Electronic device with bidirectional dielectric resonator antenna

Abstract

An electronic device is entitled "Electronic Device with Bi-directional Dielectric Resonator Antenna." An electronic device can have a first phase-controlled antenna array that radiates through a display and a second phase-controlled antenna array that radiates through a rear wall. The first array can include a front-facing dielectric resonator antenna, and the second array can include a rear-facing dielectric resonator antenna. The front-facing antenna and the rear-facing antenna can share a dielectric resonator element. A feed probe can excite a first volume of the dielectric resonator element to radiate through the display and can excite a second volume of the dielectric resonator element to radiate through the rear wall. The dielectric resonator element can have a geometry that facilitates isolating the front-facing dielectric resonator antenna from the rear-facing dielectric resonator antenna. The first array and the second array can collectively cover an entire sphere around the device while occupying a minimal amount of volume within the device.

Description

[0001] This patent application claims priority to U.S. Patent Application No. 17 / 235,240, filed April 20, 2021, the entire contents of which are incorporated herein by reference. Background Technology

[0002] This disclosure relates in general to electronic devices, and more specifically to electronic devices having wireless communication circuitry.

[0003] This electronic device typically includes wireless communication circuitry. For example, cellular phones, computers, and other devices often contain antennas and wireless transceivers to support wireless communication. Support for wireless communication in millimeter-wave and centimeter-wave frequency bands may be required. Millimeter-wave communication (sometimes called extremely high frequency (EHF) communication) and centimeter-wave communication involve frequencies approximately 10 GHz to 300 GHz.

[0004] Operating at these frequencies can support high throughput, but can present significant challenges. For example, radio frequency signals at millimeter-wave and centimeter-wave frequencies are characterized by substantial attenuation and / or distortion during signal propagation through various media. Furthermore, antennas can be undesirably large if not carefully designed, and the presence of conductive electronic components can make it difficult to incorporate circuitry for handling millimeter-wave and centimeter-wave communications into the electronic device. Providing satisfactory wireless coverage at these frequencies throughout the entire sphere surrounding the electronic device can also be challenging.

[0005] Therefore, there is a desire to provide improved wireless communication circuits for electronic devices, such as communication circuits that support millimeter and centimeter wave communication. Summary of the Invention

[0006] The electronic device may include wireless circuitry and a housing. The housing may have a peripheral conductive housing structure and a rear wall. A display may be mounted opposite the rear wall to the peripheral conductive housing structure. A front-facing phased antenna array can radiate frequencies greater than 10 GHz through the display. A rear-facing phased antenna array can radiate frequencies greater than 10 GHz through the rear wall.

[0007] The front-facing phased antenna array may include a front-facing dielectric resonator antenna. The rear-facing phased antenna array may include a rear-facing dielectric resonator antenna. The front-facing and rear-facing dielectric resonator antennas may share a dielectric resonant element. The dielectric resonant element may include a dielectric cylinder disposed within an opening in a printed circuit board. The dielectric cylinder may be embedded within a dielectric overmolded component. The dielectric resonant element may be fed using at least a first feed probe for the front-facing dielectric resonator antenna and a second feed probe for the rear-facing dielectric resonator antenna. These antennas may also share feed probes. The first feed probe may excite the volume of the dielectric cylinder between the first feed probe and the display to radiate through the display. The second feed probe may excite the volume of the dielectric cylinder between the second feed probe and the rear wall to radiate through the rear wall.

[0008] The dielectric cylinder may have a geometry that helps isolate the front-facing dielectric resonator antenna from the rear-facing dielectric resonator antenna. For example, the dielectric cylinder may include a notch between a first feed probe and a second feed probe, or the feed probes may be disposed within the notch. The feed probes may, in addition to or alternatively, have a reverse orientation. Additional feed probes may be used to cover additional polarizations. In this way, the device may include a phased antenna array for covering the entire sphere surrounding the device while occupying a minimal volume within the device. Attached Figure Description

[0009] Figure 1 It is a perspective view of an exemplary electronic device based on some implementation schemes.

[0010] Figure 2 It is a schematic diagram of an exemplary circuit in an electronic device according to some implementation schemes.

[0011] Figure 3 It is a schematic diagram of an exemplary wireless circuit based on some implementation schemes.

[0012] Figure 4 This is a diagram illustrating an exemplary phased antenna array based on some implementation schemes.

[0013] Figure 5 It is a cross-sectional side view of an exemplary electronic device having a phased antenna array for radiating through different sides of the electronic device according to some embodiments.

[0014] Figure 6 This is a cross-sectional side view of an exemplary electronic device having both a front-facing dielectric resonator antenna and a rear-facing dielectric resonator antenna, according to some embodiments.

[0015] Figure 7 This is a top view of an exemplary printed circuit with corresponding openings to accommodate each dielectric resonant element in a phased antenna array, according to some implementation schemes.

[0016] Figure 8 This is a top view of an exemplary printed circuit with a single opening accommodating each dielectric resonant element in a phased antenna array, according to some embodiments.

[0017] Figure 9 This is a top view of an exemplary comb-shaped printed circuit for accommodating dielectric resonant elements in a phased antenna array, according to some implementation schemes.

[0018] Figure 10 This is a top view showing how an exemplary dielectric resonant element can be fed using a first feed probe for a front-facing dielectric resonator antenna and a second feed probe for a rear-facing dielectric resonator antenna, according to some embodiments.

[0019] Figure 11 This is a top view illustrating how, according to some embodiments, an exemplary dielectric resonator element can be fed using horizontally and vertically polarized feed probes for a front-facing dielectric resonator antenna and horizontally and vertically polarized feed probes for a rear-facing dielectric resonator antenna.

[0020] Figure 12 This is a cross-sectional side view of an exemplary dielectric resonator element according to some embodiments, having a notch for accommodating a first feed probe for a front-facing dielectric resonator antenna and a second feed probe for a rear-facing dielectric resonator antenna.

[0021] Figure 13 This is a cross-sectional side view of an exemplary dielectric resonator element according to some embodiments, which has a notch that helps to electromagnetically isolate the front-facing dielectric resonator antenna from the rear-facing dielectric resonator antenna.

[0022] Figure 14 It is a cross-sectional side view of a front-facing dielectric resonator antenna and a rear-facing dielectric resonator antenna formed by corresponding dielectric resonator elements mounted on opposite sides of the interposer, according to some implementation schemes. Detailed Implementation

[0023] Electronic devices such as Figure 1The electronic device 10 may be equipped with wireless circuitry including an antenna. This antenna can be used to transmit and / or receive radio frequency signals. The antenna may include a phased antenna array for performing wireless communication and / or spatial ranging operations using millimeter-wave and centimeter-wave signals. Millimeter-wave signals, sometimes referred to as extremely high frequency (EHF) signals, propagate at frequencies above about 30 GHz (e.g., 60 GHz or other frequencies between about 30 GHz and 300 GHz). Centimeter-wave signals propagate at frequencies between about 10 GHz and 30 GHz. If desired, the device 10 may also include an antenna for processing satellite navigation system signals, cellular telephone signals, wireless local area network signals, near-field communication, light-based wireless communication, or other wireless communication.

[0024] Device 10 may be a portable electronic device or other suitable electronic device. For example, device 10 may be a laptop computer, tablet computer, smaller devices (such as wristwatches, wall-mounted devices, headphones, handsets, or other wearable or micro-devices), handheld devices (such as cellular phones), media players, or other small portable devices. Device 10 may also be a set-top box, desktop computer, display with integrated computer or other processing circuitry, display without integrated computer, wireless access point, wireless base station, electronic equipment integrated into a newsstand, building, or vehicle, or other suitable electronic equipment.

[0025] Device 10 may include a housing such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or combinations thereof. In some cases, components of housing 12 may be formed of dielectric or other low-conductivity materials (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12 or at least some of the structures constituting housing 12 may be formed of metallic elements.

[0026] If desired, device 10 may have a display such as display 14. Display 14 may be mounted on the front of device 10. Display 14 may be a capacitive touch electrode or a touchscreen that is not sensitive to touch. The back of housing 12 (i.e., the side of device 10 opposite to the front of device 10) may have a substantially flat housing wall, such as a rear housing wall 12R (e.g., a planar housing wall). The rear housing wall 12R may have a gap that extends completely through the rear housing wall, thus separating portions of housing 12 from each other. The rear housing wall 12R may include conductive and / or dielectric portions. If desired, the rear housing wall 12R may include a planar metal layer covered by a thin layer or dielectric coating such as glass, plastic, sapphire, or ceramic (e.g., a dielectric overlay). Housing 12 may also have shallow grooves that do not extend completely through housing 12. The gaps or grooves may be filled with plastic or other dielectric materials. If necessary, the portions of the housing 12 that are separated from each other (e.g., by means of through slots) can be joined by internal conductive structures (e.g., metal sheets or other metal components bridging the slots).

[0027] The housing 12 may include peripheral housing structures such as peripheral structure 12W. The conductive portions of peripheral structure 12W and the conductive portions of the rear housing wall 12R are sometimes collectively referred to herein as the conductive structure of housing 12. Peripheral structure 12W may extend around the periphery of device 10 and display 14. In a configuration where device 10 and display 14 have a rectangular shape with four edges, peripheral structure 12W may be implemented using a peripheral housing structure having a rectangular ring shape with four corresponding edges and extending from the rear housing wall 12R to the front of device 10 (by way of example). In other words, device 10 may have a length (e.g., measured parallel to the Y-axis), a width less than the length (e.g., measured parallel to the X-axis), and a height less than the width (e.g., measured parallel to the Z-axis). If desired, peripheral structure 12W or a portion thereof may serve as a frame for display 14 (e.g., surrounding all four sides of display 14 and / or decorative embellishments that help hold display 14 to device 10). If necessary, the peripheral structure 12W can form the sidewall structure of the device 10 (e.g., by forming a metal strip with vertical sidewalls, curved sidewalls, etc.).

[0028] The peripheral structure 12W may be formed of a conductive material (such as a metal) and is therefore sometimes referred to as a peripheral conductive shell structure, conductive shell structure, peripheral metal structure, peripheral conductive sidewall, peripheral conductive sidewall structure, conductive shell sidewall, peripheral conductive shell sidewall, sidewall, sidewall structure, or peripheral conductive shell member (by way of example). The peripheral conductive shell structure 12W may be formed of a metal such as stainless steel, aluminum, alloy, or other suitable material. One, two, or more than two separate structures may be used to form the peripheral conductive shell structure 12W.

