Connector device and method of manufacturing a connector device

Abstract

A connector device includes a circuit board, a connector, and a molded resin portion. The circuit board includes a conductor path. The connector includes a cylindrical housing made of resin and a terminal that protrudes from an inner side of the housing to an outer side of the housing in an axial direction of the housing, and is connected to the conductor path. The molded resin portion covers the circuit board, the terminal located on the outer side of the housing, and a portion of the housing. The housing and the molded resin portion include a fusion portion formed by fusion of constituent materials of the housing and the molded resin portion. The fusion portion is provided over an entire circumference of the housing. A difference between a maximum width and a minimum width in a circumferential direction of the housing is 30% or less of the maximum width.

Description

Technical Field

[0001] This disclosure relates to connector devices and methods for manufacturing connector devices.

[0002] This application claims priority based on Japanese Patent Application No. 2020-039413 filed on March 6, 2020, and incorporates all the contents of the Japanese application. Background Technology

[0003] Patent Document 1 discloses an electronic device in which a circuit board and a portion of a connector are housed within a casing. The casing is constructed by assembling a housing and a cover. A seal is located between the housing and the cover, making the interior space of the casing a waterproof space. Hereinafter, the electronic device will be referred to as a connector device.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-004698 Summary of the Invention

[0007] The connector device disclosed herein includes a circuit board, a connector, and a molding resin portion. The circuit board has conductive paths. The connector includes a cylindrical housing made of resin and terminals that protrude from the inside of the housing outward in the axial direction and connect to the conductive paths. The molding resin portion covers the circuit board, the terminals located on the outside of the housing, and a portion of the housing. The housing and the molding resin portion have welded portions formed by fusing their constituent materials together. The welded portions are provided throughout the entire circumference of the housing, and the difference between the maximum and minimum widths of the welded portions in the circumferential direction of the housing is less than 30% of the maximum width.

[0008] The disclosed method for manufacturing a connector device includes: a step of preparing an assembly comprising a circuit board and a connector; a step of constructing an integral body by covering a portion of the assembly with a molding resin portion; and a step of irradiating the integral body with a laser, wherein the circuit board has a conductive path, and the connector has: a cylindrical housing made of resin; and terminals protruding from the inside of the housing outward in the axial direction and connected to the conductive path; in the step of constructing the integral body, the circuit board, the terminals located on the outside of the housing, and a portion of the housing are covered together with the molding resin portion; and in the step of irradiating the laser, the entire circumference of the housing is simultaneously irradiated with a laser through the molding resin portion, thereby fusing the constituent materials of the housing and the molding resin portion together. Attached Figure Description

[0009] Figure 1 This is a perspective view showing an outline of the connector device according to an embodiment.

[0010] Figure 2 This is a side view showing an outline of the connector device according to an embodiment.

[0011] Figure 3 yes Figure 1 Sectional view III-III.

[0012] Figure 4 This is a perspective view showing an outline of the assembly prepared in the manufacturing method of the connector device according to the embodiment.

[0013] Figure 5 This is a perspective view showing an outline of an integral body obtained by covering a portion of the assembly with a molded resin portion in a method for manufacturing a connector device according to an embodiment.

[0014] Figure 6 This is an explanatory diagram illustrating the process of irradiating a monolith with a laser in the manufacturing method of the connector device according to the embodiment.

[0015] Figure 7 This is a side view showing a partial outline of the connector device of the modified example.

[0016] Figure 8 This is a perspective view of the test specimen used in the shear-tensile test to evaluate adhesive properties. Detailed Implementation

[0017] [The problem this disclosure aims to solve]

[0018] The connector device described in Patent Document 1 is large due to its housing. Furthermore, the connector device described in Patent Document 1 ensures waterproofing by placing a seal between the outer shell and the cover constituting the housing; however, it has many parts, making manufacturing complex.

[0019] One objective of this disclosure is to provide a connector device that is not only small and easy to manufacture but also has excellent waterproof performance. Another objective of this disclosure is to provide a method for manufacturing a connector device that easily yields a small and waterproof connector device.

[0020] [The Effects of This Disclosure]

[0021] The connector device disclosed herein is not only small and easy to manufacture, but also has excellent waterproof performance. The manufacturing method of the connector device disclosed herein easily yields a small connector device with excellent waterproof performance.

[0022] [Description of embodiments of this disclosure]

[0023] First, the implementation methods of this disclosure are listed and explained.

[0024] (1) A connector device according to one aspect of the present disclosure includes a circuit board, a connector, and a molding resin portion. The circuit board has a conductor path. The connector has: a cylindrical housing made of resin; and terminals protruding from the inside of the housing outward in the axial direction of the housing and connected to the conductor path. The molding resin portion covers the circuit board, the terminals located on the outside of the housing, and a portion of the housing together. The housing and the molding resin portion have a welded portion formed by fusing their constituent materials together. The welded portion is provided throughout the entire circumference of the housing. The difference between the maximum width and the minimum width of the welded portion in the circumferential direction of the housing is less than 30% of the maximum width.

[0025] The connector device disclosed herein has a fusion joint provided throughout the entire circumference of the connector housing. Therefore, in the connector device of this disclosure, the fit between the housing and the molding resin portion is excellent throughout the entire circumference of the housing. Consequently, the connector device of this disclosure can prevent liquids such as water from seeping in through the gap between the housing and the molding resin portion. By preventing liquid seepage, liquid adhesion to conductive components such as circuit boards and terminals covered by the molding resin portion can be prevented.

[0026] The difference between the maximum and minimum circumferential widths of the welded portion and the housing is less than 30% of the maximum width. Therefore, it can be said that the width deviation of the welded portion is small in the circumferential direction of the housing. This small width deviation of the welded portion reduces the deviation in adhesive strength between the housing and the molded resin portion. When the deviation in adhesive strength is small, the sealing performance is easily improved. Based on the above, the connector device of this disclosure has excellent waterproof performance.

[0027] The connector device disclosed herein covers the circuit board, terminals, and other conductive components with a molded resin portion. Therefore, the connector device of this disclosure does not require a separate housing to house the conductive components. Furthermore, as described above, the connector device of this disclosure provides excellent waterproof performance through the welded portion, thus eliminating the need for a separate seal. Therefore, the connector device according to this disclosure has a small number of components, eliminating the need for assembling a housing and configuring seals, resulting in excellent manufacturability. Based on the above, the connector device of this disclosure is small and easy to manufacture.

[0028] (2) As an example of the connector device of this disclosure, a plurality of measuring points with four or more points are provided along the circumference of the housing, the ratio of the maximum width to the average width of the welded portion based on the plurality of measuring points is 130% or less, and the ratio of the minimum width to the average width is 70% or more.

[0029] It can be said that the width of the welded portion in the above-described method is the same along the circumference of the shell. Because the welded portion has a uniform width, it is easy to ensure that the bonding strength between the shell and the molded resin portion is constant along the circumference of the shell. Therefore, the waterproof performance of the above-described method is superior.

