Light emitting device package

Abstract

A light emitting device package includes a frame, a first lead frame spaced apart from the frame by a specified distance, a second lead frame spaced apart from the frame by a specified distance, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices disposed on the frame to be exposed through the first cavity, wherein the body includes a reflection portion disposed inside the first cavity to surround at least one of the light emitting devices. The light emitting device package of the present application can prevent deformation of a molding portion disposed in the first cavity, thereby preventing damage to a wire caused by the deformation of the molding portion, by providing the reflection portion.

Description

[0001] This application is a divisional of the application patent application No. 201710188302.X, the title of which is "Light emitting device package".

[0002] Cross Reference to Related Applications

[0003] This application claims priority to Korean Patent Application Nos. 10-2016-0036091, 10-2016-0036096 and 10-2016-0036100, filed in Korea on March 25, 2016, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0004] Embodiments relate to a light emitting device package and a lighting apparatus having the same. BACKGROUND

[0005] A light emitting diode includes a P-N junction diode having a characteristic of converting electrical energy into light energy. A light emitting device can be manufactured using a compound semiconductor belonging to Group III and Group V of the periodic table. The light emitting device is capable of generating various colors by adjusting a composition ratio of the compound semiconductor.

[0006] When a forward voltage is applied to the light emitting device, electrons of the N layer combine with holes of the P layer so that energy corresponding to an energy gap between a conduction band and a valence band can be generated. The energy is generated mainly in the form of heat or light. In the case of the light emitting device, the energy is generated in the form of light.

[0007] For example, a nitride semiconductor exhibits excellent thermal stability and a wide band gap energy, so that the nitride semiconductor has been attracting attention in the fields of optical devices and high power electronic devices. In particular, a blue light emitting device, a green light emitting device, an ultraviolet (UV) light emitting device, etc. using the nitride semiconductor are commercialized and widely used.

[0008] Recently, as the luminance of a light emitting diode has been significantly improved, the light emitting device has been applied to various apparatuses such as a backlight unit of a liquid crystal display, an electronic sign, an indicator, and a home appliance. SUMMARY

[0009] Embodiments provide a light emitting device package capable of improving light extraction efficiency and a lighting apparatus having the same.

[0010] Embodiments provide a light emitting device package capable of improving coupling force between members and a lighting apparatus having the same.

[0011] Embodiments provide a chip on board (COB) light emitting device package having a stable structure and a lighting apparatus having the same.

[0012] According to an embodiment, a light emitting device package includes a frame, a first lead frame spaced apart from the frame by a specified distance, a second lead frame spaced apart from the frame by a specified distance, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices disposed on the frame to be exposed through the first cavity, wherein the body includes a reflection portion disposed inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency. According to an embodiment, deformation of the light emitting device package caused by shrinkage and expansion of the light emitting device package can be prevented by the reflection portion. According to an embodiment, deformation of a molding portion disposed in the first cavity caused by shrinkage and expansion of the molding portion can be prevented by the reflection portion. In other words, according to an embodiment, deformation of the molding portion can be prevented, thereby preventing damage to the electric wires caused by the deformation of the molding portion.

[0013] According to an embodiment, a lighting apparatus can include a light emitting device package.

[0014] As described above, according to the light emitting device package of an embodiment, deformation of the light emitting device package caused by shrinkage and expansion of the light emitting device package can be prevented by the reflection portion extending across a central region of a cavity in which the light emitting devices are mounted.

[0015] According to an embodiment, deformation of a molding portion disposed in the first cavity caused by shrinkage and expansion of the molding portion can be prevented by the reflection portion extending across a central region of a cavity in which the light emitting devices are mounted. In other words, according to an embodiment, deformation of the molding portion can be prevented, thereby preventing damage to the electric wires caused by the deformation of the molding portion.

[0016] According to an embodiment, when a stepped portion is disposed on a top surface of the heat spreader, a coupling force between the heat spreader and the body can be improved, and external moisture penetration can be prevented due to the stepped structure.

[0017] According to an embodiment, a stepped portion is disposed on lower portions of the first and second lead frames and is supported by the molding frame to prevent deformation of the first and second lead frames. In addition, reliability of an injection molding process of the body in which the connection portions and the pads are exposed from the body through the cavity can be improved. Furthermore, external moisture penetration can be prevented due to the stepped structure formed on the lower portions of the first and second lead frames.

[0018] According to an embodiment, a flexure structure is disposed at edges of the first and second lead frames to not only improve a coupling force with the body but also prevent breakage of a peripheral portion of a spacer disposed between the first and second frames.

[0019] According to an embodiment, a protection portion covering an outer portion of the pad is included to protect the pad and to increase a coupling force between the body and the first lead frame and the second lead frame. Also, according to an embodiment, at least one through-hole is formed through the pad to increase the coupling force between the body and the first lead frame and the second lead frame. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present disclosure will become more fully understood from the detailed description given herein below and the accompanying drawings, given by way of illustration only, and thus, are not limitative of the present disclosure, and wherein:

[0021] Figure 1 is a perspective view illustrating a light emitting device package according to an embodiment;

[0022] Figure 2 is a cross-sectional view illustrating a light emitting device package according to an embodiment;

[0023] Figure 3 is a plan view illustrating a light emitting device package according to an embodiment;

[0024] Figure 4 is a plan view illustrating a reflection portion according to an embodiment;

[0025] Figure 5 is a plan view illustrating a reflection portion and a first coupling portion according to an embodiment;

[0026] Figure 6 is a plan view illustrating a frame coupled to a body and an upper portion of a first lead frame and a second lead frame according to an embodiment;

[0027] Figure 7 is a plan view illustrating a frame and an upper portion of a first lead frame and a second lead frame according to an embodiment;

[0028] Figure 8 is a plan view illustrating a frame coupled to a body and a lower portion of a first lead frame and a second lead frame according to an embodiment;

[0029] Figure 9 is a plan view illustrating a frame and a lower portion of a first lead frame and a second lead frame according to an embodiment;

[0030] Figure 10 is a view illustrating a first spacer and a second spacer between a frame and a first lead frame and a second lead frame according to an embodiment;

[0031] Figure 11 is a view illustrating a first pad area according to an embodiment;

[0032] Figure 12 is a view illustrating a second pad area according to an embodiment;

[0033] Figure 13 is a perspective view illustrating a light emitting device package according to another embodiment; and

[0034] Figure 14 and Figure 15 is a plan view illustrating a light emitting device package according to still another embodiment. DETAILED DESCRIPTION

[0035] Variations, modifications, and combinations of embodiments are possible, and the disclosure is not limited to the embodiments to be described below.

[0036] Although things described in a certain embodiment are not described in other embodiments, it is understood that other embodiments can be related to other embodiments unless they are explicitly described otherwise or constrained by other embodiments.

