A high-precision large-format processing system and method for punching membrane materials

Abstract

The present invention discloses a high-precision, large-format processing system and method for punching membrane materials. The system is equipped with the following components along the laser optical path: a laser, a beam expander, five groups of reflectors, a galvanometer, a lens, and a loading platform; it also includes auxiliary devices and a control device. The auxiliary devices include a winder, a dust extraction component, an adsorption component, and an infrared height measurement component. The winder is used to convey the unwinding and rewinding of materials; the dust extraction component is used to remove dust generated during the processing; the adsorption component is used to adsorb the processing sample and remove residue; and the infrared height measurement component is used to monitor the level of the loading platform. The control device includes visual positioning, two flying optical paths, two lifting axes, and processing software. The visual positioning is used to locate the processing position of the drawing; the two flying optical paths are used to achieve large-format splicing of the drawings; one of the two lifting axes is used to control the focus of the processing process, and the other is used to control the lifting and lowering of the loading platform when the winder is conveying materials. The processing software is used to load large-format CAD drawings for automatic segmentation processing.

Description

Technical Field

[0001] The present invention belongs to the field of laser processing technology, specifically a high-precision large-format processing system and method for punching membrane materials, which is suitable for large-format processing of various membrane materials, and is mainly used for large-format high-precision processing of flexible materials required by the 3C industry. It is not limited to punching, and can easily be used for marking, grooving, etc. Background Art

[0002] PI film, or polyimide film, is currently the world's highest-performing thin-film insulation material and is widely used in the microelectronics field. Due to its excellent properties, such as high oil resistance, heat resistance, and low dielectric loss, it is commonly used as cable insulation, thermal insulation, and recording carrier materials, particularly in flexible circuit boards.

[0003] Traditional flexible circuit boards are made by copper-cladding the PI film surface before drilling and etching. This process produces a large amount of copper-cladding residue, resulting in waste of raw metal materials and increased production costs. Furthermore, the traditional copper-cladding-before-processing process involves etching the copper foil to form the hole pattern, then removing the upper and lower surfaces of the insulation layer as needed to form the through-holes. This can lead to precision deviations in the upper and lower positions of the through-holes, thereby restricting the drilled hole size and hindering the processing of micron-level holes.

[0004] In addition, PI film is extremely thin, with the thickness commonly used in industry being only 12 to 75 μm. Traditional machine processing generally involves the processing platform and the laser light output working together, which can cause the surface of the film to be easily scratched, rendering the film scrapped and affecting subsequent manufacturing processes.

[0005] In existing laser processing, large-format processing is limited by the effective processing format of the lens used in the platform. For situations exceeding the effective processing format of the lens, large-format processing is required through splicing. For example, the Chinese patent with publication number CN113664378A disclosed on November 19, 2021, a large-format splicing marking machine achieves large-format splicing by moving the laser body and sliding the bearing. It requires manual sliding of the machine, and there are large errors in the splicing of large-format drawings, which is not suitable for high-precision integrated automated production.

[0006] Therefore, there is an urgent need to provide a processing system that can process micron-scale holes on extremely thin film materials without scratching the surface of the film material and can achieve high-precision large-scale automated processing. Summary of the Invention

[0007] In order to overcome the above-mentioned deficiencies in the prior art, the present invention provides a high-precision large-format film punching processing system and method, which are used to solve at least one of the above-mentioned technical problems.

[0008] According to one aspect of the present invention, a high-precision large-format film punching processing system is provided, comprising a laser device, an auxiliary device and a control device; wherein,

[0009] The laser device includes: a laser for generating laser pulses; a beam expander for expanding the size of the pulse spot generated by the laser; a reflector group for returning the light path; a galvanometer for controlling the processing of the image within a single format of the film sample; and a lens for focusing the laser beam emitted from the galvanometer and incident on the film sample.

