Chip test socket and installation method

Abstract

The embodiments of this specification provide a chip test socket and installation method, wherein the test socket includes: a bottom mold; a first carrier for placing test probes, the first carrier and the bottom mold being installed in cooperation; a second carrier that cooperates with the first carrier, the test probes being placed between the second carrier and the first carrier; a coarse positioning pin, when the second carrier is installed on the first carrier, the coarse positioning pin performs coarse positioning on the second carrier and the first carrier; a fine positioning pin, when the fine positioning pin is installed in cooperation with the second carrier, the fine positioning pin performs fine positioning on the second carrier and the first carrier and pushes out the coarse positioning pin; an upper mold that cooperates with the bottom mold, the fine positioning pin and the upper mold being installed in cooperation. Using positioning pins instead of standard screws to connect and fix the carriers can make it possible to arrange more test probes within a limited range while reducing the volume of the carriers.

Description

Technical Field

[0001] This specification relates to the field of semiconductor testing technology, and in particular to a chip test socket and an installation method. Background Art

[0002] In the field of semiconductor testing, with decreasing pitch, increasingly complex processes, and more diverse chip designs, the demand for defect detection during chip manufacturing is increasing. Chip test sockets have emerged as an excellent solution, playing a significant role in screening yield rates. The chip test socket's function is to position the chip and transmit electronic signal currents between circuit boards to achieve inspection and testing results.

[0003] During the use of existing chip test sockets, test probes are generally placed between two or more layers of carriers and fixed with screws. However, in actual practice, it is found that due to the large diameter of standard screws, the distribution of dies (multiple test probes form a die) will be encroached upon, and the carrier size will be too large. In addition, human errors may be introduced during operation, resulting in installation failure. Even worse, the test probes and carriers may be damaged, causing economic losses and slowing down project progress. Summary of the Invention

[0004] In order to solve the problems in the background technology, the embodiments of this specification provide a chip test seat and installation method, which uses positioning pins instead of standard screws to connect and fix the carriers, so that more test probes can be arranged within a limited range, while reducing the volume of the carrier. The coarse positioning pins are pushed out by the fine positioning pins to precisely position the first carrier and the second carrier, ensuring that the first carrier and the second carrier are more stable after installation, reducing errors caused by human factors, and improving the efficiency of successful installation.

[0005] The embodiments of this specification provide the following technical solutions: a chip test socket, the test socket comprising:

[0006] bottom mold;

[0007] a first carrier for placing the test probe, wherein the first carrier is fitted with the bottom mold;

[0008] a second carrier matched with the first carrier, the test probe being placed between the second carrier and the first carrier;

[0009] a coarse positioning pin, for coarsely positioning the second carrier and the first carrier when the second carrier is mounted on the first carrier;

[0010] a fine positioning pin, wherein the fine positioning pin is fitted with the second carrier, and when the second carrier is mounted on the first carrier, the fine positioning pin performs fine positioning on the second carrier and the first carrier and pushes out the coarse positioning pin;

[0011] An upper die is matched with the bottom die, and the precision positioning pin is matched and installed with the upper die.

[0012] Preferably, the coarse positioning pin passes through the bottom mold and the first carrier, and the coarse positioning pin is in sliding contact with the bottom mold and the first carrier.

[0013] Preferably, a movable limiting portion is provided at the bottom of the bottom mold, and the limiting portion limits the coarse positioning pin. By moving the limiting portion, when the second carrier is installed on the first carrier, the fine positioning pin can push the coarse positioning pin out of the bottom mold.

[0014] Preferably, when the upper mold is installed on the bottom mold, the upper mold drives the second carrier to be installed in cooperation with the first carrier, and the upper mold drives the fine positioning pin to push out the rough positioning pin.

[0015] Preferably, the size of the fine positioning pin is larger than that of the rough positioning pin.

[0016] Preferably, the test seat further comprises a pressing die, and the pressing die is used to press the fine positioning pin into the second carrier and the first carrier, so that the fine positioning pin presses the rough positioning pin out of the bottom die.

[0017] Preferably, the test seat further comprises a guide post, and the guide post is arranged on the top of the bottom mold;

[0018] When the upper mold is mounted on the bottom mold, the guide column is used to guide and position the upper mold;

[0019] When the pressing die is mounted on the bottom die, the guide post is used to guide and position the pressing die.

