Power supply unit

By designing a dual-input power supply device and using modular circuit design and optimizing air ducts, the problem of the power supply configuration in the prior art requires replacement of high-current-resistant connectors, achieving higher power supply and cost-reducing effect.

CN115275717BActive Publication Date: 2025-05-16DELTA ELECTRONICS (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202110471324.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-04-29
Publication Date
2025-05-16
Estimated Expiration
2041-04-29

AI Technical Summary

Technical Problem

When configuring network server power supply, the existing technology requires replacement of input connectors with stronger current resistance, resulting in an increase in investment costs for data center infrastructure.

Method used

Design a dual input power supply device, including two input ports, at least one fan and two isolated power supplies, provides sufficient insulation distance through a modular circuit design and optimizes the air duct to improve heat dissipation capabilities.

Benefits of technology

The power supply device can provide higher power supply power without changing the existing input connector, reduce production costs, and ensure good heat dissipation effect by optimizing the heat dissipation design.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a power supply device, which includes: two input ports, the two input ports are arranged at the front end of the power supply device; at least one fan, the at least one fan is arranged behind the two input ports; and two isolated power supplies, the two isolated power supplies are connected to the two input ports in a one-to-one correspondence and are arranged behind the two input ports and the at least one fan, the main power circuit of each of the isolated power supplies includes at least one module, each of the modules includes a PCB board, and a magnetic element and / or a switch element combined with the PCB board, the at least one module includes an isolation circuit module, the winding of its transformer is formed by copper plating in the PCB board, the magnetic core of the transformer is fixed on the PCB board, and the at least one fan is used to dissipate heat for the at least one module. The present invention does not need to change the existing power distribution system, and ensures a good heat dissipation effect by using methods such as modular circuit design.
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Description

Technical Field

[0001] The present invention relates to the technical field of power electronics, and in particular to a power supply device. Background Art

[0002] Network server power supplies are mostly configured in N+N redundancy mode, such as 1+1, 2+2 and 4+4 redundancy configurations.

[0003] Assuming that the actual power of the system is 3kW, if a 1.5kW power supply is used, four units are required for 2+2 redundancy configuration, while a 3kW power supply only needs 1+1 redundancy configuration. Since the input current of a 3kW power supply is twice that of a 1.5kW power supply, it is necessary to replace the input connector with a stronger current resistance, such as upgrading from a C14 connector to a C20 connector. However, the replacement of the connector will directly change the original power distribution architecture of the data center room, which will greatly increase the investment cost of the data center infrastructure. Summary of the invention

[0004] An object of the present invention is to provide a power supply device that can solve one or more defects of the prior art.

[0005] In order to achieve the above-mentioned purpose, according to one embodiment of the present invention, the present invention provides a power supply device, which includes: two input ports, the two input ports are arranged at the front end of the power supply device; at least one fan, the at least one fan is arranged behind the two input ports; and two isolated power supplies, the two isolated power supplies are connected to the two input ports in a one-to-one correspondence and are arranged behind the two input ports and the at least one fan, the main power circuit of each of the isolated power supplies includes at least one module, each of the modules includes a PCB board, and a magnetic element and / or a switch element combined with the PCB board, the at least one module includes an isolation circuit module, the winding of the transformer of the isolation circuit module is formed by copper plating in the PCB board, the magnetic core of the transformer is fixed on the PCB board, and the at least one fan is used to dissipate heat for the at least one module.

[0006] In an embodiment of the present invention, the power supply device further includes a casing, wherein the casing forms an accommodation space for accommodating the two input ports, the at least one fan, and the two isolated power supplies.

[0007] In one embodiment of the present invention, the isolation circuit module includes a plurality of PCB boards, the winding of the transformer of the isolation circuit module is formed by copper plating in the plurality of PCB boards, and the magnetic core of the transformer is fixed on the plurality of PCB boards.

[0008] In an embodiment of the present invention, the at least one module further includes at least one of a PFC module, a DC-DC module, an EMI module, a capacitor module and an auxiliary power module.

[0009] In one embodiment of the present invention, a main board is further included, the PCB board of the DC-DC module is plugged into the main board, the magnetic element of the DC-DC module on the PCB board is placed away from the main board, the switch element of the DC-DC module on the PCB board is placed close to the main board, and an inter-board air duct is formed at a position of the PCB board close to the main board.

[0010] In an embodiment of the present invention, an insulating sheet is further provided between the heat sinks of the two PFC modules of the two isolated power supplies.

[0011] In one embodiment of the present invention, the power supply device further includes a mainboard, and the at least one module is arranged on the mainboard, wherein the PCB board of at least one of the PFC module and the DC-DC module is further provided with a slot at the plug-in position of the mainboard.

