Resin molding apparatus and method for manufacturing resin molded article

Abstract

The present application provides a resin molding device capable of simplifying the structure of the device and a method for manufacturing a resin molded product. The resin molding device includes a molding die including an upper die and a lower die facing the upper die, which resin-molds a substrate; a die closing mechanism, which closes the molding die; and a useless resin removing mechanism, which removes useless resin formed on the resin-molded substrate, the useless resin removing mechanism including a substrate placement portion, which places a substrate portion of the resin-molded substrate; and a useless resin placement portion, which is disposed laterally to the substrate placement portion, places useless resin of the resin-molded substrate, and causes the useless resin removed from the resin-molded substrate to fall due to gravity.

Description

Technical Field

[0001] This invention relates to a resin molding apparatus and a method for manufacturing resin molded articles. Background Technology

[0002] Patent Document 1 discloses a resin molding apparatus including a cutting head for separating waste resin from a molded article. The cutting head includes: a pair of left and right cutting head plates for holding the molded article, a waste material receiving part for receiving molded article waste (waste resin) between the pair of cutting head plates, and a waste material pressing part for pressing the molded article waste relative to the waste material receiving part.

[0003] In this cutting head configuration, after the molded part is separated from the molded part, the residual molded part is adsorbed by an adsorption pad built into the residual material pressing part and lifted from the residual material receiving part. Afterwards, once the molded part is removed, the adsorption of the residual molded part by the residual material pressing part is released, and the residual molded part is placed into the scrap box. In this way, the residual molded part separated from the molded part can be discharged.

[0004] [Existing Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2012-43839 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] However, in the technology described in Patent Document 1, in order to discharge the molded article residue (useless resin) separated from the molded article, a mechanism for adsorbing the molded article residue is required, so there is room for improvement in terms of the complexity of the device structure.

[0009] The present invention was made in view of the situation described above, and the problem to be solved therein is to provide a resin molding apparatus and a method for manufacturing resin molded articles that can achieve a simplified structure of the device.

[0010] [Technical means to solve the problem]

[0011] As described above, the problem to be solved by the present invention is addressed by the resin molding apparatus of the present invention, which includes: a molding die including an upper die and a lower die facing the upper die for resin molding a substrate; a mold closing mechanism for closing the molding die; and a waste resin removal mechanism for removing waste resin formed on the resin-molded substrate. The waste resin removal mechanism includes: a substrate mounting portion for mounting a substrate portion of the resin-molded substrate; and a waste resin mounting portion disposed to the side of the substrate mounting portion for mounting the waste resin on the resin-molded substrate, and causing the waste resin removed from the resin-molded substrate to fall off due to its own weight.

[0012] Furthermore, the method for manufacturing resin molded articles of the present invention uses the resin molding apparatus to manufacture resin molded articles.

[0013] [The effects of the invention]

[0014] According to the present invention, the structure of the device can be simplified. Attached Figure Description

[0015] Figure 1 This is a plan view showing the overall structure of a resin molding apparatus according to one embodiment.

[0016] Figure 2 This is a front view showing the overall structure of a resin molding apparatus according to one embodiment.

[0017] Figure 3 This is a planar schematic diagram showing the arrangement of a resin-molded substrate after it has been formed in a molding die.

[0018] Figure 4 This is a three-dimensional diagram showing the structure of the useless resin removal mechanism.

[0019] Figure 5 This is a side view showing the structure of the useless resin removal mechanism.

[0020] Figure 6 This is an enlarged side sectional view showing the structure of the useless resin removal mechanism.

[0021] Figure 7 This is an enlarged side cross-sectional view showing the situation of useless resin falling.

[0022] Figure 8 This is a side view showing the situation where the removal part is driven.

[0023] Figure 9 (a) is a side view showing the positional relationship between the useless resin, the useless resin placement part, and the resin pressing part. Figure 9 (b) is a planar schematic diagram showing the positional relationship between the useless resin and the useless resin mounting part.

[0024] Figure 10 (a) is a side view showing a first modified example of the useless resin mounting portion. Figure 10 (b) is a side view of a second modified example of the useless resin mounting portion. Figure 10 (c) is a side view of a third modified example of the useless resin mounting part.

[0025] [Explanation of Symbols]

[0026] 1: Resin molding device

[0027] 2: Substrate after resin molding

[0028] 3: Substrate

[0029] 5: Removal Pool

[0030] 6: Flow channel

[0031] 10: Resin Molding Module

[0032] 20: Move out module

[0033] 100: Forming mold

[0034] 110: Lower mold

[0035] 120: Upper mold

[0036] 200: Mold closing mechanism

[0037] 500: Useless resin removal mechanism

[0038] 520: Loading unit

[0039] 521: Substrate mounting part

[0040] 522: Useless resin carrier

[0041] 550: Removal section

[0042] 551: Substrate pressing part

[0043] 552: Resin pressing part Detailed Implementation

[0044] The directions indicated by arrows U, D, L, R, F, and B in the diagram are defined as up, down, left, right, forward, and backward, respectively.

[0045] <Overall Structure of Resin Molding Device 1>

[0046] First, use Figure 1 and Figure 2The structure of a resin molding apparatus 1 according to one embodiment of the present invention will be described. The resin molding apparatus 1 manufactures resin molded articles by sealing electronic components (hereinafter simply referred to as "chips") such as semiconductor chips, resistors, and capacitors with resin. In particular, in this embodiment, a resin molding apparatus 1 that performs resin molding using a transfer molding method is illustrated.

[0047] The resin molding apparatus 1 includes a resin molding module 10 and a transfer module 20 as components. Each component can be installed, removed, and replaced relative to the other components.

[0048] <Resin Molding Module 10>

[0049] Resin molding module 10 and substrate 3 (refer to) Figure 3 The connected chips are sealed with resin. The resin molding module 10 mainly includes a molding mold 100 (lower mold 110 and upper mold 120), a mold closing mechanism 200, and a control unit 300. Furthermore, as the substrate 3, various substrates such as epoxy glass substrates, ceramic substrates, resin substrates, and metal substrates can be used, with the lead frame as the primary component.

