Common mode filter, filtering device, device with filtering function, and electronic equipment

Abstract

The present application relates to a common-mode filter, a filtering device, a device with filtering function, and an electronic device. The common-mode filter includes: at least two coil groups, multiple routing connecting lines, at least one dielectric structure, and at least two stacked routing layers, each coil group includes multiple routing lines, and each routing layer is provided with one or more routing lines belonging to different coil groups; each routing connecting line is respectively connected to two different routing lines of the same coil group to connect the multiple routing lines of each coil group together in sequence; each dielectric structure is located between two adjacent routing layers, and the routing layers are stacked together under the action of the dielectric structure, and the volume of each dielectric structure is smaller than the volume of the interlayer space between the two routing layers in contact. The common-mode filter provided by the present application reduces dielectric loss and differential mode loss, and the common-mode filter has good symmetry and low mode conversion.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a common mode filter, a filtering device, a device with filtering function, and an electronic device. Background Art

[0002] Multimedia systems such as cameras and displays in electronic devices can achieve high-speed data transmission using high-speed data transmission interfaces such as the Mobile Industry Processor Interface (MIPI), the serdes (serializer / deserializer) interface, and the embedded digital audio and video transmission interface (eDP)). However, as electronic devices such as mobile phones, smart tablets, and laptops become smaller and thinner, the layout of RF antennas and multimedia systems becomes closer and closer, and the spacing between them becomes smaller and smaller. This leads to an increasing risk of interference and mutual interference between high-speed data transmission pathways such as MIPI used by multimedia systems and RF antennas. Reducing the risk of interference and mutual interference and ensuring signal quality in high-speed data transmission links is an urgent problem that needs to be solved. Summary of the Invention

[0003] In order to filter out common-mode noise on a high-speed data path, the present application proposes a common-mode filter, a filtering device, a device with filtering function, and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a common mode filter, comprising: at least two coil groups, a plurality of wiring connecting lines, at least one dielectric structure, and at least two stacked wiring layers.

[0005] Each coil group includes multiple routing lines, and each routing layer is provided with one or more routing lines belonging to different coil groups;

[0006] Each routing connection line is connected to two different routing lines of the same coil group, so as to sequentially connect multiple routing lines of each coil group;

[0007] Each dielectric structure is located between two adjacent routing layers. The routing layers are stacked together under the action of the dielectric structures. The volume of each dielectric structure is smaller than the volume of the interlayer space between the two routing layers in contact.

[0008] Through the first aspect, the wiring of the same coil group of the common-mode filter is located in different wiring layers, and the wiring layers are maintained parallel or approximately parallel to each other and stacked together under the support of the multiple dielectric structural components, thereby reducing the dielectric loss of the common-mode filter and the differential mode loss of the common-mode filter. In addition, the common-mode filter has better symmetry and lower mode conversion, and can filter out common-mode noise carried by high-speed data channels while ensuring signal quality.

[0009] According to the first aspect, in a first possible implementation of the common-mode filter, each dielectric structure includes at least one structural branch, each structural branch contacting at least a corner of a trace in an adjacent trace layer. Each trace in a trace layer contacts the dielectric structure at least at its corner, allowing it to be supported by the dielectric structure and ensuring that the traces in the multiple trace layers are stably parallel to each other.

[0010] According to a first possible implementation of the first aspect, in a second possible implementation of the common-mode filter, the cross-sectional shape of each structural branch perpendicular to the routing layer includes any one of the following: a rectangle, a trapezoid, a parallelogram, and a combination of at least two of the rectangle, trapezoid, and parallelogram. In this way, the shape and size of the cross-sectional area T of each structural branch of the dielectric structural component can be set based on support requirements determined by the winding shape and length of the routing in the two routing layers contacted by the dielectric structural component. While meeting the support requirements, the volume of each structural branch can be minimized to further reduce the low differential mode loss of the common-mode filter.

[0011] According to the first or second possible implementation of the first aspect, in a third possible implementation of the common-mode filter, all structural branches of the same dielectric structural component are fixedly connected together. This can enhance the structural stability of the dielectric structural component itself, thereby improving the structural stability of the common-mode filter.

[0012] According to the first aspect, or any possible implementation of the first aspect, in a fourth possible implementation of the common-mode filter, the shape of the orthographic projection of each dielectric structural component on any routing layer includes any one of the following: a cross-shaped, a ∘ shape, a square shape, a rectangle, an X-shaped, a circle, an annular shape, an I-shaped, a cross-shaped, and a combination of at least two of the cross-shaped, ∘ shape, a square shape, a rectangle, an X-shaped, a circle, an annular shape, an I-shaped, and a cross-shaped shape. In this way, the orthographic projection shape of the dielectric structural component can be arbitrarily set according to the structural support requirements of the common-mode filter, and the volume of the dielectric structural component can be reduced as much as possible while meeting the support requirements, thereby further reducing the low differential mode loss of the common-mode filter.

[0013] According to the first aspect, or any possible implementation of the first aspect, in a fifth possible implementation of the common mode filter, fillers are further provided in some or all of the multiple routing layers, and the fillers include porous solid fillers and / or gas fillers.

[0014] According to a fifth possible implementation manner of the first aspect, in a sixth possible implementation manner of the common mode filter, a volume of the filler in each routing layer is less than or equal to 80% of the total volume of the routing layer where the filler is located.

[0015] The fifth and sixth possible implementations of the first aspect can enhance the structural stability of the common-mode filter while minimizing differential-mode loss. Under the same conditions, the smaller the volume of the filler in the routing layer, the lower the differential-mode loss of the common-mode filter.

[0016] According to the fifth or sixth possible implementation manner of the first aspect, in a seventh possible implementation manner of the common mode filter, the porous solid filler in each routing layer includes at least one of the following: insulating foam, porous ceramic, and porous resin.

[0017] According to the first aspect and any possible implementation of the first aspect, in an eighth possible implementation of the common mode filter, the common mode filter further includes at least one connector, each connector being configured to securely connect any two dielectric structural members. The provision of the connector can improve the stability of the common mode filter structure.

[0018] According to an eighth possible implementation manner of the first aspect, in a ninth possible implementation manner of the common mode filter, the common mode filter further includes at least one interlayer via, and each interlayer via is used to accommodate a corresponding connector.

[0019] According to any one of the fifth to seventh possible implementations of the first aspect, in a tenth possible implementation of the common mode filter, the porous solid filler in each routing layer is fixedly connected to the dielectric structure in contact therewith, thereby enhancing the structural stability of the common mode filter.

[0020] According to the first aspect or any possible implementation manner of the first aspect, in an eleventh possible implementation manner of the common mode filter, the common mode filter further includes:

[0021] A plurality of pins are arranged on the surface of any one of the two outermost routing layers among the plurality of routing layers.

[0022] According to the first aspect and any possible implementation of the first aspect, in a twelfth possible implementation of the common-mode filter, the volume of each dielectric structural component is less than or equal to 80% of the volume of the interlayer space between the two wiring layers it contacts; and / or the volume of each dielectric structural component is less than or equal to 80% of the volume of the wiring layer it contacts. This ensures the structural stability of the common-mode filter while also reducing differential-mode loss. The smaller the volume of the dielectric structural component, the lower the differential-mode loss of the common-mode filter.