[0010] Auxiliary devices include: a winder for conveying and winding film materials; a dust extraction component that moves synchronously with the galvanometer to remove dust generated during processing; an adsorption component located below the loading platform to absorb processing residues and fix the film sample; and an infrared height measurement component that moves synchronously with the X and Y axes of the linear motor to monitor the level of the entire surface of the loading platform where the film sample is located.

[0011] The control device includes: a visual positioning component, which is used to locate the processing position of the drawing; two flying light paths, which are used to automatically run to the next single-format drawing processing position according to the system path after the galvanometer has processed a single-format drawing, so as to realize large-format splicing of drawings; a Z-axis lifting axis, which is linked to the Y-axis of the linear motor, and is used to control the focusing point of the light beam during the processing process; a U-axis, which is used to control the lifting and lowering of the loading platform when the winder transports film materials; and processing software, which is used to load large-format CAD drawings and automatically split them into several single-format drawings.

[0012] Before starting processing, the above technical solution adjusts the laser optical path so that the laser pulse is focused on the sample surface and can process the pattern within a single width range of the film sample. Then, the film sample is fixed so that it does not move during the processing to avoid scratching the film surface. Then, the large-format pattern is poured in, and a single processed pattern is obtained through pattern cutting. The pattern processing coordinates are obtained through the cooperation of the visual positioning component and the processing software. During laser processing, the U-axis carries the loading platform to the processing position and automatically adsorbs the film material. The laser beam will process along the pattern path. After processing a single-width pattern, it will automatically run to the single-width pattern position of the next array for processing until all patterns are processed. At this time, the U-axis carries the loading platform down, the adsorption is automatically disconnected, and the right end of the winder receives a complete length of the film. Then, the left end of the winder feeds a complete length of the film and enters the next automatic processing system cycle.

[0013] The above technical solution realizes large-scale automated processing of film materials through the mutual cooperation of laser devices, auxiliary devices and control devices without scratching the surface of the film material and without the need for additional sliding machines, and ensures the accuracy of large-scale splicing through two flying light paths.

[0014] During laser processing, the above technical solution uses an adsorption component to complete residue adsorption and vacuum adsorption fixation of film material samples, and uses a dust extraction device to remove upper dust, thereby eliminating the influence of material residue and dust on the processing effect during the processing process. At the same time, the level of the entire surface is monitored by an infrared height measurement component to ensure the surface processing accuracy.

[0015] As a further technical solution, the reflector group includes: reflector 1 and reflector 2, which are installed on the machine base and are used to control the Y-direction flight light path; reflector 3, which is installed on the Y-axis of the linear motor and is used to control the X-direction flight light path; reflector 4, which is installed on the X-axis of the linear motor and moves synchronously with the X-axis; reflector 5, which is installed on the Z-direction lifting axis and moves synchronously with the Z-direction lifting axis.

[0016] Reflector 1 and Reflector 2 are mounted in a two-dimensional adjustable mirror frame. Screws in the frame allow the mirrors to be adjusted up, down, left, and right. The mirror frames for Reflector 1 and Reflector 2 are mounted on the machine base and are stationary.

[0017] This technical solution creates two optical paths: one for the Y direction and one for the X direction. The X and Y directions correspond to the X and Y axes of the linear motor. During the full-width film processing, the film sample remains stationary, and large-scale splicing is achieved through these two optical paths. Compared to existing methods that rely on the linkage of the processing platform and laser light output to achieve large-scale splicing, this solution solves the problem of easily scratching the film surface due to the linkage of the processing platform with the galvanometer, thus avoiding surface scratches and damage during film processing.

[0018] As a further technical solution, the mirror mount of reflector 3 is equipped with a fine-tuning guide rail, which is used to achieve six-direction adjustment together with the mirror mount. The screws in the mirror mount can control the four directions of up, down, left and right, while the guide rail can control the two directions of front and back.

[0019] Only reflector three has a fine-tuning guide rail because reflector three controls the X-axis flight light path to be parallel to the X-axis. It is difficult to adjust six directions with a single reflector through the mirror mount, so a fine-tuning guide rail is needed to achieve this.