[0050] The molding mold 100 uses molten resin material to seal the chip connected to the substrate 3. The molding mold 100 includes a pair of molds facing each other, namely a lower mold 110 and an upper mold 120. A heating element (not shown) such as a heater is provided in the molding mold 100.

[0051] The mold closing mechanism 200 closes or opens the forming mold 100 by moving the lower mold 110 up and down.

[0052] The control unit 300 controls the operation of each module of the resin molding apparatus 1. The control unit 300 controls the operation of the resin molding module 10 and the unloading module 20. In addition, the control unit 300 can be used to arbitrarily change (adjust) the operation of each module.

[0053] Furthermore, in this embodiment, an example is shown where the control unit 300 is provided in the resin molding module 10, but the control unit 300 can also be provided in other modules. Additionally, multiple control units 300 can be provided. For example, a control unit 300 can be provided for each module or each device, allowing for individual control while simultaneously enabling the operation of each module to be interconnected.

[0054] <Moving out module 20>

[0055] The removal module 20 receives the resin-sealed substrate 3 (resin-molded substrate 2) from the resin molding module 10 and removes it. The removal module 20 is arranged adjacent to the right side of the resin molding module 10. The removal module 20 mainly includes: an unloading machine 400, a waste resin removal mechanism 500, a transfer mechanism 600, and a substrate receiving section 700.

[0056] The unloading machine 400 holds the resin-molded substrate 2, which has been sealed with resin by the molding mold 100, and moves it to the waste resin removal mechanism 500. The unloading machine 400 is configured to move left and right through the resin molding module 10 (molding mold 100) and the transfer module 20 (waste resin removal mechanism 500).

[0057] The waste resin removal mechanism 500 removes resin (waste resin) that is useless as a product from the resin-molded substrate 2. Although details will be described later, the waste resin removal mechanism 500 includes a mounting unit 520 for mounting the resin-molded substrate 2 and a removal section 550 for removing waste resin from the resin-molded substrate 2 mounted on the mounting unit 520.

[0058] The transfer mechanism 600 transfers the resin-molded substrate 2, from the waste resin removal mechanism 500 to the substrate receiving section 700 after the waste resin has been removed. The transfer mechanism 600 is located to the right of the waste resin removal mechanism 500 (removal section 550).

[0059] The substrate receiving section 700 receives the resin-molded substrate 2. The substrate receiving section 700 is disposed below the transfer mechanism 600.

[0060] <Summary of the operation of resin molding apparatus 1>

[0061] Next, an overview of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing resin molded articles using the resin molding apparatus 1) will be given.

[0062] The substrate 3, which is the object of resin molding, and the resin material (e.g., small sheet resin) used for molding are supplied to the molding die 100 in advance. The substrate 3 or the resin material can be supplied to the molding die 100 using a supply mechanism not shown.

[0063] In the resin molding module 10, the mold closing mechanism 200 closes the molding mold 100. Then, the small sheet of resin is heated and melted using the heating part (not shown) of the molding mold 100, and the resulting fluid resin is used to seal the substrate 3. Thus, a resin-molded substrate 2 with resin sealing is formed.

[0064] After the resin sealing is completed, the mold closing mechanism 200 opens the molding mold 100, allowing the resin-molded substrate 2 to be demolded. Subsequently, the resin-molded substrate 2 is removed from the molding mold 100 by the unloading machine 400 and placed in the placement unit 520 of the waste resin removal mechanism 500.

[0065] The mounting unit 520, on which the resin-molded substrate 2 is placed, moves downward toward the removal unit 550. The removal unit 550 removes the unwanted resin from the resin-molded substrate 2 placed in the mounting unit 520.

[0066] After the unwanted resin is removed, the placement unit 520 moves below the transfer mechanism 600. The transfer mechanism 600 transfers the resin-molded substrate 2, from the placement unit 520 to the substrate receiving section 700. In this way, the resin-molded substrate 2 is manufactured and received in the substrate receiving section 700.

[0067] <Regarding the resin-molded substrate 2>

[0068] The structure of the waste resin removal mechanism 500 will be described in more detail below. As a premise, the resin-molded substrate 2 of this embodiment will be described.

[0069] like Figure 3 As shown, in the molding die 100 of this embodiment, three rows (rows L1 to L3) of resin-molded substrate 2 are arranged before and after molding. Specifically, the resin-molded substrate 2 is formed by resin molding six rectangular substrates 3 arranged in three rows before and two rows to the left and right on the lower die 110. A resin (molded resin portion 4) is formed on the upper surface of the resin-molded substrate 3 to seal the chip.

[0070] Additionally, a resin that is useless for the product is formed on the side of the substrate 3. Specifically, after the resin of the nearest front (front side) column L1 is formed on the substrate 2, a rejection pool 5 is formed on the front side of the substrate 3. Furthermore, a flow channel 6 is formed extending from the rejection pool 5 to the back (lower surface) of the substrate 3. On the substrate 3, a plurality of through holes 3a for removing the flow channel 6 from the substrate 3 are formed along the flow channel 6.

[0071] The resin-molded substrates 2 of the front and rear center column L2 and the innermost (rear) column L3 are formed in a shape such that the resin-molded substrates 2 of column L1 are reversed. That is, in the resin-molded substrates 2 of columns L2 and L3, a rejection pool 5 is formed on the rear side of the substrate 3.

[0072] Thus, in the molding mold 100 of this embodiment, resin-molded substrates 2 with different configurations (positional relationship between substrate 3 and useless resin) are formed.

[0073] <Detailed Structure of the Useless Resin Removal Mechanism 500>

[0074] Next, the structure of the useless resin removal mechanism 500 will be described in more detail. Furthermore, the following description uses… Figure 6 and Figure 7 This is a schematic diagram for illustration purposes, and there are parts where the cross-sectional positions are inaccurate.

