Method of manufacturing a plastic base for an electronic component

Abstract

The application provides a manufacturing method of an electronic component plastic base, and belongs to the technical field of injection molding processes. When the plastic base is injection molded, a gate is arranged outside the edge of the back of the plastic body, and the excess solidified material formed at the gate position is directly cut off after demolding, so that the plastic base without traces of runner connection on the back is obtained, the appearance of the product is ensured, the quality of the back of the product is ensured, and the problem of affecting the installation and use performance of the product is avoided. Meanwhile, four plastic bases share one main runner, which not only facilitates the design of the runner, but also reduces the number of main runners, thereby reducing the generation of gate material, saving injection molding materials, and reducing injection molding cost. In addition, the ejector pin in the mold presses on the metal substrate outside the plastic body, avoiding leaving traces of the ejector pin by pressing on the plastic body, and the ejector pin can also form a positioning effect on the metal substrate, avoiding deformation of the metal substrate under the high-strength pressure impact of the plastic, and ensuring the molding quality of the product.

Description

Technical Field

[0001] The invention relates to a method for manufacturing an electronic component plastic base, and belongs to the technical field of injection molding technology. Background Art

[0002] Packaged electronic components usually include a housing, a cover plate, and components packaged inside. For example, the Chinese invention patent application with application publication number CN108259018A discloses a plastic packaged quartz crystal resonator housing and its preparation method. The quartz crystal resonator includes a cover plate, a quartz lens, and a base. The base is a plastic base, and its structure is as follows: Figure 1 and Figure 2 As shown, it includes a plastic body 1 and a metal lead 2 injection-molded and cured on the plastic body 1. The plastic body 1 is square and has a receiving chamber 13 for accommodating a quartz lens. The plastic body 1 also includes two parallelly arranged first extending side surfaces 11 and second extending side surfaces 12 for extending the metal lead 2 respectively. Therefore, there are lead extension feet 21 on the first extending side surfaces 11 and the second extending side surfaces 12 respectively.

[0003] During the injection molding of the existing plastic base, the gate is set in the middle of the back surface 14 of the plastic body 1, such as Figure 2 As shown, after demolding, a runner connection mark 16 will be left on the back surface 14, which not only affects the appearance of the product, but also affects the quality of the back surface 14, and further affects the installation and use performance of the product. At the same time, when the entire metal substrate is placed in the mold and injection molded into a whole plate product with multiple plastic bases arranged horizontally and vertically, each plastic body needs a corresponding main runner, resulting in a large amount of sprue material, serious material waste, and increased manufacturing costs. In addition, the ejector pin of the existing injection mold is usually set corresponding to the receiving chamber 13, such as Figure 1 As shown, after the plastic base is demoulded, a pressure mark 15 will be left on the bottom surface of the receiving chamber 13, which may affect the appearance of the product at the least and the quality of the bottom surface of the receiving chamber 13 at the worst, thereby affecting the installation and use performance of the product. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for manufacturing a plastic base for electronic components to solve the problem in the prior art that the gate is set in the middle of the back of the plastic body, resulting in runner connection marks left on the back after demolding, thereby affecting the appearance of the product and even affecting the quality of the back and the installation and use performance of the product.

[0005] To achieve the above-mentioned purpose, the manufacturing method of the electronic component plastic base in the present invention adopts the following technical solutions:

[0006] A method for manufacturing a plastic base for electronic components. During injection molding of the plastic base, a gate is set on the outside of the back edge of the plastic body. After demoulding, excess solidified material formed at the gate position is directly cut off to obtain a plastic base with no runner connection traces on the back.

[0007] The beneficial effect of the above technical solution is that: the present invention changes the position of the gate and sets the gate on the outside of the back edge of the plastic body. After demolding, the excess solidified material formed at the gate position is directly cut off, so that a plastic base without runner connection traces on the back can be obtained, which not only ensures the appearance of the product, but also ensures the quality of the back of the product, avoiding problems that affect the installation and use performance of the product.

[0008] Furthermore, during injection molding, a whole metal substrate is placed in a mold, and after injection molding, a whole plate product is obtained with multiple plastic bases arranged in the horizontal and vertical directions. The whole plate product is then punched into single plastic bases, and the gate corresponding to any plastic base in the whole plate product is arranged adjacent to the gate corresponding to the adjacent plastic base on the horizontal side or the vertical side.

