Display substrate, manufacturing method thereof, and display device

Abstract

Provided are a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a first display area and a second display area, wherein the display substrate includes: a first substrate substrate; a second substrate substrate; a first barrier layer and a light-emitting unit, the first substrate substrate having a first penetration area, the first penetration area penetrates the first substrate substrate; the first barrier layer having a second penetration area, the second penetration area penetrates the first barrier layer; the second substrate substrate includes a first substrate sub-portion located in the first display area, the first substrate sub-portion penetrates the second penetration area, and at least a part of the first substrate sub-portion is located in the first penetration area, the display substrate includes a recessed portion; and the second substrate substrate includes a first surface and a second surface, the first surface is located in the first display area, the second surface is located in the second display area, and both the first surface and the second surface are formed as flat surfaces.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and particularly to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] With the increasing demand for diversified use of display devices by users and the emergence of design requirements for high screen-to-body ratio of display devices, full-screen design has become the current design mainstream. However, full-screen mobile phones have always been restricted by cameras. Although the market has introduced solutions such as punching and pop-up to increase the screen-to-body ratio, these solutions have problems such as poor mechanical sealing and low punching screen-to-body ratio. In comparison, under-screen camera technology can greatly increase the screen-to-body ratio of the display without affecting the overall appearance of the display. At present, in the solution of under-screen camera technology, how to ensure the light transmittance and display effect at the position where the imaging module is not placed in the display substrate has become an important topic of concern for R&D personnel.

[0003] The above information disclosed in this section is only for understanding the background of the technical concept of the present disclosure and therefore, the above information may contain information that does not constitute the prior art. Summary of the invention

[0004] In one aspect, a display substrate is provided, the display substrate comprising a first display area and a second display area, wherein the display substrate comprises: a first base substrate; a second base substrate located on one side of the first base substrate; a first barrier layer arranged between the first base substrate and the second base substrate; and a light emitting unit arranged on a side of the second base substrate away from the first base substrate, wherein the first base substrate has a first penetration area, the first penetration area penetrates the first base substrate, and the orthographic projection of the first penetration area on the first base substrate is located in the orthographic projection of the first display area on the first base substrate; the first barrier layer has a second penetration area, the second penetration area penetrates the first barrier layer, and the second penetration area The orthographic projection on the first substrate coincides with the orthographic projection of the first through-region on the first substrate; the second substrate comprises a first substrate sub-portion located in the first display area, the first substrate sub-portion penetrates the second through-region, and at least a portion of the first substrate sub-portion is located in the first through-region, the display substrate comprises a recessed portion, the orthographic projection of the recessed portion on the first substrate coincides with the orthographic projection of the first through-region on the first substrate; and the second substrate comprises a first surface and a second surface located on a side away from the first substrate, the first surface is located in the first display area, the second surface is located in the second display area, and both the first surface and the second surface are formed as flat surfaces.

[0005] According to some exemplary embodiments, at least one light emitting unit is disposed in the first display area.

[0006] According to some exemplary embodiments, the second substrate includes a second substrate sub-portion located in the second display area, the thickness of the first substrate sub-portion is greater than the thickness of the second substrate sub-portion, and the thickness of the first substrate sub-portion is approximately 0.5-2 microns greater than the thickness of the second substrate sub-portion.

[0007] According to some exemplary embodiments, the depth of the recessed portion is less than the thickness of the first substrate, and the difference between the thickness of the first substrate and the depth of the recessed portion is about 0.5-2 micrometers.

[0008] According to some exemplary embodiments, materials of the first base substrate and the second base substrate include polyimide.

[0009] According to some exemplary embodiments, the first substrate has a thickness of about 3-8 microns; and / or the second substrate has a thickness of about 3-5 microns; and / or the first substrate is about 1-5 microns thicker than the second substrate.

[0010] According to some exemplary embodiments, the depth of the recessed portion is about 75% to 95% of the thickness of the first substrate; and / or the slope angle of at least one sidewall of the recessed portion is between about 40° and 80°.

[0011] According to some exemplary embodiments, the area of ​​the orthographic projection of the recessed portion on the first substrate is substantially equal to the area of ​​the first display region; and / or the area of ​​the orthographic projection of the recessed portion on the first substrate is approximately 0.1% to 30% of the combined area of ​​the first display region and the second display region.

[0012] According to some exemplary embodiments, a plurality of the light emitting units are disposed in the second display area, and a distribution density of the light emitting units in the first display area is smaller than a distribution density of the light emitting units in the second display area.

[0013] On the other hand, a display device is provided, comprising an image sensor and any one of the display substrates described above, wherein the orthographic projection of the image sensor on the first substrate is located in the first display area.