[0075] like Figure 4 and Figure 5 As shown, the useless resin removal mechanism 500 mainly includes: a lower movable body 510, a mounting unit 520, an upper base part 530, an upper movable body 540, a removal part 550, and a cooling part 560.

[0076] <Lower movable part 510>

[0077] The lower movable body 510 supports the mounting unit 520, which will be described later. The lower movable body 510 can be moved in the left and right direction by a suitable moving mechanism (e.g., a guide rail that guides the lower movable body 510 so that it can move in the left and right direction, a servo motor that moves the lower movable body 510 to any position along the guide rail, etc.).

[0078] <Loading Unit 520>

[0079] Figures 4 to 6 The mounting unit 520 shown holds the resin-molded substrate 2. The mounting unit 520 is provided on the lower movable body 510. Three mounting units 520 are arranged in a row to correspond to the three rows of resin-molded substrates 2. Furthermore, for ease of explanation, the mounting unit 520 located closest to the front (front side) will be described in detail below, and detailed descriptions of the other mounting units 520 are appropriate to be omitted.

[0080] The mounting unit 520 mainly includes a substrate mounting part 521, a useless resin mounting part 522, and a guide plate 523.

[0081] The substrate mounting portion 521 holds the substrate 3 portion of the resin-molded substrate 2. The substrate mounting portion 521 is formed in the shape of a cuboid with a generally flat upper surface. The substrate mounting portion 521 is fixed to the lower movable body 510. Although not shown in the figure, grooves corresponding to the shape of the unused resin (flow channels 6, etc.) of the resin-molded substrate 2 are appropriately provided in the substrate mounting portion 521. This prevents interference between the unused resin and the substrate mounting portion 521 when the resin-molded substrate 2 is placed on the substrate mounting portion 521.

[0082] The waste resin placement section 522 supports the waste resin portion of the resin-molded substrate 2 from below (especially the rejection pool 5 formed on the side of the substrate 3). The waste resin placement section 522 is disposed in front of the substrate placement section 521. The waste resin placement section 522 mainly includes a support section 522a and a placement section 522b.

[0083] The support portion 522a supports the mounting portion 522b, which will be described later. The support portion 522a is positioned in front of the substrate mounting portion 521. The support portion 522a is positioned with a suitable gap between it and the substrate mounting portion 521. The support portion 522a is positioned so that it rises upwards from the lower movable body 510. The support portion 522a is positioned along its length in the left-right direction.

[0084] The mounting portion 522b is the part that holds the unused resin from the resin-molded substrate 2. The mounting portion 522b is formed as a cylinder extending longitudinally (axially) to the left and right. The mounting portion 522b is fixed to the upper surface of the support portion 522a. The height of the upper end of the mounting portion 522b is arranged such that it is approximately the same as the height of the upper surface of the substrate mounting portion 521. The mounting portion 522b is positioned with a suitable gap between it and the substrate mounting portion 521.

[0085] Figure 5 and Figure 6 The guide plate 523 shown guides the waste resin removed from the resin-molded substrate 2 in a suitable direction. The guide plate 523 is disposed between the substrate mounting portion 521 and the waste resin mounting portion 522. The guide plate 523 is arranged in a downwardly inclined manner from the front (towards the waste resin mounting portion 522) to the rear (towards the substrate mounting portion 521). Thus, the guide plate 523 can guide the falling waste resin to the waste resin receiving portion (not shown) formed in the lower part of the substrate mounting portion 521.

[0086] In this embodiment, the aforementioned mounting units 520 are arranged in three rows on the upper part of the lower movable body 510. The three mounting units 520 correspond to three rows of resin-molded substrates 2 (see reference 1). Figure 3 That is, the resin-molded substrate 2 of the foremost column L1 is placed in the nearest front (front side) placement unit 520. Similarly, resin-molded substrates 2 of columns L2 and L3 are placed in the front and rear center and the innermost (rear side) placement units 520, respectively. The three placement units 520 can move left and right as a whole through the lower movable body 510.

[0087] Furthermore, in order to distinguish the three mounting units 520, the nearest front (front side) mounting unit 520 is sometimes referred to as mounting unit 520F, the middle mounting unit 520 is referred to as mounting unit 520M, and the innermost (rear side) mounting unit 520 is referred to as mounting unit 520B.

[0088] The orientation of each mounting unit 520 is set in a manner corresponding to the orientation of the resin-molded substrate 2. More specifically, the mounting units 520M and 520B are formed in a shape such that the nearest mounting unit 520F is reversed. That is, in the mounting units 520M and 520B, the unused resin mounting portion 522 is disposed behind the substrate mounting portion 521.

[0089] <Upper base section 530>

[0090] Figure 5 The upper base portion 530 shown supports the upper movable body 540, which will be described later. The upper base portion 530 is positioned at a predetermined height via suitable support members.

[0091] <Upper movable part 540>

[0092] The upper movable body 540 supports the removal part 550, which will be described later. The upper movable body 540 is provided at the lower part of the upper base part 530. The upper movable body 540 can be moved relative to the upper base part 530 in the front-back direction by a suitable moving mechanism (e.g., a guide rail 541 that guides the upper movable body 540 so that it can move in the front-back direction, a servo motor that moves the upper movable body 540 to any position along the guide rail 541, etc.).

[0093] Furthermore, for convenience, in Figure 4 The illustrations of the upper base portion 530 and the upper movable part 540 are appropriately omitted in the above.

[0094] <Removal Section 550>

[0095] Figures 4 to 6 The removal section 550 shown removes waste resin from the resin-molded substrate 2 by pressing the waste resin on the resin-molded substrate 2. Two removal sections 550 are arranged in a row. Furthermore, for ease of explanation, the removal section 550 located near the front (front side) will be described in detail below, and a detailed description of the other removal section 550 is appropriate to be omitted.

