Wafer debonding apparatus

Abstract

The application relates to the technical field of wafers, in particular to a wafer debonding device which comprises a debonding machine body table, a debonding head, a debonding seat and a wafer, and further comprises a feeding seat and a separating seat, wherein the feeding seat and the separating seat are fixed on the upper side of the debonding machine body table; a rotating disc is arranged on the upper side of the debonding machine body table, and a double driving assembly is arranged between the rotating disc and the debonding machine body table; three connecting plates are fixed on the outer side of the rotating disc; three carrying rings are fixed on one side of the connecting plates respectively, and the debonding seat, the feeding seat and the separating seat can be arranged on the inner side of the carrying rings; and a sliding frame can slide on the upper side of the debonding machine body table. The wafer debonding device has the functions of automatic material replacement, continuous processing, automatic discharging, automatic classification and automatic stacking through the arrangement of the feeding seat, the separating seat, the rotating disc, the connecting plates, the carrying rings, the sliding frame, a positioning frame and a fixing cover.

Description

Technical Field

[0001] This invention relates to the field of wafer technology, and more particularly to a wafer debonding device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Domestic wafer production lines mainly produce 8-inch and 12-inch wafers.

[0003] Debonding is an important step in wafer fabrication, mainly used to separate bonded silicon wafers from glass substrates. Current debonding machines use a debonding head to emit a laser, which is then used to separate the silicon wafer from the glass substrate.

[0004] While existing debonding machines can separate silicon wafers from glass plates, after separation, the silicon wafers and glass plates need to be manually removed and sorted before the wafers to be processed are placed on the debonding seat of the debonding machine for further separation and processing. This material changing method is slow and results in low work efficiency. To address this issue, we propose a wafer debonding device to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing debonding machines, which, although capable of separating silicon wafers from glass plates, require manual removal and sorting of the silicon wafers and glass plates after separation, and then place the wafers to be processed on the debonding seat of the debonding machine before further separation and processing can proceed. This material changing method is slow and results in low work efficiency. Therefore, this invention proposes a wafer debonding device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Design a wafer debonding apparatus, including: a debonding stage, a debonding head, a debonding holder, and a wafer, and further including:

[0008] The feeding seat and the separating seat are both fixed on the upper side of the debonding machine body table;

[0009] A rotary disk is located on the upper side of the debonding machine stage, and a dual drive assembly is provided between the rotary disk and the debonding machine stage.

[0010] Three connecting plates, all of which are fixed to the outside of the rotating disk;

[0011] Three transport rings are provided, each of which is fixed to one side of the connecting plate. The unbonding seat, the feeding seat, and the separating seat can all be located inside the transport rings.

[0012] A sliding frame is slidable on the upper side of the debonding machine platform. An automatic sliding component is provided on one side of the sliding frame, and a material picking and placing component is provided on the other side of the sliding frame. A sorting and storage component is provided on the upper side of the debonding machine platform.

[0013] Preferably, a plurality of evenly distributed positioning frames are fixed on the outer side of the feeding seat.

[0014] Preferably, the dual-drive assembly includes a fixed cover, which is fixed to the upper side of the debonding machine platform. The fixed cover has a through hole on its upper side. An A servo motor is fixedly installed on the inner top side of the fixed cover. The A servo motor needs to be connected to an external drive controller and power supply via wires. A square rod is fixedly installed on the shaft end of the A servo motor. A guide sleeve is slidably installed on the outer side of the square rod. A square hole is provided on one side of the rotating disk. The guide sleeve is fixed inside the square hole. A support ring frame is fixedly installed on the upper side of the fixed cover. A plurality of mounting holes are provided on the upper side of the support ring frame. An A electric telescopic push rod is fixedly installed inside each mounting hole. The A electric telescopic push rod needs to be connected to an external power supply via wires for switching. A rotating ring is rotatably installed on the lower side of the rotating disk. The shaft ends of the A electric telescopic push rods are all fixed to the lower side of the rotating ring.

