Substrate connector

Abstract

This invention relates to a substrate connector, comprising: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other along a first axis; and a grounding housing coupled to the insulating portion, the grounding housing comprising: a grounding inner wall facing the insulating portion; a grounding outer wall spaced apart from the grounding inner wall; and a grounding connection wall coupled to the grounding inner wall and the grounding outer wall respectively, the grounding inner wall and the grounding outer wall being double shielding walls on the sides surrounding an inner space, the first RF contact and the second RF contact being located in the inner space surrounded by the double shielding walls, the grounding inner wall and the grounding outer wall being respectively connected to the grounding housing of an opposing connector inserted into the inner space.

Description

Technical Field

[0001] The present invention relates to a substrate connector provided in an electronic device for electrical connection between a plurality of substrates. Background Technology

[0002] A connector is a device used for electrical connection in various electronic devices. For example, connectors are used in electronic devices such as mobile phones, computers, and tablets to electrically connect various components within these devices to each other.

[0003] Typically, in electronic devices, RF connectors and board-to-board connectors (hereinafter referred to as "board connectors") are located inside wireless communication devices such as smartphones and tablet PCs. RF connectors transmit RF (Radio Frequency) signals. Board connectors handle digital signals from cameras, etc.

[0004] These RF connectors and substrate connectors are mounted on a PCB (Printed Circuit Board). Because existing technologies involve mounting multiple substrate connectors and RF connectors along with multiple components within a limited PCB space, the PCB mounting area becomes larger. Therefore, with the trend towards miniaturization in smartphones, there is a need for a technology that optimizes the PCB mounting area by integrating the RF connector and substrate connector.

[0005] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0006] Reference Figure 1 The existing substrate connector 100 includes a first connector 110 and a second connector 120.

[0007] The first connector 110 is used to attach to a first substrate (not shown). The first connector 110 can be electrically connected to the second connector 120 through a plurality of first contacts 111.

[0008] The second connector 120 is used for bonding to a second substrate (not shown). The second connector 120 can be electrically connected to the first connector 110 via a plurality of second contacts 121.

[0009] With a plurality of first contacts 111 and a plurality of second contacts 121 connected to each other, the prior art substrate connector 100 can electrically connect the first substrate and the second substrate to each other. Furthermore, when a portion of the plurality of first contacts 111 and the plurality of second contacts 121 are used as a plurality of RF contacts for transmitting RF signals, the prior art substrate connector 100 can be implemented to transmit RF signals between the first substrate and the second substrate via the RF contacts.

[0010] The existing substrate connector 100 has the following problems.

[0011] First, in the existing substrate connector 100, when a plurality of contacts 111 and 121 that are close to each other are used as RF contacts, there is a problem that the signal cannot be transmitted smoothly due to RF signal interference between the plurality of RF contacts 111', 111", 121', and 121".

[0012] Second, in the existing substrate connector 100, although the outermost part of the connector has an RF signal shielding part 112 that can shield RF signals from radiating to the outside, it is impossible to achieve shielding between RF signals.

[0013] Third, in the prior art substrate connector 100, a plurality of RF contacts 111', 111”, 121', and 121” each include a plurality of mounting portions 111a', 111a”, 121a', and 121a” mounted on the substrate, wherein the plurality of mounting portions 111a', 111a”, 121a', and 121a” are configured to be exposed to the outside. Therefore, the prior art substrate connector 100 has the problem that it cannot achieve shielding of the plurality of mounting portions 111a', 111a”, 121a', and 121a”. Summary of the Invention

[0014] The problem that the invention aims to solve

[0015] The present invention is designed to solve the above-mentioned problems and aims to provide a substrate connector that can reduce the possibility of RF signal interference between multiple RF contacts.

[0016] Technical solutions to the problem

[0017] To address the issues described above, the present invention may include the following configuration.

[0018] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other along a first axis; and a grounding cover coupled with the insulating portion. The grounding cover may include: a grounding inner wall facing the insulating portion; a grounding outer wall spaced apart from the grounding inner wall; and a grounding connection wall coupled to the grounding inner wall and the grounding outer wall, respectively. The grounding inner wall and the grounding outer wall may be double shielding walls surrounding an inner space. The first RF contact and the second RF contact may be located in the inner space surrounded by the double shielding walls. The grounding inner wall and the grounding outer wall may be connected to the grounding cover of a corresponding connector inserted into the inner space.

[0019] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other along a first axis; and a grounding cover coupled with the insulating portion. The grounding cover may include: a grounding sidewall surrounding an inner space; a grounding bottom protruding from the lower end of the grounding sidewall toward the inner space; and a grounding arm protruding upward from the grounding bottom. The first RF contact and the second RF contact may be located within the inner space surrounded by the grounding sidewall and the grounding bottom.

[0020] Invention Effects

[0021] According to the present invention, the following effects can be achieved.

[0022] This invention utilizes a grounding enclosure to shield signals and electromagnetic waves from multiple RF contacts. Therefore, this invention prevents electromagnetic waves generated from the multiple RF contacts from being interfered with by signals from multiple circuit components located around the electronic device, and also prevents electromagnetic waves generated from multiple circuit components located around the electronic device from being interfered with by RF signals transmitted through the multiple RF contacts. Thus, this invention utilizes a grounding enclosure to improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance.

[0023] This invention can be implemented such that all of the plurality of RF contacts, including the portion mounted on the substrate, are located inside a grounding enclosure. Therefore, this invention utilizes the grounding enclosure to enhance the shielding function of the plurality of RF contacts, thereby achieving complete shielding. Attached Figure Description

[0024] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0025] Figure 2 This is a schematic perspective view of the socket connector and plug connector in the substrate connector of the present invention.

[0026] Figure 3 This is a schematic perspective view of the substrate connector of the first embodiment.

[0027] Figure 4 This is a schematic exploded perspective view of the substrate connector of the first embodiment.

[0028] Figure 5 This is a schematic top view of the substrate connector of the first embodiment.

[0029] Figure 6 This is a schematic perspective view of the grounding cover of the substrate connector in the first embodiment.

[0030] Figure 7 Therefore Figure 3 The schematic side sectional view, with line II as reference, shows the configuration of the substrate connector of the first embodiment and the substrate connector of the second embodiment before they are combined.

[0031] Figure 8 It is magnification Figure 7 Part A shows a schematic side sectional view of the configuration of the substrate connector of the first embodiment and the substrate connector of the second embodiment.

[0032] Figures 9 to 12 It is magnification Figure 7 Part B shows a schematic side sectional view of the configuration of the substrate connector of the first embodiment and the substrate connector of the second embodiment.

[0033] Figure 13 This is a schematic top view used to illustrate the grounding loop in the substrate connector of the first embodiment.

[0034] Figure 14 This is a schematic perspective view of a modified embodiment of the substrate connector of the first embodiment.

[0035] Figure 15 In a modified embodiment of the substrate connector of the first embodiment, Figure 14A schematic partial side sectional view shown with reference to line II-II.

[0036] Figure 16 This is a schematic perspective view of the substrate connector of the second embodiment.

[0037] Figure 17 This is a schematic exploded perspective view of the substrate connector of the second embodiment.

[0038] Figure 18 This is a schematic top view of the substrate connector of the second embodiment.

[0039] Figure 19 This is a schematic perspective view of the grounding cover of the substrate connector in the second embodiment.

[0040] Figure 20 It is magnification Figure 7 Part B shows a schematic side sectional view of the configuration of the substrate connector of the second embodiment and the substrate connector of the first embodiment.

[0041] Figure 21 This is a schematic top view illustrating the grounding loop in the substrate connector of the second embodiment. Detailed Implementation

[0042] Hereinafter, embodiments of the substrate connector of the present invention will be described in detail with reference to the accompanying drawings.

[0043] Reference Figure 2 The substrate connector 1 of the present invention can be disposed in electronic devices such as mobile phones, computers, and tablet computers (not shown). The substrate connector 1 of the present invention can be used to electrically connect a plurality of substrates (not shown). The substrate can be a printed circuit board (PCB). For example, when the first substrate and the second substrate are electrically connected, a receptacle connector mounted on the first substrate and a plug connector mounted on the second substrate can be connected to each other. Thus, the first substrate and the second substrate can be electrically connected to each other via the receptacle connector and the plug connector. Alternatively, the plug connector mounted on the first substrate and the receptacle connector mounted on the second substrate can be connected to each other.

[0044] The substrate connector 1 of the present invention can be implemented by the socket connector. The substrate connector 1 of the present invention can also be implemented by the plug connector. The substrate connector 1 of the present invention can also be implemented by including both the socket connector and the plug connector. Hereinafter, the embodiment in which the substrate connector 1 of the present invention is implemented by the plug connector is defined as the substrate connector 200 of the first embodiment, and the embodiment in which the substrate connector 1 of the present invention is implemented by the socket connector is defined as the substrate connector 300 of the second embodiment, and will be described in detail with reference to the accompanying drawings. Furthermore, the description will be based on an embodiment in which the substrate connector 200 of the first embodiment is mounted on the first substrate, and the substrate connector 300 of the second embodiment is mounted on the second substrate. Therefore, it is obvious to those skilled in the art that the embodiment in which the substrate connector 1 of the present invention includes both the socket connector and the plug connector can be deduced.