[0023] According to the first aspect and any possible implementation of the first aspect, in a thirteenth possible implementation of the common mode filter, at least two traces in a trace layer having a number of traces greater than or equal to 2 are wound in parallel, which can improve the symmetry of the common mode filter.

[0024] In a second aspect, an embodiment of the present application provides a filtering device, comprising:

[0025] The common-mode filter in the first aspect or any possible implementation of the first aspect;

[0026] A first printed circuit board, used for carrying the common mode filter;

[0027] Wherein, each pin of the common mode filter is fixedly connected to the corresponding pad on the first printed circuit board.

[0028] According to the second aspect, in a first possible implementation of the device, the manner in which each pin of the common mode filter is fixedly connected to the corresponding pad on the first printed circuit board includes any one of the following: wire bonding connection, welding connection, and conductive adhesive connection.

[0029] According to the second aspect and the first possible implementation of the second aspect, in the second possible implementation of the device, insulating glue is provided on part or all of the surface of the common-mode filter, so as to transfer the common-mode filter to the corresponding position of the first printed circuit board using the insulating glue.

[0030] In a third aspect, an embodiment of the present application provides a device having a filtering function, the device comprising: a functional device, an auxiliary device, and a second printed circuit board, the functional device and the auxiliary device being mounted on the second printed circuit board, the functional device and the auxiliary device being coupled to each other;

[0031] The functional device includes a common-mode filter as described in the first aspect or any possible implementation of the first aspect, and the auxiliary device includes an amplifier and / or a passive device.

[0032] In a fourth aspect, an embodiment of the present application provides an electronic device, including:

[0033] The common mode filter in the first aspect or any possible implementation of the first aspect, or

[0034] The filtering device in the second aspect or any possible implementation of the second aspect, or;

[0035] The third aspect is a device with filtering function.

[0036] These and other aspects of the present application will become more readily apparent from the following description of the embodiment(s). BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the description, serve to explain the principles of the application.

[0038] Figure 1A-1G A schematic structural diagram of a common-mode filter according to an embodiment of the present application is shown.

[0039] Figures 2A-2D A perspective view, a front view, a side view and a top view of another exemplary common mode filter according to an embodiment of the present application are shown.

[0040] Figure 2E-2H A perspective view, a front view, a side view and a top view are shown of another exemplary common mode filter according to an embodiment of the present application.

[0041] Figure 3A 、 Figure 3B A cross-sectional view of a common mode filter according to an embodiment of the present application is shown.

[0042] Figure 3C A structural schematic diagram of a common mode filter according to an embodiment of the present application is shown.

[0043] Figure 3D A schematic structural diagram of a dielectric structure according to an embodiment of the present application is shown.

[0044] Figure 4A 、 Figure 4B A schematic structural diagram of a common mode filter and a schematic structural diagram of a dielectric structure according to an embodiment of the present application are shown.

[0045] Figure 5A 、 Figure 5B A schematic structural diagram of another schematic common mode filter and a schematic structural diagram of a dielectric structure according to an embodiment of the present application are shown.

[0046] Figure 6A 、 Figure 6B A schematic structural diagram of another schematic common mode filter and a schematic structural diagram of a dielectric structure according to an embodiment of the present application are shown.

[0047] Figure 7A 、 Figure 7B Schematic diagrams of the structures of connectors according to different embodiments of the present application are shown.

[0048] Figure 8A 、 Figure 8B A schematic diagram of the structure of dielectric components in another schematic common mode filter according to an embodiment of the present application is shown.

[0049] Figure 9 A structural schematic diagram of a filtering device according to an embodiment of the present application is shown.

[0050] Figure 10A 、 Figure 10B 、 Figure 10C A schematic diagram of a manufacturing process of a common mode filter according to an embodiment of the present application is shown.

[0051] Figure 11 A schematic structural diagram of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0052] Various exemplary embodiments, features, and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0053] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0054] In addition, numerous specific details are provided in the detailed description below to better illustrate the present application. Those skilled in the art will appreciate that the present application can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main purpose of the present application.

[0055] Electronic devices are often subject to electromagnetic interference (EMI) when working.

[0056] Electromagnetic interference is a type of noise conducted through conductive media or electromagnetic waves radiated in space. It spreads in the air or is transmitted through power lines or signal lines, which can harm the normal operation of electronic equipment and seriously affect and hinder communications.

[0057] Electromagnetic interference can be broadly categorized as "conducted interference" and "radiated interference." It should be understood that "conducted interference" can also be referred to as "conducted noise," and "radiated interference" can also be referred to as "radiated noise." Conducted noise is primarily propagated through conductive wires. Radiated noise is primarily transmitted through spatial coupling. For example, high-frequency signal lines, integrated circuit pins, and various connectors can all become sources of radiated interference with antenna characteristics, emitting electromagnetic waves and affecting the normal operation of other systems or subsystems within the system.

[0058] The electromagnetic interference of high-speed data link transmission is mainly conducted noise, which can be divided into differential mode noise and common mode noise.

[0059] Circuits are based on the flow of current along a path. For example, if a signal source and a load are connected by two wires, with current flowing in and out respectively, the currents of equal magnitude flow in opposite directions. Therefore, the sum is always zero. Current flowing in this manner is called common-mode current. Similarly, noise flowing in this manner is called common-mode noise.

[0060] Because the signal source and load have static capacitance to ground, some current flows from the signal source to the load. Therefore, the currents flowing in the same direction in both wires between the signal source and the load are called common-mode currents, also known as common-mode noise. For example, at a specific frequency, when the signal source ground pin conductor and the capacitance to ground form a resonant structure similar to an antenna, common-mode noise is introduced. In practical applications, temperature changes and various environmental noise influences can be considered common-mode interference. However, if the noise attenuation of the two wires to ground differs during transmission, resulting in a voltage difference between the two wires, common-mode noise becomes differential-mode noise. Therefore, eliminating common-mode noise is crucial.

[0061] Common-mode filters are commonly used to filter common-mode noise on high-speed data paths and typically consist of at least two coils. For example, two coils have the same number of turns and phase, wound around the same core. These are also called common-mode suppression inductors or common-mode inductors. Because the coils in a common-mode inductor are wound in phase, when common-mode currents of equal amplitude and direction flow through the inductor, the magnetic field generated within the inductor coils is also in the same direction. This increases the inductive reactance of the inductor coils, making them exhibit high impedance and a strong damping effect. This attenuates common-mode currents and achieves filtering, but has no attenuation effect on differential-mode currents of equal amplitude and opposite directions. Common-mode filters with more than two wires (i.e., more than two coils) have broad application prospects in high-speed data transmission. For example, common-mode filters for the MIPI (Mobile Industry Processor Interface) C-PHY interface (PHY is the abbreviation for Port Physics Layer, and C-PHY is a standard for the port physical layer specified by MIPI) data transmission method consist of three coils. The three coils are coupled and differentially connected between them to filter out common-mode noise.

