Cooling device, cooling assembly, and method for cooling a computing system

Abstract

A cooling device, a cooling assembly, and a method for cooling a computing system are disclosed, wherein the cooling device is for a computing system, the cooling device comprising an input conduit, a first heat sink, a second heat sink, a connecting conduit, and an output conduit. The first heat sink has a first top slot and a first bottom slot. The first top slot is coupled to the input conduit. The second heat sink has a second top slot and a second bottom slot. The second heat sink is positioned parallel to the first heat sink. The first heat sink and the second heat sink are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end and a second end, the first end coupled to the first bottom slot and the second end coupled to the second bottom slot. The output conduit is coupled to the second top slot.

Description

TECHNICAL FIELD

[0001] The present invention relates to a cooling device, and more particularly, to a dual heat sink device for cooling electronic components in a server system. BACKGROUND

[0002] Cooling devices, such as cold plates, generally dissipate heat generated by electronic components in a server system. Liquid coolant is used to help transfer heat from the electronic components to a cooling assembly having the cooling device. Cooling devices that use only one heat sink can not maximize the surface area for cooling the liquid coolant. In addition, the design of the cooling device can affect the cooling efficiency of the server system. Another way to help transfer heat from a higher temperature region to a lower temperature region is to increase components that promote heat conduction or convection. Regardless of the method used, there is still a need for a cooling device that has a high cooling efficiency. SUMMARY

[0003] The use of the terms embodiment and similar terms (e.g., implementations, configurations, aspects, examples, and options) is intended to refer broadly to all of the subject matter of this patent and the claims appended hereto. Statements containing these terms should be understood not to limit the claimed subject matter to the particular facts or circumstances described, but rather to represent one example of the subject matter of this patent. The embodiments of the invention covered by this patent are defined by the claims appended hereto, rather than by the description in this Summary. This Summary is a high-level overview of various features of the invention and introduces some of the concepts that are more fully described in the Implementation section below. This Summary is not intended to identify key or essential inventive features of the claimed subject matter, nor is it meant to limit the scope of the claimed subject matter to embodiments described in this Summary. The claimed subject matter should be understood from the complete specification including all drawings and claims.

[0004] A cooling device for a computing system is disclosed in accordance with certain aspects of the present invention. The cooling device includes an input conduit, a first heat sink, a second heat sink, a connecting conduit, and an output conduit. The first heat sink has a first top slot and a first bottom slot. The first top slot is coupled to the input conduit. The second heat sink has a second top slot and a second bottom slot. The second heat sink is positioned parallel to the first heat sink. The first heat sink and the second heat sink are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom slot and a second end coupled to the second bottom slot. The output conduit is coupled to the second top slot.

[0005] In accordance with configurations of the above embodiments, each of the first heat sink and the second heat sink includes a tube extending from the first top slot and the second top slot to the respective first bottom slot and second bottom slot.

[0006] In another aspect of the above embodiments, each of the first and second heat sinks includes fins between the first top and bottom slots and the second top and bottom slots, respectively.

[0007] In another aspect of the above embodiments, the cooling device also includes a fan to direct airflow through the first and second heat sinks.

[0008] According to another configuration of the above embodiments, the cooling device also includes a pump fluidly coupled to the output conduit.

[0009] In another aspect of the above embodiments, the cooling device also includes an external conduit coupled to the pump.

[0010] In another aspect of the above embodiments, the pump is coupled to a control unit.

[0011] In another aspect of the above embodiments, the cooling device also includes a support frame on which the first and second heat sinks are mounted at an angle relative to the bottom panel.

[0012] According to a configuration of the above embodiments, the first and second heat sinks dissipate heat at a rate of between about 8.5 and 20 kilowatts.

[0013] According to another aspect of the present invention, a method for cooling a computing system is disclosed, the method using a cooling device thermally coupled to the computing system, the method including receiving a liquid coolant into an input conduit of the cooling device. The method also includes flowing the liquid coolant from the input conduit to a first top slot of a first heat sink in the cooling device. The method further includes moving the liquid coolant through a connection conduit between a first bottom slot of the first heat sink and a second bottom slot of a second heat sink in the cooling device. The second heat sink is parallel to the first heat sink and is angled relative to a bottom panel of the cooling device. The method further includes expelling the liquid coolant from a second top slot of the second heat sink through an output conduit of the cooling device. The method further includes cooling at least one of the first and second heat sinks with airflow through the cooling device.