[0029] The peripheral conductive housing structure 12W does not necessarily have a uniform cross-section. For example, if desired, the top of the peripheral conductive housing structure 12W may have an inwardly projecting flange that helps hold the display 14 in place. The bottom of the peripheral conductive housing structure 12W may also have an enlarged lip (e.g., in the plane of the back of the device 10). The peripheral conductive housing structure 12W may have substantially straight vertical sidewalls, may have curved sidewalls, or may have other suitable shapes. In some configurations (e.g., when the peripheral conductive housing structure 12W is used as the frame of the display 14), the peripheral conductive housing structure 12W may extend around the lip of the housing 12 (i.e., the peripheral conductive housing structure 12W may only cover the edge of the housing 12 surrounding the display 14 and not the remaining sidewalls of the housing 12).

[0030] The rear housing wall 12R may be located in a plane parallel to the display 14. In the configuration of device 10, where some or all of the rear housing wall 12R is formed of metal, it may be necessary to form a portion of the peripheral conductive housing structure 12W as an integrated part of the housing structure forming the rear housing wall 12R. For example, the rear housing wall 12R of device 10 may include a planar metal structure, and a portion of the peripheral conductive housing structure 12W on the side of housing 12 may be formed as a flat or curved vertically extending integrated metal portion of the planar metal structure (e.g., housing structures 12R and 12W may be formed from a continuous sheet of metal in a monolithic configuration). If desired, housing structures such as these housing structures may be machined from a block of metal, and / or may include multiple metal pieces assembled together to form housing 12. The rear housing wall 12R may have one or more, two or more, or three or more parts. The conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R may form one or more outer surfaces of the device 10 (e.g., user-visible surfaces of the device 10), and / or may be implemented using internal structures that do not form outer surfaces of the device 10 (e.g., conductive housing structures not visible to the user of the device 10, such as conductive structures covered with layers (e.g., thin decorative layers, protective coatings, and / or other coatings that may include dielectric materials such as glass, ceramics, and plastics) or other structures that form outer surfaces of the device 10 and / or serve to conceal the conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R from being seen by the user).

[0031] Display 14 may have a pixel array forming an effective area AA, which displays an image of the user of device 10. For example, the effective area AA may include a display pixel array. The pixel array may be formed from liquid crystal display (LCD) components, electrophoretic pixel arrays, plasma display pixel arrays, organic light-emitting diode display pixels or other light-emitting diode pixel arrays, electrowetting display pixel arrays, or display pixels based on other display technologies. If desired, the effective area AA may include a touch sensor, such as a touch sensor capacitive electrode, a force sensor, or other sensors for collecting user input.

[0032] Display 14 may have invalid boundary regions extending along one or more edges of the active region AA. The invalid region IA of display 14 may lack pixels for displaying images and may overlap with circuitry and other internal device structures within housing 12. To prevent these structures from being viewed by the user of device 10, an opaque masking layer may be applied to the underside of the display overlay or to other layers in display 14 that overlap with the invalid region IA. The opaque masking layer may have any suitable color. The invalid region IA may include a recessed area or notch extending into the active region AA (e.g., at speaker port 16). The active region AA may be defined, for example, by a lateral region of the display module of display 14 (e.g., a display module including pixel circuitry, touch sensor circuitry, etc.).

[0033] A display cover can be used to protect the display 14. The display cover may be made of a layer of transparent glass, transparent plastic, transparent ceramic, sapphire, or other transparent crystalline material, or one or more other transparent layers. The display cover may have a planar shape, a convex curved profile, a shape with planar and curved portions, a layout including a planar main area surrounding one or more edges (parts of one or more edges bending outwards from the plane of the planar main area), or other suitable shapes. The display cover may cover the entire front of the device 10. In another suitable arrangement, the display cover may substantially cover all of the front of the device 10 or only a portion of the front of the device 10. Openings may be formed in the display cover. For example, openings may be formed in the display cover to accommodate buttons. Openings may also be formed in the display cover to accommodate ports such as speaker port 16 or microphone port. If desired, openings may be formed in the housing 12 to form communication ports (e.g., audio jack ports, digital data ports, etc.) and / or audio ports for audio components, such as speakers and / or microphones.

[0034] Display 14 may include conductive structures such as capacitive electrode arrays for touch sensors, conductive lines for addressing pixels, driver circuitry, etc. Housing 12 may include internal conductive structures such as metal frame members and planar conductive housing members (sometimes referred to as conductive support plates or back plates) spanning the walls of housing 12 (e.g., a substantially rectangular sheet formed by welding or otherwise connecting one or more metal portions between opposing sides of the peripheral conductive housing structure 12W). The conductive support plate may form the outer rear surface of device 10, or may be covered by a dielectric overlay (such as a thin decorative layer, protective coating, and / or other coatings that may include dielectric materials such as glass, ceramic, or plastic) or other structures that form the outer surface of device 10 and / or serve to conceal the conductive support plate from being seen by the user (e.g., the conductive support plate may form part of the rear housing wall 12R). Device 10 may also include conductive structures such as printed circuit boards, components mounted on the printed circuit boards, and other internal conductive structures. For example, these conductive structures, which may be used to form a ground layer in device 10, may extend under the effective area AA of display 14.

[0035] In regions 22 and 20, openings may be formed within the conductive structures of device 10 (e.g., between the peripheral conductive housing structure 12W and the opposing conductive grounding structure (such as the conductive portion of the rear housing wall 12R, conductive traces on a printed circuit board, conductive electronic components in display 14, etc.)). If desired, these openings, sometimes referred to as gaps, may be filled with air, plastic, and / or other dielectrics and may be used to form slot antenna resonant elements for one or more antennas in device 10.

[0036] The conductive housing structure and other conductive structures in device 10 can be used as a ground plane for the antenna in device 10. The openings in regions 22 and 20 can be used as slots in open or closed slot antennas, as central dielectric regions surrounded by conductive paths of material in loop antennas, as spaces separating antenna resonant elements (such as strip antenna resonant elements or inverted F-shaped antenna resonant elements) from the ground plane, to aid in the performance of parasitic antenna resonant elements, or otherwise as part of the antenna structures formed in regions 22 and 20. If desired, the ground plane under the effective area AA of the display 14 and / or other metallic structures in device 10 may have a portion extending into a portion of the end of device 10 (e.g., the ground portion may extend toward the dielectric-filled openings in regions 22 and 20), thereby narrowing the slots in regions 22 and 20. Region 22 may sometimes be referred to herein as the lower region 22 or lower end 22 of device 10. Region 20 may sometimes be referred herein as the upper region 20 or upper end 20 of device 10.

[0037] Generally, device 10 may include any suitable number of antennas (e.g., one or more, two or more, three or more, four or more, etc.). The antennas in device 10 may be located along one or more edges of the device housing at opposite first and second ends of the elongated device housing (e.g., at...). Figure 1 The device 10 may be located in the lower region 22 and / or the upper region 20, in the center of the device housing, in other suitable locations, or in one or more of these locations. Figure 1 The arrangement is only illustrative.

[0038] A portion of the outer conductive shell structure 12W may be provided with an outer gap structure. For example, the outer conductive shell structure 12W may be provided with one or more dielectric-filled gaps, such as... Figure 1 The gap 18 is shown. Gaps in the peripheral conductive housing structure 12W can be filled using dielectrics such as polymers, ceramics, glass, air, other dielectric materials, or combinations thereof. Gaps 18 divide the peripheral conductive housing structure 12W into one or more peripheral conductive segments. If desired, conductive segments formed in this way can form a portion of an antenna in device 10. Other dielectric openings can be formed in the peripheral conductive housing structure 12W (e.g., dielectric openings other than gap 18) and can serve as dielectric antenna windows for antennas mounted inside device 10. Antennas within device 10 can be aligned with dielectric antenna windows for transmitting radio frequency signals through the peripheral conductive housing structure 12W. Antennas within device 10 can also be aligned with inactive areas IA of display 14 for transmitting radio frequency signals through display 14.

[0039] To provide the end user of device 10 with the largest possible display (e.g., maximizing the area of ​​the device used for displaying media, running applications, etc.), it is desirable to increase the amount of area covered by the effective area AA of display 14 on the front of device 10. Increasing the size of the effective area AA can reduce the size of the ineffective area IA within device 10. This reduces the area behind display 14 available for antennas within device 10. For example, the effective area AA of display 14 may include conductive structures to prevent radio frequency signals processed by an antenna mounted behind the effective area AA from radiating through the front of device 10. Therefore, it is desirable to provide an antenna that occupies a small amount of space within device 10 (e.g., allowing the largest possible effective display area AA) while still allowing the antenna to communicate with wireless equipment outside device 10 with satisfactory efficiency bandwidth.

[0040] In a typical scenario, device 10 may have one or more upper antennas and one or more lower antennas. For example, an upper antenna may be formed in the upper region 20 of device 10. A lower antenna may be formed in the lower region 22 of device 10. If desired, additional antennas may be formed along the edge of the housing 12 extending between region 22 and region 20. Examples of device 10 including three or four upper antennas and five lower antennas are described herein as examples. Antennas may be used individually to cover the same communication band, overlapping communication bands, or separate communication bands. The antenna may be used to implement an antenna diversity scheme or a multiple-input multiple-output (MIMO) antenna scheme. Additional antennas for covering any other desired frequencies may also be mounted within device 10 at any desired location. Figure 1 The examples provided are merely illustrative. If desired, the housing 12 may have other shapes (e.g., square, cylindrical, spherical, combinations of these shapes, and / or different shapes, etc.).

[0041] Figure 2 A schematic diagram of an exemplary component that can be used in device 10 is shown. Figure 2 As shown, device 10 may include control circuitry 28. Control circuitry 28 may include storage circuitry 30, such as a storage repository. Storage circuitry 30 may include hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random access memory), etc.

[0042] Control circuitry 28 may include processing circuitry such as processing circuitry 32. Processing circuitry 32 may be used to control the operation of device 10. Processing circuitry 32 may include one or more microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application-specific integrated circuits, central processing units (CPUs), etc. Control circuitry 28 may be configured to perform operations within device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code used to perform operations within device 10 may be stored on storage circuitry 30 (e.g., storage circuitry 30 may include a non-transitory (tangible) computer-readable storage medium storing the software code). This software code may sometimes be referred to as program instructions, software, data, commands, or code. The software code stored on storage circuitry 30 may be executed by processing circuitry 32.

[0043] Control circuitry 28 can be used to run software on device 10, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interaction with external equipment, control circuitry 28 can be used to implement communication protocols. Communication protocols that can be implemented using control circuitry 28 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol—sometimes referred to as...). Protocols for other short-range wireless communication links, such as This includes protocols such as WPAN protocols, IEEE 802.11ad protocols, cellular phone protocols, MIMO protocols, antenna diversity protocols, satellite navigation system protocols, and antenna-based spatial ranging protocols (e.g., Radio Detection and Ranging (RADAR) protocols or other required distance detection protocols for signals transmitted at millimeter-wave and centimeter-wave frequencies). Each communication protocol may be associated with a corresponding Radio Access Technology (RAT) that specifies the physical connection method used to implement the protocol.