[0020] Reflector 4 and Reflector 5 only need to control the optical path to be perpendicular to the machine processing platform. After the platform focus is determined, Reflector 5 hardly needs to be moved.

[0021] Reflector three, reflector four and reflector five are all mounted on a mirror frame, and the mirror frame is then mounted on the axis.

[0022] As a further technical solution, the X-axis and Y-axis of the linear motor are parallel to the surface of the loading platform, and the Z-axis lifting axis and U-axis are perpendicular to the surface of the loading platform; the U-axis is installed below the loading platform, and the Z-axis lifting axis is installed above the loading platform, and the U-axis is parallel to the Z-axis lifting axis.

[0023] Specifically, the linear motor's X- and Y-axes are parallel to the surface of the loading platform, allowing the linear motor to drive the galvanometer mirror in the X and Y directions to process the film sample on the loading platform. The Z-axis is perpendicular to the loading platform surface and installed above the loading platform. It drives the linear motor to move it up and down, driving the reflector mounted on it to move up and down, thereby controlling the focus of the light beam during processing. The U-axis is perpendicular to the loading platform surface and installed below the loading platform. It drives the linear motor to move it up and down, controlling the lifting and lowering of the loading platform when the winder is transporting materials.

[0024] As a further technical solution, reflector five, galvanometer, lens, infrared height measurement component, visual positioning component, and dust extraction component are all installed on the fixture. The fixture is linked with the X-axis and Y-axis of the linear motor, and moves synchronously with the Z-axis lifting axis.

[0025] These components are secured in fixtures, and when linear motors drive the fixtures in the X, Y, or Z directions, they move as a whole. During machining, an infrared height tracking system monitors the height and levelness of the machining platform in real time, providing direct feedback to the system if errors are significant.

[0026] Since the PI film has a strong electrostatic adsorption effect, if the residue during the processing is not removed in time, it will cover the subsequent unprocessed area and cause hole blockage. Therefore, the dust extraction system is installed on the tooling fixture, which can be linked with the galvanometer to remove dust and residue in time during the processing.

[0027] As a further technical solution, the adsorption component includes a jig, the central area of which is covered with array holes, and the diameter of the holes is larger than the diameter of the circle in the processing drawing.

[0028] The center of the adsorption assembly's fixture is covered with an array of holes. These holes, with a diameter larger than the circle in the processing drawing, form a honeycomb pattern, effectively and evenly distributing suction. Together with the loading platform above, upon which the sample is placed, they form a sealed vacuum system. Between the loading platform and the honeycomb plate, a relatively closed cavity exists. This design allows any film residue or heavier debris, such as copper foil, to fall into the cavity and be carried away, freeing the processing material from being confined to the PI film. Furthermore, it provides uniform adsorption, support, and fixation for the extremely soft PI film, preventing excessive suction in certain areas, which could cause the film to sag and affect precision and process results. The dust extraction system above the galvanometer only removes airborne dust.

[0029] As a further technical solution, the pulse width of the laser is 100fs~10ps, and the wavelength is 355~1064nm; the speed of the galvanometer is 0~20000mm / s, and the accuracy is ±2.5um; the lens is a telecentric lens, and the flatness focal depth range of a single plane is within 0.1mm; the spot diameter of the laser pulse is 3~20um.

[0030] Furthermore, the levelness of the entire surface of the loading platform is within the range of 20 μm to ensure the processing accuracy of the entire surface.

[0031] Furthermore, the mirror adjustment mounts on the flight optical path can resist the stress generated during the operation of the motion control system and prevent the optical path from shifting. During the machining process of reflectors three, four, and five, their mounts all need to be moved to resist the stress generated by the motion control system.

[0032] The mirror mounts of reflector 1 and reflector 2 are fixed on the fixture and are used to adjust the Y-axis optical path. They do not need to be moved during the processing, so their mirror mounts are ordinary mirror mounts.