[0062] Figure 1A-1G FIG. 1 shows a schematic structural diagram of a common mode filter according to an embodiment of the present application. Figure 1A This is a perspective diagram of a common mode filter having three coil groups. Figure 1B 、 Figure 1D 、 Figure 1F Can be right Figure 1A The filter shown is a cross-sectional view along a plane (such as plane Q) parallel to the x-axis and the y-axis and located in the space R. Figure 1C 、 Figure 1E 、 Figure 1G Can be right Figure 1A The filter shown is a cross-sectional view along a plane parallel to the z-axis and the y-axis and located in space R (such as a plane perpendicular to plane Q and parallel to the z-axis and the y-axis in space R). Figure 1A-1G The common mode filter in the related art shown includes three coil groups, each coil group is composed of multiple traces in different trace layers, such as Figure 1B-1G As shown in the figure, the traces marked as "A" in different trace layers belong to the first coil group, the traces marked as "B" in different trace layers belong to the second coil group, and the traces marked as "C" in different trace layers belong to the third coil group. There are several ways to lay out the traces of a common mode filter: Figure 1B 、 Figure 1CAs shown, the wiring of the three coil groups is arranged in a triangle. The wiring "A" of the first coil group and the wiring "B" of the second coil group are on the same wiring layer, and the wiring "C" of the third coil group is set separately on a wiring layer different from wiring A and B. Figure 1D 、 Figure 1E As shown, the wiring of the three coil groups is also arranged in an equilateral triangle, and the wiring "A", "B" and "C" of the three coil groups are not in the same wiring layer. Figure 1F 、 Figure 1G As shown in the figure, the wiring of the three coil groups is not on the same wiring layer, and the wiring "A", "B", and "C" of the three coil groups are arranged in sequence in the vertical direction. Figure 1B-1G The common-mode filter's routing layers, excluding the routing traces, and the interlayer areas between routing traces are all filled with dielectric, encasing each trace. This reduces interference and mutual interference between the high-speed data path and the RF antenna, ensuring signal quality in the high-speed data transmission link.

[0063] The present application provides another common-mode filter with low differential-mode loss. The differential-mode loss of the common-mode filter mainly includes the conductor loss and dielectric loss of the common-mode filter, wherein the conductor loss is mainly determined by the wiring material of the coil group, and the dielectric loss is related to the filling medium. In some embodiments, the method of reducing dielectric loss can be achieved by replacing the filling medium in the common-mode filter with a material with a smaller Dk (relative dielectric constant) and / or df (dielectric loss factor). Wherein, Dk is a physical quantity that measures the degree of polarization of the dielectric. The larger the Dk value of the dielectric, the higher the polarization degree of the dielectric, and the higher its charge Q value, indicating that the dielectric has a stronger ability to store electrical energy, and the greater the ability to hinder signal transmission, the greater the dielectric loss of the dielectric. The loss factor df is a physical quantity that characterizes the hysteresis effect of dielectric conductivity and dielectric polarization. Due to the hysteresis effect in the alternating electric field, there is a certain phase difference in the current and voltage phasors flowing through the dielectric, i.e., a phase angle δ is formed. The tangent value of the phase angle δ is the tan value, also known as df, dielectric loss factor, and dielectric loss tangent. The energy loss caused by the hysteresis effect between dielectric conductivity and dielectric polarization is called dielectric loss. The higher the df, the greater the power loss and the greater the dielectric loss of the dielectric.

[0064] Another common mode filter 100 with low differential mode loss provided by the present application includes: at least two coil groups, each coil group includes a plurality of traces located in different trace layers (for example, Figure 3B The wiring 131 in each wiring layer 11 belongs to the same coil group); multiple wiring connection lines (for example, Figure 3C 14); at least one dielectric structure (e.g., Figure 3C 12 of 12, or Figure 4A12); and at least two routing layers (eg, Figure 3A-3C 11). One or more routing lines belonging to different coil groups are provided in the same routing layer; each routing connection line is respectively connected to two different routing lines belonging to the same coil group (for example, each routing connection line can be respectively connected to two routing lines belonging to the same coil group and having the shortest interlayer distance between the routing layers), so as to connect the multiple routing lines of each coil group together in sequence. Each dielectric structure is located between two adjacent routing layers, and the multiple routing layers are stacked together under the action of the multiple dielectric structures, and can maintain a parallel or approximately parallel state with each other under the support of the dielectric structures. The volume of each dielectric structure is smaller than the volume of the interlayer space between the two routing layers it contacts, that is, the dielectric structure between the routing layers does not occupy the entire interlayer space, so that the filling medium in the entire common mode filter is reduced, the dielectric loss of the common mode filter is reduced, the differential mode loss of the common mode filter is reduced, and the differential mode loss index Sdd21 is improved. In addition, in some embodiments, the relative dielectric constant Dk and / or df (dielectric loss factor) of the dielectric structure can be reduced. In the common-mode filter provided by the present application, the individual traces of the same coil group are located in different trace layers, the dielectric constant of the interlayer dielectric (i.e., each dielectric structural component) of the trace layer is reduced, and the parasitic capacitance is also reduced, so that the main factor affecting the symmetry between the coil groups is the electrical length and impedance matching of all traces of each coil group. Since the individual traces of the same coil group are located in different trace layers, the symmetry of the common-mode filter can be improved by adjusting the length of the traces of each coil group in different trace layers and the winding structure between the traces in the same trace layer, thereby improving the mode conversion of the common-mode filter (i.e., reducing the possibility of the common-mode signal input to the common-mode filter being converted to a differential-mode signal output, and reducing the possibility of the differential-mode signal input to the common-mode filter being converted to a common-mode signal output), reducing the longitudinal transfer loss, and improving the longitudinal transfer loss indicators Sdc21 and Scd21.

[0065] In order to facilitate an intuitive and clear description of the structural setting of another common-mode filter with low differential mode loss provided by the present application, the following description uses "a common-mode filter 100 having three coil groups" as an example of "a common-mode filter comprising at least two coil groups of the present application", and "131", "132", and "133" respectively represent the routing lines belonging to different coil groups, that is, the routing lines marked as 131 in each routing layer belong to the routing lines of the first coil group, the routing lines marked as 132 in each routing layer belong to the routing lines of the second coil group, and the routing lines marked as 132 in each routing layer belong to the routing lines of the third coil group. When the number of coil groups is 2 or greater than 2, those skilled in the art can make corresponding adjustments with reference to the layout setting of the "common-mode filter having three coil groups", which will not be described in detail in this application. Figures 2A-2Dshows a perspective view, a front view, a side view and a top view of another schematic common mode filter according to an embodiment of the present application, Figure 2E-2H 1 shows a perspective view, a front view, a side view and a top view of another schematic common mode filter according to an embodiment of the present application. Figure 2A 、 Figure 2E shows a perspective view of different common mode filters according to an embodiment of the present application, Figure 2B 、 Figure 2F 1 shows a front view of different common mode filters according to an embodiment of the present application. Figure 2C 、 Figure 2G A side view of different common mode filters according to an embodiment of the present application is shown. Figure 2D 、 Figure 2H 1 shows a top view of different common mode filters according to an embodiment of the present application.

[0066] Figure 3A 、 Figure 3B 1 shows a cross-sectional view of a common mode filter according to an embodiment of the present application, Figure 3C FIG. 1 shows a schematic diagram of the structure of a common mode filter according to an embodiment of the present application. Figure 3A It is along Figure 2E-2H as well as Figure 3C The cross-sectional view obtained by cutting at the position of the cross-sectional area S1 shown in FIG. Figure 3B It is along Figure 2E-2H as well as Figure 3C The cross-sectional view is obtained by cutting at the position of the cross-sectional view S2 shown in FIG. Wherein, the cross-sectional view S1 and the cross-sectional view S2 correspond to the same three-dimensional space R of the common mode filter 100. And for the sake of simplicity, Figure 3C The common mode filter in the figure only shows three dielectric components and four routing layers. Figure 3A 、 Figure 3B The common-mode filter in FIG also only shows 5 dielectric structural components and 6 routing layers.