[0037] For example, if a feature is described in a certain embodiment for construction A, and a feature is described in another embodiment for construction B, it is understood that even if an embodiment in which construction A and construction B are combined is not explicitly described, it falls within the scope of the disclosure unless otherwise specified or constrained.

[0038] Hereinafter, embodiments of the disclosure will be described in detail in order to accomplish the above object of the disclosure.

[0039] In the following description of the disclosure, it will be understood that when a certain element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the element, or one or more other elements can be present therebetween. Also, if an element is expressed in connection with the term "on" or "under", the direction of the element includes the lower direction of the element as well as the upper direction of the element.

[0040] A semiconductor device can include various electronic devices such as a light emitting device, a light receiving device, or the like. The light emitting device and the light receiving device can include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer.

[0041] According to an embodiment, the semiconductor device can be a light emitting device.

[0042] A light emitting device emits light by recombination of electrons and holes, and the wavelength of light is determined depending on the inherent energy band gap of the material. Thus, the emitted light can be varied with the composition of the material.

[0043] Figure 1 is a perspective view illustrating a light emitting device package according to an embodiment.Figure 2 is a cross-sectional view illustrating a light emitting device package according to an embodiment. Figure 3 is a plan view illustrating a light emitting device package according to an embodiment. Figure 4 is a plan view illustrating a reflection part according to an embodiment. Figure 5 is a plan view illustrating a reflection part and a first coupling part according to an embodiment.

[0044] As shown in Figures 1 to 5 , according to an embodiment, the light emitting device package 100 can include a frame (heat sink) 110, a first lead frame 120, a second lead frame 130, a body 170, a protection device 160, and a plurality of light emitting devices 150. According to an embodiment, in the light emitting device package 100, the protection device 160 and the light emitting devices 150 can be mounted on the frame 110. The first lead frame 120 and the second lead frame 130 can be spaced apart from the frame 110 by a specified distance. According to an embodiment, the light emitting device package 100 can be a chip on board (COB) light emitting device package. For example, according to an embodiment, the light emitting device package 100 can be directly die-bonded to a substrate and electrically connected with the substrate through wires, but embodiments are not limited thereto.

[0045] The body 170 can include at least one of a transmissive material, a reflective material, and an insulating material. The body 170 can include a material having a higher reflectivity than transmissivity with respect to light emitted from the light emitting devices 150. The body 170 can include a resin-based insulating material. For example, the body 170 can include at least one of a resin material such as polyphthalamide (PPA), an epoxy resin, or a silicone gel material, silicon (Si), a metal material, a photo sensitive glass (PSG), sapphire (Al2O3), and a printed circuit board (PCB). The body 170 can include four corners.

[0046] The body 170 can include a first corner 170a and a second corner 170b facing each other in a first direction X-X' and a third corner 170c and a fourth corner 170d facing each other in a second direction Y-Y' perpendicular to the first direction X-X'. The first pad 121 of the first lead frame 120 can be exposed through the first corner 170a. The second pad 131 of the second lead frame 130 can be exposed through the second corner 170b. The first corner 170a and the second corner 170b can expose top surfaces of the first pad 121 and the second pad 131. End portions of the first corner 170a and the second corner 170b can cover edges of the first pad 121 and the second pad 131, respectively. For example, the end portions of the first corner 170a and the second corner 170b can be disposed outwardly from the first pad 121 and the second pad 131, respectively. When a substrate (not shown) is coupled to the light emitting device package 100, the third corner 170c and the fourth corner 170d can be screw-engaged. The third corner 170c and the fourth corner 170d can be formed in a curved structure such that a screw can be coupled to the third corner 170c and the fourth corner 170d, but embodiments are not limited thereto. For example, the third corner 170c and the fourth corner 170d can be formed in a curved structure having a concave outer portion.

[0047] The body 170 can be coupled to the frame 110 and the first and second lead frames 120 and 130. The body 170 can include first and second cavities 171a and 171b that expose portions of the top surface of the frame 110 and the first and second lead frames 120 and 130. The first cavity 171a can extend from a central region of the body 170. The first cavity 171a can be disposed in a region where the light emitting device 150 is mounted. The first cavity 171a can have a circular shape when viewed from a top view, but embodiments are not limited thereto. For example, the first cavity 171a can have an elliptical shape or at least a three-sided polygonal shape when viewed from a top view. The second cavity 171b can be spaced apart from the first cavity 171a by a specified distance. The second cavity 171b can be adjacent to one lateral side of the body 170 and can be disposed between one lateral side of the body 170 and the first cavity 171a. The second cavity 171b can be spaced apart from the lateral side of the body 170 by a specified distance. The distance between the second cavity 171b and the first cavity 171a can be 0.1 mm or more. The distance between the second cavity 171b and the lateral side of the body 170 can be 0.1 mm or more. According to embodiments, when the distance between the lateral side of the body 170 and the second cavity 171b is 0.1 mm or more and the distance between the first cavity 171a and the second cavity 171b is 0.1 mm or more, reliability can be improved when the first and second cavities 171a and 171b are implemented. For example, when the distance between the lateral side of the body 170 and the second cavity 171b or the distance between the first and second cavities 171a and 171b is less than 0.1 mm, defects can be caused in the injection molding process of the first and second cavities 171a and 171b. The second cavity 171b can be disposed between the first and second corners 170a and 170b, but embodiments are not limited thereto. The second cavity 171b can be disposed in a region where the protection device 160 is mounted. The second cavity 171b can have a smaller diameter than the first cavity 171a. For example, the second cavity 171b can have a more narrow bottom surface area than the first cavity 171a. The area of the second cavity 171b can be 10-25% of the area of the first cavity 171a. The more narrow width 171W of the second cavity 171b can be 2-6% of the entire width of the light emitting device package 100. When the more narrow width 171W of the second cavity 171b is less than 2% of the entire width of the light emitting device package 100, the size of the protection device 160 is limited, such that the stability of the light emitting device package 100 can be degraded.When the narrower width 171W of the second cavity 171 exceeds 6% of the entire width of the light emitting device package 100, the light emitting device package 100 can be limited in application to various fields since the size of the light emitting device package 100 can be increased except for a light emitting area in which light is emitted. For example, the narrower width 171W of the second cavity 171b can be in the range of 0.150mm to 0.450mm.

[0048] The body 170 can include four outer portions each of which is disposed between two adjacent corners among the first to fourth corners 170a to 170d. The four outer portions can be flat planes. According to an embodiment, portions of the frame 110 and portions of the first and second lead frames 120 and 130 can be exposed through the outer portions. For example, the first protrusion 110p can extend from the frame 110 through the outer portion of the body 170. In such a case, the first protrusion 110p can be formed in a unit package cutting process after a process of injection molding of the body 170 is performed. In other words, the first protrusion 110p can be a joint portion that joins adjacent frames to each other before a unit package cutting process is performed. The second protrusion 120p can be disposed at the outer portion of the body 170 while extending from the first lead frame 120. In such a case, the second protrusion 120p can be formed in a unit package cutting process after the process of injection molding of the body 170 is performed. In other words, the second protrusion 120p can be a joint portion that joins adjacent first lead frames to each other before the unit package cutting process is performed. The third protrusion 130p can be disposed at the outer portion of the body 170 while extending from the second lead frame 130. In such a case, the third protrusion 130p can be formed in a unit cutting process after the process of injection molding of the body 170 is performed. In other words, the third protrusion 130p can be a connection portion that connects adjacent second lead frames to each other before a unit package cutting process is performed.