[0033] The above technical solution ensures high-precision stitching of large-format images through system configuration. By selecting and configuring the laser, galvanometer, lens, laser spot, leveling of the entire loading platform, and the mirror adjustment frame, combined with software control, integrated automated production is achieved, enabling high-precision automated stitching of large-format images.

[0034] According to one aspect of the present invention, a method for high-precision large-format film punching is provided, which is implemented using the aforementioned system. The method comprises:

[0035] Adjust the optical path of the laser so that the laser beam is focused on the surface of the film material, and adjust the positions of the Z-axis lifting and lowering, and the U-axis lifting and lowering respectively;

[0036] Fix the film material on the loader at the left end of the winder, adjust the position, and then pass the film material through the machine table, position it above the loading platform, and fix the other end on the take-up machine at the right end of the winder;

[0037] Import large-format CAD drawings, input lens format values, and automatically split the large-format CAD drawings according to the lens format to form n1xn2 array drawings;

[0038] Capture the position coordinates of the first drawing and the offset angle of the entire drawing and input them into the processing software to obtain the processing coordinates of the remaining array drawings;

[0039] When processing starts, the U-axis carries the loading platform up to the processing position and automatically absorbs the film material;

[0040] The laser beam processes along the image path. After processing a single-format image, it automatically moves to the next array of single-format image positions via two flying light paths for processing until all images are processed.

[0041] The U-axis carries the loading platform down, the adsorption is automatically disconnected, and the right end of the winder rewinds a complete length of film material.

[0042] After completing the processing of a full length of film material, the left end of the winder feeds a full length of film material to the loading platform and automatically enters the next processing system cycle.

[0043] After adjusting the laser light path, the above technical solution fixes the film material to be processed and does not move the film material during the processing to avoid scratching the surface of the film material; after the single-format processing drawing is completed, it automatically runs to the next single-format processing position according to the system path via two flying light paths, realizing large-format splicing of drawings without the need for sliding the machine, and ensuring the splicing accuracy; and, the lifting and lowering of the loading platform is controlled by the U-axis to realize automatic winding of the material after processing is completed.

[0044] In the above technical solution, the holes on the carrier platform jig are consistent with the drawing. The residue generated during the processing will fall through the holes of the carrier platform into the adsorption jig below and be taken away. At the same time, the dust generated during the processing will also be taken away in time by the dust extraction component above the carrier platform.

[0045] The focused light spot formed by the objective lens acts on the surface of the film sample on the loading platform. The laser beam processes along the image path within a single lens frame. After processing a single frame, it will move to the next processing position in sequence. The residue and dust generated are taken away through the holes below the adsorption platform and the dust extraction system above the loading platform to avoid secondary burns affecting the edge effect of the hole.

[0046] As a further technical solution, when the processing software divides the drawing, if the size cannot be an integer multiple, the overall format of the n1xn2 array drawings automatically divided will be slightly larger than the input CAD drawing format, but the effective size of the overall processed drawing will be the same.

[0047] As a further technical solution, the graphics files generated after automatic segmentation by the processing software need to set the laser processing parameters in the graphics marking interface, including: laser power, frequency, galvanometer scanning speed, jump speed, on / off light delay, and number of processing times.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] (1) The present invention realizes large-scale automated processing of film materials through the mutual cooperation of laser devices, auxiliary devices and control devices without scratching the surface of the film materials and without the need for additional sliding machines, and ensures the large-scale splicing accuracy through two flying light paths.

[0050] (2) During laser processing, the present invention uses an adsorption component to complete residue adsorption and vacuum adsorption fixation of film material samples, and uses a dust extraction device to remove upper dust, thereby eliminating the influence of material residue and dust on the processing effect during the processing. At the same time, the level of the entire surface is monitored by an infrared height measurement component to ensure the surface processing accuracy.