[0044] Device 10 may include input-output circuitry 24. Input-output circuitry 24 may include input-output devices 26. Input-output devices 26 may be used to allow data to be supplied to device 10 and to allow data to be supplied from device 10 to external devices. Input-output devices 26 may include user interface devices, data port devices, sensors, and other input-output components. For example, input-output devices may include touchscreens, displays without touch sensor capabilities, buttons, joysticks, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, speakers, status indicators, light sources, audio jacks, and other audio port components, digital data port devices, light sensors, gyroscopes, accelerometers, or other components capable of detecting motion and device orientation relative to the earth, capacitive sensors, proximity sensors (e.g., capacitive proximity sensors and / or infrared proximity sensors), magnetic sensors, and other sensors and input-output components.

[0045] Input-output circuitry 24 may include wireless circuitry, such as wireless circuitry 34 for wireless transmission of radio frequency signals. Although for clarity... Figure 2 In the example, control circuitry 28 is shown separately from wireless circuitry 34, but wireless circuitry 34 may include processing circuitry forming part of processing circuitry 32 and / or storage circuitry forming part of storage circuitry 30 forming part of control circuitry 28 (e.g., a portion of control circuitry 28 that may be implemented on wireless circuitry 34). For example, control circuitry 28 may include baseband processor circuitry or other control components forming part of wireless circuitry 34.

[0046] Wireless circuit 34 may include millimeter-wave and centimeter-wave transceiver circuitry such as millimeter-wave / centimeter-wave transceiver circuitry 38. Millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication at frequencies between approximately 10 GHz and 300 GHz. For example, millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication in extremely high frequency (EHF) or millimeter-wave communication bands between approximately 30 GHz and 300 GHz and / or in centimeter-wave communication bands (sometimes referred to as ultra-high frequency (SHF) bands) between approximately 10 GHz and 30 GHz. For example, millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication in the following communication bands: the IEEE K communication band between approximately 18 GHz and 27 GHz, the K-band between approximately 26.5 GHz and 40 GHz... a Communication frequency band, between approximately 12 GHz and 18 GHz K u The communication band may include the V communication band between approximately 40 GHz and 75 GHz, the W communication band between approximately 75 GHz and 110 GHz, or any other desired band between approximately 10 GHz and 300 GHz. If desired, the millimeter-wave / centimeter-wave transceiver circuit 38 may support IEEE 802.11ad communication at 60 GHz (e.g., the WiGig or 60 GHz Wi-Fi band between approximately 57 GHz and 61 GHz) and / or the 5G mobile network or 5G wireless system (5G) New Radio (NR) Frequency Range 2 (FR2) communication band between approximately 24 GHz and 90 GHz. The millimeter-wave / centimeter-wave transceiver circuit 38 may be formed from one or more integrated circuits (e.g., multiple integrated circuits mounted on a general-purpose printed circuit board in a system package device, one or more integrated circuits mounted on different substrates, etc.).

[0047] Millimeter-wave / centimeter-wave transceiver circuit 38 (sometimes simply referred to herein as transceiver circuit 38 or millimeter-wave / centimeter-wave circuit 38) can perform spatial ranging operations using radio frequency signals transmitted and received by the millimeter-wave / centimeter-wave transceiver circuit 38 at millimeter-wave and / or centimeter-wave frequencies. The received signal may be a version of the transmitted signal that has been reflected from an external object and returned to device 10. Control circuit 28 can process the transmitted and received signals to detect or estimate the distance between device 10 and one or more external objects around device 10 (e.g., objects outside device 10, such as the body of a user or other person, other equipment, animals, furniture, walls, or other objects or obstacles near device 10). If desired, control circuit 28 can also process the transmitted and received signals to identify the two-dimensional or three-dimensional spatial position of the external object relative to device 10.

[0048] The spatial ranging operation performed by the millimeter-wave / centimeter-wave transceiver circuit 38 is unidirectional. If needed, the millimeter-wave / centimeter-wave transceiver circuit 38 can also communicate bidirectionally with external wireless equipment, such as external wireless equipment 10 (e.g., via a bidirectional millimeter-wave / centimeter-wave wireless communication link). External wireless equipment may include other electronic devices such as electronic device 10, wireless base stations, wireless access points, wireless accessories, or any other desired equipment for transmitting and receiving millimeter-wave / centimeter-wave signals. Bidirectional communication involves the transmission of wireless data by the millimeter-wave / centimeter-wave transceiver circuit 38 and the reception of the transmitted wireless data by the external wireless equipment. Wireless data may include, for example, data encoded into corresponding data packets, such as wireless data associated with telephone calls, streaming media content, internet browsing, wireless data associated with software applications running on device 10, email messages, etc.

[0049] If needed, wireless circuitry 34 may include transceiver circuitry for handling communications at frequencies below 10 GHz, such as non-millimeter-wave / centimeter-wave transceiver circuitry 36. For example, non-millimeter-wave / centimeter-wave transceiver circuitry 36 may handle wireless local area network (WLAN) frequency bands (e.g., (IEEE 802.11) or other WLAN communication bands, such as the 2.4 GHz WLAN band (e.g., 2400 MHz to 2480 MHz), the 5 GHz WLAN band (e.g., 5180 MHz to 5825 MHz), 6E band (e.g., 5925MHz to 7125MHz) and / or others Frequency bands (e.g., 1875MHz to 5160MHz); Wireless Personal Area Network (WPAN) frequency bands such as 2.4GHz Frequency bands or other WPAN communication bands; cellular telephone bands (e.g., bands from about 600 MHz to about 5 GHz, 3G bands, 4G LTE bands, 5G New Radio Frequency Range 1 (FR1) band below 10 GHz, etc.); near-field communication bands (e.g., 13.56 MHz); satellite navigation bands (e.g., GPS bands from 1565 MHz to 1610 MHz, Global Navigation Satellite System (GLONASS) bands, BeiDou Navigation Satellite System (BDS) bands, etc.); ultra-wideband (UWB) bands operating under the IEEE 802.15.4 protocol and / or other ultra-wideband communication protocols; communication bands under the 3GPP wireless communication standard family; communication bands under the IEEE 802.XX standard family; and / or any other desired bands of interest. Communication bands processed by RF transceiver circuitry may be referred to herein as frequency bands or simply "bands" and may span the corresponding frequency range. The non-millimeter-wave / centimeter-wave transceiver circuit 36 ​​and the millimeter-wave / centimeter-wave transceiver circuit 38 may each include one or more integrated circuits, power amplifier circuits, low-noise input amplifiers, passive RF components, switching circuits, transmission line structures, and other circuits for processing RF signals.

[0050] Generally speaking, the transceiver circuitry in wireless circuit 34 can cover (process) any desired frequency band of interest. For example... Figure 2 As shown, wireless circuitry 34 may include antenna 40. Transceiver circuitry may use one or more antennas 40 to transmit radio frequency (RF) signals (e.g., antenna 40 may transmit RF signals for transceiver circuitry). As used herein, the term "transmit RF signals" means the transmission and / or reception of RF signals (e.g., for performing one-way and / or two-way wireless communication with external wireless communication equipment). Antenna 40 may transmit RF signals by radiating them (or through an intermediary device structure such as a dielectric overlay) into free space. Alternatively or additionally, antenna 40 may receive RF signals from free space (e.g., through an intermediary device structure such as a dielectric overlay). The transmission and reception of RF signals by antenna 40 each involve the excitation or resonance of antenna currents on antenna resonant elements in the antenna by RF signals within the antenna's operating frequency band.

[0051] In satellite navigation system links, cellular phone links, and other long-distance links, radio frequency signals are typically used to transmit data over thousands of feet or miles. These signals operate at 2.4 GHz and 5 GHz. Links and In short-range wireless links, radio frequency (RF) signals are typically used to transmit data over distances of tens or hundreds of feet. Millimeter-wave / centimeter-wave transceiver circuitry 38 can transmit RF signals over short distances traveling along a line-of-sight path. To enhance signal reception in millimeter-wave and centimeter-wave communications, phased antenna arrays and beamforming (straightening) techniques can be used (e.g., schemes in which the antenna signal phase and / or amplitude of each antenna in the array is adjusted to perform beam steering). Antenna diversity schemes can also be used to ensure that antennas have begun to be blocked or otherwise degraded, as the operating environment of device 10 can be switched to a state where no antennas are used and higher-performance antennas are employed in their locations.

[0052] The antenna 40 in the wireless circuit 34 can be formed using any suitable antenna type. For example, the antenna 40 may include an antenna with a resonant element, formed from a stacked patch antenna structure, a loop antenna structure, a patch antenna structure, an inverted F-shaped antenna structure, a slot antenna structure, a planar inverted F-shaped antenna structure, a monopole antenna structure, a dipole antenna structure, a helical antenna structure, a Yagi-Uda antenna structure, a mixture of these designs, etc. In another suitable arrangement, the antenna 40 may include an antenna with a dielectric resonant element, such as a dielectric resonant antenna. If desired, one or more antennas 40 may be cavity-backed antennas. Different types of antennas may be used for different frequency bands and combinations of frequency bands. For example, one type of antenna may be used to form a non-millimeter-wave / centimeter-wave wireless link for a non-millimeter-wave / centimeter-wave transceiver circuit 36, while another type of antenna may be used to transmit radio frequency signals at millimeter-wave and / or centimeter-wave frequencies for a millimeter-wave / centimeter-wave transceiver circuit 38. The antenna 40 for transmitting radio frequency signals at millimeter-wave and / or centimeter-wave frequencies may be arranged in one or more phased antenna arrays.

[0053] Figure 3 The diagram shows an antenna 40 that can be formed in a phased antenna array for transmitting radio frequency signals at millimeter-wave and / or centimeter-wave frequencies. Figure 3 As shown, antenna 40 can be coupled to millimeter / centimeter (MM / CM) wave transceiver circuitry 38. Millimeter / centimeter wave and centimeter wave transceiver circuitry 38 can be coupled to antenna feed section 44 of antenna 40 using a transmission line path including radio frequency transmission line 42. Radio frequency transmission line 42 may include a positive signal conductor such as signal conductor 46 and may include a ground conductor such as ground conductor 48. Ground conductor 48 can be coupled to antenna ground of antenna 40 (e.g., at the ground antenna feed terminal of antenna feed section 44 located at antenna ground). Signal conductor 46 can be coupled to antenna resonant element of antenna 40. For example, signal conductor 46 can be coupled to the positive antenna feed terminal of antenna feed section 44 located at antenna resonant element.