[0012] In an embodiment of the present invention, the external dimensions of the power supply device include a height of 38-46 mm and a width of 60-80 mm.

[0013] In an embodiment of the present invention, the at least one fan is two fans, and the two fans are connected in series.

[0014] In one embodiment of the present invention, the at least one fan is placed at a first offset position along the length direction of the power supply device relative to the vertical central axis.

[0015] In one embodiment of the present invention, the at least one fan is placed centrally along the width direction of the power supply device; the two input ports are arranged side by side on the front panel of the case along the width direction of the power supply device, and the front panel has a plurality of ventilation holes, and the plurality of ventilation holes are concentrated between the two input ports and are arranged corresponding to the at least one fan.

[0016] In one embodiment of the present invention, a wind-blocking filler is provided in the space between the at least one fan and the housing along the width direction of the power supply device to prevent the wind generated by the at least one fan from flowing back.

[0017] In an embodiment of the present invention, the two input ports are respectively connected to the ground.

[0018] In an embodiment of the present invention, the two input ports are connected to a ground through a grounding structure at a grounding point.

[0019] In one embodiment of the present invention, the grounding structure includes: a first grounding member, which is correspondingly installed on the first input port of the two input ports, and has a first connecting portion and a first grounding portion, wherein the first connecting portion is connected to the first grounding end of the first input port; a second grounding member, which is correspondingly installed on the second input port of the two input ports, and has a second connecting portion and a second grounding portion, wherein the second connecting portion is connected to the second grounding end of the second input port; wherein the first grounding portion and the second grounding portion are connected to the casing and grounded at the grounding point through a connecting member.

[0020] In an embodiment of the present invention, part of the first grounding member further forms a first electromagnetic shielding portion, and part of the second grounding member further forms a second electromagnetic shielding portion.

[0021] In one embodiment of the present invention, the two input ports are C14 connectors or C20 connectors.

[0022] In one embodiment of the present invention, the input of the isolated power supply is AC input or DC input.

[0023] In one embodiment of the present invention, each of the isolated power supplies has a main power output, and the two main power outputs of the two isolated power supplies are connected in parallel after passing through a first anti-reverse circuit to form a first output.

[0024] In one embodiment of the present invention, each of the isolated power supplies further has a spare output, and the two spare outputs of the two isolated power supplies are respectively connected in parallel after passing through a second anti-reverse circuit to form a second output.

[0025] In one embodiment of the present invention, the isolated power supply is a single-stage circuit; or, the isolated power supply is a two-stage circuit, which includes a front-stage circuit and a rear-stage circuit, wherein the front-stage circuit is a PFC circuit or a pre-voltage regulation circuit, and the rear-stage circuit is a DC-DC circuit.

[0026] In an embodiment of the present invention, each of the isolated power supplies includes at least one control chip for controlling the isolated power supply.

[0027] In an embodiment of the present invention, the control chip of any one of the two isolated power supplies is also used to communicate with an external system.

[0028] In an embodiment of the present invention, the power supply device further includes another control chip, and the control chip is used to communicate with an external system.

[0029] The present invention proposes a power supply device with dual-input, which can keep the original input connector unchanged, without changing the existing power distribution system, saving production costs, for example, two 1.5kW power modules can be integrated into one power supply housing. Compared with the traditional single-input power supply device, the dual-input power supply device of the present invention requires double the devices, which poses a great challenge to insulation and heat dissipation. Therefore, the present invention provides sufficient insulation distance and optimizes the air duct by using methods such as modular circuit design, thereby improving the heat dissipation capacity and ensuring a good heat dissipation effect.

[0030] Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0032] Figure 1A It is a schematic diagram of the exploded structure of the power supply device of the present invention before assembly;

[0033] Figure 1B is a schematic diagram of the internal layout of the power supply device of the present invention;

[0034] Figure 1C It is a schematic diagram of the structure of two fans connected in series in the power supply device of the present invention;

[0035] Figure 2 It is a schematic diagram of the three-dimensional structure of the power supply device of the present invention after being assembled;

[0036] Figure 3A for Figure 2 The top view of

[0037] Figure 3B for Figure 2 Bottom view of

[0038] Figure 3C for Figure 2 Right view of;

[0039] Figure 3D for Figure 2 Left view of

[0040] Figure 3E for Figure 2 Front view of

[0041] Figure 3F for Figure 2 Rear view of

[0042] Figure 4A A schematic diagram of the layout of multiple modules of the modular power supply device of the present invention;

[0043] Figure 4B A schematic diagram of the slots at the connection between the PFC module or DC-DC module of the power supply device of the present invention and the mainboard;