[0009] The beneficial effects of the above technical solution are: first making a whole plate product, and then punching it into single pieces, which is convenient for injection molding and can improve production efficiency; at the same time, the gate corresponding to any plastic base in the whole plate product is arranged adjacent to the gate corresponding to the adjacent plastic base on the lateral side or the longitudinal side, which facilitates the design of the runner and helps reduce mold design and manufacturing costs.

[0010] Furthermore, the gate is set at the corner position close to the square back side of the plastic main body. The plastic bases with two adjacent gates in the horizontal direction and the plastic bases with adjacent gates in the longitudinal direction in the whole plate product constitute a group of base groups. The four gates of a group of base groups are arranged adjacent to each other. During injection molding, the molten plastic passes through a main channel and four branch channels to the four gates of a group of base groups.

[0011] The beneficial effects of the above technical solution are: the gate is located at the corner position on the back side, and the four plastic bases constitute a group of base groups with the gates arranged adjacent to each other. During injection molding, the molten plastic passes through a main channel and four branch channels to the four gates of a group of base groups. In this way, the four plastic bases share one main channel, which not only facilitates the design of the flow channel and helps to reduce the mold design and manufacturing costs, but also the reduction in the number of main channels can reduce the generation of sprue materials, thereby saving injection molding materials and reducing injection molding costs.

[0012] Furthermore, the plastic body includes two parallelly arranged first and second protruding side surfaces for respectively extending the metal lead. The gate is arranged on the outside of the first protruding side surface and close to one of the corners of the first protruding side surface. Plastic bodies connected to the plastic body are respectively formed on the outside of the first protruding side surface and close to the other corner of the side surface and on the outside of the second protruding side surface and close to the two corners of the side surface. The lead protruding foot on the first protruding side surface is located between the plastic body corresponding to the side surface and the excess solidified material corresponding to the gate position. The lead protruding foot on the second protruding side surface is located between the two plastic bodies corresponding to the side surface. The three plastic bodies and the excess solidified material are cut off at the same time when punching out a single plastic base to directly form a lead protruding foot that meets the product requirements.

[0013] The beneficial effect of the above technical solution is that: for a plastic main body, the excess solidified material corresponding to the gate position and the three plastic bodies are respectively located at the four corners. When punching a single plastic base, in addition to cutting off the excess solidified material, the other three plastic bodies can also be cut off at the same time, thereby directly forming the lead extension pins corresponding to the first protruding side surface and the second protruding side surface, which is convenient for processing and can improve production efficiency.

[0014] Furthermore, during injection molding, a portion of the ejector pins in the mold press against the metal substrate between the plastic body and excess solidified material outside the first protruding side surface, while another portion of the ejector pins press against the metal substrate between the two plastic bodies outside the second protruding side surface, thereby avoiding ejector pin marks on the plastic body and simultaneously utilizing the ejector pins to position the metal substrate to prevent deformation of the metal substrate.

[0015] The beneficial effect of the above technical solution is that: the present invention changes the position of the ejector pin so that the ejector pin presses on the metal substrate between the plastic body and the excess solidified material outside the first protruding side surface, and presses on the metal substrate between the two plastic bodies outside the second protruding side surface, thereby avoiding ejector pin marks left on the plastic body due to pressing, thereby avoiding affecting the appearance and surface quality of the product and ensuring the installation and use performance of the product; at the same time, the ejector pin pressing on the metal substrate can also form a positioning effect on the metal substrate, preventing the metal substrate from being deformed under the high-intensity pressure impact of the plastic, thereby ensuring the molding quality of the product.

[0016] Furthermore, the plastic body is square in shape and includes two parallel arranged first and second protruding side surfaces for extending the metal leads respectively. Plastic bodies connected to the plastic body are respectively formed on the outside of the first protruding side surface and close to the two corners of the side surface and on the outside of the second protruding side surface and close to the two corners of the side surface. The lead protruding legs on the first protruding side surface are located between the two plastic bodies corresponding to the side surface, and the lead protruding legs on the second protruding side surface are located between the two plastic bodies corresponding to the side surface. The four plastic bodies are cut off at the same time when punching out a single plastic base to directly form lead protruding legs that meet product requirements.