[0049] The body 170 can include a first spacer 175 and a second spacer 176. The first spacer 175 can be interposed between the frame 110 and the first lead frame 120. The second spacer 176 can be interposed between the frame 110 and the second lead frame 130.

[0050] The body 170 can include a first coupling portion 173 and a second coupling portion 174. The first coupling portion 173 and the second coupling portion 174 can be disposed on the frame 110. The first coupling portion 173 and the second coupling portion 174 can increase a contact area between the body 170 and the frame 110. The first coupling portion 173 and the second coupling portion 174 can improve a coupling force between the body 170 and the frame 110. The first coupling portion 173 and the second coupling portion 174 can be disposed on a top surface of the frame 110 on which the light emitting device package 150 is mounted. The first coupling portion 173 and the second coupling portion 174 can be disposed on a stepped portion disposed on the top surface of the frame 110. The stepped portion can be a groove structure disposed in the top surface of the frame 110 and having a concave shape. The stepped portion will be described in detail later with reference to FIGS. 6A and 6B. Figure 8 and Figure 9 The stepped portion will be described in detail. The first coupling portion 173 and the second coupling portion 174 can include a top surface aligned in a straight line with the top surface of the frame 110.

[0051] The body 170 can include a reflection portion 190 inside the first cavity 171a. The reflection portion 190 can include first to third reflection partitions 191, 193, and 195. The first to third reflection partitions 191, 193, and 195 can be connected with the first coupling portion 173 disposed on the top surface of the frame 110. For example, the first to third reflection partitions 191, 193, and 195 can be disposed on the first coupling portion 173. The first to third reflection partitions 191, 193, and 195 can be defined as parts protruding from the top surface of the first coupling portion 173. The first to third reflection partitions 191, 193, and 195 can protrude upward from the bottom surface of the first cavity 171a. The first reflection partition 191 and the second reflection partition 193 can be connected with the inner surface of the first cavity 171a. The first reflection partition 191 and the second reflection partition 193 can directly contact the inner surface of the first cavity 171a. The first reflection partition 191 and the second reflection partition 193 can be spaced apart from each other by a specified distance. The first reflection partition 191 and the second reflection partition 193 can be disposed in parallel to each other. The third reflection partition 195 can be disposed between the first reflection partition 191 and the second reflection partition 193. The third reflection partition 195 can be disposed at a middle point of the first reflection partition 191 and the second reflection partition 193, but embodiments are not limited thereto. Through the first to third reflection partitions 191, 193, and 195, the reflection portion 190 can be divided into two regions. Two light emitting devices can be disposed in each of the two regions, but embodiments are not limited thereto.

[0052] The first to third reflective partitions 191, 193, and 195 can have a width that gradually decreases upward. The first to third reflective partitions 191, 193, and 195 can include inclined lateral sides, but embodiments are not limited thereto. For example, the first to third reflective partitions 191, 193, and 195 can include lateral sides formed in a curved structure. In such a case, the first reflective partition 191 and the second reflective partition 193 can be defined as parts that protrude upward from a top surface of the first coupling portion 173. The first reflective partition 191 and the second reflective partition 193 can include an upper portion in contact with the first coupling portion 173 and a lower portion. The upper portion of the first reflective partition 191 and the second reflective partition 193 can include a first width W1, and the lower portion of the first reflective partition 191 and the second reflective partition 193 can include a second width W2. The lower portion of the first reflective partition 191 and the second reflective partition 193 can be disposed in parallel with the top surface of the first coupling portion 113. The first width W1 of the first reflective partition 191 and the second reflective partition 193 can be smaller than the second width W2. According to embodiments, the first width W1 can be in the range of 0.1 mm to 0.6 mm, and the second width W2 can be 0.2 mm or more. The second width W2 can be in the range of 0.2 mm to 0.9 mm. In such a case, the lower portion of the first reflective partition 191 and the second reflective partition 193 can contact the lateral sides of the light emitting device 150 while being perpendicular to the lateral sides of the light emitting device 150.

[0053] The lower portion of the first reflective partition 191 and the second reflective partition 193 can be a boundary region between the first coupling portion 173 and the reflective portion 190. The second width W2 of the first reflective partition 191 and the second reflective partition 193 can be smaller than a third width W3 of the third reflective partition 195. The third width W3 of the third reflective partition 195 can be equal to or greater than the second width W2 of the first reflective partition 191 and the second reflective partition 193. For example, the third width W3 of the third reflective partition 195 can be 2 to 10 times the second width W2 of the first reflective partition 191 and the second reflective partition 193. The third width W3 of the third reflective partition 195 can be in the range of 0.4 mm to 2.0 mm.

[0054] When the third width W3 of the third reflective partition 195 is less than 0.4 mm, since a distance between adjacent light emitting devices 150 is increased, a reflection function can be deteriorated. When the third width W3 of the third reflective partition 195 exceeds 2.0 mm, a dark portion can be formed by the third reflective partition 195, and an inner space defined by the first to third reflective partitions 191, 193, and 195 can be limited when the light emitting devices 150 are arranged in the inner space.

[0055] The width of the lower portions of the first to third reflective partitions 191, 193, and 195 can be less than the width of the first coupling portion 173. In such a case, the first coupling portion 173 can include first extension portions 173a and second extension portions 173b. The first extension portions 173a can directly contact the inner surface of the first cavity 171a in the body 170. The first extension portions 173a can face each other on the inner surface of the first cavity 171a in the body 170. The second extension portions 173b can be disposed between the first extension portions 173a. The second extension portions 173b can be spaced apart from each other by a specified distance. The second extension portions 173b can be disposed under the first reflective partition 191 and the second reflective partition 193. The second extension portions 173b can be disposed under the third reflective partition 195 and can have a width greater than that of the third reflective partition 195, but embodiments are not limited thereto. The first extension portions 173a and the second extension portions 173b can overlap the reflective portion 190.

[0056] The distance 173W1 between the first extension portions 173a can be 2 to 12 times the second width W2. The width of each of the second extension portions 173b can be 1.0 to 5 times the second width W2. The width of the first extension portions 173a can be in the range of 1.5 mm to 2.5 mm, and the width of each of the second extension portions 173b can be in the range of 0.2 mm to 0.9 mm. The distance 173W1 between the first extension portions 173a can be greater than the distance 191W between the first reflective partition 191 and the second reflective partition 193. The distance 173W2 between the second extension portions 173b can be less than the distance 191W between the first reflective partition 191 and the second reflective partition 193. According to embodiments, since the widths of the first extension portions 173a and the second extension portions 173b are greater than the width of the reflective portion 190, the reliability of the injection molding process can be improved when the reflective portion 190 is manufactured.