[0030] (3) As an example of the connector device of this disclosure, the housing has a protrusion provided throughout the circumference, and the welding portion is provided on the protrusion.

[0031] The welded section is typically constructed using laser welding. In laser welding, a laser beam is irradiated onto the housing through the molding resin section, generating heat at the interface between the housing and the molding resin section. This heat causes the constituent materials of the housing and the molding resin section to fuse together. Here, the molding resin section transmits the laser beam, while the housing absorbs it. The housing, having absorbed the laser beam, heats up, and its constituent materials melt. The molten heat in the housing is transferred to the molding resin section, causing it to heat up and melt. The welded section is formed by the molten constituent materials of the housing and the molding resin section.

[0032] The above-described method incorporates a welded portion in the protrusion. In other words, this method creates a welded portion by generating heat from a laser on the protrusion. Because heat is generated on the protrusion, it is easily concentrated, resulting in a strong welded portion. Therefore, the above-described method offers superior waterproofing performance.

[0033] (4) As an example of the connector device disclosed herein, the transmittance of the molded resin portion is 40% or more, the transmittance of the molded resin portion is the ratio of light quantity a1 to light quantity b1 (b1 / a1) × 100, the light quantity a1 is the light quantity of a laser with a wavelength of 940 nm, and the light quantity b1 is the light quantity of the laser transmitted through a test piece with a thickness of 2 mm made of the constituent material of the molded resin portion.

[0034] As described above, the welded section is formed by laser welding. Since the transmittance of the molding resin portion is over 40%, the laser is not easily absorbed by the molding resin portion and can easily reach the surface of the housing. Therefore, the above method easily generates laser heat at the boundary between the housing and the molding resin portion, facilitating the formation of the welded section.

[0035] (5) As an example of the connector device of this disclosure, the transmittance of the housing is 10% or less, the transmittance of the housing is the ratio of light quantity a2 to light quantity b2 (b2 / a2)×100, the light quantity a2 is the light quantity of a laser with a wavelength of 940nm, and the light quantity b2 is the light quantity of the laser transmitted through a test piece with a thickness of 2mm made of the constituent material of the housing.

[0036] As described above, the welded section is formed by laser welding. Since the transmittance of the housing is less than 10%, the laser is easily absorbed by the housing. Therefore, the above method easily generates laser heat at the interface between the housing and the molded resin part, thus easily forming the welded section.

[0037] (6) As an example of the connector device of this disclosure, the molding resin portion comprises polyamide resin or polyester.

[0038] Polyamide resins possess excellent mechanical strength, etc. Therefore, molding resin portions containing polyamide resin readily provide mechanical protection for components covered by the molding resin portion. Polyesters possess excellent electrical insulation and water resistance, etc. Therefore, molding resin portions containing polyester readily provide electrochemical protection for components covered by the molding resin portion.

[0039] (7) As an example of the connector device of this disclosure, the housing is made of polyester.

[0040] The above methods can easily provide electrochemical protection for terminals, etc.

[0041] (8) As an example of the connector device of this disclosure, the molding resin portion and the housing are both made of polyester.

[0042] The above-described method uses the same type of resin in both the molded resin portion and the shell, making it easier to approximate the solubility parameters of the two components. Therefore, the molding resin portion and the shell exhibit good adhesion. Consequently, the waterproof performance of this method is superior. Furthermore, by using the same type of resin in the welded portion, the strength of the welded portion itself is easily increased. Therefore, the sealing between the molded resin portion and the shell is even stronger in this method.

[0043] (9) As an example of the connector device of this disclosure, the molded resin portion has a surface that is in contact with the atmosphere.

[0044] In the above-described method, the surface of the molded resin portion is located on the outermost layer. That is, the above-described method does not include a housing for storing circuit boards, etc. Therefore, the above-described method is easily miniaturized.

[0045] (10) As an example of the connector device of this disclosure, the molded resin part is an injection molded body.

[0046] Injection-molded bodies can be manufactured through injection molding. In injection molding, the constituent material of the molding resin portion is filled into a mold under pressure to cover the circuit board, housing, etc. Therefore, compared with casting, injection molding makes it easier to fill all corners of the molding resin portion with the constituent material. Consequently, gaps are less likely to form between the circuit board or housing and the molding resin portion. Because gaps are less likely to form, water vapor condenses within the gaps, reducing the likelihood of water droplets forming. Furthermore, by utilizing injection molding, the shape of the molding resin portion offers a high degree of freedom.

[0047] (11) As an example of the connector device of this disclosure, the circuit board and the connector constitute a control unit.

[0048] The aforementioned method offers high water resistance between the housing and the molded resin part, enabling long-term use. Therefore, this method is suitable for use in control units. Furthermore, its compact size also makes it suitable for use in control units.

[0049] (12) A method for manufacturing a connector device according to one aspect of the present disclosure includes: a step of preparing an assembly including a circuit board and a connector; a step of constructing an integral body by covering a portion of the assembly with a molding resin portion; and a step of irradiating the integral body with a laser, wherein the circuit board has a conductor circuit, and the connector has: a cylindrical housing made of resin; and terminals protruding from the inside of the housing to the outside of the housing in the axial direction and connected to the conductor circuit; in the step of constructing the integral body, the circuit board, the terminals located on the outside of the housing, and a portion of the housing are covered together with the molding resin portion; and in the step of irradiating the laser, the entire circumference of the housing is irradiated with a laser through the molding resin portion, thereby fusing the constituent materials of the housing and the molding resin portion together.

[0050] The method for manufacturing the connector device disclosed herein involves irradiating the entire circumference of the connector housing with a laser. Hereinafter, this laser irradiation method will be referred to as the overall type. In addition to the overall type, laser irradiation can also be performed while simultaneously scanning the circumference of the housing with the laser. Hereinafter, this laser irradiation method will be referred to as the scanning type.

[0051] In laser welding, heat is generated at the boundary between the housing and the molded resin part. Under generalized irradiation, the heat generated at this boundary tends to become substantially uniform regardless of the location. Therefore, under generalized irradiation, a welded section with small width deviation can be formed by fusing the constituent materials of the housing and the molded resin part. Specifically, a welded section can be formed throughout the entire circumference of the housing, such that the difference between the maximum and minimum circumferential widths of the housing is less than 30% of the maximum width. On the other hand, under scanning irradiation, the heat generated at the boundary is also transmitted in the scanning direction, making the heat more uneven. Therefore, under scanning irradiation, welding is easier to perform with scanning, and a welded section with a larger width is easier to form with scanning.

