A testing method for testing pipeline

Abstract

The present invention discloses a test method for a test line, comprising the following steps: a first step, configuring a corresponding machine group according to the production demand of the processed module to be tested; a second step, a feeding machine group sends a chip or a module to be tested into a first machine group; after the first machine group completes the corresponding test process, the chip or the module to be tested is sent to a transfer module; the transfer module dynamically configures the chip or the module to be tested to the second machine group based on the operating status of the second machine group. The test line is used to test and burn chips or electronic modules. In this test method, a transfer module is used to realize the dynamic transfer of materials between different machine groups, thereby balancing the difference in test time of different machine groups, so that the test line can flexibly arrange different test units according to production needs, and at the same time, it can also eliminate the situation of the unit stopping waiting for materials, and maximize the production potential of each machine on the test line.

Description

Technical Field

[0001] The invention relates to the field of burning and testing, and in particular to a testing method for a testing pipeline. Background Art

[0002] With the development of society, chips or electronic modules occupy an increasingly larger proportion in people's daily lives. At the same time, chips or electronic modules are developing rapidly, and chips or electronic modules are becoming diversified and complex. In order to ensure the quality of chips or electronic modules before entering the market, it is often necessary to burn and test chips or electronic modules. In the invention application of patent number CN202110376324.5, a control method for a multi-test-station FCT test system is proposed to solve the increasing operation difficulty of the FCT test system.

[0003] In the field of test burning, with the advancement of technology, the test burning requirements for chips or electronic modules have become higher and higher. Correspondingly, the test content of the test line also needs to be increased accordingly. Corresponding test units often need to be added to traditional test lines. At the same time, with the difference in the chips or electronic modules to be tested, the test content of the entire test line will also change. In order to solve the above production needs, the desired direction is that the machines of the test line can be flexibly configured to facilitate the subsequent increase (reduction) of machines, and the production line can be flexibly configured according to the type of electronic module to be tested; in the test line, except for the feeding and discharging processes, the test order of other test contents can be adjusted to a certain extent, and there is no need to follow a fixed test order, which makes the design of a flexibly configurable test line have a theoretical basis.

[0004] However, in the actual installation process of the test line, since the time spent on each test process on the test line is different, the test line needs to be arranged in combination with the test time of each machine, which makes the arrangement of the test line have an optimal step (the optimal step is that there will be no or as little production interference as possible between the machines. The specific production interference situation can be understood as follows: after the first machine completes the test, the second machine needs to wait for the first machine to send materials, or the first machine completes the test and sends it to the second machine. The second machine has not completed the test operation and needs the first machine to wait for it to be sent in). In order to ensure production efficiency, the test line needs to be arranged in the optimal step. This makes the arrangement of the test line a fixed process setting. The test line cannot flexibly increase or decrease test machines, nor can it be configured according to production needs. At the same time, even if the test line is arranged in the optimal step, due to the basic problem that the time spent on each test process is different, there must be a part of the machines in the test line that need to wait for other machines to complete before they can send or receive materials, and the production efficiency of the entire test line is not fully utilized. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a testing method for a testing pipeline.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: comprising the following steps:

[0007] The first step is to configure the corresponding machine group according to the production requirements of the module to be processed and tested;

[0008] In the second step, the feeding unit feeds the chip or the module to be tested into the first machine unit, and the first machine unit feeds the chip or the module to be tested into the transfer module after completing the corresponding test process;

[0009] In the third step, the transfer module dynamically configures the chip or the module to be tested to the second machine group based on the operating status of the second machine group;

[0010] Step 4: repeat the above steps until the chip or the module to be tested is sent to the Nth machine group, which is the last machine group in the test line;

[0011] In the fifth step, the Nth machine group completes the last test process of the chip or the module to be tested, and the discharging unit collects and sends out the chips or the module to be tested, completing the test line production of the chips or the module to be tested.

[0012] Preferably, the transfer module is arranged between different machine groups.