[0044] Figure 4C It is a structural schematic diagram of a transformer in an isolation circuit module of a power supply device of the present invention;

[0045] Figure 4D It is a structural schematic diagram of another transformer in the isolation circuit module of the power supply device of the present invention;

[0046] Figure 5 It is a structural schematic diagram of a DC-DC module using LLC topology in a power supply device of the present invention;

[0047] Figure 6 A schematic diagram of a simulation of a heat dissipation duct of a power supply device of the present invention;

[0048] Figure 7 It is a structural schematic diagram of two input ports in the power supply device of the present invention being grounded together at a grounding point through a grounding structural member;

[0049] Figure 8 is a first control schematic diagram of the power supply device of the present invention;

[0050] Fig. 9 is a second control schematic diagram of the power supply device of the present invention;

[0051] Fig.10 It is a third control schematic diagram of the power supply device of the present invention. DETAILED DESCRIPTION

[0052] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0053] When introducing the elements / components / etc. described and / or illustrated herein, the terms "a", "an", "the", "said", and "at least one" are used to indicate the presence of one or more elements / components / etc. The terms "comprises", "includes", and "have" are used to indicate an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc. Relative terms may be used in the embodiments, such as "upper" or "lower" to describe the relative relationship of one component of the icon to another component. It is understood that if the device of the icon is turned over so that it is upside down, the component described on the "upper" side will become the component on the "lower" side. In addition, the terms "first", "second", etc. in the claims are used only as labels and are not numerical limitations on their objects.

[0054] like Figure 1A-1B and Figure 4C As shown, the present invention provides a power supply device 100, which may include two input ports 10, at least one fan 20 and two isolated power supplies 30. The two input ports 10, for example, include a first input port 10A and a second input port 10B, are arranged at the front end of the power supply device. The at least one fan 20 is arranged behind the two input ports 10. The two isolated power supplies 30, for example, include a first isolated power supply 30A and a second isolated power supply 30B, are connected to the two input ports 10 in a one-to-one correspondence and are arranged behind the two input ports 10 and the at least one fan 20. In the present invention, the main power circuit of each of the isolated power supplies 30 may include at least one module, and each of the modules includes a PCB board, and a magnetic element and / or a switch element combined with the PCB board. At least one module in the power supply module 30 includes an isolation circuit module, which can be, for example but not limited to, a DC-DC module. The isolation circuit module includes a transformer 80. The winding of the transformer 80 can be formed by copper plating in a PCB board 90. The magnetic core of the transformer 80 can be fixed on the PCB board 90. The at least one fan 20 can be used to dissipate heat for the at least one module.

[0055] Preferably, the two input ports 10 (including 10A and 10B) may be, for example, C14 connectors or C20 connectors, wherein connector A may be used to receive an input A, and connector B may be used to receive an input B.

[0056] In this embodiment, the at least one fan 20 is preferably, for example, one fan. Figure 1C As shown, the at least one fan 20 may also be two fans, and the two fans are connected in series and are disposed after the two output ports 10 .

[0057] Preferably, the input of the two isolated power supplies 30 (including 30A, 30B) can be an AC input or a DC input. In addition, each of the isolated power supplies 30 can also include a backup circuit, for example, it can include an output circuit of an auxiliary power supply. Preferably, each of the isolated power supplies 30 can have one main power output and one backup output. In this way, the power supply device 100 of the present invention can have dual inputs and dual outputs.

[0058] like Figure 1A As shown, the power supply device 100 may further include a housing 40, and the housing 40 may form a receiving space 401 for receiving the two input ports 10, the at least one fan 20 and the two isolated power supplies 30. Figure 2 , which shows the structure of the power supply device 100 of the present invention after assembly, wherein the external dimensions of the power supply device 100 may have a height H of 38 to 46 mm and a width W of 60 to 80 mm. Preferably, for example, the power supply device 100 may have an external dimension of length L*width W*height H of 265 mm*73.5 mm*40 mm, and its power density may be, for example, 78 W / inch 3 However, it is understood that in other embodiments, the power supply device of the present invention may also be of other sizes, which is not intended to limit the present invention.