[0014] On the other hand, a method for manufacturing a display substrate is provided, comprising: forming a reinforcement layer in a first area of ​​a glass backplane; forming a first substrate material layer on the glass backplane, the first substrate material layer covering the reinforcement layer; forming a first barrier material layer on a side of the first substrate material layer away from the glass backplane; removing the first barrier material layer and a portion of the first substrate material layer located in the first area through a patterning process to form a first substrate substrate and a first barrier layer, and exposing a surface of the reinforcement layer away from the glass backplane; forming a second substrate material layer on a side of the first barrier layer away from the glass backplane to form a second substrate substrate, a portion of the second substrate substrate in the first area contacts the reinforcement layer, wherein a surface of the second substrate substrate away from the first substrate substrate is a flat surface; and separating both the glass backplane and the reinforcement layer from the first substrate substrate and the second substrate substrate to form a recessed portion in the first area, wherein a first adhesion force exists between the reinforcement layer and the glass backplane, a second adhesion force exists between the reinforcement layer and the second substrate substrate, and the first adhesion force is greater than the second adhesion force.

[0015] According to some exemplary embodiments, forming the reinforcement layer includes:

[0016] A first metal layer is formed in a first area of ​​the glass back panel; a retaining wall is formed in a second area of ​​the glass back panel so that the retaining wall and the first metal layer form a recess in the first area; in the first area, a second metal layer is formed on a side of the first metal layer away from the glass back panel so that the second metal layer fills the recess; and the retaining wall is removed.

[0017] According to some exemplary embodiments, forming the reinforcement layer further includes: forming a third metal layer on a side of the second metal layer away from the glass back plate.

[0018] According to some exemplary embodiments, the first metal layer is formed by a magnetron sputtering process.

[0019] According to some exemplary embodiments, the second metal layer is formed by an electroplating process.

[0020] According to some exemplary embodiments, the third metal layer is formed by a patterning process.

[0021] According to some exemplary embodiments, the first metal layer and the second metal layer are made of the same material, and the third metal layer is made of a material different from that of the first metal layer.

[0022] According to some exemplary embodiments, a material of the first metal layer includes copper.

[0023] According to some exemplary embodiments, the third metal layer includes a single-layer structure, and the material of the single-layer structure includes molybdenum; or, the third metal layer includes a stacked structure, and the stacked structure includes a first sublayer, a third sublayer and a second sublayer sandwiched between the first sublayer and the third sublayer, the first sublayer and the third sublayer are made of the same material, the material of the first sublayer includes molybdenum-niobium-titanium alloy or titanium, and the material of the second sublayer includes copper or aluminum.

[0024] According to some exemplary embodiments, removing the portion of the first barrier material layer and the first substrate material layer located in the first region through a composition process includes: removing the portion of the first barrier material layer located in the first region through a composition process to form a first barrier layer; and removing the portion of the first substrate material layer located in the first region through a composition process using the first barrier layer as a mask.

[0025] According to some exemplary embodiments, separating both the glass back panel and the reinforcement layer from the first substrate and the second substrate includes: separating both the glass back panel and the reinforcement layer from the first substrate and the second substrate by a laser lift-off process.

[0026] According to some exemplary embodiments, the thickness of the first metal layer is 0.2-0.6 micrometers; and / or the thickness of the second metal layer is about 2.4-6.8 micrometers; and / or the thickness of the third metal layer is 1000-10000 angstroms.

[0027] According to some exemplary embodiments, the thickness of the retaining wall and the thickness of the reinforcing layer are substantially equal; and / or, the thickness of each of the retaining wall and the reinforcing layer is set to be approximately 2-7 microns. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings.

[0029] Figure 1 is a flow chart of a method for manufacturing a display substrate according to an exemplary embodiment of the present disclosure;

[0030] Figure 2 is a flow chart of a method for manufacturing a reinforcement layer of a display substrate according to an exemplary embodiment of the present disclosure;

[0031] Figure 3 is a cross-sectional view of a display substrate in step S1011 according to an exemplary embodiment of the present disclosure;

[0032] Figure 4is a cross-sectional view of a display substrate in step S1012 according to an exemplary embodiment of the present disclosure;

[0033] Figure 5 is a cross-sectional view of a display substrate in step S1013 according to an exemplary embodiment of the present disclosure;

[0034] Figure 6 is a cross-sectional view of a display substrate in step S1014 according to an exemplary embodiment of the present disclosure;

[0035] Figure 7 is a cross-sectional view of a display substrate in step S1015 according to an exemplary embodiment of the present disclosure;

[0036] Figure 8 is a cross-sectional view of a display substrate in step S102 according to an exemplary embodiment of the present disclosure;

[0037] Fig. 9 is a cross-sectional view of a display substrate in step S103 according to an exemplary embodiment of the present disclosure;

[0038] Fig.10 is a cross-sectional view of a display substrate in step S104 according to an exemplary embodiment of the present disclosure;

[0039] Fig.11 is a cross-sectional view of a display substrate in step S105 according to an exemplary embodiment of the present disclosure;

[0040] Fig. 12A is a cross-sectional view of a display substrate in step S106 according to an exemplary embodiment of the present disclosure;

[0041] Fig. 12B is a partial cross-sectional view of a structure after main steps of a method for manufacturing a display substrate according to some exemplary embodiments of the present disclosure are performed;

[0042] Fig.13 is a cross-sectional view of a display substrate according to an exemplary embodiment of the present disclosure;

[0043] Fig.14 is a schematic plan view of a display device according to some exemplary embodiments of the present disclosure, wherein a plan view of a display substrate included in the display device is schematically shown; and

[0044] Fig.15 A display device according to some exemplary embodiments of the present disclosure is provided along Fig.14 Schematic cross-sectional view taken along line AA'. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] It should be noted that in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. Thus, the size and relative size of each element are not necessarily limited to the size and relative size shown in the drawings. In the specification and drawings, the same or similar reference numerals indicate the same or similar parts.