[0057] The first to third reflective partitions 191, 193, and 195 can have a height H1 lower than the height of the inner surface of the first cavity 171a, but embodiments are not limited thereto. The height H1 of the first to third reflective partitions 191, 193, and 195 can be equal to or higher than the height of the light emitting device 150. The height H1 of the first to third reflective partitions 191, 193, and 195 can be equal to or lower than the height of the inner surface of the first cavity 171a.

[0058] The reflection part 190 can include a first curved part 197 and a second curved part 199 formed at a region where the first reflection partition 191 and the second reflection partition 193 meet the third reflection partition 195. The first curved part 197 and the second curved part 199 are disposed at the region where the first reflection partition 191 and the second reflection partition 193 meet the third reflection partition 195, and thus refract light emitted from the light emitting device 150 in various directions, thereby improving the light extraction efficiency of the light emitting device package 100.

[0059] The light emitting device 150 can be disposed on the frame 110. The light emitting device 150 can be disposed on the frame 110 exposed from the body 170. According to an embodiment, the light emitting device 150 is connected in parallel to each other in the form of two groups. In such a case, the light emitting device 150 can be electrically connected to each other by the wire 150w. Although the embodiment is limited to the configuration in which the light emitting device 150 is connected in parallel to each other in the form of two groups as described above, the embodiment is not limited thereto. For example, the light emitting device 150 can be connected in parallel to each other in the form of a plurality of groups. The light emitting device 150 can be electrically connected with the first lead frame 120 and the second lead frame 130. The light emitting device 150 can be electrically connected with the first lead frame 120 and the second lead frame 130 by the wire 150w. The first group of light emitting devices 150 can be connected in series to each other by the wire 150w and thus can be connected with the first to fourth connection parts 126, 128, 136, and 138 exposed in the first cavity 171a. In such a case, the first connection part 126 and the second connection part 128 can be portions of the first lead frame 120. The top surfaces of the first connection part 126 and the second connection part 128 can be exposed from the body 170 within the first cavity 171a. The third connection part 136 and the fourth connection part 138 can be portions of the second lead frame 130. The top surfaces of the third connection part 136 and the fourth connection part 138 can be exposed from the body 170 within the first cavity 171a.

[0060] In such a case, according to an embodiment, the first lead frame 120 and the second lead frame 130 are included. The first lead frame 120 can include a third stepped part 125 and a fourth stepped part 127 and the second lead frame 130 can include a fifth stepped part 135 and a sixth stepped part 137.

[0061] The first connection part 126 can extend from the third stepped part 125. The second connection part 128 can extend from the fourth stepped part 127.

[0062] An area of the first connecting portion 126 can be 3% to 10% of an area of the third stepped portion 125. An area of the second connecting portion 128 can be 3% to 10% of an area of the fourth stepped portion 127. When the area of the first connecting portion 126 is less than 3% of the area of the third stepped portion 125, a minimum area for bonding of the electric wire 150w is not secured, and thus bonding reliability can be deteriorated. When the area of the second connecting portion 128 is less than 3% of the area of the fourth stepped portion 127, a minimum area for bonding of the electric wire 150w is not secured, and thus bonding reliability can be deteriorated. When the area of the first connecting portion 126 exceeds 10% of the area of the third stepped portion 125, an arrangement area of the light emitting device 150 can be reduced, and thus a degree of freedom in arrangement of the light emitting device 150 can be reduced. When the area of the second connecting portion 128 exceeds 10% of the area of the fourth stepped portion 127, an arrangement area of the light emitting device 150 can be reduced, and thus a degree of freedom in arrangement of the light emitting device 150 can be reduced.

[0063] The third connecting portion 136 can extend from the fifth stepped portion 135. The fourth connecting portion 138 can extend from the sixth stepped portion 137.

[0064] An area of the third connecting portion 136 can be 3% to 10% of an area of the fifth stepped portion 135. An area of the fourth connecting portion 138 can be 3% to 10% of an area of the sixth stepped portion 137. When the area of the third connecting portion 136 is less than 3% of the area of the fifth stepped portion 135, a minimum area for bonding of the electric wire 150w can not be secured, and thus bonding reliability can be deteriorated. When the area of the fourth connecting portion 138 is less than 3% of the area of the sixth stepped portion 137, a minimum area for bonding of the electric wire 150 can not be secured, and thus bonding reliability can be deteriorated. When the area of the third connecting portion 136 exceeds 10% of the area of the fifth stepped portion 135, an arrangement area of the light emitting device 150 is reduced, and thus a degree of freedom in arrangement of the light emitting device 150 can be reduced. When the area of the fourth connecting portion 138 exceeds 10% of the area of the sixth stepped portion 137, an arrangement area of the light emitting device 150 can be reduced, and thus a degree of freedom in arrangement of the light emitting device 150 can be reduced.

[0065] A width between the first connecting part 126 and an inner surface of the first chamber 171a can be in a range of 30㎛ to 100㎛. A width between the second connecting part 128 and the inner surface of the first chamber 171a can be in a range of 30㎛ to 100㎛. A width between the third connecting part 136 and the inner surface of the first chamber 171a can be in a range of 30㎛ to 100㎛. A width between the fourth connecting part 138 and the inner surface of the first chamber 171a can be in a range of 30㎛ to 100㎛. When the width between each of the first to fourth connecting parts 126, 128, 136, and 138 and the inner surface of the first chamber 171a is less than 30㎛, a minimum area for bonding of the electric wire 150w can not be ensured, and thus bonding reliability can be deteriorated. When the width between each of the first to fourth connecting parts 126, 128, 136, and 138 and the inner surface of the first chamber 171a exceeds 100㎛, an arrangement area of the light emitting device 150 can be reduced, and thus a degree of freedom in the arrangement of the light emitting device 150 can be reduced.

[0066] According to an embodiment, the areas and widths of the first to fourth connecting parts 126, 128, 136, and 138 can improve bonding reliability and can increase a degree of freedom in the arrangement of the light emitting device 150.

[0067] The protection device 160 can be disposed on the frame 110. The protection device 160 can be disposed on a top surface of the frame 110 exposed through a bottom of the second chamber 171b. The protection device 160 can be a Zener diode, a thyristor, a transient voltage suppressor (TVS), or the like, but embodiments are not limited thereto. According to an embodiment, the protection device 160 can be a Zener diode protecting the light emitting device 150 from electrostatic discharge (ESD) in the following description for illustrative purposes. The protection device 160 can be connected with the first lead frame 120 and the second lead frame 130 through an electric wire. The protection device 160 can be connected with the fifth connecting part 124 and the sixth connecting part 134 exposed within the second chamber 171b. In such a case, the fifth connecting part 124 can be a part of the first lead frame 120. A top surface of the fifth connecting part 124 can be exposed from the body 170 within the second chamber 171b. The sixth connecting part 134 can be a part of the second lead frame 130. A top surface of the sixth connecting part 134 can be exposed from the body 170 within the second chamber 171b.