[0059] In this embodiment, combined with reference Figure 1A and Figures 3A to 3F The housing 40 may be assembled from a lower housing 41 and an upper housing 42. The lower housing 41 may include a bottom plate 411 at the bottom, two side plates 412 at the sides, and a front panel 413 at the front end, and the upper housing 42 may include a top plate 421 at the top and a rear panel 422 at the rear end. The two input ports 10 (including 10A and 10B) may be arranged side by side on the front panel 413 along the width direction of the power supply device 100, as shown in FIG. Figure 3E As shown, the front panel 413 may have a plurality of ventilation holes 4131, which are concentrated between the two input ports (including 10A and 10B) and are arranged corresponding to the fan 20. By controlling the height and space of the front and rear components of the fan 20, the air duct can be optimized to the maximum extent and the heat dissipation efficiency can be improved. Specifically, the fan 20 can be suspended and fixed on the top plate 421 of the upper housing 42. The power supply device 100 may also include a main board 60, and two isolated power supplies 30, namely the first isolated power supply 30A and the second isolated power supply 30B, are arranged on the main board 60. In some embodiments, a through hole is arranged at a position corresponding to the main board 60 and the fan 20, so that the fan 20 passes through the main board 60 and is fixed on the bottom plate 411.

[0060] Preferably, in the present invention, Figure 4A As shown, the at least one module also includes at least one of a PFC module, a DC-DC module, an EMI module, a capacitor module and an auxiliary power module. In addition, each of the isolated power supplies 30 can use a modular circuit design, and the so-called "modular circuit design" refers to a module formed by combining magnetic components and / or switch components with a PCB board. In particular, the use of a modular circuit design can not only significantly improve the manufacturability of the power supply device and reduce production costs, but also save space inside the power supply device, improve heat distribution, increase the wind speed at the main heating components, and thus improve heat dissipation efficiency, and can provide sufficient creepage distance to improve the insulation effect between the two isolated power supplies 30.

[0061] In the present invention, if Figure 1B As shown, the isolated power supply 30 can be a single-stage circuit or a two-stage circuit. Figure 4AAs shown, when the isolated power supply 30 is a two-stage circuit, it may include a front-stage circuit and a rear-stage circuit, wherein the front-stage circuit may, for example, include a PFC circuit, and the rear-stage circuit may, for example, include a DC-DC circuit. For example, the first isolated power supply 30A of line A is a two-stage isolated power supply A, whose front-stage circuit includes a PFC module 31A, and the rear-stage circuit includes a DC-DC module A, wherein the PFC module 31A includes a heat sink 311A, a switch combination 312A and an inductor 313A, and the heat sink 311A, the switch combination 312A and the inductor 313A are arranged in sequence from the transverse central axis I1-I1 outward along the width direction of the power supply device 100. The DC-DC module A may be composed of two parts, wherein the first part 32A of the DC-DC module A may be, for example, the primary circuit part of the DC-DC module A, and the second part 33A of the DC-DC module A may be, for example, the secondary circuit part of the DC-DC module A, and the first part 32A of the DC-DC module A and the second part 33A of the DC-DC module A are sequentially arranged along the transverse central axis I1-I1 in the length direction of the power supply device 100. The second isolated power supply 30B of the B circuit is a two-stage isolated power supply B, whose front-stage circuit includes a PFC module 31B, and the rear-stage circuit includes a DC-DC module B, wherein the PFC module 31B includes a heat sink 311B, a switch combination 312B and an inductor 313B, and the heat sink 311B, the switch combination 312B and the inductor 313B are sequentially arranged from the transverse central axis I1-I1 outward along the width direction of the power supply device 100. The DC-DC module B is composed of two parts, the first part 32B of the DC-DC module B can be, for example, the primary circuit part of the DC-DC module B, the second part 33B of the DC-DC module B can be, for example, the secondary circuit part of the DC-DC module B, and the first part 32B of the DC-DC module B and the second part 33B of the DC-DC module B are sequentially arranged along the transverse central axis I1-I1 in the length direction of the power supply device 100. It can be understood that the primary circuit part and the secondary circuit part of the DC-DC module of the isolated power supply 30 can also be integrated into an integral module and arranged along the transverse central axis I1-I1. Preferably, the first isolated power supply 30A of the A circuit can further include an EMI module 34A, a capacitor module 35A and an auxiliary power supply module 36A; the first isolated power supply 30B of the B circuit can further include an EMI module 34B, a capacitor module 35B and an auxiliary power supply module 36B, wherein the outputs of the auxiliary power supply modules 36A and 36B are externally connected to form the standby output loop. The two outputs of the first isolated power supply 30A of the A circuit and the second isolated power supply 30B of the B circuit can be connected to the load through the output terminal 50 and supply power to the load. In the present invention, at least one module of the first isolated power supply 30A of the A circuit and the first isolated power supply 30B of the B circuit can be arranged along both sides of the transverse central axis I1-I1 in the length direction of the power supply device 100, and form a plurality of air ducts in the length direction.Furthermore, at least one module of the first isolated power supply 30A of path A and at least one module of the first isolated power supply 30B of path B may also be symmetrically distributed along the transverse center axis I1 - I1 of the power supply device 100 .