[0014] In another aspect of the above embodiments, the liquid coolant flows through a tube in each of the first and second heat sinks, the tube extending from the first and second top slots to the first and second bottom slots, respectively.

[0015] In another aspect of the above embodiments, the cooling further includes using a fan to direct airflow through the first and second heat sinks.

[0016] The foregoing description is not intended to represent every embodiment or every feature of the invention. Rather, the foregoing description provides only examples of some novel features and characteristics set forth herein. These features and advantages, as well as other features and advantages of the invention, will become apparent from the following detailed description of representative embodiments and modes when taken in conjunction with the accompanying drawings and appended claims. Additional features of the invention will be apparent to those skilled in the art in light of the detailed description of the various embodiments with reference to the illustrations, a brief summary of which will be provided below. Attached Figure Description

[0017] The advantages of the invention and the accompanying drawings will be better understood from the following description of embodiments in conjunction with the accompanying drawings. These drawings depict exemplary embodiments only and should not be considered as limiting the scope of the various embodiments or claims.

[0018] Figure 1 A partially transparent schematic side view of an exemplary cooling assembly connected to a server system, representing certain aspects of the present invention;

[0019] Figure 2 For certain aspects of the present invention Figure 1 A partially transparent front perspective view of an exemplary cooling assembly;

[0020] Figure 3A A front view of an exemplary heat sink for certain aspects of the present invention;

[0021] Figure 3B For certain aspects of the present invention Figure 3A An enlarged view of the heatsink, showing exemplary heatsink piping and fins;

[0022] Figure 4 Described for certain aspects of the invention Figure 1 A schematic side view of the flow direction of liquid coolant in an exemplary cooling assembly;

[0023] Figure 5 Block diagrams depicting methods for certain aspects of the present invention, using Figures 1 to 2 The cooling assembly is used to cool the computing system.

[0024] This invention is readily adaptable to various modifications and alternatives, some representative embodiments of which have been illustrated by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that this invention is not intended to be limited to the specific forms disclosed. Rather, this invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined in the claims.

[0025] Symbol Explanation

[0026] 100: Cooling Assembly

[0027] 102: cooling device

[0028] 104: housing

[0029] 106: panel

[0030] 108: panel

[0031] 110: front panel

[0032] 112: first side panel

[0033] 114: rear panel

[0034] 116: second side panel

[0035] 118: fan wall

[0036] 120: power supply

[0037] 122: control unit

[0038] 124: input conduit

[0039] 126A: manifold

[0040] 126B: manifold

[0041] 128: output conduit

[0042] 130: external conduit

[0043] 132: connecting conduit

[0044] 134: first heat sink

[0045] 136: second heat sink

[0046] 138: support frame

[0047] 140: pump

[0048] 142A: first top slot

[0049] 142B: second top slot

[0050] 144A: first bottom slot

[0051] 144B: second bottom slot

[0052] 146: fan module

[0053] 148: alignment member

[0054] 150: base

[0055] 152: top surface

[0056] 154A: transverse channel

[0057] 154B: transverse channel

[0058] 156: rail

[0059] 160: server system

[0060] 162: server rack

[0061] 164: heat-generating electronic device

[0062] 166: first connector

[0063] 168: second connector

[0064] 170: first conduit

[0065] 172: second conduit

[0066] 174: cooling block

[0067] 176: bottom frame

[0068] 178: top frame

[0069] 180a: upright post

[0070] 180b: upright post

[0071] 180c: upright post

[0072] 180d: upright post

[0073] 182: cold manifold

[0074] 184: hot manifold

[0075] 186: cold coolant line

[0076] 188: hot coolant line

[0077] 190: coolant connector

[0078] 192: coolant connector

[0079] 202: line

[0080] 204: fin

[0081] 206: first opening

[0082] 208: second opening

[0083] 260: joint

[0084] 500: method

[0085] 510: step

[0086] 520: step

[0087] 530: step

[0088] 540: step

[0089] 550: step

[0090] θ: angle DETAILED DESCRIPTION

[0091] The present invention is directed to a cooling device, and more particularly to a dual heat sink cooling device in a cooling assembly that uses liquid coolant to cool electronic components. The cooling device cools liquid coolant heated by the electronic components and recirculates the cooled liquid coolant to cool the electronic components. The dual heat sink feature is able to cool the coolant more efficiently than using a single heat sink, at least in part due to the increased surface area for cooling.

