit board substrate 20e, forming an integrated substrate 93. Next, as shown in step S4, a plurality of through holes 801a are formed on the integrated substrate 93, wherein the method of forming the plurality of through holes 801a can be, but is not limited to, drilling. Next, as shown in step S5, the plurality of through holes 801a on the integrated substrate 93 are electroplated to achieve an electrical connection between the adapter plate substrate 80d and the circuit board substrate 20e. Specifically, as shown in Figure 29b, the power conversion module 2g's adapter plate 80 has multiple through holes 801a on its first surface 80a. The positions of these through holes are related to... Figure 22 The multiple pins shown are in the same position, including multiple positive input pins 81, multiple positive output pins 82, multiple negative output pins 83, and multiple signal pins 84. Figure 29B The diagram only schematically shows the location, diameter, and number of through holes 801a. The actual location, diameter, and number of through holes 801a are determined based on actual needs and are not limited to specific locations. Figure 29B As shown, in some embodiments, the positions of the plurality of through holes can be changed according to the arrangement positions of the plurality of pins. Next, as shown in step S6, the adapter board surface layer 80e and the circuit board surface layer 20f are pressed onto the integrated substrate 93 to form the integrated circuit board 90, such that the integrated substrate 93 is located between the adapter board surface layer 80e and the circuit board surface layer 20f. Next, as shown in step S7, a plurality of soldering surfaces are formed on the first and second surfaces of the integrated circuit board 90. Next, as shown in step S8, devices are soldered onto the first surface of the integrated circuit board 90. Next, as shown in step S9, the adapter conductor 85 is soldered onto the second surface of the integrated circuit board 90 to form... Figure 29A The power conversion module 2g is shown. This packaging and connection method of the power conversion module 2g effectively integrates the circuit board 90, eliminating the need for two separate soldering connections between the adapter board 80 and the circuit board 20. The problem with two-way soldering connections is that when new solder joints are connected via reflow soldering, old solder joints may remelt, potentially causing the old solder joints to fail. The integrated circuit board 90 significantly improves the reliability of the packaged electrical connections of the power conversion module 2g, and further enhances product reliability when the power conversion module 2g is reflow soldered on the system board.

[0260] Please see Figure 33A , Figure 33B and Figure 34 ,in Figure 33A This is an exploded view of the power conversion module according to the fourteenth embodiment of this disclosure. Figure 33B for Figure 33A The diagram shown is an exploded view of the power conversion module from another perspective. Figure 34 for Figure 33A The diagram shows the structure of the magnetic component of the power conversion module. The power conversion module 2h in this embodiment is similar to... Figure 29A The power conversion module shown is 2g, compared to Figure 29A The power conversion module 2g shown includes two external inductors, while the power conversion module 2h in this embodiment includes only a single external inductor 45a, located on the side of the first magnetic element 41 away from the second magnetic element 42. In this embodiment, the external inductor 45a is composed of two external inductor magnetic covers 451a, two external inductor side posts 452a, one external inductor center post 453a, and a portion of the second winding 45. For example... Figure 33A and Figure 33B As shown, two external inductor magnetic covers 451a are located on the first surface 20a and the second surface 20b of the circuit board 20, respectively. Two external inductor side posts 452a pass through the circuit board 20 and are respectively connected between the two external inductor magnetic covers 451a. An external inductor center post 453a passes through the circuit board 20, is connected between the two external inductor magnetic covers 451a, and is located between the two external inductor side posts 452a. Figure 34 As shown, the second winding 45 wound around the central post 453a of the external inductor has at least one turn, for example, two turns. The winding method of the second winding 45 is similar to the aforementioned winding methods, and therefore will not be described again here. In this embodiment, the external inductor 45a is exposed on the first surface 20a of the circuit board 20, and can dissipate heat to the external metal substrate through an externally added thermally conductive medium, thereby reducing the operating temperature of the external inductor 45a. Furthermore, since the coil of the external inductor 45a is part of the second winding 45, the solder joint connection between the external inductor 45a and the second winding 45 is eliminated, thereby eliminating the conduction loss of the solder joint. This not only significantly improves the efficiency performance of the power conversion module 2h, but also greatly reduces the complexity of the assembly process of the power conversion module 2h.

[0261] The adapter connector 85 in all the above embodiments can also be constructed from the pins of other grid array packages, and is not limited to the pins of ball grid array (BGA) packages, such as... Figure 35In the embodiment shown, all the adapter leads 85 are made of land grid array (LGA) pins. Using LGA instead of BGA can eliminate the height of BGA, thereby further reducing the overall height of the power conversion module and making it easier to achieve a thinner power conversion module.