[0062] In some embodiments, Figure 4C As shown, the isolation circuit module further includes a plurality of primary switch elements 811 and a plurality of secondary switch elements 821, and the plurality of primary switch elements 811 and the plurality of secondary switch elements 821 are arranged on the PCB board 90, and the isolation circuit module is connected to the main board 60 of the power supply device through the primary pin 812 and the secondary pin 822 of the PCB board 90. Of course, it can be understood that in the present invention, each of the isolated power supplies 30 may also include other devices, circuits, modules, etc., which is not intended to limit the present invention.

[0063] In some embodiments, Figure 4D As shown, the isolation circuit module may also include multiple PCB boards, such as but not limited to PCB board 90 and PCB board 91. The winding of the transformer 80 of the isolation circuit module is formed by copper plating in PCB board 90 and PCB board 91, and the magnetic core of the transformer 80 is inserted and fixed on PCB board 90 and PCB board 91. Further, the winding of the transformer 80 in PCB board 90 and PCB board 91 can be connected by a copper sheet, or by other methods, which are not limited here. The creepage distance between the primary winding and the secondary winding of the transformer 80 can be adjusted by controlling the thickness and number of layers between the PCB layers where the primary winding and the secondary winding of the transformer 80 are located, thereby meeting the insulation requirements between the primary winding and the secondary winding of the transformer 80 of the isolation circuit module in the two-way isolated power supply 30, and realizing double insulation.

[0064] like Figure 4A As shown, the present invention places the fan 20 at a first offset position along the length direction of the power supply device and the vertical center axis I2-I2. The first offset position can be flexibly set according to the actual circuit and is not limited here. In this embodiment, a fan 20 is arranged at the front end of the power supply device 100 and is placed in the center in the width direction, and the connector A of the A path and the connector B of the B path are arranged side by side on the front panel. The ventilation holes on the front panel are concentrated between the connector A of the A path and the connector B of the B path and face the fan 20. By controlling the height and space of the front and rear components of the fan 20, the air duct can be optimized to the maximum extent and the heat dissipation efficiency can be improved.

[0065] like Figure 4AAs shown, in order to ensure that the main power modules of the A / B two-way isolated power supply, such as the PFC module / DC-DC module, can dissipate heat well, the present invention places the fan 20 in the center, and the main power modules of the first isolated power supply 30A of the A-way and the second isolated power supply 30B of the B-way are arranged separately on both sides of the transverse central axis I1-I1 in the length direction of the power supply device to form a better air duct. For example, passive modules / devices such as EMI modules (34A, 34B), capacitor modules (35A, 35B) and modules with less heat generation such as auxiliary power modules (36A, 36B) and control boards (37B) are placed on both sides, showing a trend of diverting to the middle; modules / devices such as PFC modules (31A, 31B) and DC-DC modules (32A, 32B, 33A, 33B) with high heat generation are placed in the middle of the width direction, and at the same time, they are kept at a certain distance from the fan 20. In this way, the heat generating device can be placed in a good air duct to dissipate heat to the greatest extent, and at the same time, the air sucked by the fan 20 can be ensured to have a uniform temperature and ensure that the fan 20 can operate in a safe ambient temperature. Figure 4A The layout shown is the optimal layout in this case. If the power level is lower or the heat generation is less, the main power modules of the first isolated power supply 30A of path A and the second isolated power supply 30B of path B can be placed on both sides in the width direction as needed.

[0066] like Figure 4A As shown, the heat sink A of the PFC module 31A of the first isolated power supply 30 of the A circuit and the heat sink B of the PFC module 31B of the second isolated power supply 30B of the B circuit are relatively close, so an insulating sheet 314 can be inserted between the heat sinks of the two isolated power supplies to increase the creepage distance between the two heat sinks. In some embodiments, Figure 4B As shown, the PCB board of at least one of the PFC module and the DC-DC module is also provided with a slot 70 at the plug-in position of the main board 60 to improve the insulation effect between the first isolated power supply 30A of the A path and the second isolated power supply 30B of the B path, thereby meeting the insulation requirements between the first isolated power supply 30A of the A path and the second isolated power supply 30B of the B path and realizing double insulation.