[0047] When an element is described as being "on" another element, "connected to" another element or "coupled to" another element, the element may be directly on the other element, directly connected to the other element or directly coupled to the other element, or there may be an intermediate element. However, when an element is described as being "directly on" another element, "directly connected to" another element or "directly coupled to" another element, there is no intermediate element. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, "between..." versus "directly between...", "adjacent" versus "directly adjacent" or "on..." versus "directly on...", etc. In addition, the term "connection" may refer to a physical connection, an electrical connection, a communication connection and / or a fluid connection. In addition, the X-axis, the Y-axis and the Z-axis are not limited to the three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the X-axis, the Y-axis and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the listed associated items.

[0048] It should be noted that, although the terms "first", "second", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another. Thus, for example, the first part, first member, first element, first region, first layer and / or first part discussed below may be referred to as the second part, second member, second element, second region, second layer and / or second part without departing from the teachings of the present disclosure.

[0049] For ease of description, spatial relational terms, such as "upper", "lower", "left", "right", etc., may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figure. It should be understood that the spatial relational terms are intended to cover other different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the figure is turned upside down, elements described as "below" or "beneath" other elements or features will be oriented "above" or "above" the other elements or features.

[0050] It should be noted that, in this article, the expression "flat surface" may mean that there are no obvious protrusions or depressions on the surface, and the "no obvious protrusions or depressions" here means that except for fluctuations caused by the manufacturing process, the height of the surface at various positions does not differ beyond the range of process error.

[0051] Herein, the expression "distribution density of light emitting units" refers to the number of light emitting units per unit area. Similarly, the expression "distribution density" refers to the number of components (eg, repeating units, sub-pixels, light emitting units, etc.) per unit area.

[0052] Figure 1 A flow chart schematically shows a method for manufacturing a display substrate according to an embodiment of the present disclosure; Figure 2 is a flow chart of a method for manufacturing a reinforcement layer of a display substrate according to an exemplary embodiment of the present disclosure; Figures 3 to 12A A cross-sectional view schematically shows a structure after the main steps of the method for manufacturing a display substrate according to an embodiment of the present disclosure are executed. Figures 1 to 12A A method for manufacturing an exemplary display substrate according to the present disclosure will be described in detail.

[0053] In step S101, refer to Figures 1 to 6 , a reinforcement layer 12 is formed in the first area A1 on the glass back plate 11. Specifically, referring to Figure 6The reinforcement layer 12 may be composed of three metal layers, the first metal layer 121 and the second metal layer 122 may be made of the same metal material, for example, copper. The material of the third metal layer 123 is different from that of the first metal layer 121, for example, molybdenum.

[0054] The third metal layer 123 includes a single-layer structure, for example, a single-layer structure including only molybdenum.

[0055] Optionally, the third metal layer 123 is configured as a stacked structure including three sublayers, for example, including a first sublayer, a third sublayer, and a second sublayer sandwiched between the first sublayer and the third sublayer. The first sublayer and the third sublayer are made of the same material, for example, the material of the first sublayer includes molybdenum-niobium-titanium alloy or titanium, and the material of the second sublayer includes copper or aluminum.

[0056] In step S101 , the step of forming the reinforcement layer 12 may specifically include the following steps.

[0057] Step S1011, as Figure 3 As shown, a first metal layer 121 is formed in the first area A1 of the glass back plate 11 .

[0058] For example, the first metal layer 121 is formed by a magnetron sputtering process, and the thickness of the first metal layer 121 is controlled to be about 0.2-0.6 micrometers. Forming the first metal layer 121 by a magnetron sputtering process can make the first metal layer 121 and the glass back plate 11 have good adhesion.

[0059] Step S1012, as Figure 4 As shown, a retaining wall 13 is formed in the second area A2 of the glass back plate 11 , so that the retaining wall 13 and the first metal layer 121 form a recess B located in the first area.

[0060] For example, the material of the retaining wall is a covering layer material, and the retaining wall is formed only in the second region, which facilitates the execution of step S1013.

[0061] For example, the thickness of the retaining wall 13 is substantially equal to the thickness of the reinforcement layer to be formed. The thickness of the retaining wall 13 is set to about 2-7 microns.