[0262] Please see Figure 36A , Figure 36B , Figure 37A and Figure 37B ,in Figure 36A This is a schematic diagram of the power conversion module according to the fifteenth embodiment of this disclosure. Figure 36B for Figure 36A The diagram shown is an exploded view of the power conversion module. Figure 37A for Figure 36A The diagram shown is a structural schematic of the power conversion module from another perspective. Figure 37B for Figure 37A The diagram shows an exploded view of the power conversion module. As shown, the power conversion module 2i of this embodiment includes a circuit board 20, an adapter board 80, at least one first element 22, and at least one second element 23. The circuit board 20 has a first surface 20a, a second surface 20b, a first sidewall 21a, a second sidewall 21b, a third sidewall 21c, and a fourth sidewall 21d. The first surface 20a and the second surface 20b of the circuit board 20 are arranged opposite to each other. The first sidewall 21a, the second sidewall 21b, the third sidewall 21c, and the fourth sidewall 21d are respectively located between the first surface 20a and the second surface 20b. The first sidewall 21a and the second sidewall 21b are arranged opposite to each other, and the third sidewall 21c and the fourth sidewall 21d are arranged opposite to each other and located between the first sidewall 21a and the second sidewall 21b. The second surface 20b of the circuit board 20 has at least one recessed area, which can be either one or multiple. Figure 37B As shown, the circuit board 20 has a plurality of (e.g., two) sixth recessed areas 203a and a plurality of (e.g., two) seventh recessed areas 204a. The plurality of sixth recessed areas 203a are formed by recesses in the second surface 20b of the circuit board 20, and each sixth recessed area 203a is partially exposed to the fourth sidewall 21d of the circuit board 20. The extending direction of each sixth recessed area 203a is the same as the direction from the third sidewall 21c of the circuit board 20 toward the fourth sidewall 21d. In other embodiments, the sixth recessed areas 203a are formed by recesses in the second surface 20b of the circuit board 20, and the sixth recessed areas 203a are not exposed to either sidewall of the circuit board 20. Some of the seventh recessed areas 204a are located at the junction of the second surface 20b and the first sidewall 21a of the circuit board 20, and are respectively formed by recesses in the second surface 20b and the first sidewall 21a of the circuit board 20, for example... Figure 37BOne of the seventh recessed areas 204a shown is located at the junction of the second surface 20b and the first sidewall 21a of the circuit board 20, and is formed by the recesses of the second surface 20b and the first sidewall 21a of the circuit board 20. Other seventh recessed areas 204a are located at the junction of the second surface 20b and the second sidewall 21b of the circuit board 20, and are formed by the recesses of the second surface 20b and the second sidewall 21b of the circuit board 20, for example... Figure 37B Another seventh recessed area 204a is provided at the connection between the second surface 20b and the second sidewall 21b of the circuit board 20, and is formed by the recesses of the second surface 20b and the second sidewall 21b of the circuit board 20, respectively. The extension direction of each seventh recessed area 204a is the same as the direction from the third sidewall 21c of the circuit board 20 toward the fourth sidewall 21d.

[0263] The adapter board 80 includes a first surface 80a and a second surface 80b, which are disposed opposite to each other. The first surface 80a of the adapter board 80 is attached to the second surface 20b of the circuit board 20. The first surface 80a of the adapter board 80 includes at least one component placement area 802a with conductive function. Each component placement area 802a is electrically coupled to wiring within the adapter board 80, such as... Figure 36B As shown, the first surface 80a of the adapter board 80 includes multiple component setting areas 802a, which are arranged sequentially in multiple rows, for example... Figure 36B The four arrangement rows shown are the first arrangement row 802b, the second arrangement row 802c, the third arrangement row 802d, and the fourth arrangement row 802e. The arrangement direction of the first arrangement row 802b, the second arrangement row 802c, the third arrangement row 802d, and the fourth arrangement row 802e is the same as the direction from the first sidewall 21a of the circuit board 20 towards the second sidewall 21b. Furthermore, the extension direction of the multiple component placement areas 802a in each arrangement row is the same as the direction from the third sidewall 21c of the circuit board 20 towards the fourth sidewall 21d. When the first surface 80a of the adapter plate 80 is attached to the second surface 20b of the circuit board 20, the components in the first arrangement row 802b... The setting position of setting area 802a corresponds to the setting position of one of the two seventh recessed areas 204a. The setting position of component setting area 802a in the fourth row 802e corresponds to the setting position of the other of the two seventh recessed areas 204a. The setting position of component setting area 802a in the second row 802c corresponds to the setting position of one of the two sixth recessed areas 203a. The setting position of component setting area 802a in the third row 802d corresponds to the setting position of the other of the two sixth recessed areas 203a.