[0096] The removal section 550 mainly includes a substrate pressing section 551 and a resin pressing section 552.

[0097] Figure 6The substrate pressing part 551 shown presses the substrate 3 portion of the resin-molded substrate 2 placed on the substrate mounting part 521 from above. The substrate pressing part 551 mainly includes: a lifting part 551a, a substrate contact part 551b, an elastic member 551c, and a pin 551d.

[0098] Figure 5 and Figure 6 The lifting part 551a shown is capable of moving up and down (lifting). The lifting part 551a is provided at the lower part of the upper movable body 540. The lifting part 551a can be moved up and down relative to the upper movable body 540 by a suitable moving mechanism (e.g., a guide rail that guides the lifting part 551a to move in the up and down direction, a servo motor that moves the lifting part 551a to any position along the guide rail, etc.).

[0099] The substrate contact portion 551b is the portion that contacts the substrate 3 of the resin-molded substrate 2. The substrate contact portion 551b is formed in a generally plate-like shape. The substrate contact portion 551b is disposed below the lifting portion 551a with its thickness direction pointing vertically. The substrate contact portion 551b is supported by suitable members in a manner that allows it to move vertically (lift) relative to the lifting portion 551a. A recess is suitably formed on the lower surface of the substrate contact portion 551b to prevent interference between the resin-molded substrate 2 and the molded resin portion 4. A through hole 551e is formed in the substrate contact portion 551b for the insertion of the pin 551d, which will be described later.

[0100] Figure 6 The elastic member 551c shown applies a downward force to the substrate contact portion 551b. The elastic member 551c is formed, for example, by a compression coil spring. The elastic member 551c is disposed between the lifting portion 551a and the substrate contact portion 551b. Through the force applied by the elastic member 551c, a downward force is always applied to the substrate contact portion 551b.

[0101] Pin 551d presses down on the unused resin (especially the flow channel 6) of the resin-molded substrate 2 from above. Pin 551d is formed into a generally cylindrical shape with its length pointing vertically. Pin 551d is fixed to the lower part of the lifting part 551a. Pin 551d is arranged to extend downward from the lifting part 551a. Multiple pins 551d are provided at positions on the resin-molded substrate 2 corresponding to the through hole 3a. The lower part of pin 551d is inserted into the through hole 551e of the substrate contact part 551b.

[0102] The resin pressing part 552 mainly presses the unused resin (rejection pool 5, flow channel 6) of the resin-molded substrate 2 from above. The resin pressing part 552 is disposed in front of the substrate pressing part 551. The resin pressing part 552 mainly includes a support part 552a, a connecting part 552b, and a resin contact part 552c.

[0103] The support portion 552a supports the resin contact portion 552c, which will be described later. The support portion 552a is fixed to the front of the lifting portion 551a.

[0104] The connecting portion 552b connects the support portion 552a to the resin contact portion 552c, which will be described later. The connecting portion 552b is formed into a generally cylindrical shape extending vertically along its length. The connecting portion 552b is arranged to extend downwards from the support portion 552a. Multiple connecting portions 552b are arranged in a left-right configuration (see reference). Figure 4 ).

[0105] The resin contact portion 552c is the part that contacts the unused resin of the resin-molded substrate 2. The resin contact portion 552c is formed in a generally rectangular parallelepiped shape extending horizontally along its length. The resin contact portion 552c has chamfered apex portions at its lower front and lower rear. This results in inclined surfaces formed at the lower front and lower rear of the resin contact portion 552c. The resin contact portion 552c is fixed to the lower part of the connecting portion 552b. The lower end of the resin contact portion 552c is positioned such that it is approximately the same height as the lower end of the substrate contact portion 551b (specifically, the substrate contact portion 551b in its lowest position relative to the lifting portion 551a). Cooling holes 552d are formed in the resin contact portion 552c.

[0106] Cooling hole 552d is a hole for ejecting gas (e.g., cooling air) toward the resin-molded substrate 2. Cooling hole 552d is formed by opening onto an inclined surface (chamfered portion) facing the rear-lower part of resin contact portion 552c. Cooling hole 552d is formed to connect with a flow path of cooling air formed inside the resin contact portion 552c. Cooling air is supplied to the flow path of resin contact portion 552c by operating a blower (not shown). The cooling air is ejected rear-lower from resin contact portion 552c via cooling hole 552d.

[0107] In this embodiment, the removal section 550 described above is arranged in two rows on the lower part of the upper movable body 540. Furthermore, in order to distinguish the two removal sections 550, the removal section 550 that is closer to the front (front side) is sometimes referred to as removal section 550F, and the removal section 550 that is closer to the back (rear side) is sometimes referred to as removal section 550B.

[0108] The removal section 550B is formed in a shape that reverses the front and back of the removal section 550F. That is, in the removal section 550B, the resin pressing section 552 is disposed behind the substrate pressing section 551.

[0109] Furthermore, the two removal units 550 (lifting units 551a) can be driven (lifted) independently of each other. Moreover, the structure for driving the two removal units 550 independently is not limited. For example, a structure can be used that provides a separate drive source (servo motor, etc.) for each of the two removal units 550 and independently controls the two drive sources, or a structure can be used that allows for independent switching of whether the driving force can be transmitted from one (shared) drive source to the two removal units 550.

[0110] <Cooling Section 560>

[0111] Figure 5 The cooling section 560 shown sprays cooling air toward the resin-molded substrate 2 placed in the mounting unit 520B. The cooling section 560 is positioned above the mounting unit 520B. The cooling section 560 has a resin contact portion 552c with the removal section 550 (see reference). Figure 6 It has a structure that is roughly the same as that of other components. That is, the cooling section 560 is a member that extends in the left-right direction along its length and has cooling holes for ejecting cooling air.

[0112] <Operation of the Waste Resin Removal Mechanism 500>

[0113] The following describes the process of removing unwanted resin from the resin-molded substrate 2 using the unwanted resin removal mechanism 500 configured as described above.