[0045] <Baseboard connector 200 of the first embodiment>

[0046] Reference Figures 2 to 4 The substrate connector 200 of the first embodiment may include a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground cover 230, and an insulating portion 240.

[0047] The plurality of RF contacts 210 are used to transmit RF (Radio Frequency) signals. The plurality of RF contacts 210 can transmit ultra-high frequency RF signals. The plurality of RF contacts 210 can be supported on the insulating portion 240. The plurality of RF contacts 210 can be assembled to the insulating portion 240 by an assembly process. The plurality of RF contacts 210 can also be integrally formed with the insulating portion 240 by injection molding.

[0048] The plurality of RF contacts 210 may be spaced apart from each other. The plurality of RF contacts 210 are mounted on the first substrate, thereby enabling electrical connection to the first substrate. The plurality of RF contacts 210 are connected to the plurality of RF contacts of the opposing connector, thereby enabling electrical connection to the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate can be electrically connected. In the case where the substrate connector 200 of the first embodiment is a plug connector, the opposing connector may be a jack connector. In the case where the substrate connector 200 of the first embodiment is a jack connector, the opposing connector may be a plug connector.

[0049] The first RF contact 211 and the second RF contact 212 of the plurality of RF contacts 210 can be spaced apart from each other along a first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 are supported on the insulating portion 240 at positions where they can be spaced apart from each other along the first axial direction (X-axis direction). Figure 4 The substrate connector 200 shown in the first embodiment includes two RF contacts 210, but it is not limited thereto; the substrate connector 200 of the first embodiment may also include three or more RF contacts 210. On the other hand, in this specification, the substrate connector 200 of the first embodiment including two RF contacts 210 is used as a reference.

[0050] The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first substrate. Thus, the first RF contact 211 can be electrically connected to the first substrate via the first RF mounting member 2111. The first RF contact 211 may be formed of an electrically conductive material. For example, the first RF contact 211 may be formed of metal. The first RF contact 211 may be connected to any one of the plurality of RF contacts of the opposing connector.

[0051] The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first substrate. Thus, the second RF contact 212 can be electrically connected to the first substrate via the second RF mounting member 2121. The second RF contact 212 may be formed of an electrically conductive material. For example, the second RF contact 212 may be formed of metal. The second RF contact 212 may connect to any one of the plurality of RF contacts of the opposing connector.

[0052] Reference Figures 2 to 4 A plurality of the transmission contacts 220 are coupled to the insulating portion 240. The plurality of transmission contacts 220 can function as signal transmitters, data transmitters, etc. The plurality of transmission contacts 220 can be coupled to the insulating portion 240 through an assembly process. Alternatively, the plurality of transmission contacts 220 can be integrally formed with the insulating portion 240 by injection molding.

[0053] A plurality of the transmission contacts 220 can be arranged between the first RF contact 211 and the second RF contact 212 with reference to the first axial direction (X-axis direction). Therefore, in order to reduce RF signal interference between the first RF contact 211 and the second RF contact 212, the plurality of transmission contacts 220 can be arranged in the space separating the first RF contact 211 and the second RF contact 212. Thus, the substrate connector 200 of the first embodiment not only reduces RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212, but also improves the space utilization of the insulating portion 240 by arranging a plurality of the transmission contacts 220 in the space between them.

[0054] The plurality of transmission contacts 220 may be spaced apart from each other. The plurality of transmission contacts 220 are mounted on the first substrate, thereby enabling electrical connection with the first substrate. In this case, the transmission mounting member 2201 of each of the plurality of transmission contacts 220 may be mounted on the first substrate. The plurality of transmission contacts 220 may be formed of an electrically conductive material. For example, the plurality of transmission contacts 220 may be formed of metal. The plurality of transmission contacts 220 connect with the plurality of transmission contacts of the opposing connector, thereby enabling electrical connection with the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate can be electrically connected.

[0055] on the other hand, Figure 4 The substrate connector 200 shown in the first embodiment includes four transmission contacts 220, but is not limited thereto; the substrate connector 200 of the first embodiment may also include five or more transmission contacts 220. The plurality of transmission contacts 220 may be spaced apart from each other along a first axial direction (X-axis direction) and a second axial direction (Y-axis direction). The first axial direction (X-axis direction) and the second axial direction (Y-axis direction) are axial directions perpendicular to each other.

[0056] Reference Figures 2 to 6The grounding cover 230 is integrated with the insulating portion 240. The grounding cover 230 is mounted on the first substrate and can thus be grounded. Therefore, the grounding cover 230 can shield the plurality of RF contacts 210 from signals, electromagnetic waves, etc. In this case, the grounding cover 230 can prevent electromagnetic waves generated from the plurality of RF contacts 210 from being interfered with by signals from a plurality of circuit components located around the electronic device, and can also prevent electromagnetic waves generated from the plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted by the plurality of RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the grounding cover 230 to improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance. The grounding cover 230 can be formed of an electrically conductive material. For example, the grounding cover 230 can be formed of metal.

[0057] The grounding enclosure 230 can be configured to surround the sides of the inner space 230a. A portion of the insulating portion 240 can be provided in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contact 22 can all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting member 2201 can also all be located in the inner space 230a. Therefore, by providing a shielding wall for all the first RF contacts 211 and the second RF contacts 212, the grounding enclosure 230 can enhance the shielding function of the first RF contacts 211 and the second RF contacts 212, thereby achieving complete shielding. The opposing connector can be inserted into the inner space 230a.

[0058] The grounding cover 230 can be configured to surround all sides based on the inner space 230a. The inner space 230a can be located inside the grounding cover 230. When the grounding cover 230 is generally formed into a rectangular ring shape, the inner space 230a can be formed into a cuboid shape. In this case, the grounding cover 230 can be configured to surround four sides based on the inner space 230a.

[0059] Reference Figures 2 to 8The grounding enclosure 230 can be configured to have double shielding walls. Therefore, the grounding enclosure 230 may include an inner grounding wall 231, an outer grounding wall 232, and a grounding connection wall 233.

[0060] The grounding inner wall 231 faces the insulating portion 240. The grounding inner wall 231 may be configured to face the inner space 230a. The grounding inner wall 231 may be configured to surround all sides relative to the inner space 230a. If the opposing connector is inserted into the inner space 230a, the grounding inner wall 231 may be connected to the grounding cover of the opposing connector.

[0061] The grounding outer wall 232 is spaced apart from the grounding inner wall 231. The grounding outer wall 232 may be disposed outside the grounding inner wall 231. The grounding outer wall 232 may be configured to surround all sides relative to the grounding inner wall 231.

[0062] The grounding outer wall 232 and the grounding inner wall 231 can be implemented by a double shielding wall surrounding the inner space 230a. The first RF contact 211 and the second RF contact 212 can be located in the inner space 230a surrounded by the double shielding wall. Thus, the grounding enclosure 230 can utilize the double shielding wall to enhance the shielding function for the plurality of RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the double shielding wall to further improve EMI shielding performance and EMC performance.

[0063] The grounding outer wall 232 is mounted on the first substrate, thereby allowing it to be grounded. In this case, the grounding enclosure 230 can be grounded through the grounding outer wall 232. With one end of the grounding outer wall 232 connected to the grounding connection wall 233, the other end of the grounding outer wall 232 can be mounted on the first substrate. In this case, the grounding outer wall 232 can be formed to have a higher height than the grounding inner wall 231.

[0064] The grounding outer wall 232 and the grounding inner wall 231 can be connected to the grounding housings of the opposing connectors inserted into the inner space 230a, respectively. For example, as Figure 8As shown, the grounding outer wall 232 and the grounding inner wall 231 can be connected to the grounding cover 330 of the opposite connector. As described above, since both the grounding outer wall 232 and the grounding inner wall 231 are connected to the grounding cover of the opposite connector, the substrate connector 200 of the first embodiment can further enhance its shielding function by increasing the contact area between the grounding cover 230 and the grounding cover of the opposite connector. Furthermore, the substrate connector 200 of the first embodiment can reduce adverse electrical effects such as crosstalk caused by mutual capacitance or mutual inductance between adjacent terminals by increasing the contact area between the grounding cover 230 and the grounding cover of the opposite connector. In this case, the substrate connector 200 of the first embodiment can ensure a path for electromagnetic waves to flow into the ground of at least one of the first and second substrates, thereby further enhancing EMI shielding performance.

[0065] The grounding connection wall 233 is connected to both the grounding inner wall 231 and the grounding outer wall 232. The grounding connection wall 233 can be disposed between the grounding inner wall 231 and the grounding outer wall 232. Through the grounding connection wall 233, the grounding inner wall 231 and the grounding outer wall 232 can be electrically connected to each other. Thus, if the grounding outer wall 232 is mounted on the first substrate and grounded, the grounding connection wall 233 and the grounding inner wall 231 are similarly grounded, thereby achieving a shielding function. If the opposing connector is inserted into the inner space 230a, the grounding connection wall 233 can be connected to the grounding cover of the opposing connector.

[0066] The grounding connection wall 233 can be connected to one end of the grounding outer wall 232 and one end of the grounding inner wall 231, respectively. Figure 6 When used as a reference, one end of the grounding outer wall 232 can correspond to the upper end of the grounding outer wall 232, and one end of the grounding inner wall 231 can correspond to the upper end of the grounding inner wall 231. The grounding connection wall 233 can be formed as a plate arranged in the horizontal direction, and the grounding outer wall 232 and the grounding inner wall 231 can each be formed as a plate arranged in the vertical direction. The grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 can also be formed as a single unit.