[0264] At least one first element 22 may be, but is not limited to, an input capacitor, and is fixed within the sixth recessed area 203a of the circuit board 20. In some embodiments, the bottom surface of the sixth recessed area 203a further has pads (not shown). Each first element 22 is electrically coupled to wiring within the circuit board 20 via a corresponding pad. The height of each first element 22 is less than or equal to the depth of the sixth recessed area 203a, such that each first element 22 does not protrude from the second surface 20b of the circuit board 20.

[0265] At least one second element 23 may be, but is not limited to, an output capacitor, and each second element 23 is fixed on a corresponding element placement area 802a on the adapter plate 80. Each second element 23 is electrically coupled to wiring in the adapter plate 80 via the corresponding element placement area 802a. When the first surface 80a of the adapter plate 80 is attached to the second surface 20b of the circuit board 20, the second elements 23 disposed on the element placement areas 802a of the first row and the fourth row are housed in the corresponding seventh recessed area 204a, and the second elements 23 disposed on the element placement areas 802a of the second row and the third row are housed in the corresponding sixth recessed area 203a. The height of each second element 23 housed in the sixth recessed area 203a is less than or equal to the depth of the corresponding sixth recessed area 203a, and the height of each second element 23 housed in the seventh recessed area 204a is less than or equal to the depth of the corresponding seventh recessed area 204a. In some embodiments, the first element 22 and the second element 23 may be switching elements or magnetic devices, respectively.

[0266] In this embodiment, the number of first elements 22 is multiple, for example, X. These X first elements 22 can be divided into P first element integrations 221 based on their placement. Each first element integration 221 includes a portion of the multiple first elements 22, for example... Figure 37B Each first element integration 221 shown contains six first elements 22; the number of second elements 23 is multiple, for example, Y, and the Y second elements 23 can be divided into Q second element integrations 231 according to their setting positions. Each second element integration 231 contains a portion of the multiple second elements 23, for example... Figure 36BEach second element integration 231 shown includes four second elements 23. P first element integrations 221 and Q second element integrations 231 are staggered within the sixth recessed region 203a, where X, Y, P, and Q are all positive integers, and X and Y are greater than 1. Further, when multiple first element integrations 221 exist (i.e., P is a positive integer greater than 1), the multiple first element integrations 221 can be spaced apart. The six first elements 22 in each first element integration 221 are arranged sequentially, and the arrangement direction of the six first elements 22 in each first element integration 221 is the same as the direction from the third sidewall 21c of the circuit board 20 towards the fourth sidewall 21d. When multiple second element integrations 231 exist (i.e., Q is a positive integer greater than 1), the multiple second element integrations 231 can be spaced apart. The arrangement direction of the four second elements 23 in each second element integration 231 is the same as the direction from the third sidewall 21c of the circuit board 20 towards the fourth sidewall 21d. Furthermore, each first element integration 221 may contain only one first element 22, and each second element integration 231 may contain only one second element 23. In this case, multiple first elements 22 and multiple second elements 23 are arranged alternately within the sixth recessed region 203a. Since multiple first elements 22 and multiple second elements 23 are arranged alternately within the sixth recessed region 203a in an integrated manner or in a separate manner, the depth of the sixth recessed region 203a must be greater than the height of any one of the first elements 22 and second elements 23. Therefore, the height of the power conversion module 2i is lower, and the overall size of the power conversion module 2i is reduced.

[0267] In this embodiment, the power conversion module 2i further includes multiple magnetic components 40g. Each magnetic component 40g includes a first magnetic cover 413, a second magnetic cover 414, a central post, and four side posts. The first magnetic cover 413 and the second magnetic cover 414 are fastened to the first surface 20a and the second surface 20b of the circuit board 20. The central post and the corresponding four side posts are located between the corresponding first magnetic cover 413 and the second magnetic cover 414, and each central post and the corresponding four side posts pass through the circuit board 20. The side of the second magnetic cover 414 of each magnetic component 40g adjacent to the first sidewall 21a is adjacent to the corresponding first element integration 221, and the other side of the second magnetic cover 414 of each magnetic component 40g adjacent to the second sidewall 21b is adjacent to another corresponding first element integration 221. The magnetic component 40g of this embodiment is similar to the magnetic components of the aforementioned embodiments, and the arrangement positions of the central post and the four side posts of the magnetic component 40g are similar to those of the aforementioned embodiments. Figure 3B The positions of the central column and four side columns of the magnetic component shown are therefore... Figures 36A to 37B Although not shown in the figure, the positions of the central column and four side columns of the magnetic component 40g in this embodiment can be clearly seen.