[0052] In the case of generalized irradiation, multiple laser emission outlets are arranged side-by-side along the circumference of the housing, and laser light is simultaneously emitted from these multiple laser emission outlets. The laser emission outlets are arranged side-by-side on the circumferential surface of the housing in a manner where the laser spots are evenly distributed. Therefore, in the case of generalized irradiation, it is easy to miniaturize the laser irradiation device. On the other hand, in the case of scanning irradiation, it is necessary to scan the laser emission outlets along the circumference of the housing. Therefore, in the case of scanning irradiation, a mechanism for scanning the laser emission outlets is required, and the device is easily enlarged.

[0053] Based on the above, the manufacturing method of the connector device disclosed herein can easily produce a connector device with a general-purpose irradiation and a fusion joint.

[0054] (13) As an example of the manufacturing method of the connector device disclosed herein, the process of irradiating the laser is carried out in such a way that the molding resin portion is pressed toward the housing side.

[0055] By pressing the molded resin part towards the housing side, gaps are less likely to form between the housing and the molded resin part. By irradiating with a laser in a state where there is essentially no gap between the housing and the molded resin part, the constituent materials of the housing and the molded resin part are easily fused together, and the tightness of the fit between the housing and the molded resin part is easily improved.

[0056] [Details of the embodiments of this disclosure]

[0057] The following is a reference to the appendix. Figure 1 The details of embodiments of this disclosure will be described below. The same reference numerals in the figures denote the same names of objects.

[0058] <Connector Device>

[0059] like Figure 1 and Figure 2As shown, the connector device 1 of this embodiment includes a circuit board 2 and a connector 3. The circuit board 2 includes a conductor path 20. The connector 3 includes a housing 31 and terminals 32. The housing 31 is a cylindrical shape made of resin. The terminals 32 protrude outward in the axial direction of the housing 31 and connect to the conductor path 20. One of the features of the connector device 1 of this embodiment is that it includes a molded resin portion 4, which covers the circuit board 2, the terminals 32 located on the outside of the housing 31, and a portion of the housing 31. In addition, one of the features of the connector device 1 of this embodiment is that it includes a welded portion 5 provided throughout the entire circumference of the housing 31. The welded portion 5 is typically formed by laser welding. The welded portion 5 is formed by using the heat of a laser to fuse the constituent materials of the housing 31 and the molded resin portion 4 together. The structure is described in detail below. In each figure, the welded portion 5 is indicated by crosshairs.

[0060] [Circuit board]

[0061] The circuit board 2 is a plate-shaped component for mounting electronic components such as semiconductor relays (not shown), connectors 3, etc. The circuit board 2 can be a printed circuit board. The circuit board 2 includes conductive paths 20. Conductive paths 20 refer to the exposed portions of the conductive components constituting the circuit of the circuit board 2. Conductive paths 20 include, for example, conductive patterns 21 on the circuit board 2, terminals of electronic components mounted on the circuit board 2 (not shown), solder 22, etc., with the solder 22 connecting the terminals of the electronic components or the terminals 32 of the connector 3 to the conductive patterns 21. The circuit board 2 is embedded in the molding resin portion 4, described later.

[0062] [Connector]

[0063] Connector 3 is a connecting component to which the other-side connector (not shown) is connected. The other-side connector is connected to vehicle electrical installation components, etc., via a wiring harness. Connector 3 is mounted on the circuit board 2. Connector 3 includes a housing 31 and terminals 32. Connector 3 further includes an assembly part 33 and a fixing member 34. Figure 2 The connector 3 is arranged with a gap relative to the extended surface of the circuit board 2. Figure 1 and Figure 2 The connector 3 shown is positioned above the circuit board 2.

[0064] <Shell>

[0065] The housing 31 is a cylindrical member into which the connector on the opposite side is inserted. The housing 31 is a bottomed cylindrical shape with an opening on the side where the connector is inserted and a closed side opposite to that opening. The terminal 32, described later, passes through this closed surface. That is, the terminal 32 extends from the inside of the housing 31 towards the outside through this closed surface. Hereinafter, this closed surface will sometimes be referred to as the closed end face. The terminal 32 located on the outside of the housing 31 protrudes from this closed end face. The closed end face and its vicinity are embedded throughout the entire circumference of the molding resin portion 4, described later.

[0066] In this example, the cross-sectional shape of the housing 31 is a racetrack shape. The cross-section of the housing 31 is a section cut along a direction orthogonal to the axial direction of the housing 31. The racetrack shape is a shape in which the ends of a pair of parallel and equal-length straight sections are connected to each other by an arc.

[0067] Transmittance

[0068] The transmittance of the housing 31 is preferably low. The transmittance of the housing 31 is the ratio (b2 / a2) × 100 of the light intensity a2 of a 940 nm laser and the light intensity b2 of the laser transmitted through a 2 mm thick test piece made of the constituent material of the housing 31. A housing 31 with low transmittance readily absorbs the laser light. That is, a housing 31 with low transmittance is easily melted by the laser light. Therefore, the welded portion 5 described later is easily formed. The transmittance of the housing 31 is preferably, for example, 10% or less. A housing 31 with a transmittance of 10% or less readily absorbs the laser light and readily melts, thus easily forming the welded portion 5. The transmittance of the housing 31 is further preferably 7% or less, and particularly preferably 5% or less. The color of the housing 31 is preferably opaque black, gray, or the like. These colors readily absorb the laser light.

[0069] Material

[0070] The housing 31 preferably comprises, for example, polyester. Polyester has excellent electrical insulation and water resistance. Therefore, a housing 31 containing polyester can easily provide mechanical and electrochemical protection for terminals 32 and the like located on the inner side of the housing 31. Polyester is typically represented by polybutylene terephthalate (PBT). The housing 31 preferably further comprises a colorant. Colorants can include those that reduce the transmittance of the housing 31. Carbon black can be an example of a colorant. By including carbon black, the color of the housing 31 can easily be changed to black.

[0071] <Terminal>

[0072] Terminal 32 electrically connects the counterpart connector and the circuit board 2. Terminal 32 extends through the closed end face of housing 31, extending from the inside of housing 31 towards the outside. The portion of terminal 32 located inside housing 31 is arranged along the axial direction of housing 31. One end of terminal 32 located inside housing 31 is electrically connected to the counterpart connector. The portion of terminal 32 located outside housing 31 is bent in a manner extending towards the circuit board 2. In this example, terminal 32 is constructed of a metal wire bent substantially vertically. The other end of terminal 32 located outside housing 31 is electrically connected to the conductive pattern 21 of circuit board 2. The electrical connection between the other end of terminal 32 and conductive pattern 21 can be achieved using solder 22. Terminal 32 can also be a press-fit terminal. In this case, terminal 32 is electrically connected to conductive pattern 21 by press-fitting. Therefore, when terminal 32 is a press-fit terminal, solder 22 can be omitted. The other end of terminal 32 extends through circuit board 2. Terminal 32, located on the outside of housing 31, is embedded in molding resin part 4.

