Image sensors, camera modules and electronic devices

Abstract

The present application discloses an image sensor, a camera module and an electronic device. The image sensor comprises: a photoelectric unit; a lens unit, which is arranged on one side of the photoelectric unit; a light filtering and heat dissipation unit, which comprises: a thermal conductive layer and a light filtering layer; the thermal conductive layer and the light filtering layer are sequentially stacked between the photoelectric unit and the lens unit, or the light filtering layer and the thermal conductive layer are sequentially stacked between the photoelectric unit and the lens unit.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an image sensor, a camera module and an electronic device. Background Art

[0002] Consumer electronics such as mobile phones have become an indispensable tool in people's daily lives. Users are accustomed to using their mobile phones to record some special and classic scenes in life, such as large-scale light shows, music festivals, celebrity concerts, etc. In these scenes, there are often some strong lasers. Lasers have high brightness and high directionality. When the laser is irradiated on the camera module, due to the focusing effect of the lens, the laser is converged by the lens to form a high energy density area on the surface of the image sensor. The accumulated high heat cannot be dissipated, and eventually burns the image sensor, causing the camera module to fail. This failure phenomenon will seriously affect the consumer's experience.

[0003] The current solution to solve the problem of laser burns to image sensors mostly involves setting up a laser detection device to detect lasers in the scene. However, this solution has problems such as slow detection speed and the need for external auxiliary components, and cannot fundamentally solve the problem of image sensors being susceptible to laser burns. Summary of the invention

[0004] The present application aims to provide an image sensor, a camera module and an electronic device, which at least solve the problem that a high energy density area is formed on the surface of the image sensor after being converged by a lens, and the accumulated high heat cannot be dissipated.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an image sensor, including:

[0007] Photovoltaic unit;

[0008] A lens unit, arranged on one side of the photoelectric unit;

[0009] The light filtering and heat dissipation unit comprises: a temperature conducting layer and a light filtering layer;

[0010] The thermal conductive layer and the optical filter layer are sequentially stacked between the photoelectric unit and the lens unit, or the optical filter layer and the thermal conductive layer are sequentially stacked between the photoelectric unit and the lens unit.

[0011] In a second aspect, an embodiment of the present application provides a camera module, including:

[0012] An image sensor, the image sensor comprising: a photoelectric unit; a lens unit, arranged on one side of the photoelectric unit; a light filtering and heat dissipation unit, comprising: a thermal conductive layer and a light filtering layer; the thermal conductive layer and the light filtering layer are sequentially stacked between the photoelectric unit and the lens unit, or the light filtering layer and the thermal conductive layer are sequentially stacked between the photoelectric unit and the lens unit.

[0013] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0014] The image sensor comprises: a photoelectric unit; a lens unit, which is arranged on one side of the photoelectric unit; a light filtering and heat dissipation unit, which comprises: a temperature conducting layer and a light filtering layer; the temperature conducting layer and the light filtering layer are sequentially stacked between the photoelectric unit and the lens unit, or the light filtering layer and the temperature conducting layer are sequentially stacked between the photoelectric unit and the lens unit;

[0015] A data processing module, electrically connected to the image sensor;

[0016] The display module is electrically connected to the data processing module.

[0017] In an embodiment of the present application, the image sensor is provided with a photoelectric unit, a lens unit and a light filtering and heat dissipation unit. The light filtering and heat dissipation unit includes a thermal conductive layer and a light filtering layer. The thermal conductive layer and the light filtering layer are sequentially stacked between the photoelectric unit and the lens unit, or sequentially stacked between the lens unit and the photoelectric unit. According to the arrangement of the thermal conductive layer and the light filtering layer, the thermal conductive layer can dissipate heat for the photoelectric unit or the lens unit, and can complete the light filtering function, quickly dissipate the high heat accumulated in the image sensor, avoid the high energy density area formed in the image sensor after the laser converges, thereby effectively solving the burn problem caused by heat accumulation.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a schematic diagram of an image sensor provided according to an embodiment of the present application;

[0021] Figure 2 is a schematic diagram of an image sensor provided according to another embodiment of the present application;

[0022] Figure 3 is a schematic diagram of a filter layer provided according to an embodiment of the present application;