[0268] The power conversion module 2i also includes multiple switch integrations 311 disposed on the first surface 20a of the circuit board 20. The side of the first magnetic cover 413 of each magnetic component 40g adjacent to the first sidewall 21a is adjacent to the corresponding switch integration 311. The side of the first magnetic cover 413 of each magnetic component 40g adjacent to the second sidewall 21b is adjacent to another corresponding switch integration 311. The positions of the switch integrations 311 adjacent to the first magnetic cover 413 of the magnetic component 40g and the positions of the corresponding first element integrations 221 are located on opposite sides of the circuit board 20 and are interconnected through wiring within the circuit board 20. Therefore, the connection path between the first element integration 221 constituting the input capacitor Cin and the switch integration 311 is shorter, which also reduces the loop inductance between the first element integration 221 constituting the input capacitor Cin and the switch integration 311, thereby reducing the switching loss of the switch integration 311 and improving the overall efficiency of the power conversion module 2i.

[0269] like Figure 37A and Figure 37B As shown, the power conversion module 2i of this embodiment further includes at least one first adapter conductor 851 disposed on the second surface 80b of the adapter board 80. When the second surface 80b of the adapter board 80 is disposed on the system board (not shown), at least one first adapter conductor 851 is connected between the second surface 80b of the adapter board 80 and the system board. The at least one first adapter conductor 851 is connected to the central processing unit located on the system board through a through-hole in the system board. In some embodiments, the at least one first adapter conductor 851 is composed of the pins of a ball grid array (BGA) package. Because the method by which the power conversion module 2i connects to the central processing unit using the first adapter conductor 851 of the adapter board 80 is very simple, and the parasitic impedance on the system board is low with low conduction loss, the power conversion module 2i of this embodiment has high power supply efficiency for the central processing unit. Furthermore, since at least one second element 23 is fixed on the corresponding element placement area 802a on the first surface 80a of the adapter plate 80, and each second element 23 is electrically coupled to the first adapter conductor 851 via the corresponding element placement area 802a and the wiring within the adapter plate 80, the connection path between at least one second element 23 and at least one first adapter conductor 851 is shorter, and the loop inductance between at least one second element 23 and at least one first adapter conductor 851 is reduced, thereby improving the dynamic performance of the overall power conversion module 2i. Of course, the element arrangement within the power conversion module 2i of this embodiment can also be applied to the aforementioned embodiments, and will not be described in detail here.

[0270] Please see Figure 38A , Figure 38B , Figure 39A and Figure 39B ,in Figure 38A This is a schematic diagram of the power conversion module according to the sixteenth embodiment of this disclosure. Figure 38B for Figure 38A The diagram shown is an exploded view of the power conversion module. Figure 39A for Figure 38A The diagram shows another view of the power conversion module. Figure 39B for Figure 39A The diagram shows an exploded view of the power conversion module. As shown, the power conversion module 2j in this embodiment is similar to... Figures 36A to 37B The power conversion module 2i shown is compared to... Figures 36A to 37B The power conversion module 2i shown has multiple first elements 22 and multiple second elements 23 arranged in a component integration manner. In this embodiment, the power conversion module 2j has multiple first elements 22 arranged at intervals in the sixth recessed area 203 of the circuit board 20, and multiple second elements 23 arranged at intervals in the component placement area 802a of the adapter plate 80. When the second surface 20b of the circuit board 20 is attached to the first surface 80a of the adapter plate 80, each first element 22 and its corresponding second element 23 are stacked. Each first element 22 and its corresponding second element 23 are housed within a sixth recessed area 203a or a seventh recessed area 204a of the circuit board 20. The sum of the height of each first element 22 stacked within the sixth recessed area 203a of the circuit board 20 and the height of its corresponding second element 23 is less than or equal to the depth of the sixth recessed area 203a. Similarly, the sum of the height of each first element 22 stacked within the seventh recessed area 204a of the circuit board 20 and the height of its corresponding second element 23 is less than or equal to the depth of the seventh recessed area 204a. Of course, the element arrangement within the power conversion module 2i of this embodiment can also be applied to the aforementioned embodiments, and will not be elaborated further here. In other embodiments, the shape and position of the sixth recessed area 203a, the seventh recessed area 204a of the circuit board 20, and the element placement area 802a of the adapter board 80 can be set according to the design requirements of the power conversion module, and are not limited thereto.