[0073] Assembly Department

[0074] The mounting portion 33 is integrally formed with the housing 31. In this example, the mounting portion 33 is integrally formed as part of the housing 31. The mounting portion 33 is bent into an L-shape extending from the closed end face of the housing 31 towards the circuit board 2. In this example, the mounting portion 33 is composed of a round bar member bent substantially vertically. In this example, two mounting portions 33 are provided with a gap between them and the terminal 32. A threaded hole is provided on the end face of the mounting portion 33. The fixing member 34, described later, is mounted in the threaded hole. By clamping the circuit board 2 with the end face of the mounting portion 33 and the fixing member 34, the circuit board 2 and the housing 31 are fixed. The mounting portion 33 is embedded in the molding resin portion 4.

[0075] <Fixed Components>

[0076] The fixing member 34 secures the housing 31 to the circuit board 2. The fixing member 34 can be, for example, a screw. In this example, the fixing member 34 is made of resin screws. In this example, two fixing members 34 pass through through holes (not shown) provided in the circuit board 2 and are assembled to respective mounting portions 33. Through the assembly of the fixing members 34 relative to the mounting portions 33, the housing 31 is fixed to the circuit board 2. A portion of the fixing member 34 protrudes from the surface of the circuit board 2. The fixing member 34 is embedded in the molded resin portion 4.

[0077] [Molding Resin Section]

[0078] The molding resin part 4 provides mechanical and electrochemical protection to conductive components such as the circuit board 2 and terminals 32 from the external environment. The molding resin part 4 covers the circuit board 2, the terminals 32 located on the outside of the housing 31, and a portion of the housing 31. In this example, the molding resin part 4 covers most of the circuit board 2 and the connector 3. Most of the connector 3 is the area within the housing 31 excluding the end of the opening where the opposite connector is inserted.

[0079] The molding resin part 4 has a surface that is in contact with the atmosphere. "In contact with the atmosphere" means that the connector assembly 1 is not covered by a housing or the like, but is exposed, forming the outermost surface of the connector assembly 1. In this example, the surface of the molding resin part 4 covers the entire area and is in contact with the atmosphere. That is, the connector assembly 1 is without a housing. Therefore, the connector assembly 1 is small.

[0080] Transmittance

[0081] The transmittance of the molding resin part 4 is preferably high. The transmittance of the molding resin part 4 is the ratio (b1 / a1) × 100 of the light intensity a1 of a 940nm laser and the light intensity b1 of the laser transmitted through a 2mm thick test piece made of the molding resin part 4's constituent material. A molding resin part 4 with high transmittance is less likely to absorb the laser, allowing it to easily reach the housing 31. Therefore, the welded portion 5 described later is easily formed. The transmittance of the molding resin part 4 is preferably, for example, 40% or more. A molding resin part 4 with a transmittance of 40% or more allows the laser to easily pass through, thus facilitating the formation of the welded portion 5. The transmittance of the molding resin part 4 is further preferably 45% or more, and particularly preferably 50% or more. The color of the molding resin part 4 is preferably colorless and transparent, white transparent, or opaque white, etc. These colors allow the laser to easily pass through.

[0082] Material

[0083] The molding resin portion 4 preferably comprises, for example, polyamide resin or polyester. Polyamide resin has excellent mechanical strength, etc. Therefore, the molding resin portion 4 containing polyamide resin can easily provide mechanical protection to the component covered by the molding resin portion 4. Polyester has excellent electrical insulation and water resistance, etc. Therefore, the molding resin portion 4 containing polyester can easily provide electrochemical protection to the component covered by the molding resin portion 4.

[0084] The housing 31 and the molding resin portion 4 preferably contain the same type of resin. In particular, the housing 31 and the molding resin portion 4 are preferably made of completely identical resin. By containing the same type of resin, the solubility parameters of the housing 31 and the molding resin portion 4 are easily made similar. Therefore, the housing 31 and the molding resin portion 4 have good compatibility. Furthermore, by containing the same type of resin in the weld portion 5 (described later), the strength of the weld portion 5 itself is easily increased. Therefore, the adhesion between the housing 31 and the molding resin portion 4 is even stronger. For example, if the housing 31 contains polyester, the molding resin portion 4 preferably contains polyester.

[0085] The molding resin portion 4 is preferably an injection-molded body. Injection-molded bodies can be manufactured by injection molding. In injection molding, the constituent material of the molding resin portion 4 is filled into the molding die while pressure is applied, covering the circuit board 2, housing 31, etc. Therefore, compared to casting, injection molding makes it easier to fill all corners of the molding die with the constituent material of the molding resin portion 4. Therefore, compared to casting, gaps are less likely to form between the injection-molded body and the molding resin portion 4, such as the circuit board 2 or housing 31. Because gaps are less likely to form, water vapor condenses within the gaps, making it less likely for water droplets to form. Furthermore, the shape of the molding resin portion 4 of the injection-molded body has a high degree of freedom. In this example, the molding resin portion 4 is constructed of a quadrangular prism.

[0086] The melting point of the constituent material of the molding resin part 4 is preferably 180°C or higher and 200°C or lower. By having a melting point of 180°C or higher, the molding resin part 4 can be prevented from melting and deforming when the connector device 1 is used. On the other hand, by having a melting point of 200°C or lower, the molding temperature during injection molding can be set to 200°C or lower, preventing the solder 22 and the like from melting at the molding temperature.

[0087] The molding resin part 4 is an injection-molded body, and therefore has a runner trace portion 40. The trace portion 40 is a portion corresponding to the runner used to fill the cavity of the mold cavity with the constituent material of the molding resin part 4 during molding. The molding resin part 4, which is produced by injection molding, has an appendage portion having a portion corresponding to the runner. By removing this appendage portion, the runner trace portion 40 is formed in the molding resin part 4. In addition to the portion corresponding to the runner, this appendage portion sometimes has a portion corresponding to the gating channel, and sometimes it further has a portion corresponding to the runner. For example, the appendage portion can be removed by folding it off. Because terminals 32, etc., are arranged around the periphery of the housing 31, the runner during injection molding is preferably set at a position away from the housing 31. Therefore, the trace portion 40 is preferably provided on the side of the molding resin part 4 opposite to the housing 31.

[0088] [Welded section]

[0089] like Figure 3 As shown, the welded portion 5 is formed by fusing the constituent materials of the housing 31 and the molding resin portion 4 together. Welding refers to satisfying at least one of the following: the constituent materials are mixed together; the constituent materials are compatible; material failure occurs due to shear force rather than interface failure; the surface of the connector 3 becomes rough. Interface failure refers to failure occurring at the interface between the housing 31 and the molding resin portion 4. Therefore, the housing 31 and the molding resin portion 4 peel off along their interface. Therefore, the constituent material of one component (housing 31 or molding resin portion 4) is not attached to the other component. Material failure refers to failure occurring inside one component (housing 31 or molding resin portion 4). Therefore, with the constituent material of one component attached to the opposite surface of the other component, the two components separate. The welded portion 5 improves the sealing performance of the housing 31 and the molding resin portion 4.