[0015] Preferably, the sliding frame has a Z-shaped structure.

[0016] Preferably, the automatic sliding assembly includes a B servo motor, which is fixed on the upper side of the debonding machine platform. The B servo motor needs to be externally connected to a drive controller and power supply via wires. A threaded rod is fixedly provided at the shaft end of the B servo motor. Several connecting seats are rotatably provided on the outer side of the threaded rod. All connecting seats are fixed on the upper side of the debonding machine platform. A threaded hole is provided on one side of the sliding frame, and the threaded rod is threadedly connected to the inner side of the threaded hole.

[0017] Preferably, the material handling assembly includes a square box, a through hole on the upper side of the sliding frame, the square box being fixed inside the through hole, a connection hole on the upper side of the square box, and a B-type electric telescopic push rod fixed inside the connection hole. The B-type electric telescopic push rod needs to be connected to an external power source and switch via a wire. A lifting column is fixed to the shaft end of the B-type electric telescopic push rod, and the lifting column can slide inside the square box. A material handling frame is fixed to the lower side of the lifting column, and a plurality of material handling holes are provided on the upper side of the material handling frame. A vacuum suction cup is fixed inside each of the material handling holes, and each vacuum suction cup needs to be connected to a vacuum generator via an air pipe.

[0018] Preferably, the sorting and storage assembly includes a fixed column, which is fixed to the upper side of the debonding machine platform. A storage plate is slidably provided on the outer side of the fixed column. A drive hole is provided on the upper side of the storage plate. A C-type electric telescopic push rod is fixedly provided inside the drive hole. The C-type electric telescopic push rod needs to be connected to an external power source and switch through a wire. The shaft end of the C-type electric telescopic push rod is fixed to the upper side of the debonding machine platform.

[0019] The wafer debonding device proposed in this invention has the following advantages:

[0020] (1) By setting up a feeding seat, a separating seat, a rotating disk, a connecting plate, a conveying ring, a positioning frame, a fixed cover, an A servo motor, a square rod, a guide sleeve, a support ring frame, an A electric telescopic push rod, and a rotating ring, it has the functions of automatic material changing and continuous processing. It can perform automatic and efficient material changing, so that the equipment does not need to wait and can perform continuous separation processing, which can greatly improve the processing efficiency.

[0021] (2) By setting up a sliding frame, B servo motor, threaded rod, connecting seat, square box, B electric telescopic push rod, lifting column, picking frame, vacuum suction cup, fixed column, storage plate, and C electric telescopic push rod, it has the functions of automatic feeding, automatic sorting and automatic stacking. It can automatically sort and place the separated materials, which is convenient for subsequent use and can save manpower. Attached Figure Description

[0022] Figure 1 This is a front perspective view of a wafer debonding device proposed in this invention.

[0023] Figure 2 This is a front-section three-dimensional structural diagram of a wafer debonding device proposed in this invention;

[0024] Figure 3 The invention proposed Figure 2 A magnified schematic diagram of a portion of area A in the middle;

[0025] Figure 4 This is a front-section axonometric view of the wafer debonding device proposed in this invention.

[0026] Figure 5 This is a three-dimensional back view of a wafer debonding device proposed in this invention.

[0027] In the diagram: 1 Debonding machine platform, 2 Debonding head, 3 Debonding seat, 4 Wafer, 5 Feeding seat, 6 Separating seat, 7 Rotary disk, 8 Connecting plate, 9 Transport ring, 10 Sliding frame, 11 Positioning frame, 12 Fixing cover, 13A Servo motor, 14 Square rod, 15 Guide sleeve, 16 Support ring frame, 17A Electric telescopic push rod, 18 Rotating ring, 19B Servo motor, 20 Threaded rod, 21 Connecting seat, 22 Square box, 23B Electric telescopic push rod, 24 Lifting column, 25 Picking rack, 26 Vacuum suction cup, 27 Fixing column, 28 Storage plate, 29C Electric telescopic push rod. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0029] Reference Figure 1-5 A wafer debonding apparatus includes: a debonding stage 1, a debonding head 2, a debonding holder 3, and a wafer 4, and further includes:

[0030] The feeding seat 5 and the separating seat 6 are both fixed on the upper side of the debonding machine platform 1. Several evenly distributed positioning frames 11 are fixed on the outer side of the feeding seat 5 to give it a positioning function, which can facilitate the placement of the wafer 4.