[0271] Please see Figure 40A , Figure 40B , Figure 41A and Figure 41B ,in Figure 40A This is a schematic diagram of the power conversion module according to the seventeenth embodiment of this disclosure. Figure 40B for Figure 40A The diagram shown is an exploded view of the power conversion module. Figure 41A for Figure 40A The diagram shows another view of the power conversion module. Figure 41B for Figure 41AThe diagram shows an exploded view of the power conversion module. As shown, the power conversion module 2k in this embodiment is similar to... Figures 36A to 37B The power conversion module 2i shown in this embodiment, and the power conversion module 2k of this embodiment, further include a protrusion 24 and at least one second adapter conductor 852. The protrusion 24 is formed by protruding from the second surface 20b of the circuit board 20 along the third sidewall 21c of the circuit board 20. The height of the protrusion 24 is equal to the thickness of the adapter plate 80. When the first surface 80a of the adapter plate 80 is disposed on the second surface 20b of the circuit board 20, the top surface of the protrusion 24 is disposed in the same plane as the second surface 80b of the adapter plate 80.

[0272] In this embodiment, at least one second transition conductor 852 of the power conversion module 2k is disposed on the top surface of the protrusion 24. For example, in this embodiment, at least one second transition conductor 852 may correspond to, for example, as shown in the figure below. Figure 35 The signal conversion guide 85d shown is electrically connected to the signal conversion guide 85d through wiring within the adapter board 80; at least one second conversion guide 852 allows the second surface 20b of the circuit board 20 to also be disposed on the system board (not shown) through at least one second conversion guide 852, so that the circuit board 20 and the adapter board 80 of the power conversion module 2k in this embodiment only require a small number of pins to be soldered to achieve the connection relationship between the circuit board 20 and the adapter board 80, and avoids the problem of soldering failure caused by possible bending of the connection between the circuit board 20 and the adapter board 80, which greatly improves the production yield and reliability of the power conversion module 2k. Of course, the setting of the protrusion 24 in this embodiment can also be applied to the aforementioned embodiments, and will not be described again here.

[0273] In summary, in the power conversion module of this disclosure, each first winding of the magnetic component is wound around a corresponding side post, and the second winding is wound around all the middle posts to form a loop. When the load driven by the electronic device constituted by the power conversion module undergoes dynamic switching, switching from a heavy load to a light load, the output voltage of the power conversion module may overshoot. To solve the problem of output voltage overshoot, the control component of the power conversion module responds by making the duty cycle of all output PWM switching signals zero, and the lower switching transistor of each switch is turned on, so that the inductor formed by each first winding and the corresponding side post bears the output voltage, while the second winding couples out a large voltage and applies it to the line of the second winding, causing the current in the line of the second winding to rise significantly, while the current in the first winding drops significantly, thereby greatly suppressing the output voltage overshoot and effectively reducing the output voltage overshoot caused by dynamic load switching. Therefore, the power conversion module of this disclosure can achieve the effect of suppressing the fluctuation range of the output voltage without increasing the number of output capacitors. Thus, the power conversion module of this disclosure can achieve the technical effect of reducing cost and size. Furthermore, this disclosure provides a recessed area on the second surface of the circuit board for placing a first component, and a component placement area on the first surface of the adapter board for placing a second component. When the first surface of the adapter board is attached to the second surface of the circuit board, the second component is housed in the corresponding recessed area, thereby reducing the loop inductance in the power conversion module, reducing the thickness of the power conversion module, and further improving the performance and reducing the size of the power conversion module.

Claims

1. A magnetic component comprising: M magnetic elements, including M central pillars and 2N side pillars, the 2N side pillars surrounding the M central pillars, wherein each magnetic element includes one central pillar and a corresponding number of side pillars; 2N first windings, each first winding wound on a corresponding side post among the 2N side posts, and each first winding having at least one turn on its corresponding side post, where M and N are both integers greater than 1, and the winding direction and DC flux of each first winding on its corresponding side post are the same; and A second winding is wound on all M central posts of all M magnetic elements to form a loop, wherein the second winding is a coupling winding and the second winding has at least one turn on each central post. At least two of the 2N side posts and at least two of the 2N first windings wound on the at least two side posts are located on a first side of the M central posts, and the remaining side posts and the remaining first windings wound on the remaining side posts are located on a second side of the M central posts. The magnetic component includes W pairs of magnetic covers. Each pair of magnetic covers, at least one of the M central pillars, and at least two of the 2N side pillars constitute the corresponding magnetic element. The voltage phase difference between the first winding wound on the side pillar located on the first side of the M central pillars and the first winding wound on the side pillar located on the second side of the M central pillars is a first angle, which is a function of N and W.

2. The magnetic component of claim 1, wherein the second winding is connected to an external inductor or a line parasitic inductance.

3. The magnetic component of claim 1, wherein at least a portion of the second windings wound on the M central posts are connected in series.

4. The magnetic component of claim 1, wherein at least a portion of the second windings wound on the M central posts are connected in parallel.

5. The magnetic component as claimed in claim 1, wherein the DC current flowing through the 2N first windings flows in the same direction.