[0090] The welded portion 5 is provided around the entire circumference of the housing. Therefore, it can prevent liquids such as water from seeping in from between the housing 31 and the molding resin portion 4. Therefore, it can prevent liquids from adhering to conductive components such as the circuit board 2 and terminals 32.

[0091] The difference between the maximum and minimum width of the welded portion 5 in the circumferential direction of the housing 31 is less than 30% of the maximum width. Therefore, it can be said that the deviation in the width of the welded portion 5 is small in the circumferential direction of the housing 31. Because the deviation in the width of the welded portion 5 is small, the deviation in the adhesive strength between the housing 31 and the molding resin portion 4 can be reduced. Sometimes, the ratio of the above difference to the maximum width of the welded portion 5 in the circumferential direction of the housing 31 is called the width ratio. The above-mentioned width ratio in the welded portion 5 is determined by separating the housing 31 and the molding resin portion 4 to expose the welded portion 5 and measuring the width of the welded portion 5 along the circumferential direction of the housing 31. For example, the separation of the housing 31 and the molding resin portion 4 can be achieved by using a suitable tool such as pliers to peel the molding resin portion 4 from the housing 31. The above-mentioned width ratio in the welded portion 5 is further preferably less than 20%, and particularly less than 10%.

[0092] When multiple measuring points, four or more, are provided in the welded portion 5 along the circumference of the housing 31, it is preferable that the ratio of the maximum width to the average width of the welded portion 5 based on the multiple measuring points is 130% or less, and the ratio of the minimum width to the average width is 70% or more. The ratio of the maximum width to the average width of the welded portion 5 is called the maximum width ratio. The ratio of the minimum width to the average width of the welded portion 5 is called the minimum width ratio. When the maximum width ratio is 130% or less and the minimum width ratio is 70% or more, it can be said that the width of the welded portion 5 is the same along the circumference of the housing 31. Because the width of the welded portion 5 is the same, it is easy to set the bonding strength between the housing 31 and the molding resin portion 4 to be constant along the circumference of the housing 31. The maximum width ratio in the welded portion 5 is further preferably 120% or less, particularly 110% or less. The minimum width ratio in the welded portion 5 is preferably 80% or more, particularly 90% or more. The welded portion 5 preferably has a maximum width ratio of 120% or less and a minimum width ratio of 80% or more. In particular, the maximum width ratio of the welded portion 5 is preferably 110% or less, and the minimum width ratio is 90% or more. Alternatively, the maximum width ratio of the welded portion 5 may be 105% or less, and the minimum width ratio may be 95% or more.

[0093] 〔use〕

[0094] The connector device 1 of the embodiment can be appropriately used in the engine control unit of an automobile, the module of the electronic braking system of an automobile, etc. For example, a fuel injection engine control unit (FI-ECU) can be cited as an example. For an electronic braking system module, modules of electromechanical brake (EMB) and electronic parking brake (EPB) can be cited as examples.

[0095] <Manufacturing Method of Connector Device>

[0096] The method for manufacturing the connector device according to the embodiment includes a step of preparing an assembly, a step of forming an integral part, and a step of irradiating with a laser. Hereinafter, refer to... Figures 4 to 6 Details of the manufacturing method of the connector device are explained.

[0097] [Process for preparing the assembly]

[0098] In the process of preparing the assembly, such as Figure 4As shown, an assembly 100 is prepared by connecting the circuit board 2 and the connector 3 described above. The conductive pattern 21 of the circuit board 2 and the terminals 32 of the connector 3 are electrically connected to the assembly 100 using solder 22. Furthermore, the assembly 100 is secured by a fixing member 34 via the mounting portion 33 of the connector 3. Figure 2 It is fixed to the circuit board 2. In this example, the cross-sectional shape of the housing 31 in the connector 3 is racetrack shaped.

[0099] [The process of forming a single object]

[0100] In the process of forming a single object, such as Figure 5 As shown, a portion of the assembly 100 is covered with molding resin portion 4 to create an integral part 200. Specifically, in the process of forming the integral part, the circuit board 2, the terminals 32 located on the outside of the housing 31 in the connector 3, and a portion of the housing 31 are covered together with molding resin portion 4. That is, in the process of forming the integral part, most of the assembly 100, except for the opening of the housing 31 in the connector 3 into which the connector is inserted, is covered with molding resin portion 4. In this example, molding resin portion 4 is constructed of a quadrangular prism. Therefore, molding resin portion 4 surrounds the housing 31 on all four sides.

[0101] [The process of irradiating with a laser]

[0102] In the laser irradiation process, the molding resin part 4 is simultaneously irradiated with laser light onto the housing 31, fusing the constituent materials of the housing 31 and the molding resin part 4 together. Laser irradiation can be performed from the outside of the molding resin part 4 in the normal direction to the outer peripheral surface of the housing 31. The molding resin part 4 transmits the laser light, and the housing 31 absorbs the laser. The housing 31, having absorbed the laser light, heats up, and its constituent materials melt. The molten heat in the housing 31 is transferred to the molding resin part 4, causing the molding resin part 4 to heat up and melt. The molten constituent materials of the housing 31 and the molding resin part 4 solidify in an adhesive state, thereby forming the welded section 5.

[0103] Laser irradiation is performed simultaneously on the entire circumference of the housing 31. In the case of comprehensive irradiation, multiple laser emission outlets are arranged side by side along the circumference of the housing 31, and lasers are simultaneously irradiated from these multiple laser emission outlets.

[0104] The laser emission outlets are arranged side-by-side on the circumferential surface of the housing 31 with laser spots evenly spaced. It is preferable that adjacent laser spots overlap slightly. A gap may also exist between adjacent laser spots, but it is preferred that the gap be sufficiently small.

[0105] The laser spot is typically circular. The laser exit points are preferably configured such that the centers of the laser spots on the circumferential surface of the housing 31 are aligned on a straight line. Furthermore, the laser exit points are preferably configured such that the maximum length of the parallel direction of the laser spots in the overlapping region of adjacent laser spots on the circumferential surface of the housing 31 is at least 1 / 8 and less than 1 / 2 of the laser spot diameter. By ensuring that the maximum length in the overlapping region is at least 1 / 8 of the laser spot diameter, laser illumination can be reliably carried out throughout the entire circumference of the housing 31. On the other hand, by ensuring that the maximum length in the overlapping region is less than 1 / 2 of the laser spot diameter, an excessive number of laser exit points is unnecessary.

[0106] Types of laser sources include solid-state lasers, semiconductor lasers, and fiber lasers.

[0107] The wavelength of the laser can be, for example, 800 nm or more and 990 nm or less, further 850 nm or more and 990 nm or less, and particularly 930 nm or more and 950 nm or less. A wavelength of 940 nm is preferred. The laser output depends on the material of the housing 31 and the molding resin part 4, and can be, for example, 10 W or more and 100 W or less, further 20 W or more and 90 W or less, and particularly 30 W or more and 60 W or less.