[0013] Preferably, the number of transfer modules between different machine groups is at least one group.

[0014] Preferably, the first machine group, the second machine group ... the Nth machine group is one of a radio frequency tester, an online functional tester, a burner, and an encoder.

[0015] Preferably, at least one set of transfer channels is provided on the transfer module.

[0016] Preferably, a material storage transfer mechanism is provided on each group of transfer flow channels.

[0017] Preferably, the material storage transfer mechanism is arranged in the middle of the transfer flow channel, and includes a lifting mechanism and a material tray clamping mechanism.

[0018] Preferably, the transfer flow channel is also provided with a sensing mechanism and a feeding stopping mechanism.

[0019] Preferably, the first machine group, the second machine group ... the Nth machine group are all adapted to be equipped with an encoding machine.

[0020] The present invention has the following beneficial effects:

[0021] The test line is used to test and burn chips or electronic modules. In the test line, the transfer module is used to realize the dynamic transfer of materials between different machine groups, so as to balance the difference in test time of different machine groups, so that the test line can flexibly arrange different test units according to production needs. At the same time, it can also eliminate the situation of unit downtime waiting for materials, and maximize the production potential of each machine on the test line. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the process flow of the test line machine set of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of the transfer module of the present invention.

[0024] Legend:

[0025] 1. The first machine group; 2. The second machine group; 3. The Nth machine group; 4. The transfer module; 41. The transfer channel; 42. The storage transfer mechanism; 43. The lifting mechanism; 44. The disc clamping mechanism; 45. The sensing mechanism; 46. The stopping mechanism; 5. The feeding unit; 6. The discharging unit. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Reference Figure 1-2, an embodiment provided by the present invention comprises the following steps:

[0029] The first step is to configure the corresponding machine group according to the production requirements of the module to be processed and tested;

[0030] In the second step, the feeding unit 5 feeds the chip or the module to be tested into the first machine unit 1, and the first machine unit 1 feeds the chip or the module to be tested into the transfer module 4 after completing the corresponding test process;

[0031] Step 3: the transfer module 4 dynamically configures the chip or the module to be tested to the second machine group 2 based on the operating status of the second machine group 2;

[0032] Step 4, repeat the above steps until the chip or the module to be tested is sent to the Nth machine group 3, which is the last machine group in the test line;

[0033] In the fifth step, the Nth machine group 3 completes the last test process of the chip or the module to be tested, and the discharging unit 6 collects and sends out the chip or the module to be tested, completing the test line production of the chip or the module to be tested.

[0034] Through this technical solution, in the test line, the first machine group 1 completes process A, and the second machine group 2 completes process B. Then there are three production situations: the test time of the first machine group 1 is less than the test time of the second machine group 2. At this time, if the existing layout method is used, the production speed of the first machine group 1 is faster than that of the second machine group 2, and the first machine group 1 needs to wait for the second machine group 2 during the test process. In this technical solution, the number of the second machine group 2 can be set to be greater than the number of the first machine group 1, and the transfer module 4 is used to dynamically send the tested chips or the modules to be tested to the second machine group 2, and the more More second machine groups 2 match the production capacity of the first machine group 1; similarly, if the test time of the first machine group 1 is more than that of the second machine group 2, the number of second machine groups 2 can be set to be smaller than the number of first machine groups 1, and more first machine groups 1 can be used to match the production capacity of the second machine group 2; finally, the first machine group 1 and the second machine group 2 are machine groups of the same type with the same production capacity, and the number of first machine groups 1 and the second machine group 2 are set to be the same. Based on this arrangement, the time taken by the machines in each process in the test line to process the same batch of chips or modules to be tested is consistent.

[0035] Furthermore, the transfer module 4 is arranged between different machine groups.

[0036] Furthermore, the number of transfer modules 4 between different machine groups is at least one group.