[0067] like Figure 3A 、 Figure 3B 、 Figure 3C As shown, the common mode filter 100 includes: three coil groups, multiple routing wires 14, multiple dielectric structures 12 and multiple routing layers 11. Each coil group includes multiple routing wires (the routing material is metal), that is, the routing wires 131 in each routing layer 11 belong to the routing wires of the first coil group, the routing wires 132 in each routing layer 11 belong to the routing wires of the second coil group, and the routing wires 133 in each routing layer 11 belong to the routing wires of the third coil group. Each routing layer 11 is provided with one or more routing wires belonging to different coil groups (for example, Figure 3A 、 Figure 3B 、 Figure 3CEach routing layer 11 is provided with routing 131, 132, 133 of each coil group. Each routing connection line 14 is connected to two routing lines of different routing layers 11 belonging to the same coil group 13 and having the shortest inter-layer distance (for example, for example Figure 3A 、 Figure 3B 、 Figure 3C A certain routing connection line can be connected to two routing lines 131 in two adjacent routing layers 11), and the multiple routing connection lines 14 are used to connect the multiple routing lines of each coil group 13 together in sequence. Each dielectric structure 12 is located between two adjacent routing layers 11. The multiple routing layers 11 are stacked together under the action of the multiple dielectric structures 12, and can maintain a state of being parallel or approximately parallel to each other under the support of the dielectric structures 12. Among them, the multiple routing layers 11 described in this application can maintain a state of being parallel or approximately parallel to each other under the support of the dielectric structures 12, which can refer to a theoretical design state. In the actual manufacturing process, due to problems such as process and materials, there will be certain deviations in the "parallel or approximately parallel" between the multiple routing layers 11.

[0068] in, Figure 3A-3C , and the following Figure 4A 、 Figure 5A 、 Figure 6A In the common mode filters with dielectric structures shown in FIG. 1 and FIG. 2 , the wiring layout can be the layout shown in the corresponding drawings, or can refer to FIG. Figure 1B-1G The wiring layout shown in Figure 3A-3C , and the following Figure 4A 、 Figure 5A 、 Figure 6A The wiring layout of the common mode filter with dielectric structural parts is set. Other settings can also be made to the wiring layout of the common mode filter with dielectric structural parts as needed, and this application does not limit this.

[0069] Among them, the layout of each routing layer in the same routing layer, the structure of each dielectric structural component, and the shape and position of each routing connection line can be set under the premise of ensuring that multiple routing layers of the common mode filter maintain a parallel or approximately parallel state and the structure of the common mode filter is stable. This application does not impose any restrictions on this. To further describe the settings of the various parts of the common mode filter in this application, the different common mode filter parts are described separately below in combination with the examples provided in the drawings of this application. Among them, Figure 3D 、 Figure 4B 、 Figure 5B 、 Figure 6B Schematic diagrams of the structures of dielectric structures according to different embodiments of the present application are shown. Figure 4A 、 Figure 5A 、 Figure 6ASchematic diagrams of the structures of common mode filters according to different embodiments of the present application are shown. Figure 3D and Figure 3C Shown is the same common mode filter, Figure 4A and Figure 4B 、 Figure 5A and Figure 5B 、 Figure 6A and Figure 6B They correspond to the same common-mode filter respectively.

[0070] In a possible implementation, each dielectric structure 12 may include at least one structural branch (e.g., Figure 3D The structural branches 122, 121, 122' and 121' shown; or Figure 4B The structural branches 123 and 124 shown, or as Figure 5B The structural branches 125, 126, 127 and 128 shown; or Figure 6B The number, structure, and spatial position of the structural branches of the dielectric structural component in the common mode filter can be set accordingly according to the arrangement of each routing line in the routing layer that the dielectric structural component contacts.

[0071] Among them, such as Figure 5A 、 Figure 5B As shown, all structural branches of the same dielectric structure 12 may not be connected to each other. Figure 3C 、 Figure 3D 、 Figure 4A 、 Figure 4B 、 Figure 6A 、 Figure 6B As shown, by manufacturing the dielectric structural member itself into an integral structure, all structural branches of the same dielectric structural member 12 can be fixedly connected together. Alternatively, all structural branches of the same dielectric structural member 12 can also be partially connected together. In this way, the structural stability of the dielectric structural member itself can be enhanced, thereby improving the structural stability of the common mode filter. Alternatively, all structural branches of the same dielectric structural member can be disconnected from each other, or not completely fixedly connected together, such as some structural branches are fixedly connected together, and the remaining structural branches are not connected. Whether all structural branches of the same dielectric structural member are fixedly connected together and the connection method between the structural branches is set are not limited by this application.

[0072] In a possible implementation, dielectric structures of different layers may be connected by connectors, where the positions of the connectors are not limited. Figure 7A 、 Figure 7BSchematic diagrams of the structures of connectors according to different embodiments of the present application are shown. The common mode filter 100 may further include at least one connector 15, each connector 15 being used to securely connect any two dielectric structural members 12 together. The two dielectric structural members 12 connected by each connector 15 may be separated by a wiring layer; or may be separated by multiple wiring layers and dielectric structural members between the wiring layers. Figure 7A As shown, each connector 15 can pass through each layer between the two dielectric structural members 12 it connects, which can reduce the volume of the common mode filter. Figure 7B As shown, the connector 15 can also be arranged outside the plurality of routing layers 11, which can simplify the processing process of the common mode filter, increase the processing speed, and simplify the processing technology. In some embodiments, when there are multiple connectors, each connector can be as follows: Figure 7A 、 Figure 7B Alternatively, all the connectors may be connected together in an integrated structure. The provision of connectors can improve the stability of the common mode filter structure.

[0073] For example, assuming that a common mode filter has 7 routing layers, namely "Z1, Z2...Z7" and 6 dielectric structural components, namely "M1, M2...M6", it can also include 5 connecting components, namely "L1, L2...L5", and the connection relationship between each connecting component and the dielectric structural component can be the following possible situations such as "possible situation 1, possible situation 2, possible situation 3".

[0074] Possible situation 1: L1 is connected to M1 and M2 respectively, L2 is connected to M2 and M3 respectively, L3 is connected to M3 and M4 respectively, L4 is connected to M4 and M5 respectively, and L5 is connected to M5 and M6 respectively.

[0075] Possible situation 2: L1 is connected to M1 and M6 respectively, L2 is connected to M2 and M6 respectively, L3 is connected to M3 and M6 respectively, L4 is connected to M4 and M6 respectively, and L5 is connected to M5 and M6 respectively.

[0076] Possible situation 3: L1 is connected to M1 and M3 respectively, L2 is connected to M2 and M3 respectively, L3 is connected to M3 and M4 respectively, L4 is connected to M3 and M6 respectively, and L5 is connected to M5 and M3 respectively.