[0067] like Figure 5As shown, it shows the structure of the second part 33A of the DC-DC module A (or the second part 33B of the DC-DC module B) in the DC-DC module A using the LLC topology circuit, that is, the structure of the secondary circuit part of the DC-DC module. The second part 33A of the DC-DC module A can be plugged into the main board 60 through the pin 822. Among them, the magnetic element, such as the integrated inductor 331 and the integrated transformer 332, is placed on the PCB board 90 at a position away from the main board 60, and the surface mounted device (Surface Mounted Devices, SMD) 333, such as but not limited to the switch element, is attached to the lower side of the magnetic element, that is, the position on the PCB board 90 close to the main board 60. It can be understood that the integrated inductor 331 and the integrated transformer 332 can also be integrated into a magnetic element. Although the magnetic element itself is seriously blocked by wind, the heat generation of the magnetic element is relatively low compared to the switch element. Due to the presence of the larger magnetic element, the inter-board air duct at the position of the PCB board 90 close to the main board is better, the wind speed is high, and the heat dissipation efficiency is high. At the same time, since the air ducts in the areas of the auxiliary power modules 36A and 36B on both sides of the second part 33A of the DC-DC module and the second part 33B of the DC-DC module B are unobstructed, such a layout can ensure that the entire power supply device obtains sufficient heat dissipation airflow to meet the thermal requirements. It can be understood that the primary circuit part of the DC-DC module also adopts the above-mentioned similar structure layout, which will not be repeated here.

[0068] In the present invention, reference is made to Figure 4A , along the width direction of the power supply device 100, a windproof filler 38 is also provided in the space between the fan 20 and the housing 40 to prevent the wind generated by the fan 20 from flowing back and reducing the effective heat dissipation efficiency of the fan. Considering the cost and ease of use, the present invention preferably uses foam for partitioning. Of course, it is understandable that in other embodiments of the present invention, the partition can also be achieved by components, PCB boards or other structural parts.

[0069] The heat dissipation duct simulation of the power supply device of the present invention is as follows Figure 6 As shown by Figure 6 It can be seen that the power supply device of the present invention can form a central air duct 61 and a side air duct 62 in the center and on both sides, respectively, and the wind flow rate flowing through the central main heating area is higher than the wind flow rate flowing to the two sides, which is consistent with the above analysis. In some embodiments, the two isolated power supplies 30 are arranged behind the air outlet of the at least one fan 20, and the air outlet of the at least one fan 20 is used to dissipate heat for the two isolated power supplies, and the wind direction is the first direction. In some embodiments, the two isolated power supplies 30 are arranged behind the air inlet of the at least one fan 20, and the air inlet of the at least one fan 20 is used to dissipate heat for the two isolated power supplies, and the wind direction is the second direction.

[0070] Preferably, if Figure 7 As shown, in the present invention, the two input ports 10 (including 10A and 10B) can be connected to a ground at a ground point through a grounding structure 12 .

[0071] The grounding structure 12 may include a first grounding member 12A and a second grounding member 12B. The first grounding member 12A is correspondingly mounted on the first input port 10A and has a first connecting portion 121A and a first grounding portion 122A, wherein the first connecting portion 121A is connected to the first grounding terminal 101A of the first input port 10A. The second grounding member 12B is correspondingly mounted on the second input port 10B and has a second connecting portion 121B and a second grounding portion 122B, wherein the second connecting portion 121B is connected to the second grounding terminal 101B of the second input port 10B. The first grounding portion 122A and the second grounding portion 122B may be connected to the housing 40 at the grounding point through a connecting member 13 (e.g., a screw) and grounded.

[0072] Preferably, in the present invention, part of the first grounding member 12A further forms a first electromagnetic shielding portion 123A, and part of the second grounding member 12B further forms a second electromagnetic shielding portion 123B. The present invention combines EMI protection design and space optimization, by eliminating the conventional PE flying wire of the A / B two-way input, and using a connector to simultaneously fix the A / B two-way input to the housing to complete grounding at the same grounding point, which can save internal space, improve insulation effect, and optimize the heat dissipation duct.

[0073] Of course, it can be understood that in other embodiments of the present invention, the two input ports 10 (including 10A and 10B) can also be grounded respectively.

[0074] like Figure 8 As shown, the dual-input power supply device of the present invention can use dual C14 connectors for input A and input B, and the isolated power supply of channel A and the isolated power supply of channel B are both of a two-stage topology structure, with the front stage being a PFC circuit or a pre-voltage regulation circuit, and the back stage being a DC-DC circuit. Moreover, the main power outputs on the output sides of the DC-DC circuits of channels A and B are respectively connected in parallel after passing through a first anti-reverse circuit (such as an ORing circuit) to synthesize one output to power the load. For example, the main power outputs of the isolated power supply of channel A and the isolated power supply of channel B are respectively connected in parallel after passing through a first anti-reverse circuit A and a first anti-reverse circuit B to form a first output. In some embodiments, as Figure 8As shown, the isolated power supply of path A and the isolated power supply of path B may also include a spare output respectively. The spare outputs of the isolated power supply of path A and the isolated power supply of path B are respectively connected in parallel after passing through the second anti-reverse circuit C and the second anti-reverse circuit D to form a second output. The second anti-reverse circuit may be, for example, an ORing circuit.