[0031] A rotating disk 7 is located on the upper side of the debonding machine platform 1. A dual drive assembly is provided between the rotating disk 7 and the debonding machine platform 1. The dual drive assembly includes a fixed cover 12, which is fixed on the upper side of the debonding machine platform 1. The fixed cover 12 has a through hole on its upper side. An A servo motor 13 is fixed on the inner side of the top of the fixed cover 12. The A servo motor 13 needs to be connected to an external drive controller and power supply through wires. A square rod 14 is fixed on the shaft end of the A servo motor 13. A guide sleeve 15 is slidably provided on the outer side of the square rod 14. A square hole is provided on one side of the rotating disk 7. The guide sleeve 15 is fixed on the inner side of the square hole. A support ring frame 16 is fixed on the upper side of the fixed cover 12. Several mounting holes are provided on the upper side of the support ring frame 16. An A electric telescopic push rod 17 is fixed on the inner side of each mounting hole. The A electric telescopic push rod 17 needs to be connected to an external power supply through wires for switching. A rotating ring 18 is rotatably provided on the lower side of the rotating disk 7. The shaft ends of the A electric telescopic push rod 17 are all fixed on the lower side of the rotating ring 18.

[0032] Three connecting plates 8 are fixed to the outside of the rotating disk 7;

[0033] Three transport rings 9 are fixed to one side of the connecting plate 8. The debonding seat 3, the feeding seat 5, and the separation seat 6 can all be located inside the transport rings 9, enabling automatic material changing and continuous processing. This allows for automatic and efficient material changing, eliminating waiting time and enabling continuous separation processing, significantly improving processing efficiency. During separation, the debonding head 2 emits a laser to separate the wafer 4 from the debonding seat 3. In use, the wafer 4 to be processed can be placed on the feeding seat 5, where the positioning frame 11 provides positioning. After placing the wafer 4 on the feeding seat 5, the electric telescopic push rod 1 can be controlled. When the material on the debonding seat 3 and the feeding seat 5 is extended, the material on both the debonding seat 3 and the feeding seat 5 will be lifted by the transport ring 9. Then, the A servo motor 13 is controlled to rotate at a certain angle. At this time, the square rod 14, guide sleeve 15, rotating disk 7, connecting plate 8, and transport ring 9 will rotate at a certain angle along with the motor shaft of the A servo motor 13. Then, the A electric telescopic push rod 17 is controlled to retract. At this time, the material on the feeding seat 5 will be automatically transported to the debonding seat 3, and the material on the debonding seat 3 will be automatically transported to the separating seat 6. Then, the material on the debonding seat 3 can continue to be processed, thereby realizing automatic material changing and continuous processing, which can greatly improve processing efficiency.

[0034] The sliding frame 10 has a Z-shaped structure and can slide on the upper side of the debonding machine platform 1. An automatic sliding assembly is provided on one side of the sliding frame 10. The automatic sliding assembly includes a B servo motor 19, which is fixed on the upper side of the debonding machine platform 1. The B servo motor 19 needs to be connected to an external drive controller and power supply through wires. A threaded rod 20 is fixed on the shaft end of the B servo motor 19. Several connecting seats 21 are rotatably provided on the outside of the threaded rod 20. All connecting seats 21 are fixed on the upper side of the debonding machine platform 1. A threaded hole is provided on one side of the sliding frame 10, and the threaded rod 20 is connected to the inside of the threaded hole through a thread.