[0108] Preferably, the laser irradiation is performed while the molded resin part 4 is pressed against the housing 31. By pressing the molded resin part 4 against the housing 31, gaps are less likely to form between the housing 31 and the molded resin part 4. By irradiating the housing 31 with virtually no gap between the housing 31 and the molded resin part 4, the constituent materials of the housing 31 and the molded resin part 4 are easily fused together, and the sealing performance between the housing 31 and the molded resin part 4 is easily improved.

[0109] In a manner where the molded resin part 4 is pressed towards the housing 31 and a laser is irradiated onto the entire circumference of the housing 31, for example, a method such as... Figure 6 The pressing device 400 shown is used. The pressing load of the pressing device 400 can be set to 1 kgf or more and 10 kgf or less. By setting the pressing load to 1 kgf or more, it is less likely that a gap will form between the housing 31 and the molded resin part 4. On the other hand, by setting the pressing load to 10 kgf or less, it is possible to suppress deformation of the molded resin part 4 due to excessive pressure applied to the connector device 1. The pressing load can be further set to 2 kgf or more and 8 kgf or less, and particularly 3 kgf or more and 5 kgf or less.

[0110] The pressing device 400 is a cylindrical member disposed on the outer periphery of the molding resin part 4. The pressing device 400 has an inner peripheral shape corresponding to the outer shape of the molding resin part 4. In this example, the inner peripheral shape of the pressing device 400 is quadrilateral.

[0111] The pressing device 400 is composed of a plurality of segmented pieces that are divided circumferentially. In this example, the pressing device 400 is composed of four segmented pieces. Each segmented piece is configured to press each corner of the molded resin part 4.

[0112] The pressing device 400 comprises a metal portion 410 located on the outer periphery and a glass portion 420 located on the inner periphery. Multiple laser emission outlets are provided in the metal portion 410 along the circumference of the pressing device 400. Specifically, an optical fiber 411 penetrates the metal portion 410 from the outer peripheral surface toward the inner peripheral surface, and the tip of the optical fiber 411 is the laser emission outlet. The laser emission outlets face the inner peripheral surface of the metal portion 410. The glass portion 420 is in direct contact with the molding resin portion 4. The laser emitted from each emission outlet irradiates the outer side of the molding resin portion 4 via the glass portion 420, passes through the molding resin portion 4, and is absorbed by the housing 31. The optical fiber 411 and the emission outlets are arranged at equal intervals to the laser spots in the housing 31. In this example, the cross-sectional shape of the housing 31 is a racetrack shape. Therefore, the optical fiber 411 and the emission outlets are arranged to irradiate the laser in the normal direction of the outer peripheral surface of the straight and arc portions constituting the outer periphery of the housing 31.

[0113] <Effect>

[0114] The connector device 1 of the embodiment can achieve the following effects.

[0115] (1) Excellent waterproof performance. This is because the welded portion 5 improves the seal between the housing 31 and the molding resin portion 4, thus easily preventing liquid from seeping in through the gap between the housing 31 and the molding resin portion 4. In particular, the welded portion 5, which has a small width deviation, is formed throughout the entire circumference of the housing 31, thus easily forming a strong welded portion 5. Therefore, it is possible to prevent liquid from adhering to conductive components such as the circuit board 2 and terminals 32 covered by the molding resin portion 4.

[0116] (2) It is easy to miniaturize. This is because: by covering the circuit board 2, terminals 32 and other conductive components together with the molding resin part 4, it is not necessary to have a separate box to house the circuit board 2 and the like. Since there is no box, it is also not necessary to have a seal to keep the boxes waterproof.

[0117] (3) Easy to manufacture. This is because: As described above, the connector device 1 of the embodiment has excellent waterproof performance through the welded portion 5, so there is no need for a housing and seals. Therefore, the number of parts is small, and the work of assembling the housing and configuring the seals can be omitted. In particular, since the welded portion 5 is formed by irradiating the entire circumference of the housing 31 with a laser, it is not only easy to reduce the deviation of the width of the welded portion 5, but also easy to miniaturize the device for irradiating the laser.

[0118] <Variation Example>

[0119] like Figure 7 As shown, the connector device 1 described above can have a protrusion 311 on the housing 31. The protrusion 311 is provided throughout the entire circumference of the housing 31 that contacts the molding resin portion 4. When the protrusion 311 is provided, the welding portion 5 is provided on the protrusion 311. The following description focuses on the protrusion 311, which is a difference from the connector device 1 described above, and the description of the same matters is omitted.

[0120] The protrusion 311 has the function of absorbing the heat of the laser in a concentrated manner when forming the welded part 5. The shape and size of the protrusion 311 remain basically unchanged before and after laser welding.

[0121] The protrusion 311 can be appropriately shaped to concentrate the absorption of laser heat. Preferably, the protrusion 311 has a top surface 311s parallel to the axial direction of the housing 31. By having a top surface 311s on the protrusion 311, the surface in the protrusion 311 that receives laser heat can be easily and stably secured. Furthermore, by having a top surface 311s on the protrusion 311, the area generating laser heat can be easily positioned on the top side of the protrusion 311, and heat transfer to the base side of the protrusion 311 can be easily suppressed.

[0122] The cross-sectional shape of the protrusion 311 is not particularly limited. Examples of cross-sectional shapes for the protrusion 311 include a square. The cross-sectional shape of the protrusion 311 is the shape of a section cut in a direction orthogonal to the direction in which the protrusion 311 extends. The direction in which the protrusion 311 protrudes is radial to the housing 31. The protrusion 311 can extend circumferentially around the housing 31 in a configuration that is along the circumference of the housing 31, or it can be a curved configuration that deviates from the circumference of the housing 31, such as a wave shape. When the cross-sectional shape of the protrusion 311 is square, the shape of the protrusion 311 is simple, making it easier to improve the fit between the protrusion 311 and the molding resin part 4. Furthermore, when the cross-sectional shape of the protrusion 311 is square, it is easier to manufacture the protrusion 311. The cross-sectional shape of the protrusion 311 can also be triangular. Additionally, the cross-sectional shape of the protrusion 311 can also be a semi-circle with a top surface 311s composed of an arc surface. The cross-sectional shape of the protrusion 311 can also be trapezoidal. The cross-sectional shape of the protrusion 311 can also be an inverted trapezoid, such as one whose width narrows from the top side to the base side.

[0123] The maximum width of the protrusion 311 is preferably 1 mm or more and less than 2 mm. With a maximum width of 1 mm or more, it is easy to ensure the surface receiving the laser, and the heat from the laser is easily concentrated in the protrusion 311. On the other hand, with a maximum width of less than 2 mm, although it also depends on the intensity distribution of the laser, the heat from the laser is easily concentrated in the protrusion 311. The maximum width of the protrusion 311 can be further exemplified as 1 mm or more and 1.7 mm or less, particularly 1 mm or more and 1.5 mm or less.