[0023] Figure 4 is a schematic diagram of a nanocolumn provided according to an embodiment of the present application;

[0024] Figure 5 is a schematic diagram of an image sensor provided according to another embodiment of the present application;

[0025] Figure 6 yes Figure 5 A partial schematic diagram of an image sensor;

[0026] Reference numerals:

[0027] Among them, 100, lens unit; 200, filter and heat dissipation unit; 210, thermal conductive layer; 2101, first thermal conductive layer; 2102, second thermal conductive layer; 220, filter layer; 2201, nano column; 2202, filling medium; 2203, red filter unit; 2204, green filter unit; 2205, blue filter unit; 300, photoelectric unit; 310, photodiode; 320, metal layer. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0029] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] Existing image sensors are mainly composed of the following components: microlens array, color filters (CF), photodiode (PD), and metal wiring. Taking backside illumination (BSI) as an example, due to the dense stacking structure of color filters, microlens arrays, and photodiodes, the heat dissipation performance of the surface of traditional image sensors is poor. The high heat accumulated on the chip surface after the laser is focused by the lens cannot be quickly dissipated. When the heat reaches the damage threshold of about 50kW / cm 2 When the battery is too low, it will cause the image sensor to burn out, making the camera module ineffective.

[0032] To solve the above problems, this embodiment provides an image sensor. Figure 1 and Figure 2 The image sensor proposed according to the embodiment of the present application is described. The image sensor is a complementary metal oxide semiconductor (CMOS) sensor. The image sensor uses the photoelectric conversion function of the photoelectric device to convert the light image on the photosensitive surface into an electrical signal that is proportional to the light image.

[0033] like Figure 1 and Figure 2 As shown, the image sensor includes: a lens unit 100, a light filtering and heat dissipation unit 200 and a photoelectric unit 300. The light filtering and heat dissipation unit 200 includes: a temperature conductive layer 210 and a light filtering layer 220.

[0034] The lens unit 100 is a microlens array (MLA), which is an array of multiple small lenses and is used to converge and diverge light radiation. The photoelectric unit 300 is used to convert the optical signal into an electrical signal and transmit the electrical signal to the light filtering and heat dissipation unit 200, which is arranged between the lens unit 100 and the photoelectric unit 300. The thermal conductive layer 210 and the filter layer 220 in the light filtering and heat dissipation unit 200 can be adjusted according to the needs.

[0035] like Figure 1 As shown, when the heat accumulated after the laser is converged by the lens unit 100 is mainly in the lens unit 100, the filter layer 220 and the thermal conductive layer 210 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, that is, the thermal conductive layer 210 is arranged on the side close to the lens unit 100, and the filter layer 220 is arranged on the side close to the photoelectric unit 300, so that the thermal conductive layer 210 can quickly conduct the heat in the lens unit 100 to avoid the heat from being gathered in the lens unit 100. At the same time, the filter layer 220 can replace the color filter to complete the filtering function, thereby ensuring the normal operation of the image sensor.

[0036] like Figure 2 As shown, when the heat accumulated after the laser is converged by the lens unit 100 is mainly in the photoelectric unit 300, the thermal conductive layer 210 and the filter layer 220 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, that is, the filter layer 220 is arranged on the side close to the lens unit 100, and the thermal conductive layer 210 is arranged on the side close to the photoelectric unit 300, so that the thermal conductive layer 210 can quickly conduct the heat in the photoelectric unit 300 to avoid heat convergence in the photoelectric unit 300. At the same time, the filter layer 220 can replace the color filter to complete the filtering function to ensure the normal operation of the image sensor.

[0037] After the laser is converged and enters through the lens unit 100, the thermal conductive layer 210 can output the heat in the lens unit 100 or the optoelectronic unit 300 according to the arrangement, ensuring that there is no risk of damage in the high energy density area formed in the image sensor after the laser is converged by the lens unit 100.