[0054] In another suitable arrangement, antenna 40 can be an antenna fed by a feed probe. In this arrangement, antenna feed section 44 can be implemented as a feed probe. Signal conductor 46 can be coupled to the feed probe. RF transmission line 42 can transmit RF signals to and from the feed probe. When RF signals are being transmitted on the feed probe and antenna, the feed probe can excite the resonant element of the antenna (e.g., excite the electromagnetic resonant mode of the dielectric antenna resonant element of antenna 40). The resonant element can radiate RF signals in response to being excited by the feed probe. Similarly, when the antenna receives RF signals (e.g., from free space), the RF signals can excite the resonant element of the antenna (e.g., excite the electromagnetic resonant mode of the dielectric antenna resonant element of antenna 40). This can generate an antenna current on the feed probe, and the corresponding RF signal can be transmitted to the transceiver circuitry via the RF transmission line.

[0055] The RF transmission line 42 may include a stripline transmission line (sometimes simply referred to as a stripline herein), a coaxial cable, a coaxial probe implemented with a metallized via, a microstrip transmission line, an edge-coupled microstrip transmission line, an edge-coupled stripline transmission line, a waveguide structure, or a combination thereof. Various types of transmission lines can be used to form the transmission line path that couples the millimeter-wave / centimeter-wave transceiver circuitry 38 to the antenna feed section 44. If desired, filter circuits, switching circuits, impedance matching circuits, phase shifter circuits, amplifier circuits, and / or other circuits may be inserted onto the RF transmission line 42.

[0056] The radio frequency (RF) transmission lines in device 10 can be integrated into a ceramic substrate, a rigid printed circuit board, and / or a flexible printed circuit. In a suitable arrangement, the RF transmission lines in device 10 can be integrated within a multilayer laminate (e.g., layers of conductive material (such as copper) and dielectric material (such as resin) laminated together without the intervention of an adhesive), which can be folded or bent in multiple dimensions (e.g., two-dimensional or three-dimensional) and retain its bent or folded shape after bending (e.g., the multilayer laminate can be folded into a specific three-dimensional shape to wire around other device components and can be sufficiently rigid to retain its shape after folding without being held in place by reinforcements or other structures). All the multiple layers of the laminate can be laminated together in batches without adhesive (e.g., in a single pressing process) (e.g., in contrast to performing multiple pressing processes to laminate multiple layers together with adhesive).

[0057] Figure 4 This illustrates how an antenna 40 for processing radio frequency signals at millimeter-wave and centimeter-wave frequencies can be formed in a phased antenna array. For example... Figure 4As shown, the phased antenna array 54 (sometimes referred to herein as array 54, antenna array 54, or array 54 of antennas 40) can be coupled to radio frequency transmission line 42. For example, the first antenna 40-1 in the phased antenna array 54 can be coupled to the first radio frequency transmission line 42-1, the second antenna 40-2 in the phased antenna array 54 can be coupled to the second radio frequency transmission line 42-2, the Nth antenna 40-N in the phased antenna array 54 can be coupled to the Nth radio frequency transmission line 42-N, and so on. Although antennas 40 are described herein as forming a phased antenna array, antennas 40 in the phased antenna array 54 can sometimes be referred to as collectively forming a single phased array antenna.

[0058] The antennas 40 in the phased antenna array 54 can be arranged in any desired number of rows and columns or in any other desired pattern (e.g., the antennas do not need to be arranged in a grid pattern with rows and columns). During signal transmission operation, the radio frequency transmission line 42 can be used to transmit signals (e.g., radio frequency signals, such as millimeter wave and / or centimeter wave signals) from the millimeter wave / centimeter wave transceiver circuit 38 ( Figure 3 The signal is supplied to the phased antenna array 54 for wireless transmission. During signal reception operation, the radio frequency transmission line 42 can be used to supply the signal received at the phased antenna array 54 (e.g., received from external wireless equipment, or transmitted signal reflected by an external object) to the millimeter-wave / centimeter-wave transceiver circuitry 38. Figure 3 ).

[0059] Using multiple antennas 40 in a phased antenna array 54 allows for beam steering arrangements by controlling the relative phase and amplitude (vibration) of the radio frequency signals transmitted by the antennas. Figure 4 In the example, each of the antennas 40 has a corresponding radio frequency phase and amplitude controller 50 (e.g., a first phase and amplitude controller 50-1 inserted on radio frequency transmission line 42-1 can control the phase and amplitude of the radio frequency signal processed by antenna 40-1, a second phase and amplitude controller 50-2 inserted on radio frequency transmission line 42-2 can control the phase and amplitude of the radio frequency signal processed by antenna 40-2, and an Nth phase and amplitude controller 50-N inserted on radio frequency transmission line 42-N can control the phase and amplitude of the radio frequency signal processed by antenna 40-N, etc.).

[0060] The phase and amplitude controllers 50 may each include circuitry for adjusting the phase of the radio frequency signal on the radio frequency transmission line 42 (e.g., a phase shifter circuit) and / or circuitry for adjusting the amplitude of the radio frequency signal on the radio frequency transmission line 42 (e.g., a power amplifier and / or low-noise amplifier circuitry). The phase and amplitude controllers 50 may be collectively referred to herein as beam steering circuitry (e.g., beam steering circuitry for steering the beam of the radio frequency signal transmitted and / or received by the phased antenna array 54).

[0061] Phase and amplitude controller 50 can adjust the relative phase and / or amplitude of the transmitted signals supplied to each antenna in phased antenna array 54, and can adjust the relative phase and / or amplitude of the received signals received by phased antenna array 54. If desired, phase and amplitude controller 50 may include phase detection circuitry for detecting the phase of the received signals received by phased antenna array 54. The terms “beam” or “signal beam” may be used herein to uniformly refer to wireless signals transmitted and received by phased antenna array 54 in a particular direction. A signal beam may exhibit a peak gain oriented in a particular pointing direction with a corresponding pointing angle (e.g., based on constructive and destructive interference of the signal combination from each antenna in the phased antenna array). The term “transmit beam” may sometimes be used herein to refer to radio frequency signals transmitted in a particular direction, while the term “receive beam” may sometimes be used herein to refer to radio frequency signals received from a particular direction.

[0062] For example, if the phase and amplitude controller 50 is adjusted to generate a first set of phases and / or amplitudes of the transmitted radio frequency signal, the transmitted signal will form as follows: Figure 4 Beam B1 is a transmit beam oriented in the direction of point A. However, if the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes for the transmitted signal, the transmitted signal will form a transmit beam oriented in the direction of point B, as shown in beam B2. Similarly, if the phase and amplitude controller 50 is adjusted to generate a first set of phases and / or amplitudes, an RF signal can be received from the direction of point A (e.g., an RF signal in the beam), as shown in beam B1. If the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes, an RF signal can be received from the direction of point B, as shown in beam B2.

[0063] Based on Figure 2 The control circuit 28 receives corresponding control signals 52 to control each phase and amplitude controller 50 to generate the desired phase and / or amplitude (e.g., control signal 52-1 can be used to control the phase and / or amplitude provided by phase and amplitude controller 50-1, control signal 52-2 can be used to control the phase and / or amplitude provided by phase and amplitude controller 50-2, etc.). If needed, the control circuit can actively adjust the control signals 52 in real time to steer the transmit or receive beam in different desired directions over time. If needed, the phase and amplitude controller 50 can provide the control circuit 28 with information identifying the phase of the received signal.

[0064] When performing wireless communication using radio frequency signals at millimeter-wave and centimeter-wave frequencies, the radio frequency signals are transmitted along the line-of-sight path between the phased antenna array 54 and the external communication equipment. If an external object is located... Figure 4At point A, the phase and amplitude controller 50 can be adjusted to steer the signal beam toward point A (e.g., to steer the direction of the steerable signal beam toward point A). The phased antenna array 54 can transmit and receive radio frequency signals in the direction of point A. Similarly, if external communication equipment is located at point B, the phase and amplitude controller 50 can be adjusted to steer the signal beam toward point B (e.g., to steer the direction of the steerable signal beam toward point B). The phased antenna array 54 can transmit and receive radio frequency signals in the direction of point B. Figure 4 In the example, for simplicity, beam steering is shown as occurring in a single degree of freedom (e.g., in...). Figure 4 This can be performed on the page facing left and right. However, in practice, it can be performed in two or more degrees of freedom (e.g., entering and leaving the page in three dimensions and in...). Figure 4 The phased antenna array 54 may have a corresponding field of view on which beam steering can be performed (e.g., in a hemispherical or hemispherical segment of the phased antenna array). If desired, the device 10 may include a plurality of phased antenna arrays, each facing a different direction to provide coverage from multiple sides of the device.

[0065] Figure 5 This is a cross-sectional side view of device 10 in an example where device 10 has multiple phased antenna arrays. (See example...) Figure 5 As shown, the peripheral conductive housing structure 12W may extend around the (lateral) periphery of the device 10 and may extend from the rear housing wall 12R to the display 14. The display 14 may have a display module such as a display module 68 (sometimes referred to as a display panel). The display module 68 may include pixel circuitry, touch sensor circuitry, force sensor circuitry, and / or any other desired circuitry for forming the effective area AA of the display 14. The display 14 may include a dielectric overlay, such as a display overlay 56 overlapping the display module 68. The display module 68 may emit image light and may receive sensor input through the display overlay 56. The display overlay 56 and the display 14 may be mounted to the peripheral conductive housing structure 12W. The lateral regions of the display 14 that do not overlap with the display module 68 may form the ineffective area IA of the display 14.

[0066] Device 10 may include multiple phased antenna arrays 54, such as a rear-facing phased antenna array 54-1. Figure 5As shown, the phased antenna array 54-1 can transmit and receive radio frequency signals 60 at millimeter-wave and centimeter-wave frequencies through the rear housing wall 12R. In cases where the rear housing wall 12R includes a metal portion, the radio frequency signal 60 can be transmitted through holes or openings in the metal portion of the rear housing wall 12R, or through other dielectric portions of the rear housing wall 12R. The holes may overlap with a dielectric overlay or dielectric coating extending across a lateral region of the rear housing wall 12R (e.g., between the peripheral conductive housing structures 12W). The phased antenna array 54-1 can perform beam steering for the radio frequency signal 60 across the hemisphere under the device 10, as indicated by arrow 62.