6. The magnetic component of claim 1, wherein the first angle is 360 / (2N / W) degrees.

7. The magnetic component of claim 1, wherein the voltage phase difference between at least two first windings of at least two side posts on the first side of the M central posts is a second angle, and the voltage phase difference between at least two first windings of the remaining side posts on the second side of the M central posts is the second angle, the second angle being a function of N and W.

8. The magnetic component of claim 7, wherein the second angle is 360 / (N / W) degrees.

9. The magnetic assembly of claim 1, wherein the magnetic assembly comprises W pairs of magnetic covers, each of the W pairs of magnetic covers, at least one of the M central pillars, and at least two of the 2N side pillars constitutes a corresponding magnetic element, and the difference between the sum of the voltage phases on the at least two side pillars of each magnetic element and the sum of the voltage phases on the at least two side pillars of an adjacent magnetic element is 0 degrees or 180 degrees.

10. The magnetic assembly of claim 1, wherein the magnetic assembly comprises W pairs of magnetic covers, each of the W pairs of magnetic covers, one of the M central pillars, and four of the 2N side pillars constitutes a corresponding magnetic element, each magnetic element comprises a first side, a second side, a third side, and a fourth side, the first side and the second side being disposed opposite to each other, the third side and the fourth side being disposed opposite to each other and located between the first side and the second side, the central pillar of each magnetic element being located at the center of the magnetic element, and the four side pillars of each magnetic element comprising a first side pillar, a second side pillar, a third side pillar, and a fourth side pillar, the first side pillar being adjacent to the first side and the third side of the magnetic element, the second side pillar being adjacent to the first side and the fourth side of the magnetic element, the third side pillar being adjacent to the second side and the third side of the magnetic element, and the fourth side pillar being adjacent to the second side and the fourth side of the magnetic element, wherein the fourth side of each magnetic element is disposed opposite to the third side of another adjacent magnetic element.

11. The magnetic assembly of claim 10, wherein the voltage signal of the first winding wound on the first side post of each magnetic element is out of phase by 180 degrees with the voltage signal of the first winding wound on the second side post, the voltage signal of the first winding wound on the first side post of each magnetic element is out of phase by 90 degrees with the voltage signal of the first winding wound on the third side post of each magnetic element, and the voltage signal of the first winding wound on the third side post of each magnetic element is out of phase by 180 degrees with the voltage signal of the first winding wound on the fourth side post.

12. The magnetic assembly of claim 10, wherein each of the magnetic elements has a first channel between the first side post and the second side post and the central post, a second channel between the third side post and the fourth side post and the central post, and a third channel between the central post of each magnetic element and the central post of an adjacent magnetic element.

13. The magnetic assembly of claim 12, wherein the W magnetic cap, the M central posts, and the 2N side posts constitute four magnetic elements, the four magnetic elements comprising a first magnetic element, a second magnetic element, a third magnetic element, and a fourth magnetic element, the first magnetic element, the second magnetic element, the third magnetic element, and the fourth magnetic element arranged in sequence, and the second winding passing through the first channel of the first magnetic element, the first channel of the second magnetic element, the first channel of the third magnetic element, the first channel of the fourth magnetic element, and the first channel of the fourth magnetic element. The four sides, the second channel of the fourth magnetic element, the second channel of the third magnetic element, the second channel of the second magnetic element, the second channel of the first magnetic element, and the third side of the first magnetic element are wound around the four central pillars of the first magnetic element, the second magnetic element, the third magnetic element, and the fourth magnetic element, wherein the number of turns of the second winding wound on the central pillar of the first magnetic element, the second winding on the central pillar of the second magnetic element, the second winding on the central pillar of the third magnetic element, and the second winding on the central pillar of the fourth magnetic element is one turn each.

14. The magnetic assembly of claim 12, wherein the W magnetic cover, the M central posts, and the 2N side posts constitute four magnetic elements, the four magnetic elements comprising a first magnetic element, a second magnetic element, a third magnetic element, and a fourth magnetic element, the first magnetic element, the second magnetic element, the third magnetic element, and the fourth magnetic element arranged sequentially, the second winding passing through the first channel of the first magnetic element, the first channel of the second magnetic element, the first channel of the third magnetic element, the first channel of the fourth magnetic element, the fourth side of the fourth magnetic element, the second channel of the fourth magnetic element, the second channel of the third magnetic element, the second channel of the second magnetic element, the second channel of the first magnetic element, and the second side of the first magnetic element. The first channel of the first magnetic element, the first channel of the second magnetic element, the first channel of the third magnetic element, the first channel of the fourth magnetic element, the fourth side of the fourth magnetic element, the second channel of the fourth magnetic element, the second channel of the third magnetic element, the second channel of the second magnetic element, the second channel of the first magnetic element, and the third side of the first magnetic element are wound around the four central pillars of the first magnetic element, the second magnetic element, the third magnetic element, and the fourth magnetic element, wherein the number of turns of the second winding wound on the central pillar of the first magnetic element, the second winding on the central pillar of the second magnetic element, the second winding on the central pillar of the third magnetic element, and the second winding on the central pillar of the fourth magnetic element are all two.