[0124] The maximum height of the protrusion 311 is preferably 0.2 mm or more and 0.5 mm or less. With a maximum height of 0.2 mm or more, the area generating laser heat is easily positioned at the tip of the protrusion 311, and heat transfer to the base of the protrusion 311 is easily suppressed. On the other hand, with a maximum height of 0.5 mm or less, the diffusion of laser heat is more easily stabilized, and the melting of the constituent material in the protrusion 311 is more easily stabilized. The maximum height of the protrusion 311 can be further exemplified as 0.2 mm or more and 0.4 mm or less, particularly 0.2 mm or more and 0.3 mm or less.

[0125] The connector device 1 in this example has a plurality of recesses 312 in the housing 31. Each recess 312 is provided all around the circumference of the housing 31. Furthermore, the recesses 312 are arranged side by side in the axial direction of the housing 31. The protrusions 311 are provided in such a way that they form the sidewalls of adjacent recesses 312. Molded resin portions 4 are filled into the recesses 312. Therefore, except that the molded resin portions 4 filled into the recesses 312 become anchors, the contact area between the housing 31 and the molded resin portions 4 can be increased compared to the case where the protrusions 311 are of the same height and there are no recesses 312. Therefore, by providing recesses 312, the sealing performance between the housing 31 and the molded resin portions 4 can be easily improved.

[0126] In this example, two recesses 312 are provided. Among the plurality of recesses 312, the recess 312 located on the closed end face side of the housing 31 is formed by a notch connected to the closed end face. The closed end face side of the housing 31 is Figure 7 The right side. Among the multiple recesses 312, the recess 312 located on the opening side of the housing 31 is formed by grooves having sidewalls on both sides. The opening side of the housing 31 is Figure 7 On the left side.

[0127] In this example, the depth of the recess 312 is the same as the maximum height of the protrusion 311. By using such a recess 312 to form the protrusion 311, the amount of protrusion of the protrusion 311 from the outer surface of the housing 31 can be reduced compared to the case without the recess 312. When the amount of protrusion of the protrusion 311 measured from the outer surface of the housing 31 is small, it is easier to reduce the thickness of the molded resin portion 4 measured from the outer surface of the housing 31, thus facilitating miniaturization.

[0128] There may be three or more recesses 312. In this case, two protrusions 311 are arranged side by side in the axial direction of the housing 31. There may also be only one recess 312. In this case, one sidewall of the protrusion 311 is formed by the sidewall of the recess 312, and the other side is formed by the closed end face of the housing 31. There may also be no recess 312. In this case, the protrusion 311 protrudes from the outer surface of the housing 31.

[0129] [Experimental Example]

[0130] A connector assembly with a fusion joint was fabricated, and the bonding performance between the connector housing and the molded resin portion was investigated. The bonding performance was evaluated using... Figure 8 The test piece 500 shown is used. The test piece 500 is a component simulating the joint between the connector housing and the molded resin part.

[0131] <Experimental film>

[0132] [Sample No. 1-1]

[0133] Prepare absorber 510, which simulates the joint between the absorber and the molded resin part in the housing. Absorber 510 is made of PBT resin with a transmittance of 1%. Absorber 510 is a racetrack-shaped column with a circumference of 50 mm.

[0134] The transmissive element 520 is injection molded to cover a portion of the prepared absorbent element 510. The transmissive element 520 is made of thermoplastic polyester resin with a transmittance of 40%. The thermoplastic polyester resin used is Vyloshot (registered trademark) manufactured by Toyobo Co., Ltd. The transmissive element 520 is molded to cover a 5mm area measured from the first end face side in the axial direction of the absorbent element 510. The transmissive element 520 is a quadrangular prism. The length of the overlapping area between the absorbent element 510 and the transmissive element 520 is set to 50mm. This overlapping area refers to the length along the circumference of the absorbent element 510. The circumference of the transmissive element 520 is 76mm.

[0135] In the area where the absorber 510 and the transmitter 520 overlap, laser light is simultaneously irradiated onto the entire circumference of the absorber 510 through the transmitter 520 while the transmitter 520 is pressed towards the absorber 510. This simultaneous laser irradiation utilizes... Figure 6The pressing device 400 shown is used. The pressing load is set to 2 kgf. The laser source is a fiber laser. The diameter of each laser spot is set to 2.0 mm. The laser wavelength is set to 940 nm. As a result, a welded portion 550 is formed throughout the entire circumference of the absorber 510.

[0136] [Sample No. 1-2]

[0137] In specimens 1-2, the transmitting element 520 is formed to cover a range of 3 mm from the first end face of the absorbing element 510 in the axial direction. Furthermore, in specimens 1-2, the laser irradiation method is modified compared to specimen 1-1. In specimens 1-2, in the overlapping area of ​​the absorbing element 510 and the transmitting element 520, the laser scans the entire circumference of the absorbing element 510 through the transmitting element 520. The laser scan is performed around both the absorbing element 510 and the transmitting element 520. That is, the start and end positions of the laser scan are substantially the same. The laser scanning speed is set to 50 mm / min. In scanning irradiation, the laser spot diameter is set to 1.5 mm. Other conditions are the same as in specimen 1-1. As a result, a welded portion 550 is formed throughout the entire circumference of the absorbing element 510.

[0138] <Determination of the width deviation of the welded section>

[0139] For each obtained test piece 500, the absorber 510 and the transmissive element 520 are separated to expose the welded portion 550, and the width of the welded portion 550 is measured along the circumference of the absorber 510. Here, the separation of the absorber 510 and the transmissive element 520 is performed by peeling the transmissive element 520 from the absorber 510 using pliers. Furthermore, the ratio of the difference between the maximum and minimum widths of the welded portion 550 along the circumference of the absorber 510 to the maximum width is calculated. This ratio is called the width ratio. The results are shown in Table 1.

[0140] In addition, seven measurement points are set along the circumference of the absorber 510, and the average width of the welded portion 550 based on these seven measurement points is determined. In sample numbers 1-2, the laser scanning start position is set as measurement point 1, the laser scanning end position is set as measurement point 7, and measurement points 2 to 6 are set at equal intervals between measurement points 1 and 7. In sample numbers 1-2, the laser scanning start position and scanning end position are substantially the same. However, in sample numbers 1-2, a step is generated in the welded portion 550 at the same position. The widths at measurement points 1 and 7 can be measured based on the step of the welded portion 550. In sample number 1-1, each measurement point is set at the same position as in sample number 1-2. In sample number 1-1, the widths at measurement points 1 and 7 can also be measured based on the step of the welded portion 550. Furthermore, the ratio of the maximum width to the average width and the ratio of the minimum width to the average width are determined. The ratio of the maximum width to the average width is called the maximum width ratio. The ratio of the minimum width to the average width is called the minimum width ratio. The results of the width, maximum width ratio, and minimum width ratio of the welded portion 550 at each measurement point are shown in Table 1.