[0067] The grounding connection wall 233 can be connected to the grounding cover of the opposite connector inserted into the inner space 230a. Therefore, since the grounding outer wall 232, the grounding inner wall 231, and the grounding connection wall 233 are all connected to the grounding cover of the opposite connector, the substrate connector 200 of the first embodiment increases the contact area between the grounding cover 230 and the grounding cover of the opposite connector, thereby further enhancing the shielding function.

[0068] The grounding cover 230 may include a grounding bottom 234.

[0069] The grounding bottom 234 protrudes from the grounding inner wall 231 toward the inner space 230a. The grounding bottom 234 can also protrude from the other end of the grounding inner wall 231 toward the inner space 230a. Figure 6 When used as a reference, the other end of the grounding inner wall 231 can correspond to the lower end of the grounding inner wall 231. Utilizing the grounding bottom 234, the substrate connector 200 of the first embodiment can also achieve a shielding function on the bottom side of the grounding cover 230, thereby further enhancing the shielding function for the first RF contact 211 and the second RF contact 212. If the opposing connector is inserted into the inner space 230a, the grounding bottom 234 can be connected to the grounding cover of the opposing connector. Thus, the substrate connector 200 of the first embodiment increases the contact area through the connection between the grounding bottom 234 and the grounding cover of the opposing connector, thereby further enhancing the shielding function. The grounding bottom 234 can be formed as a plate arranged in the horizontal direction.

[0070] The grounding bottom 234, the grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 can also be integrally formed. In this case, the grounding cover 230 can be integrally formed without seams. The grounding cover 230 can be integrally formed without seams using metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding cover 230 can also be integrally formed without seams using CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0071] Reference Figures 2 to 12 To further enhance the shielding function by improving the contact between the grounding inner wall 231 and the grounding cover of the opposite connector, the grounding cover 230 may include the following configuration.

[0072] First, such as Figure 9 As shown, the grounding cover 230 may include a connecting groove 235. The connecting groove 235 may be formed on the outer surface of the grounding outer wall 232. The outer surface of the grounding outer wall 232 is the side facing the opposite side of the inner space 230a. The connecting groove 235 may be implemented as a groove formed to a predetermined depth on the outer surface of the grounding outer wall 232. The grounding cover 330 of the opposing connector can be inserted into the connecting groove 235. In this case, the connecting protrusion 335 of the grounding cover 330 of the opposing connector can be inserted into the connecting groove 235. Thus, the substrate connector 200 of the first embodiment utilizes the connecting groove 235 to improve the contact between the grounding cover 230 and the grounding cover 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Although Figure 9 The diagram shows that the connecting groove 235 is longer than the connecting protrusion 335 in the vertical direction, but it is not limited to this; the connecting groove 235 and the connecting protrusion 335 can be of approximately the same length. On the other hand, the grounding outer wall 232 supports the connecting protrusion 335 inserted into the connecting groove 235, thereby preventing the connecting protrusion 335 from detaching from the connecting groove 235. The grounding cover 230 may also include a plurality of connecting grooves 235. In this case, the plurality of connecting grooves 235 can be spaced apart from each other along the outer surface of the grounding outer wall 232.

[0073] Next, as Figure 10 As shown, the grounding housing 230 may further include a connecting protrusion 236. The connecting protrusion 236 may be formed on the outer surface of the grounding outer wall 232. The connecting protrusion 236 may protrude from the outer surface of the grounding outer wall 232. The connecting protrusion 236 may be inserted into the grounding housing 330 of the opposing connector. In this case, the connecting protrusion 236 may be inserted into the connecting groove 336 of the grounding housing 330 of the opposing connector. Thus, the substrate connector 200 of the first embodiment utilizes the connecting protrusion 236 to improve the contact between the grounding housing 230 and the grounding housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Although Figure 10The diagram shows that the connecting protrusion 236 is shorter than the connecting groove 336 in the vertical direction, but it is not limited to this; the connecting protrusion 236 and the connecting groove 336 can also be formed to approximately the same length. On the other hand, the connecting protrusion 236 is supported on the grounding cover 330 by being inserted into the connecting groove 336, thereby preventing it from detaching from the connecting groove 336. The grounding cover 230 may also include a plurality of the connecting protrusions 236. In this case, the plurality of connecting protrusions 236 can be arranged spaced apart from each other along the outer surface of the grounding outer wall 232.

[0074] Next, as Figure 11 As shown, when the grounding housing 230 includes the connecting protrusion 236, the connecting protrusion 236 can also support the connecting protrusion 335 of the grounding housing 330 of the opposing connector. Therefore, the substrate connector 200 of the first embodiment utilizes the connecting protrusion 236 to improve the contact between the grounding housing 230 and the grounding housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. On the other hand, the connecting protrusion 236, by being positioned below the connecting protrusion 335 to support it, can also prevent detachment.

[0075] Next, as Figure 8 As shown, the grounding enclosure 230 can also contact the grounding enclosure 330 of the opposite connector through a surface contact between the outer surface of the grounding outer wall 232 and the grounding enclosure 330 of the opposite connector. In this case, a gap may be generated between the outer surface of the grounding outer wall 232 and the grounding enclosure 330 of the opposite connector. To compensate for this, as... Figure 12 As shown, the grounding cover 230 may include a conductive member 237. The conductive member 237 may be attached to the outer surface of the grounding outer wall 232. The conductive member 237 extends along the corner portion 232a of the outer surface including the grounding outer wall 232. Figure 6The outer surface of the grounding outer wall 232 (shown in the diagram) extends to form a closed loop shape. Thus, the substrate connector 200 of the first embodiment utilizes the conductive member 237 to improve the contact between the grounding cover 230 and the grounding cover 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Furthermore, in the embodiment utilizing the connecting protrusion 236 and the connecting groove 235, it is difficult to perform operations on the corner portion 232a of the outer surface of the grounding outer wall 232; however, in the embodiment utilizing the conductive member 237, the ease of performing operations on the corner portion 232a of the outer surface of the grounding outer wall 232 is improved. The conductive member 237 can be formed of an electrically conductive material to enable electrical connection between the grounding outer wall 232 and the grounding cover 330 of the opposing connector. For example, the conductive member 237 can be formed of metal. After being manufactured separately, the conductive component 237 can be combined with the grounding outer wall 232 by mounting, attaching, or fastening it to the outer surface of the grounding outer wall 232. Alternatively, the conductive component 237 can be combined with the grounding outer wall 232 by coating the outer surface of the grounding outer wall 232 with a conductive shielding material.

[0076] Reference Figures 2 to 12 The insulating portion 240 supports a plurality of the RF contacts 210. The plurality of RF contacts 210 and the plurality of transmission contacts 220 can be coupled to the insulating portion 240. The insulating portion 240 can be formed of an insulating material. The insulating portion 240 can be coupled to the grounding cover 230 so that the plurality of RF contacts 210 are located in the inner space 230a.

[0077] The insulating part 240 may include an insulating member 241.

[0078] The insulating member 241 supports a plurality of the RF contacts 210 and a plurality of the transmission contacts 220. The insulating member 241 may be located within the inner space 230a. The insulating member 241 may be located inside the grounding bottom 234. In this case, the grounding bottom 234 may be located between the grounding inner wall 231 and the insulating member 241. The grounding bottom 234 may be configured to surround the outer surface of the insulating member 241. The insulating member 241 may be inserted into the inner space of the opposing connector.

[0079] The insulating part 240 may include an insertion member 242 and a connecting member 243.

[0080] The insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232. As the insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232, the insulating portion 240 can engage with the grounding cover 230. The insertion member 242 can be inserted between the inner grounding wall 231 and the outer grounding wall 232 in an interference fit manner. The insertion member 242 can be disposed on the outside of the insulating member 241. The insertion member 242 can be configured to surround the outside of the insulating member 241.

[0081] The connecting member 243 is coupled to both the insertion member 242 and the insulating member 241. The insertion member 242 and the insulating member 241 can be connected to each other via the connecting member 243. Based on the vertical direction, the connecting member 243 can be formed to be thinner than the insertion member 242 and the insulating member 241. This allows a space to be provided between the insertion member 242 and the insulating member 241, and the corresponding connector can be inserted into that space. The connecting member 243 can be configured to contact the grounding bottom 234. In this case, the grounding bottom 234 can be configured to cover the connecting member 243. The connecting member 243, the insertion member 242, and the connecting member 243 can be integrally formed.

[0082] Reference Figures 2 to 7 The insulating part 240 may include a welding inspection window 244. Figure 5 (as shown in the image).

[0083] The solder inspection window 244 can be formed through the insulating portion 240. The solder inspection window 244 can be used to inspect the state of the first RF mounting member 2111 mounted on the first substrate. In this case, the first RF contact 211 can be combined with the insulating portion 240 so that the first RF mounting member 2111 is located in the solder inspection window 244. Therefore, the first RF mounting member 2111 is not obstructed by the insulating portion 240. Therefore, when the substrate connector 200 of the first embodiment is mounted on the first substrate, the operator can inspect the state of the first RF mounting member 2111 mounted on the first substrate through the solder inspection window 244. Thus, even if all the first RF contacts 211, including the first RF mounting member 2111, are located inside the grounding cover 230, the substrate connector 200 of the first embodiment can improve the accuracy of the installation operation of mounting the first RF contacts 211 to the first substrate. The solder inspection window 244 can be formed through the insulating portion 241.