[0017] The beneficial effect of the above technical solution is that: plastic bodies connected to the plastic body are respectively arranged at the corner positions outside the first protruding side surface and the second protruding side surface. When punching a single plastic base, the four plastic bodies are cut off at the same time, thereby directly forming the lead protruding feet corresponding to the first protruding side surface and the second protruding side surface, which is convenient for processing and can improve production efficiency.

[0018] Furthermore, during injection molding, a portion of the ejector pins in the mold press against the metal substrate between the two plastic bodies outside the first protruding side surface, while another portion of the ejector pins press against the metal substrate between the two plastic bodies outside the second protruding side surface, thereby avoiding ejector pin marks on the plastic body and simultaneously utilizing the ejector pins to position the metal substrate to prevent deformation of the metal substrate.

[0019] The beneficial effect of the above technical solution is that: the present invention changes the position of the ejector pin so that the ejector pin presses on the metal substrate between the two plastic bodies outside the first protruding side surface, and presses on the metal substrate between the two plastic bodies outside the second protruding side surface, thereby avoiding ejector pin marks left on the plastic body due to pressing, thereby avoiding affecting the appearance and surface quality of the product and ensuring the installation and use performance of the product; at the same time, the ejector pin pressing on the metal substrate can also form a positioning effect on the metal substrate, thereby preventing the metal substrate from being deformed under the high-intensity pressure impact of the plastic, and ensuring the molding quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a structural diagram of the front side of a plastic base in the prior art;

[0021] Figure 2 This is a structural diagram of the back of a plastic base in the prior art;

[0022] Figure 1 and Figure 2 Center: 1. Plastic body; 11. First extended side; 12. Second extended side; 13. Receiving chamber; 14. Back; 15. Top pressure mark; 16. Runner connection mark; 2. Metal lead; 21. Lead extension pin;

[0023] Figure 3 This is a structural diagram of the front side of the whole board product produced by the manufacturing method of the present invention;

[0024] Figure 4 This is a structural diagram of the back of the whole board product produced by the manufacturing method of the present invention;

[0025] Figure 5 A structural diagram of the front side of a single plastic base produced by the manufacturing method of the present invention;

[0026] Figure 6 This is a structural diagram of the back side of a single plastic base produced by the manufacturing method of the present invention.

[0027] Figures 3 to 6 Middle: 3. Metal substrate; 31. Metal lead; 32. Lead extension pin; 4. Plastic body; 41. Excess curing material; 42. Plastic body; 43. Back side; 44. First extension side; 45. Second extension side; 5. Gate. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present invention and are not intended to limit the present invention. That is, the embodiments described herein are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein may be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely intended to represent selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative work are within the scope of protection of the present invention.

[0030] It should be noted that relational terms such as "first" and "second" that may appear are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, terms such as "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article or device. In the absence of further limitations, an element defined by a sentence such as "including a..." does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0031] The features and performance of the present invention are further described in detail below with reference to the embodiments.

[0032] The preferred embodiment of the manufacturing method of the electronic component plastic base of the present invention (hereinafter referred to as the manufacturing method) is as follows:

[0033] The electronic component targeted by the manufacturing method in this embodiment is a quartz crystal resonator, such as Figure 3 and Figure 4 As shown, during the injection molding of the plastic base of the quartz crystal resonator, a whole metal substrate 3 is placed in a mold, and after injection molding, a whole plate product with multiple plastic bases arranged in both the horizontal and vertical directions is obtained. The whole plate product is then punched into individual plastic bases, and the gate 5 corresponding to any plastic base in the whole plate product is arranged adjacent to the gate 5 corresponding to the adjacent plastic base on one side in the horizontal direction or the one side in the vertical direction. Specifically, combined with Figure 5 and Figure 6 As shown, the plastic body 4 of the single plastic base after punching is rectangular, including two parallelly arranged first protruding side surfaces 44 and second protruding side surfaces 45 for the metal lead 31 to extend respectively, that is, two side surfaces in the length direction. This structure is the same as that of the prior art.