[0062] Step S1013, as Figure 5 As shown, in the first area A1, the second metal layer 122 is formed on the side of the first metal layer 121 away from the glass back plate 11, so that the second metal layer fills the concave portion B.

[0063] For example, the second metal layer 122 is formed by an electroplating process, and the thickness of the second metal layer 122 is controlled to be about 2.4-6.8 microns. Compared with the formation process of the first metal layer 121 by magnetron sputtering, the second metal layer 122 can be formed to be thicker. In addition, based on step S1012, the second area A2 is blocked by the retaining wall, so during the process of performing step S1013, the second metal layer 122 is only formed in the concave portion B, ensuring that the size of the second metal layer 122 is more regular.

[0064] Step S1014, as Figure 6 As shown, a third metal layer 123 is formed on the side of the second metal layer 122 away from the glass back panel 11. Specifically, after the second metal layer 122 is formed, the third metal layer 123 is continuously formed on the second metal layer 122. For example, the third metal layer 123 is formed by a patterning process, and the thickness of the third metal layer is set to about 1000-10000 angstroms. Specifically, the third metal layer 123 is formed by (specific steps of the patterning process) so that the thickness of the reinforcement layer composed of the first metal layer, the second metal layer and the third metal layer is equal to the depth of the recess B formed in step S1013. Accurate control of the thickness of the reinforcement layer 12 is achieved. For example, the thickness of the reinforcement layer is set to about 2-7 microns. In this article, the reinforcement layer can be, for example, a metal wall.

[0065] Step S1015, as Figure 7 As shown, the retaining wall 13 is removed.

[0066] For example, the retaining wall 13 is removed by a dry etching process, that is, the reinforcement layer 12 is formed only in the first area A1 of the glass back plate, and the retaining wall 13 in the second area A2 of the glass back plate is removed.

[0067] In step S102, refer to Figure 8 A first substrate material layer 14 is formed on the glass backplane 11, and the first substrate material layer 14 covers the reinforcement layer 12. Specifically, the first substrate material is, for example, polyimide, and the thickness of the first substrate material formed on the glass backplane 11 is about 0.5-2 microns, for example, about 1 micron, thicker than the thickness of the reinforcement layer 12 formed on the glass backplane. For example, the thickness of the first substrate material is about 3-8 microns.

[0068] In step S103, refer to Fig. 9 A first barrier material layer 15 is formed on the side of the first substrate material layer 14 away from the glass back plate 11. Specifically, after the first substrate material layer 14 is formed, the first barrier material layer 15 is deposited by a deposition process, for example, the first barrier material layer 15 is made of an inorganic material.

[0069] In step S104, refer to Fig.10Through a patterning process, portions of the first barrier material layer 15 and the first substrate material layer 14 located in the first area A1 are removed to form a first substrate 14 and a first barrier layer 15 , and to expose the surface of the enhancement layer 12 away from the glass back panel 11 .

[0070] For example, the portion of the first barrier material layer in the first area A1 is removed through a patterning process to form a first barrier layer 15; and the portion of the first substrate material layer in the first area is removed through a patterning process using the first barrier layer 15 as a mask.

[0071] For example, removing the first barrier material in the first area by exposure, development and etching can effectively prevent the first barrier material layer from breaking during the stripping process. After the first barrier material layer is removed, removing the first substrate material on the reinforcement layer in the first area by a composition process can achieve the removal of the first substrate material without damaging the reinforcement layer.

[0072] In step S105, refer to Fig.11 A second substrate material layer is formed on the side of the first barrier layer 15 away from the glass back plate 11 to form a second substrate 16, and the second substrate 16 is in contact with the enhancement layer 12 in the first region, wherein the surface of the second substrate 16 away from the first substrate 14 is a flat surface. In the embodiment of the present disclosure, other structures of the display substrate are further formed on the surface of the second substrate 16, such as a second barrier layer 17, a thin film transistor 18 (for example, including an active layer, a gate, a source electrode, a drain electrode, etc.), a light emitting unit 19, a TFE layer (i.e., a thin film encapsulation structure) 20, a touch layer 21, a COE layer (i.e., a color filter layer) 22, an OCA layer (i.e., an optical adhesive layer) 23, a cover plate 24, etc.

[0073] For example, the part of the second base substrate 16 in the first area A1 is in contact with the enhancement layer 12, which can make up for the problem of insufficient strength of the first base substrate 14 after the A1 in the first area is removed. By setting the surface of the second base substrate 16 on the side away from the first base substrate 14 to a flat plane, the active layer of the thin film transistor (TFT) subsequently formed on the second base substrate 16 can be a flat film layer. In this way, when the active layer of the TFT is crystallized, it is conducive to uniform crystallization. Therefore, in the embodiment of the present disclosure, the transmittance of the display substrate can be further improved without affecting the electrical characteristics of the driving circuit of the display substrate.

[0074] In step S106, refer to Fig. 12A , the glass back plate 11 and the reinforcement layer 12 are separated from the first base substrate 14 and the second base substrate 16 to form a recessed portion C in the first area A1.