[0084] The insulating portion 240 may also include a plurality of solder inspection windows 244. In this case, the second RF mounting member 2121 and the plurality of transmission mounting members 2201 may be located within the plurality of solder inspection windows 244. Therefore, when the substrate connector 200 of the first embodiment is mounted on the first substrate, the operator can inspect the mounting status of the first RF mounting member 2111, the second RF mounting member 2121, and the plurality of transmission mounting members 2201 on the first substrate through the plurality of solder inspection windows 244. Thus, the substrate connector 200 of the first embodiment can improve the accuracy of the operation of mounting the first RF contact 211, the second RF contact 212, and the plurality of transmission contacts 220 onto the first substrate. The plurality of solder inspection windows 244 may be formed through the insulating portion 240 at spaced-apart locations.

[0085] Reference Figures 2 to 7 , Figure 13 The substrate connector 200 in the first embodiment may include a first grounding contact 250.

[0086] The first grounding contact 250 is coupled to the insulating portion 240. The first grounding contact 250 is mounted on the first substrate, thereby allowing it to be grounded. The first grounding contact 250 can be coupled to the insulating portion 240 via an assembly process. Alternatively, the first grounding contact 250 can be integrally formed with the insulating portion 240 via injection molding.

[0087] The first grounding contact 250, together with the grounding enclosure 230, can provide shielding for the first RF contact 211. In this case, such as Figure 5As shown, the grounding enclosure 230 may include a first double shielding wall 230b, a second double shielding wall 230c, a third double shielding wall 230d, and a fourth double shielding wall 230e. The first double shielding wall 230b, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e can each be implemented using the grounding inner wall 231, the grounding outer wall 232, and the grounding connection wall 233, respectively. The first double shielding wall 230b and the second double shielding wall 230c are configured opposite to each other with reference to the first axial direction (X-axis direction). With reference to the first axial direction (X-axis direction), the first RF contact 211 can be located between the first double shielding wall 230b and the second double shielding wall 230c. With reference to the first axial direction (X-axis direction), the first RF contact 211 can be located at a position where the distance between it and the first double shielding wall 230b is shorter than the distance between it and the second double shielding wall 230c. The third double shielding wall 230d and the fourth double shielding wall 230e are configured opposite to each other with reference to the second axial direction (Y-axis direction). With reference to the second axial direction (Y-axis direction), the first RF contact 211 can be located between the third double shielding wall 230d and the fourth double shielding wall 230e. With reference to the second axial direction (Y-axis direction), the first RF contact 211 can be located at a position that is approximately equidistant from the third double shielding wall 230d and the fourth double shielding wall 230e, respectively.

[0088] The first grounding contact 250 can be disposed between the first RF contact 211 and a plurality of the transmission contacts 220, with the first axial direction (X-axis direction) as a reference. Thus, the first RF contact 211 can be located between the first double shielding wall 230b and the first grounding contact 250, with the first axial direction (X-axis direction) as a reference, and can be located between the third double shielding wall 230d and the fourth double shielding wall 230e, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 200 of the first embodiment can utilize the first grounding contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e to enhance the shielding function of the first RF contact 211.

[0089] The first grounding contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e are arranged on four sides with the first RF contact 211 as a reference, thereby achieving shielding against RF signals. In this case, the first grounding contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e can form a ground loop 250a for the first RF contact 211. Figure 13 (As shown in the figure). Therefore, the substrate connector 200 of the first embodiment utilizes the ground loop 250a to further enhance the shielding function of the first RF contact 211, thereby achieving complete shielding of the first RF contact 211.

[0090] The first grounding contact 250 may be formed of an electrically conductive material. For example, the first grounding contact 250 may be formed of metal. If the opposing connector is inserted into the inner space 230a, the first grounding contact 250 may connect with the grounding contact of the opposing connector. The first grounding contact 250 may also be configured to contact the grounding housing 330.

[0091] The connector 200 of the first embodiment may also include a plurality of the first grounding contacts 250. The plurality of the first grounding contacts 250 may be spaced apart from each other along the second axial direction (Y-axis direction). Figure 13 The connector 200 shown in the first embodiment includes two first ground contacts 250, but is not limited thereto; the connector 200 of the first embodiment may also include one or more first ground contacts 250. When three or more first ground contacts 250 are provided, the plurality of first ground contacts 250 may be spaced apart from each other along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). Gaps formed by the plurality of first ground contacts 250 being spaced apart from each other can be blocked as the first ground contacts 250 connect to the ground contacts of the opposing connector.

[0092] Reference Figures 2 to 7 , Figure 13 The substrate connector 200 in the first embodiment may include a second grounding contact 260.

[0093] The second grounding contact 260 is coupled to the insulating portion 240. The second grounding contact 260 is mounted on the first substrate, thereby allowing it to be grounded. The second grounding contact 260 can be coupled to the insulating portion 240 via an assembly process. Alternatively, the second grounding contact 260 can be integrally formed with the insulating portion 240 via injection molding.

[0094] The second grounding contact 260, together with the grounding cover 230, can provide shielding for the second RF contact 212. The second grounding contact 260 can be positioned between a plurality of the transmission contacts 220 and the second RF contact 212, with the first axial direction (X-axis direction) as a reference. Thus, the second RF contact 212 can be positioned between the second grounding contact 260 and the second double shielding wall 230c, with the first axial direction (X-axis direction) as a reference, and can be positioned between the third double shielding wall 230d and the fourth double shielding wall 230e, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 200 of the first embodiment can further enhance the shielding function of the second RF contact 212 using the second grounding contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e.

[0095] The second grounding contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e are arranged on four sides relative to the second RF contact 212, thereby achieving shielding against RF signals. In this case, the second grounding contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e can be configured as a ground loop 260a for the second RF contact 212. Figure 13 (As shown in the figure). Therefore, the substrate connector 200 of the first embodiment utilizes the ground loop 260a to further enhance the shielding function of the second RF contact 212, thereby achieving complete shielding of the second RF contact 212.

[0096] The second grounding contact 260 can be formed of an electrically conductive material. For example, the second grounding contact 260 can be formed of metal. If the opposing connector is inserted into the inner space 230a, the second grounding contact 260 can connect with the grounding contact of the opposing connector. The second grounding contact 260 can also be configured to contact the grounding cover 330.

[0097] The connector 200 of the first embodiment may also include a plurality of second grounding contacts 260. The plurality of second grounding contacts 260 may be spaced apart from each other along the second axial direction (Y-axis direction). Figure 13 The connector 200 shown in the first embodiment includes two second grounding contacts 260, but is not limited thereto; the connector 200 of the first embodiment may also include one or more second grounding contacts 260. When three or more second grounding contacts 260 are provided, the plurality of second grounding contacts 260 may be spaced apart from each other along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). Gaps formed by the plurality of second grounding contacts 260 being spaced apart from each other can be blocked as the second grounding contacts 260 connect to the grounding contacts of the opposing connector.

[0098] Reference Figures 2 to 7 , Figure 14 , Figure 15 In the substrate connector 200 of the first embodiment, the grounding inner wall 231 of the grounding cover 230 can be implemented as including a first sub-grounding inner wall 2311, a second sub-grounding inner wall 2312, a third sub-grounding inner wall 2313 and a fourth sub-grounding inner wall 2314.

[0099] The first sub-grounding inner wall 2311 and the second sub-grounding inner wall 2312 can be arranged opposite each other with reference to the first axial direction (X-axis direction). The third sub-grounding inner wall 2313 and the third sub-grounding inner wall 2314 can be arranged opposite each other with reference to the second axial direction (Y-axis direction). The first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can be coupled to the grounding connection wall 233 at positions spaced apart from each other. The first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can each elastically move with reference to the portion coupled to the grounding connection wall 233, thereby pressurizing the insulating portion 240. Thus, the substrate connector 200 of the first embodiment can strengthen the bonding force between the grounding cover 230 and the insulating portion 240. Furthermore, when the relative connector is inserted into the inner space 230a, the first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 exert stronger pressure on the insulating portion 240 due to being pushed by the relative connector, thereby further increasing the bonding force between the grounding cover 230 and the insulating portion 240.

[0100] When the first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 are provided, the insulating part 240 may include a plurality of pressure grooves 245. Figure 15 (As shown in the diagram). A plurality of the pressure grooves 245 may be formed on the inner surface of the insertion member 242. The inner surface of the insertion member 242 is the surface facing the inner space 230a. By means of the plurality of pressure grooves 245, the distance that each of the first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can be elastically moved. Therefore, in the substrate connector 200 of the first embodiment, the elastic movement of the first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can further enhance the pressure applied to the insertion member 242.

[0101] <Substrate connector 300 of the second embodiment>

[0102] Reference Figure 2 , Figure 16 as well as Figure 17 The substrate connector 300 of the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a ground cover 330, and an insulating portion 340.