[0092] Various embodiments are described in terms of technical features. A description of a technical feature in the description or in any of the claims is not a limitation of that feature to that particular embodiment. Rather, any feature described can be combined with any other feature or claim in any manner. Various embodiments are described herein with reference to the drawings. In the drawings, like reference numerals refer to like elements throughout. Unless otherwise specified, an "embodiment" or "exemplary embodiment" means an example of the described invention. Various embodiments are described in terms of technical features. A description of a technical feature in the description or in any of the claims is not a limitation of that feature to that particular embodiment. Rather, any feature described can be combined with any other feature or claim in any manner. Various embodiments are described herein with reference to the drawings. In the drawings, like reference numerals refer to like elements throughout. Unless otherwise specified, an "embodiment" or "exemplary embodiment" means an example of the described invention. Numerous specific details are described to provide a thorough understanding of various embodiments. However, in certain instances, well-known methods, procedures, components and circuits have been omitted in order to avoid obscuring various embodiments. One skilled in the relevant art will recognize that many of the embodiments can be practiced with one or more of the specific details set forth herein. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. Rather, the methods, devices and systems described herein are widely applicable in various embodiments and / or for various extensions, permutations, combinations, and the like. Various embodiments can be implemented using hardware elements, software elements, or a combination of both. Examples of hardware elements can include processors, microprocessors, circuits, circuit elements (e.g., transistors, logic gates, resistors, capacitors, inductors, and so forth), control logic, programmable logic devices, application specific integrated circuits (ASICs), programmable logic arrays (PLAs), field programmable gate arrays (FPGAs), digital signal processors (DSPs), or other similar devices. Examples of software elements can include software components, programs, applications, computer programs, application programs, system programs, software development programs, machine programs, operating system

[0093] The disclosed elements and limitations, such as in the abstract, summary, and detailed description, but not explicitly set forth in the claims, should not be incorporated by implication or otherwise into the claims. For purposes of the present embodiment, the singular includes the plural and vice versa unless explicitly stated otherwise. The term "include" is meant to be synonymous with the term "comprise" and vice versa. Additionally, words such as "about", "almost", "substantially", "approximately", and the like, can mean, for example, "at", "near", "within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5% of vertical" or "within 3-5% of horizontal", respectively. Further, directional words such as "top", "bottom", "left", "right", "above", and "below", are intended to be associated with equivalent directions as described in the referenced figures, as understood from the context of the object or element being referenced, such as from the usual position of the object or element, or as otherwise stated herein.

[0094] Referring to the drawings, Figure 1 A partially transparent schematic side view of a cooling assembly 100 in a server system 160 is shown, while Figure 2 A partially transparent front perspective view of the cooling assembly 100 is shown. The cooling assembly 100 is thermally and fluidly coupled to a server rack 162 in the server system 160, and includes a cooling device 102. The cooling assembly 100 is used to cool one or more heat-generating electronic components 164 of the server rack 162. In non-limiting embodiments, the heat-generating electronic components 164 can include storage servers, application servers, switches, high-power components, processors, in-line isolators, light isolators, output isolators, faraday rotators, power transistors, central processing units, graphics processing units, microcontrollers, microprocessors, embedded processors, media processors, and the like. In non-limiting embodiments, the cooling assembly 100 can be used to cool one or more heat-generating electronic components 164 of a server rack 162 in a server system 160. Figures 1 to 2In the exemplary embodiment shown in FIG. 1, the server rack 162 is configured to support a horizontal orientation of the heat-generating electronic components 164. Each heat-generating electronic component 164 can be coupled to a cooling block 174. In non-limiting embodiments, the cooling block 174 can be a water block, a heat sink, a cold plate, a cooling plate, a heat exchanger, or the like.