[0067] The phased antenna array 54-1 can be mounted to a substrate such as substrate 64. Substrate 64 can be an integrated circuit chip, flexible printed circuit, rigid printed circuit board, or other substrate. In this document, substrate 64 may sometimes be referred to as antenna module 64. If desired, transceiver circuitry (e.g., Figure 2 The millimeter-wave / centimeter-wave transceiver circuit 38) can be mounted to the antenna module 64. The phased antenna array 54-1 can be adhered to the rear housing wall 12R using adhesive, can be pressed against (e.g., contacted) the rear housing wall 12R, or can be spaced apart from the rear housing wall 12R.

[0068] The field of view of the phased antenna array 54-1 is limited to the hemisphere below the rear of device 10. The display module 68 and other components 58 in device 10 (e.g., Figure 2 The input-output circuitry 24 or control circuitry 28, the battery for device 10, etc., include conductive structures. These conductive structures can, if not carefully managed, prevent the transmission of radio frequency signals by the phased antenna array within device 10 across the hemisphere on the front of device 10. While an additional phased antenna array to cover the hemisphere on the front of device 10 could be mounted against the display overlay 56 within the ineffective area IA, there may not be sufficient space between the lateral periphery of the display module 68 and the peripheral conductive housing structure 12W to form all the circuitry and radio frequency transmission lines necessary to fully support the phased antenna array.

[0069] To mitigate these issues and provide coverage across the front of device 10, a front-facing phased antenna array may be mounted within the peripheral region 66 of device 10. The antennas in the front-facing phased antenna array may include dielectric resonator antennas. The dielectric resonator antennas may be... Figure 5It occupies less area in the XY plane than other types of antennas such as patch antennas and slot antennas. Implementing the antenna as a dielectric resonator antenna allows the radiating element of the front-facing phased antenna array to be fitted within the ineffective region IA between the display module 68 and the peripheral conductive housing structure 12W. Meanwhile, the RF transmission lines and other components of the phased antenna array can be located behind (below) the display module 68. While this document describes an example of a front-facing phased antenna array radiating through the display 14, in another suitable arrangement, the phased antenna array could be a side-facing phased antenna array radiating through one or more holes in the peripheral conductive housing structure 12W.

[0070] To further optimize the space within device 10 while providing wireless coverage across the entire sphere surrounding device 10, the dielectric resonator antennas in the peripheral region 66 may include a front-facing dielectric resonator antenna (e.g., in a front-facing phased antenna array of dielectric resonators) and a rear-facing dielectric resonator antenna (e.g., in a rear-facing phased antenna array of dielectric resonators). The front-facing dielectric resonator antenna transmits radio frequency (RF) signals through the display overlay 56 and within a hemisphere on the front side (display 14) of device 10. The rear-facing dielectric resonator antenna transmits RF signals through the dielectric portion of the rear housing wall 12R and within a hemisphere beneath the rear side (rear housing wall 12R) of device 10. In these examples, device 10 may also include a phased antenna array 54-1 for providing additional coverage within the hemisphere beneath the rear side of device 10, or the phased antenna array 54-1 may be omitted, thereby saving additional space within device 10. To allow front-facing and rear-facing dielectric resonator antennas to cooperate within the peripheral region 66 (e.g., without requiring device 10 to be too thick in the Z dimension), the front-facing dielectric resonator antenna and the rear-facing dielectric resonator antenna can share a dielectric resonator element.

[0071] Figure 6 This is a cross-sectional side view illustrating how a given dielectric resonant element in the peripheral region 66 of device 10 can be used to form a front-facing dielectric resonator antenna and a rear-facing dielectric resonator antenna. Figure 6 As shown, device 10 may include a front-facing phased antenna array with a given front-facing antenna 40F and may include a rear-facing phased antenna array with a given rear-facing antenna 40R (e.g., mounted on...). Figure 5Within the peripheral region 66). The front-facing phased antenna array may include any desired number of front-facing antennas (e.g., a one-dimensional or two-dimensional array of front-facing antennas). The rear-facing phased antenna array may include any desired number of rear-facing antennas (e.g., a one-dimensional or two-dimensional array of rear-facing antennas).

[0072] Antennas 40F and 40R can each be dielectric resonator antennas sharing a single dielectric resonant element 92. The dielectric resonant element 92 can be mounted to a substrate, such as a printed circuit board 74. For example, the printed circuit board 74 can be a rigid printed circuit board or a flexible printed circuit board. The printed circuit board 74 has a lateral region extending along the rear housing wall 12R (e.g., in...). Figure 6 (in the XY plane). The printed circuit 74 can be secured to the rear housing wall 12R and / or the peripheral conductive housing structure 12W using one or more screws (e.g., grounding screws), adhesives, and / or any other desired structure. The millimeter-wave / centimeter-wave transceiver circuitry for the front-facing antenna 40F and the rear-facing antenna 40R can be mounted to the printed circuit 74 or to a different substrate in the device 10 (e.g., the main logic board or another substrate separate from the printed circuit 74).

[0073] The printed circuit 74 may include multiple stacked dielectric layers. These dielectric layers may include polyimide, ceramic, liquid crystal polymer, plastic, and / or any other desired dielectric material. Conductive traces may be patterned onto the top surface of the printed circuit 74, the bottom surface of the printed circuit 74, and / or onto the dielectric layers within the printed circuit 74. Some conductive traces may be maintained at ground potential to form ground traces for the front-facing antenna 40F and the rear-facing antenna 40R (e.g., a portion of the antenna ground). The ground traces may be coupled to a system ground in the device 10 (e.g., using solder, weld, conductive adhesive, conductive tape, conductive bracket, conductive pin, conductive screw, conductive clip, combinations thereof, etc.). For example, the ground traces may be coupled to a conductive portion of the peripheral conductive housing structure 12W, the rear housing wall 12R, or other grounding structures in the device 10.

[0074] The printed circuit 74 may include one or more openings, such as opening 76. A dielectric resonant element 92 may be mounted within opening 76 (e.g., the dielectric resonant element 92 may protrude through opening 76). The front-facing antenna 40F may be fed using one or more radio frequency (RF) transmission lines formed on and / or embedded in the printed circuit 74. The rear-facing antenna 40R may also be fed using one or more RF transmission lines formed on and / or embedded in the printed circuit 74. The RF transmission lines have a ground conductor including a ground trace on the printed circuit 74 (e.g., Figure 3The grounding conductor 48). The radio frequency transmission line may also have signal conductors including some conductive traces on the printed circuit 74 (e.g., grounding conductor 48). Figure 3 (Signal conductor 46).

[0075] The dielectric resonant element 92 may be formed from a cylinder (pillar) of dielectric material mounted into an opening 76 in the printed circuit 74. The dielectric resonant element 92 may be embedded within a dielectric substrate, such as a dielectric overmolded member 86 (e.g., laterally surrounded by the dielectric substrate). Although for clarity... Figure 6 The diagram shows a non-zero gap between the dielectric overmolded component 86 and the circuit board 74, but the dielectric overmolded component 86 can completely fill the opening 76 if needed. The dielectric overmolded component 86 can facilitate securing the dielectric resonant element 92 to the printed circuit 74. If needed, the dielectric overmolded component 86 can facilitate securing the dielectric resonant element 86 to the peripheral conductive housing structure 12W.

[0076] The dielectric resonant element 92 may have a first (bottom) surface 82 facing the rear housing wall 12R. The rear housing wall 12R may include a conductive material. Slits such as slit 70 may be formed in the conductive material of the rear housing wall 12R at a location overlapping with the dielectric resonant element 92. Dielectric antenna windows such as dielectric antenna window 72 may be mounted to the rear housing wall 12R and may cover slit 70. Alternatively or additionally, a dielectric overlay may cover the entire rear surface of the device 10 (rear housing wall 12R). Slit 70 may also be referred to herein as opening 70 or antenna window 70.

[0077] The dielectric resonant element 92 may have a second (top) surface 84 located at the display 14. The top surface 84 may be laterally inserted between the display module 68 and the peripheral conductive housing structure 12W (e.g., a portion of the dielectric resonant element 92 may be located within a gap 96 between the display module 68 and the peripheral conductive housing structure 12W, which forms part of an inactive area of ​​the display 14). The dielectric resonant element 92 may have a vertical sidewall 94 extending from the top surface 84 to the bottom surface 82. The dielectric resonant element 92 may have a longitudinal axis 98 (e.g., parallel to the Z-axis) extending through the center of the top surface 84 and the bottom surface 82. The longitudinal axis 98 may be, for example, the longest rectangular dimension of the dielectric resonant element 92. The dielectric resonant element 92 may have a height (measured parallel to the longitudinal axis 98) from the top surface 84 to the bottom surface 82. The dielectric resonant element 92 may also have a length (measured parallel to the X-axis) and a width (measured parallel to the Y-axis), each less than the height of the dielectric resonant element 92.

[0078] The dielectric resonant element 92 may have a central axis 100 passing through the longitudinal axis 98 and dividing (e.g., equally) the height of the dielectric resonant element 92. The central axis 100 is oriented orthogonally to the longitudinal axis 98. The central axis 100 does not need to equally divide the height of the dielectric resonant element 92. The central axis 100 can separate the portion of the dielectric resonant element 92 used to form the front-facing antenna 40F from the portion of the dielectric resonant element 92 used to form the rear-facing antenna 40R. The operating (resonant) frequency of the front-facing antenna 40F can be selected by adjusting the dimensions of the dielectric resonant element 92 above the central axis 100. Similarly, the operating (resonant) frequency of the rear-facing antenna 40R can be selected by adjusting the dimensions of the dielectric resonant element 92 below the central axis 100. The geometry of the dielectric resonator 92 below the central axis 100 can also have a certain influence on the operating frequency of the antenna 40F facing forward, and / or the geometry of the dielectric resonator 92 above the central axis 100 can also have a certain influence on the operating frequency of the antenna 40R facing rearward.

[0079] The dielectric resonant element 92 can be made of a material having a first dielectric constant ε r1 The dielectric material is formed into a cylinder. The dielectric constant ε r1 The dielectric resonant element 92 can be relatively high (e.g., greater than 10.0, greater than 12.0, greater than 15.0, greater than 20.0, between 15.0 and 40.0, between 10.0 and 50.0, between 18.0 and 30.0, between 12.0 and 45.0, etc.). In a suitable arrangement, the dielectric resonant element 92 can be formed of zirconium oxide or ceramic material. If desired, other dielectric materials can be used to form the dielectric resonant element 92.