[0103] The plurality of RF contacts 310 are used for RF signal transmission. The plurality of RF contacts 310 can transmit ultra-high frequency RF signals. The plurality of RF contacts 310 can be supported on the insulating portion 340. The plurality of RF contacts 310 can be assembled to the insulating portion 340 by an assembly process. The plurality of RF contacts 310 can also be integrally formed with the insulating portion 340 by injection molding.

[0104] The plurality of RF contacts 310 may be spaced apart from each other. The plurality of RF contacts 310 are mounted on the second substrate, thereby enabling electrical connection to the second substrate. The plurality of RF contacts 310 are connected to the plurality of RF contacts of the opposing connector, thereby enabling electrical connection to the first substrate on which the opposing connector is mounted. Thus, the second substrate and the first substrate can be electrically connected. In this case, the opposing connector may also be implemented by the substrate connector 200 of the first embodiment. On the other hand, the opposing connector in the substrate connector 200 of the first embodiment may also be implemented by the substrate connector 300 of the second embodiment.

[0105] The first RF contact 311 and the second RF contact 312 of the plurality of RF contacts 310 may be spaced apart from each other along the first axial direction (X-axis direction). The first RF contact 311 and the second RF contact 312 may be supported on the insulating portion 340 at positions spaced apart from each other along the first axial direction (X-axis direction). Figure 17 The substrate connector 300 shown in the second embodiment includes two RF contacts 310, but it is not limited thereto; the substrate connector 300 of the second embodiment may also include three or more RF contacts 310. On the other hand, in this specification, the substrate connector 300 of the second embodiment including two RF contacts 310 is used as a reference.

[0106] The first RF contact 311 may include a first RF mounting member 3111. The first RF mounting member 3111 may be mounted on the second substrate. Thus, the first RF contact 311 can be electrically connected to the second substrate via the first RF mounting member 3111. The first RF contact 311 may be formed of an electrically conductive material. For example, the first RF contact 311 may be formed of metal. The first RF contact 311 may be connected to any one of the plurality of RF contacts of the opposing connector.

[0107] The second RF contact 312 may include a second RF mounting member 3121. The second RF mounting member 3121 may be mounted on the second substrate. Thus, the second RF contact 312 can be electrically connected to the second substrate via the second RF mounting member 3121. The second RF contact 312 may be formed of an electrically conductive material. For example, the second RF contact 312 may be formed of metal. The second RF contact 312 may connect to any one of the plurality of RF contacts of the opposing connector.

[0108] Reference Figure 2 , Figure 16 as well as Figure 17 A plurality of the transmission contacts 320 are coupled to the insulating portion 340. The plurality of transmission contacts 320 can function as signal transmitters, data transmitters, etc. The plurality of transmission contacts 320 can be coupled to the insulating portion 340 through an assembly process. Alternatively, the plurality of transmission contacts 320 can be integrally formed with the insulating portion 340 by injection molding.

[0109] With the first axial direction (X-axis direction) as a reference, a plurality of the transmission contacts 320 can be disposed between the first RF contact 311 and the second RF contact 312. Therefore, in order to reduce RF signal interference between the first RF contact 311 and the second RF contact 312, the plurality of transmission contacts 320 can be disposed in the space separating the first RF contact 311 and the second RF contact 312. Thus, the substrate connector 300 of the second embodiment not only reduces RF signal interference by increasing the distance between the first RF contact 311 and the second RF contact 312, but also improves the space utilization of the insulating portion 340 by arranging a plurality of the transmission contacts 320 in the space between them.

[0110] The plurality of transmission contacts 320 may be spaced apart from each other. The plurality of transmission contacts 320 are mounted on the second substrate, thereby enabling electrical connection with the second substrate. In this case, the transmission mounting member 3201 of each of the plurality of transmission contacts 320 may be mounted on the second substrate. The plurality of transmission contacts 320 may be formed of an electrically conductive material. For example, the plurality of transmission contacts 320 may be formed of metal. The plurality of transmission contacts 320 connect with the transmission contacts of the opposing connector, thereby enabling electrical connection with the second substrate on which the opposing connector is mounted. Thus, the second substrate and the first substrate can be electrically connected.

[0111] On the other hand, although Figure 17 The substrate connector 300 shown in the second embodiment includes four transmission contacts 320, but is not limited thereto; the substrate connector 300 of the second embodiment may also include five or more transmission contacts 320. The plurality of transmission contacts 320 may be spaced apart from each other along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction).

[0112] Reference Figures 16 to 19The grounding cover 330 is combined with the insulating portion 340. The grounding cover 330 is mounted on the second substrate and can thus be grounded. Therefore, the grounding cover 330 can shield the plurality of RF contacts 310 from signals, electromagnetic waves, etc. In this case, the grounding cover 330 can prevent electromagnetic waves generated from the plurality of RF contacts 310 from being interfered with by signals from a plurality of circuit components located around the electronic device, and can also prevent electromagnetic waves generated from the plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted by the plurality of RF contacts 310. Therefore, the substrate connector 300 of the second embodiment can utilize the grounding cover 330 to improve EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance. The grounding cover 330 can be formed of an electrically conductive material. For example, the grounding cover 330 can be formed of metal.

[0113] The grounding enclosure 330 can be configured to surround the sides of the inner space 330a. The insulating portion 340 can be provided in the inner space 330a. The first RF contact 311, the second RF contact 312, and a plurality of the transmission contacts 22 can all be located in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and a plurality of the transmission mounting members 3201 can also be located in the inner space 330a. Therefore, by providing a shielding wall for the first RF contact 311 and the second RF contact 312, the grounding enclosure 330 can enhance the shielding function of the first RF contact 311 and the second RF contact 312, thereby achieving complete shielding. The opposing connector can be inserted into the inner space 330a. In this case, a portion of the opposing connector is inserted into the inner space 330a, and a portion of the substrate connector 300 of the second embodiment can be inserted into the inner space of the opposing connector.

[0114] The grounding enclosure 330 can be configured to surround all sides based on the inner space 330a. The inner space 330a can be located inside the grounding enclosure 330. When the grounding enclosure 330 is generally formed into a rectangular ring shape, the inner space 330a can be formed into a cuboid shape. In this case, the grounding enclosure 330 can be configured to surround four sides based on the inner space 330a.

[0115] Reference Figure 7 , Figure 8 , Figures 16 to 19 The grounding cover 330 may include a grounding sidewall 331 and a grounding bottom 332.

[0116] The grounding sidewall 331 is configured to surround the sides of the inner space 330a. The grounding sidewall 331 may be configured to surround all sides relative to the inner space 330a. If the opposing connector is inserted into the inner space 330a, the grounding sidewall 331 may be connected to the grounding housing of the opposing connector. For example, the grounding sidewall 331 may be connected to the grounding outer wall 232 of the grounding housing 230 of the opposing connector. The grounding sidewall 331 may be formed as a plate arranged in a vertical direction.

[0117] The grounding bottom 332 protrudes from the lower end of the grounding sidewall 331 toward the inner space 330a. That is, the grounding bottom 332 can protrude toward the inner side of the grounding sidewall 331. The grounding bottom 332 extends along the lower end of the grounding sidewall 331, thereby forming a closed ring shape. The grounding bottom 332 is mounted on the second substrate, thereby being grounded. Thus, the grounding sidewall 331 can be grounded through the grounding bottom 332. In this case, the grounding cover 330 can be grounded through the grounding bottom 332. If the opposing connector is inserted into the inner space 330a, the grounding bottom 332 can be connected to the grounding cover of the opposing connector. For example, the grounding bottom 332 can be connected to the grounding connection wall 233 of the grounding cover 230 of the opposing connector. The grounding bottom 332 can be formed as a plate arranged in the horizontal direction.

[0118] The grounding bottom 332 and the grounding sidewall 331 can be configured to surround the inner space 330a. In this case, the first RF contact 311 and the second RF contact 312 can be located in the inner space 330a surrounded by the grounding bottom 332 and the grounding sidewall 331. Therefore, the grounding bottom 332 and the grounding sidewall 331 act as a complete shielding wall for the first RF contact 311 and the second RF contact 312, thereby enhancing the shielding function of the first RF contact 311 and the second RF contact 312 to achieve complete shielding.

[0119] The grounding bottom 332 and the grounding sidewall 331 can also be integrally formed. In this case, the grounding cover 330 can be integrally formed without seams. The grounding cover 330 can be integrally formed without seams using metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding cover 330 can also be integrally formed without seams using CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0120] Reference Figure 7 , Figure 8 , Figures 16 to 19 The grounding cover 330 may include a grounding arm 333.

[0121] The grounding arm 333 protrudes upward from the grounding bottom 332. The grounding arm 333 can elastically move relative to the portion engaging with the grounding bottom 332. In this case, if the opposing connector is inserted into the inner space 330a, the grounding arm 333 can elastically rotate towards the inner space 330a relative to the portion engaging with the grounding bottom 332, as it is pressed by the grounding cover of the opposing connector. Thus, the grounding arm 333 uses restoring force to press against the grounding cover of the opposing connector, thereby achieving strong contact with the grounding cover of the opposing connector. Therefore, the substrate connector 300 of the second embodiment utilizes the grounding arm 333 to improve the contact between the grounding cover 330 and the grounding cover of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. For example, the grounding arm 333 can contact the grounding inner wall 231 of the grounding cover 230 of the opposing connector. In this case, the grounding cover 230 of the opposing connector can be inserted into the space between the grounding arm 333 and the grounding sidewall 331. Thus, if the inner grounding wall 231 of the grounding cover 230 of the opposing connector contacts the grounding arm 333, and the outer grounding wall 232 of the grounding cover 230 of the opposing connector contacts the grounding sidewall 331, then the grounding connection wall 233 of the grounding cover 230 of the opposing connector can contact the grounding bottom 332.