[0095] The server rack 162 includes a top frame 178 and a bottom frame 176. The bottom frame 176 can include wheels or slides that allow the server rack 162 to be moved to a desired location in a data center. The cooling assembly 100 is mounted on the bottom frame 176. The bottom frame 176 supports upright posts 180a, 180b, 180c, and 180d. The top frame 178 connects the top ends of the upright posts 180a, 180b, 180c, and 180d. Each of the upright posts 180a, 180b, 180c, and 180d can also include holes to allow pins to be inserted to support shelves supported by the upright posts 180a, 180b, 180c, and 180d.

[0096] The server rack 162 supports a cold manifold 182 and a hot manifold 184 that span between the bottom frame 176 and the top frame 178 of the server rack 162. The cold manifold 182 is fluidly connected to the cooling assembly 100 via a cold coolant line 186 proximate to the bottom of the server rack 162. The hot manifold 184 is fluidly connected to the cooling assembly 100 via a hot coolant line 188 proximate to the bottom of the server rack 162. Each of the heat-generating electronic components 164 is fluidly connected to coolant connectors 190 and 192, which can be couplers spaced along the length of the cold manifold 182 and the hot manifold 184, respectively.

[0097] The heat-generating electronic components 164 can include an internal network of fluid conduits that circulate liquid coolant throughout the internal components of the heat-generating electronic components 164. In a non-limiting example, one of the heat-generating electronic components 164 can be an application server having an internal cold plate in contact with a processing device within the chassis of the server system 160. Liquid coolant is provided by a cold manifold 182 through a coolant connector 190 and circulated through the cold plate to carry away heat generated by the processing device. The liquid coolant is returned through a hot manifold 184 to a coolant connector 192. Thus, liquid coolant flows from a cold coolant line 186 and the cold manifold 182 into the heat-generating electronic component 164. The liquid coolant will then circulate through the internal components to absorb heat and flow out of the heat-generating electronic component 164 through the hot manifold 184 to a hot coolant line 188. The heated liquid coolant will then be sent through the cooling assembly 100 to dissipate the heat.

[0098] With continued reference to Figures 1 to 2 , the cooling device 102 includes an input conduit 124, manifolds 126A and 126B, an output conduit 128, an external conduit 130, a connection conduit 132, a first radiator 134, and a second radiator 136. The first and second radiators 134 and 136 are stacked parallel to each other and angled relative to the bottom end of the cooling device 102. The first and second radiators 134 and 136 are configured to remove heat from the liquid coolant as it passes through the first and second radiators 134 and 136. The input conduit 124 and the external conduit 130 circulate the liquid coolant through the first and second radiators 134 and 136.

[0099] The manifolds 126A and 126B are located near the support frame 138 and the second side panel 116. The manifold 126A can be coupled to the output conduit 128 and a pump 140. As Figures 1 to 2 shown, the input conduit 124 is shown coupled to the second radiator 136. The connection conduit 132 fluidly connects the first radiator 134 to the second radiator 136. The output conduit 128 fluidly connects the first radiator 134 to the manifold 126A. The manifold 126B is also fluidly connected to the pump 140 and the external conduit 130. Thus, in the illustrated embodiment, the flow direction through the cooling assembly 100 is from the input conduit 124 to the second radiator 136 to the connection conduit 132 to the first radiator 134 to the output conduit 128 to the manifold 126A to the pump 140 to the manifold 126B to the external conduit 130. Figures 1 to 2

[0100] ​The input conduit 124 and the output conduit 128 are generally above the first heat sink 134 and the second heat sink 136. The input conduit 124, the connection conduit 132, the output conduit 128, and the external conduit 130 can be made of the same material, such as, but not limited to, plastic, metal, rubber, and the like. In other embodiments, any of the input conduit 124, the connection conduit 132, the output conduit 128, and the external conduit 130 can be made of the same or different materials. Fittings 260 are used to connect (i) the input conduit 124 and the second heat sink 136, (ii) the second heat sink 136 and the connection conduit 132, (iii) the connection conduit 132 and the first heat sink 134, (iv) the first heat sink 134 and the output conduit 128, (v) the output conduit 128 and the manifold 126A, and (vi) the external conduit 130 and the manifold 126B. The fittings 260 enable fluid connections between the connecting components on either side. In non-limiting embodiments, the fittings 260 can be connectors, extenders, elbows, reducers, tees, bushings, couplings, adapters, plugs, caps, valves, and the like.