[0141] <Evaluation of Adhesive Performance>

[0142] For each of the obtained test specimens (500 pieces), shear and tensile tests were performed to evaluate the adhesive properties. The shear and tensile testing apparatus used was the Autograph AGS-X series manufactured by Shimadzu Corporation. The shear and tensile test was conducted as follows: Figure 8 As shown by the hollow arrow, the absorber 510 and the transmitter 520 are stretched along their length towards separation, and the maximum tensile stress at which the absorber 510 and the transmitter 520 separate is determined. The number of samples measured for each specimen is set to 5. The average value of the maximum tensile stress is shown in Table 1.

[0143] Furthermore, the bonding surfaces in the absorbing element 510 and the transmitting element 520 were visually inspected. As a result, material failure occurred in the welded portion 550 of both samples. In the material failure, failure occurred inside one of the absorbing element 510 and the transmitting element 520, while the constituent material of the other element remained attached to its separated surface.

[0144] [Table 1]

[0145]

[0146]

[0147] As shown in Table 1, the width ratio of sample 1-1, which underwent generalized irradiation, was less than 10%. Furthermore, the maximum width ratio of sample 1-1 under generalized irradiation was less than 110%, and the minimum width ratio was greater than 90%. In other words, the width of the welded portion of sample 1-1 under generalized irradiation was uniform along the circumference of the absorber with minimal deviation. Therefore, it is considered that sample 1-1 under generalized irradiation improved the bonding strength between the absorber and the transmitting element, and enhanced the seal. On the other hand, the width ratio of sample 1-2, which underwent scanning irradiation, was very large, at 57%. Furthermore, the maximum width ratio of sample 1-2 underwent scanning irradiation was as high as 140%, and the minimum width ratio was as low as 60%. In other words, the width of the welded portion of sample 1-2 underwent scanning irradiation was uneven along the circumference of the absorber with significant deviation. In the case of scanning irradiation, the heat of the laser is also transferred in the scanning direction, and welding is easier to achieve as scanning continues. Therefore, it is believed that in samples 1-2, a welded portion with a width that increases as scanning progresses is formed. In fact, in samples 1-2, the width is smallest at measurement point 1 at the start of the scan, gradually increasing as the scan continues, and reaching its maximum at measurement point 7 at the end of the scan. It is believed that in samples 1-2 subjected to scanning irradiation, the welded portion width is uneven along the circumference of the absorber, and the deviation is large, resulting in low adhesion strength and reduced sealing between the absorber and the transmissive element.

[0148] Comprehensive irradiation can simultaneously form a weld zone around the entire circumference of the absorber. Therefore, it is believed that laser irradiation devices are simpler to use compared to scanning irradiation.

[0149] The invention is not limited to these examples, but as indicated by the claims, it is intended to include all modifications that are equivalent in meaning and scope to the claims.

[0150] Explanation of reference numerals in the attached figures

[0151] 1 Connector device

[0152] 2 Circuit board

[0153] 20 Conductor circuit, 21 Conductive pattern, 22 Solder

[0154] 3 connectors

[0155] 31 shell, 311 protrusion, 311s top surface, 312 recess

[0156] 32 Terminals, 33 Assembly parts, 34 Fixing components

[0157] 4 Molding Resin Section

[0158] 40 traces

[0159] 5 Welded section

[0160] 100-unit combination

[0161] 200 in one object

[0162] 400 pressing device

[0163] 410 Metal component, 411 Optical fiber, 420 Glass component

[0164] 500 test pieces

[0165] 510 Absorbing component, 520 Transmitting component, 550 Welded section

Claims

1. A connector device comprising a circuit board, a connector, and a molding resin portion, The circuit board has conductive paths. The connector includes: A cylindrical shell made of resin; and The terminal protrudes from the inside of the housing outward in the axial direction and connects to the conductor path. The molded resin portion covers the circuit board, the terminals located on the outside of the housing, and a portion of the housing together. The housing and the molded resin part have a welded portion formed by fusing their constituent materials together. The welded portion is provided throughout the entire circumference of the housing. The difference between the maximum and minimum width of the welded portion in the circumferential direction of the housing is less than 30% of the maximum width.

2. The connector device according to claim 1, wherein, The shell has multiple measuring points with four or more points along its circumference. The ratio of the maximum width to the average width of the welded portion based on the plurality of measurement points is 130% or less. The ratio of the minimum width to the average width is 70% or more.

3. The connector device according to claim 1, wherein, The housing has protrusions that are provided all around its circumference. The welded portion is disposed on the protrusion.

4. The connector device according to claim 1, wherein, The transmittance of the molded resin portion is 40% or higher. The transmittance of the molded resin portion is the ratio of light intensity a1 to light intensity b1 (b1 / a1) × 100. The light quantity a1 is the light quantity of a laser with a wavelength of 940nm. The light intensity b1 is the amount of light transmitted by the laser through a 2mm thick test piece made of the constituent material of the molding resin portion.

5. The connector device according to claim 1, wherein, The transmittance of the housing is less than 10%. The transmittance of the shell is the ratio of light quantity a2 to light quantity b2 (b2 / a2) × 100. The light quantity a2 is the light quantity of a laser with a wavelength of 940nm. The light intensity b2 is the amount of light transmitted by the laser through a 2mm thick test piece made of the material constituting the shell.

6. The connector device according to claim 1, wherein, The molding resin portion comprises polyamide resin or polyester.

7. The connector device according to claim 1, wherein, The housing is made of polyester.

8. The connector device according to claim 1, wherein, Both the molded resin portion and the housing comprise polyester.

9. The connector device according to claim 1, wherein, The molded resin part has a surface that comes into contact with the atmosphere.

10. The connector device according to claim 1, wherein, The molded resin part is an injection molded body.

11. The connector device according to any one of claims 1 to 10, wherein, The circuit board and the connector constitute a control unit.

12. A method for manufacturing a connector device, comprising: The process of preparing an assembly including a circuit board and connectors; The process of constructing an integral body by covering a portion of the assembly with a molded resin portion; and The process of irradiating the integral object with a laser. The circuit board has conductive paths. The connector includes: A cylindrical shell made of resin; and The terminal protrudes from the inside of the housing outward in the axial direction and connects to the conductor path. In the process of forming the integral object, the circuit board, the terminals located on the outside of the housing, and a portion of the housing are covered together with the molding resin portion. During the laser irradiation process, while the molding resin part is pressed towards the housing side using a pressing device disposed on the outer periphery of the molding resin part, the laser is irradiated from the outside of the molding resin part in the normal direction of the outer peripheral surface of the housing using the pressing device, so that the laser passes through the molding resin part and irradiates the entire circumference of the housing, thereby fusing the constituent materials of the housing and the molding resin part together.

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