[0037] Through this technical solution, the transfer module 4 plays the role of transfer and allocation, which is used to send the chips or modules to be tested of the previous process to the next process. The transfer module 4 can choose to transport the chips or modules to be tested to the next process machine based on the operating status of the next process machine, or store the chips or modules to be tested for subsequent transmission; in the test line layout, although the time taken by the machines of multiple processes to process the same batch of chips or modules to be tested is consistent, due to the different test times, the direct delivery method will still cause the machine to get stuck. By using the dynamic configuration of the transfer module 4, it can be ensured that the test machines in the test line are almost always in operation, and there will be no shutdown waiting for materials.

[0038] Furthermore, the first machine group 1, the second machine group 2, ... the Nth machine group 3 are one of a radio frequency tester, an online functional tester, a burner, and an encoding machine.

[0039] Through this technical solution, RF testers, online functional testers, and burners are all commonly used units in chip or electronic module test lines. The first machine group 1, the second machine group 2...the Nth machine group 3 can be the same machine group or different machine groups. Their selection is set according to production needs, and corresponding adjustments can be made according to the different test chips or modules to be tested. At the same time, when new test units need to be added in the later stage, the new machine groups can be easily equipped in the entire test line, and the overall test efficiency of the machine groups will not be affected after the equipment is equipped.

[0040] Furthermore, at least one set of transfer channels 41 is disposed on the transfer module 4 .

[0041] Through this technical solution, the transfer module 4 is provided with multiple flow channels, and the multiple flow channels of the transfer module 4 can be connected to multiple groups of machine groups, so that multiple groups of chips or modules to be tested of the first machine group 1 can be sent to a group of the second machine group 2, and a group of materials of the first machine group 1 can be sent to multiple groups of the second machine group 2, and multiple groups of materials of the first machine group 1 can be sent to multiple groups of the second machine group 2.

[0042] Furthermore, a material storage transfer mechanism 42 is provided on each group of transfer flow channels 41 .

[0043] Furthermore, the material storage transfer mechanism 42 is arranged in the middle of the transfer channel 41 , and includes a lifting mechanism 43 and a material tray clamping mechanism 44 .

[0044] Furthermore, a sensing mechanism 45 and a feeding stopping mechanism 46 are also provided on the transfer flow channel.

[0045] Through this technical solution, after the first machine group 1 completes the test, the chips or modules to be tested are sent to the second machine group 2 by the transfer module 4. When the second machine group 2 of the test line is in operation, the material storage transfer mechanism 42 of the transfer module 4 needs to stack and store the transfer pallets that continue to be sent in. The steps are as follows: when the sensing mechanism 45 senses the first group of transfer pallets being sent in, the lifting mechanism 43 lifts the first group of transfer pallets to the position of the material tray clamping mechanism 44, and the material tray clamping mechanism 44 closes to fix and clamp the first group of transfer pallets. When the second group of transfer pallets are sent in, the lifting mechanism 43 lifts the second group of transfer pallets to the position of the first group of transfer pallets At the bottom, when the two groups of transfer pallets overlap, the tray clamping mechanism 44 opens, and the lifting mechanism 43 continues to lift the two groups of transfer pallets for a certain distance, so that the tray clamping mechanism 44 and the bottom transfer pallet are at the same position height. At this time, the tray clamping mechanism 44 closes to fix the two groups of transfer pallets. After clamping, the lifting mechanism 43 resets and continues to perform the above operations on the next transfer pallet, thereby stacking the transfer pallets for storage; the transfer module 4 can temporarily store the chip or the module to be tested and then dynamically configure it to the next process, so as to balance the difference in test time of different machine groups and maximize the production potential of each machine on the test line.

[0046] Furthermore, the first machine group 1, the second machine group 2, ... the Nth machine group 3 are all adapted to be equipped with an encoding machine.

[0047] Through this technical solution, the encoding machine is a laser encoding device. By adapting and installing the encoding machine on the first machine group 1, the second machine group 2...the Nth machine group 3, the chip or the module to be tested can be coded and marked in different processes of the chip or the module to be tested, so as to facilitate traceability after the chip or the module to be tested is produced, and it is more conducive to discovering faults in the test line, which plays a better role in quality control.