[0075] For example, the glass back sheet 11 and the reinforcement layer 12 are both separated from the first base substrate 14 and the second base substrate 16 by a laser lift-off process.

[0076] According to the embodiment of the present disclosure, there is a first adhesion force between the reinforcing layer 12 and the glass back plate 11, and there is a second adhesion force between the reinforcing layer 12 and the second base substrate 16, and the first adhesion force is greater than the second adhesion force. Therefore, when the glass back plate 11 and the reinforcing layer 12 are separated from the first base substrate 14 and the second base substrate 16, the first adhesion force between the reinforcing layer 12 and the glass back plate 11 is larger, so it will not fall off, and there is a second adhesion force between the reinforcing layer 12 and the second base substrate 16, and the second adhesion force is less than the first adhesion force. Therefore, the reinforcing layer 12 and the second base substrate 16 fall off first than the reinforcing layer 12 and the glass back plate 11. Thereby, the formation of the recessed portion C is ensured. After the recessed portion C is formed, since the sum of the thicknesses of the first base substrate 14 and the second base substrate 16 is reduced, the display substrate has a good light transmittance in the first area, which is conducive to improving the image quality received by the image sensor arranged in the orthographic projection direction of the first area.

[0077] For example, when the reinforcement layer 12 is peeled off from the first substrate 14 and the second substrate 16, the surfaces of the first substrate 14 and the second substrate 16 that are in contact with the reinforcement layer 12 (for example, the side surface of the first substrate 14 facing the recessed portion C, and the lower surface of the second substrate 16 facing the recessed portion C) may change. For example, some metal particles may remain on at least one of the side surface of the first substrate 14 facing the recessed portion C and the lower surface of the second substrate 16 facing the recessed portion C. In this way, the surface properties of at least one of the side surface of the first substrate 14 facing the recessed portion C and the lower surface of the second substrate 16 facing the recessed portion C are different from the surface properties of other surfaces of the first substrate 14 or the second substrate 16.

[0078] Fig. 12B 1 is a partial cross-sectional view of a structure after the main steps of the method for manufacturing a display substrate according to some exemplary embodiments of the present disclosure are performed. Fig. 12B , the reinforcement layer 12 may have a regular trapezoidal shape in a cross-sectional view. For example, each of the first metal layer 121 , the second metal layer 122 , and the third metal layer 123 may have a regular trapezoidal shape in a cross-sectional view.

[0079] Accordingly, the recessed portion C may have a regular trapezoidal shape in a cross-sectional view. For example, the slope angle α of at least one sidewall of the recessed portion C is between 40° and 80°, for example, between 40° and 60°, for example, about 45°, about 50°.

[0080] According to the embodiments of the present disclosure, the display substrate manufactured by the above-mentioned manufacturing method can not only ensure the electrical characteristics of the device, but also form a recessed portion C on the first base substrate of the display substrate, thereby improving the light transmittance of the display substrate in the first area, which is beneficial to improving the image quality received by the image sensor.

[0081] Another embodiment of the present disclosure provides a display substrate, such as Fig.13 As shown, the display substrate includes a first display area B1 and a second display area B2. The orthographic projection direction of the first display area B1 is suitable for installing an image sensor (not shown), so that the image sensor receives light from the first display area B1 to collect image information. The second display area B2 is an area for display different from the first display area B1, and the second display area B2 is not used for image collection.

[0082] According to an embodiment of the present disclosure, the display substrate includes: a first base substrate 14, a second base substrate 16, a first barrier layer 15, and a light emitting unit 19. The second base substrate 16 is located on one side of the first base substrate 14. The first barrier layer 15 is disposed between the first base substrate 14 and the second base substrate 16. The light emitting unit 19 is disposed on one side of the second base substrate 16 away from the first base substrate 14.

[0083] For example, at least one light emitting unit 19 is provided in the first display area B1, for example, a plurality of light emitting units 19 are provided. A plurality of light emitting units 19 are provided in the second display area B2. The distribution density of the light emitting units in the first display area B1 is less than the distribution density of the light emitting units in the second display area B2. For example, the distribution density of the light emitting units in the first display area B1 is 50-100 units / mm 2 The distribution density of the light emitting units in the second display area B2 is 80-500 / mm 2 .

[0084] According to an embodiment of the present disclosure, the first base substrate 14 is provided with a first penetration area D1 , which penetrates the first base substrate 14 , and the orthographic projection of the first penetration area D1 on the first base substrate 14 is located in the orthographic projection of the first display area on the first base substrate.

[0085] For example, the first through-region D1 may be circular, elliptical or rectangular. In other optional embodiments, it may also be other suitable shapes.

[0086] According to an embodiment of the present disclosure, the first barrier layer 15 has a second through-region D2 that penetrates the first barrier layer 15 , and an orthographic projection of the second through-region D2 on the first base substrate 14 coincides with an orthographic projection of the first through-region D1 on the first base substrate.