[0077] In a possible implementation, each structural branch contacts at least one routing corner of a routing line in an adjacent routing layer 11. For example, Figure 3CAs shown, for traces 131, 132, and 133 in the topmost trace layer 11, the dielectric structure 12 beneath this trace layer contacts four of the five corners of trace 131, four of the five corners of trace 132, and all three corners of trace 133. Thus, by ensuring that each structural branch contacts at least one trace corner of a trace in an adjacent trace layer, the traces can be supported by the dielectric structure, ensuring that the parallelism or near-parallelism between the multiple trace layers can be maintained stably.

[0078] In a possible implementation, each structural branch is perpendicular to the cross section T of the wiring layer 11 (for example, Figure 4B 、 Figure 5B 、 Figure 6B The cross-sectional shape of the cross-sectional area T) may include any of the following: rectangular (e.g., Figure 4B 、 Figure 5B 、 Figure 6B The cross-section T of each structural branch of the same dielectric structure member perpendicular to the wiring layer 11 may have the same size and shape (e.g. Figure 4B 、 Figure 5B The shapes and sizes of the cross sections T of the structural branches shown as being perpendicular to the wiring layer 11 are the same), or they may be different (for example Figure 6B Of the four structural branches shown, two structural branches 129 and the other two structural branches 129' have the same shape of cross-section T perpendicular to the routing layer 11, but different sizes of cross-section T. In this way, the shape and size of the cross-section T of each structural branch of the dielectric structural component can be set based on support requirements determined by the winding shape and length of the routing in the two routing layers contacted by the dielectric structural component. While meeting the support requirements, the volume of each structural branch can be minimized to further reduce the low differential mode loss of the common mode filter.

[0079] In a possible implementation, the shape of the orthographic projection of each dielectric structure 12 on any wiring layer may include any of the following: a tic-tac-toe shape (e.g. Figure 3D ), M-shaped (such as Figure 6A 、 Figure 6B ), square, rectangular, X-shaped (such as Figure 4A 、 Figure 4B), circular, annular, I-shaped, cross-shaped, and a combination of at least two of the following shapes: a crisscross shape, a 'M' shape, a square shape, a rectangle, an X-shape, a circular, annular, I-shaped, and a cross-shaped. In this way, the orthographic projection shape of the dielectric structure can be arbitrarily set according to the structural support requirements of the common-mode filter. While meeting the support requirements, the volume of the dielectric structure can be minimized, thereby further reducing the low differential mode loss of the common-mode filter.

[0080] It should be noted that the above only exemplifies the cross-sectional shape of the structural branch perpendicular to the routing layer and the shape of the positive projection of the dielectric structural component on any routing layer. Those skilled in the art can set them according to actual needs, and this application does not impose any restrictions on this.

[0081] In one possible implementation, the volume of each dielectric structural member 12 can be less than or equal to 80% of the volume of the interlayer space between the two contacting wiring layers; and / or the volume of each dielectric structural member can be less than or equal to 80% of the volume of the contacting wiring layer. In this way, the structural stability of the common-mode filter can be ensured while also reducing differential-mode loss. The volume of the dielectric structural member can be set according to the configuration requirements of the common-mode filter. The smaller the volume of the dielectric structural member, the lower the differential-mode loss of the common-mode filter.

[0082] Figure 8A 、 Figure 8B FIG. 1 is a schematic diagram showing a dielectric structure of another common mode filter according to an embodiment of the present application. The structures of multiple dielectric structures in the same common mode filter may be the same or similar (for example, Figure 3C 、 Figure 4A 、 Figure 6A In the common-mode filter, the structures of the dielectric structural components in the same common-mode filter are similar). Alternatively, among the multiple dielectric structural components of the same common-mode filter, some dielectric structural components have the same structure, while the structures of the other dielectric structural components are different, for example Figure 8A Of the three dielectric structural members 121, 122, and 123 of the common mode filter, the dielectric structural members 122 and 123 have the same structure, while the dielectric structural member 121 has a different structure from the dielectric structural members 122 and 123. Alternatively, the structures of the multiple dielectric structural members of the same common mode filter may be different from each other. For example Figure 8B The structures of the three dielectric structural members 121, 122 and 124 of the common mode filter are different from each other. Figure 8A 、 Figure 8BTo illustrate the differences between the dielectric structural components, the routing layers are shown schematically, and the routing connections are not shown. Those skilled in the art may configure the structures of the dielectric structural components based on the layout of the routing in different routing layers within the same common-mode filter, and this application does not impose any restrictions on this.

[0083] In one possible implementation, fillers may be provided in some or all of the multiple routing layers, and the fillers include porous solid fillers and / or gas fillers. The material of the porous solid filler may include a solid material with a relatively small Dk and / or df, for example, a solid material with Dk≤10 and / or df≤0.1. Alternatively, the remaining space of the routing layer except for the space where the routing is located may be in a vacuum state. The volume of the filler in each routing layer is less than or equal to 80% of the total volume of the routing layer where the filler is located. In this way, the structural stability of the common-mode filter can be enhanced, and the differential-mode loss can also be reduced as much as possible. The smaller the volume of the filler in the routing layer, the lower the differential-mode loss of the common-mode filter.

[0084] In a possible implementation, the porous solid filler in each wiring layer may include at least one of the following: insulating foam, porous ceramic, and porous resin. The porous solid fillers in different wiring layers may be made of the same or different materials.

[0085] In a possible implementation, the porous solid filler in each wiring layer 11 can be fixedly connected to the dielectric structure 12 in contact therewith, thereby enhancing the structural stability of the common mode filter.

[0086] Since each routing connection line is connected to the ends of the two routing lines to be connected, the position of the ends of the routing lines and the obstacles between the two routing ends (dielectric structures, porous solid fillers, etc.) will have different effects on the setting of the spatial position occupied by each routing connection line, the implementation methods of the routing connection lines may include the following possible situations a, b, and c.

[0087] Possible situation a: If the space where the routing connection line is located is all gas, that is, there is no obstacle between the ends of the two routing lines connected by the routing connection line, then the routing connection line can be directly set between the routing layers where the two routing lines to be connected are located. The routing connection line can be a metal wire, a metal column, etc. For example, Figure 3C The routing layer of the common mode filter is filled with air, and the routing connection line 14 can be a metal column.

[0088] Possible situation b: If the entire spatial position where the routing connection line is located is occupied by dielectric structures and / or porous solid fillers, a metallized hole can be set in the first part of the space to be occupied by the routing connection line in the dielectric structure; a through hole can be set in the second part of the space to be occupied by the routing connection line in the porous solid filler, and a metal wire or metal column can be set in the through hole, and then the metallized hole set in the first part of the space and / or the metal wire or metal column in the through hole in the second part of the space can be used as a routing connection line connecting the ends of the two routing lines.

[0089] Possible situation c: If part of the spatial position where the routing connection line is located is occupied by a dielectric structure, a porous solid filler, etc., and the remaining spatial position is air, a metallized hole can be set in the first part of the space to be occupied by the routing connection line in the dielectric structure; a through hole can be set in the second part of the space to be occupied by the routing connection line in the porous solid filler, and a metal wire or metal column can be set in the through hole; a metal wire or metal column can be set in the third part of the space to be occupied by the routing connection line in the air, and then a metallized hole is set in the first part of the space, a metal wire or metal column in the through hole in the second part of the space, and / or a metal wire or metal column in the third part of the space as a routing connection line connecting the ends of the two routing lines.