[0051] (3) The present invention, through the design of the adsorption component, is conducive to the film material residue or heavier residues such as copper foil metal falling into the cavity and being taken away, so that the processing material is not limited to the PI film. On the other hand, it plays a role in uniformly distributing adsorption, support and fixation for the extremely soft PI film material, preventing the suction force in the local area from being too strong, causing the film material to sag, affecting the accuracy and process effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 Schematic diagram of the structure of a high-precision large-format film punching processing system according to an embodiment of the present invention.

[0053] Figure 2 This is a schematic diagram of a 30 μm hole in a PI membrane at 100X magnification under a microscope according to an embodiment of the present invention;

[0054] Figure 3 This is a schematic diagram of a 50 μm hole in a PI membrane according to an embodiment of the present invention magnified 100X by a microscope;

[0055] Figure 4 This is a schematic diagram of a 75 μm hole in a PI membrane according to an embodiment of the present invention at 100X magnification.

[0056] Figure 5 This is a schematic diagram of a 100 μm hole in a PI film magnified 100X by a microscope in an embodiment of the present invention;

[0057] Figure 6 This is a schematic diagram of a 2mm hole in a PI film according to an embodiment of the present invention magnified 20X by a microscope;

[0058] Figure 7 Schematic diagram of a microscope for scratching the PI film surface in an embodiment of the present invention.

[0059] In the figure: 1. Laser; 2. Beam expander; 3. Galvanometer; 4. Lens; 5. Film material; 6. Loading platform; 7. Adsorption component; 8. U-axis; 9. Infrared height measurement component; 10. CCD camera positioning system; 11. Dust extraction component; 12. Winding machine feeding system; 13. Winding machine rewinding system; 14. Fixture; 15. Reflector 1; 16. Reflector 2; 17. Reflector 3; 18. Reflector 4; 19. Reflector 5. DETAILED DESCRIPTION

[0060] The following will clearly and completely describe the technical solutions of various embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0061] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0062] like Figure 1 As shown, the present invention provides a high-precision large-format processing system for punching membrane materials. Along the optical propagation path, the processing system includes a laser 1, a beam expander 2, a reflector 15, a reflector 2 16, a reflector 3 17, a reflector 4 18, a reflector 5 19, a galvanometer 3, a lens 4, a loading platform 6, an adsorption component 7, a U-axis 8, an infrared height measurement component 9, a CCD camera positioning system 10, a dust extraction component 11, a winder feeding system 12, a winder winding system 13, and a fixture 14.

[0063] In the above system, the exit beam of the laser 1 is coaxial with the beam expander 2 .

[0064] Reflector 1 15 and reflector 2 16 are fixed on the machine base to debug the Y-axis flying light path.

[0065] The reflector 3 17 is installed on the Y axis of the linear motor and can run with the Y axis, forming the first flying optical path.

[0066] There is a fine-tuning guide rail on the mirror base of the reflector three 17, which can be adjusted in four directions together with the mirror base for debugging the X-axis flight optical path.

[0067] The reflector 4 18 is installed on the X-axis and can move along with the X-axis.

[0068] The reflector 19, the galvanometer 3, the lens 4, the infrared height measuring component 9, the CCD camera positioning system 10, and the dust extraction component 11 are all installed on the fixture 14. The fixture 14 is installed on the Z axis and can move up and down, and the Z axis is installed on the X axis and can be linked with the X and Y axes; the X axis and the Y axis are parallel to the surface of the loading platform 6, and the Z axis and the U axis are perpendicular to the surface of the loading platform 6.

[0069] Specifically, the winder 11 at the left end of the machine is used to transport the material. The material passes through the processing platform via the left winder to the right winder 12. After processing a full-width sample, the right winder 12 rewinds the material. Winding and rewinding are prior art and will not be described in detail here.

[0070] The dust extraction assembly 11 moves with the galvanometer, promptly removing dust generated during processing. The suction assembly 7, located beneath the loading platform 6, removes processing debris while also providing a vacuum to secure the film material. The infrared height measurement assembly 9, mounted next to the galvanometer, moves with the X and Y axes, monitoring the level of the entire loading platform.