[0080] Dielectric-coated molded part 86 can be made of a material having a dielectric constant ε r2 The material is formed from this. Dielectric constant ε r2 The dielectric constant ε of the dielectric resonator element 92 can be less than that of the dielectric resonator element. r1 (For example, less than 18.0, less than 15.0, less than 10.0, between 3.0 and 4.0, less than 5.0, between 2.0 and 5.0, etc.). Dielectric constant ε r2 Comparable dielectric constant ε r1Smallest values ​​are at least 10.0, 5.0, 15.0, 12.0, 6.0, etc. In a suitable arrangement, the dielectric overmolded part 86 may be formed from molded plastic (e.g., injection molded plastic). Other dielectric materials may be used to form the dielectric overmolded part 86, or the dielectric overmolded part 86 may be omitted if desired. The difference in dielectric constant between the dielectric resonant element 92 and the dielectric overmolded part 86 can help establish radio frequency boundary conditions from the bottom surface 82 to the top surface 84 between the dielectric resonant element 92 and the dielectric overmolded part 86. This allows the dielectric resonant element 92 to be configured as a waveguide for propagating radio frequency signals at millimeter-wave and centimeter-wave frequencies.

[0081] When excited by the signal conductor of the RF transmission line in the printed circuit 74, the dielectric resonant element 92 can radiate an RF signal. The antenna formed by the dielectric resonant element 92 can be fed using an RF feed probe such as feed probe 78. Feed probe 78 can form antenna feed sections for the front-facing antenna 40F and the rear-facing antenna 40R (e.g., Figure 3 The antenna 40F is part of the antenna feed section 44. The front-facing antenna 40F can be fed using at least one of the feed probes 78. The rear-facing antenna 40R can also be fed using at least one of the feed probes 78. If necessary, antennas 40F and 40R can be fed using different (independent) feed probes 78.

[0082] like Figure 6 As shown, each feed probe 78 may include a corresponding feed conductor 102. At least a portion of the feed conductor 102 (e.g., a patch-shaped portion of the feed conductor 102) may contact the sidewall 94 of the dielectric resonant element 92. The feed conductor 102 may be formed from a stamped sheet of metal that is folded and pressed against the sidewall 94 (e.g., by a bias structure and / or by a dielectric overmolding 86). In another embodiment, the feed conductor 102 may be formed from conductive traces directly patterned onto the sidewall 94 (e.g., using a sputtering process, a laser direct structuring process, or other conductive deposition techniques). A portion of the feed conductor 102 may be coupled to signal traces on the printed circuit 74 using a conductive interconnect structure 80. The conductive interconnect structure 80 may include solder, weld, conductive adhesive, conductive tape, conductive foam, conductive spring, conductive support, and / or any other desired conductive interconnect structure.

[0083] The signal traces in the printed circuit 74 can transmit radio frequency (RF) signals to and from the feed probe 78. The feed probe 78 can electromagnetically couple the RF signals on the signal traces to the dielectric resonator 92. The feed probe 78, used for the front-facing antenna 40F, can couple RF signals to the dielectric resonator 92, which excite one or more electromagnetic modes (e.g., RF cavity or waveguide modes around the central axis 100 and between the central axis 100 and the top surface 84) of the dielectric resonator 92. When the feed probe 78 used for the front-facing antenna 40F is excited, these electromagnetic modes of the dielectric resonator 92 can configure the dielectric resonator 92 to function as a waveguide along the length of the dielectric resonator 92 (e.g., at...). Figure 6 The wavefront of the radio frequency signal 88 propagates along the Z-axis direction through the top surface 84 and through the display 14.

[0084] For example, during signal transmission, the feed probe 78 for the front-facing antenna 40F can couple the radio frequency (RF) signal on the signal trace to the dielectric resonator 92. This can be used to excite one or more electromagnetic modes of the volume of the dielectric resonator 92 located around the central axis 100 and the top surface 84, causing the RF signal 88 to propagate upwards along the length of the dielectric resonator 92 and through the display overlay 56 to the outside of the device 10. Similarly, during signal reception, the RF signal 88 can be received through the display overlay 56. The received RF signal can excite the electromagnetic modes of the dielectric resonator 92 located between the top surface 84 and the central axis 100, causing the RF signal to propagate downwards along the length of the dielectric resonator 92. The feed probe 78 for the front-facing antenna 40F can couple the received RF signal to a corresponding RF transmission line on the printed circuit 74, which transmits the RF signal to the millimeter-wave / centimeter-wave transceiver circuitry in the device 10.

[0085] Similarly, the feed probe 78 for the rear-facing antenna 40R can couple radio frequency (RF) signals into the dielectric resonator 92, which excites one or more electromagnetic modes (e.g., RF cavity or waveguide modes around the central axis 100 and between the central axis 100 and the bottom surface 82) of the dielectric resonator 92. When the feed probe 78 is used to excite the rear-facing antenna 40R, these electromagnetic modes of the dielectric resonator 92 can configure the dielectric resonator 92 to function as a waveguide along the length of the dielectric resonator 92 (e.g., in...). Figure 6 The wavefront of the radio frequency signal 90 propagating in the Z-axis direction passes through the bottom surface 82 and through the dielectric antenna window 72.

[0086] For example, during signal transmission, the feed probe 78 for the rear-facing antenna 40R can couple the radio frequency (RF) signal on the signal trace to the dielectric resonator 92. This can be used to excite one or more electromagnetic modes of the volume of the dielectric resonator 92 located around the central axis 100 and the bottom surface 82, causing the RF signal 90 to propagate downwards along the length of the dielectric resonator 92 and through the dielectric antenna window 72 and slit 70 to the outside of the device 10. Similarly, during signal reception, the RF signal 90 can be received through the antenna window 72 and slit 70. The received RF signal can excite the electromagnetic modes of the dielectric resonator 92 located around the bottom surface 82 and the central axis 100, causing the RF signal to propagate upwards along the length of the dielectric resonator 92. The feed probe 78 for the rear-facing antenna 40R can couple the received RF signal to a corresponding RF transmission line on the printed circuit 74, which transmits the RF signal to the millimeter-wave / centimeter-wave transceiver circuitry in the device 10. The relatively large difference in dielectric constant between the dielectric resonator 92 and the dielectric overlay 86 allows the dielectric resonator 92 to transmit radio frequency signals 88 and 90 with relatively high antenna efficiency (e.g., by establishing a strong boundary for the radio frequency signals between the dielectric resonator 92 and the dielectric overlay 86). The relatively high dielectric constant of the dielectric resonator 92 also allows it to occupy a relatively small volume compared to using materials with lower dielectric constants.

[0087] The size of the feed probe 78 can be selected to facilitate matching the impedance of the RF transmission lines in the printed circuit 74 with the impedance of the dielectric resonant element 92. Each feed probe 78 can be located on a corresponding sidewall 94 of the dielectric resonant element 92 to provide the desired linear polarization (e.g., vertical or horizontal polarization) to the antennas 40F and 40R. If desired, multiple feed probes 78 can be formed on multiple sidewalls 94 of the dielectric resonant element 92 to configure the antennas 40F and 40R to simultaneously cover multiple orthogonal linear polarizations. If desired, the phase of each feed probe can be adjusted independently over time to provide additional polarization to the antenna, such as elliptical or circular polarization. The feed probe 78 may be referred to herein as feed conductor 78, feed patch 78, or probe feed section 78. The dielectric resonant element 92 may be referred herein as dielectric radiating element, dielectric radiator, dielectric resonator, dielectric antenna resonant element, dielectric column, dielectric pillar, radiating element, or resonant element.

[0088] In this way, the dielectric resonant element 92 can be used to form both the front-facing antenna 40F and the rear-facing antenna 40R of the front-facing phased antenna array in device 10. If desired, the printed circuit 74 may include a corresponding opening 76 for each dielectric resonant element 92. Figure 7 This is a top view showing an example of how the printed circuit 74 may include a corresponding opening 76 for each dielectric resonant element 92 in the front-facing phased antenna array and the rear-facing phased antenna array.

[0089] exist Figure 7 In the example, the front-facing phased antenna array and the rear-facing phased antenna array each include three antennas. These three antennas are formed by three dielectric resonant elements 92-1, 92-2, and 92-3 arranged in a one-dimensional array pattern (e.g., dielectric resonant element 92-1 can form a first front-facing antenna and a first rear-facing antenna, dielectric resonant element 92-2 can form a second front-facing antenna and a second rear-facing antenna, etc.). Figure 7 As shown, the printed circuit 74 may completely surround (enclose) the corresponding opening 76 for each dielectric resonant element 92 (e.g., dielectric resonant element 92-1 may be mounted within opening 76-1, dielectric resonant element 92-2 may be mounted within opening 76-2, etc.). In other words, the opening 76 may be a closed slit within the printed circuit 74.

[0090] Figure 7 The example provided is merely illustrative. If desired, each dielectric resonant element may be located within the same opening 76, such as... Figure 8 As shown in the example. In another embodiment, each opening 76 may be an opening slit in the printed circuit 74, such as... Figure 9 As shown in the example. Figure 9 As shown, the printed circuit 74 may surround some, but not all, of the openings 76-1, 76-2, and 76-3. In other words, the printed circuit 74 may be a comb-shaped PCB, wherein the openings 76-1, 76-2, and 76-3 are formed by notches in a given edge of the printed circuit 74. Figures 7 to 9 The examples are merely illustrative. The printed circuit 74 may surround any desired number of openings 76. The front-facing phased antenna array and the rear-facing phased antenna array may include any desired number of antennas formed using any desired number of dielectric resonant elements arranged in any desired array pattern.

[0091] Figure 10 This is a top-down view of a given dielectric resonant element 92 (e.g., as shown in...). Figure 6(Cut off in the -Z direction), this view shows how different feed probes 78 can be used to feed the front-facing antenna 40F and the rear-facing antenna 40R, respectively. Figure 10 In the example, for clarity, printed circuit 74 and dielectric overmolded part 86 have been omitted.

[0092] like Figure 10 As shown, the dielectric resonant element 92 can be fed by a first feed probe 78 (such as for a front-facing antenna, e.g., Figure 6 The antenna 40F is fed by a feed probe 78F, and can be fed by a second feed probe (such as for a rear-facing antenna). Figure 6 The antenna 40R is fed by a feed probe 78R. Feed probe 78F may include a feed conductor 102 contacting the first sidewall 94, and feed probe 78R may include a second feed conductor 102 contacting the second sidewall of the dielectric resonant element 92. Feed probes 78F and 78R each may include a feed conductor 102 contacting the second sidewall of the dielectric resonant element 92 via… Figure 6 The conductive interconnect structure 80 is coupled to the corresponding conductive portion 104 (e.g., conductive trace) of the corresponding signal conductor in the printed circuit 74.

[0093] exist Figure 10 In the example, feed probes 78F and 78R are coupled to opposite sidewalls 94 of the dielectric resonant element 92. Therefore, Figure 10 Feed probes 78F and 78R can use the same linear polarization to transmit radio frequency signals. In another embodiment, feed probes 78R and 78F can be coupled to the orthogonal sidewall 94 of the dielectric resonator 92. In yet another embodiment, feed probes 78R and 78F can be coupled to the same sidewall 94 of the dielectric resonator 92. If desired, front-facing and rear-facing antennas can use orthogonal linear polarization to transmit radio frequency signals.