[0114] like Figure 2 As shown, the resin-molded substrate 2, sealed with resin by the molding mold 100, is placed in the loading unit 520 via the unloading machine 400. At this time, three rows (rows L1 to L3) of resin-molded substrates 2 (see reference) Figure 3 They are respectively placed in the corresponding placement unit 520.

[0115] exist Figure 6 The image shows the resin-molded substrate 2, which is the closest column L1, placed in the mounting unit 520F. In the resin-molded substrate 2, the substrate 3 portion is placed in the substrate mounting section 521. Additionally, the waste resin pool 5 portion is placed in the waste resin mounting section 522. Thus, by supporting not only the substrate 3 portion but also the waste resin (waste resin pool 5) formed on the side of the substrate 3, the resin-molded substrate 2 can be stably supported.

[0116] Furthermore, although the illustrations are omitted, the resin-molded substrates 2 in other columns (column L2, column L3) are also similarly placed in the mounting units 520M and 520B. Hereinafter, the description will mainly focus on the removal of unwanted resin from the resin-molded substrate 2 placed in the mounting unit 520F, and the description of the other resin-molded substrates 2 is omitted.

[0117] When the resin-molded substrate 2 is placed in the mounting unit 520, the lower movable body 510 (see reference) Figure 4 Move to the right and stop below the removal section 550. At this time, as... Figure 4 and Figure 5 As shown, the removal unit 550F and the removal unit 550B are located above the mounting unit 520F and the mounting unit 520M, respectively.

[0118] Next, as Figure 5 As shown, cooling air is ejected from the resin contact portion 552c of the removal section 550 and the cooling portion 560 at predetermined intervals. The cooling air ejected from the resin contact portion 552c cools the resin-molded substrate 2 placed in the mounting units 520F and 520M. Additionally, the cooling air ejected from the cooling portion 560 cools the resin-molded substrate 2 placed in the mounting unit 520B. Thus, by cooling the resin-molded substrate 2 to a certain extent, unwanted resin can be easily removed.

[0119] Next, removal sections 550F and 550B descend. More specifically, the lifting section 551a of each removal section 550 moves downward (descends) relative to the upper movable body 540. As the lifting section 551a descends, the substrate contact section 551b and the resin pressing section 552 also descend.

[0120] like Figure 7 As shown, when the removal section 550 descends to a certain extent, the substrate 3 portion of the resin-molded substrate 2 placed in the substrate mounting section 521 comes into contact with the substrate contact section 551b. Thus, the substrate 3 is held between the substrate contact section 551b and the substrate mounting section 521.

[0121] When the lifting portion 551a descends further in the aforementioned state, it descends relative to the substrate contact portion 551b. Consequently, the pin 551d provided in the lifting portion 551a protrudes downward from the substrate contact portion 551b and presses down the flow channel 6 portion via the through hole 3a formed in the substrate 3. Additionally, almost simultaneously, a resin pressing portion 552 is formed on the side of the substrate 3. Figure 7 Press down the waste resin pool 5 (front side). In this way, by pressing down the waste resin of the resin-molded substrate 2, the waste resin is peeled off from the resin-molded substrate 2.

[0122] Although a waste resin holding section 522 (holding section 522b) is disposed below the waste resin (rejection tank 5), the waste resin cannot be stably supported in the cylindrical holding section 522b. Therefore, the waste resin peeled off from the resin-molded substrate 2 will fall downwards due to its own weight. At this time, the waste resin is pressed down by the resin pressing section 552 disposed behind the waste resin holding section 522, and the waste resin falls to the rear side of the waste resin holding section 522. The falling waste resin is guided by the guide plate 523 and collected into the waste resin receiving section (not shown) and discharged.

[0123] Furthermore, although the illustration is omitted, not only the resin-molded substrate 2 placed in the mounting unit 520F, but also the resin-molded substrate 2 placed in the mounting unit 520M, has its useless resin removed by the removal unit 550B.

[0124] When the waste resin is removed from the resin-molded substrate 2 placed in the mounting units 520F and 520M, the removal sections 550F and 550B rise respectively. Thereafter, as... Figure 8 As shown, the upper movable body 540 moves rearward. Simultaneously, the two removal parts 550 move rearward as a single unit. When the removal part 550B reaches above the mounting unit 520, the upper movable body 540 stops.

[0125] Next, only removal section 550B of the two removal sections 550 descends. Thus, similar to the cases of mounting units 520F and 520M, unwanted resin is removed from the resin-molded substrate 2 mounted on the mounting unit 520B. When unwanted resin is removed from the resin-molded substrate 2, removal section 550B rises.

[0126] Subsequently, as described above, the mounting unit 520 (lower movable body 510) moves to the right, and the resin-molded substrate 2, from which waste resin has been removed, is transferred to the substrate receiving section 700 (see reference). Figure 2 ).

[0127] As described above, in the waste resin removal mechanism 500 of this embodiment, waste resin can be removed from three rows of resin-molded substrates 2 by using two removal units 550 that can be driven independently of each other. That is, by making the removal units 550 capable of being driven independently of each other, waste resin can be removed regardless of the number (rows) of resin-molded substrates 2. As a result, the versatility of the resin molding apparatus 1 can be improved.

[0128] In particular, in this embodiment, the two removal sections 550 are arranged in a configuration that is reversed from each other. By arranging multiple removal sections 550 with different configurations in this way, as in this embodiment, the resin-molded substrate 2 (columns L1, L2, and L3, as shown in the previous embodiment) can be removed appropriately and in turn. Figure 3 Useless resin.

[0129] Furthermore, in the waste resin removal mechanism 500 of this embodiment, the waste resin removed from the resin-molded substrate 2 is not stably supported by the waste resin holding part 522, and therefore falls downwards and is collected due to its own weight. That is, in this embodiment, there is no need to provide a mechanism for discharging the removed waste resin (e.g., an adsorption mechanism for holding the waste resin, or a conveying mechanism for discharging, etc.), thus simplifying the structure of the device. Hereinafter, the structure of the waste resin holding part 522, etc., for causing the waste resin to fall due to its own weight will be specifically described.