[0034] During the injection molding process, Figure 3 and Figure 4 As shown, the metal lead 31 corresponding to each plastic base is connected to the entire metal substrate 3, and the gate 5 corresponding to each plastic base is arranged on the outside of the edge of the back side 43 of the plastic body 4, close to the corner position of the back side 43, and is also located on the outside of the first protruding side 44 and close to one of the corners of the first protruding side 44. Therefore, the plastic bases with two adjacent gates in the horizontal direction and the plastic bases with adjacent gates in the longitudinal direction in the whole plate product constitute a group of base groups. The four gates 5 of a group of base groups are arranged adjacent to each other. During injection molding, the molten plastic passes through a main channel and four branch channels to the four gates 5 of a group of base groups. In this way, the four plastic bases share one main channel, which not only facilitates the design of the flow channel and helps to reduce the mold design and manufacturing costs, but also reduces the number of main channels. It can reduce the generation of sprue material, thereby saving injection molding materials and reducing injection molding costs. At the same time, since the gate 5 is located on the outside of the edge of the back side of the plastic body, the excess solidified material 41 formed at the gate 5 position is directly cut off after demolding, and a plastic base without flow channel connection traces on the back can be obtained (such as Figure 6 This ensures both the appearance of the product and the quality of the back of the product, avoiding problems that affect the installation and performance of the product.

[0035] Further, combined with Figures 3 to 6As shown, a plastic body 42 connected to the plastic body 4 is formed on the outside of the first protruding side surface 44 and near the other corner of the side surface, and on the outside of the second protruding side surface 45 and near the two corners of the side surface. That is, the metal substrate 3 corresponding to the position is processed with a notch, so that the plastic body 42 can be injection molded. Including the above-mentioned excess solidified material 41, which also has a notch at the corresponding position on the metal substrate 3, the excess solidified material 41 and the other three plastic bodies 42 are located exactly at the four corners, arranged symmetrically in the horizontal and vertical directions, and have the same outer edge dimensions. The difference is that because the excess solidified material 41 corresponds to the gate, a boss is formed at this position that is thicker than the other three plastic bodies 42. However, the thickness of the boss is also much smaller than the height of the side wall of the plastic body 4. Of course, the three plastic bodies 42 are thinner, about 1 mm, which can reduce material waste.

[0036] The lead extension pin 32 on the first protruding side 44 is located between the plastic body 42 corresponding to that side and the excess solidified material 41 corresponding to the gate position. The lead extension pin 32 on the second protruding side 45 is located between the two plastic bodies 42 corresponding to that side. The three plastic bodies 42 and the excess solidified material 41 are simultaneously trimmed away when punching out a single plastic base, directly forming the lead extension pin that meets product requirements. In other words, when punching out a single plastic base, the manufacturing method of the present invention can simultaneously trim away the other three plastic bodies 42 in addition to the excess solidified material 41, thereby directly forming the lead extension pin corresponding to the first and second protruding sides. This facilitates processing and improves production efficiency.

[0037] Furthermore, during injection molding, some ejector pins within the mold press against the metal substrate 3 between the plastic body 42 and excess solidified material 41 outside the first protruding side 44, while others press against the metal substrate 3 between the two plastic bodies 42 outside the second protruding side 45. This prevents ejector pin marks from pressing against the plastic body 4, thereby preventing any impact on the product's appearance and surface quality, and ensuring proper installation and use. Furthermore, the ejector pins pressing against the metal substrate 3 also provide a positioning effect, preventing deformation of the metal substrate 3 under the high-intensity pressure of the plastic, thereby ensuring product molding quality.

[0038] In other embodiments of the manufacturing method of the plastic base of an electronic component: the gate is not arranged on the outside of the first protruding side surface and close to one of the corners of the first protruding side surface, but is arranged on the outside of the side surface perpendicular to the first protruding side surface, that is, it is arranged on the outside of one of the side surfaces in the width direction and close to the corner of the side surface. At this time, the outside of the first protruding side surface and close to the two corners of the side surface, and the outside of the second protruding side surface and close to the two corners of the side surface are also respectively formed with plastic bodies connected to the plastic body. These four plastic bodies plus the excess solidified material formed at the gate position are five in total, and all of them are cut off when punching out a single plastic base, directly forming lead protrusions that meet product requirements.