[0020] A chip test socket installation method, based on any one of the chip test sockets described above, the method comprising:

[0021] Mounting the first carrier on the bottom mold via coarse positioning pins;

[0022] placing a test probe to be tested on top of the first carrier;

[0023] The upper die is installed on the bottom die, and the upper die drives the second carrier to cooperate with the first carrier for installation, and the upper die drives the fine positioning pin to push out the rough positioning pin;

[0024] The upper mold is removed, the second carrier and the precision positioning pin remain on the first carrier, the pressing mold is installed on the bottom mold, and the precision positioning pin is pressed into the second carrier and the first carrier through the pressing mold.

[0025] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0026] The present invention uses positioning pins instead of standard screws to connect and fix the carriers, which can make it possible to arrange more test probes within a limited range. Compared with the connection method using standard screws, the arrangement of the test probes can be increased by about 10%, while reducing the volume of the carriers. The first carrier and the second carrier are roughly positioned by the coarse positioning pins, and the first carrier and the second carrier are precisely positioned by pushing out the coarse positioning pins using the fine positioning pins, thereby ensuring that the first carrier and the second carrier are more stable after installation, reducing errors caused by human factors, and improving the efficiency of successful installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 This is a structural schematic diagram of a chip test socket provided by the present invention, in which a first carrier is installed on a bottom mold;

[0029] Figure 2 This is a schematic structural diagram of a chip test socket provided by the present invention after the second carrier and the first carrier are installed in coordination;

[0030] Figure 3 This is a structural diagram of the upper mold and the bottom mold of a chip test socket provided by the present invention when they are installed in coordination;

[0031] Figure 4 The present invention is a schematic structural diagram of a chip test seat provided by the present invention when the pressing die and the bottom die are installed in coordination. DETAILED DESCRIPTION

[0032] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0033] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the features in the following embodiments and embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0034] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.

[0035] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0036] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described can be practiced without these specific details.

[0037] At present, in the process of using chip test sockets to test chips, the following problems mainly exist:

[0038] In the prior art, standard screws are generally used to connect the carriers on which the test probes are placed. However, the diameter of the standard screws is generally large, which causes the standard screws to occupy a larger area, thereby encroaching on the distribution area of ​​the Die (multiple test probes form a Die) and increasing the volume of the carrier. At the same time, standard screws are used to connect the carriers. During the connection process, the standard screws need to be manually installed, which may lead to installation failure due to human error, and in severe cases, it may cause damage to the probe and the carrier.

[0039] After extensive and in-depth experiments, the inventors found that using positioning pins instead of standard screws to connect and fix the carriers can arrange more Dies within a limited range and reduce the volume of the carriers.

[0040] The technical problem solved by the present invention is to increase the distribution quantity of Die and avoid installation failure caused by human factors.

[0041] More specifically, the solution adopted by the present invention includes: using positioning pins instead of standard screws to connect and fix the carriers, which can enable more test probes to be arranged within a limited range while reducing the volume of the carrier, and using fine positioning pins to push out the coarse positioning pins to precisely position the first carrier and the second carrier, ensuring that the first carrier and the second carrier are more stable after installation and reducing errors caused by human factors.

[0042] The following describes the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0043] like Figure 1-Figure 3 As shown, a chip test socket, the test socket includes:

[0044] Bottom mold 1;

[0045] A first carrier 3 for placing the test probe, the first carrier 3 is installed in cooperation with the bottom mold 1, the bottom mold 1 has a notch, and the first carrier 3 is installed in the notch of the bottom mold 1;

[0046] The second carrier 5 cooperates with the first carrier 3, and the test probe is placed between the second carrier 5 and the first carrier 3. The test probe is clamped and fixed by the first carrier 3 and the second carrier 5 to ensure the fixing effect of the test probe;

[0047] Coarse positioning pin 2, when the second carrier 5 is mounted on the first carrier 3, the coarse positioning pin 2 performs coarse positioning on the second carrier 5 and the first carrier 3. The first carrier 3 and the second carrier 5 are both provided with a through hole for the coarse positioning pin 2 to pass through. The inner diameter of the through hole is slightly larger than the outer diameter of the coarse positioning pin 2. The coarse positioning pin 2 performs coarse positioning between the second carrier 5 and the first carrier 3;