[0068] As shown in Figures 1 to 5 According to an embodiment, a reflecting part 190 can be included in the COB light emitting device package 100 to reflect light emitted from the light emitting device 150 to the outside, thereby improving light extraction efficiency.

[0069] According to an embodiment, deformation of the light emitting device package 100 caused by contraction and expansion of the light emitting device 150 can be prevented by the reflection part 190 disposed in the first chamber 171a in which the light emitting device 150 is mounted.

[0070] According to an embodiment, deformation of a molding part (not shown) disposed in the first chamber 171a caused by contraction and expansion of the molding part can be prevented by the reflection part 190 disposed in the first chamber 171a in which the light emitting device 150 is mounted. In other words, according to an embodiment, deformation of the molding part is prevented, and thus the electric wire 150w is prevented from being damaged due to the deformation of the molding part.

[0071] Figure 6 is a plan view showing a frame coupled to a body and upper portions of first and second lead frames according to an embodiment, and Figure 7 is a plan view showing a frame and upper portions of first and second lead frames according to an embodiment. Figure 8 is a plan view showing a frame coupled to a body and lower portions of first and second lead frames according to an embodiment, and Figure 9 is a plan view showing a frame and lower portions of first and second lead frames according to an embodiment.

[0072] As shown in Figures 6 to 9 , according to an embodiment, a light emitting device package can include a frame 110 exposed through an upper portion of the light emitting device package having first and second chambers 171a and 171b disposed therein. The frame 110 can include first and second stepped parts 113 and 114.

[0073] The first stepped portion 113 and the second stepped portion 114 can be provided on the frame 110. The first stepped portion 113 and the second stepped portion 114 can have a recessed portion shape and can have a stepped structure when viewed from a cross-sectional view, but embodiments are not limited thereto. The first stepped portion 113 and the second stepped portion 114 can increase a contact area with the body 170 to improve a coupling force with the body 170. Further, the first stepped portion 113 and the second stepped portion 114 can prevent external moisture from being penetrated due to the stepped structure thereof. The first stepped portion 113 and the second stepped portion 114 can be formed by etching a portion of a top surface of the frame 110, but embodiments are not limited thereto. The thickness of the first stepped portion 113 and the second stepped portion 114 can be 50% of the thickness of the frame 110, but embodiments are not limited thereto. For example, the thickness of the first stepped portion 113 and the second stepped portion 114 can be 50% or more of the thickness of the frame 110. The first stepped portion 113 can be provided while extending across a central region of the frame 110. The first stepped portion 113 completely overlaps the first coupling portion 173 of the body 170 and can directly contact the first coupling portion 173. The first stepped portion 113 can include a first groove 113a and a second groove 113b. The first groove 113a can be provided at both end portions of the first stepped portion 113. The first grooves 113a can be symmetrical to each other. A portion of the first grooves 113a can be provided inside the first chamber 171a and another portion of the first grooves 113a can contact the body 170 outside the first chamber 171a. The second grooves 113b can extend from the first grooves 113a. The second grooves 113b can be spaced apart from each other by a specified distance. The second grooves 113b can be provided in parallel to each other. The second grooves 113b can include a connection structure to connect the second grooves 113b to each other, but embodiments are not limited thereto. The frame 110 can be divided into two regions inwardly from the first stepped portion 113. In such a case, a plurality of light emitting devices can be provided in the two regions.

[0074] The second stepped portion 114 can be spaced apart from the first stepped portion 113 by a specified distance. The second stepped portion 114 can be symmetrical to each other with respect to the first stepped portion 113. The second stepped portion 114 can include a first linear portion 114a and a second linear portion 114b. The first linear portion 114a can be disposed in parallel with the second groove 113b of the first stepped portion 113. In this case, the light emitting device can be disposed between the first linear portion 114a and the first stepped portion 113. The second linear portion 114b can extend from a central region of the first linear portion 114a. The second linear portion 114b can extend from the first linear portion 114a toward an outer portion of the frame 110. In this case, the light emitting device can be disposed at both sides of the second linear portion 114b. The second linear portion 114b can include a terminal portion 114c which contacts the first cavity 171a. A portion of the terminal portion 114c can be disposed inside the first cavity 171a and another portion of the terminal portion 114c can overlap the body 170 outside the first cavity 171a.

[0075] The terminal portion 114c can have a fourth width W4 and the second linear portion 114b can have a fifth width W5. The fourth width W4 of the terminal portion 114c can be equal to or wider than the fifth width W5 of the second linear portion 114b. According to an embodiment, the fourth width W4 of the terminal portion 114c extending from the body 170 can be equal to or wider than the fifth width W5 of the second linear portion 114b, and a molding process for the body 170 can reach even an edge region of the first linear portion 114a. That is, according to an embodiment, due to the terminal portion 114c having the fourth width W4 equal to or wider than the fifth width W5, the reliability of the molding process for the first linear portion 114a disposed farthest from the first cavity 171a can be improved. According to an embodiment, the fifth width W4 can be 50% to 100% of the fourth width W4. The fifth width W5 can be in the range of 0.2mm to 0.9mm. The fourth width W4 can be in the range of 0.1mm to 0.9mm. In this case, the first linear portion 114a can have a width wider than the fifth width W5 of the second linear portion 114b, but embodiments are not limited thereto. For example, the first linear portion 114a can be 50% to 100% of the fourth width W4, and can be in the range of 0.2mm to 0.9mm.

[0076] According to an embodiment, the frame 110 is provided with a first stepped portion 113 and a second stepped portion 114 at a top surface thereof. The first stepped portion 113 and the second stepped portion 114 are coupled to a first coupling portion 173 and a second coupling portion 174 of the body 170 to increase a contact area between the body 170 and the frame 110. Thus a coupling force between the body 170 and the frame 110 can be improved. In addition, since the stepped structure, external moisture can be prevented from being penetrated.