15. The magnetic assembly of claim 12, wherein the W magnetic cap, the M central posts, and the 2N side posts constitute five magnetic elements, the five magnetic elements comprising a first magnetic element, a second magnetic element, a third magnetic element, a fourth magnetic element, and a fifth magnetic element, the first magnetic element, the second magnetic element, the third magnetic element, the fourth magnetic element, and the fifth magnetic element arranged sequentially, and the second winding passing through the first channel of the first magnetic element, the first channel of the second magnetic element, the first channel of the third magnetic element, and the fourth magnetic element... The first channel, the first channel of the fifth magnetic element, the fourth side of the fifth magnetic element, the second channel of the fifth magnetic element, the second channel of the fourth magnetic element, the second channel of the third magnetic element, the second channel of the second magnetic element, the second channel of the first magnetic element, the third side of the first magnetic element, the first channel of the first magnetic element, the first channel of the second magnetic element, the third channel between the second magnetic element and the third magnetic element, the second channel of the second magnetic element, and the third channel between the first magnetic element and the second magnetic element. The third channel, the first channel of the second magnetic element, the first channel of the third magnetic element, the first channel of the fourth magnetic element, the third channel between the fourth magnetic element and the fifth magnetic element, the second channel of the fourth magnetic element, the third channel between the third magnetic element and the fourth magnetic element, the first channel of the fourth magnetic element, the first channel of the fifth magnetic element, the fourth side of the fifth magnetic element, the second channel of the fifth magnetic element, the second channel of the fourth magnetic element, the second channel of the third magnetic element, and the second magnetic element. The second channel, the second channel of the first magnetic element, and the third side of the first magnetic element are wound around the five central pillars of the first magnetic element, the second magnetic element, the third magnetic element, the fourth magnetic element, and the fifth magnetic element. The number of turns of the second winding wound on the central pillar of the first magnetic element, the second winding wound on the central pillar of the third magnetic element, and the second winding wound on the central pillar of the fifth magnetic element are all two, and the number of turns of the second winding wound on the central pillar of the second magnetic element and the second winding wound on the central pillar of the fourth magnetic element are all three.

16. The magnetic component of claim 1, wherein the direction of the DC magnetic flux on any of the side pillars is opposite to the direction of the DC magnetic flux on the M middle pillars.

17. The magnetic component as claimed in claim 1, wherein the M central pillars and the 2N side pillars are all made of a single magnetic material, the M central pillars are made of ferrite, and the 2N side pillars are made of ferrite.

18. The magnetic component as claimed in claim 1, wherein the M central pillars and the 2N side pillars are all made of a variety of magnetic materials, the M central pillars are made of iron powder, and the 2N side pillars are made of ferrite.

19. The magnetic component of claim 1, wherein the magnetic reluctance of any one of the M central pillars is greater than or equal to twice the magnetic reluctance of any one of the 2N side pillars.

20. A power conversion module, comprising: A circuit board has a first surface and a second surface disposed opposite to each other. The second surface of the circuit board has at least one recessed area. The circuit board also includes a first sidewall, a second sidewall, a third sidewall and a fourth sidewall. The first sidewall, the second sidewall, the third sidewall and the fourth sidewall are all located between the first surface and the second surface of the circuit board. The first sidewall and the second sidewall are disposed opposite to each other. The third sidewall and the fourth sidewall are disposed opposite to each other and are located between the first sidewall and the second sidewall. An adapter board has a first surface and a second surface disposed opposite to each other. The first surface of the adapter board is attached to the second surface of the circuit board. The first surface of the adapter board includes at least one component placement area with conductive function. The placement position of the at least one component placement area corresponds to the placement position of the at least one recessed area. At least one first element is fixed in the at least one recessed area, wherein the height of the at least one first element is less than or equal to the depth of the corresponding at least one recessed area; At least one second element is fixed on the at least one element placement area and accommodated within the corresponding at least one recessed area, wherein the height of the at least one second element is less than or equal to the depth of the corresponding at least one recessed area; and At least one pad is disposed on the bottom surface of the at least one recessed area of ​​the circuit board, wherein the at least one first element is electrically coupled to the circuit board via the at least one pad, wherein the at least one first element is an input capacitor.

21. The power conversion module of claim 20, wherein each of the first elements and the corresponding second elements are stacked in the corresponding recessed region, and the sum of the heights of the stacked first elements and the second elements is less than or equal to the depth of the corresponding recessed region.