[0035] A material handling assembly is provided on one side of the sliding frame 10. The material handling assembly includes a square box 22. A through hole is provided on the upper side of the sliding frame 10. The square box 22 is fixed inside the through hole. A connection hole is provided on the upper side of the square box 22. An electric telescopic push rod 23 is fixed inside the connection hole. The electric telescopic push rod 23 needs to be connected to an external power source and switch through a wire. A lifting column 24 is fixed at the shaft end of the electric telescopic push rod 23. The lifting column 24 can slide inside the square box 22. A material handling frame 25 is fixed on the lower side of the lifting column 24. Several material handling holes are provided on the upper side of the material handling frame 25. A vacuum suction cup 26 is fixed inside each material handling hole. The vacuum suction cup 26 needs to be connected to a vacuum generator through an air pipe.

[0036] The debonding machine platform 1 has a sorting and storage assembly on its upper side. This assembly includes a fixing column 27, which is fixed to the upper side of the debonding machine platform 1. A storage plate 28 is slidably mounted on the outer side of the fixing column 27. A drive hole is located on the upper side of the storage plate 28, and a C-type electric telescopic push rod 29 is fixed inside the drive hole. The C-type electric telescopic push rod 29 requires an external power supply and switch via wires. The shaft end of the C-type electric telescopic push rod 29 is fixed to the upper side of the debonding machine platform 1, enabling it to automatically unload, sort, and stack materials. The system automatically sorts and places the separated materials for easy subsequent use, saving manpower. When the material change is complete, the materials separated by the debonding head 2 on the debonding seat 3 are automatically transported to the separation seat 6. At this time, the wafer 4 will be separated into a form with a glass plate on top and a silicon wafer on the bottom. Then, the electric telescopic push rod 23 is extended. When the electric telescopic push rod 23 extends, it can drive the lifting column 24, the material picker 25, and the vacuum chuck 26 to descend together, so that the vacuum chuck 26 can approach the glass plate. When the vacuum chuck 26 contacts the glass plate, the material picker 25 will be able to move towards the glass plate. When lifting the glass plate, the vacuum generator can be turned on to allow the vacuum suction cup 26 to adhere to the glass plate. Then, the B electric telescopic push rod 23 can be controlled to retract, at which point the glass plate will be lifted. Then, the B servo motor 19 can be controlled to rotate, which in turn drives the threaded rod 20 to rotate. When the threaded rod 20 rotates, the sliding frame 10 can be moved automatically, thereby moving the glass plate above the storage plate 28. At this time, the B electric telescopic push rod 23 can be controlled to extend, causing the picking rack 25 to descend and approach the storage plate 28. At this time, the C electric telescopic push rod can also be controlled. When rod 29 extends, the storage plate 28 rises and approaches the picking rack 25, thus shortening the distance between the material and the picking rack 25 and preventing the material from being broken. When the distance between the material and the storage plate 28 is appropriate, the electric telescopic push rods B and C can be stopped, and then the vacuum generator can be turned off. The material can then be placed on the storage plate 28. Then, using the same principle, the silicon wafers on the separating seat 6 can be placed on another part of the storage plate 28, thus completing automatic sorting and automatic unloading, which is convenient for use.

[0037] It should be noted that:

[0038] The following components mentioned in this application—servo motor 13, electric telescopic push rod 17, servo motor 19, electric telescopic push rod 23, vacuum suction cup 26, and electric telescopic push rod 29—are all prior art and will not be described in detail here.