[0075] In the present invention, each isolated power supply may include at least one control chip for controlling the isolated power supply. Moreover, any one of the control chips of the two isolated power supplies can also be used to communicate with an external system. Due to the insulation requirements between the two isolated power supplies, each needs to be controlled by at least one control chip. Since the dual-channel input power supply is still a power supply for the system, in order to facilitate communication with the system, the present invention can use one of the control chips to complete communication with the external system while controlling the A-channel isolated power supply or the B-channel isolated power supply. In some embodiments, the power supply device can also use another control chip to communicate with the external system. The above-mentioned control chip is, for example but not limited to, a single-chip microcomputer, a digital signal processor (Digital Signal Processor, DSP), etc.

[0076] like Figure 8 As shown, this embodiment can be controlled by two control chips, wherein the PFC circuit A of the isolated power supply of the A circuit can be controlled by the primary control chip A, and the PFC circuit B of the isolated power supply of the B circuit can be controlled by the primary control chip B, and the primary control chip A and the primary control chip B can be respectively coupled to the DC-DC circuit A and the DC-DC circuit B through a photocoupler to respectively control the operation of the DC-DC circuit A and the DC-DC circuit B. Either the primary control chip A or the primary control chip B can communicate with an external system through another photocoupler.

[0077] like Fig. 9 As shown, this embodiment can also be controlled by three control chips, wherein the PFC circuit A of the isolated power supply on path A can be controlled by the primary control chip A, and the PFC circuit B of the isolated power supply on path B can be controlled by the primary control chip B, and the primary control chip A and the primary control chip B can be coupled to the secondary control chip through an optocoupler respectively, and the secondary control chip can control the DC-DC circuit A of the isolated power supply on path A and the DC-DC circuit B of the isolated power supply on path B and simultaneously realize communication with an external system.

[0078] like Fig.10As shown, this embodiment can also be controlled by five control chips, and the two isolated power supplies respectively include a primary control chip and a secondary control chip, and the power supply device also includes a communication control chip. Among them, the PFC circuit A of the isolated power supply of the A circuit can be controlled by the primary control chip A, and the PFC circuit B of the isolated power supply of the B circuit can be controlled by the primary control chip B, and the primary control chip A and the primary control chip B can be respectively coupled to the secondary control chip A and the secondary control chip B through a photoelectric coupler, and the secondary control chip A can control the DC-DC circuit A of the isolated power supply of the A circuit, and the secondary control chip B can control the DC-DC circuit B of the isolated power supply of the B circuit. The secondary control chip A and the secondary control chip B are connected to the communication control chip, and the communication control chip can realize communication with the external system.

[0079] The present invention proposes a power supply device with dual input, which can keep the original input connector unchanged, without changing the existing power distribution system, saving production costs, for example, two 1.5kW power modules can be integrated into one power supply housing. Compared with the traditional single-input power supply device, the dual-input power supply device of the present invention requires double the devices, which poses a great challenge to insulation and heat dissipation. Therefore, the present invention provides sufficient insulation distance and optimizes the air duct by using methods such as modular circuit design, thereby improving the heat dissipation capacity and ensuring a good heat dissipation effect.

[0080] The modular dual-input power supply device proposed in the present invention can greatly increase the power supply of the data center computer room under the premise of keeping the total number of power supplies unchanged. Since there is no need to replace the input terminal, it is possible to avoid the modification of the existing data center computer room power distribution system, greatly reducing the cost of computer room expansion; at the same time, there is no need to change the output terminal, so it can be compatible with the original system; by using a modular circuit design, while improving the heat dissipation inside the power supply and the insulation performance between the two isolated power supplies, it can also improve the manufacturability and reduce the production cost.

[0081] In general, the modular dual-input power supply device proposed in the present invention is an efficient and low-cost design solution for high-power power supply that serves the transformation of existing data center computer rooms.

[0082] The exemplary embodiments of the present invention are specifically shown and described above. It should be understood that the present invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A power supply device, characterized in that: include: Two input ports, the two input ports are arranged at the front end of the power supply device; at least one fan, the at least one fan being disposed behind the two input ports; as well as Two isolated power supplies, the two isolated power supplies are connected to the two input ports in a one-to-one correspondence and are arranged behind the two input ports and the at least one fan, the main power circuit of each of the isolated power supplies includes at least one module, each of the modules includes a PCB board, and a magnetic element and / or a switch element combined with the PCB board, the at least one module includes an isolation circuit module, the winding of the transformer of the isolation circuit module is formed by copper plating in the PCB board, the magnetic core of the transformer is fixed on the PCB board, and the at least one fan is used to dissipate heat for the at least one module.