[0048] The fine positioning pin 7 is installed in cooperation with the second carrier 5, and the fine positioning pin 7 is cooperated with the through hole of the second carrier 5. When the second carrier 5 is installed on the first carrier 3, the fine positioning pin 7 performs fine positioning on the second carrier 5 and the first carrier 3 and pushes out the rough positioning pin 2. The fine positioning pin 7 cooperates with the through holes on the first carrier 3 and the second carrier 5. In the initial state, the fine positioning pin 7 is inserted into the through hole of the second carrier 5 from the top and fits tightly with the second carrier 5. When the upper mold 6 drives the second carrier 5 to be installed on the first carrier 3, the rough positioning pin 2 is inserted into the through hole of the second carrier 5 from the bottom. As the upper mold 6 moves downward, the second carrier 5 is installed on the first carrier 3. After the installation is completed, the upper mold 6 is removed, and the upper mold 6 is separated from the fine positioning pin 7. The fine positioning pin 7 is fully inserted into the second carrier 5 and the first carrier 3. The fine positioning pin 7 pushes the rough positioning pin 2 out of the second carrier 5 and the first carrier 3 to complete the installation between the second carrier 5 and the first carrier 3;

[0049] The upper mold 6 cooperates with the bottom mold 1, and the precision positioning pin 7 is installed between the upper mold 6. A groove that cooperates with the precision positioning pin 7 is provided on the upper mold 6. The upper mold 6 drives the second carrier 5 to move through the precision positioning pin 6 to facilitate the installation of the second carrier 5 on the first carrier 3.

[0050] like Figure 1 As shown, in some embodiments, the coarse positioning pin 2 passes through the bottom mold 1 and the first carrier 3, and the coarse positioning pin 2 is in sliding contact with the bottom mold 1 and the first carrier 3. A through hole is opened at the bottom of the bottom mold 1 to facilitate the coarse positioning pin 2 to pass through the bottom mold, and the coarse positioning pin 2 is installed on the bottom mold 1. The first carrier 3 is roughly positioned by the coarse positioning pin 2, and the first carrier 3 is installed in the notch on the bottom mold 1.

[0051] In some embodiments, a movable limiting portion is provided at the bottom of the bottom mold 1 (the limiting portion is not drawn in the figure). The limiting portion can be a limiting plate hinged to the bottom of the bottom mold 1 or other structures that are convenient for separation from the bottom mold. It can be selected according to actual conditions and will not be elaborated in detail here. The limiting portion limits the coarse positioning pin 2. By moving the limiting portion, when the second carrier 5 is installed on the first carrier 3, the fine positioning pin 7 can push the coarse positioning pin 2 out of the bottom mold 1. During the initial installation, the coarse positioning pin 2 is installed in the through hole on the bottom mold 1. At this time, the limiting portion limits the coarse positioning pin 2 to avoid separation between the coarse positioning pin 2 and the bottom mold 1. Rough positioning is performed by the coarse positioning pin 2, and the first carrier 3 is installed on the bottom mold 1, and the coarse positioning pin 2 passes through the first carrier 3; when the coarse positioning pin 2 needs to be pushed out, the limiting portion can be moved so that the limiting portion no longer contacts the coarse positioning pin 2, thereby facilitating separation between the coarse positioning pin 2 and the bottom mold 1.

[0052] like Figure 2-Figure 3As shown, in some embodiments, the fine positioning pin 7 is installed in cooperation with the upper mold 6. When the upper mold 6 is installed on the bottom mold 1, the upper mold 6 drives the second carrier 5 to be installed in cooperation with the first carrier 3. The upper mold 6 drives the fine positioning pin 7 to push out the coarse positioning pin 2. When the second carrier 5 needs to be installed on the first carrier 3, the upper mold 6 drives the second carrier 5 to move through the fine positioning pin 7, and roughly positions the second carrier 5 through the coarse positioning pin 2, so that the second carrier 5 is installed on the first carrier 3. When the upper mold 6 drives the second carrier 5 to be installed on the first carrier 3, the coarse positioning pin 2 is inserted into the through hole of the second carrier 5 from the bottom. As the upper mold 6 moves downward, the second carrier 5 is installed on the first carrier 3, and the fine positioning pin 7 is completely inserted into the second carrier 5 and the first carrier 3. The fine positioning pin 7 pushes the coarse positioning pin 2 out of the second carrier 5 and the first carrier 3, completing the installation between the second carrier 5 and the first carrier 3.