[0087] For example, the second through-region D2 has the same shape as the first through-region D1, for example, a circle, an ellipse or a rectangle. In other optional embodiments, the second through-region D2 may also be other suitable shapes that are the same as the first through-region D1.

[0088] According to an embodiment of the present disclosure, the second substrate substrate 16 includes a first substrate sub-portion 161 located in the first display area B1, the first substrate sub-portion 161 penetrates the second penetration area D2, and at least a portion of the first substrate sub-portion 161 is located in the first penetration area D1, the display substrate includes a recessed portion C, and the orthographic projection of the recessed portion C on the first substrate substrate 14 coincides with the orthographic projection of the first penetration area D1 on the first substrate substrate 14.

[0089] According to the embodiment of the present disclosure, the second base substrate 16 is integrally formed with the first base sub-portion 161 located in the first display area B1, and at least a portion of the first base sub-portion 161 is located in the first through-area D1, which can improve the problem of insufficient strength of the display substrate in the first display area B1 caused by forming a recessed portion C on the display substrate. By forming the recessed portion C on the display substrate, it is possible to reduce the blocking of the light in the first display area B1 by the first base substrate 14 and the second base substrate 16, and improve the light transmittance of the display area.

[0090] According to an embodiment of the present disclosure, the second base substrate 16 includes a first surface 162 and a second surface 163 located on a side away from the first base substrate, the first surface 162 is located in the first display area, the second surface 163 is located in the second display area, and both the first surface 162 and the second surface 163 are formed as flat surfaces.

[0091] For example, the distance between the first surface 162 and the bottom of the first substrate 14 is d1, and the distance between the second surface and the bottom of the first substrate is d2. The first surface 162 and the second surface 163 form a flat surface, indicating that the values ​​of d1 and d2 are equal, that is, the first surface 162 and the second surface 163 are located in the same plane. According to the embodiment of the present disclosure, the first surface 162 and the second surface 163 form a flat surface to ensure the electrical characteristics of the driving circuit of the display substrate.

[0092] It should be noted that, in the expression “flat surface” here, the surface formed by the combination of the first surface 162 and the second surface 163 has no obvious protrusions or depressions, and the “no obvious protrusions or depressions” here means that except for the fluctuations caused by the manufacturing process, the height of the surface at each position does not differ beyond the range of the process error.

[0093] According to an embodiment of the present disclosure, by setting a recessed portion C on the first base substrate 14, the overall thickness of the first base substrate 14 and the second base substrate 16 can be reduced, the blocking of light of the image sensor by the base substrate can be reduced, and the transmittance of light in the imaging area (i.e., the first display area) can be improved.

[0094] In an optional embodiment of the present disclosure, the display substrate may include a second barrier layer 17, wherein the second barrier layer 17 is disposed on a side of the second base substrate 16 away from the first base substrate 14 and closer to the second base substrate 16 than the light emitting unit 19. The second barrier layer 17 is used to improve the strength of the display substrate.

[0095] According to an embodiment of the present disclosure, at least one light emitting unit 19 is provided in the first display area B1. For example, the light emitting unit 19 is provided in the first display area B1 to ensure that images or information can be displayed normally in the first display area B1. The light emitting unit is provided in the first display area B1, which inevitably leads to a decrease in the light transmittance of the first display area B1. Therefore, by providing a recessed portion C in the first display area B1, the light transmittance of the first display area B1 is improved while ensuring the display effect of the first display area B1.

[0096] According to an embodiment of the present disclosure, the second substrate 16 includes a second substrate sub-portion 164 located in the second display area, and the thickness of the first substrate sub-portion 161 is greater than the thickness of the second substrate sub-portion 164. After the first substrate 14 and the first barrier layer 15 of the first display area B1 are removed, the strength of the display substrate in the first display area B1 is inevitably low. Therefore, in order to compensate for the insufficient strength of the first display area B1, the thickness of the first substrate sub-portion 161 is set to be greater than the thickness of the second substrate sub-portion 164, which can improve the strength of the second substrate 16 in the first display area B1 and compensate for the above-mentioned insufficient strength problem. In addition, the thickness of the first substrate sub-portion 161 is less than the sum of the thicknesses of the first substrate 14 and the second substrate 16, that is, the light transmittance of the first display area B1 is guaranteed while meeting the strength requirements.

[0097] According to an embodiment of the present disclosure, the depth of the recessed portion C is less than the thickness of the first base substrate 14 , and the difference between the thickness of the first base substrate 14 and the depth of the recessed portion C is about 0.5-2 microns, for example, about 1 micron.

[0098] For example, the depth of the concave portion C is set to about 2-7 micrometers.

[0099] The material of the first base substrate 14 and the second base substrate 16 may be, for example, polyimide.

[0100] The thickness of the first base substrate 14 is, for example, set to about 3-8 microns, and the thickness of the second base substrate 16 is, for example, set to about 3-5 microns.

[0101] For example, the depth of the recessed portion C is about 75%-95%, for example, about 80%-95%, or about 80%-90%, or about 82%-85% of the thickness of the first substrate 14. For example, the depth of the recessed portion C is about 83% of the thickness of the first substrate 14.