[0090] In one possible implementation, the common-mode filter 100 may further include at least one interlayer via, each of which is used to accommodate a corresponding connector. That is, if the space required for the connector is partially or completely occupied by other components of the common-mode filter (such as a porous solid filler), the connector can be accommodated by providing an interlayer via.

[0091] In a possible implementation, the common mode filter 100 may further include a plurality of pins 81. The plurality of pins 81 may be as follows: Figure 2E-2H 、 Figure 3C As shown in FIG. 1 , the plurality of pins 81 are respectively arranged on the surfaces of the two outermost wiring layers 11 of the plurality of wiring layers 11. Alternatively, the plurality of pins 81 may also be as shown in FIG. Figures 2A-2D 、 Figure 6A The surface of any one of the two outermost routing layers 11 among the multiple routing layers 11 is shown.

[0092] Arranging the plurality of pins 81 of the common mode filter 100 on the surface of the same wiring layer can facilitate the movement of the common mode filter, and facilitate the transfer and installation of the common mode filter to the corresponding pad positions on the printed circuit board PCB.

[0093] In one possible implementation, the layout of the traces in a trace layer can be configured based on the number of traces contained in the trace layer. In a trace layer with two or more traces, at least two traces can be wound in parallel to improve the symmetry of the common-mode filter. Parallel winding of traces in the same trace layer involves winding traces in parallel in the same trace layer. Parallel-wound traces have the same phase.

[0094] Among them, for each routing in each routing layer, if the routing participates in parallel winding, the routing participating in parallel winding may be a partial or full segment of the routing. According to the winding situation, each partial routing segment of the routing may include at least one of the following segments: a first partial routing segment that is wound in parallel with all other routings participating in parallel winding, a second partial routing segment that is wound in parallel with some of all other routings participating in parallel winding, and a third partial routing segment that is not wound in parallel with other routings.

[0095] In one possible implementation, the common-mode filter 100 may further include a packaging layer for packaging the various parts of the common-mode filter 100 (including dielectric structural components, routing layers, etc.) together, and exposing each pin 81 to the outside of the common-mode filter 100 after packaging to facilitate the installation of the common-mode filter 100.

[0096] Figure 9 FIG. 1 shows a schematic structural diagram of a filtering device according to an embodiment of the present application. Figure 9 As shown, the filtering device includes the common mode filter 100 and a first printed circuit board PCB. The first printed circuit board PCB is used to carry the common mode filter 100. The pins 81 of the common mode filter 100 are fixedly connected to the corresponding pads H on the PCB.

[0097] The manner in which each pin 81 of the common mode filter 100 is fixedly connected to the corresponding pad H on the PCB may include any one of the following: wire bonding connection, welding connection, conductive adhesive connection (such as conductive silver paste, etc.).

[0098] If the pins 81 of the common mode filter 100 are Figure 9 If the common-mode filter 100 is on the surface of the same wiring layer as shown, a vacuum suction device or the like can be used to transfer the common-mode filter 100 to the PCB, ensuring that each pin 81 is positioned above the corresponding pad H. Alternatively, insulating glue can be applied to a portion of the surface of the common-mode filter 100, and the insulating glue can be used to transfer the common-mode filter 100 to the PCB.

[0099] The present application also provides a device with a filtering function, comprising: a functional device, an auxiliary device, and a second printed circuit board. The functional device includes the common-mode filter 100 described above. The auxiliary device includes an amplifier and / or a passive device. The functional device and the auxiliary device are mounted on the second printed circuit board, and the functional device and the auxiliary device are coupled to each other.

[0100] The second printed circuit board has a first surface and a second surface arranged opposite to each other, the first surface is provided with a plurality of pads, the second surface is provided with a plurality of device pins, and the pins of each functional device and each auxiliary device are fixedly connected to the corresponding pads on the first surface.

[0101] In a possible implementation, each pin may be fixedly connected to the corresponding pad on the second printed circuit board by any one of the following methods: wire bonding, welding, or conductive adhesive (such as conductive silver paste).

[0102] In one possible implementation, for the common-mode filter 100 in the functional device, if all pins 81 of the common-mode filter 100 are on the surface of the same routing layer, a vacuum suction device, such as a suction device, can be used to transfer the common-mode filter 100 to the device's printed circuit board, ensuring that all pins 81 are positioned above corresponding pads. Alternatively, insulating adhesive can be applied to a portion of the surface of the common-mode filter 100 and used to transfer the common-mode filter 100 to the device's printed circuit board.

[0103] The present application also provides a method for manufacturing a common-mode filter, which is used to manufacture the common-mode filter 100 . Figure 10A 、 Figure 10B 、 Figure 10C FIG. 1 is a schematic diagram showing a manufacturing process of a common mode filter according to an embodiment of the present application. Figure 10B In order to clearly illustrate that the parts of the common mode filter generated in different steps are different, only the parts related to the common mode filter components are shown, and the photoresist, substrate, etc. are not shown. Figure 10A shows the process of manufacturing common mode filters, Figure 10B 、 Figure 10C is based on Figure 10A Two examples of common-mode filters manufactured using the method are shown. To facilitate the description of the manufacturing process, FIG10A illustrates an example where "each routing layer includes three routing lines belonging to different coil groups." In practice, each routing layer can have at least one routing line, each of which belongs to a different coil group.

[0104] like Figure 10A As shown, the method includes:

[0105] In step S11, Figure 10A As shown in "Step S11", if the first wiring layer does not need to be filled with porous solid fillers, a metal layer and a first photoresist layer are prepared on the substrate in sequence, and the metal layer is etched according to the number of wirings in the first wiring layer and the layout of the wirings to form the first wiring layer.

[0106] Among them, if the first routing layer needs to be filled with a porous solid filler, step S11 can be: preparing a metal layer and a first photoresist layer on the substrate in sequence, and etching the metal layer according to the number of routings and the layout of the routings in the first routing layer to form each routing in the first routing layer; and further etching the first photoresist layer to form a filling space, filling the filling space with a porous solid filler to obtain a first routing layer, which includes each routing and a porous solid filler (not shown in the figure).

[0107] Among them, in the above two steps S11, if Figure 10A As shown in the top view of step S11 and the cross-sectional view corresponding to M1 (a cross-sectional view obtained by cutting the cross section perpendicular to the substrate corresponding to the line segment M1 in the top view of step S11), after completing the preparation of the first wiring layer, the remaining first photoresist layer can be retained to facilitate the subsequent preparation of dielectric structures, wiring layers, etc.

[0108] Furthermore, in order to meet the processing requirements of different routing layers, the bonding requirements between layers, etc., the process used to prepare the metal layer corresponding to each routing layer can be set according to actual needs. The preparation of each metal layer can be achieved by one or more processes such as electroplating and magnetron sputtering. The processes used to prepare each metal layer can be the same or different. For example, in step S11, a metal layer of a certain thickness can be first generated on the substrate by magnetron sputtering, and then a metal layer of a certain thickness can be generated by electroplating on the metal layer. The magnetron sputtered metal layer and the electroplated metal layer together constitute the metal layer required to form the first routing layer. In this way, the bonding force between the first metal layer and the substrate can be improved, and the preparation efficiency of the metal layer can be guaranteed.