2. The power supply device according to claim 1, characterized in that: The invention also includes a casing, wherein the casing forms a containing space for containing the two input ports, the at least one fan and the two isolated power supplies.

3. The power supply device according to claim 1, characterized in that: The isolation circuit module includes a plurality of PCB boards, the winding of the transformer of the isolation circuit module is formed by copper plating in the plurality of PCB boards, and the magnetic core of the transformer is fixed on the plurality of PCB boards.

4. The power supply device according to claim 1, characterized in that: The at least one module further includes at least one of a PFC module, a DC-DC module, an EMI module, a capacitor module and an auxiliary power module.

5. The power supply device according to claim 4, characterized in that: The invention also includes a main board, the PCB board of the DC-DC module is plugged into the main board, the magnetic element of the DC-DC module on the PCB board is placed away from the main board, the switch element of the DC-DC module on the PCB board is placed close to the main board, and an inter-board air duct is formed at a position of the PCB board close to the main board.

6. The power supply device according to claim 4, characterized in that: An insulating sheet is also provided between the heat sinks of the two PFC modules of the two isolated power supplies.

7. The power supply device according to claim 4, characterized in that: It also includes a main board, and the at least one module is arranged on the main board, wherein the PCB board of at least one of the PFC module and the DC-DC module is also provided with a slot at the insertion position of the main board.

8. The power supply device according to claim 2, characterized in that: The external dimensions of the power supply device include a height of 38-46 mm and a width of 60-80 mm.

9. The power supply device according to claim 1, characterized in that: The at least one fan is two fans, and the two fans are connected in series.

10. The power supply device according to claim 1, characterized in that: The at least one fan is placed at a first offset position along the length direction of the power supply device relative to the vertical central axis.

11. The power supply device according to claim 2, characterized in that: The at least one fan is placed centrally along the width direction of the power supply device; the two input ports are arranged side by side on the front panel of the casing along the width direction of the power supply device, and the front panel has a plurality of ventilation holes, and the plurality of ventilation holes are concentrated between the two input ports and are arranged corresponding to the at least one fan.

12. The power supply device according to claim 2, characterized in that: Along the width direction of the power supply device, a wind-blocking filler is arranged in the space between the at least one fan and the housing to prevent the wind generated by the at least one fan from flowing back.

13. The power supply device according to claim 1, characterized in that: The two input ports are grounded respectively.

14. The power supply device according to claim 1, characterized in that: The two input ports are connected to a ground through a grounding structure at a grounding point.

15. The power supply device according to claim 14, characterized in that: The grounding structure comprises: A first grounding member, mounted correspondingly on the first input port of the two input ports, and comprising a first connecting portion and a first grounding portion, wherein the first connecting portion is connected to the first grounding end of the first input port; A second grounding member is mounted correspondingly on the second input port of the two input ports and comprises a second connecting portion and a second grounding portion, wherein the second connecting portion is connected to the second grounding end of the second input port; The first grounding portion and the second grounding portion are connected to the housing at the grounding point through a connecting member and are grounded.

16. The power supply device according to claim 15, characterized in that: Part of the first grounding member further forms a first electromagnetic shielding portion, and part of the second grounding member further forms a second electromagnetic shielding portion.

17. The power supply device according to claim 1, characterized in that: The two input ports are C14 connectors or C20 connectors.

18. The power supply device according to claim 1, characterized in that: The input of the isolated power supply is AC input or DC input.

19. The power supply device according to claim 1, characterized in that: Each of the isolated power supplies has a main power output, and the two main power outputs of the two isolated power supplies are connected in parallel after passing through a first anti-reverse circuit to form a first output.

20. The power supply device according to claim 19, characterized in that: Each of the isolated power supplies also has a spare output, and the two spare outputs of the two isolated power supplies are connected in parallel after passing through a second anti-reverse circuit to form a second output.

21. The power supply device according to claim 1, characterized in that: The isolated power supply is a single-stage circuit; or, the isolated power supply is a two-stage circuit, which includes a front-stage circuit and a rear-stage circuit, wherein the front-stage circuit is a PFC circuit or a pre-voltage regulation circuit, and the rear-stage circuit is a DC-DC circuit.

22. The power supply device according to claim 1, characterized in that: Each of the isolated power supplies includes at least one control chip for controlling the isolated power supply.

23. The power supply device according to claim 22, characterized in that: The control chip of any one of the two isolated power supplies is also used to communicate with an external system.

24. The power supply device according to claim 22, characterized in that: The power supply device further includes another control chip, and the control chip is used to communicate with an external system.

Citation Information

Patent Citations

  • Power supply device

    CN215600682U