[0102] For example, the thickness of the first substrate substrate 14 is greater than the thickness of the second substrate substrate 16. For example, the thickness of the first substrate substrate 14 may be greater than the thickness of each of the first substrate sub-portion 161 and the second substrate sub-portion 164. For example, the thickness of the first substrate substrate 14 is about 2-5 microns thicker than the thickness of the second substrate sub-portion 164, and the thickness of the first substrate substrate 14 is about 1-4 microns thicker than the thickness of the first substrate sub-portion 161.

[0103] For example, the thickness of the first substrate sub-portion 161 is approximately 0.5-2 microns thicker than the thickness of the second substrate sub-portion 164 .

[0104] Fig.14 is a schematic plan view of a display device according to some exemplary embodiments of the present disclosure, in which a plan view of a display substrate included in the display device is schematically shown. Fig.15 A display device according to some exemplary embodiments of the present disclosure is provided along Fig.14 Schematic cross-sectional view taken along line AA'.

[0105] like Fig.14 As shown, the display device according to the embodiment of the present disclosure includes a display substrate 10. The display substrate 10 includes a display area, and the display area may include a first display area B1 and a second display area B2. For example, the first display area B1 and the second display area B2 do not overlap. For example, the second display area B2 at least partially surrounds (e.g., completely surrounds) the first display area B1.

[0106] Reference Fig.14 The area of ​​the orthographic projection of the recessed portion C on the first base substrate 14 is substantially equal to the area of ​​the first display region B1.

[0107] The area of ​​the orthographic projection of the recessed portion C on the first base substrate 14 is approximately 0.1% to 30% of the combined area of ​​the first display area B1 and the second display area B2.

[0108] like Fig.15 As shown, the display substrate may include a first base substrate 14, a second base substrate 16, a first barrier layer 15, and a light emitting unit 19. The sensor 2 may be disposed on the side of the first base substrate 14 located on the projection surface of the first display area B1 away from the second base substrate 16 and located in the projection surface area where the recessed portion C is located (in the Fig.15 The first display area B1 can meet the imaging requirements of the sensor 2 for light transmittance.

[0109] In the illustrated exemplary embodiment, the shape of the first display area B1 may be circular, elliptical, rectangular, or other suitable shapes, but the embodiments of the present disclosure are not limited thereto.

[0110] Return to reference Fig.14 and Fig.15 At least some embodiments of the present disclosure further provide a display device. The display device may include the display substrate as described above and a sensor 2 (eg, a camera).

[0111] The sensor 2 may adopt a structure known in the art, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The sensor 2 may be electrically connected to an image processor. In addition to the image sensor, in order to achieve a better imaging effect, the imaging module including the image sensor may also include a lens assembly, and the lens assembly and the image sensor may be arranged in sequence along the optical axis of the lens assembly in a direction perpendicular to the substrate 1.

[0112] The display device may include any device or product having a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0113] Although some embodiments of the overall technical concept of the present disclosure have been shown and described, those skilled in the art will appreciate that changes may be made to these embodiments without departing from the principles and spirit of the overall technical concept, and the scope of the present disclosure is defined by the claims and their equivalents.

Claims

1. A display substrate, comprising a first display area and a second display area, wherein: The display substrate comprises: a first substrate base plate; A second substrate, located on one side of the first substrate; a first barrier layer disposed between the first substrate and the second substrate; and a light emitting unit, arranged on a side of the second substrate away from the first substrate, The first substrate has a first through-region, the first through-region penetrates the first substrate, and an orthographic projection of the first through-region on the first substrate is located in an orthographic projection of the first display area on the first substrate; The first barrier layer has a second penetration region, the second penetration region penetrates the first barrier layer, and an orthographic projection of the second penetration region on the first substrate coincides with an orthographic projection of the first penetration region on the first substrate; The second substrate includes a first substrate sub-portion located in the first display area, the first substrate sub-portion passes through the second penetration area, and at least a portion of the first substrate sub-portion is located in the first penetration area, the display substrate includes a recessed portion, and an orthographic projection of the recessed portion on the first substrate coincides with an orthographic projection of the first penetration area on the first substrate; and The second base substrate includes a first surface and a second surface located at a side away from the first base substrate, the first surface is located in the first display area, the second surface is located in the second display area, and both the first surface and the second surface are formed as flat surfaces.

2. The display substrate according to claim 1, wherein: At least one light emitting unit is disposed in the first display area.

3. The display substrate according to claim 1, wherein: The second substrate includes a second substrate sub-portion located in the second display area, the thickness of the first substrate sub-portion is greater than the thickness of the second substrate sub-portion, and the thickness of the first substrate sub-portion is 0.5-2 microns greater than the thickness of the second substrate sub-portion.

4. The display substrate according to claim 1, wherein: The depth of the recessed portion is less than the thickness of the first substrate, and the difference between the thickness of the first substrate and the depth of the recessed portion is 0.5-2 micrometers.