[0077] A third stepped portion 125 and a fourth stepped portion 127 can be provided on a lower portion of the first lead frame 120. The third stepped portion 125 and the fourth stepped portion 127 can have a recess shape and can have a stepped structure when viewed from a cross-sectional view, but embodiments are not limited thereto. When the body 170 undergoes a process of injection molding, the third stepped portion 125 and the fourth stepped portion 127 can be supported by a molding frame provided under the first lead frame 120, thereby preventing the first lead frame 120 from being deformed. In addition, the third stepped portion 125 and the fourth stepped portion 127 can prevent the first lead frame 120 from being deformed so that the first connection portion 126, the second connection portion 128, and the fifth connection portion 124 can be formed. Portions of the third stepped portion 125 and the fourth stepped portion 127 can overlap the first connection portion 126, the second connection portion 128, and the fifth connection portion 124. The third stepped portion 125 and the fourth stepped portion 127 can expose the first connection portion 126, the second connection portion 128, and the fifth connection portion 124 from the body 170 within the first cavity 171a and the second cavity 171b. The third stepped portion 125 can overlap the first pad 121. The third stepped portion 125 can expose the first pad 121 from the body 170. The third stepped portion 125 and the fourth stepped portion 127 can prevent external moisture from being penetrated by the stepped structure. The thickness of the third stepped portion 125 and the fourth stepped portion 127 can be 50% of the thickness of the first lead frame 120, but embodiments are not limited thereto. For example, the thickness of the third stepped portion 125 and the fourth stepped portion 127 can be 50% or more of the thickness of the first lead frame 120.

[0078] The fifth stepped portion 135 and the sixth stepped portion 137 can have a recessed shape and can have a stepped structure, but embodiments are not limited thereto. The fifth stepped portion 135 and the sixth stepped portion 137 can be supported by a molding frame disposed under the second lead frame 130 when the body 170 undergoes an injection molding process, thereby preventing the second lead frame 130 from being deformed. In addition, the fifth stepped portion 135 and the sixth stepped portion 137 can prevent the second lead frame 130 from being deformed, so that the third connection portion 136, the fourth connection portion 138, and the sixth connection portion 134 can be formed. Parts of the fifth stepped portion 135 and the sixth stepped portion 137 can overlap the third connection portion 136, the fourth connection portion 138, and the sixth connection portion 134. The fifth stepped portion 135 and the sixth stepped portion 137 can expose the third connection portion 136, the fourth connection portion 138, and the sixth connection portion 134 from the body 170 within the first cavity 171a and the second cavity 171b. The sixth stepped portion 137 can overlap the second pad 131. The sixth stepped portion 137 can expose the second pad 131 from the body 170. The fifth stepped portion 135 and the sixth stepped portion 137 can prevent external moisture from being penetrated by the stepped structure. The thickness of the fifth stepped portion 135 and the sixth stepped portion 137 can be 50% of the thickness of the second lead frame 130, but embodiments are not limited thereto. For example, the thickness of the fifth stepped portion 135 and the sixth stepped portion 137 can be 50% or more of the thickness of the second lead frame 130.

[0079] According to embodiments, the third stepped portion 125 and the fourth stepped portion 127 are disposed under the first lead frame 120, and the fifth stepped portion 135 and the sixth stepped portion 137 are disposed under the second lead frame 130. The third to sixth stepped portions 125, 127, 135, and 137 are supported when an injection molding process is performed with respect to the body 170, thereby preventing the first lead frame 120 and the second lead frame 130 from being deformed. According to embodiments, the first to sixth connection portions 126, 128, 136, 138, 124, and 134 and the first pad 121 and the second pad 131 overlapping the third to sixth stepped portions 125, 127, 135, and 137 are exposed from the body 170, thereby preventing manufacturing defects of the first to sixth connection portions 126, 128, 136, 138, 124, and 134 and the first pad 121 and the second pad 131. In addition, according to embodiments, external moisture can be prevented from being penetrated by the stepped structure of the third to sixth stepped portions 125, 127, 135, and 137.

[0080] Figure 10 FIG. 4 is a view illustrating a first spacer and a second spacer between a frame and a first lead frame and a second lead frame according to an embodiment.

[0081] As shown in Figure 10 According to an embodiment, a frame 110, a first lead frame 120, and a second lead frame 130 are included. A first spacer 175 can be disposed between the frame 110 and the first lead frame 120, and a second spacer 176 can be disposed between the frame 110 and the second lead frame 130.

[0082] The first spacer 175 can have a sixth width W6. The sixth width W6 of the first spacer 175 can be a distance between the frame 110 and the first lead frame 120. The first spacer 175 can extend to an outer portion of the light emitting device package. A width of the second spacer 176 can be a distance between the frame 110 and the second lead frame 130. The first spacer 175 can be symmetrical with the second spacer 176 and can have a uniform width as a whole, but embodiments are not limited thereto.

[0083] The frame 110, and the first lead frame 120 and the second lead frame 130 can include a flexure structure at an edge of the light emitting device package. The flexure structure can correspond to a structure of the first spacer 175 and the second spacer 176. According to an embodiment, a coupling force between the body 170 and the first frame 110, a coupling force between the body 170 and the first lead frame 120 and the second lead frame 130 can be improved, and the first spacer 175 and the second spacer 176 can be prevented from being broken due to an external force.

[0084] The frame 110 can include a first protrusion portion 110p exposed through an outer portion of the light emitting device package. The frame 110 can include a mounting portion 110b on which a light emitting device is mounted, and a first flexure portion 110a extending from the mounting portion 110b. The first flexure portion 110a can directly contact the first protrusion portion 110p. The first flexure portion 110a can have a width greater than that of the protrusion portion 110p.

[0085] The width of the protrusion portion 110p can be 20% to 50% of the width of the first flexure portion 110a. When the width of the protrusion portion 110p is less than 20% of the width of the first flexure portion 110a, the strength between adjacent light emitting device packages can be reduced, and thus defects can occur in a cutting process or an injection molding process of the body 170. When the width of the protrusion portion 110p exceeds 50% of the width of the first flexure portion 110a, the body in a cutting area can be broken as the strength of the first lead frame 120 and the second lead frame 130 and the frame 110 in the cutting area increases.

[0086] According to an embodiment, since the structure of the first flexure portion 110a has a width greater than that of the protrusion portion 110p, the coupling force between the body and the frame 110 and the coupling force between the body and the first and second lead frames 120 and 130 can be increased. In addition, according to an embodiment, since the structure of the protrusion portion 110p has a width narrower than that of the first flexure portion 110a, the frame 110 and the first and second lead frames 120 and 130 having stronger strength can be easily cut, thereby preventing the peripheral portion of the cutting area from being broken.

[0087] The first lead frame 120 can include a second protrusion portion 120p exposed through other portions. The first lead frame 120 can include a second flexure portion 120a facing the first flexure portion 110a. The second flexure portion 120a can protrude toward the frame 110. The second flexure portion 120a has a seventh width W7 formed in the first direction X-X' toward the first flexure portion 110a and an eighth width W8 formed in the second direction Y-Y perpendicular to the first direction X-X'. The seventh width W7 of the second flexure portion 120a can be greater than the sixth width W6 of the first spacer 175, but embodiments are not limited thereto. For example, the seventh width W7 of the second flexure portion 120a can be 1.2 to 10 times the sixth width W6 of the first spacer 175. The eighth width W8 of the second flexure portion 120a can be equal to or greater than the sixth width W6 of the first spacer 175, but embodiments are not limited thereto. For example, the eighth width W8 of the second flexure portion 120a can be 1 to 10 times the sixth width W6 of the first spacer 175. When the seventh width W7 and the eighth width W8 are less than the sixth width W6, the coupling force between the body 170 and the frame 110 and the coupling force between the body and the first and second lead frames 120 and 130 can be reduced, and the first and second spacers 175 and 176 can not be prevented from being broken by an external force. When the seventh width W7 and the eighth width W8 exceed ten times the sixth width W6, the design of the light emitting device package can be difficult.