[0053] In some embodiments, the size of the fine positioning pin 7 is larger than that of the coarse positioning pin 2, and the size of the fine positioning pin 7 is slightly larger than that of the coarse positioning pin 2, ensuring that the coarse positioning pin 2 can slide in the through holes on the first carrier 3 and the second carrier 5, so that the fine positioning pin 7 can push the coarse positioning pin 2 out of the first carrier 3 and the second carrier 5, and the fine positioning pin 7 is tightly fitted with the through holes on the first carrier 3 and the second carrier 5 to ensure that the fine positioning pin 7 completes the positioning installation between the first carrier 3 and the second carrier 5.

[0054] like Figure 4 As shown, in some embodiments, the test seat also includes a pressing mold 8, which is used to press the fine positioning pin 7 into the second carrier 5 and the first carrier 3, so that the fine positioning pin 7 presses the coarse positioning pin 2 out of the bottom mold 1. When the second carrier 5 is installed on the first carrier 3, the upper mold 6 is removed, and the fine positioning pin 7 is separated from the upper mold 6. At this time, the second carrier 5 stays on the first carrier 3, and the fine positioning pin 7 stays on the second carrier 5. The fine positioning pin 7 is pressed downward by the pressing mold 8, and the fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3. When the fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3, the coarse positioning pin 2 is pushed out.

[0055] like Figure 1-Figure 4 As shown, in some embodiments, the test seat further includes a guide post 4, which is disposed on the top of the bottom mold 1, and the guide post 4 can be fixedly disposed on the top of the bottom mold 1;

[0056] When the upper mold 6 is installed on the bottom mold 1, the guide column 4 is used to guide and position the upper mold 6. The upper mold 6 is provided with a through hole that matches the guide column 4. The guide column 4 guides the upper mold 6 so that the upper mold 6 drives the second carrier 5 to be installed on the first carrier 3.

[0057] When the die 8 is installed on the base die 1, the guide column 4 is used to guide and position the die 8. A through hole that cooperates with the guide column 4 is opened on the die 8. The die 8 is guided by the guide column 4. The die 8 moves downward along the guide column 4. The die 8 presses the fine positioning pin 7 to move downward. The fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3. When the fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3, the coarse positioning pin 2 is pushed out.

[0058] like Figure 1-Figure 4 As shown, in the present invention, during installation, the coarse positioning pin 2 is installed on the bottom mold 1, and the bottom limiting part of the bottom mold 1 limits the coarse positioning pin 2 to prevent the coarse positioning pin 2 from separating from the bottom mold 1. The coarse positioning pin 2 is used for coarse positioning, and the first carrier 3 is installed on the bottom mold 1. The coarse positioning pin 2 passes through the first carrier 3, and the upper mold 6 drives the second carrier 5 to move through the fine positioning pin 7. The second carrier 5 is coarsely positioned by the coarse positioning pin 2, so that the second carrier 5 is installed on the first carrier 3. When the upper mold 6 drives the second carrier 5 to be installed on the first carrier 3, the coarse positioning pin 2 is inserted into the through hole of the second carrier 5 from the bottom. As the upper mold 6 moves downward, the second carrier 5 is The carrier 5 is installed on the first carrier 3. When the upper mold 6 is installed, the guide column 4 is used to guide and position the upper mold 6. When the second carrier 5 is installed on the first carrier 3, the limit part is moved so that the limit part no longer contacts the coarse positioning pin 2, thereby facilitating the separation between the coarse positioning pin 2 and the bottom mold 1. The upper mold 6 is removed and the fine positioning pin 7 is separated from the upper mold 6. At this time, the second carrier 5 stays on the first carrier 3 and the fine positioning pin 7 stays on the second carrier 5. The fine positioning pin 7 is pressed downward by the pressing mold 8. The fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3. When the fine positioning pin 7 is inserted into the second carrier 5 and the first carrier 3, the coarse positioning pin 2 is pushed out.

[0059] like Figure 1-Figure 4 As shown, based on the same inventive concept, an embodiment of this specification provides a chip test socket installation method, based on any one of the chip test sockets described above, the method includes:

[0060] Install the coarse positioning pins 2 on the bottom mold 1, and install the first carrier 3 on the bottom mold 1 through the coarse positioning pins 2. The coarse positioning pins 2 roughly position the first carrier 3, making it easier for the first carrier 3 to be installed on the bottom mold 1;

[0061] Place the test probe to be tested on top of the first carrier 3. Multiple test probes can be placed at the same time. The placement of the test probes can be carried out according to actual conditions.