[0130] <Details of the useless resin carrier 522, etc.>

[0131] exist Figure 9 The diagram schematically shows the waste resin (rejection pool 5 and flow channel 6), waste resin placement part 522 and resin pressing part 552 of the resin-molded substrate 2.

[0132] In this embodiment, the mounting portion 522b is formed into a cylindrical shape. Therefore, when viewed from the side, the mounting portion 522b contacts the useless resin at a point on the side of the curved cylinder. Hereinafter, the portion of the mounting portion 522b that contacts the useless resin will be referred to as the contact portion P1.

[0133] If the contact portion P1 is positioned so as not to overlap with the center of gravity G of the useless resin when viewed from above, the useless resin mounting portion 522 cannot stably support the useless resin, causing the useless resin to fall due to its own weight. Therefore, it is preferable to position the useless resin mounting portion 522 in such a way that the contact portion P1 does not overlap with the center of gravity G of the useless resin when viewed from above.

[0134] Furthermore, to facilitate the falling of the useless resin, it is preferable to minimize the contact area P1 (the portion where the mounting portion 522b contacts the useless resin). For example, in this embodiment, the mounting portion 522b is formed into a cylindrical shape, such that a point (contact area P1) at the upper end of the mounting portion 522b in a side view contacts the useless resin. In this way, by minimizing the contact area with the useless resin, the useless resin placed on the useless resin mounting portion 522 is made to be in an unstable state, thereby making it easier for it to fall due to its own weight.

[0135] Furthermore, to facilitate the discharge of the waste resin, it is preferable to position the resin pressing portion 552 for pressing the waste resin to the side of the waste resin holding portion 522. More specifically, it is preferable that the portion of the resin pressing portion 552 (resin contact portion 552c) that contacts the waste resin (hereinafter referred to as contact portion P2) is positioned so as not to overlap with the contact portion P1 of the waste resin holding portion 522 when viewed from above. Moreover, in this embodiment, the lower end face of the resin contact portion 552c is designated as contact portion P2.

[0136] In more detail with reference to this embodiment, it is preferable that the position A of the front end of the contact portion P2 of the resin contact portion 552c is positioned further rearward than the contact portion P1 of the mounting portion 522b (i.e., at a position that overlaps with the curved surface of the mounting portion 522b (excluding the contact portion P1), or at a position that does not overlap with the mounting portion 522b). With this configuration, it is possible to prevent useless resin from being clamped by the contact portions P1 and P2 and making it difficult to fall.

[0137] Furthermore, the resin molding apparatus 1 does not necessarily need to have all the structures regarding the positional relationship between the useless resin placement part 522 and the center of gravity G, the size of the contact part P1, and the arrangement of the resin pressing part 552. That is, if the resin molding apparatus 1 has at least one of the structures mentioned above, the useless resin can fall due to its own weight.

[0138] The following uses Figure 10 A modified example of the useless resin mounting part 522 will be described.

[0139] exist Figure 10 In the first variation of the useless resin placement portion 522 shown in (a), the placement portion 522b is formed into a triangular shape when viewed from the side. Specifically, the placement portion 522b is formed with the corner (one vertex) formed by two inclined planes facing upwards. The corner becomes the contact portion P1 that contacts the useless resin. In the first variation, the useless resin placement portion 522 contacts the useless resin at one point of the vertex of the triangle when viewed from the side, thus allowing the useless resin to fall easily.

[0140] exist Figure 10 In the second variation of the useless resin placement portion 522 shown in (b), the placement portion 522b is formed into a trapezoidal shape when viewed from the side. Specifically, the placement portion 522b is formed such that the front-to-back width of its upper surface (upper base when viewed from the side) is smaller than the front-to-back width of its lower surface (lower base). Its upper surface becomes the contact portion P1 that contacts the useless resin. The upper surface of the useless resin placement portion 522 in the second variation is formed to be relatively small, so that the useless resin can fall more easily.

[0141] exist Figure 10In the third variation of the useless resin placement portion 522 shown in (c), the placement portion 522b is formed into a rectangular shape when viewed from the side. In this case, the upper surface of the placement portion 522b becomes the contact portion P1 that contacts the useless resin. Although the upper surface of the useless resin placement portion 522 in the third variation is relatively large, by arranging the useless resin placement portion 522 in such a way that the center of gravity G of the useless resin does not overlap with the contact portion P1 when viewed from above, the useless resin can fall.

[0142] As described above, the resin molding apparatus 1 of this embodiment includes: a molding die 100, including an upper die 120 and a lower die 110 facing the upper die 120, for resin molding a substrate 3; a mold closing mechanism 200 for closing the molding die 100; and a waste resin removal mechanism 500 for removing waste resin formed on the resin-molded substrate 2. The waste resin removal mechanism 500 includes a plurality of removal parts 550, which remove the waste resin from the resin-molded substrate 2 by pressing the waste resin on the resin-molded substrate 2. The plurality of removal parts 550 can be driven independently of each other.

[0143] This configuration improves the versatility of the resin molding apparatus 1. That is, the removal unit 550 can be driven individually according to the number or arrangement of the resin-molded substrates 2, so that useless resin can be appropriately removed regardless of the number or arrangement of the resin-molded substrates 2.

[0144] Furthermore, the plurality of removal units 550 can move independently of each other in the vertical direction.

[0145] This configuration improves the versatility of the resin molding apparatus 1. That is, multiple removal sections 550 can be moved individually in the vertical direction, so only the required removal section 550 can be operated depending on the number of resin-molded substrates 2.

[0146] In addition, the plurality of removal units 550 can move integrally in the horizontal direction.

[0147] By configuring it in this way, the structure of the resin molding apparatus 1 can be simplified. That is, by configuring it so that the plurality of removal sections 550 move together in the horizontal direction, the structure for moving the removal sections 550 in the horizontal direction can be simplified.