[0122] The grounding enclosure 330 may also include a plurality of grounding arms 333. In this case, the plurality of grounding arms 333 may be spaced apart from each other along the grounding bottom 332. Figure 19The grounding cover 330 is shown to include four grounding arms 333, but it is not limited thereto. The grounding cover 330 may also include two, three, or more than five grounding arms 333.

[0123] The grounding housing 330 may include a grounding protrusion 3331 protruding from the inner surface of the grounding arm 333. The inner surface of the grounding arm 333 is the face of the grounding arm 333 facing the grounding sidewall 331. Thus, the grounding protrusion 3331 can protrude towards the grounding sidewall 331. As the opposing connector is inserted between the grounding protrusion 3331 and the grounding sidewall 331, as... Figure 8 As shown, the grounding arm 333 can move elastically with reference to the portion that engages with the grounding bottom 332. Therefore, the grounding protrusion 3331 will utilize the restoring force of the grounding arm 333 to make stronger contact with the grounding housing of the opposing connector. Thus, the substrate connector 300 of the second embodiment utilizes the grounding arm 333 with the grounding protrusion 3331 formed thereon to improve the contact between the grounding housing 330 and the grounding housing of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312.

[0124] Reference Figure 7 , Figure 8 , Figures 16 to 19 The grounding cover 330 may include a grounding upper wall 334.

[0125] The upper grounding wall 334 protrudes from the upper end of the grounding sidewall 331 toward the opposite side of the inner space 330a. In this case, the upper grounding wall 334 may protrude outward from the grounding sidewall 331. The upper grounding wall 334 extends along the upper end of the grounding sidewall 331, thereby forming a closed ring shape. The upper grounding wall 334 may be formed as a plate arranged in the horizontal direction.

[0126] The grounding upper wall 334, the grounding bottom 332, and the grounding side wall 331 can be integrally formed. In this case, the grounding cover 330 can be integrally formed without seams. The grounding cover 330 can be integrally formed without seams using metal injection molding processes such as metal die casting or MIM. The grounding cover 330 can also be integrally formed without seams using CNC machining or MCT machining.

[0127] like Figure 8As shown, the connection portion between the upper grounding wall 334 and the side grounding wall 331 can be formed into an arc shape. Therefore, when the opposite connector is inserted into the inner space 330a, the connection portion between the upper grounding wall 334 and the side grounding wall 331 can guide the opposite connector. In this case, the portion of the connection portion between the upper grounding wall 334 and the side grounding wall 331 facing the inner space 330a can have a curved surface and form an arc shape. The connection portion between the upper grounding wall 334 and the side grounding wall 331 can also guide the grounding cover of the opposite connector to be inserted between the side grounding wall 331 and the grounding arm 333.

[0128] Reference Figures 8 to 12 , Figure 20 In order to further enhance the shielding function by improving the contact between the grounding sidewall 331 and the grounding cover of the opposite connector, the grounding cover 330 may include the following configuration.

[0129] First, such as Figure 9 As shown, the grounding housing 330 may include a connecting protrusion 335. The connecting protrusion 335 may be formed on the inner surface of the grounding sidewall 331. The connecting protrusion 335 may protrude from the inner surface of the grounding sidewall 331. The connecting protrusion 335 may be inserted into the grounding housing 230 of the opposing connector. In this case, the connecting protrusion 335 may be inserted into the connecting groove 235 of the grounding housing 230 of the opposing connector. Thus, the substrate connector 300 of the second embodiment utilizes the connecting protrusion 335 to improve the contact between the grounding housing 330 and the grounding housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Figure 9 The diagram shows that the connecting protrusion 335 is shorter than the connecting groove 235 in the vertical direction, but it is not limited to this; the connecting protrusion 335 and the connecting groove 235 may also be formed to approximately the same length. The grounding cover 330 may also include a plurality of the connecting protrusions 335. In this case, the plurality of connecting protrusions 335 may be spaced apart from each other along the inner surface of the grounding sidewall 331.

[0130] Next, as Figure 10As shown, the grounding cover 330 may include a connecting groove 336. The connecting groove 336 may be formed on the inner surface of the grounding sidewall 331. The connecting groove 336 may be implemented as a groove of a predetermined depth formed on the inner surface of the grounding sidewall 331. The grounding cover 230 of the opposing connector can be inserted into the connecting groove 336. In this case, the connecting protrusion 236 of the grounding cover 230 of the opposing connector can be inserted into the connecting groove 336. Thus, the substrate connector 300 of the second embodiment utilizes the connecting groove 336 to improve the contact between the grounding cover 330 and the grounding cover 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Figure 10 The diagram shows that the connecting groove 336 is longer than the connecting protrusion 236 in the vertical direction, but it is not limited to this; the connecting groove 336 and the connecting protrusion 236 may also be formed to approximately the same length. On the other hand, the grounding sidewall 331 supports the connecting protrusion 236 inserted into the connecting groove 336, thereby preventing the connecting protrusion 236 from disengaging from the connecting groove 336. The grounding cover 330 may also include a plurality of the connecting grooves 336. In this case, the plurality of connecting grooves 336 may be spaced apart from each other along the inner surface of the grounding sidewall 331.

[0131] Next, as Figure 11 As shown, when the grounding housing 330 includes the connecting protrusion 335, the connecting protrusion 335 can also support the connecting protrusion 236 of the grounding housing 230 of the opposing connector. Therefore, the substrate connector 300 of the second embodiment utilizes the connecting protrusion 335 to improve the contact between the grounding housing 330 and the grounding housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. On the other hand, the connecting protrusion 335 is disposed above the connecting protrusion 236, thereby supporting the connecting protrusion 236.

[0132] Next, as Figure 8 As shown, the grounding enclosure 330 can also contact the grounding enclosure 230 of the opposing connector through a surface contact between the inner surface of the grounding sidewall 331 and the grounding enclosure 230 of the opposing connector. In this case, a gap may be generated between the inner surface of the grounding sidewall 331 and the grounding enclosure 230 of the opposing connector. To compensate for this gap, as... Figure 20As shown, the grounding cover 330 may include a conductive member 337. The conductive member 337 may be coupled to the inner surface of the grounding sidewall 331. The conductive member 337 may be formed such that along the corner portion 3301 (including the inner surface of the grounding sidewall 331) Figure 19 The inner surface of the grounding sidewall 331 (shown in the diagram) extends to form a closed loop shape. Thus, the substrate connector 300 of the second embodiment utilizes the conductive member 337 to improve the contact between the grounding cover 330 and the grounding cover 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Furthermore, in the embodiment utilizing the connecting protrusion 335 and the connecting groove 336, it is difficult to work on the corner portion 3301 of the inner surface of the grounding sidewall 331; however, in the embodiment utilizing the conductive member 337, the ease of working on the corner portion 3301 of the inner surface of the grounding sidewall 331 is improved. The conductive member 337 can be formed of an electrically conductive material to electrically connect the grounding sidewall 331 and the grounding cover 230 of the opposing connector. For example, the conductive member 337 can be formed of metal. After being manufactured separately, the conductive component 337 can be attached to the grounding sidewall 331 by mounting, attaching, or fastening it to the inner surface of the grounding sidewall 331. Alternatively, the conductive component 337 can be attached to the grounding sidewall 331 by coating the inner surface of the grounding sidewall 331 with a conductive shielding material.

[0133] Reference Figures 16 to 19 The grounding cover 330 may include a connecting member 338.

[0134] The connecting member 338 protrudes upward from the grounding bottom 332. When the grounding cover 330 and the insulating portion 340 are engaged, the connecting member 338 can be inserted into the insulating portion 340. Thus, the connecting member 338 can securely connect the grounding cover 330 and the insulating portion 340. The connecting member 338 can also be coupled to the insulating portion 340 in an interference fit manner. The connecting member 338 and the grounding bottom 332 can also be integrally formed. A connecting groove (not shown) for the insertion of the connecting member 338 can be formed in the insulating portion 340. The connecting groove can be formed on the lower surface of the insulating portion 340.

[0135] The grounding enclosure 330 may also include a plurality of the connecting members 338. In this case, the plurality of connecting members 338 may be spaced apart from each other along the grounding bottom 332. Although Figure 19 The grounding cover 330 is shown to include four connecting members 338, but is not limited thereto; the grounding cover 330 may also include two, three, or five or more connecting members 338. The insulating portion 340 may have a number of connecting grooves equal to the number of the plurality of connecting members 338.

[0136] The grounding cover 330 may include a wedge-shaped member 3381 protruding from the connecting member 338. As the connecting member 338 is inserted into the insulating portion 340, the wedge-shaped member 3381 embeds into the insulating portion 340, thereby securing the grounding cover 330 and the insulating portion 340. Therefore, the substrate connector 300 of the second embodiment can more securely connect the grounding cover 330 and the insulating portion 340 using the wedge-shaped member 3381. When the connecting member 338 is spaced apart from the grounding sidewall 331 along the second axial direction (Y-axis direction), the wedge-shaped member 3381 may protrude from the side of the connecting member 338 along the first axial direction (X-axis direction). The wedge-shaped member 3381 and the connecting member 338 may be integrally formed.