22. The power conversion module of claim 21, wherein the power conversion module further comprises a plurality of magnetic components, each magnetic component comprising a first magnetic cover, a second magnetic cover, a central post, and four side posts, the first magnetic cover and the second magnetic cover being respectively fastened to the first surface and the second surface of the circuit board, the central post and the four side posts being located between the corresponding first magnetic cover and second magnetic cover, and the central post and the four side posts passing through the circuit board, wherein... The second magnetic cover of each magnetic component is adjacent to the first sidewall on one side and to the corresponding stacked first element and the second element on the other sidewall, and to the corresponding stacked first element and the second element on the other side of the second magnetic cover of each magnetic component.

23. The power conversion module of claim 22, wherein the power conversion module further comprises a plurality of switch integrations disposed on the first surface of the circuit board, wherein the side of the first magnetic cover of each magnetic component adjacent to the first sidewall is adjacent to the corresponding switch integration, and the side of the first magnetic cover of each magnetic component adjacent to the second sidewall is adjacent to the corresponding other switch integration.

24. The power conversion module of claim 20, wherein the at least one first element is X first elements, the X first elements are divided into P first element integrations according to their setting positions, each of the first element integrations includes a portion of the X first elements; the at least one second element is Y second elements, the Y second elements are divided into Q second element integrations according to their setting positions, each of the second element integrations includes a portion of the Y second elements, the P first element integrations and the Q second element integrations are staggered in the corresponding at least one recessed area, wherein X, Y, P and Q are all positive integers, and X and Y are greater than 1.

25. The power conversion module of claim 24, wherein the P first component integrations are spaced apart, and the portion of the first components in each first component integration are arranged sequentially in the same direction as the direction from a third sidewall of the circuit board to a fourth sidewall; the Q second component integrations are spaced apart, and the portion of the second components in each second component integration are arranged sequentially in the same direction as the direction from the third sidewall of the circuit board to the fourth sidewall.

26. The power conversion module of claim 24, wherein the power conversion module further comprises a plurality of magnetic components, each magnetic component comprising a first magnetic cover, a second magnetic cover, a central post and four side posts, the first magnetic cover and the second magnetic cover being respectively fastened to the first surface and the second surface of the circuit board, the central post and the four side posts being located between the corresponding first magnetic cover and the second magnetic cover, and the central post and the four side posts being inserted through the circuit board, wherein the side of the second magnetic cover of each magnetic component adjacent to the first sidewall is integrated adjacent to the corresponding first element, and the other side of the second magnetic cover of each magnetic component adjacent to the second sidewall is integrated adjacent to the corresponding other first element.

27. The power conversion module of claim 26, wherein the power conversion module further comprises a plurality of switch integrations disposed on the first surface of the circuit board, wherein the side of the first magnetic cover of each magnetic component adjacent to the first sidewall is adjacent to the corresponding switch integration, and the other side of the first magnetic cover of each magnetic component adjacent to the second sidewall is adjacent to another corresponding switch integration.

28. The power conversion module of claim 20, wherein the at least one recessed area is disposed at the connection between the second surface and the first sidewall of the circuit board, and is formed by the indentation of the second surface and the first sidewall of the circuit board, and / or disposed at the connection between the second surface and the second sidewall of the circuit board, and is formed by the indentation of the second surface and the second sidewall of the circuit board, wherein the extending direction of the at least one recessed area is the same as the direction of the third sidewall of the circuit board toward the fourth sidewall.

29. The power conversion module of claim 20, wherein the at least one recessed area is formed by the indentation of the second surface of the circuit board, and the extending direction of the at least one recessed area is the same as the direction of the third sidewall of the circuit board toward the fourth sidewall.

30. The power conversion module of claim 20, wherein a portion of the at least one recessed area is exposed on the fourth sidewall of the circuit board.

31. The power conversion module of claim 20, wherein the power conversion module further comprises at least one first adapter conductor soldered between the second side of the adapter plate and a system board.

32. The power conversion module of claim 31, wherein the power conversion module further comprises a protrusion and at least one second adapter conductor, the protrusion being formed by protruding from the second surface along the third sidewall of the circuit board, wherein the height of the protrusion protruding from the second surface of the circuit board is equal to the thickness of the adapter plate, and when the first surface of the adapter plate is disposed on the second surface of the circuit board, a top surface of the protrusion is coplanar with the second surface of the adapter plate, the at least one second adapter conductor is located on the top surface of the protrusion, and the at least one second adapter conductor is soldered between the top surface of the protrusion and the system board.

33. The power conversion module of claim 20, wherein the at least one second element is an output capacitor.

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