[0039] In other embodiments of the method for manufacturing the plastic base of an electronic component: the plastic body may also be square.

[0040] In other embodiments of the method for manufacturing a plastic base for an electronic component: regardless of whether the gate is arranged on the outside of the first protruding side surface and close to one of the corners of the first protruding side surface, the ejector pin in the mold can be pressed against the bottom surface of the receiving chamber of the plastic body instead of the metal substrate outside the plastic body, as in the prior art.

[0041] In other embodiments of the method for manufacturing a plastic base for an electronic component: no plastic body is formed during the injection molding process, that is, in the preferred embodiment, the notch corresponding to the plastic body on the metal substrate does not exist, and the metal substrate here needs to be cut off when punching out a single plastic base later.

[0042] In other embodiments of the method for manufacturing a plastic base for an electronic component: a base group may not be composed of four plastic bases, that is, four plastic bases do not share one main runner, but a base group may be composed of plastic bases with two adjacent gates in the transverse direction or plastic bases with two adjacent gates in the longitudinal direction. In this case, the two plastic bases share one main runner, that is, the molten plastic passes through one main runner and two branch runs to the two gates of a group of base groups. Of course, the gates can be located at the corners of the back side of the square of the plastic body, or in the middle of the side of the square, as long as the two gates of a group of bases are arranged adjacent to each other.

[0043] In other embodiments of the method for manufacturing a plastic base for an electronic component: any plastic base does not share a main flow channel with other plastic bases. In this case, although the gate is set on the outside of the back edge of the plastic body, each plastic base still corresponds to an independent main flow channel and is not arranged adjacent to the gates of other plastic bases. In this case, the plastic body can be square or round.

[0044] In other embodiments of the method for manufacturing a plastic base for an electronic component, the electronic component targeted by the manufacturing method may also be a patch sensor, such as a pyroelectric infrared sensor.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The scope of patent protection of the present invention shall be based on the claims. Any equivalent structural changes made using the description and drawings of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A method for manufacturing a plastic base for an electronic component, characterized in that: During the injection molding of the plastic base, the gate is set on the outside of the back edge of the plastic main body. After demoulding, the excess solidified material formed at the gate position is directly cut off to obtain a plastic base without runner connection traces on the back; the plastic main body includes two parallel protruding side surfaces for extending the metal leads respectively; the gate is provided on the outside of one of the protruding side surfaces and close to one of the corners of the side surface, and a plastic body connected to the plastic main body is formed at the other corner position, and the lead protruding legs on the side surface are located between the plastic body and the excess solidified material corresponding to the gate position; the plastic body connected to the plastic main body is respectively formed on the outside of the other protruding side surface and close to the two corners of the side surface, and the lead protruding legs on the side surface are located between the two plastic bodies; a plastic body is formed at the position of the excess solidified material The thickness of the boss is thicker than that of the other three plastic bodies; during injection molding, the entire metal substrate is placed in the mold, and after injection molding, a whole plate product with multiple plastic bases arranged in the horizontal and vertical directions is obtained, and then the whole plate product is punched into single plastic bases. During punching, the three plastic bodies and excess solidified material connected to each plastic base are all cut off. After punching, the plastic body of the single plastic base is square; during injection molding, a part of the ejector pins in the mold presses on the metal substrate between one of the plastic bodies extending outward from the side and the excess solidified material, and at the same time, a part of the ejector pins presses on the metal substrate between the other two plastic bodies extending outward from the side, so as to avoid leaving ejector pin marks on the plastic body, and at the same time, the ejector pins are used to position the metal substrate to prevent deformation of the metal substrate.

2. The method for manufacturing an electronic component plastic base according to claim 1, characterized in that: The gate corresponding to any plastic base in the whole plate product is arranged adjacent to the gate corresponding to the adjacent plastic base on one lateral side or one longitudinal side.

3. The method for manufacturing an electronic component plastic base according to claim 2, characterized in that: The gate is set at the corner position close to the square back of the plastic main body. The plastic bases with two adjacent gates in the horizontal direction and the plastic bases with adjacent gates in the vertical direction in the whole plate product constitute a group of base groups. The four gates of a group of base groups are arranged adjacent to each other. During injection molding, the molten plastic passes through a main channel and four branch channels to the four gates of a group of base groups.

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