[0148] Additionally, the removal section 550 includes: a substrate pressing section 551 that presses and holds the substrate 3 portion of the resin-molded substrate 2; and a resin pressing section 552 formed on the side of the substrate pressing section 551 that presses the waste resin and removes it from the resin-molded substrate 2.

[0149] With this configuration, unwanted resin formed on the side of the resin-molded substrate 2 can be easily removed.

[0150] Additionally, the plurality of removal portions 550 include: a removal portion 550F (first removal portion) having its resin pressing portion 552 disposed on one side (front) of the substrate pressing portion 551; and a removal portion 550B (second removal portion) having its resin pressing portion 552 disposed on the other side (rear) of the substrate pressing portion 551.

[0151] This configuration improves the versatility of the resin molding apparatus 1. That is, by using the removal section 550F and the removal section 550B differently depending on the shape of the resin-molded substrate 2 (especially the position of the waste resin relative to the substrate 3), it can be adapted to various resin-molded substrates 2.

[0152] Additionally, the resin-molded substrate 2 includes: a resin-molded substrate 2 in column L1 (first resin-molded substrate), on one side (front) of the substrate 3 portion having the waste resin formed thereon; and resin-molded substrates 2 in columns L2 and L3 (second resin-molded substrates), on the other side (rear) of the substrate 3 portion having the waste resin formed thereon.

[0153] This configuration improves the versatility of the resin molding apparatus 1. That is, it can remove the waste resin from the resin-molded substrate 2, even if the shape (especially the position of the waste resin relative to the substrate 3) is different.

[0154] In addition, the resin pressing part 552 can cool the resin-molded substrate 2 by spraying gas onto it.

[0155] With this configuration, the resin-molded substrate 2 is cooled to a certain extent, thereby making it easy to remove unwanted resin. In addition, by using the structure for cooling unwanted resin, etc., as the resin pressing part 552, the structure of the resin molding apparatus 1 can be simplified.

[0156] Furthermore, the resin molding method of this embodiment uses the resin molding apparatus 1 to manufacture resin molded articles.

[0157] This configuration improves the versatility of the resin molding apparatus 1.

[0158] Furthermore, the resin molding apparatus 1 of this embodiment includes: a molding mold 100, including an upper mold 120 and a lower mold 110 facing the upper mold 120, for resin molding a substrate 3; a mold closing mechanism 200 for closing the molding mold 100; and a waste resin removal mechanism 500 for removing waste resin formed on the resin-molded substrate 2. The waste resin removal mechanism 500 includes: a substrate mounting portion 521 for mounting the substrate 3 portion of the resin-molded substrate 2; and a waste resin mounting portion 522 disposed to the side of the substrate mounting portion 521 for mounting the waste resin of the resin-molded substrate 2, and causing the waste resin removed from the resin-molded substrate 2 to fall off due to its own weight.

[0159] By configuring it in this way, the structure of the resin molding apparatus 1 can be simplified. That is, there is no need for a mechanism for discharging the waste resin that will be removed from the resin-molded substrate 2 (e.g., an adsorption mechanism for adsorbing waste resin), thus simplifying the structure of the resin molding apparatus 1 and reducing its cost.

[0160] In addition, the position of the useless resin placement part 522 does not overlap with the center of gravity G of the useless resin that is removed from the resin-molded substrate 2 when viewed from below.

[0161] This configuration makes it easy for the useless resin to fall due to its own weight. That is, the useless resin holding part 522 does not support the center of gravity G of the useless resin, so the useless resin becomes unstable and thus falls easily.

[0162] Furthermore, the useless resin placement portion 522 has a curved surface at the portion (contact portion P1) that contacts the placed useless resin (see reference). Figure 9 ), or the corner where multiple faces intersect (see Figure 10 It is formed in the manner of (a)).

[0163] This configuration makes it easy for the useless resin to fall due to its own weight. That is, by reducing the contact portion P1 of the useless resin placement portion 522, the useless resin becomes unstable and thus falls easily.

[0164] Furthermore, the useless resin placement portion 522 (placement portion 522b) is formed in a cylindrical shape and is arranged such that its curved side surface is in contact with the useless resin.

[0165] This configuration makes it easy for the useless resin to fall due to its own weight. That is, by reducing the contact portion P1 of the useless resin placement portion 522, the useless resin becomes unstable and thus falls easily.

[0166] In addition, the useless resin removal mechanism 500 includes a resin pressing part 552, which is disposed on the side of the useless resin placing part 522 and removes the useless resin from the substrate 3 by pressing it from above.

[0167] This configuration allows the useless resin to easily fall off due to its own weight. That is, by pressing the useless resin against the side of the useless resin holding portion 522, the useless resin can easily fall off the useless resin holding portion 522.

[0168] Furthermore, the resin pressing part 552 is configured such that when the useless resin is pressed, the part in contact with the useless resin (contact part P2) does not overlap with the part in contact with the useless resin placing part 522 (contact part P1) when viewed from above.

[0169] This configuration allows the useless resin to easily fall off due to its own weight. That is, it prevents the useless resin from being held between the useless resin holding part 522 and the resin pressing part 552, and allows the useless resin to fall off easily.

[0170] Additionally, the useless resin is formed on one side of portion 3 of the substrate.

[0171] With this configuration, the structure of the resin molding apparatus 1, which removes the useless resin formed on one side of the substrate 3, can be simplified.

[0172] Furthermore, the method for manufacturing resin molded articles in this embodiment uses the resin molding apparatus 1 to manufacture resin molded articles.

[0173] This configuration simplifies the structure of the resin molding apparatus 1.

[0174] The embodiments of the present invention have been described above, but the present invention is not limited to the described embodiments, and appropriate modifications can be made within the scope of the technical concept of the invention as described in the claims.