[0094] Figure 11 This is a top-down view of the dielectric resonator 92 in an example where the front-facing antenna and the rear-facing antenna each use orthogonal linear polarization to transmit radio frequency signals. (See image.) Figure 11As shown, the front-facing antenna can be fed using feed probes 78FH and 78FV, while the rear-facing antenna is fed using feed probes 78RV and 78RH. Feed probes 78FH and 78FV can be mounted to the orthogonal sidewalls 94 of the dielectric resonator 92. Feed probes 78RV and 78FV can be mounted to the opposite sidewalls 94 of the dielectric resonator 92. Feed probes 78RH and 78FH can be mounted to the opposite sidewalls 94 of the dielectric resonator 92. Feed probes 78RV and 78RH can be mounted to the orthogonal sidewalls 94 of the dielectric resonator 92. In this manner, feed probe 78FV can transmit vertically polarized RF signals to the front-facing antenna, feed probe 78RV can transmit vertically polarized RF signals to the rear-facing antenna, feed probe 78FH can transmit horizontally polarized RF signals to the front-facing antenna, and feed probe 78RH can transmit horizontally polarized RF signals to the rear-facing antenna. Figure 11 The examples are for illustrative purposes only. If needed, feed probe 78RV may be coupled to the same sidewall 94 as feed probe 78FV, and / or feed probe 78RH may be coupled to the same sidewall 94 as feed probe 78FH.

[0095] Figure 12 This is a cross-sectional side view illustrating an example of how feed probes 78F and 78R can feed corresponding portions of the dielectric resonant element 92 (e.g., for the front-facing antenna 40F and the rear-facing antenna 40R, respectively). Figure 12 As shown, the feed probe 78F for the front-facing antenna 40F can contact the first sidewall 94 of the dielectric resonator 92. The feed probe 78R for the rear-facing antenna 40R can contact the second sidewall of the dielectric resonator 92 opposite to the first sidewall 94. In cases where antennas 40F and 40R cover multiple polarizations, the feed probes 78F and 78R can be used to form... Figure 11 The feed probes 78FH and 78RH, or can be used to form Figure 11 The feed probes are 78FV and 78FV.

[0096] If desired, a notch such as notch 110 may be formed in or around the central axis 100 in the sidewall 94. The geometry of notch 110 may help isolate the electromagnetic modes of the dielectric resonator 92 used to propagate the radio frequency signal 88 for the front-facing antenna 40F from the electromagnetic modes of the dielectric resonator 92 used to propagate the radio frequency signal 90 for the rear-facing antenna 40R. If desired, feed probes 78F and 78R may each be coupled to the dielectric resonator 92 within notch 110 (e.g., feed probes 78F and 78R may be mounted within notch 110).

[0097] To further isolate the front-facing antenna 40F from the rear-facing antenna 40R, the feed probes 78F and 78R can be mounted to the dielectric resonator 92 in opposite orientations (e.g., reversed or flipped). Figure 12 In the example, the feed conductor 102 of the feed probe 78F is an L-shaped feed conductor having a first portion 106 in contact with the dielectric resonant element 92 and a second portion 108 extending away from the first portion 106. The second portion 108 can be coupled to a given conductive interconnect structure 80 on the printed circuit 74. Figure 6 Similarly, the feed conductor 102 of the feed probe 78R is an L-shaped feed conductor having a first portion 106 in contact with the dielectric resonant element 92 and a second portion 108 extending away from the first portion 106. Figure 12 The feed conductor 102 can be formed, for example, from a sheet of metal folded into an L-shape. Because the feed probes 78F and 78R have opposite orientations, the second portions 108 of feed probe 78F and 78R are located on opposite sides of the central axis 100. This allows feed probe 78R to more easily excite the electromagnetic mode of the dielectric resonator 92 located between the central axis 100 and the bottom surface 82 (for propagating the radio frequency signal 90), and feed probe 78F to more easily excite the electromagnetic mode of the dielectric resonator 92 located between the central axis 100 and the top surface 84 (for propagating the radio frequency signal 88), thereby facilitating the isolation of the front-facing antenna 40F from the rear-facing antenna 40R.

[0098] Figure 12 The examples provided are merely illustrative. Feed conductor 102 may have other shapes (e.g., it may be folded into a T-shape or other shape instead of an L-shape). If desired, more (e.g., all) of the feed probes 78R compared to feed probe 78F may be positioned below the central axis 100, and more (e.g., all) of the feed probes 78F compared to feed probe 78R may be positioned above the central axis 100. In embodiments where feed probes 78F and 78R comprise conductive material directly patterned onto the dielectric resonant element 92, the point on feed conductor 102 closest to the bottom surface 82 of feed probe 78F may be coupled to printed circuit 74, while the point on feed conductor 102 closest to the top surface 84 of feed probe 78R may be coupled to printed circuit 74. Recess 110 may have other shapes, these other shapes having edges following any path having any desired number of curved and / or straight segments. Feed probes 78F and 78R may be coupled to sidewall 94 outside recess 110. If needed, the feed probes 78F and 78R can be coupled to the same sidewall 94 of the dielectric resonant element 92 (e.g., within the notch 110 or on the opposite side of the notch 110).

[0099] Figure 13 This is a cross-sectional side view illustrating an example of how feed probes 78F and 78R can be coupled to the same sidewall 94 of the dielectric resonant element 92. Figure 13 As shown, feed probes 78F and 78R can be coupled to the same sidewall 94 of dielectric resonator 92. If desired, feed probes 78F and 78R can have an opposing orientation around central axis 100 to help isolate the front-facing electromagnetic mode of the dielectric resonator from the rear-facing electromagnetic mode. When oriented in this manner, the sides of feed probes 78F and 78R closest to central axis 100 can be coupled to printed circuitry 74. If desired, dielectric resonator 92 can include a notch, such as notch 112, between feed probes 78F and 78R (e.g., at or extending through central axis 100) to further isolate the front-facing antenna from the rear-facing antenna. If desired, notch 112 can extend around all sides of dielectric resonator 92 (e.g., in the XY plane around longitudinal axis 98, leaving only a central portion 114 connecting the portion of dielectric resonator 92 above central axis 100 to the portion of dielectric resonator 92 below central axis 100).

[0100] Figure 13 The examples provided are merely illustrative. The notch 112 may have other shapes (e.g., shapes having edges following any path with any desired number of curved and / or straight segments). The feed probes 78F and 78R may have other shapes (e.g., may be formed from sheet metal folded in a T-shape, may be formed from conductive traces directly patterned onto the sidewall 94, etc.). The notch 112 may be omitted. If desired, the feed probe 78F may be mounted to the sidewall 94 opposite to the feed probe 78R (e.g., at position 116). If desired, the feed probe 78R may be mounted to the sidewall 94 opposite to the feed probe 78F (e.g., at position 118). If desired, the notch 112 may be filled with a dielectric material (e.g., Figure 6 (part of dielectric-coated molded part 86).

[0101] Sidewall 94 may have other shapes. If desired, the same feed probe can be used to feed both the front-facing and rear-facing antennas (e.g., when the feed probe is positioned at a specific location on the dielectric resonator and has a specific shape, when combined with the geometry of the dielectric resonator, the feed probe excites separate front-facing and rear-facing electromagnetic modes of the dielectric resonator to allow the front-facing and rear-facing antennas to operate independently).

[0102] Figures 6 to 13The example of antennas 40F and 40R being formed from the same dielectric resonant element is merely illustrative. If desired, antennas 40F and 40R can be formed from corresponding dielectric resonant elements separated by the interposer substrate, such as... Figure 14 As shown in the example. Figure 14 As shown, the front-facing antenna 40F may include a front-facing dielectric resonator 92F, and the rear-facing antenna 40R may include a rear-facing dielectric resonator 92R. The dielectric resonators 92R and 92F may be mounted to opposite sides of an interposer substrate, such as substrate 120. The dielectric resonator 92F may be fed using a feed probe 78F located on a first side of substrate 120. The dielectric resonator 92R may be fed using a feed probe 78R located on a second side of substrate 120. Substrate 120 may facilitate isolation between the front-facing antenna 40F and the rear-facing antenna 40R.

[0103] Device 10 may collect and / or use personally identifiable information. It is well known that the use of personally identifiable information should comply with privacy policies and practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0104] According to one embodiment, an electronic device is provided, comprising: a housing having a housing wall; a display having a display cover layer mounted to the housing opposite to the housing wall; a dielectric resonant element; a first feed probe coupled to the dielectric resonant element and configured to excite the dielectric resonant element to transmit a first radio frequency signal through the display cover layer; and a second feed probe coupled to the dielectric resonant element and configured to excite the dielectric resonant element to transmit a second radio frequency signal through the housing wall.

[0105] According to another embodiment, the electronic device includes: a printed circuit having an opening, the dielectric resonant element being disposed within the opening; a first transmission line located on the printed circuit and coupled to a first feed probe; and a second transmission line located on the printed circuit and coupled to a second feed probe.

[0106] According to another embodiment, the electronic device includes a dielectric overmolded part, wherein the dielectric resonant element is embedded in the dielectric overmolded part.

[0107] According to another embodiment, the electronic device includes: a further opening in the printed circuit; a further dielectric resonant element disposed in the further opening; a third feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a third radio frequency signal through the display overlay; and a fourth feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a fourth radio frequency signal through the housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal, and the fourth radio frequency signal are at frequencies greater than 10 GHz.

[0108] According to another embodiment, the electronic device includes: a further dielectric resonant element disposed in an opening; a third feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a third radio frequency signal through a display overlay; and a fourth feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a fourth radio frequency signal through a housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal, and the fourth radio frequency signal are at frequencies greater than 10 GHz.

[0109] According to another embodiment, the opening includes a first notch in the edge of the printed circuit, and the electronic device further includes: a further dielectric resonant element disposed in a further notch in the edge of the printed circuit; a third feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a third radio frequency signal through the display overlay; and a fourth feed probe coupled to the further dielectric resonant element and configured to excite the further dielectric resonant element to transmit a fourth radio frequency signal through the housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal, and the fourth radio frequency signal are at frequencies greater than 10 GHz.

[0110] According to another implementation, the first radio frequency signal and the second radio frequency signal are at frequencies greater than 10 GHz.

[0111] According to another embodiment, the dielectric resonant element has: a first end facing the dielectric cover layer; a second end facing the housing wall; a first sidewall extending from the first end to the second end; and a second sidewall extending from the first end to the second end opposite to the first sidewall, wherein a first feed probe is coupled to the first sidewall and a second feed probe is coupled to the second sidewall.