[0038] In an embodiment of the present application, the image sensor is provided with a photoelectric unit 300, a lens unit 100 and a light filtering and heat dissipation unit 200. The light filtering and heat dissipation unit 200 includes a thermal conductive layer 210 and a light filtering layer 220. The thermal conductive layer 210 and the light filtering layer 220 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, or sequentially stacked between the lens unit 100 and the photoelectric unit 300. According to the arrangement of the thermal conductive layer 210 and the light filtering layer 220, the thermal conductive layer 210 can dissipate heat for the photoelectric unit 300 or the lens unit 100, and can complete the light filtering function, quickly dissipate the high heat accumulated in the image sensor, and avoid the high energy density area formed in the image sensor after the laser converges, thereby effectively solving the burn problem caused by heat accumulation.

[0039] In one example, if Figure 1 to Figure 2 As shown, the thermal conductive layer 210 includes: a graphene thermal conductive layer.

[0040] The graphene thermal conductive layer is a single-layer carbon atom surface material. The room temperature thermal conductivity of a single-layer suspended graphene can reach 3000-5300 W.m -1 .K -1 The graphene thermal conductive layer is a new material with the best thermal conductivity in the thermal conductive material industry. The graphene thermal conductive layer is only 0.34nm thick and has a visible light transmittance of 97%. The graphene thermal conductive layer can be quickly deposited using a high-temperature vapor deposition process (Chemical Vapor Deposition, CVD) with a mature process. Depending on the location of the installation, it can be used to quickly export the heat from the photoelectric unit 300 or the lens unit 100, ensuring that there is no risk of damage to the high energy density area formed after the laser is converged by the lens.

[0041] When the heat accumulated after the laser is converged by the lens unit 100 is mainly in the lens unit 100, as Figure 1 As shown, the graphene thermal conductive layer is arranged between the filter layer 220 and the lens unit 100, so that the graphene thermal conductive layer can quickly conduct the heat in the lens unit 100 to avoid heat accumulation in the lens unit 100. At the same time, the filter layer 220 can replace the color filter to complete the filtering function and ensure the normal operation of the image sensor.

[0042] When the heat accumulated after the laser is converged by the lens unit 100 is mainly in the photoelectric unit 300, as shown in FIG. Figure 2 As shown, the graphene thermal conductive layer is disposed between the filter layer 220 and the photoelectric unit 300. Thus, the graphene thermal conductive layer can quickly conduct the heat in the photoelectric unit 300 to avoid heat accumulation in the photoelectric unit 300. At the same time, the filter layer 220 can replace the color filter to complete the filtering function and ensure the normal operation of the image sensor.

[0043] In one example, if Figures 1 to 3 As shown, the filter layer 220 includes: a plurality of filter sub-units. The filter sub-units are arranged in an array, and the filter function is achieved through the array arrangement of the filter sub-units.

[0044] When the filter layer 220 and the thermal conductive layer 210 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, as shown in FIG. Figure 1 As shown, each filter unit is arranged between the photoelectric unit 300 and the thermal conductive layer 210 , so that the filter unit completes the filtering function, and the thermal conductive layer 210 quickly conducts the heat in the lens unit 100 to avoid heat accumulation in the lens unit 100 .

[0045] When the temperature conducting layer 210 and the filter layer 220 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, as shown in FIG. Figure 2 As shown, each filter unit is arranged between the lens unit 100 and the thermal conductive layer 210 , so that the filter unit completes the filtering function, and the thermal conductive layer 210 quickly conducts the heat in the photoelectric unit 300 to avoid heat accumulation in the photoelectric unit 300 .

[0046] In this embodiment, Figures 1 to 4As shown, the filter unit includes: a nanocolumn 2201 and a filling medium 2202 surrounding the nanocolumn 2201. The refractive index of the filling medium 2202 is greater than or less than the refractive index of the nanocolumn 2201. Since there are multiple filter units, each nanocolumn 2201 is separated by the filling medium 2202. Therefore, after the laser enters the nanocolumn 2201, the refractive index of the nanocolumn 2201 is not equal to the refractive index of the filling medium 2202, so the propagation direction of the laser will change, and the propagation direction of different light rays can be changed. According to the corresponding setting of the filter unit, the filtering function can be completed.