[0071] Specifically, the visual positioning component is used to locate the drawing processing position. After the CCD camera visual positioning system automatically captures the drawing mark point, the resulting drawing starting point coordinates and the processing angle of the entire drawing and the loading platform will be automatically imported into the processing software processing interface.

[0072] The two-way flying light path is used to realize large-format splicing of drawings. The large-format drawings will be automatically divided into several valid single-format drawings in the processing software. After the galvanometer processes a single-format drawing, the flying light path will automatically run to the next single-format drawing processing position according to the system path.

[0073] The Z-axis, which is installed above the loading platform and linked to the Y-axis, is used to control the focus of the beam during processing.

[0074] The U-axis installed under the loading platform controls the lifting and lowering of the loading platform when the winder transfers materials. When the loading platform rises, the drawing is processed. When the loading platform descends, the winder reels and takes away the processed materials.

[0075] The processing software is used to load large-format CAD drawings for automatic segmentation and processing, and control the automation process of the entire platform.

[0076] In this embodiment, an adsorption component and a dust extraction component that operate synchronously with the galvanometer are provided. Both have the function of promptly removing dust residues, but there are some differences. The center area of the fixture of the adsorption component is covered with an array of holes. The diameter of the holes is larger than the diameter of the circle in the processing drawing. They are honeycomb-shaped and can effectively and evenly distribute the suction force. After the sample is placed on the loading platform above, a closed vacuum system is formed. There is a cavity with a certain closed range between the loading platform and the honeycomb plate. On the one hand, this design is conducive to the generated film material residues or heavier residues such as copper foil metal falling into the cavity and being taken away, so that the processing material is not limited to the PI film. On the other hand, it plays a role in uniformly distributing adsorption, support and fixation for the extremely soft PI film material, preventing the suction force in the local area from being too strong, causing the film material to sag, affecting the accuracy and process effect. The dust extraction component above the galvanometer only serves to remove dust in the air.

[0077] In this embodiment, the laser used is an ultraviolet picosecond device with a pulse width of 10ps, a wavelength of 355nm, a frequency of 100-2000khz, and a power of 0-25W; the focused spot formed by the laser at the focus is 4-10um; the galvanometer uses a high-precision digital galvanometer with a speed of 0-20000mm / s and an accuracy of ±2.5um; the lens is a telecentric lens, and the focal depth of flatness within a single plane is within the range of 0.1mm; the horizontality of the entire plane of the loading platform is within the range of 20um; the travel range of the two flying optical paths is 300x600mm; the pressure of the dust extraction and adsorption system is 0-40Mpa.

[0078] Before starting the processing, the present invention adjusts the laser light path so that the laser pulse is focused on the sample surface and can process the pattern within a single width range of the film sample. Then, the film sample is fixed so that it does not move during the processing to avoid scratching the film surface (such as Figure 7 The PI film surface is scratched as shown); then a large-format drawing is poured in, and a single processed drawing is obtained through cutting; the drawing processing coordinates are obtained through the cooperation of the visual positioning component and the processing software; during laser processing, the U-axis carries the carrier platform to the processing position, automatically adsorbs the film material, and the laser beam will process along the drawing path. After processing a single-format drawing, it will automatically run to the single-format drawing position of the next array for processing until all drawings are processed; at this time, the U-axis carries the carrier platform down, the adsorption is automatically disconnected, and the right end of the winder receives a full length of film material; then the left end of the winder feeds a full length of film material and enters the next automatic processing system cycle.