[0137] Reference Figures 16 to 19 The insulating portion 340 supports a plurality of the RF contacts 310. The insulating portion 340 may be combined with a plurality of the RF contacts 310 and a plurality of the transmission contacts 320. The insulating portion 340 may be formed of an insulating material. The insulating portion 340 may be combined with the grounding cover 330 such that the plurality of the RF contacts 310 are located in the inner space 330a.

[0138] The insulating portion 340 may include a welding inspection window 341. Figure 18 (as shown in the image).

[0139] The solder inspection window 341 can be formed through the insulating portion 340. The solder inspection window 341 can be used to inspect the state of the first RF mounting member 3111 mounted on the second substrate. In this case, the first RF contact 311 can be combined with the insulating portion 340 so that the first RF mounting member 3111 is located in the solder inspection window 341. Therefore, the first RF mounting member 3111 is not obstructed by the insulating portion 340. Therefore, when the substrate connector 300 of the second embodiment is mounted on the second substrate, the operator can inspect the state of the first RF mounting member 3111 mounted on the second substrate through the solder inspection window 341. Thus, even if the first RF contact 311, including the first RF mounting member 3111, is located inside the grounding cover 330, the substrate connector 300 of the second embodiment can improve the accuracy of the installation operation of mounting the first RF contact 311 on the second substrate. The solder inspection window 341 can be formed through the insulating member 241.

[0140] The insulating portion 340 may also include a plurality of solder inspection windows 341. In this case, the second RF mounting member 3121 and the plurality of transmission mounting members 3201 may also be located within the plurality of solder inspection windows 341. Therefore, when the substrate connector 300 of the second embodiment is mounted on the second substrate, the operator can inspect the mounting status of the first RF mounting member 3111, the second RF mounting member 3121, and the plurality of transmission mounting members 3201 on the second substrate through the plurality of solder inspection windows 341. Thus, the substrate connector 300 of the second embodiment can improve the accuracy of the operation of mounting the first RF contact 311, the second RF contact 312, and the plurality of transmission contacts 320 onto the second substrate.

[0141] Reference Figure 7 , Figure 8 , Figures 16 to 19 The insulating part 340 may include a movable groove 342.

[0142] The movable groove 342 is used for the movement of the grounding arm 333. The movable groove 342 can be implemented as a groove of a certain depth formed in the insulating portion 340. The movable groove 342 can be formed on the side of the insulating portion 340 facing the grounding sidewall 331. When the grounding arm 333 is pressed as the opposing connector is inserted into the inner space 330a, the grounding arm 333 can elastically rotate and insert into the movable groove 342 with reference to the portion connected to the grounding bottom 332. Thus, the substrate connector 300 of the second embodiment can use the movable groove 342 to increase the distance that the grounding arm 333 can elastically move, thereby increasing the restoring force to achieve stronger contact between the grounding arm 333 and the opposing connector. Therefore, the substrate connector 300 of the second embodiment can further improve the contact between the grounding cover 330 and the grounding cover of the opposing connector.

[0143] The movable groove 342 can be formed such that its size increases as it extends from the lower side to the upper side. Therefore, a deeper movable groove 342 can be formed at the portion where the grounding arm 333 rotates a greater distance relative to the part connected to the grounding bottom 332. Thus, the substrate connector 300 of the second embodiment can improve the contact between the grounding cover 330 and the grounding cover of the opposing connector by increasing the distance the grounding arm 333 can move, while reducing the degree of durability reduction of the insulation portion 340 due to the movable groove 342. The lower side of the movable groove 342 can be configured at a position corresponding to the portion where the grounding arm 333 connects to the grounding bottom 332.

[0144] The insulating portion 340 may also include a plurality of the movable slots 342. The plurality of movable slots 342 may be arranged at positions spaced apart from each other. The plurality of grounding arms 333 may also be inserted into each of the plurality of movable slots 342. In this case, the plurality of movable slots 342 may each be formed to a larger size than each of the plurality of grounding arms 333.

[0145] Reference Figures 16 to 21 The substrate connector 300 in the second embodiment may include a first grounding contact 350.

[0146] The first grounding contact 350 is coupled to the insulating portion 340. The first grounding contact 350 is mounted on the second substrate, thereby allowing it to be grounded. The first grounding contact 350 can be coupled to the insulating portion 340 via an assembly process. Alternatively, the first grounding contact 350 can be integrally molded with the insulating portion 340 via injection molding.

[0147] The first grounding contact 350, together with the grounding enclosure 330, can provide shielding for the first RF contact 311. In this case, such as Figure 18 and Figure 21 As shown, the grounding enclosure 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can each be implemented using the grounding side wall 331, the grounding bottom wall 332, and the grounding top wall 334, respectively. The first shielding wall 330b and the second shielding wall 330c are arranged opposite each other with reference to the first axial direction (X-axis direction). The first RF contact 311 can be located between the first shielding wall 330b and the second shielding wall 330c, with reference to the first axial direction (X-axis direction). With reference to the first axial direction (X-axis direction), the first RF contact 311 can be located at a position where the distance between it and the first shielding wall 330b is shorter than the distance between it and the second shielding wall 330c. The third shielding wall 330d and the fourth shielding wall 330e are configured opposite to each other with reference to the second axial direction (Y-axis direction). With reference to the second axial direction (Y-axis direction), the first RF contact 311 can be located between the third shielding wall 330d and the fourth shielding wall 330e. With reference to the second axial direction (Y-axis direction), the first RF contact 311 can be located at a position spaced approximately equidistant from each of the third shielding wall 330d and the fourth shielding wall 330e.

[0148] The first grounding contact 350 can be disposed between the first RF contact 311 and a plurality of the transmission contacts 320, with the first axial direction (X-axis direction) as a reference. Thus, the first RF contact 311 can be located between the first shielding wall 330b and the first grounding contact 350, with the first axial direction (X-axis direction) as a reference, and can be located between the third shielding wall 330d and the fourth shielding wall 330e, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 300 of the second embodiment can utilize the first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e to enhance the shielding function of the first RF contact 311.

[0149] The first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e are arranged on four sides relative to the first RF contact 311, thereby achieving shielding against RF signals. In this case, the first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e can be configured as a ground loop 350a for the first RF contact 311. Figure 21 (As shown in the diagram). Therefore, the substrate connector 300 of the second embodiment utilizes the ground loop 350a to further enhance the shielding function of the first RF contact 311, thereby achieving complete shielding of the first RF contact 311.

[0150] The first grounding contact 350 may be formed of an electrically conductive material. For example, the first grounding contact 350 may be formed of metal. If the opposing connector is inserted into the inner space 330a, the first grounding contact 350 may connect with the grounding contact of the opposing connector.

[0151] The substrate connector 300 of the second embodiment may also include a plurality of first ground contacts 350. The plurality of first ground contacts 350 may be spaced apart from each other along the second axial direction (Y-axis direction). Gaps formed by the plurality of first ground contacts 350 being spaced apart from each other can be blocked by connecting the first ground contacts 350 to the ground contacts of the opposing connector.

[0152] Reference Figures 16 to 21 The substrate connector 300 in the second embodiment may include a second grounding contact 360.

[0153] The second grounding contact 360 is coupled to the insulating portion 340. The second grounding contact 360 is mounted on the second substrate, thereby allowing it to be grounded. The second grounding contact 360 can be coupled to the insulating portion 340 via an assembly process. Alternatively, the second grounding contact 360 can be integrally molded with the insulating portion 340 via injection molding.

[0154] The second grounding contact 360, together with the grounding cover 330, can provide shielding for the second RF contact 312. The second grounding contact 360 can be positioned between a plurality of the transmission contacts 320 and the second RF contact 212, with reference to the first axial direction (X-axis direction). Thus, the second RF contact 312 can be positioned between the second grounding contact 360 and the second shielding wall 330c, with reference to the first axial direction (X-axis direction), and can be positioned between the third shielding wall 330d and the fourth shielding wall 330e, with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 300 of the second embodiment can utilize the second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e to enhance the shielding function of the second RF contact 312.

[0155] The second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e are arranged on four sides with the second RF contact 312 as a reference, thereby achieving shielding against RF signals. In this case, the second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can form a ground loop 360a for the second RF contact 312. Figure 21 (As shown in the figure). Therefore, the substrate connector 300 of the second embodiment utilizes the ground loop 360a to further enhance the shielding function of the second RF contact 312, thereby achieving complete shielding of the second RF contact 312.

[0156] The second grounding contact 360 may be formed of an electrically conductive material. For example, the second grounding contact 360 may be formed of metal. If the opposing connector is inserted into the inner space 330a, the second grounding contact 360 may connect with the grounding contact of the opposing connector.

[0157] The substrate connector 300 of the second embodiment may also include a plurality of second ground contacts 360. The plurality of second ground contacts 360 may be spaced apart from each other along the second axial direction (Y-axis direction). The gaps formed by the plurality of second ground contacts 360 being spaced apart from each other can be blocked by connecting the second ground contacts 360 to the ground contacts of the opposing connector.