[0048] Working principle: The test line can flexibly configure the required machine groups according to the test electronic modules, sites, and production requirements, and conveniently use the transfer module 4 to realize the transfer of chips or modules to be tested between different machine groups, so as to balance the differences in test time of different machine groups, thereby maximizing the production potential of each machine on the test line.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A testing method for a testing pipeline, characterized in that: The following steps are involved: The first step is to configure the corresponding machine group according to the production requirements of the module to be processed and tested; In the second step, the feeding unit (5) feeds the chip or the module to be tested into the first machine unit (1), and the first machine unit (1) feeds the chip or the module to be tested into the transfer module (4) after completing the corresponding test process; In the third step, the transfer module (4) dynamically configures the chip or the module to be tested to the second machine group (2) based on the operating status of the second machine group (2); Step 4, repeat the above steps until the chip or the module to be tested is sent to the Nth machine group (3), the Nth machine group (3) being the last machine group in the test line; In the fifth step, the Nth machine group (3) completes the last test process of the chip or the module to be tested, and the discharging unit (6) collects and sends out the chip or the module to be tested, thus completing the test line production of the chip or the module to be tested; The transfer module (4) is arranged between different machine groups; The number of the transfer modules (4) between different machine groups is at least one group; The transfer module (4) plays a role in transfer and dispatching, and is used to send the chip or the module to be tested of the previous process to the next process. The transfer module (4) selects to send the chip or the module to be tested to the machine of the next process or to store the chip or the module to be tested for subsequent transmission based on the operating status of the machine of the next process; The transfer module (4) is provided with at least one set of transfer channels (41); Each group of transfer channels (41) is provided with a material storage transfer mechanism (42); The material storage transfer mechanism (42) is arranged in the middle of the transfer flow channel (41), and comprises a lifting mechanism (43) and a material tray clamping mechanism (44); The transfer flow channel is also provided with a sensing mechanism (45) and a feeding stopping mechanism (46); After the first machine group (1) completes the test, the transfer module (4) feeds the chips or modules to be tested into the second machine group (2). When the second machine group (2) of the test line is in operation, the storage transfer mechanism (42) of the transfer module (4) needs to stack and store the transfer pallets that continue to be fed in. The steps are as follows: when the sensing mechanism (45) senses the feeding in of the first group of transfer pallets, the lifting mechanism (43) lifts the first group of transfer pallets to the position of the material tray clamping mechanism (44), and the material tray clamping mechanism (44) closes to fix and clamp the first group of transfer pallets, and waits until the second group of transfer pallets are fed in. When two groups of transfer pallets are fed in, the lifting mechanism (43) lifts the second group of transfer pallets to the bottom of the first group of transfer pallets. When the two groups of transfer pallets overlap, the tray clamping mechanism (44) opens, and the lifting mechanism (43) continues to lift the two groups of transfer pallets a certain distance, so that the tray clamping mechanism (44) and the bottom transfer pallet are at the same height. At this time, the tray clamping mechanism (44) closes to fix and clamp the two groups of transfer pallets. After clamping is completed, the lifting mechanism (43) is reset, and the above operation is continued for the next transfer pallet, so that the transfer pallets are stacked and stored.

2. The testing method of a testing pipeline according to claim 1, characterized in that: The number of the first machine group (1), the second machine group (2) ... the Nth machine group (3) is set according to their production capacity.

3. The testing method of a testing pipeline according to claim 1, characterized in that: The first machine group (1), the second machine group (2) ... the Nth machine group (3) are one of a radio frequency tester, an online functional tester, a burner, and an encoding machine.

4. The testing method of a testing pipeline according to claim 1, characterized in that: The first machine group (1), the second machine group (2) ... the Nth machine group (3) are all adapted to be equipped with an encoding machine.

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