[0079] Corresponding to the above-mentioned processing system, the present invention also provides a high-precision large-format processing method for punching membrane materials. The PI film used in this processing is 75um thick, the image format is 250x520mm, and the processing format of a single lens is 43x43mm. The specific processing method is as follows:

[0080] Step 1: Check the machine processing software, return all motion control systems to zero, and adjust the optical path until the two flying optical paths are within the 300x600mm travel range of the X and Y axes, and the centroid coordinate of the focused light spot below the lens is less than 100um;

[0081] Step 2: Turn on the infrared height measurement system and randomly slide it within the width of the loading platform to adjust the height of the loading platform until the levelness of the entire loading platform is within 20μm.

[0082] Step 3: Install the film material on the delivery end of the winder, pass it through the machine and lay it flat on the loading platform, then fix it on the winding end of the winder, turn on the adsorption and dust extraction components, set the pressure to 0.4 MPa, and set the U and Z axis parameters so that the laser beam focuses on the surface of the film material, which are U1 and Z1 respectively; when the winder is winding, the U axis parameter is U2;

[0083] Step 4: Open the processing software, import the CAD drawing file of 250x520mm to be processed, click on the split button on the software interface, and it will automatically split into 6x13 array files. The software splits the file according to the single processing format of the lens 43x43mm. The size of the split file is 6x43=258mm, 13x43=559mm, that is, 258x559, which is slightly larger than the CAD file size. Here, according to the different lens formats and the different CAD file sizes, you can allocate it yourself, as long as the split size is larger than the CAD file size. Turn on the CCD, the CCD vision system will automatically capture the Mark point on the file, and then enter the coordinates of the first single format of the split file, and then automatically generate the coordinates of the 6x13 array files.

[0084] Step 5: Enter the processing parameters in the segmented marking file interface loaded in the processing software interface: laser output power 4W, frequency 2000kHz, galvanometer scanning speed 1000mm / s, jump speed 500mm / s, on / off delay 70 / 150us, processing times 2 times;

[0085] Step 6: Click the "Process" button on the processing software control interface. The winder automatically feeds the PI film material one CAD format length. The U-axis automatically rises to the U1 position, the suction system automatically turns on, the Z-axis moves to the Z1 position, and the X and Y axes automatically move to the position of the first automatically split single-format image. The laser emits light and automatically processes along the image path. After processing the first single-format image, the X and Y axes automatically move to the position of the second automatically split single-format image. The laser emits light and automatically processes, and the process continues inward until all the array images are processed. In other words, once a complete CAD large-format image is processed, the suction system automatically disengages, the U-axis automatically descends to the U2 position, and the winder rewinds the PI film material one CAD format length. At this point, the automated processing of a CAD large-format image is completed. The winder feed end then feeds another CAD-length PI film material, entering the next system cycle. Once the entire roll of film is processed, the completed film can be removed.

[0086] The microscopic diagram of the pore diameters of the local area of the 75um thick PI film processed this time is 30um, 50um, 75um, 100um, and 2mm as shown in the figure. Figures 2 to 6 shown.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention.

Claims

1. A high-precision large-format film punching processing system, characterized in that: It includes a laser device, an auxiliary device and a control device; wherein, The laser device includes: a laser for generating laser pulses; a beam expander for expanding the size of the pulse spot generated by the laser beam; a reflector group for returning the optical path; a galvanometer for controlling the processing of images within a single format of the film sample; a lens for focusing the laser beam emitted from the galvanometer and incident on the film sample; the reflector group includes: reflector 1 and reflector 2, which are installed on the machine base and are used to control the Y-direction flying optical path; reflector 3, which is installed on the Y-axis of the linear motor and is used to control the X-direction flying optical path; reflector 4, which is installed on the X-axis of the linear motor and moves synchronously with the X-axis; reflector 5, which is installed on the Z-direction lifting axis and moves synchronously with the Z-direction lifting axis; the reflector group forms two flying optical paths, one for the Y-direction flying optical path and the other for the X-direction flying optical path. During the whole-format processing of the film material, the film sample does not move, and large-scale splicing processing is achieved through the two flying optical paths; Auxiliary devices include: a winder for conveying and winding film materials; a dust extraction component that moves synchronously with the galvanometer to remove dust generated during processing; an adsorption component located below the loading platform to absorb processing residues and fix the film sample; and an infrared height measurement component that moves synchronously with the X and Y axes of the linear motor to monitor the level of the entire surface of the loading platform where the film sample is located. The control device includes: a visual positioning component, which is used to locate the processing position of the drawing; two flying light paths, which are used to automatically run to the next single-format drawing processing position according to the system path after the galvanometer has processed a single-format drawing, so as to realize large-format splicing of drawings; a Z-axis lifting axis, which is linked to the Y-axis of the linear motor, and is used to control the focusing point of the light beam during the processing process; a U-axis, which is used to control the lifting and lowering of the loading platform when the winder transports film materials; and processing software, which is used to load large-format CAD drawings and automatically split them into several single-format drawings.