[0101] The cooling device 102 is disposed within a fully sealed enclosure 104. The enclosure 104 includes a top panel 106, a bottom panel 108, a front panel 110, a first side panel 112, a rear panel 114, and a second side panel 116. The panels 106-116 of the enclosure 104 can be made of a thermally conductive material, such as, but not limited to, steel or aluminum. The enclosure 104 can be made of a thermally insulating material, such as, but not limited to, a plastic material. The cooling device 102 further includes a pump 140, a power supply 120, a control unit 122, a fan wall 118, and a support frame 138.

[0102] The pump 140 directs the flow of liquid coolant within the cooling assembly 100. The pump 140 is located near the power supply 120 and the control unit 122, close to the rear panel 114. The pump 140 and the control unit 122 are generally in line with each other and electrically connected. The power supply 120 is electrically coupled to the pump 140 to provide power to the pump motor. In the depicted embodiment, there are two pumps 140. In other embodiments, there can be any number of pumps 140. In non-limiting embodiments, the pump 140 can be a hydraulic pump, a rotary pump, a piston pump, a diaphragm pump, and the like.

[0103] Pump 140 is fluidly coupled to manifolds 126A and 126B, output conduit 128, and external conduit 130. Pump 140 removes heated liquid coolant flowing from hot coolant line 188 and recirculates cool liquid coolant back through cool coolant line 186. Control unit 122 can be configured to perform control processes and switching commands to pump 140. Thus, control unit 122 can control pump 140 to speed up or slow down, for example, to achieve a desired flow rate or pressure.

[0104] Power supply 120 is coupled to control unit 122 and pump 140. Power supply 120 is located on bottom panel 108 proximate rear panel 114. Power supply 120 can provide at least sufficient power to activate control unit 122 and pump 140 while cooling assembly 100 is in use. In other embodiments, power supply 120 can be located on other panels of housing 104. Figures 1 to 2 In the illustrated embodiment, there is one power supply 120. In other embodiments, there can be several power supplies similar to power supply 120 located within housing 104.

[0105] Control unit 122 is in series with power supply 120 proximate rear panel 114. Control unit 122 can meter and control the flow of one or more pumps 140 to increase or decrease the rate of heat removal from computer components. Control unit 122 can also control the speed of one or more fan modules 146 to increase or decrease the rate of heat removal from computer components.

[0106] Fan wall 118 includes a set of fan modules 146 that generate airflow from front panel 110 to rear panel 114. Fan modules 146 of fan wall 118 are positioned along front panel 110 of housing 104. In other embodiments, fan modules 146 can be positioned along other panels of housing 104. Figures 1 to 2 In the non-limiting embodiment shown in FIG. 1, there are twelve fan modules 146 arranged in a three-by-four pattern. In other embodiments, there can be more or less than twelve fan modules 146 arranged in any manner to form fan wall 118. Fan modules 146 can be powered by power supply 120. Airflow from fan modules 146 causes the temperature of air proximate front panel 110 to be lower than the temperature of air proximate rear panel 114 by absorbing heat from air surrounding first and second heat sinks 134 and 136. Input conduit 124 and external conduit 130 are located on front panel 110.