[0109] In step S12, as Figure 10A As shown in "Step S12", a dielectric layer and a second photoresist layer are prepared on the first routing layer and the remaining first photoresist layer, and the dielectric layer is etched to form a first dielectric structure according to the layout of each routing in the first routing layer and the layout of each routing in the second routing layer to be supported by the first dielectric structure.

[0110] After completing step S12, Figure 10AAs shown in the top view of step S12, the cross-sectional view corresponding to M2 (a cross-sectional view obtained by cutting the cross-sectional view perpendicular to the substrate corresponding to the line segment M2 in the top view of step S12), and the cross-sectional view corresponding to M3 (a cross-sectional view obtained by cutting the cross-sectional view perpendicular to the substrate corresponding to the line segment M3 in the top view of step S12), the remaining second photoresist layer can be retained to facilitate the subsequent preparation of dielectric structures, routing layers, etc.

[0111] In step S13, Figure 10A As shown in "step S13", a second wiring layer is sequentially prepared on at least the first dielectric structure and the second photoresist layer. Step S13 can refer to the preparation process of the first wiring layer in step S11.

[0112] After completing step S13, Figure 10A As shown in the top view of step S13, the cross-sectional view corresponding to M4 (a cross-sectional view obtained by cutting the cross-sectional view perpendicular to the substrate corresponding to the line segment M4 in the top view of step S13), and the cross-sectional view corresponding to M5 (a cross-sectional view obtained by cutting the cross-sectional view perpendicular to the substrate corresponding to the line segment M5 in the top view of step S13), the remaining first photoresist layer can be retained to facilitate the subsequent preparation of dielectric structures, routing layers, etc.

[0113] In step S14, Figure 10A As shown in "step S14", a second dielectric structure is prepared on the second wiring layer and the remaining first photoresist layer (which may also include the first group of connectors). Step S14 can refer to the preparation process of step S12 above.

[0114] After completing step S14, Figure 10A As shown in the top view of step S14 and the cross-sectional view corresponding to M6 (a cross-sectional view obtained by cutting the cross section perpendicular to the substrate corresponding to the line segment M6 in the top view of step S14), the remaining second photoresist layer can be retained to facilitate the subsequent preparation of dielectric structures, routing layers, etc.

[0115] Then, referring to the steps of preparing the wiring layer, dielectric structure, wiring connection line and connector in the above steps S11 to S14, the remaining wiring layer, dielectric structure, wiring connection line and connector are prepared, and then all the remaining photoresist is removed to obtain the following: Figure 10A Common mode filter.

[0116] After step S11 and before completing the preparation of the common mode filter, the method may include the following steps:

[0117] Steps for preparing the wiring connection line:

[0118] Since each routing connection line is used to connect routing lines between different routing layers in the same coil group (for example, the connection between routing lines with the shortest distance between two layers), assuming that a target routing connection line is used to connect two routing lines prepared earlier and later in the same coil group, it is necessary to generate the corresponding target routing connection line before preparing the later routing line to ensure that the two routing lines prepared earlier and later can be connected together. For example, if Figure 10A The first group of routing connection lines in the first routing layer is used to connect the routing lines of different coil groups in the second routing layer. Therefore, before preparing the second routing layer, as after preparing the first dielectric structure in step S12, the second photoresist layer and / or the first dielectric structure can be etched to form holes according to the spatial position of the first group of routing connection lines (the spatial position of each routing connection line in the first group of routing connection lines can be determined based on the relative position of the "routing lines in the first routing layer" and the "routing lines in the second routing layer" belonging to the same coil group to which they are connected), and metal is filled in each hole to generate the corresponding routing connection line. Figure 10A Since the second group of routing connections in the second routing layer and the third routing layer are used to connect the routings of different coil groups, before preparing the third routing layer, such as after preparing the second dielectric structure in step S14, the second photoresist layer and / or the second dielectric structure can be etched to form holes according to the spatial position of the second group of routing connections (the spatial position of each routing connection in the second group of routing connections can be determined based on the relative position of the "routing in the second routing layer" and the "routing in the third routing layer" belonging to the same coil group to which it is connected), and metal is filled in each hole to generate a corresponding routing connection.

[0119] Connector preparation steps:

[0120] If the common mode filter includes connectors and the connectors are located between the layers of the common mode filter, it is necessary to prepare each connector during the steps of preparing the common mode filter. Since each connector is required to fix the dielectric structure prepared in the front and the dielectric structure prepared in the back together, it can be prepared according to the spatial position of the connector before the dielectric structure prepared in the back is prepared. For example, Figure 10AThe first group of connectors in the method includes four connectors, which are used to connect the first dielectric structure and the second dielectric structure. Therefore, after preparing the second wiring layer in step S13, if the second wiring layer contains a porous solid filler and there are connectors passing through the porous solid filler, it is necessary to first etch the porous solid filler to form interlayer vias, and then form the first group of connectors based on the spatial positions of the interlayer vias and the connectors. If the second wiring layer does not contain a porous solid filler, before forming the first group of connectors, it is necessary to etch the first photoresist layer of the second wiring layer to form spaces to accommodate the connectors, thereby forming the first group of connectors.

[0121] If the common-mode filter includes connectors and they are located outside the filter and not between layers, the connectors can be prepared after the dielectric components and routing layers are completed. Alternatively, different parts of the connectors can be prepared simultaneously with the preparation of the dielectric components and routing layers, depending on their spatial location.

[0122] If the common-mode filter includes a connector and part of the connector is located outside the common-mode filter and not between layers, and the remaining part is located between layers, different parts of the connector can be prepared synchronously with the preparation process of each dielectric structural component and routing layer according to the spatial position of the connector.

[0123] It should be noted that the aforementioned connectors can be prepared before the subsequent dielectric structural components of the two connected components are manufactured, and there is no specific time limit for their preparation. Similarly, the routing connectors can be prepared before the subsequent routing components of the two connected components are manufactured, and there is no specific time limit for their preparation.

[0124] After completing the above steps, the newly formed layer can be polished using chemical mechanical polishing (CMP) to ensure that the resulting layers are flat and scratch-free, thereby reducing surface roughness and removing residual surface impurities and contamination. The above layers can be prepared using suitable film processing techniques such as electroplating and sputtering, depending on the film material.

[0125] Referring to the above Figure 10A The method shown can produce Figure 10C and Figure 10B Two common mode filter examples are shown. Figure 10B The common mode filter 1001 and Figure 10C No connector is shown for the common mode filter 1002 in FIG. 1 , but both may be provided with connectors.

[0126] like Figure 10B As shown, through steps (1)-(7), a common mode filter 1001 can be prepared having three coil groups, and the same routing layer includes three routings of different coil groups. The dielectric structural components have the same structure and size, and their orthographic projections on the first routing layer are in the same area.

[0127] like Figure 10C As shown, through steps (a)-(u), a common-mode filter 1002 can be prepared. It also includes three coil groups, the first coil group including traces A1, A2, A3, and A4. The second coil group includes traces B1, B2, B3, and B4. The third coil group includes traces C1, C2, C3, and C4. The difference between common-mode filter 1002 and common-mode filter 1001 is that the space occupied by the entire device and the number of layers included are different, and the trace layer only includes traces of two coil groups (the first coil group and the second coil group) or one coil group (the third coil group).