[0047] When the heat accumulated after convergence is mainly in the lens unit 100, the filter layer 220 and the thermal conductive layer 210 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, and the nanorods 2201 and the filling medium 2202 are arranged between the photoelectric unit 300 and the thermal conductive layer 210. Thus, the thermal conductive layer 210 can quickly conduct the heat in the lens unit 100 to avoid the heat from being gathered in the lens unit 100, and at the same time, the nanorods 2201 and the filling medium 2202 surrounding the nanorods 2201 can replace the color filter to complete the filtering function, thereby ensuring the normal operation of the image sensor.

[0048] When the heat accumulated after convergence is mainly in the photoelectric unit 300, the thermal conductive layer 210 and the filter layer 220 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, and the nanorods 2201 and the filling medium 2202 are arranged between the lens unit 100 and the thermal conductive layer 210. Thus, the thermal conductive layer 210 can quickly conduct the heat in the photoelectric unit 300 to avoid the convergence of heat in the photoelectric unit 300. At the same time, the nanorods 2201 and the filling medium 2202 surrounding the nanorods 2201 can replace the color filter to complete the filtering function, thereby ensuring the normal operation of the image sensor.

[0049] Among them, the nanocolumn 2201 is composed of at least one of high refractive index and high transmittance materials such as silicon nitride Si3N4, titanium dioxide TiO2 and amorphous silicon a-Si, and its cross-sectional shape can be a centrally symmetrical circle or square to avoid the influence of polarization on the color filtering performance. The material of the filling medium 2202 can include but is not limited to air, polycarbonate (PC), polymethyl methacrylate (PMMA) and other materials. Of course, the manufacturing materials of the nanocolumn 2201 listed here can also be used as the manufacturing materials of the filling medium 2202, and the manufacturing materials of the filling medium 2202 can also be used as the manufacturing materials of the nanocolumn 2201.

[0050] It should be noted that when air is used as the filling medium 2202, the nanorods 2201 are arranged in intervals with the air. Compared with the densely arranged traditional color filters, the air can act as a thermal buffer layer to facilitate the rapid dissipation of accumulated heat, further avoiding heat accumulation and causing burns to the image sensor.

[0051] In order to achieve filtering of different colors, such as Figure 3 and Figure 4 As shown, the optical parameters of the plurality of filter sub-units are different, including: a red filter sub-unit 2203 , a green filter sub-unit 2204 and a blue filter sub-unit 2205 .

[0052] Considering the requirements of the traditional visible light CMOS sensor for the separation of the three colors of red R, green G, and blue B, the red filter subunit 2203 can only pass red light, the green filter subunit 2204 can only pass green light, and the blue filter subunit 2205 can only pass blue light. The heights of the nanopillars 2201 in the red filter subunit 2203, the green filter subunit 2204, and the blue filter subunit 2205 are all equal, and the height h of the nanopillars 2201 can be 300 to 800 nm. The nanopillars 2201 are arranged with p as a period, and the size of p can be designed to be 300 to 600 nm. Since the filter and heat dissipation unit 200 needs to separate the three different wavelengths of RGB light, the size of the nanopillars 2201 in the red filter subunit 2203, the green filter subunit 2204, and the blue filter subunit 2205 gradually decreases along the direction perpendicular to the laser propagation direction. When the nanorod 2201 is a cylinder, the diameter d of the nanorod 2201 in the corresponding area will be significantly different. Usually, the size of d is proportional to the target wavelength of the color filter. d1, d2, and d3 are the diameters of the nanorod 2201 corresponding to the blue, green, and red areas, respectively. Usually, d1 <d2<d3。

[0053] Based on the above embodiments, Figure 5 and Figure 6 As shown, the thermal conductive layer 210 includes: a first thermal conductive layer 2101 and a second thermal conductive layer 2102. The first thermal conductive layer 2101 and the second thermal conductive layer 2102 are respectively arranged on both sides of the filter layer 220. The first thermal conductive layer 2101 is used for heat conduction of the lens unit 100, and the first thermal conductive layer 2101 is arranged between the lens unit 100 and the filter layer 220. The second thermal conductive layer 2102 is used for heat conduction of the photoelectric unit 300, and the second thermal conductive layer 2102 is arranged between the photoelectric unit 300 and the filter layer 220.