[0107] Support frame 138 is located on bottom panel 108 and is removably coupled to first and second heat sinks 134 and 136. Support frame 138 can be made of thermally conductive or thermally insulating materials such as, but not limited to, steel, aluminum, plastic, or glass. As shown in FIG. 1, support frame 138 is positioned between first and second heat sinks 134 and 136. Figure 2It is further shown that the support bracket 138 can also include lateral channels 154A-154B for the first heat sink 134 and the second heat sink 136, respectively. The support bracket 138 includes a base 150 having a registration feature 148 on the bottom panel 108 that allows for attachment to the housing 104. The top surface 152 includes lateral channels 154A-154B that allow for insertion of the first bottom slot 144A or the second bottom slot 144B of the first heat sink 134 and the second heat sink 136, respectively. The lateral channels 154A-154B are angled at an angle Θ with respect to the bottom panel 108. The angle Θ can be adjusted by coupling the lateral channels 154A-154B and the first heat sink 134 and the second heat sink to a rail 156. The rail 156 is located on the base 150 of the support bracket 138. The lateral channels 154A-154B can vary in size to adjust for the angle complementary to the angle Θ. Thus, the angle on the lateral channels 154A-154B is generally 90 degrees different from the angle Θ. The angle Θ can be between 0 degrees and 90 degrees, such as 22.5 degrees, when the first heat sink 134 is positioned at the angle Θ with respect to the bottom panel 108.

[0108] The housing 104 also includes a first connector 166 and a second connector 168 connected to a first conduit 170 and a second conduit 172, respectively, that supply liquid coolant to the heat generating electronic components 164. In non-limiting embodiments, the first connector 166 and the second connector 168 can be connectors, fittings, couplings, joints, adapters, valves, or the like. The first connector 166 is located on one end of the input conduit 124 on the front panel 110. Similarly, the second connector 168 is located on one end of the external conduit 130 on the front panel 110. The first connector 166 is coupled to the first conduit 170. The second connector 168 is coupled to the second conduit 172.

[0109] During operation, after the liquid coolant has circulated through the cooling assembly 100, the liquid coolant that exits the cooling assembly 100 through the second connector 168 can be cooled liquid coolant. As the cooled liquid coolant flows through the second connector 168, the cooled liquid coolant can flow through the second conduit 172 to the cooling block 174 to cool the heat generating electronic components 164. After the liquid coolant circulates to the heat generating electronic components 164, the temperature of the liquid coolant increases with the heat of the heat generating electronic components 164. Thereafter, the liquid coolant continues to circulate through the first conduit 170, the first connector 166, and into the input conduit 124 to continuously repeat the circulation. Thus, the cooling assembly 100 is a closed-loop system.

[0110] Figure 3A is Figure 1 a front view of the first heat sink 134. Figure 3B is an enlarged view showing the internal structure of the first heat sink 134. The first heat sink 134 is identical or similar to the second heat sink 136. The first heat sink 134 is used to reduce the temperature of the liquid coolant. As Figure 3A illustrated, the first heat sink 134 includes a first top trough 142A and a first bottom trough 144A. The tubes 202 and fins 204 (shown in greater detail in Figure 3B ) generally span the entire first top trough 142A and first bottom trough 144A. The tubes 202 are configured to transport the liquid coolant. The tubes 202 are interconnected and thus bend along the first top trough 142A and first bottom trough 144A so that the liquid coolant can flow continuously through the tubes 202. In this embodiment, there are approximately thirty-three tubes 202. In other embodiments, there can be more or less than thirty-three tubes 202. Thus, there can be first openings 206 near the first top trough 142A or first bottom trough 144A that receive the liquid coolant into the tubes 202. Similarly, there can be second openings 208 near the first top trough 142A or first bottom trough 144A that allow the liquid coolant to exit the tubes 202. The tubes 202 are in the airflow path and further help reduce the temperature of the liquid coolant by transferring heat out of the tubes 202 and into the air.

[0111] As Figure 3B shown, the fins 204 are located on either side of the tubes 202. The fins 204 can help the tubes 202 reduce the temperature of the liquid coolant flowing through the tubes 202 by providing additional surface area to dissipate heat. In addition, the fins 204 are in contact with the airflow from the fan module 146 (as Figure 1 shown) to dissipate heat more efficiently. When the first heat sink 134 is positioned at an angle relative to the bottom panel 108 (as Figure 1 shown), the surface area of the airflow that contacts the fins 204 and tubes 202 of the heat sink is increased relative to when the first heat sink 134 is positioned in an upright position (e.g., at 90 degrees to the bottom panel 108 in Figure 1 The fins 204 and tubes 202 of the first heat sink 134 can be made of a durable, thermally conductive material, such as, but not limited to, steel, aluminum, brass, copper, cast iron, etc.