2. A high-precision large-format film punching processing system according to claim 1, characterized in that: The mirror base of the reflector 3 is provided with a fine-tuning guide rail for realizing adjustment in four directions together with the mirror base.

3. The high-precision large-format film punching processing system according to claim 1, characterized in that: The X-axis and Y-axis of the linear motor are parallel to the surface of the loading platform, and the Z-axis and U-axis are perpendicular to the surface of the loading platform; the U-axis is installed below the loading platform, and the Z-axis is installed above the loading platform, and the U-axis is parallel to the Z-axis.

4. The high-precision large-format film punching processing system according to claim 1, characterized in that: Reflector 5, galvanometer, lens, infrared height measurement component, visual positioning component, and dust extraction component are all installed on the fixture. The fixture is linked with the X-axis and Y-axis of the linear motor and moves synchronously with the Z-axis lifting axis.

5. The high-precision large-format film punching processing system according to claim 1, characterized in that: The adsorption component includes a fixture, the central area of the fixture is covered with array holes, and the diameter of the holes is larger than the diameter of the circle in the processing drawing.

6. The high-precision large-format film punching processing system according to claim 1, characterized in that: The laser pulse width is 100fs~10ps, and the wavelength is 355~1064nm; the speed of the galvanometer is 0~20000mm / s, with an accuracy of ±2.5um; the lens is a telecentric lens, and the flatness focal depth range of a single plane is within 0.1mm; the spot diameter of the laser pulse is 3~20um.

7. A high-precision large-area processing method for punching holes in membrane materials, implemented using the system according to any one of claims 1 to 6, characterized in that: The method comprises: Adjust the optical path of the laser so that the laser beam is focused on the surface of the film material, and adjust the positions of the Z-axis lifting and lowering, and the U-axis lifting and lowering respectively; Fix the film material on the loader at the left end of the winder, adjust the position, and then pass the film material through the machine table, position it above the loading platform, and fix the other end on the take-up machine at the right end of the winder; Import large-format CAD drawings, input lens format values, and automatically split the large-format CAD drawings according to the lens format to form n1xn2 array drawings; Capture the position coordinates of the first drawing and the offset angle of the entire drawing and input them into the processing software to obtain the processing coordinates of the remaining array drawings; When processing starts, the U-axis carries the loading platform up to the processing position and automatically absorbs the film material; The laser beam processes along the image path. After processing a single-format image, it automatically moves to the next array of single-format image positions via two flying light paths for processing until all images are processed. The U-axis carries the loading platform down, the adsorption is automatically disconnected, and the right end of the winder rewinds a complete length of film material.

8. A high-precision large-format film punching method according to claim 7, characterized in that: When the processing software splits the drawing, if the size cannot be an integer multiple, the overall format of the automatically split n1xn2 array drawing will be slightly larger than the input CAD drawing format, but the effective size of the overall processed drawing is the same.

9. A high-precision large-format film punching method according to claim 7, characterized in that: The graphics files generated after automatic segmentation by the processing software need to set the laser processing parameters in the graphics marking interface, including: laser power, frequency, galvanometer scanning speed, jump speed, on / off light delay, and number of processing times.

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