[0054] When the heat accumulated after the laser is converged by the lens unit 100 is mainly in the lens unit 100 and the photoelectric unit 300, the first thermal conductive layer 2101 can quickly conduct the heat in the lens unit 100 to avoid the heat being gathered in the lens unit 100, and the second thermal conductive layer 2102 can quickly conduct the heat in the photoelectric unit 300 to avoid the heat being gathered in the photoelectric unit 300. At the same time, the filter layer 220 can replace the color filter to complete the filtering function, thereby ensuring the normal operation of the image sensor.

[0055] like Figure 6 As shown, the filter unit includes: a nanocolumn 2201 and a filling medium 2202 surrounding the nanocolumn 2201. The nanocolumn 2201 is supported between the first thermal conductive layer 2101 and the second thermal conductive layer 2102, and the refractive index of the filling medium 2202 is greater than or less than the refractive index of the nanocolumn 2201. Since there are multiple filter units, each nanocolumn 2201 is separated by the filling medium 2202. Therefore, after the laser enters the nanocolumn 2201, since the refractive index of the nanocolumn 2201 is not equal to the refractive index of the filling medium 2202, the propagation direction of the laser will change, and the propagation direction of different light rays can be changed. According to the corresponding settings of the filter unit, the filtering function can be completed.

[0056] When air is used as the filling medium 2202, the nanorods 2201 are arranged in intervals with the air. Compared with the densely arranged traditional color filters, the air can act as a thermal buffer layer to facilitate the rapid dissipation of the heat accumulated on the first thermal conductive layer 2101 and the second thermal conductive layer 2102, thereby avoiding heat accumulation and causing burns to the image sensor.

[0057] Based on the above embodiments, Figures 1 to 5 As shown, the photoelectric unit includes: a photodiode 310 and a metal layer 320. The photodiode 310 is used to convert an optical signal into an electrical signal. The photodiode 310 is arranged on a side of the light filtering and heat dissipation unit 200 away from the lens unit 100. According to the location of the heat conduction layer 210, the photodiode 310 can be selectively abutted against the heat conduction layer 210 or the light filtering layer 220. The metal layer 320 is used to transmit the electrical signal converted by the photodiode 310, and the metal layer 320 is arranged on a side of the photodiode 310 away from the light filtering and heat dissipation unit 200.

[0058] When the image sensor is in operation, if the laser is incident on the lens unit 100, the heat accumulated after being converged by the lens unit 100 can be conducted by the thermal conductive layer 210 to avoid heat convergence in the lens unit 100 or the photoelectric unit 300. At the same time, the filter layer 220 filters the interfering light signal, and the photodiode 310 converts the remaining light signal into an electrical signal and transmits it to the metal layer 320.

[0059] The present application also provides a camera module, including: an image sensor. Figure 1 and Figure 2 As shown, the image sensor includes: a lens unit 100, a filter heat dissipation unit 200 and a photoelectric unit 300. The filter heat dissipation unit 200 includes: a thermal conductive layer 210 and a filter layer 220. The lens unit 100 is a microlens array, which is an array composed of a plurality of small lenses and is used to converge and diverge light radiation. The photoelectric unit 300 is used to convert the optical signal into an electrical signal and transmit the electrical signal to the filter heat dissipation unit 200, which is arranged between the lens unit 100 and the photoelectric unit 300. The thermal conductive layer 210 and the filter layer 220 in the filter heat dissipation unit 200 can be adjusted as needed.

[0060] like Figure 1 As shown, when the laser enters the camera module and the heat accumulated after being converged by the lens unit 100 is mainly in the lens unit 100, the filter layer 220 and the thermal conductive layer 210 are sequentially stacked between the photoelectric unit 300 and the lens unit 100, that is, the thermal conductive layer 210 is arranged on the side close to the lens unit 100, and the filter layer 220 is arranged on the side close to the photoelectric unit 300, so that the thermal conductive layer 210 can quickly conduct the heat in the lens unit 100 to avoid heat convergence in the lens unit 100. At the same time, the filter layer 220 can replace the color filter to complete the filtering function to ensure the normal operation of the camera module.