5. The display substrate according to claim 1, wherein: The material of the first base substrate and the second base substrate includes polyimide.

6. The display substrate according to claim 1, wherein: The thickness of the first substrate is 3-8 micrometers; and / or, The thickness of the second substrate is 3-5 microns; and / or, The thickness of the first substrate is 1-5 microns greater than the thickness of the second substrate.

7. The display substrate according to claim 1, wherein: The depth of the recessed portion is 75% to 95% of the thickness of the first substrate; and / or, The slope angle of at least one side wall of the recessed portion is between 40° and 80°.

8. The display substrate according to claim 1, wherein: The area of ​​the orthographic projection of the recessed portion on the first base substrate is substantially equal to the area of ​​the first display region; and / or, An area of ​​an orthographic projection of the recessed portion on the first base substrate is 0.1% to 30% of a combined area of ​​the first display region and the second display region.

9. The display substrate according to claim 2, wherein: A plurality of the light emitting units are disposed in the second display area, and a distribution density of the light emitting units in the first display area is smaller than a distribution density of the light emitting units in the second display area.

10. A display device comprising an image sensor and a display substrate according to any one of claims 1 to 9, in, The orthographic projection of the image sensor on the first substrate is located in the first display area.

11. A method for manufacturing a display substrate, comprising: forming a reinforcement layer in a first region of the glass back panel; forming a first substrate material layer on the glass back plate, wherein the first substrate material layer covers the reinforcement layer; forming a first barrier material layer on a side of the first substrate material layer away from the glass back plate; By means of a patterning process, the first barrier material layer and the first substrate material layer are removed in the first region to form a first substrate and a first barrier layer, and the surface of the enhancement layer away from the glass back plate is exposed; forming a second substrate material layer on a side of the first barrier layer away from the glass back plate to form a second substrate, a portion of the second substrate in the first region being in contact with the reinforcement layer, wherein a surface of the second substrate away from the first substrate is a flat surface; and separating both the glass back plate and the reinforcement layer from the first base substrate and the second base substrate to form a recessed portion in the first region, There is a first adhesion force between the reinforcing layer and the glass back plate, there is a second adhesion force between the reinforcing layer and the second base substrate, and the first adhesion force is greater than the second adhesion force.

12. The manufacturing method according to claim 11, wherein: Forming the reinforcement layer comprises: forming a first metal layer on a first area of ​​the glass back panel; forming a retaining wall in the second area of ​​the glass back plate, so that the retaining wall and the first metal layer form a recessed portion located in the first area; In the first region, forming a second metal layer on a side of the first metal layer away from the glass back plate, so that the second metal layer fills the concave portion; and The retaining wall is removed.

13. The manufacturing method according to claim 12, wherein: Forming the reinforcement layer further includes: forming a third metal layer on a side of the second metal layer away from the glass back plate.

14. The manufacturing method according to claim 12, wherein: The first metal layer is formed by a magnetron sputtering process.

15. The manufacturing method according to claim 12, wherein: The second metal layer is formed by an electroplating process.

16. The manufacturing method according to claim 13, wherein: The third metal layer is formed by a patterning process.

17. The manufacturing method according to claim 13, wherein: The first metal layer and the second metal layer are made of the same material, and the third metal layer is made of a material different from that of the first metal layer.

18. The manufacturing method according to claim 12, wherein: The material of the first metal layer includes copper.

19. The manufacturing method according to claim 16, wherein: The third metal layer comprises a single-layer structure, and the material of the single-layer structure comprises molybdenum; or, The third metal layer includes a stacked structure, which includes a first sublayer, a third sublayer and a second sublayer sandwiched between the first sublayer and the third sublayer. The first sublayer and the third sublayer are made of the same material. The material of the first sublayer includes molybdenum-niobium-titanium alloy or titanium, and the material of the second sublayer includes copper or aluminum.

20. The manufacturing method according to claim 11, wherein: Removing the first barrier material layer and the first substrate material layer in the first region by a patterning process includes: Removing the portion of the first barrier material layer located in the first region through a patterning process to form a first barrier layer; and The first barrier layer is used as a mask and a patterning process is performed to remove a portion of the first substrate material layer located in the first region.

21. The manufacturing method according to claim 11, wherein: Separating both the glass backplane and the reinforcement layer from the first base substrate and the second base substrate comprises: Both the glass back sheet and the reinforcement layer are separated from the first and second base substrates by a laser lift-off process.

22. The manufacturing method according to claim 13, wherein: The thickness of the first metal layer is 0.2-0.6 micrometers; and / or the thickness of the second metal layer is 2.4-6.8 micrometers; and / or the thickness of the third metal layer is 1000-10000 angstroms.

23. The manufacturing method according to claim 12, wherein: The thickness of the retaining wall is substantially equal to the thickness of the reinforcement layer; and / or, The thickness of each of the retaining wall and the reinforcing layer is set to 2-7 microns.

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