[0175] For example, the constituent components (such as the resin molding module 10) used in the resin molding apparatus 1 of the above embodiment can be appropriately installed, removed, or replaced. For example, a supply module for supplying the substrate 3 or small sheet resin to the resin molding module 10 can be further provided, or the number of resin molding modules 10 can be changed. In addition, the structure or operation of the constituent components used in the resin molding apparatus 1 of this embodiment can be appropriately modified.

[0176] Furthermore, in this embodiment, a structure is shown in which the two removal sections 550 move together in the horizontal direction, but the present invention is not limited to this. For example, it can also be configured such that the two removal sections 550 move independently in the horizontal direction. This further improves the versatility of the resin molding apparatus 1.

[0177] Furthermore, in this embodiment, a resin molding apparatus 1 having two removal sections 550 is illustrated, but the present invention is not limited thereto. For example, it can also be configured to have three or more removal sections 550, each of which is driven independently.

[0178] Furthermore, in this embodiment, a removal portion 550F with the resin pressing portion 552 disposed "in front" of the substrate pressing portion 551 and a removal portion 550B with the resin pressing portion 552 disposed "behind" the substrate pressing portion 551 are exemplified. However, the present invention is not limited to this, and the relative positional relationship between the resin pressing portion 552 and the substrate pressing portion 551 can be arbitrarily changed. For example, a removal portion 550 with the resin pressing portion 552 disposed "to the left" of the substrate pressing portion 551 and a removal portion 550 with the resin pressing portion 552 disposed "to the right" of the substrate pressing portion 551 can also be used.

[0179] Furthermore, in this embodiment, a resin-molded substrate 2 with a row L1 of useless resin formed in front of the substrate 3 and a resin-molded substrate 2 with rows L2 and L3 of useless resin formed in front of the substrate 3 are illustrated. However, the present invention is not limited to this, and the relative positional relationship between the substrate 3 and the useless resin can be arbitrarily changed. For example, a resin-molded substrate 2 with useless resin formed in the left side of the substrate 3 and a resin-molded substrate 2 with useless resin formed in the right side of the substrate 3 can also be used.

[0180] Thus, by arbitrarily setting the orientation of the removal section 550 and the resin-molded substrate 2, the versatility of the resin molding apparatus 1 can be improved.

[0181] Furthermore, the number or arrangement of the resin-molded substrates 2 and the corresponding number or arrangement of the mounting units 520 illustrated in this embodiment are examples that can be arbitrarily changed.

[0182] In addition, in this embodiment, the shape of several useless resin placement portions 522 (placement portions 522b) is illustrated (see reference). Figure 9 and Figure 10However, the present invention is not limited thereto, and the shape of the mounting portion 522b can be arbitrarily changed. That is, the shape of the useless resin mounting portion 522 (mounting portion 522b) is not particularly limited as long as the useless resin removed from the resin-molded substrate 2 can fall off due to its own weight. For example, the mounting portion 522b can also be formed in a shape that is not cylindrical (circular in side view, see reference). Figure 9 It is formed into a semi-cylindrical shape with the curved surface facing upwards (semi-circular when viewed from the side).

Claims

1. A resin molding apparatus comprising: a molding die including an upper die and a lower die facing the upper die, which resin-molds a substrate; a die closing mechanism which closes the molding die; and a useless resin removing mechanism which removes useless resin formed on a resin-molded substrate, the useless resin removing mechanism including: a substrate placement portion which places a substrate portion of the resin-molded substrate; a useless resin placement portion which is disposed laterally to the substrate placement portion, places useless resin of the resin-molded substrate, and causes the useless resin removed from the resin-molded substrate to fall due to its own weight; a removing portion which removes the useless resin from the resin-molded substrate by pressing the placed useless resin of the resin-molded substrate; and a guide plate for guiding the useless resin to a useless resin housing portion formed in a lower portion of the substrate placement portion, the removing portion being movable in an up-and-down direction and a horizontal direction, the removing portion removing the useless resin from a plurality of resin-molded substrates arranged side by side, the number of resin-molded substrates arranged side by side being greater than the number of removing portions, and the useless resin removed from the resin-molded substrate falling due to its own weight, the guide plate being disposed between the substrate placement portion and the useless resin placement portion, the guide plate being inclined downward from the useless resin placement portion side toward the substrate placement portion side, guiding the useless resin falling due to its own weight to the useless resin housing portion, the molding die resin-molding the substrate to form the resin-molded substrate, in the resin-molded substrate, a scum pool is formed outside the substrate, and a runner extends from the scum pool to a surface of the substrate, the useless resin includes the scum pool and the runner, the removing portion removes the useless resin by pressing the scum pool and the runner of the resin-molded substrate.

2. The resin molding apparatus according to claim 1, wherein the useless resin placement portion supports a position, from below, which does not overlap a center of gravity of the useless resin removed from the resin-molded substrate in a plan view.

3. The resin molding apparatus according to claim 1 or 2, wherein the useless resin placement portion is formed in such a manner that a portion in contact with the placed useless resin is a curved surface or an angular portion where a plurality of surfaces intersect.

4. The resin molding apparatus according to claim 3, wherein the useless resin placement portion is formed in a cylindrical shape, and is disposed in such a manner that a side surface formed in a curved shape is in contact with the useless resin.

5. The resin molding apparatus according to claim 1 or 2, wherein the removing portion includes a resin pressing portion which is disposed laterally to the useless resin placement portion, and removes the useless resin from the substrate portion by pressing the useless resin from above.

6. The resin molding apparatus according to claim 5, wherein The resin pressing portion is arranged in such a manner that, when the unnecessary resin is pressed, the portion in contact with the unnecessary resin does not overlap the portion of the unnecessary resin placement portion in contact with the unnecessary resin in plan view.

7. The resin forming apparatus according to claim 1 or 2, wherein The unnecessary resin is formed on one side of the substrate portion.

8. A method of manufacturing a resin formed article, which uses the resin forming apparatus according to any one of claims 1 to 7 to manufacture a resin formed article.

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