[0061] like Figure 2 As shown, when the laser enters the camera module and the heat accumulated after being converged by the lens unit 100 is mainly in the photoelectric unit 300, the thermal conductive layer 210 and the filter layer 220 are stacked in sequence between the photoelectric unit 300 and the lens unit 100, that is, the filter layer 220 is arranged on the side close to the lens unit 100, and the thermal conductive layer 210 is arranged on the side close to the photoelectric unit 300, so that the thermal conductive layer 210 can quickly conduct the heat in the photoelectric unit 300 to avoid heat convergence in the photoelectric unit 300. At the same time, the filter layer 220 can replace the color filter to complete the filtering function to ensure the normal operation of the camera module.

[0062] In an embodiment of the present application, the camera module is provided with the above-mentioned image sensor, so that the thermal conductive layer 210 can dissipate heat for the photoelectric unit 300 or the lens unit 100, and can complete the filtering function, quickly dissipate the high heat accumulated in the image sensor, and avoid the high energy density area formed in the image sensor after the laser converges, thereby effectively solving the burn problem caused by heat accumulation.

[0063] The embodiment of the present application also provides an electronic device, which may be a mobile phone, a tablet, a computer, an electronic watch, etc. Taking a mobile phone as an example, the electronic device includes: an image sensor, a data processing module, and a display module.

[0064] The specific structure of the image sensor can refer to the above embodiment and will not be described here. The data processing module includes a graphics processor, and the image processor is used to process the image data of the obtained static picture or video. The display module includes a display panel, which can be configured in the form of a liquid crystal display, an organic light emitting diode, etc., for displaying the image data processed by the image processor.

[0065] Since the electronic device is provided with an image sensor, the image sensor can quickly dissipate the high heat accumulated in the image sensor, avoiding the high energy density area formed in the image sensor after the laser converges, thereby effectively solving the burn problem caused by heat accumulation in the electronic device.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0067] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An image sensor, characterized in that: include: Photovoltaic unit; A lens unit, arranged on one side of the photoelectric unit; A light filtering and heat dissipation unit is arranged between the photoelectric unit and the lens unit, comprising: a thermal conductivity layer and a light filtering layer; the thermal conductivity layer comprises: a first thermal conductivity layer and a second thermal conductivity layer; the first thermal conductivity layer and the second thermal conductivity layer are respectively arranged on both sides of the light filtering layer, the first thermal conductivity layer is arranged between the lens unit and the light filtering layer, and the second thermal conductivity layer is arranged between the photoelectric unit and the light filtering layer; the light filtering layer comprises: a plurality of light filtering sub-units; each of the light filtering sub-units is arranged in an array; the light filtering sub-unit comprises: a nano-column and a nano-column surrounding the nano-column The nanocolumns are filled with a filling medium; the nanocolumns are arranged between the first thermal conductive layer and the second thermal conductive layer, and the filling medium is used to act as a thermal buffer layer to facilitate heat dissipation; the multiple filter units include: a red filter unit, a green filter unit and a blue filter unit; the heights of the nanocolumns in the red filter unit, the green filter unit and the blue filter unit are equal; the size of the nanocolumns in the red filter unit, the green filter unit and the blue filter unit gradually decreases along the direction perpendicular to the laser propagation direction.

2. The image sensor according to claim 1, characterized in that The refractive index of the filling medium is greater than or less than the refractive index of the nanorods.

3. The image sensor according to claim 2, characterized in that The nanorods are composed of at least one of silicon nitride and titanium dioxide, and the filling medium includes air.

4. The image sensor according to claim 1, characterized in that The thermal conductive layer is a graphene thermal conductive layer.

5. The image sensor according to any one of claims 1 to 4, characterized in that: The photoelectric unit comprises: A photodiode is arranged on a side of the light filtering and heat dissipation unit away from the lens unit and abuts against the light filtering and heat dissipation unit; The metal layer is arranged on a side of the photodiode away from the light filtering and heat dissipation unit.

6. A camera module, characterized in that: include: An image sensor as claimed in any one of claims 1 to 5.

7. An electronic device, characterized in that: include: The image sensor according to any one of claims 1 to 5; A data processing module, electrically connected to the image sensor; The display module is electrically connected to the data processing module.

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