[0112] Figure 4is a schematic side view depicting a flow direction of liquid coolant in the exemplary cooling assembly 100, and Figure 5 is a block diagram depicting a method 500 for cooling a computing system using a cooling device (e.g., the cooling device 102) thermally coupled to the computing system. The method 500 includes steps 510-550 and is described in conjunction with Figure 4 is received into an input conduit in the cooling device. In Figure 4 In the illustrated embodiment, the heated liquid coolant carrying heat dissipated by electronic components of the computing system is received into the input conduit 124.

[0113] In step 520, the liquid coolant flows from the input conduit to a first top tank of a first heat sink in the cooling device. In Figure 4 In the illustrated embodiment, the heated liquid coolant flows from the input conduit 124 to the second top tank 142B of the second heat sink 136. As discussed above in relation to Figures 1 to 2 The liquid coolant circulates through the second heat sink 136 and flows into a second bottom tank 144B of the second heat sink 136.

[0114] In step 530, the liquid coolant moves via a connecting conduit between a first bottom tank of the first heat sink and a second bottom tank of the second heat sink in the cooling device, the second heat sink being parallel to the first heat sink and angled relative to a bottom panel of the cooling device. In Figure 4 In the illustrated embodiment, the second heat sink 136 is positioned parallel to the first heat sink 134 and angled relative to the bottom panel 108. The liquid coolant moves via the connecting conduit 132 between the second bottom tank 144B of the second heat sink 136 and the first bottom tank 144A of the first heat sink 134.

[0115] In some implementations, the liquid coolant flows through each of the first heat sink and the second heat sink via a pipeline extending from the first top tank and the second top tank to the respective first bottom tank and second bottom tank. In Figure 4 In the illustrated embodiment, the liquid coolant flows through each of the first heat sink 134 and the second heat sink 136 via a pipeline 202( Figures 3A to 3BThe heat from the liquid coolant dissipates as it flows through the first heat sink 134 and the second heat sink 136, thereby reducing the temperature of the liquid coolant. The first heat sink 134 and the second heat sink 136 can dissipate heat at a rate of between approximately 8.5 kilo Watts (k Watts) and 20 k Watts, which can be improved by at least 25% over a single heat sink cooling device positioned upright. For example, the first heat sink 134 and the second heat sink 136 can dissipate heat at a rate of 10,500 Watts. Thus, the temperature of the liquid coolant in the input conduit 124 is reduced, allowing the cooler liquid coolant provided by the external conduit 130.

[0116] In step 540, the liquid coolant is ejected from the second top tank of the second heat sink via the output conduit. In the illustrated embodiment, the liquid coolant is ejected from the second top tank 142B of the second heat sink 136 via the output conduit 128. The liquid coolant then flows into the manifold 126B and is ejected into the external conduit 130 by the pump 140. Figure 4 In the illustrated embodiment, the liquid coolant is ejected from the first top tank 142A of the first heat sink 134 via the output conduit 128. The liquid coolant then flows into the manifold 126A and is ejected into the external conduit 130 by the pump 140.

[0117] In step 550, at least one of the first heat sink and the second heat sink is cooled by an airflow through the cooling device. In some embodiments, the cooling further includes using a fan to direct the airflow through the first heat sink and the second heat sink. In the illustrated embodiment, the first heat sink 134 and the second heat sink 136, which dissipate heat from the liquid coolant, are cooled by an airflow generated by the fan wall 118 having a fan module 146. Figure 4 In the illustrated embodiment, the first heat sink 134 and the second heat sink 136, which dissipate heat from the liquid coolant, are cooled by an airflow generated by the fan wall 118 having a fan module 146.

[0118] While the application has been illustrated and described in connection with one or more embodiments, as will be readily appreciated by those skilled in the art, changes in the precise results and applications can be made without departing from the spirit and scope of the application. Accordingly, the various embodiments set forth are meant to be illustrative and not restrictive and the scope of the application should be determined by reference mainly to the appended claims and equivalents thereof.