[0158] The present invention described above is not limited to the foregoing embodiments and drawings. Those skilled in the art will clearly understand that various substitutions, modifications and alterations can be made without departing from the technical concept of the present invention.

Claims

1. A substrate connector, characterized in that, include: Multiple RF contacts for transmitting RF signals; The insulating part supports a plurality of the RF contacts; A plurality of transmission contacts are coupled to the insulating portion between a first RF contact and a second RF contact among the plurality of said RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other along a first axis direction, and the plurality of said transmission contacts transmit signals different from the RF signal; and The grounding cover is combined with the aforementioned insulating part. The grounding enclosure includes: an inner grounding wall facing the insulating portion; an outer grounding wall spaced apart from the inner grounding wall and surrounding the insulating portion from the outside; and a grounding connection wall connected to both the inner grounding wall and the outer grounding wall. The grounding inner wall, the grounding outer wall, and the grounding connection wall of the grounding enclosure are integrally formed without joints to create a continuous surface, so as to eliminate gaps. The grounding inner wall and the grounding outer wall are double shielding walls on the sides that surround the inner space. The first RF contact and the second RF contact are located in the inner space surrounded by the double shielding walls. The first RF contact and the second RF contact located in the inner space are completely shielded by the grounding cover in the first axial direction and the second axial direction perpendicular to the first axial direction, so that they are not exposed to the outside. The grounding inner wall and the grounding outer wall are respectively connected to the grounding cover of the opposite connector inserted into the inner space.

2. The substrate connector according to claim 1, characterized in that, The grounding enclosure includes a grounding bottom that protrudes from the inner grounding wall toward the inner space. The insulating portion includes an insulating member that supports a plurality of the RF contacts and a plurality of the transmission contacts. The grounding bottom is located between the grounding inner wall and the insulating member.

3. The substrate connector according to claim 2, characterized in that, The insulating part includes an insertion member inserted between the grounding inner wall and the grounding outer wall, and connecting members respectively connected to the insertion member and the insulating member. The grounding bottom is configured to cover the connecting member.

4. The substrate connector according to claim 1, characterized in that, The substrate connector includes a first grounding contact that engages with the insulating portion between the first RF contact and the plurality of transmission contacts. The grounding enclosure includes: a first double shielding wall and a second double shielding wall, configured opposite to each other with respect to the first axial direction; and a third double shielding wall and a fourth double shielding wall, configured opposite to each other with respect to a second axial direction perpendicular to the first axial direction. The first RF contact is located between the first double shield and the first ground contact, with the first axial direction as the reference, and between the third double shield and the fourth double shield, with the second axial direction as the reference.

5. The substrate connector according to claim 4, characterized in that, The first double shielding wall, the first grounding contact, the third double shielding wall, and the fourth double shielding wall are arranged on four sides with the first RF contact as a reference to achieve shielding force for RF signals.

6. The substrate connector according to claim 4, characterized in that, The substrate connector includes a second grounding contact that engages with the insulating portion between the second RF contact and the plurality of transmission contacts. The second RF contact is located between the second double shield and the second ground contact, with the first axial direction as the reference, and between the third double shield and the fourth double shield, with the second axial direction as the reference.

7. The substrate connector according to claim 6, characterized in that, The second double shielding wall, the second grounding contact, the third double shielding wall, and the fourth double shielding wall are arranged on four sides with the second RF contact as a reference to achieve shielding force against RF signals.

8. The substrate connector according to claim 1, characterized in that, The grounding cover includes a connecting groove formed on the outer surface of the grounding outer wall.

9. The substrate connector according to claim 1, characterized in that, The grounding enclosure includes a conductive component that is coupled to the outer surface of the grounding outer wall. The conductive member is formed in a closed loop shape to extend along the grounding outer wall, including the corner portions of the grounding outer wall.

10. The substrate connector according to claim 1, characterized in that, The first RF contact includes a first RF mounting member for mounting on a substrate, and the first RF contact is coupled to the insulating portion such that the first RF mounting member is located in a solder inspection window formed through the insulating portion.

11. The substrate connector according to claim 1, characterized in that, The grounding outer wall is mounted on the base plate. The grounding cover is grounded by being installed on the grounding outer wall of the substrate.

12. The substrate connector according to claim 1, characterized in that, The grounding inner wall includes: a first sub-grounding inner wall and a second sub-grounding inner wall, configured opposite to each other with respect to the first axial direction; and a third sub-grounding inner wall and a fourth sub-grounding inner wall, configured opposite to each other with respect to a second axial direction perpendicular to the first axial direction. The first sub-grounding inner wall, the second sub-grounding inner wall, the third sub-grounding inner wall, and the fourth sub-grounding inner wall each move elastically with reference to the portion that is connected to the grounding connection wall, thereby applying pressure to the insulating part.

13. The substrate connector according to claim 12, characterized in that, The insulating portion includes: a plurality of pressure grooves for insertion into each of the first sub-grounding inner wall, the second sub-grounding inner wall, the third sub-grounding inner wall, and the fourth sub-grounding inner wall; and an insertion member inserted between the grounding inner wall and the grounding outer wall. A plurality of the pressure grooves are formed on the inner surface of the insertion member facing the inner space.

14. A substrate connector, characterized in that, include: Multiple RF contacts for transmitting RF signals; The insulating part supports a plurality of the RF contacts; A plurality of transmission contacts are coupled to the insulating portion between a first RF contact and a second RF contact among the plurality of said RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other along a first axis direction, and the plurality of said transmission contacts transmit signals different from the RF signal; and The grounding cover is combined with the aforementioned insulating part. The grounding enclosure includes: a grounding sidewall surrounding the inner space; a grounding bottom protruding from the lower end of the grounding sidewall toward the inner space; and a grounding arm protruding upward from the grounding bottom. The grounding sidewall and the grounding bottom are seamlessly integrated to form a continuous surface, so as to eliminate gaps. The first RF contact and the second RF contact are located in the inner space surrounded by the ground sidewall and the ground bottom. The first RF contact and the second RF contact located in the inner space are completely shielded by the grounding cover in the first axial direction and the second axial direction perpendicular to the first axial direction, so that they are not exposed to the outside.

15. The substrate connector according to claim 14, characterized in that, The grounding enclosure includes a grounding protrusion that extends from the inner surface of the grounding arm toward the grounding sidewall. As the relative connector is inserted between the grounding sidewall and the grounding protrusion, the grounding arm moves elastically with respect to the portion that engages with the grounding bottom.

16. The substrate connector according to claim 15, characterized in that, A moving groove for moving the grounding arm is formed in the insulating part. The movable groove is formed such that its size increases as it extends from the bottom to the top.

17. The substrate connector according to claim 14, characterized in that, The grounding cover includes a connecting member that protrudes upward from the bottom of the grounding enclosure. The connecting member is inserted into the insulating part, thereby connecting the grounding cover and the insulating part.

18. The substrate connector according to claim 17, characterized in that, The grounding cover includes a wedge-shaped member protruding from the connecting member. The wedge-shaped member is inserted into the insulating part as the connecting member is inserted into the insulating part, thereby fixing the grounding cover and the insulating part.

19. The substrate connector according to claim 14, characterized in that, The substrate connector includes a first grounding contact that engages with the insulating portion between the first RF contact and the plurality of transmission contacts. The grounding enclosure includes: a first shielding wall and a second shielding wall, configured opposite to each other with respect to the first axial direction; and a third shielding wall and a fourth shielding wall, configured opposite to each other with respect to a second axial direction perpendicular to the first axial direction. The first RF contact is located between the first shielding wall and the first grounding contact, with the first axial direction as the reference, and between the third shielding wall and the fourth shielding wall, with the second axial direction as the reference.

20. The substrate connector according to claim 19, characterized in that, The first shielding wall, the first grounding contact, the third shielding wall, and the fourth shielding wall are arranged on four sides with the first RF contact as a reference, thereby achieving shielding force against RF signals.

21. The substrate connector according to claim 19, characterized in that, The substrate connector includes a second grounding contact that engages with the insulating portion between the second RF contact and the plurality of transmission contacts. The second RF contact is located between the second shielding wall and the second grounding contact, with the first axial direction as the reference, and is located between the third shielding wall and the fourth shielding wall, with the second axial direction as the reference.

22. The substrate connector according to claim 21, characterized in that, The second shielding wall, the second grounding contact, the third shielding wall, and the fourth shielding wall are arranged on four sides with the second RF contact as a reference, thereby achieving shielding force against RF signals.

23. The substrate connector according to claim 14, characterized in that, The grounding enclosure includes a connecting protrusion that extends from the inner surface of the grounding sidewall.

24. The substrate connector according to claim 14, characterized in that, The grounding enclosure includes a conductive member that is coupled to the inner surface of the grounding sidewall. The conductive member is formed in a closed ring shape to extend along the inner surface of the grounding sidewall, including the corner portions of the inner surface of the grounding sidewall.

25. The substrate connector according to claim 14, characterized in that, The first RF contact includes a first RF mounting member for mounting on a substrate, and the first RF contact is coupled to the insulating portion such that the first RF mounting member is located in a solder inspection window formed through the insulating portion.

26. The substrate connector according to claim 14, characterized in that, The grounding bottom is mounted on the substrate. The grounding cover is grounded by being installed on the grounding bottom of the substrate.

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