[0039] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer debonding device, comprising: The debonding stage (1), debonding head (2), debonding seat (3), and wafer (4) are characterized in that they further include: Feeding seat (5) and separating seat (6) are both fixed on the upper side of the debonding machine body (1); A rotating disk (7) is located on the upper side of the debonding machine stage (1), and a dual drive assembly is provided between the rotating disk (7) and the debonding machine stage (1). Three connecting plates (8) are fixed to the outside of the rotating disk (7); Three transport rings (9) are fixed on one side of the connecting plate (8), and the unbonding seat (3), the feeding seat (5), and the separating seat (6) can all be located inside the transport rings (9); A sliding frame (10) is slidable on the upper side of the debonding machine platform (1). An automatic sliding component is provided on one side of the sliding frame (10), and a material picking and placing component is provided on one side of the sliding frame (10). A sorting and storage component is provided on the upper side of the debonding machine platform (1). The dual drive assembly includes a fixed cover (12), which is fixed to the upper side of the unbonding machine platform (1). The fixed cover (12) has a through hole on its upper side. An A servo motor (13) is fixedly installed on the inner side of the top of the fixed cover (12). The A servo motor (13) needs to be connected to an external drive controller and power supply through wires. A square rod (14) is fixedly installed on the shaft end of the A servo motor (13). A guide sleeve (15) is slidably installed on the outer side of the square rod (14). The rotating disk (7) has a side A square hole is provided, and the guide sleeve (15) is fixed inside the square hole. A support ring frame (16) is fixed on the upper side of the fixed cover (12). A number of mounting holes are provided on the upper side of the support ring frame (16). An electric telescopic push rod (17) is fixed inside each mounting hole. The electric telescopic push rod (17) needs to be connected to an external power source via a wire to be switched on and off. A rotating ring (18) is rotatably provided on the lower side of the rotating disk (7). The shaft end of the electric telescopic push rod (17) is fixed on the lower side of the rotating ring (18).

2. The wafer debonding apparatus according to claim 1, characterized in that, The material feeding seat (5) is fixed with several evenly distributed positioning frames (11) on its outer side.

3. The wafer debonding apparatus according to claim 1, characterized in that, The sliding frame (10) has a Z-shaped structure.

4. The wafer debonding apparatus according to claim 1, characterized in that, The automatic sliding assembly includes a B servo motor (19), which is fixed on the upper side of the debonding machine platform (1). The B servo motor (19) needs to be connected to an external drive controller and power supply through wires. A threaded rod (20) is fixedly provided on the shaft end of the B servo motor (19). Several connecting seats (21) are rotatably provided on the outer side of the threaded rod (20). The connecting seats (21) are all fixed on the upper side of the debonding machine platform (1). A threaded hole is provided on one side of the sliding frame (10). The threaded rod (20) is connected to the inner side of the threaded hole through a thread.

5. The wafer debonding apparatus according to claim 1, characterized in that, The material handling assembly includes a square box (22), a through hole on the upper side of the sliding frame (10), the square box (22) is fixed inside the through hole, a connection hole on the upper side of the square box (22), a B electric telescopic push rod (23) is fixed inside the connection hole, the B electric telescopic push rod (23) needs to be connected to an external power source and switch through a wire, a lifting column (24) is fixed at the shaft end of the B electric telescopic push rod (23), the lifting column (24) can slide inside the square box (22), a material handling rack (25) is fixed at the lower side of the lifting column (24), a number of material handling holes are provided on the upper side of the material handling rack (25), a vacuum suction cup (26) is fixed inside the material handling hole, and the vacuum suction cup (26) needs to be connected to a vacuum generator through an air pipe.

6. The wafer debonding apparatus according to claim 1, characterized in that, The sorting and storage assembly includes a fixed column (27), which is fixed on the upper side of the debonding machine platform (1). A storage plate (28) is slidably provided on the outer side of the fixed column (27). A drive hole is provided on the upper side of the storage plate (28). A C-type electric telescopic push rod (29) is fixed on the inner side of the drive hole. The C-type electric telescopic push rod (29) needs to be connected to an external power supply and switch through a wire. The shaft end of the C-type electric telescopic push rod (29) is fixed on the upper side of the debonding machine platform (1).

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