[0119] While the application has been disclosed in connection with various embodiments thereof, it will be understood that it is capable of further modifications and this application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended to obtain for the inventors of the application(s) all of the benefits of applicable copyright and intellectual property laws and treaties consistent with the above disclosure.

Claims

1. A cooling device for a computing system, the cooling device comprising: Infusion catheter; A first heat sink has a first top slot and a first bottom slot, the first top slot being coupled to the input conduit; The second heat sink has a second top slot and a second bottom slot. The second heat sink is positioned parallel to the first heat sink, and the first heat sink and the second heat sink are at a predetermined angle relative to the bottom panel of the computing system. A connecting conduit has a first end and a second end, the first end being coupled to the first bottom groove and the second end being coupled to the second bottom groove; The output conduit is coupled to the second top slot; as well as The support frame is located on the bottom panel. The computing system also includes a front panel and a rear panel. The front panel supports a fan module that generates airflow parallel to the bottom panel from the front panel to the rear panel. The support frame includes a first transverse channel and a second transverse channel at a predetermined angle relative to the bottom panel. A first heatsink is inserted into the first transverse channel, and a second heatsink is inserted into the second transverse channel, so that the first heatsink and the second heatsink are mounted at the predetermined angle relative to the bottom panel in the airflow path between the front panel and the rear panel. Each of the first radiator and the second radiator includes conduits extending from the first top slot and the second top slot to the respective first bottom slot and the second bottom slot.

2. The cooling device of claim 1, wherein each of the first radiator and the second radiator includes a plurality of fins located between the first top slot and the first bottom slot and between the second top slot and the second bottom slot, respectively.

3. The cooling device of claim 1 further includes a pump fluidly coupled to the output conduit.

4. The cooling device of claim 3 further includes an external conduit coupled to the pump.

5. The cooling device of claim 3, wherein the pump is coupled to the control unit.

6. A cooling assembly for a computing system, the cooling assembly comprising: The housing has a bottom panel and a front panel and a rear panel connected to both ends of the bottom panel; as well as Cooling device, including: Inlet conduit for conducting liquid coolant; A pair of radiators are arranged in parallel configuration, the pair of radiators are at a predetermined angle relative to the bottom panel, the predetermined angle being greater than 0 degrees and less than 90 degrees, and the input conduit is coupled to the first radiator of the pair of radiators. A connecting conduit, coupled between the first and second radiators of the pair of radiators, allows the liquid coolant to flow between the first and second radiators; and An outlet conduit, coupled to the second radiator, discharges the liquid coolant from the second radiator; and The support frame is located on the bottom panel. The front panel supports a fan module that generates airflow parallel to the bottom panel from the front panel to the rear panel. The support frame includes a first transverse channel and a second transverse channel at an angle relative to the bottom panel. A first heat sink is inserted into the first transverse channel, and a second heat sink is inserted into the second transverse channel, so that the first heat sink and the second heat sink are installed at an angle relative to the bottom panel in the airflow path between the front panel and the rear panel.

7. A method for cooling a computing system, the method using a cooling device as claimed in claim 1, thermally coupled to the computing system, the method comprising: An inlet conduit for receiving liquid coolant into the cooling device; The liquid coolant flows from the inlet conduit to the first top slot of the first radiator in the cooling device; The liquid coolant is moved via a connecting conduit between the first bottom groove of the first radiator and the second bottom groove of the second radiator in the cooling device, the second radiator being parallel to the first radiator and forming a predetermined angle with respect to the bottom panel of the cooling device. The liquid coolant is discharged from the second top slot of the second radiator via an outlet conduit in the cooling device; and The first radiator and the second radiator are cooled by airflow through the cooling device. The bottom panel is equipped with a support frame. The cooling device also includes a front panel and a rear panel. The front panel supports a fan module that generates airflow parallel to the bottom panel and from the front panel to the rear panel. The support frame includes a first transverse channel and a second transverse channel at a predetermined angle relative to the bottom panel. A first radiator is inserted into the first transverse channel, and a second radiator is inserted into the second transverse channel, so that the first radiator and the second radiator are installed at the predetermined angle relative to the bottom panel in the airflow path between the front panel and the rear panel.

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