[0062] The upper mold 6 is installed on the bottom mold 1. The guide column 4 guides and positions the upper mold 6. The upper mold 6 drives the second carrier 5 to be installed with the first carrier 3. The upper mold 6 drives the second carrier 5 to be installed on the first carrier 3 through the fine positioning pin 7. The coarse positioning pin 2 roughly positions the second carrier 5 to facilitate the installation of the second carrier 5 on the first carrier 3.

[0063] The upper mold 6 is removed, the second carrier 5 and the fine positioning pin 7 remain on the first carrier 3, and the pressing mold 8 is installed on the bottom mold 1. The fine positioning pin 7 is pressed into the second carrier 5 and the first carrier 3 through the pressing mold 8, and the fine positioning pin 7 pushes out the rough positioning pin 2.

[0064] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences from other embodiments. In particular, the method embodiments described later are relatively simple to describe because they correspond to the system. For relevant parts, refer to the description of the system embodiments.

[0065] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A chip test socket, characterized in that: The test socket comprises: bottom mold (1); a first carrier (3) for placing a test probe, the first carrier (3) being mounted in cooperation with the bottom mold (1); a second carrier (5) matched with the first carrier (3), the test probe being placed between the second carrier (5) and the first carrier (3); a coarse positioning pin (2), which performs coarse positioning on the second carrier (5) and the first carrier (3) when the second carrier (5) is mounted on the first carrier (3); A fine positioning pin (7), wherein the fine positioning pin (7) is fitted with the second carrier (5). When the second carrier (5) is mounted on the first carrier (3), the fine positioning pin (7) performs fine positioning on the second carrier (5) and the first carrier (3) and pushes out the rough positioning pin (2). The size of the fine positioning pin (7) is larger than that of the rough positioning pin (2), so that the fine positioning pin (7) is tightly fitted with the through holes on the first carrier (3) and the second carrier (5), ensuring that the fine positioning pin (7) completes the positioning installation between the first carrier (3) and the second carrier (5); An upper die (6) matched with the bottom die (1), and the precision positioning pin (7) is matched and installed with the upper die (6); A pressing die (8) is used to press the fine positioning pin (7) into the second carrier (5) and the first carrier (3), so that the fine positioning pin (7) presses the rough positioning pin (2) out of the bottom die (1).

2. The chip test socket according to claim 1, characterized in that: The coarse positioning pin (2) passes through the bottom mold (1) and the first carrier (3), and the coarse positioning pin (2) is in sliding contact with the bottom mold (1) and the first carrier (3).

3. The chip test socket according to claim 2, characterized in that: A movable limiting portion is provided at the bottom of the bottom mold (1), and the limiting portion limits the rough positioning pin (2). By moving the limiting portion, when the second carrier (5) is installed on the first carrier (3), the fine positioning pin (7) can push the rough positioning pin (2) out of the bottom mold (1).

4. The chip test socket according to claim 1, characterized in that: When the upper mold (6) is installed on the bottom mold (1), the upper mold (6) drives the second carrier (5) and the first carrier (3) to be installed in a coordinated manner, and the upper mold (6) drives the fine positioning pin (7) to push out the rough positioning pin (2).

5. The chip test socket according to claim 1, characterized in that: The test seat further comprises a guide post (4), and the guide post (4) is arranged on the top of the bottom mold (1); When the upper mold (6) is mounted on the bottom mold (1), the guide column (4) is used to guide and position the upper mold (6); When the pressing die (8) is mounted on the bottom die (1), the guide column (4) is used to guide and position the pressing die (8).

6. A chip test socket installation method, characterized in that: Based on the chip test socket according to any one of claims 1 to 5, the method comprises: The first carrier (3) is mounted on the bottom mold (1) via a coarse positioning pin (2); Placing a test probe to be tested on top of the first carrier (3); The upper mold (6) is installed on the bottom mold (1), and the upper mold (6) drives the second carrier (5) and the first carrier (3) to be installed in a coordinated manner; The upper mold (6) is removed, the second carrier (5) and the fine positioning pin (7) remain on the first carrier (3), the pressing mold (8) is installed on the bottom mold (1), and the fine positioning pin (7) is pressed into the second carrier (5) and the first carrier (3) by the pressing mold (8), and the fine positioning pin (7) pushes out the rough positioning pin (2).

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