[0088] The sixth width W6 can be in the range of 0.2 to 0.5 mm, the seventh width W7 can be in the range of 0.24 to 2 mm, and the eighth width W8 can be in the range of 0.2 to 2 mm. For example, according to an embodiment, the sixth width W6 can be 0.3 mm, the seventh width W7 can be 0.5 mm, and the eighth width W8 can be 0.58 mm.

[0089] The second lead frame 130 can include a third protruding portion 130p exposed through an outer portion. The second lead frame 130 can include a third flexure portion 130a facing the first flexure portion 110a. Details of the third flexure portion 130a can be understood by those skilled in the art by referring to the description of the second flexure portion 120a, and thus will be omitted below.

[0090] According to an embodiment, when the first lead frame 120 and the second lead frame 130 include flexure structures at edges thereof, a coupling force between the body 170 and the first lead frame 120 and the second lead frame 130 can be increased, and a peripheral portion of the first spacer 175 and the second spacer 176 can be prevented from being broken.

[0091] Figure 11 FIG. 17 is a view illustrating a first pad area according to an embodiment, and Figure 12 FIG. 18 is a view illustrating a second pad area according to an embodiment.

[0092] As illustrated in Figure 1 , Figure 11 and Figure 12 , according to an embodiment, the light emitting device package 100 can include first pads 121 and second pads 122 disposed symmetrically to each other on the first edge 170a and the second edge 170b.

[0093] Top surfaces of the first pads 121 and the second pads 131 can be exposed from the body 170. The first pads 121 can include at least one through hole 179. The through hole 179 can be filled with a portion of the body 170. The through hole 179 can increase a contact area between the first lead frame 120 and the body 170 to increase a coupling force between the body 170 and the first lead frame 120. According to an embodiment, a first protection portion 177 covering an outer portion of the first pads 121 and a second protection portion 178 covering an outer portion of the second pads 131 can be included. The first protection portion 177 and the second protection portion 178 can be included in the body 170. The first protection portion 177 is disposed at the outer portion of the first pads 121 to directly contact the first pads 121, and the second protection portion 178 is disposed at the outer portion of the second pads 131 to directly contact the second pads 131. The first protection portion 177 and the second protection portion 178 are disposed outside the first corner 170a and the second corner 170b to protect the first pads 121 and the second pads 131 from external influences.

[0094] The first protection portion 177 can be disposed between the second protrusion portions 120p extending from the first pad 121. The first protection portion 177 can include a third linear portion 177a and a fourth linear portion 177b. The third linear portion 177a and the fourth linear portion 177b can directly contact the second protrusion portions 120p. The third linear portion 177a and the fourth linear portion 177b can be connected to each other. The third linear portion 177a and the fourth linear portion 177b can directly contact an outer portion of the first pad 121 exposed between the second protrusion portions 120p.

[0095] The second protection portion 178 can be disposed between the third protrusion portions 130p extending from the second pad 131. The second protection portion 178 can include a fifth linear portion 178a and a sixth linear portion 178b. The fifth linear portion 178a and the sixth linear portion 178b can directly contact the third protrusion portions 130p. The fifth linear portion 178a and the sixth linear portion 178b can be connected to each other. The fifth linear portion 178a and the sixth linear portion 178b can directly contact an outer portion of the second pad 131 exposed between the third protrusion portions 130p.

[0096] According to an embodiment, the first protection portion 177 and the second protection portion 178 covering the outer portions of the first pad 121 and the second pad 131 are included to protect the first pad 121 and the second pad 131 and to increase the coupling force between the body 170 and the first lead frame 120 and the second lead frame 130. According to an embodiment, at least one through-hole 179 is formed through the first pad 121 and the second pad 131 to increase the coupling force between the body 170 and the first lead frame 120 and the second lead frame 130.

[0097] Figure 13 is a perspective view illustrating a light emitting device package according to another embodiment.

[0098] As shown in Figure 13 , according to another embodiment, the light emitting device package 200 can include a reflection portion 290. According to another embodiment, the light emitting device package 200 can employ the technical features of the light emitting device package 100 in the previous embodiment of Figures 1 to 12 , except for the reflection portion 290.

[0099] The body 170 can include a reflection portion 290 inside the first chamber 171a. The reflection portion 290 can include a sub-chamber 290a that individually surrounds the related light emitting device 150. The reflection portion 290 can be defined as a component that protrudes upward from the bottom of the first chamber 171a. The reflection portion 290 can correspond to the arrangement structure of the light emitting device 150. For example, the reflection portion 290 can be formed in a matrix type, but embodiments are not limited thereto. The reflection portion 290 can include sub-chambers 290a corresponding in number to the light emitting devices 150. For example, according to embodiments, the reflection portion 290 can include 16 sub-chambers 290a corresponding to 16 light emitting devices 150, but embodiments are not limited thereto.

[0100] The reflection portion 290 can have a width that gradually decreases upward. The reflection portion 290 can include an inclined side surface, but is not limited thereto. For example, the reflection portion 290 can include a side surface of a flexure structure. Here, the width of the upper and lower portions of the reflection portion 290 can adopt the technical features of the first and second reflection partitions 191 and 193 in the previous embodiments.

[0101] The reflection portion 290 can have a height less than that of the inner surface of the first chamber 171a, but embodiments are not limited thereto. For example, the height of the reflection portion 290 can be equal to or higher than that of the light emitting device 150. The height of the reflection portion 290 can be equal to or less than that of the inner surface of the first chamber 171a.

[0102] According to another embodiment, a matrix-type reflection portion 290 can be included in the COB light emitting device package 200 to reflect light emitted from the light emitting device 150 to the outside, thereby improving light extraction efficiency.

[0103] According to another embodiment, deformation of the light emitting device package 200 caused by shrinkage and expansion of the light emitting device package 200 can be prevented by providing a matrix-type reflection portion 190 in the first chamber 171a in which the light emitting device 150 is mounted.

[0104] According to another embodiment, deformation of a molding portion (not shown) caused by shrinkage and expansion of the molding portion provided in the first chamber 171a can be prevented by providing a matrix-type reflection portion 190 in the first chamber 171a in which the light emitting device 150 is mounted. In other words, according to another embodiment, deformation of the molding portion can be prevented, thereby preventing damage to the wire 150W caused by deformation of the molding portion.

[0105] According to another embodiment, light extraction efficiency of the light emitting device package 200 can be improved by refracting light from the light emitting device 150 in various ways.

[0106] Figure 14 andFigure 15 is a plan view illustrating a light emitting device package according to still another embodiment.