[0128] In Example 1, let's consider a common-mode filter with three coil groups. The first coil group includes traces A1 and A2. The second coil group includes traces B1 and B2. The third coil group includes traces C1 and C2. The first trace layer can include traces A1, the second trace layer can include traces B1 and C1, the third trace layer can include traces C2, and the fourth trace layer can include traces B2 and A2.

[0129] That is, when the routing layer only includes routing of a part of the coil group, the routing layer that is also "including routing of a part of the coil group" may include: routing belonging to the same "part of the coil group" (such as Figure 10C The first routing layer and the third routing layer in Example 1 both include "routes for the first coil group and the second coil group"), routings belonging to completely different coil groups (such as the first routing layer including A1 and the third routing layer including C2 in Example 1), and routings that partially belong to the same coil group and others belong to different coil groups (such as the second routing layer including B1 and C1 and the fourth routing layer including B2 and A2 in Example 1).

[0130] It should be noted that the above process of manufacturing a common-mode filter is only a feasible example. Those skilled in the art can refer to the above example and, based on the layout of each layer of the common-mode filter, use a processing technology suitable for each layer to prepare it layer by layer. This application does not impose any restrictions on this.

[0131] Figure 11 FIG. 1 shows a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 11As shown, the electronic device may include at least one of a mobile phone, a foldable electronic device, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, an in-vehicle device, a smart home device, or a smart city device. The embodiments of the present application do not impose any particular restrictions on the specific type of the electronic device.

[0132] The electronic device may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) connector 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, among other components. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0133] In which, the common-mode filter can be set in the transmission line between the processor 110 and the display screen 194 in the above-mentioned electronic device, in the transmission line between the processor 110 and the camera 193, and / or in the transmission line between the processor 110 and the internal storage 121, so as to filter the signals between the processor 110 and the display screen 194, the signals between the processor 110 and the camera 193, and / or the signals between the processor 110 and the internal storage 121 in the transmission line.

[0134] It is understood that the structures illustrated in the embodiments of the present application do not constitute specific limitations on the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0135] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, systems, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a part for a module, program segment or instruction, and the part for the module, program segment or instruction comprises one or more executable instructions for realizing the logical function of the specification. In some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two continuous boxes can actually be performed substantially in parallel, and they can sometimes also be performed in the opposite order, depending on the function involved.

[0136] It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented by hardware that performs the corresponding function or action (such as a circuit or ASIC (Application Specific Integrated Circuit)), or can be implemented by a combination of hardware and software, such as firmware.

[0137] Although the present invention is described herein in conjunction with various embodiments, in the process of implementing the claimed invention, those skilled in the art can understand and implement other variations of the disclosed embodiments by reviewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude multiple situations. A single processor or other unit can implement several functions listed in the claims. Certain measures are recorded in different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0138] The embodiments of the present application have been described above. The above description is illustrative and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to the technology in the market, or to enable other persons skilled in the art to understand the embodiments disclosed herein.

Claims

1. A common mode filter, characterized in that: include: At least two coil groups, a plurality of wiring connecting lines, at least one dielectric structure and at least two wiring layers stacked together, Each coil group includes multiple routing lines, and each routing layer is provided with one or more routing lines belonging to different coil groups; Each routing connection line is connected to two different routing lines of the same coil group, so as to sequentially connect multiple routing lines of each coil group; Each dielectric structure is located between two adjacent routing layers, the multiple routing layers are stacked together under the action of the at least one dielectric structure, and the volume of each dielectric structure is smaller than the volume of the interlayer space between the two routing layers in contact; Each dielectric structural component includes at least one structural branch, and each structural branch is in contact with at least a routing corner of a routing line in an adjacent routing layer; all structural branches of the same dielectric structural component are fixedly connected together.

2. The common mode filter according to claim 1, wherein The cross-sectional shape of each structural branch perpendicular to the routing layer includes any one of the following: rectangle, trapezoid, parallelogram, and a combination of at least two of the rectangle, trapezoid and parallelogram.

3. The common mode filter according to claim 1 or 2, characterized in that The shape of the orthographic projection of each dielectric structural component on any routing layer includes any one of the following: a tic-tac-toe shape, a criss-cross shape, a square shape, a rectangle, an X-shape, a circle, an annulus, an I-shape, a cross shape, and a combination of at least two of the tic-tac-toe shape, the criss-cross shape, the square shape, the rectangle, the X-shape, the circle, the annulus, the I-shape, and the cross shape.

4. The common mode filter according to claim 1 or 2, characterized in that: Fillers are further provided in some or all of the multiple routing layers, and the fillers include porous solid fillers and / or gas fillers.

5. The common mode filter according to claim 4, characterized in that The volume of the filler in each routing layer is less than or equal to 80% of the total volume of the routing layer where the filler is located.

6. The common mode filter according to claim 4, characterized in that The porous solid filler in each routing layer includes at least one of the following: insulating foam, porous ceramic, and porous resin.

7. The common mode filter according to claim 1 or 2, characterized in that: The common mode filter further comprises at least one connecting member, each connecting member being used to fixedly connect any two dielectric structural members together.

8. The common mode filter according to claim 7, wherein: The common mode filter further includes at least one interlayer via hole, and each interlayer via hole is used to accommodate a corresponding connecting member.

9. The common mode filter according to claim 4, wherein: The porous solid filler in each wiring layer is fixedly connected to the contacting dielectric structure.

10. The common mode filter according to claim 1 or 2, characterized in that: The common mode filter further comprises: A plurality of pins are arranged on the surface of any one of the two outermost routing layers among the plurality of routing layers.

11. The common mode filter according to claim 1 or 2, characterized in that: The volume of each dielectric structure is less than or equal to 80% of the volume of the interlayer space between the two wiring layers it contacts; and / or The volume of each dielectric structure is less than or equal to 80% of the volume of the wiring layer it contacts.

12. The common mode filter according to claim 1 or 2, characterized in that: In a routing layer with 2 or more routing lines, at least two routing lines are routed in parallel.

13. A filtering device, characterized in that: include: The common mode filter according to any one of claims 1 to 12; A first printed circuit board, used for carrying the common mode filter; Wherein, each pin of the common mode filter is fixedly connected to the corresponding pad on the first printed circuit board.

14. The device according to claim 13, characterized in that The manner in which each pin of the common mode filter is fixedly connected to the corresponding pad on the first printed circuit board includes any one of the following: wire bonding connection, welding connection, and conductive adhesive connection.

15. The device according to claim 13 or 14, characterized in that Insulating glue is provided on part or all of the surface of the common-mode filter, so that the common-mode filter can be transferred to a corresponding position of the first printed circuit board by using the insulating glue.

16. A device with a filtering function, characterized in that: The device includes: a functional device, an auxiliary device, and a second printed circuit board, wherein the functional device and the auxiliary device are mounted on the second printed circuit board, and the functional device and the auxiliary device are coupled to each other; The functional device includes the common mode filter according to any one of claims 1 to 12, and the auxiliary device includes an amplifier and / or a passive device.

17. An electronic device, characterized in that: include: The common mode filter according to any one of claims 1 to 12, or The filtering device according to any one of claims 13 to 15, or The device with filtering function as claimed in claim 16.

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