[0112] According to another embodiment, the first feed probe has a first orientation, and the second feed probe has a second orientation opposite to the first orientation.

[0113] According to another embodiment, the electronic device includes: a first recess in the first sidewall, wherein a first power supply probe is disposed in the first recess; and a second recess in the second sidewall, wherein a second power supply probe is disposed in the second recess.

[0114] According to another embodiment, the dielectric resonant element has a third sidewall extending from a first end to a second end perpendicular to the first and second sidewalls, and a fourth sidewall extending from the first end to the second end opposite to the third sidewall. The electronic device further includes: a third feed probe coupled to the third sidewall and configured to excite the dielectric resonant element to radiate through the display overlay; and a fourth feed probe coupled to the fourth sidewall and configured to excite the dielectric resonant element to radiate through the housing wall.

[0115] According to another embodiment, the dielectric resonant element has: a first end facing the dielectric cover layer; a second end facing the housing wall; and a sidewall extending from the first end to the second end, a first feed probe coupled to a first position on the sidewall, and a second feed probe coupled to a second position on the sidewall, the second position being inserted between the first position on the sidewall and the second end of the dielectric resonant element.

[0116] According to another embodiment, the electronic device includes a notch located in the sidewall of the dielectric resonant element between a first feed probe and a second feed probe.

[0117] According to one embodiment, an electronic device is provided, comprising: a housing having a rear housing wall; a display mounted to the housing opposite to the rear housing wall; a front-facing phased antenna array configured to radiate through the display; a rear-facing phased antenna array configured to radiate through the rear housing wall; and a dielectric cylinder forming both a front-facing dielectric resonant antenna of the front-facing phased antenna array and a rear-facing dielectric resonant antenna of the rear-facing phased antenna array.

[0118] According to another embodiment, the electronic device includes: a printed circuit; an opening in the printed circuit, a dielectric cylinder disposed within the opening; and a dielectric overmolded part on the printed circuit, the dielectric cylinder being embedded in the dielectric overmolded part.

[0119] According to another embodiment, the front-facing dielectric resonator antenna is probe-fed, and the rear-facing dielectric resonator antenna is probe-fed.

[0120] According to another embodiment, the dielectric cylinder has: a first end facing the display; a second end facing the housing wall; and sidewalls extending from the first end to the second end. The display includes a display module and a display cover layer, the display module being configured to emit light through the display cover layer. The housing includes a peripheral conductive housing structure extending around the periphery of the display module, the display cover layer being mounted to the peripheral conductive housing structure, and the first end of the dielectric cylinder being laterally inserted between the display module and the peripheral conductive housing structure.

[0121] According to another embodiment, the electronic device includes a dielectric antenna window located in the rear housing wall and overlapping with a second end of a dielectric cylinder.

[0122] According to one embodiment, an electronic device is provided, comprising: a dielectric overmolded component; a dielectric resonant element embedded in the dielectric overmolded component, the dielectric resonant element having: a longitudinal axis; a first surface located at a first end of the longitudinal axis; a second surface located at a second end of the longitudinal axis; and a wall extending from the first surface to the second surface; a first feed probe coupled to a first position on the sidewall, the first feed probe being configured to excite a first volume of the dielectric resonant element extending from the first position to the first end to radiate through the first end at a frequency greater than 10 GHz; and a second feed probe coupled to a second position on the sidewall, the second feed probe being configured to excite a second volume of the dielectric resonant element extending from the second position to the second end to radiate through the second end at a frequency greater than 10 GHz.

[0123] According to another embodiment, the electronic device includes a notch located in the sidewall between a first position and a second position on the sidewall.

[0124] The foregoing description is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and substance of the described embodiments. The aforementioned embodiments can be implemented independently or in any combination.

Claims

1. An electronic device, the electronic device comprising: The outer casing has an outer casing wall; A display having a display cover layer mounted to the housing opposite to the housing wall; Dielectric resonant element; A first feed probe is coupled to the dielectric resonant element and configured to excite the dielectric resonant element to transmit a first radio frequency signal through the display overlay. as well as A second feed probe is coupled to the dielectric resonant element and configured to excite the dielectric resonant element to transmit a second radio frequency signal through the housing wall.

2. The electronic device according to claim 1, further comprising: A printed circuit having an opening, wherein the dielectric resonant element is disposed within the opening; A first transmission line is located on the printed circuit and coupled to the first feed probe; as well as The second transmission line is located on the printed circuit and coupled to the second feed probe.

3. The electronic device according to claim 2, further comprising: A dielectric-coated molded part, wherein the dielectric resonant element is embedded in the dielectric-coated molded part.

4. The electronic device according to claim 2, further comprising: Additional openings in the printed circuit; An additional dielectric resonant element is disposed in the additional opening; A third feed probe is coupled to the additional dielectric resonant element and configured to excite the additional dielectric resonant element to transmit a third radio frequency signal through the display overlay. as well as A fourth feed probe is coupled to the additional dielectric resonator and configured to excite the additional dielectric resonator to transmit a fourth radio frequency signal through the housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal and the fourth radio frequency signal are at frequencies greater than 10 GHz.

5. The electronic device according to claim 2, further comprising: An additional dielectric resonant element is disposed in the opening; A third feed probe is coupled to the additional dielectric resonant element and configured to excite the additional dielectric resonant element to transmit a third radio frequency signal through the display overlay. as well as A fourth feed probe is coupled to the additional dielectric resonator and configured to excite the additional dielectric resonator to transmit a fourth radio frequency signal through the housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal and the fourth radio frequency signal are at frequencies greater than 10 GHz.

6. The electronic device of claim 2, wherein the opening comprises a first notch in the edge of the printed circuit, and the electronic device further comprises: Additional dielectric resonant elements are disposed in additional recesses in the edge of the printed circuit. A third feed probe is coupled to the additional dielectric resonant element and configured to excite the additional dielectric resonant element to transmit a third radio frequency signal through the display overlay. as well as A fourth feed probe is coupled to the additional dielectric resonator and configured to excite the additional dielectric resonator to transmit a fourth radio frequency signal through the housing wall, wherein the first radio frequency signal, the second radio frequency signal, the third radio frequency signal and the fourth radio frequency signal are at frequencies greater than 10 GHz.

7. The electronic device according to claim 1, wherein the first radio frequency signal and the second radio frequency signal are at a frequency greater than 10 GHz.

8. The electronic device of claim 1, wherein the dielectric resonant element has: a first end facing the display cover layer; a second end facing the housing wall; a first sidewall extending from the first end to the second end; and a second sidewall extending from the first end to the second end opposite to the first sidewall, wherein the first feed probe is coupled to the first sidewall and the second feed probe is coupled to the second sidewall.

9. The electronic device of claim 8, wherein the first feed probe has a first orientation, and the second feed probe has a second orientation opposite to the first orientation.

10. The electronic device according to claim 9, further comprising: A first recess in the first sidewall, wherein the first feed probe is disposed within the first recess; as well as The second recess in the second sidewall, wherein the second feed probe is disposed within the second recess.

11. The electronic device of claim 8, wherein the dielectric resonant element has a third sidewall extending from the first end to the second end perpendicular to the first sidewall and the second sidewall, the dielectric resonant element has a fourth sidewall extending from the first end to the second end opposite to the third sidewall, and the electronic device further comprises: A third feed probe is coupled to the third sidewall and configured to excite the dielectric resonant element to radiate through the display overlay. as well as A fourth feed probe is coupled to a fourth sidewall and configured to excite the dielectric resonant element to radiate through the housing wall.

12. The electronic device according to claim 1, wherein the dielectric resonant element comprises: A first end, the first end facing the display cover layer; a second end, the The second end faces the housing wall; and a sidewall extends from the first end to the second end, the first feed probe being coupled to a first position on the sidewall, and the second feed probe being coupled to a second position on the sidewall, the second position being inserted between the first position on the sidewall and the second end of the dielectric resonant element.

13. The electronic device according to claim 12, further comprising: A notch is located in the sidewall of the dielectric resonant element between the first feed probe and the second feed probe.

14. An electronic device, the electronic device comprising: An outer casing, the outer casing having a rear outer casing wall; A display, which is mounted to the housing opposite to the rear housing wall; A front-facing phased antenna array configured to radiate through the display; A rear-facing phased antenna array, the rear-facing phased antenna array being configured to radiate through the rear housing wall; as well as A dielectric cylinder that forms both the front-facing dielectric resonator antenna in the front-facing phased antenna array and the rear-facing dielectric resonator antenna in the rear-facing phased antenna array.

15. The electronic device according to claim 14, further comprising: Printed circuits; The opening in the printed circuit, wherein the dielectric cylinder is disposed within the opening; as well as The dielectric overmolded part on the printed circuit, wherein the dielectric cylinder is embedded in the dielectric overmolded part.

16. The electronic device of claim 14, wherein the front-facing dielectric resonator antenna is probe-fed, and the rear-facing dielectric resonator antenna is probe-fed.

17. The electronic device of claim 14, wherein the dielectric cylinder has: a first end facing the display; a second end facing the housing wall; and a sidewall extending from the first end to the second end, the display including a display module and a display cover layer, the display module being configured to emit light through the display cover layer, the housing including a peripheral conductive housing structure extending around the periphery of the display module, the display cover layer being mounted to the peripheral conductive housing structure, and the first end of the dielectric cylinder being laterally inserted between the display module and the peripheral conductive housing structure.

18. The electronic device of claim 17, further comprising: A dielectric antenna window, which is located in the rear housing wall and overlaps with the second end of the dielectric cylinder.

19. An electronic device, the electronic device comprising: Dielectric-coated molded parts; A dielectric resonant element, the dielectric resonant element being embedded in the dielectric overmolded part, wherein the dielectric resonant element has: a longitudinal axis; A first surface, the first surface being located at a first end of the longitudinal axis; A second surface, the second surface being located at the second end of the longitudinal axis; and a sidewall extending from the first surface to the second surface; A first feed probe is coupled to a first position on the sidewall of the dielectric resonant element, wherein the first feed probe is configured to excite a first volume of the dielectric resonant element extending from the first position to the first end to radiate through the first end at a frequency greater than 10 GHz. as well as A second feed probe is coupled to a second position on the sidewall of the dielectric resonant element, wherein the second feed probe is configured to excite a second volume of the dielectric resonant element extending from the second position to the second end to radiate through the second end at a frequency greater than 10 GHz.

20. The electronic device of claim 19, further comprising: A notch is located in the sidewall of the dielectric resonator between a first position on the sidewall and a second position on the sidewall of the dielectric resonator.

Images