[0107] As shown in Figure 14 and Figure 15 , according to still another embodiment, the light emitting device package 300 can include a stepped portion 313 and a coupling portion 373. According to still another embodiment, the light emitting device package 300 can employ technical features of the light emitting device package 100 shown in Figures 1 to 12 in the previous embodiments except for the stepped portion 313 and the coupling portion 373.

[0108] The frame 110 can include the stepped portion 313. The stepped portion 313 can be disposed on the frame 110. The stepped portion 313 can have a recessed shape and can have a stepped structure when viewed from a cross-section, but embodiments are not limited thereto. The stepped portion 313 can increase a contact area with the body 170 to improve a coupling force with the body 170. Further, due to the stepped structure, the stepped portion 313 can prevent external moisture from being penetrated. The stepped portion 313 can be formed by etching a portion of a top surface of the frame 110, but embodiments are not limited thereto. A thickness of the stepped portion 313 can be 50% of a thickness of the frame 110, but embodiments are not limited thereto. For example, the thickness of the stepped portion 313 can be 50% or more of the thickness of the frame 110. The stepped portion 313 can be spaced apart from the frame 110 by a specified distance along an edge of the frame 110. Although not shown in the drawings, the frame 110 can be provided with a lower stepped structure (not shown) formed along an edge of the frame 110 at a bottom surface thereof. According to another embodiment, the stepped portion 313 can be spaced apart from the frame 110 by a specified distance along an edge of the frame 110 such that the stepped portion 313 does not overlap the lower stepped structure, but embodiments are not limited thereto. For example, when the stepped structure is omitted from the bottom surface of the frame 110, the stepped portion 313 can be disposed up to an edge of the top surface of the frame 110. In such a case, the frame 110 can include a plurality of light emitting device mounting portions 350 formed on the top surface. A thickness of the light emitting device mounting portion 350 can correspond to a width of the frame 110. According to another embodiment, when the frame 110 has the stepped portion 313 disposed at a remaining area of the frame other than the edge of the frame 110 and the light emitting device mounting portion 350, a contact area between the coupling portion 373 and the frame 110 is increased to improve a coupling force between the body 170 and the frame 110.

[0109] The stepped portion 313 can completely cover the coupling portion 373 of the body 170 and can contact the coupling portion 373. A top surface of the coupling portion 373 can be linearly aligned with a top surface of the light emitting device mounting portion 350.

[0110] According to still another embodiment, when the stepped portion 313 is provided in a region other than the light emitting device mounting portion 350 and is coupled to the coupling portion 373 of the body 170 to increase the contact area between the body 170 and the frame 110, the coupling force between the body 170 and the frame 110 can be increased, and external moisture can be prevented from being penetrated due to the stepped structure.

[0111] According to embodiments, the light emitting device package can be applied to a display apparatus, an illumination unit, an indicator, a lamp, a street lamp, an illumination apparatus for a vehicle, a display apparatus for a vehicle, a smart watch, etc., but embodiments are not limited thereto.

[0112] When the light emitting device package is used for a backlight unit of a display apparatus, the light emitting device package can be used for an edge type backlight unit or a direct type backlight unit. When the light emitting device package is used for a light source of an illumination apparatus, the light emitting device package can be used in an illumination apparatus type or a bulb type, or can be used for a light source of a mobile terminal.

[0113] The semiconductor device includes a laser diode in addition to a light emitting diode.

[0114] In addition, the semiconductor device can not be implemented only with a semiconductor. If necessary, the semiconductor device can further include a metallic material. For example, a semiconductor device used as a light receiving device can be implemented with at least Ag, Al, Au, In, Ga, N, Zn, Se, P, or As, or can be implemented with a semiconductor material doped with a P-type dopant or an N-type dopant or an intrinsic semiconductor material.

[0115] As described above, although various embodiments have been illustrated and described, the present disclosure is not limited to the embodiments mentioned above and various modifications can be made by those skilled in the art without departing from the scope of the appended claims. For example, elements of the embodiments can be modified, and these modified examples should not be understood independently of the technical spirit or prospect.

Claims

1. A light emitting device package comprising: a frame; a first lead frame spaced apart from the frame by a specified distance; a second lead frame spaced apart from the frame by a specified distance; a body coupled to the frame and the first and second lead frames, and having a first cavity; a plurality of light emitting devices disposed on the frame to be exposed through the first cavity; and a first spacer interposed between the frame and the first lead frame; wherein the body includes a reflection portion disposed inside the first cavity to enclose at least one of the light emitting devices, wherein the frame includes a mounting portion in which the light emitting devices are mounted, and a first flexure portion extending from the mounting portion; wherein the first lead frame includes a second flexure portion facing the first flexure portion, wherein a width of the second flexure portion protruding in a first direction is greater than a width of the first spacer, and wherein a width of the second flexure portion protruding in a second direction perpendicular to the first direction is equal to or greater than the width of the first spacer. The reflection portion includes sub-cavities individually enclosing at least one of the light emitting devices.

2. The light emitting device package of claim 1, wherein, The number of the sub-cavities is equal to the number of the light emitting devices, each of the sub-cavities individually enclosing one of the light emitting devices.

3. The light emitting device package of claim 2, wherein, The plurality of sub-cavities are arranged in a matrix.

4. The light emitting device package of claim 3, wherein, The reflection portion has a width gradually decreasing upward, the reflection portion including an inclined or flexed side surface.

5. The light emitting device package of claim 1, wherein, The reflection portion is equal to or higher than a height of the light emitting devices, the height of the reflection portion being equal to or less than a height of an inner surface of the first cavity.

6. The light emitting device package of claim 1, wherein, Further comprising:

7. The light emitting device package of claim 1, wherein, a second spacer interposed between the frame and the second lead frame; wherein the second lead frame includes a flexure structure at an edge of the light emitting device package, the flexure structure corresponding to a structure of the second spacer. 8.The light emitting device package of claim 7, wherein, the second lead frame includes a third flexure portion facing the first flexure portion. a width of the third flexure portion protruding in the first direction is greater than a width of the second spacer, and a width of the third flexure portion protruding in the second direction is equal to or greater than the width of the second spacer.

9. The light emitting device package of claim 8, wherein, a width of each of the second and third flexure portions protruding in the first direction while facing each other is 1.2 to 10 times a width of each of the first and second spacers, 10. The light emitting device package of claim 9, wherein, wherein a width of each of the second and third flexure portions protruding in the second direction perpendicular to the first direction is 1 to 10 times the width of each of the first and second spacers, ​ wherein a width of each of the second and third flexure portions protruding in the first direction while facing each other is in a range of 0.24 mm to 2 mm, wherein a width of each of the second and third flexure portions protruding in the second direction perpendicular to the first direction while facing each other is in a range of 0.2 mm to 2 mm, and wherein a width of each of the first and second spacers is in a range of 0.2 mm to 0.5 mm.

Images